a FEATURES 14-Bit/16-Bit Multiplying DAC Guaranteed Monotonicity Output Control on Power-Up and Power-Down Internal or External Control Versatile Serial Interface DAC Clears to 0 V in Both Unipolar and Bipolar Output Ranges Serial Input, 14-Bit/16-Bit DAC AD7849* FUNCTIONAL BLOCK DIAGRAM VDD R VREF+ ROFS R A1 R APPLICATIONS Industrial Process Control PC Analog I/O Boards Instrumentation VCC 16SEGMENT SWITCH MATRIX R 10-BIT/ 12-BIT DAC 10/ 12 A2 R VREF– RST IN G1 VOUT A3 LOGIC CIRCUITRY G2 DAC LATCH 4 10/ 12 AD7849 INPUT LATCH VOLTAGE MONITOR AGND RST OUT INPUT SHIFT REGISTER/ CONTROL LOGIC GENERAL DESCRIPTION The AD7849 is a 14-bit/16-bit serial input multiplying DAC. The DAC architecture ensures excellent differential linearity performance, and monotonicity is guaranteed to 14 bits for the A grade and to 16 bits for all other grades over the specified temperature ranges. During power-up and power-down sequences (when the supply voltages are changing), the VOUT pin is clamped to 0 V via a low impedance path. To prevent the output of A3 being shorted to 0 V during this time, transmission gate G1 is also opened. These conditions are maintained until the power supplies stabilize and a valid word is written to the DAC register. At this time, G2 opens and G1 closes. Both transmission gates are also externally controllable via the Reset In (RST IN) control input. For instance, if the RST IN input is driven from a battery supervisor chip, then on power-off or during a brown out, the RST IN input will be driven low to open G1 and close G2. The DAC must be reloaded, with RST IN high, to re-enable the output. Conversely, the on-chip voltage detector output (RST OUT) is also available to the user to control other parts of the system. DGND SDIN SCLK SYNC CLR BIN/ DCEN SDOUT LDAC VSS COMP The AD7849 has a versatile serial interface structure and can be controlled over three lines to facilitate opto-isolator applications. SDOUT is the output of the on-chip shift register and can be used in a daisy-chain fashion to program devices in the multichannel system. The DCEN (Daisy Chain Enable) input controls this function. The BIN/COMP pin sets the DAC coding; with BIN/COMP set to 0, the coding is straight binary; and with it set to 1, the coding is 2s complement. This allows the user to reset the DAC to 0 V in both the unipolar and bipolar output ranges. The part is available in a 20-lead DIP and 20-lead SOIC package. *Protected by U.S. Patent No. 5,319,371. REV. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000 AD7849–SPECIFICATIONS1 (VDD = +14.25 V to +15.75 V; VSS = –14.25 V to –15.75 V; VCC = +4.75 V to +5.25 V; VOUT loaded with 2 kΩ,2 200 pF to 0 V; VREF+ = +5 V; ROFS connected to 0 V; TA = TMIN to TMAX, unless otherwise noted) Parameter A Versions B, T Versions C Versions Units Test Conditions/Comments RESOLUTION 14 16 16 Bits A Versions: 1 LSB = 2 (VREF+–VREF–)/214 B, C, T Versions: 1 LSB = 2 (VREF+–VREF–)/216 UNIPOLAR OUTPUT Relative Accuracy @ +25°C TMIN to TMAX Differential Nonlinearity Gain Error @ +25°C TMIN to TMAX Offset Error @ +25°C TMIN to TMAX Gain TC3 Offset TC3 ±4 ±5 ± 0.25 ±1 ±4 ±1 ±6 ±2 ±2 ±6 ± 16 ± 0.9 ±4 ± 16 ±4 ± 24 ±2 ±2 ±4 ±8 ± 0.5 ±4 ± 16 ±4 ± 16 ±2 ±2 LSBs typ LSBs max LSBs max LSBs typ LSBs max LSBs typ LSBs max ppm FSR/°C typ ppm FSR/°C typ BIPOLAR OUTPUT Relative Accuracy @ +25°C TMIN to TMAX Differential Nonlinearity Gain Error @ +25°C TMIN to TMAX Offset Error @ +25°C TMIN to TMAX Bipolar Zero Error @ +25°C TMIN to TMAX Gain TC3 Offset TC3 Bipolar Zero TC3 ±2 ±3 ± 0.25 ±1 ±4 ± 0.5 ±3 ± 0.5 ±4 ±2 ±2 ±2 ±3 ±8 ± 0.9 ±4 ± 16 ±2 ± 12 ±2 ± 12 ±2 ±2 ±2 ±2 ±4 ± 0.5 ±4 ± 16 ±2 ±8 ±2 ±8 ±2 ±2 ±2 LSBs typ LSBs max LSBs max LSBs typ LSBs max LSBs typ LSBs max LSBs typ LSBs max ppm FSR/°C typ ppm FSR/°C typ ppm FSR/°C typ 25 43 VSS + 6 to VDD – 6 VSS + 6 to VDD – 6 25 43 VSS + 6 to VDD – 6 VSS + 6 to VDD – 6 25 43 VSS + 6 to VDD – 6 VSS + 6 to VDD – 6 kΩ min kΩ max Volts VSS + 4 to VDD – 4 2 200 0.3 ± 25 VSS + 4 to VDD – 4 2 200 0.3 ± 25 VSS + 4 to VDD – 4 2 200 0.3 ± 25 V max kΩ min pF max Ω typ mA typ 2.4 0.8 ± 10 10 2.4 0.8 ± 10 10 2.4 0.8 ± 10 10 V min V max µA max pF max 0.4 4.0 ± 10 0.4 4.0 ± 10 0.4 4.0 ± 10 Volts max Volts min µA max 10 10 10 pF max +14.25/+15.75 –14.25/–15.75 +4.75/+5.25 5 5 2.5 0.4 100 +14.25/+15.75 –14.25/–15.75 +4.75/+5.25 5 5 2.5 1.5 100 +14.25/+15.75 –14.25/–15.75 +4.75/+5.25 5 5 2.5 1.5 100 V min/V max V min/V max V min/V max mA max mA max mA max LSB/V max mW typ REFERENCE INPUT Input Resistance VREF+ Range VREF– Range OUTPUT CHARACTERISTICS Output Voltage Swing Resistive Load Capacitive Load Output Resistance Short Circuit Current DIGITAL INPUTS VINH, Input High Voltage VINL, Input Low Voltage IINH, Input Current CIN, Input Capacitance DIGITAL OUTPUTS VOL (Output Low Voltage) VOH (Output High Voltage) Floating State Leakage Current Floating State Output Capacitance POWER REQUIREMENTS4 VDD VSS VCC IDD ISS ICC Power Supply Sensitivity5 Power Dissipation VREF– = 0 V, VOUT = 0 V to +10 V All Grades Guaranteed Monotonic Over Temperature VOUT Load = 10 MΩ VREF– = –5 V, VOUT = –10 V to +10 V All Grades Guaranteed Monotonic Over Temperature VOUT Load = 10 MΩ Resistance from VREF+ to VREF– Typically 34 kΩ Volts To 0 V To 0 V Voltage Range: –10 V to +10 V ISINK = 1.6 mA ISOURCE = 400 µA VOUT Unloaded, VINH = VDD – 0.1 V, VINL = 0.1 V VOUT Unloaded, VINH = VDD – 0.1 V, VINL = 0.1 V VINH = VDD – 0.1 V, VINL = 0.1 V VOUT Unloaded NOTES 1 Temperature ranges: A, B, C Versions: –40°C to +85°C; T Version: –55°C to +125°C. 2 Minimum load for T Version is 3 kΩ. 3 Guaranteed by design and characterization, not production tested. 4 The AD7849 is functional with power supplies of ± 12 V. See Typical Performance Curves. 5 Sensitivity of Gain Error, Offset Error and Bipolar Zero Error to V DD, VSS variations. Specifications subject to change without notice. –2– REV. B AD7849 RESET SPECIFICATIONS (These specifications apply when the device goes into the Reset mode during a power-up or power-down sequence.) VOUT unloaded. Parameter All Versions Units VA1, Low Threshold Voltage for VDD, VSS 1.2 0 VB, High Threshold Voltage for VDD, VSS 9.5 6.4 1 VC, Low Threshold Voltage for VCC 0 4 VD, High Threshold Voltage for VCC 2.5 G2 RON 1 Test Conditions/Comments Volt max Volts typ Volts max Volts min Volt max Volts typ Volts max Volts min kΩ typ This is the lower VDD/VSS threshold voltage for the reset function. Above this, the reset is activated. This is the higher VDD/VSS threshold voltage for the reset function. Below this, the reset is activated. Typically 8 volts. This is the lower threshold voltage for the reset function. Above this, the reset is activated. This is the higher VCC threshold voltage for the reset function. Below this, the reset is activated. Typically 3 volts. On Resistance of G2; VDD = 2 V; VSS = –2 V; IG2 = 1 mA. NOTES 1 A pull-down resistor (65 kΩ) on VOUT maintains 0 V output when V DD/VSS is below VA. Specifications subject to change without notice. AC PERFORMANCE CHARACTERISTICS (These characteristics are included for Design Guidance and are not subject to test. (VREF+ = +5 V; VDD = +14.25 V to +15.75 V; VSS = –14.25 V to –15.75 V; VCC = +4.75 V to +5.25 V; ROFS connected to 0 V.) T Version A, B, C Versions Units Test Conditions/Comments 7 10 4 250 µs typ µs typ V/µs typ nV-s typ To 0.006% FSR. VOUT Loaded. VREF– = 0 V. To 0.003% FSR. VOUT Loaded. VREF– = –5 V. Slew Rate Digital-to-Analog Glitch Impulse 7 10 4 250 AC Feedthrough 150 1 150 1 nV-s typ mV pk-pk typ Digital Feedthrough 5 5 nV-s typ Output Noise Voltage Density 1 kHz–100 kHz 80 80 nV/√Hz typ Parameter DYNAMIC PERFORMANCE Output Settling Time1 DAC Alternately Loaded with 00 . . . 00 and 111 . . . 11. VOUT Unloaded. LDAC Permanently Low. BIN/COMP Set to 1. VREF– = –5 V. LDAC Frequency = 100 kHz VREF– = 0 V, VREF+ = 1 V rms, 10 kHz Sine Wave. DAC Loaded with All 0s. BIN/COMP Set to 0. DAC Alternately Loaded with All 1s and All 0s. SYNC High. Measured at VOUT. VREF+ = VREF– = 0 V. BIN/COMP Set to 0. NOTES 1 LDAC = 0. Settling time does not include deglitching time of 5 µs (typ). Specification subject to change without notice. TIMING CHARACTERISTICS1, 2 (VDD = +14.25 V to +15.75 V; VSS = –14.25 V to –15.75 V; VCC = +4.75 V to +5.25 V; RL = 2 kΩ, CL = 200 pF. All Specifications TMIN to TMAX unless otherwise noted.) Parameter 3 t1 t2 t3 t4 t5 t6 4 t7 tr tf Limit at +25ⴗC (All Versions) Limit at TMIN, TMAX (All Versions) Units Conditions/Comments 200 50 70 10 40 80 80 30 30 200 50 70 10 40 80 80 30 30 ns min ns min ns min ns min ns min ns max ns min µs max µs max SCLK Cycle Time SYNC to SCLK Setup Time SYNC to SCLK Hold Time Data Setup Time Data Hold Time SCLK Falling Edge to SDO Valid LDAC, CLR Pulsewidth Digital Input Rise Time Digital Input Fall Time NOTES 1 Guaranteed by characterization. 2 All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V. 3 SCLK mark/space ratio range is 40/60 to 60/40. 4 SDO load capacitance is 50 pF. Specification subject to change without notice. REV. B –3– AD7849 ABSOLUTE MAXIMUM RATINGS 1 NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 V CC must not exceed V DD by more than 0.4 V. If it is possible for this to happen during power-up or power-down (for example, if V CC is greater than +0.4 V while VDD is still 0 V), the following diode protection scheme will ensure protection. (TA = +25°C unless otherwise noted) VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V VCC to DGND2 . . . . . . . . . . . . . . . . . . –0.4 V, VDD + 0.4 V or +7 V (Whichever Is Lower) VSS to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to –17 V VREF+ to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V VREF– to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V VOUT to DGND3 . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V or ± 10 V (Whichever Is Lower) ROFS to DGND . . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V Digital Input Voltage to DGND . . . . . . –0.4 V to VCC + 0.4 V Input Current to any Pin Except Supplies4 . . . . . . . . . ± 10 mA Operating Temperature Range Commercial/Industrial (A, B, C Versions). . . . –40°C to +85°C Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Plastic DIP Package, Power Dissipation . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102°C/W Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +260°C SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 74°C/W Lead Temperature, Soldering Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 71°C/W Lead Temperature, Soldering (Soldering 10 secs) . . . 260°C VDD VDD AD7849AN AD7849BN AD7849CN AD7849AR AD7849BR AD7849CR AD7849TQ –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –55°C to +125°C Resolution (Bits) 14 16 16 14 16 16 16 VCC AD7849 3 V OUT may be shorted to DGND, +10 V, –10 V, provided that the power dissipation of the package is not exceeded. 4 Transient currents of up to 100 mA will not cause SCR latch-up. WARNING! ESD SENSITIVE DEVICE PIN CONFIGURATION ORDERING GUIDE Temperature Range SD103C 1N5711 1N5712 1N4148 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7849 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Model VCC Bipolar INL (LSBs) ±3 ±8 ±4 ±3 ±8 ±4 ±8 Package Option* N-20 N-20 N-20 R-20 R-20 R-20 Q-20 VREF+ 1 20 ROFS VREF– 2 19 VOUT SCLK 5 17 VDD AD7849 16 AGND TOP VIEW 15 RSTOUT (Not to Scale) 14 RSTIN SDOUT 7 VCC 6 DCEN 8 BIN/COMP 9 *N = Plastic DIP; R = SOP (Small Outline Package); Q = Cerdip. 18 NC VSS 3 SYNC 4 DGND 10 13 CLR 12 SDIN 11 LDAC NC = NO CONNECT –4– REV. B AD7849 TERMINOLOGY Least Significant Bit Offset Error This is the error present at the device output with all 0s loaded in the DAC. It is due to op amp input offset voltage and bias current and the DAC leakage current. This is the analog weighting of 1 bit of the digital word in a DAC. For the AD7849, B, C and T versions, 1 LSB = (VREF+ – VREF–)/ 216. For the AD7849, A version, 1 LSB = (VREF+ – VREF–)/214. Bipolar Zero Error When the AD7849 is connected for bipolar output and (100 . . . 000) is loaded to the DAC, the deviation of the analog output from the ideal midscale of 0 V, is called the bipolar zero error. Relative Accuracy Relative accuracy or endpoint nonlinearity is a measure of the maximum deviation from a straight line passing through the endpoints of the DAC transfer function. It is measured after adjusting for both endpoints (i.e., offset and gain errors are adjusted out) and is normally expressed in least significant bits or as a percentage of full-scale range. Digital-to-Analog Glitch Impulse This is the amount of charge injected from the digital inputs to the analog output when the inputs change state. This is normally specified as the area of the glitch in nV-secs. Differential Nonlinearity Differential nonlinearity is the difference between the measured change and the ideal change between any two adjacent codes. A specified differential nonlinearity of less than ± 1 LSB over the operating temperature range ensures monotonicity. Multiplying Feedthrough Error Gain Error When the DAC is not selected (SYNC is held high), high frequency logic activity on the digital inputs is capacitively coupled through the device to show up as noise on the VOUT pin. This noise is digital feedthrough. This is an ac error due to capacitive feedthrough from either of the VREF terminals to VOUT when the DAC is loaded with all 0s. Digital Feedthrough Gain error is a measure of the output error between an ideal DAC and the actual device output with all 1s loaded after offset error has been adjusted out. Gain error is adjustable to zero with an external potentiometer. PIN FUNCTION DESCRIPTION Pin Mnemonic Description 1 2 3 4 5 6 7 VREF+ VREF– VSS SYNC SCLK VCC SDOUT 8 DCEN 9 BIN/COMP VREF+ Input. The DAC is specified for VREF+ of +5 V. The DAC is fully multiplying so that the VREF+ range is +5 V to –5 V. VREF– Input. The DAC is specified for VREF– of –5 V. Since the DAC is fully multiplying the VREF– range is –5 V to +5 V. Negative supply for the analog circuitry. This is nominally –15 V. Data Synchronization Logic Input. When it goes low, the internal logic is initialized in readiness for a new data word. Serial Clock Logic Input. Data is clocked into the input register on each SCLK falling edge. Positive supply for the digital circuitry. This is nominally +5 V. Serial Data Output. With DCEN at Logic “1,” this output is enabled and the serial data in the input shift register is clocked out on each rising edge of SCLK. Daisy-Chain Enable Logic Input. Connect this pin high if a daisy-chain interface is being used, otherwise this pin must be connect low. Logic Input. This input selects the data format to be either binary or 2s complement. In the unipolar output range, natural binary format is selected by connecting the input to a Logic “0.” In the bipolar output range, offset binary is selected by connecting this input to a Logic “0” and 2s complement is selected by connecting it to a Logic “1.” Digital Ground. Ground reference point for the on-chip digital circuitry. Load DAC Logic Input. This input updates the DAC output. The DAC output is updated on the falling edge of this signal or alternatively, if this input is permanently low, an automatic update mode is selected whereby the DAC is updated on the 16th falling SCLK edge. Serial Data Input. The 16-bit serial data word is applied to this input. Clear Logic Input. Taking this input low sets VOUT to 0 V in both the unipolar output range and the bipolar 2s complement output range. It sets VOUT to VREF– in the offset binary bipolar output range. Reset Logic Input. This input allows external access to the internal reset logic. Applying a Logic “0” to this input, resets the DAC output to 0 V. In normal operation it should be tied to Logic “1.” Reset Logic Output. This is the output from the on-chip voltage monitor used in the reset circuit. It may used to control other system components if desired. This is the analog ground for the device. It is the point to which the output gets shorted in the reset mode. Positive supply for the analog circuitry. This is +15 V nominal. No Connect. Leave unconnected. DAC Output Voltage Pin. Input to summing resistor of DAC output amplifier. This is used to select output voltage ranges. See Figures 16 to 19 in “APPLYING THE AD7849.” 10 11 DGND LDAC 12 13 SDIN CLR 14 RSTIN 15 RSTOUT 16 17 18 19 20 AGND VDD NC VOUT ROFS REV. B –5– AD7849 Typical Performance Curves 7 VDD = +15V VSS = –15V VREF+ = 1V rms VREF– = 0V 6 C1 FREQ 9.9942kHz VREF+ 1 5 VOUT – mV pk-pk C1 RMS 728mV 3 2 C4 RMS 556µV VOUT 4 4 1 CH1 CH4 M 20.0µs CH1 1.00V 1.00mV 0 102 –300mV Figure 1a. AC Feedthrough 103 104 FREQUENCY – Hz 105 106 Figure 1b. AC Feedthrough vs. Frequency LDAC SYNC 1 1 SDIN 2 SDIN 2 C4 AREA 247.964nVS VOUT 4 VOUT 4 CH1 5.00V CH2 5.00V CH4 200mV M 1.00µs CH1 3.7V CH1 Figure 2a. Digital-to-Analog Glitch Impulse Without Internal Deglitcher 5.00V CH2 5.00V CH4 50.0mV M 5.00µs CH1 2.3V Figure 2b. Digital-to-Analog Glitch Impulse with Internal Deglitcher 22 20 C1 Pk-Pk 10.4V 18 VOUT – V pk-pk 16 14 12 VREF+ 1 VDD = +15V VSS = –15V VREF+ = ±5V SINE WAVE VREF– = 0V GAIN = +2 C2 Pk-Pk 20.8V 10 8 VOUT C2 RISE 2.79230µs 2 6 C2 FALL 3.20385µs 4 2 102 103 104 FREQUENCY – Hz 105 106 CH1 Figure 3. Large Signal Frequency Response 10.0V CH2 20.0V M 2.5µs CH1 –400mV Figure 4. Pulse Response (Large Signal) –6– REV. B AD7849 VREF+ 1 C1 Pk-Pk 104mV 2 C2 Pk-Pk 216mV VOUT C2 RISE 458ns C2 FALL 452.4ns CH1 100mV CH 2 200mV M 2.00µs CH1 –10mV Figure 5. Pulse Response (Small Signal) 2 1.5 TA = +25°C VREF+ = +5V VREF– = 0V GAIN = 1 C1 RISE 3.808 ms VDD INL – LSBs 1 1 C2 RISE 8µs VOUT 2 0.5 LDAC 3 0 11 12.25 13.5 VDD/V SS – Volts 14.75 16 CH1 CH 3 10.0V 5.00V CH 2 10.0V M 10.0ms CH 1 7.8V Figure 8. Turn-On Characteristics Figure 6. Typical Integral Nonlinearity vs. Supplies 0.5 DNL – LSBs 0.375 TA = +25°C VREF+ = +5V VREF– = 0V GAIN = 1 7.8V VDD C1 FALL 4.7621ms 1 0.25 VOUT 0.125 2 0 11 12 13 14 VDD/V SS – Volts 15 16 CH1 Figure 7. Typical Differential Nonlinearity vs. Supplies REV. B 10.0V CH 2 10.0V M 1.00ms CH 1 7.8V Figure 9. Turn-Off Characteristics –7– AD7849 CIRCUIT DESCRIPTION D/A CONVERSION RSTIN ROFS R 10kΩ Figure 10 shows the D/A section of the AD7849. There are three on-chip DACs each of which has its own buffer amplifier. DAC1 and DAC2 are 4-bit DACs. They share a 16-resistor string but have their own analog multiplexers. The voltage reference is applied to the resistor string. DAC3 is a 12-bit voltage mode DAC with its own output stage. R 10kΩ C1 G3 G1 VOUT DAC 3 The 4 MSBs of the 16-bit digital input code drive DAC1 and DAC2 while the 12 LSBs control DAC3. Using DAC1 and DAC2, the MSBs select a pair of adjacent nodes on the resistor string and present that voltage to the positive and negative inputs of DAC3. This DAC interpolates between these two voltages to produce the analog output voltage. ONE-SHOT LOGIC CIRCUITRY LDAC VOLTAGE MONITOR G2 AGND RSTOUT Figure 11. AD7849 Output Stage To prevent nonmonotonicity in the DAC due to amplifier offset voltages, DAC1 and DAC2 “leap-frog” along the resistor string. For example, when switching from Segment 1 to Segment 2, DAC1 switches from the bottom of Segment 1 to the top of Segment 2 while DAC 2 remains connected to the top of Segment 1. The code driving DAC3 is automatically complemented to compensate for the inversion of its inputs. This means that any linearity effects due to amplifier offset voltages remain unchanged when switching from one segment to the next and 16-bit monotonicity is ensured if DAC3 is monotonic. So, 12-bit resistor matching in DAC3 guarantees overall 16-bit monotonicity. This is much more achievable than the 16-bit matching which a conventional R-2R structure would have needed. When the supply voltages are changing, the VOUT pin is clamped to 0 V via a low impedance path . To prevent the output of A3 being shorted to 0 V during this time, transmission gate G1 is also opened. These conditions are maintained until the power supplies stabilize and a valid word is written to the DAC register. At this time, G2 opens and G1 closes. Both transmission gates are also externally controllable via the Reset In (RST IN) control input. For instance, if the RST IN input is driven from a battery supervisor chip, then on power-off or during a brownout, the RST IN input will be driven low to open G1 and close G2. The DAC has to be reloaded, with RST IN high, to re-enable the output. Conversely, the on-chip voltage detector output (RST OUT) is also available to the user to control other parts of the system. Output Stage The output stage of the AD7849 is shown in Figure 11. It is capable of driving a load of 2 kΩ in parallel with 200 pF. The feedback and offset resistors allow the output stage to be configured for gains of 1 or 2. Additionally, the offset resistor may be used to shift the output range. The AD7849 output buffer is configured as a track-and-hold amplifier. Although normally tracking its input, this amplifier is placed in a hold mode for approximately 5 µs after the leading edge of LDAC. This short state keeps the DAC output at its previous voltage while the AD7849 is internally changing to its new value. So, any glitches that occur in the transition are not seen at the output. In systems where the LDAC is permanently low, the deglitching will not be in operation. The AD7849 has a special feature to ensure output stability during power-up and power-down sequences. This is specifically available for control applications where actuators must not be allowed to move in an uncontrolled fashion. VREF+ R DAC 1 R DAC 2 S2 S1 R S3 DAC 3 S4 A1 S15 S17 10-BIT/12-BIT DAC S14 R OUTPUT STAGE S16 10/12 R DB15–DB12 R DB15–DB12 VREF – A2 Figure 10. AD7849 D/A Conversion –8– REV. B AD7849 t1 SCLK t3 t2 SYNC BIN/COMP t4 SDIN (AD7849B/C/T) DB0 t4 SDIN (AD7849A) t5 DB15 t5 DB13 DB0 t7 LDAC, CLR DCEN IS TIED PERMANENTLY LOW Figure 12. Timing Diagram (Stand-Alone Mode) DIGITAL INTERFACE There are two ways in which the DAC latch and hence the analog output may be updated. The status of the LDAC input is examined after SYNC is taken low. Depending on its status, one of two update modes is selected. The AD7849 contains an input serial to parallel shift register and a DAC latch. A simplified diagram of the input loading circuitry is shown in Figure 12. Serial data on the SDIN input is loaded to the input register under control of DCEN, SYNC and SCLK. When a complete word is held in the shift register it may then be loaded into the DAC latch under control of LDAC. Only the data in the DAC latch determines the analog output on the AD7849. If LDAC = 0 then the automatic update mode is selected. In this mode the DAC latch and analog output are updated automatically when the last bit in the serial data stream is clocked in. The update thus takes place on the sixteenth falling SCLK edge. The DCEN (daisy-chain enable) input is used to select either a stand-alone mode or a daisy-chain mode. The loading format is slightly different depending on which mode is selected. If LDAC = 1 then the automatic update is disabled. The DAC latch update and output update are now separate. The DAC latch is updated on the falling edge of LDAC. However, the output update is delayed for a further 5 µs by means of an internal track-and-hold amplifier in the output stage. This function results in lower digital-to-analog glitch impulse at the DAC output. Note that the LDAC input must be taken back high again before the next data transfer is initiated. Serial Data Loading Format (Stand-Alone Mode) With DCEN at Logic 0 the stand-alone mode is selected. In this mode a low SYNC input provides the frame synchronization signal which tells the AD7849 that valid serial data on the SDIN input will be available for the next 16 falling edges of SCLK. An internal counter/decoder circuit provides a low gating signal so that only 16 data bits are clocked into the input shift register. After 16 SCLK pulses the internal gating signal goes inactive (high) thus locking out any further clock pulses. Therefore either a continuous clock or a burst clock source may be used to clock in the data. DCEN SYNC RESET EN SCLK The SYNC input is taken high after the complete 16-bit word is loaded in. COUNTER/ DECODER GATED SCLK INPUT SHIFT REGISTER (16 BITS) SDOUT SDIN AUTO-UPDATE CIRCUITRY The AD7849B, AD7849C and AD7849T versions are 16-bit resolution DACS and have a straight 16-bit load format, with the MSB (DB15) being loaded first. The AD7849A is a 14-bit DAC but the loading structure is still 16-bit. The MSB (DB13) is loaded first and the final two bits of the 16-bit stream must be 0s. REV. B GATED SIGNAL ÷16 LDAC CLR DAC LATCH (14/16 BITS) Figure 13. Simplified Loading Structure –9– AD7849 t1 SCLK t2 t3 SYNC BIN/COMP t4 t5 SDIN (AD7849B/C/T) DB15 (N) DB0 (N) DB15 (N+1) DB0 (N+1) DB15 (N) DB0 (N) t6 SDOUT (AD7849B/C/T) t4 t5 SDIN (AD7849A) DB13 (N) DB13 (N+1) DB0 (N) DB0 (N+1) t6 SDOUT (AD7849A) DB13 (N) DB0 (N) t7 LDAC, CLR DCEN IS TIED PERMANENTLY HIGH Figure 14. Timing Diagram (Daisy-Chain Mode) Serial Data Loading Format (Daisy Chain Mode) Clear Function (CLR) By connecting DCEN high, the daisy-chain mode is enabled. This mode of operation is designed for multi-DAC systems where several AD7849s may be connected in cascade. In this mode, the internal gating circuitry on SCLK is disabled and a serial data output facility is enabled. The internal gating signal is permanently active (low) so that the SCLK signal is continuously applied to the input shift register when SYNC is low. The data is clocked into the register on each falling SCLK edge after SYNC going low. If more than 16 clock pulses are applied, the data ripples out of the shift register and appears on the SDOUT line. By connecting this line to the SDIN input on the next AD7849 in the chain, a multi-DAC interface may be constructed. Sixteen SCLK pulses are required for each DAC in the system. Therefore the total number of clock cycles must equal 16 × N where N is the total number of devices in the chain. When the serial transfer to all devices is complete, SYNC is taken high. This prevents any further data being clocked into the input register. The clear function bypasses the input shift register and loads the DAC Latch with all 0s. It is activated by taking CLR low. In all ranges except the Offset Binary bipolar range (–5 V to +5 V) the output voltage is reset to 0 V. In the offset binary bipolar range the output is set to VREF–. This clear function is distinct and separate from the automatic power-on reset feature of the device. APPLYING THE AD7849 Power Supply Sequencing and Decoupling In the AD7849, VCC should not exceed VDD by more than 0.4 V. If this does happen then an internal diode can be turned on and produce latch-up in the device. Care should be taken to employ the following power supply sequence: VDD; VSS; VCC. In systems where it is possible to have an incorrect power sequence (for example, if VCC is greater than 0.4 V while VDD is still 0 V), the circuit of Figure 15 may be used to ensure that the Absolute Maximum Ratings are not exceeded. A continuous SCLK source may be used if it can be arranged that SYNC is held low for the correct number of clock cycles. Alternatively, a burst clock containing the exact number of clock cycles may be used and SYNC taken high some time later. When the transfer to all input registers is complete, a common LDAC signal updates all DAC latches with the data in each input register. All analog outputs are therefore updated simultaneously, 5 µs after the falling edge of LDAC. VDD VCC SD103C 1N5711 1N5712 1N4148 VDD VCC AD7849 Figure 15. Power Supply Protection –10– REV. B AD7849 Unipolar Configuration Bipolar Configuration Figure 16 shows the AD7849 in the unipolar binary circuit configuration. The DAC is driven by the AD586, +5 V reference. Since ROFS is tied to 0 V, the output amplifier has a gain of ×2 and the output range is 0 V to +10 V. If a 0 V to +5 V range is required, ROFS should be tied to VOUT, configuring the output stage for a gain of ×1. Table I gives the code table for the circuit of Figure 16. Figure 17 shows the AD7849 set up for ± 10 V bipolar operation. The AD588 provides precision ± 5 V tracking outputs which are fed to the VREF+ and VREF– inputs of the AD7849. The code table for Figure 17 is shown in Table II. +15V 8 6 AD586 5 C1 1nF +5V VDD 2 VOUT +5V VDD VCC R1 39kΩ VOUT (0 TO +10V) ROFS 3 9 DGND VSS AD588 R2 100kΩ SIGNAL GND VOUT 2 7 C1 1µF AGND VREF– 6 4 AD7849* 4 *ADDITIONAL PINS OMITTED FOR CLARITY +15V VCC VREF+ R1 10kΩ Full-scale and bipolar-zero adjustment are provided by varying the gain and balance on the AD588. R2 varies the gain on the AD588 while R3 adjusts the +5 V and –5 V outputs together with respect to ground. –15V 1 5 14 10 15 11 16 12 8 VOUT (–10V TO +10V) ROFS VREF+ AD7849* AGND VREF– DGND VSS 13 SIGNAL GND R3 100kΩ Figure 16. Unipolar Binary Operation *ADDITIONAL PINS –15V OMITTED FOR CLARITY Table I. Code Table for Figure 16 Binary Number in DAC Latch MSB LSB Analog Output (VOUT) 1111 1000 0000 0000 +10 (65535/65536) V +10 (32768/65536) V +10 (1/65536) V 0V 1111 0000 0000 0000 1111 0000 0000 0000 1111 0000 0001 0000 Figure 17. Bipolar ± 10 V Operation Table II. Offset Binary Code Table for Figure 17 NOTE: Assumes 16-bit resolution; 1 LSB = 10 V/2 16 = 10 V/65536 = 152 µV. Offset and gain may be adjusted in Figure 16 as follows: To adjust offset, disconnect the VREF– input from 0 V, load the DAC with all 0s and adjust the VREF– voltage until VOUT = 0 V. For gain adjustment, the AD7849 should be loaded with all 1s and R1 adjusted until VOUT = 10 (65535)/65536 = 9.9998474 V, (B, T and C, 16-bit versions). For the 14-bit A version, VOUT should be 10 (16383/16384) = 9.9993896 V. If a simple resistor divider is used to vary the VREF– voltage, it is important that the temperature coefficients of these resistors match that of the DAC input resistance (–300 ppm/°C). Otherwise, extra offset errors will be introduced over temperature. Many circuits will not require these offset and gain adjustments. In these circuits, R1, can be omitted. Pin 5 of the AD586 may be left open circuit and Pin 2 (VREF– ) of the AD7849 tied to 0 V. REV. B Binary Number in DAC Latch MSB LSB Analog Output (VOUT) 1111 1000 1000 0111 0000 +10 (32767/32768) V +10 (1/32768) V 0V –10 (1/32768) V –10 (32768/32768) V 1111 0000 0000 1111 0000 1111 0000 0000 1111 0000 1111 0001 0000 1111 0000 NOTE: Assumes 16-bit resolution; 1 LSB = 20 V/2 16 = 305 µV. For bipolar-zero adjustment on the AD7849, load the DAC with 100 . . . 000 and adjust R3 until VOUT = 0 V. Full scale is adjusted by loading the DAC with all 1s and adjusting R2 until VOUT = 9.999694 V. When bipolar-zero and full-scale adjustment are not needed, R2 and R3 can be omitted, Pin 12 on the AD588 should be connected to Pin 11 and Pin 5 should be left floating. If a user wants a ± 5 V output range with the circuit of Figure 17, simply tie Pin 20 (ROFS) to Pin 19 (VOUT), thus reducing the output gain stage to unity and giving an output range of ± 5 V. –11– AD7849 Other Output Voltage Ranges MICROPROCESSOR INTERFACING In some cases, users may require output voltage ranges other than those already mentioned. One example is systems which need the output voltage to be a whole number of millivolts (i.e., 1 mV, 2 mV, etc.,). If Figure 18 is used, then the LSB size is 125 µV. This makes it possible to program whole millivolt values at the output. Table III shows the code table for Figure 18. Microprocessor interfacing to the AD7849 is via a serial bus which uses standard protocol compatible with DSP processors and microcontrollers. The communications channel requires a three-wire interface consisting of a clock signal, a data signal and a synchronization signal. The AD7849 requires a 16-bit data word with data valid on the falling edge of SCLK. For all the interfaces, the DAC update may be done automatically when all the data is clocked in or it may be done under control of LDAC. +15V +5V VDD 8 R1 VCC VREF+ 8.192V VOUT 1 AD584 Figures 20 to 24 show the AD7849 configured for interfacing to a number of popular DSP processors and microcontrollers. ROFS VOUT (0V TO +8.192V) AD7849-ADSP-2101/ADSP-2102 Interface AD7849* R2 DGND 4 VREF– SIGNAL GND AGND *ADDITIONAL PINS OMITTED FOR CLARITY Figure 18. 0 V to 8.192 V Output Range Table III. Code Table for Figure 18 Binary Number in DAC Latch MSB LSB Analog Output (VOUT) 1111 1000 0000 0000 0000 0000 8.192 V (65535/65536) = 8.1919 V 8.192 V (32768/65536) = 4.096 V 8.192 V (8/65536) = 0.001 V 8.192 V (4/65536) = 0.0005 V 8.192 V (2/65536) = 0.00025 V 8.192 V (1/65536) = 0.000125 V 1111 0000 0000 0000 0000 0000 1111 0000 0000 0000 0000 0000 1111 0000 1000 0100 0010 0001 Figure 20 shows a serial interface between the AD7849 and the ADSP-2101/ADSP-2102 DSP processor. The ADSP-2101/ ADSP-2102 contains two serial ports and either port may be used in the interface. The data transfer is initiated by TFS going low. Data from the ADSP-2101/ ADSP-2102 is clocked into the AD7849 on the falling edge of SCLK. The DAC can be updated by holding LDAC high while performing the write cycle. TFS must be taken high after the 16-bit write cycle. LDAC is brought low at the end of the cycle and the DAC output is updated. In the interface shown the DAC is updated using an external timer which generates an LDAC pulse. This could also be done using a control or decoded address line from the processor. Alternatively, if the LDAC input is hardwired low the output update takes place automatically on the 16th falling edge of SCLK. TIMER ADSP-2101 ADSP-2102* SCLK DT NOTE: Assumes 16-bit resolution; 1 LSB = 8.192 V/2 = 125 µV. 16 TFS Generating ⴞ5 V Output Range From Single +5 V Reference The diagram below shows how to generate a ± 5 V output range when using a single +5 V reference. VREF– is connected to 0 V and ROFS is connected to VREF+. The +5 V reference input is applied to these pins. With all 0s loaded to the DAC, the noninverting terminal of the output stage amplifier is at 0 V and VOUT is simply the inverse of VREF+. With all 1s loaded to the DAC, the noninverting terminal of the output stage amplifier is at 5 V and so VOUT is also at 5 V. 2 8 +5V VDD VCC ROFS 6 AD586 C1 1nF +15V 5 VOUT VREF+ R1 10kΩ VOUT (–5V TO +5V) AD7849* 4 DGND VREF– VSS AGND SIGNAL GND LDAC SCLK AD7849* SDIN SYNC *ADDITIONAL PINS OMITTED FOR CLARITY Figure 20. AD7849 to ADSP-2101/ADSP-2102 Interface AD7849-DSP56000 Interface A serial interface between the AD7849 and the DSP56000 is shown in Figure 21. The DSP56000 is configured for Normal Mode Asynchronous operation with Gated Clock. It is also set up for a 16-bit word with SCK and SC2 as outputs and the FSL control bit set to a “0”. SCK is internally generated on the DSP56000 and applied to the AD7849 SCLK input. Data from the DSP56000 is valid on the falling edge of SCK. The SC2 output provides the framing pulse for valid data. This line must be inverted before being applied to the SYNC input of the AD7849. In this interface an LDAC pulse generated from an external timer is used to update the outputs of the DACs. This update can also be produced using a bit programmable control line from the DSP56000. *ADDITIONAL PINS OMITTED FOR CLARITY –15V Figure 19. Generating ±5 V Output Range From Single +5 V –12– REV. B AD7849 Figure 23 shows the LDAC input of the AD7849 being driven from another bit programmable port line (PC1). As a result, the DAC can be updated by taking LDAC low after the DAC input register has been loaded. TIMER LDAC DSP56000 SCK SCLK STD SDIN SC2 SYNC AD7849* 68HC11* *ADDITIONAL PINS OMITTED FOR CLARITY Figure 21. AD7849 to DSP56000 Interface PC1 LDAC PC0 SYNC SCK SCLK MOSI SDIN AD7849* AD7849-TMS320C2x Interface *ADDITIONAL PINS OMITTED FOR CLARITY Figure 22 shows a serial interface between the AD7849 and the TMS320C2x DSP processor. In this interface, the CLKX and FSX signals for the TMS320C2x should be generated using external clock/timer circuitry. The FSX pin of the TMS320C2x must be configured as an input. Data from the TMS320C2x is valid on the falling edge of CLKX. Figure 23. AD7849 to 68HC11 Interface AD7849-87C51 Interface A serial interface between the AD7849 and the 87C51 microcontroller is shown in Figure 24. TXD of the 87C51 drives SCLK of the AD7849 while RXD drives the serial data line of the part. The SYNC signal is derived from the port line P3.3 and the LDAC line is driven port line P3.2. CLOCK/TIMER TMS320C2x LDAC FSX SYNC CLKX SCLK DX SDIN The 87C51 provides the LSB of its SBUF register as the first bit in the serial data stream. Therefore, the user will have to ensure that the data in the SBUF register is arranged correctly so that the most significant bits are the first to be transmitted to the AD7849 and the last bit to be sent is the LSB of the word to be loaded to the AD7849. When data is to be transmitted to the part, P3.3 is taken low. Data on RXD is valid on the falling edge of TXD. The 87C51 transmits its serial data in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. To load data to the AD7849, P3.3 is left low after the first eight bits are transferred and a second byte of data is then transferred serially to the AD7849. When the second serial transfer is complete, the P3.3 line is taken high. AD7849* *ADDITIONAL PINS OMITTED FOR CLARITY Figure 22. AD7849 to TMS320C2x Interface The clock/timer circuitry generates the LDAC signal for the AD7849 to synchronize the update of the output with the serial transmission. Alternatively, the automatic update mode may be selected by connecting LDAC to DGND. AD7849-68HC11 Interface Figure 23 shows a serial interface between the AD7849 and the 68HC11 microcontroller. SCK of the 68HC11 drives SCLK of the AD7849 while the MOSI output drives the serial data line of the AD7849. The SYNC signal is derived from a port line (PC0 shown). For correct operation of this interface, the 68HC11 should be configured such that its CPOL bit is a 0 and its CPHA bit is a 1. When data is to be transmitted to the part, PC0 is taken low. When the 68HC11 is configured like this, data on MOSI is valid on the falling edge of SCK. The 68HC11 transmits its serial data in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. To load data to the AD7849, PC0 is left low after the first eight bits are transferred and a second byte of data is then transferred serially to the AD7849. When the second serial transfer is complete, the PC0 line is taken high. Figure 24 shows the LDAC input of the AD7849 driven from the bit programmable port line P3.2. As a result, the DAC output can be updated by taking the LDAC line low following the completion of the write cycle. Alternatively LDAC could be hardwired low and the analog output will be updated on the sixteenth falling edge of TXD after the SYNC signal for the DAC has gone low. 87C51* P3.2 LDAC P3.3 SYNC TXD SCLK RXD SDIN AD7849* *ADDITIONAL PINS OMITTED FOR CLARITY Figure 24. AD7849 to 87C51 Interface REV. B –13– AD7849 31. This leaves 800 ns for the LDAC pulse. Of course, as the update rate requirement decreases, the number of possible channels increases. APPLICATIONS Opto-Isolated Interface In many process control type applications it is necessary to provide an isolation barrier between the controller and the unit being controlled. Opto isolators can provide voltage isolation in excess of 3 kV. The serial loading structure of the AD7849 makes it ideal for opto-isolated interfaces as the number of interface lines is kept to a minimum. The sequence of events to program the output channels in Figure 25 is as follows. 1. Take the SYNC line low. Figure 25 shows a 4-channel isolated interface using the AD7849. The DCEN pin must be connected high to enable the daisy-chain facility. Four channels with 14-bit or 16-bit resolution are provided in the circuit shown, but this may be expanded to accommodate any number of DAC channels without any extra isolation circuitry. The only limitation is the output update rate. For example, if an output update rate of 10 kHz is required, then all the DACs must be loaded and updated in a time period of 100 µs. Operating at the maximum clock rate of 5 MHz means that it takes 3.2 µs to load a DAC. This means that the total number of channels for this update rate would be 2. Transmit the data as four 16-bit words. A total of 64 clock pulses is required to clock the data through the chain. 3. Take the SYNC line high. 4. Pulse the LDAC line low. This updates all output channels simultaneously on the falling edge of LDAC. To reduce the number of opto-couplers, the LDAC line could be driven from a one-shot which is triggered by the rising edge on the SYNC line. A low level pulse of 100 ns duration or greater is all that is required to update the outputs. VDD DATA OUT CONTROLLER VDD SDIN CLOCK OUT SCLK VDD VOUT VOUT A SYNC AD7849* SYNC OUT LDAC VDD DCEN +5V SDOUT CONTROL OUT SDIN SCLK QUAD OPTO-COUPLER VOUT VOUT B SYNC AD7849* LDAC DCEN +5V SDOUT SDIN SCLK VOUT VOUT C SYNC AD7849* LDAC DCEN +5V SDOUT SDIN SCLK VOUT VOUT D SYNC *ADDITIONAL PINS OMITTED FOR CLARITY AD7849* LDAC DCEN +5V SDOUT Figure 25. Four-Channel Opto-Isolated Interface –14– REV. B AD7849 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 11 20 0.280 (7.11) 0.240 (6.10) PIN 1 10 1 0.325 (8.25) 0.300 (7.62) 1.060 (26.90) 0.925 (23.50) 0.060 (1.52) 0.015 (0.38) 0.210 (5.33) 0.150 (3.81) 0.200 (5.05) 0.125 (3.18) 0.100 (2.54) BSC 0.022 (0.558) 0.014 (0.356) 0.195 (4.95) 0.115 (2.93) C2011a–0–3/00 (rev. B) Plastic DIP (N-20) 0.015 (0.381) 0.008 (0.204) SEATING PLANE 0.070 (1.78) 0.045 (1.15) Cerdip (Q-20) 20 11 1 10 0.28 (7.11) 0.24 (6.1) PIN 1 0.97 (24.64) 0.935 (23.75) 0.32 (8.128) 0.29 (7.366) 0.18 (4.57) 0.125 (3.18) 0.20 (5.0) 0.14 (3.56) 0.011 (0.28) 0.009 (0.23) 0.15 (3.8) 0.125 (3.18) 0.02 (0.5) 0.016 (0.41) 0.07 (1.78) 0.05 (1.27) 0.11 (2.79) 0.09 (2.28) 15 ° SEATING PLANE 0° LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH LEADS ARE SOLDER OR TIN-PLATED KOVAR OR ALLOY 42 SOIC (R-20) 20 11 0.2992 (7.60) 0.2914 (7.40) 0.4193 (10.65) 0.3937 (10.00) 10 0.1043 (2.65) 0.0926 (2.35) 0.5118 (13.00) 0.4961 (12.60) 0.0118 (0.30) 0.0040 (0.10) REV. B 0.0500 (1.27) BSC 0.0192 (0.49) 0.0138 (0.35) 0.0125 (0.32) 0.0091 (0.23) –15– 0.0291 (0.74) x 45 ° 0.0098 (0.25) 8° 0° 0.0500 (1.27) 0.0157 (0.40) PRINTED IN U.S.A. PIN 1 1