MURA205T3, MURA210T3 Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. • • • • Small Compact Surface Mountable Package with J–Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.74 Volts Max @ 2.0 A, TJ = 150°C) Mechanical Characteristics: http://onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES 50–100 VOLTS • Case: Epoxy, Molded • Weight: 70 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Shipped in 12 mm Tape and Reel, 5000 units per reel Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) ESD Protection: Machine Model > 400 V (Class C) Marking: U5A, U5B MARKING DIAGRAM U5x SMA CASE 403D PLASTIC x = A (205T3) B (210T3) ORDERING INFORMATION MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA205T3 MURA210T3 VRRM VRWM VR Average Rectified Forward Current @ TL = 155°C @ TL = 135°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 50 A TJ –65 to +175 °C Operating Junction Temperature Range Semiconductor Components Industries, LLC, 2001 February, 2001 – Rev. 0 Value Device Package Shipping MURA205T3 SMA 5000/Tape & Reel MURA210T3 SMA 5000/Tape & Reel Unit V 50 100 A 1.0 2.0 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURA205T3/D MURA205T3, MURA210T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Lead (Note 1.) Thermal Resistance, Junction to Ambient (Note 1.) Symbol Max Unit PsiJL (Note 2.) RθJA 24 °C/W 216 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3.) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3.) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/µs) trr Volts 0.94 0.74 µA 2.0 50 30 ns 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR–4. 2. In compliance with JEDEC 51, these values (historically represented by RθJL) are now referenced as PsiJL. 3. Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%. 100 IR, REVERSE CURRENT (A) 1 TJ = 100°C 0.1 0.01 0.001 IF, INSTANTANEOUS FORWARD CURRENT (A) TJ = 175°C 10 TJ = 25°C TJ = 175°C 10 TJ = 100°C 1 TJ = 25°C 0.1 20 0 40 60 80 60 80 100 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100°C TC = 175°C 25°C 1 0.1 0.01 0.4 40 VR, REVERSE VOLTAGE (VOLTS) 10 0.3 20 0 100 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (A) 100 0.5 0.6 0.7 0.8 0.9 1 1.1 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 2 1.1 MURA205T3, MURA210T3 60 50 NOTE: MAXIMUM CAPACITANCE AT 0 V = 48 pF 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 40 35 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 45 30 25 20 15 10 40 30 20 10 5 0 4 0 8 12 16 20 28 24 36 32 0 40 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance IF, AVERAGE FORWARD CURRENT (A) RJL = 24°C/W TJ = 175°C dc 3 2.5 SQUARE WAVE 2 1.5 1 0.5 0 100 110 8 VR, REVERSE VOLTAGE (VOLTS) 4 3.5 4 VR, REVERSE VOLTAGE (VOLTS) 120 130 140 150 160 170 RJA = 216°C/W TJ = 175°C dc 1 SQUARE WAVE 0.5 0 0 180 20 40 60 100 120 140 160 Figure 8. Current Derating, Ambient (FR–4 Board with Minimum Pad) 2.5 TJ = 175°C 2 dc SQUARE WAVE 1.5 1 0.5 0 0.5 80 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Lead 0 36 1.5 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 3 3.5 40 MURA205T3, MURA210T3 PACKAGE DIMENSIONS SMA CASE 403D–01 ISSUE O S A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D H J K S B INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.105 0.050 0.064 0.004 0.008 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.67 1.27 1.63 0.10 0.20 0.15 0.41 0.76 1.52 4.83 5.59 C K J H MINIMUM SOLDER PAD SIZE 0.157 4.0 0.0787 2.0 0.0787 2.0 inches mm ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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