ETC HFBR

Agilent HFBR-53B3EM/HFBR-53B3FM
5 V 1 x 9 Fiber Optic Transceivers for
Gigabit Ethernet (GbE) and Fibre
Channel (FC)
Data Sheet
Description
The HFBR-53B3EM/FM
transceivers from Agilent allow
the system designer to
implement a range of solutions
for multimode GbE and FC
applications.
The overall Agilent transceiver
product consists of three
sections: the transmitter and
receiver optical subassemblies, an
electrical subassembly, and the
package housing which
incorporates a duplex SC
connector receptacle.
Transmitter Section
The transmitter section of the
HFBR-53B3EM/FM consists of an
850 nm Vertical Cavity Surface
Emitting Laser (VCSEL) in an
Optical Subassembly (OSA),
which mates to the fiber cable.
The OSA is driven by a custom,
silicon bipolar IC which converts
differential PECL compatible
logic signals into an analog laser
diode drive current. The high
speed output lines are internally
ac-coupled and differentially
terminated with a 100 W resistor.
Receiver Section
The receiver of the
HFBR-53B3EM/FM includes a
GaAs PIN photodiode mounted
together with a custom, silicon
bipolar transimpedance
preamplifier IC in an OSA. This
OSA is mated to a custom silicon
bipolar circuit that provides
post-amplification and
quantization.
The post-amplifier also includes
a Signal Detect circuit which
provides a TTL logic-high output
upon detection of a usable input
optical signal level. The high
speed output lines are dccoupled, different that the
transmitter.
Features
• Compliant with ANSI X3.297-1996
Fibre Channel Physical Interface
FC-PH-2 revision 7.4 proposed
specification for 100-M5-SN-I and
100-M6-SN-I signal interfaces
• Compliant with IEEE-802.3z Gigabit
Ethernet specifications
• 300 m links in 62.5/125 mm MMF
cables
• 500 m links in 50/125 mm MMF
cables
• Wave solder and aqueous wash
process compatible
• Industry standard mezzanine
height 1 x 9 package style with
integral duplex SC connector
• IEC 60825-1 Class 1/CDRH Class I
laser eye safe
• Single +5 V power supply operation
with PECL compatible logic
interfaces and TTL Signal Detect
• AC/DC Couple
Applications
• Switch to switch interface
• Switched backbone applications
• Mass storage systems I/O
• Computer systems I/O
• High-speed peripheral interface
• High-speed switching systems
• Computer systems I/O
Related Products
• Physical layer ICs available for
optical or copper interface (HDMP1636A/1646A)
• Versions of this transceiver module
also available for +3.3 V operation
(HFBR-53A5V/53A3V)
• MT-RJ SFF fiber optic transceivers
for GbE and FC (HFBR-5912E/
5912E)
• Gigabit Interface Converters (GBIC)
for GbE and FC (HFBR-5601/5602)
Package and Handling Instructions
Flammability
The HFBR-53B3EM/FM
transceiver housing is made of
high strength, heat resistant,
chemically resistant and UL 94V0 flame retardant plastic.
Recommended Solder and Wash
Process
The HFBR-53B3EM/FM is
compatible with industrystandard wave or hand solder
processes.
Process Plug
This transceiver is supplied with
a process plug (HFBR-5000) for
protection of the optical ports
within the duplex SC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse
as well as during handling,
shipping and storage. It is made
of a high-temperature, molded
sealing material that can
withstand +85°C and a rinse
pressure of 110 lbs per square
inch.
Recommended Solder Fluxes
Solder fluxes used with the
HFBR-53B3EM/FM should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/ Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane.
Other: soap solution, naphtha.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
2
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
Regulatory Compliance
(See the Regulatory Compliance
Table for transceiver
performance) The overall
equipment design will determine
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in considering
their use in equipment designs.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas. The transceiver
performance has been shown to
provide adequate performance in
typical industry production
environments.
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the transceiver parts.
To the extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet. The
transceiver performance is more
robust than typical industry
equipment requirements of
today.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 4) for more details.
Immunity
Equipment utilizing these
transceivers will be subject to
radio-frequency electromagnetic
fields in some environments.
These transceivers have good
immunity to such fields due to
their shielded design.
Eye Safety
These laser-based transceivers
are classified as AEL Class I
(U.S.
21 CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). They are eye
safe when used within the data
sheet limits per CDRH. They are
also eye safe under normal
operating conditions and under
all reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the
transceiver design for
compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to
maximum volts transmitter VCC.
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFBR-53B3EM/
FM. All adjustments are made at
the factory before shipment to
our customers. Tampering with
or modifying the performance of
the HFBR-53B3EM/FM will
result in voided product
warranty. It may also result in
improper operation of the HFBR53B3EM/FM circuitry, and
possible overstress of the laser
source. Device degradation or
product failure may result.
Connection of the
HFBR-53B3EM/FM to a
nonapproved optical source,
operating above the
recommended absolute maximum
conditions or operating the
HFBR-53B3EM/FM in a manner
inconsistent with its design and
function may result in
hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
Regulatory Compliance
Feature
Test Method
Electrostatic Discharge (ESD) to MIL-STD-883C
the Electrical Pins
Class 1 (>1500 V).
Method 3015.4
Electrostatic Discharge (ESD) to Variation of IEC 801-2
the Duplex SC Receptacle
Electromagnetic Interference
FCC Class B
(EMI)
Performance
Typically withstand at least 15 kV without damage when the duplex
SC connector receptacle is contacted by a Human Body Model probe.
Margins are dependent on customer board and chassis designs.
CENELEC EN55022 Class B
(CISPR 22A)
Immunity
VCCI Class I
Variation of IEC 801-3
Typically show no measurable effect from a 10 V/m field swept from
27 to 1000 MHz applied to the transceiver without a chassis
Laser Eye Safety and Equipment US 21 CFR, Subchapter J
Type Testing
enclosure.
AEL Class I, FDA/CDRH
per Paragraphs 1002.10
and 1002.12
EN 60825-1: 1994 + A11:1996
AEL Class 1, TUV Rheinland of North America
EN 60825-2: 1994 + A1
EN 60950: 1992 + A1 + A2 + A3
Component Recognition
EN 60950: 1992 + A4 + A11
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment.
3
Protection Class III
UL File E173874
APPLICATION SUPPORT
Optical Power Budget and Link
Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiberoptic link is determined by the
difference between the minimum
transmitter output optical power
(dBm avg) and the lowest
receiver sensitivity (dBm avg).
This OPB provides the necessary
optical signal range to establish
a working fiber-optic link. The
OPB is allocated for the fiberoptic cable length and the
corresponding link penalties. For
proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
Data Line Interconnections
Agilent’s HFBR-53B3EM/FM
fiber-optic transceiver is
designed for PECL compatible
signals. The transmitter inputs
are internally ac-coupled to the
laser driver circuit from the
transmitter input pins (pins 7,
8). The transmitter driver circuit
for the laser light source is an
ac-coupled circuit. This circuit
regulates the output optical
power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is reasonably
balanced in duty factor. If the
data duty factor has long,
continuous state times (low or
high data duty factor), then the
output optical power will
gradually change its average
output optical power level to its
preset value.
4
The receiver section is internally
ac-coupled between the preamplifier and the post-amplifier
stages. The actual Data and
Data- bar outputs of the postamplifier are dc-coupled to their
respective output pins (pins 2,
3). Signal Detect is a singleended, TTL output signal that is
dc-coupled to pin 4 of the
module. Signal Detect should not
be ac-coupled externally to the
follow-on circuits because of its
infrequent state changes.
Caution should be taken to
account for the proper interconnection between the supporting
Physical Layer integrated
circuits and this HFBR53B3EM/FM transceiver. Figure
3 illustrates a recommended
interface circuit for
interconnecting to a PECL
compatible fiber-optic
transceiver.
Eye Safety Circuit
For an optical transmitter device
to be eye-safe in the event of a
single fault failure, the
transmitter must either maintain
normal,
eye-safe operation or be disabled.
In the HFBR-53B3EM/FM there
are three key elements to the
laser driver safety circuitry: a
monitor diode, a window
detector circuit, and direct
control of the laser bias. The
window detection circuit
monitors the average optical
power using the monitor diode.
If a fault occurs such that the
transmitter dc regulation circuit
cannot maintain the preset bias
conditions for the laser emitter
within ± 20%, the transmitter
will automatically be disabled.
Once this has occurred, only an
electrical power reset will allow
an attempted turn-on of the
transmitter.
Signal Detect
The Signal Detect circuit
provides a TTL low output signal
when the optical link is broken
or when the transmitter is off.
The Signal Detect threshold is set
to transition from a high to low
state between the minimum
receiver input optional power
and –30 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or
data source). A Signal Detect
indicating a working link is
functional when receiving
encoded 8B/10B characters. The
Signal Detect does not detect
receiver data error or error-rate.
Data errors are determined by
signal processing following the
transceiver.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard; and
more importantly, it reduces the
possibility of interference to
neighboring equipment. The EMI
performance of an enclosure
using these transceivers is
dependent on the chassis design.
Agilent encourages using
standard RF suppression
practices and avoiding poorly
EMI-sealed enclosures.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter
in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that
limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum
ratings for extended periods can adversely affect device reliability.
Parameter
Symbol
Min.
Max.
Unit
Storage Temperature
TS
-40
Typ.
+100
°C
Supply Voltage
VCC
-0.5
7.0
V
Data Input Voltage
VI
-0.5
VCC
V
Transmitter Differential Input Voltage
VD
1.6
V
Output Current
ID
50
mA
Relative Humidity
RH
95
%
Max.
Unit
+70
°C
+90
°C
5.25
V
5
Reference
1
2
Recommended Operating Conditions
Parameter
Symbol
Min.
Ambient Operating Temperature
TA
0
Typ.
Case Temperature
TC
Supply Voltage
VCC
Power Supply Rejection
PSR
Transmitter Differential Input Voltage
VD
0.3
Data Output Load
RDL
50
W
5
Signal Detect Output Load
RSDL
50
W
5
Parameter
Symbol
Min.
Max.
Unit
Reference
Hand Lead Soldering Temperature/Time
TSOLD/tSOLD
+260/10
°C/sec
Wave Soldering and Aqueous Wash
TSOLD/tSOLD
+260/10
°C/sec
4.75
50
mVP-P
1.6
Reference
3
4
V
Process Compatibility
Typ.
6
Notes:
1. The transceiver is class 1 eye-safe up to VCC = 7 V.
2. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs without damaging the input circuit.
3. Case temperature measurement referenced to the center-top of the internal metal transmitter shield.
4. Tested with a 50 mVP–P sinusoidal signal in the frequency range from 500 Hz to 1500 kHz on the VCC supply with the recommended power supply filter
in place. Typically less than a 0.25 dB change in sensitivity is experienced.
5. The outputs are terminated to VCC –2 V.
6. Aqueous wash pressure < 110 psi.
5
HFBR-53B3 Family, 850 nm VCSEL
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Typ.
Max.
Unit
Supply Current
ICCT
Min.
85
120
mA
Power Dissipation
PDIST
0.45
0.63
W
Reference
Data Input Current - Low
IIL
Data Input Current - High
IIH
16
350
µA
Laser Reset Voltage
VCCT-reset
2.7
2.5
V
1
Reference
-350
0
µA
Receiver Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Supply Current
ICCR
Min.
Power Dissipation
PDISR
Data Output Voltage - Low
VOL - VCC
-1.950
Data Output Voltage - High
VOH - VCC
-1.045
Data Output Rise Time
tr
Typ.
Max.
Unit
105
130
mA
0.53
0.68
W
2
-1.620
V
3
-0.740
V
3
0.40
ns
4
Data Output Fall Time
tf
0.40
ns
4
Signal Detect Output Voltage - Low
VOL - VCC
-1.950
-1.620
V
3
Signal Detect Output Voltage - High
VOH - VCC
-1.045
-0.740
V
3
Notes:
1. The Laser Reset Voltage is the voltage level below which the VCCT voltage must be lowered to cause the laser driver circuit to reset from an electrical/
optical shutdown condition to a proper electrical/optical operating condition. The maximum value corresponds to the worst-case highest VCC voltage
necessary to cause a reset condition to occur. The laser safety shutdown circuit will operate properly with transmitter VCC levels of 3.5 Vdc £ VCC £ 7.0
Vdc.
2. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the
products of the output voltages and currents.
3. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.
4. These are 20-80% values.
6
HFBR-53B3 Family, 850 nm VCSEL
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Max.
Unit
Reference
Output Optical Power
50/125 µm, NA = 0.20 Fiber
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
Optical Extinction Ratio
POUT
-9.5
Typ.
-4
dBm avg.
1
POUT
-9.5
-4
dBm avg.
1
dB
2
Center Wavelength
lC
Spectral Width - rms
s
0.85
nm rms
Optical Rise/Fall Time
tr/tf
0.26
ns
-116
dB/Hz
9
830
850
RIN12
Coupled Power Ratio
CPR
860
9
Total Transmitter Jitter
Added at TP2
nm
3, 4 Figure 1
dB
5
227
ps
6
Max.
Unit
Reference
dBm avg.
7
-12.5
-13.5
dBm avg.
dBm avg.
ps
8
8
6,9
1500
MHz
10
860
nm
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 V to 5.25 V)
Parameter
Symbol
Min.
Input Optical Power
PIN
-17
Stressed Receiver Sensitivity
62.5 µm
50 µm
Stressed Receiver Eye
Opening at TP4
Receive Electrical 3 dB
Upper Cutoff Frequency
Operating Center Wavelength
Typ.
0
201
lC
Return Loss
770
12
dB
-18
11
dBm avg.
Signal Detect – Asserted
PA
Signal Detect – Deasserted
PD
-30
dBm avg.
Signal Detect – Hysteresis
PA - PD
1.5
dB
Notes:
1. The maximum Optical Output Power complies with the IEEE 802.3z specification, and is class 1 laser eye safe.
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state. The
transmitter is driven with a Gigabit Ethernet 1250 MBd 8B/10B encoded serial data pattern. This Optical Extinction Ratio is expressed in decibels (dB)
by the relationship 10log(Phigh avg/Plow avg).
3. These are unfiltered 20-80% values.
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time, fall time, pulse
overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. These parameters are
specified by the referenced Gigabit Ethernet eye diagram using the required filter. The output optical waveform complies with the requirements of the
eye mask discussed in section 38.6.5 and Fig. 38-2 of IEEE 802.3z.
5. CPR is measured in accordance with EIA/TIA-526-14A as referenced in 802.3z, section 38.6.10.
6. TP refers to the compliance point specified in 802.3z, section 38.2.1.
7. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
8. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3z, section 38.6.11. The conformance test signal is
conditioned by applying deterministic jitter and intersymbol interference.
9. The stressed receiver jitter is measured using the conformance test signal defined in 802.3z, section 38.6.11 and set to an average optical power 0.5 dB
greater than the specified stressed receiver sensitivity.
10. The 3 dB electrical bandwidth of the receiver is measured using the technique outlined in 802.3z, section 38.6.12.
11. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
7
Table 1. Pinout Table
Pin
Symbol
Mounting Pins
1
VEER
2
RD+
3
RD–
4
SD
5
VCCR
6
VCCT
7
TD–
8
TD+
9
VEET
Functional Description
The mounting pins are provided for transceiver mechanical attachment to the circuit board. They are embedded in the
nonconductive plastic housing and are not connected to the transceiver internal circuit, nor is there a guaranteed connection
to the metallized housing in the EM and FM versions. They should be soldered into plated-through holes on the printed circuit
board.
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. (For HFBR-5B3, VEER = VEET).
Receiver Data Out
RD+ is an open emitter output circuit. Termination is done externally to the module.
Receiver Data Out Bar
RD- is an open emitter output circuit. Termination is done externally to the module.
Signal Detect
Signal Detect is a single-ended TTL output. If Signal Detect output is not used, leave it open circuited.
Normal optical input levels to the receiver result in a logic “1” output, V OH, asserted.
Low input optical levels to the receiver result in a fault condition indicated by a logic “0” output V OL, deasserted.
Receiver Power Supply
Provide +5 V dc via the recommended receiver power supply filter circuit.
Locate the power supply filter circuit as close as possible to the V CCR pin.
Transmitter Power Supply
Provide +5 V dc via the recommended transmitter power supply filter circuit.
Locate the power supply filter circuit as close as possible to the V CCT pin.
Transmitter Data In-Bar
AC coupled - PECL compatible. Internally terminated differentially with 100W.
Transmitter Data In
AC coupled - PECL compatible. Internally terminated differentially with 100W.
Transmitter Signal Ground
Directly connect this pin to the transmitter signal ground plane.
1 = VEER
NIC
2 = RD+
1.3
RX
NORMALIZED AMPLITUDE
3 = RD–
1.0
4 = SD
0.8
5 = VCCR
6 = VCCT
0.5
7 = TD–
0.2
8 = TD+
0
9 = VEET
-0.2
0
0.15
0.375
0.625
NORMALIZED TIME
0.85
8
TOP VIEW
1.0
Figure 1. Transmitter optical eye diagram mask.
TX
NIC
NIC = NO INTERNAL CONNECTION (MOUNTING PINS)
Figure 2. Pin-out.
3.3 V dc
+
0.01 µF VEET
LASER
DRIVER
CIRCUIT
PECL
INPUT
100
9
50
8
TD+
W
50
7
VCC2 VEE2
W
TD+
W
TDR13
150
0.01 µF
VCCT
L2
6
C2
HFBR-53B3
FIBER-OPTIC
TRANSCEIVER
C1
+ C8*
0.1
µF
SIGNAL
DETECT
CIRCUIT
PREAMPLIFIER
C3
+ C4
0.1
µF
10
µF
10 µF*
SD 4
270
50
C12
POSTAMPLIFIER
RD+ 2
1
VEER
0.01 µF
W
R12
270
C11
0.01 µF
RD-
R14
INPUT
BUFFER
100
R11
270
50
W
RD+
W
Figure 3. Recommended Gigabit/sec Ethernet HFBR-53B3 Fiber-Optic Transceiver and HDMP-1636A/1646A
SERDES Integrated Circuit Transceiver Interface and Power Supply Filter Circuits.
2 x Ø 1.9 ± 0.1
(0.075 ± 0.004)
20.32
(0.800)
9 x Ø 0.8 ± 0.1
(0.032 ± 0.004)
20.32
(0.800)
2.54
(0.100)
TOP VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 4. Recommended Board Layout Hole Pattern.
9
CLOCK
RECOVERY
CIRCUIT
SERIAL TO
PARALLEL
CIRCUIT
SEE HDMP-1636A/-1646A DATA SHEET FOR
DETAILS ABOUT THIS TRANSCEIVER IC.
NOTES:
*C8 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW-FREQUENCY NOISE FILTERING.
USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE.
USE 50 MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS.
LOCATE 50 TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.
W
PARALLEL
TO SERIAL
CIRCUIT
TO SIGNAL DETECT (SD)
INPUT AT UPPER-LEVEL-IC
R9
RD- 3
L1
1 µH
CLOCK
SYNTHESIS
CIRCUIT
HDMP-1636A/-1646A
SERIAL/DE-SERIALIZER
(SERDES - 10 BIT
TRANSCEIVER)
5 V dc
5
OUTPUT
DRIVER
R12
150
1 µH
0.1 µF
VCCR
GND
XXXX-XXXX
Agilent ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
TX
KEY:
YYWW = DATE CODE
XXXX-XXXX = HFBR-53B3EM
ZZZZ = 850 nm
29.6 UNCOMPRESSED
(1.16)
39.6
(1.56) MAX.
12.7
(0.50)
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00) MAX.
12.7
(0.50)
SLOT WIDTH
25.8
(1.02) MAX.
(
+0.1
0.25 -0.05
0.010 +0.004
-0.002
2.09 UNCOMPRESSED
(0.08)
10.2 MAX.
(0.40)
)
9.8 MAX.
(0.386)
1.3
(0.05)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X Ø
0.018 +0.010
-0.002
(
23.8
(0.937)
20.32
(0.800)
20.32
(0.80)
15.8 ± 0.15
(0.622 ± 0.006)
)
8X 2.54
(0.100)
1.3
2X Ø (0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ±0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 5. Package outline for HFBR-53B3EM.
10
2.0 ± 0.1
(0.079 ± 0.004)
2X Ø
(
+0.25
1.27 -0.05
0.050 +0.010
-0.002
20.32
(0.800)
)
25.76
(1.014)
0.8
2X (0.032)
0.8
2X (0.032)
)
9.4
(0.37)
6.35
(0.25)
MODULE
PROTRUSION
27.4 ± 0.50
(1.08 ± 0.02)
PCB BOTTOM VIEW
Figure 6. Suggested module positioning and panel cut-out for HFBR-53B3EM.
11
10.
+0.5
9
0.25
0.4
+0.02
3
-0.01
)
XXXX-XXXX
Agilent ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TX
RX
KEY:
YYWW = DATE CODE
XXXX-XXXX = HFBR-53B3FM
ZZZZ = 850 nm
39.6
MAX.
(1.56)
1.01
(0.40)
+0.25
0.46 -0.05
9X Ø
0.018 +0.010
-0.002
(
23.8
(0.937)
20.32
(0.800)
2.2
SLOT DEPTH (0.09)
10.2
(0.40) MAX.
)
3.3 ± 0.38
(0.130 ± 0.015)
14.4
(0.57)
9.8 MAX.
(0.386)
20.32
(0.800)
22.0
(0.87)
15.8 ± 0.15
(0.622 ± 0.006)
)
8X 2.54
(0.100)
2X Ø
AREA
RESERVED
FOR
PROCESS
PLUG
1.3
2X Ø (0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 7. Package outline for HFBR-53B3FM.
12
12.7
(0.50)
29.7
(1.17)
SLOT WIDTH
25.8
(1.02) MAX.
(
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
0.25 +0.1
-0.05
0.010 +0.004
-0.002
12.7
(0.50)
+0.25
1.27 -0.05
0.050 +0.010
-0.002
(
20.32
(0.800)
)
2.0 ± 0.1
(0.079 ± 0.004)
1.98
(0.078)
DIMENSION SHOWN FOR MOUNTING MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.27 OPTIONAL SEPTUM
(0.05)
30.2
(1.19)
0.36
(0.014)
10.82
(0.426)
13.82
(0.544)
BOTTOM SIDE OF PCB
1.82
(0.072)
26.4
(1.04)
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8. Suggested module positioning and panel cut-out for HFBR-53B3FM.
Ordering Information
850 nm VCSEL
(SX – Short Wavelength Laser)
HFBR-53B3EM Extended shield, metal housing.
HFBR-53B3FM Flush shield, metal housing.
13
KEEP OUT ZONE
14.73
(0.58)
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semiconductors
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Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
Obsoletes: 5998-5257EN
June 12, 2002
5988-7029EN