ETC HD74HC73FP

HD74HC73
Dual J-K Flip-Flops (with Clear)
Description
The flip-flop is edge sensitive to the clock input and change state on the negative going transition of the
clock pulse. Each flip-flop has independent, J, K, clock, and clear inputs and Q and Q outputs. Clear is
independent of the clock and accomplished by a low level on the input.
Features
•
•
•
•
•
High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF)
High Output Current: Fanout of 10 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 2 µA max (Ta = 25°C)
Function Table
Inputs
Outputs
Clear
Clock
J
K
Q
Q
L
X
X
X
L
H
H
L
L
No change
H
L
H
L
H
H
H
L
H
L
H
H
H
Toggle
H
L
X
X
No change
H
H
X
X
No change
X
X
No change
H
HD74HC73
Pin Arrangement
14 1J
1CK 1
CLR
1CLR 2
1K 3
J
Q
13 1Q
CK
K
Q
12 1Q
11 GND
VCC 4
2CK 5
K
2CLR 6
J
Q
10 2K
Q
9 2Q
CK
CLR
2J 7
8 2Q
(Top view)
Block Diagram
Q
CLR
J
CK
CK
Q
K
CK
CK
CK
CK
CK
2
CK
CK
CK
CK
HD74HC73
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –4 mA
6.0
5.68 —
—
5.63
—
I OH = –5.2 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 4 mA
6.0
—
—
0.26 —
0.33
I OL = 5.2 mA
VIL
Output voltage
VOH
VOL
Test Conditions
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
2.0
20
µA
Vin = VCC or GND, Iout = 0 µA
—
3
HD74HC73
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Maximum clock
f max
2.0
—
—
6
—
5
MHz
4.5
—
—
30
—
24
6.0
—
—
35
—
28
Propagation delay t PLH
2.0
—
—
150 —
190
time
4.5
—
18
30
—
38
6.0
—
—
26
—
33
2.0
—
—
140 —
175
4.5
—
18
28
—
35
6.0
—
—
24
—
30
2.0
80
—
—
100
—
4.5
16
8
—
20
—
6.0
14
—
—
17
—
2.0
100 —
—
125
—
4.5
20
3
—
25
—
6.0
17
—
—
21
—
2.0
5
—
—
5
—
4.5
5
–2
—
5
—
6.0
5
—
—
5
—
2.0
100 —
—
125
—
4.5
20
–3
—
25
—
6.0
17
—
—
21
—
frequency
Pulse width
Setup time
Hold time
Removal time
t PHL
tw
t su
th
t rem
Output rise/fall
t TLH
2.0
—
—
75
—
95
time
t THL
4.5
—
5
15
—
19
6.0
—
—
13
—
16
—
—
5
10
—
10
Input capacitance
4
Cin
ns
Test Conditions
Clock to Q or Q
Clear to Q or Q
ns
Clock, Clear
ns
Data to clock
ns
Clock to data
ns
Clear to clock
ns
pF
Unit: mm
19.20
20.32 Max
8
6.30
7.40 Max
14
1.30
7
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.39 Max
2.54 Min 5.06 Max
1
7.62
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-14
Conforms
Conforms
0.97 g
Unit: mm
10.06
10.5 Max
8
5.5
14
1
0.10 ± 0.10
1.42 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
7
+ 0.20
7.80 – 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DA
—
Conforms
0.23 g
Unit: mm
8.65
9.05 Max
8
1
7
*0.20 ± 0.05
0.635 Max
1.75 Max
3.95
14
+ 0.10
6.10 – 0.30
1.08
*0.40 ± 0.06
0.11
0.14 +– 0.04
0° – 8°
1.27
0.67
0.60 +– 0.20
0.15
0.25 M
*Pd plating
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DN
Conforms
Conforms
0.13 g
Unit: mm
4.40
5.00
5.30 Max
14
8
1
7
0.65
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.83 Max
0.07 +0.03
–0.04
*0.22+0.08
–0.07
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-14D
—
—
0.05 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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