ETC CY7C4241-15AC

CY7C4421/4201/4211/4221 CY7C4231/4241/425164/256/512/1K/2K/4K/8K x 9 Synchronous FIFOs
1CY7C4231/4241/42
51
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
64/256/512/1K/2K/4K/8K x 9 Synchronous FIFOs
Features
Functional Description
• High-speed, low-power, First-In, First-Out (FIFO)
memories
• 64 x 9 (CY7C4421)
• 256 x 9 (CY7C4201)
• 512 x 9 (CY7C4211)
• 1K x 9 (CY7C4221)
• 2K x 9 (CY7C4231)
• 4K x 9 (CY7C4241)
• 8K x 9 (CY7C4251)
• High-speed 100-MHz operation (10 ns read/write cycle
time)
• Low power (ICC = 35 mA)
• Fully asynchronous and simultaneous read and write
operation
• Empty, Full, and Programmable Almost Empty and
Almost Full status flags
• TTL-compatible
• Expandable in width
• Output Enable (OE) pin
• Independant read and write enable pins
• Center power and ground pins for reduced noise
• Width Expansion Capability
• Space saving 7 mm x 7 mm 32-pin TQFP
• 32-pin PLCC
• Pin compatible and functionally equivalent to IDT72421,
72201, 72211, 72221, 72231, and 72241
The CY7C42X1 are high-speed, low-power, First-In First-Out
(FIFO) memories with clocked read and write interfaces. All
are 9 bits wide. The CY7C42X1 are pin-compatible to
IDT722X1. Programmable features include Almost Full/Almost
Empty flags. These FIFOs provide solutions for a wide variety
of data buffering needs, including high-speed data acquisition,
multiprocessor interfaces, and communications buffering.
These FIFOs have 9-bit input and output ports that are controlled by separate clock and enable signals. The input port is
controlled by a free-running clock (WCLK) and two write-enable pins (WEN1, WEN2/LD).
When WEN1 is LOW and WEN2/LD is HIGH, data is written
into the FIFO on the rising edge of the WCLK signal. While
WEN1, WEN2/LD is held active, data is continually written into
the FIFO on each WCLK cycle. The output port is controlled in
a similar manner by a free-running read clock (RCLK) and two
read-enable pins (REN1, REN2). In addition, the CY7C42X1
has an output enable pin (OE). The read (RCLK) and write
(WCLK) clocks may be tied together for single-clock operation
or the two clocks may be run independently for asynchronous
read/write applications. Clock frequencies up to 100 MHz are
achievable.
Depth expansion is possible using one enable input for system
control, while the other enable is controlled by expansion logic
to direct the flow of data.
Logic Block Diagram
Pin Configuration
D0 - 8
D2
D3
D4
D5
D6
D7
D8
PLCC
Top View
INPUT
REGISTER
D1
D0
PAF
PAE
GND
REN1
RCLK
REN2
OE
WCLK WEN1 WEN2/LD
FLAG
PROGRAM
REGISTER
WRITE
CONTROL
READ
POINTER
8k x 9
42X1–2
D4
D5
D6
D7
D8
RS
WRITE
POINTER
RS
WEN1
WCLK
WEN2/LD
V CC
Q8
Q7
Q6
Q5
TQFP
Top View
D2
D3
Dual Port
RAM Array
64 x 9
EF
FF
Q0
Q1
Q2
Q3
Q4
EF
PAE
PAF
FF
FLAG
LOGIC
4 3 2 1 32 3130
29
5
28
6
27
7
26
8
9
25
10
24
11
23
12
22
21
13
141516171819 20
32 31 30 29 28 27 26 25
OE
Q0 - 8
•
3901 North First Street
VCC
Q8
Q7
Q6
Q5
9 10 11 12 13 14 15 16
RCLK REN1 REN2
42X1–3
42X1–1
Cypress Semiconductor Corporation
WEN1
WCLK
WEN2/LD
•
San Jose
•
Q3
Q4
READ
CONTROL
PAF
PAE
GND
REN1
RCLK
REN2
24
23
22
21
20
19
18
17
Q2
THREE-STATE
OUTPUTREGISTER
1
2
3
4
5
6
7
8
OE
EF
FF
Q0
Q1
RS
D1
D0
RESET
LOGIC
CA 95134
•
408-943-2600
March 8, 2001
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Functional Description (continued)
entering or exiting the Empty and Almost Empty states, the
flags are updated exclusively by the RCLK. The flags denoting
Almost Full, and Full states are updated exclusively by WCLK.
The synchronous flag architecture guarantees that the flags
maintain their status for at least one cycle
The CY7C42X1 provides four status pins: Empty, Full, Almost Empty,
Almost Full. The Almost Empty/Almost Full flags are programmable
to single word granularity. The programmable flags default to
Empty – 7 and Full – 7.
All configurations are fabricated using an advanced 0.65µ
N-Well CMOS technology. Input ESD protection is greater than
2001V, and latch-up is prevented by the use of guard rings.
The flags are synchronous, i.e., they change state relative to
either the read clock (RCLK) or the write clock (WCLK). When
Selection Guide
CY7C42X1-10
CY7C42X1-15
CY7C42X1-25
Maximum Frequency (MHz)
100
66.7
40
Maximum Access Time (ns)
8
10
15
Minimum Cycle Time (ns)
10
15
25
Minimum Data or Enable Set-Up (ns)
3
4
6
Minimum Data or Enable Hold (ns)
0.5
1
1
8
10
15
Commercial
35
35
35
Industrial
40
40
40
Maximum Flag Delay (ns)
Active Power Supply
Current (ICC1)
Density
CY7C4421
CY7C4201
CY7C4211
CY7C4221
CY7C4231
CY7C4241
CY7C4251
64 x 9
256 x 9
512 x 9
1K x 9
2K x 9
4K x 9
8K x 9
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-Up Current..................................................... >200 mA
Storage Temperature ...................................–65°C to +150°C
Operating Range
Ambient Temperature with
Power Applied ...............................................–55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
Range
Ambient
Temperature
DC Voltage Applied to Outputs
in High Z State ............................................... –0.5V to +7.0V
VCC
Commercial
0°C to +70°C
5V ± 10%
Industrial[1]
–40°C to +85°C
5V ± 10%
DC Input Voltage............................................ –3.0V to +7.0V
Note:
1. TA is the “instant on” case temperature.
2
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Pin Definitions
Signal Name
Description
I/O
Description
D0–8
Data Inputs
I
Data Inputs for 9-bit bus
Q0–8
Data Outputs
O
Data Outputs for 9-bit bus
WEN1
Write Enable 1
I
The only write enable when device is configured to have programmable flags. Data is
written on a LOW-to-HIGH transition of WCLK when WEN1 is asserted and FF is HIGH.
If the FIFO is configured to have two write enables, data is written on a LOW-to-HIGH transition
of WCLK when WEN1 is LOW and WEN2/LD and FF are HIGH.
WEN2/LD
Dual Mode Pin
Write Enable 2
I
Load
I
If HIGH at reset, this pin operates as a second write enable. If LOW at reset, this pin
operates as a control to write or read the programmable flag offsets. WEN1 must be
LOW and WEN2 must be HIGH to write data into the FIFO. Data will not be written into the FIFO
if the FF is LOW. If the FIFO is configured to have programmable flags, WEN2/LD is held LOW
to write or read the programmable flag offsets.
REN1, REN2
Read Enable
Inputs
I
Enables the device for Read operation.
WCLK
Write Clock
I
The rising edge clocks data into the FIFO when WEN1 is LOW and WEN2/LD is HIGH
and the FIFO is not Full. When LD is asserted, WCLK writes data into the programmable flag-offset register.
RCLK
Read Clock
I
The rising edge clocks data out of the FIFO when REN1 and REN2 are LOW and the FIFO
is not Empty. When WEN2/LD is LOW, RCLK reads data out of the programmable flag-offset
register.
EF
Empty Flag
O
When EF is LOW, the FIFO is empty. EF is synchronized to RCLK.
FF
Full Flag
O
When FF is LOW, the FIFO is full. FF is synchronized to WCLK.
PAE
Programmable
Almost Empty
O
When PAE is LOW, the FIFO is almost empty based on the almost empty offset value programmed into the FIFO.
PAF
Programmable
Almost Full
O
When PAF is LOW, the FIFO is almost full based on the almost full offset value programmed
into the FIFO.
RS
Reset
I
Resets device to empty condition. A reset is required before an initial read or write
operation after power-up.
OE
Output Enable
I
When OE is LOW, the FIFO’s data outputs drive the bus to which they are connected. If OE is
HIGH, the FIFO’s outputs are in High Z (high-impedance) state.
3
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Electrical Characteristics Over the Operating Range[2]
7C42X1-10
Parameter
Description
Test Conditions
Min.
Max.
VOH
Output HIGH Voltage
VCC = Min.,
IOH = –2.0 mA
VOL
Output LOW Voltage
VCC = Min.,
IOL = 8.0 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIX
Input Leakage
Current
VCC = Max.
IOS[3]
Output Short
Circuit Current
VCC = Max.,
VOUT = GND
–90
IOZL
IOZH
Output OFF,
High Z Current
OE > VIH,
VSS < VO < VCC
–10
ICC1[4]
Active Power Supply
Current
Com’l
35
Ind
Average Standby
Current
ICC2[5]
2.4
7C42X1-15
Min.
Max.
Min.
2.4
0.4
2.2
7C42X1-25
0.4
VCC
2.2
–3.0
0.8
–10
+10
Unit
V
0.4
V
VCC
V
VCC
2.2
–3.0
0.8
–3.0
0.8
V
–10
+10
–10
+10
mA
–90
+10
Max.
2.4
–10
–90
+10
–10
mA
+10
mA
35
35
mA
40
40
40
mA
Com’l
10
10
10
mA
Ind
15
15
15
mA
Capacitance[6]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
5
pF
7
pF
AC Test Loads and Waveforms[7, 8]
R1 1.1 KΩ
ALL INPUT PULSES
5V
OUTPUT
3.0V
CL
INCLUDING
JIG AND
SCOPE
Equivalent to:
THÉVENIN EQUIVALENT
420Ω
OUTPUT
R2
680Ω
GND
≤ 3 ns
42X1–4
90%
10%
90%
10%
≤ 3 ns
42X1–5
1.91V
Notes:
2. See the last page of this specification for Group A subgroup testing information.
3. Test no more than one output at a time for not more than one second.
4. Outputs open. Tested at Frequency = 20 MHz.
5. All inputs = VCC – 0.2V, except WCLK and RCLK, which are switching at 20 MHz.
6. Tested initially and after any design or process changes that may affect these parameters.
7. CL = 30 pF for all AC parameters except for tOHZ.
8. CL = 5 pF for tOHZ.
4
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Characteristics Over the Operating Range
7C42X1-10
Parameter
Description
Min.
Max.
7C42X1-15
Min.
100
Max.
7C42X1-25
Min.
Unit
40
MHz
15
ns
Clock Cycle Frequency
tA
Data Access Time
2
tCLK
Clock Cycle Time
10
15
25
ns
tCLKH
Clock HIGH Time
4.5
6
10
ns
tCLKL
Clock LOW Time
4.5
6
10
ns
tDS
Data Set-Up Time
3
4
6
ns
tDH
Data Hold Time
0.5
1
1
ns
tENS
Enable Set-Up Time
tENH
Enable Hold Time
Width[9]
6
ns
1
1
ns
10
15
25
ns
10
15
ns
Reset Set-Up Time
8
tRSR
Reset Recovery Time
8
tRSF
Reset to Flag and Output Time
tOE
Output Enable to Output Valid
10
10
0
Z[10]
2
4
tRSS
Z[10]
10
3
Reset Pulse
Output Enable to Output in Low
2
0.5
tRS
tOLZ
8
66.7
Max.
tS
15
15
0
3
7
3
3
7
3
ns
25
0
ns
ns
8
3
12
ns
8
3
tOHZ
Output Enable to Output in High
12
ns
tWFF
Write Clock to Full Flag
8
10
15
ns
tREF
Read Clock to Empty Flag
8
10
15
ns
tPAF
Clock to Programmable Almost-Full Flag
8
10
15
ns
tPAE
Clock to Programmable Almost-Full Flag
15
ns
tSKEW1
Skew Time between Read Clock and Write
Clock for Empty Flag and Full Flag
5
6
10
ns
tSKEW2
Skew Time between Read Clock and Write
Clock for Almost-Empty Flag and Almost-Full
Flag
10
15
18
ns
8
Notes:
9. Pulse widths less than minimum values are not allowed.
10. Values guaranteed by design, not currently tested.
5
10
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms
Write Cycle Timing
tCLK
tCLKH
tCLKL
WCLK
tDS
tDH
D0 –D8
tENS
tENH
WEN1
NO OPERATION
NO OPERATION
WEN2
(if applicable)
tWFF
tWFF
FF
tSKEW1
[11]
RCLK
REN1,REN2
42X1–6
Read Cycle Timing
tCKL
tCLKH
tCLKL
RCLK
tENS
tENH
REN1,REN2
NO OPERATION
tREF
tREF
EF
tA
VALID DATA
Q0 –Q8
tOLZ
tOHZ
tOE
OE
tSKEW1
[12]
WCLK
WEN1
WEN2
42X1–7
Notes:
11. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH during the current clock cycle. If the time between the
rising edge of RCLK and the rising edge of WCLK is less than tSKEW1, then FF may not change state until the next WCLK rising edge.
12. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH during the current clock cycle. It the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF may not change state until the next RCLK rising edge.
6
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
Reset Timing[13]
tRS
RS
tRSS
tRSR
tRSS
tRSR
tRSS
tRSR
REN1,
REN2
WEN1
WEN2/LD
[14]
tRSF
EF,PAE
tRSF
FF,PAF,
tRSF
OE=1 [15]
Q0 - Q8
OE=0
42X1–8
Notes:
13. The clocks (RCLK, WCLK) can be free-running during reset.
14. Holding WEN2/LD HIGH during reset will make the pin act as a second enable pin. Holding WEN2/LD LOW during reset will make the pin act as a load enable for the
programmable flag offset registers.
15. After reset, the outputs will be LOW if OE = 0 and three-state if OE=1.
7
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
First Data Word Latency after Reset with Simultaneous Read and Write
WCLK
tDS
D0 –D8
D0 (FIRSTVALID WRITE)
D1
D2
D3
[17]
tA
D4
tENS
tFRL
WEN1
[16]
WEN2
(if applicable)
tSKEW1
RCLK
tREF
EF
tA
REN1,
REN2
Q0 –Q8
D0
D1
tOLZ
tOE
OE
42X1–9
Notes:
16. When tSKEW1 > minimum specification, tFRL (maximum) = tCLK + tSKEW1. When tSKEW1 < minimum specification, tFRL (maximum) = either 2*tCLK + tSKEW1 or tCLK + tSKEW1.
The Latency Timing applies only at the Empty Boundary (EF = LOW).
17. The first word is available the cycle after EF goes HIGH, always.
8
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
Empty Flag Timing
WCLK
tDS
tDS
DATAWRITE2
DATAWRITE1
D0 –D8
tENS
tENH
tENH
tENS
WEN1
WEN2
(if applicable)
tENS
tENH
tFRL
tENS
[16]
tENH
tFRL
[16]
RCLK
tSKEW1
tREF
tREF
tREF
tSKEW1
EF
REN1,
REN2
LOW
OE
tA
Q0 –Q8
DATA IN OUTPUT REGISTER
DATA READ
42X1–10
9
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
Full Flag Timing
NO WRITE
NO WRITE
NO WRITE
WCLK
tSKEW1 [11]
tSKEW1 [11]
tDS
DATA WRITE
DATA WRITE
D0 –D8
tWFF
tWFF
tWFF
FF
WEN1
WEN2
(if applicable)
RCLK
tENH
REN1,
REN2
OE
tENH
tENS
tENS
LOW
tA
Q0 –Q8
tA
DATA READ
DATA IN OUTPUT REGISTER
NEXT DATA READ
42X1–11
10
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
Programmable Almost Empty Flag Timing
tCLKL
tCLKH
WCLK
tENS tENH
WEN1
WEN2
(if applicable)
tENS tENH
PAE
tSKEW2
[18]
Note
19
N + 1 WORDS
INFIFO
tPAE
Note
20
tPAE
RCLK
tENS
tENS tENH
REN1,
REN2
42X1–12
Programmable Almost Full Flag Timing
tCLKH
tCLKL
Note
21
WCLK
tENS tENH
WEN1
Note
22
WEN2
(if applicable)
tPAF
tENS tENH
PAF
FULL − M WORDS
IN FIFO [23]
FULL − M+1 WORDS
IN FIFO
tSKEW2 [24]
tPAF
RCLK
tENS
tENS tENH
REN1,
REN2
42X1–13
Notes:
18. tSKEW2 is the minimum time between a rising WCLK and a rising RCLK edge for PAE to change state during that clock cycle. If the time between the edge of WCLK and the
rising RCLK is less than tSKEW2, then PAE may not change state until the next RCLK.
19. PAE offset = n.
20. If a read is performed on this rising edge of the read clock, there will be Empty + (n – 1) words in the FIFO when PAE goes LOW.
21. If a write is performed on this rising edge of the write clock, there will be Full – (m – 1) words of the FIFO when PAF goes LOW.
22. PAF offset = m.
23. 64-m words for CY7C4421, 256 – m words in FIFO for CY7C4201, 512 – m words for CY7C4211, 1024 – m words for CY7C4221, 2048 – m words for
CY7C4231, 4096 – m words for CY7C4241, 8192 – m words for CY7C4251.
24. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to change during that clock cycle. If the time between the rising edge of RCLK
and the rising edge of WCLK is less than tSKEW2, then PAF may not change state until the next WCLK.
11
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Switching Waveforms (continued)
Write Programmable Registers
tCLK
tCLKL
tCLKH
WCLK
tENS
tENH
WEN2/LD
tENS
WEN1
tDS
tDH
D0 –D8
PAE OFFSET
LSB
PAE OFFSET
MSB
PAF OFFSET
LSB
PAF OFFSET
MSB
42X1–14
Read Programmable Registers
tCLK
tCLKL
tCLKH
RCLK
tENS
tENH
WEN2/LD
tENS
PAF OFFSET
MSB
REN1,
REN2
tA
Q0 –Q8
UNKNOWN
PAE OFFSET LSB
PAE OFFSET MSB
PAF OFFSET
LSB
42X1–15
Architecture
rising edge of the WCLK signal. Similarly, when the REN1 and
REN2 signals are active LOW, data in the FIFO memory will
be presented on the Q0–8 outputs. New data will be presented
on each rising edge of RCLK while REN1 and REN2 are active. REN1 and REN2 must set up tENS before RCLK for it to
be a valid read function. WEN1 and WEN2 must occur tENS
before WCLK for it to be a valid write function.
The CY7C42X1 consists of an array of 64 to 8K words of 9 bits
each (implemented by a dual-port array of SRAM cells), a read
pointer, a write pointer, control signals (RCLK, WCLK, REN1,
REN2, WEN1, WEN2, RS), and flags (EF, PAE, PAF, FF).
Resetting the FIFO
An output enable (OE) pin is provided to three-state the Q0–8
outputs when OE is asserted. When OE is enabled (LOW),
data in the output register will be available to the Q0–8 outputs
after tOE.
Upon power-up, the FIFO must be reset with a Reset (RS)
cycle. This causes the FIFO to enter the Empty condition signified by EF being LOW. All data outputs (Q0–8) go LOW tRSF
after the rising edge of RS. In order for the FIFO to reset to its
default state, a falling edge must occur on RS and the user
must not read or write while RS is LOW. All flags are guaranteed to be valid tRSF after RS is taken LOW.
The FIFO contains overflow circuitry to disallow additional
writes when the FIFO is full, and underflow circuitry to disallow
additional reads when the FIFO is empty. An empty FIFO
maintains the data of the last valid read on its Q0–8 outputs
even after additional reads occur.
FIFO Operation
Write Enable 1 (WEN1) - If the FIFO is configured for programmable flags, Write Enable 1 (WEN1) is the only write enable control pin. In this configuration, when Write Enable 1
When the WEN1 signal is active LOW and WEN2 is active HIGH,
data present on the D0–8 pins is written into the FIFO on each
12
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
(WEN1) is LOW, data can be loaded into the input register and
RAM array on the LOW-to-HIGH transition of every write clock
(WCLK). Data is stored is the RAM array sequentially and independently of any on-going read operation.
When the device is configured for programmable flags and
both WEN2/LD and WEN1 are LOW, the first LOW-to-HIGH
transition of WCLK writes data from the data inputs to the empty offset least significant bit (LSB) register. The second, third,
and fourth LOW-to-HIGH transitions of WCLK store data in the
empty offset most significant bit (MSB) register, full offset LSB
register, and full offset MSB register, respectively, when
WEN2/LD and WEN1 are LOW. The fifth LOW-to-HIGH transition of WCLK while WEN2/LD and WEN1 are LOW writes data
to the empty LSB register again. Figure 1 shows the registers
sizes and default values for the various device types.
Write Enable 2/Load (WEN2/LD) - This is a dual-purpose pin.
The FIFO is configured at Reset to have programmable flags
or to have two write enables, which allows for depth expansion.
If Write Enable 2/Load (WEN2/LD) is set active HIGH at Reset
(RS=LOW), this pin operates as a second write enable pin.
If the FIFO is configured to have two write enables, when Write
Enable (WEN1) is LOW and Write Enable 2/Load (WEN2/LD)
is HIGH, data can be loaded into the input register and RAM
array on the LOW-to-HIGH transition of every write clock
(WCLK). Data is stored in the RAM array sequentially and independently of any on-going read operation.
It is not necessary to write to all the offset registers at one time.
A subset of the offset registers can be written; then by bringing
the WEN2/LD input HIGH, the FIFO is returned to normal read
and write operation. The next time WEN2/LD is brought LOW,
a write operation stores data in the next offset register in sequence.
Programming
The contents of the offset registers can be read to the data
outputs when WEN2/LD is LOW and both REN1 and REN2
are LOW. LOW-to-HIGH transitions of RCLK read register contents to the data outputs. Writes and reads should not be preformed simultaneously on the offset registers.
When WEN2/LD is held LOW during Reset, this pin is the load
(LD) enable for flag offset programming. In this configuration,
WEN2/LD can be used to access the four 8-bit offset registers
contained in the CY7C42X1 for writing or reading data to these
registers.
64 x 9
8
256 x 9
0
6 5
8
Empty Offset (LSB) Reg.
Default Value = 007h
8
Empty Offset (LSB) Reg.
Default Value = 007h
0
8
1K x 9
512 x 9
0
7
Empty Offset (LSB) Reg.
Default Value = 007h
0
1
8
0
7
8
Empty Offset (LSB) Reg.
Default Value = 007h
0
8
0
7
(MSB)
0
8
0
6 5
0
7
8
Full Offset (LSB) Reg
Default Value = 007h
8
Full Offset (LSB) Reg
Default Value = 007h
0
8
8
Full Offset (LSB) Reg
Default Value = 007h
0
1
0
7
8
Full Offset (LSB) Reg
Default Value = 007h
0
8
(MSB)
00
0
7
8
2K x 9
4K x 9
0
7
8
Empty Offset (LSB) Reg.
Default Value = 007h
8
Full Offset (LSB) Reg
Default Value = 007h
8
(MSB)
000
8
Full Offset (LSB) Reg
Default Value = 007h
0
2
(MSB)
00000
0
7
8
8
(MSB)
0000
Figure 1. Offset Register Location and Default Values
13
0
7
Full Offset (LSB) Reg
Default Value = 007h
0
3
0
4
8
(MSB)
0000
0
7
0
7
Empty Offset (LSB) Reg.
Default Value = 007h
0
3
8
(MSB)
000
8
8
Empty Offset (LSB) Reg.
Default Value = 007h
0
2
8
(MSB)
00
8K x 9
0
7
0
1
(MSB)
0
8
0
1
8
0
4
(MSB)
00000
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Programmable Flag (PAE, PAF) Operation
and is LOW when the FIFO contains n or fewer unread words.
PAE is set HIGH by the LOW-to-HIGH transition of RCLK when
the FIFO contains (n+1) or greater unread words.
Whether the flag offset registers are programmed as described in Table 1 or the default values are used, the programmable almost-empty flag (PAE) and programmable almost-full
flag (PAF) states are determined by their corresponding offset
registers and the difference between the read and write pointers.
The number formed by the full offset least significant bit register and full offset most significant bit register is referred to as
m and determines the operation of PAF. PAE is synchronized
to the LOW-to-HIGH transition of WCLK by one flip-flop and is
set LOW when the number of unread words in the FIFO is
greater than or equal to CY7C4421. (64 – m), CY7C4201
(256 – m), CY7C4211 (512 – m), CY7C4221 (1K – m),
CY7C4231 (2K – m), CY7C4241 (4K – m), and CY7C4251
(8K – m). PAF is set HIGH by the LOW-to-HIGH transition of
WCLK when the number of available memory locations is
greater than m.
Table 1. Writing the Offset Registers
WCLK[25]
LD
WEN
Selection
0
0
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
0
1
No Operation
1
0
Write Into FIFO
1
1
No Operation
The number formed by the empty offset least significant bit
register and empty offset most significant register is referred
to as n and determines the operation of PAE. PAE is synchronized to the LOW-to-HIGH transition of RCLK by one flip-flop
Table 2. Status Flags
Number of Words in FIFO
CY7C4421
CY7C4201
0
1 to
CY7C4211
0
n[26]
FF
PAF
PAE
EF
H
H
L
L
n[26]
H
H
L
H
0
1 to
n[26]
1 to
(n+1) to 32
(n+1) to 128
(n+1) to 256
H
H
H
H
33 to (64 – (m+1))
129 to (256 – (m+1))
257 to (512 – (m+1))
H
H
H
H
(64 – m)[27] to 63
(256 – m)[27] to 255
(512 – m)[27] to 511
H
L
H
H
64
256
512
L
L
H
H
Number of Words in FIFO
CY7C4221
0
1 to
CY7C4231
0
n[26]
(n+1) to 512
1 to
CY7C4241
0
n[26]
(n+1) to 1024
1 to
CY7C4251
0
n[26]
(1024 –
1024
(2048 –
2048
m)[27] to 2047
(4096 –
m)[27] to 4095
4096
PAE
EF
L
L
H
H
H
H
L
H
(n+1) to 4096
H
H
H
H
H
H
H
H
H
L
H
H
L
L
H
H
513 to (1024 – (m+1)) 1025 to (2048 – (m+1)) 2049 to (4096 – (m+1)) 4097 to (8192 – (m+1))
m)[27] to 1023
PAF
n[26]
1 to
(n+1) to 2048
FF
(8192 –
8192
m)[27] to 8191
Notes:
25. The same selection sequence applies to reading from the registers. REN1 and REN2 are enabled and a read is performed on the LOW-to-HIGH transition of RCLK.
26. n = Empty Offset (n = 7 default value).
27. m = Full Offset (m = 7 default value).
14
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Width Expansion Configuration
Flag Operation
Word width may be increased simply by connecting the corresponding input controls signals of multiple devices. A composite flag should be created for each of the end-point status flags
(EF and FF). The partial status flags (PAE and PAF) can be
detected from any one device. Figure 2 demonstrates a 18-bit
word width by using two CY7C42X1s. Any word width can be
attained by adding additional CY7C42X1s.
The CY7C42X1 devices provide four flag pins to indicate the
condition of the FIFO contents. Empty, Full, PAE, and PAF are
synchronous.
Full Flag
The Full Flag (FF) will go LOW when device is full. Write operations are inhibited whenever FF is LOW regardless of the
state of WEN1 and WEN2/LD. FF is synchronized to WCLK,
i.e., it is exclusively updated by each rising edge of WCLK.
When the CY7C42X1 is in a Width Expansion Configuration,
the Read Enable (REN2) control input can be grounded (See
Figure 2). In this configuration, the Write Enable 2/Load
(WEN2/LD) pin is set to LOW at Reset so that the pin operates
as a control to load and read the programmable flag offsets.
Empty Flag
The Empty Flag (EF) will go LOW when the device is empty.
Read operations are inhibited whenever EF is LOW, regardless of the state of REN1 and REN2. EF is synchronized to
RCLK, i.e., it is exclusively updated by each rising edge of
RCLK.
RESET (RS)
DATA IN (D) 18
RESET (RS)
9
9
READ CLOCK (RCLK)
WRITE CLOCK (WCLK)
READ ENABLE 1 (REN1)
WRITE ENABLE 1 (WEN1)
OUTPUT ENABLE (OE)
WRITE ENABLE 2/LOAD
(WEN2/LD)
CY7C42X1
PROGRAMMABLE (PAF)
CY7C42X1
EF EMPTY FLAG (EF) #2
EF
FULL FLAG (FF) # 1
PROGRAMMABLE (PAE)
EMPTY FLAG (EF) #1
FF
FF
9
FULL FLAG (FF) # 2
DATA OUT (Q)
18
9
Read Enable 2 (REN2)
Read Enable 2 (REN2)
42X1–16
Figure 2. Block Diagram of 64 x 9,256 x 9,512 x 9,1024 x 9,2048 x 9,4096 x 9,8192 x 9 Synchronous FIFO
Memory Used in a Width Expansion Configuration
15
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Typical AC and DC Characteristics
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
1.20
1.0
VIN = 3.0V
TA = 25°C
f = 100 MHz
0.8
0.6
4
4.5
5
5.5
1.10
1.00
0.90
SUPPLY VOLTAGE (V)
25
0
1.0
0.9
5.5
35
25
0
1
2
3
OUTPUT VOLTAGE (V)
4
OUTPUT SINK CURRENT (mA)
45
100
TYPICAL t A CHANGE vs.
OUTPUT LOADING
40
1.00
0.75
25
10
VCC = 5.0V
TA = 25°C
25
125
AMBIENT TEMPERATURE (°C)
55
75
1.25
SUPPLY VOLTAGE (V)
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
50
VCC = 5.0V
0.50
−55
6
25
FREQUENCY (MHz)
Delta t A (ns)
NORMALIZED tA
NORMALIZED t A
1.1
0.8
OUTPUT SOURCE CURRENT (mA)
0.60
125
1.50
5
0.80
NORMALIZED tA vs.
AMBIENT TEMPERATURE
1.2
4.5
0.90
AMBIENT TEMPERATURE (°C)
NORMALIZED tA vs. SUPPLY
VOLTAGE
4
VCC = 5.0V
TA = 25°C
VIN = 3.0V
1.00
0.70
0.80
−55
6
1.10
VIN = 3.0V
VCC = 5.0V
f = 100 MHz
NORMALIZED I CC
NORMALIZED I CC
NORMALIZED I CC
1.4
1.2
NORMALIZED SUPPLY CURRENT
vs. FREQUENCY
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
OUTPUT SINK CURRENT vs.
OUTPUT VOLTAGE
160
140
120
100
80
60
40
20
0
0
1
2
3
OUTPUT VOLTAGE (V)
16
4
0
0
200
400
600
800 1000
CAPACITANCE (pF)
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Ordering Information
64 x 9 Synchronous FIFO
Speed
(ns)
10
15
Ordering Code
Package
Name
Package
Type
CY7C4421-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4421-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4421-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4421-15JC
J65
32-Lead Plastic Leaded Chip Carrier
Package
Name
Package
Type
Operating
Range
Commercial
Commercial
256 x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
CY7C4201-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4201-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4201-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4201-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4201-25AC
A32
32-Lead Thin Quad Flatpack
CY7C4201-25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4201-25AI
A32
32-Lead Thin Quad Flatpack
Operating
Range
Commercial
Commercial
Commercial
Industrial
512 x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
Package
Name
Package
Type
Operating
Range
CY7C4211-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4211-10JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C4211-10AI
A32
32-Lead Thin Quad Flatpack
CY7C4211-10JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4211-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4211-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4211-15AI
A32
32-Lead Thin Quad Flatpack
Industrial
CY7C4211-25AC
A32
32-Lead Thin Quad Flatpack
Commercial
CY7C4211-25JC
J65
32-Lead Plastic Leaded Chip Carrier
Package
Name
Package
Type
Industrial
Commercial
1K x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
CY7C4221-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4221-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4221-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4221-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4221-25AC
A32
32-Lead Thin Quad Flatpack
CY7C4221-25JC
J65
32-Lead Plastic Leaded Chip Carrier
17
Operating
Range
Commercial
Commercial
Commercial
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Ordering Information (Continued)
2K x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
Package
Name
Package
Type
CY7C4231-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4231-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4231-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4231-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4231-25AC
A32
32-Lead Thin Quad Flatpack
CY7C4231-25JC
J65
32-Lead Plastic Leaded Chip Carrier
Package
Name
Package
Type
Operating
Range
Commercial
Commercial
Commercial
4K x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
Operating
Range
CY7C4241-10AC
A32
32-Lead Thin Quad Flatpack
Commercial
CY7C4241-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4241-10JI
J65
32-Lead Plastic Leaded Chip Carrier Industrial
CY7C4241-15AC
A32
32-Lead Thin Quad Flatpack
CY7C4241-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4241-25AC
A32
32-Lead Thin Quad Flatpack
CY7C4241-25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4241-25JI
J65
32-Lead Plastic Leaded Chip Carrier Industrial
Commercial
Commercial
8K x 9 Synchronous FIFO
Speed
(ns)
10
15
25
Ordering Code
Package
Name
Package
Type
Operating
Range
CY7C4251-10AC
A32
32-Lead Thin Quad Flatpack
CY7C4251-10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4251-10AI
A32
32-Lead Thin Quad Flatpack
Industrial
CY7C4251-15AC
A32
32-Lead Thin Quad Flatpack
Commercial
CY7C4251-15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4251-25AC
A32
32-Lead Thin Quad Flatpack
CY7C4251-25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C4251-25AI
A32
32-Lead Thin Quad Flatpack
Document #: 38-00419-*B
18
Commercial
Commercial
Industrial
CY7C4421/4201/4211/4221
CY7C4231/4241/4251
Package Diagrams
32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0 mm A32
51-85063-B
32-Lead Plastic Leaded Chip Carrier J65
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.