ETC TMS29F008B

TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
D
D
D
D
D
D
D
D
D
"
Single Power Supply Supports 5 V 10%
Read/Write Operation
Organization . . . 1 048576 By 8 Bits
Array-Blocking Architecture
– One 16K-Byte Boot Sector
– Two 8K-Byte Parameter Sectors
– One 32K-Byte Sector
– Fifteen 64K-Byte Sectors
– Any Combination of Sectors Can Be
Erased. Supports Full-Chip Erase
– Any Combination of Sectors Can Be
Marked as Read-Only
Boot-Code Sector Architecture
– T = Top Sector
– B = Bottom Sector
Sector Protection
– Hardware Protection Method That
Disables Any Combination of Sectors
From Write or Erase Operations Using
Standard Programming Equipment
Embedded Program/Erase Algorithms
– Automatically Pre-Programs and Erases
Any Sector
– Automatically Programs and Verifies the
Program Data at Specified Address
JEDEC Standards
– Compatible With JEDEC Byte Pinouts
– Compatible With JEDEC EEPROM
Command Set
Fully Automated On-Chip Erase and
Program Operations
100 000 Program/Erase Cycles
Low Power Dissipation
– 40-mA Typical Active Read for Byte Mode
– 60-mA Typical Program/Erase Current
– Less Than 100-µA Standby Current
– 5 µA in Deep Power-Down Mode
D
D
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D
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All Inputs/Outputs TTL-Compatible
Erase Suspend/Resume
– Supports Reading Data From, or
Programming Data to, a Sector Not
Being Erased
Hardware-Reset Pin Initializes the
Internal-State Machine to the Read
Operation
40-Pin Thin Small-Outline Package (TSOP)
(DCD Suffix)
Detection Of Program/Erase Operation
– Data Polling and Toggle Bit Feature of
Program/Erase Cycle Completion
– Hardware Method for Detection of
Program/Erase Cycle Completion
Through Ready/Busy (RY/BY) Output Pin
High-Speed Data Access at 5-V VCC 10%
at Three Temperature Ranges
– 80 ns Commercial . . . 0°C to 70°C
– 90 ns Commercial . . . 0°C to 70°C
– 100 ns Extended . . . –40°C to 85°C
– 120 ns Automotive . . . –40°C to 125°C
"
PRODUCT PREVIEW
D
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
PIN NOMENCLATURE
A[0 :19]
DQ[0 :7]
CE
OE
NC
RESET
RY / BY
VCC
VSS
WE
Address Inputs
Data In / Data out
Chip Enable
Output Enable
No Internal Connection
Reset / Deep Power Down
Ready / Busy Output
Power Supply
Ground
Write Enable
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1997, Texas Instruments Incorporated
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
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1
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
PRODUCT PREVIEW
40-PIN TSOP
DCD PACKAGE
( TOP VIEW )
A16
A15
A14
A13
A12
A11
A9
A8
WE
RESET
NC
RY / BY
A18
A7
A6
A5
A4
A3
A2
A1
1
40
2
39
3
38
4
37
5
36
6
35
7
34
8
33
9
32
10
31
11
30
12
29
13
28
14
27
15
26
16
25
17
24
18
23
19
22
20
21
A17
VSS
NC
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
NC
DQ3
DQ2
DQ1
DQ0
OE
VSS
CE
A0
description
The TMS29F008T/B is an 1 048 576 by 8-bit (8 388 608-bit), 5-V single-supply, programmable read-only
memory device that can be electrically erased and reprogrammed. This device is organized as 1 024K by 8 bits,
divided into the following 19 sectors:
–
One 16K-byte boot sector
–
Two 8K-byte sectors
–
One 32K-byte sector
–
Fifteen 64K-byte sectors
Any combination of sectors can be marked as read-only or erased. Full-chip erasure is also supported.
Sector data protection is afforded by methods that can disable any combination of sectors from write or read
operations using standard programming equipment. An on-chip state machine provides an on-board algorithm
that automatically pre-programs and erases any sector before it automatically programs and verifies program
data at any specified address. The command set is compatible with the JEDEC 8M-bit electrically erasable,
programmable read-only memory (EEPROM) command set. A suspend/resume feature allows access to
unaltered memory blocks during a section-erase operation. All outputs of this device are TTL-compatible.
Additionally, an erase/suspend/resume feature supports reading data from, or programming data to, a sector
that is not being erased.
2
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
description (continued)
Device operations are selected by writing JEDEC-standard commands into the command register using
standard microprocessor write timings. The command register acts as an input to an internal-state machine
which interprets the commands, controls the erase and programming operations, outputs the status of the
device, outputs the data stored in the device, and outputs the device algorithm-selection code. On initial power
up, the device defaults to the read mode. A hardware-reset pin initializes the internal-state machine to the read
operation.
The device has low power dissipation with a 40-mA active read for the byte mode, 60-mA typical program/erase
current mode, and less than 100-mA standby current with a 5-mA deep-power-down mode. These devices are
offered with 80-, 90-, 100-, and 120-ns access times. Table 1 and Table 2 show the sector-address ranges. The
TMS29F008T/B is offered in a 40-pin thin small-outline package (TSOP) (DCD suffix).
device symbol nomenclature
TMS29F008
T
–90
C
DCD
L
PRODUCT PREVIEW
Temperature Range Designator
L = Commercial (0°C to 70°C)
E = Extended (– 40°C to 85°C)
Q = Automotive (– 40°C to 125°C)
Package Designator
DCD = 40-Pin Plastic Dual Small-Outline Package
Program/Erase Endurance
C = 100 000 Cycles
B = 10 000 Cycles
Speed Option
80 = 80 ns
90 = 90 ns
100 = 100 ns
120 = 120 ns
Boot Code Selection Architecture
T = Top Sector
B = Bottom Sector
Device Number / Description
8M Bits
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3
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
logic symbol†
PRODUCT PREVIEW
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
RY / BY
RESET
CE
OE
WE
21
20
19
18
17
16
15
14
8
7
36
6
5
4
3
2
1
40
13
37
12
10
22
24
9
FLASH
MEMORY
1048576 × 8
0
A
19
G1
[PWR DWN]
G2 1, 2 EN (READ)
1C3 (WRITE)
A, 3D
∇4
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
0
1048575
A, Z4
25
26
27
28
32
33
34
35
† This symbol is in accordance with ANSI / IEEE Std 91-1984 and IEC Publication 617-12.
4
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
block diagram
DQ0 – DQ7
RY / BY
Buffer
RY / BY
VCC
VSS
Erase Voltage
Generator
Input/Output Buffers
WE
State Control
RESET
Command Registers
PGM Voltage
Generator
STB
CE
PRODUCT PREVIEW
Data Latch
Chip-Enable
Output-Enable
Logic
OE
VCC Detector
Timer
STB
A0 – A19
L
a
t
c
h
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Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A
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s
• HOUSTON, TEXAS 77251–1443
5
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
operation
See Table 1 and Table 2 for the sector-address ranges of the TMS29F008T/B.
Table 1. Top-Boot Sector-Address Ranges†
PRODUCT PREVIEW
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ÁÁÁÁÁÁÁÁÁÁÁ
A19
A18
A17
A16
A15
A14
A13
SECTOR SIZE
ADDRESS RANGE
SA18
1
1
1
1
1
1
X
16K Byte
FC000H – FFFFFH
SA17
1
1
1
1
1
0
1
8K Byte
FA000H – FBFFFH
SA16
1
1
1
1
1
0
0
8K Byte
F8000H – F9FFFH
SA15
1
1
1
1
0
X
X
32K Byte
F0000H – F7FFFH
SA14
1
1
1
0
X
X
X
64K Byte
E0000H – EFFFFH
SA13
1
1
0
1
X
X
X
64K Byte
D0000H – DFFFFH
SA12
1
1
0
0
X
X
X
64K Byte
C0000H – CFFFFH
SA11
1
0
1
1
X
X
X
64K Byte
B0000H – BFFFFH
SA10
1
0
1
0
X
X
X
64K Byte
A0000H – AFFFFH
SA9
1
0
0
1
X
X
X
64K Byte
90000H – 9FFFFH
SA8
1
0
0
0
X
X
X
64K Byte
80000H – 8FFFFH
SA7
0
1
1
1
X
X
X
64K Byte
70000H – 7FFFFH
SA6
0
1
1
0
X
X
X
64K Byte
60000H – 6FFFFH
SA5
0
1
0
1
X
X
X
64K Byte
50000H – 5FFFFH
SA4
0
1
0
0
X
X
X
64K Byte
40000H – 4FFFFH
SA3
0
0
1
1
X
X
X
64K Byte
30000H – 3FFFFH
SA2
0
0
1
0
X
X
X
64K Byte
20000H – 2FFFFH
SA1
0
0
0
1
X
X
X
64K Byte
10000H – 1FFFFH
SA0
0
0
0
0
X
X
X
64K Byte
00000H – 0FFFFH
† The address range is A0–A19
6
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
operation (continued)
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ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
A19
A18
A17
A16
A15
A14
A13
SECTOR SIZE
ADDRESS RANGE
SA18
1
1
1
1
X
X
X
64K Byte
F0000H – FFFFFH
SA17
1
1
1
0
X
X
X
64K Byte
E0000H – EFFFFH
SA16
1
1
0
1
X
X
X
64K Byte
D0000H – DFFFFH
SA15
1
1
0
0
X
X
X
64K Byte
C0000H – CFFFFH
SA14
1
0
1
1
X
X
X
64K Byte
B0000H – BFFFFH
SA13
1
0
1
0
X
X
X
64K Byte
A0000H – AFFFFH
SA12
1
0
0
1
X
X
X
64K Byte
90000H – 9FFFFH
SA11
1
0
0
0
X
X
X
64K Byte
80000H – 8FFFFH
SA10
0
1
1
1
X
X
X
64K Byte
70000H – 7FFFFH
SA9
0
1
1
0
X
X
X
64K Byte
60000H – 6FFFFH
SA8
0
1
0
1
X
X
X
64K Byte
50000H – 5FFFFH
SA7
0
1
0
0
X
X
X
64K Byte
40000H – 4FFFFH
SA6
0
0
1
1
X
X
X
64K Byte
30000H – 3FFFFH
SA5
0
0
1
0
X
X
X
64K Byte
20000H – 2FFFFH
SA4
0
0
0
1
X
X
X
64K Byte
10000H – 1FFFFH
SA3
0
0
0
0
1
X
X
32K Byte
08000H – 0FFFFH
SA2
0
0
0
0
0
1
1
8K Byte
06000H – 07FFFH
SA1
0
0
0
0
0
1
0
8K Byte
04000H – 05FFFH
SA0
0
0
0
0
0
0
X
16K Byte
00000H – 03FFFH
† The address range is A0–A19
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PRODUCT PREVIEW
Table 2. Bottom-Boot Sector-Address Ranges†
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
operation (continued)
See Table 3 for the operation modes of the TMS29F008T/B.
Table 3. Operation Modes
MODE
FUNCTIONS†
CE
OE
WE
A0
A1
A6
A9
RESET
VIL
VIL
VIH
VIL
VIL
VIL
VID
VIH
VIL
VIL
VIH
VIH
VIL
VIL
VID
VIH
Device-Equivalent Code D6h
(TMS29F008T-Byte)
VIL
VIL
VIH
VIH
VIL
VIL
VID
VIH
Device-Equivalent Code 58h
(TMS29F008B-Byte)
VIL
VIH
VIH
VIH
A0
A1
A6
A9
X
X
X
X
VIH
VIH
Data out
Output disable
VIL
VIL
Standby and write inhibit
Write‡
VIH
VIL
X
X
X
X
X
X
Hi-Z
VIL
X
A0
A1
A6
A9
X
VIH
X
VIH
VIH
X
X
X
X
VIL
X
VIH
X
VIL
X
VIH
X
VIL
X
VID
X
VID
VIH
X
VIL
X
VIL
Hi-Z
Algorithm-selection mode
5 V power supply
5-V
Read
Temporary sector unprotect
PRODUCT PREVIEW
DQ0–DQ7
Manufacture-Equivalent Code 01h
(TMS29F008-Byte)
Verify sector protect
Hardware reset
Hi-Z
Data in
Data out
Legend:
VIL = Logic low
VIH = Logic high
VID = 12.0 ± 0.5 V
† X can be VIL or VIH.
‡ See Table 5 for valid address and data during write.
read mode
A logic-low signal applied to the CE and OE pins allows the output of the TMS29F008T/B to be read. When two
or more ’29F008T/B devices are connected in parallel, the output of any one device can be read without
interference. The CE pin is for power control and must be used for device selection. The OE pin is for output
control, used to gate the data output onto the bus from the selected device.
The address-access time (tAVQV) is the delay from stable address to valid output data. The chip-enable (CE)
access time (tELQV) is the delay from CE low and stable addresses to valid output data. The output-enable
access time (tGLQV) is the delay from OE low to valid output data when CE equals logic low and addresses are
stable for at least the duration of tAVQV–tGLQV.
standby mode
ICC supply current is reduced by applying a logic-high level on CE and RESET to enter the standby mode. In
the standby mode, the outputs are placed in the high-impedance state. Applying a CMOS logic-high level on
CE and RESET reduces the current to 100 µA. Applying a TTL logic-high level on CE and RESET reduces the
current to 1 mA. If the ’29F008T/B is deselected during erasure or programming, the device continues to draw
active current until the operation is complete.
output disable
When OE equals VIH or CE equals VIH, output from the device is disabled and the output pins (DQ0–DQ7) are
placed in the high-impedance state.
8
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automatic-sleep mode
The ’29F008 has a built-in feature called automatic-sleep mode to minimize device energy consumption which
is independent of CE, WE, and OE, and is enabled when addresses remain stable for 300 ns. Typical
sleep-mode current is 100 µA. Sleep mode does not affect output data, which remains latched and available
to the system.
algorithm selection
The algorithm-selection mode provides access to a binary code that matches the device with its proper
programming and erase command operations. This mode is activated when VID (11.5 V to 12.5 V) is placed on
address pin A9. Address pins A1 and A6 must be logic low. Two bytes of code are accessed by toggling address
pin A0 from VIL to VIH. Address pins other than A0, A1, and A6 can be at logic low or at logic high.
The algorithm-selection mode can also be read by using the command register, which is useful when VID is not
available to be placed on address pin A9. Table 4 shows the binary algorithm-selection codes.
CODE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
Manufacturer-equivalent code
01H
0
0
0
0
0
0
0
1
TMS29F008T-Byte
D6H
1
1
0
1
0
1
1
0
TMS29F008B-Byte
58H
0
1
0
1
1
0
0
0
Sector protection
01H
0
0
0
0
0
0
0
1
† A1 = VIL, A6 = VIL, CE = OE = VIL
erasure and programming
Erasure and programming of the ’29F008 are accomplished by writing a sequence of commands using standard
microprocessor write timing. The commands are written to a command register and input to the command-state
machine (CSM). The CSM interprets the command entered and initiates program, erase, suspend, and resume
operations as instructed. The CSM acts as the interface between the write-state machine (WSM) and
external-chip operations. The WSM controls all voltage generation, pulse generation, preconditioning, and
verification of memory contents. Program and block-/chip-erase functions are fully automatic. Once the end of
a program or erase operation has been reached, the device resets internally to the read mode. If VCC drops
below the low-voltage-detect level (VLKO), any programming or erase operation is aborted and subsequent
writes are ignored until the VCC level is greater than VLKO. The control pins must be logically correct to prevent
unintentional command writes or programming or erasing.
command definitions
Device operating modes are selected by writing specific address and data sequences into the command
register. Table 5 defines the valid command sequences. Writing incorrect address and data values or writing
them in the incorrect sequence causes the device to reset to the read mode. The command register does not
occupy an addressable memory location. The register is used to store the command sequence, along with the
address and data needed by the memory array. Commands are written by setting CE = VIL, OE = VIH, and
bringing WE from logic high to logic low. Addresses are latched on the falling edge of WE and data is latched
on the rising edge of WE. Holding WE = VIL and toggling CE is an alternative method. See the switching
characteristics of the write/erase/program-operations section for specific timing information.
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PRODUCT PREVIEW
Table 4. Algorithm-Selection Codes (5-V Single Power Supply)†
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
command definitions (continued)
Table 5. Command Definitions
COMMAND
PRODUCT PREVIEW
Read/reset
BUS
CYCLES
1ST CYCLE
ADDR
DATA
1
XXXH
F0H
3
555H
AAH
2ND CYCLE
ADDR
DATA
3RD CYCLE
ADDR
DATA
2AAH
555H
55H
F0H
4TH CYCLE
ADDR
DATA
RA
5TH CYCLE
ADDR
DATA
6TH CYCLE
ADDR
DATA
RD
D6H
T
go
Algorithm
selection
3
555H
AAH
2AAH
55H
555H
90H
Program
4
555H
AAH
2AAH
55H
555H
A0H
PA
PD
Chip erase
6
555H
AAH
2AAH
55H
555H
80H
555H
AAH
2AAH
55H
555H
10H
Sector erase
6
555H
AAH
2AAH
55H
555H
80H
555H
AAH
2AAH
55H
SA
30H
Sector-erase
suspend
1
XXXH
B0H
Erase-suspend valid during sector-erase operation
Sector-erase
resume
1
XXXH
30H
Erase-resume valid only after erase-suspend
01H
58H
B
LEGEND:
RA = Address of the location to be read
PA = Address of the location to be programmed
SA = Address of the sector to be erased
Addresses A13–A19 select 1 to 19 sectors.
RD = Data to be read at selected address location
PD = Data to be programmed at selected address location
read/reset command
The read or reset mode is activated by writing either of the two read/reset command sequences into the
command register. The device remains in this mode until another valid command sequence is input in the
command register. Memory data is available in the read mode and can be read with standard microprocessor
read-cycle timing.
On power up, the device defaults to the read/reset mode. A read/reset command sequence is not required and
memory data is available.
algorithm-selection command
The algorithm-selection command allows access to a binary code that matches the device with the proper
programming and erase command operations. After writing the three-bus-cycle command sequence, the first
byte of the algorithm-selection code can be read from address XX00h. The second byte of the code can be read
from address XX01h (see Table 5). This mode remains in effect until another valid command sequence is written
to the device.
byte-program command
Programming is a four-bus-cycle command sequence. The first three bus cycles put the device into the
program-setup state. The fourth bus cycle loads the address location and the data to be programmed into the
device. The addresses are latched on the falling edge of WE and the data is latched on the rising edge of WE
in the fourth bus cycle. The rising edge of WE starts the program operation. The embedded programming
function automatically provides needed voltage and timing to program and verify the cell margin. Any further
commands written to the device during the program operation are ignored.
10
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byte-program command (continued)
Programming can be performed at any address location in any sequence. When erased, all bits are in a
logic-high state. Logic lows are programmed into the device and only an erase operation can change bits from
logic lows to logic highs. Attempting to program a 1 into a bit that has been programmed previously to a 0 causes
the internal-pulse counter to exceed the pulse-count limit, which sets the exceed-time-limit indicator (DQ5) to
a logic-high state. The automatic-programming operation is complete when the data on DQ7 is equivalent to
the data written to this bit, at which time the device returns to the read mode and addresses are no longer
latched. Figure 8 shows a flowchart of the typical device-programming operation.
chip-erase command
Chip erase is a six-bus-cycle command sequence. The first three bus cycles put the device into the erase-setup
state. The next two bus cycles unlock the erase mode. The sixth bus cycle loads the chip-erase command. This
command sequence is required to ensure that the memory contents are not erased accidentally. The rising edge
of WE starts the chip-erase operation. Any further commands written to the device during the chip-erase
operation are ignored.
Figure 10 shows a flowchart of the typical chip-erase operation.
sector-erase command
Sector-erase is a six-bus-cycle command sequence. The first three bus cycles put the device into the
erase-setup state. The next two bus cycles unlock the erase mode and then the sixth bus cycle loads the
sector-erase command and the sector-address location to be erased. Any address location within the desired
sector can be used. The addresses are latched on the falling edge of WE and the sector-erase command (30h)
is latched on the rising edge of WE in the sixth bus cycle. After a delay of 80 µs from the rising edge of WE, the
sector-erase operation begins on the selected sector(s).
Additional sectors can be selected to be erased concurrently during the sector-erase command sequence. For
each additional sector to be selected for erase, another bus cycle is issued. The bus cycle loads the next
sector-address location and the sector-erase command. The time between the end of the previous bus cycle
and the start of the next bus cycle must be less than 100 µs; otherwise, the new sector location is not loaded.
A time delay of 100 µs from the rising edge of the last WE starts the sector-erase operation. If there is a falling
edge of WE within the 100 µs time delay, the timer is reset.
One to nineteen sector-address locations can be loaded in any sequence. The state of the delay timer can be
monitored using the sector-erase delay indicator (DQ3). If DQ3 is at logic low, the time delay has not expired.
See the operation status section for a description.
Any command other than erase suspend (B0h) or sector erase (30h) written to the device during the
sector-erase operation causes the device to exit the sector-erase mode and the contents of the sector(s)
selected for erase are no longer valid. To complete the sector-erase operation, re-issue the sector-erase
command sequence.
The embedded sector-erase function automatically provides needed voltage and timing to program and to verify
all of the memory cells prior to electrical erase and then erases and verifies the cell margin automatically.
Programming the memory cells prior to erase is not required.
See the operation status section for a full description. Figure 12 shows a flowchart of the typical sector-erase
operation.
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PRODUCT PREVIEW
The embedded chip-erase function automatically provides voltage and timing needed to program and to verify
all the memory cells prior to electrical erase. It then erases and verifies the cell margin automatically without
programming the memory cells prior to erase.
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
erase-suspend command
The erase-suspend command (B0h) allows interruption of a sector-erase operation to read data from unaltered
sectors of the device. Erase-suspend is a one-bus-cycle command. The addresses can be VIL or VIH and the
erase-suspend command (B0h) is latched on the rising edge of WE. Once the sector-erase operation is in
progress, the erase-suspend command requests the internal write-state machine to halt operation at
predetermined breakpoints. The erase-suspend command is valid only during the sector-erase operation and
is invalid during programming and chip-erase operations. The sector-erase delay timer expires immediately if
the erase-suspend command is issued while the delay is active.
After the erase-suspend command is issued, the device takes between 0.1 µs and 15 µs to suspend the
operation. The toggle bit must be monitored to determine when the suspend has been executed. When the
toggle bit stops toggling, data can be read from sectors that are not selected for erase. Reading from a sector
selected for erase can result in invalid data. See the operation status section for a full description.
Once the sector-erase operation is suspended, reading from or programming to a sector that is not being erased
can be performed. This command is applicable only during sector-erase operation. Any other command written
during erase-suspend mode to the suspended sector is ignored.
PRODUCT PREVIEW
erase-resume command
The erase-resume command (30h) restarts a suspended sector-erase operation from the point where it was
halted. Erase resume is a one-bus-cycle command. The addresses can be VIL or VIH and the erase-resume
command (30h) is latched on the rising edge of WE. When an erase-suspend/erase-resume command
combination is written, the internal-pulse counter (exceed timing limit) is reset. The erase-resume command
is valid only in the erase-suspend state. After the erase-resume command is executed, the device returns to
the valid sector-erase state and further writes of the erase-resume command are ignored. After the device has
resumed the sector-erase operation, another erase-suspend command can be issued to the device.
operation status
The status of the device during an automatic-programming algorithm, chip-erase, or automatic-erase algorithm
can be determined in three ways:
D
D
D
DQ7: Data polling
DQ6: Toggle bit
RY/ BY: Ready / busy bit
status-bit definitions
During operation of the automatic embedded program and erase functions, the status of the device can be
determined by reading the data state of designated outputs. The data-polling bit (DQ7) and toggle bit (DQ6)
require multiple successive reads to observe a change in the state of the designated output. Table 6 defines
the values of the status flags.
12
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status-bit definitions (continued)
Table 6. Operation Status Flags†
DQ7
DQ6
DQ5
DQ3
DQ2
RY/BY
DQ7
T
0
0
T
0
1
No Tog
§
0
0
1
No Tog
0
0
T
1
D
DQ7¶
D
D
D
T
0
0
D
1§
1
Program in erase suspend
Programming
DQ7
T
1
0
0
Programming
Program/erase in auto-erase
In progress
Exceeded time limits
Erase suspend mode
Erase-suspend
Erase-sector address
Non-erase sector address
0
0
T
1
1
No Tog
#
DQ7
T
1
0
No Tog
0
Programming complete
D
D
D
D
D
1
Sector-/chip-erase complete
1
1
1
1
1
1
Program/erase in auto erase
Program in erase suspend
Successful operation
complete
0
0
† T= toggle, D= data, No Tog= No toggle
‡ DQ4, DQ1, DQ0 are reserved for future use.
§ DQ2 can be toggled when the sector address applied is an erasing sector. DQ2 cannot be toggled when the sector address applied is a
non-erasing sector. DQ2 is used to determine which sectors are erasing and which are not.
¶ Status flags apply when outputs are read from the address of a non-erase-suspend operation.
# If DQ5 is high (exceeded timing limits), successive reads from a problem sector causes DQ2 to toggle.
data-polling (DQ7)
The data-polling-status function outputs the complement of the data latched into the DQ7 data register while
the write-state machine is engaged in a program or erase operation. Data bit DQ7 changes from complement
to true to indicate the end of an operation. Data-polling is available only during programming, chip-erase,
sector-erase, and sector-erase-timing delay. Data-polling is valid after the rising edge of WE in the last bus cycle
of the command sequence loaded into the command register. Figure 14 shows a flowchart for data-polling.
During a program operation, reading DQ7 outputs the complement of the DQ7 data to be programmed at the
selected address location. Upon completion, reading DQ7 outputs the true DQ7 data loaded into the
program-data register. During the erase operations, reading DQ7 outputs a logic low. Upon completion, reading
DQ7 outputs a logic high. Also, data-polling must be performed at a sector address that is within a sector that
is being erased. Otherwise, the status is invalid. When using data-polling, the address should remain stable
throughout the operation.
During a data-polling read, while OE is logic low, data bit DQ7 can change asynchronously. Depending on the
read timing, the system can read valid data on DQ7, while other DQ pins are still invalid. A subsequent read
of the device is valid. See Figure 15 for the data-polling timing diagram.
toggle bit (DQ6)
The toggle-bit status function outputs data on DQ6, which toggles between logic high and logic low while the
write-state machine is engaged in a program or erase operation. When DQ6 stops toggling after two
consecutive reads to the same address, the operation is complete. The toggle bit is available only during
programming, chip erase, sector erase, and sector-erase-timing delay. Toggle-bit data is valid after the rising
edge of WE in the last bus cycle of the command sequence loaded into the command register. Figure 16 shows
a flowchart of the toggle-bit status-read algorithm. Depending on the read timing, DQ6 can stop toggling while
other DQ pins are still invalid and a subsequent read of the device is valid. See Figure 17 for the toggle-bit timing
diagram.
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PRODUCT PREVIEW
DEVICE OPERATION‡
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
exceed time limit (DQ5)
Program and erase operations use an internal-pulse counter to limit the number of pulses applied. If the
pulse-count limit is exceeded, DQ5 is set to a logic-high data state. This indicates that the program or erase
operation has failed. DQ7 does not change from complemented data to true data and DQ6 does not stop
toggling when read. To continue operation, the device must be reset.
The exceed-time-limit condition occurs when attempting to program a logic-high state into a bit that has been
programmed previously to a logic low. Only an erase operation can change bits from logic low to logic high. After
reset, the device is functional and can be erased and reprogrammed.
sector-load-timer (DQ3)
PRODUCT PREVIEW
The sector-load-timer status bit, DQ3, is used to determine whether the time to load additional sector addresses
has expired. After completion of a sector-erase command sequence, DQ3 remains at a logic low for 100 µs.
This indicates that another sector-erase command sequence can be issued. If DQ3 is at a logic high, it indicates
that the delay has expired and attempts to issue additional sector-erase commands are ignored. See the
sector-erase command section for a description.
The data-polling and toggle bit are valid during the 100-µs time delay and can be used to determine if a valid
sector-erase command has been issued. To ensure additional sector-erase commands have been accepted,
the status of DQ3 should be read before and after each additional sector-erase command. If DQ3 is at a logic
low on both reads, the additional sector-erase command was accepted.
toggle bit 2 (DQ2)
The state of DQ2 determines whether the device is in algorithmic-erase mode or erase-suspend mode. DQ2
toggles if successive reads are issued to the erasing or erase-suspended sector, assuming in case of the latter
that the device is in erase-suspend-read mode. It also toggles when DQ5 becomes a logic high due to the
timer-exceed limit, and reads are issued to the failed sector. DQ2 does not toggle in any other sector due to DQ5
failure. When the device is in erase-suspend-program mode, successive reads from the non-erase-suspended
sector causes a logic high on DQ2.
ready/ busy bit (RY/ BY)
The RY/ BY bit indicates when the device can accept new commands after performing algorithmic operations.
If the RY/ BY (open-drain output) bit is low, the device is busy with either a program or erase operation and does
not accept any other commands except for erase suspend. While it is in the erase-suspend mode, RY/ BY
remains high. In program mode, the RY/ BY bit is valid (logic low) after the fourth WE pulse. In erase mode, it
is valid after the sixth WE pulse. There is a delay period tbusy, after which the RY/ BY bit becomes valid. See
Figure 24 for the timing waveform.
Since the RY/ BY bit is an open-drain output, several such bits can be combined in parallel with a pullup resistor
to VCC.
hardware-reset bit (RESET)
When the RESET pin is driven to a logic low, it forces the device out of the currently active mode and into a reset
state. It also avoids bus contention by placing the outputs into the high-impedance state for the duration of the
RESET pulse.
During program or erase operation, if RESET is asserted to logic low, the RY/ BY bit remains at logic low until
the reset operation is complete. Since this can take anywhere from 1 µs to 20 µs, the RY/ BY bit can be used
to sense reset completion or the user can allow a maximum of 20 µs. If RESET is asserted during read mode,
then the reset operation is complete within 500 ns. See Figure 1 and Figure 2 for timing specifications.
The RESET pin also can be used to drive the device into deep power-down (standby) mode by applying
VSS ± 0.3 V to it. ICC4 reads <1 µA typical, and 5 µA maximum for CMOS inputs. Standby mode can be entered
anytime, regardless of the condition of CE.
14
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hardware-reset bit (RESET) (continued)
Asserting RESET during program or erase can leave erroneous data in the address locations. These locations
need to be updated after the device resumes normal operations. A minimum of 50 ns must be allowed after
RESET goes high before a valid read can take place.
tRL = 500 ns
RESET
20 µs max
RY/BY
Figure 1. Device Reset During a Program or Erase Operation
RESET
RY/BY
0V
Figure 2. Device Reset During Read Mode
temporary hardware-sector unprotect feature
This feature temporarily enables both programming and erase operations on any combination of one to nineteen
sectors that were previously protected. This feature is enabled using high voltage VID (11.5 V to 12.5 V) on the
RESET pin, using standard command sequences.
Normally, the device is delivered with all sectors unprotected.
sector-protect programming
The sector-protect programming mode is activated when A6, A0, and CE are at VIL, and address pin A9 and
control pin OE are forced to VID. Address pin A1 is set to VIH.The sector-select address pins A13–A19 are used
to select the sector to be protected. Address pins A0–A12 and I/O pins must be stable and can be either VIL
or VIH. Once the addresses are stable, WE is pulsed low for 100 µs, causing programming to begin on the falling
edge of WE and to terminate on the rising edge of WE. Figure 18 is a flowchart of the sector-protect algorithm,
and Figure 19 shows a timing diagram of the sector-protect operation.
Commands to program or erase a protected sector do not change the data contained in the sector. Attempts
to program and erase a protected sector cause the data-polling bit (DQ7) and the toggle bit (DQ6) to operate
from 2 µs to 100 µs and then return to valid data.
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tRL = 500 ns
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-protect verify
Verification of the sector-protection programming is activated when WE = VIH, OE = VIL, CE = VIL, and address
pin A9 = VID. Address pins A0 and A6 are set to VIL, and A1 is set to VIH. The sector-address pins A13–A19
select the sector that is to be verified. The other addresses can be VIH or VIL. If the sector that was selected
is protected, the DQs output 01h. If the sector is not protected, the DQs output 00h.
Sector-protect verify can also be read using the algorithm-selection command. After issuing the three-bus-cycle
command sequence, the sector-protection status can be read on DQ0. Set address pins
A0 = VIL, A1 = VIH, and A6 = VIL, and then the sector address pins A13–A19 select the sector to be verified.
The remaining addresses are set to VIL. If the sector selected is protected, DQ0 outputs a logic-high state. If
the sector selected is not protected, DQ0 outputs a logic-low state. This mode remains in effect until another
valid command sequence is written to the device. Figure 18 is a flowchart of the sector-protect algorithm and
Figure 19 shows a timing diagram of the sector-protect operation.
PRODUCT PREVIEW
sector unprotect
Prior to sector unprotect, all sectors must be protected using the sector-protect programming mode. The sector
unprotect is activated when address pin A9 and control pin OE are forced to VID. Address pins A1 and A6 are
set to VIH while CE and A0 are set to VIL. The sector-select address pins A13–A19 can be VIL or VIH. All sectors
are unprotected in parallel and once the inputs are stable, WE is pulsed low for 10 ms, causing the unprotect
operation to begin on the falling edge of WE and to terminate on the rising edge of WE. Figure 20 is a flowchart
of the sector-unprotect algorithm and Figure 21 shows a timing diagram of the sector-unprotect operation.
sector-unprotect verify
Verification of the sector unprotect is accomplished when WE = VIH, OE = VIL, CE =VIL and address pin
A9 = VID, and then select the sector to be verified. Address pins A1 and A6 are set to VIH, and A0 is set to VIL.
The other addresses can be VIH or VIL. If the sector selected is protected, the DQs output 01h. If the sector is
not protected, the DQs output 00h. Sector unprotect can also be read using the algorithm-selection command.
low VCC write lockout
During power-up and power-down operations, write cycles are locked out for VCC less than VLKO. If VCC < VLKO,
the command input is disabled and the device is reset to the read mode. On power up, if CE = VIL, WE = VIL,
and OE = VIH, the device does not accept commands on the rising edge of WE. The device automatically powers
up in the read mode.
glitching
Pulses of less than 5 ns (typical) on OE, WE, or CE do not issue a write cycle.
power supply considerations
Each device should have a 0.1-µF ceramic capacitor connected between VCC and VSS to suppress circuit noise.
Printed circuit traces to VCC should be appropriate to handle the current demand and minimize inductance.
16
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
absolute maximum ratings over ambient temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 7 V
Input voltage range: All inputs except A9, CE, OE (see Note 2) . . . . . . . . . . . . . . . . . . . . – 0.6 V to VCC + 1 V
A9, CE, OE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 13.5 V
Output voltage range (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to VCC + 1 V
Ambient temperature range during read / erase / program, TA
(L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
(E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
(Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to VSS.
2. The voltage on any input pin can undershoot to –2 V for periods less than 20 ns (see Figure 4).
3. The voltage on any input or output pin can overshoot to 7 V for periods less than 20 ns (see Figure 5).
recommended operating conditions
MIN
MAX
4.5
5.5
V
0.7 *VCC
VCC+0.5
VCC+0.5
V
TTL
–0.5
0.8
CMOS
–0.5
0.8
11.5
12.5
V
3.2
4.2
V
Supply voltage
VIH
High level dc input voltage
High-level
VIL
Low level dc input voltage
Low-level
VID
VLKO
Algorithm-selection and sector-protect input voltage
TA
Ambient temperature
TTL
CMOS
Low VCC lock-out voltage
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2
L version
0
70
E version
–40
85
Q version
–40
125
UNIT
PRODUCT PREVIEW
VCC
V
°C
17
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
electrical characteristics over recommended ranges of supply voltage and ambient temperature
PARAMETER
TEST CONDITIONS
TTL-input level
VOH
High-level output voltage
CMOS-input level
PRODUCT PREVIEW
CMOS-input level
VOL
II
Low-level output voltage
IO
IID
Output current (leakage)
Input current (leakage)
MIN
VCC = VCC MIN,
VCC = VCC MIN,
IOH = –2.5 mA
IOH = – 100 µA
VCC = VCC MIN,
VCC = VCC MIN,
IOH = – 2.5 mA
IOL = 5.8 mA
MAX
TTL-input level
V
VCC–0.4
0.85 * VCC
VCC = VCC MAX, VIN = VSS to VCC
VO = VSS to VCC, CE = VIH
A9 or CE or OE = VID MAX
High-voltage current (standby)
UNIT
2.4 V
CE = VIH, VCC = VCC MAX
CE = VCC ± 0.2,
VCC = VCC MAX
0.45
V
±1
µA
±1
µA
35
µA
1
mA
100
µA
ICC1
VCC supply current (standby)
ICC2
VCC supply current (see Notes 4 and 5)
CE = VIL, OE = VIH
40
mA
ICC3
VCC supply current (see Note 6)
CE = VIL, OE = VIH
60
mA
ICC4
VCC supply current (standby during reset)
VCC = VCC MAX,
RESET = VSS ± 0.3 V
5
µA
100
µA
CMOS-input level
ICC5
Automatic sleep mode (see Notes 5 and 7)
VIH = VCC ± 0.3 V, VIL = VSS ± 0.3 V
NOTES: 4. ICC current in the read mode, switching at 6 MHz
5. IOUT = 0 mA
6. ICC current while erase or program operation is in progress
7. Automatic sleep mode is entered when addresses remain stable for 300 ns.
capacitance over recommended ranges of supply voltage and ambient temperature
PARAMETER
Ci1
Input capacitance (All inputs except A9, CE, OE)
Ci2
Co
TEST CONDITIONS
f = 1 MHz
Input capacitance (A9, CE, OE)
VI = 0 V,
VI = 0 V,
Output capacitance
VO = 0 V,
18
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MIN
MAX
UNIT
7.5
pF
f = 1 MHz
9
pF
f = 1 MHz
12
pF
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
PARAMETER MEASUREMENT INFORMATION
0.5 mA
IOL
Output
Under
Test
1.5 V
CL = 30 pF
(see Note A and Note B)
– 0.5 mA
2.4 V
IOH
0.45 V
NOTES: A. CL includes probe and fixture capacitance.
B. The ac testing inputs are driven at 2.4 V for logic high and 0.45 V for logic low. Timing measurements are made at 2 V for logic high
and 0.8 V for logic low on both inputs and outputs. Each device should have a 0.1-µF ceramic capacitor connected between VCC
and VSS as closely as possible to the device pins.
Figure 3. AC Test Output Load Circuit
20 ns
20 ns
+0.8 V
–0.5 V
–2.0 V
20 ns
Figure 4. Maximum Negative Overshoot Waveform
20 ns
VCC + 2.0 V
VCC + 0.5 V
2.0 V
20 ns
20 ns
Figure 5. Maximum Positive Overshoot Waveform
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PRODUCT PREVIEW
2.0 V
0.8 V
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
PARAMETER MEASUREMENT INFORMATION
switching characteristics over recommended ranges of supply voltage and ambient temperature,
read-only operation
PARAMETER
ALTERNATE
SYMBOL
’29F008-90
MIN
MIN
MAX
MIN
MAX
MIN
MAX
tdis(E)
tdis(G)
Disable time, CE to high impedance
ten(E)
ten(G)
Enable time, CE to low impedance
tGHQZ
tELQX
0
0
0
0
ns
Enable time, OE to low impedance
tGLQX
0
0
0
0
ns
Hold time, output from address CE
or OE change
tAXQX
0
0
0
0
ns
20
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ns
80
90
100
120
ns
80
90
100
120
ns
40
45
50
55
ns
30
30
30
40
ns
40
ns
30
30
PRODUCT PREVIEW
th(D)
120
UNIT
Access time, CE
Disable time, OE to high impedance
100
’29F008-120
ta(E)
ta(G)
tGLQV
tEHQZ
90
’29F008-100
Cycle time, read
Access time, OE
80
MAX
tc(R)
ta(A)
Access time, address
tAVAV
tAVQV
tELQV
’29F008-80
• HOUSTON, TEXAS 77251–1443
30
switching characteristics over recommended ranges of supply voltage and ambient temperature, controlled by WE
PARAMETER
tc(W)
tsu(A)
Cycle time, write
th(A)
tsu(D)
th(D)
MIN
TYP
’29F008-90
MAX
MIN
TYP
’29F008-100
MAX
MIN
TYP
’29F008-120
MAX
MIN
TYP
MAX
UNIT
90
100
120
ns
0
0
0
0
ns
Hold time, address
45
50
50
65
ns
Setup time, data
tDVWH
45
50
50
65
ns
Hold time, data valid after
WE high
tWHDX
0
0
0
0
ns
tELWL
tEHWH
0
0
0
0
ns
0
0
0
0
ns
tWLWH1
tWHWL
45
50
50
65
ns
20
30
30
35
ns
tGHWL
0
0
0
0
ns
tWHGL1
tWHGL2
0
0
0
0
ns
10
10
10
10
ns
tVCEL
50
50
50
50
µs
tHVT
4
4
4
4
µs
tw(WL)
tw(WH)
Pulse duration, WE low
Hold time, CE
Pulse duration, WE high
Recovery time, read before
write
Hold time, OE read
Hold time, OE toggle, data
Setup time, VCC
Transition time, VID
(see Notes 8 and 9)
tWLWH2
100
100
100
100
µs
Pulse duration, WE low
(see Note 9)
tWLWH3
10
10
10
10
ms
Setup time, CE VID to WE
(see Note 9)
tEHVWL
4
4
4
4
µs
Setup time, OE VID to WE
(see Notes 8 and 9)
tGHVWL
4
4
4
4
µs
Cycle time, programming
operation
tWHWH1
Write recovery time from
RY / BY
tRB
8
0
8
0
NOTES: 8. Sector-protect timing
9. Sector-unprotect timing
21
PRODUCT PREVIEW
8
0
8
0
µs
ns
TMS29F008T, TMS29F008B
1 048 576 BY 8-BIT
FLASH MEMORIES
Pulse duration, WE low
(see Note 8)
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
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80
Setup time, CE
tc(W)PR
’29F008-80
tAVAV
tAVWL
tWLAX
Setup time, address
tsu(E)
th(E)
trec(R)
ALTERNATE
SYMBOL
PRODUCT PREVIEW
’29F008-120
tRL
500
500
500
500
ns
RESET high time before
read
tRH
50
50
50
50
ns
RESET to power-down
time
tRPD
20
20
20
20
µs
tBUSY
90
90
90
90
ns
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Cycle time, sector-erase
operation
tWHWH2
1
Cycle time, chip-erase
operation
tWHWH3
6
NOTES: 8. Sector-protect timing
9. Sector -unprotect timing
MAX
MIN
TYP
MAX
1
50
6
MIN
TYP
MAX
1
50
6
MIN
TYP
MAX
1
50
6
UNIT
s
50
s
Template Release Date: 7–11–94
’29F008-100
RESET low time
TYP
TMS29F008T, TMS29F008B
1 048 576 BY 8-BIT
FLASH MEMORIES
’29F008-90
MIN
Program/erase
valid to RY / BY delay
tc(W)ER
’29F008-80
ALTERNATE
SYMBOL
PARAMETER
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
22
switching characteristics over recommended ranges of supply voltage and ambient temperature, controlled by WE
(continued)
switching characteristics over recommended ranges of supply voltage and ambient temperature, controlled by CE
PARAMETER
Cycle time, write
th(A)
tsu(D)
Hold time, address
th(D)
tsu(W)
Hold time, data
th(W)
tw(EL)
Hold time, WE
tw(EH)
trec(R)
Pulse duration, CE high
Setup time, address
Setup time, data
Setup time, WE
Pulse duration, CE low
Recovery time, read before write
Setup time, OE
th(C)
Hold time, OE read
Hold time, OE toggle, data
’29F008-80
MIN
TYP
’29F008-90
MAX
MIN
TYP
’29F008-100
MAX
MIN
TYP
’29F008-120
MAX
MIN
TYP
MAX
UNIT
tAVAV
tAVEL
tELAX
80
90
100
120
ns
0
0
0
0
ns
45
50
50
65
ns
tDVEH
tEHDX
45
50
50
65
ns
0
0
0
0
ns
tWLEL
tEHWH
tELEH1
0
0
0
0
ns
0
0
0
0
ns
45
50
50
65
ns
tEHEL
tGHEL
20
30
30
35
ns
0
0
0
0
ns
tGLEL
tEHGL1
tEHGL2
0
0
0
0
ns
0
0
0
0
ns
10
10
10
10
ns
8
8
8
8
µs
Cycle time, sector-erase operation
tEHEH1
tEHEH2
1
1
1
1
s
Cycle time, chip-erase operation
tEHEH3
6
Programming operation
50
6
50
6
50
6
50
s
23
TMS29F008T, TMS29F008B
1 048 576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
tc(W)
tsu(A)
ALTERNATE
SYMBOL
PRODUCT PREVIEW
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
erase and program performance†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1‡
15§
s
µs
s
Sector-erase time
Excludes 00H programming prior to
erasure
Program word time
Excludes system-level overhead
9
11
Program time
Excludes system-level overhead
9
9
5200§
3 600§
6‡
50§
Chip-programming time
Excludes system-level overhead
µs
Erase/program cycles
100 000 1 000 000
cycles
† The internal algorithms allow for 2.5-ms byte-program time. DQ5 = 1 only after a byte takes the theoretical maximum time to program. A minimal
number of bytes can require signficantly more programming pulses than the typical byte. The majority of the bytes program within one or two
pulses. This is demonstrated by the typical and maximum programming times listed above.
‡ 25°C, 5-V VCC, 100 000 cycles, typical pattern
§ Under worst-case conditions: 90°C, 5-V VCC, and 100 000 cycles
latchup characteristics (see Note 10)
PARAMETER
PRODUCT PREVIEW
MIN
MAX
Input voltage with respect to VSS on all pins except I/O pins (including A9 and OE)
–1
13
V
Input voltage with respect to VSS on all I/O pins
–1
VCC + 1
100
V
Current
– 100
UNIT
mA
NOTE 10: Includes all pins except VCC test conditions: VCC = 5 V, one pin at a time
pin capacitance, all packages (see Note 11)
PARAMETER
TEST CONDITIONS
CIN
Input capacitance
COUT
Output capacitance
VIN = 0
VOUT = 0
CIN2
Control pin capacitance
VIN = 0
TYP
MAX
6
7.5
UNIT
pF
8.5
12
pF
8
10
pF
MIN
MAX
NOTE 11: Test conditions TA: 25°C, f = 1 MHz
data retention
PARAMETER
Minimum pattern data retention time
24
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TEST CONDITIONS
150°C
10
125°C
20
• HOUSTON, TEXAS 77251–1443
UNIT
Years
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
read operation
tAVAV
Valid Addresses
Addresses
tAVQV
CE
tEHQZ
tELQV
OE
tGHQZ
WE
PRODUCT PREVIEW
tGLQV
tGLQX
tAXQX
tELQX
Valid Data
DQ
Figure 6. AC Waveform for Read Operation
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
write operation
Start
Write Bus Cycle
555H / AAH
Write Bus Cycle
2AAH / 55H
Write Bus Cycle
555H / A0H
PRODUCT PREVIEW
Write Bus Cycle
Program Address / Program Data
Poll Device Status
Operation
Complete
?
Yes
No
Next Address
Last
Address
?
Yes
End
Figure 7. Program Algorithm
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No
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
write operation (continued)
tAVAV
555H
Addresses
2AAH
555H
PA
PA
tWLAX
tAVWL
CE
tELWL
tWHEH
OE
tWHDX
tGHWL
tWHWL
PRODUCT PREVIEW
tWLWH1
WE
tWHWH1
tDVWH
DQ
AAH
55H
A0H
PD
DQ7
DOUT
NOTES: A. PA = Address to be programmed
B. PD = Data to be programmed
C. DQ7 = Complement of data written to DQ7
Figure 8. AC Waveform for Program Operation
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
write operation (continued)
tAVAV
555H
Addresses
2AAH
555H
PA
PA
tAVEL
tELAX
tELEH1
CE
tEHEL
tGHEL
OE
tDVEH
tWLEL
tEHWH
tWHWH1
PRODUCT PREVIEW
WE
tEHDX
DQ
AAH
55H
A0H
PD
DQ7
NOTES: A. PA = Address to be programmed
B. PD = Data to be programmed
C. DQ7 = Complement of data written to DQ7
Figure 9. Alternate CE-Controlled Write Operation
28
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DOUT
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
chip-erase operation
Start
Write Bus Cycle
555H / AAH
Write Bus Cycle
2AAH / 55H
Write Bus Cycle
555H /80H
PRODUCT PREVIEW
Write Bus Cycle
555H / AAH
Write Bus Cycle
2AAH / 55H
Write Bus Cycle
555H /10H
Poll Device Status
Operation
Complete
?
No
Yes
End
Figure 10. Chip-Erase Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
chip-erase operation (continued)
tAVAV
555H
Addresses
555H
2AAH
555H
VA
tWLAX
tAVWL
CE
tELWL
tWHEH
OE
tWHDX
tGHWL
PRODUCT PREVIEW
tWHWL
tWLWH1
WE
tWHWH3
tDVWH
DQ
80H
AAH
55H
10H
NOTES: A. VA = any valid address
B. Figure details the last four bus cycles in a six-bus-cycle operation.
Figure 11. AC Waveform for Chip-Erase Operation
30
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DQ7=0
DOUT=FFH
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-erase operation
Start
Write Bus Cycle
555H / AAH
Write Bus Cycle
2AAH / 55H
Write Bus Cycle
555H / 80H
PRODUCT PREVIEW
Write Bus Cycle
555H/AAH
Write Bus Cycle
2AAH / 55H
Write Bus Cycle
Sector Address / 30H
No
DQ3 = 0
?
Yes
Load
Additional
Sectors
?
Yes
No
Poll Device Status
No
Operation
Complete
?
Yes
End
Figure 12. Sector-Erase Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-erase operation (continued)
tAVAV
555H
Addresses
555H
2AAH
SA
SA
tWLAX
tAVWL
CE
tELWL
tWHEH
OE
tWHDX
tGHWL
PRODUCT PREVIEW
tWHWL
tWLWH1
WE
tWHWH2
tDVWH
DQ
80H
AAH
55H
30H
NOTES: A. SA = Sector address to be erased
B. Figure details the last four bus cycles in a six-bus-cycle operation.
Figure 13. AC Waveform for Sector-Erase Operation
32
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DQ7=0
DOUT=FFH
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
data-polling operation
Start
Read DQ0 – DQ7
Addr = VA
DQ7 =
Data
?
Yes
No
No
PRODUCT PREVIEW
DQ5 = 1
?
Yes
Read DQ0 – DQ7
Addr = VA
DQ7 =
Data
?
Yes
No
Fail
Pass
NOTES: A. Polling status bits DQ7 and DQ5 may change asynchronously.
Read DQ7 after DQ5 changes states.
B. VA = Program address for byte-programming
= Selected sector address for sector erase
= Any valid address for chip erase
Figure 14. Data-Polling Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
data-polling operation (continued)
AIN
Addresses
AIN
AIN
tAVQV
tAVQV
tELQV
tAXQX
tELQV
CE
tGLQV
tGLQV
OE
tGHQZ
tWHGL1
WE
tGHQX
PRODUCT PREVIEW
tWHWH1, 2, or 3
DQ
DIN
NOTES: A.
B.
C.
D.
DIN
DQ7
DOUT
AIN
DQ7
=
=
=
=
DQ7
DQ7
Last command data written to the device
Complement of data written to DQ7
Valid data output
Valid address for byte-program, sector-erase, or chip-erase operation
Figure 15. AC Waveform for Data-Polling Operation
34
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DOUT
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
toggle-bit operation
Start
Read DQ0 – DQ7
Addr = VA
Read DQ0 – DQ7
Addr = VA
DQ6 =
Toggle
?
No
PRODUCT PREVIEW
Yes
No
DQ5 = 1
?
Yes
Read DQ0 – DQ7
DQ6 =
Toggle
?
No
Yes
Fail
Pass
NOTE A: Polling status bits DQ6 and DQ5 can change
asynchronously. Read DQ6 after DQ5 changes
states.
Figure 16. Toggle-Bit Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
toggle-bit operation (continued)
AIN
Addresses
tAVQV
tELQV
tELQV
CE
tGLQV
tGLQV
OE
tWHGL2
PRODUCT PREVIEW
WE
tWHWH1, 2 or 3
DQ
DIN
DOUT
DQ6 = TOGGLE
NOTES: A.
B.
C.
D.
DIN
DQ6
DOUT
AIN
=
=
=
=
DQ6 = TOGGLE
DQ6 = TOGGLE
Last command data written to the device
Toggle bit output
Valid data output
Valid address for byte-program, sector-erase, or chip-erase operation
Figure 17. AC Waveforms for Toggle-Bit Operation
36
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DQ6 = STOP
TOGGLE
TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-protect operation
Start
Select Sector Address
A13 – A19
X=1
OE and A9 = VID,
CE, A0, and A6 = VIL,
A1 = VIH
Apply One 100-µs
Pulse
PRODUCT PREVIEW
X = X+1
CE, OE, A0, A6 = VIL,
A1 = VIH,
A9 = VID
Read Data
No
X = 25
?
No
Data = 01H
?
Yes
Yes
Sector Protect
Failed
Protect
Additional
Sectors
?
Yes
No
A9 = VIH or VIL
Write Reset Command
End
Figure 18. Sector-Protect Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-protect operation (continued)
Sector Address
A13 – A19
Sector Address
VID
A9
tAVQV
tHVT
A6
A1
A0
CE
VID
PRODUCT PREVIEW
OE
tGHVWL
tHVT
tHVT
tWLWH2
WE
tGLQV
DQ
DOUT
NOTE A: DOUT = 00H if selected sector is not protected,
01H if the sector is protected
Figure 19. AC Waveform for Sector-Protect Operation
38
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-unprotect operation
Start
Protect All Sectors
X=1
OE, A9 = VID,
CE and A0 = VIL,
A6 and A1 = VIH
Apply One
10-ms Pulse
PRODUCT PREVIEW
CE, OE, A0 = VIL,
A6 and A1 = VIH,
A9 = VID
Select Sector Address
X = X+1
Read Data
No
No
X = 1000
?
Next Sector
Address
Data = 00H
?
Yes
Yes
Sector Unprotect
Failed
Last
Sector
?
No
Yes
A9 = VIH or VIL
Write Reset Command
End
Figure 20. Sector-Unprotect Algorithm
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
sector-unprotect operation (continued)
Sector Address
A13 – A19
VID
tAVQV
A9
tHVT
A6
A1
PRODUCT PREVIEW
A0
CE
VID
OE
tGHVWL
tHVT
tHVT
tWLWH3
WE
tGLQV
DQ
DOUT
NOTE A: DOUT = 00H if selected sector is not protected,
01H if the sector is protected
Figure 21. AC Waveform for Sector-Unprotect Operation
40
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
temporary sector-unprotect operation
Start
RESET = VID
(see Note A)
Perform Erase or
Program Operations
RESET = VIH
Temporary SectorGroup-Unprotect
Completed (see Note B)
PRODUCT PREVIEW
NOTES: A. All protected sectors unprotected
B. All previously protected sectors are protected once again
Figure 22. Temporary Sector-Unprotect Algorithm
12 V
5V
RESET
CE
WE
tVLHT
Program or Erase Command Sequence
RY / BY
Figure 23. Temporary Sector-Unprotect Timing Diagram
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
PARAMETER MEASUREMENT INFORMATION
CE
The Rising Edge of the Last WE Signal
WE
Entire Programming or Erase Operations
RY / BY
tBUSY
PRODUCT PREVIEW
Figure 24. RY/ BY Timing Diagram During Program/Erase Operations
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TMS29F008T, TMS29F008B
1048576 BY 8-BIT
FLASH MEMORIES
SMJS845A – MARCH 1997 – REVISED OCTOBER 1997
MECHANICAL DATA
DCD (R-PDSO-G**)
PLASTIC DUAL SMALL-OUTLINE PACKAGE
40 PIN SHOWN
NO. OF
PINS **
MAX
MIN
40
0.402
(10,20)
0.385
(9,80)
48
0.476
(12,10)
0.469
(11,90)
1
40
0.020 (0,50)
A
A
0.012 (0,30)
0.004 (0,10)
0.008 (0,21) M
21
PRODUCT PREVIEW
20
0.728 (18,50)
0.720 (18,30)
0.795 (20,20)
0.780 (19,80)
0.041 (1,05)
0.037 (0,95)
0.006 (0,15)
NOM
0.047 (1,20) MAX
Seating Plane
0.028 (0,70)
0.020 (0,50)
0.004 (0,10)
0.010 (25,00) NOM
4073307/B 07/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
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43
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