ETC PLDC20G10-25PC

PLDC20G10B/PLDC20G10
CMOS Generic 24-Pin
Reprogrammable Logic Device
Features
• CMOS EPROM technology for reprogrammability
• Highly reliable
— Uses proven EPROM technology
• Fast
— Commercial: tPD = 15 ns, tCO = 10 ns, tS = 12 ns
— Fully AC and DC tested
— Military: tPD = 20 ns, tCO = 15 ns, tS = 15 ns
• Low power
— ICC max.: 70 mA, commercial
— Security feature prevents logic pattern duplication
— ±10% power supply voltage and higher noise immunity
— ICC max.: 100 mA, military
• Commercial and military temperature range
• User-programmable output cells
— Selectable for registered or combinatorial operation
Functional Description
Cypress PLD devices are high-speed electrically programmable logic devices. These devices utilize the sum-of-products
(AND-OR) structure providing users the ability to program custom logic functions for unique requirements.
— Output polarity control
— Output enable source selectable from pin 13 or product term
• Generic architecture to replace standard logic functions including: 20L10, 20L8, 20R8, 20R6, 20R4, 12L10,
14L8, 16L6, 18L4, 20L2, and 20V8
• Eight product terms and one OE product term per output
In an unprogrammed state the AND gates are connected via
EPROM cells to both the true and complement of every input.
By selectively programming the EPROM cells, AND gates may
be connected to either the true or complement or disconnected
from both true and complement inputs.
Logic Block Diagram
VSS
I
I
I
I
I
I
I
I
I
I
CP/I
12
11
10
9
8
7
6
5
4
3
2
1
PROGRAMMABLE
ANDARRAY
8
OUTPUT
CELL
OUTPUT
CELL
OUTPUT
CELL
8
OUTPUT
CELL
OE
OUTPUT
CELL
8
OE
OUTPUT
CELL
8
OE
OUTPUT
CELL
8
OE
OUTPUT
CELL
8
OE
OUTPUT
CELL
8
OE
8
OE
8
OE
8
OUTPUT
CELL
13
14
15
16
17
18
19
20
21
22
23
24
I/OE
I/O 9
I/O 8
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
I/O 0
V CC
20G10–1
NC
I
I
CP/I
VCC
I/O 0
I/O 1
4 3 2 1 282726
25
24
23
PLDC20G10 22
PLDC20G10B
21
20
19
12131415161718
4 3 2 1 2827 26
NC
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NC
I
I
NC
I
I
NC
5
6
7
8
9
10
11
25
24
23
PLDC20G10
PLDC20G10B 22
21
20
121314 1516 1718 19
I
I
I
I
I
5
6
7
8
9
10
11
I
I
I
NC
I
I
I
25
24
23
CG7C323–A
CG7C323B–A 22
21
20
121314 1516 1718 19
I
I
20G10–2
[1]
4 3 2 1 2827 26
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NC
VSS
I/OE
I/O 9
I/O 8
5
6
7
8
9
10
11
V SS
I/OE
I/O9
I/O8
NC
I
I
I
I
I
I
NC
JEDEC PLCC
Top View
I
I
CP/I
NC
V CC
I/O0
I/O 1
STD PLCC
Top View
I
I
I
CP/I
V CC
I/O0
I/O1
LCC
Top View
20G10–4
VSS
NC
I/OE
I/O 9
I/O 8
Pin Configurations
I/O 2
I/O 3
I/O 4
NC
I/O 5
I/O 6
I/O 7
20G10–3
Note:
1. The CG7C323 is the PLDC20G10 packaged in the JEDEC-compatible 28-pin PLCC pinout. Pin function and pin order is identical for both PLCC pinouts.
The difference is in the location of the “no connect” or NC pins.
Cypress Semiconductor Corporation
Document #: 38-03010 Rev. **
•
3901 North First Street
•
San Jose
•
CA 95134 • 408-943-2600
Revised March 26, 1997
PLDC20G10B/PLDC20G10
Selection Guide
ICC (mA)
Generic
Part Number
Com/Ind
20G10B–15
70
20G10B–20
70
20G10B–25
20G10–25
Mil
Com/Ind
20
100
Com/Ind
12
Cypress PLDC20G10 uses an advanced 0.8-micron CMOS
technology and a proven EPROM cell as the programmable
element. This technology and the inherent advantage of being
able to program and erase each cell enhances the reliability
and testability of the circuit. This reduces the burden on the
customer to test and to handle rejects.
A preload function allows the registered outputs to be preset
to any pattern during testing. Preload is important for testing
the functionality of the Cypress PLD device.
20G10 Functional Description
The PLDC20G10 is a generic 24-pin device that can be programmed to logic functions that include but are not limited to:
20L10, 20L8, 20R8, 20R6, 20R4, 12L10, 14L8, 16L6, 18L4,
20L2, and 20V8. Thus, the PLDC20G10 provides significant
design, inventory and programming flexibility over dedicated
24-pin devices. It is executed in a 24-pin 300-mil molded DIP
and a 300-mil windowed cerDIP. It provides up to 22 inputs and
10 outputs. When the windowed cerDIP is exposed to UV light,
the 20G10 is erased and then can be reprogrammed.
The programmable output cell provides the capability of defining the architecture of each output individually. Each of the 10
output cells may be configured with registered or combinatorial
outputs, active HIGH or active LOW outputs, and product term
or Pin 13 generated output enables. Three architecture bits
determine the configurations as shown in the Configuration
Mil
10
15
12
15
15
15
20
30
40
Com/Ind
18
30
Functional Description (continued)
Mil
15
35
80
tCO (ns)
12
20
25
80
Document #: 38-03010 Rev. **
Mil
25
55
20G10–40
tS (ns)
15
100
55
20G10–30
20G10–35
tPD (ns)
20
25
35
25
Table and in Figures 1 through 8. A total of eight different configurations are possible, with the two most common shown in
Figure 3 and Figure 5. The default or unprogrammed state is
registered/active/LOW/Pin 11 OE. The entire programmable
output cell is shown in the next section.
The architecture bit ‘C1’ controls the registered/combinatorial
option. In either combinatorial or registered configuration, the
output can serve as an I/O pin, or if the output is disabled, as
an input only. Any unused inputs should be tied to ground. In
either registered or combinatorial configuration, the output of
the register is fed back to the array. This allows the creation of
control-state machines by providing the next state. The register is clocked by the signal from Pin 1. The register is initialized
on power up to Q output LOW and Q output HIGH.
In both the combinatorial and registered configurations, the
source of the output enable signal can be individually chosen
with architecture bit ‘C2’. The OE signal may be generated
within the array, or from the external OE (Pin 13). The Pin 13
allows direct control of the outputs, hence having faster enable/disable times.
Each output cell can be configured for output polarity. The output can be either active HIGH or active LOW. This option is
controlled by architecture bit ‘C0’.
Along with this increase in functional density, the Cypress
PLDC20G10 provides lower-power operation through the use
of CMOS technology and increased testability with a register
preload feature.
Page 2 of 13
PLDC20G10B/PLDC20G10
Programmable Output Cell
OE PRODUCT TERM
OUTPUT
ENABLE
MUX
C2
10
11
00
D
Q
Q
CP
01
OUTPUT
SELECT
MUX
C1 C0
0
INPUT/
FEED–
BACK
MUX
C3
1
C2
C1
C0
PIN 13
20G10–5
Configuration Table
Figure
C2
C1
C0
1
0
0
0
Product Term OE/Registered/Active LOW
2
0
0
1
Product Term OE/Registered/Active HIGH
5
0
1
0
Product Term OE/Combinatorial/Active LOW
6
0
1
1
Product Term OE/Combinatorial/Active HIGH
3
1
0
0
Pin 13 OE/Registered/Active LOW
4
1
0
1
Pin 13 OE/Registered/Active HIGH
7
1
1
0
Pin 13 OE/Combinatorial/Active LOW
8
1
1
1
Pin 13 OE/Combinatorial/Active HIGH
Document #: 38-03010 Rev. **
Configuration
Page 3 of 13
PLDC20G10B/PLDC20G10
Registered Output Configurations
D
C2 = 0
C1 = 0
C0 = 0
Q
D
Q
Q
CP
Q
CP
20G10–7
20G10–6
Figure 1. Product Term OE/Active LOW
D
Figure 2. Product Term OE/Active HIGH
C2 = 1
C1 = 0
C0 = 0
Q
D
Q
CP
C2 = 0
C1 = 0
C0 = 1
C2 = 1
C1 = 0
C0 = 1
Q
Q
CP
20G10–8
20G10–9
Figure 3. Pin 13 OE/Active LOW
Figure 4. Pin 13 OE/Active HIGH
Combinatorial Output Configurations[2]
C2 = 0
C1 = 1
C0 = 0
C2 = 0
C1 = 1
C0 = 1
20G10–10
20G10–11
Figure 5. Product Term OE/Active LOW
Figure 6. Product Term OE/Active HIGH
C2 = 1
C1 = 1
C0 = 0
C2 = 1
C1 = 1
C0 = 1
20G10–12
20G10–13
PIN 13
Figure 7. Pin 13 OE/Active Low
PIN 13
Figure 8. Pin 13 OE/Active HIGH
Note:
2. Bidirectional I/O configurations are possible only when the combinatorial output option is selected
Document #: 38-03010 Rev. **
Page 4 of 13
PLDC20G10B/PLDC20G10
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
DC Programming Voltage
PLDC20G10B and CG7C323B–A ............................... 13.0V
PLDC20G10 and CG7C323–A.................................... 14.0V
Latch-Up Current..................................................... >200 mA
Static Discharge Voltage ............................................. >500V
(per MIL-STD-883, Method 8015)
Operating Range
DC Voltage Applied to Outputs
in High Z State ............................................... –0.5V to +7.0V
Range
Ambient
Temperature
VCC
DC Input Voltage............................................ –3.0V to +7.0V
Commercial
0°C to +75°C
5V ±10%
Output Current into Outputs (LOW) .............................16 mA
Military[3]
–55°C to +125°C
5V ±10%
Industrial
–40°C to +85°C
5V ±10%
]
Electrical Characteristics Over the Operating Range (Unless Otherwise Noted)[4]
Parameter
VOH
Description
Output HIGH Voltage
VOL
Output LOW Voltage
Test Conditions
Min.
VCC = Min.,
VIN = VIH or VIL
IOH = –3.2 mA
Com’l/Ind
IOH = –2 mA
Military
VCC = Min.,
VIN = VIH or VIL
IOL = 24 mA
Com’l/Ind
IOL = 12 mA
Military
Input HIGH Level
Guaranteed Input Logical HIGH Voltage for All Inputs[5]
VIL
Input LOW Level
Guaranteed Input Logical LOW Voltage for All Inputs
[5]
IIX
Input Leakage Current
VSS ≤ VIN ≤ VCC
ISC
Output Short Circuit Current VCC = Max., VOUT = 0.5V[6, 7]
ICC
Power Supply Current
VIH
IOZ
Output Leakage Current
Unit
2.4
V
0.5
V
2.0
V
0.8
V
+10
µA
–90
mA
Com’l/Ind–15, –20
70
mA
Com’l/Ind–25, –35
55
mA
Military–20, –25
100
mA
Military–30, –40
80
mA
100
µA
–10
0 ≤ VIN ≤ VCC
VCC = Max.,
IOUT = 0 mA
Unprogrammed Device
Max.
VCC = Max., VSS ≤ VOUT ≤ VCC
–100
Capacitance[7]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max.
Unit
TA = 25°C, f = 1 MHz
10
pF
VIN = 2.0V, VCC = 5.0V
10
pF
Notes:
3. TA is the “instant on” case temperature.
4. See the last page of this specification for Group A subgroup testing information.
5. These are absolute values with respect to device ground. All overshoots due to system or tester noise are included.
6. Not more than one output should be tested at a time. Duration of the short circuit should not be more than one second. VOUT = 0.5V has been chosen to avoid
test problems caused by tester ground degradation.
7. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-03010 Rev. **
Page 5 of 13
PLDC20G10B/PLDC20G10
AC Test Loads and Waveforms (Commercial)
R1 238 Ω
(319Ω MIL)
R1 238 Ω
(319Ω MIL)
5V
5V
OUTPUT
50pF
INCLUDING
JIG AND
SCOPE
R2 170 Ω
(236Ω MIL)
OUTPUT
5 pF
INCLUDING
JIG AND
SCOPE
(a)
Equivalent to: THÉVENIN EQUIVALENT (Commercial)
99Ω
OUTPUT
2.08V=Vthc
R2 170 Ω
(236Ω MIL)
20G10–14
(b)
Equivalent to: THÉVENIN EQUIVALENT (Military/Industrial)
136 Ω
OUTPUT
2.13V=V thm
20G10–15
20G10–16
Switching Characteristics Over Operating Range[3, 8, 9]
Commercial
B–15
Parameter
Description
B–20
–25
–35
Min. Max. Min. Max. Min. Max. Min. Max.
Unit
tPD
Input or Feedback to Non-Registered Output
15
20
25
35
ns
tEA
Input to Output Enable
15
20
25
35
ns
tER
Input to Output Disable
15
20
25
35
ns
tPZX
Pin 11 to Output Enable
12
15
20
25
ns
tPXZ
Pin 11 to Output Disable
12
15
20
25
ns
tCO
Clock to Output
10
12
15
25
ns
tS
Input or Feedback Set-Up Time
tH
Hold Time
0
0
tP[10]
Clock Period
22
24
tWH
Clock High Time
8
10
tWL
Clock Low Time
8
fMAX[11]
Maximum Frequency
45.4
12
12
15
30
ns
0
0
ns
30
55
ns
12
17
ns
10
12
17
ns
41.6
33.3
18.1
MHz
Notes:
8. Part (a) of AC Test Loads and Waveforms used for all parameters except tER, tPZX, and tPXZ. Part (b) of AC Test Loads and Waveforms used for tER, tPZX,
and tPXZ.
9. The parameters tER and tPXZ are measured as the delay from the input disable logic threshold transition to VOH – 0.5V for an enabled HIGH output or VOL
+ 0.5V for an enabled LOW input.
10. tP, minimum guaranteed clock period is that guaranteed for state machine operation and is calculated from tP = tS + tCO. The minimum guaranteed period
for registered data path operation (no feedback) can be calculated as the greater of (tWH + tWL) or (tS + tH).
11. fMAX, minimum guaranteed operating frequency, is that guaranteed for state machine operation and is calculated from fMAX = 1/(tS + tCO). The minimum
guaranteed fMAX for registered data path operation (no feedback) can be calculated as the lower of 1/(tWH + tWL) or 1/(tS + tH).
Document #: 38-03010 Rev. **
Page 6 of 13
PLDC20G10B/PLDC20G10
Switching Characteristics Over Operating Range[3, 8, 9] (continued)
Military/Industrial
B–20
Parameter
Description
B–25
–30
Min. Max. Min. Max. Min.
–40
Max.
Min. Max.
Unit
tPD
Input or Feedback to Non-Registered Output
20
25
30
40
ns
tEA
Input to Output Enable
20
25
30
40
ns
tER
Input to Output Disable
20
25
30
40
ns
tPZX
Pin 11 to Output Enable
17
20
25
25
ns
tPXZ
Pin 11 to Output
Disable
17
20
25
25
ns
tCO
Clock to Output
15
15
20
25
ns
tS
Input or Feedback
Set-Up Time
15
18
20
35
ns
tH
Hold Time
0
0
0
0
ns
tP[10]
Clock Period
30
33
40
60
ns
tWH
Clock High Time
12
14
16
22
ns
tWL
Clock Low Time
fMAX[11]
Maximum Frequency
12
14
16
22
ns
33.3
30.3
25.0
16.6
MHz
Switching Waveform
INPUTS I/O,
REGISTERED
FEEDBACK
tH
tS
tW
tW
CP
tP
OE
tPXZ
tCO
tPZX
REGISTERED
OUTPUTS
tPD
t ER
t EA
COMBINATORIAL
OUTPUTS
20G10–17
Document #: 38-03010 Rev. **
Page 7 of 13
PLDC20G10B/PLDC20G10
Functional Logic Diagram
1
0
4
8
12
16
20
24
28
32
36
40
OE
0
••
•
OUTPUT
CELL
7
23
OE
0
••
•
OUTPUT
CELL
22
7
2
OE
0
••
•
7
OUTPUT
CELL
21
3
OE
0
••
•
OUTPUT
CELL
7
20
4
OE
0
••
•
OUTPUT
CELL
19
7
5
OE
0
••
•
OUTPUT
CELL
18
7
6
OE
0
••
•
OUTPUT
CELL
7
17
7
OE
0
••
•
OUTPUT
CELL
16
7
8
OE
0
••
•
OUTPUT
CELL
15
7
9
OE
0
••
•
7
OUTPUT
CELL
14
10
11
Document #: 38-03010 Rev. **
13
Page 8 of 13
PLDC20G10B/PLDC20G10
Ordering Information
tPD
(ns)
tS
(ns)
tCO
(ns)
ICC
(mA)
15
12
10
70
20
15
15
100
25
15
15
55
30
35
20
30
20
80
25
55
Ordering Code
Package
Name
Package Type
Operating
Range
PLDC20G10B–15PC
P13
24-Lead (300-Mil) Molded DIP
Commercial
PLDC20G10B–15WC
W14
24-Lead (300-Mil) Windowed CerDIP
PLDC20G10B–20DMB
D14
24-Lead (300-Mil) CerDIP
Military
PLDC20G10–25JC
J64
28-Lead Plastic Leaded Chip Carrier
Commercial
PLDC20G10–25PC/PI
P13
24-Lead (300-Mil) Molded DIP
Commercial/
Industrial
PLDC20G10–25WC
W14
24-Lead (300-Mil) Windowed CerDIP
Commercial
PLDC20G10–30DMB
D14
24-Lead (300-Mil) CerDIP
Military
PLDC20G10–30LMB
L64
28-Square Leadless Chip Carrier
PLDC20G10–30WMB
W14
24-Lead (300-Mil) Windowed CerDIP
PLDC20G10–35JC
J64
28-Lead Plastic Leaded Chip Carrier
PLDC20G10–35PC
P13
24-Lead (300-Mil) Molded DIP
Commercial
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameter
Switching Characteristics
Subgroups
Parameter
Subgroups
VOH
1, 2, 3
tPD
9, 10, 11
VOL
1, 2, 3
tPZX
9, 10, 11
VIH
1, 2, 3
tCO
9, 10, 11
VIL
1, 2, 3
tS
9, 10, 11
IIX
1, 2, 3
tH
9, 10, 11
IOZ
1, 2, 3
ICC
1, 2, 3
Document #: 38-03010 Rev. **
Page 9 of 13
PLDC20G10B/PLDC20G10
Package Diagrams
24-Lead (300-Mil) CerDIP D14
28-Lead Plastic Leaded Chip Carrier J64
MIL–STD–1835 D– 9Config.A
28-Square Leadless Chip Carrier L64
MIL–STD–1835 C–4
Document #: 38-03010 Rev. **
Page 10 of 13
PLDC20G10B/PLDC20G10
Package Diagrams (continued)
28-Pin Windowed Leaded Chip Carrier H64
Document #: 38-03010 Rev. **
Page 11 of 13
PLDC20G10B/PLDC20G10
Package Diagrams (continued)
24-Lead (300-Mil) Molded DIP P13/P13A
24-Lead (300-Mil) Windowed CerDIP W14
MIL–STD–1835 D– 9Config.A
Document #: 38-03010 Rev. **
Page 12 of 13
PLDC20G10B/PLDC20G10
Document Title: PLDC20G10B/PLDC20G10 CMOS Generic 24-Pin Reprogrammable Logic Device
Document Number: 38-03010
REV.
ECN NO.
Issue Date
Orig. of Change
Description of Change
**
106292
04/25/01
SZV
Change from Spec number: 38-00019 to 38-03010
Document #: 38-03010 Rev. **
Page 13 of 13
© Cypress Semiconductor Corporation, 1997. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.