ETC HFCT-5911ATL

Agilent HFCT-5911ATL Single Mode Laser
Transceivers for Gigabit Ethernet and
iSCSI Applications at 1.25 Gb/s
Data Sheet
Description
The HFCT-5911ATL transceiver
is a high performance, cost
effective module for serial
optical data communications
applications operating at 1.25
Gb/s. This module is designed
for single mode fiber and
operates at a nominal
wavelength of 1310 nm. It
incorporates high performance,
reliable, long wavelength optical
devices and proven circuit
technology to give long life and
consistent service.
The transmitter section
incorporates a 1310 nm Fabry
Perot (FP) laser. The transmitter
has full IEC 825 and CDRH Class
1 eye safety.
The receiver section uses an
MOVPE grown planar SEDET
PIN photo detector for low dark
current and excellent
responsivity.
The transceiver is supplied in
the industry standard 2 x 5 DIP
style package with the LC fiber
connector interface and is
footprint compatible with SFF
Multi Source Agreement (MSA).
Features
• 10 km Links with 9/125 µm single
mode fiber (SMF)
• 550 m Links in 62.5/125 µm multi
mode fiber (MMF)
• Compliant to IEEE 802.3, 2000
Edition
• Compliant to Small Form Factor
MSA specifications
• 2 x 5 package style with LC
receptacle
• Single +3.3 V power supply
• Case operating temperature
range: -10°C to +85°C
• Manufactured in an ISO9002
certified facility
• Fully Class 1 CDRH/IEC 825
compliant
• Wave solder and aqueous wash
process compatible
Applications
• Gigabit Ethernet 1000BASE-LX
• High speed links for Gigabit
Ethernet
• Switches
• Routers
• Hubs
Functional Description
Receiver Section
Design
The receiver section for the
HFCT-5911ATL contains an
InGaAs/InP photo detector and
a pre-amplifier mounted in an
optical subassembly. This optical
subassembly is coupled to a
post-amplifier/decision circuit
on a circuit board. The design of
the optical assembly is such that
it provides better than 12 dB
Optical Return Loss (ORL).
Figure 1 also shows a filter
function which limits the
bandwidth of the pre-amplifier
output signal. The filter is
designed to bandlimit the preamplifier output noise and thus
improve the receiver sensitivity.
These components will reduce
the sensitivity of the receiver as
the signal bit rate is increased
above 1.25 Gb/s.
The post-amplifier is ac coupled
to the pre-amplifier as
illustrated in Figure 1. The
coupling capacitors are capable
of passing the Gigabit Ethernet
test pattern at 1.25 Gb/s without
any significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
Figure 1. Receiver Block Diagram
2
PECL
OUTPUT
BUFFER
AMPLIFIER
GND
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of the
received signal and comparing
this level to a reference. The SD
output is low voltage TTL.
DATA OUT
FILTER
TRANSIMPEDANCE
PREAMPLIFIER
Noise Immunity
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
Application Section).
SIGNAL
DETECT
CIRCUIT
TTL
OUTPUT
BUFFER
DATA OUT
SD
Functional Description
Transmitter Section
Design
A schematic diagram for the
transmitter is shown in Figure 2.
The HFCT-5911ATL
incorporates an FP laser and has
been designed to be compliant
with IEC 825 eye safety
requirements under any single
fault condition and CDRH under
normal operating conditions.
The optical output is controlled
by a custom IC that detects the
laser output via the monitor
photodiode. This IC provides
both dc and ac current drive to
the laser to ensure correct
modulation, eye diagram and
extinction ratio over
temperature, supply voltage and
operating life.
FP
LASER
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
LASER BIAS
CONTROL
Figure 2. Simplified Transmitter Schematic
3
PHOTODIODE
(rear facet monitor)
Package
The overall package concept for
the device consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and the
housing as illustrated in the
block diagram in Figure 3.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin out
are compliant with the multisource definition of the 2 x 5
DIP.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
The receiver electrical
subassembly includes an
internal shield for the electrical
and optical subassembly to
ensure high immunity to
external EMI fields.
The optical subassemblies are
each attached to their respective
transmit or receive electrical
subassemblies. These two units
are then placed within the outer
housing of the transceiver. The
outer housing of the transceiver
is molded with nonconductive
plastic to provide mechanical
strength. The housing is then
encased with a metal EMI
protective shield. The case is
signal ground and we
recommend soldering the four
ground tabs to host card signal
ground.
Each electrical subassembly PCB
carries the signal pins that exit
from the bottom of the
transceiver.
The solder posts are fastened
into the molding of the device.
This design provides the
mechanical strength required to
withstand the additional
stresses on the transceiver
resulting from the insertion
force of fiber cable mating.
Although the solder posts are
connected electrically to the
transceiver, it is recommended
that they are connected to the
chassis ground.
RX SUPPLY
*
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
DATA OUT
RX GROUND
SIGNAL
DETECT
LC
RECEPTACLE
TX GROUND
DATA IN
DATA IN
Tx DISABLE
LASER BIAS
MONITORING
LASER DRIVER
AND CONTROL
CIRCUIT
LASER DIODE
OUTPUT POWER
MONITORING
TX SUPPLY
LASER
OPTICAL
SUBASSEMBLY
CASE
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE
Figure 3. Block Diagram
4
15.0 ± 0.2
(0.591 ± 0.008)
13.59 + 0
- 0.2
0.535 +0
-0.008
(
13.59
(0.535)
MAX
)
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
(0.386)
MAX
10.8 ± 0.2
9.6 ± 0.2
(0.425 ± 0.008)(0.378 ±0.008)
Ø 1.07
(0.042)
10.16
(0.4)
19.5 ±0.3
(0.768 ±0.012)
FRONT VIEW
4.06
(0.16)
MIN
1
(0.039)
10 x 0.5
(0.02)
1.78
(0.07)
3.81
(0.15)
MIN
0.25
(0.01)
1
(0.039)
BACK VIEW
SIDE VIEW
10 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
TCASE REFERENCE
POINT
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-5911ATL Package Outline Drawing
5
Connection Diagram
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
o
o
o
o
o
1
2
3
4
5
10
9
8
7
6
o
o
o
o
o
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Figure 5. Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Receiver Signal Ground VEE RX:
Directly connect this pin to the
receiver ground plane.
Pin 4 Receiver Data Out Bar RD-:
Output internally biased and ac
coupled.
Pin 9 Transmitter Data In TD+:
Input internally terminated and
ac coupled.
Pin 2 Receiver Power Supply VCC RX:
Provide +3.3 V dc via the
recommended dc receiver power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the VCC RX
pin. Note: the filter circuit
should not cause VCC to drop
below minimum specification.
Pin 5 Receiver Data Out RD+:
Output internally biased and ac
coupled.
Pin 10 Transmitter Data In Bar TD-:
Input internally terminated and
ac coupled.
Pin 6 Transmitter Power Supply
VCC TX:
Provide +3.3 V dc via the
recommended dc transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
VCC TX pin.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Pin 7 Transmitter Signal Ground
VEE TX:
Directly connect this pin to the
transmitter signal ground plane.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
Pin 3 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a LVTTL input on
an upstream circuit, such as
Signal Detect input or Loss of
Signal-bar.
6
Pin 8 Transmitter Disable TDIS:
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Application Information
The Applications Engineering
Group at Agilent is available to
assist you with technical
understanding and design tradeoffs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
link. The OPB is allocated for the
fiber-optic cable length and the
corresponding link penalties.
For proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
The Gigabit Ethernet IEEE 802.3
standard identifies, and has
modeled, the contributions of
these OPB penalties to establish
the link length requirements for
62.5/125 µm and 50/125 µm
multimode fiber usage. In
addition, single mode fiber with
standard 1310 nm Fabry-Perot
lasers have been modeled and
specified. Refer to the IEEE
802.3 standard and its
supplemental documents that
develop the model, empirical
results and specifications.
The following information is
provided to answer some of the
most common questions about
the use of the parts.
Optical Power Budget and
Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiberoptic link is determined by the
difference between the
minimum transmitter output
optical power (dBm avg) and the
lowest receiver sensitivity (dBm
avg). This OPB provides the
necessary optical signal range to
establish a working fiber-optic
Refer to Section 38.11.4 for
specification of offset-launch
mode-conditioning patch cord
required for MMF operation of
HFCT-5911ATL.
10km Link Support
As well as complying with the
LX 5 km standard, the HFCT5911ATL specification provides
additional margin allowing for a
10 km Gigabit Ethernet link on a
single mode fiber. This is
accomplished by limiting the
spectral width and center
wavelength range of the
transmitter while increasing the
output optical power and
improving sensitivity. All other
LX cable plant recommendations
should be followed.
Z = 50 W
VCC (+3.3 V)
TDIS (LVTTL)
130 W
TD-
Z = 50 W
NOTE A
130 W
VEE TX o
VCC TX o
o RD+
6
o RD-
TD+ o
7
o SD
8
o V CC RX
RX
TD- o
TX
9
o VEE RX
10
TDIS o
TD+
1
2
3
4
5
VCC (+3.3 V)
1 µH
C2
10 µF
C3
10 µF
VCC (+3.3 V)
1 µH
RD+
C1
10 µF
Z = 50 W
100 W
NOTE B
RD-
Z = 50 W
SD
Note:
C1 = C2 = C3 = 10 nF or 100 nF
TD+, TD- INPUTS ARE INTERNALLY TERMINATED AND AC COUPLED.
RD+, RD- OUTPUTS ARE INTERNALLY BIASED AND AC COUPLED.
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT.
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ V CC - 1.3 V.
Figure 6. Recommended Interface Circuit
7
LVTTL
Electrical and Mechanical Interface
Recommended Circuit
Figure 6 shows the
recommended interface for
deploying the Agilent
transceivers in a +3.3 V system.
Data Line Interconnections
Agilent’s HFCT-5911ATL fiberoptic transceivers are designed
to couple to +3.3 V PECL signals.
The transmitter driver circuit
regulates the output optical
power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is balanced in
duty cycle. If the data duty cycle
has long, continuous state times
(low or high data duty cycle),
then the output optical power
will gradually change its average
output optical power level to its
preset value.
2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1
(0.09)
(0.055 ±0.004)
The HFCT-5911ATL has a
transmit disable function which
is a single-ended +3.3 V TTL
input which is dc-coupled to Pin
8.
The receiver section is internally
ac-coupled between the preamplifier and the post-amplifier
stages. The Data and Data-bar
outputs of the post-amplifier are
internally biased and ac-coupled
to their respective output pins
(Pins 4, 5).
Caution should be taken to
account for the proper interconnection between the supporting
Physical Layer integrated
circuits and these transceivers.
Figure 6 illustrates a
recommended interface circuit
for interconnecting to a +3.3 V
dc PECL fiber-optic transceiver.
Signal Detect is a single-ended,
+3.3 V TTL compatible output
signal that is dc-coupled to Pin 3
of the module. Signal Detect
should not be ac-coupled
externally to the follow-on
circuits because of its infrequent
state changes.
17.8
(0.700)
2 x Ø 1.4 ±0.1
7.11
(0.055 ±0.004)
(0.28)
3.56
(0.14)
4 x Ø 1.4 ±0.1
(0.055 ±0.004)
13.34
(0.525)
10.16
(0.4)
7.59
(0.299)
9.59
(0.378)
3
(0.118)
4 x 1.78
(0.07)
3
(0.118)
6
(0.236)
2
(0.079)
2
2 x Ø 2.29
(0.079) (0.09)
4.57
(0.18)
3.08
(0.121)
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 7. Recommended Board Layout Hole Pattern
8
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figure 6
shows the power supply circuit
which complies with the Small
Form Factor Multisource
Agreement. It is further
recommended that a continuous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This
recommendation is in keeping
with good high frequency board
layout practices.
Package footprint and front panel
considerations
The Agilent transceivers comply
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 5 package style.
This drawing is reproduced in
Figure 7 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure 8
shows the front panel
dimensions associated with such
a layout.
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the event
of a single fault failure, the
transmit-ter must either
maintain eye-safe operation or
be disabled.
The HFCT-5911ATL is
intrinsically eye safe and does
not require shut down circuitry.
000
000
000
15.24
(0.6)
10.16 ± 0.1
(0.4 ± 0.004)
TOP OF PCB
000
000
000
000
000
000
000
000000000
000000000
000000000
000000000
000000000
B
B
DETAIL A
15.24
(0.6)
1
(0.039)
00
00
00
00000000000000000000000000000
00000000000000000000000000000
14.22 ±0.1
(0.56 ±0.004)
00
00
00
SOLDER POSTS
0000000000
0000000000 00000000000000000000000000000
00000000000000000000000000000
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
DIMENSIONS IN MILLIMETERS (INCHES)
1.
2.
FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
Figure 8. Recommended Panel Mounting
Signal Detect
The Signal Detect circuit
provides a de-asserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optical power and
-30 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or data
source). The Signal Detect does
not detect receiver data error or
error-rate. Data errors can be
determined by signal processing
offered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
9
A
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-5911ATL
to provide good EMI
performance. The EMI
performance of a chassis is
dependent on physical design
and features which help improve
EMI suppression. Agilent
encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
Agilent’s LC transceivers (HFCT5911ATL) have nose shields
which provide a convenient
chassis connection to the nose of
the transceiver. This nose shield
improves system EMI
performance by effectively
closing off the LC aperture.
Localized shielding is also
improved by tying the four metal
housing package grounding tabs
to signal ground on the PCB.
Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and signal grounds together.
Figure 8 shows the
recommended positioning of the
transceivers with respect to the
PCB and faceplate.
Package and Handling Instructions
Flammability
The HFCT-5911ATL transceiver
housing consists of high
strength, heat resistant and UL
94 V-0 flame retardant plastic
and metal packaging.
Recommended Solder and Wash
Process
The HFCT-5911ATL are
compatible with industrystandard wave solder processes.
Process plug
This transceiver is supplied with
a process plug for protection of
the optical port within the LC
connector receptacle. This
process plug prevents
contamination during wave
solder and aqueous rinse as well
as during handling, shipping and
storage. It is made of a hightemperature, molded sealing
material that can withstand
+85°C and a rinse pressure of
110 lbs per square inch.
10
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5911ATL should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process
is the use of forced nitrogen. If
contamination is thought to have
remained, the optical ports can
be cleaned using a NTT
international Cletop stick type
(diam. 1.25mm) and HFE7100
cleaning fluid.
Regulatory Compliance
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
equipment design will determine
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
Electrostatic Discharge (ESD)
The device has been tested to
comply with MIL-STD-883
(Method 3015). It is important to
use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
Immunity
Transceivers will be subject to
radio-frequency electromagnetic
fields following the IEC 61000-4-3
test method.
Table 1: Regulatory Compliance - Targeted Specification
Feature
Electrostatic Discharge
(ESD) to the
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Electromagnetic
Interference (EMI)
Eye Safety
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per IEC60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH.
They are also eye safe under
normal operating conditions and
under all reasonably foreseeable
single fault conditions per
IEC60825-1. Agilent has tested
the transceiver design for
compliance with the
requirements listed below.
These tests were conducted
under normal operating
conditions and under single
fault conditions where
applicable. TUV Rheinland has
granted certification to these
transceivers for laser eye safety
and use in IEC60825-2
applications. Their performance
enables the transceivers to be
used without concern for eye
safety up to 3.6 V transmitter
VCC.
Test Method
MIL-STD-883
Method 3015
Performance
Class 2 (>2 kV).
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Margins are dependent on customer board and chassis
designs.
Immunity
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class I
Variation of IEC 61000-4-3
Laser Eye Safety
and Equipment Type
Testing
FDA CDRH
21-CFR 1040
Class 1
Component
Recognition
IEC 60825-1
Amendment 2
2001 - 01
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
11
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Accession Number:
HFCT-5911ATL ) 9521220 - 53
License Number: 933/510206/01
UL File Number: E173874
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5911ATL.
All adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of
the parts will result in voided
product warranty. It may also
result in improper operation of
the circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the devices to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5911ATL in
a manner inconsistent with its
design and function may result
in hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to re-certify and
re-identify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
12
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Storage Temperature
(non-operating)
Relative Humidity
Supply Voltage
Input Voltage on any Pin
Symbol
TS
Min
-40
RH
VCC
VI
-0.5
-0.5
Typ
Max
+85
Unit
°C
85
3.6
VCC
%
V
V
Max
+85
3.5
10
1.0
Unit
°C
V
mVP-P
W
V
V
µs
ms
Max
+260/10
Unit
°C/sec.
Notes
1
Recommended Operating Conditions
Parameter
Case Operating Temperature
Supply Voltage
Power Supply Noise Rejection
Data Output Load
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
Symbol
TC
VCC
PSNR
RDL
TDIS
TDIS
TASSERT
TDEASSERT
Min
-10
3.1
100
Symbol
TSOLD/tSOLD
Min
Typ
+25
3.3
50
0.6
2.2
Notes
2
3
4
Process Compatibility
Parameter
Wave Soldering and Aqueous Wash
Typ
Notes
5
Notes:
1. The transceiver is class 1 eye safe up to V CC = 3.6 V.
2. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place.
Typically less than a 1 dB change in sensitivity is experienced.
3. Time delay from Transmit Disable Assertion to laser shutdown.
4. Time delay from Transmit Disable Deassertion to laser startup.
5. Aqueous wash pressure <110 psi.
13
Transmitter Electrical Characteristics
TC = -10°C to +85°C, VCC = 3.1 V to 3.5 V
Parameter
Supply Current
Transmitter Power Dissipation
Data Input Voltage Swing (single-ended)
Transmitter Differential
Data Input Current - Low
Transmitter Differential
Data Input Current - High
Symbol
ICCT
PDIST
VIH - VIL
Min
IIL
-350
Typ
52
172
250
Max
120
420
930
Unit
mA
mW
mV
Notes
µA
IIH
350
µA
Max
140
490
930
0.40
0.40
0.6
Unit
mA
mW
mV
ns
ns
V
V
µs
µs
Receiver Electrical Characteristics
TC = -10°C to +85°C, VCC = 3.1 V to 3.5 V
Parameter
Supply Current
Receiver Power Dissipation
Data Output Voltage Swing (single-ended)
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
Symbol
ICCRX
PDISS
VOH - VOL
tr
tf
VOL
VOH
ASMAX
ANSMAX
Min
575
2.0
Notes:
1. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
2. These are 20-80% values.
3. SD is LVTTL compatible.
14
Typ
103
340
100
100
Notes
1
2
2
3
3
Transmitter Optical Characteristics
TC = -10°C to +85°C, VCC = 3.1 V to 3.5 V
Parameter
Output Optical Power 9 µm SMF
62.5 µm MMF
50 µm MMF
Optical Extinction Ratio
Center Wavelength
Spectral Width - RMS
Optical Rise/Fall Time
Random Intensity Noise
Contributed Total Jitter added at TP2
Coupled Power Ratio 62.5 µm MMF
Coupled Power Ratio 50 µm MMF
Symbol
POUT
ER
Cl
Min
-9.5
-11.5
-11.5
9
1278
Typ
1.4
TRISE/FALL
RIN12
TJ
CPR
CPR
Max
-3
-3
-3
Unit
dBm
1343
2.8
0.26
-120
227
28<CPR<40
12<CPR<20
dB
nm
nm
ns
dB/Hz
ps
Notes
1
8, Fig 10
8, Fig 10
2, 3, Fig 9
4
Receiver Optical Characteristics
TC = -10°C to +85°C, VCC = 3.1 V to 3.5 V
Parameter
Receiver Overload
Receiver Sensitivity
Stressed Receiver Sensitivity
Stressed Receiver Eye Opening at TP4
Receiver Electrical 3 dB Upper Cutoff
Frequency
Operating Center Wavelength
Return Loss
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
Symbol
PIN MAX
PIN MIN
Min
-3
Typ
Max
-20
-14.4
201
1500
lC
PA
PD
PA - PD
1270
12
1570
-20
-30
1.5
Unit
dBm avg
dBm avg
dBm avg
ps
MHz
Reference
5
6, 7
4, 7
nm
dB
dBm avg
dBm avg
dB
Notes:
1. The maximum Optical Output Power complies with IEEE 802.3 specification, and is class 1 laser eye safe.
2. These are unfiltered 20-80% values.
3. An eye diagram (Figure 9) specifies laser transmitter pulse response characteristics. The characteristics include rise time, fall time, pulse
undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. The referenced Gigabit Ethernet eye
diagram using the required filter specifies these parameters. The output optical waveform complies with the requirements of the eye mask
discussed in section 38.6.5 and Fig. 38-2 of IEEE 802.3.
4. TP refers to the compliance point specified in 802.3, section 38.2.1.
5. The receiver sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
For a 27-1 PRBS the receiver will provide output data with better than or equal to 1E-12 BER.
6. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3, section 38.6.11. The conformance test signal is
conditioned by applying deterministic jitter and intersymbol interference.
7. The stressed receiver jitter is measured using the conformance test signal defined in 802.3, section 38.6.11 and set to an average optical power 0.5
dB greater than the specified stressed receiver sensitivity.
8. In order to meet the 10 km link power budget the transmitter can trade off spectral width and center wavelength as shown in Figure 10.
15
NORMALIZED TIME (UNIT INTERVAL)
0.625
0.22
0.375
0.78
1.0
130
1.30
100
1.00
80
0.80
50
0.50
20
0.20
0
0.0
-20
NORMALIZED AMPLITUDE
NORMALIZED AMPLITUDE (%)
0
-0.20
0
37.5
62.5
78
22
NORMALIZED TIME (% OF UNIT INTERVAL)
100
Figure 9. Gigabit Ethernet Transmitter eye mask diagram
5
4.5
RMS spectral width (nm)
4
3.5
3
2.5
2
1.5
Minimum Launched Power -9.5 dBm
1
0.5
0
1270
1280
1290
1300
1310
1320
1330
1340
1350
Wavelength (nm)
Figure 10. Maximum spectral width trade off curve derived from GigaBit Ethernet link model
16
1360
Design Support Materials
Agilent has created a reference
design with HDMP-1687 PHY IC
in order to demonstrate full
functionality and
interoperability. Such design
information and results can be
made available to the designer
as a technical aid. Please contact
your Agilent representative for
further information if required.
Ordering Information
1310 nm FP Laser (Case Temperature range -10°C to +85°C)
HFCT-5911ATL
Related Products
Other single mode Gigabit Ethernet transceivers in this product family are:
HFCT-5914ATL
2x10 DIP
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5911ATL can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
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Hong Kong: (+65) 271 2451
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Malaysia, Singapore: (+65) 271 2054
Taiwan: (+65) 271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes: 5988-7982EN
October 8, 2002
5988-8139EN