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Table 4:
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Absolute Maximum Ratings
(Packaged Parts)(1)
Condition
Value
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Table 6: DC Parameters (Packaged Parts)
Symbol
Parameters
9,/
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Typ(1)
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Table 6: DC Parameters (Packaged Parts)
Symbol
Min(2)
Parameters
5$1$,1
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Table 7: AC Parameters (Packaged Parts)
Symbol
)6
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Typ(1)
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Symbol
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Table 7: AC Parameters (Packaged Parts)
Symbol
Characteristic
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Typ(1)
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Table 8:
Absolute Maximum Ratings
(Die)(1)
Condition
Table 9:
Operating Conditions (Die)
Condition
Value
Value
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Table 10: DC Parameters (Die)
Symbol
Parameters
9,/
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9,+
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92/
Min(2)
Typ(1)
Max(2)
Units
Conditions
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Table 10: DC Parameters (Die)
Symbol
Min(2)
Parameters
5$1$,1r
$1$,1r,QSXW5HVLVWDQFH
$$53
$1$,1RU$1$,1rWR$8'287*DLQ
Typ(1)
Max(2)
Units
Conditions
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SHUFHQWWHVWHG
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Table 11: AC Parameters (Die)
Symbol
)6
Characteristic
6DPSOLQJ)UHTXHQF\
Min(2)
Typ(1)
Max(2)
Units
Conditions
,6'
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PVHF
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,6'
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PVHF
PVHF
PVHF
PVHF
PVHF
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Table 11: AC Parameters (Die)
Symbol
75$&/2
Min(2)
Characteristic
5$&&ORFN/RZ7LPH
Typ(1)
Max(2)
Units
,6'
,6'
,6'
,6'
PVHF
PVHF
PVHF
PVHF
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5$&&ORFN3HULRGLQ
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Conditions
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SHUFHQWWHVWHG
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6LQJOHHQGHGLQSXWPRGH,QWKHGLIIHUHQWLDOLQSXWPRGH9,1PD[LPXPIRU$1$,1DQG$1$,1¥LVP9SHDN
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0LQLPXPDQGPD[LPXPOLPLWVDUHJXDUDQWHHGE\,6'YLDSHUFHQWHOHFWULFDOWHVWLQJRUFKDUDFWHUL]DWLRQWRPHHW
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7KHW\SLFDORXWSXWYROWDJHZLOOEHDSSUR[LPDWHO\P9SHDNWRSHDNZLWK9,1DWP9SHDNWRSHDN
)RURSWLPDOVLJQDOTXDOLW\WKLVPD[LPXPOLPLWLVUHFRPPHQGHG
:KHQDUHFRUGFRPPDQGLVVHQW75$&
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Table 12: SPI AC Parameters(1)
Symbol
Characteristics
Min
Max
Units
Conditions
7666
666HWXS7LPH
QVHF
766+
66+ROG7LPH
QVHF
7',6
'DWDLQ6HWXS7LPH
QVHF
7',+
'DWDLQ+ROG7LPH
QVHF
73'
2XWSXW'HOD\
QVHF
7')
2XWSXW'HOD\WRKL=
QVHF
766PLQ
66+,*+
76&.KL
µVHF
6&/.+LJK7LPH
QVHF
76&.ORZ
6&/./RZ7LPH
QVHF
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7ULVWDWHWHVWFRQGLWLRQ
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7,0,1*',$*5$06
Figure 5: Timing Diagram
Figure 6: 8-Bit Command Format
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Figure 7: 16-Bit Command Format
Figure 8: Playback/Record and Stop Cycle
18
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Figure 9: Application Example Using SPI
127(
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Figure 10: Application Example Using Microwire
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Figure 11: Application Example Using SPI Port on Microcontroller
127(
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Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type I (E)
Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions
INCHES
Min
Nom
Max
Min
Nom
Max
$
%
&
'
(
)
*
+
Š
Š
Š
Š
Š
Š
,
-
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Figure 13: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
Table 14: Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
$
Min
Nom
Max
Min
Nom
Max
%
%
&
&
'
'
(
)
*
+
22
MILLIMETERS
-
6
T
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Figure 14: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
Table 15: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions
INCHES
Min
Nom
Max
Min
Nom
Max
$
%
&
'
(
)
*
+
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Figure 15: ISD33120/150/180/240 Products Bonding Physical Layout(1) (Unpackaged Die)
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966$
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Table 16: ISD33120/150/180/240 Devices PIN/PAD Designations,
with Respect to Die Center (µm)
Pin
Pin Name
X Axis
Y Axis
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Part Number
Part Number
Part Number
Part Number
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