ETC 74LCX652TTR

74LCX652
LOW VOLT. CMOS OCTAL BUS TRANSCEIVER/REGISTER
WITH 5 VOLT TOLERANT INPUTS AND OUTPUTS(3-STATE)
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5V TOLERANT INPUTS AND OUTPUTS
HIGH SPEED :
tPD = 7.0 ns (MAX.) at VCC = 3V
POWER DOWN PROTECTION ON INPUTS
AND OUTPUTS
SYMMETRICAL OUTPUT IMPEDANCE:
|IOH| = IOL = 24mA (MIN) at VCC = 3V
PCI BUS LEVELS GUARANTEED AT 24 mA
BALANCED PROPAGATION DELAYS:
tPLH ≅ tPHL
OPERATING VOLTAGE RANGE:
VCC(OPR) = 2.0V to 3.6V (1.5V Data
Retention)
PIN AND FUNCTION COMPATIBLE WITH
74 SERIES 652
LATCH-UP PERFORMANCE EXCEEDS
500mA (JESD 17)
ESD PERFORMANCE:
HBM > 2000V (MIL STD 883 method 3015);
MM > 200V
DESCRIPTION
The 74LCX652 is a low voltage CMOS OCTAL
BUS
TRANSCEIVER
AND
REGISTER
(3-STATE) fabricated with sub-micron silicon gate
and double-layer metal wiring C2MOS technology.
It is ideal for low power and high speed 3.3V
applications; it can be interfaced to 5V signal
environment for both inputs and outputs.
SOP
TSSOP
ORDER CODES
PACKAGE
TUBE
T&R
SOP
TSSOP
74LCX652M1R
74LCX652RM13TR
74LCX652TTR
This device consists of bus transceiver circuits
with 3 state, D-type flip-flops, and control circuitry
arranged for multiplexed transmission of data
directly from the input bus or from the internal
storage registers. Enable (GAB) and (GBA) pins
are provided to control the transceiver functions.
Select AB and Select BA control pins are provided
to select whether real-time or stored data is
transferred. A low input level selects real-time,
and a high selects stored data.
Data on the A or B bus, or both, can be stored in
the internal D flip-flop by low to high transitions at
the appropriate clock pins (CAB or CBA)
regardless of the select or enable control pins.
When select AB and select BA are in the real-time
transfer mode, it is also possible to store data
PIN CONNECTION AND IEC LOGIC SYMBOLS
September 2001
1/13
M74LCX652
without using the internal D-type flip-flops by
simultaneously enabling GAB or GBA. In this
configuration each output reinforces its input.
It has same speed performance at 3.3V than 5V
AC/ACT family, combined with a lower power
consumption.
All inputs and outputs are equipped with
protection circuits against static discharge, giving
them 2KV ESD immunity and transient excess
voltage.
INPUT AND OUTPUT EQUIVALENT CIRCUIT
PIN DESCRIPTION
2/13
PIN No
SYMBOL
1
CLOCK AB (CAB)
2
3
4, 5, 6, 7, 8, 9, 10, 11
20, 19, 18, 17, 16, 15, 14, 13
21
22
23
SELECT AB (SAB)
GAB
A1 to A8
B1 to B8
GBA
SELECT BA (SBA)
CLOCK BA (CBA)
12
24
GND
VCC
NAME AND FUNCTION
A to B Clock Input (LOW to HIGH,
Edge-Triggered)
Select A to B Source Input
Direction Control Input
A Data Inputs/Outputs
B Data Inputs/Outputs
Output Enable Input (Active LOW)
Select B to A Source Input
B to A Clock Input (LOW to HIGH,
Edge Triggered)
Ground (0V)
Positive Supply Voltage
M74LCX652
TRUTH TABLE
GAB GBA CAB CBA SAB SBA
X
L
Both the A bus and the B bus are inputs
The Output functions of the A and B bus are disabled
Both the A and B bus are used for inputs to the internal
flip-flops. Data at the bus will be stored on low to high
transition of the clock inputs.
The A bus are outputs and the B bus are inputs
X
INPUTS
Z
INPUTS
Z
X
X
INPUTS
INPUTS
X
L
OUTPUTS
L
H
L
INPUTS
L
H
L
X
L
X
H
X
H
X*
L
X
X*
L
X
X*
H
X
X*
H
X
X*
H
X
X
H
H
X
L
X*
X
X*
X
H
X
H
FUNCTION
X
X
X*
H
B
H
X*
L
A
L
X
The data at the B bus are displayed at the A bus
The data at the B bus are displayed at the A bus. The
data of the B bus are stored to internal flip-flop on low
H
H
to high transition of the clock pulse
The data stored to the internal flip-flop are displayed at
Qn
X
the A bus.
L
L
The data at the B bus are stored to the internal flip-flop
on low to high transition of the clock pulse. The states
H
H
of the internal flip-flops output directly to the A bus.
INPUTS OUTPUTS The A bus are inputs and the B bus are outputs.
L
L
The data at the A bus are displayed at the B bus
H
H
L
L
The data at the A bus are displayed at the B bus. The
data of the A bus are stored to the internal flip-flop on
H
H
low to high transition of the clock pulse.
The data stored to the internal flip-flops are displayed
X
Qn
at the B bus
L
L
The data at the A bus are stored to the internal flip-flop
on low to high transition of the clock pulse. The states
H
H
of the internal flip-flops output directly to the B bus.
OUTPUTS OUTPUTS Both the A bus and the B bus are outputs
The data stored to the internal flip-flops are displayed
Qn
Qn
at the A and B bus respectively.
X : Don’t Care
Z : High Impedance
Qn : The data stored to the internal flip-f lops by most recent low to high transition of the clock inputs
* : The data at the A and B bus will be stored to the internal flip-flops on every low to high transition of the clock inputs.
3/13
M74LCX652
LOGIC DIAGRAM
This logic diagram has not be used to estimate propagation delays
TIMING CHART
4/13
M74LCX652
ABSOLUTE MAXIMUM RATINGS
Symbol
V CC
Parameter
Value
Unit
Supply Voltage
-0.5 to +7.0
V
VI
DC Input Voltage
-0.5 to +7.0
V
VO
DC Output Voltage (OFF State)
VO
DC Output Voltage (High or Low State) (note 1)
-0.5 to +7.0
V
-0.5 to VCC + 0.5
V
IIK
DC Input Diode Current
- 50
mA
IOK
DC Output Diode Current (note 2)
- 50
mA
IO
DC Output Current
± 50
mA
ICC
DC Supply Current per Supply Pin
± 100
mA
IGND
DC Ground Current per Supply Pin
± 100
mA
Tstg
Storage Temperature
-65 to +150
°C
TL
Lead Temperature (10 sec)
300
°C
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is
not implied
1) IO absolute maximum rating must be observed
2) VO < GND
RECOMMENDED OPERATING CONDITIONS
Symbol
V CC
Parameter
Supply Voltage (note 1)
Value
Unit
2.0 to 3.6
V
0 to 5.5
V
VI
Input Voltage
VO
Output Voltage (OFF State)
0 to 5.5
V
VO
Output Voltage (High or Low State)
0 to VCC
V
± 24
mA
± 12
mA
IOH, IOL
IOH, IOL
Top
dt/dv
High or Low Level Output Current (V CC = 3.0 to 3.6V)
High or Low Level Output Current (V CC = 2.7V)
Operating Temperature
Input Rise and Fall Time (note 2)
-55 to 125
°C
0 to 10
ns/V
1) Truth Table guaranteed: 1.5V to 3.6V
2) VIN from 0.8V to 2V at VCC = 3.0V
5/13
M74LCX652
DC SPECIFICATIONS
Test Condition
Symbol
VIH
VIL
VOH
Parameter
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
Low Level Output
Voltage
Ioff
IOZ
ICC
∆ICC
Input Leakage
Current
Power Off Leakage
Current
High Impedance
Output Leakage
Current
Quiescent Supply
Current
ICC incr. per Input
Min.
Max.
2.0
-55 to 125 °C
Min.
Unit
Max.
2.0
V
2.7 to 3.6
0.8
0.8
2.7 to 3.6
I O=-100 µA
VCC-0.2
VCC-0.2
2.7
IO=-12 mA
2.2
2.2
IO=-18 mA
2.4
2.4
IO=-24 mA
2.2
V
V
2.2
2.7 to 3.6
IO=100 µA
0.2
0.2
2.7
IO=12 mA
0.4
0.4
IO=16 mA
0.4
0.4
IO=24 mA
0.55
0.55
2.7 to 3.6
VI = 0 to 5.5V
±5
±5
µA
0
V I or VO = 5.5V
10
10
µA
2.7 to 3.6
V I = VIH or VIL
VO = 0 to VCC
±5
±5
µA
2.7 to 3.6
VI = VCC or GND
VI or VO= 3.6 to 5.5V
10
10
± 10
± 10
2.7 to 3.6
VIH = VCC - 0.6V
500
500
3.0
II
-40 to 85 °C
VCC
(V)
3.0
VOL
Value
V
µA
µA
DYNAMIC SWITCHING CHARACTERISTICS
Test Condition
Symbol
VOLP
V OLV
Parameter
Dynamic Low Level Quiet
Output (note 1)
TA = 25 °C
VCC
(V)
3.3
Value
Min.
CL = 50pF
VIL = 0V, V IH = 3.3V
Typ.
0.8
-0.8
Unit
Max.
V
1) Number of outputs defined as ”n”. Measured with ”n-1” outputs switching from HIGH to LOW or LOW to HIGH. The remaining output is
measured in the LOW state.
6/13
M74LCX652
AC ELECTRICAL CHARACTERISTICS
Test Conditi on
Symbol
Parameter
VCC
(V)
tPLH tPHL
Propagation Delay
Time (CAB or CBA
to An or Bn)
Propagation Delay
Time (An to Bn or Bn
to An)
Propagation Delay
Time (SAB or SBA
to An or Bn)
Output Enable Time
(GAB, GBA to An or
Bn)
Output Disable Time
(GAB, GBA to An or
Bn)
Setup Time, HIGH or
LOW level Data to
CAB, CBA
Hold Time, HIGH or
LOW level Data to
CAB, CBA
CAB, CBA Pulse
Width, HIGH or
LOW
Clock Pulse
Frequency
Output To Output
Skew Time (note1,
2)
2.7
tPLH tPHL
tPLH tPHL
tPZL tPZH
tPLZ tPHZ
tS
th
tW
fMAX
tOSLH
tOSHL
CL
(pF)
RL
(Ω)
Value
ts = t r
(ns)
50
500
2.5
50
500
2.5
50
500
2.5
50
500
2.5
50
500
2.5
50
500
2.5
50
500
2.5
50
500
2.5
3.0 to 3.6
50
500
2.5
3.0 to 3.6
50
500
2.5
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
2.7
3.0 to 3.6
-40 to 85 °C
-55 to 125 °C
Min.
Max.
Min.
Max.
1.5
9.5
1.5
9.5
1.5
8.5
1.5
8.5
1.5
8.0
1.5
8.0
1.5
7.0
1.5
7.0
1.5
9.5
1.5
9.5
1.5
8.5
1.5
8.5
1.5
9.5
1.5
9.5
1.5
8.5
1.5
8.5
1.5
9.5
1.5
9.5
1.5
8.5
1.5
8.5
2.5
2.5
2.5
2.5
1.5
1.5
1.5
1.5
4.0
4.0
3.3
3.3
150
150
1.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
MHz
1.0
ns
1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switching in the same direction, either HIGH or LOW (tOSLH = | tPLHm - tPLHn|, tOSHL = | tPHLm - tPHLn|)
2) Parameter guaranteed by design
CAPACITIVE CHARACTERISTICS
Test Condition
Symbol
Parameter
CIN
Input Capacitance
CI/O
I/O Capacitance
CPD
Power Dissipation Capacitance
(note 1)
Value
TA = 25 °C
VCC
(V)
Min.
Typ.
Unit
Max.
3.3
VIN = 0 to VCC
6
pF
3.3
VIN = 0 to VCC
10
pF
3.3
fIN = 10MHz
V IN = 0 or VCC
36
pF
1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without
load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + ICC/8 (per circuit)
7/13
M74LCX652
TEST CIRCUIT
TEST
tPLH, tPHL
SWITCH
Open
tPZL, tPLZ
6V
tPZH, tPHZ
GND
C L = 50 pF or equivalent (includes jig and probe capacitance)
R L = R1 = 500Ω or equivalent
R T = ZOUT of pulse generator (typically 50Ω)
WAVEFORM 1 : PROPAGATION DELAY TIMES (f=1MHz; 50% duty cycle)
8/13
M74LCX652
WAVEFORM 2: OUTPUT ENABLE AND DISABLE TIME (f=1MHz; 50% duty cycle)
9/13
M74LCX652
WAVEFORM 3 : SETUP AND HOLD TIME, MAXIMUM CK FREQUENCY (f=1MHz; 50% duty cycle)
WAVEFORM 4 : PULSE WIDTH (f=1MHz; 50% duty cycle)
10/13
M74LCX652
SO-24 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
A
MIN.
TYP.
MAX.
2.65
a1
0.1
0.104
0.2
a2
0.004
0.008
2.45
0.096
b
0.35
0.49
0.014
0.019
b1
0.23
0.32
0.009
0.012
C
0.5
0.020
c1
45° (typ.)
D
15.20
15.60
0.598
0.614
E
10.00
10.65
0.393
0.419
e
1.27
0.050
e3
13.97
0.550
F
7.40
7.60
0.291
0.300
L
0.50
1.27
0.020
0.050
S
8° (max.)
L
s
e3
b1
e
a1
b
A
a2
C
c1
E
D
13
1
12
F
24
PO13T
11/13
M74LCX652
TSSOP24 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
A
MIN.
TYP.
MAX.
1.1
A1
0.05
0.15
A2
0.043
0.002
0.006
0.9
0.035
b
0.19
0.30
0.0075
0.0118
c
0.09
0.20
0.0035
0.0079
D
7.7
7.9
0.303
0.311
E
6.25
6.5
0.246
0.256
E1
4.3
4.5
0.169
0.177
e
0.65 BSC
0.0256 BSC
K
0°
8°
0°
8°
L
0.50
0.70
0.020
0.028
A
A2
A1
b
K
e
L
E
c
D
E1
PIN 1 IDENTIFICATION
1
7047476A
12/13
M74LCX652
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consequences of use of such information nor for any infringe ment of patents or other righ ts of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this pub lication are subject to change without notice. Thi s pub lication supersedes and replaces all information
previously supplied. STMicroelectronics prod ucts are not authori zed for use as critical components in life suppo rt devices or
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