ETC 82C465MVA

OPTi
®
82C465MV/MVA/MVB
Single-Chip Mixed Voltage
Notebook Solution
Data Book
Revision: 3.0
912-3000-016
October, 1997
Copyright
Copyright © 1997, OPTi Inc. All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, stored
in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise, without the prior written permission of OPTi Incorporated, 888 Tasman
Drive, Milpitas, CA 95035.
Disclaimer
OPTi Inc. makes no representations or warranties with respect to the design and documentation herein described and especially disclaims any implied warranties of merchantability or fitness for any particular purpose. Further, OPTi Inc. reserves the
right to revise the design and associated documentation and to make changes from time to time in the content without obligation
of OPTi Inc. to notify any person of such revisions or changes.
Note:
Before designing contact OPTi for latest Product Alerts, Applications Notes, and Errata for this product line.
Trademarks
OPTi and OPTi Inc. are registered trademarks of OPTi Inc. All other trademarks and copyrights are the property of their respective holders.
OPTi Inc.
888 Tasman Drive
Milpitas, CA 95035
Tel: (408) 486-8000
Fax: (408) 486-8001
WWW: http://www.opti.com/
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82C465MV/MVA/MVB
Table of Contents
1.0
Features ............................................................................................................................ 1
2.0
Overview ........................................................................................................................... 4
2.1
3.0
Upgrade Comparison ......................................................................................................................... 4
Signal Definitions ............................................................................................................. 5
3.1
Terminology/Nomenclature Conventions ........................................................................................ 5
3.2
Pinout Options .................................................................................................................................... 5
3.3
Strap-Selected Interface Options ...................................................................................................... 5
3.4
3.5
3.3.1
Mixed Voltage Interface Options ............................................................................................ 7
3.3.2
Resume Reset (RSMRST#) Function .................................................................................... 7
3.3.3
Reading the 1X/2X Strap Setting............................................................................................ 7
3.3.4
Using Strap Options with TTL Logic ....................................................................................... 8
Program Selected Interface Options................................................................................................. 9
3.4.1
DACKMUX Decoder Lines Source ......................................................................................... 9
3.4.2
EPMI Signal Source .............................................................................................................10
3.4.2.1 Additional EPMI Sources ......................................................................................10
Standard Mode 82C465MV Interface ...............................................................................................11
3.5.1
Reduced Memory Interface Signal Group Option.................................................................12
3.5.2
82C465MV Interface with L2 Cache Support .......................................................................14
3.5.3
82C465MV with 386 Interface ..............................................................................................15
3.6
Pin Signal Characteristics ...............................................................................................................16
3.7
Signal Descriptions ..........................................................................................................................21
3.7.1
Clock and Reset Interface ....................................................................................................21
3.7.2
CPU / VL-Bus Interface ........................................................................................................22
3.7.3
DRAM Interface ....................................................................................................................25
3.7.4
L2 Cache Interface ...............................................................................................................26
3.7.5
ISA Bus Interface..................................................................................................................26
3.7.6
IPC (82C206) Interface.........................................................................................................27
3.7.7
PMU Interface.......................................................................................................................28
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Table of Contents (cont.)
4.0
3.7.8
Miscellaneous Signal Interface .............................................................................................30
3.7.9
Power and Ground Pins .......................................................................................................31
Functional Description .................................................................................................. 33
4.1
463/465 Chipset Programming Comparison ..................................................................................33
4.2
CPU and VL-Bus Interface ...............................................................................................................33
4.3
4.2.1
Basic Command Interface ....................................................................................................33
4.2.1.1 Cycle Signals ........................................................................................................33
4.2.2
Local Device Interface ..........................................................................................................34
4.2.2.1 LDEV# Operation ..................................................................................................34
4.2.2.2 LRDY# Operation..................................................................................................35
4.2.2.3 VL-Bus Arbitration Logic .......................................................................................35
4.2.3
VL-Bus Masters ....................................................................................................................36
4.2.3.1 Hardware Considerations .....................................................................................36
4.2.3.2 Programming ........................................................................................................36
4.2.4
Data Bus Conversion/Data Path Logic .................................................................................36
4.2.4.1 CPU Data Bus Multiplex Option ............................................................................36
4.2.5
Numeric Coprocessor Interface............................................................................................37
4.2.5.1 Hardware Considerations .....................................................................................37
4.2.5.2 Programming ........................................................................................................37
4.2.6
Special CPU Interface Support.............................................................................................37
4.2.6.1 Ability to Cut CPU Power During Suspend ...........................................................37
4.2.6.2 Programmable A20M# Functionality .....................................................................37
4.2.6.3 Programmable CPU RESET Functionality............................................................38
4.2.6.4 Programmable DACK2# Functionality ..................................................................38
4.2.6.5 Cyrix Linear Burst Mode Support ..........................................................................38
4.2.6.6 Programmable Exclusion of Coprocessor Recognition.........................................38
4.2.6.7 Programmable RDYI# Functionality......................................................................38
System Functions .............................................................................................................................39
4.3.1
Reset Logic...........................................................................................................................39
4.3.1.1 RST1# ...................................................................................................................39
4.3.1.2 RST4# ...................................................................................................................39
4.3.1.3 CPURST and SRESET.........................................................................................39
4.3.1.4 Resume Reset (RSMRST#) Function ...................................................................39
4.3.1.5 Rapid RESET Generation .....................................................................................41
4.3.1.6 Fast Reset Handling in SMM ................................................................................41
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Table of Contents (cont.)
4.4
4.5
4.3.2
System Clock Generation .....................................................................................................42
4.3.2.1 Input Clocks ..........................................................................................................42
4.3.2.2 Output Clocks .......................................................................................................43
4.3.3
A20M# Generation ...............................................................................................................45
4.3.3.1 Rapid A20M# Generation .....................................................................................45
4.3.3.2 Inhibition of Fast A20M# and Fast Reset Generation ...........................................46
4.3.3.3 A20M# Handling in SMM ......................................................................................47
4.3.3.4 Port 060/064h A20M# Setting Accessibility ..........................................................47
DRAM Controller ...............................................................................................................................48
4.4.1
DRAM Controller Hardware Options ....................................................................................48
4.4.2
DRAM Bus Drive Capability..................................................................................................50
4.4.3
Setting Up DRAM Operation ................................................................................................50
4.4.3.1 Faster Memory Cycles ..........................................................................................52
4.4.3.2 DRAM Mapping Scheme Enable ..........................................................................52
4.4.3.3 DRAM Control Register 2I - SYSCFG 35h ...........................................................52
4.4.4
EDO DRAM Support.............................................................................................................53
4.4.5
DRAM Cycle Speed..............................................................................................................53
4.4.6
System ROM and Shadow RAM ..........................................................................................54
Cache Control ...................................................................................................................................57
4.5.1
Global Enabling of Cacheability............................................................................................57
4.5.2
Defining Non Cacheable Blocks ...........................................................................................57
4.5.2.1 C000, E000, F000h Block Cache Enable .............................................................58
4.5.2.2 Cache Control of C000-F000h ..............................................................................59
4.5.2.3 Cache Invalidation Feature ...................................................................................61
4.5.3
L1 Write-Back Cache Support ..............................................................................................61
4.5.3.1 Hardware Considerations .....................................................................................61
4.5.3.2 Extra Programmable Pin Options .........................................................................62
4.5.3.3 Programming ........................................................................................................63
4.5.3.4 Burst Write Feature ...............................................................................................63
4.5.4
L2 Cache Support.................................................................................................................64
4.5.4.1 Performance .........................................................................................................65
4.5.4.2 L2 Cache Operation Details ..................................................................................65
4.5.4.3 L2 Cache Arrangement .........................................................................................67
4.5.4.4 Differences Between L2 Support and No Cache Support Modes .........................68
4.5.4.5 Hardware Considerations .....................................................................................69
4.5.4.6 Programming ........................................................................................................69
4.5.4.7 Timing Control Register ........................................................................................70
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Table of Contents (cont.)
4.6
Peripheral Interface Logic................................................................................................................71
4.6.1
ISA Bus
4.6.1.1
4.6.1.2
4.6.1.3
4.6.1.4
4.6.1.5
4.6.1.6
4.6.1.7
Logic .......................................................................................................................71
Hardware Considerations .....................................................................................71
ISA Write Cycle Inhibition .....................................................................................72
ISA Bus Clock Options..........................................................................................73
ISA Bus Refresh Control.......................................................................................73
Programming ........................................................................................................74
ISA Bus Address Buffer Enable Signal .................................................................75
Docking Station Attachment Feature ....................................................................75
4.6.2
Programmed Hardware Reset..............................................................................................76
4.6.3
Integrated Peripheral Controller ...........................................................................................76
4.6.3.1 Multiplexor Hardware Considerations ...................................................................76
4.6.3.2 DMA Hardware Considerations ............................................................................76
4.6.3.3 IPC Configuration Programming ...........................................................................77
4.6.3.4 Interrupt Controller Register Programming ...........................................................77
4.6.3.5 DMA Controller Programming Registers...............................................................81
4.6.3.6 Determining DMA Status Before Suspend............................................................84
4.6.3.7 DMA Register Read Back Provisions ...................................................................85
4.6.3.8 LDEV# Sense Control...........................................................................................86
4.6.3.9 Type F DMA Support ............................................................................................86
4.6.3.10 Timer Programming Registers ..............................................................................87
4.6.3.11 Writing/Reading I/O Port 070h ..............................................................................88
4.6.3.12 Additional Floppy Support.....................................................................................89
4.6.3.13 IRQ8 Polarity.........................................................................................................89
4.6.4
Integrated Local-Bus Enhanced IDE Interface .....................................................................90
4.6.4.1 Hardware Considerations .....................................................................................90
4.6.4.2 Performance and Power .......................................................................................91
4.6.4.3 Signal Connection.................................................................................................91
4.6.4.4 DBE (TRIS) Polarity ..............................................................................................91
4.6.4.5 Programming ........................................................................................................91
4.6.4.6 Four-Drive IDE Support ........................................................................................96
4.6.5
Compact ISA Interface .........................................................................................................98
4.6.5.1 CISA Stop Clock Cycle Generation ......................................................................99
4.6.5.2 Configuration Cycle Generation ............................................................................99
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Table of Contents (cont.)
4.6.5.3
4.7
4.8
Driveback Cycle Handling ...................................................................................100
Power Management Unit ................................................................................................................102
4.7.1
Activity Monitoring ..............................................................................................................102
4.7.1.1 Timers .................................................................................................................102
4.7.1.2 Events .................................................................................................................103
4.7.2
Timers.................................................................................................................................103
4.7.2.1 Time-out Count and Time-out SMI......................................................................104
4.7.3
ACCESS Events .................................................................................................................105
4.7.3.1 Serial (COMx) and Parallel Port (LPT) Access ...................................................106
4.7.3.2 ISA Bus Floppy and Hard Drive Access .............................................................106
4.7.3.3 Integrated Controller Hard Drive Access ............................................................106
4.7.3.4 Keyboard Access ................................................................................................106
4.7.3.5 LCD Controller Access........................................................................................107
4.7.3.6 Chip Select Generation (CSG) Access ...............................................................108
4.7.3.7 General Purpose (GNR) Access .........................................................................108
4.7.4
Activity Tracking .................................................................................................................111
4.7.5
Reloading IDLE_TIMER .....................................................................................................112
4.7.6
External PMI Events ...........................................................................................................112
4.7.6.1 Suspend/Resume Pin .........................................................................................113
4.7.6.2 EPMI Signal Relocation ......................................................................................113
4.7.6.3 Programming ......................................................................................................114
4.7.6.4 Power Management Event Status ......................................................................115
System Management Interrupt (SMI) ............................................................................................116
4.8.1
SMI Presetting for Various CPU Type ................................................................................118
4.8.1.1 Intel SL-Enhanced and AMD 5x86 CPU Settings ...............................................119
4.8.1.2 Cyrix CPU Settings .............................................................................................119
4.8.1.3 AMD 486DXLV / IBM “Blue Lightning” CPU Settings .........................................119
4.8.1.4 Non-SMI CPU Settings .......................................................................................120
4.8.2
Loading Initial SMM Code and Data ...................................................................................120
4.8.2.1 SMBASE Register...............................................................................................121
4.8.3
Run-Time SMI Address Relocation ....................................................................................122
4.8.3.1 Relocation with Standard Interface SMI..............................................................122
4.8.3.2 Relocation with Alternative Interface SMI ...........................................................122
4.8.4
SMI Event Generation ........................................................................................................122
4.8.4.1 Time-out Event Generation of SMI .....................................................................122
4.8.4.2 Access Event Generation of SMI ........................................................................122
4.8.4.3 No Flush Required on Entry to SMM ..................................................................123
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Table of Contents (cont.)
4.8.4.4
4.8.4.5
4.9
Interrupt Event Generation of SMI ......................................................................124
Enabling of Events to Generate SMI...................................................................124
4.8.5
DRQ Generation of SMI .....................................................................................................126
4.8.6
Servicing an SMI ................................................................................................................126
4.8.6.1 PMI Source Register Details ...............................................................................127
4.8.6.2 EPMI Pin PMI Sources .......................................................................................127
4.8.6.3 I/O SMI Trap Indication .......................................................................................128
4.8.6.4 Utility Registers ...................................................................................................128
System Power Management ..........................................................................................................129
4.9.1
STPCLK# Mechanism to Change CPU Speed...................................................................129
4.9.1.1 Hardware Considerations ...................................................................................129
4.9.1.2 Programming ......................................................................................................129
4.9.2
Doze Mode .........................................................................................................................131
4.9.2.1 Dual Doze Timer Reload Selections ...................................................................131
4.9.2.2 Presetting Events to Reset Doze Mode ..............................................................133
4.9.2.3 LDEV# Doze Reset .............................................................................................134
4.9.2.4 Doze Reset Inside SMM .....................................................................................134
4.9.2.5 Automatic (Hardware) Doze Mode......................................................................135
4.9.2.6 APM (Software) Doze Mode ...............................................................................136
4.9.2.7 Start Doze Bit......................................................................................................137
4.9.2.8 Using Doze Time-out to Trigger an SMI .............................................................137
4.9.3
CPU Thermal Management Unit ........................................................................................138
4.9.3.1 Prediction of Overtemp Activity ...........................................................................138
4.9.3.2 Example ..............................................................................................................140
4.9.3.3 Programming ......................................................................................................140
4.9.4
Emergency Overtemp Sense .............................................................................................141
4.9.4.1 Programming ......................................................................................................141
4.10 Suspend and Resume ....................................................................................................................142
4.10.1
Suspend Mode ...................................................................................................................142
4.10.1.1 Suspend Mode Power Savings ...........................................................................143
4.10.2
Resume Event ....................................................................................................................145
4.10.2.1 EPMI/IRQ Events ................................................................................................145
4.10.2.2 SUSP/RSM and RI Events..................................................................................145
4.10.3
Chip-Level Power Conservation Features ..........................................................................147
4.10.3.1 Automatic Keeper Resistors ...............................................................................147
4.10.3.2 Zero-Volt CPU Suspend .....................................................................................148
4.10.3.3 Clock Stretching ..................................................................................................149
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4.10.3.4 Stopping IPC Clock When Not In Use ................................................................149
4.10.3.5 Stopping KBCLK and KBCLK2 ...........................................................................149
4.11 Power Control Latch and PIO Pins ...............................................................................................150
4.11.1
Power Control Latch ...........................................................................................................150
4.11.1.1 Hardware Considerations ...................................................................................150
4.11.1.2 Signal Considerations .........................................................................................150
4.11.1.3 Programming ......................................................................................................150
4.11.2
Programmable I/O Pins ......................................................................................................152
4.11.2.1 PIO3/STPGNT# Pin Select .................................................................................152
4.11.2.2 PIO2/CPUSPD Pin Select...................................................................................152
4.11.2.3 PIO1/NOWS# Pin Select ....................................................................................152
4.11.3
Programmable Chip Select Feature ...................................................................................153
4.11.3.1 Programmable Chip Select Limitations ...............................................................155
5.0
Register Summary ....................................................................................................... 157
6.0
Electrical Ratings ......................................................................................................... 177
6.1
Absolute Maximum Ratings...........................................................................................................177
6.2
5.0V DC Characteristics: TA = 0°C to +70°C, VDDS = 5.0V± 5% .................................................177
6.3
3.3V DC Characteristics: TA = 0°C to +70°C, VDD = 3.3V± 5% ...................................................178
6.4
AC Characteristics..........................................................................................................................178
6.5
Timing Characteristics: CPU interface = 3.3V, all other interfaces = 5.0V ................................179
6.5.1
Cache Timing .....................................................................................................................179
6.5.2
DRAM Timing .....................................................................................................................179
6.5.3
AT Bus Timing ....................................................................................................................180
6.5.4
Reset and Local Bus Timing...............................................................................................181
6.5.5
Power Management Timing................................................................................................182
6.6
Timing Diagrams.............................................................................................................................183
6.7
Functional Memory Timing Diagrams...........................................................................................205
6.7.1
Fast Page Mode (FPM) DRAM...........................................................................................205
6.7.2
Extended Data Out (EDO)..................................................................................................213
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Table of Contents (cont.)
7.0
Test Mode Information ................................................................................................ 219
8.0
Mechanical Package Outline....................................................................................... 221
A.
Incompatibilities with the 82C463MV ......................................................................... 223
B.
A.1
Power Plane Changes ....................................................................................................................223
A.2
Read Cycle Efficiency ....................................................................................................................223
A.3
ADS# Sampling ...............................................................................................................................223
A.4
Removal of Sequencer ...................................................................................................................223
A.5
Default Refresh Rate Change ........................................................................................................223
A.6
I/O Blocking Default Change .........................................................................................................223
A.7
Suspend Mode DACKMUX Parking...............................................................................................223
Compact ISA Specification ......................................................................................... 225
B.1
Compact ISA Overview ..................................................................................................................225
B.2
Compact ISA Cycle Definition .......................................................................................................226
B.3
B.2.1
Memory Cycle.....................................................................................................................226
B.2.2
I/O Cycle.............................................................................................................................229
B.2.3
DMA on the CISA/ISA Bus .................................................................................................230
B.2.4
DACK# Cycle......................................................................................................................230
B.2.5
Configuration Cycle ............................................................................................................232
Interrupt and DMA Request Drive-Back .......................................................................................234
B.3.1
Interrupt Requests ..............................................................................................................234
B.3.2
DMA Requests ...................................................................................................................234
B.4
Performance Control ......................................................................................................................235
B.5
Compatibility and Host Responsibilities ......................................................................................236
B.6
Shared Speaker Signal Support (Optional) ..................................................................................236
B.6.1
Initial Synchronization.........................................................................................................236
B.6.2
SPKR Sharing During Active Mode ....................................................................................237
B.6.3
SPKR Sharing During Stop Clock Mode ............................................................................238
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Table of Contents (cont.)
B.6.4
B.7
C.
Audio Output Circuit Recommendations ............................................................................238
Automatic Voltage Threshold Detection ......................................................................................238
82C602A Notebook Companion Chip......................................................................... 239
C.1
C.2
C.3
Features ...........................................................................................................................................239
C.1.1
General Features................................................................................................................239
C.1.2
Power-Saving Features ......................................................................................................239
Overview ..........................................................................................................................................239
C.2.1
Modes/Chipset Support ......................................................................................................239
C.2.2
Design Notes ......................................................................................................................239
C.2.3
Reducing Suspend Power Consumption ............................................................................240
C.2.4
82C602A Power Consumption Measurements ..................................................................240
C.2.5
Internal Real-Time Clock (RTC) .........................................................................................240
C.2.5.1 RTC Features .....................................................................................................240
C.2.5.2 RTC Overview.....................................................................................................241
C.2.5.3 RTC Address Map ..............................................................................................241
C.2.5.4 Programming the RTC ........................................................................................242
C.2.5.5 Square-wave Output ...........................................................................................243
C.2.5.6 Interrupts .............................................................................................................243
C.2.5.7 Power-Down/Power-Up Cycle ............................................................................248
C.2.5.8 Control/Status Registers .....................................................................................249
Signal Definitions ...........................................................................................................................251
C.3.1
486 NB Mode Signal Descriptions......................................................................................254
C.3.1.1 Clock and Reset Interface Signals ......................................................................254
C.3.1.2 Interrupt/Control Interface Signals ......................................................................254
C.3.1.3 ISA DMA Arbiter Interface Signals ......................................................................254
C.3.1.4 Bus Interface Signals ..........................................................................................255
C.3.1.5 Real-Time Clock and Keyboard Interface Signals ..............................................255
C.3.1.6 Miscellaneous Interface Signals .........................................................................256
C.3.1.7 Power and Ground Pins ......................................................................................256
C.4
Schematics ......................................................................................................................................257
C.5
82C602A Mechanical Package Outline .........................................................................................258
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Table of Contents (cont.)
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List of Figures
Figure 1-1
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Figure 4-5
Figure 4-6
Figure 4-7
Figure 4-8
Figure 4-9
Figure 6-1
Figure 6-2
Figure 6-3
Figure 6-4
Figure 6-5
Figure 6-6
Figure 6-7
Figure 6-8
Figure 6-9
Figure 6-10
Figure 6-11
Figure 6-12
Figure 6-13
Figure 6-14
Figure 6-15
Figure 6-16
Figure 6-17
Figure 6-18
Figure 6-19
Figure 6-20
Figure 6-21
Figure 6-22
Figure 6-23
System Block Diagram .................................................................................................................... 1
RST4# and Buffer Connection......................................................................................................... 8
Standard DACKMUX0-2 Connection (SYSCFG A0h[3] = 1) ........................................................... 9
Multiplexed EPMI Input Connections.............................................................................................10
Pin Diagram - Standard Mode .......................................................................................................11
Pin Diagram - 82C463MV-Compatible Mode ................................................................................13
Pin Diagram - 82C465MV Interface with L2 Cache Support .........................................................14
Pin Diagram - 386 Interface Mode.................................................................................................15
Resume Reset Function ................................................................................................................40
Generation of HITM# and BOFF# .................................................................................................61
L2 Cache Connection - Two Bank Configuration...........................................................................64
Correcting AEN for 16-bit DMA......................................................................................................77
Multiplexed Input Sampling Points ................................................................................................77
Interface to Integrated IDE Controller ............................................................................................90
Activity Monitoring Block Diagram ...............................................................................................102
Thermal Management Block Diagram .........................................................................................139
Damping R-C for PPWRL Spike ..................................................................................................150
ROM Cycle with SDENH#, SDENL# (L2 Cache Enabled) ..........................................................183
ISA Bus Cycle..............................................................................................................................184
Keyboard Controller Access Cycle ..............................................................................................185
CD[31:0] to SD[15:0] and MP[3:0] Valid and Invalid Delay..........................................................185
SD[15:0] to CD[31:0] and MP[3:0] Valid and Invalid Delay..........................................................185
Data Valid and Invalid Delay Between SD[15:8] and SD[7:0] Data Swapping ............................186
NMI Valid Delay Related to IOCHK# ...........................................................................................186
L2 Cache Read Miss - Dirty, Double Bank Cache.......................................................................186
L2 Cache Write 0 Wait State, Not Dirty .......................................................................................187
L2 Cache Write, Dirty ..................................................................................................................187
L2 Cache Burst Read 3-2-2-2 For Double Bank..........................................................................188
L2 Cache Burst Read 3-2-2-2 For Single Bank ...........................................................................189
L2 Cache Burst Read 2-1-1-1 Cycle For Double Bank................................................................190
HITM# Active With L2 Cache Hit, L2 Cache 3-2-2-2 Write Cycle (Cache 0 Wait Write) .............191
HITM# Signal Active, Burst Write Back Cycle, 1 Wait State DRAM Write Setup ........................192
Refresh Cycle ..............................................................................................................................193
DRAM Burst Read 5-4-4-4 (Page Hit) .........................................................................................193
DRAM Burst Read X-2-2-2 (Page Miss) ......................................................................................194
DRAM Burst Read 3-2-2-2 (Page Hit) .........................................................................................194
DRAM Burst Read 4-3-3-3 (Page Hit) .........................................................................................195
DRAM Burst Read X-3-3-3, 1 Wait Page Miss ............................................................................195
DRAM Burst Read X-3-3-3, 0 Wait Page Miss ............................................................................196
DRAM Write Wait State (without L2 Cache Support) ..................................................................196
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List of Figures (cont.)
Figure 6-24
Figure 6-25
Figure 6-26
Single Local Bus Cycle ................................................................................................................197
Reset Timing ...............................................................................................................................197
Low Word ISA Bus Memory Read to High Word Local Bus With SDENL#, SDENH#, and SDIR
Active ...........................................................................................................................................198
Write PPWR[3:0] With '1111' .......................................................................................................198
PIO Timing Example (PIO2) ........................................................................................................199
Suspend Sequence after Writing '1' to SYSCFG 50h[0]..............................................................200
Resume Sequence ......................................................................................................................201
Timer Time-out and SMI Generation Sequence ..........................................................................202
APM Stop Clock Sequence .........................................................................................................203
Doze Sequence ...........................................................................................................................204
FPM DRAM, 3-2-2-2 Page Hit Read ...........................................................................................205
FPM DRAM, 5-2-2-2 Inactive Page Miss Read ...........................................................................206
FPM DRAM, 8-2-2-2 Active Page Miss Read..............................................................................206
FPM DRAM, 4-3-3-3 Page Hit Read ...........................................................................................207
FPM DRAM, 8-3-3-3 Inactive Page Miss Read ...........................................................................207
FPM DRAM, 11-3-3-3 Active Page Miss Read............................................................................208
FPM DRAM, 4-3-3-3 Page Hit Read (0 Wait State Page Miss)...................................................208
FPM DRAM, 6-3-3-3 Inactive Page Miss Read (0 Wait State Page Miss) ..................................209
FPM DRAM, 9-3-3-3 Active Page Miss Read (0 Wait State Page Miss) .....................................209
FPM DRAM, 5-4-4-4 Page Hit Read ...........................................................................................210
FPM DRAM, 8-4-4-4 Inactive Page Miss Read ...........................................................................210
FPM DRAM, 12-4-4-4 Active Page Miss Read............................................................................211
FPM DRAM, 0 Wait State Write ..................................................................................................211
FPM DRAM, 1 Wait State Write ..................................................................................................212
FPM DRAM, 5-2-2-2 Inactive Page Miss with RAS 1/2 CLK Early..............................................212
EDO, 3-1-1-1 Page Hit Read .......................................................................................................213
EDO, 5-1-1-1 Inactive Page Miss with RAS 1/2 CLK Early .........................................................214
EDO, 8-1-1-1 Active Page Miss with RAS 1/2 CLK Early............................................................214
EDO, 10-1-1-1 Active Page Miss with Normal RAS ....................................................................215
EDO, 3-2-2-2 Page Hit Read .......................................................................................................215
EDO, 6-2-2-2 Inactive Page Miss ................................................................................................216
EDO, 10-2-2-2 Active Page Miss Read .......................................................................................216
EDO, 4-2-2-2 Page Hit Read .......................................................................................................217
EDO, 7-2-2-2 Inactive Page Miss ................................................................................................217
EDO, 11-2-2-2 Active Page Miss.................................................................................................218
208-Pin Plastic Quad Flat Pack (QFP) ........................................................................................221
Compact ISA Memory Cycle Operation, Fast CISA Timing* .......................................................227
Compact ISA Memory Cycle Operation, Standard ISA Timing* ..................................................228
Compact ISA I/O Cycle Operation* .............................................................................................229
Compact ISA DACK# Cycle Operation........................................................................................231
Figure 6-27
Figure 6-28
Figure 6-29
Figure 6-30
Figure 6-31
Figure 6-32
Figure 6-33
Figure 6-34
Figure 6-35
Figure 6-36
Figure 6-37
Figure 6-38
Figure 6-39
Figure 6-40
Figure 6-41
Figure 6-42
Figure 6-43
Figure 6-44
Figure 6-45
Figure 6-46
Figure 6-47
Figure 6-48
Figure 6-49
Figure 6-50
Figure 6-51
Figure 6-52
Figure 6-53
Figure 6-54
Figure 6-55
Figure 6-56
Figure 6-57
Figure 6-58
Figure 8-1
Figure B-1
Figure B-2
Figure B-3
Figure B-4
OPTi
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82C465MV/MVA/MVB
List of Figures (cont.)
Figure B-5
Figure B-6
Figure B-7
Figure B-8
Figure C-1
Figure C-1
Figure C-1
Figure C-2
Figure C-3
Figure C-4
Figure C-5
Figure C-6
Figure C-1
Figure C-2
Figure C-1
Figure C-2
Figure C-3
Compact ISA Configuration Cycle Operation ..............................................................................233
Compact ISA Interrupt and DMA Request Drive-Back Cycle ......................................................235
Synchronizing to ATCLK at 1st ALE ............................................................................................236
Shared SPKROUT Signal Management......................................................................................237
RTCVCC Switching Circuit Example ...........................................................................................240
RTC Address Map .......................................................................................................................241
Update-Ended/Periodic Interrupt Relationship ............................................................................244
Quartz Crystal Equivalent Circuit.................................................................................................245
Impedance Graph ........................................................................................................................246
RTC Oscillator Circuit Block Diagram..........................................................................................246
Typical Temperature Characteristics ...........................................................................................247
Frequency Variation Versus Load Capacitance ..........................................................................248
486 NB Mode Pin Diagram (100-Pin PQFP) ...............................................................................251
486 NB Mode Pin Diagram (100-Pin TQFP)................................................................................252
82C602A Internal Circuitry in 486 Notebook Mode .....................................................................257
82C602A 100-Pin Plastic Quad Flat Pack (PQFP)......................................................................258
82C602A 100-Pin Thin Quad Pack (TQFP).................................................................................259
OPTi
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Page xv
82C465MV/MVA/MVB
List of Figures (cont.)
OPTi
®
Page xvi
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Revision: 3.0
82C465MV/MVA/MVB
List of Tables
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Table 3-8
Table 3-9
Table 3-10
Table 3-11
Table 4-1
Table 4-2
Table 4-3
Table 4-4
Table 4-5
Table 4-6
Table 4-7
Table 4-8
Table 4-9
Table 4-10
Table 4-11
Table 4-12
Table 4-13
Table 4-14
Table 4-15
Table 4-16
Table 4-17
Table 4-18
Table 4-19
Table 4-20
Table 4-21
Table 4-22
Table 4-23
Table 4-24
Table 4-25
Table 4-26
Table 4-27
Table 4-28
Table 4-29
Signal Definitions Legend ................................................................................................................ 5
Strap Option Summary .................................................................................................................... 6
Strap Settings for Interface Voltages ............................................................................................... 7
1X/2X Strapping Readback Register Bit.......................................................................................... 7
Program-Selected DACKMUX Interface Recovery.......................................................................... 9
DACKMUX Interface Option Enabling ............................................................................................. 9
PMIMUX Multiplex Option .............................................................................................................10
EPMMUX Multiplex Option ............................................................................................................10
EPMMUX Option Enabling ............................................................................................................10
Strap-Selected Reduced Memory Interface Option .......................................................................12
82C465MV Pin Characteristics......................................................................................................16
Product Indicator Register Bit ........................................................................................................33
ADS# Sampling Control.................................................................................................................34
LDEV# Control...............................................................................................................................34
RDY# Synchronization ..................................................................................................................35
Bus Master Enabling .....................................................................................................................36
Special CPU Feature Programming Bits .......................................................................................37
Burst Mode Setting ........................................................................................................................38
Resume Reset Control ..................................................................................................................39
System Control Port A (PS/2 Compatibility Port)...........................................................................41
Controlling Fast Reset ...................................................................................................................41
Inhibition of SRESET in SMM........................................................................................................41
ATCLKIN Enabling and SQWIN frequency Bits.............................................................................42
ATCLK Rate Selection...................................................................................................................43
Recommended Divisor Settings for Various Input Clock Frequencies ..........................................44
AT Bus Clock Stretch Controls ......................................................................................................44
System Control Port A (PS/2 Compatibility Port)...........................................................................45
Fast Signal Generation Control Bits ..............................................................................................46
A20M# Read-Only Bit ....................................................................................................................47
A20M# Setting within SMM ...........................................................................................................47
Symmetrical DRAM Address Decoding .........................................................................................48
Asymmetrical DRAM Decoding, Asymmetry SYSCFG D3h[4:0] = 0 .............................................49
Asymmetrical DRAM Decoding, Asymmetry SYSCFG D3h[4:0] = 1 .............................................49
Heavy-duty Memory Bus Drive Capability Feature........................................................................50
DRAM Setup Registers .................................................................................................................50
DRAM Early RAS# Control ............................................................................................................52
EDO DRAM Selection ...................................................................................................................53
Suggested EDO DRAM Cycle Speed Settings..............................................................................53
ROM Select Registers ...................................................................................................................54
Write Destination Registers ...........................................................................................................54
OPTi
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Revision: 3.0
Page xvii
82C465MV/MVA/MVB
List of Tables (cont.)
Table 4-30
Table 4-31
Table 4-32
Table 4-33
Table 4-34
Table 4-35
Table 4-36
Table 4-37
Table 4-38
Table 4-39
Table 4-40
Table 4-41
Table 4-42
Table 4-43
Table 4-44
Table 4-45
Table 4-46
Table 4-47
Table 4-48
Table 4-49
Table 4-50
Table 4-51
Table 4-52
Table 4-53
Table 4-54
Table 4-55
Table 4-56
Table 4-57
Table 4-58
Table 4-59
Table 4-60
Table 4-61
Table 4-62
Table 4-63
Table 4-64
Table 4-65
Table 4-66
Table 4-67
Table 4-68
Table 4-69
Table 4-70
Access Control Bit Meanings for SYSCFG 38h[4:1], 37h[7:4], 31h[3:0]........................................55
Shadow RAM Control Bits .............................................................................................................55
Write Protect Registers..................................................................................................................56
Global Cache Control Enable ........................................................................................................57
Size and Valid Start Address Bits of Non-Cacheable Memory Blocks ..........................................57
Non-Cacheable Block Registers....................................................................................................57
C000, E000, F000h Block Cache Enable ......................................................................................58
Write-Protected DRAM Cache Control ..........................................................................................61
Pin Options ....................................................................................................................................62
L1 Writeback Programming Bits ....................................................................................................63
Burst Write Control ........................................................................................................................63
L2 Cache Support Signal Correspondence ...................................................................................65
Correspondence Between Tag Bits and CPU Address Lines .......................................................66
Maximum Cacheable System DRAM for Each Cache Configuration ............................................66
SRAM Speed Requirements .........................................................................................................67
L2 Cache Arrangement Selection Bit ............................................................................................67
L2 Cache Support Option (strap-selected) ....................................................................................68
L2 Cache Registers .......................................................................................................................69
Cache Timing Control....................................................................................................................70
Pin 186 Function Select.................................................................................................................72
Cycle Enable Bits ..........................................................................................................................72
ISA Bus Refresh Control ...............................................................................................................73
ATCLKIN Programming Register Bits ...........................................................................................73
Peripheral Device Programming Register Bits ..............................................................................74
PIO2 and SABUFEN# Program Bits..............................................................................................75
Programmed Hardware Reset Bit..................................................................................................77
IPC Configuration Bits ...................................................................................................................78
INTC1 Initialization Command Words ...........................................................................................78
INTC2 Initialization Command Words ...........................................................................................78
INTC1 and INTC2 Operational Command Words .........................................................................80
Interrupt Controller Shadow Register Index Values ......................................................................81
DMA Address and Count Registers...............................................................................................81
DMA Control and Status Register .................................................................................................81
DMAC1 Control and Status Bits ....................................................................................................82
DMAC2 Control and Status Bits ....................................................................................................83
DMA Commands ...........................................................................................................................83
DMA Progress Bits ........................................................................................................................84
LDEV# Sampling for DMA to Local Bus ........................................................................................86
Type F DMA Control......................................................................................................................86
Timer Control and Status Registers ..............................................................................................87
Timer Control Bits ..........................................................................................................................87
OPTi
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82C465MV/MVA/MVB
List of Tables (cont.)
Table 4-71
Table 4-72
Table 4-73
Table 4-74
Table 4-75
Table 4-76
Table 4-77
Table 4-78
Table 4-79
Table 4-80
Table 4-81
Table 4-82
Table 4-83
Table 4-84
Table 4-85
Table 4-86
Table 4-87
Table 4-88
Table 4-89
Table 4-90
Table 4-91
Table 4-92
Table 4-93
Table 4-94
Table 4-95
Table 4-96
Table 4-97
Table 4-98
Table 4-99
Table 4-100
Table 4-101
Table 4-102
Table 4-103
Table 4-104
Table 4-105
Table 4-106
Table 4-107
Table 4-108
Table 4-109
Table 4-110
Table 4-111
Timer Shadow Registers ...............................................................................................................88
RTC Index Register - I/O Port 070h ..............................................................................................88
RTC Index Shadow Register .........................................................................................................88
Floppy Shadow and Control Registers ..........................................................................................89
PMU Control Register - SYSCFG 50h...........................................................................................89
IDE Controller Configuration..........................................................................................................91
Automatic Cycle Settings Available Through SYSCFG ACh[7:4] ..................................................92
82C465MVA Operation with Primary I/O Range Selected ............................................................93
82C465MVA Operation with Secondary I/O Range Selected........................................................93
“611” Register Set .........................................................................................................................94
82C465MVA Operation with Primary I/O Range Selected ............................................................96
82C465MVA Operation with Secondary I/O Range Selected........................................................96
82C465MVB Operation with Four Drive Support Selected............................................................96
Four Drive IDE Control ..................................................................................................................97
Compact ISA Control Registers.....................................................................................................98
CISA Cycle Generation Registers ...............................................................................................100
Timer Control Bits and Clock Source Selection Registers...........................................................103
Time Interval Choices Applicable to _TIMER Settings ................................................................103
Timer Source Registers ...............................................................................................................104
ACCESS Events and Their Enabling Bit Locations .....................................................................105
Floppy and Hard Drive DSK_ACCESS Control ...........................................................................106
IDE Port Address Select Bit.........................................................................................................107
LCD Controller Access Control....................................................................................................107
CSG Access Control Bits.............................................................................................................108
General Purpose Access 1 Registers..........................................................................................109
General Purpose Access 2 Registers..........................................................................................109
Memory Watchdog Feature Extension Registers ........................................................................110
Memory Decoding Control Bits ....................................................................................................111
Activity Tracking Registers ..........................................................................................................111
Idle Reload Source Registers ......................................................................................................112
External PMI Source Summary ...................................................................................................112
EPMI Programming Registers .....................................................................................................114
Power Management Event Status ...............................................................................................115
IRQ and EPMI SMI Sources ........................................................................................................116
Time-out Event SMI Sources.......................................................................................................117
Access Event SMI Sources .........................................................................................................117
SMI Initialization Registers ..........................................................................................................118
BIOS Code Jump Bit ...................................................................................................................120
Dynamic SMI Relocation Bit ........................................................................................................120
Software SMI Enable Registers...................................................................................................121
SMBASE Register .......................................................................................................................121
OPTi
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Page xix
82C465MV/MVA/MVB
List of Tables (cont.)
Table 4-112
Table 4-113
Table 4-114
Table 4-115
Table 4-116
Table 4-117
Table 4-118
Table 4-119
Table 4-120
Table 4-121
Table 4-122
Table 4-123
Table 4-124
Table 4-125
Table 4-126
Table 4-127
Table 4-128
Table 4-129
Table 4-130
Table 4-131
Table 4-132
Table 4-133
Table 4-134
Table 4-135
Table 4-136
Table 4-137
Table 4-138
Table 4-139
Table 4-140
Table 4-141
Table 4-142
Table 4-143
Table 4-144
Table 4-145
Table 4-146
Table 5-1
Table B-1
Table B-2
Table B-3
Table B-4
Table B-5
SMI Address Relocation Associated Register Bits ......................................................................122
Current and Next Access Registers ............................................................................................123
SMM Flush Control Bits ...............................................................................................................124
INTRGRP IRQ Select Registers ..................................................................................................125
SMI Event Enable Registers........................................................................................................125
DMA Trap Related Bits ................................................................................................................126
SMI Service Registers .................................................................................................................127
I/O Access Trap Registers...........................................................................................................128
Utility Registers............................................................................................................................128
Register Bits Associated with STPCLK# Feature ........................................................................130
Doze Time-out Control Registers ................................................................................................132
Register Bits that Select Doze Mode Reset Events ....................................................................133
Local Bus Doze Reset Registers .................................................................................................134
Doze Reset Bits Inside and Outside of SMM ..............................................................................134
Hardware Doze Mode Registers .................................................................................................135
Software Doze Mode Registers ...................................................................................................136
DOZE_TIMER SMI Generation Bits ............................................................................................137
Power Levels Assigned to Each Operating Mode .......................................................................138
Thermal Management Registers .................................................................................................140
Suspend Control Register Bits ....................................................................................................142
Suspend Mode Power Saving Feature Bits.................................................................................143
Suspend Refresh Pulse Width Control ........................................................................................144
Resume Event Registers .............................................................................................................145
Resume Sources (Read-Only) ....................................................................................................146
Resistor Control Registers...........................................................................................................147
Zero-Volt CPU Suspend Register Bits.........................................................................................148
Clock Stretch Register .................................................................................................................149
PMU Control Register - SYSCFG 50h.........................................................................................149
KBCLK/KBCLK2 Stop Control .....................................................................................................149
PPWRL Programming Registers .................................................................................................151
PIO Pin Registers ........................................................................................................................152
Programmable Chip Select 0 Registers ......................................................................................153
Programmable Chip Select 1 Registers ......................................................................................154
Programmable Chip Select 2 Registers ......................................................................................154
Programmable Chip Select 3 Registers ......................................................................................155
SYSCFG Register Space ............................................................................................................157
Compact ISA (CISA) Interface Signals ........................................................................................225
Common MAD Bit Usage ............................................................................................................226
MAD Bits During Memory Cycles ................................................................................................226
MAD Bits During I/O Cycles ........................................................................................................229
MAD Bits During DMA Acknowledge Cycles ...............................................................................230
OPTi
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82C465MV/MVA/MVB
List of Tables (cont.)
Table B-6
Table B-7
Table B-8
Table C-1
Table C-2
Table C-3
Table C-4
Table C-5
Table C-6
Table C-7
Table C-8
Table C-9
MAD Bits During Stop Clock Configuration Cycles......................................................................232
IRQ/DRQ Drive Back Cycle .........................................................................................................234
SPKR Sharing During Active Mode .............................................................................................237
Mode Strapping Options ..............................................................................................................239
Typical Current Consumption Figures for RTC Power ................................................................240
Typical Current Consumption Figures for Digital Power..............................................................240
Time, Alarm, and Calendar Formats............................................................................................242
Square-Wave Frequency/Periodic Interrupt Rate........................................................................243
Crystal Parameters ......................................................................................................................245
Control/Status Registers Summary .............................................................................................249
Registers A through D Bit Formats ..............................................................................................249
486 NB Mode - Numerical Pin Cross-Reference List ..................................................................253
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Page xxi
82C465MV/MVA/MVB
List of Tables (cont.)
OPTi
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Page xxii
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Revision: 3.0
OPTi
82C465MV/MVA/MVB
®
Single-Chip Mixed Voltage Notebook Solution
1.0
Features
CPU and VL-Bus Features
• Fully supports local bus implementations, including VL-bus
masters.
The 82C465MV offers the following CPU interface features.
• Supports AMD®, Cyrix®, Intel®, and IBM® 486-type 32-bit
CPUs, in 3.3V or 5.0V, including clock-tripled technology.
• Provides a fail-safe thermal management scheme that predicts when CPU temperature is rising to unsafe levels and
forces the system into a slower operating mode (cooldown clocking).
• Provides fast emulation of keyboard controller CPU reset
and gate A20 control; supports Port 092h as well.
Figure 1-1
• Offers complete Microsoft® APM (Advance Power Management) operability, with CPU stop clock support available.
• Supports next generation processor stop clock protocol, to
take advantage of the performance improvement possible
when PLL start-up delay is reduced from milliseconds to
nanoseconds.
• Engages automatic internal resistors to eliminate the need
for external pull-up / pull-down resistors on CPU address,
data, and control lines.
System Block Diagram
ISA Control
D[31:0]
SD[15:0]
Address
Bus
SA[1:0]
OPTi
82C465MV
MA[11:0]
D[31:0]
VESA
Local
Bus
SA[19:0]
DMA, IRQ
208 PIN PFP
Address Bus
OPTi
8 Power Management Input Pins
Control Bus
D[31:0]
82C602A
3X
Address Bus
A[23:2]
Control Bus
Buffer
(optional)
IDE
92C178
LCD
SVGA
ISA BUS
486 CPU
Control
Bus
SA[19:0]
XD[7:0]
MA[11:0]
2X
1-64MB
DRAM
912-3000-016
Revision: 3.0
Latch
PPWR0
PPWR11
Power Control Pins
Keyboard
Controller
BIOS ROM
Page 1
82C465MV/MVA/MVB
• Provides SMBASE relocation to match the feature found in
some CPUs that allows the SMBASE to be reprogrammed; each 64KB segment can be remapped to any
64KB-boundary segment in the first 640KB of address
space.
• Offers PCI compatibility in that the 82C465MV is fully compatible with the OPTi 82C832 PCI peripheral bridge, providing bus master support as well.
• With the core operating at 5.0V, runs as fast as 50MHz
with:
- CPU and ISA bus I/O at 5.0V
- CPU at 3.3V and ISA bus I/O at 5.0V
• With the core operating at 3.3V, runs as fast as 40MHz
with:
- CPU and ISA bus I/O at 3.3V
DRAM/Cache Controller Features
The DRAM controller of the 82C465MV Single-Chip Notebook chipset runs from a 1X clock. It provides all of the performance features popular on powerful desktop systems and
integrates power control for efficient operation.
• Provides L1 cache support for an on-CPU writeback cache
such as that found on the Cyrix Cx486DX/DX2 processor
and L1 writeback CPUs from Intel and AMD.
• Provides power-managed L2 cache support with a highperformance, writeback external cache using the proven
OPTi desktop 32-bit cache controller. Integral power control turns on the chip select lines only to cache chips actually being accessed, resulting in extremely low activemode power consumption. Moreover, the cache can be
flushed and completely turned off during low-power Suspend mode.
• Operates up to five banks of DRAM, supporting any memory type in any bank, along with bank skipping (of intermediate banks) for automatic BIOS-based disabling of
defective DRAM.
• Uses simplified memory programming scheme that supports up to 12x12 symmetrical along with asymmetrical
DRAM such as 11x9 and 12x8 configurations. Symmetrical and asymmetrical types can be mixed.
• Allows any bank to use 256Kb, 512Kb, 1Mb, 2Mb, 4Mb,
8Mb, or 16Mb DRAM devices.
• Page mode DRAM controller supports 3-2-2-2, 4-3-3-3,
and 5-4-4-4 burst read memory cycles, zero or one wait
state DRAM write cycles.
• Supports two programmable non-cacheable regions
• Offers fully programmable shadowing of ROM using
DRAM in the C0000-FFFFFh region.
• Allows write-protected shadowing and caching of system
and video BIOS.
• Allows normal or slow refresh, CAS-before-RAS refresh,
and self-refresh DRAM support; minimum-pulse refresh
cycles save power during Suspend mode.
ISA Bus Features
The ISA bus interface of the 82C465MV chip offers many
improvements over previous generation OPTi notebook
chipsets and competitive notebook chipsets.
• The internal 82C206 IPC offers a true single-chip notebook implementation and is based on the proven
82C463MV core.
• The 82C465MV implements a complete ISA-compatible
system with only one extra device, the OPTi 82C602 Notebook Companion chip, which contains a Real Time Clock
(RTC) with 256 bytes of non-volatile (backed up by battery) RAM and the equivalent of seven discrete TTL
devices.
• The logic integrates an enhanced IDE interface running at
local-bus speeds (100% speed increase typical) based on
the proven OPTi 82C611 core.
• Integral IDE support uses one external 74244 TTL device
to control the IDE, with a second 7416245 device optional
for complete power-down isolation of the IDE drive while
the system is active. Dual drive support is also available.
• The IDE command scheme shares no ISA bus command
lines, to prevent incompatibility with other ISA bus devices
due to illegal “short pulse” cycles on ISA bus.
• 8.00MHz ISA bus operation is available for implementations requiring exact adherence to the original ISA standard.
• 16-bit decoding for internal I/O prevents conflicts for I/O
peripherals addressed above 100h.
• Four programmable chip selects each decode ten address
lines, A[9:0] for I/O addressing or A[23:14] for memory
addressing. Memory address decoding allows simplified
ROM chip select generation for applications such as Windows CE.
OPTi
®
Page 2
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82C465MV/MVA/MVB
Power Management Features
The synergistic incorporation of power management and system control features with the standard ISA subsystem controller of the 82C465MV chipset results in a compact design
that handles multiple tasks with a simple, common interface.
The power management interrupt (PMI) scheme provides
system management code with a quick means of identifying
and handling events that affect power control and consumption.
• Recognizes 28 separate PMI events. Within these events,
many sub-events are also identifiable for a high degree of
power management monitoring flexibility.
• Eleven of the PMI events have individual timers to indicate
inactivity time-out situations.
• Eight external inputs are available for monitoring asynchronous system events. These are in addition to the ISAcompatible IRQ lines that can also be monitored as power
management events.
• PMI generation on access allows SMI code to intercept
status queries to powered-down devices that do not actually need to be restarted simply to return an “Idle” status.
• Activity tracking register of eight events allows SMI or nonSMI applications a means of determining whether activity
has occurred since the last time the register was checked.
Polling for I/O activity can then be used instead of multiple
SMIs for less significant events.
• Memory watchdog monitoring allows accesses to memory
ranges (specified as programmed) to cause an SMI. ISA
bus memory devices that are not being accessed can be
programmed to cause a time-out SMI so that unused
peripherals can be powered down.
• Supports system-level low-power Suspend, low-power
Suspend with zero-volt CPU Suspend, or total system
zero-volt Suspend
• Twelve peripheral power control pins plus four user-definable I/O pins provides exceptional flexibility in peripheral
device control.
• RTC alarm or modem ring can wake up the system from
low-power Suspend mode.
• Suspend current leakage control ensures that negligible
power will be consumed in Suspend mode without additional external buffering.
Backward Compatibility Features
The 82C465MV is application-compatible
82C463MV for the vast majority of applications.
with
the
• The register set and logic are derived from and are a
superset of the popular OPTi 82C463MV notebook
chipset.
• When used as a drop-in replacement for the 82C463MV,
the 82C465MV allows continued operation with no
required changes to the original 82C463MV BIOS.
Optional programming needed to take advantage of performance improvements of 82C465MV logic can be run
from an executable file.
• Many of the new 82C465MV features can be utilized with
only minor changes to the 82C463MV BIOS; more extensive use of the new feature set requires some changes to
hardware design as well.
• BIOS code need only check a single register to learn
whether it is running on the 82C465MV or on an 82C463/
463MV chipset.
Note:
The Sequencer of the 82C463MV has not been
implemented in the 82C465MV. Contact OPTi for
information regarding the conversion of Sequencer
routines to SMI routines.
OPTi
®
912-3000-016
Revision: 3.0
Page 3
82C465MV/MVA/MVB
2.0
Overview
The OPTi 82C465MV chipset is a highly integrated ASIC that
implements 32-bit ISA-compatible core logic, along with
power management and CPU thermal management hardware, in a single device. Its feature set provides an array of
control and status monitoring options, all accessed through a
simple and straightforward interface. All major BIOS vendors
provide power management modules that are optimized for
the OPTi power management unit and provide extensive software “hooks” that allow system designers to integrate their
own special features with minimal effort.
The 82C465MV requires very little board space, implemented
as a single 208-pin PQFP package in 0.6 micron (465MVB)
CMOS technology. It can be used in conjunction with a 100pin buffer chip to completely implement all the functions available on a typical desktop system.
2.1
Upgrade Comparison
The 82C465MV chipset has been replaced by the
82C465MVA and 82C465MVB derivatives. The following lists
show the improvements made in each chip.
Note:
This document covers the 82C465MV, 82C465MVA,
and 82C465MVB. Features that apply only to the
82C465MVB are marked MVB, while features that
apply to both the 82C465MVA and the 82C465MVB
are marked MVA. Unmarked features apply to all
three.
MVA
•
•
•
•
•
•
•
•
•
•
•
•
•
•
No FLUSH required on entry into SMM
Dual doze timers
Local bus device can reset Doze mode
DMA state can be fully saved and restored when Suspending
DMA can trigger SMI
HITM# and BOFF# can be connected directly (no external
TTL)
Fast RESET and A20M# generation can be disabled
I/O trap address is saved
Memory watchdog has additional control
Floppy ports are shadowed
ISA bus address buffer can be disabled to save power
The ATHOLD function is supported for docking station
Software can generate hard reset
High DRAM can be mode non-cacheable in L2 when using
small tag RAM
MVB
• EDO DRAM is supported with no pin changes
• Includes Compact ISA support for the 82C852 PCMCIA
controller
• ISA bus refresh can be disabled to improve performance
• Four IDE drives are supported
• Cyrix and AMD 5x86 CPUs are supported
• Type F DMA is supported
• Faster memory cycles are supported
• A20M# setting can be restored inside SMM
• Suspend refresh can be a narrower pulse
• Shadow RAM is now cacheable in L1
OPTi
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Page 4
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Revision: 3.0
82C465MV/MVA/MVB
3.0
Signal Definitions
3.1
Terminology/Nomenclature
Conventions
The “#” symbol at the end of a signal name indicates that the
active, or asserted state occurs when the signal is at a low
voltage level. When “#” is not present after the signal name,
the signal is asserted when at the high voltage level.
The terms “assertion” and “negation” are used extensively.
This is done to avoid confusion when working with a mixture
of “active low” and “active high” signals. The term “assert”, or
“assertion” indicates that a signal is active, independent of
whether that level is represented by a high or low voltage.
The term “negate”, or “negation” indicates that a signal is
inactive.
Some pins have more than one function. These pins can be
time-multiplexed, have strap options, or can be selected via
register programming. Included in the signal descriptions is a
column titled “Selected By” which explains how to implement/invoke the various functions that a pin may have.
The tables in this section use several common abbreviations.
Table 3-1 lists the mnemonics and their meanings. Note that
TTL/CMOS/Schmitt-trigger levels pertain to inputs only. Outputs are driven at CMOS levels.
Table 3-1
Signal Definitions Legend
Mnemonic
Description
CMOS
CMOS-level compatible
Dcdr
Decoder
Ext
External
G
Ground
I
Input
Int
Internal
I/O
Input/Output
Mux
Multiplexer
O
Output
OD
Open drain
P
Power
PD
Pull-down resistor
PU
Pull-up resistor
S
Schmitt-trigger
S/T/S
Sustain Tristate
TTL
TTL-level compatible
3.2
Pinout Options
The OPTi 82C465MV can alter its character significantly by
simple strap options that are detected at hardware reset time.
Figure 3-4, Figure 3-5, Figure 3-6 and Figure 3-7, shown later
in this section, illustrate the pinouts of the 82C465MV in the
following modes:
• 82C465MV standard configuration without L2 cache
interface
• 82C463MV-compatible configuration
• 82C465MV enhanced configuration with L2 cache
interface
• 386 interface configuration (Blue Lightning-compatible).
These modes are strap-selected interface options and are
described below.
3.3
Strap-Selected Interface Options
The flexibility of the 82C465MV across a wide variety of applications is due in large part to its many interface strap options.
The options listed in Table 3-2 are strap-selected at reset
time as indicated. Normally, these pins are simply pulled up
or down with a resistor to enable the desired function. The
chip contains internal resistors that are enabled only at reset
time to preset a default function, so that an external pullup/pull-down may not be needed and can sometimes be
avoided to save power. In most cases where an external
resistor is required, the direction (pull-up or pull-down) coincides with the inactive state of the signal and therefore consumes negligible power. The internal resistors have a value
of approximately 50Kohm.
Optionally, the system designer can strap these pins with
tristate drivers that enable their outputs only when the RST4#
signal is active. The chip samples the lines on the rising edge
of the RST1# input, at which time RST4# is still active.
Each strap option is described in detail in the section of this
document that describes the affected subsystem.
OPTi
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Page 5
82C465MV/MVA/MVB
Table 3-2
Strap Option Summary
Internal
Up/Down
at Reset
Strap Option
Signal
Pin
No.
L2 Cache Support
SA0
146
Strap SA0 low w/ 4.7K to enable L2
cache interface
Up
No cache
Local-Bus IDE
DBE Polarity
TRIS#
176
Strap DBE (TRIS) high for active
low, low for active high
Up
TRIS# active low (for
82C463MV compatibility)
Input Clock 1X/2X
Selection
ATCYC#
160
Strap ATCYC# high for 1X w/10K
Down
2X clock OSCCLK (for
82C463MV compatibility)
FBCLKOUT Delay
MA11+
DACKMUX2
77
Strap pin 77 high for delay w/10K
Down
No delay
CPUCLK Delay
RAS4#+
DACKMUX1
78
Strap pin 78 low for delay w/10K
Up
No delay
New Memory
Control Interface
MDIR+
DACKMUX0
79
Strap pin 79 high for old 82C463MVcompatible scheme w/10K
Down
New interface
SL-Enhanced
Enable
CCS1:0#
13,
23
Strap CCS0# and CCS1# high for
STPCLK# operation w/10K
Down
No STPCLK# feature
CPU Clock 1X/2X
Selection *
CCS2#
3
Strap CCS2# high for 2X clock
w/10K
Down
1X CPU clock
CPU Type
386/486 Selection
CCS3#
198
Strap CCS3# high for 486 interface
w/10K
Down
386-type interface
Resume Reset
Selection *
SA1
148
Strap SA1 high for RSMRST# on
EPMI2 w/10K, otherwise defaults to
normal RST4# reset
Down
No RSMRST# on
EPMI2**
CA25/RDYI#
Selection
SBHE#
161
Strap SBHE# high for pin 139 =
CA25, otherwise pin 89 defaults to
RDYI#
Down
Pin 139 is RDYI# **
CPU Interface
Level *
NMI
120
Strap NMI low w/10K for 5.0V CPU;
otherwise, 3.3V CPU assumed
Up
3.3V CPU interface
ISA Bus Interface
Level *
INTR
121
Strap INTR low w/10K for 3.3V ISA
bus; otherwise, 5.0V ISA bus
assumed
Up
5.0V ISA bus interface
Control Provided
Default with No Strap
* Indicates that additional information is available on the following pages.
** Indicates that heavy ISA bus loading might require use of external 4.7K pull-down resistors. The internal pull-down
resistor may not be sufficient to oppose external conductance to VCC through devices on the ISA bus that have this
line pulled up.
OPTi
®
Page 6
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Revision: 3.0
82C465MV/MVA/MVB
3.3.1
Mixed Voltage Interface Options
Pins 120 and 121 provide strap options to select internal level
translation of interface signals before the core logic interface.
Pin 120 selects the CPU interface level, and pin 121 selects
the ISA bus interface level. With no straps, the option defaults
to a 3.3V CPU and a 5.0V ISA bus. The proper selections
depend on the voltage applied to each power plane; the VCC
pins for each power plane are listed in the Power and Ground
Pins table of the Pin Descriptions section that follows.
Table 3-3 shows the proper strap settings for each voltage
mix.
Using 5V Tolerant CPUs
It is highly recommended that the 5V-tolerant feature of
CPUs not be used with the OPTi 82C465 series chip. The
82C465 core should instead be powered at the 3.3V applied
to the CPU interface.
Table 3-3
The reason for this recommendation it that the DMA timing on
the 82C465 series is not met by 5V-tolerant CPUs. When the
82C465 chip CPU interface is running at 5V, the translator
from CPU 5V to 82C465 core 3.3V induces a dealy that may
negatively impact DMA timing requirements.
3.3.2
Resume Reset (RSMRST#) Function
Pin 148 strapping works in conjunction with SYSCFG 40h[0]
to determine whether pin 185 acts as a reset line that toggles
upon resuming from Suspend mode. Refer to Section 4.3.1.4,
"Resume Reset (RSMRST#) Function" on page 39 for complete information on this option.
3.3.3
Reading the 1X/2X Strap Setting
The state of the 1X/2X CPU strapping selection can be read
back through SYSCFG 35h[3], as shown in Table 3-4.
Strap Settings for Interface Voltages
CPU Interface
Voltage
ISA Bus Interface
Voltage
Core Operating
Voltage
Pin 120 (NMI)
Pin 121 (INTR)
3.3V
3.3V
3.3V
No strap
Strap
3.3V
5.0V
3.3V
No strap
No strap
5.0V
5.0V
5.0V
Strap
No Strap
Notes: 1) Pins 120 and 121 are never both strapped at the same time.
2) The combination of CPU interface at 5.0V and ISA bus interface at 3.3V is not allowed, regardless of core voltage.
3) If the core is operating at 3.3V, both the CPU and ISA bus interfaces must be at 3.3V as well.
Table 3-4
7
SYSCFG 35h
1X/2X Strapping Readback Register Bit
6
5
4
3
DRAM Control Register 2
2
1
0
Default = FFh
CCS2# (pin 3)
strapping (RO):
0 = 2X CPU
1 = 1X CPU
OPTi
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Revision: 3.0
Page 7
82C465MV/MVA/MVB
3.3.4
Using Strap Options with TTL Logic
ever, the 82C465MV series can also be used in applications
in which TTL logic is preferred. This situation creates a problem for the strap option selections, because the internal resistors are no longer sufficient to bring the inputs to 0V or to
VCC because of the current draw of TTL parts. Even strong
external resistors may not be sufficient if multiple TTL devices
are connected to the same pin.
As previously stated, the 82C465MV series chips incorporate
strap option sensing mechanisms that operate only at hardware reset time. This feature depends on chip signal pins that
are normally outputs: At reset time, the pins temporarily
become inputs so that the chip can sense whether the pins
are being pulled high or low by the strap resistors. Each of
these strap option pins has a weak internal resistor so that no
external resistor is needed for the most common selection
options.
Therefore, when using TTL parts it is recommended that all
strap pins connected to TTL be driven to their correct level at
reset time. A 74244-type buffer can be used. Connect the
"enable" pin of the buffer to RST4# of the chip.
This scheme was developed for use with CMOS logic
devices, which draw negligible current at their inputs. How-
Figure 3-1
RST4# and Buffer Connection
VCC
DI0
DI1
DI2
DO0
1/2 of
’244
DI3
DO1
DO2
DO3
Pull-up type strap option
Pull-up type strap option
Pull-up type strap option
Pull-up type strap option
EN
RST4#
OPTi
®
Page 8
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Revision: 3.0
82C465MV/MVA/MVB
3.4
Program Selected Interface Options
Several interface options that are not critical to system startup are selectable through configuration register bits. Some of
these options can even be switched dynamically, if external
logic is in place to support such an arrangement.
3.4.1
DACKMUX Decoder Lines Source
The system designer must determine whether there is a need
for the DACKMUX interface, the interface that generates the
DACK#0-7 signals through an external decoder. Many portable systems use only DMA channel 2, which is available
through dedicated DRQ2/DACK2# pins on the 82C465MV.
However, if other DMA channels must be provided, the
DACKMUX signal interface must be recovered by one of two
means:
Table 3-5
• Deleting the MA11, MDIR, and RAS4# signals of the memory interface. This option is described in the “Reduced
Memory Configuration Signal Group” section.
• Relocating the EPMI1, EPMI2, LOWBAT, and LLOWBAT
pins by programming SYSCFG A0h[3] = 1. Table 3-5 indicates the reassignment that takes place.
The hardware initialization BIOS code must select the DACKMUX replacement interface programmatically after reset by
setting SYSCFG A0h[3] = 1. Figure 3-2 illustrates the typical
connection.
The optional 82C602A chip incorporates this decoder.
Program-Selected DACKMUX Interface Recovery
Pin
Normal Signal
(SYSCFG A0h[3] = 0)
Optional DACKMUX Replacement
(SYSCFG A0h[3] = 1)
184
EPMI1
DACKMUX2
185
EPMI2
DACKMUX1
163
LOWBAT
DACKMUX0
182
LLOWBAT
PMIMUX
Table 3-6
7
DACKMUX Interface Option Enabling
6
5
4
SYSCFG A0h
3
2
Feature Control Register 1
1
0
Default = 00h
Enable alternative DACKMUX
Interface:
0 = Disable
1 = Enable
See Table 3-5
Figure 3-2
Standard DACKMUX0-2 Connection (SYSCFG A0h[3] = 1)
74138
82C465MV
DACK0#
DACK1#
163 DACKMUX0
A
DACK2#
185 DACKMUX1
B
DACK3#
n/c
184 DACKMUX2
C
DACK5#
DACK6#
DACK7#
OPTi
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Page 9
82C465MV/MVA/MVB
3.4.2
EPMI Signal Source
If the DACKMUX pin functions have been moved to pins 184,
185, and 163 by setting SYSCFG A0h[3] = 1, then the displaced signal set LOWBAT, LLOWBAT, EPMI1, and EPMI2
can be recovered through an external multiplexer. This multiplexer will scan each input for status changes at the rate of
once every 280ns. The signals are sampled through the multiplexer as shown in Table 3-7. One-half of an external
74153-type multiplexer is required to return the selected sample through pin 182 (PMIMUX) of the 82C465MV interface.
See Figure 3-3 for a typical connection example.
Note that if just one of these power management input signals will be needed, it is easiest to eliminate the multiplexer
and connect the required signal directly to the PMIMUX input
of the 82C465MV. The unneeded EPMI inputs can simply be
programmed to be ignored.
Table 3-7
PMIMUX Multiplex Option
74153 Mux Pin
Signal
A (input)
KBCLK
B (input)
KBCLK2
C0 (input)
LOWBAT
C1 (input)
LLOWBAT
C2 (input)
EPMI1
C3 (input)
EPMI2
Y (output)
PMIMUX
(the output of the multiplexer). On the multiplexer itself, pins
are defined as shown in Table 3-2.
Figure 3-3 illustrates how all EPMI pins can be multiplexed in
using a single device when DACKMUX interface has displaced the EPMI-2, LOWBAT, and LLOWBAT signals.
Table 3-8
74153
Mux Pin
Signal
A (input)
KBCLK
B (input)
KBCLK2
C0 (input)
DRQ2
C1 (input)
ATHOLD
(MVA)
C2 (input)
EPMI3
RI# when SYSCFG
FAh[5] = 1 (MVB)
C3 (input)
EPMI4
CHCK# when SYSCFG
FAh[4] = 1 (MVB)
Y (output)
EPMMUX
Figure 3-3
3.4.2.1
Additional EPMI Sources
The 82C465MV can use one-half of a 74153 multiplexer to
provide two new signals, EPMI3 and EPMI4. This feature is
convenient if one-half of the 74153 multiplexer is already
being used to bring in LOWBAT, LLOWBAT, EPMI1, and
EPMI2 as described above.
Optional Signal
Multiplexed EPMI Input Connections
PMIMUX
182
7
EPMMUX
88
9
82C465MV
When this feature is enabled by setting SYSCFG A1h[5] = 1,
pin 88 changes from the DRQ2 input to the EPMMUX input
Table 3-9
EPMMUX Multiplex Option
KBCLK2
KBCLK
167
1Y
2Y
1C0
1C1
1C2
1C3
6
5
4
3
LOWBAT
LLOWBAT
EPMI1
EPMI2
2C0
2C1
2C2
2C3
10
11
12
13
DRQ2
ATHOLD
EPMI3/RI#
EPMI4/CHCK#
A
B
1G
2G
14
2
1
15
74153
158
EPMMUX Option Enabling
7
6
5
SYSCFG A1h
4
3
Feature Control Register 2
2
1
0
Default = 00h
Pin 88 - for
EPMI3-4:
0 = DRQ2
1 = EPMMUX
OPTi
®
Page 10
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Revision: 3.0
82C465MV/MVA/MVB
3.5
Standard Mode 82C465MV Interface
In its standard mode, the full complement of memory control
options are available on the 82C465MV chip. Figure 3-4 illustrates the chip pinout in its standard mode, which requires
Pin Diagram - Standard Mode
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
ATCLK
MRD#
MWR#
IORD#
IOWR#
CHRDY#
XDIR
SA1
VCC5
SA0
RFSH#
FBCLKIN
FBCLKOUT
VSS
CPUCLK
LDEV#
CA25/RDYI#
IGNNE#
SMI#
SMIACT#
FLUSH#
EADS#
M/IO#
W/R#
D/C#
A20M#
FERR#
HOLDA
BE3#
BE2#
BE1#
BE0#
AHOLD
SRESET
INTR
NMI
VSS
STPCLK#
KEN#
RDY#
HOLD
VCC3
BRDY#
BLAST#
ADS#
SD0
SD1
SD2
SD3
SD4
VSS
Figure 3-4
strapping pin 198 high at reset. This figure also assumes that
the full DACKMUX0-2 interface is required and is enabled
through setting SYSCFG A0h[3] = 1.
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
82C465MV/MVA/MVB
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
KBDCS#
SD5
SD6
SD7
SD8
SD9
SD10
VCC5
VSS
SD11
SD12
SD13
SD14
SD15
ROMCS#
RTCD#
EPMMUX
IRQ5
IRQ9
IRQ11
RQMX0
RQMX1
RQMX2
RQMX3
LGNT#
MDIR
RAS4#
MA11
CA2
CA3
CA4
CA5
CA6
VSS
CA7
CA8
CA9
CA10
CA11
CA12
CA13
CA14
CA15
VCC5
VSS
CA16
CA17
CA18
CA19
CA20
CA21
VCC3
VCC3
CD16
CCS2#
CD15
CD14
CD13
CD12
CD11
CD10
VCC5
CD9
CD8
CCS1#
CD7
VSS
CD6
CD5
CD4
CD3
CD2
CD1
CD0
CCS0#
RAS3#
DWE#
VSS
CAS3#
RAS2#
RAS1#
RAS0#
MA9
MA10
CPURST
MA8
MA7
MA6
CAS2#
VSS
CAS1#
MA5
MA4
MA3
VCC3
MA2
CA31
CA24
CA23
CA22
MA1
MA0
CAS0#
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCC5
KBCLK
M16#
LMEGCS#/ATCYC#
SBHE#
BALE
DACKMUX0
VSS
VCC5
OSCCLK
KBCLK2
RTCAS
RST4#
AEN
PIO3/STPGNT#
PIO2/ATCLKIN
PIO1/NOWS#
PIO0/LREQ#
TC
DBE#
SPKD
IO16#
CHCK#
OSC14
SQWIN
PMIMUX
SUSP/RSM#
DACKMUX2
DACKMUX1
MASTER#/RI#
RST1#
PPWRL
LCLK
CD31
CD30
CD29
CD28
CD27
CD26
CD25
CD24
CCS3#
CD23
VSS
VCC3
CD22
CD21
CD20
CD19
CD18
CD17
VSS
OPTi
®
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Revision: 3.0
Page 11
82C465MV/MVA/MVB
3.5.1
Reduced Memory Interface Signal Group
Option
The standard 82C465MV DRAM controller hardware includes
direct control of up to five banks of DRAM (RAS0#-RAS4#)
and up to 12 bits of symmetrical or asymmetrical DRAM
addressing (MA[11:0]), and provides memory data buffer
direction control (MDIR).
To maintain backward compatibility with 82C463MV-based
applications, three signals must be redefined: MA11, MDIR,
and RAS4#. The three memory signals are disabled by a
strap option: if pin 79 is pulled high at reset time, the chipset
initialization logic will redefine three pins with their corresponding 82C463MV-located signals of DACKMUX0, 1, and
2. The memory features will not be available. Table 3-10 lists
the pin changes.
If pin 79 is left floating at reset, a weak internal pull-down
resistor straps the line low and the 82C465MV memory inter-
Table 3-10
face signals will be available. If pin 79 is pulled high at reset,
the old 82C463MV-compatible DACKMUX interface will be in
effect. All 82C463MV designs required pin 79 to be pulled
high at reset; consequently, replacing an 82C463MV chip
with the 82C465MV part automatically establishes the proper
interface scheme for backward compatibility.
Note:
When the DACKMUX0-2 signals are used from pins
77-79, they are provided on the CPU interface power
plane. Therefore, in a mixed-voltage system, these
will be 3.3V signals. The appropriate logic family
must be considered when selecting the DACK
decoder to avoid the high current associated with
driving 3.3V signals to 5.0V-powered logic.
Figure 3-5 illustrates the 82C465MV pinout in its 82C463MVcompatible mode, selected by strapping pins 79 and 198 high
at reset.
Strap-Selected Reduced Memory Interface Option
Pin
Normal 82C465MV (Pin 79 Low at Reset)
Reduced Memory Interface (Pin 79 High at Reset)
77
MA11
DACKMUX2
78
RAS4#
DACKMUX1
79
MDIR
DACKMUX0
OPTi
®
Page 12
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Revision: 3.0
82C465MV/MVA/MVB
Pin Diagram - 82C463MV-Compatible Mode
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
ATCLK
MRD#
MWR#
IORD#
IOWR#
CHRDY#
XDIR
SA1
VCC5
SA0
RFSH#
FBCLKIN
FBCLKOUT
VSS
CPUCLK
LDEV#
CA25/RDYI#
IGNNE#
SMI#
SMISCT#
FLUSH#
EADS#
M/IO#
W/R#
D/C#
A20M#
FERR#
HOLDA
BE3#
BE2#
BE1#
BE0#
AHOLD
SRESET
INTR
NMI
VSS
STPCLK#
KEN#
RDY#
HOLD
VCC3
BRDY#
BLAST#
ADS#
SD0
SD1
SD2
SD3
SD4
VSS
Figure 3-5
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
82C463MV-Compatible
Mode
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
KBDCS#
SD5
SD6
SD7
SD8
SD9
SD10
VCC5
VSS
SD11
SD12
SD13
SD14
SD15
ROMCS#
RTCD#
DREQ2
IRQ5
IRQ9
IRQ11
RQMX0
RQMX1
RQMX2
RQMX3
DACK2#
DACKMUX0
DACKMUX1
DACKMUX2
CA2
CA3
CA4
CA5
CA6
VSS
CA7
CA8
CA9
CA10
CA11
CA12
CA13
CA14
CA15
VCC5
VSS
CA16
CA17
CA18
CA19
CA20
CA21
VCC3
VCC3
CD16
CCS2#
CD15
CD14
CD13
CD12
CD11
CD10
VCC5
CD9
CD8
CCS1#
CD7
VSS
CD6
CD5
CD4
CD3
CD2
CD1
CD0
CCS0#
RAS3#
DWE#
VSS
CAS3#
RAS2#
RAS1#
RAS0#
MA9
MA10
CPURST
MA8
MA7
MA6
CAS2#
VSS
CAS1#
MA5
MA4
MA3
VCC3
MA2
CA31
CA24
CA23
CA22
MA1
MA0
CAS0#
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCC5
KBCLK
M16#
LMEGCS#/ATCYC#
SBHE#
BALE
LOWBAT
VSS
VCC5
OSCCLK
KBCLK2
RTCAS
RST4#
AEN
PIO3/STPGNT#
PIO2/CPUSPD
PIO1/NOWS#
PIO0
TC
TRIS#
SPKD
IO16#
CHCK#
OSC14
SQWIN
LLOWBAT
SUSP/RSM#
EPMI1
EPMI2
MASTER#/RI#
RST1#
PPWRL
LCLK
CD31
CD30
CD29
CD28
CD27
CD26
CD25
CD24
CCS3#
CD23
VSS
VCC3
CD22
CD21
CD20
CD19
CD18
CD17
VSS
OPTi
®
912-3000-016
Revision: 3.0
Page 13
82C465MV/MVA/MVB
3.5.2
82C465MV Interface with L2 Cache Support
An optional mode for the 82C465MV chipset provides a complete, direct set of cache control signals to an external writeback cache. This option is enabled by strapping pin 146 low
Pin Diagram - 82C465MV Interface with L2 Cache Support
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
82C465MV Interface with
L2 Cache Support
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
SDENH#
SD5
SD6
SD7
SD8
SD9
SD10
VCC5
VSS
SD11
SD12
SD13
SD14
SD15
ROMCS#/RTCD#
SDENL#
EPMMUX
IRQ5
IRQ9
IRQ11
RQMX0
RQMX1
RQMX2
RQMX3
LGNT#
MDIR
RAS4#
MA11
CA2
CA3
CA4
CA5
CA6
VSS
CA7
CA8
CA9
CA10
CA11
CA12
CA13
CA14
CA15
VCC5
VSS
CA16
CA17
CA18
CA19
CA20
CA21
VCC3
VCC3
TAG0
CCS2#
CD15
CD14
CD13
CD12
CD11
CD10
VCC5
CD9
CD8
CCS1#
CD7
VSS
CD6
CD5
CD4
CD3
CD2
CD1
CD0
CCS0#
RAS3#
DWE#KBDCS#
VSS
CAS3#
RAS2#
RAS1#
RAS0#
MA9
MA10
CPURST
MA8
MA7
MA6
CAS2#
VSS
CAS1#
MA5
MA4
MA3
VCC3
MA2
CA31
CA24
CA23
CA22
MA1
MA0
CAS0#
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCC5
KBCLK
M16#
LMEGCS#/ATCYC#
SBHE#
BALE
DACKMUX0
VSS
VCC5
OSCCLK
KBCLK2
RTCAS
RST4#
AEN
PIO3/STPGNT#
PIO2/ATCLKIN
PIO1/NOWS#
PIO0/LREQ#
TC
DBE#
SPKD
IO16#
CHCK#
OSC14
SQWIN
PMIMUX
SUSP/RSM#
DACKMUX2
DACKMUX1
MASTER#/RI#
RST1#
PPWRL
TAGCS#
ECA3
ECA2
TAGWE#
OCAWE#
ECAWE#
BOOE#
BEOE#
DRTY
CCS3#
TAG7
VSS
VCC3
TAG6
TAG5
TAG4
TAG3
TAG2
TAG1
VSS
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
ATCLK
MRD#
MWR#
IORD#
IOWR#
CHRDY#
SDIR
SA1
VCC5
SA0
RFSH#
FBCLKIN
FBCLKOUT
VSS
CPUCLK
LDEV#
CA25/RDYI#
IGNNE#
SMI#
SMISCT#
FLUSH#
EADS#
M/IO#
W/R#
D/C#/HITM#
A20M#
FERR#
HOLDA
BE3#
BE2#
BE1#
BE0#
AHOLD
SRESET
INTR
NMI
VSS
STPCLK#
KEN#
RDY#
HOLD
VCC3
BRDY#
BLAST#
ADS#
SD0
SD1
SD2
SD3
SD4
VSS
Figure 3-6
and pin 198 high at reset. The external pin interface changes
substantially with this option. Figure 3-6 illustrates the pinout
in this mode.
OPTi
®
Page 14
912-3000-016
Revision: 3.0
82C465MV/MVA/MVB
3.5.3
82C465MV with 386 Interface
The 82C465MV chipset offers the option of a 386DX-type
interface. This configuration supports processors like the IBM
Pin Diagram - 386 Interface Mode
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
82C465MV
386 Interface Mode
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
KBDCS#
SD5
SD6
SD7
SD8
SD9
SD10
VCC5
VSS
SD11
SD12
SD13
SD14
SD15
ROMCS#
RTCD#
EPMMUX/DREQ2
IRQ5
IRQ9
IRQ11
RQMX0
RQMX1
RQMX2
RQMX3
LGNT#
MDIR
RAS4#
MA11
CA2
CA3
CA4
CA5
CA6
VSS
CA7
CA8
CA9
CA10
CA11
CA12
CA13
CA14
CA15
VCC5
VSS
CA16
CA17
CA18
CA19
CA20
CA21
VCC3
VCC3
CD16
CCS2#
CD15
CD14
CD13
CD12
CD11
CD10
VCC5
CD9
CD8
CCS1#
CD7
VSS
CD6
CD5
CD4
CD3
CD2
CD1
CD0
CCS0#
RAS3#
DWE#
VSS
CAS3#
RAS2#
RAS1#
RAS0#
MA9
MA10
VLBUSRST
MA8
MA7
MA6
CAS2#
VSS
CAS1#
MA5
MA4
MA3
VCC3
MA2
CA31
CA24
CA23
CA22
MA1
MA0
CAS0#
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCC5
KBCLK
M16#
LMEGCS#/ATCYC#
SBHE#
BALE
DACKMUX0
VSS
VCC5
OSCCLK
KBCLK2
RTCAS
RST4#
AEN
DFSRDY#
PIO2/ATCLKIN
PIO1/NOWS#
LREQ#
TC
DBE#
SPKD
IO16#
CHCK#
OSC14
SQWIN
PMIMUX
SUSP/RSM#
DACKMUX2
DACKMUX1
MASTER#/RI#
RST1#
PPWRL
LCLK
CD31
CD30
CD29
CD28
CD27
CD26
CD25
CD24
CCS3#
CD23
VSS
VCC3
CD22
CD21
CD20
CD19
CD18
CD17
VSS
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
ATCLK
MRD#
MWR#
IORD#
IOWR#
CHRDY#
SDIR
SA1
VCC5
SA0
RFSH#
FBCLKIN
FBCLKOUT
VSS
CPUCLK
LDEV#
CA25/RDYI#
BUSY#
PWI#
PWIADS#
NPRST#
EADS#
M/IO#
W/R#
D/C#
A20M#
FERR#
HOLDA
BE3#
BE2#
BE1#
BE0#
AHOLD
0VCPURST
INTR
NMI
VSS
DFSREQ#
KEN#
RDY#
HOLD
VCC3
ERROR#
NPBSY#
ADS#
SD0
SD1
SD2
SD3
SD4
VSS
Figure 3-7
Blue Lightning. It is enabled by default with no strap pins. Figure 3-7 illustrates the 386 interface mode.
OPTi
®
912-3000-016
Revision: 3.0
Page 15
82C465MV/MVA/MVB
3.6
Pin Signal Characteristics
The signal types, drive capabilities, signal directions, power
plane, and other information for each pin on the 82C465MV is
provided in Table 3-11. The following legend applies to the
table entries.
Legend
D
DH
DL
Drive (mA)
Driven (to the last state before Suspend)
Driven high
Driven low
Maximum recommended steady state output current for each pin, assuming rated
current loading on all pins at once.
External
TTL-level input
CMOS-level input
Ext
I
IC
Table 3-11
Pin
No.
Int
IS
O
OD
PD
PU
TS
Internal
Schmitt-trigger-level input
CMOS-level output
Open-drain (open-collector) CMOS output
Pull-down
Pull-up
Tristated
Note that internal pull-up and pull-down resistors are
engaged only during bus hold condition (which includes Suspend mode), or only at hardware reset time (RST1# active) if
so indicated. External pull-up resistors are suggested but
may not be desirable in all cases (zero-volt Suspend CPUs,
for example).
82C465MV Pin Characteristics
Signal Name
Pin Type
(Drive)
PU/PD,
Where
1 CPUVCC
Bus Hold/
Suspend
Level
Note
Pwr
Plane
--
CPU
CPU
2 CD16/TAG0
I/O
(4mA)
Int PD
TS
3 CCS2#
I/O
(4mA)
Int PD on
Reset
TS or DH
4 CD15
I/O
(4mA)
Int PD
TS
CPU
5 CD14
I/O
(4mA)
Int PD
TS
CPU
6 CD13
I/O
(4mA)
Int PD
TS
CPU
7 CD12
I/O
(4mA)
Int PD
TS
CPU
8 CD11
I/O
(4mA)
Int PD
TS
CPU
9 CD10
I/O
(4mA)
Int PD
TS
CPU
10 COREVCC
1
CPU
--
CORE
11 CD9
I/O
(4mA)
Int PD
TS
CPU
12 CD8
I/O
(4mA)
Int PD
TS
CPU
13 CCS1#
I/O
(4mA)
Int PD on
Reset
TS or DH
14 CD7
I/O
(4mA)
Int PD
TS
CPU
--
GND
15 GND
1
CPU
16 CD6
I/O
(4mA)
Int PD
TS
CPU
17 CD5
I/O
(4mA)
Int PD
TS
CPU
Pin
No. Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
18 CD4
I/O
(4mA)
Int PD
TS
CPU
19 CD3
I/O
(4mA)
Int PD
TS
CPU
20 CD2
I/O
(4mA)
Int PD
TS
CPU
21 CD1
I/O
(4mA)
Int PD
TS
CPU
22 CD0
I/O
(4mA)
Int PD
TS
CPU
23 CCS0#
I/O
(4mA)
Int PD on
Reset
TS or DH
24 RAS3#
O
(8/12mA)
D
CPU
25 DWE#
(+KBDCS#)
O
(8/12mA)
DH
CPU
26 GND
1
CPU
--
GND
27 CAS3#
O
(8mA)
D
CPU
28 RAS2#
O
(8/12mA)
D
CPU
29 RAS1#
O
(8/12mA)
D
CPU
30 RAS0#
O
(8/12mA)
D
CPU
31 MA9
O
(8/12mA)
D
CPU
32 MA10
O
(8/12mA)
D
CPU
O
(8mA)
DL
CPU
33 CPURST
OPTi
®
Page 16
912-3000-016
Revision: 3.0
82C465MV/MVA/MVB
Table 3-11 82C465MV Pin Characteristics (cont.)
Pin
No.
Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
Pin
No. Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
34 MA8
O
(8/12mA)
D
CPU
62 CA15
I/O
(4mA)
Int PD
TS
CPU
35 MA7
O
(8/12mA)
D
CPU
63 CA14
I/O
(4mA)
Int PD
TS
CPU
36 MA6
O
(8/12mA)
D
CPU
64 CA13
I/O
(4mA)
Int PD
TS
CPU
O
(8mA)
D
CPU
65 CA12
I/O
(4mA)
Int PD
TS
CPU
66 CA11
I/O
(4mA)
Int PD
TS
CPU
67 CA10
I/O
(4mA)
Int PD
TS
CPU
68 CA9
I/O
(4mA)
Int PD
TS
CPU
69 CA8
I/O
(4mA)
Int PD
TS
CPU
70 CA7
I/O
(4mA)
Int PD
TS
CPU
--
GND
37 CAS2#
38 GND
--
GND
O
(8mA)
D
CPU
40 MA5
O
(8/12mA)
D
CPU
41 MA4
O
(8/12mA)
D
CPU
O
(8/12mA)
D
CPU
--
CPU
D
CPU
39 CAS1#
42 MA3
43 CPUVCC
44 MA2
O
(8/12mA)
45 CA31
I
Int PD
TS
CPU
46 CA24
I
Int PD
TS
CPU
47 CA23
I/O
(4mA)
Int PD
TS
48 CA22
I/O
(4mA)
Int PD
49 MA1
50 MA0
71 GND
72 CA6
I/O
(4mA)
Int PD
TS
CPU
73 CA5
I/O
(4mA)
Int PD
TS
CPU
CPU
74 CA4
I/O
(4mA)
Int PD
TS
CPU
TS
CPU
75 CA3
I/O
(4mA)
Int PD
TS
CPU
O
(8/12mA)
D
CPU
76 CA2
I/O
(4mA)
Int PD
TS
CPU
O
(8/12mA)
D
CPU
77 MA11/
DACKMUX2
O
(8mA)
Int PD on
Reset
D/TS
CPU
O
(8mA)
D
CPU
O
(8mA)
Int PU on
Reset
D/TS
CPU
52 GND
--
GND
78 RAS4#/
DACKMUX1/
CDIR
53 CPUVCC
--
CPU
79 MDIR/
DACKMUX0
O
(4mA)
Int PD on
Reset
DH/TS
CPU
80 DACK2#/LGNT#
O
(4mA)
Ext 20KΩ
PU
TS
CPU
51 CAS0#
54 CA21
I/O
(4mA)
Int PD
TS
CPU
55 CA20
I/O
(4mA)
Int PD
TS
CPU
56 CA19
I/O
(4mA)
Int PD
TS
CPU
I/O
(4mA)
Int PD
57 CA18
TS
CPU
81 RQMX3
IS
ATIO
82 RQMX2
IS
ATIO
83 RQMX1
IS
ATIO
84 RQMX0
IS
ATIO
85 IRQ11
I
ATIO
58 CA17
I/O
(4mA)
Int PD
TS
CPU
86 IRQ9
I
ATIO
59 CA16
I/O
(4mA)
Int PD
TS
CPU
87 IRQ5
I
ATIO
ATIO
--
GND
88 DREQ2/
EPMMUX
IS
60 GND
61 COREVCC
--
CORE
89 RTCD#/
SDENL#
O
(4mA)
RTCD#:
Ext 20KΩ
PU
TS/DH
ATIO
OPTi
®
912-3000-016
Revision: 3.0
Page 17
82C465MV/MVA/MVB
Table 3-11 82C465MV Pin Characteristics (cont.)
Pin
No.
Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
Pin
No. Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
90 ROMCS#
(/+RTCD#)
O
(4mA)
Ext 20KΩ
PU
TS
ATIO
116 RDY#
I/O
(4mA)
Ext 10KΩ
PU
TS
CPU
91 SD15
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
117 KEN#
O
(4mA)
Int CPU
PU
TS
CPU
92 SD14
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
118 STPCLK#
O
(4mA)
Int CPU
PU
DL
93 SD13
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
119 GND
94 SD12
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
95 SD11
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
96 GND
--
GND
97 ATIOVCC
--
ATIO
98 SD10
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
99 SD9
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
100 SD8
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
101 SD7
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
102 SD6
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
103 SD5
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
104 KBDCS#/
SDENH#
O
(4mA)
KBDCS#:
Ext 20KΩ
PU
TS/DH
ATIO
105 GND
--
GND
DL
CPU
121 INTR
I/O
(4mA)
Int PU on
Reset
DL
CPU
122 SRESET
O
(8mA)
DL
CPU
123 AHOLD
O
(4mA)
DL
CPU
124 BE0#
I/O
(4mA)
Int PD
TS
CPU
125 BE1#
I/O
(4mA)
Int PD
TS
CPU
126 BE2#
I/O
(4mA)
Int PD
TS
CPU
127 BE3#
I/O
(4mA)
Int PD
TS
CPU
128 HLDA
I
129 FERR#
I
131 DC#+HITM#
I
Int PD
132 W/R#
I/O
(4mA)
Int PD
CPU
133 M/IO#
I/O
(4mA)
Int PD
CPU
134 EADS#
/NPRST#
O
(4mA)
Int CPU
PU
TS
CPU
I/O
(4mA)
Int CPU
PU
TS
CPU
I
107 SD3
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
108 SD2
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
109 SD1
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
135 FLUSH#/
SMIRDY#/
HITM#
110 SD0
I/O
(8mA)
Ext 10KΩ
PU
TS
ATIO
136 SMIACT#/
SMIADS#
111 ADS#
I/O
(4mA)
Ext 10KΩ
PU
TS
CPU
112 BLAST#/
NPBUSY#
I
Ext 10KΩ
PU
113 BRDY#/
ERROR#
I/O
(4mA)
115 HOLD
O
(4mA)
CPU
TS
CPU
5
CPU
CPU
I/O
(4mA)
Int CPU
PU
TS
CPU
138 IGNNE#/BUSY#
O
(4mA)
Int CPU
PU
TS
CPU
139 CA25/RDYI#
2
Int CPU
PU
137 SMI#
CPU
D
CPU
I/O
(4mA)
ATIO
CPU
CPU
Int PU
130 A20M#/GA20
TS
114 CPUVCC
GND
Int PU on
Reset
Ext 10KΩ
PU
CPU
-I/O
(4mA)
I/O
(8mA)
TS
CPU
120 NMI
106 SD4
Int CPU
PU
4
140 LDEV#
141 CPUCLK
142 GND
I
Int PD
CPU
I
O
(8mA)
CPU
DL
CPU
GND
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82C465MV/MVA/MVB
Table 3-11 82C465MV Pin Characteristics (cont.)
Pin
No.
Signal Name
143 FBCLKOUT
144 FBCLKIN
Pin Type
(Drive)
Bus Hold/
Suspend
Level
Bus Hold/
Suspend
Level
Pwr
Plane
Pin
No. Signal Name
O
(8mA)
CPU
169 RST4#
O
(4mA)
IC
CPU
170 AEN
O
(8mA)
171 PIO3/ STPGNT#
I/O
(4mA)
ATIO
172 PIO2/CPUSPD/
ATCLKIN/
SABUFEN#
I/O
(4mA)
ATIO
145 RFSH#
I/O
(8mA)
146 SA0
I/O
(8mA)
148 SA1
I/O
(8mA)
149 XDIR/SDIR
PU/PD,
Where
Note
Pin Type
(Drive)
PU/PD,
Where
Note
Pwr
Plane
ATIO
DL
ATIO
TS
ATIO
Int PU on
Reset
TS
ATIO
Int PD on
reset
TS
ATIO
173 PIO1/NOWS#/
CMD#
I/O
(4mA)
ATIO
O
(4mA)
DH
ATIO
174 PIO0/LREQ#
I/O
(4mA)
ATIO
150 CHRDY
IS/OD
(8mA)
TS
ATIO
175 TC/DRD#
O
(4mA)
151 IOWR#
I/O
(8mA)
TS
ATIO
176 TRIS#/DBE#
O
(4mA)
152 IORD#
I/O
(8mA)
TS
ATIO
177 SPKD
O
(4mA)
153 MWR#
I/O
(8mA)
TS
ATIO
178 IO16#
IS
ATIO
154 MRD#
I/O
(8mA)
TS
ATIO
179 CHCK#/
KBCRSTIN
IS
ATIO
155 ATCLK
O
(8mA)
DL
ATIO
I
ATIO
147 VDDS
ATIO
156 GND
GND
157 COREVCC
158 KBCLK
CORE
O
(4mA)
Runs
159 M16#
IS/O
(8mA)
TS
ATIO
160 LMEGCS#+
ATCYC#
O
(4mA)
Int PD on
Reset
TS
ATIO
161 SBHE#/DWR#
I/O
(8mA)
Int PD on
Reset
TS
ATIO
162 BALE
O
(8mA)
DL
ATIO
163 LOWBAT/
DACKMUX0
I/O
(4mA)
TS
ATIO
164 GND
Int PD disabled on
Suspend
and when
pin is output
GND
ATIO
180 OSC14
ATIO
166 OSCCLK
IC
ATIO
167 KBCLK2
O
(4mA)
Runs
ATIO
168 RTCAS
O
(4mA)
DL
ATIO
ATIO
Int PU on
Reset
ATIO
TS
ATIO
181 SQWIN
I
ATIO
182 LLOWBAT/
PMIMUX
I
ATIO
183 SUSP/RSM
I
184 EPMI1/
DACKMUX2
I/O
(4mA)
Int PU disabled on
Suspend
and when
pin is output
TS
185 EPMI2/
DACKMUX1
I/O
(4mA)
Int PD disabled on
Suspend
and when
pin is output
TS
186 MASTER#/
RI/SEL#-ATB#
ATIO
ATIO
3
I
ATIO
ATIO
187 RST1#
IS
188 PPWRL
O
(4mA)
DL
189 LCLK/TAGCS#/
BOFF#
O
(4mA)
TS or DH
190 CD31/ECA3
I/O
(8mA)
Int PD
TS
CPU
191 CD30/ECA2
I/O
(8mA)
Int PD
TS
CPU
GND
165 ATIOVCC
DL
ATIO
CPU
1
CPU
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Page 19
82C465MV/MVA/MVB
Table 3-11 82C465MV Pin Characteristics (cont.)
Pin
No.
Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
Pin
No. Signal Name
Pin Type
(Drive)
PU/PD,
Where
Bus Hold/
Suspend
Level
Note
Pwr
Plane
192 CD29/TAGWE#
I/O
(4mA)
Int PD
TS or DH
1
CPU
206 CD18/TAG2
I/O
(4mA)
Int PD
TS
CPU
193 CD28/OCAWE#
I/O
(8mA)
Int PD
TS or DH
1
CPU
207 CD17/TAG1
I/O
(4mA)
Int PD
TS
CPU
194 CD27/ECAWE#
I/O
(8mA)
Int PD
TS or DH
1
CPU
208 GND
195 CD26/BOOE#
I/O
(8mA)
Int PD
TS or DH
1
CPU
196 CD25/BEOE#
I/O
(8mA)
Int PD
TS or DH
1
CPU
197 CD24/DRTY
I/O
(4mA)
Int PD
TS
198 CCS3#
I/O
(4mA)
Int PD on
Reset
TS or DH
199 CD23/TAG7
I/O
(4mA)
Int PD
TS
CPU
1
CPU
CPU
200 GND
GND
201 CPUVCC
CPU
202 CD22/TAG6
I/O
(4mA)
Int PD
TS
CPU
203 CD21/TAG5
I/O
(4mA)
Int PD
TS
CPU
204 CD20/TAG4
I/O
(4mA)
Int PD
TS
CPU
205 CD19/TAG3
I/O
(4mA)
Int PD
TS
CPU
GND
Notes: 1. These pins can be driven high during Suspend if
L2 cache is still powered, or can be tristated if
cache is powered off, as selected through
SYSCFG D0h[6].
2. These pins are driven low when zero-volt CPU
Suspend is selected through SYSCFG ADh[5].
3. The EPMI2 pin is driven during Suspend if the
chip is strapped for the RSMRST# option.
4. The CPU disconnects its STPGNT# pull-up during stop grant cycles.
5. D/C# still requires an external pull-up on the
CPU side when the D/C#+HITM# gate is used
for L2 cache.
6. Pins with dual drive capability are set through
program registers.
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82C465MV/MVA/MVB
3.7
Signal Descriptions
References throughout the pin descriptions depend on the
chip strapping options made, as described in Section 3.3,
"Strap-Selected Interface Options" on page 5. Refer to Table
3.7.1
3-2 to determine the features that are mutually exclusive.
Internal pull-ups or pull-downs are not listed here, but can be
found in Table 3-11 on page 16.
Clock and Reset Interface
Signal Name
Pin
No
Signal
Type
Selected
By
OSCCLK
166
I-CMOS
Oscillator Clock Input: Fixed at the on-mode frequency
of the CPU. ATCYC# strapping option also allows it to be
2X for a 1X CPU clock if desired.
FBCLKIN
144
I-CMOS
Feedback Clock Input: This signal is used to clock most
of the internal circuitry. This input should be connected to
FBCLKOUT.
FBCLKOUT
143
O
System Feedback Clock Output: This signal should be
connected to the 82C465MV FBCLKIN input through a
discrete passive component (33Ω resistor is typical).
This output is 1X, regardless of whether a 1X or 2X CPU
is being used.
CPUCLK
141
O
CPU Clock Output: This output is 1X for 1X clock CPUs
and 2X for 2X clock CPUs. It should be connected to the
CPU clock input through a discrete passive component
(33Ω resistor is typical).
SQWIN
181
I
Square Wave Input: This clock input may be 32kHz or
128kHz. This clock input is used to clock the internal
power management timers. This clock is also used to
time refresh frequency, both active and during Suspend
(if Suspend refresh is programmed). Set SYSCFG 40h[3]
to indicate the input frequency used.
OSC14
180
I
14.318MHz Clock Input: This signal goes to the IPC
timer, times refresh pulse width except during Suspend
mode, and can be enabled to time ISA bus operations.
This input can be turned off during Suspend mode if the
KBCLK source is set to 32kHz (SYSCFG 66h[6]) or if no
KBCLK and interrupt scanning is needed.
KBCLK
158
O
Keyboard Controller Clock: Also used with KBCLK2 to
multiplex IRQs, DRQs, and EPMI inputs.
KBCLK2
167
O
Keyboard Controller Clock Divided by Two: Also used
with KBCLK to multiplex interrupts and DMA requests.
RST1#
187
IS
Reset One: Initiates a cold reset from the power supply
or reset switch.
RST4#
169
O
Reset Four: Indicates a cold reset to the system.
CPURST
33
O
CPU Reset: Standard CPU reset (includes SMBASE
reset for SMI CPUs).
SRESET
122
O
CPU Soft Reset: Partially resets the CPU (the SMBASE
is not reset for SMI CPUs). Used as the main CPU reset
for IBM Blue Lightning.
Signal Description
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82C465MV/MVA/MVB
3.7.2
CPU / VL-Bus Interface
Signal Name
CD[31:16]
Cache Signals
Pin
No
Signal
Type
190-197,
199,
202-7
I/O
I/O
Selected By
Pin 146 strap
option (see
Table 3-2)
Signal Description
Upper CPU Data Bus Word (No L2 cache mode)
Cache Data and Control Signals (L2 cache mode): See
Section 4.5.4, "L2 Cache Support" on page 64.
2, 4-9, 11,
12, 14, 16-22
I/O
Lower CPU Data Bus Word
ADS#
111
I/O
Address Strobe: As an input, this pin from the CPU indicates the start of a valid address cycle. As an output, this
signal is used to support the VESA local bus during ISA
bus access of local memory (ISA masters and DMA).
M/IO#
133
I/O
Memory or I/O: As an input, this signal from the CPU indicates whether the current cycle is a memory or I/O access.
As an output, this signal is used to support the VESA local
bus during ISA bus access of local memory (ISA masters
and DMA).
W/R#
132
I/O
Write or Read: This signal from the CPU indicates
whether the current cycle is a write or read access during
ISA bus access of local memory (ISA masters and DMA).
D/C#
131
I
CD[15:0]
Cycle
Multiplexed
Data or Command: This signal from the CPU indicates
whether the current cycle is a data or code access.
Hit on Modified Line: CPU indication that the external
master bus snoop initiated when EADS# went active has
hit upon a modified internal cache line, requiring the CPU
to update external DRAM before the master can continue.
HITM#
CPU Address A31, A24 inputs: Use strong (2Kohm) pulldown on these lines as well as CPU CA[30:25] for proper
DMA operation.
CA31, CA24
45, 46
I
CA[23:10]
47, 48,
54-59,
62-67
I/O
CPU Address Lines A23 to A10: These pins are inputs
for CPU and master cycles. These pins are outputs for
DMA cycles.
CA[9:2]
68-70,
72-76
I/O
CPU Address Lines A9 to A2: These pins are inputs for
CPU and master cycles. These pins are outputs for DMA
and refresh cycles.
BE[3:0]#
127-124
I/O
Byte Enables: For CPU cycles, these inputs are the CPU
byte enables. For ISA bus access of local memory, they
are outputs.
RDY#
116
I/O
Ready: Indicates completion of the current VL-bus cycle.
Local bus devices can drive RDY# directly to the CPU as
long as they use a tristate driver that does not drive while
LDEV# is inactive.
HOLD
115
O
Hold Request: Requests system control from the CPU.
HLDA
128
I
Hold Acknowledge: CPU acknowledges a hold request
with this signal.
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82C465MV/MVA/MVB
Signal Name
Pin
No
Signal
Type
NMI
120
O
Non Maskable Interrupt: Indicates the occurrence of a
non maskable interrupt to the CPU.
O
Interrupt: Indicates occurrence of a maskable interrupt to
the CPU.
Cache Enable: Indicates to the CPU that current bus cycle
is cacheable.
Selected By
Strap option
pin, refer to
Table 3-2
INTR
121
Strap option
pin, refer to
Table 3-2
KEN#
117
O
BRDY#
113
I/O
ERROR#
EADS#
134
O
Pin 198 strap
option (see
Table 3-2)
External Address Strobe (486 mode): Indicates that an
external bus master has placed a valid address on the
CPU address bus, and is used by the CPU to invalidate
internal cache (and generate HITM# if available).
O
Numerical Processor Reset (386 mode): This signal is
used to reset the numeric coprocessor.
Address Hold Request: The CPU will float its address
bus in the clock following AHOLD going active. The
82C465MV generates AHOLD after a cache writeback has
been completed; AHOLD active while HITM# is inactive
constitutes the BOFF# signal to the CPU.
AHOLD
123
O
BLAST#
112
I
NPBUSY#
Burst Ready (486 mode): Indicates termination of a burst
cycle. The 82C465MV controller logic also terminates non
burst cycles with BRDY# on occasion.
Numeric Processor Error (386 mode): Indicates a calculation error from the numeric processor.
I/O
NPRST#
I
LDEV#
140
I
CA25 (64MB)
139
I
RDYI# (32MB)
Pin 198 strap
option (see
Table 3-2)
Signal Description
I
Pin 198 strap
option (see
Table 3-2)
Burst Last (486 mode): Indicates that the next BRDY#
will complete the current burst cycle.
Numeric Processor Busy (386 mode): Indication from
the numeric processor that the current operation has not
completed.
Local Device: Local devices drive this input to indicate
that they are responding to the current cycle. This signal
must be asserted by the end of the first T2 (with appropriate setup time) for local device recognition. This signal has
an internal 50K pull-up resistor.
Pin 161 strap
option (see
Table 3-2)
CA25: Address for increased local DRAM capacity. This
pin must function as CA25 if DRAM memory size over
32MB is required.
RDYI# (LRDY# from VL-bus): Local devices drive this
input to indicate that the current cycle is completed.
The function of pin 139 is determined by pin 161 strapping.
If CA25 is required as well as LRDY#, the VL-bus device
can drive the CPU RDY# signal directly (LRDY# is defined
as open-collector) up to 33MHz.
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Page 23
82C465MV/MVA/MVB
Signal Name
Pin
No
Signal
Type
FERR#
129
I
IGNNE#
138
O
Selected By
Signal Description
Floating Point Error: Driven by the coprocessor to indicate an error condition when an unmasked exception
occurs.
Pin 198 strap
option (see
Table 3-2)
Ignore Numeric Errors (486 mode): Instructs the CPU to
ignore the numeric coprocessor's error output.
O
Pin 146 strap
option (see
Table 3-2)
Tag Chip Select (L2 cache mode): See Section 4.5.4,
"L2 Cache Support" on page 64.
BOFF#
O
Pin 146 strap
option (see
Table 3-2)
and SYSCFG
D4h[0] = 0
CPU Backoff (No L2 cache mode): This pin becomes
BOFF# to the CPU when there is no L2 cache present and
the 465 memory interface is enabled.
LCLK
O
Pin 146 strap
option (see
Table 3-2)
and SYSCFG
D4h[0] = 1
Local Bus Clock (Pin 79 Strapped high - 82C463MVcompatible mode only): For 2X clock CPUs, this signal is
the VESA local bus 1X clock. For 1X clock CPUs, this signal is a 2X clock output. (In this mode, the VESA local bus
1X clock comes from pin 143, FBCLKOUT)
BUSY#
O
TAGCS#
189
Numeric Processor Busy (386 mode): Indicates that the
numeric co-processor has not completed its current operation.`
STPCLK#
118
O
Stop Clock: Requests a change in the clock frequency
from the CPU.
SMI#
137
I/O
System Management Interrupt: Request System Management Mode (SMM) operation from the CPU. For support of some CPUs, this pin is bidirectional. See SYSCFG
5Bh[4].
SMIACT#
136
I
SMIADS#
SYSCFG
[5Bh[4] = 0
SYSCFG
[5Bh[4] = 1
SMI Process Active or SMI Address Strobe: This pin is
used to indicate that the CPU is operating is System Management Mode (SMM).
O
SYSCFG
[6Bh[6] = 0
Cache Flush: The FLUSH# signal commands flushing of
the internal CPU cache on entry to SMM.
SMIRDY#
O
SYSCFG
[6Bh[6] = 1
SMI Ready: The SMIRDY# signal responds to SMIADS#
for CPUs that require this signal interface.
HITM#
I
SYSCFG
[D6h[4] = 1
Hit On Modified line: CPU indication that the external
master bus snoop initiated when EADS# went active has
hit upon a modified internal cache line, requiring the CPU
to update external DRAM before the master can continue.
FLUSH#
135
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82C465MV/MVA/MVB
3.7.3
DRAM Interface
Signal Name
CCS[3:0]#
Pin
No.
Signal
Type
198, 3, 13,
23
O
Selected
By
Description
Cache Chip Select 0-3 (L2 cache mode): These pins are
strap options only, in the case where no L2 cache is used.
Strap option
pins, refer to
Table 3-2
DWE#
25
DWE#+
KBDCS#
O
O
Pin 146 strap
option (see
Table 3-2)
DRAM Write Enable (No L2 cache mode): For DRAM
memory cycles, this signal is the DRAM write strobe.
DWE# combined with KBDCS# (L2 cache mode): This
signal must be qualified with AEN low to decode the true
KBDCS# signal. Refer to the separate KBDCS# description also.
CAS[3:0]#
27, 37, 39,
51
O
Column Address Strobes 3 to 0: These outputs drive the
CAS# inputs on DRAM bytes 3 to 0.
RAS[3:0]#
24, 28, 29,
30
O
Row Address Strobes 3 to 0: These outputs drive the
RAS# inputs on DRAM Banks 3 to 0.
78
O
SYSCFG
F8h[1] = 0 and
Pin 79 strap
option not
used
Row Address Strobe 4: This output drives the RAS#
input from DRAM Bank 4. Note that RAS4# is not available
if pin 79 strapping option is used to defeat it.
O
SYSCFG
F8h[1] = 1
Compact ISA Direction: Controls buffer direction for
CISA cable drive buffer.
RAS4#
CDIR
MDIR
O
Memory Buffer Direction Signal: Note that this signal is
not available if pin 79 strapping option is used to defeat it.
77
O
Memory Address Signal MA11: Note that this signal is
not available if pin 79 strapping option is used to defeat it.
32, 31,
34-36,
40-42,
44, 49, 50
O
Memory Address Signal MA10 to MA0 and Peripheral
Power Control Signals: For DRAM cycles, these are MA
addresses.
79
Strap option
pin, refer to
Table 3-2
MA11
MA[10:0]
For ISA Bus cycles (ATCYC# low):
1)
MA[11:0] are peripheral power control pins latched
externally with signal PPWRL;
2)
MA[9:6] are decoded by AEN and ATCYC# low to
become programmable chip select signals CSG1#,
CSG0#, CSG3#, and CSG2# respectively.
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Revision: 3.0
Page 25
82C465MV/MVA/MVB
3.7.4
L2 Cache Interface
Signal Name
Pin
No.
Signal
Type
DRTY
197
I/O
BEOE#
196
O
BOOE#
195
O
ECAWE#
194
O
OCAWE#
193
O
TAGWE#
192
O
Tag RAM Write Enable
ECA2
191
O
Cache CA2
ECA3
190
O
Cache CA3
TAG[7:0]
199, 202207, 2
I/O
Tag RAM Data
TAGCS#
189
O
Tag RAM Chip Select
CCS0-3#
23, 13, 3,
198
O
Cache Chip Select 0-3
SDIR
149
O
SD[15:0]-to-CD[31:16] buffer direction control
SDENH#
104
O
SD[15:8]-to-CD[31:24] buffer enable
SDENL#
89
O
SD[7:0]-to-CD[23:16] buffer enable
3.7.5
Selected
By
This interface
is only available if the Pin
146 strap
option (see
Table 3-2) is
set.
Signal Description
Dirty bit
Cache Output Enable, Even
Cache Output Enable, Odd
Cache Write Enable, Even
Cache Write Enable, Odd
ISA Bus Interface
Pin
No.
Signal
Type
91-95, 98103, 106-110
I/O
ISA Bus Data SD15 to SD0
ATCLK
155
O
ISA Bus Clock
BALE
162
O
ISA Bus Address Latch
MRD#
154
I/O
ISA Bus Memory Read Command
MWR#
153
I/O
ISA Bus Memory Write Command
IORD#
152
I/O
ISA Bus I/O Read Command
IOWR#
151
I/O
ISA Bus I/O Write Command
CHRDY
150
IS/OD
M16#
159
IS/O
16-bit Memory Slave: This ISA bus signal indicates a 16bit memory slave is responding. Normally an input, this signal becomes an output when a master accesses local
memory.
IO16#
178
IS
16-bit I/O Slave: This ISA bus signal indicates a 16-bit I/O
slave is responding.
Signal Name
SD[15:0]
Selected
By
Signal Description
ISA Bus Channel Ready
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Revision: 3.0
82C465MV/MVA/MVB
Signal Name
SA[1:0]
Pin
No.
Signal
Type
Selected
By
148, 146
I/O
ISA Bus Address SA1 to SA0: Provide the remaining two
SA bus address lines, which cannot be buffered directly
from the CPU CA bus.
Strap option
pins, refer to
Table 3-2
Signal Description
SBHE#
161
I/O
System Byte High Enable: Indicates a transfer on the
upper byte of the ISA data bus SD[15:8].
DWR#
Strap option
pin, refer to
Table 3-2
O
Drive Write: Provides write command for local-bus IDE
cycles when qualified by DBE.
RFSH#
145
I/O
Refresh: Indicates ISA bus refresh cycles.
LMEGCS# +
ATCYC#
160
O
Lower Memory Chip Select and ISA I/O Cycle Indicator: This signal is active when the memory cycle address
is below 1MB. It is used to generate SMRD# and SMWR#.
For ISA bus I/O cycles, it is used to generate CSG0-3#.
IS
ISA Bus Channel Check: Provides the system with parity
information about memory or devices on the ISA bus. It
indicates a non-correctable system error and is one of the
sources used to generate a CPU NMI.
CHCK#
Strap option
pin, refer to
Table 3-2
179
KBCRSTIN
3.7.6
IS
SYSCFG
79h[2:1] = 11
(MVA)
Keyboard Controller Reset Input: CHCK# can be recovered on EPMI4 (MVB). Internally synchronized to HLT to
generate CPURST with the correct timing.
IPC (82C206) Interface
Signal Name
Pin
No.
Signal
Type
RQMX3
81
IS
Multiplexed input signals of DRQ1, DRQ3, DRQ6,
DRQ7
RQMX2
82
IS
Multiplexed input signals of IRQ10, DRQ0, DRQ5,
IRQ15
RQMX1
83
IS
Multiplexed input signals of IRQ6, IRQ8, IRQ4, IRQ12
RQMX0
84
IS
Multiplexed input signals of IRQ3, IRQ1, IRQ7, IRQ14
IRQ11
85
I
Interrupt request channel 11
IRQ9
86
I
Interrupt request channel 9
IRQ5
87
I
Interrupt request channel 5
DREQ2
88
I
SYSCFG
A1h[5] = 0
DMA request channel 2.
I
SYSCFG
A1h[5] = 1
EPMI Input Mux
O
SYSCFG
A0h[5] = 0
DMA Channel Two Acknowledge (486 mode, 386 mode
option)
EPMMUX
DACK2# (486)
80
NPINT (386)
O
LGNT#
O
Selected
By
Signal Description
Numeric Processor Interrupt (386 mode)
SYSCFG
A0h[5] = 1
Local Bus Grant
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Signal Name
Memory Controls (normal)
DACKMUX02 (if mem. controls are
defeated)
Pin
No.
Signal
Type
79-77
O
Strap option
pins, refer to
Table 3-2
Memory Control Lines: Refer to Section 4.4, "DRAM
Controller" on page 48
O
Encoded DACK0-7# Signals (463-compatible solution):
Available here only if memory controls interface is
defeated through pin 79 strap option. Connect to 74138
decoder to derive DACK0#-DACK7# (DACK4# not valid).
Note that pins 77-79 are on CPU I/O power plane and may
be 3.3V signals.
163, 185,
184
EPMI pins
(default)
DACKMUX0-2
Selected
By
Signal Description
I
SYSCFG
A0h[3] = 0
LOWBAT, EPMI2, EPMI1 Interface (at power on
default): Refer to Section 4.7, "Power Management Unit"
on page 103 for full details.
O
SYSCFG
A0h[3] = 1
Encoded DACK0-7# Signals (preferred solution for
new designs): Available here only if SYSCFG A0h[3] = 1.
EPMI signals must be relocated to an external multiplexer.
Connect to a 74138 decoder to derive DACK0#-DACK7#
(DACK4# not valid). Note that these pins are on the AT I/O
power plane and may be 5.0V signals.
TC/DRD#
175
O
ISA Bus Terminal Count/Drive Read: Provides read
command for local bus IDE when qualified by DBE#.
AEN
170
O
ISA Bus Address Enable: Indicates that the DMA controller has taken control of the CPU address bus and the ISA
bus command lines.
3.7.7
PMU Interface
Signal Name
Pin
No.
Signal
Type
LOWBAT
163
I
SYSCFG
A0h[3] = 0
Low Battery Indication: Has programmable polarity:
SYSCFG 40h[4].
I
SYSCFG
A0h[3] = 1
DACKMUX0: See Section 4.6.3, "Integrated Peripheral
Controller" on page 76.
I
SYSCFG
A0h[3] = 0
Very Low Battery Indication: Has programmable polarity:
SYSCFG 40h[5].
I
SYSCFG
A0h[3] = 1
EPMI Multiplex Input: Refer to Section 3.4, "Program
Selected Interface Options" on page 9.
I
SYSCFG
A0h[3] = 0
External PMI Source One: Has programmable polarity:
SYSCFG 40h[1].
I
SYSCFG
A0h[3] = 1
DACKMUX2: See Section 4.6.3, "Integrated Peripheral
Controller" on page 76.
DACKMUX0
LLOWBAT
182
PMIMUX
EPMI1
184
DACKMUX2
Selected
By
Description
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Signal Name
Pin
No.
Signal
Type
Selected
By
EPMI2
185
I
SYSCFG
A0h[3] = 0
External PMI Source Two: Has programmable polarity:
SYSCFG 40h[2].
DACKMUX1
O
SYSCFG
A0h[3] = 1
DACKMUX1: See Section 4.6.3, "Integrated Peripheral
Controller" on page 76.
RSMRST#
O
Pin 148 strap
option (see
Table 3-2)
Resume Reset
Description
SUSP/RSM
183
I
Suspend/Resume: Indirect Suspend source (can cause
SMI to initiate Suspend); direct resume source (cannot be
disabled).
TRIS#
176
O
Strap option
pin, refer to
Table 3-2
Suspend Mode Indication (No IDE): A '0' indicates that
the system is in Suspend mode.
O
Data Buffer Enable (IDE enabled): Enables the command line buffer to the IDE interface. Refer to the “IDE
Interface” section.
174
I/O
SYSCFG
A0h[5] = 0
User definable I/O pin PIO0
I/O
SYSCFG
A0h[5] = 1
Local Bus Master Request
I/O
SYSCFG
66h[1] = 0
User definable I/O pin PIO1
NOWS#
I
SYSCFG
66h[1] = 1
ISA Bus Zero Wait State: Option available when
CMD#
O
SYSCFG
F8h[0] = 1
Compact ISA Command: This signal generates ISA-like
command timing to the CISA peripheral devices.
I/O
SYSCFG
66h[2] = 0
User definable I/O pin PIO2
CPUSPD
O
SYSCFG
66h[2] = 1
CPU Full Speed Indicator: A '1' indicates that the CPU is
operating at full speed.
ATCLKIN
I
SYSCFG
A0h[1] = 1
AT Clocking Source Input
SABUFEN#
O
SYSCFG
79h[3] = 1
(MVA)
SA Bus Buffer Enable: Allows CA-to-SA bus buffer to be
tristated when not in use to save power.
I/O
SYSCFG
66h[3] = 0
User Definable I/O pin PIO3
I
SYSCFG
66h[3] = 1
CPU Stop Clock Grant Signal
DBE
PIO0
(No master)
LREQ# (VLbus master)
PIO1
PIO2
PIO3
173
172
171
STPGNT#
PPWRL
188
O
Peripheral Power Control Signal Latch: This signal is
used to control the external latching of the peripheral
power control signals PPWR11-0 from MA[11:0]. This signal is pulsed during reset to pre-set the external latch.
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Signal Name
Pin
No.
Signal
Type
MASTER#
186
I
Selected
By
Description
ISA Bus Master: Note: MASTER# is internally decipherable and need not be input. This pin should always be programmed as RI#.
RI#
I
SYSCFG
F8h[0] = 0
Ring Indicator: When the CISA interface is not needed
(SYSCFG F8h[0] = 0), this pin becomes the RI input and
can be used to resume the system after entry to Suspend
mode.
SEL#/ATB# +
CLKRUN#
I
SYSCFG
F8h[0] = 1
Compact ISA Select. The CISA peripheral device (usually
the 82C852) asserts SEL# to claim a CISA cycle after
decoding its address on ALE active. The 82C465MVB can
optionally inhibit the ISA command lines when it receives
SEL#.
AT Backoff. The CISA peripheral device asserts ATB#
between cycles to generate an interrupt on the
82C465MVB.
Clock Run. The CISA peripheral device asserts CLKRUN# to restart ATCLK when the 82C465MVB has issued
a STPCLK broadcast cycle and stopped ATCLK.
3.7.8
Miscellaneous Signal Interface
Signal Name
Pin
No.
Signal
Type
A20M#
130
O
GA20
I/O
Selected By
Pin 198 strap
option (see
Table 3-2)
Description
A20 Mask Control (486 mode)
Gated A20 line (386 mode): Can be forced to A20M#
function.
RTCAS
168
O
RTC Address Strobe: This signal is active when the system accesses Port 70h.
SPKD
177
O
Speaker signal. Uses special protocol when CISA is
enabled.
ROMCS#
90
O
ROMCS# +
RTCD#
O
RTCD#
89
SDENL#
O
Pin 146 strap
option (see
Table 3-2)
ROM Chip Select (No L2 cache mode): For memory
cycles in the proper range, this is the ROM chip select.
Pin 146 strap
option (see
Table 3-2)
Real Time Clock (RTC) Data Strobe Qualifier (No L2
cache mode): For I/O cycles at Port 70h, this is used to
generate the RTC data strobe and read/write signal.
L2 Cache Control Signal (L2 cache mode): Refer to “L2
Cache Interface” section of this table.
O
KBDCS#
104
SDENH#
O
O
ROM Chip Select and RTCD# Signal (L2 cache mode):
Combined signals. Valid as RTCD# only when AEN is low.
Pin 146 strap
option (see
Table 3-2)
Keyboard Controller Chip Select (No L2 cache mode):
This signal is qualified with AEN to produce the keyboard
chip select.
L2 Cache Control Signal (L2 cache mode): Refer to “L2
Cache Interface” section of this table.
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Signal Name
Pin
No.
Signal
Type
XDIR
149
O
SDIR
3.7.9
Selected By
Pin 146 strap
option (see
Table 3-2)
O
Description
XD Bus Data Buffer Direction Control: A '1' indicates
data transfer from the 82C465MV SD bus to the XD-bus
device. Normally high, it is low for the following two conditions:
1)
When ROMCS# and MRD# are both active, and
2)
During reads from I/O Ports 060h, 064h, 070h, and
071h.
L2 Cache Control Signal: Refer to “L2 Cache Interface”
section of this table.
Power and Ground Pins
Name
Type
Pin No
Description
VDD
CPU I/O
Power
1, 43, 53, 114, 201
+3.3V
VDDS
AT I/O
Power
97, 147, 165
+5.0V
VDDCORE
Core VCC
Power
10, 61, 157
Same as VDDS
GND
GND
15, 26, 38, 52, 60, 71, 96, 105, 119, 142, 156, 164, 200,
208
Ground
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4.0
Functional Description
4.1
463/465 Chipset Programming Comparison
Many OPTi chipsets are designed to be register-compatible
with their immediate predecessors. In the case of the
82C465MV, virtually all of the programming registers in the
82C463MV are directly available.
on older registers, but are discouraged from using non current registers. The reason for this is that in the eventual successor to the 82C465MV, certain 82C463MV registers may
no longer be available.
However, certain 82C463MV features have been superseded
by new 82C465MV registers. In such cases, only the recommended registers have been documented here. Programmers can refer to the 82C463MV Data Book for information
Code designed to accommodate both the 82C463MV and
82C465MV to determine the chipset type should read the
product indicator SYSCFG 30h[7:6] (see Table 4-1).
Table 4-1
7
Product Indicator Register Bit
6
5
SYSCFG 30h
4
3
Control Register 1
2
1
0
Default = 40h
82C46x product indicator (RO):
00 = 82C463/463MV
01 = 82C465MV
10 = 82C465MVA
11 = 82C465MVB
4.2
CPU and VL-Bus Interface
The 82C465MV chipset is typically used to support a CPU
with a 32-bit 486-type interface, but can also support 32-bit
386DX-type interfaces. The standard CPU signaling interface
is provided and is known as the VESA local bus (VL-bus).
The fully featured VL-bus interface additionally allows for
connection of high-speed peripheral devices such as the
OPTi 92C178 Local-Bus LCD Controller.
This section describes the CPU interface as part of the total
VL-bus support provided by the 82C465MV chipset. All
VESA-standard signals are provided either on dedicated pins
or as options.
4.2.1
Basic Command Interface
The VL-bus interface uses a standard command interface
whose function and timing are described in CPU data books.
The primary signal interface involves three cycle-type signals:
M/IO#, W/R#, and D/C#; and a pair of cycle start and completion handshaking signals, ADS# and RDY#. Both 386 and
486 interfaces use these signals.
4.2.1.1
Cycle Signals
The CPU interface provides three status signals to indicate
cycle type for the current cycle: M/IO#, to distinguish memory
accesses from I/O access; W/R#, to distinguish writes from
reads; and D/C#, to distinguish data accesses from code
fetches. All of these signals are valid for a guaranteed
amount of time before the CPU or VL-bus master sets its
ADS# signal active. The rising edge of ADS# (when it goes
from active to inactive) indicates that the CA bus address and
the cycle type signals are valid.
Normally, the 82C465MV samples the state of ADS# according to the CPUCLK signal. All of the cycle type signals are
guaranteed by the CPU manufacturer to be valid for a certain
amount of time from a CPUCLK clock edge when ADS# is
active. Therefore, if the 82C465MV logic sees ADS# low
within this “window” it can determine the cycle type without
actually waiting for the rising edge of ADS#. This logic
improves performance dramatically, since a full CPUCLK is
saved on each CPU cycle.
The 486 interface allows for read bursts (multiple high-speed
sequential read cycles) and therefore provides BRDY# and
BLAST# to control burst read cycles.
For the 486 interface, and for certain hybrid 386/486 interfaces as well, signals KEN#, AHOLD, EADS#, and FLUSH#
are provided for cache control.
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However, at high bus speeds (40-50MHz), the ADS# signal
may not always be synchronized as well with the CPUCLK
signal and only after the rising edge of ADS# will the controller logic be guaranteed to capture the correct cycle being signaled. Therefore, the 82C465MV logic includes a control bit
that allows the selection of whether the cycle type will sampled when ADS# is seen low to improve performance, or
whether ADS# will be latched and the cycle sampled on the
next clock edge to guarantee functionality. SYSCFG D1h[6]
selects this functionality (see Table 4-2) and defaults to latching ADS# so that booting at any speed will be possible. The
BIOS should check for slower speed CPUs and clear this bit
if possible for better performance.
4.2.2
Local Device Interface
The 82C465MV allows VL-bus peripheral devices to share
the local bus with the CPU and the numeric coprocessor. The
performance of these devices, which may include the video
controller, LAN adapters, and other PC/AT controllers, will
dramatically increase when allowed to operate in this high
speed environment. These devices are responsible for their
own address and bus cycle decoding and must operate properly at the elevated frequencies required for the local CPU
bus.
Table 4-2
4.2.2.1
LDEV# Operation
The LDEV# input signal to the 82C465MV indicates whether
a local-bus device will be responding to the current cycle. If
the access is not in the local DRAM range and the
82C465MV samples LDEV# active at the end of the first T2
clock cycle, it will allow the responding device to assume
responsibility for terminating the current local cycle. Otherwise, the 82C465MV passes on the cycle to the ISA bus. If
the access is in the local DRAM range, the 82C465MV logic
ignores LDEV#.
Normally, if a local bus device asserts LDEV# and then
removes it without responding with its LRDY#, the
82C465MV will await a response forever and the system will
hang. SYSCFG ADh[7], as shown in Table 4-3, is provided to
avoid this situation.
Ignore Unfinished LDEV# Cycles SYSCFG ADh[7] - allows
LDEV# to be asserted to claim a cycle for the local bus, but
then allows the cycle to be given up if no LRDY# (RDYI# or
RDY#) is generated. When SYSCFG ADh[7] = 0 and LDEV#
is sampled asserted, the logic gives up the cycle to the local
bus and awaits RDY# from the local device. If the local
device never actually responds, the system will hang. If
SYSCFG ADh[7] = 1 and LDEV# is sampled asserted, the
logic gives up the cycle to the local bus and awaits RDY# as
usual. However, if no RDY# is returned before LDEV# goes
inactive, the chipset logic takes back ownership of the cycle
and forwards it to the ISA bus.
ADS# Sampling Control
7
6
5
SYSCFG D1h
4
3
2
1
L2 Cache Control Register 2
0
Default = 41h
ADS# sampling:
0 = Sample on
ADS# low
1 = Latch
ADS#, sample on next
cycle
Table 4-3
LDEV# Control
7
6
SYSCFG ADh
5
4
3
Feature Control Register 3
2
1
0
Default = 00h
Ignore
unfinished
LDEV# cycles:
0 = Wait
1 = Ignore
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Note that there is no “time-out” when the “ignore unfinished
LDEV# cycles” option is selected. The 82C465MV chip will
wait indefinitely as long as LDEV# remains active and no
RDY# signal is returned. As soon as LDEV# goes inactive
with no RDY# signal yet received, the 82C465MV takes back
control of the cycle.
4.2.2.2
LRDY# Operation
When the local bus device has completed its operation, it
uses the VL-bus local ready signal LRDY# to terminate the
cycle. The LRDY# signal is defined in the VL-bus specification to be driven by a tristate buffer. Therefore, at bus speeds
up to 33MHz, LRDY# can simply be tied directly to the CPU
RDY# input. Above 33MHz, the VL-bus device may not meet
the timing requirements of CPU RDY#. In this case, LRDY#
can be connected to the RDYI# input of the 82C465MV for
re-synchronization to the CPU RDY# signal.
The 82C465MV provides SYSCFG ADh[0] to control whether
the RDYI# input will be buffered to drive the CPU RDY# line
directly, or will be latched and synchronized to the CPU
RDY# input on the next clock. Refer to the Numeric Coprocessor Interface section of this document for information on
this bit.
4.2.2.3
VL-Bus Arbitration Logic
The 82C465MV provides arbitration among the various system resources: CPU, DMA, VL-bus masters, ISA bus masters, and refresh logic.
Table 4-4
7
SYSCFG ADh
During cycles where the CPU is not the system master, the
82C465MV asserts HOLD to the CPU. The CPU responds to
an active HOLD signal by generating HLDA after completing
its current bus cycle and placing most of its output and I/O
pins in a high impedance state. After the CPU relinquishes
the bus, the 82C465MV responds by issuing the appropriate
signal.
• For a refresh timer request, the 82C465MV logic runs a
DRAM refresh cycle and ISA bus refresh cycle.
• For a DMA request or master request initiated by assertion
of one of the DRQ lines, the chip provides the corresponding DACK# signal along with IOR#+MEMW# or
IOWR#+MEMR#.
• For a VL-bus master request indicated on LREQ#, the chip
responds with LGNT#.
The ISA bus controller in the 82C465MV arbitrates between
hold and refresh requests, deciding which will own the bus
once the CPU relinquishes control with the HLDA signal. The
arbitration between refresh and DMA/masters is based on a
FIFO priority. However, a refresh request (RFSH#) will be
internally latched and serviced immediately after the
DMA/master finishes its request if queued behind HOLD.
HOLD must remain active to be serviced if the refresh
request comes first.
RDY# Synchronization
6
5
4
3
Feature Control Register 3
2
1
0
Default = 00h
RDYI# input:
0 = Synchronized to
RDY#
1 = Direct
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4.2.3
VL-Bus Masters
The 82C465MV optionally provides one set of LREQ# and
LGNT# signals to support bus masters. These signals are
used in conjunction with devices such as the OPTi 82C832
VL-PCI Bridge chip that must gain ownership of the VL bus
for certain bus agents.
Support for a single bus master request is adequate for most
applications, since the PCI subsystem can often combine
multiple master requests into the single request line available. Consequently, this solution will not limit the PCI options
if the 82C832 solution is chosen.
The bus master support actually is provided on the VL-bus.
Therefore, any VL-bus master can make use of these signals.
4.2.3.1
Hardware Considerations
Enabling bus master support requires that pin 80, the dedicated DACK2# signal, be replaced by LGNT#, and that pin
174 (PIO0) be replaced by the LREQ# input from the VL-bus.
DACK2# is always available on the DACK decoder (decoding
DACKMUX0-2), so only PIO0 is lost and no additional TTL is
required.
4.2.3.2
Programming
The VL-bus master support feature is enabled by setting
SYSCFG A0h[5] = 1 (see Table 4-5). DACK2# is always
Table 4-5
available on DACK decoder, regardless of the setting of this
bit.
4.2.4
Data Bus Conversion/Data Path Logic
The 82C465MV performs data bus conversion when the CPU
accesses 8- or 16-bit devices through 16- or 32-bit instructions. It also handles DMA and master cycles that transfer
data between local DRAM or cache memory and locations on
the ISA or VL-bus.
4.2.4.1
CPU Data Bus Multiplex Option
When the system design includes an external writeback
cache, the signal pins normally used for the upper 16 lines of
the CPU data bus are converted to cache tag data and control signals. Consequently, the 82C465MV must use an external 16-bit buffer to move data between CD[31:16] and
SD[15:0] for ISA bus operations and internal register
accesses.
This external buffer is controlled by three signals: SDENH#,
SDENL#, and SDIR, that control a 16-bit '245-type buffer. If
the CPU interface operates at 3.3V and the ISA bus at 5.0V,
this buffer must translate the level. The control signals mentioned will always be at the level of the VCC supplied to ISA
I/O pads, which is appropriate for all standard designs.
Also when the external writeback cache is used, the XDIR
signal is redefined and must be derived from IOW#, MEMR#,
and the chip selects of all devices on the XD bus.
Bus Master Enabling
7
6
5
SYSCFG A0h
4
3
Feature Control Register 1
2
1
0
Default = 00h
Enable local
bus master
support:
0 = PIO0 and
DACK2#
1 = LREQ# and
LGNT#
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4.2.5
Numeric Coprocessor Interface
The 82C465MV monitors FERR# and NPBUSY# to provide
support for the 80387 coprocessor (NPX) when the chipset is
strapped for an 80386-type interface. There are no provisions
for an external coprocessor when a 486SX CPU is used.
4.2.5.1
Hardware Considerations
The NPX asserts FERR# during a power-on reset to indicate
its presence. If the 82C465MV logic senses FERR# low when
it asserts NPURST, it automatically generates LDEV# to itself
whenever CA31 is high for a cycle. This feature allows the
coprocessor to generate its own RDY# to the CPU. The automatic co-processor recognition feature can be disabled
through SYSCFG ADh[1].
The 82C465MV treats any access to the NPX address space
as an AT cycle if the NPX is not installed, and generates its
own RDY# to the CPU at the end of the AT cycle. Note that a
VL-bus device can also respond with LDEV# to claim the
cycle, and is responsible for generating LRDY# (RDY#) to the
CPU.
When the NPX has completed its cycle, the NPX RDY# signal terminates the cycle by asserting:
1.
CPU RDY# with a fast open-collector driver controlled by
the NPX RDY# signal (not generally a practical option to
implement)
2.
RDYI# to the 82C465MV, which latches it and drives its
RDY# output to the CPU low on the next clock (SYSCFG
ADh[0] = 0)
3.
RDYI# to the 82C465MV, which drives its RDY# signal
to the CPU low on the same clock (SYSCFG ADh[0] =
1).
The coprocessor asserts NPBUSY# while executing a floating-point calculation and asserts RDYI# to the 82C465MV
when it is finished. If NPBUSY# is active and a co-processor
error occurs (co-processor asserts FERR#), the 82C465MV
latches NPBUSY# and generates IRQ13. Latched BUSY#
and IRQ13 is cleared by a write command to I/O Port 0F0h.
Table 4-6
7
0 = Wait
1 = Ignore
4.2.5.2
Programming
The RDYI# pin option must first be selected by strapping as
noted above. Once RDYI# is available, it can function either
as a direct input to the CPU RDY# signal or as a latched,
delayed input, according to the setting of SYSCFG ADh[0].
SYSCFG ADh[1] provides a means for overriding automatic
co-processor detection if desired. The register at SYSCFG
ADh is described next and shown in Table 4-6.
4.2.6
Special CPU Interface Support
Certain CPUs operate internally with '486-type logic, yet
present a '386 or '386/'486 hybrid signal interface. The IBM
“Blue Lightning” processor uses this type of interface. The
82C465MV logic provides special features to handle mixed
interfaces.
4.2.6.1
Ability to Cut CPU Power During Suspend
The 82C465MV will condition its outputs during suspend
according to whether the connected CPU can be placed in a
low-power mode during suspend, or can simply be powered
down completely. The affected signals are listed in Section
3.6 "Pin Signal Characteristics". The 82C465MV reset logic
generates a CPURST on exiting from suspend mode when
this option is selected.
The option of complete CPU power-down on Suspend is
selected by writing bit ADh[5] = 1.
4.2.6.2
Programmable A20M# Functionality
Strapping the 82C465MV to provide a '386 interface automatically switches the function of pin 130 from A20M# to GA20.
However, certain hybrid interface CPUs require a 386 interface with an A20M# input. The 82C465MV is programmable
to force A20M# operation regardless of the interface
selected. This option is enabled by writing SYSCFG ADh[4] =
1.
Special CPU Feature Programming Bits
6
5
SYSCFG ADh
Ignore
unfinished
LDEV# cycles:
The RDYI# input is a strap-selectable option on the
82C465MV interface. Refer to the Section 3.3 "StrapSelected Interface Options" for details on enabling the RDYI#
input.
4
3
2
1
Feature Control Register 3
Generate
CPURST
immediately?
0 = No
1 = Yes
(MVA)
CPU power
state in
Suspend:
0 = Powered
1 = 0 volt
Pin 130 in
386 mode:
0 = GA20
1 = A20M#
SRESET
operation:
0 = Normal
1 = Toggle on
Resume
0
Default = 00h
Pin 80 in
386 mode:
0 = NPINT
1 = DACK2#
Coprocessor
recognition:
0 = Enable
1 = Override
RDYI# input:
0 = Synchronized to
RDY#
1 = Direct
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4.2.6.3
Programmable CPU RESET Functionality
Programmable reset functionality allows a CPU powereddown during suspend to restart operation on resume. The
82C465MV provides both soft and hard resets on SRESET
whenever it is strapped for '386 interface operation. The
RESET input to hybrid-interface CPUs must be connected to
the 82C465MV SRESET signal for proper operation.
This reset option is enabled by writing SYSCFG ADh[3] = 1
before the first software-generated reset occurs. Operation is
then as follows. The CPU has its power cut after entering
Suspend mode (using the PPWR0 power control latch signal
to control the power MOSFET for the CPU). On Resume, the
PPWR0 line will turn on the CPU first. Then after the programmable delay associated with PPWR0, the SRESET line
will be driven high to reset the CPU.
Note that this arrangement provides the VL-bus with an independent reset signal, CPURST, so that VL-bus peripheral
devices need not be inadvertently reset on a quick resume
cycle.
The only important consideration in this type of arrangement
is the software scheme. The SMM code that initiates the suspend operation must save the complete CPU context and be
capable of restoring it without lapsing into a complete system
reboot.
4.2.6.4
Programmable DACK2# Functionality
Strapping the 82C465MV to provide a '386 interface automatically switches the function of pin 80 from DACK2# to NPINT,
requiring system designs to use DACK2# from the DACK
decoder. However, since NPINT serves no purpose for most
systems, many designers would prefer to keep the dedicated
DACK2# signal. The 82C465MV is programmable to force
DACK2# operation regardless of the interface selected. This
option is enabled by writing SYSCFG ADh[2] = 1. Note that
this bit setting is ignored if pin 80 is used for LGNT#
(SYSCFG A0h[5] = 1); the LGNT# function always takes priority.
4.2.6.5
Cyrix Linear Burst Mode Support
Next-generation Cyrix M1sc CPUs provide a performance
improvement through an optional “linear wrap mode” burst.
The 82C465MVB part supports this feature through SYSCFG
3Fh[7] (see Table 4-7). Since the Cyrix CPU defaults to an
Table 4-7
Intel-compatible mode at power-up, the system can boot
without problems.
4.2.6.6
Programmable Exclusion of Coprocessor
Recognition
The 82C465MV automatically recognizes the presence of an
external co-processor in a '386-type system by looking for an
active FERR# line at reset time. If FERR# is sampled low at
reset, any I/O cycle with A31 high automatically gets forwarded to the VL-bus and the 82C465MV logic will not provide RDY#.
For special designs in which this arrangement conflicts with
other devices mapped in high I/O space, the 82C465MV
local-bus logic can be programmed to always pass these
cycles through to the ISA bus and generate RDY# to the
CPU. This feature is enabled by writing SYSCFG ADh[1] = 1.
4.2.6.7
Programmable RDYI# Functionality
The 82C465MV normally takes the RDYI# input, synchronizes it through a flip-flop, and combines it with other sources
to generate the open-collector RDY# signal to the CPU. This
feature is provided for devices that cannot meet CPU RDY#
setup times or cannot tristate their RDY# output after driving
it inactive. The process effectively inserts a wait state and
may reduce performance. Timing analysis indicates that the
co-processor RDY# signal, for example, can be combined
with CPU RDY# through a fast tristate buffer and will meet
the CPU RDY# setup requirement in many systems.
Therefore, the 82C465MV is programmable to inhibit RDYI#
synchronization and simply pass RDYI# through a tristate
buffer to combine it with the existing RDY# output line to the
CPU. This feature can be used in conjunction with an external co-processor that provides a direct-drive coprocessor
RDY# signal, such that when the 82C465MV recognizes a
co-processor cycle, it will route the RDYI# signal directly to
CPU RDY# and improve co-processor performance. This
option is enabled by writing SYSCFG ADh[0] = 1. This bit has
no function unless SBHE# is pulled low at system reset time
to enable the RDYI# pin function.
Note that the co-processor RDYO# signal can also be tristate
buffered externally so that the RDYI#/CA25 input can be
used in its CA25 capacity for 64MB on-board DRAM support.
Burst Mode Setting
7
6
SYSCFG 3Fh
5
4
3
Misc. Control Register
2
1
0
Default = 00h
CPU burst
mode:
0 = Intel
1 = Cyrix linear
(MVB)
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4.3
System Functions
The 82C465MV handles clock generation, reset logic, and
other basic system logic functions as described in the following sections.
4.3.1
Reset Logic
There are several signals involved in the 82C465MV system
reset logic scheme.
4.3.1.1
RST1#
A low signal on input RST1# causes a hardware reset. The
system must generate RST1# from the reset switch or from
the power module signal representing “power good”. This
reset signal forces the system to begin execution in a known
state. When RST1# is sensed active, the 82C465MV initiates
a general reset cycle that lasts for 128 CPU clock cycles on
all reset outputs.
4.3.1.2
RST4#
The RST4# output provides a peripheral reset signal that can
be used to reset local devices directly, and can be inverted to
provide RSTDRV to the ISA bus.
4.3.1.3
CPURST and SRESET
The CPURST output provides a hard reset signal to the CPU,
usually through its RESET input.
Table 4-8
7
SYSCFG 40h
The SRESET output provides a soft reset signal to CPUs that
can accommodate this function. Software generates reset by
writing to the AT- or PS/2-compatible command ports. A soft
reset is much faster (from the CPU perspective) than a hard
reset. The SRESET signal duration is the same as that of
CPURST. On the 82C465MV, SRESET also goes active during hardware resets in '386 interface mode.
Refer also to Section 4.2.6 "Special CPU Interface Support"
for information on how the CPURST and SRESET signals
can be controlled during resume sequences.
4.3.1.4
Resume Reset (RSMRST#) Function
The RSMRST# output supplies a reset signal only when
resuming from Suspend mode that is used to restart devices
that were powered down on entering Suspend mode.
RSMRST# is provided on PPWR10 of the power control
latch.
RSMRST# is optionally available on pin 185 (EPMI2) as well.
Pin 148 strapping works in conjunction with SYSCFG 40h[0]
(seeTable 4-8) to determine the reset lines that toggle upon
resuming from suspend mode. Refer to Section 3.3 "StrapSelected Interface Options" for information on redefining pin
185 as RSMRST#. See Figure 4-1 for an illustration of the
options.
Resume Reset Control
6
5
4
3
2
1
0
PMU Control Register 1Default = 00h
RSMRST#
select:
0 = Disable
1 = Enable
See Figure 4-1
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Figure 4-1
Resume Reset Function
Power-On
Case 1: RST4#
Resume
RST4#
SA1 (Pin 148) pulled high
SYSCFG 40h[0] = 0
EPMI2/RSMRST#
PPWR10/RSMRST#
Case 2: RST4#
SA1 (Pin 148) pulled high
SYSCFG 40h[0] = 1
RST4#
EPMI2/RSMRST#
PPWR10/RSMRST#
Case 3:* RST4#
SA1 (Pin 148) pulled low
SYSCFG 40h[0] = 0
Case 4:* RST4#
SA1 (Pin 148) pulled low
SYSCFG 40h[0] = 1
RST4#
PPWR10/RSMRST#
RST4#
PPWR10/RSMRST#
* For Cases 3 and 4, SA1 (Pin 148) pulled low causes EPMI2/RSMRST# to have the function EPMI2 and is an input.
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4.3.1.5
Rapid RESET Generation
The 82C465MV will monitor commands to I/O Ports 060h and
064h, and intercept certain commands to Port 060h, so that it
can rapidly emulate the keyboard controller generation of the
software reset signal. The decode sequence is softwaretransparent and requires no BIOS modifications to function.
The 82C465MV logic rapidly generates a fast CPU “warm
reset” function when it detects a write of value FEh to Port
064h, or a value of 1 to bit 0 of I/O Port 092h.
Note:
Fast reset (Ports 092h and 064h emulation) is generated on SRESET for the Intel SL Enhanced or the
Cyrix Cx486S/S2 CPUs (CCS0#, pin 23 and CCS1#,
pin 13, both strapped high) and on CPURST for other
CPUs.
Port 092h is implemented in the logic according to the register layout shown in Table 4-9.
Fast Reset Control (Port 092h or 064h) SYSCFG 30h[1] Setting SYSCFG 30h[1] = 0 requires a Halt instruction before
Table 4-9
7
generation of CPURST (SRESET if Intel SL Enhanced CPU).
Setting SYSCFG 30h[1] = 1 allows the reset to occur immediately without a Halt instruction.
4.3.1.6
Fast Reset Handling in SMM
In normal operating mode, fast reset I/O commands to the
keyboard controller Ports 060h and 064h are intercepted and
handled by the 82C465MV logic. The keyboard control never
receives KBDCS# and therefore does not know the fast reset
status. In SMM, however, the 82C465MV logic does not
inhibit KBDCS#. Therefore, a read of the keyboard controller
ports to determine fast reset status will return the invalid status contained in the keyboard controller. Therefore, Port 092h
should always be used to determine the fast reset setting.
Port 092h returns the current setting of both of the fast reset
sources (Port 092h and Port 060/064h).
Note that generation of SRESET during SMM is prohibited on
Intel and some other processors. Writing SYSCFG A0h[2] = 1
(see Table 4-11) inhibits generation of SRESET during SMM.
System Control Port A (PS/2 Compatibility Port)
6
5
4
Port 092h
3
2
1
0
Alternate Fast
Gate A20
(R/W):
Alternate Fast
Reset (R/W):
System Control Port A
Don't care
0 = No action
1 = Set Gate
A20 active
Table 4-10
7
0 = No reset
1 = Set reset
active
Controlling Fast Reset
6
5
SYSCFG 30h
4
3
2
1
Control Register 1
0
Default = 40h
Fast Reset:
0 = Wait for
HLT
1 = Immediately
Table 4-11
7
SYSCFG A0h
Inhibition of SRESET in SMM
6
5
4
3
2
Feature Control Register 1
1
0
Default = 00h
Allow SRESET
in SMM:
0 = Enable
1 = Disable
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82C465MV/MVA/MVB
4.3.2
System Clock Generation
The 82C465MV chipset requires a minimum of three input
clocks. These clocks are used to generate output clocks and
to time internal operations as described below.
4.3.2.1
Input Clocks
OSCCLK. OSCCLK is the main input clock from which CPUCLK, FBCLKOUT, LCLK, and possibly ATCLK are derived.
Its frequency is determined by the CPU as follows.
• If a 2X CPU is being used, OSCCLK is required to be 2X.
Pin 3 (CCS2#) must be sensed high at reset (as described
in Section 3.3 "Strap-Selected Interface Options") to indicate this condition. For example, a 33MHz 486DX, 2X
clock CPU would require a 66MHz input on OSCCLK. The
pin 160 strap option, which indicates whether the input
clock is 1X or 2X, must indicate 2X clock (not pulled high)
when pin 3 indicates a 2X CPU (pulled high).
• If a 1X CPU is being used, OSCCLK can be either a 1X or
a 2X clock. Pin 3 must be sensed low at reset (pin 3 has
an internal pull-down resistor at reset time so no external
resistor is needed) to indicate a 1X CPU. With pin 3 low,
OSCCLK can be 1X or 2X as selected by pin 160.
- If pin 160 is sensed high at reset time, OSCCLK is 1X.
Pin 160 must be pulled up by a 10KΩ resistor if a 1X
external clock is provided.
- If pin 160 is sensed low, OSCCLK is 2X. An internal
pull-down resistor is engaged at reset time on pin 160
so no external strap is needed.
When a 1X CPU is used with a 2X input clock, the 2X clock is
simply divided and the resulting 1X clock is passed on to the
logic as if the 1X clock had been input directly. None of the
internal 82C465MV logic uses the 2X input clock in this configuration. With a 1X CPU, a 1X input clock is recommended
to save power.
Table 4-12
OSC14. The OSC14 clock input (from a 14.31818MHz
source) is used primarily for the system timer to retain ISA
compatibility. Most systems will also buffer the source of this
clock and pass it on to the ISA bus as the OSC14 signal to
expansion devices. No synchronization to other system
clocks is required.
The 82C465MV configuration SYSCFG 43h[3:0] can select
the OSC14 signal (or other clocks) as the clock source for
timing ISA bus cycles. The selection provides OSC14 divided
by two for an effective AT clock rate of 7.2MHz as a close
approximation of the 8MHz bus speed of the original ISA bus.
The KBCLK and KBCLK2 signals are derived from OSC14.
Their use is described in the section below.
ATCLKIN. The ATCLKIN option is selected through SYSCFG
A0h[4]. If selected, the desired base clock is input on pin 172
(PIO2). This clock allows the ISA bus clocking to be derived
from any external input frequency. For example, if 8.0MHz
ISA bus operation is desired, ATCLKIN must be any multiple
of 8MHz. 24MHz is often available and is commonly used for
this function.
SQWIN. The SQWIN signal should always be running, even
in Suspend mode. The clock input to SQWIN is used to:
• Time periodic DRAM refresh requests, both in active mode
and, if enabled, in suspend mode
• Decrement the system activity counters (SQWIN is divided
by program-selected values first)
• Control the sample rate of certain power management
input pins
• To generate the KBCLK and KBCLK2 multiplexer clocks
when no 14MHz source is available.
The SQWIN clock input can be 32KHz or 128KHz as selected
by SYSCFG 40h[3].
ATCLKIN Enabling and SQWIN frequency Bits
7
6
SYSCFG A0h
5
4
3
Feature Control Register 1
2
1
0
Default = 00h
Pin 172
function:
0 = PIO2 (or
CPUSPD)
1 = ATCLKIN
SYSCFG 40h
PMU Control Register 1Default = 00h
SQWIN
frequency:
0 = 32KHz
1 = 128KHz
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4.3.2.2
Output Clocks
The 82C465MV chipset provides six clock outputs. It can
control power consumption by adjusting many of these output
clock frequencies dynamically as demand changes.
FBCLKOUT and CPUCLK. The clock input OSCCLK is used
to generate signals FBCLKOUT and CPUCLK. CPUCLK is
2X for a 2X CPU and 1X for a 1X CPU. FBCLKOUT is always
1X.
CPUCLK may be divided internally using programmable
divide rates to provide power control of the CPU and the
82C465MV chipset. Whenever CPUCLK is divided, FBCLKOUT is divided as well to maintain proper signal synchronization. The two clocks can be divided to achieve a slower fullspeed clock and save system power. They can also be automatically slowed down (no software intervention required)
during periods of low activity by the hardware Doze mode
feature described in this document.
• FBCLKOUT is the system clock and is fed back into pin
FBCLKIN to provide a synchronized clock for most of the
82C465MV internal circuitry.
• CPUCLK is the clock to the CPU. In addition to being able
to divide this clock, the logic can stop CPUCLK completely
(known as the stop-clock feature) by writing a register bit.
It will be restarted automatically when the 82C465MV logic
detects an interrupt event such as IRQ, SMI, or EPMI.
Note that FBCLKOUT is not stopped when CPUCLK is
stopped.
Clock Phase. Both FBCLKOUT and CPUCLK must be kept
in close phase alignment with each other; otherwise, the
82C465MV cycle controller may not sample the CPU control
lines at the appropriate time. Clock phase alignment is
affected primarily by board layout and CPU type. The provision for an external feedback clock (FBCLKOUT is fed back
to FBCLKIN) allows any skew to be compensated for exact
Table 4-13
7
SYSCFG 43h
phase alignment. Usually, a series resistor or small inductor
in series with either the CPU clock or the feedback clock is
sufficient to realign the clocks. However, for certain CPUs
and board layouts this correction is not sufficient and an
external delay must be introduced.
The 82C465MV logic allows an internal gate delay to be programmed on either the CPU clock line or the feedback clock
line through strapping options. This delay provides a coarse
adjustment of clock skew; fine adjustment can then be completed using discrete components as described above.
• To delay FBCLKOUT by approximately 2ns:
Pull pin 77 high at reset (can be strapped permanently with
10KΩ to ISA bus VCC)
• To delay CPUCLK by approximately 2ns:
Pull pin 78 low at reset (can be strapped permanently with
10KΩ to ground).
Both straps can be used, but tend to cancel each other out.
External resistors are not required to disable the delays, as
internal resistors are activated on pins 77 and 78 at reset.
Designs should always include both strap options, even if
one or both are later deemed unnecessary.
LCLK. LCLK can be used to provide a 1X clock for the local
bus. Normally, FBCLKOUT is used to provide the local bus
clock, but LCLK can be used if FBCLKOUT is too heavily
loaded. LCLK is always a 1X clock, regardless of whether
CPUCLK is 1X or 2X. However, the LCLK pin is redefined for
L2 cache operation, in which case FBCLKOUT must be used.
ATCLK. The ATCLK is used for the ISA bus clock. It is
derived by dividing one of three sources: FBCLKIN, OSC14,
or ATCLKIN. The source clock and divisor are selected
through SYSCFG 43h[3:0] (refer to Table 4-13). If ATCLKIN
is selected, a suitable clock must be provided on PIO2 and
SYSCFG A0h[4] must be set to 1.
ATCLK Rate Selection
6
5
4
3
2
1
0
PMU Control Register 4
ATCLK
generator
source:
0 = FBCLKIN
1 = ATCLKIN
w/SYSCFG
A0h[4] = 1
Default = 00h
ATCLK rate selections:
000 = /8
001 = /6
010 = /4
011 = /3
100 = 7.2 MHz
101 = /2
110 = /1 (/2 if SYSCFG43h[3] = 0)
111 = Stop
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To avoid the incompatibilities introduced because OSCCLK
can be either 1X or 2X, the clock divisors are based on double the FBCLKIN clock. For example, whether OSCCLK is a
2X 66MHz clock or a 1X 33MHz, FBCLKIN is 33MHz and the
ISA clock divisors are based on double that value. Therefore,
selecting FBCLKIN/8 would result in an 8.33MHz ISA clock in
this case. This rule holds true in all cases except for the
divide-by-1 setting, which can only select the actual OSCCLK
clock input. For example, using a 2X 66MHz OSCCLK, the
divide-by-1 ISA clock is 66MHz; using a 1X 33MHz OSCCLK,
the divide-by-1 ISA clock is 33MHz.
Note to 82C463MV Programmers: PMU Control Register 4
(SYSCFG 43h) changes slightly from its 82C463MV implementation, providing additional ISA clock divisor selections
and a new ISA clock source option. These features are pro-
Table 4-14
vided using reserved bits and selections, so that backward
compatibility with 82C463MV software is maintained.
Table 4-14 indicates the appropriate ATCLK divisor settings
for common input clock rates.
ATCLK can automatically be stopped if there is no AT bus
activity through SYSCFG 5Eh[2:1], as shown in Table 4-15.
KBCLK and KBCLK2. The clock output KBCLK is provided
for the keyboard controller. KBCLK is also used along with
KBCLK2 (KBCLK divided by 2) to provide clocks for multiplexing interrupt and DMA requests. KBCLK is 7.2MHz, and
KBCLK2 is 3.6MHz. When connected as the select inputs to
74153 multiplexers, they select each of the four multiplexed
inputs sequentially once every 280ns.
Recommended Divisor Settings for Various Input Clock Frequencies
FBCLKIN
frequency
Doubled frequency
used for divisor
calculation
/3
12.5MHz
25MHz
8.1MHz
16MHz
33MHz
20MHz
40MHz
6.6MHz
25MHz
50MHz
8.3MHz
33MHz
66MHz
8.25MHz
40MHz
80MHz
10MHz *
50MHz
100MHz
12.5MHz *
/4
/6
/8
8MHz
* Use 7.2MHz setting if these speeds are too fast for AT bus operations.
Table 4-15
AT Bus Clock Stretch Controls
7
6
SYSCFG 5Eh
5
4
3
2
1
Clock Stretch Register
0
Default = 00h
ATCLK when
not in cycle:
AT clock
stretch:
0 = Runs
1 = Stopped
0 = Async
1 = Sync
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4.3.3
A20M# Generation
The 82C465MV logic provides both AT-compatible and PS/2compatible means of controlling the A20M# signal to the
CPU.
• A20M# goes inactive (high) if either the AT-compatible
port control is set to 1 (by writing D1h to Port 064h followed by setting Port 060h[1] = 1) or the PS/2-compatible
port control is set to 1 (by setting Port 092h[1] = 1).
•
A20M# goes active if both the AT-compatible port control
and the PS/2-compatible port control are cleared to 0.
The A20M# port control of port 092h is shown in Table 4-16.
A write to Port 064h with data D0h will enable the status of
GATEA20 (bit 1 of Port 060h) and the system reset control
(bit 0 of Port 060h) to be readable in normal mode.
Table 4-16
7
4.3.3.1
Rapid A20M# Generation
The 82C465MV will monitor commands to I/O Ports 060h and
064h, and intercept certain commands to Port 060h, so that it
can rapidly emulate the keyboard controller generation of the
A20M# signal. The decode sequence is software-transparent
and requires no BIOS modifications to function.
The fast A20M# generation sequence occurs when the CPU
writes the value D1h to Port 064h, followed by writing the
value 02h to Port 060h. The logic inhibits KBDCS# on both
the Port 064h access and on the following Port 060h access.
Therefore, the 82C465MV logic can quickly switch its own
A20M# line without waiting for the keyboard controller to do
so. The I/O write command and output data still go to the SD
and XD buses in both cases.
System Control Port A (PS/2 Compatibility Port)
6
5
4
Port 092h
3
2
1
0
Alternate Fast
Gate A20
(R/W):
Alternate Fast
Reset (R/W):
System Control Port A
Don't care
0 = No action
1 = Set Gate
A20 active
0 = No reset
1 = Set reset
active
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82C465MV/MVA/MVB
4.3.3.2
Inhibition of Fast A20M# and Fast Reset Generation
Due to a patent awarded against internal duplication of external keyboard controller functionality, system designers may
prefer not to use the 82C465MV fast reset and fast A20M#
2.
generation features. Therefore, the 82C465MVA part provides the means to partially or completely disable this mechanism. Whether a system designer decides to use all, part, or
none of the internal fast generation logic depends on his
interpretation of the patent with regard to the intended system
implementation.
3.
The 82C465MV part blocks KBDCS# generation when it
detects certain data write sequences to Ports 060h and 064h,
and generates the A20M# output or SRESET output as
appropriate. The 82C465MVA logic can inhibit this fast generation logic at three different levels.
1.
The logic permits KBDCS# to pass through regardless of
whether it detects Port 060/064h accesses. The chip
Table 4-17
continues to monitor Port 060/064h accesses and generate A20M# and SRESET.
The logic permits KBDCS# to pass through as above,
but does not monitor Port 060h/064h accesses to generate A20M# and SRESET. Internal Port 092h accesses
can still generate A20M# and SRESET. The signals
must be combined externally with the signals generated
by the keyboard controller.
The logic operates as in item 2 above. In addition, pin
179 is redefined as the KBCRSTIN input for the reset
signal output from the keyboard controller. The logic
combines this control with the Port 092h control as
sources for SRESET. Pin 179 is normally used as
CHCK#, the ISA bus NMI source; this option is lost when
the pin is used as KBCRSTIN.
The register bits required for these options are shown below,
along with a new shadow register for Port 064h writes.
Fast Signal Generation Control Bits
7
6
SYSCFG 79h
5
4
3
2
1
PMU Control Register 11
0
Default = 00h
“Fast” logic functionality level:
00 = Fully functional
01 = Do not inhibit KBDCS#
10 = Also: Disable reset from
060/064h
11 = Also: Redefine pin 179 as
KBCRSTIN
(MVA)
SYSCFG 9Fh
Port 064h Shadow Register
Default = 00h
- Shadows I/O writes to Port 064h bits [7:0], regardless of whether KBDCS# is inhibited. In this way, when an SMI occurs between a Port
064h write and the subsequent write to Port 060h, SMM code can access the keyboard controller as needed and then simply restore the
Port 064h value just before leaving SMM.
(MVA)
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82C465MV/MVA/MVB
4.3.3.3
A20M# Handling in SMM
On entry to SMM, the A20M# signal is forced high. The signal
returns to its prior value on return to normal mode. Writes to
either A20M# control port are blocked while in SMM.
Port 092h can be read at any time, including SMM. However,
the GATEA20 setting cannot be read directly from ports
060/064h while in SMM. Therefore, a read-only bit is provided at SYSCFG A1h[7] to return the A20M# setting at any
time. SYSCFG A1h[7] provides an indication of the Gate A20
setting last made through the normal write sequence at I/O
Port 060/064h.
4.3.3.4
Port 060/064h A20M# Setting Accessibility
On the 82C465MV and 82C465MVA parts, the Port 060/064h
A20M# setting can be read in SMM through SYSCFG A1h[7].
This feature is important to zero-volt Suspend (Suspend to
disk) because SMM code must know the setting of A20M# in
Table 4-18
7
order to restore the value after resuming from a zero-volt
Suspend.
The complementary feature, however, is missing from the MV
and MVA parts: There is no way to restore the Port 060/064h
bit setting from within SMM. Therefore, resume code currently has to restore the A20M# setting from outside SMM,
which is not very clean.
The 82C465MVB redefines SYSCFG A1h[7] to be writable as
well as readable. When written as 0, SYSCFG A1h[7] has no
effect. When written as 1, SYSCFG A1h[7] toggles the current setting of the Port 060/064h A20M# bit. If SMM code
needs to restore A20M# to its original setting, it simply reads
SYSCFG A1h[7] to determine the current setting, then writes
back to SYSCFG A1h with bit 7 set to 1 if it is necessary to
toggle the bit. Software should then re-read SYSCFG A1h[7]
to ensure that the bit has been restored to the desired value.
A20M# Read-Only Bit
6
5
SYSCFG A1h
4
3
2
1
Feature Control Register 2
0
Default = 00h
Port 060/4
Gate A20 (RO):
Table 4-19
7
SYSCFG A1h
A20M# Setting within SMM
6
5
4
3
Feature Control Register 2
2
1
0
Default = 00h
Port 060/4
Gate A20 (RO):
In MVB, Port
060/4 A20M#
bit
Read: Return
current value;
Write: Toggle
A20M# setting
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4.4
DRAM Controller
The 82C465MV uses an advanced memory controller to generate cycles to five banks of symmetrical or asymmetrical
DRAM, manage the on-CPU writeback or write-through
cache (L1), and manage an external writeback cache (L2).
During DRAM read or write cycles, a row address and a column address is required. In most DRAMs, the row address
access time is longer than the column address access time.
Therefore, bus performance can be improved by using pagemode DRAM operation. Memory locations sharing the same
row address are on the same page; therefore, only a new column address is required. In page mode operation, the row
address strobe, RAS# can be kept active and only a new
CAS# needs to be generated, thus reducing memory cycle
time.
Since the CAS# lines are common for all the banks, only one
bank can be kept active at a time. The effectiveness of pagemode operation depends heavily on the page size. A larger
page size increases the chances of a page hit.
4.4.1
DRAM Controller Hardware Options
The standard DRAM controller hardware includes direct control of five banks of DRAM (RAS0#-RAS3#) and up to 12 bits
of DRAM addressing (MA[11:0]). Through relocation of certain signals, certain of these features can be deleted to avoid
using external TTL for external power management input signals. Refer to Section 3.3 "Strap-Selected Interface Options"
for information on the memory interface selection options.
The DRAM controller can also change its decoding according
to the symmetry of the DRAM devices in use. The mapping of
the CPU address (CA) signals to the memory address (MA)
signals is controlled by the following inputs.
• Bank capacity, as set by bits [2:0] and [6:4] of SYSCFG
A8h, A9h, and AAh
• Symmetrical or asymmetrical DRAM selection, as set by
bits [3] and [7] of SYSCFG A8h, A9h, and AAh (ignored for
32MB and 64MB banks)
• Asymmetry selection, as set by bits [4:0] of SYSCFG D3h
(ignored for 32MB and 64MB banks).
The decoding is shown in Tables 4-20, 4-21, and 4-22.
Table 4-20
Symmetrical DRAM Address Decoding
1MB
2MB
4MB
8MB
16MB
32MB
64MB
Memory
Address
Col
Row
Col
Row
Col
Row
Col
Row
Col
Row
Col
Row
Col
Row
MA0
A2
A11
A2
A11
A2
A11
A2
A11
A2
A11
A2
A11
A2
A11
MA1
A3
A12
A3
A12
A3
A12
A3
A12
A3
A12
A3
A12
A3
A12
MA2
A4
A13
A4
A13
A4
A13
A4
A13
A4
A13
A4
A13
A4
A13
MA3
A5
A14
A5
A14
A5
A14
A5
A14
A5
A14
A5
A14
A5
A14
MA4
A6
A15
A6
A15
A6
A15
A6
A15
A6
A15
A6
A15
A6
A15
MA5
A7
A16
A7
A16
A7
A16
A7
A16
A7
A16
A7
A16
A7
A16
MA6
A8
A17
A8
A17
A8
A17
A8
A17
A8
A17
A8
A17
A8
A17
MA7
A9
A18
A9
A18
A9
A18
A9
A18
A9
A18
A9
A18
A9
A18
MA8
A10
A19
A10
A19
A10
A19
A10
A19
A10
A19
A10
A19
A10
A19
MA9
A21
A20
A21
A20
A21
A20
A21
A20
A21
A20
A21
A20
A21
A20
MA10
A23
A22
A23
A22
A23
A22
A23
A22
A23
A22
A23
A22
A23
A22
MA11
A25
A24
A25
A24
A25
A24
A25
A24
A25
A24
A25
A24
A25
A24
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Table 4-21
Asymmetrical DRAM Decoding, Asymmetry SYSCFG D3h[4:0] = 0
1MB, 10x8
2MB, 11x8
4MB, 11x9
8MB, 12x9
16MB, 12x10
Memory
Address
Col
Row
Col
Row
Col
Row
Col
Row
Col
Row
MA0
A2
A11
A2
A11
A2
A11
A2
A11
A2
A11
MA1
A3
A12
A3
A12
A3
A12
A3
A12
A3
A12
MA2
A4
A13
A4
A13
A4
A13
A4
A13
A4
A13
MA3
A5
A14
A5
A14
A5
A14
A5
A14
A5
A14
MA4
A6
A15
A6
A15
A6
A15
A6
A15
A6
A15
MA5
A7
A16
A7
A16
A7
A16
A7
A16
A7
A16
MA6
A8
A17
A8
A17
A8
A17
A8
A17
A8
A17
MA7
A9
A18
A9
A18
A9
A18
A9
A18
A9
A18
MA8
A10
A19
A10
A19
A10
A19
A10
A19
A10
A19
MA9
A21
A10
A21
A20
A21
A20
A21
A20
A21
A20
MA10
A23
A22
A23
A10
A23
A21
A23
A22
A23
A22
MA11
A25
A24
A25
A24
A25
A24
A25
A21
A25
A23
Table 4-22
Asymmetrical DRAM Decoding, Asymmetry SYSCFG D3h[4:0] = 1
1MB, 11x7
2MB, 12x7
4MB, 12x8
8MB, 12x9
16MB, 12x10
Memory
Address
Col
Row
Col
Row
Col
Row
Col
Row
Col
Row
MA0
A2
A11
A2
A11
A2
A11
A2
A11
A2
A11
MA1
A3
A12
A3
A12
A3
A12
A3
A12
A3
A12
MA2
A4
A13
A4
A13
A4
A13
A4
A13
A4
A13
MA3
A5
A14
A5
A14
A5
A14
A5
A14
A5
A14
MA4
A6
A15
A6
A15
A6
A15
A6
A15
A6
A15
MA5
A7
A16
A7
A16
A7
A16
A7
A16
A7
A16
MA6
A8
A17
A8
A17
A8
A17
A8
A17
A8
A17
MA7
A9
A18
A9
A18
A9
A18
A9
A18
A9
A18
MA8
A10
A19
A10
A19
A10
A19
A10
A19
A10
A19
MA9
A21
A10
A21
A20
A21
A20
A21
A20
A21
A20
MA10
A23
A9
A23
A10
A23
A21
A23
A22
A23
A22
MA11
A25
A24
A25
A9
A25
A10
A25
A21
A25
A23
Note:
The shaded address lines in Tables 4-21 and 4-22 should not be used for asymmetrical DRAM decoding, however, they
are still output during the memory cycle.
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4.4.2
DRAM Bus Drive Capability
By setting SYSCFG A1h[4] = 1, the drive capability of certain
MA bus signals and DRAM control signals is increased by
approximately 50% (see Table 4-23). Refer to the “AC Characteristics” section of this document for determining whether
this additional drive, at the rated capacitance and speed of
the DRAM load, will eliminate the need for extra bus buffers
on the memory address lines.
4.4.3
Setting Up DRAM Operation
Programming the 82C465MV DRAM controller is a simple
matter of:
1.
Setting SYSCFG A0h[0] = 1 to enable simplified memory
programming.
Table 4-23
2.
Setting SYSCFG 31h[5] according to whether or not parity bit DRAM will be used (not an available option if L2
cache is part of design).
3.
Writing the size and arrangement of each bank to its corresponding register at SYSCFG A8h-AAh.
4.
Setting the asymmetry selection for that bank in the register at SYSCFG D3h if the DRAM is not symmetrical.
5.
Setting the cycle speed in at SYSCFG 35h.
6.
Selecting the desired refresh rate through SYSCFG
67h[6:5].
7.
Enabling DRAM refresh through SYSCFG 57h[7].
The register bits involved in setting up DRAM operation are
shown in Table 4-24.
Heavy-duty Memory Bus Drive Capability Feature
7
6
5
4
SYSCFG A1h
3
2
1
0
Feature Control Register 2
Default = 00h
Heavy-duty
memory bus
drive:
0 = Disable
1 = Enable
Table 4-24
DRAM Setup Registers
7
6
5
4
SYSCFG A0h
3
2
1
0
Feature Control Register 1
Default = 00h
DRAM
mapping:
0 = Disable
1 = Enable
SYSCFG 31h
Control Register 2
Default = 40h
DRAM Bank Select Register 1
Default = 00h
Parity check:
0 = Enable
1 = Disable
SYSCFG A8h
Bank 1 memory size:
Bank 1 type:
0 = Sym
1 = Asym
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
Bank 0 type:
0 = Sym
1 = Asym
Bank 0 memory size:
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
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Table 4-24
7
DRAM Setup Registers (cont.)
6
5
4
SYSCFG A9h
2
1
0
DRAM Bank Select Register 2
Bank 3 memory size:
Bank 3 type:
0 = Sym
1 = Asym
3
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
Bank 2 memory size:
Bank 2 type:
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
SYSCFG AAh
Default = 00h
0 = Sym
1 = Asym
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
DRAM Bank Select Register 3
Default = 00h
Bank 4 type:
0 = Sym
1 = Asym
SYSCFG D3h
Bank 4 memory size:
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
Asym. DRAM Select Register
Bank 4 asym
type:
0 = 11x9
1 = 12x8
SYSCFG 35h
Bank 3 asym
type:
0 = 11x9
1 = 12x8
Default = 00h
Bank 2 asym
type:
0 = 11x9
1 = 12x8
DRAM Control Register 2
Standard DRAM read wait states:
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
Bank 1 asym
type:
0 = 11x9
1 = 12x8
Bank 0 asym
type:
0 = 11x9
1 = 12x8
Default = FFh
DRAM write wait states:
00 = 3-2-2-2
00 = No wait states
01 = 4-3-3-3, 1 WS page miss
01 = 1 wait state
10 = 4-3-3-3, 0 WS page miss
10 = 1 wait state
11 = 5-4-4-4
11 = No wait states, RAS# 1/2
clock early (MVB)
SYSCFG 67h
PMU Control Register 9
Default = 00h
PMU Control Register 6
Default = 00h
Refresh rate
Active or Suspend mode:
00 = 15µs (30µs in Suspend if
SYSCFG A1h[6] = 0)
01 = 30µs
10 = 61µs
11 = 122µs
SYSCFG 57h
Refresh:
0 = Disable
1 = Enable
Note:
Parity checking (SYSCFG 31h[5]) is always disabled if L2 cache option is enabled.
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4.4.3.1
Faster Memory Cycles
On the 82C465MV and 82C465MVA chipsets, 3-2-2-2 burst
reads with zero wait state writes are possible only with 70ns
or better DRAM. On the 82C465MVB part, RAS# can be programmed to come one-half clock early on page miss cycles
to give a wider timing margin and permits the use of 80ns
DRAM in this application. SYSCFG 35h[5:4]=11, formerly a
reserved combination, select this cycle as shown in Table 425.
4.4.3.2
DRAM Mapping Scheme Enable
Setting SYSCFG A0h[0] = 0 provides compatibility with BIOS
code written for the 82C463MV chipset. The proper method
Table 4-25
for 82C465MV designs is to set up the DRAM through
SYSCFG A8h, A9h, and D3h, then set SYSCFG A0h[0] = 1
before attempting to access DRAM.
4.4.3.3
DRAM Control Register 2I - SYSCFG 35h
DRAM Control Register 2 at SYSCFG 35h is not strictly backward compatible with the 82C463MV chipset register due to
changes in the memory controller timing selections. However,
the 82C465MV memory controller will not fail if 82C463MV
programming is used; only slower operation will occur. Refer
to the 82C463MV Data Book for comparison of the SYSCFG
35h bit select functions.
DRAM Early RAS# Control
7
6
5
SYSCFG 35h
4
3
DRAM Control Register 2
2
1
0
Default = FFh
DRAM write wait states:
00 = No wait states
01 = 1 wait state
10 = 1 wait state
11 = No wait states, RAS# 1/2
clock early (MVB)
SYSCFG 3Fh
Misc. Control Register
Default = 00h
Minimum
wait states for
non-L2 cache
systems:
0 = 1 WS
1 = 0 WS
(MVB)
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4.4.4
EDO DRAM Support
The 82C465MVB provides a dramatic performance improvement with the incorporation of EDO DRAM support in its
memory controller. EDO DRAM latches its output data while
its input address changes in order to save an additional clock
on most memory read cycles. The performance of a system
based on EDO DRAM is nearly as high as a system with L2
cache.
EDO DRAM requires special control of the DRAM WE# pin to
extend the data output duration. However, it requires no additional pins. SYSCFG 3Eh[4:0] enable EDO DRAM support
separately for each bank as indicated below. SYSCFG
3Eh[7:6] select the read wait state timing for EDO banks.
Table 4-26
4.4.5
DRAM Cycle Speed
The values typically used for EDO DRAM cycle speed are
shown in Table 4-27.
It is always recommended to perform a complete system timing analysis using the worst-case timing parameters for the
components chosen. The timing recommended below
assumes that FBCLKIN (pin 144) clock timing leads the PCUCLK timing (measured at the CPU). This is easily achieved
by using the CPUCLK delay strap (pin 78) noted in Table 3-2.
FBCLKIN leading CPUCLK by 0-2ns provides optimal timing.
EDO DRAM Selection
7
6
5
4
SYSCFG 3Eh
3
2
1
DRAM Type Select Register
EDO DRAM read wait states:
00 = 3-1-1-1
01 = 3-2-2-2
(MVB)
SYSCFG 35h[7:6] apply only to Standard DRAM. Table 4-26
shows the above mentioned register bits.
10 = 4-2-2-2
11 = Reserved
Bank 4 DRAM:
0 = Standard
1 = EDO
(MVB)
SYSCFG 35h
Bank 3 DRAM:
0 = Standard
1 = EDO
(MVB)
0
Default = 00h
Bank 2 DRAM:
0 = Standard
1 = EDO
(MVB)
DRAM Control Register 2
Bank 1 DRAM:
0 = Standard
1 = EDO
(MVB)
Bank 0 DRAM:
0 = Standard
1 = EDO
(MVB)
Default = FFh
Standard DRAM read wait states:
00 = 3-2-2-2
01 = 4-3-3-3, 1 WS page miss
10 = 4-3-3-3, 0 WS page miss
11 = 5-4-4-4
Table 4-27
Suggested EDO DRAM Cycle Speed Settings
1X CPU Frequency
DRAM Speed
Read Cycle Timing
Write Cycle Timing
20MHz
80ns
3-2-2-2
0 Wait State
25MHz
80ns
3-2-2-2
0 Wait State
33MHz
70ns
3-2-2-2
0 Wait State
33MHz
60ns
3-1-1-1
0 Wait State
40MHz
70ns
3-2-2-2
1 Wait State
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4.4.6
System ROM and Shadow RAM
1.
Select the blocks in the C00000-FFFFFh range whose
access should generate ROMCS#. The ROM Select
Registers shown in Table 4-28 list the possible blocks.
ROMCS# generation implies reads from the XD bus, so
the XDIR signal will direct the ROM data onto the SD
bus. If ROM is on the ISA bus (such as for a video
adapter), the corresponding ROMCS bit for that block
should not be set.
2.
Globally enable loading of the shadow DRAM. The Write
Destination Register (Table 4-29) shows the control
available: SYSCFG 36h[7] to enable writes to DRAM for
all blocks C000-F000h, and SYSCFG 36h[6] for writes to
DRAM in the C000h, D000h, and E000h blocks.
SYSCFG 36h[7] must be set to 1 before SYSCFG 36h[6]
can be set to 1.
Since accesses to local DRAM are much faster than those to
ROM, the 82C465MV provides shadow RAM capability. With
this feature, code from slow devices can be copied to local
DRAM for faster access. All accesses to the specified
EPROM space are redirected to the corresponding DRAM
location.
The 82C465MV supports up to 256K bytes of ROM in the first
1MB of address space. The F000h segment is handled as
one continuous 64K block, while the C000h, D000h and
E000h segments each are divided into four 16K blocks that
can be individually controlled. Segments C000h, E000h and
F000h can be shadowed, cached, or both; segment D000h
can be shadowed but not cached.
The procedure for configuring shadow RAM operating and
loading the shadow RAM is as follows.
Table 4-28
SYSCFG 38h[4:1], 37h[7:4], and 31h[3:0] are set
according to a common scheme, depending on the settings of SYSCFG 36h[7:6], as shown in Table 4-30.
ROM Select Registers
7
6
5
4
SYSCFG 38h
3
2
1
Block Control Register 1
Default = 80h
ROMCS for
CC000:
ROMCS for
C8000:
ROMCS for
C4000:
ROMCS for
C0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
SYSCFG 37h
D/E000 Control Register
ROMCS for
DC000:
ROMCS for
D8000:
ROMCS for
D4000:
ROMCS for
D0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
SYSCFG 31h
Default = 0Fh
Control Register 2
Table 4-29
0
Default = 40h
ROMCS for
EC000:
ROMCS for
E8000:
ROMCS for
E4000:
ROMCS for
E0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
3
2
1
0
Write Destination Registers
7
6
SYSCFG 36h
5
4
Shadow RAM Control Register 3
Default = 10h
C-D-E000
select
destination:
F000
write select
destination:
0 = DRAM
0 = ISA/ROM
1 = ROM
don't care
for F000 if
SYSCFG
32h[7] = 0
1 = DRAM
See Table 4-30
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Table 4-30
Access Control Bit Meanings for
SYSCFG 38h[4:1], 37h[7:4], 31h[3:0]
SYSCFG 36h[7:6]
Setting
00
4.
Again using SYSCFG 36h[7:6], globally disable writes to
the shadow DRAM.
5.
Select the ROM blocks that have been shadowed in
DRAM. The register bits shown in Table 4-31 are used to
select the blocks that have been shadowed. Enabling
F000h reads to come from DRAM (SYSCFG 32h[7]) also
automatically enables write protection for that DRAM
block.
0 = R/W from ISA Bus
0 = Read from ISA bus if not shadowed,
write to DRAM
1 = Read from ROMCS# if not shadowed,
write to DRAM
See SYSCFG 33h[7:0] and 36h[3:0] for
shadowing selection
10
Copy the information to be shadowed from ROM to
DRAM by simply reading from and then writing back to
the same location for each byte of the block to be copied.
The ROM need not be located in the physical BIOS
ROM; it can also be ROM on the ISA bus as selected in
Step 1.
Access Control Bit Selection
1 = Read from ROMCS#; writes disabled
X1
3.
0 = R/W from ISA bus
1 = R/W from ROMCS#
Table 4-31
7
Shadow RAM Control Bits
6
5
SYSCFG 33h
EC000
read select
ROM/RAM:
4
3
2
1
Shadow RAM Control Register 2
E8000
read select
ROM/RAM:
E4000
read select
ROM/RAM:
E0000
read select
ROM/RAM:
DC000
read select
ROM/RAM:
0
Default = 00h
D8000
read select
ROM/RAM:
D4000
read select
ROM/RAM:
D0000
read select
ROM/RAM:
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
SYSCFG 36h
Shadow RAM Control Register 3
CC000
read select
ROM/RAM:
SYSCFG 32h
Default = 10h
C8000
read select
ROM/RAM:
C4000
read select
ROM/RAM:
C0000
read select
ROM/RAM:
0 = ROM
0 = ROM
0 = ROM
0 = ROM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
Shadow RAM Control Register 1
Default = E4h
F0000
access:
0 = DRAM
1 = ROM
Note:
F0000h-FFFFFh access control SYSCFG 32h[7] - This bit serves a dual purpose. Setting SYSCFG 32h[7] = 0 allows
reading from DRAM and write protect (enable shadowing) for the F000h block. Setting SYSCFG 32h[7] = 1 allows reading from ROMCS#, and writing to ROMCS# (if SYSCFG 36h[7] = 1) or to DRAM (if SYSCFG 36h[7] = 0).
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6.
Select the shadowed blocks that should be write protected. The bits used to select the blocks to be write-protected are shown in Table 4-32. While F000h was
automatically write-protected in the previous step, it can
be unprotected (for test purposes only) through
SYSCFG A1h[1].
The 82C465MV logic provides special handling for writeprotected DRAM areas (ROM shadowed in RAM). Normally, shadow RAM selected as cacheable makes the
RAM cacheable in both L1 and L2 cache. However,
selecting shadow RAM areas as write-protected makes
Table 4-32
them cacheable only in L2 cache (if present). This provision prevents loss of cache coherency between L1
cache and external RAM (if a program were to try to
write to write-protected memory that is cached in L1
cache, for example).
7.
Read accesses to BIOS and other ROM code that has
been shadowed will now come from DRAM. Write
accesses will be either blocked if write protection has
been engaged, or will be directed to the ISA bus or to
EPROM otherwise.
Write Protect Registers
7
6
5
SYSCFG 32h
4
3
2
1
Shadow RAM Control Register 1
0
Default = E4h
D000 block
E000 block
shadow control: shadow control:
0 = Writable
1 = Protected
SYSCFG 36h
0 = Writable
1 = Protected
Shadow RAM Control Register 3
Default = 10h
Feature Control Register 2
Default = 00h
C000
write protect:
0 = Writable
1 = Protected
SYSCFG A1h
F000 shadow
test:
0 = Read or
write
1 = Read and
write
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4.5
Cache Control
The 82C465MV manages several levels of cache: L1 writethrough, L1 writeback (if supported by the CPU), and L2
writeback.
4.5.1
Global Enabling of Cacheability
The various levels of cache control must first be enabled individually. Then, setting SYSCFG 35h[1] = 0 globally enables
all individually enabled cache control features. This control bit
is shown in Table 4-33.
Table 4-33
4.5.2
Defining Non Cacheable Blocks
SYSCFG 38h-3Bh are used to define two non-cacheable
blocks. The starting address for these blocks must have the
same granularity as the block size. For example, if a 512Kbyte non-cacheable block is selected, its starting address is a
multiple of 512K bytes; consequently, only address bits of
A[23:19] are significant and A[18:16] are “don't cares”. Table
4-34 shows the valid starting address bits for all block sizes.
The two non-cacheable blocks are defined through the registers shown in Table 4-35.
Global Cache Control Enable
7
6
5
4
SYSCFG 35h
3
2
1
DRAM Control Register 2
0
Default = FFh
Global caching
control:
0 = Enable
1 = Disable
Table 4-34
Size and Valid Start Address Bits of Non-Cacheable Memory Blocks
SYSCFG 38h, and 3Ah
Valid Starting Address Bits
7
6
5
Block Size
A24
A23
A22
A21
A20
A19
A18
A17
A16
0
0
0
64KB
V
V
V
V
V
V
V
V
V
0
0
1
128KB
V
V
V
V
V
V
V
V
X
0
1
0
256KB
V
V
V
V
V
V
V
X
X
0
1
1
1MB
V
V
V
V
V
X
X
X
X
1
X
X
Disabled
Note:
V = Valid Bit; X = “don't care”
Table 4-35
7
Non-Cacheable Block Registers
6
5
SYSCFG 38h
4
3
Block Control Register 1
Non-cacheable block 1 (ncb1) size:
2
1
0
Default = 80h
ncb1 A24
See Table 4-34
SYSCFG 39h
Block Control Register 2
Default = 00h
Block Control Register 3
Default = 80h
- Non-cacheable block 1 start address A[23:16]
SYSCFG 3Ah
Non-cacheable block 2 (ncb2) size:
ncb2 A24
See Table 4-34
SYSCFG 3Bh
Block Control Register 4
Default = 00h
- Non-cacheable block 2 start address A[23:16]
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4.5.2.1
C000, E000, F000h Block Cache Enable
Certain blocks in the option ROM range C0000-FFFFFh can
be made cacheable. The cacheability is effective only if the
ROM in that range has been shadowed in DRAM.
• SYSCFG 35h[0] determines whether the 32KB block from
C0000 to C7FFFh will be cacheable.
Table 4-36
• SYSCFG 35h[2] determines whether the 64KB block from
F0000 to FFFFFh will be cacheable.
• SYSCFG 37h[3:0] determine the 16KB blocks from E0000
to EFFFFh that will be cacheable.
These enable bits are shown in Table 4-36.
C000, E000, F000h Block Cache Enable
7
6
SYSCFG 35h
5
4
3
2
1
DRAM Control Register 2
Default = FFh
F000
64KB block
cacheable?
C000
32KB block
cacheable?
0 = Yes
1 = No
SYSCFG 37h
0 = Yes
1 = No
D/E000 Control Register
EC00
16KB block
cacheable?
0 = Yes
1 = No
0
Default = 0Fh
E800
16KB block
cacheable?
0 = Yes
1 = No
E400
16KB block
cacheable?
0 = Yes
1 = No
E000
16KB block
cacheable?
0 = Yes
1 = No
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4.5.2.2
Cache Control of C000-F000h
The cache controller of the 82C465MVA chip can be used
with either write-through or writeback CPUs, and with or without an external cache. The following subsections describe
the operation of L2 cache in this region.
Introduction
Cacheability of C0000-FFFFFh starts out very simply. First of
all, any ROM in these regions must be shadowed in DRAM;
otherwise the area cannot be cached at either L1 or L2. Second, SYSCFG 35h[1] must be set to 0 to globally enable
caching.
L1 Cache Control
L1 cacheability is interlinked with the 82C463MV-compatible
memory mapping mode of the 82C465MVA chip. SYSCFG
A0h[0] defaults to 0, selecting 82C463MV compatibility at
reset. In this mode, cacheability is available as follows.
• C0000h 32KB block:
- Cacheable in L1 when SYSCFG 35h[0] = 0.
• C8000h 32KB and D0000h 64KB blocks:
- Never cacheable.
• E0000, E4000, E8000, and EC000h 16KB blocks:
- Cacheable in L1 when respective SYSCFG 37h[3:0] =
0.
• F0000 64KB block:
- Cacheable in L1 when SYSCFG 35h[2] = 0.
This programming scheme on the 82C463MV was not very
secure, in that a shadowed region of ROM could be made
cacheable in L1 yet write-protected in DRAM. In the case
where an application program writes to the ROM region (as
Windows® does, for example), the content of L1 cache could
be changed without updating the memory region in DRAM
(which the 82C463MV would write-protect). This situation
would become even more dangerous in the case of a system
with L2 cache, since the DRAM, L2 cache, and L1 cache
could all contain different values for the same memory space.
Therefore, the 82C465 series chip introduced greater protection against this type of programming when not in
82C463MV-compatible mode. When SYSCFG A0h[0] is set
to 1, the 82C465MVA operates according to the new memory
control scheme. This setting automatically introduces an
additional layer of cacheability control, requiring that the
region also be declared read/writable before it becomes
cacheable.
• C0000h 32KB block:
- Cacheable when SYSCFG 35h[0] = 0 and SYSCFG
36h[5] = 0 (C000h writable).
• E0000, E4000, E8000, and EC000h 16KB blocks:
- Cacheable when respective SYSCFG 37h[0:3] = 0 and
SYSCFG 32h[3] = 0 (E000h writable).
• F0000 64KB block:
- Cacheable when SYSCFG 35h[2] = 0 and SYSCFG
A1h[1] = 1 (F000h writable).
This interlock ensures that the CPU cache contents will be
coherent with the DRAM contents (or at least the L2 cache
contents) at all times.
L2 Cache Control
L2 cacheability is not affected by the selection between
82C463MV-compatible memory mapping operation and
82C465MVA new memory mapping. L2 cacheability control
works essentially the same for all regions.
• C0000, C4000, C8000, and CC000h 16KB blocks:
- Cacheable in L2 when respective SYSCFG D2h[3:0]=1,
along with SYSCFG 36h[5] = 0 or on any read cycle.
• D0000, D4000, D8000, and DC000h 16KB blocks:
- Cacheable in L2 when respective SYSCFG D2h[7:4] =
1, along with SYSCFG 32h[4] = 0 or on any read cycle.
• E0000, E4000, E8000, and EC000h 16KB blocks:
- Cacheable in L2 when respective SYSCFG D1h[3:0] =
1, along with SYSCFG 32h[3] = 0 or on any read cycle.
• F0000h 64KB block:
- Cacheable in L2 when SYSCFG 35h[2] = 0, along with
SYSCFG A1h[1] = 1 or on any read cycle.
Note that, as with 82C465MVA L1 cache control, writes to a
region are only cacheable if the region is not write-protected.
However, unlike L1 cache, reads are cacheable in L2 regardless of the write-protect state of the region.
Example
Here is a practical example of the cacheability controls for a
system with L1 writeback and L2 cache. The system is programmed for 82C465MV memory mapping so that the L1
cacheability interlock is in place.
1.
The setup code shadows ROM code in the E0000E7FFFh region, and sets SYSCFG 32h[3] = 1 to writeprotect the region. It also sets SYSCFG D1h[1:0] = 11 to
make the region cacheable in L2, and SYSCFG 37h[0] =
0 to make the region cacheable in L1.
2.
Application code reads the 1KB block starting from
E0000h. The block is write-protected, so it will not be
cached in L1. However, it will be cached in L2.
3.
The application modifies the 1KB block and writes it back
to E0000h. Since the block was never cached in L1,
there is no effect for the CPU. Since the block is writeprotected, the 82C465MVA prevents updating of both
the L2 cache and the system DRAM. So all memory is
still coherent.
If the system had been programmed for 82C463MV-compatible memory mapping mode, the write-protect status of the
block would not have mattered. When the CPU read the
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block, it would have cached it in L1. When the CPU writes the
block, it would have updated the block in L1, but the L2 cache
and the DRAM would have been write-protected. Therefore,
system memory would no longer be coherent. If the CPU
accesses data in that region again, it will not be the same
data that an external master would access (even if the CPU
performed a writeback cycle).
Verifying L2 Cache Operation
The following routine may prove useful in testing whether L2
cache is being read and written properly in an 82C465MVbased system. The procedure can be run from DEBUG commands if desired. Any errors indicate possible timing problems or RAM failures.
1.
2.
Program segments 0:0h through 3000:0h to be noncacheable. Using non-cacheable block 2, this would
involve setting SYSCFG 3Ah[7:5] = 010 (256KB block)
and SYSCFG 3Ah[0] + SYSCFG 3Bh[7:0] = 0 (start
address 0:0). In this way, the debug program and all
DOS routines in low memory will not involve cache.
Branch (A)
7. Enter:
F 9000:0LFFFF 00
to fill L2 with data that is different from the original pattern.
8.
Disable L2 cache by setting SYSCFG D0h[5] = 0.
9.
Enter:
C 9000:0LFFFF 3000:0
The comparison will take place against data in DRAM
only, to determine whether it has been corrupted. Any
mismatches indicate a failure.
Branch (B)
10. Enter:
F 9000:0LFFFF 20 21 22 ... 2F
to fill segment 9000 with a new pattern.
11. Enter:
Enter debug command:
M 5000:0LFFFF 8000:0
F 3000:0LFFFF 00 01 02 ... 0F
to fill all of segment 3000h with a repeating pattern.
3.
Enter commands:
M
M
M
M
4000:0LFFFF
5000:0LFFFF
6000:0LFFFF
7000:0LFFFF
8000:0
8000:0
8000:0
8000:0
to ensure that 9000:0 is not in L2 cache.
4.
12. Enter:
F 3000:0LFFFF 20 21 22 ... 2F
to fill segment 3000 with the same pattern written to segment 9000.
13. Enter:
Enter:
M 3000:0LFFFF 9000:0
to copy the pattern in segment 3000h to 9000h. L2 is
unaffected.
5.
to force segment 9000 to be written back to DRAM
(when the 5000 segment is read in, it has to occupy the
spot where the segment 9000 data resides).
Enter:
C 3000:0LFFFF 9000:0
to see whether the data forced out of L2 cache to segment 9000 in DRAM is still the same pattern originally
entered. Any mismatches indicate a failure.
M 9000:0LFFFF 8000:0
to copy the pattern into L2 as it is being read from segment 9000h.
6.
Enter:
9000:0LFFFF 3000:0
to compare the data written to L2 to the original data pattern in DRAM. Any mismatches indicate a failure.
From this point, there are two branches to the test. Taking
Branch (a) will test whether DRAM is corrupted by new writes
to L2 cache. Taking Branch (b) will test whether “dirty” data in
L2 cache is getting written back to DRAM properly. To implement the test completely, it should go from Step 1 through 9a
the first time, and Step 1 through 10b the second time.
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4.5.2.3
Cache Invalidation Feature
Caching of write-protected DRAM in L1 cache is automatically prevented on the 82C465MVA part, because the chip
can only write-protect the external L2 cache and the DRAM.
A write to on-CPU cache would result in a loss of coherency
between L1 cache and any external memory.
Table 4-37
7
On the 82C465MVB part, SYSCFG 3Fh[2] provides the
option of invalidating the cache line instead (see Table 4-37).
If SYSCFG 3Fh[2] = 1, and shadow RAM is programmed to
be cacheable in L1, a write to a shadow RAM location results
in generation of EADS# and the invalidation of that cache
line. This feature provides better performance. For example,
frequently executed BIOS code shadowed at F000h can be
cached in L1.
Write-Protected DRAM Cache Control
6
5
SYSCFG 3Fh
4
3
2
1
0
Misc. Control Register
Default = 00h
Invalidate L1
cache line on
writes to WP
DRAM:
0 = Disable
1 = Enable
(MVB)
4.5.3
L1 Write-Back Cache Support
The 82C465MV incorporates support for CPUs with a levelone (on-chip) writeback cache such as that found on the
AMD® 5x86 processor, the Cyrix® 5x86 processor, and
some Intel® processors.
4.5.3.1
Hardware Considerations
L1 writeback cache support requires two additional signals,
HITM# and BOFF#. The 82C465MV bus controller manages
L1 cache without requiring dedicated pins by using the following scheme. The logic operates properly only if the
82C465MV registers have been programmed to recognize
and generate L1 cache signals.
• HITM# is combined with the existing D/C# input to the bus
controller. Since D/C# will always be high during a bus
snoop cycle (after EADS# goes active), HITM# can be
combined with D/C#. The D/C# input to the 82C465MV is
a HITM# input for only one cycle, on the second or third
clock after it sees EADS# active.
Because HITM# does not have a dedicated input, it is monitored only during a specific window after EADS# occurs. The
82C465MV looks for HITM# to go active on the second or
third clock edges after EADS#, according to programming;
this provision accounts for the delay introduced by the external gate and ensures that all processors can meet the HITM#
setup requirement of the cache support logic.
Figure 4-2 illustrates the typical circuit used to generate
HITM# and BOFF#.
Figure 4-2
CPU
Generation of HITM# and BOFF#
D/C#
HITM#
82C465MV
D/C#
AHOLD
BOFF#
• BOFF# is generated externally from the AHOLD output
qualified with the HITM# output of the 82C465MV logic.
When the logic sets AHOLD active (high) along with
HITM# inactive (high), BOFF# to the CPU must go low to
request a restart of the current bus cycle.
A feature of the 82C465MVA and MVB chips allows the chips
to generate two L1 writeback signals internally to avoid using
external gates.
• BOFF# is possible on the TAGCS# line if TAGCS# is not
used (no L2 cache)
• HITM# is possible on the FLUSH# line if cache is flushed
by some other means (by software for example).
However, these two signals must always be used together.
When BOFF# is generated internally by the 82C465 chip, its
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source is the AHOLD output and the HITM# signal expected
to be input on the FLUSH# pin.
which is the only time the 82C465MV ever generates
FLUSH#.
If the FLUSH# pin is not used to input HITM#, always use an
external gate to generate BOFF# from the combination of
HITM# and AHOLD.
BOFF# Output Option
Pin 189 (LCLK/TAGCS#) is redefined as BOFF# after reset
under the following conditions:
4.5.3.2
Extra Programmable Pin Options
HITM# and BOFF# signal generation on the 82C465MVA
part can be internal to avoid the requirement for two external
gates. Note that these signals can be defined only if the new
memory control interface has been strap selected on pin 79
at reset.
1.
Pin 79 (DACKMUX0) sensed low at reset, indicating that
the new 82C465MV memory control interface must be
enabled
2.
Pin 146 (SA0) sensed high at reset, indicating that the L2
cache interface is not used.
HITM# Input Option
HITM# can be directly input to the chip on the FLUSH# pin.
Selecting the HITM# option will allow better performance for
CPUs that cannot return HITM# fast enough for sampling on
the second clock after EADS# when the external gate solution (D/C#+HITM#) is used. Note that until the HITM# option
is selected, pin 135 is an output and will drive against the
HITM# signal. However, both signals will be driving high in
their normal state so no harm is done.
Note that the FLUSH# output can be eliminated only when
SMBASE is relocated to A000h/B000h. This relocation eliminates the need for generating FLUSH# on entry to SMM,
Table 4-38
The LCLK function of pin 189 should never be needed on
82C465MV designs, because it is the same 1X clock as
FBCLKOUT. Also, the TAGCS# function of pin 189 for L2
cache should never be needed on designs using L1 writeback cache CPUs. Therefore, the pin changes function to
accommodate the need for BOFF# on L1 writeback CPUs.
If desired, setting SYSCFG D4h[0] = 1 will reassign pin 189
as LCLK even though conditions 1 and 2 above have been
met.
Table 4-38 shows which registers to program for the above
mentioned options.
Pin Options
7
6
SYSCFG D6h
5
4
3
PMU Control Register 10
2
1
0
Default = 00h
HITM# source:
0 = D/C#
1 = Pin 135
(MVA)
SYSCFG D4h
Resistor Control Register 1
Default = 00h
Redefine pin
189:
0 = BOFF#
1 = LCLK
(MVA)
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4.5.3.3
Programming
The L1 cache option must first be preset through setting
SYSCFG A0h[1] = 1. The HITM# sensing is set according to
the CPU used and speed of operation through SYSCFG
D1h[7]. After cacheable ranges have been established as
described in the previous section, the cache operation is then
enabled by writing SYSCFG 35h[1] = 1. Table 4-39 shows
these register bits.
L1 Cache HITM# Sensing SYSCFG D1h[7] - selects the
cycle during which the 82C465MV looks for HITM# after it
sees EADS# low. CPUs that cannot reliably meet the setup
time requirements for HITM# to be returned on the second
clock after EADS# should use the default third-clock setting.
Table 4-39
7
• 0 = Sample HITM# (on D/C# input) on second clock after
sampling EADS# low
• 1 = Sample HITM# on third clock after sampling EADS#
low
4.5.3.4
Burst Write Feature
The 82C465MVA part provides the burst write feature for L1
writeback CPUs. The feature is enabled only when the L1
writeback feature is enabled. On the 82C465MVB part,
SYSCFG 3Fh[4] allows the burst write feature to be enabled
independently for non-L1 writeback CPUs. Regardless of the
setting of SYSCFG 3Fh[4], burst writes are always enabled
when the L1 writeback feature is selected.
L1 Writeback Programming Bits
6
5
SYSCFG A0h
4
3
2
1
Feature Control Register 1
0
Default = 00h
CPU cache
operation
select:
0 = Standard
1 = L1 writeback
SYSCFG D1h
L2 Cache Control Register 2
Default = 41h
L1 cache
HITM# sensing
after EADS#:
0 = 2nd clock
1 = 3rd clock
SYSCFG 35h
DRAM Control Register 2
Default = FFh
Global caching
control:
0 = Enable
1 = Disable
Table 4-40
7
SYSCFG 3Fh
Burst Write Control
6
5
4
3
Misc. Control Register
2
1
0
Default = 00h
CPU burst
write support:
0 = Disable
1 = Enable
(MVB)
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4.5.4
L2 Cache Support
The 82C465MV incorporates support for an L2 (external)
writeback cache. The L2 cache support is optional, and is
engaged when the 82C465MV initialization logic sees SA0
low at hardware reset time. As soon as reset is complete, the
Figure 4-3
logic redefines a large block of pins for L2 cache support. Figure 4-3 illustrates the connection of the L2 cache to the chip.
Table 4-41 lists the “No Cache Support” interface versus the
“L2 Cache Support” interface.
L2 Cache Connection - Two Bank Configuration
SD[15:0]
16245
ISA Bus
SDENH#
SDENL#
SDIR
CD[31:16]
CD[15:0]
OPTi
82C465MV
CA[31:2]
TAG[7:0], DRTY
CCS[3:0]#
TAGCS#, TAGWE#
0 1 2 3
ECA3
ECAWE#
BEOE#
CD[31:0]
CA[17:4]
486 CPU
ECA2
OCAWE#
BOOE#
CD[31:24]
CD[23:16]
CD[15:8]
CD[7:0]
Tag
Bank 1
CD[31:0]
CD[31:24]
CD[23:16]
CD[15:8]
CD[7:0]
Bank 0
64MB or 256MB SRAM
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Table 4-41
L2 Cache Support Signal Correspondence
“L2 Cache Support” Signal
“No Cache
Support” Signal
Impact on System Design
BEOE# (O) - Cache Output Enable, Even
CD25
External buffers required to move CD31:16 data
BOOE# (O) - Cache Output Enable, Odd
CD26
down to SD15:0
ECAWE# (O) - Cache Write Enable, Even
CD27
OCAWE# (O) - Cache Write Enable, Odd
CD28
TAGWE# (O) - Tag RAM write enable
CD29
DRTY (I/O) - Dirty bit to/from tag RAM
CD24
TAG7:0 (I/O) - Tag RAM data bus
CD23:16
ECA2 (O) - Early CA2
CD30
ECA3 (O) - Early CA3
CD31
TAGCS# (O) - Tag RAM chip select
LCLK
LCLK no longer available
SDIR (O) - SD15:0 to CD31:16 buffer dir.
XDIR
XDIR must be derived externally
SDENH# (O) - SD15:8 to CD31:24 buffer en.
KBDCS#
None - combine with DWE#
SDENL# (O) - SD7:0 to CD23:16 buffer en.
RTCD#
None - combine with ROMCS#
CCS0# (O - 3.3V) - Cache chip select 0
STRP0
Memory parity checking is no longer available
CCS1# (O - 3.3V) - Cache chip select 1
STRP1
CCS2# (O - 3.3V) - Cache chip select 2
STRP2
CCS3# (O - 3.3V) - Cache chip select 3
STRP3
4.5.4.1
Performance
The L2 cache implementation is a full-performance scheme.
Because the 82C465MV provides all control signals and the
tag RAM data connections directly, there are no external
buffer or gate delays and no extra clocks required for synchronization.
The integrated CCS0-3# select lines provide an additional
feature. Besides eliminating the need to externally gate W/R#
with each of the BE0-3# lines, these dedicated chip select
lines go active only when the cache is actually being
accessed. Consequently, the cache consumes less power
when not actively being accessed.
4.5.4.2
L2 Cache Operation Details
The integrated cache controller uses a direct-mapped, bankinterleaved scheme to dramatically boost the overall performance of the local memory subsystem by caching writes as
well as reads (writeback mode). Cache memory can be configured as one or two banks, and sizes of 64KB, 128KB, and
256KB are supported. The cache controller operates in nonpipeline mode, with a fixed 16-byte line size (optimized to
match a 486 burst linefill) in order to simplify the motherboard
design without increasing cost or degrading system performance. For 486 systems, the secondary cache operates
independently and in addition to the internal cache of the
CPU.
Cache Bank Interleave
In order to support cache burst cycles at elevated frequencies and still utilize conventional-speed SRAMs, a bank-interleave cache access method is employed. The addresses are
applied to the cache memory one cycle earlier, while cache
output enable signals control even/odd bank selection and
enable cache RAM data to the CPU data bus. Since the output enable time is about one-half of the address access time,
the 82C465MV can achieve a high performance cache burst
mode without using more expensive high-speed SRAMs.
The 82C465MV chip supports one or two cache banks. Two
cache banks are required to interleave and optimally realize
the performance advantages of this cache scheme. A selection of 128KB is a single-bank cache, while 64KB and 256KB
cache sizes are two-bank configurations. When using a twobank configuration, the even and odd banks receive mostly
the
same
address
lines;
signals
ECA3/ECA2,
ECAWE#/OCAWE# and BEOE#/BOOE# are used to dictate
the even or odd bank access.
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Writeback Cache
The writeback cache scheme derives its superior performance by optimizing write cycles. There is no performance
penalty in the cache write cycle, since the cache controller
does not need to wait for the much slower DRAM controller to
finish its import before proceeding to the next cycle.
Tag RAM
A built-in tag comparator improves system performance while
reducing component count on the system board. The comparator internally detects the cache hit/miss status by comparing the high-order address bits (for the memory cycle in
progress) with the stored tag bits from previous cache entries
(see Table 4-42). When a match is detected, and the location
is cacheable, a cache hit cycle takes place. If the comparator
does not match, or a non-cacheable location is accessed
(based on the internal non-cacheable region registers), the
current cycles is a cache miss.
The tag is invalidated automatically during memory reads
when the cache is disabled; each memory read will write into
the corresponding tag location a non-cacheable address
(such as A0000h or B0000h of the video memory area). To
flush the cache, simply disable the L2 cache and read a block
of memory equal to the size of the cache. The advantage of
this invalidation scheme is that no valid bit is necessary and
expensive SRAM can be conserved.
Table 4-42 details CPU address bits that are stored as tags
for the various cache sizes supported by the cache controller.
The table also marks the high-order address bit in each configuration. This is the bit that can be eliminated in each configuration and replaced by the dirty bit if the design must use
an 8-bit wide tag SRAM instead of a 9-bit wide device. Table
4-43 illustrates the consequences of this choice for each configuration.
Table 4-42
Correspondence Between Tag Bits
and CPU Address Lines
Tag Bit
64KB
Cache
128KB
Cache
256KB
Cache
7
CA23*
CA23
CA23
6
CA22
CA22
CA22
5
CA21
CA21
CA21
4
CA20
CA20
CA20
3
CA19
CA19
CA19
2
CA18
CA18
CA18
1
CA17
CA17
CA25*
0
CA16
CA24*
CA24
Note:
Table 4-43
Maximum Cacheable System DRAM
for Each Cache Configuration
Maximum DRAM Possible
Tag/Dirty SRAM
Width
64KB
Cache
128KB
Cache
256KB
Cache
9-bit
16MB
32MB
63MB*
8-bit
8MB
16MB
31MB*
Note:
*Not 64MB or 32MB because those addresses in the
upper MB conflict with the value used to invalidate
cache.
Dirty Bit Mechanism
The “dirty bit” is a mechanism for monitoring data coherency
between the external cache subsystem and DRAM. Each tag
entry has a corresponding dirty bit to indicate whether the
data in the represented cache line has been modified since it
was loaded from system memory. This bit allows the cache
controller to determine whether the data in memory is “stale”
and needs to be updated before a new memory location is
allowed to overwrite the currently indexed cache entry. The
writeback cycle causes an entire cache line (16 bytes) to be
written back to memory, followed by a line burst from the new
memory location into the cache and CPU. Normally, the performance advantage of completing fast writes to the cache
outweigh the “writeback” read-miss penalties which are
incurred while operating the writeback scheme.
Possible cache cycles are detailed below:
Cache Read-Hit. The secondary cache provides the data to
the CPU directly. The cache controller follows the CPU burst
protocol to fill the internal cache line of the processor.
Cache Read-Miss (DRTY bit negated): Import Cycle. The
cache controller does not need to update system memory
with the current data from the cache, because that data has
not been modified (as shown by the dirty bit negation). The
cache controller asserts TAGWE# to update the tag RAMs
with the new address, and asserts BEOE#/BOOE# to update
cache memory with data from the new DRAM line. Data is
presented to the CPU and the secondary cache concurrently
(following the 486 burst protocol).
Cache Read-Miss (DRTY bit asserted): Castout Cycle.
The cache controller must update the system memory with
data from the cache location that is going to be overwritten.
The cache controller writes the 16-byte line from cache memory into DRAM, then reads the new line from DRAM into the
cache memory and de-asserts the dirty bit. The cache controller asserts TAGWE# and BEOE#/BOOE# during this line
fill. This new data is presented to the CPU and to the secondary cache concurrently (following the 486 burst protocol).
* Optional Tag Bit
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Cache Write-Hit. Because this is a writeback cache, the
cache controller does not need to update the much slower
DRAM memory. Instead, the controller updates the cache
memory and sets the DRTY bit. DRTY may already be set,
but that does not affect this cycle. The contents of the tag
RAM remains unmodified.
Cache Write-Miss. The cache controller bypasses the cache
entirely and writes the data directly into DRAM. The DRTY bit
is unchanged. No import cycle to the cache takes place.
Table 4-44 shows recommended DATA and TAG SRAM
speeds for relative CPU clock rates.
4.5.4.3
L2 Cache Arrangement
The 82C465MVA part provides two new bits for greater flexibility of L2 cache.
Table 4-44
• SYSCFG D1h[4] selects single-bank operation of L2
cache. The original 82C465MV part provided for singlebank operation of 128KB cache only. This new feature
allows 64KB and 256KB cache to operate in a single bank
mode.
• SYSCFG D1h[5] allows the use of a 7-bit tag RAM
address in order to use an 8-bit wide tag SRAM instead of
a 9-bit wide SRAM. The original 82C465MV part allowed
this arrangement, but since there was no way to indicate to
the chipset to make upper DRAM non cacheable, the 8-bit
tag RAM selection would severely limit the maximum possible system DRAM.
These register bits are shown in Table 4-45.
SRAM Speed Requirements
Speed
Cache
SRAM
TAG
SRAM
Write Wait
States
Burst Read Timing
(Note 1)
Bank Arrangement
16MHz
25ns
25ns
0
2-1-1-1
Single/double bank
20MHz
25ns
25ns
0
2-1-1-1
Single/double bank
25MHz
20ns
25ns
0
2-1-1-1
Single bank
25MHz
25ns
25ns
0
2-1-1-1
Double bank
33MHz
20ns
15ns
0
3-2-2-2
Single bank cache
33MHz
20ns
(Note 2)
15ns
0
2-1-1-1
Double bank cache only
40MHz
20ns
15ns
1
3-2-2-2
Single/double bank
50MHz
20ns
15ns
1
3-2-2-2
Single/double bank
Notes: 1. DRAM and cache cycles are at their minimum wait states.
2. 20ns SRAM with Tdoe ≤ 10ns.
3. DRAM speed assumed to be 80ns minimum.
Table 4-45
7
L2 Cache Arrangement Selection Bit
6
5
SYSCFG D1h
4
3
L2 Cache Control Register 2
L2 Tag RAM
size:
0 = 8-bit
1 = 7-bit
(MVA)
2
1
0
Default = 41h
L2 cache
arrangement:
0 = Two banks
1 = One bank
(MVA)
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4.5.4.4
Differences Between L2 Support and No Cache Support Modes
When the L2 cache feature is strap-selected, the following
• The old KBDCS# pin becomes the high-byte enable signal
SDENH# to the CD-SD buffer.
changes must be made to the system design.
• The CD[31:16] inputs to the 82C465MV controller logic are
redefined by the L2 cache interface. CD[31:16] are used
only for data exchanges between the SD[15:0] bus and the
CPU, and do not affect the CPU-to-memory interface.
Enabling L2 support requires the use of a word-wide, leveltranslating transceiver between CD[31:16] and SD[15:0].
Whenever bus exchanges take place between the ISA bus
and the local CPU bus, the 82C465MV ISA controller
directs data onto the correct byte lanes as appropriate.
• The cache chip select lines CCS#0-3 become available.
No parity checking is available in the 82C465 series chip.
• RTCD# is multiplexed with ROMCS# on the old ROMCS#
pin. The new pin is valid as RTCD# when AEN is low, and
as ROMCS# always. Only RTCD# needs to be qualified
with AEN, as ROMCS# to the ROM is further qualified by
MEMR# going active.
• The old RTCD# pin becomes the low-byte enable signal
SDENL# to the CD-SD buffer.
• KBDCS# is multiplexed with DWE# on the old DWE# pin.
The new pin is valid as KBDCS# when AEN is low, and as
DWE# always. Only KBDCS# needs to be qualified with
AEN, as DWE# to the DRAM is further qualified by one of
the RAS# lines going active.
Table 4-46
Pin
• The old XDIR pin becomes the CD-SD buffer direction signal SDIR. Systems that are designed using the OPTi
82C602 chip do not need an XDIR signal. For those
designs using discrete logic for the XD bus, the XDIR function must be derived externally using W/R# from the CPU
to control XD bus buffer direction, and ROMCS#/RTCD#
ANDed with DWE#/KBDCS# to enable the buffer.
• The old LCLK pin becomes the TAGCS# control line to tag
RAM. The LCLK function should not be needed in a new
design since the 82C465MV clock FBCLKOUT runs at the
proper speed for the VL bus (always 1X).
These functions are controlled separately from the L2 cache
enable feature to allow systems to be designed with all the L2
cache support logic in place and operating, without actually
having to install and enable the cache itself on every board.
Not until the “Enable L2 Cache Operation” control bit is set in
the Feature Control Register do the converted pins actually
begin to function for cache support. The strapping option
does, however, change pin definitions so that the CD-SD
buffer is used in all transactions involving CD[31:16].
Table 4-46 illustrates the actual signal changes per pin.
L2 Cache Support Option (strap-selected)
82C463MV Signal
82C465MV Signal
w/ L2 Option Strapped
Pin
82C463MV Signal
82C465MV Signal
w/ L2 Option Strapped
149
XDIR
SDIR
205
CD19
TAG3
89
RTCD#
SDENL#
204
CD20
TAG4
104
KBDCS#
SDENH#
203
CD21
TAG5
90
ROMCS#
ROMCS#+RTCD#
202
CD22
TAG6
25
DWE#
KBDCS#+DWE#
199
CD23
TAG7
23
MP0
CCS0#
197
CD24
DRTY
13
MP1
CCS1#
196
CD25
BEOE#
3
MP2
CCS2#
195
CD26
BOOE#
198
MP3
CCS3#
194
CD27
ECAWE#
189
LCLK
TAGCS#
193
CD28
OCAWE#
2
CD16
TAG0
192
CD29
TAGWE#
207
CD17
TAG1
191
CD30
ECA2
206
CD18
TAG2
190
CD31
ECA3
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4.5.4.5
Hardware Considerations
The system designer should be aware of the following information when designing in L2 cache.
SYSCFG D0h[6] is provided as explained below to select
whether the cache control signals will be tristated or just
driven inactive (high) during Suspend.
DWE# is on the CPU/memory interface and is therefore a
3.3V signal in a mixed-voltage system. Since the DWE# pin is
shared by KBDCS#, KBDCS# is a 3.3V signal also. The 7432
gate normally used to decode KBDCS# using AEN will have
a 3.3V high input. If a 5.0V gate is used, the 3.3V inactive
input at low-power Suspend time could cause a current drain.
4.5.4.6
Programming
Support for L2 cache is enabled by strapping SA0 low as
described in Table 3-2, “Strap Option Summary,” on page 6.
Any system designed for L2 cache should enable this support, whether the cache is actually installed or not. The size
of the cache, the wait states, and the cacheable areas are
programmed in L2 Cache Control Registers 1, 2, and 3.
Then, the cache is actually enabled for operation by writing
SYSCFG D0h[5] = 1.
Also, the sense of SDIR is as follows: logic high indicates an
A-to-B exchange which is from CD[31:16] to SD[15:0]; logic
low indicates a B-to-A exchange which is from SD[15:0] to
CD[31:16]. System designers must be careful to orient the 'A'
and 'B' sides of the buffer properly.
Note:
L2 cache is often placed on its own separate power plane so
that it can be powered down when the system Suspends.
Table 4-47
7
L2 Cache Registers
6
5
SYSCFG D0h
L2 cache
CCS0-3#
deassert:
0 = Stop grant
and Suspend
When L2 cache is enabled, the 82C465MV part
requires the DRAM controller to run no faster than
4-3-3-3 DRAM read cycles.
4
3
2
1
L2 Cache Control Register 1
L2 cache controls Suspend
state:
0 = Tristate
1 = Driven
L2 cache
engage:
0 = Disable
1 = Enable
Cache size:
00 = 64KB
01 = 128KB
10 = 256KB
11 = Reserved
0
Default = C0h
L2 cache write
wait state:
0 = 1 WS
1 = No WS
L2 cache read
burst wait state
control:
L2 cache first
read wait state
control:
0 = X-1-1-1
1 = X-2-2-2
0 = 3-X-X-X
1 = 2-X-X-X
E4000-E7FFFh
L2 cacheable?
E0000-E3FFFh
L2 cacheable?
1 = Also
between
accesses
SYSCFG D1h
L2 Cache Control Register 2
L2 cache
arrangement:
0 = Two banks
1 = One bank
(MVA)
SYSCFG D2h
DC000DFFFFh L2
cacheable?
0 = No
1 = Yes
EC000EFFFFh L2
cacheable?
0 = No
1 = Yes
Default = 41h
E8000EBFFFh L2
cacheable?
0 = No
1 = Yes
0 = No
1 = Yes
L2 Cache Control Register 3
D8000DBFFFh L2
cacheable?
0 = No
1 = Yes
D4000D7FFFh L2
cacheable?
0 = No
1 = Yes
D0000D3FFFh L2
cacheable?
0 = No
1 = Yes
CC000CFFFFh L2
cacheable?
0 = No
1 = Yes
0 = No
1 = Yes
Default = 00h
C8000CBFFFh L2
cacheable?
0 = No
1 = Yes
C4000C7FFFh L2
cacheable?
0 = No
1 = Yes
C0000C3FFFh L2
cacheable?
0 = No
1 = Yes
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L2 Chip Select Control SYSCFG D0h[7] - Selects when the
CCS0-3# and TAGCS# signals should go inactive. Some
cache RAM may not be ready for access in time if its chip
enable is turned off between cycles. Setting SYSCFG D0h[7]
= 0 lets CCS0-3# and TAGCS# go inactive only during Stop
Grant cycles and during Suspend mode. Setting SYSCFG
D0h[7] = 1 lets CCS0-3# and TAGCS# go inactive between
cache accesses as well as during Stop Grant and Suspend
mode.
L2 Cache Read Burst Wait State Control SYSCFG D0h[1]
- When SYSCFG D0h[1] = 0, read hit burst cycles run with no
wait states (X-1-1-1). When SYSCFG D0h[1] = 1, read hit
burst cycles run with one wait state (X-2-2-2).
L2 Chip Select State During Suspend SYSCFG D0h[6] Allows cache to be flushed and turned off during Suspend
mode if desired to save power. Software must perform the
flush.
4.5.4.7
Timing Control Register
The superior performance of EDO DRAM requires timing that
is tighter than for standard DRAM. This timing becomes
especially critical during an L2 cache read miss cycle,
because the DRAM read and L2 cache write occurs in the
same clock cycle and from the same clock edge. Therefore,
the 82C465MVB part provides SYSCFG 3Ch[2:0]. These bits
control the number of gate delays inserted to delay the cache
ECAWE#, OCAWE#, and TAGWE# signals so that the L2
cache write occurs after EDO DRAM read data is ready. The
required setting for these bits depends on system layout. A
value of 100b*, 4 gate delays, is typical.
L2 Cache Engage SYSCFG D0h[5] - Enables L2 writeback
cache operation if chip was strapped for L2 cache configuration. Otherwise, the bit setting has no effect. This bit would
remain set to 0 on a system that was predisposed to accept
cache but on which no cache was presently installed.
Table 4-48
L2 Cache First Read Wait State Control SYSCFG D0h[0] When SYSCFG D0h[0] = 0, the first read hit cycle runs with
no wait states (2-X-X-X). When SYSCFG D0h[0] = 1, the first
read hit cycle runs with one wait state (3-X-X-X).
Cache Timing Control
7
6
SYSCFG 3Ch
5
4
3
2
1
Timing Control Register
0
Default = 00h
L2 cache WE# delay (MVB):
000 = No delay
001 = 1 gate delay
010 = 2 gate delays
011 = 3 gate delays
100 = 4 gate delays*
101 = 5 gate delays
110 = 6 gate delays
111 = 7 gate delays
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4.6
Peripheral Interface Logic
The peripheral interface logic of the 82C465MV chip includes
ISA bus control logic, the 82C206-type IPC, the integrated
local bus IDE controller, and the Compact ISA (CISA) interface.
SD Bus Buffer Control
The internal bus controller logic automatically splits word or
double-word writes from the CPU to multiple 8-bit ISA bus
cycles. If the responding device asserts M16# or IO16#, the
bus controller will transfer 16 bits at a time.
4.6.1
Conversely, CPU memory reads, which can be 32-bits wide,
will automatically be assembled by the 82C465MV bus conversion logic either byte-by-byte or word-by-word, depending
on whether M16# is asserted by the peripheral. The bytes or
words are moved individually from the SD bus to the appropriate lanes on the CD bus as indicated by the CPU BE[3:0]#
lines until the complete data word is ready. The 82C465MV
logic then finally asserts RDY# to transfer the 8-, 16-, or 32bit data back to the CPU.
ISA Bus Logic
The 82C465MV handles all the typical aspects of ISA bus
operation. 8- or 16-bit transactions can take place on the ISA
bus, depending on the state of the IO16# and M16# lines during the transaction.
All ISA bus commands generated by the CPU will be passed
first to the VL bus. If no local device responds by activating
LDEV#, the 82C465MV bus controller runs the cycle on the
ISA bus. Even I/O accesses that are destined for internal
devices such as the DMA controller and interrupt controller
will be presented on the ISA bus. It is therefore important that
no external device attempt to respond to these cycles as well.
Bus contention and invalid data could result.
Note that write accesses to internal configuration registers at
022h and 024h are also available outside the chip for any
external logic that needs to record these transactions. Read
accesses to these registers are available only on the CPU
interface.
4.6.1.1
Hardware Considerations
The design of the ISA subsystem is heavily dependent on the
load and the target power consumption. For example, a 3.3V
ISA subsystem is ideal in terms of power consumption characteristics, yet not all ISA bus peripherals can operate at
3.3V. Therefore, the designer may need to separately buffer
3.3V and 5.0V buses and implement a control isolation mechanism. In addition the designer must consider the XD bus,
which also can be either 3.3V or 5.0V, and determine
whether this separate local peripherals bus is necessary as
described below.
XD Bus Buffer Control
The logic provides an XDIR signal to control the movement of
8-bit ISA bus data to and from the SD[15:0] bus, always on
the lower byte. When the XDIR signal is not available, as
when the L2 cache interface is selected, the buffer direction
can be derived from MEMR# and IOR#, and the buffer enable
from ROMCS#, RTCD#, and KBDCS#.
Note that a separate XD bus is not always needed in a
design. If there are not a large number of devices on the SD
bus, the XD bus peripherals can simply be placed directly on
the SD bus. The only absolute requirement for a separate XD
bus is for designs in which SD and XD run at different voltages and the XD bus buffer acts also as a level translator.
SD-to-CD Bus Buffer Controller
When the L2 cache interface is implemented, the CD[31:16]
signal interface is converted to various tag data and cache
control signals. Since the CD[31:16] inputs are always moved
down to the SD[15:0] bus anyway, this operation is readily
achieved using an external 16-bit transceiver. In most cases
the transceiver will also be a level-translator, since the CD
bus is generally 3.3V and the SD bus is 5.0V. A
74FCT164245 level translator device or a 74LVT16245 5.0Vtolerant device are often used for this purpose as shown in
Figure 4-3 on Page 64.
For any data exchange that requires a direct byte or word
movement from CD[31:16] to SD[15:0], the bus controller
sets the direction on SDIR to point to the SD bus, sets its
internal SD bus buffer to input (so it can capture the data
being written to the ISA bus in case it needs to act on the
data), and then enables SDENH# or SDENL# as appropriate.
For direct movement from SD[15:0] to CD[31:16], the process
is similar but the SDIR direction changes. Once again, the
bus controller captures the data on its internal SD[15:0] lines
in case it needs to act on the data.
For any operation that involves a byte-swap, the bus controller must direct the CD-SD buffer output to its internal
SD[15:0] input. It then latches this data, performs the
required byte swap, disables the SDENH# and SDENL# lines
to the CD-SD buffer, and finally drives the correctly swapped
data to the ISA bus.
These operations take place at CPU clock speeds, not ISA
bus speeds; therefore, the impact on operational speed is
negligible.
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MASTER# Control
The internal logic can recognize any active DRQ and an
active HLDA from the CPU as an indication that an ISA bus
peripheral device has bus ownership. It can further determine
that the device is a bus master, as opposed to a DMA slave,
by looking at the state of AEN. Therefore, the 82C465MV can
determine whether the current ISA bus cycle is a master
cycle without having to observe the MASTER# input pin.
The RI# pin was formerly shared with the MASTER# input on
the 82C463 chipset and can continue to act as a MASTER#
input if SYSCFG 30h[5] is written to '0' (see Table 4-49).
Table 4-49
However, this function need not be supported and should not
be implemented in new designs. MASTER# from the ISA bus
should be used only to control the direction of any CA-to-SA
bus buffers in use.
4.6.1.2
ISA Write Cycle Inhibition
The cycle enable bits listed in Table 4-50 default to “enabled”
to allow write accesses to the ISA bus or EPROM to be generated normally. In those situations where ROMs are present,
the write cycles can be blocked.
Pin 186 Function Select
7
6
5
SYSCFG 30h
4
3
2
1
Control Register 1
0
Default = 40h
Pin 186
function:
0 = MASTER#
1 = RI
Table 4-50
Cycle Enable Bits
7
6
5
SYSCFG 32h
Allow D000
writes:
0 = Disable
1 = Enable
SYSCFG 36h
4
3
2
1
0
Shadow RAM Control Register 1
Default = E4h
Shadow RAM Control Register 3
Default = 10h
Allow E000
writes:
0 = Disable
1 = Enable
Allow C000
writes:
0 = Disable
1 = Enable
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4.6.1.3
ISA Bus Clock Options
The ISA bus can run at exactly 8.0MHz on the 82C465MV if
an appropriate external clock is provided. This feature
requires a new input pin, ATCLKIN. If this feature is enabled,
ATCLKIN will replace the PIO2 signal presently found on pin
172 of the 82C463MV.
ATCLKIN is simply an alternative clock source. It can be
divided in the same way as the FBCLKIN source. An 8.0MHz
clock will most likely be derived by dividing a 16MHz
ATCLKIN by 2, or a 24MHz ATCLKIN by 3.
The ATCLKIN input for this function must be enabled first as
explained previously in Section 4.3.2 "System Clock Generation". The clock can then be selected by writing SYSCFG
43h[3] = 1, and using SYSCFG 43h[2:0] to choose the divisor
(see Table 4-52). Bit 3 defaults to 0 on power-up.
Table 4-51
7
Note:
The 82C465MV can run from either a 1X clock or a
2X clock (refer to the Section 3.3 "Strap-Selected
Interface Options" for details). To remain compatible
in both modes, the AT bus clock selections are based
on the FBCLKIN (feedback) clock times 2. This
scheme effectively maintains the same rate as would
have been selected through 82C463MV programming.
4.6.1.4
ISA Bus Refresh Control
The 82C465MVB part allows refresh on the ISA bus to be
completely eliminated. Since very few ISA bus devices actually make use of the refresh cycle, this bandwidth can be
recovered to improve system performance. Setting SYSCFG
32h[2] = 0 disables hidden refresh on the ISA bus and generation of addresses for refresh as well, but does not in any
way affect local system DRAM refresh.
ISA Bus Refresh Control
6
5
SYSCFG 32h
4
3
2
1
Shadow RAM Control Register 1
0
Default = E4h
Hidden Refresh
on ISA bus:
0 = Enable
1 = Disable*
(MVB)
* Enable when
using EDO
DRAM.
Table 4-52
7
SYSCFG 43h
ATCLKIN Programming Register Bits
6
5
4
3
1
0
PMU Control Register 4
ATCLK
generator
source:
0 = FBCLKIN
1 = ATCLKIN
w/SYSCFG
A0h[4] = 1
SYSCFG A0h
2
Feature Control Register 1
Default = 00h
ATCLK rate selections:
000 = /8
001 = /6
010 = /4
011 = /3
100 = 7.2 MHz
101 = /2
110 = /1 (/2 if SYSCFG43h[3] = 0)
111 = Stop
Default = 00h
Pin 172
function:
0 = PIO2 (or
CPUSPD)
1 = ATCLKIN
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82C465MV/MVA/MVB
4.6.1.5
Programming
The ISA bus requires a certain amount of programming in
order to preset and optimize its operation for the peripheral
devices chosen. Table 4-53 shows the related register programming bits and the following explains their functions.
Turbo VGA forces zero wait state operation from memory
accesses at addresses A0000h to B0000h, as if NOWS#
were always active.
AT wait state control adds one extra wait state to each ISA
bus cycle, useful for slower devices.
Master byte swap control enables ISA bus byte swapping
for bus masters. While some ISA bus masters are capable of
monitoring the IOCS16# and MEMCS16# ISA bus signals to
determine where to drive data, others depend on the system
Table 4-53
to do the byte swap for them. This bit allows either type of
bus master to be accommodated.
ALE control during bus conversion allows selection of a
single ALE on the first cycle or an ALE on the subsequent
command cycle as well when word accesses are split into
two separate byte accesses. Most all newer peripheral
devices require two separate ALEs.
Internal I/O address decode size selection allows addressing to wrap around every 400h ports or to end after 100h.
System designs with peripheral devices at aliases of the 0FFh range (for example, an I/O device addressed at 420h)
should use 16-bit decoding to prevent the internal peripheral
devices from responding at aliased addresses and conflicting
with the external devices.
Peripheral Device Programming Register Bits
7
6
SYSCFG 30h
5
4
3
2
Control Register 1
Turbo VGA
(NOWS#):
0 = Disable
1 = Enable
SYSCFG 31h
1
0
Default = 40h
AT wait states:
0 = None
1 = One
Control Register 2
Default = 40h
Shadow RAM Control Register 1
Default = E4h
Master byte
swap:
0 = Disable
1 = Enable
SYSCFG 32h
ALEs in bus
conversion:
0 = Multiple
1 = Single
SYSCFG A0h
Feature Control Register 1
Internal I/O
address
decoding:
Default = 00h
Pin 172
function:
0 = PIO2 (or
CPUSPD)
0 = 10-bit
1 = 16-bit
1 = ATCLKIN
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82C465MV/MVA/MVB
4.6.1.6
ISA Bus Address Buffer Enable Signal
The 82C465MVA interface provides the SABUFEN# signal
output as a strap-selected option on pin 172. Pin 172 is normally used for the CPUSPD output indicator, the ATCLKIN
bus clock input function, or as general purpose I/O pin PIO2.
As PIO2, pin 172 defaults to input mode at power-up time.
When the new function is programmed, pin 172 becomes the
SABUFEN# output. SABUFEN# is normally high, and drives
low on any ISA bus access (including DMA, refresh, etc.).
This signal is enabled early in all cycles so that the CA[23:2]
bits can be driven onto the SA[23:2] bus in time for decode by
ISA peripheral devices.
The 82C465MVA enables a weak internal pull-down resistor
on pin 172 after reset to enable any connected buffer. Once
SYSCFG 57h (where input or output is selected for each PIO
pin) is written with any value, the internal pull-down resistor is
disabled.
4.6.1.7
Docking Station Attachment Feature
The “hot” attachment of a notebook computer to a docking
station through the ISA bus requires the ability to stop any
Table 4-54
7
SYSCFG 57h
ISA cycle in progress and tristate the bus. The 82C465MVA
part implements this feature through an unused interrupt line
on the multiplexed EPMMUX input. On the 82C465MV part,
inputs C0-C3 to EPMMUX are defined as DRQ2, RSVD,
EPMI3, and EPMI4. The RSVD line is always shown as
pulled low in the current schematics. On the 82C465MVA
part, the C1 input is redefined from RSVD to ATHOLD.
Bringing ATHOLD high causes the 82C465MVA logic to stop
the CPU operation after the current bus cycle is complete.
Since ATHOLD is recognized through a multiplexer, there is a
maximum latency of 280ns from assertion of ATHOLD to recognition by the logic. In addition, there is the time required for
the system to complete its current cycle, which could take on
the order of microseconds for certain ISA bus cycles. Finally,
the ISA bus signals are all tristated and will remain tristated
as long as ATHOLD is high. Bringing ATHOLD low again
restarts the system.
This feature is always enabled.
PIO2 and SABUFEN# Program Bits
6
5
4
3
2
PMU Control Register 6
1
0
Default = 00h
PIO2
direction:
0 = Input
1 = Output
SYSCFG 79h
PMU Control Register 11
Default = 00h
Pin 172
function:
0 = PIO2 or
CPUSPD
1 = Buffer
enable pin
SABUFEN#
(MVA)
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82C465MV/MVA/MVB
4.6.2
Programmed Hardware Reset
The 82C465MVA part allows generation of hardware reset
signal CPURST by writing a register bit. This function is useful for restoring the registers to their default condition in certain situations. For example, if a flash BIOS has been
reprogrammed, the system must be re-initialized and booted
properly. Using this bit may eliminate the need for some hardware reset logic.
4.6.3
Integrated Peripheral Controller
The Integrated Peripheral Controller (IPC) includes two 8237
DMA controllers, two 8259 interrupt controllers, one 8254
timer/counter and one 74612 memory mapper. It is registercompatible with the 82C206 chip.
For information on the design architecture of this unit, refer to
the separate document on the 82C206 IPC. This document is
available on request from OPTi.
4.6.3.1
Multiplexor Hardware Considerations
The 82C465MV uses an external multiplexing scheme to
read in many of the IRQ, DRQ, and external PMI inputs. The
scheme uses the KBCLK and KBCLK2 outputs to toggle a
74153-type multiplexer through four distinct sampling
phases. While the system is active, KBCLK and KBCLK2 are
generated from the OSC14 input and sample each multiplexer input once every 280ns. During Suspend, if OSC14 is
not present the 32KHz signal is used to generate KBCLK and
KBCLK2. Therefore, the inputs are sampled only once every
120µs in this case.
Sampling occurs between multiplexer input switching. For
example, when in active mode and running off OSC14,
KBCLK/KBCLK2 switch the multiplexer input every 70ns. The
chipset samples the state of its input 35ns after the multiplexer has switched. Therefore, no “glitching” occurs on sampling. The sampling points are shown in Figure 4-5, where
the “SMPL14” signal is a delayed internal version of the
OSC14 input signal.
External peripheral devices that generate IRQs or external
PMIs must therefore generate a pulse of sufficient duration to
be seen by the sampling logic. The OPTi 82C602 Notebook
Companion chip incorporates a latching mechanism to
ensure that IRQ inputs that pulse low will be held low for at
least one complete KBCLK/KBCLK2 cycle (280ns or 120µs).
4.6.3.2
DMA Hardware Considerations
DMA Address After High Memory Access
The 82C465MVB part incorporates automatic pulldown resistors on the CPU address lines. The chip manufacturing process allows for resistor values between 40k and 60k ohm to
be implemented internally. Most of the time, either the CPU
or the chipset drives the address lines. The resistors are
intended to prevent floating of the address lines when no one
is driving, such as during bus hold periods.
During DMA cycles, the DMA controller within the
82C465MVB chipset drives the address on the CPU address
bus; the CPU is in hold acknowledge state at this time and
does not drive an address. However, the DMA controller
does not drive address lines above CA23. (Even if it did, the
DMA controller still would not be able to control lines CA26CA30 since they do not connect to the 82C465MVB part.)
If the last CPU access just prior to being put in HOLD was to
an address in high memory, one in which any of CA24-CA31
was high, the value on these address lines may remain high
when EADS# is generated. If the bus capacitance is high
enough, weak internal or external pulldown resistors will not
be sufficient to restore the address line value to 0 before the
DMA cycle takes place. In this situation, the CPU will see the
wrong address when EADS# is asserted, and will not invalidate the proper line in L1 cache.
Address lines CA24 to CA31 should be pulled down externally with 2k ohm resistors. This strong pulldown value
ensures that the line will return to logic '0' before EADS is
asserted.
AEN and 16-Bit DMA
The 82C465 series drops AEN earlier than the ISA specification allows during 16-bit DMA transfers. The AEN signal
should remain high at least for the duration of the ISA command lines (IORD#/IOWR#, MRD#/MWR#) during DMA. But
AEN will drop low mid-way through the command, possibly
allowing an I/O device to decode the transfer as a standard
input/output command.
The 82C465 chip itself can decode this cycle and hang the
system under certain circumstances. Generally this failure
mode is evident only when writeback CPU operation is
enabled.
There are several possible workarounds to this issue.
• If there is no possibility of 16-bit DMA occurring, no
workaround is required.
• If no local ISA devices will misinterpret the DMA transfer
as an I/O access, it is sufficient to simply set register
43h[2:0]=000 to enable synchronous ATCLK operation.
The internal logic of the 82C465 chips will not misinterpret
the DMA access as an I/O access when in synchronous
mode.
• If full ISA support is expected, the fix shown in the figure
below must be implemented using two 7432 gates and a
7408 gate. Note that if ISA masters are not supported, the
7408 gate is not required.
OPTi
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82C465MV/MVA/MVB
Figure 4-4
Correcting AEN for 16-bit DMA
DACKMUX1
82C465
Table 4-55
7
DACKMUX0
465AEN
MSTR#
from ISA bus
AEN
to ISA bus
Programmed Hardware Reset Bit
6
SYSCFG ADh
5
4
3
Feature Control Register 3
2
1
0
Default = 00h
Generate
CPURST
immediately?
0 = No
1 = Yes
(MVA)
Figure 4-5
Multiplexed Input Sampling Points
280ns
SMPL14
KBCLK
KBCLK2
465MV samples multiplexed input
four times for every KBCLK2 cycle
4.6.3.3
IPC Configuration Programming
The sole configuration register of the IPC, separate from
those of the 82C465MV, is accessed by first writing the register index of interest to I/O Port 022h; the selected register
information then becomes available for reading or writing at
I/O Port 023h as opposed to Port 024h used by the
82C465MV configuration registers (SYSCFG). Table 4-56
shows the IPC configuration bits.
Initialization Command Words
The Initialization Command Words (ICWs) are shown first
and must always be written in sequence starting with ICW1.
Two I/O port groups are listed. The first group refers to
INTC1, the interrupt controller for IRQs 0-7; the second refers
to INTC2, the interrupt controller for IRQs 8-15. Refer to
Table 4-57 and Table 4-58.
4.6.3.4
Interrupt Controller Register Programming
The IPC provides two peripheral interrupt controllers that are
register compatible with the 8259 part. The registers of this
logic module are listed below. These registers are accessed
directly through the I/O subsystem (no index/data method is
used).
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Table 4-56
IPC Configuration Bits
7
6
5
Index 01h
4
3
2
1
0
IPC Configuration Register
IPC register access wait states
(ATCLKs):
00 = 1 wait states
01 = 2 wait states
10 = 3 wait states
11 = 4 wait states (default)
16-bit DMA wait states(1):
8-bit DMA wait states(1):
00 = 1 wait state (default)
01 = 2 wait states
10 = 3 wait states
11 = 4 wait states
00 = 1 wait state (default)
01 = 2 wait states
10 = 3 wait states
11 = 4 wait states
Delay DMA
DMA clock
select:
MEMR# one
clock from sys- 0 = ATCLK/2,
tem MEMR#? (default)
0 = Yes (AT1= ATCLK
compatible default)
1 = No
(1) Note that IOCHRDY can also be asserted by DMA devices to add wait states to DMA cycles.
Table 4-57
INTC1 Initialization Command Words
7
6
5
4
Port 020h
3
2
1
0
Trigger mode:
Don't care
Cascade mode
select?
Don't care
ICW1 (WO)
Always = 1
Don't care
0 = Edge
1 = Level
0 = Yes
(always)
1 = No
Port 021h
ICW2 (WO)
V[7:3] - Upper bits of interrupt vector. For AT compatibility, write 08h.
Port 021h
Not used - lower bits of interrupt vector are generated by interrupt controller.
ICW3 (WO)
S[7:0] - Slave mode controller connections. For AT compatibility, write 04h (IRQ2).
Port 021h
ICW4 (WO)
Don't care
Enable multiple
interrupts?
Don't care
Enable Auto
End-of-Interrupt command?
0 = No
1 = Yes
Table 4-58
Don't care
0 = No
1 = Yes
INTC2 Initialization Command Words
7
6
Port 0A0h
5
4
3
2
1
0
Trigger mode:
Don't care
Cascade mode
select?
Don't care
ICW1 (WO)
Don't care
Always = 1
0 = Edge
1 = Level
0 = Yes
(always)
1 = No
Port 0A1h
ICW2 (WO)
V[7:3] - Upper bits of interrupt vector. For AT compatibility, write 70h.
Not used - lower bits of interrupt vector are generated by interrupt controller.
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Table 4-58
7
INTC2 Initialization Command Words (cont.)
6
5
4
Port 0A1h
3
2
1
0
ICW3 (WO)
Don't care
ID[2:] - Slave mode address. For AT compatibility,
write 02h (IRQ2).
Port 0A1h
ICW4 (WO)
Don't care
Enable multiple
interrupts?
0 = No
1 = Yes
Enable Multiple Interrupts can be enabled to allow INTC2
to fully nest interrupts without being blocked by INTC1. Correct handling of this mode requires the CPU to issue a non
specific EOI command to zero when exiting an interrupt service routine. If the feature is disabled, no command need be
issued.
Don't care
Enable Auto
End-of-Interrupt Command?
Don't care
0 = No
1 = Yes
Automatic End of Interrupt can be enabled to allow the
interrupt controller to generate a non specific EOI command
on the trailing edge of the second interrupt acknowledge
cycle from the CPU. The feature allows the interrupt currently
in service to be cleared automatically on exit from the service
routine. This function should not be used with fully nested
interrupts except by INTC1.
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Operational Command Words
The Operational Command Words are used to program the
interrupt controller during the course of normal operation.
Two I/O port addresses are listed for each register. The first
Table 4-59
address refers to INTC1, the interrupt controller for IRQs 0-7;
the second refers to INTC2, the interrupt controller for IRQs
8-15. Table 4-59 shows the registers.
INTC1 and INTC2 Operational Command Words
7
6
5
4
Port 021h, 0A1h
3
2
1
0
OCW1 Mask Register
IRQ7/15:
IRQ6/14:
IRQ5/13:
IRQ4/12:
IRQ3/11:
IRQ2/10:
IRQ1/9:
IRQ0/8:
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
0 = Enable
1 = Mask
Port 020h, 0A0h
OCW2 Command Register (WO)
000 = Disable auto-rotate, auto EOI mode
100 = Enable auto-rotate, auto EOI mode
001 = Generate nonspecific EOI
011 = Generate specific EOI
101 = Rotate on nonspecific EOI
111 = Rotate on specific EOI
110 = Set Priority
010 = No operation
Always = 0
for OCW2
Port 020h, 0A0h
Always = 0
Always = 0
for OCW2
L[2:0] - Interrupt level acted on by Set Priority and
Rotate of Specific EOI
OCW3 Command Register (WO)
Allow bit 5
changes?
0 = No
1 = Yes
Special mask
mode:
Always = 0
for OCW3
Always = 1
for OCW3
0 = Disable
1 = Enable
Polled mode:
0 = Disable
(generate
interrupt)
Allow bit 0
changes?
0 = No
1 = Yes
1 = Enable (poll
020/ 0A0h
for interrupt)
Port 020h, 0A0h
IRQ6/14
pending?
IRQ5/13
pending?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
IRQ5/13
In-Service?
0 = No
1 = Yes
IRQ4/12
In-Service?
0 = No
1 = Yes
IRQ3/11
pending?
IRQ2/10
pending?
IRQ1/9
pending?
IRQ0/8
pending?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
IRQ3/11
In-Service?
0 = No
1 = Yes
IRQ2/10
In-Service?
0 = No
1 = Yes
IRQ1/9
In-Service?
0 = No
1 = Yes
IRQ0/8
In-Service?
0 = No
1 = Yes
Polled Mode Register OCW3[2] = 1 (RO)
Not used
Interrupt
pending?
1 = Return ISR
In-Service Register OCW3[0] = 1 (RO)
IRQ6/14
In-Service?
Port 020h, 0A0h
IRQ4/12 pending?
0 = No
1 = Yes
Port 020h, 0A0h
0 = No
1 = Yes
0 = 020/0A0h
reads
return IRR
Interrupt Request Register OCW3[0] = 0 (RO)
IRQ7/15
pending?
IRQ7/15
In-Service?
In-Service
access:
IRQ[2:0] - Number of highest priority interrupt that is
pending
0 = No
1 = Yes
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82C465MV/MVA/MVB
Interrupt Controller Shadow Registers
Values written to the interrupt controller are not always
directly readable in the AT architecture. However, the
82C465MV shadows these values as they are written so that
they can be read back later through the configuration registers. Table 4-60 lists the correspondence of shadow indexes
to the write-only registers in the interrupt controllers.
Following the register bit formats tables is Table 4-65 which
lists the DMA commands.
Table 4-60
Register
INTC1 Index
INTC2 Index
ICW1
80h
88h
ICW2
81h
89h
ICW3
82h
8Ah
ICW4
83h
8Bh
OCW2
85h
8Dh
OCW3
86h
8Eh
4.6.3.5
DMA Controller Programming Registers
The IPC provides two direct memory access controllers
(DMAC1 and DMAC2) and their associated memory mappers
that are register compatible with AT-type systems. The registers of this logic module are listed below. These registers are
accessed directly through the I/O subsystem (no index/data
method is used). Each DMAC has four DMA channels. Channels 0-3 are in DMAC1, channels 4-7 in DMAC2. Table 4-61
and Table 4-62 list the register locations while Table 4-63 and
Table 4-64 list the register bit formats.
Table 4-61
Interrupt Controller Shadow Register
Index Values
DMA Address and Count Registers
DMA
Channel
0 Addr.
DMA
Channel
1 Addr.
DMA
Channel
2 Addr.
DMA
Channel
3 Addr.
DMA
Channel
4 Addr.
DMA
Channel
5 Addr.
DMA
Channel
6 Addr.
DMA
Channel
7 Addr.
Memory Address
Register
000h R/W
002h R/W
004h R/W
006h R/W
0C0h R/W
0C4h R/W
0C8h R/W
0CCh R/W
Count Register
001h R/W
003h R/W
005h R/W
007h R/W
0C2h R/W
0C6h R/W
0CAh R/W
0CEh R/W
Page Address
Register
087h R/W
083h R/W
081h R/W
082h R/W
08Fh R/W
08Bh R/W
089h R/W
08Ah R/W
Name
Table 4-62
DMA Control and Status Register
Command Port Address
for DMA Channels 0-3
Command Port Address
for DMA Channels 5-7
Sets the function type for each channel.
Group can be read back - see “Reset
Mode Register Readback Counter” command
Read/write 00Bh
Read/write 0D6h
Status Register
Returns channel request and terminal
count information
Read 008h
Read 0D0h
Command Register
Sets the DMAC configuration
Write 008h, Read 00Ah
Write 0D0h, Read 0D4h
Request Register
Makes a software DMA request
Read/write 009h
Read/write 0D2h
Mask Register
Enables or masks DMA transfers on
selected channels
Read/write 00Fh
Read/write 0DEh
Temporary Register
Not used in AT-compatible design
Read 00Dh
Read 0DAh
Command
Function
Mode Register
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Table 4-63
DMAC1 Control and Status Bits
7
6
5
4
Port 008h
3
2
1
0
Ch. 2 reached
terminal count?
Ch. 1 reached
terminal count?
Ch. 0 reached
terminal count?
DMAC1 Status Register
Ch. 2 request
pending?
Ch. 3 request
pending?
0 = No
1 = Yes
0 = No
1 = Yes
Ch. 1 request
pending?
Ch. 0 request
pending?
0 = No
1 = Yes
0 = No
1 = Yes
Port 00Bh
Ch. 3 reached
terminal count?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
DMAC1 Mode Register
Mode select:
Address count:
00 = Demand
01 = Single
10 = Block
11 = Cascade
Auto-Initialize:
0 = Disable
1 = Enable
0 = Increment
1 = Decrement
Port 009h
Transfer select:
Channel select:
00 = Verify
01 = Memory write
10 = Memory read
11 = Reserved
00 = Channel 0
01 = Channel 1
10 = Channel 2
11 = Channel 3
DMAC1, DMA Request Register
Reserved. Write as 0.
Port 008h
Request:
Channel select:
0 = Clear
1 = Set
00 = Channel 0
01 = Channel 1
10 = Channel 2
11 = Channel 3
DMAC1 Command Register
DACK active
sense:
DRQ active
sense:
0 = Low
1 = High
0 = High
1 = Low
Extended
write:
Rotating
priority:
Compressed
timing:
DMAC
operation:
Channel 0
address hold:
Memory-tomemory:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Enable
1 = Disable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
Port 00Fh
DMAC1 Mask Register
Reserved. Write as 0.
Channel 3:
0 = Unmasked
1 = Masked
Channel 2:
0 = Unmasked
1 = Masked
Channel 1:
0 = Unmasked
1 = Masked
Channel 0:
0 = Unmasked
1 = Masked
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Table 4-64
DMAC2 Control and Status Bits
7
6
5
4
Port 0D0h
3
2
1
0
Ch. 6 reached
terminal count?
Ch. 5 reached
terminal count?
Ch. 4 reached
terminal count?
DMAC2 Status Register
Ch. 7 request
pending?
Ch. 6 request
pending?
0 = No
1 = Yes
Ch. 5 request
pending?
0 = No
1 = Yes
Ch. 4 request
pending?
0 = No
1 = Yes
Ch. 7 reached
terminal count?
0 = No
1 = Yes
Port 0D6h
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
DMAC2 Mode Register
Address count:
Mode select:
Auto-Initialize:
0 = Increment
1 = Decrement
00 = Demand
01 = Single
10 = Block
11 = Cascade
Port 0D2h
0 = Disable
1 = Enable
Transfer select:
Channel select:
00 = Verify
01 = Memory Write
10 = Memory Read
11 = Reserved
00 = Channel 4
01 = Channel 5
10 = Channel 6
11 = Channel 7
DMAC2, DMA Request Register
Reserved. Write as 0.
Port 0D0h
Request:
Channel select:
0 = Clear
1 = Set
00 = Channel 4
01 = Channel 5
10 = Channel 6
11 = Channel 7
DMAC2 Command Register
DACK active
sense:
DRQ active
sense:
0 = Low
1 = High
0 = High
1 = Low
Extended
write:
Rotating
priority:
Compressed
timing:
DMAC
operation:
Channel 0
address hold:
Memory-tomemory:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Enable
1 = Disable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
Port 0DEh
DMAC2 Mask Register
Reserved. Write as 0.
Channel 7:
0 = Unmasked
1 = Masked
Table 4-65
0 = No
1 = Yes
Channel 6:
0 = Unmasked
1 = Masked
Channel 5:
0 = Unmasked
1 = Masked
Channel 4:
0 = Unmasked
1 = Masked
DMA Commands
Command
Function
Command Port Address for
DMA Channels 0-3
Command Port Address
for DMA Channels 5-7
Set Single Mask Bits
Register
Sets or clears individual mask register bits
without having to do a read/modify/write of the
Mask Register
Write 00Ah: bits [1:0] select
the channel, bit [2] selects the
new mask bit value
Write 0D4h: bits [1:0] select
the channel, bit [2] selects the
new mask bit value
Clear Mask
Unmasks all DMA channels at once
Write any value to 00Eh
Write any value to 0DCh
Reset Mode Register Readback
Counter
Resets the Mode Register Readback function
to start at register 0. The next four Mode Register reads then return channels 0, 1, 2, and 3 for
that DMAC
Read 00Eh (then read 00Bh
four times to get the Mode
Register values)
Read 0DCh (then read 0D6h
four times to get the Mode
Register values)
Master Clear
Clears all values, masks all channels, just like
a hardware reset
Write any value to 00Dh
Write any value to 0DAh
Clear Byte Pointer
Flip-Flop
Resets the byte pointer flip-flop so that the next
byte access to a word-wide DMA register is to
the low byte
Write any value to 00Ch
Write any value to 0D8h
Set Byte Pointer FlipFlop
Sets the byte pointer flip-flop so that the next
byte access to a word-wide DMA register is to
the high byte
Read 00Ch
Read 0D8h
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82C465MV/MVA/MVB
4.6.3.6
Determining DMA Status Before Suspend
The 82C465MVA is the first chip in the OPTi 82C46x family
to allow DMA transfer status to be determined before Suspending operation. In this way, complete system context can
be saved to disk and restored at any time, even to the point of
being able to reload and restart DMA operations such as
DMA-driven audio applications.
The 82C465MVA logic provides a DMA SMI enable,
SYSCFG D6h[6], that traps to SMM on any DMA request
without actually servicing the request. This same bit can be
set from within SMM to stop any DMA in progress. The DMA
will not restart until SYSCFG DDh[4] is written to 1 to clear
the event. If another DMA transfer then occurs, it too will be
blocked if SYSCFG D6h[6] is still set to 1.
Stopping DMA Activity in SMM
On receiving a Suspend request, SMM code may want to
stop DMA and determine the current state of all DMA peripheral devices. This would be difficult to do by masking the
channels, since the mask register must be read first to determine the channels that are unmasked and then masked. By
time this read/modify/write cycle is completed, transfer completion on a channel may have caused one of the unmasked
channels to be masked.
Once DMA is stopped, SMM code can read the “in-progress”
bits to quickly determine the state of transfers on each channel. These bits are set on the first DRQ after a channel is
unmasked, and cleared by a TC on that channel. Once
known, this information allows the code to decide how to
properly save and then restore the state of each channel as
described in the following sections.
Table 4-66
DMA Progress Bits
7
6
5
SYSCFG D6h
4
3
2
1
PMU Control Register 10
DMA trap
PMI#28 SMI:
0 = Disable
1 = Enable
(MVA)
Default = 00h
DMAC1 byte
pointer flip-flop
(RO):
0 = Cleared
1 = Set
(MVA)
SYSCFG 84h
DMA In-Progress Register (RO)
Channel 6
DMA in
progress:
Channel 7
DMA in
progress:
0 = No
1 = Possibly
0 = No
1 = Possibly
SYSCFG DDh
0
Channel 5
DMA in
progress:
0 = No
1 = Possibly
DMAC2 Byte
Pointer FlipFlop (RO).
0 = Cleared
1 = Set
(MVA)
Channel 3
DMA in
progress:
0 = No
1 = Possibly
PMU SMI Source Register 4
Default = XXh
Channel 2
DMA in
progress:
0 = No
1 = Possibly
Channel 1
DMA in
progress:
0 = No
1 = Possibly
Channel 0
DMA in
progress:
0 = No
1 = Possibly
Default = 00h
PMI#28, DMA:
0 = Clear
1 = Active
(MVA)
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82C465MV/MVA/MVB
4.6.3.7
DMA Register Read Back Provisions
The 82C465MVA part provides the means of reading those
DMA register settings that are normally not accessible in
order to restore the state after powering down the chip.
Saving Count and Address Registers
On the 82C465MVA part, only the current address and count
values can be read back. The base values are not shadowed
and cannot be read directly. However, this does not prohibit
saving and restoring base values. Using the count registers
as an example, when the SMM Suspend code starts to execute the possible states of the DMA transfer are:
Not yet started. The current count and the base count will be
identical.
Completed on an auto-initialized channel. The base count
will be restored to the current count and the two will be identical.
Completed on a non auto-initialized channel. The base
count is meaningless and can be restored to the current
count (which will be FFFFh after DMA completion).
In mid-transfer on an auto-initialized channel. The current
count and base count will be different. SMM code must perform the following steps.
1.
Read back the current count.
2.
Set the channel to “block verify” mode and make a software request to start the transfer.
3.
Read back the current count, which now will reflect the
base count instead (at the end of the transfer the current
count will be auto-initialized to the base count).
In mid-transfer on a non auto-initialized channel. The
base count is meaningless. Only the current count needs to
be read back.
For all these cases, the register values can be read back
directly from the DMA controller registers to which the base
values were originally written.
Saving Mode and Mask Register Contents
The IPC in the 82C465MVA part provides the means of reading back the mode and mask registers. Perform the following
steps, involving system I/O ports (not 82C465MVA configuration registers).
1.
Read I/O Port 00Eh to reset the mode register readback
counter for DMAC 1
2.
Do four successive reads from I/O Port 00Bh to retrieve
mode registers 0-3
3.
Read I/O Port 00Fh to return Channel 0-3 mask bits in
bits 0-3
4.
Read I/O Port 0DCh to reset the mode register readback
counter for DMAC 2
5.
Do four successive reads from I/O Port 0D6h to retrieve
mode registers 4-7
6.
Read I/O Port 0DEh to return Channel 4-7 mask bits in
bits 0-3.
Determining Programming and Transfer Progress
Aside from the registers already listed, the 82C465MVA logic
shadows the byte pointer flip-flop and provides special “inprogress” indicators for each channel. Using this information
along with the readable DMAC register information, SMM
Suspend code can save the state of the DMAC as follows.
1.
Read and save the DMA mode and mask registers from
the PMU.
2.
Read the “in-progress” bits to determine whether DMA
could be taking place on any channel. These bits are set
on the first DRQ after a channel is unmasked, and
cleared by a TC on that channel.
3.
Read the PMU byte pointer flip-flop setting for each
DMAC.
4.
Clear the byte pointer flip-flops by writing the appropriate
DMAC registers.
5.
Read and save all current count and current address values from the DMAC.
The 82C465MVA part can now be powered down.
Restoring Registers on Resume
On resuming operation, the DMAC register values can be
restored as follows.
1.
Restore the DMAC mode and mask register values.
2.
Restore the DMAC count and address values.
3.
If either of the saved PMU byte pointer flip-flop settings
indicates that a flip-flop was set, perform one read from
an appropriate DMAC count or address register to set
the flip-flop to its original state.
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82C465MV/MVA/MVB
4.6.3.8
LDEV# Sense Control
When the 82C465MV chip runs DMA to a local-bus device
(usually the video controller), the chip generates ADS#
instead of the CPU. During a DMA write cycle (I/O read, localbus write), the chip waits to sample LDEV# and ADS# low at
the same time before it enables its buffer to drive SD bus
data back to the local bus. If the local bus is heavily loaded,
the data may not be ready in time for the local-bus device to
latch it.
The 82C465MVA part provides a program bit to select a different sampling method in the case of DMA to the local bus
(see Table 4-67). When SYSCFG D6h[3] = 0, sampling is as
with the 82C465MV. When SYSCFG D6h[3] = 1, the buffer
enable control depends only on LDEV# and not on ADS#.
Effectively, the sampling window occurs one clock earlier.
Local-bus devices that decode LDEV# from address and status alone should have no problem meeting the early sample
requirement of this setting.
Table 4-67
4.6.3.9
Type F DMA Support
Improved DMA transfer performance is available on a channel-by-channel basis for those devices capable of shorter ISA
command pulses. Normally the 82C465MVB DMA cycle
width is six AT clocks for the read command and four AT
clocks for the write command. Enabling Type F DMA for a
channel changes this timing as follows.
• For ISA DMA devices: Read command (IOR# or MEMR#)
is two AT clocks, Write command (IOW# or MEMW#) is
one AT clock.
• For CISA DMA devices: CMD# is three AT clocks; MEMR#
or MEMW# is also three AT clocks.
Type F DMA is controlled through the EISA register scheme.
Only the bits shown are supported (see Table 4-68).
LDEV# Sampling for DMA to Local Bus
7
6
5
SYSCFG D6h
4
3
2
1
PMU Control Register 10
0
Default = 00h
Local bus
DMA LDEV#
sampling:
0 = Normal
1 = Sample
one clock
sooner
(MVA)
Table 4-68
Type F DMA Control
7
6
Port 40Bh (0-3) (MVB)
Not implemented.
Not implemented.
Port 4D6h (4-7) (MVB)
Not implemented.
Not implemented.
5
4
3
2
1
0
EISA DMA Extended Mode Register
Cycle timing:
00 = ISA-compatible
01 = ISA-compatible
10 = ISA-compatible
11 = Type F
Not implemented.
Not implemented.
DMA Channel:
00 = Channel 0
01 = Channel 1
10 = Channel 2
11 = Channel 3
EISA DMA Extended Mode Register
Cycle timing:
00 = ISA-compatible
01 = ISA-compatible
10 = ISA-compatible
11 = Type F
Not implemented.
Not implemented.
DMA Channel:
00 = Reserved
01 = Channel 5
10 = Channel 6
11 = Channel 7
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82C465MV/MVA/MVB
4.6.3.10 Timer Programming Registers
The IPC provides an 8254-type timer with three channels that
is register compatible with AT-type systems. The registers of
this logic module are listed below. These registers are
Table 4-69
accessed directly through the I/O subsystem (no index/data
method is used). Table 4-69 lists the register locations while
Table 4-70 gives the register bit formats.
Timer Control and Status Registers
Port Address for Timer
Name
Function
Counter
Registers
Access
Used to write and read the word-wide count. Writes always program the
base value. Reads return either the instantaneous count value or the
latched count value.
040h
Counter Mode
Command
Selects the operational mode for each timer counter.
Write 043h
Counter Latch
Command
Latches the count from the selected register for reading at the associated counter register access port.
Write 043h then read 040h, 041h, and/or
042h
Readback
Command
Selects whether count or status, or both, will be latched for subsequent
reading at the associated counter register access port. If both are
selected, status is returned first. This command can latch information
from more than one counter at a time.
Write 043h then read 040h, 041h, and/or
042h
Table 4-70
Channel 0
Channel 1
041h
Channel 2
042h
Timer Control Bits
7
6
5
4
Port 043h
3
2
1
0
Counter Mode Command (WO)
Counter select:
Counter access:
Mode select:
01 = Counter 1
00 = Counter latch command (see
below)
10 = Counter 2
01 = R/W LSB only
11 = Readback command (see
below)
10 = R/W MSB only
00 = Counter 0
11 = R/W LSB followed by MSB
Port 043h
000 = M0) Interrupt on terminal count
001 = M1) Hardware retrig. one-shot
X10 = M2) Rate generator
X11 = M3) Square wave generator
100 = M4) Software-triggered strobe
101 = M5) Hardware-triggered strobe
Count mode
select:
0 = 16-bit binary
1 = 4-decade
BCD
Counter Latch Command (WO)
Counter select:
Counter latch command = 00
Don't care
00 = Counter 0
01 = Counter 1
10 = Counter 2
11 = Illegal
Port 043h
Readback Command (WO)
Readback command = 11
Latch count?
0 = Yes
1 = No
Port 043h
OUT signal
status
Latch status?
0 = Yes
1 = No
Counter 2
select?
Counter 1
select?
Counter 0
select?
0 = Yes
1 = No
0 = Yes
1 = No
0 = Yes
1 = No
Reserved:
Write as 0.
Status Byte (RO)
Null count counter contents valid?
Return bits [5:0] written in Counter Mode Command (see above)
0 = Yes
1 = No (being
updated)
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Shadow Registers To Support Timer
Values written to the timer are not always directly readable in
the AT architecture. However, the 82C465MV shadows these
values as they are written so that they can be read back later
through the configuration registers (see Table 4-71). The values from SYSCFG 90h to 96h are valid only when a Counter
Mode Command byte for the counter has been written to the
timer register at I/O Port 043h. Setting Port 043h[5:4] = 11
starts the sequence.
Table 4-71
4.6.3.11 Writing/Reading I/O Port 070h
The AT architecture does not allow the readback of the NMI
enable bit settings and the RTC index value written at I/O
Port 070h. However, the 82C465MV logic makes the NMI
Enable bit setting, along with the last RTC index value written
to I/O Port 070h, available for reading in its shadow register
set. Table 4-72 shows the bit format for this register.
RTC Index Shadow Register
This shadow register is read as a normal 82C465MV configuration register: write 98h to I/O Port 022h followed immediately by an I/O read at I/O Port 024h. Table 4-73 shows the
bit formats for this register.
Timer Shadow Registers
7
6
5
4
3
2
1
0
SYSCFG 90h
Timer Channel 0 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 91h
Timer Channel 0 Count High Byte: A[15:8]
Default = XXh
SYSCFG 92h
Timer Channel 1 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 93h
Timer Channel 1 Count High Byte: A[15:8]
Default = XXh
SYSCFG 94h
Timer Channel 2 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 95h
Timer Channel 2 Count High Byte: A[15:8]
Default = XXh
SYSCFG 96h
Write Counter High/Low Byte Latch
Default = XXh
Unused
Unused
Table 4-72
Channel 2 read
LSB toggle bit
Channel 1 read
LSB toggle bit
Channel 0 read
LSB toggle bit
Channel 2 write
LSB toggle bit
Channel 1 write
LSB toggle bit
Channel 0 write
LSB toggle bit
3
2
1
0
2
1
0
RTC Index Register - I/O Port 070h
7
6
5
4
Port 070h
RTC Index Register (WO)
NMI enable:
RTC/CMOS RAM Index
0 = Disable
1 = Enable
Table 4-73
RTC Index Shadow Register
7
6
5
SYSCFG 98h
4
3
RTC Index Shadow Register (RO)
Default = 00h
- CMOS RAM Index last written
NMI enable
setting
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4.6.3.12 Additional Floppy Support
The 82C465MVA part allows floppy register writes to be
shadowed for easier management of power-down operations.
Register writes to primary FDC port addresses 3F2h and
3F7h, and to secondary FDC port addresses 372h and 377h,
are always copied to the 82C465MVA shadow registers.
In addition, the 82C465MVA logic provides a new register bit
to select whether additional FDC port accesses should be
monitored by DSK_ACCESS. On the original 82C465MV
part, only port 3F5h is monitored. If the new bit is set to
enable additional monitoring, DSK_ACCESS will monitor I/O
reads and writes to all primary and secondary FDC port
Table 4-74
7
6
5
4
3
2
1
3F2h+3F7h Shadow Register
Shadows
3F7h[1] “Disk
Type” bit 1
(MVA)
Shadows
Shadows
Shadows
3F2h[5] “Drive 2 3F2h[4] “Drive 1 3F2h[3] “DMA
Motor” bit
Motor” bit
Enable” bit
(MVA)
(MVA)
(MVA)
Shadows
377h[1] “Disk
Type” bit 1
(MVA)
Shadows
372h[5] “Drive
2 Motor” bit
(MVA)
SYSCFG BCh
Shadows
372h[7] “Mode
Select” bit
(MVA)
4.6.3.13 IRQ8 Polarity
The recognition of the IRQ8 interrupt can be inverted through
SYSCFG 50h[5] (see Table 4-75). In the normal AT architecture, IRQ8 is active low and driven by an open-collector output of the RTC against a pull-up resistor. If the 82C465MV
chip is used in conjunction with the 82C602 Notebook Companion chip, IRQ8 polarity should be set to active high.
Floppy Shadow and Control Registers
SYSCFG 9Bh
Shadows
3F2h[7] “Mode
Select” bit
(MVA)
addresses. Note that this feature can be used in conjunction
with the new I/O port address registers at SYSCFG D6h and
D7h to determine which register access caused the trap.
Table 4-74 shows the formats for the above mentioned bits.
Default = 00h
Shadows
3F2h[2] “Soft
Reset” bit
(MVA)
Shadows
3F7h[0] “Disk
Type” bit 0
(MVA)
Shadows
372h[2] “Soft
Reset” bit
(MVA)
Shadows
377h[0] “Disk
Type” bit 0
(MVA)
372h+377h Shadow Register
SYSCFG D6h
Shadows
372h[4] “Drive
1 Motor” bit
(MVA)
Shadows
372h[3] “DMA
Enable” bit
(MVA)
Shadows
3F2h[0] “Drive
Select” bit
(MVA)
Default = 00h
PMU Control Register 10
Shadows
372h[0] “Drive
Select” bit
(MVA)
Default = 00h
ACCESS trap
bit A9 (RO)
(MVA)
DSK_ACCESS:
0 = 3F5h only
1 = All FDC
ports
(3F2,4,5,7h
and
372,4,5,7h)
(MVA)
SYSCFG D7h
0
ACCESS Port Address Register
ACCESS trap
bit A8 (RO)
(MVA)
Default = 00h
ACCESS Trap Address bits A[7:0]:
- These bits, along with A[9:8] in bits D6h[1:0], provide the 10-bit I/O address of the port access that caused the SMI trap. SYSCFG D6h[2]
indicates whether an I/O read or I/O write access was trapped.
(MVA)
Table 4-75
7
PMU Control Register - SYSCFG 50h
6
5
SYSCFG 50h
4
3
PMU Control Register 5
2
1
0
Default = 00h
IRQ8 polarity:
0 = Active low
1 = Active high
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82C465MV/MVA/MVB
4.6.4
Integrated Local-Bus Enhanced IDE Interface
Enhanced IDE support through the local bus is available on
the 82C465MV as a register-programmable option. Logic
from the proven OPTi 82C611 local-bus IDE controller is
used to incorporate this option. Note, however, that the write
posting and read prefetching features of the separate
82C611 device are not supported by the 82C465MV chip.
4.6.4.1
Hardware Considerations
Local-bus IDE support requires seven pins. Six of the signals
are shared signals that also go to their active state (from the
perspective of the IDE) during non-IDE cycles. Therefore,
these signals must be qualified by DBE#; they cannot be connected directly to the IDE interface. The signals are defined
as follows.
• Drive Read (DRD#) - Provides the read strobe signal for
the IDE drive; also switches the data buffer direction
toward the SD bus during read cycles. The 82C465MV
drives DRD# on the BALE line if Compact ISA is disabled
and on TC is CISA is enabled. Refer to Section 4.6.5
"Compact ISA Interface".
• Address bits 1:0 (DA1:0) - Provided directly from the
82C465MV SA1:0 signals.
• Address bits 2 and 9 (DA2 and DA9) - Buffered version of
CPU CA2 and CA9.
• Address bit 7 can be used for four drive support (MVB).
• Drive Buffer Enable (DBE#) - Enables the buffer for control
lines DRD# and DWR#, and address bits DA9, 2, 1, and 0
to the IDE drive, as well as the data bus buffers. DBE#
replaces the TRIS# signal on pin 176.
The DRD# and DWR# signals and the other control signals
are separated from the standard ISA bus I/O control signals
to avoid the incompatibility that can occur when signals such
as IOR# and IOW# are “short pulsed” as they would be for an
IDE cycle. Short pulses on these lines can cause incorrect
operation on some ISA peripheral devices, even if the read
and write is not intended for those devices.
Figure 4-6 illustrates how the connections would typically be
made.
• Drive Write (DWR#) - Provides the write strobe signal for
the IDE drive. The 82C465MV drives DWR# on the
SBHE# line.
Figure 4-6
Interface to Integrated IDE Controller
IOCHRDY
150
HDCHRDY
82C465MV
SBHE#
TC*
SA2
SA1
SA0
74244
161
DWR#
175
DRD#
170
DA2
148
DA1
146
DA0
HDCS0#
SA9
SA9
HDCS1#
DBE#
176
1OE#
2OE#
* DRD# comes out on BALE if Compact ISA interface is disabled. See Section 4.6.5, "Compact ISA Interface" on page 98.
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4.6.4.2
Performance and Power
Enhanced IDE uses the SD bus for its data transfers, but
does not use ISA bus transfers because of its dedicated
DRD#, DWR#, and DBE# signals. Essentially, the local-bus
IDE controller can run extremely short cycles because all timing aspects of the cycle are directly programmable to meet
the capabilities of the drive being used.
The 82C465MV chipset implementation of local-bus IDE is
designed to save power. The buffers to/from the IDE are
tristated between cycles. Therefore, no power is wasted toggling the IDE data lines when the IDE is not in use.
An innovative method is used to handle Port 3F7h[7] from the
external floppy controller. Bit 7 from the FDC must be
attached to bits [6:0] from the IDE controller whenever an I/O
read of 3F7h takes place, and normally requires a separate
IDED7 line from the IDE. On the 82C465MV, two separate
cycles take place whenever the an I/O read from 3F7h takes
place. First, the local-bus IDE cycle is run using DRD# and
DBE#. Then an ISA bus I/O cycle is run. When the
82C465MV returns a value to the CPU, it provides bits [6:0]
read from the IDE and bit 7 from the ISA bus.
4.6.4.3
Signal Connection
With the IDE interface disabled, the chip pin functions remain
compatible with those of the 82C463MV. When the IDE interface is enabled, the only function actually lost is TRIS#.
TRIS# serves only to indicate that the system is in Suspend
mode, a status which can also be derived from the PPWR0-1
outputs. The various ISA bus signals that are used for IDE
command and chip select lines are signals that would normally require qualification by other signals; toggled by themselves, they should not cause any action or conflicts on the
ISA bus.
4.6.4.4
DBE (TRIS) Polarity
The DBE# line (or the TRIS# line if the IDE interface is not
enabled through SYSCFG ACh[3]) is normally an active low
signal. Since this polarity may not be correct for all connected
devices, the polarity can be inverted through a strap option.
The inversion is valid for either the TRIS# or the DBE# func-
Table 4-76
tion, changing them to TRIS and DBE respectively. The
options available are as follows.
• Normal active-low sense, for DBE# (TRIS#):
Do not strap TRIS# at reset (internal pull-up selects option)
• Active-high sense, for DBE (TRIS):
Pull TRIS# low at reset (can be strapped permanently with
10KΩ to ground)
4.6.4.5
Programming
The controller can be enabled to respond to I/O accesses
either in the 1F0-1F7h and 3F6-3F7h range, or in the 170177h and 376-377h range, but never to both. I/O port references in this document list both ranges, but only one range
can ever be active at a time (always selected by SYSCFG
ACh[2] regardless of other mode settings).
There are two ways to program operation of the local bus IDE
controller. “Basic” timing is the fixed timing selection available
through SYSCFG ACh[7:4]. “Enhanced” timing refers to the
precise control provided through the 611 register set.
Easy Programming Method (Basic)
Use SYSCFG ACh[7:4] to select the CPU speed and the
mode of operation. The IDE controller logic will generate
commands for the correct number of CPU clocks to approximate the selected mode timing.
IDE Interface Enable SYSCFG ACh[3] - When the IDE interface is disabled, TRIS# is available. When the IDE interface
is enabled, pin 176 (TRIS#) becomes DBE# and TRIS# is no
longer available. PPWR0-1 in their auto-toggle mode can
perform essentially the same function as TRIS#.
Port 3F7 Decode Disable SYSCFG ACh[1] - Prevents port
3F7 reads from being combined with IDE controller reads in
situations where this arrangement causes problems. When
SYSCFG ACh[1] = 0, 3F7h[7] comes from the ISA bus;
3F7h[6:0] (or 377h[6:0] if bit 2 = 1) come from local-bus IDE.
When SYSCFG ACh[1] = 1, 3F7h[7:0] come from the ISA
bus.
Table 4-76 gives the bit formats for SYSCFG ACh. The setting in SYSCFG ACh[7:4] will select cycle timings according
to the scheme in Table 4-77.
IDE Controller Configuration
7
6
SYSCFG ACh
Chipset input clock frequency:
00 = 50MHz
01 = 40MHz
10 = 33MHz
11 = 20/25MHz
5
4
3
2
1
IDE Interface Configuration Register
IDE command pulse duration:
00 = 600ns
01 = 383ns
10 = 240ns
11 = 180ns
IDE interface:
0 = Disable
1 = Enable
IDE port
address select:
0 = 1F0-7h,
3F6-7h
0
Default = 00h
3F7h[6:0]
source:
Reserved
0 = Local IDE
1 = ISA bus
1 = 170-7h,
376-7h
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82C465MV/MVA/MVB
Table 4-77
Automatic Cycle Settings Available Through SYSCFG ACh[7:4]
SYSCFG
ACh[7:4]
Expected Input Clock
Frequency (MHz)
Setup Time
(clocks)
Command Pulse
(clocks)
Recovery Time
(clocks)
Maximum
Cycle Time
(clocks)
0000
50
4
9
17
30
0001
3
7
10
20
0010
2
6
4
12
0011
2
5
2
9
8-bit
--
15
14
31
3
7
14
24
0101
3
6
7
16
0110
2
5
3
10
0111
2
4
2
8
8-bit
--
12
11
25
3
6
11
20
1001
2
5
6
13
1010
2
4
2
8
1011
1
3
2
6
8-bit
--
10
9
20
2
5
8
15
1101
2
4
4
10
1110
1
3
2
6
1111
1
2
2
5
8-bit
--
8
6
15
0100
40
1000
33
1100
25
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82C465MV/MVA/MVB
Precise Programming Method (Enhanced)
More precise control of IDE operation is available by using
the “611” register set, so called because it is register-compatible with the register set used in the OPTi 82C611 standalone local-bus IDE controller. This register set is hidden
behind the IDE drive I/O ports and is not normally accessible.
Timing 0 and Timing 1
The 611 register set supports two separate IDE drives on a
single cable with independent timing requirements. Application software writes bit 1F6h[4] or 176h[4] to select between
drive 0 and 1 on the cable. The 611 core tracks writes to this
I/O port and switches its timing. The correspondence is not
necessarily direct, however, between Drive 0 and Timing 0,
for example. Each drive can select its timing from two
sources, which are themselves selectable according to bit
1F3/173h[7].
Table 4-78
“Enhanced” choices when bit 1F3/173h[7] = 1:
1. Timing 1
2. Timing 0
The basic or enhanced timing choices are made as follows.
Internal to the 82C465MVA, there is a single 611 register set.
The 611 registers are available only when enabled through a
special unlocking procedure. Timing choices are made
according to Table 4-78 and Table 4-79 through bits
1F3/173h[2-3] for Drives 0 and 1, respectively. Once all programming is complete, the 611 register set again becomes
hidden. From then on, accesses to the IDE Port bit
1F6/176h[4] are tracked to determine the timing to use.
82C465MVA Operation with Primary I/O Range Selected
SYSCFG
ACh[2]
I/O Range
0
Primary
SA7 Value
IDE Drive Setting
(IDE Head/Drive
Select Register)
Drive Selected
Timing Selected by
Hidden 611 Register Bit
1
1F6h[4] = 0
0
1F3h[2]
1F6h[4] = 1
1
1F3h[3]
1F0-7h, 3F6-7h
Table 4-79
“Basic” choices when bit 1F3/173h[7] = 0:
1. The “easy method” timings from SYSCFG ACh[7:4]
2. Timing 0
82C465MVA Operation with Secondary I/O Range Selected
SYSCFG
ACh[2]
I/O Range
1
Secondary
170-7h, 376-7h
SA7 Value
IDE Drive Setting
(IDE Head/Drive
Select Register)
Drive Selected
Timing Selected by
Hidden 611 Register Bit
0
176h[4] = 0
0
173h[2]
176h[4] = 1
1
173h[3]
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82C465MV/MVA/MVB
Subset Registers for Timing 0 and Timing 1
Within the single 611 register set, there are two subsets of
registers to program the Read Pulse Width, Write Pulse
Width, Read Recovery Time, and Write Recovery Time separately for Timing 0 and Timing 1. The register set loaded by
Table 4-80
writing to 1F0/1h or 170/1h is selected by bit 1F6/176h[0].
Setting this bit to 0 allows writes to 1F0/1h or 170/1h to program Timing 0; setting the bit to 1 allows programming of
Timing 1.
“611” Register Set
7
6
5
4
Port 1F0h/170h
3
2
1
0
Read Cycle Timing Register
Read recovery time:
Read pulse width:
The value written to these bits, plus 1, selects the DRD# pulse width
for a read from the 16-bit data register.(1)
The value written to these bits, plus 2, determines the minimum time
allowed between the end of DRD# and the start of the next IDE chip
select (HDCS0-1#, derived from TC).(1)
(1) The value indicates the width in terms of FBCLKIN cycles.
Port 1F1h/171h
Write Cycle Timing Register
Write pulse width:
Write recovery time:
The value written to these bits, plus 1, selects the DWR# pulse width
for a write to the 16-bit data register.(1)
The value written to these bits, plus 2, determines the minimum time
allowed between the end of DWR# and the start of the next IDE chip
select (HDCS0-1#, derived from TC).(1)
(1) The value indicates the width in terms of FBCLKIN cycles.
Port 1F2h/172h
ID Register (WO)
82C611 register access:
Reserved
ID bits:
0x = Enable
These bits must always be written
as 11.
10 = Two 1F1/171h reads to
enable (default)
11 = Permanently disable
Port 1F3h/173h
Control Register 1
Timing register
value select:
Reserved
Drive 1 timing
select:
0 = Basic
1 = Enhanced
Port 1F5h/175h
ISA 3F7h[7]
status
Drive 0 timing
select:
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
Reserved
IDE operation:
0 = Disable
1 = Enable
Status Register (RO)
Revision number:
IRQ14 status
SYSCFG ACh[5:4] setting
SYSCFG ACh[7:6] setting
Returns 00 on present silicon revision.
Port 1F6h/176h
Reserved
Secondary Setup and Hold Timing Register
Address setup time:
Channel ready hold time:
The value written, plus 1, selects
the address setup time.(1)
The value written, plus 2, selects the delay for setting the command pulse inactive from when the controller sees IOCHRDY go high.(1)
Timing register
load select
0=Timing 0
1=Timing 1
(1) The value indicates the width in terms of FBCLKIN cycles.
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82C465MV/MVA/MVB
Step-by-Step Programming Procedure
Each phase of 611 programming is described below. Before
accessing the 611 register set, the basic interface must be
set up as follows.
1.
Enable the external IDE controller interface by setting
SYSCFG ACh[3] = 1.
2.
Select the I/O range to be used through SYSCFG
ACh[2]. For the purposes of this example, SYSCFG
ACh[2] is set to 0 to select the 1F0-7h and 3F6-7h range.
If the 170-7h and 376-7h range is selected instead, use
the x7x port instead of the xFx port for each of the following steps.
3.
Use SYSCFG ACh[1] to select whether 3F7h accesses
will be directed to the IDE drive. If enabled, only bits [6:0]
will come from the local bus IDE interface; bit 7 always
comes from the ISA bus because it belongs to the floppy
disk controller (if present).
The basic IDE interface is now available. SYSCFG ACh[7:4]
can be used to select the fixed timings listed above. If these
fixed timings are sufficient, there is no need to use the 611
register set.
Enabling Access to 611 Register Set
The 611 register set must be enabled through a very specific
procedure.
3.
Write 1F6h with bit 0 = 1 to be able to program Timing 1.
4.
Program 1F0h and 1F1h with the correct values for Timing 1.
5.
Write 1F6h with bits [5:1] set to select the required
address setup time and IOCHRDY recovery time. These
values apply to both Timing 0 and Timing 1. Bit 0 can be
left in any state.
The timing sets are now programmed. The next step is to
assign one of the timing sets to each drive.
Associating Timing with Each Drive
Register 1F3h selects timing options for the drives, and is the
last step necessary before “hiding” the 611 register set and
enabling 611 operation. Prepare a programming byte in
which:
1.
Bit [7] =1 to enable Enhanced timing, thus allowing both
drives to select between the precise timing sets Timing 0
and Timing 1.
2.
Bit [2] selects Timing 0 or Timing 1 for drive 0, and bit [3]
does the same for drive 1.
3.
Bit [0] = 1 to enable all of the programming established to
this point.
Set all other bits to 0, and write this value to 1F3h.
1.
Perform a word read of 1F1h two times. This operation
makes the 611 register set accessible for the next I/O
operation.
Enabling IDE Operation and Hiding 611 Register Set
The 611 register set must be hidden from standard access
before IDE operation can begin. Two options are available.
2.
Write 00000011b (03h) to Port 1F2h. This programming
keeps the 611 registers accessible indefinitely.
• Write 1F2h with 11000011b (C3h) to disable 611 register
access and fully enable IDE operation, and also prevent
any future access to the 611 register set until the next
hardware reset.
The 611 register set is now accessible. No IDE operation can
take place as long as the register set access is enabled.
Setting Up Enhanced 611 Timing
Once the 611 register set is unlocked, Timing 0 and Timing 1
can be programmed.
1.
Write x1F6h with bit 0 = 0 to be able to program Timing
0.
2.
Program the upper and lower nibbles of 1F0h and 1F1h
with the correct values for Timing 0. The read and write
pulse widths can be independently programmed to be as
short as one clock, while the recovery time for these
cycles can be as short as two clocks.
• Write 1F2h with 10000011b (83h) to disable 611 register
access and fully enable IDE operation, but leave open the
future possibility of accessing the 611 register set by
restarting this whole procedure.
Application software can now control the drive selection and
the timing with which it will be accessed through bit 1F6h[4].
OPTi
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Page 95
82C465MV/MVA/MVB
4.6.4.6
Four-Drive IDE Support
The 82C465MV and 82C465MVA parts provide local bus IDE
controller logic that supports two separate IDE drives with
independent timing requirements. However, both drives must
be on a single cable that responds either to 1F0-7h and 3F67h (main I/O range) accesses or to 170-7h and 376-7h (auxiliary I/O range) accesses. Writing bit 1F6h[4] (main) or
176h[4] (auxiliary) selects between Drive 0 and 1 in the
selected range. Internally, there is only a single register set
that is selected by SA7 according to the setting of SYSCFG
ACh[2].
The 82C465MVB part maintains backward compatibility with
its predecessors, but allows both the primary and secondary
I/O ranges to be claimed by the IDE controller; SYSCFG
Table 4-81
ACh[2] is ignored in this mode. The DBE# signal must then
be qualified by SA7 (with external logic) to select between the
two cables. There is still just a single set of internal registers
that are common to both the 1Fx/3Fx and 17x/37x
addresses, with the exception of bits 1F3h[3:2] and
173h[3:2], which are separate. In this way, either of the timing
sets 0 and 1 can be programmed individually for any of the
four drives. The ACh[5:4] setting can also be used.
Setting SYSCFG 3Fh[5]=1 enables four IDE drive support
mode.
Tables 4-81 through 4-83 shows the discussed programming
drive selections.
82C465MVA Operation with Primary I/O Range Selected
SYSCFG
ACh[2]
I/O Range
IDE Drive Setting
Drive Selected
Timing Selected by
0
Primary
1F6h[4] = 0
0
1F3h[2]
1F0-7h, 3F6-7h
1F6h[4] = 1
1
1F3h[3]
Table 4-82
82C465MVA Operation with Secondary I/O Range Selected
SYSCFG
ACh[2]
I/O Range
IDE Drive Setting
Drive Selected
Timing Selected by
0
Primary
1F6h[4] = 0
0
1F3h[2]
1F0-7h, 3F6-7h
1F6h[4] = 1
1
1F3h[3]
Table 4-83
82C465MVB Operation with Four Drive Support Selected
I/O Range
IDE Drive Setting
Drive
SA7
Timing Selected by
Main Cable
1F6h[4] = 0
0
1
1F3h[2]
1F0-7h, 3F6-7h
1F6h[4] = 1
1
Auxiliary Cable
176h[4] = 0
0
170-7h, 376-7h
176h[4] = 1
1
1F3h[3]
0
173h[2]
173h[3]
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82C465MV/MVA/MVB
Performance Improvement
Bits 1F3h/173h[5:4] allow extra control over the register settings normally available at 1F0-1h/170-1h. These bits are not
Table 4-84
controlled by SYSCFG 3Fh[5]. Table 4-84 shows the registers associated with four drive IDE control.
Four Drive IDE Control
7
6
5
4
SYSCFG 3Fh
3
2
1
Misc. Control Register
0
Default = 00h
Four IDE
drive support:
0 = Disable
1 = Enable
(MVB)
Port 1F3h (MVB)
Timing register
value select:
0 = Basic
1 = Enhanced
Port 173h (MVB)
Primary Cable IDE Control Register 1
Reserved
Timing 1
performance:
Timing 0
performance:
0 = 465MVcompatible
0 = 465MVcompatible
1 = Reduce
cmd. pulse
1/2 clock,
recovery
time 1/2
clock
1 = Reduce
cmd. pulse
1/2 clock,
recovery
time 1/2
clock
Primary Cable
Drive 1 timing
select:
Primary Cable
Drive 0 timing
select:
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
Reserved
IDE operation:
0 = Disable
1 = Enable
Secondary Cable IDE Control Register 1
Secondary
Cable Drive 1
timing select:
Secondary
Cable Drive 0
timing select:
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Basic:
0 = ACh[5:4]
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
-Enhanced:
0 = Timing 1
1 = Timing 0
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Page 97
82C465MV/MVA/MVB
4.6.5
Compact ISA Interface
The 82C465MVB chipset incorporates the OPTi Compact
ISA (CISA) interface. This interface allows connection of any
Compact ISA peripheral device, such as the OPTi 82C852
PCMCIA Controller. The Compact ISA Specification is a separate document that describes the interface in detail.
The Compact ISA implementation must deal with certain
issues that are specific to the interface architecture.
• ATCLK cannot be stopped without a specific stop clock
cycle, since CISA depends on clock edges to transfer
interrupts. The 82C465MVB can be programmed to generate this stop clock cycle, both automatically and manually.
• The CISA interface generates an AT Backoff (ATB#) signal to the 465MVB to make an interrupt or DMA request.
The CISA interface is required to backoff any ISA cycle it
has already started as long as it has not yet asserted ALE.
ATB# will come, at latest, one-half ATCLK before ALE#
would be asserted. Once ATB# is asserted, the
82C465MVB must inhibit all DMA activity and must prevent an EOI command to the interrupt controller from taking effect until ATB# is de-asserted and the new DRQ/IRQ
states are latched in.
weak pull-up on this pin until its programming registers
are written. A write to SYSCFG 57h disables the pull-up
resistor. Therefore, software should enable CMD#
before writing SYSCFG 57h.
- SEL#/ATB# (I) - CISA peripheral device “selected”
handshake input during ISA cycles; AT backoff request
between cycles; clock restart request during idle mode.
SEL#/ATB# is on pin 186 and replaces the RI pin on the
82C465MVB part when the CISA interface is enabled.
The CISA interface requires a pull-up resistor on this
line, which is automatically enabled when the
SEL#/ATB# function is selected.
- CDIR (O) - Optional CISA buffer direction signal. For
desktop-type designs where the CISA signals are buffered on the motherboard to connect through a long ribbon cable to 82C852 PCMCIA Controller(s). CDIR is on
pin 78 and replaces the RAS4# function.
The Compact ISA Control Registers SYSCFG F8h, F9h, and
FAh enable the interface and control various features. The bit
formats for SYSCFG F8h and F9h are shown in Table 4-85.
Refer to Table 4-86 for SYSCFG FAh bit formats.
Note:
• The 82C465MVB Compact ISA involves two mandatory
signals and one optional signal.
- CMD# (O) - Command, generated by the 82C465MVB
to run CISA cycles. CMD# is on pin 173 and replaces
the PIO1 function on the 82C465MVB part when the
CISA interface is enabled. To eliminate the need for an
external keeper resistor, the 82C465MVB implements a
Table 4-85
The Compact ISA interface uses the ALE signal for
all its cycles. The 82C465MV and 82C465MVA parts
also use ALE as the DRD# signal for local bus IDE.
Therefore, when CISA is enabled, the DRD# signal
moves to TC from ALE so that ALE will not toggle
except on ISA/CISA cycles. Use SA9 instead of TC
on the IDE buffer to generate CS0# and CS1#.
Compact ISA Control Registers
7
6
5
SYSCFG F8h
4
3
2
1
Compact ISA Control Register 1 (MVB)
Inhibit MRD#
and MWR# if
SEL# asserted
on DMA cycle?
Inhibit MRD#
and MWR# if
SEL# asserted
on memory
cycle?
0 = No
1 = Yes
0 = No
1 = Yes
Inhibit IORD#
and IOWR# if
SEL# asserted
on I/O cycle?
0 = No
1 = Yes
SYSCFG F9h
IRQ15
assignment:
0 = IRQ15
1 = RI
Reserved
Fast CISA
memory cycle:
0 = Disable
(ISA# = 0)
Default = 00h
Pin 78
function:
0 = RAS4#
1 = CDIR
End-of-Interrupt Hold:
Delays 8259 recognition of EOI
command to prevent false interrupts.
0 = Always, per
AT spec.
1 = Synchronously, per
CISA spec.
00 = None
01 = 1 ATCLK
10 = 2 ATCLKs
11 = 3 ATCLKs
Stop clock count bits CC[2:0]:
Stop clock cycle indication to CISA devices of how
many ATCLKs to expect before the clock will stop.
000 = Reserved
001 = 1 ATCLK (default)
...
111 = 7 ATCLKs
Compact ISA
Interface (reassigns pins 173,
186):
0 = Disable
1 = Enable
1 = Enable
(ISA#=1)
Compact ISA Control Register 2 (MVB)
SPKD signal
driving:
0
Default = 00h
Generate CISA stop clock cycle (if
not already stopped):
00 = Never
01 = On STPCLK# cycles to the
CPU (hardware)
10 = Immediately (software)
11 = Reserved
OPTi
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82C465MV/MVA/MVB
Compact ISA Interface Enable bit - Provides master control
over whole interface and enables reassignment on pins 173
and 186 to support CISA. If this bit is 0, all Compact ISA functions are disabled and no address strobing occurs on the SD
bus. No other Compact ISA register bits should be set when
SYSCFG F8h[0] = 0.
CDIR Pin Enable bit - Selects whether pin 78 will be reassigned as CDIR to control CISA cable driver direction.
IRQ15 Assignment - Reassigns IRQ15 from the PCMCIA
slot so that it can generate a Ring Indicator (RI) SMI instead.
Inhibit Commands if SEL# Asserted - These bits control
whether commands will be hidden from ISA bus peripheral
devices if the cycle is claimed by a CISA device. The feature
allows devices that use the same memory or I/O space to
avoid conflict with each other; CISA devices always preempt
ISA devices. A separate bit is provided for memory signals
during DMA, which would allow fly-by transfers to function
between a PCMCIA DMA card and an ISA memory device.
SPKD Signal Driving - Selects the CISA scheme for shared
audio outputs. Refer to the CISA specification for complete
information.
4.6.5.1
CISA Stop Clock Cycle Generation
SYSCFG F9h[1:0] enable the 82C465MVB to generate the
Stop Clock Broadcast cycle on the CISA bus, after which it
can stop the AT clock. There are two methods of generating
a CISA stop clock cycle: hardware-controlled and softwarecontrolled.
Hardware CISA Stop-Clock Control
Hardware-controlled CISA stop clock cycle generation occurs
automatically, if ATCLK has not been stopped already, whenever SYSCFG F9h[1:0] = 01 and the 82C465MVB chip
receives a stop grant cycle (or STPGNT# signal such as
SUSPA#) from the CPU. The chipset generates a stop
request to the CPU when changing CPU speeds or stopping
the CPU clock; the CPU responds with a stop grant.
When SYSCFG F9h[1:0] = 01 to enable automatic stop clock
cycle generation on CISA, Address Phase 1 of each CISA
cycle will not be generated until the cycle is decoded to be an
ISA cycle. The logic adds in one extra AT clock before the
cycle starts to properly start the CISA interface. Inhibition of
CISA Phase 1 generation saves power by avoiding unnecessary toggling on the MAD bus.
When SYSCFG F9h[1:0] = 00 to disable hardware stop clock
mode, the 82C465MVB logic drives Address Phase 1 of each
CISA cycle as soon as it detects ADS# active. In this mode,
there is no AT clock start-up delay. Software stop-clock control can still be used to stop the clock and save power.
Software CISA Stop-Clock Control
Software-controlled CISA stop clock cycle generation occurs
only when SYSCFG F9h[1:0] are written to 10. A CISA stop
clock cycle is forced onto the CISA bus. Whenever SYSCFG
F9h[1:0] = 10, SYSCFG F9h[7:2] written to this register are
ignored so no “read/modify/write” procedure is required. This
cycle is generated only once; the bits then revert to their previous setting (00 or 01).
Stop Clock Count bits CC[2:0] - Indicate to CISA devices
how many ATCLKs to expect before the clock will stop. The
default setting of one ATCLK is correct for most applications.
4.6.5.2
Configuration Cycle Generation
The 82C465MVB part can be programmed to generate one
CISA Configuration Cycle, the Stop Clock Broadcast cycle,
automatically after a period of inactivity. In order to provide
for future Configuration Cycle possibilities, the 82C465MVB
CISA interface also includes a generic command generation
scheme. This scheme takes advantage of the Scratchpad
registers already present in the 82C465 series parts, and
does not prevent their continued use as Scratchpad registers.
They must be reprogrammed only in order to send out a Configuration Cycle.
To generate a Configuration Cycle:
1. Load the phase 1 word in SYSCFG 6C-6Dh.
2. Load the phase 2 word in SYSCFG 6E-6Fh.
3. Load the data phase word in SYSCFG 52-53h.
4. Write SYSCFG FAh[0] = 1 to run the cycle.
The CISA interface will generate the desired Configuration
Cycle. The cycle will always be a Broadcast (write) cycle,
since there is no inherent means of receiving information
back from the Configuration Cycle. Whenever SYSCFG
FAh[0] = 1, SYSCFG FAh[7:1] written to this register are
ignored so no “read/modify/write” procedure is required.
SYSCFG FAh[0] is automatically cleared to 0 after the cycle
runs.
OPTi
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Revision: 3.0
Page 99
82C465MV/MVA/MVB
4.6.5.3
Driveback Cycle Handling
Normally the 82C465MVB will transfer the IRQ and DRQ
information of an IRQ/DRQ Driveback Cycle to the interrupt
and DMA controllers. However, SYSCFG FAh[2] allows
driveback cycle information to simply be latched and an SMI
generated. In this way, SMM code can determine how (or
whether) to deal with the changed IRQ or DMA status. The
Table 4-86
information is latched in the new Scratchpad registers 7-10.
These new registers can be used for general purpose storage if Compact ISA is disabled. PMI#36 is generated for this
event, and is read/cleared through SYSCFG EAh[7].
Table 4-86 shows the registers associated with CISA cycle
generation.
CISA Cycle Generation Registers
7
6
SYSCFG 52h
5
4
3
Scratchpad Register 1
2
1
0
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Data phase information, low byte (MVB)
SYSCFG 53h
Scratchpad Register 2
Default = 00h
General purpose storage byte
- For CISA Configuration Cycles: Data phase information, high byte (MVB)
SYSCFG 6Ch
Scratchpad Register 3
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, low byte (MVB)
SYSCFG 6Dh
Scratchpad Register 4
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, high byte (MVB)
SYSCFG 6Eh
Scratchpad Register 5
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, low byte (MVB)
SYSCFG 6Fh
Scratchpad Register 6
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, high byte (MVB)
SYSCFG FCh
Scratchpad Register 7
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: IRQ phase information, low byte (RO) (MVB)
SYSCFG FDh
Scratchpad Register 8
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: IRQ phase information, high byte (RO) (MVB)
SYSCFG FEh
Scratchpad Register 9
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: DRQ phase information, low byte (RO) (MVB)
SYSCFG FFh
Scratchpad Register 10
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: DRQ phase information, high byte (RO) (MVB)
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Table 4-86
7
CISA Cycle Generation Registers (cont.)
6
5
SYSCFG FAh
4
2
1
Compact ISA Control Register 3 (MVB)
Reassign
EPMI3 as RI?
0 = No
1 = Yes
Use in case RI
is assigned as
SEL#/ATB#
SYSCFG EAh
3
Reassign
EPMI4 as
IOCHCK#?
0 = No
1 = Yes
Use in case
IOCHCK# is
assigned as
KBCRSTIN
Resume from
Suspend on
SEL#/ATB#
low:
0 = Disable
1 = Enable
CMD# state
during
Suspend:
0
Default = 00h
Driveback
cycle handling:
Configuration
cycle generation:
0 = Pass DRQs
0 = Driven inacand IRQs
0 = No action
tive (high)
1 = Latch info
1 = Run cycle
1 = Driven low
and generusing
ate SMI
scratchpad
PMU Source Register 5 (MVB)
Default = 00h
Resume Source Register
Default = 00h
IRQ/DRQ
Driveback Trap
PMI#36:
0 = Inactive
1 = Active
Write 1 to clear
SYSCFG 6Bh
CISA SEL#/
ATB# low
caused
Resume (RO)?
0 = No
1 = Yes
(MVB)
MD# State During Suspend - If the CISA bus devices are to
be powered down during Suspend mode, setting SYSCFG
FAh[2] = 1 drives the CMD# line low with the same timing as
the PPWR0-1 lines so that there is no current leakage path.
Resume from Suspend on SEL#/ATB# low - Setting
SYSCFG FAh[3] = 1 allows CISA devices in stop clock mode
to resume system operation by generating an interrupt. During normal operation when CISA devices are in stop clock
mode, the SEL#/ATB# line acts as a CLKRUN# signal. This
bit also allows the same signal to act as RSM#.
IRQ/DRQ Driveback Trap - If SYSCFG FAh[1] = 1 and an
IRQ/DRQ driveback cycle occurs, SYSCFG EAh[7] indicates
that the SMI was caused by the interrupt driveback. No more
IRQ driveback cycles will be serviced until this PMI is cleared
by writing SYSCFG EAh[7] = 1.
CISA SEL/ATB# Low Caused Resume - If SYSCFG FAh[3]
= 1 to allow resume from SEL#/ATB#, SYSCFG 6Bh[3] reads
1 to identify the resume source as CISA.
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4.7
Power Management Unit
The 82C465MV provides a large amount of programmable
logic for managing system power control on the most precise
of levels. The basic concepts of the 82C465MV power management scheme involve activity monitoring through time-out
events, access events, reload events, EPMI events, and
interrupt events. These concepts are illustrated in Figure 4-7
and described in detail in the following sections.
4.7.1
Activity Monitoring
Activity monitoring is based on time-outs of countdown timers, the events that can be enabled to reload the timers and
delay a time-out, general access events, and the system
management interrupts that can be generated in all cases.
4.7.1.1
Timers
The eleven 82C465MV timer registers all have _TIMER
appended to their name.
• The IDLE_TIMER times long periods of inactivity across
all selected system peripherals to determine, for example,
when a full power down (called Suspend mode) is appropriate.
Figure 4-7
• The DOZE_TIMER times short inactivity intervals
(between keystrokes, for example) to put the system in an
intermediate power-saving state called Doze mode.
• The R_TIMER generates a periodic interrupt to allow system management code to poll for activity.
• Eight peripheral activity timers are available to monitor
activity on specific peripheral devices so that system management software can put each peripheral device individually into a low power mode while the rest of the system
continues to operate.
Simply loading the timer with a countdown value presets the
timers. Then, the next access or interrupt event starts them
counting down. A “dummy” access is needed in most cases
to start the timer counting.
As each timer is clocked by its programmed source, it counts
down to a time-out (zero) which generates a power management interrupt (PMI). The time-out PMI can, in turn, be
enabled to generate a system management interrupt (SMI)
on the SMI# line that goes from the 82C465MV to the CPU to
switch it into system management mode (SMM).
Activity Monitoring Block Diagram
PMI Enable
IRQs
EPMIs
Interrupt Events
EPMI Events
#6
#0-3, 24-26
IDLE
CSG0-3
LPT
Timers
DOZE
Group Enabled
LCD
KBD
DSK
HDU
R
(Periodic
Timer)
Time-out Events
COM1
COM2
GNR1
GNR2
LCD
DSK
KBD
HDU
COM1
COM2
GNR1
GNR2
SMI
Access Events
#12-15, 20-23
#4 (Idle)
#27 (Doze)
#5 (R)
#8-11, 16-19
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4.7.1.2
Events
Each timer has one or more events that can reload it with its
original value, holding off the time-out. The events can be:
access events, those that are caused by CPU access to a
certain I/O and/or memory range associated with that timer;
or interrupt events, triggered by ISA bus IRQ events or special external power management inputs (EPMIs).
4.7.2
The 82C465MV logic implements eleven distinct timer circuits. Each timer has a clocking source associated with it. For
all but the DOZE_TIMER these are named SQW0, SQW1,
SQW2, or SQW3; the DOZE_TIMER circuit works differently
than the rest and is described separately in the “Doze Mode”
section of this document. Table 4-88 shows the frequencies
that can be applied to the rest of the _TIMER counters.
All events can be enabled individually to generate a PMI;
access events generate separately numbered PMIs, while
interrupt events are combined into a single PMI (PMI#6).
The SQW0-3 timings are based on the SQWIN input to the
82C465MV logic, which can be either 32KHz or 128KHz as
selected by SYSCFG 40h[3]. SYSCFG 40h[6] provides a
secondary range of time intervals and applies globally to all
SQW0-3 selections.
As opposed to time-out caused PMIs, event PMIs can be
enabled to:
• Reload the timer(s) and, if needed, restore the system
clocks speed
• Generate an SMI
• Do both.
Table 4-87 shows the timer control register bits and the register bit locations for each timer. The timer source is selected
by bit combinations: 00 = SQW0, 01 = SQW1, 10 = SQW2,
and 11 = SQW3.
Because of the flexibility of the 82C465MV power management logic, the interaction among these mechanisms can
become complex. It is important to keep in mind the basic
goal of the logic in order to deal with power management
effectively.
Table 4-87
Table 4-88 lists the range of time-out delay that can be
achieved by selecting each SWQx+SYSCFG 40h[6] combination.
Timer Control Bits and Clock Source Selection Registers
7
6
5
4
SYSCFG 40h
3
1
0
SQWIN
frequency:
0 = 32KHz
1 = 128KHz
0 = divide by 1
1 = divide by 4
SYSCFG 42h
Clock Source Register 1
Clock source for GNR_TIMER
Clock source for KBD_TIMER
SYSCFG B2h
Default = 00h
Clock source for DSK_TIMER
Clock source for LCD_TIMER
Clock Source Register 2
Clock source for HDU_TIMER
Clock source for COM2_TIMER
SYSCFG 68h
Default = 00h
Clock source for COM1_TIMER
Clock source for GNR2_TIMER
Clock Source Register 3
R_TIMER clock source
Default = 00h
IDLE_TIMER clock source
Time Interval Choices Applicable to _TIMER Settings
SYSCFG 40h[6] = 0 - No base clock divisor
Choice
2
PMU Control Register 1Default = 00h
Global timer
divide:
Table 4-88
Timers
Bits
Frequency
SYSCFG 40h[6] = 1 - Divide base clock by 4
Decrement
timer every:
Maximum
Delay
Frequency
Decrement
timer every:
Maximum
Delay
31.25ms
SQW0
00
32768Hz
30.5µs
7.81ms
8.192KHz
0.122ms
SQW1
01
512Hz
1.95ms
0.5s
128Hz
7.8ms
2s
SQW2
10
16Hz
62.5ms
16s
4Hz
0.25s
64s
SQW3
11
0.5Hz
2s
8.5 min.
0.125Hz
8s
34 min.
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4.7.2.1
Time-out Count and Time-out SMI
The Timer Source Registers listed in Table 4-89 are used to
load the initial time-out count. The following rules apply.
• A time-out count of 5 or greater indicates the countdown
value. Time-out count values 1-4 should not be used:
since the logic can take up to four clocks to reload a timeout count value, an invalid time-out could occur in the
meantime.
• Writing a time-out count of 0 disables the timer.
• A dummy access in the appropriate address range for that
timer triggers counting. From then on, additional accesses
Table 4-89
will reload the timer with its initial value and delay a timeout.
• Reading the timer value will return only the value initially
written, not the current count. This rule holds true for all but
the R_TIMER, which does return the current count.
SYSCFG 60h returns the initial value of R_TIMER.
When a time-out occurs, it can only trigger an SMI. Registers
listed under the “Enabling of Events to Generate SMI” heading of the “System Management Interrupt” section enable
each time-out event individually to cause an SMI.
Timer Source Registers
7
6
SYSCFG 44h
5
4
3
2
LCD_TIMER Register
1
0
Default = 00h
Time count byte for LCD_TIMER - monitors LCD_ACCESS. Time-out generates PMI#8.
SYSCFG 45h
DSK_TIMER Register
Default = 00h
Time count byte for DSK_TIMER - monitors DSK_ACCESS. Time-out generates PMI#9.
SYSCFG 46h
KBD_TIMER Register
Default = 00h
Time count byte for KBD_TIMER - monitors KBD_ACCESS. Time-out generates PMI#10.
SYSCFG B4h
HDU_TIMER Register
Default = 00h
Time count byte for HDU_TIMER - monitors HDU_ACCESS. Time-out generates PMI#19.
SYSCFG B5h
COM1_TIMER Register
Default = 00h
Time count byte for COM1_TIMER - monitors COM1_ACCESS. Time-out generates PMI#17.
SYSCFG B6h
COM2_TIMER Register
Default = 00h
Time count byte for COM2_TIMER - monitors COM2_ACCESS. Time-out generates PMI#18.
SYSCFG 47h
GNR1_TIMER Register
Default = 00h
Time count byte for GNR1_TIMER - monitors GNR1_ACCESS. Time-out generates PMI#11.
SYSCFG B7h
GNR2_TIMER Register
Default = 00h
Time count byte for GNR2_TIMER - monitors GNR2_ACCESS. Time-out generates PMI#16.
SYSCFG 4Fh
IDLE_TIMER Register
Default = 00h
Time count byte for IDLE_TIMER - monitors selected IRQs and EPMIs. Time-out generates PMI #4.
SYSCFG 69h
R_TIMER Register
Default = 00h
Time count byte for R_TIMER - starts to count after a non zero write to this register.
Unlike the other timer registers, a read from this register returns the current count. Time-out generates PMI#5.
SYSCFG 60h
R_TIMER Base Count Register (RO)
Default = 00h
R_TIMER initial count
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Table 4-89
Timer Source Registers (cont.)
7
6
5
SYSCFG 41h
4
3
2
1
PMU Control Register 2
0
Default = 00h
DOZE_0 time-out select:
000 = 2 ms
001 = 4 ms
010 = 8 ms
011 = 32 ms
100 = 128 ms
101 = 512ms
110 = 2s
111 = 8s
Time count bits for DOZE_TIMER - monitors
selected IRQs and EPMIs. Unlike the other timer
registers, DOZE_TIMER uses its own time base
selected by these bits. Time-out generates PMI#27.
4.7.3
ACCESS Events
CPU memory and I/O instructions to peripheral devices
cause power management events known as ACCESS
events.
• Most ACCESS events generate an access PMI directly,
which in turn can be enabled to activate the SMI input to
the CPU so that the event can be serviced.
Table 4-90
• These same events can be programmed to reload an
associated countdown timer, thus delaying a time-out PMI
from occurring.
• Still other ACCESS events can only cause a timer reload,
and cannot directly generate an SMI.
Table 4-90 lists all of the ACCESS events and how the
access can reload its associated timer and reload the
IDLE_TIMER.
ACCESS Events and Their Enabling Bit Locations
ACCESS
PMI#
Enable SMI
on Current
Access
Enable SMI
on Next
Access
Enable
Reload of
IDLE_TIMER
Reads/writes in I/O address ranges 378-Fh, 278Fh, and 3B8-Fh (LPT1, 2, and 3)
--
--
--
4Eh[5]
COM1
Reads/writes in I/O address range 3F8-Fh.
21
DEh[5]
DBh[1]
BEh[4]
COM2
Reads/writes in I/O address range 2F8-Fh.
22
DEh[6]
DBh[2]
BEh[5]
DSK
FDD accesses to I/O Port 3F5h and/or HDD
accesses to 1F0-1F7h+3F6h. SYSCFG 57h[5:4]
determine which ranges apply.
13
DEh[1]
5Bh[1]
4Eh[1]
KBD
Reads/writes to I/O Ports 060h and 064h.
14
DEh[2]
5Bh[2]
4Eh[2]
LCD
Reads/writes in memory address range A0000BFFFFh and/or I/O address range 3B0-3DFh.
SYSCFG 43h[7:6] and 5Fh[7:6]. determine
which ranges apply.
12
DEh[0]
5Bh[0]
4Eh[0]
HDU
HDU accesses in the integrated IDE controller
range: 1F0-7h + 3F6h (primary) or 170-7h +
376h (secondary). SYSCFG ACh[2] determines
which addresses apply.
23
DEh[7]
DBh[3]
BEh[2]
CSG0
Defined in SYSCFG 4Ah[7:0], 4Bh[7:0], BFh[4,0]
--
--
--
4Eh[6]
CSG1
Defined in SYSCFG 4Ch[7:0], 4Dh[7:0], BFh[5,1]
--
--
--
4Eh[7]
CSG2
Defined in SYSCFG BCh[7:0], BDh[7:0],
BFh[6,2]
--
--
--
BEh[6]
ACCESS
Mnemonic
LPT
Monitored Range
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Table 4-90
ACCESS Events and Their Enabling Bit Locations (cont.)
ACCESS
Mnemonic
Monitored Range
ACCESS
PMI#
Enable SMI
on Current
Access
Enable SMI
on Next
Access
Enable
Reload of
IDLE_TIMER
CSG3
Defined in SYSCFG BAh[7:0], BBh[7:0],
BFh[7,3]
--
--
--
BEh[7]
GNR1
Defined in SYSCFG 48h[7:0], 49h[7:0], and
AEh[4,2,0]
15
DEh[3]
5Bh[3]
4Eh[3]
GNR2
Defined in SYSCFG B8h[7:0], B9h[7:0], and
AEh[5,3,1]
20
DEh[4]
DBh[0]
BEh[3]
Note:
Enabled access events, except for the GNRx, COMx, and CSG events, can be globally enabled to reload the
DOZE_TIMER by setting SYSCFG 41h[1] = 1. Refer to the “Doze Mode” section for details.
4.7.3.1
Serial (COMx) and Parallel Port (LPT) Access
Accesses to the LPT1, LPT2, and LPT3 I/O range group can
be programmed to reload the IDLE_TIMER. For a greater
degree of control, COM1 and COM2 can individually be
enabled to cause COM1_ACCESS or COM2_ACCESS,
reload the COM1_TIMER or COM2_TIMER, and reload the
IDLE_TIMER.
4.7.3.2
ISA Bus Floppy and Hard Drive Access
DSK_ACCESS can come from either or both of two separate
access types. If enabled, the DSK_ACCESS will reload the
DSK_TIMER, and the IDLE_TIMER as well if desired.
• Floppy accesses to I/O Port 3F5h generate
DSK_ACCESS if SYSCFG 57h[5] = 0.
• Hard disk accesses to 1F0-1F7h and 3F6h generate
DSK_ACCESS if SYSCFG 57h[4] = 0. Both ISA bus IDE
accesses and VL-bus IDE accesses will generate the
access event.
Table 4-91 shows the above mentioned register bits.
Two separate and independent hard disk drives can be managed if the primary drive is on the ISA bus or VL bus and the
Table 4-91
secondary drive is managed by the integrated IDE controller.
Refer to the HDU_ACCESS event regarding access events
from the integrated local-bus IDE controller.
4.7.3.3
Integrated Controller Hard Drive Access
Accesses to the integrated hard disk controller, in the primary
range (1F0-1F7h and 3F6h) or the secondary range (170177h and 377h) can cause an HDU_ACCESS, reload the
HDU_TIMER, and reload the IDLE_TIMER. SYSCFG ACh[2]
determines which addresses apply (see Table 4-92)
HDU_ACCESS is based solely on the decoding for the internal IDE controller. It is independent of the DSK_ACCESS
decoding. Therefore, SYSCFG 57h[4] does not affect
HDU_ACCESS. DSK_ACCESS can continue to monitor both
floppy disk and primary external hard disk accesses if
desired.
4.7.3.4
Keyboard Access
Keyboard accesses to I/O Ports 060h and 064h can cause
KBD_ACCESS, reload the KBD_TIMER, and reload the
IDLE_TIMER.
Floppy and Hard Drive DSK_ACCESS Control
7
6
5
SYSCFG 57h
4
3
PMU Control Register 6
DSK_ACCESS
includes FDD?
0 = Yes
1 = No
2
1
0
Default = 00h
DSK_ACCESS
includes HDD?
0 = Yes
1 = No
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Table 4-92
7
IDE Port Address Select Bit
6
5
SYSCFG ACh
4
3
2
1
IDE Interface Configuration Register
0
Default = 00h
IDE port
address select:
0 = 1F0-7h,
3F6-7h
1 = 170-7h,
376-7h
4.7.3.5
LCD Controller Access
Video controller accesses are defined as accesses to I/O
Ports 3B0-3DFh and to memory locations A0000-BFFFFh if
not masked by SYSCFG 43h[7:6].
The enabled accesses cause LCD_ACCESS, reload the
LCD_TIMER, and reload the IDLE_TIMER if not masked in
SYSCFG 5Fh[7:6].
Generate BOFF# (AHOLD) on Next Access Trap. When
the LCD_TIMER has timed out and the Next Access feature
has been enabled on memory access, the memory access
cannot easily be trapped. Usually, the access takes place to
a dead LCD subsystem. SMI occurs but does not get serviced until several instructions later.
Table 4-93
7
0 = Yes
1 = No
6
0 = Yes
1 = No
SYSCFG D5h
5
4
3
2
1
0
PMU Control Register 4
Default = 00h
PMU Control Register 7
Default = 00h
Resistor Control Register 2
Default = 00h
LCD_ACCESS
includes memory A0000BFFFFh?
0 = Yes
1 = No
SYSCFG 5Fh
LCD_ACCESS
includes ISA
bus video
access?
Table 4-93 shows the above mentioned register bits.
LCD Controller Access Control
SYSCFG 43h
LCD_ACCESS
includes I/O
range 3B0h3DFh?
When SYSCFG D5h[0] = 1, a Next Access to the LCD
causes the 82C465MV logic to generate AHOLD before generating SMI. If the AHOLD signal is externally gated to generate a BOFF# signal (as for L1 writeback cache control), the
BOFF# signal should force the CPU to move back to the start
of the current instruction. After SMI is asserted, BOFF#
(AHOLD) is de-asserted. Depending on the CPU logic, this
procedure might convince the CPU to perform the SMI service first. If so, the video subsystem can be completely powered down on a backlight time-out and restored without losing
characters on the next video access.
LCD_ACCESS
includes VLbus video
access?
0 = No
1 = Yes
Generate
BOFF#
(AHOLD) on
Next Access
Trap:
0 = Disable
1 = Enable
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4.7.3.6
Chip Select Generation (CSG) Access
The CSG0-3# lines can be programmed to generate a chip
select based on either memory or I/O decoding of reads
and/or writes. Even if the external logic necessary to imple-
Table 4-94
ment the chip select lines is not in place, the chip select
events themselves can be individually enabled to reload the
IDLE_TIMER through SYSCFG 4Eh[7:6] and BEh[7:6] (refer
to Table 4-94).
CSG Access Control Bits
7
6
SYSCFG 4Eh
CSG1_
ACCESS:
5
4
3
2
1
0
Idle Reload Event Enable Register 1
Default = 00h
Idle Reload Event Enable Register 2
Default = 00h
CSG0_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG BEh
CSG3_
ACCESS:
CSG2_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
4.7.3.7
General Purpose (GNR) Access
Two programmable ranges, GNR1 and GNR2, are provided,
each with its own separate timer, to allow any two I/O or
memory ranges to be monitored. As an example, the COM3
I/O range 3E8-3EFh could be monitored for reads and writes
in order to determine whether the connected UART was in
active use. As another example, a network card that uses
memory in the D800-DFFFh half-segment could be monitored to determine whether the memory is being accessed
regularly and, if not, a query could be sent through the network to ensure that the connection was still valid.
Memory Watchdog Feature
The 82C465MV general-purpose access register sets, GNR1
and GNR2, can be monitored for activity and can generate an
SMI when no activity has occurred in a given amount of time.
As an option, either or both of these register sets can be
assigned to monitor memory space instead. In this case,
instead of the bit values corresponding to I/O address bits
A[9:0], the values correspond to memory address bits
A[23:14]. The bits that select I/O read or I/O write cycles
instead indicate memory read or memory write cycles.
to write into the A[9:0] GNR address decode bits. The bits are
set by writing:
• SYSCFG B8h (A[8:1]) = 00011001b, or 19h
• SYSCFG B9h (A9 + write decode + read decode + A[5:1]
mask bits) = 01000000b, or 40h
• SYSCFG AEh (GNR2 cycle + GNR1 cycle + GNR2 A0 +
GNR1 A0 + GNR2 A0 mask + GNR1 A0 mask) = 011000b,
or 18h (GNR1 values must also be considered).
The timer values must then be entered, the PMI enabled, and
then a dummy write access must be made to the CC000CFFFFh range to start GNR2_TIMER. If no accesses are
occurring, the timer will eventually expire and generate an
SMI. If enabled, the next write access to this range will also
cause an SMI and will reload the timer.
Example:
To monitor memory write activity in the 16KB block from
CC00:0 to CC00:3FFF requires first viewing the CC00 segment value as
0000 1100 1100 0000 0000 0000
to determine the value of the upper 10 bits, CA[23:14], which
is
0000110011
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Table 4-95
7
General Purpose Access 1 Registers
6
5
SYSCFG 48h
4
3
2
1
0
GNR1 Base Address Register
Default = 00h
GNR1 Control Register
Default = 00h
GNR1_ACCESS base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 49h
GNR1
base address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG AEh
GNR1 mask bits for address A[5:1] (I/O) or A[19:15] memory:
A '1' in a particular bit means that the corresponding SYSCFG 48h[4:0] is not compared.
This is used to determine address block size.
GNR_ACCESS Feature Register
GNR1 cycle
decode type:
0 = I/O
1 = Memory
Table 4-96
7
Default = 03h
GNR1 base
address:
GNR1 mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
General Purpose Access 2 Registers
6
5
SYSCFG B8h
4
3
2
1
0
GNR2 Base Address Register
Default = 00h
GNR2 Control Register
Default = 00h
GNR2_ACCESS base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG B9h
GNR2 base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG AEh
GNR2 mask bits for address A[5:1] (I/O) or A[19:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG B8h[4:0] is not compared. This is used to determine address block size.
GNR_ACCESS Feature Register
GNR2 cycle
decode type:
0 = I/O
1 = Memory
Default = 03h
GNR2 base
address:
GNR2 mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
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82C465MV/MVA/MVB
Memory Watchdog Feature Extension
The 82C465MVA part provides extended granularity for the
memory watchdog function of GNR1 and GNR2. In the
82C465MV part, the GNR registers provide bits A[23:14] for a
minimum monitoring range of 16KB. The 82C465MV logic
extends these registers by providing address and mask bits
for A[13:2] for a minimum monitoring range of 4 bytes.
When these registers are used to extend the existing I/O
decoding registers, they override the setting of the 10/16-bit
I/O decoding SYSCFG A0h[7]. In other words, even if
SYSCFG A0h[7] = 1 such that upper address bits must be
zero, the GNR1 and GNR2 registers still decode the full 16
bits of the address as long as those upper bits are not
masked off (default).
Table 4-97
These new registers are completely ignored until at least one
of them is written in order to maintain compatibility with the
82C465MV part. Once any of registers at SYSCFG 70-75h is
written, they must all be written. This rule is especially important for the mask bits: address comparison would normally be
masked for memory cycles, but unmasked for I/O cycles, to
maintain backward compatibility. Therefore, there is no clear
default available and the register values must always be written explicitly.
Note that on both the 82C465MV and 82C465MVA parts, the
memory watchdog feature cannot detect access by a local
bus master other than the CPU, nor by an ISA bus master.
Memory Watchdog Feature Extension Registers
7
6
5
SYSCFG 70h
4
3
2
1
0
GNR1 Control Register 2
Default = 00h
GNR1 Control Register 3
Default = 00h
GNR1 Base Address Register 4
Default = 00h
GNR1_ACCESS base address: (MVA)
- A[13:6] for memory watchdog
- A[15:10] for I/O (right-aligned)
SYSCFG 71h
GNR1_ACCESS mask bits: (MVA)
- Mask for A[13:6] for memory watchdog
- Mask for A[15:10] for I/O (right-aligned)
SYSCFG 72h
GNR1_ACCESS base address: (MVA)
- A[5:2] for memory watchdog*
- Ignored for I/O
SYSCFG 73h
GNR1_ACCESS mask bits: (MVA)
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
GNR1 Control Register 2
Default = 00h
GNR1 Control Register 3
Default = 00h
GNR1 Base Address Register 4
Default = 00h
GNR2_ACCESS base address: (MVA)
- A[13:6] for memory watchdog
- A[15:10] for I/O (right-aligned)
SYSCFG 74h
GNR2_ACCESS mask bits: (MVA)
- Mask for A[13:6] for memory watchdog
- Mask for A[15:10] for I/O (right-aligned)
SYSCFG 75h
GNR2_ACCESS base address: (MVA)
- A[5:2] for memory watchdog*
- Ignored for I/O
GNR2_ACCESS mask bits: (MVA)
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
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Improved Memory Watchdog Range
The memory watchdog feature of the 82C465MVA can
decode with four-byte granularity. The 82C465MVB part
allows reassignment of this granularity so that the decode
bits can extend to the full addressing range of the chip. On
the 82C465MVA part, only addresses up to 16MB can be
decoded and then the decode repeats throughout the system
address space.
SYSCFG AEh[7:6] control this feature as shown in Table 498.
4.7.4
Activity Tracking
SMI. In this way, code can check whether a keystroke
occurred since the last time the register was checked, for
example, without actually generating an SMI for every keystroke.
The Activity Tracking Register (shown in Table 4-99) records
activity on all eight ACCESS events. No type of enabling is
needed for any of these events to be registered. Reading this
register returns flags indicating whether any of the events has
taken place and automatically resets the entire register. The
register can be written if desired to set the selected bits. In
this way, a read-modify-write code sequence can be used to
clear selected bits only.
The Activity Tracking Register at SYSCFG DFh allows events
to be flagged even if they are not programmed to generate an
Table 4-98
7
Memory Decoding Control Bits
6
5
SYSCFG AEh
GNR2 memory
decoding:
GNR1 memory
decoding:
0 = A[5:2]
1 = A[31:24]
(MVB)
0 = A[5:2]
1 = A[31:24]
(MVB)
SYSCFG 72h
4
3
2
1
GNR_ACCESS Feature Register
Default = 03h
GNR1 Base Address Register 4
Default = 00h
GNR1_ACCESS base address (MVB):
- A[5:2] for memory watchdog*
- Ignored for I/O
GNR1_ACCESS mask bits (MVB):
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
*In MVB, if SYSCFG AEh[6] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[6] = 1.
*In MVB, if SYSCFG AEh[6] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[6] = 1.
SYSCFG 75h
GNR1 Base Address Register 4
Default = 00h
GNR2_ACCESS base address (MVB):
- A[5:2] for memory watchdog*
- Ignored for I/O
GNR2_ACCESS mask bits (MVB):
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
*In MVB, if SYSCFG AEh[7] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[7] = 1.
*In MVB, if SYSCFG AEh[7] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[7] = 1.
Table 4-99
7
0
Activity Tracking Registers
6
5
HDU_
ACCESS
activity?
COM2_
ACCESS
activity?
COM1_
ACCESS
activity?
GNR2_
ACCESS
activity?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
SYSCFG DFh
4
3
2
1
GNR1_
ACCESS
activity?
KBD_
ACCESS
activity?
DSK_
ACCESS
activity?
LCD_
ACCESS
activity?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
Activity Tracking Register
0
Default = 00h
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4.7.5
Reloading IDLE_TIMER
The 82C465MV provides the IDLE_TIMER to monitor system-wide activity: I/O and memory accesses by the CPU,
IRQs from AT peripherals, and EPMIs from power control and
management subsystems. The occurrence of an enabled
event in any one of these areas will reload the IDLE_TIMER.
Once there is inactivity for a sufficiently long time, the
IDLE_TIMER will expire.
Expiration of the IDLE_TIMER generates PMI#4, which can
be enabled to generate an SMI to inform system manage-
ment code that the system is idle and that entry into suspend
mode is appropriate. Refer to the “Suspend Mode” section in
this document for complete information. Expiration of the
IDLE_TIMER cannot cause automatic (hardware-controlled)
entry into suspend mode, since important CPU processing
could be interrupted.
The register bits that enable each event individually to reload
the IDLE_TIMER and delay entry into Suspend mode are
shown in Table 4-100. SYSCFG 63h and A3h are write-only;
reads return no useful information.
Table 4-100 Idle Reload Source Registers
7
6
5
SYSCFG 4Eh
4
3
2
1
Idle Reload Event Enable Register 1
CSG1_
ACCESS:
CSG0_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
LPT_
ACCESS:
GNR1_
ACCESS:
0 = Disable
1 = Enable
SYSCFG BEh
0 = Disable
1 = Enable
Default = 00h
KBD_
ACCESS:
0 = Disable
1 = Enable
DSK_
ACCESS:
0 = Disable
1 = Enable
Idle Reload Event Enable Register 2
CSG2_
ACCESS:
COM2_
ACCESS:
COM1_
ACCESS:
GNR2_
ACCESS:
HDU_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
Idle Time-out Select Register 1
EPMI1
Level-triggered:
0 = Disable
1 = Enable
LCD_
ACCESS:
0 = Disable
1 = Enable
Default = 00h
CSG3_
ACCESS:
SYSCFG 63h
0
Default = 00h
IRQ13:
IRQ8:
IRQ7:
IRQ5:
IRQ4:
IRQ3:
IRQ0:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A3h
Idle Time-out Select Register 2
Default = 00h
IRQ15:
IRQ14:
IRQ12:
IRQ11:
IRQ10:
IRQ9:
IRQ6:
IRQ1:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
4.7.6
External PMI Events
The 82C465MV logic can monitor a variety of inputs that are
directly related to low-power, battery-operated system
designs. Table 4-101 lists the external power management
input (EPMI) pins provided. Note that all pins included here
are considered external PMI pins, not just pins EPMI1-4.
Table 4-101 External PMI Source Summary
Name
Description
LOWBAT
Activity on low battery pin
LLOWBAT
Activity on very low battery pin
Table 4-101 External PMI Source Summary (cont.)
Name
Description
EPMI1
Activity on external power management
input 1
EPMI2
Activity on external power management
input 2
EPMI3
Activity on external power management
input 3
EPMI4
Activity on external power management
input 4
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Table 4-101 External PMI Source Summary (cont.)
Name
Description
RESUME
SUSP/RSM input has been toggled while in
Suspend
SUSPEND
SUSP/RSM input has been toggled while
system is active
RI
Activity detected on RI
4.7.6.1
Suspend/Resume Pin
The SUSP/RSM pin can be programmed to generate a PMI
when changed from high-to-low. SYSCFG 61h[5:4] select the
debounce logic applied to the pin.
00 Active low, edge triggered PMI. PMI#7 is triggered on
any high-to-low edge of SUSP/RSM. Once the PMI is
triggered, software must write SYSCFG 5Ch[7] = 1 to
clear PMI#7 and deassert SMI#.
To resume: Once the system is in Suspend mode, the
next high-to-low edge on SUSP/RSM will resume operation.
01 Active low, level-controlled PMI. Setting SUSP/RSM
low causes PMI#7 to go active; setting SUSP/RSM high
causes PMI#7 to go inactive. There is no latching associated with this function, so it is not necessary to write
SYSCFG 5Ch[7] = 1 to deassert the SMI#.
To resume: A low signal on SUSP/RSM generates a
resume function. Therefore, hardware/software must
ensure that SUSP/RSM is high before going into Suspend mode; otherwise, the system will resume immediately.
10 Active high, level-sampled PMI in 16ms. SUSP/RSM
must be sampled high for at least three 4ms clock edges
before being recognized as a PMI. Therefore, it takes a
maximum of 16ms for the SUSP/RSM request to be recognized. Once the PMI is triggered, software must write
SYSCFG 5Ch[7] = 1 to clear PMI#7 and deassert SMI#.
Also, the SUSP/RSM pin must be sampled low for four
clock edges (20ms maximum) before the circuit is
rearmed to generate the next PMI#7.
To resume: Once the system is in Suspend mode, a
high level sampled on SUSP/RSM for three 4ms clocks
will resume operation.
11 Active high, level-sampled PMI in 32ms. Same as
above, but the sampling clock is 8ms instead of 4ms.
Therefore, SUSP/RSM must be sampled high for a maximum of 32ms before being recognized as a PMI, and
must remain low for 40ms before the circuit is re-armed.
To resume: Once the system is in Suspend mode, a
high level sampled on SUSP/RSM for three 8ms clocks
will resume operation.
This makes the SUSP/RSM function much more practical in a
design where the switch is set to one specific level to command Suspend mode, and to the other level to command
Resume mode.
Example
A notebook design incorporates a lid switch that normally
leaves SUSP/RSM low during operation. SYSCFG 61h[5:4]
are normally set to 11.
When the lid is closed, SUSP/RSM goes high. The chip
asserts SMI# 32ms later. Software services the SMI and recognizes PMI#7 active. The software then prepares the system for Suspend mode, and reprograms SYSCFG 61h[5:4] =
00 to prepare for Resuming. Finally, the software writes
SYSCFG 50h[0] = 1 to engage Suspend mode.
Later the lid is raised and SUSP/RSM goes low. Because
SYSCFG 61h[5:4] = 00, the high-to-low edge on SUSP/RSM
generates a Resume and PMI#7. Software then writes
SYSCFG 61h[5:4] back to 11, clears PMI#7 by writing
SYSCFG 5Ch[7] = 1, and returns to normal operation.
4.7.6.2
EPMI Signal Relocation
The 82C465MV offers several pin configuration options. In
general, the EPMI-type pins are the first to be relocated
because they need not be monitored constantly; they can all
be grouped together and monitored one at a time on a periodic basis. The possibilities are described in the “ProgramSelected Interface Options” section of this document.
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4.7.6.3
Programming
The chipset registers listed in Table 4-102 are used to initialize the EPMI pins and enable them to cause PMI events.
polarity of the input is determined by SYSCFG 40h[2]. Once
written to 1, this bit cannot be cleared without a hardware
reset.
Emergency Overtemp Sense Enable - Setting SYSCFG
A1h[2] = 1 allows a level on the EPMI2 pin to force the chip
into Cool-down Clocking mode as set by the Thermal Management registers. The Thermal Management feature itself
does not need to be enabled to use this sense function. The
EPMI1-2 Status Latch - Setting SYSCFG A1h[0] = 1 allows
the EPMI1-2 PMI events to be latched. The status returned
by SYSCFG 5Ch[2:1] is also latched. Writing these same bits
to 1 clears the status bits. Note that setting SYSCFG A1h[0] =
0 retains 82C463MV-compatible operation.
Table 4-102 EPMI Programming Registers
7
6
5
4
SYSCFG 40h
3
2
1
EPMI2
polarity:
EPMI1
polarity:
0
PMU Control Register 1Default = 00h
Global timer
divide:
LLOWBAT
polarity:
0 = divide by 1
1 = divide by 4
0 = Active hi
1 = Active low
SYSCFG DBh
LOWBAT
polarity:
0 = Active hi
1 = Active low
0 = Active hi
1 = Active low
Next Access Event Generation Register 2
External EPMI4
pin polarity:
External EPMI3
pin polarity:
0 = Active hi
1 = Active low
0 = Active hi
1 = Active low
SYSCFG 43h
PMU Control Register 4
0 = Active hi
1 = Active low
Default = 00h
Default = 00h
LOWBAT pin sample rate,
generates PMI each time
sampled active:
00 = 32s
01 = 64s
10 = 128s
11 = Reserved
SYSCFG 61h
Debounce Register
LOWBAT, LLOWBAT
debounce rate select:
00 = No debounce
01 = 250µs
10 = 8ms
11 = 500ms
Default = 00h
SUSP/RSM
debounce rate select:
00 = Active low, edge-triggered
PMI
01 = Active low, level-controlled
PMI
10 = Active high, level-sampled
PMI in 16ms
11 = Active high, level-sampled
PMI in 32ms
For further decode details, refer to
Section 4.7.6.1, "Suspend/Resume Pin" on page 113
SYSCFG A1h
Feature Control Register 2
Pin 88 - for
EPMI3-4:
0 = DRQ2
1 = EPMMUX
Default = 00h
Emergency
overtemp
sense:
0 = Disable
1 = Enable
EPMI1-2
status latch:
0 = Dynamic
1 = Latched
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Table 4-102 EPMI Programming Registers
7
6
5
SYSCFG 5Ch
4
3
2
1
PMI2,
EPMI2:
PMI1,
EPMI1:
PMI Source Register 1 (Write 1 to Clear)
0
Default = 00h
0 = Inactive
1 = Active
0 = Inactive
1 = Active
Notes: 1) EPMI1 and EPMI2 need to be asserted until recognized by its SMI service routine, since these PMIs are not latched
unless A1h[0] = 1.
2) If EPMI1 and EPMI2 are used to place the system into suspend, the EPMIx signal must be de-asserted before the
suspend command (setting bit 50h[0] = 1) is written unless bit A1h[0] = 1.
4.7.6.4
Power Management Event Status
The power management input pins can be monitored for their
instantaneous state in the 82C465MV. This feature can be
used to poll for power management status without generating
an SMI. The bits of the Power Management Event Status
Register return instantaneous pin status; the state is not
latched. However, since the state of some of these pins is
read through a multiplexer, the value from the multiplexer is
held for the duration of the multiplexer cycle. Inputs that
change state in less than the 280ns cycle time of the multiplexer may not be indicated accurately through this register.
The bits return 0 if the input is inactive, 1 if the input is active.
Table 4-103 Power Management Event Status
7
6
5
SYSCFG DAh
Reserved:
Mask when
reading
4
3
2
1
Power Mgt. Event Status Register (RO)
Reserved:
Mask when
reading
LOWBAT
state:
LLOWBAT
state:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
EPMI4
state:
0 = Inactive
1 = Active
0
Default = 00h
EPMI3
state:
0 = Inactive
1 = Active
EPMI2
state:
0 = Inactive
1 = Active
EPMI1
state:
0 = Inactive
1 = Active
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4.8
System Management Interrupt (SMI)
Most modern 80x86 processors offer a System Management
Interrupt (SMI) that allows external logic to signal to the CPU
that a high-priority event has occurred and must be serviced
but should not in any way interfere with the application currently being processed. When the CPU senses its SMI input
active, it saves the context of its current application and loads
the context of its System Management Mode (SMM) handler
routine from a protected part of RAM. SMM code can then
proceed to determine the reason for the interrupt, service it
appropriately, and return to application processing through a
special RESUME instruction that restores the context as it
originally was before the SMI. Entry to and exit from SMM is
completely hardware-controlled.
The 82C465MV handles up to 28 Power Management Interrupt (PMI) events that can be selectively enabled to cause an
SMI to the CPU. Since some of these PMI events are actually
a single indication from a group of events (such as a single
PMI#6 that indicates whether any of the selected IRQ lines
has gone active), the effective number of events that can be
indicated is actually much greater than 28.
The PMI events that can be programmed to generate an SMI
are listed in Table 4-104, Table 4-105, and Table 4-106.
Table 4-104 IRQ and EPMI SMI Sources
Source
PMI Name
Description
#3
LOWBAT
Activity on low battery pin
#0
LLOWBAT
Activity on very low battery pin
#1
EPMI1
Activity on external power management input 1
#2
EPMI2
Activity on external power management input 2
#24
EPMI3
Activity on external power management input 3
#25
EPMI4
Activity on external power management input 4
#26
RI
Selected count activity detected on RI
#7
SUSP/RSM
SUSP/RSM input has been toggled
#6
INTRGRP
- OR RSMGRP
An interrupt from the INTRGRP set has occurred while the system was running,
- OR An interrupt from the RSMGRP has occurred and resumed the system from Suspend mode
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Table 4-105 Time-out Event SMI Sources
Source
PMI Name
Description
#4
IDLE_TIMER
IDLE_TIMER has timed out due to no I/O activity
#27
DOZE_TIMER
DOZE_TIMER has timed out due to inactivity of selected devices
#5
R_TIMER
R_TIMER has timed out on its normal periodic basis
#8
LCD_TIMER
LCD timer has timed out because of no LCD activity
#9
DSK_TIMER
Floppy (and/or external hard) disk timer has timed out because of no activity
#19
HDU_TIMER
Timeout has occurred because no access has occurred in the internal IDE range
#10
KBD_TIMER
Keyboard timer has timed out because of no controller accesses
#11
GNR1_TIMER
Timeout has occurred because the memory or I/O range selected by GNR1 has had no
activity
#16
GNR2_TIMER
Timeout has occurred because the memory or I/O range selected by GNR2 has had no
activity
#17
COM1_TIMER
Timeout has occurred because no access has occurred in the COM1 range
#18
COM2_TIMER
Timeout has occurred because no access has occurred in the COM2 range
Table 4-106 Access Event SMI Sources
Source
PMI Name
Description
#14
KBD_ACCESS
Keyboard controller has been accessed, either before or after timer timeout depending on
Current/Next Access setting
#12
LCD_ACCESS
LCD controller has been accessed, either before or after timer time-out depending on
Current/Next Access setting
#13
DSK_ACCESS
Floppy (or external hard) disk controller has been accessed, either before or after timer
timeout depending on Current/Next Access setting
#23
HDU_ACCESS
Internal IDE has been accessed, either before or after timer time-out depending on
Current/Next Access setting
#15
GNR1_ACCESS
GNR1 range has been accessed, either before or after timer time-out depending on
Current/Next Access setting
#20
GNR2_ACCESS
GNR2 range has been accessed, either before or after timer time-out depending on
Current/Next Access setting
#21
COM1_ACCESS
COM1 has been accessed, either before or after timer timeout depending on Current/Next
Access setting
#22
COM2_ACCESS
COM2 has been accessed, either before or after timer timeout depending on Current/Next
Access setting
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4.8.1
SMI Presetting for Various CPU Type
The 82C465MV logic provides features to handle most types
of SMM handling commonly in use. Therefore, presetting SMI
operation for various processors involves several different
concepts of system management mode entry, exit, and activity.
at A000h and B000h are used to provide this relocated
space, because these address ranges correspond to shadow
memory of video access ranges which are always redirected
to the VL bus or ISA bus anyway. The DRAM at these locations would otherwise go unused.
For all CPUs with SMI support, setting SYSCFG 30h[3] = 1
allows relocation of CPU-generated addresses during system
management mode (SMM). The two 64KB DRAM segments
Settings of the other SMI initialization registers shown in vary
according to CPU type. Suggested settings for the most popular CPUs are described in the sections that follow.
Table 4-107 SMI Initialization Registers
7
6
5
SYSCFG 30h
4
3
2
1
Control Register 1
0
Default = 40h
SMI address
relocation:
0 = Disable
1 = Enable
SYSCFG 5Bh
PMU Event Register 4
SMI to IRQ15:
SMI type:
0 = Disable
1 = Enable
0 = Intel
1 = Other
SYSCFG 6Bh
Default = 00h
Resume Source Register
Default = 00h
Feature Control Register 1
Default = 00h
Pin 135
function:
0 = FLUSH#
1 = SMIRDY#
SYSCFG A0h
Allow SRESET
in SMM:
0 = Enable
1 = Disable
SYSCFG AFh
SMBASE Register
SMM segment to be mapped to B000h:
Default = 34h
SMM segment to be mapped to A000h:
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
(Defaults to 3h)
(Defaults to 4h)
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4.8.1.1
Intel SL-Enhanced and AMD 5x86 CPU
Settings
The Intel SL-Enhanced series CPUs and AMD 5x86 series
CPUs use the SMIACT# pin to indicate operation in SMM.
These CPUs generate addresses in the 3000h and 4000h
segments to execute SMM code and access SMM data. To
preset operation for these CPUs, pins 13 and 23 must be
sensed high at hardware reset time as described in Section
3.3 "Strap-Selected Interface Options". Then, the register bits
must be set as follows.
1.
2.
Set SYSCFG 5Bh[7] = 0 to disable rerouting of SMI to
IRQ15.
Set SYSCFG 5Bh[4] = 0 to enable Intel-type handling of
SMM. This setting selects the SMI# pin for output only
and defines pin 136 as SMIACT#.
3.
Set SYSCFG A0h[2] = 1 to prevent SRESET from occurring within SMM. Intel and AMD CPUs require SRESET
to be blocked during SMM.
4.
Set SYSCFG AFh[7:4] to the CPU code segment
SMBASE; these bits default to 3h for the 3000h segment. When in SMM, CPU accesses to the selected
code segment will map to the DRAM at B000h.
5.
Set SYSCFG AFh[3:0] to the CPU data segment
SMBASE; these bits default to 4h for the 4000h segment. When in SMM, CPU accesses to the selected data
segment will map to the DRAM at A000h.
5.
Set SYSCFG AFh[7:4] to 7h for the CPU code segment
SMBASE, which is 7000h on the Cyrix 486S/S2 and TI
CPUs. When in SMM, CPU accesses to the selected
code segment will map to the DRAM at B000h.
6.
Set SYSCFG AFh[3:0] to 6h for the CPU data segment
SMBASE, which is 6000h on the 486S/S2 CPU. When in
SMM, CPU accesses to the selected data segment will
map to the DRAM at A000h.
7.
Finally, set SYSCFG 30h[4] = 1 to enable the SMM
remapping scheme.
Proceed to Section 4.8.2, "Loading Initial SMM Code and
Data" on page 120.
4.8.1.3
AMD 486DXLV / IBM “Blue Lightning” CPU Settings
The AMD 486DXLV and IBM “Blue Lightning” CPUs use the
SMIADS# pin to indicate whether they are currently executing
SMM cycles. These CPUs generate addresses in the 6000h
segment to access SMM data. To preset operation for these
CPUs, pin 13 must be sensed low and pin 23 sensed high at
hardware reset time as described in Section 3.3 "StrapSelected Interface Options". Then, the register bits must be
set as follows.
1.
Set SYSCFG 5Bh[7] = 0 to disable rerouting of SMI to
IRQ15.
2.
Set SYSCFG 5Bh[4] = 1 to configure the SMI# pin as
bidirectional and define pin 136 as SMIADS#.
3.
Set SYSCFG 6Bh[6] = 1 to enable pin 135 as SMIRDY#.
Proceed to Section 4.8.2, "Loading Initial SMM Code and
Data" on page 120.
4.
Set SYSCFG A0h[2] = 1 to prevent SRESET from occurring within SMM if desired.
4.8.1.2
Cyrix CPU Settings
Current Cyrix CPUs use the SMIADS# pin to indicate whether
they are currently executing SMM code. These CPUs generate addresses in the 6000h and 7000h segments to execute
SMM code and access SMM data. To preset operation for
these CPUs, pins 13 and 23 must be sensed high at hardware reset time as described in the Section 3.3, "StrapSelected Interface Options" on page 5. Then, the register bits
must be set as follows.
5.
Set SYSCFG AFh[7:4] to 7h for the CPU code segment
SMBASE, which is 7000h on the 486DXLV and IBM
CPUs. When in SMM, CPU accesses to the selected
code segment will map to the DRAM at B000h.
6.
Set SYSCFG AFh[3:0] to 6h for the CPU data segment
SMBASE, which is 6000h on the 486DXLV and IBM
CPUs. When in SMM, CPU accesses to the selected
data segment will map to the DRAM at A000h.
7.
Finally, set SYSCFG 30h[4] = 1 to enable the SMM
remapping scheme.
6.
Finally, set SYSCFG 30h[4] = 1 to enable the SMM
remapping scheme.
1.
Set SYSCFG 5Bh[7] = 0 to disable rerouting of SMI to
IRQ15.
2.
Set SYSCFG 5Bh[4] = 1 to configure the SMI# pin as
bidirectional and define pin 136 as SMIADS#.
3.
Set SYSCFG 6Bh[6] = 1 to enable pin 135 as SMIRDY#
for all Cyrix and TI CPUs except for the Cyrix Cx486DX,
which does not require SMIRDY# but does require
FLUSH#.
4.
Note that the AMD 486DXLV and IBM “Blue Lightning” processors jump to the reset vector, FFFFFFF0h, upon entering
SMM. SYSCFG 40h[7] (refer to Table 4-108) is provided for
BIOS code to determine whether the jump to this entry point
is due to an SMI.
Proceed to the Section 4.8.2, "Loading Initial SMM Code and
Data" on page 120.
Set SYSCFG A0h[2] = 1 to prevent SRESET from occurring within SMM if desired.
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4.8.1.4
Non-SMI CPU Settings
The IRQ15 SMI select feature is provided for CPUs without
an SMI pin to emulate SMM through IRQ15. For CPUs with
an SMI, this feature must always be disabled.
SYSCFG 5Bh[7] = 0 does not reroute SMIs and allows the
IRQ15 pin to function as normal. SYSCFG 5Bh[7] = 1
enables SMI to be internally connected to IRQ15 and disables the IRQ15 hardware pin function. Therefore, any
enabled PMI events will trigger the internal IRQ15 signal.
Table 4-108 BIOS Code Jump Bit
7
6
5
4
SYSCFG 40h
3
2
1
PMU Control Register 1
0
Default = 00h
Last jump to
reset vector:
0 = ADS#
1 = SMIADS#
4.8.2
Loading Initial SMM Code and Data
On system initialization, the system management code and
data segments must be loaded from ROM with the appropriate information. This information will reside in the DRAM segments at physical starting addresses A0000h and B0000h
and, once loaded, will be write-protected except when the
system is operating in SMM.
Step 1: System Initialization (not in SMM)
On system initialization, the BIOS must load initial code and
data into the protected SMM memory space. Normally the
system will still be executing out of ROM at this point, but the
memory subsystem is configured and enabled. The dynamic
SMI relocation bit (SYSCFG 31h[4], see Table 4-109) is used
for this purpose (and for other reasons described in Section
4.8.3, "Run-Time SMI Address Relocation" on page 122).
SYSCFG 31h[4] is used as follows outside of SMM.
• SYSCFG 31h[4] = 0: No Relocation. This setting prevents
application software from accessing SMI memory space.
• SYSCFG 31h[4] = 1: Remap CPU addresses in the
3000/4000h segments to SMI memory space, the DRAM
segments at B000h/A000h. This setting provides the
mechanism for initially loading SMI code to the
B000h/A000h region.
The BIOS sets SYSCFG 31h[4] = 1. It can then load code
and data into DRAM segments B000h and A000h by copying
it to segments 3000h and 4000h, respectively. Even if the
CPU in use defaults to different segments, such as CPUs that
use 6000h and 7000h, this first load operation must be
addressed to the 3000h and 4000h segments. Upon completing the loading of all initial SMM code and data, the BIOS
clears SYSCFG 31h[4] to 0 to protect the SMM space.
Step 2: Software Generation of SMI
Having loaded the code and data, BIOS must now generate
an SMI to enter SMM so that it can complete the SMM initialization process (by changing SMBASE if needed or performing system-specific tasks). To allow software SMI generation
to take place, SYSCFG 59h[7] must be written to 1. Writing
SYSCFG 50h[7] = 1 then asserts SMI to the CPU to start
SMM operation. Writing SYSCFG 50h[7] = 0 clears the SMI.
The SMI routine must clear this bit; otherwise, SMI requests
will be generated continuously. Table 4-110 shows these two
register bits.
Table 4-109 Dynamic SMI Relocation Bit
7
6
SYSCFG 31h
5
4
3
Control Register 2
2
1
0
Default = 40h
Dynamic SMI
relocation:
0 = Normal
1 = Remap
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Table 4-110 Software SMI Enable Registers
7
6
5
SYSCFG 59h
4
3
2
1
0
PMU Event Register 2
Default = 00h
PMU Control Register 5
Default = 00h
Allow software
SMI:
0 = Disable
1 = Enable
SYSCFG 50h
Software start
SMI:
0 = Clear SMI
1 = Start SMI
Step 3: Reprogramming SMBASE
Once the system has entered SMM for the first time, the CPU
SMBASE value can be reprogrammed for future use. The
82C465MV SMBASE value must be subsequently updated to
match the CPU SMBASE value. The operation should occur
as follows.
1.
SMM code updates the SMBASE value of the CPU register save area.
2.
SMM code generates a RESUME instruction to return
control to the BIOS initialization code. The new SMBASE
value gets written to the CPU registers.
3.
BIOS code rewrites the 82C465MV SMBASE register
with the new value.
Using this procedure guarantees reliable results. If the
82C465MV SMBASE register is changed from within SMM,
the change takes place on the next code fetch or data access
and may not operate predictably.
4.8.2.1
SMBASE Register
The SMBASE Register at SYSCFG AFh operates in conjunction with program option SYSCFG 5Bh[4]. SYSCFG 5Bh[4]
selects the function of the SMI# and SMIADS#/SMIACT#
pins and also sets the base address of the SMI code and
data segments in the system (SMBASE). Segments 3000h
and 4000h are selected by default; these map to B000h and
A000h, respectively, when SYSCFG 5Bh[4] = 0. Other processors use segments 6000h and 7000h, which map to
A000h and B000h, respectively when SYSCFG 5Bh[4] = 1
(note that the order of A000h and B000h changes in this
case).
The SMBASE Register provides independent relocation programming for the two segments associated with SMI. The
mapping can be reprogrammed at any time. After reset, as
long as the new SMBASE Register is not written, the mapping uses the value associated with the SYSCFG 5Bh[4]
selection. Once the SMBASE Register at SYSCFG AFh has
been written with any value, all further mapping is selected by
register AFh; changing SYSCFG 5Bh[4] could cause undesirable results.
Table 4-111 SMBASE Register
7
6
5
SYSCFG AFh
4
3
2
1
0
SMBASE Register
SMM segment to be mapped to B000h:
Default = 34h
SMM segment to be mapped to A000h:
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
(Defaults to 3h)
(Defaults to 4h)
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4.8.3
Run-Time SMI Address Relocation
4.8.4
SMI Event Generation
The dynamic SMI relocation feature provides full memory
access control while in SMM. SMI relocation at run time is
controlled by SYSCFG 31h[4].
The registers shown below control the events that are
allowed to generate an SMI. The programming occurs as follows:
4.8.3.1
Relocation with Standard Interface SMI
The standard interface SMI (SYSCFG 5Bh[4] = 0) uses the
SMIACT# signal. Normally SMM code, the data at memory
segments 3000h/4000h is not accessible by the CPU
because these addresses are mapped to the SMI address
space at B000h/A000h. However, SYSCFG 31h[4] can be
used as follows to access this area during an SMI routine.
1.
Time-out, access, and interrupt events must be programmed to generate a PMI.
2.
The PMI event must be enabled to generate the SMI signal.
3.
SMIs are globally unmasked to allow full operation.
• SYSCFG 31h[4] = 0: Relocate all accesses in the
3000h/4000h segment to the B000h/A000h SMI segment
(normal operation).
• SYSCFG 31h[4] = 1: Code fetches (CPU D/C# low) from
the CPU in the 3000h/4000h segment will be translated
from the SMI space at segment B000h/A000h. Memory
data accesses (CPU D/C# high) in the 3000h/4000h space
will not be translated to SMI space. This allows data in the
3000h/4000h memory space to be accessed and saved to
disk.
4.8.3.2
Relocation with Alternative Interface SMI
The alternative mode SMI (SYSCFG 5Bh[4] = 1) uses the
SMIADS# signal. In this mode, SYSCFG 31h[4] must be programmed to 0 while in SMM; setting it to 1 is illegal. For an
SMIADS# cycle, accesses in the 6000h/7000h segment are
relocated to the A000h/B000h SMI segment. For normal
ADS# cycle, there is no relocation.
Table 4-112 shows the register bits associated with SMI
address relocation.
This process is described in detail below.
4.8.4.1
Time-out Event Generation of SMI
For time-out events, simply loading a non zero timer value
and generating a dummy access presets PMI generation on
the next time-out. Refer to Section 4.7.2, "Timers" on page
104 for information on programming the timers.
4.8.4.2
Access Event Generation of SMI
Access events can be programmed to generate an SMI. The
82C465MV classifies accesses as Current Access or a Next
Access depending on whether the timer associated with that
access range is still running or has timed out, respectively.
The available access event ranges are defined in Section
4.7.3, "ACCESS Events" on page 107.
• Next Access - Occurs after a time-out, the first time software attempts to access the I/O and/or memory range that
caused the time-out. The Next Access feature provides a
way for I/O accesses, to a peripheral whose timer has
timed out, to cause an SMI so that the peripheral can be
powered up before the access takes place. Next access
can also speed up system clocks if the system is in hardware (slow-clock) Doze mode when the access occurs.
Table 4-112 SMI Address Relocation Associated Register Bits
7
6
SYSCFG 31h
5
4
3
Control Register 2
2
1
0
Default = 40h
Dynamic SMI
relocation:
0 = Normal
1 = Remap
SYSCFG 5Bh
PMU Event Register 4
Default = 00h
SMI type:
0 = Intel
1 = Other
• Current Access - Occurs any time this feature is enabled
for an I/O and/or memory range, whether or not the device
has timed out. The Current Access PMI can be pro-
grammed to cause an SMI, but cannot provide any automatic means of controlling system clocks.
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If both the Current Access and Next Access features are
enabled for an event, and the timer has timed out, an access
will only cause a single SMI. Since both access types use the
same PMI#, clearing either one clears both events. Table 4113 shows register bits associated with Current and Next
Access generation.
I/O Blocking
The I/O blocking SYSCFG DBh[7] operates as follows. This
selection allows the I/O access that causes a Next Access
PMI to be either blocked (if the peripheral is turned off, for
example) or passed through. DBh[7] = 1 means the I/O will
not be blocked; DBh[7] = 0 means the I/O on Next Access will
be blocked and the CPU must be programmed to restart the
I/O command if desired. The feature defaults to “blocked”.
Note that if an I/O read access is blocked on generation of
SMI, a value of 0FFh is returned to the bus master.
Table 4-113 Current and Next Access Registers
7
6
5
4
SYSCFG 5Bh
3
2
1
PMU Event Register 4
SYSCFG DBh
Default = 00h
GNR1 Next
Access
PMI#15:
KBD Next
Access
PMI#14:
DSK Next
Access
PMI#13:
LCD Next
Access
PMI#12:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
Next Access Event Generation Register 2
HDU_
ACCESS
PMI#23 on
Next Access?
I/O blocking
control:
0 = Block I/O
Next
Access
0 = No
1 = Yes
1 = Unblock
SYSCFG DEh
0
COM2_
ACCESS
PMI#22 on
Next Access?
0 = No
1 = Yes
Default = 00h
COM1_
ACCESS
PMI#21 on
Next Access?
0 = No
1 = Yes
Current Access Event Generation Register
GNR2_
ACCESS
PMI#20 on
Next Access?
0 = No
1 = Yes
Default = 00h
HDU_
ACCESS
PMI#23 on
Current
Access?
COM2_
ACCESS
PMI#22 on
Current
Access?
COM1_
ACCESS
PMI#21 on
Current
Access?
GNR2_
ACCESS
PMI#20 on
Current
Access?
GNR1_
ACCESS
PMI#15 on
Current
Access?
KBD_
ACCESS
PMI#14 on
Current
Access?
DSK_
ACCESS
PMI#13 on
Current
Access?
LCD_
ACCESS
PMI#12 on
Current
Access?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
4.8.4.3
No Flush Required on Entry to SMM
The 82C465MVA part provides a feature that will allow the
CPU SMBASE to be assigned to an address in the first 1MB
of any boundary at or above 64MB (i.e., 64MB, 128MB,
192MB...). The CPU will recognize this region as being outside of cacheable memory space and will not attempt to
access its on-board cache to retrieve SMM code and data.
Therefore, the cache need not be flushed on generation of
the SMIACT# signal as occurs in the current 82C465MV
design. The feature works as in the following example with
the associated register bits shown in Table 4-114.
Example
The new CPU SMBASE address will be selected as 64MB +
segment 3000h for code, segment 4000h for data, in this
example. The addresses will map to 4030000h and
4040000h respectively.
• During non SMI mode operations, the CPU will not generate the SMIACT# signal. Therefore, the 82C465MV will not
remap 3000h/4000h accesses to B000h/A000h.
• The first SMI will take place to 30000h as usual and a
cache flush will take place. During this first SMI the CPU
SMBASE can be modified to 4030000h; this value will be
loaded to the CPU on execution of the resume instruction
and will take effect on the next SMI. Also during the initial
SMI, SMM code sets SYSCFG D3h[5] = 1 in the
82C465MVA registers to inhibit cache flush on entry to
SMI.
Note:
The SMBASE register of the 82C465MV and
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instruction from the initial SMI, since it takes effect as
soon as it is written.
• On subsequent SMIs, the CPU will generate the new
address with bit A26 high to prevent it from attempting to
access the code and data from its own internal cache. The
82C465MVA logic will not see bit A26; however, it will see
SMIACT# active and will infer that the current cycle must
come from protected SMM DRAM, not the normal DRAM
segment indicated.
With the feature enabled, SMM code has the additional
choice of making DRAM data accesses either at the
SMBASE DRAM segment or at the normal memory segment
for that address. SYSCFG D3h[7:6] are provided to select
between the SMM data segment and the normal data segment for reads and writes, respectively. In this way, the
MOVS instruction can be used by SMM code to copy data
between segments with no intermediate storage of the data.
This feature is especially important if the 82C465MVA
SMBASE is reassigned to select A000h for the data segment.
SYSCFG D3h[7:6] could then be used to copy data between
the SMM data segment and the video RAM at A000h.
Table 4-114 SMM Flush Control Bits
7
6
5
Segment for
SMM data
writes:
Cache flush on
SMI entry:
SYSCFG D3h
4
3
Asym. DRAM Select Register
Segment for
SMM data
reads:
0 = A000h
1 = SMBASE
(SYSCFG
AFh[3:0])
(MVA)
0 = A000h
1 = SMBASE
(SYSCFG
AFh[3:0])
(MVA)
2
1
0
Default = 00h
0 = Enable
1 = Disable
(MVA)
4.8.4.4
Interrupt Event Generation of SMI
Asynchronous events from peripheral devices requesting service from the CPU are known as interrupt events. Interrupts
in this context include both the traditional AT architecture
IRQs and additional inputs known as external power management interrupts (EPMIs). For the 82C465MV logic, the
desired interrupts are all grouped into a single event called
INTRGRP. INTRGRP can then be enabled to cause an SMI.
If it is desired to generate an SMI from the INTRGRP event,
setting SYSCFG 57h[6] = 1 will allow any of the selected
interrupt events to generate PMI#6. Once in the SMI handler,
the SMM code can read the registers at SYSCFG 64h and
A4h to determine which of the interrupt(s) caused the event.
The IRQs will remain latched for reading in these registers
until PMI#6 is cleared, at which time any latched sources are
cleared. The INTRGRP IRQ Select Registers are shown
below.
4.8.4.5
Enabling of Events to Generate SMI
The registers listed below allow PMI events that are enabled
to generate timer time-outs, accesses, and interrupts to
cause SMIs. Before setting the SMI Event Enable Registers
shown in Table 4-116, time-outs, accesses, and interrupts
must be individually enabled to generate PMI events as follows.
• For time-out events, loading a nonzero timer value and
generating a dummy access presets PMI generation on
the next time-out.
• For Current Access events, the appropriate Current
Access enable bit must be set to preset PMI generation on
the following access.
• For Next Access events, the appropriate Next Access
enable bit must be set. Then, a valid time-out must take
place to preset PMI generation on the following access.
• For interrupt events, the corresponding INTRGRP bit must
be set and INTRGRP must be enabled to generate PMI#6.
Then, PMI#6 will occur on any enabled interrupt.
The PMIs should be enabled to generate SMIs through the
register set below only after all desired PMI events have been
enabled. Setting SYSCFG 5Bh[6] = 1 then unmasks all the
SMIs previously enabled.
Note that a resume event can be enabled to generate PMI#6.
Refer to the “Suspend and Resume” section for details on
enabling resume events.
PMI#25 Triggers
The PMI#25 event is shared by both EPMI4 and the thermal
management unit. SYSCFG D9h[3:2] enable SMI for EPMI4
only. SYSCFG DBh[6] enables SMI only for Cool-down
Clocking entry and exit.
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Table 4-115 INTRGRP IRQ Select Registers
7
6
5
4
SYSCFG 57h
3
2
1
0
PMU Control Register 6
Default = 00h
INTRGRP generates PMI#6:
0 = Disable
1 = Enable
SYSCFG 64h
INTRGRP IRQ Select Register 1
Default = 00h
IRQ14:
IRQ8:
IRQ7:
IRQ6:
IRQ5:
IRQ4:
IRQ3:
IRQ1:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A4h
INTRGRP IRQ Select Register 2
Default = 00h
IRQ15:
IRQ13:
IRQ12:
IRQ11:
IRQ10:
IRQ9:
IRQ0:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
4
3
2
1
0
Table 4-116 SMI Event Enable Registers
7
6
5
SYSCFG 58h
PMU Event Register 1
LOWBAT PMI#3 SMI:
00 = Disable
11 = Enable
EPMI2 PMI#2 SMI:
00 = Disable
11 = Enable
SYSCFG 59h
EPMI1 PMI#1 SMI:
00 = Disable
11 = Enable
PMU Event Register 2
Resume INTRGRP PMI#6,
Suspend PMI#7 SMI:
00 = Disable
11 = Enable
SYSCFG 5Ah
R_TIMER PMI#5 SMI:
00 = Disable
11 = Enable
PMU Event Register 3
GNR1_TIMER PMI#11 SMI:
00 = Disable
11 = Enable
KBD_TIMER PMI#10 SMI:
00 = Disable
11 = Enable
00 = Disable
11 = Enable
SYSCFG 5Bh
DSK_TIMER PMI#9 SMI:
PMU Event Register 4
Default = 00h
LLOWBAT PMI#0 SMI:
00 = Disable
11 = Enable
Default = 00h
IDLE_TIMER PMI#4 SMI:
00 = Disable
11 = Enable
Default = 00h
LCD_TIMER PMI#8 SMI:
00 = Disable
11 = Enable
Default = 00h
Global SMI
control:
0 = Allow
1 = Mask
SYSCFG D8h
HDU_TIMER PMI#19
HDU_ACCESS PMI#23
SMI:
00 = Disable
11 = Enable
SYSCFG D9h
PMU Event Register 5
COM2_TIMER PMI#18
COM2_ACCESS PMI#22
SMI:
00 = Disable
11 = Enable
COM1_TIMER PMI#17
COM1_ACCESS PMI#21
SMI:
00 = Disable
11 = Enable
PMU Event Register 6
Default = 00h
GNR2_TIMER PMI#16
GNR2_ACCESS PMI#20
SMI:
00 = Disable
11 = Enable
Default = 00h
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Table 4-116 SMI Event Enable Registers (cont.)
7
6
5
4
3
RI PMI#26 SMI:
00 = Disable
11 = Enable
SYSCFG DBh
2
EPMI4 PMI#25 SMI:
1
0
EPMI3 PMI#24 SMI:
00 = Disable
11 = Enable
00 = Disable
11 = Enable
Next Access Event Generation Register 2
Default = 00h
SMI on cooldown clocking
entry/exit
PMI#25 SMI:
0 = Disable
1 = Enable
4.8.5
DRQ Generation of SMI
The 82C465MVA allows activity on the DRQ pins to generate
an SMI. The SMI takes place before the DMA transfer occurs,
allowing SMM code to emulate or modify the operation. Writing the bit to clear the PMI then allows any pending DMA
operation to take place immediately.
There are certain latency limitations for DMA operations. For
example, floppy disk DMA transfers generally must be serviced within 14µs from receipt of DRQ2 in order to avoid an
overrun condition. Entry into SMM requires a considerable
amount of time in itself. Therefore, SMM routines that trap
DMA accesses must be structured concisely so that the DMA
cycle is allowed to occur before the latency limit is exceeded.
Table 4-117 DMA Trap Related Bits
7
6
SYSCFG D6h
5
4
3
2
1
0
PMU Control Register 10
Default = 00h
PMU SMI Source Register 4
Default = 00h
DMA trap
PMI#28 SMI:
0 = Disable
1 = Enable
(MVA)
SYSCFG DDh
PMI#28,
DMA:
0 = Clear
1 = Active
(MVA)
4.8.6
Servicing an SMI
The register set shown in Table 4-118 is used by SMM code
to enable system events to cause SMIs, to determine the
events that caused an active SMI, and to clear the events.
Upon entry to SMM, the chip clears the SMI# signal to the
CPU. Then, determining the source of the SMI is a simple
procedure.
1.
Read the registers at SYSCFG 5Ch, 5Dh, DCh, and
DDh. Any nonzero bits indicate PMI sources. More than
one can be active.
2.
The PMI number will indicate the source of the service
request. In case PMI#6 is indicated, also read SYSCFG
64h and A4h (described earlier in Section 4.8.4.4, "Interrupt Event Generation of SMI" on page 124) to determine which IRQ line was responsible for the event.
3.
Service the events in the order desired. Upon completion
of each service, write a '1' back to the event source register bit to clear that event. Continue in this manner until
all events are serviced and all the SMI service registers
are clear.
4.
Issue the proper CPU instruction to return from SMM
operation.
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If any events are still pending upon resume from SMM, the
82C465MV chip will issue a new SMI# immediately.
4.8.6.1
PMI Source Register Details
Registers 5Ch, 5Dh, DCh, and DDh indicate the SMI source.
When a PMI event occurs, the corresponding bit will be set to
'1' and the SMI# signal will then be generated. In the SMI service routine, SMM code must check these registers for the
PMI source(s) and then clear them. Otherwise, for all but the
EPMI pins the latched PMI source will generate SMI# continuously. SMI code normally clears only one event at a time to
keep track of the events as they are serviced, but all events
can be cleared at once if desired. Note that clearing bit
5Ch[6] will clear bit 5Ch[7] also.
Refer to the “Suspend and Resume” section of this document
for information on PMI#6 when it is used to indicate a resume
event.
Table 4-118 SMI Service Registers
7
6
5
4
SYSCFG 5Ch
PMI#7,
Suspend:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#6, Resume
or INTRGRP:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
1
PMI#5,
R_TIMER
time-out:
PMI#4,
IDLE_TMR
time-out:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#3,
LOWBAT:
PMI#2,
EPMI2:
0 = Inactive
1 = Active
PMI#12,
PMI#14,
PMI#13,
KBD_ACCESS: DSK_ACCESS: LCD_ACCESS:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#11,
GNR1_TIMER:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#1,
EPMI1:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
SYSCFG DDh
PMI#21,
COM1_
ACCESS:
0 = Inactive
1 = Active
PMI#20,
GNR2_
ACCESS:
0 = Inactive
1 = Active
PMI#19,
HDU_
TIMER:
0 = Inactive
1 = Active
PMI#28,
DMA:
0 = Clear
1 = Active
(MVA)
4.8.6.2
EPMI Pin PMI Sources
The EPMI1-2 pin PMI source indicator bits behave a little differently than the rest of the PMI source indicator bits. For
PMIs #1 and #2, the EPMI1-2 inputs are not latched by
default, so SYSCFG 5Ch[2:1] are not latched. Therefore, an
external device could trigger an SMI by toggling one of the
EPMI1-2 lines, but if the device returns the EPMI line to its
inactive state before SMM code reads SYSCFG 5Ch[2:1], the
code would not be able to recognize the event that triggered
the SMI. Likewise, an EPMI1-2 edge could initiate a resume
PMI#27,
DOZE_TIMER:
0 = Clear
1 = Active
0 = Inactive
1 = Active
PMI#10,
KBD_TIMER:
PMI#9,
DSK_TIMER:
PMI#8,
LCD_TIMER:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#18,
COM2_
TIMER:
0 = Inactive
1 = Active
Default = 00h
PMI#17,
COM1_
TIMER:
0 = Inactive
1 = Active
PMU SMI Source Register 4
Reserved
PMI#0,
LLOWBAT:
Default = 00h
PMU SMI Source Register 3 (Write 1 to Clear)
PMI#22,
COM2_
ACCESS:
0
Default = 00h
PMI Source Register 2 (Write 1 to Clear)
SYSCFG DCh
PMI#23,
HDU_
ACCESS:
2
PMI Source Register 1 (Write 1 to Clear)
SYSCFG 5Dh
PMI#15,
GNR1_
ACCESS:
3
PMI#16,
GNR2_
TIMER:
0 = Inactive
1 = Active
Default = 00h
PMI#26,
RI:
0 = Clear
1 = Active
PMI#25,
EPMI4 pin/
cool-down
clocking:
PMI#24,
EPMI3 pin:
0 = Clear
1 = Active
0 = Clear
1 = Active
from suspend mode, but then would not be recognized if the
EPMI pin went to its inactive state.
SYSCFG A1h[0] is provided to allow EPMI1-2 to be latched
like other PMIs. If SYSCFG A1h[0] is written to 1, EPMI1-2
events will be latched at SYSCFG 5Ch[2:1]. Writing a '1' into
the active bit(s) then clears the PMI.
For PMIs #24 and #25, the EPMI3-4 inputs are always
latched, regardless of SYSCFG A1h[0] setting.
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4.8.6.3
I/O SMI Trap Indication
The 82C465MVA part provides a means for SMM code to
determine the I/O port whose access caused the SMI, as well
as a bit to indicate whether the access was a read or a write
access.
Table 4-119 I/O Access Trap Registers
7
6
5
SYSCFG D6h
4
3
2
1
PMU Control Register 10
Default = 00h
I/O port access
trapped (RO):
0 = I/O Read
1 = I/O Write
(MVA)
SYSCFG D7h
0
ACCESS trap
bit A9 (RO)
(MVA)
ACCESS Port Address Register
ACCESS trap
bit A8 (RO)
(MVA)
Default = 00h
ACCESS Trap Address bits A[7:0]:
- These bits, along with A[9:8] in bits D6h[1:0], provide the 10-bit I/O address of the port access that caused the SMI trap. SYSCFG D6h[2]
indicates whether an I/O read or I/O write access was trapped.
(MVA)
4.8.6.4
Utility Registers
The registers below provide a general purpose storage
region and a means of generating warning beeps on the sys-
tem speaker without modifying the AT-compatible I/O ports.
Table 4-120 Utility Registers
7
6
5
4
3
2
1
0
SYSCFG 52h
Scratchpad Register 1
General purpose storage byte:
- For CISA Configuration Cycles: Data phase information, low byte (MVB)
Default = 00h
SYSCFG 53h
Scratchpad Register 2
General purpose storage byte
- For CISA Configuration Cycles: Data phase information, high byte (MVB)
Default = 00h
SYSCFG 6Ch
Scratchpad Register 3
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, low byte (MVB)
Default = 00h
SYSCFG 6Dh
Scratchpad Register 4
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, high byte (MVB)
Default = 00h
SYSCFG 6Eh
Scratchpad Register 5
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, low byte (MVB)
Default = 00h
SYSCFG 6Fh
Scratchpad Register 6
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, high byte (MVB)
Default = 00h
SYSCFG 51h
Default = 00h
Beeper Control Register
General purpose storage bits
Beeper control:
00 = No action
10 = Off
01 = 1KHz
11 = 2KHz
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4.9
System Power Management
The power management unit logic provides two hardware
means of controlling the CPU clock speed.
Doze mode hardware causes the CPU speed to slow down or
stop to save power when there is no significant activity.
Thermal management hardware forces the CPU speed to be
reduced to avoid overheating the CPU when the system is
running at full speed for too long.
Both of these mechanisms engage the stop clock mechanism
to slow down the CPU.
4.9.1
STPCLK# Mechanism to Change CPU
Speed
Many CPUs contain a phase-locked loop (PLL) frequency
generator that takes the external clock frequency input and
doubles or triples it. Any CPU that depends on an internal
PLL for its frequency generation requires an input to allow it
to stop operations in an orderly manner and in a known state
until a new frequency can be established and locked onto.
This type of CPU is referred to as a PLL-based CPU, as
opposed to a static CPU whose clock can be changed at any
time. Static CPUs usually (but not always) require a 2X clock
input, while PLL-based CPUs almost always use a 1X clock
input.
The CPU speed control input is called the stop clock pin
(STPCLK#). The name is misleading, since the stop clock
protocol must be followed even when switching between
clock speeds, not just when stopping the clock altogether.
However, the 82C465MV interface uses this same name for
clarity. The STPCLK# mechanism is needed as follows.
• Static CPUs may or may not have a stop request input pin.
In either case, the CPU can be sped up, slowed down, or
stopped at any time. No protocol is required for Doze
mode on this type of CPU, but if it does have a stop clock
input the STPCLK# feature should be activated to save
additional power.
• PLL-based CPUs require a stop request signal from the
power management unit requesting the CPU to stop all
operations and disconnect from its clock input so that the
clock can be changed or stopped. This signal is called
STPCLK#, SUSP#, DFSREQ#, or similar.
• PLL-based CPUs also must tell the 82C465MV when they
are actually ready to allow the clock to be stopped or
changed. Some CPUs generate a special bus cycle to indicate this state; when they receive RDY# from the chipset
they will go to their stop grant state. Other CPUs have a
dedicated pin to indicate this condition to the chipset,
called STPGNT#, SUSPA#, DFSRDY#, or similar.
In addition to using a STPCLK# mechanism to change
speed, most CPUs provide a clock-stopping feature that
allows the CPUCLK input to be completely stopped during
periods of no activity. A system interrupt, such as initiated by
a keystroke or a timer interrupt, can cause the 82C465MV to
restart the CPU almost immediately. Stopping the CPU clock
is usually initiated by software (APM for example), but could
also be initiated by the hardware doze mechanism.
4.9.1.1
Hardware Considerations
To enable the STPCLK# request logic of the 82C465MV, the
logic must sample pins 13 and 23 high at reset. These pins
must be strapped high with 10KΩ resistors. Refer to Section
3.3, "Strap-Selected Interface Options" on page 5 for complete details.
4.9.1.2
Programming
To enable STPCLK# operation, the registers shown below
must be programmed as follows.
• SYSCFG 65h[6] and 66h[5] are set according to the
slowed or stopped CPU clock desired:
- For completely stopping the CPU clock: Set SYSCFG
65h[6] = 1 for latched STPCLK# operation and
SYSCFG 66h[5] = 1 for stopping the CPU clock during
Doze mode.
- For slowing down the CPU clock: Set SYSCFG 65h[6] =
0 for pulsed STPCLK# operation and SYSCFG 66h[5] =
0 for slowing the CPU clock during Doze mode (the
slowdown speed is set in SYSCFG 41h[4:2] as
described later).
• Enable the STPCLK# logic mechanism by setting
SYSCFG 61h[2] = 1 for any CPU that requires a clock
change request signal (STPCLK#, DFSREQ#, SUSP#) to
change operating frequency. Even for static CPUs whose
frequency can be changed dynamically, if a STPCLK#
input is provided it should be used to save power. The
additional power savings is substantial, especially in software Doze mode when the CPU clock is stopped.
• If STPCLK# is used, enable the stop grant protocol as
needed. Almost all 1X CPUs require setting SYSCFG
66h[0] = 1 to recognize the stop grant cycle. In addition:
- CPUs that have a stop grant pin (STPGNT#, DFSRDY#, SUSPA#) require setting SYSCFG 66h[3] = 1
and SYSCFG 57h[3] = 0 to enable the 82C465MV
STPGNT# input on PIO3.
- For CPUs that do not have a stop grant pin, the
STPGNT# input function to the 82C465MV be disabled
(SYSCFG 66h[3] = 0). Otherwise, the chipset may prematurely detect a “stop granted” condition and will
change the clock unconditionally, likely hanging the
CPU.
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• Enable and set a switching delay through SYSCFG
B0h[7:0] to select the precise minimum switching delay
required for the CPU in use. If disabling the STPCLK# signal, set SYSCFG B0h[7:0] = 0 for no delay.
4.
Stops the clock to the CPU
5.
Awaits a restart event such as an interrupt
6.
Restarts the clock to the CPU
The STPCLK# sequence will now be observed any time the
hardware Doze feature changes the clock speed, or when
APM commands the clock to stop. For example, during an
APM stop clock operation the 82C465MV:
7.
Waits for the switching delay time programmed
8.
De-asserts its STPCLK# output and continues operation.
1.
Asserts its STPCLK# output
2.
Waits for either a stop grant cycle or a STPGNT# signal
3.
Returns RDY# to the CPU
The sequence for slowing the clock is similar except that
instead of Steps 4 through 6 above, the 82C465MV simply
switches the clock speed.
The registers associated with the clock speed change mechanism are shown in Table 4-121. Additional detailed descriptive information follows the register bit listings.
Table 4-121 Register Bits Associated with STPCLK# Feature
7
6
5
SYSCFG 57h
4
3
2
PMU Control Register 6
1
0
Default = 00h
PIO3
direction:
0 = Input
1 = Output
SYSCFG 61h
Debounce Register
Default = 00h
STPCLK#
signal:
0 = Disable
1 = Enable
SYSCFG 65h
DOZE Register
Default = 00h
PMU Control Register 8
Default = 00h
STPCLK#
control:
0 = Pulse
1 = Latch
SYSCFG 66h
Doze type:
Pin 171
function:
0 = Slow CPU
clock
0 = PIO3
1 = STPGNT#
1 = Stop CPU
clock
SYSCFG B0h
Stop Clock Delay Register
Stop clock
delay:
Stop clock
delay time
base:
0 = Disable
1 = Enable
0 = 32KHz/4
(~122 us)
1 = FBCLK/4
CPU clock
change protocol required?
0 = No
1 = Yes
Default = 00h
Delay Count:
- This value multiplies the time base period selected in bit [6]. There is an additional 6 FBCLK delay for
all selections, even “no delay.” Sample approximate delays based on 32KHz/25MHz selections:
000000 = No delay
000001 = 122us/160ns
000010 = 244µs/320ns
000011 = 366µs/480ns
...
001000 = 976µs/1.28µs
001001 = 1.1ms/1.44µs
...
111111 = 7.7ms/10.0µs
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STPCLK# Pulse/Latch Control
The STPCLK# pulse/latch control bit, SYSCFG 65h[6], is
meaningful only if the STPCLK# protocol is enabled by
SYSCFG 61h[2] = 1 and SYSCFG 66h[0] = 1. The mechanism operates as follows.
• When STPCLK# is set to “pulse” for changing the frequency of the CPU clock (slowed CPUCLK mode),
SYSCFG B0h[6:0] determine the duration of the pulse
starting from the RDY# responding to the CPU stop grant
cycle and ending with STPCLK# going inactive. The
82C465MV logic changes the clock speed just after generating RDY# to the CPU.
• When STPCLK# is set to “latch” for stopping the CPU
clock (stopped CPUCLK mode), STPCLK# goes low and
stays low. Just after generating the RDY# responding to
the CPU stop grant cycle, the logic slows down and then
stops the clock. Upon any enabled Doze reset event, the
82C465MV logic restarts the clocks at Doze speed, then
brings them to full operating speed. SYSCFG B0h[6:0]
determine the start-up delay between the clocks returning
to full speed and the STPCLK# signal going inactive.
The total time STPCLK# is active must also include the time
from when the 82C465MV logic sets it active to the point
where the CPU responds with a stop grant cycle, which is
CPU-dependent.
Stop Clock Delay Selections
Most currently available CPUs specify a delay of 1ms from
CPUCLK stable operation to STPCLK going inactive. To
anticipate future CPUs that may require a clock stabilization
delay time significantly greater or less than 1ms, the
82C465MV provides a register to offer total delay flexibility.
The stop clock delay time base bit, SYSCFGB0h[6], provides
two ranges: 32KHz/4 (for a 122µs period), and OSCCLK/4
(for a 200ns period @ 20MHz, for example).
Note that when using the OSCCLK delay range, the values
are calculated on the effective input frequency. If a 2X OSCCLK is used, it will be divided by 2 for an effective 1X input
clock. In other words, if the input clock is 2X, the delay period
becomes OSCCLK/8 to compensate.
Also note that regardless of delay setting, even for no delay,
there will always be an additional six CPUCLKs of delay over
any setting (whether based on CPUCLK or 32KHz). The logic
requires this time to engage its sequencer.
4.9.2
Doze Mode
The 82C465MV power management unit includes Doze
mode control logic. Doze is the state in which the CPU and
the 82C465MV chipset are fully alive and operational, yet
running at a speed that is greatly reduced in order to save
power. The 82C465MV engages Doze mode when it sees no
activity in certain pre-definable areas for a certain time
period. Once initialized by software, the process is com-
pletely controlled by hardware. No further software intervention is needed, but an SMI can be generated if desired.
Even though Doze mode is intended to operate independently without application or BIOS intervention, the
82C465MV provides logic hooks to software for softwarebased power control. The most common type of softwarebased power control follows the Microsoft® Advanced Power
Management (APM) specification, which allows applications
to inform the operating system when they are Idle or do not
require full processing power. The operating system, in turn,
makes BIOS calls that can do any of the following:
• Turn off or put into a Standby mode any unneeded peripherals
• Slow system clock speeds
• Turn off clocks to the CPU.
Therefore, the 82C465MV Doze mode logic provides for
three Doze mode operations: hardware-controlled slowdown,
software-controlled slowdown, and software-controlled slowdown with a stopped CPU clock.
The three modes are very similar and are outlined in the sections below, followed by descriptions of registers that the
three modes have in common. Note, however, that the hardware mechanism of clock slowing or stopping is dependent
on the type of CPU in use. The 82C465MV provides the stop
clock logic described below.
4.9.2.1
Dual Doze Timer Reload Selections
The standard 82C465MV part can generate a Doze timer
time-out in as little as 2ms. However, this selection is not
compatible with all applications. For example, stable operating speed might be desirable for at least 2s after a keyboard
interrupt in order to completely service the event and prevent
delays on subsequent keystrokes. Another operation, such
as video access, might allow a return to Doze mode almost
immediately.
Therefore, the 82C465MVA part provides a choice of two
time-out timers for each device. When an interrupt for the
device or access in the range associated with that device
occurs, the event triggers a Doze reset that reloads the
selected timer for that device with the time-out value associated with that timer. Only when both timers have expired will
the system return to Doze mode operation.
On the original 82C465MV part, COM port, LPT port, and
GNR accesses could not cause a Doze reset. On the
82C465MVA version, these accesses can be programmed to
enable a Doze reset. However, to maintain backward compatibility with the 82C465MV and 82C463MV, the COM1,
COM2, LPT, and GNR accesses point to the secondary Doze
timer at reset; this timer in turn is programmed for “no delay”
at reset. The Doze logic interprets the “no delay” setting as
inhibiting Doze reset for that source.
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The SMI, EPMI1, and INTR signals are also potential sources
of doze reset. However, these signals always use Doze timeout 0 and cannot select Doze time-out 1.
Regarding SMI generation on Doze events: Doze time-out
events on DOZE_0 and DOZE_1 can be individually pro-
grammed to generate an SMI through SYSCFG D9h[7:6],
which are redefined on the 82C465MVA part to select the
time-out(s) that will cause an SMI. Doze reset events are all
individually programmable to generate SMIs.
Table 4-122 Doze Time-out Control Registers
7
6
5
SYSCFG 76h
4
3
2
1
Doze Reload Select Register 1
LCD_ACCESS: KBD_ACCESS: DSK_ACCESS: HDU_ACCESS:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
COM1&2_
ACCESS:
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
SYSCFG 77h
Default = 00h
LPT_ACCESS:
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
GNR1_
ACCESS:
GNR2_
ACCESS:
0 = DOZE_0
1 = DOZE_1
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
Default = 1
(MVA)
Doze Reload Select Register 2
IRQ8:
IRQ6:
IRQ7:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
SYSCFG 78h
IRQ5:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ4:
0 = DOZE_0
1 = DOZE_1
(MVA)
Default = 00h
IRQ3:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ1:
0 = DOZE_0
1 = DOZE_1
(MVA)
Doze Reload Select Register 3
IRQ14:
IRQ15:
LDEV#:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
SYSCFG D9h
IRQ13:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ12:
0 = DOZE_0
1 = DOZE_1
(MVA)
0
IRQ0:
0 = DOZE_0
1 = DOZE_1
(MVA)
Default = 00h
IRQ11:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ10:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ9:
0 = DOZE_0
1 = DOZE_1
(MVA)
PMU Event Register 6
Default = 00h
PMU Control Register 2
Default = 00h
PMU Control Register 11
Default = 00h
DOZE_TIMER PMI#27
SMI:
00 = Disable
01 = Enable DOZE_0 (MVA)
10 = Enable DOZE_1 (MVA)
11 = Enable both
SYSCFG 41h
DOZE_0 time-out select:
000 = 2 ms
001 = 4 ms
010 = 8 ms
011 = 32 ms
100 = 128 ms
101 = 512ms
110 = 2s
111 = 8s
SYSCFG 79h
DOZE_1 time-out select (MVA):
000 = No delay (Default)
001 = 1ms
010 = 4ms
011 = 16ms
100 = 64ms
101 = 256 ms
110 = 1s
111 = 4s
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4.9.2.2
Presetting Events to Reset Doze Mode
Before enabling Doze mode operation, whether hardware or
software Doze mode, some preparation must be made for the
event or events that will reset Doze mode and bring the system back to full operation. Otherwise, especially in the case
of APM stop clock mode, there would be no way to execute
CPU instructions to restart the CPU clock.
Therefore, it is first necessary to choose the source or
sources that will perform a Doze reset. Doze reset will, if the
system is currently in Doze mode, restore the system clocks
to full operating speed. Doze reset also reloads the
DOZE_TIMER with its original programmed value.
• Setting SYSCFG 41h[1] = 1 enables LCD_ACCESS,
KBD_ACCESS, DSK_ACCESS, and HDU_ACCESS to
reset Doze mode and reload the DOZE_TIMER. If the
DOZE_TIMER has timed out and switched operation to
Doze speed, this reload will change the system clocks
back to their normal speed. Obviously, this bit has no
effect if stopped (not just slowed) CPUCLK operation is
programmed.
• SYSCFG 65h[5] selects the EPMI1 pin as a Doze reset
trigger (level-triggered).
• SYSCFG 62h[7:0], A2h[5:0], and 65h[3] define individual
IRQs that can trigger a Doze reset.
• SYSCFG 65h[7] allows all enabled interrupts (i.e., any
event that toggles the INTR signal to the CPU) to reset
Doze mode.
Once the Doze mode reset events have been programmed
(see Table 4-123), either hardware or software Doze mode
can be enabled as described in the following sections.
Table 4-123 Register Bits that Select Doze Mode Reset Events
7
6
5
SYSCFG 41h
4
3
2
1
PMU Control Register 2
0
Default = 00h
LCD, DSK,
KBD, HDU
_ACCESS
events reset
Doze mode:
0 = Disable
1 = Enable
SYSCFG 62h
IRQ Doze Register 1 (WO)
Default = 00h
IRQ13 Doze
reset:
IRQ8 Doze
reset:
IRQ7 Doze
reset:
IRQ12 Doze
reset:
IRQ5 Doze
reset:
IRQ4 Doze
reset:
IRQ3 Doze
reset:
IRQ0 Doze
reset:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A2h
IRQ Doze Register 2 (WO)
IRQ15 Doze
reset:
IRQ14 Doze
reset:
IRQ11 Doze
reset:
IRQ10 Doze
reset:
IRQ9 Doze
reset:
IRQ6 Doze
reset:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0= Disable
1= Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 65h
All interrupts to
CPU reset Doze
mode:
0 = Disable
1 = Enable
Default = 00h
DOZE Register
EPMI1 Doze
reset:
0 = Disable
1 = Enable
SMI resets
Doze mode?
0 = No
1 = Yes
Default = 00h
IRQ1 Doze
reset:
0 = Disable
1 = Enable
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4.9.2.3
LDEV# Doze Reset
Activity on the local bus can reset Doze mode and cause a
return to full operating speed. The 82C465MVA logic provides two bits to enable Doze reset separately for local bus
I/O accesses and local bus memory accesses. The doze
reset is triggered by LDEV# going active and is qualified by
the M/IO# signal.
4.9.2.4
Doze Reset Inside SMM
The 82C465MVA part allows an SMI to reset Doze mode if
the clock is stopped from within system management mode.
SYSCFG 65h[4] in the 82C465MV part enables Doze mode
reset when the SMI signal goes active, but since SMI is
masked on entry to SMM, an SMI triggered while the system
is in SMM is not seen until some other trigger resets Doze
mode.
Setting SYSCFG 79h[4] = 1 handles Doze reset only from
within SMM. Set SYSCFG 65h[4] = 1 to handle SMI Doze
mode exit from outside of SMM. Table 4-125 shows the two
bits.
Table 4-124 Local Bus Doze Reset Registers
7
6
5
SYSCFG A2h
Local bus I/O
access Doze
reset:
4
3
2
1
0
IRQ Doze Register 2 (WO)
Default = 00h
Doze Reload Select Register 3
Default = 00h
Local bus memory access
Doze reset:
0 = Disable
1 = Enable
(MVA)
0 = Disable
1 = Enable
(MVA)
SYSCFG 78h
LDEV#:
0 = DOZE_0
1 = DOZE_1
(MVA)
Table 4-125 Doze Reset Bits Inside and Outside of SMM
7
6
SYSCFG 79h
5
4
3
PMU Control Register 11
2
1
0
Default = 00h
SMI resets
Doze mode if
clock is
stopped inside
SMM?
0 = No
1 = Yes
(MVA)
SYSCFG 65h
DOZE Register
Default = 00h
SMI resets
Doze mode?
0 = No
1 = Yes
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4.9.2.5
Automatic (Hardware) Doze Mode
The chipset can be set up for hardware-controlled slowdown
Doze mode by programming the following information.
1.
Set up the hardware and programming to consider the
stop clock mechanism as described in Section 4.9.1,
"STPCLK# Mechanism to Change CPU Speed" on page
129.
2.
Program the events that will reset Doze mode as
described in Section 4.9.2.2, "Presetting Events to Reset
Doze Mode" on page 133.
3.
Select the time-out, that is, the time required after the
last event before the system can be considered “inactive,” in SYSCFG 41h[7:5]. A two second time-out is typical.
4.
Select the clock divisor from SYSCFG 41h[4:2]. When
choosing a divisor, keep in mind that most CPUs cannot
run below 8MHz, while the limit for clock-tripled CPUs is
usually 12.5MHz.
5.
Set SYSCFG 66h[5] = 0 for slow-clock mode as opposed
to stop-clock mode.
6.
Set SYSCFG 65h[4] = 1 if chipset should exit Doze
mode for SMIs, or = 0 if the SMIs can run adequately at
the Doze speed. Note that since the clock change delay
is typically 1ms, it may be practical to simply run the SMI
code at the slower speed.
7.
Finally, enable the hardware DOZE_TIMER by setting
SYSCFG 41h[0] = 0.
After the selected period of inactivity, the CPU clock and the
chipset clock will automatically be set to a low-speed mode.
On the event of any of the enabled accesses, SMIs, or IRQs,
the clock will again speed up for fully active operation.
Table 4-126 shows the above discussed register bits.
Table 4-126 Hardware Doze Mode Registers
7
6
5
SYSCFG 41h
3
2
PMU Control Register 2
DOZE_0 time-out select:
000 = 2 ms
001 = 4 ms
010 = 8 ms
011 = 32 ms
4
100 = 128 ms
101 = 512ms
110 = 2s
111 = 8s
SYSCFG 66h
0
Default = 00h
Doze mode system clock speed:
000 = OSCCLK/1
001 = OSCCLK/2
010 = OSCCLK/4
011 = OSCCLK/8
1
100 = OSCCLK/16
101 = OSCCLK/3
110 = Reserved
111 = Reserved
Doze control
select:
0 = Hardware
1 = Software
PMU Control Register 8
Default = 00h
DOZE Register
Default = 00h
Doze type:
0 = Slow CPU
clock
1 = Stop CPU
clock
SYSCFG 65h
SMI resets
Doze mode?
0 = No
1 = Yes
SYSCFG 50h
PMU Control Register 5
Default = 00h
Write:
1 to Start Doze
Read:
Doze status
0 = counting
1 = timed out
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4.9.2.6
APM (Software) Doze Mode
The chipset can be set up for software-initiated, slowed or
stopped CPUCLK Doze mode in a very straightforward manner.
1.
2.
Set up the hardware and programming to consider the
stop clock mechanism as described in Section 4.9.1,
"STPCLK# Mechanism to Change CPU Speed" on page
129.
Program the events that will reset Doze mode as
described in Section 4.9.2.2, "Presetting Events to Reset
Doze Mode" on page 133.
3.
Set SYSCFG 65h[4] = 1 if chipset should exit doze mode
for SMIs, or = 0 if the SMIs can run adequately at the
doze speed. SYSCFG 65h[4] must be set to 1 for stop
clock operation or else the SMI will be missed altogether.
4.
Select the clock divisor from SYSCFG 41h[4:2]. When
choosing a divisor, keep in mind that most CPUs cannot
run below 8MHz, while the limit for clock-tripled CPUs is
usually 12.5MHz. If the CPU clock will be stopped,
ignore the lower CPU limit and use a very low clock
speed to save power to the chipset (whose clock is also
slowed).
5.
Disable the hardware DOZE_TIMER by setting SYSCFG
41h[0] = 1.
At this point the system is ready for APM control. When APM
makes a call for low or very low power operation, the BIOS or
power management code simply:
• For slow clock Doze: Sets SYSCFG 65h[6] = 0 and
SYSCFG 66h[5] = 0
-- or -For stop clock doze: Sets SYSCFG 65h[6] = 1 and
SYSCFG 66h[5] = 1
• Sets SYSCFG 50h[3] = 1 to initiate the Doze mode.
On the event of any of the enabled accesses, SMIs, or IRQs,
the clock will again speed up for fully active operation.
Table 4-127 Software Doze Mode Registers
7
6
5
SYSCFG 41h
4
3
2
PMU Control Register 2
SYSCFG 66h
0
Default = 00h
Doze mode system clock speed:
000 = OSCCLK/1
001 = OSCCLK/2
010 = OSCCLK/4
011 = OSCCLK/8
1
100 = OSCCLK/16
101 = OSCCLK/3
110 = Reserved
111 = Reserved
Doze control
select:
0 = Hardware
1 = Software
PMU Control Register 8
Default = 00h
DOZE Register
Default = 00h
Doze type:
0 = Slow CPU
clock
1 = Stop CPU
clock
SYSCFG 65h
SMI resets
Doze mode?
0 = No
1 = Yes
SYSCFG 50h
PMU Control Register 5
Default = 00h
Write:
1 to Start Doze
Read:
Doze status
0 = counting
1 = timed out
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4.9.2.7
Start Doze Bit
SYSCFG 50h[3] serves two purposes: to start Doze mode
and to read the DOZE_TIMER status.
• Write: Start APM Doze mode
'1' = start Doze mode (if SYSCFG 40h[0] = 1)
'0' = no effect
4.9.2.8
Using Doze Time-out to Trigger an SMI
In addition to the ability to reset Doze mode when an SMI is
encountered, the 82C465MV has the ability to generate
PMI#27 when the DOZE_TIMER times out. Setting SYSCFG
D9h[7:6] = 11 enables the PMI to generate an SMI (see Table
4-128).
• Read: Hardware DOZE_TIMER time-out status bit
'1' = Hardware DOZE_TIMER has timed out
'0' = Hardware DOZE_TIMER still counting
Table 4-128 DOZE_TIMER SMI Generation Bits
7
6
SYSCFG D9h
5
4
3
PMU Event Register 6
2
1
0
Default = 00h
DOZE_TIMER PMI#27
SMI:
00 = Disable
01 = Enable DOZE_0 (MVA)
10 = Enable DOZE_1 (MVA)
11 = Enable both
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4.9.3
CPU Thermal Management Unit
Thermal management hardware is implemented in the
82C465MV for monitoring the level of CPU activity and the
operating temperature of the device. A flexible hardware
scheme assesses CPU activity to determine when it is necessary to enter cool-down clocking Mode. In addition, an external sensor can force the 82C465MV permanently into cooldown clocking mode according to the parameters programmed for thermal management. In this way, a serious
over-temperature condition cannot get out of control (as a
result of “thermal runaway”).
4.9.3.1
Prediction of Overtemp Activity
Thermal management logic is implemented in the 82C465MV
for monitoring the level of CPU activity to determine its current draw, and thus approximate the operating temperature of
the device. The most obvious way to do this would be to simply count the number of CPU clocks that occur in a given time
period. However, a ripple counter running in the 20-40MHz
range would consume a great deal of power. Instead,
82C465MV logic assesses CPU activity periodically and
keeps track of how often the CPU exceeds the safety limits to
determine whether automatic intervention is called for.
Operating Temperature Ranges
The 82C465MV thermal management algorithm identifies the
temperature limits of any CPU through activity level values
that correspond with idle, equilibrium, and thermal runaway
conditions.
• Idle Condition - The CPU is cool to the touch. The
82C465MV is using APM stop clock or hardware Doze
mode to save power, and no real activity is taking place.
This operational level constitutes the base level of activity,
so it does not require a register to hold the value. It is
associated in the 82C465MV thermal management
scheme with “zero”.
• Equilibrium Condition - The CPU is warm to the touch. It is
operating at full speed for short bursts but frequently is at
slow speed or stopped. The heat generated by the CPU is
dissipated at the same rate that it is produced. Most active
computer usage falls into this category, where APM or
hardware Doze mode operates frequently enough to allow
safe operation. The 82C465MV thermal management
scheme associates this temperature with Equilibrium Level
bits, EQL6:0. The value of these bits is referred to as EQL
throughout this section.
• Thermal Runaway Condition - The CPU is hot to the touch.
It is running at its full rated speed and generating heat
faster than it can be dissipated, so its temperature
increases. The program being used is active enough that
APM or hardware Doze mode cannot operate often
enough to hold the temperature down. Operating in this
mode for an extended period may cause damage to the
CPU. The 82C465MV thermal management scheme associates this temperature with Overtemp Limit bits, OTL7:0.
The value of these bits is referred to as OTL throughout
this section.
Accounting for CPU Activity
82C465MV logic frequently assesses CPU activity, according
to the current CPU running mode. Each CPU run mode is
associated with a power level increment as shown in Table 4129. Using these values, the 82C465MV can keep a running
count of the average power being used by the CPU in the
internal 24-bit CPU Activity Counter (CNT).
Table 4-129 Power Levels Assigned to Each
Operating Mode
Current CPU Operating Mode
Power Level
Increment
Full Speed
+2
Divide by 2 or 3
+1
Divide by 4
0
Divide by 8
–1
Divide by 16 or more
–2
APM Stop Clock
–2
The 82C465MV must also be able to account for the CPU
type. For example, a clock-doubled or -tripled CPU at full
speed will heat up much faster, yet at Idle will cool down at
approximately the same rate, as a non clock-multiplied CPU.
The CPU Efficiency bits, CPUE1:0, are used to indicate the
relative CPU current consumption and are explained below.
The thermal management hardware keeps track of CPU
activity as follows. The logic checks the current CPU operating mode either 32k, 16k, 8k, or 4k times per second according to the CDHO1:0 bits setting as explained below. The
thermal management logic notes the current operating mode
to account for the instantaneous CPU current consumption
by incrementing or decrementing the CPU Activity Counter as
follows.
• For all CPU operating modes, the logic increments or decrements the counter by the value listed in Table 4-129 for
the operating mode at that time.
• Only for those modes with a power level increment above
zero, the logic also increments the CPU activity counter by
the CPU Efficiency bits value.
For example, if the CPU is sampled at full speed (+2), and
CPUE1:0 = 2, the activity counter will be incremented by 4.
However, if the CPU is sampled at divide by 8 (–1), the
counter will simply be decremented by 1. The CPUE value is
not added in if the power level increment is zero or below
because the cool-down rate is independent of CPU type.
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Determination of Operating Temperature Range
Periodically, the thermal management logic compares the
upper byte of the CPU activity counter to the Overtemp Limit
(OTL) and to the Equilibrium Level (EQL). This comparison
takes place every 32, 64, 128, or 256 seconds as programmed in the Cool-down Holdoff bits, CDHO1:0. These
bits also select the frequency of sampling, at 32k, 16k, 8k, or
4k times per second respectively, such that the value accumulated in the CPU activity count will, on average, be the
same whether a short or a long holdoff period is selected.
The logic acts on the comparison results as follows.
• If the upper byte of the activity count is greater than or
equal to OTL, the thermal management unit initiates cooldown clocking.
• If the upper byte of the activity count is above EQL but
below OTL, EQL is subtracted from the upper byte of the
CPU Activity Counter and the result is returned to the
Figure 4-8
counter. This scheme handles operation consistently
above equilibrium level that may, over time, result in
excessively high CPU temperatures.
• If the upper byte of the activity count is equal to or below
EQL, the CPU Activity Counter is simply cleared and the
thermal management logic starts a new detection period
from “zero” (Idle condition).
Cool-down Clocking
Cool-down clocking takes place according to the reduced
clock rate programmed into the Cool-down Clock Rate bits,
CDCR1:0. The 82C465MV keeps the CPU running at the
cool-down clocking rate speed for the cool-down holdoff
period multiplied by the cool-down time-out value programmed. At the end of the period, the activity counter is
cleared and normal clocking is restored. No activity accounting takes place while cool-down clocking is engaged.
Thermal Management Block Diagram
Reset
CPU Efficiency (CPUE)
+3, +2, +1, 0
CPU Activity Count (CNT)
CPU Operating Mode
24 bits
+2, +1, 0, –1, –2
Holdoff Clock (CDHO)
Sample @ 31, 61, 122, or 244µs
Limit Check @ 32, 64, 128, or 256s
23
15
Set NewCNT =
OldCNT - EQL
7
0
Yes
Overtemp Limit (OTL)
Equilibrium Level (EQL)
CNT ≥ OTL?
No
CNT ≥ EQL?
No
Yes
Cool-Down Time-out (CDTO)
1 to 20 minutes
Engage Cool-Down
Clocking (CDCR)
Restore Normal
Clocking
/2, /3, /4, /8
/1, /2, /3, /4, /8
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4.9.3.2
Example
A 25/75MHz CPU is being used with clock tripling enabled.
The cool-down clock rate is set to divide-by-2 so that even
when slowed down, the minimum clock speed will be above
12MHz. The CPU efficiency bits are set to 3 because of the
clock tripler. Cool-down holdoff is set for 64 seconds; Cooldown time-out is set for 3x; the equilibrium level is set to 40h;
and the Overtemp Limit is set to 7Fh.
Consider the situation after the CPU has run at full speed for
one minute. The thermal management hardware is checking
the CPU operating mode every 61µs (16,384 times per second), and each time increments the CPU Activity Counter by
2 to account for the CPU running at full speed and then by 3
to account for the CPU Efficiency setting. Thus, the count is
incremented by 16,384 x 5 each second for 64 seconds, for a
total count of 500000h. The value of the high byte is 50h; this
value is compared to EQL, which was set to 40h. Since the
activity count exceeds the equilibrium level, EQL is subtracted from the activity count and the result (10h) remains in
the counter. However, the activity count of 50h does not
exceed the OTL value of 7Fh. Therefore, no other action is
taken.
Now consider the situation after the CPU has run at full
speed for four minutes. After each 64-second interval, the
high-order activity count byte has been incremented by 50h,
and after the OTL comparison is made the EQL value of 40h
has been subtracted off for a net increase of 10h. So after
four minutes of operation, when the OTL comparison is
made, the activity count of 80h is compared to the OTL value
of 7Fh and an over-limit situation is detected.
Therefore, the thermal management hardware engages cooldown clocking at 25MHz/2 for three minutes (3 x 64 seconds). It then resets the CPU Activity Counter, resumes normal clocking and monitoring, and starts the whole detection
process over again.
This situation would have been avoided if APM stop clock
mode had been entered for at least ten seconds during each
64-second period. In that case, the thermal management
hardware would have counted (16384 x 5 x 54) + (16384 x –2
x 10) = 3E8000h each time, just under the 40h equilibrium
limit. The CPU activity counter would have been reset each
time and no thermal buildup would have been detected.
4.9.3.3
Programming
Before programming thermal management, the STPCLK#
mechanism must be set up for the CPU being used as
described in Section 4.9.1, "STPCLK# Mechanism to Change
CPU Speed" on page 129. Enabling thermal management
locks the STPCLK# bits and prevents them from being
altered until the next hardware reset.
The thermal management option must be configured by setting the bits in SYSCFG A5h, A6h, and A7h, and then setting
SYSCFG A5h bit 7 = 1. The register setting order is not
important, but bit 7 of SYSCFG A5h must be set to 1 only
after all other settings have been made. Once bit 7 is set,
none of the thermal management registers, nor the STPCLK#
bits (SYSCFG 61h[2], 66h[0], and B0h[7:0]), can be written
again without resetting the 82C465MV chip.
Table 4-130 shows the thermal management programming
registers and details regarding the bits follow.
Table 4-130 Thermal Management Registers
7
6
5
4
SYSCFG A5h
3
2
Thermal Management Register 1
1
0
Default = 00h
Equilibrium Level (EQL6:0):
Thermal
management:
- This count corresponds to equilibrium operation. If the CPU Activity Counter exceeds EQL, EQL is simply subtracted
from the upper activity count byte and sampling continues. If the count is below EQL, the count is cleared.
0 = Disable
1 = Enable
SYSCFG A6h
Thermal Management Register 2
Default = 00h
Overtemp Limit (OTL7:0):
- This count corresponds to an over-temperature situation. If the CPU Activity Counter exceeds OTL, the 82C465MV engages cool-down
clocking.
SYSCFG A7h
Thermal Management Register 3
CPU Efficiency (CPUE1:0):
00 = Low power
01 = Moderate
10 = High
11 = Very high
Cool-down Holdoff (CDHO1:0):
00 = 32s
01 = 64s
10 = 128s
11 = 256s
Cool-down clock rate (CDCR1:0):
00 = /2
01 = /3
10 = /4
11 = /8
Default = 00h
Cool-down time-out (CDTO1:0):
00 = 2x CDHO
01 = 3x
10 = 4x
11 = 5x
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Thermal Management Enable bit SYSCFG A5h[7] - Once
written to 1, none of the thermal management registers can
be cleared without a system reset. When read, this bit returns
1 only if cool-down clocking is currently taking place.
Cool-down Holdoff bits SYSCFG A7h[5:4] - Specify the
time period of observation to allow before checking whether
to enable cool-down clocking.
Cool-down Clock Rate bits SYSCFG A7h[3:2] - Specify the
CPU clock divisor to use during Cool-down Clocking.
Cool-down Time-out bits SYSCFG A7h[1:0] - Specify the
length of time, in terms of the cool-down holdoff selected, that
the cool-down clocking will continue before normal operation
is restored.
SMI Generation
When the thermal management unit engages or disengages
cool-down clocking, an SMI on PMI#25 can be generated.
This feature is controlled through SYSCFG DBh[6]. When
this SMI is being serviced, power management code can
read SYSCFG A5h[7] to determine whether it was an entry
into or an exit from cool-down clocking mode that caused the
SMI.
PMI#25 is also shared with the EPMI4 event. If the SMI from
EPMI4 is also enabled, on entry to the SMI software must
check the state of the EPMI4 signal to determine whether the
reason for the SMI is the external EPMI4 event or cool-down
clocking entry/exit.
4.9.4
The chip will remain in cool-down clocking mode, using the
rate specified in SYSCFG A7h, CPU Thermal Management
Register 3, (defaults to divide-by-2) as long as the EPMI2
input remains triggered. The trigger specifications are the
same as those for triggering the SMI: SYSCFG 40h[2] selects
whether a high level or a low level is active, and this same bit
selects whether a high level or a low level will engage cooldown clocking. The thermal management unit does not need
to be enabled to use this feature.
EPMI2 can be used as the overtemp sense input even when
the EPMI2 function has been moved to an external 74153
multiplexer (when the standard DACKMUX interface feature
has been selected).
4.9.4.1
Programming
The emergency overtemp sense option is enabled by writing
SYSCFG DBh[6] as explained previously (SMI Generation
section, this page). Once written, this bit cannot be changed
without a hard reset of the chip.
When SYSCFG DBh[6] = 1, entry into or exit from cool-down
clocking mode causes PMI#25 and an SMI. If the EPMI2
event is also programmed to cause an SMI, the following situation can occur.
1.
The thermal sensor input changes state, causing PMI#2
and an SMI.
2.
Power management code services the SMI.
3.
The thermal management unit generates a stop clock
request.
4.
Once the CPU generates a stop grant cycle, the chipset
reduces the clock speed to enter cool-down clocking
mode.
5.
At this point, PMI#25 is generated along with another
SMI.
Emergency Overtemp Sense
It is possible for an external sensor to force the 82C465MV
into cool-down clocking mode according to the parameters
programmed for thermal management. When low, the EPMI2
input can cause the 82C465MV to enter cool-down clocking
mode. The existing SMI enable bits for EPMI2 are still operational regardless of the setting of the emergency overtemp
enable bit. Therefore, an overtemp condition can also be programmed to cause an SMI so that the power management
firmware will be made aware of the situation and instruct the
user to shut down the system. In this way, a serious overtemperature condition cannot get out of control.
Therefore, two SMIs will have been generated. On exit from
cool-down clocking mode, only one SMI will be generated,
since the active-to-inactive transition on EPMI2 does not
cause another SMI. Power management software must be
able to anticipate this situation and deal with it appropriately.
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4.10
Suspend and Resume
The 82C465MV offers the ability to halt operations at
extremely low power yet retain all its programming, called
Suspend. The chipset will respond to interrupts to determine
that a return to normal operation, called Resume, is necessary.
4.10.1 Suspend Mode
Suspend mode provides a significant level of power conservation. The Suspend initiation event, either a key or button
depression or a time-out SMI, calls a software routine in SMM
code to save the current state of the system for complete restoration at some later time. In this mode, most system power
can be shut down while still retaining the ability to restore the
previous context. The 82C465MV can either stop the clock to
a still-powered CPU, or engage leakage controls with a CPU
that must be powered down during Suspend. The leakage
control function is enabled by either floating or driving low all
critical interface nodes to reduce power consumption to a
bare minimum.
The 82C465MV enters Suspend mode when SYSCFG 50h[0]
is set to 1. Software must control this event, even though a
timer time-out may have initiated the process, because CPU
processing must be completed in an orderly fashion.
Upon resuming from Suspend mode, the controlling code
must clear the Suspend PMI event, PMI#7, by writing
SYSCFG 5Ch[7] = 1. Otherwise, the chip will never leave
Suspend mode the next time SYSCFG 50h[0] is set to 1.
The registers shown in Table 4-131 select the state of various
signals during Suspend mode. Refer to the “Resume Event”
section that follows to determine how to select the events that
will cause the chip to resume operation after Suspend.
Reload timers on Resume (SYSCFG 59h[6]) - The system
timers can be restarted to prevent false time-outs upon
resuming from Suspend mode.
Table 4-131 Suspend Control Register Bits
7
6
5
SYSCFG ADh
4
3
2
1
0
Feature Control Register 3
Default = 00h
PMU Control Register 5
Default = 00h
CPU power
state in
Suspend:
0 = Powered
1 = 0 volt
SYSCFG 50h
Start Suspend
(WO):
1 = Enter
Suspend
mode
SYSCFG 59h
PMU Event Register 2
Default = 00h
Reload timers
on Resume?
0 = No
1 = Yes
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4.10.1.1 Suspend Mode Power Savings
The 82C465MV can be preset in various ways before entering Suspend mode in order to minimize the current consumption while suspended.
Resistor Control Registers
The resistor control registers control and/or disable the automatic internal pull-down resistors on various lines during suspend mode. These registers are described in the “Chip-Level
Power Conservation Features” section of this document.
Short-Pulse Refresh
The short pulse refresh mechanism should be engaged for
lowest DRAM power consumption during Suspend. The Suspend refresh rate is selected through SYSCFG 67h[6:5], the
same bits that select the refresh rate for active operation.
However, there is a major difference between Active mode
refresh and Suspend mode refresh: Active mode refresh
pulse width is controlled by the OSCCLK input clock, while
the Suspend mode refresh pulse width is generated from the
SQWIN clock and therefore has the same pulse width as that
clock. For a 32KHz input, this pulse width is 15µs which will
cause DRAM to consume extra power.
Setting SYSCFG A1h[6] = 1 allows the refresh pulse width to
be narrowed to approximately 100ns and should always be
selected if appropriate for the DRAM in use.
Self-Refresh DRAM
Suspend refresh can be eliminated altogether through
SYSCFG 66h[7] for self-refresh DRAM. If “none” is selected
for Suspend refresh, only a single low pulse sequence is generated to put the DRAM into self-refresh mode.
Interrupt Scan Rate
The logic can scan for interrupts at a slower rate, at 122µs
intervals instead of 280ns intervals. This feature uses the
SQWIN clock instead of the 14.318MHz clock to generate
KBCLK and KBCLK2, so any keyboard controller in use must
be able to tolerate this slower clocking speed. SYSCFG
66h[6] controls the KBCLK rate to be applied during Suspend
mode.
Note that a major reduction of power consumption can come
from switching off the 14.318MHz clock generator circuit of
the clock generator chip in use when KBCLK runs from
SQWIN.
Suspend Mode HOLD Control
Asserting HOLD to the CPU before stopping the clock is used
to tristate the CPU signals during Suspend. This feature may
or may not be useful, as determined by the system design.
• Setting Suspend mode HOLD control bit, SYSCFG 66h[4],
= 0 drives HOLD high during Suspend. This setting is useful if some devices on the VL bus are powered off during
suspend. Many CPUs drive output signals to their last
state while in stop grant state, which could power up
unpowered devices on the bus. These CPUs tristate the
outputs if in stop grant state and give the system HLDA.
• Setting Suspend mode HOLD control bit, SYSCFG 66h[4],
= 1 does not drive HOLD during Suspend. This setting is
useful in conjunction with the zero-volt CPU Suspend
option described in the “Special CPU Interface Support”
section, because it allows all CPU interface signals to go
low at Suspend time.
The correct setting of the bit depends on the VL-bus powerdown scheme used in the design.
Table 4-132 Suspend Mode Power Saving Feature Bits
7
6
SYSCFG 66h
Suspend
refresh:
0 = Slow
1 = None (for
self-refresh
DRAM)
5
4
3
PMU Control Register 8
Suspend
KBCLK source:
0 = 14MHz/2
1 = 32KHz/2
SYSCFG A1h
2
1
0
Default = 00h
Assert HOLD
during
Suspend?
0 = Yes
1 = No
Feature Control Register 2
Default = 00h
Suspend
refresh pulse
generation:
0 = Wide
1 = ~100ns
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Table 4-132 Suspend Mode Power Saving Feature Bits (cont.)
7
6
5
SYSCFG 67h
4
3
2
1
PMU Control Register 9
0
Default = 00h
Refresh rate
Active or Suspend mode:
00 = 15µs (30µs in Suspend if
SYSCFG A1h[6] = 0)
01 = 30µs
10 = 61µs
11 = 122µs
Suspend Refresh Pulse Width Control
The Suspend mode refresh pulse on the 82C465 series part
is generated by gate delays. These gate delays vary significantly according to the voltage at which the part operates. At
5.0V core operation, the pulse width might be 150-250ns. If
the core operates at 3.3V, the pulse width might be 400-
500ns. Therefore, the 82C465MVB part provides SYSCFG
3Fh[6] to select fewer gates in the delay path. At its default
setting of 0, the pulse width is comparable with that of the
82C465MVA part. When set to 1, the pulse width is approximately one half of the normal value. The setting of 1 is probably the best setting for 3.3V core operation.
Table 4-133 Suspend Refresh Pulse Width Control
7
6
SYSCFG 3Fh
5
4
3
Misc. Control Register
2
1
0
Default = 00h
Suspend
refresh pulse
width:
0 = Normal
1 = Reduced
(MVB)
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4.10.2 Resume Event
A certain set of interrupt events can be enabled to Resume
the system from Suspend mode. The desired interrupts are
grouped into a single event, called RSMGRP. RSMGRP can
be enabled to generate an SMI if desired. The RI input and
the SUSP/RSM input can also trigger a resume, and can also
be enabled to generate an SMI if desired. Any one or more of
the RSMGRP, RI, and SUSP/RSM events are called a
Resume event.
4.10.2.1 EPMI/IRQ Events
The registers at SYSCFG 6Ah and B1h select the EPMI and
IRQ source(s) that will be allowed to trigger the system out of
Suspend mode. Once selected, setting SYSCFG 5Fh[5] = 1
enables the RSMGRP globally. On Resume, an SMI can be
generated either from the EPMI events (through SYSCFG
58h and D9h) or the PMI#6 event (through SYSCFG 59h).
However, since the system usually is still in SMM when the
Resume takes place, SMI generation is not normally necessary.
The IRQ and EPMI resume enabling bits are shown in Table
4-134. Default for all bits is disabled. A rising edge on the
enabled signal causes the Resume event for all selections
except IRQ8; it is a falling edge on IRQ8 that Resumes operation.
4.10.2.2 SUSP/RSM and RI Events
When the RI input pin toggles enough to exceed the count
set in SYSCFG 5Fh[3:0], and SYSCFG 5Fh[4] = 1, PMI#6 is
generated to exit Suspend mode. Signal RI should be high for
a minimum of 240ms and low for a minimum of 60ms when
changing states. The RI input is sampled with a 32KHz clock;
therefore rapid or unstable transitions may lead to unreliable
counting.
The SUSP/RSM input pin is always enabled to resume the
system, and should be pulled high if it will not be used in the
system design. Resuming from SUSP/RSM generates
PMI#6.
Table 4-134 Resume Event Registers
7
6
5
SYSCFG 6Ah
4
3
2
1
RSMGRP IRQ Register 1
0
Default = 00h
EPMI2
Resume:
EPMI1
Resume:
IRQ8
Resume:
IRQ7
Resume:
IRQ5
Resume:
IRQ4
Resume:
IRQ3
Resume:
IRQ1
Resume:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
EPMI4
Resume:
EPMI3
Resume:
IRQ15
Resume:
IRQ14
Resume:
IRQ12
Resume:
IRQ11
Resume:
IRQ10
Resume:
IRQ9
Resume:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG B1h
RSMGRP IRQ Register 2
SYSCFG 5Fh
PMU Control Register 7
RSMGRP IRQs
can resume
system?
0 = No
1 = Yes
Transitions on
RI can resume
system?
Default = 00h
Default = 00h
Number of RI transitions to cause resume
0 = No
1 = Yes
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Once a resume event has occurred, SYSCFG 6Bh[2:0]
should be read to determine the source(s). If 6Bh[1] = 1, a
read of SYSCFG 6Ah and B1h will return the latched state of
the any of the EPMI or IRQ lines that were originally enabled
for resume triggering. The latched resume IRQ and EPMI
source information in 6Ah and B1h is available until the
PMI#6 bit (SYSCFG 5Ch[6]) is eventually written to 1 to clear
the PMI generated. SYSCFG 50h[1] = 1 as long as the
resume PMI#6 remains active.
Table 4-135 Resume Sources (Read-Only)
7
6
SYSCFG 50h
5
4
3
2
1
PMU Control Register 5
Default = 00h
Ready to
Resume (RO):
SYSCFG 6Bh
PMU mode
(RO):
0 = Not in
resume
0 = Nothing
pending
1 = Ready to
Resume
1 = Suspend
active
(clear
PMI#6)
Resume Source Register
CISA SEL#/
ATB# low
caused
Resume (RO)?
0 = No
1 = Yes
(MVB)
0
Default = 00h
SUSP/RSM
caused
Resume
(RO)?
0 = No
1 = Yes
RSMGRP
caused
Resume
(RO)?
RI caused
Resume (RO)?
0 = No
1 = Yes
0 = No
1 = Yes
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4.10.3 Chip-Level Power Conservation Features
A central design goal of the 82C465MV was to incorporate
power-reducing features wherever possible. To this end, several innovative methods of power conservation are implemented.
4.10.3.1 Automatic Keeper Resistors
Since there are times during normal operation in which the
CPU tristates many of its output signals and no other source
is driving these signals, the lines tend to float between logic
transition levels. When this results in an oscillation, a substantial amount of current is consumed. For this reason,
external pull-up or pull-down resistors are typically connected
on these lines. Even if resistors are integrated into the chipset
itself, considerable current would be consumed during normal operation when the logic is active and is driving against
these resistors.
The 82C465MV circuitry provides the option of internal 50KΩ
pull-down resistors on certain lines. The resistors are automatically engaged only during bus hold and Suspend mode.
Also, the chip provides an option to enable the resistors all
the time. It is theoretically possible that during long periods
with IOCHRDY low, the temporary tristate condition of the
CPU and 82C465MV interfaces could consume more power
than would be needed on average to leave the pull-down
resistors engaged constantly. The system designer must
determine the setting that is appropriate.
The resistors are on CA31, CA[25:2], CD[31:0], BE3:0#,
W/R#, D/C#, and M/IO#. The resistors serve to prevent the
buses from floating and consuming power during Suspend
mode, as well as to hold the upper address lines low and the
CPU control lines inactive during bus hold cycles to prevent
the logic from misinterpreting cycle types and destinations
during DMA operations. This feature can be used safely with
the zero-volt CPU Suspend option, since the resistors always
pull down when engaged. Setting SYSCFG A0h[6] = 1
enables this feature.
The 82C465MV additionally manages the FERR# pin when
this feature is enabled, providing a pull-up resistor that is
engaged while the chip is active and a pull-down resistor
when the chip is in Suspend mode. This feature eliminates
the need for external control of FERR# depending on the type
of CPU installed. The registers also control the DACKMUX02 signal states during Suspend, regardless of where these
signals have been relocated on the chip.
Table 4-136 Resistor Control Registers
7
6
5
SYSCFG A0h
4
3
2
1
0
Feature Control Register 1
Default = 00h
Resistor Control Register 1
Default = 00h
Automatic
internal
resistors:
0 = Disable
1 = Enable
SYSCFG D4h
CA31, CA[25:2], BE[3:0]#
pull-down resistor control:
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
CD[31:0]
pull-down resistor control:
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
SYSCFG D5h
DACKMUX control
during Suspend:
M/IO#, D/C#, W/R#
pull-down resistor control:
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
Resistor Control Register 2
Default = 00h
FERR# pull-up
resistor control:
00 = Pull resistor-equipped lines
low, drive others low
0 = Always
enabled
01 = Tristate all lines (463MV
mode)
1 = Always
disabled
10 = Drive 100b on DACKMUX2-0
11 = Reserved
Note:
Notice that FERR# has an internal pull-up resistor.
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4.10.3.2 Zero-Volt CPU Suspend
Most CPUs designed for portable applications consume negligible power when their input clock is stopped. Some CPUs
draw too much power to be left powered when the system is
in suspend mode, yet it is still desirable to obtain the rapid
start-up available only through copying CPU context into
DRAM and keeping DRAM alive. Therefore, the 82C465MV
CPU interface provides a zero-volt Suspend option.
Setting SYSCFG ADh[5] = 1 enables zero-volt CPU Suspend. When set, the 82C465MV will condition its outputs during suspend assuming that the CPU has been powered down
completely. The affected 82C465MV output signals are listed
in Section 3.6, "Pin Signal Characteristics" on page 16. Sig-
nals that would normally be maintained high to the CPU while
in Suspend mode are instead tristated.
This feature is generally used in conjunction with a feature on
the SRESET pin which, in this case, is used as the generalpurpose CPU reset (not as a software reset). By setting
SYSCFG ADh[3] = 1, the SRESET signal will toggle on
resume from Suspend to reset a CPU that has been powered-down. Refer to the “Special CPU Interface Support” section of this document for more information.
Note also that when SYSCFG ADh[5] = 1, CPURST will
always be generated upon resuming.
Table 4-137 Zero-Volt CPU Suspend Register Bits
7
6
5
SYSCFG ADh
4
3
Feature Control Register 3
CPU power
state in
Suspend:
0 = Powered
1 = 0 volt
2
1
0
Default = 00h
SRESET
operation:
0 = Normal
1 = Toggle on
Resume
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4.10.3.3 Clock Stretching
The register bits in Table 4-138 are used to enable powersaving features for various system clocks. The CPU clock
stretch functions should be enabled only for a totally static
CPU, and then only when the CPU clock is set to /1 or /4. The
ATCLK stretch function can be enabled for both 1X and 2X
CPUs.
4.10.3.4 Stopping IPC Clock When Not In Use
Setting SYSCFG 50h[4] = 0 stops the clock going to the internal 82C206 IPC module. Primarily this setting affects the
8254-type Clock/Timer/Counter circuit. If the timer will not be
used to maintain the DOS system clock, substantial power
savings can be achieved by disabling this clock, and turning
off the OSC14 clock generator if possible. Although KBCLK
and KBCLK2 are derived from the 14MHz clock directly, they
are not affected by this bit setting. Table 4-139 highlights this
register bit.
4.10.3.5 Stopping KBCLK and KBCLK2
The 82C465MVA part allows the KBCLK and KBCLK2 outputs to be driven low. This feature is useful during Suspend
mode to stop the keyboard and IRQ/DRQ scanning clocks
when those devices are powered down. Table 4-140 shows
the register bit used for programming this feature.
Table 4-138 Clock Stretch Register
7
6
5
4
Stretch memory code cycle:
Stretch write
cycle:
Stretch read
cycle:
Stretch I/O
cycle:
Stretch memory data cycle:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 5Eh
3
2
1
ATCLK when
not in cycle:
AT clock
stretch:
0 = Runs
1 = Stopped
0 = Async
1 = Sync
Clock Stretch Register
0
Default = 00h
Table 4-139 PMU Control Register - SYSCFG 50h
7
6
5
4
SYSCFG 50h
3
2
1
PMU Control Register 5
0
Default = 00h
14.3MHz to
IPC:
0 = Enable
1 = Disable
Table 4-140 KBCLK/KBCLK2 Stop Control
7
SYSCFG 79h
6
5
4
3
PMU Control Register 11
2
1
0
Default = 00h
KBCLK/
KBCLK2
control:
0 = Normal
operation
1 = Stopped in
low state
(MVA)
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4.11
Power Control Latch and PIO Pins
There are 12 peripheral power pins (PPWR0-11) that are
used to control power to individual peripherals through external 74373 latches. Each latch pin is controlled with its individual control bits in the configuration registers at SYSCFG 54h,
55h, and ABh.
During reset, the PPWRx latch signal (PPWRL) is pulsed to
set the PPWRx signals to a known state. After reset PPWR03 and PPWR8-11 are set to '0'; PPWR4-7 are set to '1'. The
PPWRx signals will remain in this state until they are updated
by writing to SYSCFG 54h, 55h, and ABh.
Four general purpose I/O pins are also provided for controlling or monitoring external devices without the need for additional TTL. These pins also offer certain preprogrammed
functions that are commonly useful in system designs.
Note:
4.11.1 Power Control Latch
The value latched by PPWRL from the MA bus extends from
PPWR0 through PPWR11, providing four useful power control signals for up to a dozen devices if all 12 bits are latched.
MA11 is an optional signal, so PPWR11 is available only if
MA11 is enabled as explained in Section 4.4.1, "DRAM Controller Hardware Options" on page 48.
4.11.1.1 Hardware Considerations
The power control scheme uses the MA[11:0] signals that
normally address DRAM to additionally provide the inputs to
a 74373-type latch. If all 12 signals will be used, two '373
devices (or a different combination, such as one '373 and one
half of an '11873) are needed. The PPWRL signal from the
82C465MV is an active high signal and latches the MA[11:0]
signals on the latch output on its falling edge.
The pins PPWR0 and PPWR1 have a recovery delay time
associated with them when doing the Suspend/Resume function. These two pins can be used as a delay control for some
component that needs some time to become stable once
power is restored. For example, after turning off the power to
the clock oscillator during Suspend mode, the Resume function will restore power to the clock oscillator and wait until the
clock has had time to stabilize before continuing the resume
process.
PPWR10 provides the RSMRST# function. On hardware
reset and on resuming from Suspend mode, PPWR10 simply
pulses low to generate a reset for any peripherals that were
powered down during Suspend. While also available directly
from pin 185 as a strap-selected option, RSMRST# is always
provided on PPWR10 regardless of the strapping option so
that when pin 185 is reassigned from EPMI2 to DACKMUX1
(the Alternative DACKMUX Interface option), RSMRST# will
still be available. Refer to the “Reset Logic” section for
RSMRST# timing information.
The MA[11:0] pins and PPWRL are on the CPU
power plane. In a mixed-voltage system, 3.3V-inputs
to a 5.0V-powered latch will result in excessive current drain for any input that remains high during idle
periods (around 1mA per input in Suspend mode).
The designer should make provisions to minimize the
effect of this condition.
4.11.1.2 Signal Considerations
There is the possibility of a spike on the 82C465MVA or MVB
PPWRL signal. The amplitude is great enough to latch an
incorrect value on the PPWR latch. The spike is noticeable
when doing floppy or IDE accesses. It is up to 4ns wide and
can reach 1V in amplitude.
Ground bounce internal to the chip on the other nearby signals is causing the spike, a result of PPWRL being the last
signal in the 3.3V CPU power plane. Adjacent signals are in
the ISA power plane, and the nearest ground pin to PPWRL
is 12 pins away.
The workaround is to dampen the spike by using series termination on the PPWRL line as shown in the figure below. The
R-C values depend on the board layout; a good starting point
is R=~75ohm and C=~1000pF. PPWRL is not a time-critical
signal.
Figure 4-9
Damping R-C for PPWRL Spike
373
82C465
PPWRL
EN
4.11.1.3 Programming
SYSCFG 54h, 55h, and ABh set the power control latch outputs. The upper bits [7:4] of each register select whether the
corresponding bits [3:0] should be used to change the latch; if
the enable bit is 0, the current latch setting will not be
changed when the register is written.
Resume Recovery Time
SYSCFG 68h[3:2] determine the recovery time from PPWR10 active after a resume until the end of reset. The RSMRST#
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signal and/or RST4# is active during this recovery time. The
clock is guaranteed to be active for at least the last 1/8 of the
recovery time. These bits are not affected by SYSCFG
68h[1:0].
These bits can be overridden by setting SYSCFG BEh[0] = 1,
in which case the resume recovery time will always be 1 second.
PPWR1-0 Suspend Auto Toggle Feature
S7SCFG 68h[0] and 68h[1] enable PPWR0 and 1, respectively, to automatically toggle when entering and exiting Sus-
pend mode. Using PPWR0 as an example: When bit 0 = '1'
and the chipset has gone into Suspend mode, PPWR0 gets
set to the inverse of SYSCFG 54h[0]; mask bit SYSCFG
54h[4] is ignored. When exiting Suspend mode, PPWR0 is
set to the bit 54h[0] setting, followed by the recovery time
delay set in SYSCFG 68h[3:2] before continuing the resume
operation.
Table 4-130 shows the above discussed registers.
Table 4-141 PPWRL Programming Registers
7
6
5
SYSCFG 54h
4
3
2
1
0
Power Control Latch Register 1
Enable [3:0] to write latch lines PPWR3-0:
Read/write data bits for PPWR3-0 - default 0000:
0 = Disable
1 = Enable
SYSCFG 55h
Default = X0h
0 = Latch output low
1 = Latch output high
Power Control Latch Register 2
Enable [3:0] to write latch lines PPWR7-4:
Read/write data bits for PPWR7-4 - default 1111:
0 = Disable
1 = Enable
0 = Latch output low
1 = Latch output high
SYSCFG ABh
PMU Control Register 3
Enable [3:0] to write latch lines PPWR11-8:
Default = X0h
Read/write data bits for PPWR11-8 - default 0000:
0 = Disable
1 = Enable
SYSCFG 68h
Default = XFh
0 = Latch output low
1 = Latch output high
Clock Source Register 3
Default = 00h
Resume recovery time:
00 = 8ms
01 = 32ms
10 = 128ms
11 = 30µs
PPWR1-0 auto toggle:
0 = Disable
1 = Enable
Ignored if SYSCFG BEh[0] = 1
SYSCFG BEh
Idle Reload Event Enable Register 2
Default = 00h
Override
SYSCFG
68h[3:2]:
0 = No
1 = Recover
time 1s
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4.11.2 Programmable I/O Pins
The programmable I/O (PIO) pins provide general purpose
I/O pins for controlling and/or monitoring system operations.
Several of these pins have specialized options that are linked
into the 82C465MV logic.
• PIO3 can be redefined as the STPGNT# output for those
CPUs that provide a specific acknowledge signal, not just
a special stop grant cycle, to the chipset. Certain Cyrix and
TI CPUs, and the IBM “Blue Lightning” CPU, provide this
signal.
• PIO2 can be defined as an output to indicate when the
CPU is in its full-speed mode, or as an input for an external
ISA bus clocking source (ATCLKIN).
• PIO1 can be redefined as the Zero Wait State input
NOWS# from the ISA bus. When enabled and active, this
signal can reduce the time required to complete an ISA
bus cycle to improve system speed.
• PIO0 can be redefined as the LREQ# input from the VL
bus so that VL bus masters can request ownership of the
bus. When PIO0 is redefined in this way, the DACK2# pin
also gets redefined as the LGNT# output to the VL bus.
When they are not assigned special functions, the PIO pins
are set for input or output and their data read or written
through the registers at SYSCFG 56h and 57h.
Note:
If a PIO pin will not be used, it should either be programmed as an output pin or should be pulled up
externally if left as an input. Otherwise, during suspend mode the pin will float and cause high power
consumption.
4.11.2.1 PIO3/STPGNT# Pin Select
When pin 171 is STPGNT#, also set SYSCFG 57h[3] to input
mode. STPGNT# is for CPUs that use a dedicated stop grant
signal pin to acknowledge a stop request.
4.11.2.2 PIO2/CPUSPD Pin Select
When pin 172 is CPUSPD, also set SYSCFG 57h[2] to output
mode. CPUSPD indicates whether the CPU is at full speed or
is slowed down. Note that output settings on PIO2 may conflict with ATCLKIN feature set by SYSCFG A0h[4].
4.11.2.3 PIO1/NOWS# Pin Select
When pin 173 is NOWS#, also set SYSCFG 57h[1] to input
mode. NOWS# is the ISA bus signal that requests a shorter
cycle if possible.
Table 4-142 PIO Pin Registers
7
6
5
SYSCFG 56h
4
3
2
1
PIO Pin Control Register
Default = X0h
Read/write data for PIO3-0:
Write mask of SYSCFG 56h[3:0]:
Read: Returns value present at pin.
Write: Sets pin value if direction bit is set to 1.
0 = Disable writes on corresponding bit [3:0]
1 = Enable bit [3:0] writes to PIO pins
SYSCFG 57h
PMU Control Register 6
SYSCFG 66h
Default = 00h
PIO3
direction:
PIO2
direction:
PIO1
direction:
PIO0
direction:
0 = Input
1 = Output
0 = Input
1 = Output
0 = Input
1 = Output
0 = Input
1 = Output
PMU Control Register 8
Pin 171
function:
0 = PIO3
1 = STPGNT#
SYSCFG A0h
Feature Control Register 1
Enable local
bus master
support:
0 = PIO0 and
DACK2#
0
Default = 00h
Pin 172
function:
0 = PIO2
1 = CPUSPD
Pin 173
function:
0 = PIO1
1 = NOWS#
Default = 00h
Pin 172
function:
0 = PIO2 (or
CPUSPD)
1 = ATCLKIN
1 = LREQ# and
LGNT#
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82C465MV/MVA/MVB
4.11.3 Programmable Chip Select Feature
The 82C465MV provides programmable chip select features
that require no chip signals to be sacrificed. A total of four
programmable chip selects are available, and can decode
either memory cycles or I/O cycles. For I/O chip select decoding, granularity can be specified to-the-byte, decoding a total
of 10 bits. SYSCFG A7h[7] determines whether the A[15:10]
bits must be 0 or will be ignored. For ROM chip select decoding, granularity is to 16KB blocks anywhere in the ISA
address space (16MB).
Note that the memory chip select feature should be used cautiously for ROMs residing below 1MB. Since the ROM to be
selected is on the SD bus, the XD bus buffer (if used) may be
directed toward the 82C465MV chip for memory reads and
could conflict with SD bus ROMs. Therefore, always set the
ROMCS# generation registers (described in Section 4.4.6,
"System ROM and Shadow RAM" on page 54) to prevent XD
bus ROMCS# conflicts with SD bus ROMs.
In hardware design, the chip select signals are decoded as
follows. Using 7432 gates, first qualify ATCYC# with AEN to
obtain a signal called CSG# here. Then:
•
•
•
•
CSG0# =
CSG1# =
CSG2# =
CSG3# =
CSG# ORed with MA8
CSG# ORed with MA9
CSG# ORed with MA6
CSG# ORed with MA7.
The required registers are shown in Table 4-143 through
Table 4-146.
Table 4-143 Programmable Chip Select 0 Registers
7
6
5
SYSCFG 4Ah
4
3
2
1
0
Chip Select 0 Base Address Register
Default = 00h
Chip Select 0 Control Register
Default = 00h
CSG0# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 4Bh
CSG0#
base address:
A9 (I/O)
A23 (Memory)
SYSCFG BFh
SYSCFG B3h
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
CSG0# mask bits for address A[4:1] (I/O) or A[18:15] memory:
A '1' in a particular bit means that the corresponding SYSCFG
4Ah[3:0] is not compared. This is used to determine address block
size.
Chip Select Granularity Register
Default = 0Fh
CSG0# base
address:
CSG0# mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
Chip Select Cycle Type Register
CSG0#
ROM width:
0 = 8-bit
1 = 16-bit
Default = 00h
CSG0#
cycle type:
0 = I/O
1 = ROMCS
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Table 4-144 Programmable Chip Select 1 Registers
7
6
5
SYSCFG 4Ch
4
3
2
1
0
Chip Select 1 Base Address Register
Default = 00h
Chip Select 1 Control Register
Default = 00h
CSG1# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 4Dh
CSG1#
base address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG BFh
CSG1# mask bits for address A[4:1] (I/O) or A[18:15] memory:
A '1' in a particular bit means that the corresponding bit 4Ch[3:0] is not
compared. This is used to determine address block size.
Chip Select Granularity Register
Default = 0Fh
CSG1# base
address:
CSG1# mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
SYSCFG B3h
Chip Select Cycle Type Register
Default = 00h
CSG1#
ROM width:
CSG1#
cycle type:
0 = 8-bit
1 = 16-bit
0 = I/O
1 = ROMCS
Table 4-145 Programmable Chip Select 2 Registers
7
6
5
SYSCFG BAh
4
3
2
1
0
Chip Select 2 Base Address Register
Default = 00h
Chip Select 2 Control Register
Default = 00h
CSG2# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG BBh
CSG2# base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG BFh
CSG2# mask bits for address A[4:1] (I/O) or A[18:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG
BAh[3:0] is not compared. This is used to determine address
block size.
Chip Select Granularity Register
Default = 0Fh
CSG2# base
address:
CSG2# mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
SYSCFG B3h
Chip Select Cycle Type Register
CSG2#
ROM width:
0 = 8-bit
1 = 16-bit
Default = 00h
CSG2#
cycle type:
0 = I/O
1 = ROMCS
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82C465MV/MVA/MVB
Table 4-146 Programmable Chip Select 3 Registers
7
6
5
SYSCFG BCh
4
3
2
1
0
Chip Select 3 Base Address Register
Default = 00h
Chip Select 3 Control Register
Default = 00h
CSG3# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG BDh
CSG3# base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG BFh
CSG3# mask bits for address A[4:1] (I/O) or A[18:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG
BCh[3:0] is not compared. This is used to determine address
block size.
Chip Select Granularity Register
CSG3# base
address:
CSG3# mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
SYSCFG B3h
Chip Select Cycle Type Register
CSG3#
ROM width:
0 = 8-bit
1 = 16-bit
4.11.3.1 Programmable Chip Select Limitations
The programmable chip select feature uses the MA6-MA9
signals and the ATCYC# pin to generate a chip select signal.
This signal can be further qualified as I/O read, I/O write,
memory read, or memory write only. However, there are several design issues surrounding this feature.
Qualification with AEN
The shared nature of the signals involved dictates that chip
selects cannot go active during any cycle where the MA lines
are used otherwise (i.e. for DRAM accesses). Therefore, the
chip-selected device cannot be accessed during a DMA
cycle.
The data book and reference schematics specify that AEN be
used to block the chip select during DMA and refresh. But
when the ATCLK used is not synchronous to the CPU clock,
ATCYC# will go active when a DMA cycle takes place before
resynchronization allows the AEN line to go active. Therefore, OPTi now recommends using the HLDA signal from the
CPU instead of using AEN to block chip selects during DMA
and refresh. System designers using this approach must be
aware that HLDA is usually a 3.3V signal, while AEN is a 5V
signal.
Default = 0Fh
Default = 00h
CSG3#
cycle type:
0 = I/O
1 = ROMCS
Glitch Caused by Gate Delays
Whenever ATCYC# is generated for use as a programmable
chip select, the MA6-9 pins must be internally switched from
their memory controller function to their chip select function.
The multiplexer logic used internal to the chip bases its
switching on the same ATCYC# signal as is driven externally.
Therefore, ATCYC# arrives external to the chip several nanoseconds before the new MA6-9 values take effect. A glitch
can occur during this time.
If this situation is unacceptable, an extra delay can be introduced externally in ATCYC#. One way to do this would be to
insert an extra gate in the path for ATCYC#. Another way
would be to use a slower logic family for the 7432 that qualifies ATCYC# with AEN, and use faster logic for the 7432
gates that gate the qualified ATCYC# signal with the MA
lines.
In designs where the programmable chip select line is used
solely as a raw decode, and the connected device also uses
ISA command lines to qualify the operation, AEN is still an
acceptable solution.
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82C465MV/MVA/MVB
5.0
Register Summary
An indexing scheme is used to access the System Control
Register Space (SYSCFG). Port 022h is used as the Index
Register and Port 024h as the Data Register. Each access to
a register within this space consists of:
1)
a write to Port 022h, specifying the desired register in the
data byte,
2.
followed by a read or write to Port 024h with the actual
register data.
The index resets after every access; so every data access
(via Port 024h) must be preceded by a write to Port 022h
even if the same register is being accessed consecutively.
practice to maintain an up-to-date copy of all register settings
in system RAM.
Register definitions that are specific to the 82C465MVA or
82C465MVB versions of the product are indicated for each
bit with an MVA or and MVB, respectively, in parentheses. If
a bit is designated as such, it is reserved for previous versions of the product. Definitions marked as MVA are also
available in the MVB version. Registers without the MVA or
MVB marking apply to all three versions.
Note:
All registers are read/write unless otherwise specified.
Note that not all register bits are both readable and writable.
Moreover, some register bits that can be written return different information when read. Therefore, it is good programming
Table 5-1
7
SYSCFG Register Space
6
5
4
Pin 186
function:
Turbo VGA
(NOWS#):
SYSCFG 30h
00 = 82C463/463MV
01 = 82C465MV
10 = 82C465MVA
11 = 82C465MVB
0 = MASTER#
1 = RI
SYSCFG 31h
2
1
0 = Disable
1 = Enable
SMI address
relocation:
AT wait states:
Fast Reset:
0 = Disable
1 = Enable
Reserved
(RO):
0 = Disable
1 = Enable
Always reads 1.
Reserved:
Write as 1.
Dynamic SMI
relocation:
0 = Normal
1 = Remap
SYSCFG 32h
0 = None
1 = One
0 = Disable
1 = Enable
Allow E000
writes:
0 = Disable
1 = Enable
Reserved
0 = Wait for
HLT
1 = Immediately
Default = 40h
ROMCS for
EC000:
ROMCS for
E8000:
ROMCS for
E4000:
ROMCS for
E0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
Shadow RAM Control Register 1
Allow D000
writes:
0
Default = 40h
Control Register 2
Master byte
swap:
0 = DRAM
1 = ROM
3
Control Register 1
82C46x product indicator (RO):
F0000
access:
All reserved registers must be written to 0 unless otherwise specified.
Default = E4h
D000 block
E000 block
shadow control: shadow control:
Refresh on ISA
bus*:
0 = Writable
1 = Protected
0 = Enable
1 = Disable
(Hidden
Refresh Mode)
(MVB)
0 = Writable
1 = Protected
Reserved
ALEs in bus
conversion:
0 = Multiple
1 = Single
* Must enable
when using
EDO DRAM.
SYSCFG 33h
EC000
read select
ROM/RAM:
Shadow RAM Control Register 2
E8000
read select
ROM/RAM:
E4000
read select
ROM/RAM:
E0000
read select
ROM/RAM:
DC000
read select
ROM/RAM:
Default = 00h
D8000
read select
ROM/RAM:
D4000
read select
ROM/RAM:
D0000
read select
ROM/RAM:
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
0 = ROM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
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Page 157
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SYSCFG 34h
2
1
0
DRAM Control Register 1
Default = 05h
Reserved
- DRAM Banks 2 & 3 configuration (old scheme)
- DRAM Banks 0 and 1 configuration (old scheme)
Refer to 82C463MV Data Book for information
SYSCFG 35h
3
DRAM Control Register 2
Standard DRAM read wait states:
DRAM write wait states:
00 = 3-2-2-2
00 = No wait states
01 = 4-3-3-3, 1 WS page miss
01 = 1 wait state
10 = 4-3-3-3, 0 WS page miss
10 = 1 wait state
11 = 5-4-4-4
11 = No wait states, RAS# 1/2
clock early (MVB)
SYSCFG 36h
CCS2# (pin 3)
strapping (RO):
0 = 2X CPU
1 = 1X CPU
Default = FFh
F000
64KB block
cacheable?
0 = Yes
1 = No
Global caching
control:
0 = Enable
1 = Disable
Shadow RAM Control Register 3
C-D-E000
select
destination:
F000
write select
destination:
0 = DRAM
0 = AT/ROM
1 = ROM
1 = DRAM
C000
write protect:
0 = Writable
1 = Protected
Allow C000
writes:
0 = Disable
1 = Enable
See Table 4-30
Don't care for
F000 if
SYSCFG
32h[7]=0
SYSCFG 37h
CC000
read select
ROM/RAM:
ROMCS for
D8000:
ROMCS for
D4000:
ROMCS for
D0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
C8000
read select
ROM/RAM:
C4000
read select
ROM/RAM:
0 = ROM
0 = ROM
0 = ROM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
1 = Shadow
RAM
EC00
16KB block
cacheable?
Default = 0Fh
E800
16KB block
cacheable?
0 = Yes
1 = No
E400
16KB block
cacheable?
0 = Yes
1 = No
Block Control Register 1
Non-cacheable block 1 (ncb1) size:
See Table 4-34
SYSCFG 39h
C0000
read select
ROM/RAM:
0 = ROM
0 = Yes
1 = No
SYSCFG 38h
0 = Yes
1 = No
Default = 10h
D/E000 Control Register
ROMCS for
DC000:
C000
32KB block
cacheable?
E000
16KB block
cacheable?
0 = Yes
1 = No
Default = 80h
ROMCS for
CC000:
ROMCS for
C8000:
ROMCS for
C4000:
ROMCS for
C0000:
See Table 4-30
See Table 4-30
See Table 4-30
See Table 4-30
ncb1 A24
Block Control Register 2
Default = 00h
Block Control Register 3
Default = 80h
- Non-cacheable block 1 start address A[23:16]
SYSCFG 3Ah
Non-cacheable block 2 (ncb2) size:
Reserved
ncb2 A24
See Table 4-34
SYSCFG 3Bh
Block Control Register 4
Default = 00h
- Non-cacheable block 2 start address A[23:16]
SYSCFG 3Ch
Timing Control Register
Reserved:
Reserved:
Reserved:
Reserved:
Reserved:
Write as read.
Write as read.
Write as read.
Write as read.
Write as read.
Default = 00h
L2 cache WE# delay (MVB):
000 = No delay
001 = 1 gate delay
...
...
110 = 6 gate delays
111 = 7 gate delays
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Table 5-1
SYSCFG Register Space
7
6
5
4
3
2
1
0
SYSCFG 3Dh
Reserved
Default = 00h
SYSCFG 3Eh
DRAM Type Select Register
Default = 00h
EDO DRAM read wait states:
00 = 3-1-1-1
01 = 3-2-2-2
(MVB)
10 = 4-2-2-2
11 = Reserved
Reserved:
Write as read.
SYSCFG 3Fh
CPU burst
mode:
0 = Intel
1 = Cyrix linear
(MVB)
Bank 4 DRAM:
0 = Standard
1 = EDO
(MVB)
Bank 3 DRAM:
0 = Standard
1 = EDO
(MVB)
Bank 2 DRAM:
0 = Standard
1 = EDO
(MVB)
Bank 1 DRAM:
0 = Standard
1 = EDO
(MVB)
Bank 0 DRAM:
0 = Standard
1 = EDO
(MVB)
Misc. Control Register
Suspend
refresh pulse
width:
0 = Normal
1 = Reduced
(MVB)
Four IDE
drive support:
CPU burst
write support:
0 = Disable
1 = Enable
(MVB)
0 = Disable
1 = Enable
(MVB)
SYSCFG 40h
Default = 00h
Invalidate L1
cache line on
writes to WP
DRAM:
Minimum
wait states for
non-L2 cache
systems:
Reserved:
Reserved:
Write as read.
Write as read.
0 = Disable
1 = Enable
(MVB)
0 = 1 WS
1 = 0 WS
(MVB)
PMU Control Register 1
Last jump to
reset vector:
Global timer
divide:
LLOWBAT
polarity:
0 = ADS#
1 = SMIADS#
0 = divide by 1
1 = divide by 4
0 = Active hi
1 = Active low
LOWBAT
polarity:
0 = Active hi
1 = Active low
Default = 00h
SQWIN
frequency:
0 = 32KHz
1 = 128KHz
EPMI2
polarity:
0 = Active hi
1 = Active low
EPMI1
polarity:
RSMRST#
select:
0 = Active hi
1 = Active low
0 = Disable
1 = Enable
See Figure 4-1
SYSCFG 41h
PMU Control Register 2
000 = 2 ms
001 = 4 ms
010 = 8 ms
011 = 32 ms
Default = 00h
Doze mode system clock speed:
DOZE_0 time-out select:
100 = 128 ms
101 = 512ms
110 = 2s
111 = 8s
000 = OSCCLK/1
001 = OSCCLK/2
010 = OSCCLK/4
011 = OSCCLK/8
100 = OSCCLK/16
101 = OSCCLK/3
110 = Reserved
111 = Reserved
LCD, DSK,
KBD, HDU
_ACCESS
events reset
Doze mode:
Doze control
select:
0 = Hardware
1 = Software
0 = Disable
1 = Enable
SYSCFG 42h
Clock Source Register 1
Clock source for
GNR_TIMER
SYSCFG 43h
LCD_ACCESS
includes I/O
range 3B0h3DFh?
0 = Yes
1 = No
SYSCFG 44h
Clock source for
KBD_TIMER
Default = 00h
Clock source for
DSK_TIMER
Clock source for
LCD_TIMER
PMU Control Register 4
LCD_ACCESS
includes memory A0000BFFFFh?
0 = Yes
1 = No
LOWBAT pin sample rate,
generates PMI each time
sampled active:
00 = 32s
01 = 64s
10 = 128s
11 = Reserved
ATCLK
generator
source:
0 = FBCLKIN
1 = ATCLKIN w/
SYSCFG
A0h[4] = 1
LCD_TIMER Register
Default = 00h
ATCLK rate selections:
000 = /8
001 = /6
010 = /4
011 = /3
100 = 7.2 MHz
101 = /2
110 = /1 (/2 if SYSCFG43h[3] = 0)
111 = Stop
Default = 00h
Time count byte for LCD_TIMER - monitors LCD_ACCESS. Timeout generates PMI#8.
SYSCFG 45h
DSK_TIMER Register
Default = 00h
Time count byte for DSK_TIMER - monitors DSK_ACCESS. Timeout generates PMI#9.
OPTi
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Page 159
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
SYSCFG 46h
4
3
2
1
KBD_TIMER Register
0
Default = 00h
Time count byte for KBD_TIMER - monitors KBD_ACCESS. Timeout generates PMI#10.
SYSCFG 47h
GNR1_TIMER Register
Default = 00h
Time count byte for GNR1_TIMER - monitors GNR1_ACCESS. Timeout generates PMI#11.
SYSCFG 48h
GNR1 Base Address Register
Default = 00h
GNR1 Control Register
Default = 00h
GNR1_ACCESS base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 49h
GNR1
base address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 4Ah
GNR1 mask bits for address A[5:1] (I/O) or A[19:15] memory:
A '1' in a particular bit means that the corresponding SYSCFG 48h[4:0] is not compared.
This is used to determine address block size.
Chip Select 0 Base Address Register
Default = 00h
Chip Select 0 Control Register
Default = 00h
CSG0# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 4Bh
CSG0#
base address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG 4Ch
CSG0# mask bits for address A[4:1] (I/O) or A[18:15] memory:
A '1' in a particular bit means that the corresponding SYSCFG
4Ah[3:0] is not compared. This is used to determine address block
size.
Chip Select 1 Base Address Register
Default = 00h
Chip Select 1 Control Register
Default = 00h
CSG1# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG 4Dh
CSG1#
base address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG 4Eh
CSG1# mask bits for address A[4:1] (I/O) or A[18:15] memory:
A '1' in a particular bit means that the corresponding bit 4Ch[3:0] is not
compared. This is used to determine address block size.
Idle Reload Event Enable Register 1
CSG1_
ACCESS:
CSG0_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 4Fh
LPT_
ACCESS:
0 = Disable
1 = Enable
Reserved
GNR1_
ACCESS:
0 = Disable
1 = Enable
Default = 00h
KBD_
ACCESS:
0 = Disable
1 = Enable
IDLE_TIMER Register
DSK_
ACCESS:
0 = Disable
1 = Enable
LCD_
ACCESS:
0 = Disable
1 = Enable
Default = 00h
Time count byte for IDLE_TIMER - monitors selected IRQs and EPMIs. Time-out generates PMI#4.
OPTi
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82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
Reserved
IRQ8
polarity:
14.3MHz to
IPC:
SYSCFG 50h
3
2
1
0
Ready to
Resume (RO):
PMU mode
(RO):
Start Suspend
(WO):
PMU Control Register 5
Software start
SMI:
0 = Enable
1 = Disable
0 = Active low
1 = Active high
0 = Clear SMI
1 = Start SMI
SYSCFG 51h
Write:
1 to Start Doze
Read:
Doze status
0 = counting
1 = timed out
Default = 00h
0 = Not in
resume
0 = Nothing
pending
1 = Ready to
Resume
1 = Suspend
active
(clear
PMI#6)
1 = Enter
Suspend
mode
Beeper Control Register
Default = 00h
General purpose storage bits
Beeper control:
00 = No action
01 = 1KHz
10 = Off
11 = 2KHz
SYSCFG 52h
Scratchpad Register 1
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Data phase information, low byte (MVB)
SYSCFG 53h
Scratchpad Register 2
Default = 00h
General purpose storage byte
- For CISA Configuration Cycles: Data phase information, high byte (MVB)
SYSCFG 54h
Power Control Latch Register 1
Enable [3:0] to write latch lines PPWR3-0:
Default = X0h
Read/write data bits for PPWR3-0 - default 0000:
0 = Disable
1 = Enable
0 = Latch output low
1 = Latch output high
SYSCFG 55h
Power Control Latch Register 2
Default = XFh
Read/write data bits for PPWR7-4 - default 1111:
Enable [3:0] to write latch lines PPWR7-4:
0 = Latch output low
1 = Latch output high
0 = Disable
1 = Enable
SYSCFG 56h
PIO Pin Control Register
Read/write data for PIO3-0:
Write mask of SYSCFG 56h[3:0]:
Read: Returns value present at pin.
Write: Sets pin value if direction bit is set to 1.
0 = Disable writes on corresponding bit [3:0]
1 = Enable bit [3:0] writes to PIO pins
SYSCFG 57h
Refresh:
0 = Disable
1 = Enable
Default = X0h
PMU Control Register 6
INTRGRP generates PMI#6:
0 = Disable
1 = Enable
DSK_ACCESS
includes FDD?
0 = Yes
1 = No
DSK_ACCESS
includes HDD?
0 = Yes
1 = No
SYSCFG 58h
LOWBAT PMI#3 SMI:
00 = Disable
11 = Enable
Default = 00h
PIO3
direction:
PIO2
direction:
PIO1
direction:
PIO0
direction:
0 = Input
1 = Output
0 = Input
1 = Output
0 = Input
1 = Output
0 = Input
1 = Output
PMU Event Register 1
EPMI2 PMI#2 SMI:
00 = Disable
11 = Enable
EPMI1 PMI#1 SMI:
00 = Disable
11 = Enable
Default = 00h
LLOWBAT PMI#0 SMI:
00 = Disable
11 = Enable
OPTi
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Revision: 3.0
Page 161
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SYSCFG 59h
3
2
1
0
PMU Event Register 2
Allow software
SMI:
Reload timers
on Resume?
0 = Disable
1 = Enable
0 = No
1 = Yes
Resume INTRGRP PMI#6,
Suspend PMI#7 SMI:
00 = Disable
11 = Enable
SYSCFG 5Ah
Default = 00h
R_TIMER PMI#5 SMI:
00 = Disable
11 = Enable
IDLE_TIMER PMI#4 SMI:
00 = Disable
11 = Enable
PMU Event Register 3
GNR1_TIMER PMI#11 SMI:
00 = Disable
11 = Enable
KBD_TIMER PMI#10 SMI:
DSK_TIMER PMI#9 SMI:
LCD_TIMER PMI#8 SMI:
00 = Disable
11 = Enable
00 = Disable
11 = Enable
00 = Disable
11 = Enable
SYSCFG 5Bh
Default = 00h
PMU Event Register 4
SMI to IRQ15:
Global SMI
control:
0 = Disable
1 = Enable
Reserved
SMI type:
0 = Intel
1 = Other
0 = Allow
1 = Mask
SYSCFG 5Ch
Default = 00h
GNR1 Next
Access
PMI#15:
KBD Next
Access
PMI#14:
DSK Next
Access
PMI#13:
LCD Next
Access
PMI#12:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
PMI#2,
EPMI2:
PMI#1,
EPMI1:
PMI Source Register 1 (Write 1 to Clear)
PMI#7,
Suspend:
PMI#6, Resume
or INTRGRP:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#5,
R_TIMER
time-out:
PMI#4,
IDLE_TMR
time-out:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
SYSCFG 5Dh
PMI#3,
LOWBAT:
0 = Inactive
1 = Active
Default = 00h
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI Source Register 2 (Write 1 to Clear)
PMI#15,
GNR1_
ACCESS:
PMI#14,
PMI#13,
PMI#12,
KBD_ACCESS: DSK_ACCESS: LCD_ACCESS:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
0 = Inactive
1 = Active
SYSCFG 5Eh
0 = Inactive
1 = Active
PMI#11,
GNR1_TIMER:
0 = Inactive
1 = Active
PMI#10,
KBD_TIMER:
PMI#9,
DSK_TIMER:
PMI#8,
LCD_TIMER:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
0 = Inactive
1 = Active
Default = 00h
Stretch memory code cycle:
Stretch write
cycle:
Stretch read
cycle:
Stretch I/O
cycle:
Stretch memory data cycle:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
PMU Control Register 7
LCD_ACCESS
includes ISA
bus video
access?
0 = Yes
1 = No
LCD_ACCESS
includes VLbus video
access?
0 = No
1 = Yes
SYSCFG 60h
RSMGRP IRQs
can resume
system?
0 = No
1 = Yes
Transitions on
RI can resume
system?
0 = Inactive
1 = Active
Default = 00h
Clock Stretch Register
SYSCFG 5Fh
PMI#0,
LLOWBAT:
ATCLK when
not in cycle:
AT clock
stretch:
0 = Runs
1 = Stopped
0 = Async
1 = Sync
Reserved
Default = 00h
Number of RI transitions to cause resume
0 = No
1 = Yes
R_TIMER Base Count Register (RO)
Default = 00h
R_TIMER initial count
OPTi
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Page 162
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Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
SYSCFG 61h
4
3
2
1
0
Debounce Register
LOWBAT, LLOWBAT
debounce rate select:
00 = No debounce
01 = 250µs
10 = 8ms
11 = 500ms
SUSP/RSM
debounce rate select:
Reserved
Default = 00h
Reserved
STPCLK#
signal:
0 = Disable
1 = Enable
00 = Active low, edge-triggered
PMI
01 = Active low, level-controlled
PMI
10 = Active high, level-sampled
PMI in 16ms
11 = Active high, level-sampled
PMI in 32ms
For further decode details, refer to
Section 4.7.6.1, "Suspend/
Resume Pin" on page 115
SYSCFG 62h
IRQ Doze Register 1 (WO)
Default = 00h
IRQ13 Doze
reset:
IRQ8 Doze
reset:
IRQ7 Doze
reset:
IRQ12 Doze
reset:
IRQ5 Doze
reset:
IRQ4 Doze
reset:
IRQ3 Doze
reset:
IRQ0 Doze
reset:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
IRQ13:
IRQ8:
IRQ7:
IRQ5:
IRQ4:
IRQ3:
IRQ0:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 63h
EPMI1
Level-triggered:
0 = Disable
1 = Enable
Idle Time-out Select Register 1
SYSCFG 64h
Default = 00h
INTRGRP IRQ Select Register 1
Default = 00h
IRQ14:
IRQ8:
IRQ7:
IRQ6:
IRQ5:
IRQ4:
IRQ3:
IRQ1:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
STPCLK #
control:
EPMI1 Doze
reset:
SMI resets
Doze mode?
0 = Pulse
1 = Latch
0 = Disable
1 = Enable
SYSCFG 65h
All interrupts to
CPU reset Doze
mode:
0 = Disable
1 = Enable
DOZE Register
SYSCFG 66h
Suspend
refresh:
0 = Slow
1 = None (for
self-refresh
DRAM)
0 = No
1 = Yes
Default = 00h
IRQ1 Doze
reset:
Reserved
0 = Disable
1 = Enable
PMU Control Register 8
Suspend
Doze type:
KBCLK source: 0 = Slow CPU
0 = 14MHz/2
clock
1 = 32KHz/2
1 = Stop CPU
clock
Assert HOLD
during
Suspend?
0 = Yes
1 = No
Pin 171
function:
0 = PIO3
1 = STPGNT#
Default = 00h
Pin 172
function:
0 = PIO2
1 = CPUSPD
Pin 173
function:
0 = PIO1
1 = NOWS#
CPU clock
change protocol required?
0 = No
1 = Yes
OPTi
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Revision: 3.0
Page 163
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
SYSCFG 67h
4
3
2
1
0
PMU Control Register 9
Reserved
Refresh rate
Active or Suspend mode:
Reserved:
Reserved
Write as 1.
Default = 00h
Write: Select CPU frequency
Read: Return current operating frequency:
000 = CPUCLK/1
001 = CPUCLK/2
010 = CPUCLK/4
011 = CPUCLK/8
00 = 15µs (30µs in Suspend if
SYSCFG A1h[6] = 0)
01 = 30µs
10 = 61µs
100 = CPUCLK/16
101 = CPUCLK/3
110 = Reserved
111 = Reserved
11 = 122µs
SYSCFG 68h
Clock Source Register 3
R_TIMER clock source
IDLE_TIMER clock source
Default = 00h
PPWR1-0 auto toggle:
Resume recovery time:
00 = 8ms
01 = 32ms
10 = 128ms
11 = 30µs
0 = Disable
1 = Enable
Ignored if SYSCFG BEh[0] = 1
SYSCFG 69h
R_TIMER Register
Default = 00h
Time count byte for R_TIMER - starts to count after a non zero write to this register.
Unlike the other timer registers, a read from this register returns the current count. Timeout generates PMI#5.
SYSCFG 6Ah
RSMGRP IRQ Register 1
Default = 00h
EPMI2
Resume:
EPMI1
Resume:
IRQ8
Resume:
IRQ7
Resume:
IRQ5
Resume:
IRQ4
Resume:
IRQ3
Resume:
IRQ1
Resume:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG 6Bh
Resume Source Register
Reserved:
Pin 135
function:
Write as read.
0 = FLUSH#
1 = SMIRDY#
Reserved:
Reserved:
Write as read.
Write as read.
CISA SEL#/
ATB# low
caused
Resume (RO)?
0 = No
1 = Yes
(MVB)
SYSCFG 6Ch
Scratchpad Register 3
Default = 00h
SUSP/RSM
caused
Resume
(RO)?
0 = No
1 = Yes
RSMGRP
caused
Resume
(RO)?
RI caused
Resume (RO)?
0 = No
1 = Yes
0 = No
1 = Yes
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, low byte (MVB)
SYSCFG 6Dh
Scratchpad Register 4
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 1 information, high byte (MVB)
SYSCFG 6Eh
Scratchpad Register 5
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, low byte (MVB)
OPTi
®
Page 164
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Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
7
SYSCFG Register Space
6
5
SYSCFG 6Fh
4
3
2
1
Scratchpad Register 6
0
Default = 00h
General purpose storage byte:
- For CISA Configuration Cycles: Address phase 2 information, high byte (MVB)
SYSCFG 70h
GNR1 Control Register 2
Default = 00h
GNR1 Control Register 3
Default = 00h
GNR1 Base Address Register 4
Default = 00h
GNR1_ACCESS base address:
- A[13:6] for memory watchdog
- A[15:10] for I/O (right-aligned)
(MVA)
SYSCFG 71h
GNR1_ACCESS mask bits:
- Mask for A[13:6] for memory watchdog
- Mask for A[15:10] for I/O (right-aligned)
(MVA)
SYSCFG 72h
GNR1_ACCESS base address (MVA and MVB):
- A[5:2] for memory watchdog*
- Ignored for I/O
GNR1_ACCESS mask bits (MVA and MVB) :
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
*In MVB, if SYSCFG AEh[6] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[6] = 1.
*In MVB, if SYSCFG AEh[6] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[6] = 1.
SYSCFG 73h
GNR1 Control Register 2
Default = 00h
GNR1 Control Register 3
Default = 00h
GNR1 Base Address Register 4
Default = 00h
GNR2_ACCESS base address:
- A[13:6] for memory watchdog
- A[15:10] for I/O (right-aligned)
(MVA)
SYSCFG 74h
GNR2_ACCESS mask bits:
- Mask for A[13:6] for memory watchdog
- Mask for A[15:10] for I/O (right-aligned)
(MVA)
SYSCFG 75h
GNR2_ACCESS base address (MVA and MVB):
- A[5:2] for memory watchdog*
- Ignored for I/O
GNR2_ACCESS mask bits (MVA and MVB) :
- Mask for A[5:2] for memory watchdog*
- Mask for A[9:6] for I/O
*In MVB, if SYSCFG AEh[7] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[7] = 1.
*In MVB, if SYSCFG AEh[7] = 0.
For A[31]+x+A[25]+[A24] if SYSCFG AEh[7] = 1.
SYSCFG 76h
Doze Reload Select Register 1
LCD_ACCESS: KBD_ACCESS: DSK_ACCESS: HDU_ACCESS:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
COM1&2_
ACCESS:
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
Default = 00h
LPT_ACCESS:
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
GNR1_
ACCESS:
GNR2_
ACCESS:
0 = DOZE_0
1 = DOZE_1
0 = DOZE_0
1 = DOZE_1
Default = 1
(MVA)
Default = 1
(MVA)
OPTi
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912-3000-016
Revision: 3.0
Page 165
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
IRQ7:
IRQ6:
4
SYSCFG 77h
3
2
1
IRQ3:
IRQ1:
Doze Reload Select Register 2
IRQ8:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ5:
0 = DOZE_0
1 = DOZE_1
(MVA)
SYSCFG 78h
IRQ4:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
Default = 00h
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
Doze Reload Select Register 3
LDEV#:
IRQ15:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ14:
IRQ13:
0 = DOZE_0
1 = DOZE_1
(MVA)
SYSCFG 79h
IRQ12:
0 = DOZE_0
1 = DOZE_1
(MVA)
0 = DOZE_0
1 = DOZE_1
(MVA)
DOZE_1 time-out select (MVA):
SMI resets
Doze mode if
clock is
stopped inside
SMM?
100 = 64ms
101 = 256 ms
110 = 1s
111 = 4s
0 = No
1 = Yes
(MVA)
SYSCFG 7Ah-7Fh
Pin 172
function:
0 = PIO2 or
CPUSPD
IRQ0:
0 = DOZE_0
1 = DOZE_1
(MVA)
Default = 00h
IRQ11:
0 = DOZE_0
1 = DOZE_1
(MVA)
IRQ10:
0 = DOZE_0
1 = DOZE_1
(MVA)
PMU Control Register 11
000 = No delay (Default)
001 = 1ms
010 = 4ms
011 = 16ms
0
IRQ9:
0 = DOZE_0
1 = DOZE_1
(MVA)
Default = 00h
“Fast” logic functionality level:
00 = Fully functional
01 = Do not inhibit KBDCS#
KBCLK/
KBCLK2
control:
10 = Also: Disable reset from 060/ 0 = Normal
operation
1 = Buffer
064h
enable pin
1 = Stopped in
11 = Also: Redefine pin 179 as
SABUFEN#
low state
KBCRSTIN
(MVA)
(MVA)
(MVA)
Reserved
Default = 00h
SYSCFG 80h
Interrupt Controller 1 Shadow Register ICW1
Default = XXh
SYSCFG 81h
Interrupt Controller 1 Shadow Register ICW2
Default = XXh
SYSCFG 82h
Interrupt Controller 1 Shadow Register ICW3
Default = XXh
SYSCFG 83h
Interrupt Controller 1 Shadow Register ICW4
Default = XXh
SYSCFG 84h
DMA In-Progress Register (RO)
Default = XXh
Channel 6
DMA in
progress:
Channel 7
DMA in
progress:
0 = No
1 = Possibly
0 = No
1 = Possibly
Channel 5
DMA in
progress:
0 = No
1 = Possibly
DMAC2 Byte
Pointer FlipFlop (RO).
0 = Cleared
1 = Set
(MVA)
Channel 3
DMA in
progress:
0 = No
1 = Possibly
Channel 2
DMA in
progress:
0 = No
1 = Possibly
Channel 1
DMA in
progress:
0 = No
1 = Possibly
Channel 0
DMA in
progress:
0 = No
1 = Possibly
SYSCFG 85h
Interrupt Controller 1 Shadow Register OCW1
Default = XXh
SYSCFG 86h
Interrupt Controller 1 Shadow Register OCW2
Default = XXh
SYSCFG 87h
Reserved
Default = 00h
SYSCFG 88h
Interrupt Controller 2 Shadow Register ICW1
Default = XXh
SYSCFG 89h
Interrupt Controller 2 Shadow Register ICW2
Default = XXh
SYSCFG 8Ah
Interrupt Controller 2 Shadow Register ICW3
Default = XXh
SYSCFG 8Bh
Interrupt Controller 2 Shadow Register ICW4
Default = XXh
SYSCFG 8Ch
Reserved
Default = 00h
OPTi
®
Page 166
912-3000-016
Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
3
2
1
0
SYSCFG 8Dh
Interrupt Controller 2 Shadow Register OCW1
Default = XXh
SYSCFG 8Eh
Interrupt Controller 2 Shadow Register OCW2
Default = XXh
SYSCFG 8Fh
Reserved
Default = 00h
SYSCFG 90h
Timer Channel 0 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 91h
Timer Channel 0 Count High Byte: A[15:8]
Default = XXh
SYSCFG 92h
Timer Channel 1 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 93h
Timer Channel 1 Count High Byte: A[15:8]
Default = XXh
SYSCFG 94h
Timer Channel 2 Count Low Byte: A[7:0]
Default = XXh
SYSCFG 95h
Timer Channel 2 Count High Byte: A[15:8]
Default = XXh
SYSCFG 96h
Write Counter High/Low Byte Latch
Unused
Unused
Channel 2 read
LSB toggle bit
Channel 1 read
LSB toggle bit
Channel 0 read
LSB toggle bit
Channel 2 write
LSB toggle bit
Default = XXh
Channel 1 write
LSB toggle bit
Channel 0 write
LSB toggle bit
SYSCFG 97h
Reserved
Default = 00h
SYSCFG 98h
RTC Index Shadow Register (RO)
Default = 00h
- CMOS RAM Index Last Written
NMI Enable
Setting
SYSCFG 99h-9Ah
SYSCFG 9Bh
Shadows
3F2h[7] “Mode
Select” bit
(MVA)
3F2h+3F7h Shadow Register
Default = 00h
Shadows
Shadows
Shadows
3F2h[5] “Drive 2 3F2h[4] “Drive 1 3F2h[3] “DMA
Motor” bit
Motor” bit
Enable” bit
(MVA)
(MVA)
(MVA)
Shadows
377h[1] “Disk
Type” bit 1
(MVA)
Shadows
372h[5] “Drive
2 Motor” bit
(MVA)
Shadows
3F2h[2] “Soft
Reset” bit
(MVA)
Shadows
3F7h[0] “Disk
Type” bit 0
(MVA)
Shadows
372h[2] “Soft
Reset” bit
(MVA)
Shadows
377h[0] “Disk
Type” bit 0
(MVA)
372h+377h Shadow Register
SYSCFG 9Dh-9Eh
SYSCFG 9Fh
Default = 00h
Shadows
3F7h[1] “Disk
Type” bit 1
(MVA)
SYSCFG BCh
Shadows
372h[7] “Mode
Select” bit
(MVA)
Reserved
Shadows
372h[4] “Drive
1 Motor” bit
(MVA)
Shadows
372h[3] “DMA
Enable” bit
(MVA)
Shadows
3F2h[0] “Drive
Select” bit
(MVA)
Default = 00h
Shadows
372h[0] “Drive
Select” bit
(MVA)
Reserved
Default = 00h
Port 064h Shadow Register
Default = 00h
- Shadows I/O writes to Port 064h bits [7:0], regardless of whether KBDCS# is inhibited. In this way, when an SMI occurs between a Port
064h write and the subsequent write to Port 060h, SMM code can access the keyboard controller as needed and then simply restore the
Port 064h value just before leaving SMM.
(MVA)
OPTi
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912-3000-016
Revision: 3.0
Page 167
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
Internal I/O
address
decoding:
Automatic
internal
resistors:
Enable local
bus master
support:
0 = 10-bit
1 = 16-bit
0 = Disable
1 = Enable
SYSCFG A0h
4
3
2
1
Allow SRESET
in SMM:
CPU cache
operation
select:
Feature Control Register 1
0 = PIO0 and
DACK2#
Pin 172
function:
0 = PIO2 (or
CPUSPD)
1 = ATCLKIN
1 = LREQ# and
LGNT#
SYSCFG A1h
Enable alternative DACKMUX
Interface:
0 = Disable
1 = Enable
Default = 00h
0 = Enable
1 = Disable
0 = Standard
In MVB, Port
060/4 A20M#
bit
Suspend
refresh pulse
generation:
0 = Wide
1 = ~100ns
Pin 88 - for
EPMI3-4:
0 = DRQ2
1 = EPMMUX
Heavy-duty
memory bus
drive:
0 = Disable
1 = Enable
Heavy-duty ISA
bus drive:
0 = Disable
1 = Enable
DRAM
mapping:
0 = Disable
1 = Enable
1 = L1 writeback
See Table 3-5
Feature Control Register 2
Port 060/4
Gate A20 (RO):
0
Default = 00h
Emergency
overtemp
sense:
0 = Disable
1 = Enable
Read: Return
current value;
F000 shadow
test:
0 = Read or
write
EPMI1-2
status latch:
0 = Dynamic
1 = Latched
1 = Read and
write
Write: Toggle
A20M# setting
SYSCFG A2h
IRQ Doze Register 2 (WO)
Local bus I/O
access Doze
reset:
Local bus memory access
Doze reset:
0 = Disable
1 = Enable
(MVA)
0 = Disable
1 = Enable
(MVA)
Default = 00h
IRQ15 Doze
reset:
IRQ14 Doze
reset:
IRQ11 Doze
reset:
IRQ10 Doze
reset:
IRQ9 Doze
reset:
IRQ6 Doze
reset:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0= Disable
1= Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A3h
Idle Time-out Select Register 2
Default = 00h
IRQ15:
IRQ14:
IRQ12:
IRQ11:
IRQ10:
IRQ9:
IRQ6:
IRQ1:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A4h
INTRGRP IRQ Select Register 2
Default = 00h
Test bit:
IRQ15:
IRQ13:
IRQ12:
IRQ11:
IRQ10:
IRQ9:
IRQ0:
Write as 0.
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG A5h
Thermal Management Register 1
Default = 00h
Equilibrium Level (EQL6:0):
Thermal
management:
- This count corresponds to equilibrium operation. If the CPU Activity Counter exceeds EQL, EQL is simply subtracted
from the upper activity count byte and sampling continues. If the count is below EQL, the count is cleared.
0 = Disable
1 = Enable
SYSCFG A6h
Thermal Management Register 2
Default = 00h
Overtemp Limit (OTL7:0):
- This count corresponds to an over-temperature situation. If the CPU Activity Counter exceeds OTL, the 82C465MV engages cool-down
clocking.
OPTi
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82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SYSCFG A7h
Cool-down Holdoff (CDHO1:0):
00 = Low power
01 = Moderate
10 = High
11 = Very high
Default = 00h
00 = 2x CDHO
01 = 3x
10 = 4x
11 = 5x
DRAM Bank Select Register 1
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
Default = 00h
Bank 0 memory size:
Bank 0 type:
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
SYSCFG A9h
0 = Sym
1 = Asym
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
DRAM Bank Select Register 2
Bank 3 memory size:
Bank 3 type:
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
Default = 00h
Bank 2 memory size:
Bank 2 type:
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
SYSCFG AAh
0 = Sym
1 = Asym
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
DRAM Bank Select Register 3
Reserved
Default = 00h
Bank 4 memory size:
Bank 4 type:
0 = Sym
1 = Asym
SYSCFG ABh
000 = Not installed
001 = 1MB
010 = 2MB
011 = 4MB
PMU Control Register 3
Default = X0h
0 = Latch output low
1 = Latch output high
0 = Disable
1 = Enable
SYSCFG ACh
IDE Interface Configuration Register
Chipset input clock frequency:
00 = 50MHz
01 = 40MHz
10 = 33MHz
11 = 20/25MHz
IDE command pulse duration:
00 = 600ns
01 = 383ns
10 = 240ns
11 = 180ns
SYSCFG ADh
IDE interface:
0 = Disable
1 = Enable
Default = 00h
IDE port
address select:
0 = 1F0-7h,
3F6-7h
3F7h[6:0]
source:
0 = No
1 = Yes
(MVA)
CPU power
state in
Suspend:
0 = Powered
1 = 0 volt
Reserved
0 = Local IDE
1 = ISA bus
1 = 170-7h,
376-7h
Feature Control Register 3
Generate
CPURST
immediately?
100 = 8MB
101 = 16MB
110 = 32MB
111 = 64MB
Read/write data bits for PPWR11-8 - default 0000:
Enable [3:0] to write latch lines PPWR11-8:
0 = Wait
1 = Ignore
0
Cool-down time-out (CDTO1:0):
00 = /2
01 = /3
10 = /4
11 = /8
Bank 1 memory size:
Bank 1 type:
Ignore
unfinished
LDEV# cycles:
1
Cool-down clock rate (CDCR1:0):
00 = 32s
01 = 64s
10 = 128s
11 = 256s
SYSCFG A8h
0 = Sym
1 = Asym
2
Thermal Management Register 3
CPU Efficiency (CPUE1:0):
0 = Sym
1 = Asym
3
Pin 130 in
386 mode:
0 = GA20
1 = A20M#
SRESET
operation:
0 = Normal
1 = Toggle on
Resume
Default = 00h
Pin 80 in
386 mode:
0 = NPINT
1 = DACK2#
Coprocessor
recognition:
0 = Enable
1 = Override
RDYI# input:
0 = Synchronized to
RDY#
1 = Direct
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Revision: 3.0
Page 169
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
GNR2 memory
decoding:
GNR1 memory
decoding:
GNR2 cycle
decode type:
0 = A[5:2]
1 = A[31:24]
(MVB)
0 = A[5:2]
1 = A[31:24]
(MVB)
SYSCFG AEh
4
3
2
1
0
GNR2 base
address:
GNR1 base
address:
GNR2 mask
bit:
GNR1 mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
GNR_ACCESS Feature Register
0 = I/O
1 = Memory
GNR1 cycle
decode type:
0 = I/O
1 = Memory
SYSCFG AFh
Default = 03h
SMBASE Register
SMM segment to be mapped to B000h:
Default = 34h
SMM segment to be mapped to A000h:
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
0 = 0:0
1 = 1000:0h
...
9 = 9000:0h (A-F illegal)
(Defaults to 3h)
(Defaults to 4h)
SYSCFG B0h
Stop Clock Delay Register
Stop clock
delay time
base:
Stop clock
delay:
0 = Disable
1 = Enable
0 = 32KHz/4
(~122 us)
1 = FBCLK/4
Default = 00h
Delay Count:
- This value multiplies the time base period selected in bit [6]. There is an additional 6 FBCLK delay for
all selections, even “no delay.” Sample approximate delays based on 32KHz/25MHz selections:
000000 = No delay
000001 = 122us/160ns
000010 = 244µs/320ns
SYSCFG B1h
000011 = 366µs/480ns
...
001000 = 976µs/1.28µs
001001 = 1.1ms/1.44µs
...
111111 = 7.7ms/10.0µs
RSMGRP IRQ Register 2
Default = 00h
EPMI4
Resume:
EPMI3
Resume:
IRQ15
Resume:
IRQ14
Resume:
IRQ12
Resume:
IRQ11
Resume:
IRQ10
Resume:
IRQ9
Resume:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG B2h
Clock Source Register 2
Clock source
for HDU_TIMER
Clock source
for COM2_TIMER
SYSCFG B3h
Default = 00h
Clock source
for COM1_TIMER
Clock source
for GNR2_TIMER
Chip Select Cycle Type Register
CSG3#
ROM width:
CSG2#
ROM width:
CSG1#
ROM width:
CSG0#
ROM width:
0 = 8-bit
1 = 16-bit
0 = 8-bit
1 = 16-bit
0 = 8-bit
1 = 16-bit
0 = 8-bit
1 = 16-bit
SYSCFG B4h
Default = 00h
CSG3#
cycle type:
CSG2#
cycle type:
CSG1#
cycle type:
CSG0#
cycle type:
0 = I/O
1 = ROMCS
0 = I/O
1 = ROMCS
0 = I/O
1 = ROMCS
0 = I/O
1 = ROMCS
HDU_TIMER Register
Default = 00h
Time count byte for HDU_TIMER - monitors HDU_ACCESS. Timeout generates PMI#19.
SYSCFG B5h
COM1_TIMER Register
Default = 00h
Time count byte for COM1_TIMER - monitors COM1_ACCESS. Timeout generates PMI#17.
SYSCFG B6h
COM2_TIMER Register
Default = 00h
Time count byte for COM2_TIMER - monitors COM2_ACCESS. Timeout generates PMI#18.
SYSCFG B7h
GNR2_TIMER Register
Default = 00h
Time count byte for GNR2_TIMER - monitors GNR2_ACCESS. Timeout generates PMI#16.
OPTi
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Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
SYSCFG B8h
4
3
2
1
0
GNR2 Base Address Register
Default = 00h
GNR2 Control Register
Default = 00h
GNR2_ACCESS base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG B9h
GNR2 base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
SYSCFG BAh
GNR2 mask bits for address A[5:1] (I/O) or A[19:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG B8h[4:0] is not compared. This is used to determine address block size.
Chip Select 2 Base Address Register
Default = 00h
Chip Select 2 Control Register
Default = 00h
CSG2# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG BBh
CSG2# base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG BCh
CSG2# mask bits for address A[4:1] (I/O) or A[18:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG
BAh[3:0] is not compared. This is used to determine address
block size.
Chip Select 3 Base Address Register
Default = 00h
Chip Select 3 Control Register
Default = 00h
CSG3# base address:
- A[8:1] (I/O)
- A[22:15] (Memory)
SYSCFG BDh
CSG3# base
address:
A9 (I/O)
A23 (Memory)
Write
decode:
Read
decode:
Chip select
active:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = w/cmd
1 = before ALE
SYSCFG BEh
CSG3# mask bits for address A[4:1] (I/O) or A[18:15] memory:
- A '1' in a particular bit means that the corresponding SYSCFG
BCh[3:0] is not compared. This is used to determine address
block size.
Idle Reload Event Enable Register 2
Default = 00h
CSG3_
ACCESS:
CSG2_
ACCESS:
COM2_
ACCESS:
COM1_
ACCESS:
GNR2_
ACCESS:
HDU_
ACCESS:
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
0 = Disable
1 = Enable
Reserved
Override
SYSCFG
68h[3:2]:
0 = No
1 = Recover
time 1s
SYSCFG BFh
Chip Select Granularity Register
Default = 0Fh
CSG3# base
address:
CSG2# base
address:
CSG1# base
address:
CSG0# base
address:
CSG3# mask
bit:
CSG2# mask
bit:
CSG1# mask
bit:
CSG0# mask
bit:
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
A0 (I/O)
A14 (Memory)
SYSCFG C0h-CFh
Reserved
Default = 00h
OPTi
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Revision: 3.0
Page 171
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
L2 cache controls Suspend
state:
L2 cache
engage:
SYSCFG D0h
4
3
2
1
0
L2 cache write
wait state:
L2 cache read
burst wait state
control:
L2 cache first
read wait state
control:
L2 Cache Control Register 1
L2 cache
CCS0-3#
deassert:
0 = Stop grant
and Suspend
0 = Tristate
1 = Driven
Cache size:
00 = 64KB
01 = 128KB
10 = 256KB
11 = Reserved
0 = Disable
1 = Enable
Default = C0h
0 = 1 WS
1 = No WS
0 = X-1-1-1
1 = X-2-2-2
0 = 3-X-X-X
1 = 2-X-X-X
1 = Also
between
accesses
SYSCFG D1h
L2 Cache Control Register 2
ADS# sampling: L2 Tag RAM
L1 cache
size:
HITM# sensing 0 = Sample on
after EADS#:
ADS# low
0 = 8-bit
0 = 2nd clock
1 = 7-bit
1 = Latch
1 = 3rd clock
ADS#, sam- (MVA)
ple on next
cycle
SYSCFG D2h
L2 cache
arrangement:
0 = Two banks
1 = One bank
(MVA)
EC000EFFFFh L2
cacheable?
0 = No
1 = Yes
Default = 41h
E8000EBFFFh L2
cacheable?
0 = No
1 = Yes
E4000-E7FFFh
L2 cacheable?
0 = No
1 = Yes
L2 Cache Control Register 3
DC000DFFFFh L2
cacheable?
D8000DBFFFh L2
cacheable?
0 = No
1 = Yes
0 = No
1 = Yes
D4000D7FFFh L2
cacheable?
0 = No
1 = Yes
SYSCFG D3h
D0000D3FFFh L2
cacheable?
0 = No
1 = Yes
CC000CFFFFh L2
cacheable?
0 = No
1 = Yes
Segment for
SMM data
writes:
0 = A000h
1 = SMBASE
(MVA)
0 = A000h
1 = SMBASE
(MVA)
SYSCFG D4h
Cache flush on
SMI entry:
0 = Enable
1 = Disable
(MVA)
Bank 4 asym
type:
0 = 11x9
1 = 12x8
Bank 3 asym
type:
0 = 11x9
1 = 12x8
C8000CBFFFh L2
cacheable?
0 = No
1 = Yes
C4000C7FFFh L2
cacheable?
0 = No
1 = Yes
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
CD[31:0]
pull-down resistor control:
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
C0000C3FFFh L2
cacheable?
0 = No
1 = Yes
Default = 00h
Bank 2 asym
type:
0 = 11x9
1 = 12x8
Bank 1 asym
type:
0 = 11x9
1 = 12x8
Resistor Control Register 1
CA31, CA[25:2], BE[3:0]#
pull-down resistor control:
0 = No
1 = Yes
Default = 00h
Asym. DRAM Select Register
Segment for
SMM data
reads:
E0000-E3FFFh
L2 cacheable?
M/IO#, D/C#, W/R#
pull-down resistor control:
00 = Automatic
01 = Always enabled
10 = Always disabled
11 = Reserved
Bank 0 asym
type:
0 = 11x9
1 = 12x8
Default = 00h
Reserved
Redefine pin
189:
0 = BOFF#
1 = LCLK
(MVA)
OPTi
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Page 172
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Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SYSCFG D5h
3
2
1
0
Resistor Control Register 2
DACKMUX control
during Suspend:
00 = Pull resistor-equipped lines
low, drive others low
0 = Always
enabled
01 = Tristate all lines (463MV
mode)
1 = Always
disabled
Default = 00h
Reserved
FERR# pull-up
resistor control:
Generate
BOFF#
(AHOLD) on
Next Access
Trap:
0 = Disable
1 = Enable
10 = Drive 100b on DACKMUX2-0
11 = Reserved
SYSCFG D6h
DSK_ACCESS:
0 = 3F5h only
1 = All FDC
ports
(3F2,4,5,7h
and
372,4,5,7h)
(MVA)
PMU Control Register 10
DMA trap
PMI#28 SMI:
0 = Disable
1 = Enable
(MVA)
DMAC1 byte
pointer flip-flop
(RO):
0 = Cleared
1 = Set
(MVA)
SYSCFG D7h
HITM# source:
0 = D/C#
1 = Pin 135
(MVA)
Local bus
DMA LDEV#
sampling:
0 = Normal
1 = Sample
one clock
sooner
(MVA)
Default = 00h
I/O port access
trapped (RO):
0 = I/O Read
1 = I/O Write
(MVA)
ACCESS trap
bit A9 (RO)
(MVA)
ACCESS Port Address Register
ACCESS trap
bit A8 (RO)
(MVA)
Default = 00h
ACCESS Trap Address bits A[7:0]:
- These bits, along with A[9:8] in bits D6h[1:0], provide the 10-bit I/O address of the port access that caused the SMI trap. SYSCFG D6h[2]
indicates whether an I/O read or I/O write access was trapped.
(MVA)
SYSCFG D8h
PMU Event Register 5
HDU_TIMER PMI#19
HDU_ACCESS PMI#23
SMI:
00 = Disable
11 = Enable
COM2_TIMER PMI#18
COM2_ACCESS PMI#22
SMI:
00 = Disable
11 = Enable
SYSCFG D9h
00 = Disable
01 = Enable DOZE_0 (MVA)
10 = Enable DOZE_1 (MVA)
11 = Enable both
00 = Disable
11 = Enable
00 = Disable
11 = Enable
RI PMI#26
SMI:
00 = Disable
11 = Enable
SYSCFG DAh
Mask when
reading
GNR2_TIMER PMI#16
GNR2_ACCESS PMI#20
SMI:
PMU Event Register 6
DOZE_TIMER PMI#27
SMI:
Reserved:
Default = 00h
COM1_TIMER PMI#17
COM1_ACCESS PMI#21
SMI:
Default = 00h
EPMI4 PMI#25
SMI:
EPMI3 PMI#24
SMI:
00 = Disable
11 = Enable
00 = Disable
11 = Enable
Power Mgt. Event Status Register (RO)
Reserved:
Mask when
reading
LOWBAT
state:
LLOWBAT
state:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
EPMI4
state:
0 = Inactive
1 = Active
Default = 00h
EPMI3
state:
0 = Inactive
1 = Active
EPMI2
state:
0 = Inactive
1 = Active
EPMI1
state:
0 = Inactive
1 = Active
OPTi
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912-3000-016
Revision: 3.0
Page 173
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SMI on cooldown clocking
entry/exit
PMI#25 SMI:
External EPMI4
pin polarity:
External EPMI3
pin polarity:
0 = Active hi
1 = Active low
0 = Active hi
1 = Active low
SYSCFG DBh
3
2
1
COM2_
ACCESS
PMI#22 on
Next Access?
COM1_
ACCESS
PMI#21 on
Next Access?
Next Access Event Generation Register 2
I/O blocking
control:
0 = Block I/O
Next
Access
0 = Disable
1 = Enable
1 = Unblock
HDU_
ACCESS
PMI#23 on
Next Access?
0 = No
1 = Yes
SYSCFG DCh
Default = 00h
0 = No
1 = Yes
0 = No
1 = Yes
PMU SMI Source Register 3 (Write 1 to Clear)
PMI#23,
HDU_
ACCESS:
PMI#22,
COM2_
ACCESS:
0 = Inactive
1 = Active
0 = Inactive
1 = Active
PMI#21,
COM1_
ACCESS:
0 = Inactive
1 = Active
PMI#20,
GNR2_
ACCESS:
0 = Inactive
1 = Active
SYSCFG DDh
PMI#19,
HDU_
TIMER:
0 = Inactive
1 = Active
PMI#18,
COM2_
TIMER:
0 = Inactive
1 = Active
PMI#28,
DMA:
PMI#27,
DOZE_TIMER:
0 = Clear
1 = Active
(MVA)
SYSCFG DEh
0 = Clear
1 = Active
GNR2_
ACCESS
PMI#20 on
Next Access?
0 = No
1 = Yes
Default = 00h
PMI#17,
COM1_
TIMER:
0 = Inactive
1 = Active
PMU SMI Source Register 4
Reserved
0
PMI#16,
GNR2_
TIMER:
0 = Inactive
1 = Active
Default = 00h
PMI#26,
RI:
0 = Clear
1 = Active
PMI#25,
EPMI4 pin/
cool-down
clocking:
PMI#24,
EPMI3 pin:
0 = Clear
1 = Active
0 = Clear
1 = Active
Current Access Event Generation Register
Default = 00h
HDU_
ACCESS
PMI#23 on
Current
Access?
COM2_
ACCESS
PMI#22 on
Current
Access?
COM1_
ACCESS
PMI#21 on
Current
Access?
GNR2_
ACCESS
PMI#20 on
Current
Access?
GNR1_
ACCESS
PMI#15 on
Current
Access?
KBD_
ACCESS
PMI#14 on
Current
Access?
DSK_
ACCESS
PMI#13 on
Current
Access?
LCD_
ACCESS
PMI#12 on
Current
Access?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
SYSCFG DFh
Activity Tracking Register
Default = 00h
HDU_
ACCESS
activity?
COM2_
ACCESS
activity?
COM1_
ACCESS
activity?
GNR2_
ACCESS
activity?
GNR1_
ACCESS
activity?
KBD_
ACCESS
activity?
DSK_
ACCESS
activity?
LCD_
ACCESS
activity?
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
0 = No
1 = Yes
SYSCFG E0h-E9h
Reserved
Default = 00h
OPTi
®
Page 174
912-3000-016
Revision: 3.0
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
5
4
SYSCFG EAh
3
2
1
PMU Source Register 5 (MVB)
IRQ/DRQ
Driveback Trap
PMI#36:
0
Default = 00h
Reserved:
Write as read.
0 = Inactive
1 = Active
Write 1 to clear
SYSCFG EBh-F7h
Reserved
SYSCFG F8h
Inhibit MRD#
and MWR# if
SEL# asserted
on memory
cycle?
0 = No
1 = Yes
Compact ISA Control Register 1 (MVB)
Inhibit MRD#
and MWR# if
SEL# asserted
on DMA cycle?
0 = No
1 = Yes
Inhibit IORD#
and IOWR# if
SEL# asserted
on I/O cycle?
0 = Always, per
AT spec.
IRQ15
assignment:
Reserved
0 = IRQ15
1 = RI
Fast CISA
memory cycle:
0 = Disable
(ISA# = 0)
0 = No
1 = Yes
SYSCFG F9h
SPKD signal
driving:
Default = 00h
Default = 00h
Pin 78
function:
0 = RAS4#
1 = CDIR
0 = Disable
1 = Enable
1 = Enable
(ISA#=1)
Compact ISA Control Register 2 (MVB)
End-of-Interrupt Hold:
Stop clock count bits CC[2:0]:
Delays 8259 recognition of EOI
command to prevent false interrupts.
1 = Synchronously, per
CISA spec.
Reserved:
000 = Reserved
001 = 1 ATCLK (default)
...
111 = 7 ATCLKs
00 = None
01 = 1 ATCLK
10 = 2 ATCLKs
11 = 3 ATCLKs
SYSCFG FAh
Write as read.
Stop clock cycle indication to CISA devices of how
many ATCLKs to expect before the clock will stop.
Default = 00h
Generate CISA stop clock cycle (if
not already stopped):
00 = Never
01 = On STPCLK# cycles to the
CPU (hardware)
10 = Immediately (software)
11 = Reserved
Compact ISA Control Register 3 (MVB)
Reassign
EPMI3 as RI?
0 = No
1 = Yes
Use in case RI
is assigned as
SEL#/ATB#
Reassign
EPMI4 as
IOCHCK#?
0 = No
1 = Yes
Use in case
IOCHCK# is
assigned as
KBCRSTIN
Resume from
Suspend on
SEL#/ATB#
low:
0 = Disable
1 = Enable
CMD# state
during
Suspend:
Compact ISA
Interface (reassigns pins 173,
186):
Default = 00h
Driveback
cycle handling:
Configuration
cycle generation:
0 = Pass DRQs
0 = Driven inacand IRQs
0 = No action
tive (high)
1 = Latch info
1 = Run cycle
and gener1 = Driven low
using
ate SMI
scratchpad
SYSCFG FBh
Reserved
Default = 00h
SYSCFG FCh
Scratchpad Register 7
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: IRQ phase information, low byte (RO) (MVB)
SYSCFG FDh
Scratchpad Register 8
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: IRQ phase information, high byte (RO) (MVB)
SYSCFG FEh
Scratchpad Register 9
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: DRQ phase information, low byte (RO) (MVB)
OPTi
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Revision: 3.0
Page 175
82C465MV/MVA/MVB
Table 5-1
SYSCFG Register Space
7
6
SYSCFG FFh
5
4
3
Scratchpad Register 10
2
1
0
Default = 00h
General purpose storage byte:
- For CISA Driveback Cycle: DRQ phase information, high byte (RO) (MVB)
OPTi
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Page 176
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Revision: 3.0
82C465MV/MVA/MVB
6.0
Electrical Ratings
Stresses above those listed in the following tables may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification are not implied.
6.1
Absolute Maximum Ratings
Symbol
Description
Min
Max
Units
VDD/VDDS
Operating Voltage
3.0
6.5
V
VIH
Input High Voltage
VDDS + 0.3
V
VIL
Input Low Voltage
TA
Ambient Temperature
6.2
–0.3
V
0
°C
70
5.0V DC Characteristics: TA = 0°C to +70°C, VDDS = 5.0V± 5%
Symbol
Description
VIH
Input High Voltage
Min
TTL Level
CMOS Level
Max
Units
2.0
V
2.0V
V
VT+
Schmitt-trigger Input Voltage (TTL)
Positive Going Threshold
VT–
Schmitt-trigger Input Voltage (TTL)
Negative Going Threshold
VIL
Input low voltage
TTL Level
0.8
V
CMOS Level
0.8
V
VOH
Output High Voltage
(at Rated Drive Current)
CMOS Level
VOL
Output low voltage
(at Rated Drive Current)
CMOS Level
IIH
Input Leakage Current, VIN = VDDS
IIL
2.2
0.8
V
V
2.4
V
0.45
V
–10
10
µA
Input Leakage Current, VIN = GND
–10
10
µA
IOZ
Tristate Leakage Current 0.45V < VOUT < VDDS
–10
10
µA
ICC
Operating Current
33MHz, On Mode (Note)
100
mA
Suspend Mode (Note)
100
µA
Note:
Assumes controlled leakage currents.
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82C465MV/MVA/MVB
6.3
3.3V DC Characteristics: TA = 0°C to +70°C, VDD = 3.3V± 5%
Symbol
Description
Min
VIH
Input High Voltage
2.0
VT+
Schmitt-trigger Input Voltage (TTL)
Positive Going Threshold
VT–
Schmitt-trigger Input Voltage (TTL)
Negative Going Threshold
VIL
Input Low Voltage
VOH
Output High Voltage (at Rated Drive Current)
VOL
Output Low Voltage (at Rated Drive Current)
IIH
Input Leakage Current, VIN = VDD
IIL
Max
Units
V
2.2
0.8
V
V
0.8
2.4
V
V
0.45
V
–10
10
µA
Input Leakage Current, VIN = GND
–10
10
µA
IOZ
Tristate Leakage Current 0.45V < VOUT < VDD
–10
10
µA
ICC
Operating Current
33MHz, On Mode (Note)
50
mA
Suspend Mode (Note)
40
µA
Max
Units
Note:
Assumes controlled leakage currents.
6.4
AC Characteristics
Symbol
Description
Min
CIN
Input Capacitance
10
pF
COUT
Output Capacitance
10
pF
CIO
I/O Capacitance
12
pF
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Revision: 3.0
82C465MV/MVA/MVB
6.5
Timing Characteristics: CPU interface = 3.3V, all other interfaces = 5.0V
Sym.
Parameter
6.5.1
Cache Timing
Min
Typ
Max
Unit
t1
CPU bus definition valid to BEOE#/BOOE# active delay
(for 2-X-X-X leadoff cycles only)
10
20
ns
t2
CLK rising edge to BEOE#/BOOE# active delay
5
20
ns
t3
CLK rising edge to BEOE#/BOOE# inactive delay
20
ns
t4
CLK rising edge to BRDY# active delay
5
15
ns
t5
CLK rising edge to BRDY# inactive delay
5
15
ns
t7
CLK falling edge to ECAWE#/OCAWE# active delay
15
ns
t8
CLK falling edge to ECAWE#/OCAWE# inactive delay
(0 wait state write, dirty)
20
ns
t9
CLK falling edge to ECAWE#/OCAWE# inactive delay
(0 wait state write, not dirty, or 1 wait state write, dirty)
16
ns
t9A
CLK rising edge to ECAWE#/OCAWE# active delay with
DRAM at speed of 3-2-2-2
20
ns
t9B
CLK falling edge to ECAWE#/OCAWE# inactive delay with
DRAM at speed of 3-2-2-2
17
ns
t10
CLK falling edge to TAGWE# active delay
(for updating DIRTY bit)
15
ns
t11
CLK falling edge to TAGWE# inactive delay
(for updating DIRTY bit)
5
15
ns
t12
CLK rising edge to BRDY# active delay
(for cache write cycles)
5
20
ns
t13
CLK rising edge to BRDY# inactive delay
(for cache write cycles)
5
10
ns
t14
CLK rising edge to TAGWE# active delay
(for updating TAG)
5
15
ns
t15
CLK rising edge to TAGWE# inactive delay
(for updating TAG)
5
15
ns
t16
CPU bus definition valid to ECA3/ECA2 valid delay
16
ns
t17
CLK rising edge to ECA3/ECA2 invalid delay
10
ns
t161
HITM# signal setup time
10
t162
ADS# active to HOLD active delay
10
30
ns
t167
FBCLK rising edge to EADS# active delay
5
25
ns
t168
FBCLK rising edge to EADS# inactive delay
5
25
ns
6.5.2
ns
DRAM Timing
t18
CLK rising edge to CAS# active delay
5
20
ns
t19
CLK rising edge to CAS# inactive delay
5
20
ns
t20
CLK falling edge to CAS# active delay
(for 3-2-2-2 cache burst cycles only)
5
20
ns
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82C465MV/MVA/MVB
Sym.
Parameter
Min
Typ
Max
Unit
15
ns
t21
CLK rising edge to CAS# inactive delay
(for 3-2-2-2 cache burst cycles only)
t22
CLK rising edge to RAS# inactive delay
5
20
ns
t23
CLK rising edge to RAS# active delay
5
20
ns
t24
CLK rising edge to column address valid delay
5
15
ns
t25
CLK rising edge to row address hold time
8
30
ns
t26
CLK rising edge to DWE# active delay
5
15
30
ns
t27
CLK rising edge to DWE# inactive delay
5
15
30
ns
t29
RAS# precharge time
80
ns
t30
CAS# precharge time
10
ns
t31
CAS# active to RAS#[1-0] active delay
25
ns
t32
CAS# inactive to RAS#[1-0] inactive delay
25
ns
t33
RAS# active to RAS# active delay (during refresh)
55
ns
t34
RAS# inactive to RAS# active delay (during refresh)
55
ns
a
6.5.3
AT Bus Timing
t46
ATCLK falling edge to BALE active delay
5
30
ns
t47
ATCLK rising edge to BALE inactive delay
5
30
ns
t48
ATCLK falling edge to CMD active delay
5
30
ns
t49
ATCLK rising edge to CMD active delay
5
30
ns
t50
ATCLK rising edge to CMD inactive delay
5
30
ns
t51
M16# to ATCLK rising edge setup time
8
ns
t52
M16# from ATCLK rising edge hold time
8
ns
t53
IO16# to ATCLK rising edge setup time
10
ns
t54
IO16# from ATCLK rising edge hold time
10
ns
t55
CHRDY to ATCLK rising edge setup time
12
ns
t56
CHRDY from ATCLK rising edge hold time
12
ns
t57
FBCLK falling edge to HOLD active delay
5
16
ns
t58
FBCLK rising edge to HOLD inactive delay
5
16
ns
t59
ATCLK rising edge to REFRESH# active delay
8
30
ns
t60
ATCLK rising edge to REFRESH# inactive delay
8
30
ns
t70
0WS# to ATCLK falling edge setup time
t71
0WS# from ATCLK falling edge hold time
t85
A[9:0] valid to KBDCS# active delay
30
ns
t86
A[9:0] invalid to KBDCS# inactive delay
30
ns
t106
CD[31:0] valid to SD[15:0] valid delay
9
17
ns
t107
CD[31:0] valid to MP[3:0] valid delay
8
18
ns
t108
CD[31:0] invalid to SD[15:0] invalid delay
8
18
ns
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82C465MV/MVA/MVB
Sym.
Parameter
t109
CD[31:0] invalid to MP[3:0] invalid delay
t110
Min
Typ
Max
Unit
8
18
ns
SD[15:0] valid to CD[31:0] valid delay
8
16
ns
t111
SD[15:0] valid to MP[3:0] valid delay
12
20
ns
t112
SD[15:0] invalid to CD[31:0] invalid delay
8
16
ns
t113
SD[15:0] invalid to MP[3:0] delay
12
20
ns
t114
SD[15:8] valid to SD[7:0] delay
8
16
ns
t115
SD[15:8] invalid to SD[7:0] delay
9
18
ns
t116
CHCK# active to NMI delay
t131
ATCLK edge to SDENL# delay
1/2
ATCLK
t132
ATCLK edge to SDENH# delay
1/2
ATCLK
t133
FBCLK rising edge to ROMCS# active delay
t134
ATCLK falling edge to XDIR active delay
t136
18
ns
30
ns
5
20
ns
ATCLK rising edge to XDIR inactive delay
5
20
ns
t137
ATCLK rising edge to I/O CMD# inactive delay
5
20
ns
t138
ATCLK falling edge to I/O CMD# active delay
5
20
ns
t171
CPUCLK rising edge to SDENH# inactive delay
5
ns
t172
CPUCLK rising edge to SDENL# inactive delay
5
ns
t173
CPUCLK rising edge to SDIR inactive delay
5
ns
t174
AT bus turn-around time
t175
Next ATCLK edge to SDENH# active delay
20
ns
t176
Next ATCLK edge to SDENL# active delay
20
ns
t177
Next ATCLK edge to SDIR active delay
20
ns
6.5.4
1/2
ATCLK
ns
Reset and Local Bus Timing
t102
FBCLK/CPUCLK rising edge to CPURST/SRESET active
delay
8
10
15
ns
t105
FBCLK/CPUCLK rising edge to CPURST/SRESET inactive
delay
8
10
15
ns
t117
ADS# setup time
8
ns
t170
ADS# hold time
5
ns
t118
LDEV# setup time
8
ns
t119
LDEV# hold time
5
ns
t121
RDY# active to CPUCLK rising edge delay
8
ns
t122
RDY# inactive from CPUCLK rising edge delay
5
ns
t165
CPU RESET time
190
CPUCLK
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82C465MV/MVA/MVB
Sym.
Parameter
6.5.5
Power Management Timing
Min
Typ
Max
Unit
t140
ATCLK rising edge to PIO active delay
40
ns
t141
ATCLK rising edge to MA bus valid delay
25
ns
t142
ATCLK rising edge to MA bus invalid delay
20
ns
t143
ATCLK rising edge to PPWRL active delay
25
ns
t144
ATCLK rising edge to PPWRL inactive delay
25
ns
t146
Stop clock delay setup in SYSCFG B0h
t150
Stop clock delay setup in SYSCFG B0h
t151
7/8 resume recovery time
t152
1/8 resume recovery time
t158
PPWRL width (ATCLK not running)
1/2
(15us)
SQWIN
CLK
t169
PPWRL width (ATCLK running)
1
ATCLK
t180
RDY# inactive to Hold active delay
1
ATCLK
a. MA bus timing delays depend heavily on bus loading. Timing t24 assumes 12 DRAM devices on the bus. Add
approximately a 7ns delay for each additional bank of 12 devices. If heavy-duty MA bus drive is enabled (SYSCFG
A1h[4] = 1), add a 5ns delay for each additional bank.
OPTi
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Revision: 3.0
82C465MV/MVA/MVB
6.6
Timing Diagrams
Figure 6-1
ROM Cycle with SDENH#, SDENL# (L2 Cache Enabled)
FBCLK
ATCLK
ADS#
A[24:0]
1FFFFF0
SA[1:0]
0
1
SD[15:0]
EA
2
5B
CD[31:0]
3
E0
00
Valid
BE[3:0]#
RDY#
t46
t47
BALE
t134
t136
XDIR
t49
MRD#
t132
SDENH#
t131
SDENL#
SDIR
t133
ROMCS#
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Page 183
82C465MV/MVA/MVB
Figure 6-2
ISA Bus Cycle
FBCLK
T1 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T1 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2
ATCLK
ADS#
M/IO#, D/C#, W/R#, A[31:2]
BALE
t46
t47
BALE will be generated 1 ATCLK late if fast AT cycle option is disabled
8-bit ISA bus cycles
t48 one more ATCLK delay if AT extra WS is set
8-bit ISA Bus CMD#s
MCS16#
IOCS16#
t71
0WS#
t70
t55
CHRDY
t56
RDY#
16-bit ISA bus cycles
16-bit MEMR#/MEMW#
t49
one more ATCLK delay if AT extra WS is set
t133
16-bit IOR#/IOW#
t134
one more ATCLK delay if AT extra WS is set
MCS16#
t51
IOCS16#
t53
t52
t54
RDY#
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Revision: 3.0
82C465MV/MVA/MVB
Figure 6-3
Keyboard Controller Access Cycle
FBCLK
T1 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T1 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T
ATCLK
ADS#
M/IO#, D/C#, W/R#, A[31:2]
SA[9:2]
t46
BALE
t47
t134
XDIR
t136
t85
KBDCS#
t86
t48
IOR#/IOW#
t50
RDY#
Figure 6-4
CD[31:0] to SD[15:0] and MP[3:0] Valid and Invalid Delay
t106
CD[31:0]
t108
SD[15:0]
t107
MP[3:0]
Figure 6-5
SD[15:0]
t109
SD[15:0] to CD[31:0] and MP[3:0] Valid and Invalid Delay
t110
t112
CD[31:0]
MP[3:0]
t111
t113
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Page 185
82C465MV/MVA/MVB
Figure 6-6
Data Valid and Invalid Delay Between SD[15:8] and SD[7:0] Data Swapping
SD[15:8]
t114
t115
SD[7:0]
Figure 6-7
NMI Valid Delay Related to IOCHK#
t116
NMI
CHCK#
Figure 6-8
CPUCLK
L2 Cache Read Miss - Dirty, Double Bank Cache
T1
T2 T2
T2 T2
T2
T2
T2
T2
T2 T2
T2 T2
T2
T2
T2
T2
T2
T2
T2 T2
T2
T2
T2 T1
ADS#
t16
t17
ECA3
ECA2
t13
t12
BRDY#
ECAWE#
OCAWE#
t1
BEOE#
t2
t3
BOOE#
DWE#
RASx#
CAS[3:0]#
RDY#
DRTY
t11
t10
t14
t15
TAGWE#
TAG[7:0]
FBh
Valid Tag
OPTi
®
Page 186
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Revision: 3.0
82C465MV/MVA/MVB
Figure 6-9
L2 Cache Write 0 Wait State, Not Dirty
CLK
T1
T2
T2
T1
ADS#
BLAST#
M/IO#, D/C#, W/R#, A[31:2]
t9A
ECAWE#/OCAWE#
t7
ECAWE#/OCAWE#
t9B
t9
DRTY
TAGWE#
t12
BRDY#
t13
Figure 6-10 L2 Cache Write, Dirty
CLK
T1
T2
T1
T2
T2
ADS#
BLAST#
M/IO#, D/C#, W/R#, A[31:2]
t7
t8
t9
ECAWE#/OCAWE#
DRTY
TAGWE#
t12
t13
t12
t13
BRDY#
0 Wait State Dirty
1 Wait State Dirty
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Page 187
82C465MV/MVA/MVB
Figure 6-11 L2 Cache Burst Read 3-2-2-2 For Double Bank
CLK
T1
T2
T2
T2
T2
T1
T2
T2
T2
T2
ADS#
M/IO#, D/C#, W/R#, A[31:2]
BEOE#
t1
t2
BOOE#
ECA3
t16
t3
t17
ECA2
BRDY#
t4
t5
ECAWE#/OCAWE#
TAGWE#
DRTY
RDY#
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82C465MV/MVA/MVB
Figure 6-12 L2 Cache Burst Read 3-2-2-2 For Single Bank
CLK
T1
T2
T2
T2
T2
T1
T2
T2
T2
T2
ADS#
M/IO#, D/C#, W/R#, A[31:2]
BEOE#
t1
t3
BOOE#
ECA3
t16
t17
ECA2
BRDY#
t4
t5
ECAWE#/OCAWE#
TAGWE#
RDY#
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Page 189
82C465MV/MVA/MVB
Figure 6-13 L2 Cache Burst Read 2-1-1-1 Cycle For Double Bank
CLK
T1
T2
T2
T2
T2
T1
ADS#
M/IO#, D/C#, W/R#, A[31:2]
t1
t3
t1
BEOE#
t2
BOOE#
t16
t17
t16
ECA3
ECA2
t4
t5
t4
BRDY#
ECAWE#/OCAWE#
TAGWE#
DRTY
RDY#
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82C465MV/MVA/MVB
Figure 6-14 HITM# Active With L2 Cache Hit, L2 Cache 3-2-2-2 Write Cycle (Cache 0 Wait Write)
FBCLK
t167
t168
EADS#
IOCHRDY
t161
HITM#
t161
HOLD
HLDA
ADS#
BRDY#
t8
t7
ECAWE#
OCAWE#
Note:
Sampling of HITM# is programmable to be in either second or third clock after EADS#.
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82C465MV/MVA/MVB
Figure 6-15 HITM# Signal Active, Burst Write Back Cycle, 1 Wait State DRAM Write Setup
FBCLK
EADS#
AHOLD
IOCHRDY
t161
t161
HITM#
t162
HOLD
HLDA
ADS#
BRDY#
RAS#
CAS#
DWE#
Note:
Sampling of HITM# is programmable to be in either second or third clock after EADS#.
OPTi
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Revision: 3.0
82C465MV/MVA/MVB
Figure 6-16 Refresh Cycle
FBCLK
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
Ti
ATCLK
CAS[3:0]#
t31
RAS0#
t32
t33
RAS1#
t34
RAS2#
RAS3#
HOLD
t57
t58
HLDA
t59
REFRESH#
t60
Figure 6-17 DRAM Burst Read 5-4-4-4 (Page Hit)
CLK
T1 T2
T2
T2
T2
T2
T2
T2
T2
T2 T2
T2
T2
T2
T2
T2
T2
T1
ADS#
A[31:2]
RAS0#
CAS[3:0]#
MA[11:0]
t18
t19
t30
t24
DWE#
BLAST#
BRDY#
RDY#
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82C465MV/MVA/MVB
Figure 6-18 DRAM Burst Read X-2-2-2 (Page Miss)
CLK
T1
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T1
ADS#
MIO, DC, WR, A[31:2]
t22
RAS0#
t23
t29
t20
CAS[3:0]#
t21
t30
t25
MA[11:0]
DWE#
BLAST#
BRDY#
RDY#
Figure 6-19 DRAM Burst Read 3-2-2-2 (Page Hit)
T1
T2
T2
T2
T2
T2
T2
T2
T2
T1
CLKI
ADS#
MIO, DC, WR, A[31:2]
RAS0#
t21
t20
t30
CAS[3:0]#
t24
MA[11:0]
DWE#
BLAST#
BRDY#
RDY#
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82C465MV/MVA/MVB
Figure 6-20 DRAM Burst Read 4-3-3-3 (Page Hit)
T1
CPUCLK
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
ADS#
A[31:2]
RAS0#
t18
CAS[3:0]#
t30
t19
t24
MA[11:0]
DWE#
BLAST#
BRDY#
Figure 6-21 DRAM Burst Read X-3-3-3, 1 Wait Page Miss
CPUCLK
T1
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
T2
ADS#
A[31:2]
RAS0#
t30
t18
t19
CAS[3:0]#
t24
MA[11:0]
DWE#
BLAST#
BRDY#
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Figure 6-22 DRAM Burst Read X-3-3-3, 0 Wait Page Miss
T1 T2
CPUCLK
T2
T2
T2
T2
T2
T2
T2
T2 T2
T2
T2
T2
T2
T2
T2
T2
ADS#
A[31:2]
RAS0#
t19
t18
CAS[3:0]#
t30
t24
MA[11:0]
DWE#
BLAST#
BRDY#
Figure 6-23 DRAM Write Wait State (without L2 Cache Support)
T1
T2
T2
T1
T2
T2
T2
FBCLK
ADS#
BRDY#
t18
CAS#
t19
t18
t19
RAS#
t26
DWE#
0 Wait State Write*
t27
t26
t27
1 Wait State Write**
* 0 Wait State cycle takes three clocks to be completed.
** 1 Wait State cycle takes four clocks to be completed.
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Figure 6-24 Single Local Bus Cycle
OSCCLK2
t119
FBCLK
CPUCLK
t117
ADS#
t170
ADDR
t118
LDEV#
t121
t122
RDY#
Figure 6-25 Reset Timing
t105
FBCLK
CPUCLK
t102
CPURST/SRESET
RDY#
t165
t103
t104
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Figure 6-26 Low Word ISA Bus Memory Read to High Word Local Bus With SDENL#, SDENH#, and SDIR
Active
CPUCLK
ATCLK
RDY#
t175
t171
t132
SDENH#
t176
t172
t131
SDENL#
t173
t177
SDIR
MRD#
Buffer Driven
CD[31:16]
EA
465 Driven
t174
SD[15:0]
Valid data 'EA'
ZZZZ
EA
Figure 6-27 Write PPWR[3:0] With '1111'
FBCLK
ATCLK
ADS#
RDY#
A[24:0]
0000024
SD[15:0]
00FF
BALE
IOW#
t143
t169
PPWRL
t141
MA
t144
t142
4FF
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Figure 6-28 PIO Timing Example (PIO2)
FBCLK
ATCLK
ADS#
RDY#
A[24:0]
SD[15:0]
0000022
0056
0000024
ZZZZ
0044
BALE
IOW#
PIO2
t140
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Figure 6-29 Suspend Sequence after Writing '1' to SYSCFG 50h[0]
FBCLK
7
1
STPCLK#
ADS#
2
RDY#
A[24:0]
t180
0000010
HLDA
4
HOLD
3
8
PPWRL
TRIS#
t158
5
SQWIN
RAS#
6
CAS#
Notes: The timing in this waveform is not proportional. The diagram is used to show the sequence of events 1 through 8 only.
1. 82C465MV asserts STPCLK# signal to CPU.
2. CPU responds with stop grant cycle.
3. One ATCLK after the RDY# signal is asserted, 82C465MV asserts HOLD to CPU.
4. CPU responds with HLDA.
5. 82C465MV asserts TRIS# and drives its output pins according to Suspend state.
6. 82C465MV asserts suspend refresh within 1 1/2 32KHz clock (~45us). Normal refresh is still enabled within this
period (not shown in the diagram).
7. 82C465MV stops the following clocks in low state: CPUCLK, FBCLK, ATCLK, KBCLK, KBCLK2
8. One 32KHz clock after Suspend refresh, 82C465MV toggles PPWR0-1 to turn off clock generator.
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Figure 6-30 Resume Sequence
t152
t151
3
FBCLK
SQWIN
PMI#6
1
PPWRL
2
RST4#
2
t158
t158
5
7
7
TRIS#
RAS#
6
CAS#
8
STPCLK#
9
HOLD
10
HLDA
Resu/Recov
2
4
Notes: The timing in this waveform is not proportional. The diagram is used to show the sequence of events 1 through 10 only.
1. Resume source sets PMI#6 active. (No SMI generated if already in SMM.)
2. PPWR0-1 toggle to enable clock generator. PPWR10 also set to low for Resume reset. RST4# asserted for
Resume reset (also EPMI2, if enabled).
3. After 7/8 of resume recovery time, 82C465MV Resumes CPUCLK, FBCLK, ATCLK.
4. Resume recovery time expires.
5. 1/2 32KHz clock later, 82C465MV toggles PPWR10 to end Resume reset.
6. Suspend refresh ended, normal refresh started.
7. 82C465MV de-asserts TRIS# and drives its output pins back to normal state, and RST4#/EPMI2 de-asserted to
end the Resume reset.
8. 82C465MV de-asserts STPCLK# to the CPU.
9. 82C465MV de-asserts the HOLD signal.
10. CPU de-asserts the HLDA signal.
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82C465MV/MVA/MVB
Figure 6-31 Timer Time-out and SMI Generation Sequence
FBCLK
Timer CLK derived from 32KHz
Idle Timer Count
3
2
PMI#4
SMI#
SMIACT#
1
0
1
4
2
3
Notes: The timing in this waveform is not proportional. The diagram is used to show the sequence of events 1 through 4 only.
Idle Timer Count is not visible. It is shown here for illustrative purposes only. Other timers also behave in this manner.
1. Idle timer times out.
2. 82C465MV activates SMI# signal to CPU.
3. CPU returns SMIACT#.
4. 82C465MV de-asserts SMI# after SMIACT# goes active.
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Figure 6-32 APM Stop Clock Sequence
CPUCLK
A[24:0]
8
6
00000024
0000010
ADS#
3
Ready#
IOW#
1
HOLD
4
HLDA
10
5
t150
STPCLK#
9
2
IRQ
7
Notes: The timing in this waveform is not proportional. The diagram is used to show the sequence of events 1 through 10 only.
1. Write SYSCFG 50h[3] = 1 to enable 82C465MV to start stop clock cycle.
2. 82C465MV drives STPCLK# low.
3. CPU stop grant cycle.
4. 82C465MV asserts HOLD.
5. CPU responds with HLDA.
6. 82C465MV stops CPUCLK or changes the clock according to SYSCFG 41h[4:2].
7. IRQ wakes up 82C465MV from stop clock and triggers Resume speed sequence.
8. Both FBCLK and CPUCLK Resume back to full speed.
9. After STPCLK# is de-asserted, 82C465MV releases HOLD.
10. CPU releases HLDA.
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Figure 6-33 Doze Sequence
4
CPUCLK
10
A[24:0]
0000010
9
ADS#
3
RDY#
DOZE_TIMER
1
02
01
7
00
R*
R-1
R-2
R-
Timer CLK derived from 32KHz
STPCLK#
t146
2
5
IRQ
8
11
6
Notes: The timing in this waveform is not proportional. The diagram is used to show the sequence of events 1 through 11 only.
1. DOZE_TIMER times out.
2. 82C465MV asserts STPCLK# signal.
3. CPU responds with stop grant cycle.
4. 82C465MV changes the FBCLK, CPUCLK according to SYSCFG 41h[4:2].
5. Stop clock delay according to SYSCFG B0h.
6. IRQ line goes active to trigger the system back to normal speed.
7. DOZE_TIMER reload.
8. 82C465MV asserts stop clock signal.
9. CPU responds with stop grant cycle.
10. 82C465MV changes the clocks back to normal speed.
11. 82C465MV holds the STPCLK# signal active for the time selected in SYSCFG B0h.
* R = Reload Value
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6.7
Functional Memory Timing Diagrams
6.7.1
Fast Page Mode (FPM) DRAM
Figure 6-34 FPM DRAM, 3-2-2-2 Page Hit Read
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Figure 6-35 FPM DRAM, 5-2-2-2 Inactive Page Miss Read
Figure 6-36 FPM DRAM, 8-2-2-2 Active Page Miss Read
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Figure 6-37 FPM DRAM, 4-3-3-3 Page Hit Read
Figure 6-38 FPM DRAM, 8-3-3-3 Inactive Page Miss Read
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Figure 6-39 FPM DRAM, 11-3-3-3 Active Page Miss Read
Figure 6-40 FPM DRAM, 4-3-3-3 Page Hit Read (0 Wait State Page Miss)
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Figure 6-41 FPM DRAM, 6-3-3-3 Inactive Page Miss Read (0 Wait State Page Miss)
Figure 6-42 FPM DRAM, 9-3-3-3 Active Page Miss Read (0 Wait State Page Miss)
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Figure 6-43 FPM DRAM, 5-4-4-4 Page Hit Read
Figure 6-44 FPM DRAM, 8-4-4-4 Inactive Page Miss Read
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Figure 6-45 FPM DRAM, 12-4-4-4 Active Page Miss Read
Figure 6-46 FPM DRAM, 0 Wait State Write
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Figure 6-47 FPM DRAM, 1 Wait State Write
Figure 6-48 FPM DRAM, 5-2-2-2 Inactive Page Miss with RAS 1/2 CLK Early
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82C465MV/MVA/MVB
6.7.2
Extended Data Out (EDO)
Figure 6-49 EDO, 3-1-1-1 Page Hit Read
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Figure 6-50 EDO, 5-1-1-1 Inactive Page Miss with RAS 1/2 CLK Early
Figure 6-51 EDO, 8-1-1-1 Active Page Miss with RAS 1/2 CLK Early
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Figure 6-52 EDO, 10-1-1-1 Active Page Miss with Normal RAS
Figure 6-53 EDO, 3-2-2-2 Page Hit Read
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Figure 6-54 EDO, 6-2-2-2 Inactive Page Miss
Figure 6-55 EDO, 10-2-2-2 Active Page Miss Read
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Figure 6-56 EDO, 4-2-2-2 Page Hit Read
Figure 6-57 EDO, 7-2-2-2 Inactive Page Miss
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Figure 6-58 EDO, 11-2-2-2 Active Page Miss
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82C465MV/MVA/MVB
7.0
Test Mode Information
The 82C465MV part can be forced to tristate all of its outputs
at any time for board level testing. Once this mode has been
commanded, all chip operating and status information
becomes invalid. Therefore, the chip must be powered down
and then restarted after this feature is used.
Test mode is enabled by a decode of combinatorial logic.
Therefore, the order in which these pins are brought high or
low is unimportant.
To clear test mode, power down the system and clear the
high/low settings used to enable test mode.
To enter test mode:
• Set pins 85, 86, and 139 low.
• Set pins 45, 87, 128, and 140 high.
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82C465MV/MVA/MVB
8.0
Mechanical Package Outline
Figure 8-1
208-Pin Plastic Quad Flat Pack (QFP)
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Appendix A
A.
Incompatibilities with the 82C463MV
The 82C465MV is intended to be as fully compatible as possible with the 82C463MV. However, certain architectural and
programming features should be noted.
A.1
Power Plane Changes
The pins with alternative functions DACKMUX0-2 and
DACK2# are 3.3V outputs on the 82C465MV; these were
5.0V outputs on the 82C463MV. Some existing 82C463MV
designs could exhibit a slight increase in power consumption
depending on the logic family used to interface to these signals. If the 82C465MV is used in a new design, these signals
are relocated to a 5.0V plane and do not affect current draw.
A.2
Read Cycle Efficiency
On slower systems, the 82C463MV memory controller could
be programmed to a 2-1-1-1 or 3-1-1-1 cycle due to the fact
that the chipset used a 2X input clock. The 82C465MV uses
only a 1X input clock to run its memory controller. Therefore,
the fastest memory cycle possible on the 82C465MV is 3-2-22. In most practical applications, the speed difference is not
detectable because most operation occurs from the CPU
cache. Since burst read cycles are only used to refill the
cache and this process takes place concurrently with internal
processing, there is no substantial performance loss.
However, a perceived performance reduction can occur if an
82C463MV-compatible BIOS is used. The DRAM cycle controller bits changed meaning between the 82C463MV and the
82C465MV and settings that used to allow 3-1-1-1 and 3-2-22 operation now select 4-3-3-3 operation. SYSCFG 35h
should be modified as soon as possible after boot, either
through a BIOS modification or a simple executable file.
A.3
A.4
Removal of Sequencer
The 82C463MV contained a sequencer that could perform
limited power management functions on its own without CPU
intervention. Because the vast majority of CPUs now available provide SMI control, the sequencer feature has been
removed.
A.5
Default Refresh Rate Change
Since the sequencer has been removed, the global
sequencer enable bit, SYSCFG 67h[5], has been redefined to
form part of the refresh rate selection bits. Most 82C463MVbased BIOS’ enabled this bit. With this setting, the default
refresh rate on the 82C465MV (both Active mode and Suspend mode) will be every 31µs instead of the recommended
15µs. While most modern DRAM can handle slower refresh
rates, the BIOS should be modified for the correct rate if necessary.
A.6
I/O Blocking Default Change
SYSCFG DBh[7] defaults to 0 and disables I/O blocking on
Next Access. It should be set to 1 to be compatible with
82C463MV software. The 82C463MV part had no bit to control this feature, which was always set to “block”.
A.7
Suspend Mode DACKMUX Parking
SYSCFG D5h[7:6] default to a state that parks the DACKMUX lines differently than the 82C463MV part, such that
DACK2# sits low instead of DACK4#. These bits should be
reset if needed (if DACK2# low will cause problems).
ADS# Sampling
On very fast systems, predictive sampling of ADS# to determine cycle type for better efficiency is not always effective.
The safest way to determine cycle type is to latch the M/IO#,
W/R#, and D/C# status on the rising edge of ADS#. The
82C463MV could not run above 33MHz, so this sampling
was never an issue. But since the 82C465MV can run as high
as 50MHz, it must default to the safe mode for latching status. A significant performance improvement can be made to
slower systems, therefore, if the 82C463MV-compatible
mode of sampling is enabled through setting SYSCFG D1h[6]
= 1.
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Appendix A
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Appendix B
B.
Compact ISA Specification
This document describes a new OPTi interface that will be
used to interface the 82C852 PCMCIA Controller to OPTi
system controller chipsets. This interface may also be used to
interface OPTi peripheral products in the future. The interface
is OPTi-proprietary, and may be licensed to others in the
future.
B.1
Compact ISA Overview
The Compact ISA interface coexists with the standard ISA
interface. Chips that support the Compact ISA interface enjoy
a reduced ISA pin count because address signals and command information are strobed in on the SD[15:0] bus. ISA
pins eliminated are:
Table B-1
• SA[23:0] (24 pins)
• IORD#, IOWR#, MRD#, MWR#, SMRD#, SMWR#,
SBHE#, NOWS#, AEN, IO16#, M16# (11 pins)
• IRQ3, 4, 5, 6, 7, 10, 11, 12, 14, 15; DRQ/DACK#0, 1, 2, 3,
5, 6, 7, and TC (25 pins)
Compact ISA defines only two new signals, CMD# and SEL#/
ATB#, for a total requirement of 22 pins. The pin count reduction over standard ISA is 58 pins. Compact ISA performance
is comparable with that of 16-bit ISA bus peripheral devices.
Moreover, Compact ISA does not interfere with standard ISA
operations. The complete signal set of Compact ISA, referred
to in the descriptions as CISA, is shown below.
Compact ISA (CISA) Interface Signals
Name
MAD[15:0]
Type*
I/O
Description
Multiplexed Bus: Used to transfer address, command, data, IRQ, DRQ, DACK information.
ATCLK
I
Standard ISA Clock: CISA device uses rising edge to clock in the first (address) phase.
ALE
I
Standard ISA Address Latch Enable: CISA peripheral device uses rising edge of ALE to
latch the second (address and command) phase. CISA host uses falling edge of ALE to latch
CMD# from peripheral device.
CMD#
I
Command Indication: Common to host and all devices on the CISA bus. The CISA host
asserts CMD# during the data phase of the cycle to time the standard ISA command
(IORD#/WR#, MRD#/WR#), and also asserts CMD# to acknowledge SEL#ATB#.
SEL#/ATB#
(also CLKRUN#)
O
Tristate
Device Selected / ISA Bus Backoff Request: Common to all peripheral devices on the
CISA bus. When ALE is high, the CISA device asserts SEL# to indicate to the host that it is
claiming the cycle. When ALE is low, the CISA device drives this signal to indicate that it has
an interrupt and/or DMA request to make; the host acknowledges by asserting CMD#. After
the host has preset the CISA device in a Stop Clock mode, the device can assert this signal
asynchronously to restart the clock.
IOCHRDY
O
Tristate
Standard ISA Cycle Extension Request: Used during memory and I/O cycles.
RSTDRV
I
Standard ISA Bus Reset
*Peripheral side
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Appendix B
B.2
Compact ISA Cycle Definition
The MAD[15:0] lines contain different information for each
phase of the bus cycle. The use of these lines varies according to whether a memory cycle or an I/O cycle is being run.
Certain cycle definition bits are common to all cycles, as
shown in Table B-2.
Retained Values
Entries marked "Same" retain the same value as in the previous phase, in order to reduce transitions where possible.
However, the CISA peripheral device decode logic must not
Table B-2
assume that these values will be stable. The bits may be
reassigned in the future.
B.2.1
Memory Cycle
The MAD[15:0] bit meanings for each phase of a memory
cycle are shown in Table B-3. The M/IO# bit is always 1 for
memory cycles.
The general structure of Compact ISA memory cycles is
shown in Figure B-1 and Figure B-2.
Common MAD Bit Usage
Signal
Phase 1
Phase 2
MAD0
M/IO# indication bit; used to determine the cycle type.
W/R# indication bit
MAD1
I/D# indication bit. It is always 0 if M/IO# = 1, and
selects between I/O and DMA cycles if M/IO# = 0.
SBHE# indication bit
MAD2
Usage varies.
ISA# timing indication bit; described in the "Performance Control" section of this document.
Phase
Table B-3
1
MAD Bits During Memory Cycles
MAD15 MAD14 MAD13 MAD12 MAD11 MAD10
SA23
SA22
SA21
SA20
SA19
SA18
MAD9
MAD8
MAD7
MAD6
MAD5
MAD4
MAD3
MAD2
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
I/D# = 0 M/IO# = 1
MAD1
MAD0
2
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
Same
Same
Same
ISA#
SBHE#
W/R#
3
SD15
SD14
SD13
SD12
SD11
SD10
SD9
SD8
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
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Appendix B
Figure B-1
Compact ISA Memory Cycle Operation, Fast CISA Timing*
ATCLK
ALE
driven
by device
SEL#/ATB#
driven
by host
CMD#
IOCHRDY
Address
Phase 1
MAD[15:0]
(SD[15:0])
Address
Phase 2
D[15:0]
CA[25:0]
1
2
3
4
5
6
7
8
9
*Cycle optionally extended by IOCHRDY shown in gray.
1.
CISA host gets address from the CPU address lines and
byte enable lines. The host then drives out A[23:10] + M/
IO# on MAD[15:0] with M/IO# high (memory).
2.
CISA peripheral device latches address and M/IO# on
the rising edge of ATCLK and decodes the information.
3.
Host drives out remaining address + Command on
MAD[15:0].
4.
Host asserts ALE. If cycle belongs to CISA peripheral
device, it asserts SEL# and latches the address and
command from MAD[15:0] on the rising edge of ALE.
Device latches ISA# = 1 at this time.
5.
6.
For reads, the host tristates the MAD[15:0] buffers. For
writes, it drives the write data onto MAD[15:0]. Host
asserts CMD# synchronous to the rising edge of ATCLK
and can optionally inhibit its MRD#/MWR# lines.
7.
Cycle is 0 wait states as indicated by ISA# = 1. CISA
peripheral device can bring IOCHRDY low asynchronously after CDM# goes active to extend the cycle.
8.
Device brings IOCHRDY high synchronous to the falling
edge of ATCLK to allow cycle completion.
9.
Host de-asserts CMD# on the same rising edge where it
samples IOCHRDY high.
Host and other CISA devices recognize the SEL# function of SEL#/ATB# by seeing ALE high when sampling
SEL#/ATB# low on the rising edge of ATCLK. Host deasserts ALE and stops driving address on this rising
ATCLK edge.
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Appendix B
Figure B-2
Compact ISA Memory Cycle Operation, Standard ISA Timing*
ATCLK
ALE
driven
by device
SEL#/ATB#
driven
by host
CMD#
IOCHRDY
Address
Phase 1
MAD[15:0]
(SD[15:0])
Address
Phase 2
D[15:0]
CA[25:0]
1
2
3
4
5
6
7
8
9
*Cycle optionally extended by IOCHRDY shown in gray.
1.
CISA host gets address from the CPU address lines and
byte enable lines. The host then drives out A]23:10] + M/
IO# on MAD[15:0] with M/IO# high (memory).
2.
CISA peripheral device latches address and M/IO# on
the rising edge of ATCLK and decodes the information.
3.
Host drives out remaining address + Command on
MAD[15:0].
4.
Host asserts ALE. If cycle belongs to CISA peripheral
device, it asserts SEL# and latches the address and
command from MAD[15:0] on the rising edge of ALE.
Device latches ISA# = 0 at this time.
5.
Host and other CISA devices recognize the SEL# function of SEL#/ATB# by seeing ALE high when sampling
SEL#/ATB# low on the rising edge of ATCLK. Host deasserts ALE and stops driving address on this rising
ATCLK edge.
6.
For reads, the host tristates the MAD[15:0] buffers. For
writes, it drives the write data onto MAD[15:0]. Host
asserts CMD# synchronous to the rising edge of ATCLK
and can optionally inhibit its MRD#/MWR# lines.
7.
Cycle is not zero wait states, as indicated by ISA# = 0.
CISA peripheral device can bring IOCHRDY low asynchronously after CDM# goes active to extend the cycle
further.
8.
Device brings IOCHRDY high asynchronously to allow
cycle completion.
9.
Host de-asserts CMD# on the next rising edge of ATCLK
after the rising edge ATCLK edge on which it samples
IOCHRDY high.
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Appendix B
B.2.2
I/O Cycle
The MAD[15:0] bit meanings for each phase of an I/O cycle
are shown below. The M/IO# bit is always 0, and the I/D# bit
is always 1, for an I/O cycle.
Phase
Table B-4
The general structure of Compact ISA I/O cycles is shown in
Figure B-3.
MAD Bits During I/O Cycles
MAD8
MAD7
MAD6
MAD5
MAD4
MAD3
MAD2
MAD1
MAD0
1
MAD15 MAD14 MAD13 MAD12 MAD11 MAD10 MAD9
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA15
SA14
SA13
SA12
SA11
SA10
I/D# = 1
M/IO# = 0
2
Same
Same
Same
Same
Same
Same
Same
Same
SA1
SA0
Same
Same
Same
ISA# = 0
SBHE#
W/R#
3
SD15
SD14
SD13
SD12
SD11
SD10
SD9
SD8
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
Figure B-3
Compact ISA I/O Cycle Operation*
ATCLK
ALE
driven
by device
SEL#/ATB#
driven
by host
CMD#
IOCHRDY
Address
Phase 1
MAD[15:0]
(SD[15:0])
Address
Phase 2
D[15:0]
CA[25:0]
1
2
3
4
5
6
7
8
9
10
*Cycle optionally extended by IOCHRDY shown in gray.
1.
CISA host gets address from the CPU address lines and
byte enable lines. The host then drives out A[15:2] +
I/D# = 1 + M/IO# = 0 (I/O cycle).
2.
CISA peripheral device latches address and M/IO# on
the rising edge of ATCLK and decodes the information.
3.
Host drives out remaining address + Command on
MAD[15:0].
4.
Host asserts ALE. If cycle belongs to CISA peripheral
device, it asserts SEL# and latches the address and
command from MAD[15:0] on the rising edge of ALE.
5.
Host and other CISA devices recognize the SEL# function of SEL#/ATB# by seeing ALE high when sampling
SEL#/ATB# low on the rising edge of ATCLK. Host deasserts ALE and stops driving address on this rising
ATCLK edge.
6.
For reads, the host tristates the MAD[15:0] buffers. For
writes, it drives the write data onto MAD[15:0].
7.
Host asserts CMD# synchronous to the falling edge of
ATCLK to run the command and can optionally inhibit its
IOR#/IOW# lines.
8.
Cycle is never zero wait state. CISA peripheral device
can bring IOCHRDY low asynchronously after CDM#
goes active, using standard ISA setup timing, to extend
the cycle further. Note that if CISA peripheral device provides a bridge to another device (a PCMCIA slot, for
example), the device on the secondary bus must be able
to return IOCHRDY soon enough to meet setup timing
on the CISA interface.
9.
Device brings IOCHRDY high asynchronously to allow
cycle completion.
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Appendix B
10. Host de-asserts CMD# on the next falling edge of
ATCLK after the rising edge ATCLK edge on which it
samples IOCHRDY high.
B.2.3
DMA on the CISA/ISA Bus
DMA operations are handled very specifically for CISA
peripheral devices. Both CISA memory devices and CISA
DMA devices can be involved in a DMA transfer, possibly at
the same time. The CISA host must handle each situation.
The central consideration is that the CISA host must be able
to distinguish between the DMA channels that are on the ISA
bus and those that are on the CISA bus. This is a simple matter when the host also incorporates the DMA controller:
because the host is responsible for latching the DRQ driveback information, it can determine on a cycle-by-cycle basis
whether the DMA device being serviced is on CISA or on ISA
according to whether it latched DRQ active for that channel
from a CISA driveback cycle.
Because the host has this knowledge, the CISA DMA device
does not need to assert SEL# on a DACK# cycle. The host
already knows the cycle belongs to a CISA DMA device and
does not need to see SEL# for the I/O portion of the cycle.
This inhibition of SEL# is most important when a CISA memory device is responding to the memory portion of the cycle:
the CISA memory device must respond as always with SEL#,
and there would be contention (on deassertion) if the CISA
DMA device asserted SEL# as well.
The host must foresee the following two situations.
• DMA transfer between ISA DMA device and any memory device (system DRAM, ISA memory, or CISA memory) - The host runs a standard CISA memory cycle (I/D#
= 0, M/IO# = 1) along with the ISA memory-I/O cycle. If the
Phase
Table B-5
1
• DMA transfer between CISA DMA device and memory The host runs a CISA DACK# cycle (I/D# = 0, M/IO# = 0).
If a CISA memory device claims this cycle it responds with
SEL# as usual. The memory device can drive IOCHRDY
low to extend the cycle if desired.
The CISA DACK# cycle is described below.
B.2.4
DACK# Cycle
The DACK# cycle is unique in that it has properties of a memory cycle but is directed to an I/O device. Basically, the
DACK# cycle is a memory cycle whose address must be
decoded by any CISA memory device on the bus. SBHE#
and W/R# reference the memory device, not the I/O device;
the I/O device must assume the opposite sense of W/R# for
its portion of the cycle. Only the memory device responds
with SEL#; the DMA (I/O) device never responds. The CMD#
timing will be the wider pulse of MEMW#/IOR# or MEMR#/
IOW#.
The MAD[15:0] bit meanings for each phase of a DMA
acknowledge cycle are shown in Table B-5. The M/IO# bit is
always 0, and the I/D# bit is always 0, for a DACK# cycle.
DMX2-0 encode the number of the DACK#. For example,
DMX2-0 = 010 indicate DACK2# active. TC is high if the
DACK# is being returned with the Terminal Count indication.
Note that there is no ISA# bit, since there is no fast cycle possible.
The general structure of Compact ISA DACK# cycles is
shown in Figure B-4.
MAD Bits During DMA Acknowledge Cycles
MAD15 MAD14 MAD13 MAD12 MAD11 MAD10 MAD9
SA23
selected memory is present on CISA, the device will
respond to the access with SEL# as usual. The host must
drop ALE if SEL# is returned.
SA22
SA21
SA20
SA19
SA18
SA17
MAD8
MAD7
MAD6
MAD5
MAD4
MAD3
MAD2
MAD1
MAD0
SA16
SA15
SA14
SA13
SA12
SA11
SA10
I/D# = 0
M/IO# = 0
2
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
DMX2
DMX1
DMX0
TC
SBHE#
W/R#
3
SD15
SD14
SD13
SD12
SD11
SD10
SD9
SD8
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
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Figure B-4
Compact ISA DACK# Cycle Operation
ATCLK
ALE
SEL# possibly driven by
CISA memory device
SEL#/ATB#
driven by host, tracked by CISA
DMA and memory devices
CMD#
optionally driven by CISA memory device
IOCHRDY
Address
Phase 1
MAD[15:0]
(SD[15:0])
Address
Phase 2
D[15:0]
CA[25:0]
1
2
3
4
5
6
7
8
9
COMPACT ISA (CISA) DACK# CYCLE OPERATION
1. CISA host gets address from the CPU address lines and byte enable lines. The host then drives out A[23:10]+I/D#=0+M/IO#=0
1.
CISA host gets address form the CPU address lines and
byte enable lines. The host then drives out A[23:0] + I/D#
= 0 + M/IO# = 0 (DACK# cycle).
5.
Host de-asserts ALE and stops driving address on this
rising ATCLK edge. Note that in a normal ISA cycle the
host would keep ALE high.
2.
CISA DAM device, and possibly CISA memory device,
latches address and cycle type information on the rising
edge of TACLK and decodes the information.
6.
For DMA I/O read, the host tristates the MAD[15:0] buffers. For DMA I/O write, it drives the write data onto
MAD[15:0].
3.
Host drives out remaining command information on
MAD[15:0].
7.
4.
Host asserts ALE. CIDA DMA device does not assert
SEL# but latches the address and command from
MAD[15:0] on the rising edge of ALE. Any CISA memory
device present latches address and command, decodes
them, and asserts SEL# if appropriate.
Host asserts CMD# synchronous to the falling edge of
ATCLK to run the command and is required to inhibit its
IOR#/IOW# lines.
8.
Only CISA memory devices can extend the cycle with
IOCHRDY.
9.
DACK# cycle is minimum 1.5 ATCLK. Host de-asserts
CMD# synchronous to the rising edge of ATCLK.
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B.2.5
Configuration Cycle
The CISA Configuration Cycle is a special cycle reserved for
future expansion of CISA. The only configuration cycle currently defined is the Broadcast cycle; the only type of Broadcast cycle specified at this moment is the Stop Clock cycle.
In phase 1, the M/IO# bit is always 1, and the I/D# bit is
always 1, for any configuration cycle. BRD is 1 to indicate a
Broadcast cycle, and will always be zero for any other configuration cycle. The STP# bit is 0 to indicate a Stop Clock
cycle, and will be 1 for all other cycles. Bits CC2:0 are the
Clock Count bits that indicate to the CISA peripheral device
how many rising clock edges to expect after CMD# goes high
before the clock is actually stopped. The other bits of phase 1
are reserved and should not be decoded.
The Stop Clock cycle indicates that the host will immediately
put the CISA peripheral devices into a low-power mode in
which they will no longer receive clocks. Therefore, the CISA
peripheral device must enter into a state in which it can asynchronously signal that it needs the clocks restarted. CISA
devices might need to generate an interrupt back to the system, which they cannot do if not receiving clocks.
In phase 2, ISA# = 1 indicating that this will be a fast cycle.
SBHE# = 0 to indicate 16 bits of data. W/R# = 1 because the
Stop Clock Broadcast cycle is always a write cycle.
The MAD[15:0] bit meanings for each phase of the Stop
Clock configuration cycle are shown below.
The data phase of the Stop Clock cycle contains no useful
data and should not be latched.
The general structure of Compact ISA Broadcast cycles is
shown in Figure B-5.
MAD Bits During Stop Clock Configuration Cycles
Phase
Table B-6
MAD15
1
BRD = 1 STP# = 0
MAD14
MAD13 MAD12 MAD11 MAD10 MAD9 MAD8 MAD7 MAD6 MAD5 MAD4 MAD3
Rsvd
Rsvd
Rsvd
Rsvd
Rsvd
Rsvd
MAD2
MAD1
MAD0
CC2
CC1
CC0
Rsvd
Rsvd
Rsvd
I/D# = 1
M/IO# = 1
2
Same
Same
Same
Same
Same
Same
Same Same Same Same Same Same Same
ISA# = 1
SBHE#
W/R# = 1
3
Same
Same
Same
Same
Same
Same
Same Same Same Same Same Same Same
Same
Same
Same
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Figure B-5
Compact ISA Configuration Cycle Operation
ATCLK
ALE
driven
by device
SEL#/ATB#
driven
by host
driven
by host
CMD#
STPRDY
STPACTV
Broadcast
Phase 1
MAD[15:0]
(SD[15:0])
1
2
Broadcast
Phase 2
3
4
5
6
7,8
9
10
11
12
This example describes the Broadcast configuration cycle
8.
The CISA peripheral device is also counting clocks while
in STPRDY state. On the specified ATCLK edge the
device is in STPACTV state. In STPACTV state, the
CISA peripheral device gives SEL#/ATB# a third meaning: CLKRUN#. The device can assert CLKRUN# asynchronously at any time while in this mode to get the host
to restart its clocks.
9.
CISA peripheral device asserts CLKRUN# (SEL#/ATB#)
on receipt of an interrupt to restart the clocks.
1.
CISA host initiates the Configuration cycle; it is not generate form ISA commands. The host drives out BRD = 1
+ I/D# = 1 + M/IO# = 0 (Broadcast configuration cycle).
2.
CISA peripheral latches the command data on the rising
edge of ATCLK and decodes the information.
3.
Host drives out Clock Count, Stop Clock cycle indicator,
and remaining command information on MAD[15:0].
4.
Host asserts ALE. CISA devices latch clock count. CISA
peripheral devices must NOT respond with SEL#.
5.
Host asserts CMD# synchronous to the rising edge of
ATCLK to run the command. The Broadcast configuration cycle is always zero wait states so it completes in
one ATCLK.
10. On next rising ATCLK clock edge, CISA peripheral
device de-asserts CLKRUN# (SEL#/ATB#) but must not
drive it high. Device has left STPRDY state but is still in
STPACTV state and cannot initiate or respond to any
cycle.
6.
After the host de-asserts CMD#, the CISA peripheral
device is internally in STPRDY state.
11. On next falling ATCLK edge, the host drives SEL#/ATB#
high for ½ ATCLK.
7.
After the number of clocks specified by CC[2:0], the host
stops the clock in its high state. In the example, CC[2:0]
= 001 (the minimum allowed) so the host will stop the
clock on the next rising ATCLK edge. Each additional
count requires the host to wait one more clock.
12. On next rising ATCLK edge, the host stops driving SEL#/
ATB#. The CISA peripheral device leaves STPACTV
state on this clock edge and can either generate an interrupt driveback cycle or can respond to cycles from the
host.
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Appendix B
B.3
Interrupt and DMA Request Drive-Back
B.3.2
Compact ISA provides the signal SEL#/ATB# to give the
CISA peripheral device limited ownership of the bus. The
SEL#/ATB# signal acts as ATB# (AT backoff) when asserted
with ALE low. When the device asserts ATB# to the host, the
host inhibits further AT bus operations and asserts the CMD#
line to the CISA peripheral device to acknowledge that the
device now owns the bus. The peripheral device can only
drive two types of information onto the bus: interrupt requests
and DMA requests.
To make DMA requests, the CISA peripheral device drives
the MAD[15:8] lines low for each DRQ it wishes to change.
The device then sets the state of each MAD[7:0] line to correspond to the DRQ state desired. The host side DRQ generation circuitry samples ATB# and CMD# active on the next
rising ATCLK edge after the edge on which IRQs were sampled, and latches the DRQ information on MAD[7:0] for the
channels selected on MAD[15:8].
Figure B-6 illustrates the synchronous IRQ/DRQ driveback
cycle.
B.3.1
The desired DMA request line states are latched by the host
and will remain in that state until cleared by another DRQ
drive-back cycle. This scheme allows both DMA single transfer and DMA block transfer modes to be used. The CISA
peripheral device must assert SEL#/ATB# immediately any
time a DRQ line changes state (assuming the current cycle is
finished). The CISA host, in turn, must immediately deassert
all DRQ inputs to its DMA controller until the drive-back cycle
is complete.
Interrupt Requests
To drive interrupt requests, the CISA peripheral device drives
the MAD[15:0] lines low for each IRQ line it wishes to assert.
The host side IRQ generation circuitry samples ATB# and
CMD# active on the rising ATCLK edge and latches the IRQ
information on MAD[15:0].
The IRQ generation circuitry, whether external or built into
the host, determines how to treat IRQ information. For pulsetype interrupts it could latch the IRQs and enable tristate buffers to drive the lines low for 1-3 ATCLKs, for example.
Table B-7
Phase
DMA Requests
The CISA device must always precede the DRQ drive-back
cycle with an IRQ drive-back cycle, even if no IRQs have
changed state.
IRQ/DRQ Drive Back Cycle
MAD15 MAD14 MAD13 MAD12 MAD11 MAD10
MAD9
MAD8
MAD7
MAD6
MAD5
MAD4
MAD3
MAD2
MAD1
MAD0
IRQ
IRQ15
IRQ14
IRQ13
IRQ12
IRQ11
IRQ10
IRQ9
IRQ8
IRQ7
IRQ6
IRQ5
IRQ4
IRQ3
IRQ2
IRQ1
IRQ0
DRQ
EN7#
EN6#
EN5#
Rsvd
EN3#
EN2#
EN1#
EN0#
DRQ7
DRQ6
DRQ5
Rsvd
DRQ3
DRQ2
DRQ1
DRQ0
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Figure B-6
Compact ISA Interrupt and DMA Request Drive-Back Cycle
ATCLK
ATB# driven by both
host and device
ATB# driven
by device
SEL#/ATB#
ATB# driven
by host
CMD# driven by host
CMD#
IRQ[15:0]
MAD[15:0]
1, 2
3
4
EN#[7:0], DRQ[7:0]
5
1.
CISA Peripheral device must sample SEL#/ATB# and
CMD# high, and ALE low, on TWO consecutive rising
edges of ATCLK.
2.
CISA peripheral device asserts ATB# on rising edge of
ATCLK to request AT backoff. If host was starting a cycle
and was about to assert ALE on the next falling edge of
ATCLK, it must abort the cycle and retry it later. Even if
host is busy and cannot respond to drive back request
immediately, it inhibits initiation of all I/O and DMA operations (EOI to PCI is blocked, for example).
3.
As soon as AT bus operations have been completed and
bus is available, host drives MAD[15:0] high for ½
ATCLK from a falling edge of ATCLK, then asserts
CMD# after the net rising edge of ATCLK. The host
drives ATB# low at this time.
4.
CISA peripheral device(s) can drive interrupt data onto
bus on next falling edge of ATCLK, driving low only those
lines with IRQ activity and not actively driving high the
other lines. In this way, multiple CISA devices can drive
the lines in parallel.
5.
Host IRQ generation circuitry uses rising edge of
ATCLK, qualified by ATB# and CMD# low, to latch IRQs.
The CISA device stops driving ATB# at this time. The
host controls ATB# throughout the rest of the cycle.
6.
CISA peripheral device drives any MAD[15:-0] lines it
was driving low high for ½ ATCLK, then tristates the lines
for ½ ATCLK.
7.
CISA peripheral device drives DRQ information onto
MAD[7:0] and at the same time drives low the corresponding lines MAD[15:8] to indicate which DRQ channels have a status change to be transferred.
8.
Host DRQ generation circuitry uses next rising edge of
ATLCK, qualified by ATB# and CMD# low AND previous
6
7
8
9
IRQ cycle, to latch DRQs. The host DRQ generation circuitry ORs the DRQs with other system DRQs.
9.
B.4
Host de-asserts CMD# and ATB# on rising edge of
ATCLK.
Performance Control
Compact ISA performance is comparable with that of 16-bit
ISA bus peripheral devices. In its simplest implementation,
the CMD# signal is simply an AND of MRD#, MWR#, IOR#,
and IOW# from the standard AT controller state machine.
Memory cycles are always assumed to be zero wait state.
The CISA host detects a NOWS# command every time SEL#
is generated. The CISA peripheral device can use its
IOCHRDY line to extend the cycle and override the NOWS#
status. All of this functionality is consistent with standard ISA
operation.
I/O cycles cannot be made zero-wait-state cycles on the ISA
bus, so by default are not zero-wait-state cycles on the CISA
bus. However, performance improvement is possible if the
CMD# duration is shortened to one ATCLK. Future PCMCIA
I/O devices may be able to complete their cycles this quickly,
for example. For zero-wait-state CISA I/O operation, the
cycle timing would have to change from the standard ISA timing. The host can implement fast CISA timing as an option.
However, all CISA slave devices are required to be able to
accept fast CISA timing.
Fast CISA timing on the host side is defined as follows. If
the CISA host is driving CMD# as derived from the logical
AND of ISA command lines IOR#, IOW#, MRD#, and MWR#,
it sets ISA# = 0 to indicate that the CISA peripheral device
must assume ISA timing. If the host is capable of performing
fast CISA cycles, it can set ISA# = 1. In this case, the CISA
peripheral device must deassert IOCHRDY early to lengthen
cycles.
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Fast CISA timing on the device side is defined as follows. If
the CISA host drives the ISA# bit low, the CISA peripheral
device assumes normal ISA timing for CMD# and IOCHRDY.
If the CISA host drives ISA# high, the CISA peripheral device
must drop IOCHRDY low immediately upon receiving CMD#
to lengthen the cycle; this is different from ISA timing.
The CISA peripheral device will have a programmable option
to determine how IOCHRDY is deasserted. By default, the
device might drop IOCHRDY on every cycle. For the example
of a PCMCIA controller on the CISA bus, only when a fast
PCMCIA card is inserted (as indicated in the CIS header of
the card) would Card Services be allowed to enable the fast
CISA timing option on the CISA peripheral device side.
B.5
Compatibility and Host Responsibilities
Compact ISA does not interfere with standard ISA operations
or limit compatibility. This statement can be made with only
the following restrictions:
• No device can drive the SD bus between ISA cycles.
Devices capable of driving the SD bus must stay tristated
at this time.
• ATCLK can be stopped only after a Stop Clock Broadcast
configuration cycle. Slower-than-standard clock speeds
are allowed if interrupt latency is not an issue.
• ISA bus masters cannot access CISA devices. Standard
ISA masters are simply ignored by CISA devices since
these masters cannot generate CMD# and so cannot run a
CISA cycle. ISA bus masters can still take bus control and
communicate with other ISA peripherals. CISA interrupt
latency may be an issue if a bus master prevents the CISA
host from responding to ATB# for an interrupt driveback
cycle.
• No CISA bus master capability is currently defined. However, the presence of the SEL#/ATB# signal and its AT
Figure B-7
backoff feature leave open the possibility of future bus
master capabilities.
• On receipt of an ATB# request, the CISA host must immediately inhibit all system DRQ activity (possibly by deasserting all DRQs to the DMA controller) until the drive-back
cycle is complete. Otherwise, unwanted DMA cycles could
occur.
B.6
Shared Speaker Signal Support (Optional)
Compact ISA provides a new scheme for the digital speaker
output signal common to PCs and PCMCIA controllers. This
scheme allows all digital audio outputs to be tied together
without the XOR logic usually required.
The standard specification for the speaker data output is a
signal driven in both the low-to-high and high-to-low directions. The output cannot simply be respecified as open-collector, since there is no guarantee that software will leave the
speaker output line from the system chipset in a high or
tristated condition. If it leaves the signal driven low, no other
open-collector devices connected on the line could toggle the
signal. Moreover, open collector outputs tend to consume
excessive power.
Compact ISA provides an efficient solution to the problem as
described in the following sections.
B.6.1
Initial Synchronization
All CISA slave devices must tristate their SPKR outputs at
hard reset time and remain tristated until individually enabled.
On the first ALE generated by the host, all participating CISA
devices will synchronize to ATCLK and derive the signal
ATCLK/2 that is in phase as shown in Figure B-7. Four distinct phases, 0 through 3, are the result. CISA slave SPKR
outputs are still tristated at this point.
Synchronizing to ATCLK at 1st ALE
ATCLK
RESETDRV
ALE
ATCLK/2
phase 0
phase 1
phase 2
phase 3
...
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B.6.2
SPKR Sharing During Active Mode
Figure B-8 illustrates the SPKR handling requirements.
The activities performed in each phase by the CISA host and
the CISA slaves are as given in Table B-8.
Table B-8
SPKR Sharing During Active Mode
Phase
Slave
Host
On the rising ATCLK edge
starting phase 0
Sample the state of SPKR.
Sample the state of SPKR. Tristate SPKR
output.
During phase 0:
Maintain SPKR output tristated (as it was
from previous phase).
Maintain SPKR output tristated.
On the falling ATCLK edge
starting phase 1:
Sample digital audio source input.
During phase 1:
If digital audio source input sampled on ATCLK edge has changed state since the previous
phase 1 in which it was sampled, toggle SPKR. SPKR is toggled by driving the opposite of
the SPKR value sampled in phase 0 onto the SPKR output.
On the rising ATCLK edge
starting phase 2:
Tristate SPKR output.
During phase 2:
Slave and host: Maintain SPKR output
tristated.
On the falling ATCLK edge
starting phase 3:
No activity on this edge.
Drive SPKR pin to the value of SPKR sampled in phase 2.
During phase 3:
Maintain SPKR output tristated (as it was
from previous phase).
Maintain SPKR output driven.
Figure B-8
Tristate SPKR output. Sample the state of
SPKR.
Shared SPKROUT Signal Management
ATCLK
ATCLK/2
phase 0:
tri-state
phase 1:
toggle
phase 2:
tri-state
audio
source
phase 3:
host
drives
current
value
phase 0:
tri-state
phase 1:
toggle
phase 2:
tri-state
phase 3:
host
drives
current
value
SPKR
device tri-states
SPKR because
no toggle is
needed
device samples
SPKR to drive in
phase 3 (all devices)
device samples
SPKR to toggle
in phase 1
device toggles
SPKR to reflect
change in audio
source
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Appendix B
B.6.3
SPKR Sharing During Stop Clock Mode
During Stop Clock mode, CISA devices handle SPKR as follows.
Slave:
Host:
Tristate SPKR. Referring to Figure B-5, the exact
period during which CISA slaves keep SPKR
tristated is defined as the period during which both
STPACTV and STPRDY are high.
Drive or tristate SPKR. It is recommended that the
host drive SPKR low.
Note that even while CISA slave devices are in Stop Clock
mode, they must remain synchronized to the correct phase of
ATCLK. They do not resynchronize on the next ALE.
B.6.4
Audio Output Circuit Recommendations
The SPKR output must never be connected directly to a
speaker or other low-impedance transducer. The shared
SPKR implementation depends on an R-C time constant
large enough that the signal will never change its level any
appreciable amount across a period of 1.5 ATCLKs, the maximum number of clocks for which no device will be driving the
SPKR line.
B.7
Automatic Voltage Threshold Detection
Compact ISA devices are intended to work on either a traditional 5.0V ISA bus or on a local 3.3V ISA bus. Compact ISA
designs are very power-conscious, so using external strap
options on each CISA device to select the input buffer threshold may not be the best option.
Therefore, the Compact ISA host is required to use the ALE
pin at reset to indicate the ISA bus voltage to CISA slaves.
The correspondence is as follows.
• For a 5.0V ISA bus, the host must assert the ALE signal
high when RSTDRV goes high, and must keep it asserted
for at least 1/2 ATCLK and at most 1 ATCLK after RSTDRV goes low.
• For a 3.3V ISA bus, the host must keep the ALE signal low
when RSTDRV goes high, and must maintain ALE low for
at least 1/2 ATCLK after RSTDRV goes low.
This performance is required for CISA hosts, but CISA slave
devices are not required to use the feature.
Three ATCLKs last for approximately 188ns. The R-C time
constant of the design must be significantly larger than this
value. Connecting an 8 ohm speaker directly would cause the
line to begin a transition when it was tristated. Therefore,
either capacitive coupling or an amplifier circuit with a highimpedance input is recommended.
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Appendix C
C.
82C602A Notebook Companion Chip
C.1
Features
C.1.1
General Features
C.2
The notebook mode of the OPTi 82C602A chip provides general purpose multiplexers, latches, and logic to anticipate
future integrated system designs. This mode is enabled
through a strap option that operates as described below.
The 82C602A, in 486 Notebook Mode, provides:
• Multiplexers for interrupt and DMA request scanning
• A byte-wide latch or tristate buffer
• A decoder for DMA acknowledge signal generation
• An XD-SD bus buffer
• An RTC with CMOS RAM
• Miscellaneous logic.
C.2.1
Power-Saving Features
The 82C602A is available by default in a 100-pin PQFP (plastic quad flat pack). It is also available in a 100-pin TQFP (thin
quad flat pack) by special order for all notebook modes.
Signals with tristate options are listed below. See the
attached circuit diagram for a logic representation of these
tristate mechanisms.
• The signals SD[7:0] and XD[7:0] are tristated from a logic
combination of ATTRIS# (pin 58), ROMCS# (pin 5),
ROMCS#/RTCD# (pin 50), and DWE#/KBDCS# (pin 22).
C.2.2
• The signals DACK0-7#, KBDCS#, SMEMR#, and
SMEMW# are tristated when the input signal ATTRIS# is
low.
1.
Design Notes
The following information is important for proper incorporation
of the 82C602A in system designs.
• The signals DO0# and DO0-7 are tristated when the input
signal DTRIS# is low.
All other signals are driven to their normal state, usually inactive.
The power to the RTC can be disconnected during system
suspend mode even while the rest of the chip remains powered. This feature results in extremely low standby power
consumption and is described in the “Reducing Suspend
Power Consumption” section that follows.
Table C-1
Modes/Chipset Support
The 82C602A must follow the strapping options show in
Table C-1. The 82C602A will sense the XD[7:0] bits during
reset to determine which mode it will enter. In order to
achieve a ‘0’ value during reset, place a 4.7KΩ pull-down
resistor on the appropriate XD line. In order to achieve a ‘1’
value, no external are needed since the 82C602A contains
internal pull-up resistors on the XD bus.
The attached circuit diagram illustrates the internal logic of
the notebook mode.
C.1.2
Overview
The 82C602A is a single-voltage part, usually selected
as 5.0V. It has no provisions for 3.3V-to-5.0V translation.
In most cases this limitation is unimportant, as the
82C602A is primarily an ISA bus interface device. However, for implementations that provide 3.3V input signals,
the designer should be aware that 3.3V levels on 5.0V
inputs draw excessive idle current (on the order of 1mA
per input).
For example, the ‘373 latch buffer could be used to
buffer eight of the CPU address lines to the ISA bus.
However, when the system is put into suspend mode,
any buffer inputs that remain at 3.3V will cause a current
draw and create an undesirable situation for low power
suspend mode operation.
Mode Strapping Options
Mode/Chipset Supported
XD7
XD6
XD5
XD4
XD3
XD2
XD1
XD0
486 Notebook Mode/ 82C465MV
1
1
1
0
1
1
0
1
Viper Notebook Mode A (Viper NBA)
1
1
1
0
1
1
1
0
Viper Notebook Mode B (Viper NBB)
1
1
0
0
1
1
1
0
Note:
All other strap combinations are reserved for desktop modes.
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Appendix C
C.2.3
Reducing Suspend Power Consumption
In its notebook modes, the 82C602A chip has been qualified
for operation at 3.3V. However, the internal RTC still requires
5.0V for proper operation. RTCVCC, pin 57, provides VCC to
the RTC during Active mode. The VBATT, pin 55, provides
power only to maintain the RTC clock and CMOS data during
power down modes and is connected to a 2.4V-4.0V battery.
The RTCVCC pin supplies analog circuit power to the RTC
during Run mode and must always be 5.0V, regardless of
whether the rest of the chip is powered at 5.0V or 3.3V.
To save power during low-power Suspend mode (when the
rest of the chip is still powered), this pin may be disconnected
from the supply voltage. It is important that the supply be disconnected, not simply brought to ground. A P-channel MOSFET is ideal for this purpose. The gate of the MOSFET can
be controlled by PPWR0 or PPWR1 from the power control
latch.
For example, PPWR0 may be used to switch off RTCVCC by
using a P-channel MOSFET as shown in Figure C-1. The
auto-toggle feature of the PPWR0 line must be enabled,
SYSCFG 54h[0] = 0, and 68h[0] = 1. Setting bits SYSCFG
68h[3:2] = 10 provides the necessary recovery time to the
RTC analog VCC. With this implementation, the MOSFET will
switch off the power of the analog VCC only during Suspend
mode; the only current flow through the analog VCC is leakage current (less than 1µA).
Figure C-1
RTCVCC Switching Circuit Example
5.0V
3.3V or 5.0V
14
41 VCC
49
71
91
82C602A
C.2.4
82C602A Power Consumption Measurements
Using the circuit of Figure C-1, the power consumption of the
82C602A Notebook Mode in use with the OPTi 82C463MV
demonstration board is shown in the following two tables.
Table C-2
Typical Current Consumption Figures
for RTC Power
Parameter
Normal
Suspend
Analog VCC
< 1.5µA
~1µA
VBAT
~1µA
~1µA
Table C-3
Typical Current Consumption Figures
for Digital Power
Digital VCC = 3.3V
Digital VCC = 5V
Normal
Suspend
Normal
Suspend
< 4mA
< 30µA
< 4mA
250µA
C.2.5
Internal Real-Time Clock (RTC)
The internal RTC of the 82C602A is functionally compatible
with the DS1285/MC146818B. The following subsections will
give detailed functional and register features of the on-chip
RTC of the 82C602A.
C.2.5.1
RTC Features
• System wake-up capability -- alarm interrupt output active
in battery backup mode
• 4.5V to 5.5V operation
• 114 bytes of general nonvolatile storage
• Direct clock/calendar replacement for IBM ® AT-compatible
computers and other applications
• Less than 1.0µA load under battery operation
PPWR0
NDF0610
P-Channel
MOSFET
57
RTCVCC
The MOSFET used for testing at OPTi is a National® Semiconductor NDF0610, which has a typical gate threshold voltage of –2.4V (–3.5V max / –1V min).
• 14 bytes for clock/calendar and control
• BCD or binary format for clock and calendar data
• Calendar in day of the week, day of the month, months,
and years, with automatic leap-year adjustment
• Time of day in seconds, minutes, and hours
- 12- or 24-hour format
- Optional daylight saving adjustment
• Three individually maskable interrupt event flags:
- Periodic rates from 122µs to 500ms
- Time-of-day alarm once-per-second to-once-per-day
- End-of-clock update cycle
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Appendix C
C.2.5.2
RTC Overview
The on-chip RTC is a low-power microprocessor peripheral
providing a time-of-day clock and 100 year calendar with
alarm features and battery operation. The RTC supports 3.3V
systems. Other RTC features include three maskable interrupt sources, square-wave output, and 114 bytes of general
nonvolatile storage.
Wake-up capability is provided by an alarm interrupt, which is
active in battery backup mode.
Figure C-2
The RTC write-protects the clock, calendar, and storage registers during power failure. A backup battery then maintains
data and operates the clock and calendar.
The on-chip RTC is a fully compatible real-time clock for PC/
AT-compatible computers and other applications. The only
external components are a 32.768kHz crystal and a backup
battery.
C.2.5.3
RTC Address Map
The on-chip RTC provides 14 bytes of clock and control/status registers and 114 bytes of general nonvolatile storage.
Figure C-1 illustrates the address map for the RTC.
RTC Address Map
0
14
Bytes
13
Clock
and
Control
Status
Registers
14
114
Bytes
0
Seconds
00
1
Seconds Alarm
01
2
Minutes
02
00
3
Minutes Alarm
03
0E
4
Hours
04
5
Hours Alarm
05
6
Day of Week
06
7
Date of Month
07
8
Month
08
9
Year
09
10
Register A
0A
11
Register B
0B
12
Register C
0C
13
Register D
0D
00
Storage
Registers
127
7F
BCD
or
Binary
Format
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Appendix C
C.2.5.4
Programming the RTC
The time-of-day, alarm, and calendar bytes can be written in
either the BCD or binary format (see Table C-4).
These steps may be followed to program the time, alarm, and
calendar:
1.
bit to select BCD or binary format for all time, alarm,
and calendar bytes.
c.
2.
Write new values to all the time, alarm, and calendar
locations.
3.
Clear the UTI bit to allow update transfers.
Modify the contents of Register B:
a.
Write a 1 to the UTI bit to prevent transfers between
RTC bytes and user buffer.
b.
Write the appropriate value to the data format (DF)
Table C-4
Write the appropriate value to the hour format (HF)
bit.
On the next update cycle, the RTC updates all ten bytes in
the selected format.
Time, Alarm, and Calendar Formats
Range
Address
RTC Bytes
Decimal
Binary
Binary-Coded Decimal
0
Seconds
0-59
00h-3Bh
00h-59h
1
Seconds Alarm
0-59
00h-3Bh
00h-59h
2
Minutes
0-59
00h-3Bh
00h-59h
3
Minutes Alarm
0-59
00h-3Bh
00h-59h
4
Hours, 12-hour Format
1-12
01h-OCh am
81h-8Ch pm
01h-12h am
82h-92h pm
Hours, 24-hour Format
0-23
00h-17h
00h-23h
Hours Alarm, 12-hour Format
1-12
01h-OCh am
81h-8Ch pm
01h-12h am
82h-92h pm
Hours Alarm, 24-hour Format
0-23
00h-17h
00h-23h
6
Day of Week (1 = Sunday)
1-7
01h-07h
01h-07h
7
Day of Month
1-31
01h-1Fh
01h-31h
8
Month
1-12
01h-0Ch
01h-12h
9
Year
0-99
00h-63h
00h-99h
5
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Appendix C
C.2.5.5
Square-wave Output
The RTC divides the 32.768kHz oscillator frequency to produce the 1Hz update frequency for the clock and calendar.
Thirteen taps from the frequency divider are fed to a 16:1
multiplexer circuit. The output of this mux is fed to the SQW
output and periodic interrupt generation circuitry. The four
least-significant bits of Register A, RS[3:0], select among the
13 taps (see Table C-5).
C.2.5.6
Interrupts
The RTC allows three individually selected interrupt events to
generate an interrupt request. These three interrupt events
are:
1.
2.
3.
The update-ended interrupt, which occurs at the end of
each update cycle.
Each of the three interrupt events is enabled by an individual
interrupt enable bit in Register B. When an event occurs, its
event flag bit in Register C is set. If the corresponding event
enable bit is also set, then an interrupt request is generated.
The interrupt request flag bit (INTF) of Register C is set with
every interrupt request. Reading Register C clears all flag
bits, including INTF, and makes INT# high-impedance.
Two methods can be used to process RTC interrupt events:
1.
The periodic interrupt, programmable to occur once
every 122µs to 500ms.
Enable interrupt events and use the interrupt request
output to invoke an interrupt service routine.
2.
The alarm interrupt, programmable to occur once-persecond to once-per-day, is active in battery backup
mode, providing a “wake-up” feature.
Do not enable the interrupts and use a polling routine to
periodically check the status of the flag bits.
The individual interrupt sources are described in detail in the
following subsections.
Table C-5
Square-Wave Frequency/Periodic Interrupt Rate
Register A Bits
Square-Wave
Periodic Interrupt
RS3
RS2
RS1
RS0
Frequency
Units
Period
Units
0
0
0
0
None
0
0
0
1
256
Hz
3.90625
ms
0
0
1
0
128
Hz
7.8125
ms
0
0
1
1
8.192
kHz
122.070
µs
0
1
0
0
4.096
kHz
244.141
µs
0
1
0
1
2.048
kHz
488.281
µs
0
1
1
0
1.024
kHz
976.5625
µs
0
1
1
1
512
Hz
1.953125
ms
1
0
0
0
256
Hz
3.90625
ms
1
0
0
1
128
Hz
7.8125
ms
1
0
1
0
64
Hz
15.625
ms
1
0
1
1
32
Hz
31.25
ms
1
1
0
0
16
Hz
62.5
ms
1
1
0
1
8
Hz
125
ms
1
1
1
0
4
Hz
250
ms
1
1
1
1
2
Hz
500
ms
None
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Appendix C
Periodic Interrupt
The mux output used to drive the SQW output also drives the
interrupt generation circuitry. If the periodic interrupt event is
enabled by writing a 1 to the periodic interrupt enable bit
(PIE) in Register C, an interrupt request is generated once
every 122µs to 500ms. The period between interrupts is
selected by the same bits in Register A that select the
square-wave frequency (see Table C-5). Setting OSC[2:0] in
Register A to 011 does not affect the periodic interrupt timing.
C.
If only the hour and minute alarm bytes are “don't care”,
the frequency is once per minute when seconds match.
D.
If the hour, minute, and second alarm bytes are “don't
care”, the frequency is once per second.
Update Cycle Interrupt
The update cycle ended flag bit (UF) in Register C is set to a
1 at the end of an update cycle. If the update interrupt enable
bit (UIE) of Register B is 1, and the update transfer inhibit bit
(UTI) in Register B is 0, then an interrupt request is generated at the end of each update cycle.
Alarm Interrupt
The alarm interrupt is active in battery backup mode, providing a “wake-up” capability. During each update cycle, the
RTC compares the hours, minutes, and seconds bytes with
the three corresponding alarm bytes. If a match of all bytes is
found, the alarm interrupt event flag bit, AF in Register C, is
set to 1. If the alarm event is enabled, an interrupt request is
generated.
Accessing RTC bytes
Time and calendar bytes read during an update cycle may be
in error. Three methods to access the time and calendar
bytes without ambiguity are:
1.
An alarm byte may be removed from the comparison by setting it to a “don't care” state. An alarm byte is set to a “don't
care” state by writing a 1 to each of its two most significant
bits. A “don't care” state may be used to select the frequency
of alarm interrupt events as follows:
Enable the update interrupt event to generate interrupt
requests at the end of the update cycle. The interrupt
handler has a maximum of 999ms to access the clock
bytes before the next update cycle begins (see Figure C1).
2.
If none of the three alarm bytes is “don't care,” the frequency is once per day, when hours, minutes, and seconds match.
Poll the update-in-progress bit (UIP) in Register A. If UIP
= 0, the polling routine has a minimum of tBUC time to
access the clock bytes (see Figure C-1).
3.
Use the periodic interrupt event to generate interrupt
requests every tPI time, such that UIP = 1 always occurs
between the periodic interrupts. The interrupt handler
has a minimum of tPI/2 + tBUC time to access the clock
bytes (see Figure C-1).
A.
B.
If only the hour alarm byte is “don't care”, the frequency
is once per hour when minutes and seconds match.
Figure C-3
Update-Ended/Periodic Interrupt Relationship
1 sec
P
tUC
(tPI)/2
(tPI)/2
tPI
tBUC
F
F
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Appendix C
TC Time-Base Crystal
The RTC’s time-base oscillator is designed to work with an
external piezoelectric 32.768kHz crystal. A crystal can be
represented by its electrical equivalent circuit and associated
parameters as shown in Figure C-2 and Table C-6, respectively.
L1, C1, and R1 form what is known as the motional arm of
the circuit. C0 is the sum of the capacitance between electrodes and the capacitance added by the leads and mounting
structure of the crystal. The equivalent impedance of the
crystal varies with the frequency of oscillation.
There are two frequencies at which the crystal impedance
appears purely resistive (XE = 0). They’re indicated by two
points on the graph, known as the series resonant (FS) and
anti-resonant (FA) frequencies. Oscillators operating the crystal at the resonant frequency (FS) are termed series resonant
circuits, whereas those that operate the crystal around FA are
termed parallel resonant. The on-chip RTC uses a parallel
resonant oscillator circuit. The frequency of oscillation in this
mode lies between FS and FA and is dictated by the effective
load capacitance appearing across the crystal inputs, as
explained next.
Table C-6
Crystal Parameters
Parameter
Symbol
Value
Unit
Nominal Frequency
F
32.768
kHz
Load Capacitance
CL
6
pF
Motional Inductance
L1
9076.66
H
Motional Capacitance
C1
2.6 x 10-3
pF
Motional Resistance
R1
27
Kohm
Shunt Capacitance
C0
1.1
pF
Figure C-4
Quartz Crystal Equivalent Circuit
R1
L1
C1
C0
RE
XE
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Appendix C
RTC Oscillator
The parallel resonant RTC oscillator circuit is comprised of an
inverting micro-power amplifier with a PI-type feedback network. Figure C-4 illustrates a block diagram of the oscillator
circuit with the crystal as part of the PI-feedback network. The
oscillator circuit ensures that the crystal is operating in the
parallel resonance region of the impedance curve.
the impedance graph of Figure C-3, “A” indicates the point of
resonance when CL equals the specified load capacitance of
the crystal.
Figure C-6
Impedance Graph
4000000
The actual frequency at which the circuit will oscillate
depends on the load capacitance, CL. This parameter is the
dynamic capacitance of the total circuit as measured or computed across the crystal terminals.
Frequency at CL = 6 pF
1500000
A
1000000
32780
32778
32776
32774
32772
32770
32768
32766
Fa
32764
The RTC’s CL1 and CL2 values are trimmed to provide
approximately a load capacitance (CL) of 6pF across crystal
terminals. This is to match the specified load capacitance
(6pf) at which the recommended DT-26 crystal is calibrated to
resonate at the nominal frequency of 32.768kHz. Referring to
Figure C-4
2000000
500000
0
-500000
CL = (CL1 * C L2) / (CL1 + (CL2)
FL
2500000
32762
A parallel resonant crystal like the DT-26 is calibrated at this
load using a parallel oscillator circuit. CL is computed from
CL1 and CL2 as given below:
Frequency at CL = 4 pF
3000000
32760
Reactance (Ohms)
3500000
Frequency (Hz)
(b) Detailed Area of Parallel Resonance
RTC Oscillator Circuit Block Diagram
VDD
82C602A RTC
1
2
50M
CL1
X1
6pF
C L2
X2
DT-26
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Appendix C
Time Keeping Accuracy
The accuracy of the frequency of oscillation depends on:
• Crystal frequency tolerance
• Crystal frequency stability
• Crystal aging
• Effective load capacitance in oscillator circuit
• Board layout
which the crystal will “parallel” resonate at the nominal frequency. From the graph of Figure C-6, increasing the effective load capacitance by hanging additional capacitors on
either of the X1 or the X2 pin will effectively lower the resonant frequency point “A” toward Fs. The deviation of the frequency Fl with load capacitance is given by:
Crystal Frequency Tolerance. The frequency tolerance
parameter is the maximum frequency deviation from the
nominal frequency (in this case 32.768kHz) at a specified
temperature, expressed in ppm (parts per million) of nominal
frequency. In the case of the Grade A DT-26 crystal, this
parameter is ±20 ppm at 25°C.
where C1 is the crystal motional capacitance and C0 is the
crystal shunt stray capacitance, as explained above. CL is the
effective load capacitance across the crystal inputs.
FL = FS (1 + C1/2 (C0 + CL))
Crystal Frequency Stability. This parameter, dependent on
the angle and type of cut, is defined as the maximum frequency deviation from the nominal frequency over a specified
temperature range, expressed in ppm or percentage of nominal frequency.
Figure C-5 shows a typical curve of frequency variation with
temperature for the KDS DT-26 crystal.
Crystal Aging. As a crystal ages, some frequency shift may
be observed. Drift with age is specified to be typically 4 ppm
for the first year and 2 ppm per year for the life of the KDS
DT-26 crystal.
Load Capacitance. For a parallel resonant calibrated crystal,
the crystal manufacturer specifies the load capacitance at
Figure C-7
Allowing for capacitance due to board layout traces leading to
the X1and X2 pins, the RTC is trimmed internally to provide
an effective load capacitance of less than 6pF. Connecting a
6pF crystal directly to the X1 and X2 pins will cause the clock
to oscillate approximately 24 ppm faster than the nominal frequency of 32.768kHz, for reason explained previously.
For maximum accuracy, it is recommended that a small trim
capacitor (< 8pF) be hooked to the X2 pin to move the resonant point closer to the nominal frequency. The graph of Figure C-6 shows the variation of frequency with additional load
capacitance on the X2 pin of the RTC.
Translating the data in Figure C-6 into a practical rule of
thumb: for every additional 1.54pF capacitance on the X2 pin,
the frequency will decrease by 0.8Hz or a ∆F/F of -24.4 ppm
around 82.768kHz.
Typical Temperature Characteristics
10
0
-10
-20
-30
-40
-50
-60
-70
-80
78
74
70
66
62
58
54
50
46
42
38
34
30
26
22
18
14
10
6
2
-2
-6
-10
-14
-18
-22
-26
-30
-90
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Appendix C
Figure C-8
Frequency Variation Versus Load Capacitance
600
500
400
300
200
100
0
-100
-200
Board Layout. Given the high input impedance of the crystal
input pins X1 and X2, care should be taken to route highspeed switching signal traces away from them. Preferably a
ground-plane layer should be used around the crystal area to
isolate capacitive-coupling of high frequency signals. The
traces from the crystal leads to the X1 and X2 pins must be
kept short with minimal bends. A good rule of thumb is to
keep the crystal traces within 5mm of the X1 and X2 pins.
Finally, a 0.1µF ceramic bypass capacitor should be placed
close to the VCC pin of the RTC to provide an improved supply into the clock
Oscillator Start-up. Barring accuracy issues, the RTC will
oscillate with any 32.768kHz crystal. When hooked to the X1
and X2 pins in certain configurations, however, passive components can lead to oscillator start-up problems:
• Excessive loading on the crystal input pins X1 and X2
• Use of a resistive feedback element across the crystal.
Values above 10pF on either the X1 or X2 pin must be
avoided. The feedback element is build into the RTC for startup and no resistive feedback external to the part is required.
Oscillator Control
When power is first applied to the RTC and VCC is above
VPFD, the internal oscillator and frequency divider are turned
on by writing a 010 pattern to bits 4 through 6 of Register A. A
8.82
8.4
7.98
7.56
7.14
6.72
6.3
5.88
5.46
5.04
4.62
4.2
3.78
3.36
2.94
2.62
2.1
1.68
1.26
0.84
0.42
0
-300
pattern of 011 behaves as 010 but additionally transforms
Register C into a read/write register. This allows the
32.768kHz output on the square-wave pin to be turned on. A
pattern of 11X turns the oscillator on, but keeps the frequency
divider disabled. Any other pattern to these bits keeps the
oscillator off.
C.2.5.7
Power-Down/Power-Up Cycle
The RTC’s power-up/power-down cycles are different. The
RTC continuously monitors VCC for out-of-tolerance. During
a power failure, when VCC falls below VPFD (2.53V typical),
the RTC write-protects the clock and storage registers. The
power source is switched to BC when VCC is less than VPFD
and BC is greater than VPFD, or when VCC is less than VBC
and VBC is less than VPFD. RTC operation and storage data
are sustained by a valid backup energy source. When VCC is
above VPFD, the power source is VCC. Write-protection continues for tCSR time after VCC rises above VPFD.
The RTC continuously monitors VCC for out-of-tolerance.
During a power failure, when VCC falls below VPFD (4.17V
typical), the RTC write-protects the clock and storage registers. When VCC is below VBC (3V typical), the power source
is switched to BC. RTC operation and storage data are sustained by a valid backup energy source. When VCC is above
VBC, the power source is VCC. Write-protection continues for
tCSR time after VCC rises above VPFD.
OPTi
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Page 248
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Revision: 3.0
Appendix C
C.2.5.8
Control/Status Registers
The four control/status registers of the RTC are accessible
regardless of the status of the update cycle (see Table C-7).
adjustment. Register B selects the clock and calendar data
formats. See Table C-8 for Register B’s format.
Register C
Register C is a read-only event status register. See Table C-8
for Register C’s format.
Register A
Register A programs the frequency of the periodic event rate,
and oscillator operation. Register A provides the status of the
update cycle. See Table C-8 for Register A’s format.
Register D
Register D is a read-only data integrity status register. See
Table C-8 for Register D’s format.
Register B
Register B enables the update cycle transfer operation,
square-wave output-interrupt events, and daylight saving
Table C-7
Control/Status Registers Summary
Bit Name and State on Reset
Reg
Loc
(Hex)
Read
Write
A
0A
Yes
Yes1
UIP
NA
B
0B
Yes
Yes
UTI
NA
PIE
0
C
0C
Yes
No2
INTF
0
PF
D
0D
Yes
No
VRT
NA
-
7 (MSB)
6
5
OSC2 NA OSC1
4
3
2
1
0 (LSB)
0
OSC0
0
RS3
NA
RS2
NA
RS1
NA
RS0
NA
AIE
0
UIE
0
SQWE
0
DF
NA
HF
NA
DSE
NA
0
AF
0
UF
0
-
0
32KE
0
-
0
-
0
0
-
0
-
0
-
0
-
0
-
0
-
0
Notes: NA = Not Affected
1. Except Bit 7
2. Read/write only when OSC[2:0] in Register A is 011 (binary).
Table C-8
7
Registers A through D Bit Formats
6
5
4
0Ah
3
2
1
Register A
UIP (RO)
OSC[2:0]
RS[3:0]
Update-inProgress:
Oscillator Control Bits 2 through 0:
Rate Select Bits 3 through 0:
1 = An RTC
update cycle
may be in
progress. UIP
is cleared at
end of each
update cycle.
This bit is also
cleared when
the UTI bit in
Register B = 1.
0
Controls state of oscillator and divider stages.
These bits select one of the 13 frequencies for the SQW output and
010 = Enables RTC operation by turning on oscilla- the periodic interrupt rate, as shown in Table C-4
tor and enabling frequency divider (RTC
begins its first update after 500ms)
11X = Turns oscillator on, but keeps frequency
divider disabled
OPTi
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Revision: 3.0
Page 249
Appendix C
Table C-8
Registers A through D Bit Formats (cont.)
7
6
5
4
0Bh
3
2
1
0
Register B
UTI
PIE
AIE
UIE
SQWE
DF
HF
DSE
Update Transfer Inhibit:
Periodic Interrupt Enable:
Alarm Interrupt
Enable:
Square-Wave
Enable:
Data Format:
Hour Format:
Daylight Saving
Enable:
Inhibits the
transfer of RTC
bytes to the
user buffer.
Allows an interrupt request
due to a periodic interrupt
event.
Update Cycle
Interrupt
Enable:
0 = Allows
Transfer
0 = Disable
1 = Enable
1 = Inhibits
transfer
and clears
UIE
Allows an interrupt request
Allows an interdue to an alarm rupt request
interrupt event. due to an
update ended
0 = Disable
interrupt event.
1 = Enable
0 = Disable
1 = Enable
Enables
square-wave
output.
0 = Disable
and hold
low
1 = Enable
Selects
numeric format
in which the
time, alarm, and
calendar bytes
are represented.
0 = BCD
1 = Binary
Selects the
time-of-day and Allows daylight
alarm hour for- saving time
adjustments.
mat.
0 = 12-Hour
Format
0 = Disable
1 = Enable(1)
1 = 24-Hour
Format
This bit is automatically
cleared when
the UTI bit = 1.
(1) On the last Sunday in October, the first time the RTC increments past 1:59:59 AM, the time falls back to 1:00:00 am. On the first Sunday
in April, the time springs forward from 2:00:00 am to 3:00:00 am.
0Ch
Register C
INTF
PF
AF
UF
NU
Interrupt
Request Flag:
Periodic Event
Flag:
Alarm Event
Flag:
Update Event
Flag:
Not Used:
This bit is set to
a 1 every tPI
time, where tPI
is the time
period selected
by the settings
of RS[3:0] in
Register A.
This bit is set to
a 1 when an
alarm event
occurs.
This bit is set to
a 1 at the end of
the update
cycle.
This flag is set
to a 1 when
any of the following is true;
AIE & AF = 11
PIE & PF = 11
UIE & UF = 11
These bits are always set to 0.
Reading Regis- Reading Register C clears this ter C clears this
bit.
bit.
Reading Register C clears this Reading Register C clears this
bit.
bit.
0Dh
Register D
VRT (RO)
NU (RO)
Valid RAM and
Time:
Not Used:
These bits are always set to 0.
0 = Backup
energy
source is
depleted (1)
1 = Valid
backup
energy
source
(1) When the backup energy source is depleted (VRT = 0), data integrity of the RTC and storage registers is not guaranteed.
OPTi
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Page 250
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Revision: 3.0
Appendix C
C.3
Signal Definitions
486 NB Mode Pin Diagram (100-Pin PQFP)
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
DRQ6
DRQ3
DRQ1
XD7
XD6
XD5
XD4
XD3
XD2
VCC
GND
XD1
XD0
DRQ0
SD7
SD6
SD5
SD4
SD3
SD2
Figure C-9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
82C602A
486 NB
Mode
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SD1
SD0
GND
AEN
RSTDRV
DO0#
SMEMW#
SMEMR#
DRQ5
VCC
ATCYC#
MEMW#
MEMR#
KBDCS#
GND
DACK7#
DACK6#
DACK5#
DACK3#
DACK2#
DACK1#
DACK0#
ATTRIS#
RTC_5V
IRQ8#
VBATT
XTALOUT
XTALIN
GND
IRQ15
DI5
DI4
DI3
DI2
DO0
DO1
DO2
DO3
DO4
GND
VCC
DO5
DO6
DO7
IRQ3
IRQ1
DTRIS#
ROMCS#
LATCH
ROMCS#/RTCD#
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
DRQ7
DACKMUX0
GND
DACKMUX1
DACKMUX2
DI1
DI0
IRQ14
IRQ12
IRQ10
IRQ7
IRQ6
IRQ4
VCC
GND
IOR#
IOW#
RQMX3
RQMX2
RTCAS
KBCLK
DWE#/KBDCS#
RST#
KBCLK2
RQMX0
NC
RQMX1
GND
DI7
DI6
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Revision: 3.0
Page 251
Appendix C
486 NB Mode Pin Diagram (100-Pin TQFP)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
82C602A
486 NB
Mode
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DO0#
SMEMW#
SMEMR#
DRQ5
VCC
ATCYC#
MEMW#
MEMR#
KBDCS#
GND
DACK7#
DACK6#
DACK5#
DACK3#
DACK2#
DACK1#
DACK0#
ATTRIS#
RTC_5V
IRQ8#
VBATT
XTALOUT
XTALIN
GND
IRQ15
NC
RQMX1
GND
DI7
DI6
DI5
DI4
DI3
DI2
DO0
DO1
DO2
DO3
DO4
GND
VCC
DO5
DO6
DO7
IRQ3
IRQ1
DTRIS#
ROMCS#
LATCH
ROMCS#/RTCD#
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
DRQ7
DACKMUX0
GND
DACKMUX1
DACKMUX2
DI1
DI0
IRQ14
IRQ12
IRQ10
IRQ7
IRQ6
IRQ4
VCC
GND
IOR#
IOW#
RQMX3
RQMX2
RTCAS
KBCLK
DWE#/KBDCS#
RST#
KBCLK2
RQMX0
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
DRQ6
DRQ3
DRQ1
XD7
XD6
XD5
XD4
XD3
XD2
VCC
GND
XD1
XD0
DRQ0
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
GND
AEN
RSTDRV
Figure C-10
OPTi
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Revision: 3.0
Appendix C
Table C-9
Pin
#
486 NB Mode - Numerical Pin Cross-Reference List
Pin
Type
Pin
#
DRQ7
DACKMUX0
GND
DACKMUX1
DACKMUX2
I
I
G
I
I
26
27
28
29
30
6
7
8
9
10
11
12
13
DI1
DI0
IRQ14
IRQ12
IRQ10
IRQ7
IRQ6
IRQ4
I
I
I
I
I
I
I
I
14
15
16
17
18
19
20
21
VCC
GND
IOR#
IOW#
RQMX3
RQMX2
RTCAS
KBCLK
22
23
24
25
DWE#/KBDCS#
RST#
KBCLK2
RQMX0
1
2
3
4
5
Pin Name
Table E-1
Pin
Type
Pin
#
NC
RQMX1
GND
DI7
DI6
O
G
I
I
51
52
53
54
55
31
32
33
34
35
36
37
38
DI5
DI4
DI3
DI2
DO0
DO1
DO2
DO3
I
I
I
I
O
O
O
O
P
G
I
I
O
O
I
I
39
40
41
42
43
44
45
46
DO4
GND
VCC
DO5
DO6
DO7
IRQ3
IRQ1
I
I
I
O
47
48
49
50
DTRIS#
ROMCS#
LATCH
ROMCS#/RTCD#
Pin
Type
Pin
#
IRQ15
GND
XTALIN
XTALOUT
VBATT
I
G
I
O
I
76
77
78
79
80
RSTDRV
AEN
GND
SD0
SD1
O
O
G
I/O
I/O
56
57
58
59
60
61
62
63
IRQ8#
RTC_5V
ATTRIS#
DACK0#
DACK1#
DACK2#
DACK3#
DACK5#
O
I
I
O
O
O
O
O
81
82
83
84
85
86
87
88
SD2
SD3
SD4
SD5
SD6
SD7
DRQ0
XD0
I/O
I/O
I/O
I/O
I/O
I/O
I
I/O
O
G
P
O
O
O
I
I
64
65
66
67
68
69
70
71
DACK6#
DACK7#
GND
KBDCS#
MEMR#
MEMW#
ATCYC#
VCC
O
O
G
O
I
I
I
P
89
90
91
92
93
94
95
96
XD1
GND
VCC
XD2
XD3
XD4
XD5
XD6
I/O
G
P
I/O
I/O
I/O
I/O
I/O
I
I
I
I
72
73
74
75
DRQ5
SMEMR#
SMEMW#
DO0#
I
O
O
O
97
98
99
100
XD7
DRQ1
DRQ3
DRQ6
I/O
I
I
I
Pin Name
Pin
Type
Pin Name
486 NB Mode - Alphabetical Pin Cross-Reference List
Pin
#
Pin
Type
AEN
ATCYC#
ATTRIS#
DACK0#
DACK1#
77
70
58
59
60
O
I
I
O
O
DO3
DO4
DO5
DO6
DO7
DACK2#
DACK3#
DACK5#
DACK6#
DACK7#
DACKMUX0
DACKMUX1
61
62
63
64
65
2
4
O
O
O
O
O
I
I
DRQ0
DRQ1
DRQ3
DRQ5
DRQ6
DRQ7
DTRIS#
DACKMUX2
DI0
DI1
DI2
DI3
DI4
DI5
DI6
5
7
6
34
33
32
31
30
I
I
I
I
I
I
I
I
DI7
DO0#
DO0
DO1
DO2
29
75
35
36
37
I
O
O
O
O
Pin Name
Pin Name
Pin
#
Pin
Type
38
39
42
43
44
O
O
O
O
O
87
98
99
72
100
1
47
DWE#/KBDCS#
GND
GND
GND
GND
GND
GND
GND
GND
IOR#
IOW#
IRQ1
IRQ3
Pin Name
Pin
#
Pin
Type
IRQ4
IRQ6
IRQ7
IRQ8#
IRQ10
13
12
11
56
10
I
I
I
O
I
I
I
I
I
I
I
I
IRQ12
IRQ14
IRQ15
KBCLK
KBCLK2
KBDCS#
LATCH
9
8
51
21
24
67
49
22
3
15
28
40
52
66
78
I
G
G
G
G
G
G
G
MEMR#
MEMW#
NC
ROMCS#
ROMCS#/RTCD#
RQMX0
RQMX1
RQMX2
68
69
26
48
50
25
27
19
90
16
17
46
45
G
I
I
I
I
RQMX3
RTCAS
RST#
RSTDRV
RTC_5V
18
20
23
76
57
Pin Name
Pin
#
Pin
Type
SD0
SD1
SD2
SD3
SD4
79
80
81
82
83
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
O
I
SD5
SD6
SD7
SMEMR#
SMEMW#
VBATT
VCC
84
85
86
73
74
55
14
I/O
I/O
I/O
O
O
I
P
I
I
I
I
O
O
O
VCC
VCC
VCC
XTALIN
XTALOUT
XD0
XD1
XD2
41
71
91
53
54
88
89
92
P
P
P
I
O
I/O
I/O
I/O
O
I
I
O
I
XD3
XD4
XD5
XD6
XD7
93
94
95
96
97
I/O
I/O
I/O
I/O
I/O
Pin Name
OPTi
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912-3000-016
Revision: 3.0
Page 253
Appendix C
C.3.1
486 NB Mode Signal Descriptions
Refer to the 486 NB internal circuitry schematic in Section 4.0 for complete details.
C.3.1.1
Clock and Reset Interface Signals
Signal Name
Pin
No.
Signal
Type
(Drive)
RST#
23
I-S
RSTDRV
76
O
(24mA)
C.3.1.2
Signal Description
Reset: Reset input to the 82C602A logic.
Reset Drive: Inverted RST#.
Interrupt/Control Interface Signals
Signal
Type
(Drive)
Signal Name
Pin
No.
IRQ1, IRQ3,
IRQ4, IRQ6,
IRQ7
46, 45,
13, 12,
11
I
Interrupt Request Bits 1, 3, 4, 6, and 7
IRQ10, IRQ12,
IRQ14, IRQ15
10, 9,
8, 51
I
Interrupt Request Bits 10, 12, 14, and 15
IOR#
16
I
I/O Read
IOW#
17
I
I/O Write
MEMR#
68
I
Memory Read
MEMW#
69
I
Memory Write
SMEMR#
73
O
(24mA)
SMEMR# with tristate control
SMEMW#
74
O
(24mA)
SMEMW# with tristate control
C.3.1.3
Signal Description
ISA DMA Arbiter Interface Signals
Signal
Type
(Drive)
Signal Name
Pin
No.
DRQ[7:5]
DRQ3, DRQ1,
DRQ0
1, 100,
72, 99,
98, 87
I
DACK[7:5]#,
DACK[3:0]#
65:63,
62:59
O
(6mA)
DACKMUX[2:0]
5, 4, 2
I
RQMX3
18
O
(6mA)
Mux of DRQ1, DRQ3, DRQ6, and DRQ7
RQMX2
19
O
(6mA)
Mux of IRQ10, IRQ15, and DRQ5
Signal Description
DMA Request bits 7 through 5, 3, 1, and 0
DMA Acknowledge bits 7 through 5, and 3 through 0
Encoded DACKs
OPTi
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Revision: 3.0
Appendix C
Signal
Type
(Drive)
Signal Name
Pin
No.
RQMX1
27
O
(4mA)
Mux of IRQ4, IRQ6, IRQ8#, and IRQ12
RQMX0
25
O
(4mA)
Mux of IRQ1, IRQ3, IRQ7, and IRQ14
DWE#/KBDCS#
22
I
C.3.1.4
Signal Description
DRAM Write Enable or Keyboard Chip Select
Bus Interface Signals
Signal Name
Pin
No.
Signal
(Drive)
Type
Signal Description
Data Buffer Inputs 7 through 0
DI[7:0]
29:34, 6,
7
I
DO[7:0]
44:42,
39:35
O
(4mA)
Data Buffer Outputs 7 through 0
DO0#
75
O
(8mA)
Inverted Data Buffer Output 0
DTRIS#
47
I
Data Buffer Tristate Control: When active, will tristate the data buffer.
ROMCS#
48
I
ROM Chip Select: This signal, when active, will allow ROM on the XD bus to
put information on the SD bus.
ROMCS#/RTCD#
50
I
ROM Chip Select and RTC Command Line: This signal is used to enable
accesses to the ROM and RTC from the 82C465MV.
SD[7:0]
86:79
I/O
(24mA)
SD Bus Lines 7 through 0
XD[7:0]
97:92,
89, 88
I/O
(6mA)
XD Bus Data Lines 7 through 0: XD4 and XD1 must be sampled low during
reset to enter the 486 Notebook Mode. A 2.2K pull-down resistor is recommended on these lines. All XD lines in the 82C602A have internal weak pull-up
resistors and do not require any external pull-up resistors.
ATTRIS#
58
I
Tristates AT Bus Outputs: This is used to tristate the ISA bus during low
power mode.
ATCYC
70
I
AT Cycle Indication
C.3.1.5
Real-Time Clock and Keyboard Interface Signals
Signal Name
Pin
No.
Signal
(Drive)
Type
RTCAS
20
I
Real-time Clock Address Strobe: RTCAS is used to demultiplex the address/
data bus. The falling edge of AS latches the address on XD[7:0].
RTC_5V
57
I
Real-time Clock 5.0V: This pin must be connected to +5V during normal operation. As soon as this input drops below 4.0V, the RTC/CMOS RAM is protected from write accesses (read accesses will also be blocked).
VBATT
55
I
Voltage Battery: This pin is connected to the CMOS and RTC battery.
Signal Description
OPTi
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912-3000-016
Revision: 3.0
Page 255
Appendix C
Signal Name
Pin
No.
Signal
(Drive)
Type
IRQ8#
56
O
Interrupt Request Bit 8: The alarm output interrupt generated by the internal
RTC.
XTALIN
53
I
Crystal Oscillator Input: 32.768KHz XTAL input.
XTALOUT
54
O
Crystal Oscillator Output: 32.768KHz XTAL output.
KBCLK
21
I
Keyboard Clock: This input is used for demuxing interrupts and DMA
requests.
KBCLK2
24
I
Keyboard Clock / 2: This input is used for demuxing interrupts and DMA
requests.
KBDCS#
67
O
(6mA)
C.3.1.6
Signal Description
KBDCS# qualified with AEN: Allows the system to access the keyboard controller.
Miscellaneous Interface Signals
Signal Name
Pin
No.
NC
26
LATCH
49
I
Data Buffer Latch: This signal controls the latching of information on the data
bus.
AEN
77
I
Address Enable: This input is used to ensure that the system has access to
the real-time clock.
C.3.1.7
Signal
Type
Signal Description
No Connection: This pin should be left unconnected.
Power and Ground Pins
Pin
No.
Signal
Type
Signal Description
VCC
14, 41,
71, 91
P
Power Connection
GND
3, 15,
28, 40,
52, 66,
78, 90
G
Ground Connection
Signal Name
Legend:
G
I/O
G
OD
I/O
P
Sch
Ground
Input/Output
Ground
Open Drain
Input/Output
Power
Schmitt-trigger
OPTi
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Revision: 3.0
Appendix C
C.4
Schematics
Figure C-1 shows a schematic of the internal circuitry for the 82C602A when in the 486 Notebook Mode.
Figure C-11
82C602A Internal Circuitry in 486 Notebook Mode
OPTi
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912-3000-016
Revision: 3.0
Page 257
Appendix C
C.5
82C602A Mechanical Package Outline
The 82C602A is available in a 100-pin TQFP by special order for all notebook modes; default packaging is 100-pin PQFP
Figure C-12
82C602A 100-Pin Plastic Quad Flat Pack (PQFP)
OPTi
®
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912-3000-016
Revision: 3.0
Appendix C
Figure C-13
82C602A 100-Pin Thin Quad Pack (TQFP)
OPTi
®
912-3000-016
Revision: 3.0
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Appendix C
OPTi
®
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Revision: 3.0
OPTi
®
Sales Information
HEADQUARTERS:
OPTi Inc.
888 Tasman Drive
Milpitas, CA 95035
tel: 408-486-8000
fax: 408-486-8011
SALES OFFICES:
Japan
OPTi Japan KK
Murata Building 6F, 2-22-7
Ohhashi Meguro-ku
Tokyo 153, Japan
tel: 81-3-5454-0178
fax: 81-3-5454-0168
Taiwan
OPTi Inc.
9F, No 303, Sec 4, Hsin Yih Road
Taipei, Taiwan, ROC
tel: 886-2-325-8520
fax: 886-2-325-6520
United Kingdom & Europe
OPTi Inc.
30 Windmill Avenue
Bicester, Oxon OX6 7DY
U.K.
tel: + 44-1-869-369-161
fax: Same
United States
OPTi Inc.
4400 N. Federal Highway, Ste. #120
Boca Raton, FL 33431
tel: 561-395-4555
fax: 561-395-4554
OPTi Inc.
20405 State Highway 249, Ste. #220
Houston, TX 77070
tel: 281-257-1856
fax: 281-257-1825
Illinois
Micro-Tex, Inc.
1870 North Roselle Rd., Ste. #107
Schaumburg, IL 60195-3100
tel: 708-885-8200
fax: 708-885-8210
Massachusetts
S-J Associates, Inc.
267 Boston Road
Corporate Place, Ste. #3
N. Billerica, MA 01862
tel: 508-670-8899
fax: 508-670-8711
Michigan
Jay Marketing
44752 Helm Street., Ste. A
Plymouth, MI 48170
tel: 313-459-1200
fax: 313-459-1697
New Jersey
S-J Associates, Inc.
131-D Gaither Dr.
Mt. Laurel, NJ 08054
tel: 609-866-1234
fax: 609-866-8627
New York
S-J Associates, Inc.
265 Sunrise Highway
Rockville Centre, NY 11570
tel: 516-536-4242
fax: 516-536-9638
S-J Associates, Inc.
735 Victor-Pittsford
Victor, NY 14564
tel: 716-924-1720
North & South Carolina
REPRESENTATIVES:
Concord Component Reps
10608 Dunhill Terrace
Raleigh, NC 27615
tel: 919-846-3441
fax: 919-846-3401
United States
Ohio/W. Pennsylvania
Alabama/Mississippi
Concord Component Reps
190 Line Quarry Rd., Ste. #102
Madison, AL 35758
tel: 205-772-8883
fax: 205-772-8262
Florida
Engineered Solutions Ind., Inc.
1000 E. Atlantic Blvd., Ste. #202
Pompano Beach, FL 33060
tel: 305-784-0078
fax: 305-781-7722
Georgia
Concord Component Reps
6825 Jimmy Carter Blvd., Ste. #1303
Norcross, GA 30071
tel: 770-416-9597
fax: 770-441-0790
Lyons Corp.
4812 Fredrick Rd., Ste. #101
Dayton, OH 45414
tel: 513-278-0714
fax: 513-278-3609
Lyons Corp.
4615 W. Streetsboro
Richfield, OH 44286
tel: 216-659-9224
fax: 216-659-9227
Lyons Corp.
248 N. State St.
Westerville, OH 43081
tel: 614-895-1447
fax: Same
Texas
Axxis Technology Marketing, Inc.
701 Brazos, Suite 500
Austin, TX 78701
tel: 512-320-9130
fax: 512-320-5730
Axxis Technology Marketing, Inc.
6804 Ashmont Drive
Plano, TX 75023
tel: 214-491-3577
fax: 214-491-2508
India
Spectra Innovation
Unit S-822 Manipal Centre
47 Dickenson Road
Bangalore 560-042
Kamataka, India
tel: 91-80-558-8323/3977
fax: 91-80-558-6872
Israel
Ralco Components (1994) Ltd.
11 Benyamini St.
67443 Tel Aviv
Israel
tel: 972-3-6954126
fax: 972-3-6951743
Korea
S-J Associates, Inc.
900 S. Washington St., Ste. #307
Falls Church, VA 22046
tel: 703-533-2233
fax: 703-533-2236
Woo Young Tech Co., Ltd.
5th Floor Koami Bldg
13-31 Yoido-Dong
Youngduengpo-Ku
Seoul, Korea 150-010
tel: 02-369-7099
fax: 02-369-7091
Wisconsin
Singapore
Micro-Tex, Inc.
22660 Broadway, Ste. #4A
Waukesha, WI 53186
tel: 414-542-5352
fax: 414-542-7934
Instep Microsolutions Pte Ltd.
18, Tannery Lane, #05-02
Lian Tong Building
Singapore 347780
tel: 65-741-7507
fax: 65-741-1478
Virginia
International
Australia
South America
Braemac Pty. Ltd.
Unit 6, 111 Moore St., Leichhardt
Sydney, 2040 Australia
tel: 61-2-550-6600
fax: 61-2-550-6377
Uniao Digital
Rua Guido Caloi
Bloco B, Piso 3
Sao Paulo-SP, CEP 05802-140 Brazil
tel: 55-11-5514-3355
fax: 55-11-5514-1088
China
Switzerland
Legend Electronic Components. Ltd. Datacomp AG
Unit 413, Hong Kong Industrial
Silbernstrasse 10
Technology Centre
8953 Dietikon
72 Tat Chee Avenue
Switzerland
Kowloon Tong, Hong Kong
tel: 41-1-740-5140
tel: 852-2776-7708
fax: 41-1-741-3423
fax: 852-2652-2301
France
Tekelec Airtronic, France
5, Rue Carle Vernet
92315 Sevres Cedex
France
tel: 33-1-46-23-24-25
fax: 33-1-45-07-21-91
Germany
Kamaka
Rheinsrasse 22
76870 Kandel
Germany
tel: 49-7275-958211
fax: 49-7275-958220
United Kingdom
Spectrum
2 Grange Mews,
Station Road
Launton, Bicester
Oxfordshire,OX6 0DX
UK
tel: 44-1869-325174
fax: 44-1869-325175
MMD
3 Bennet Court,
Bennet Road
Reading
Berkshire, RG2 0QX
UK
tel: 44 1734 313232
fax: 44 1734 313255
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The information contained within this document is subject to change without notice. OPTi Inc. reserves the right to make changes in this manual at any time as well
as in the products it describes, at any time without notice or obligation. OPTi Inc. assumes no responsibility for any errors contained within. In no event will OPTi Inc.
be liable for any damages, direct, indirect, incidental or consequential resulting from any error, defect, or omission in this specification.
Copyright © 1997 by OPTi Inc. All rights reserved. OPTi is a trademark of OPTi Incorporated. All other brand and product names are trademarks or copyrights of
their respective owners.
OPTi Inc. · 888 Tasman Drive · Milpitas, CA 95035 · (408) 486-8000
OPTi Inc.
888 Tasman Drive
Milpitas, CA 95035
Tel: (408) 486-8000
Fax: (408) 486-8001
WWW: http://www.opti.com/