ETC JAN2N6800

The documentation and process
conversion measures necessary to
comply with this revision shall be
completed by 09 March 1998
INCH-POUND
MIL-PRF-19500/557F
09 December 1997
SUPERSEDING
MIL-S-19500/557E
9 December 1994
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, FIELD EFFECT TRANSISTOR, N-CHANNEL, SILICON
TYPES 2N6796, 2N6796U, 2N6798, 2N6798U, 2N6800, 2N6800U, 2N6802, AND 2N6802U
JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for a N-channel, enhancement-mode, MOSFET, power transistor
intended for use in high density power switching applications. Three levels of product assurance are provided for each encapsulated
device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type.
1.2 Physical dimensions. See figure 1, TO-205AF (formerly TO-39), figure 3 (LCC), and figure 4 for JANHC and JANKC die
dimensions.
1.3 Maximum ratings. Unless otherwise specified, TA = +25(C.
Type
3/
PT 1/
PT
TC = +25(C TA = +25(C
2N6796
2N6798
2N6800
2N6802
VDS
VDG
VGS
ID1 2/
TC = +25(C
ID2 2/
TC = +100(C
IS
IDM
TJ and
TSTG
W
W
V dc
V dc
V dc
A dc
A dc
A dc
A(pk)
(C
25
25
25
25
0.8
0.8
0.8
0.8
100
200
400
500
100
200
400
500
20
20
20
20
8.0
5.5
3.0
2.5
5.0
3.5
2.0
1.5
8.0
5.5
3.0
2.5
32
22
14
11
-55 to +150
-55 to +150
-55 to +150
-55 to +150
1/ Derate linearly 0.2 W/(C for TC > +25(C.
TJ max - TC
PT =
RJC
ID =
2/
( RθJX)
T J( max ) - T C
x ( R DS(on) at T J( max )
3/ Electrical characteristics for "U" suffix devices are identical to the corresponding non"U" suffix devices unless otherwise specified.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad St., Columbus, OH
43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this
document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/557F
Ltr
CH
LC
LD
LU
HD
CD
TW
TL
LL
L1
L2
P
Q
r
a
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.160
.180
4.07
4.57
.200 TP
5.08 TP
.016
.021
0.41
0.53
.016
.019
0.41
0.48
.335
.370
8.51
9.40
.305
.335
7.75
8.51
.028
.034
0.71
0.86
.029
.045
0.74
1.14
.500
.750
12.70
19.05
.050
1.27
.250
6.35
.100
2.54
.050
1.27
.010
0.25
45 TP
45 TP
Notes
6
7,8
7,8
2
3
7,8
7,8
7,8
5
4
9
6
NOTES:
1. Dimensions are inches. Metric equivalents are given for general information only.
2. Beyond radius (r) maximum, TW shall be held for a minimum length of .011 inch (0.028 mm).
3. Dimension TL measured from maximum HD.
4. Outline in this zone is not controlled.
5. Dimension CD shall not vary more than .010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.
6. Leads at gauge plane .054 +.001, -.000 inch (1.37 +0.03, -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by
direct methods or by the gauge and gauging procedure shown on figure 2.
7. LU applies between L1 and L2. LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL min.
8. All three leads.
9. Radius (r) applies to both inside corners of tab.
10. Drain is electrically connected to the case.
11. In accordance with ANSI Y14.5M, diameters are equivalent to 1x symbology.
FIGURE 1. Physical dimensions for TO-205AF.
2
MIL-PRF-19500/557F
Ltr
1b1
1b2
e
e1
h
j
j1
k
k1
L
L1
S
Dimensions
Inches
Millimeters
Min Max Min
Max
.0595 .0605 1.511 1.537
.0325 .0335 0.826 0.851
.1995 .2005 5.067 5.093
.0995 .1005 2.527 2.553
.150 Nominal
3.81 Nominal
.0175 .0180 0.444 0.457
.0350 .0355 0.889 0.902
.009 .011
0.23
0.28
.125 Nominal
3.18 Nominal
.372 .378
9.45
9.60
.054 .055
1.37
1.40
.182 .199
4.62
5.05
44.90( 45.10( 44.90( 45.10(
Notes
2
NOTES:
1.
2.
3.
4.
5.
Dimensions are in inches. Metric equivalents are given for general information only.
The location of the tab locator within the limits indicated will be determined by the tab and flange dimensions of
the device being checked.
Gauging procedure. The device being measured shall be inserted until its seating plane is .125 .010 inch
(3.18 0.25 mm) from the seating surface of the gauge. A force of 8 .5 ounces shall then be applied parallel
and symmetrical to the device's cylindrical axis. When examined visually after the force application (the force
need not be removed), the seating plane of the device shall be seated against the gauge. The use of a pin
straightener prior to insertion in the gauge is permissible.
Gauging plane.
Drill angle.
FIGURE 2. Gauge for lead and tab locations.
3
MIL-PRF-19500/557F
NOTES:
1. Dimensions are in inches. Metric equivalents are
given for information only.
2. In accordance with ANSI Y14.5M, diameters are
equivalent to 1x symbology.
Sym.
BL
BW
CH
LL1
LL2
LS
LS1
LS2
LW
Q1
Q2
Q3
TL
TW
Inches
Min
.345
.280
.095
.040
.055
.360
.295
.115
.055
.065
.050 BSC
.025 BSC
.008 BSC
.020
.030
.105 REF
.120 REF
.045
.070
.120
.055
.080
.130
FIGURE 3. Physical dimensions for LCC.
4
Max
Millimeters
Min
8.77
7.12
2.42
1.02
1.40
Max
9.14
7.49
2.92
1.39
1.65
1.27 BSC
0.635 BSC
0.203 BSC
0.51
0.76
2.67 REF
3.05 REF
1.15
1.78
3.05
1.39
2.03
3.30
MIL-PRF-19500/557F
2N6796
2N6798
Inch
mm
.016
.018
.019
.025
.026
0.41
0.46
0.48
0.64
0.66
Inch
.031
.033
.034
.041
.106
mm
0.79
0.84
0.86
1.04
2.69
2N6800 and 2N6802
Inch
.116
.148
.180
.181
mm
2.95
3.76
4.57
4.60
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Unless otherwise specified, tolerance is .005 inch (0.13 mm).
4. The physical characteristics of the die are: the back metals are chromium, nickel, and silver. The
top metal is aluminum and the back contact is the drain.
5. Die thickness is .0187 inch (0.475 mm).
FIGURE 4. JANHCA and JANKCA die dimensions.
5
MIL-PRF-19500/557F
1.4 Primary electrical characteristics at TC = +25(C.
Type
2/
Min V(BR)DSS
VGS = 0 V dc
ID = 1.0 mA dc
VGS(th)1
VDS VGS
ID = 0.25 mA dc
Max IDSS1
VGS = 0 V dc
TJ = +25(C
at ID2
TJ = +150(C
at ID2
A dc
ohm
ohm
(C/W
25
25
25
25
0.18
0.40
1.00
1.50
0.39
0.84
2.78
4.00
5.0
5.0
5.0
5.0
VDS = 80
percent of
rated VDS
V dc
2N6796
2N6798
2N6800
2N6802
100
200
400
500
V dc
Min Max
2.0 4.0
2.0 4.0
2.0 4.0
2.0 4.0
RJC
maximum
Max rDS(on) 1/
VGS = 10 V dc
1/ Pulsed (see 4.5.1).
2/ Electrical characteristics for "U" suffix devices are identical to the corresponding non"U" suffix devices unless otherwise specified.
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.3).
SPECIFICATION
MILITARY
MIL-PRF-19500
- Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750
- Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Defense
Printing Service Detachment Office, Building 4D (Customer Service), 700 Robbins Avenue, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this
document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF19500 and as follows:
C ---------------------
Coulomb.
gFS - - - - - - - - - - - - - - - - - - - -
DC forward transconductance.
IS - - - - - - - - - - - - - - - - - - - - -
Source current through drain (forward biased VSD).
V(BR)DSS - - - - - - - - - - - - - - - - - -
Drain to source breakdown voltage, all other terminals short-circuited to source.
I(ISO) - - - - - - - - - - - - - - - - - -
Source pin to case isolation current.
6
MIL-PRF-19500/557F
3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500, and figures 1 (T0-39 ), 3 (LCC) and 4 (die) herein.
3.3.1 Lead material and finish. Lead material shall be Kovar, Alloy 52 (for the T0-205AF), and a copper or plated core is permitted.
Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired,
it shall be specified in the acquisition document (see 6.3).
3.3.2 Internal construction. Multiple chip construction shall not be permitted.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking of country of origin
may be omitted from the body of the transistor, but shall be retained on the initial container.
3.5 Electrostatic discharge protection. The devices covered by this specification require electrostatic protection.
3.5.1 Handling. MOS devices must be handled with certain precautions to avoid damage due to the accumulation of static charge.
The following handling practices shall be followed:
a.
Devices shall be handled on benches with conductive handling devices.
b.
Ground test equipment, tools, and personnel handling devices.
c.
Do not handle devices by the leads.
d.
Store devices in conductive foam or carriers.
e.
Avoid use of plastic, rubber, or silk in MOS areas.
f.
Maintain relative humidity above 50 percent, if practical.
g.
Care shall be exercised, during test and troubleshooting, to apply not more than maximum rated voltage to any lead.
h.
Gate must be terminated to source, R 100 k, whenever bias voltage is to be applied drain to source.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3, 1.4, and table I.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3.
3.8 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.2 ).
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. Alternate flow is allowed for
qualification inspection in accordance with MIL-PRF-19500.
4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-PRF-19500 and table II herein.
4.2.2 JANHC and JANKC die. Qualification shall be in accordance with MIL-PRF-19500.
7
MIL-PRF-19500/557F
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table IV of MIL-PRF-19500 and as
specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a minimum, die shall be
100-percent probed in accordance with group A, subgroup 2 except test current shall not exceed 20 A.
Screen (see table IV
of MIL-PRF-19500)
1/
1/
2/
3
9 1/
10
11
12
13
Measurement
JANS level
JANTX and JANTXV levels
Gate stress test (see 4.5.5)
Gate stress test (see 4.5.5)
Method 3161 (see 4.5.3)
Method 3161 (see 4.5.3)
Method 3470 (optional)
Method 3470 (optional)
Method 1051, test condition G
Method 1051, test condition G
IGSS1, IDSS1, subgroup 2 of table I
Subgroup 2 of table I herein
herein
Method 1042, test condition B
Method 1042, test condition B
IGSS1, IDSS1, rDS(on)1, VGS(th)1,
IGSS1, IDSS1, rDS(on)1,
subgroup 2 of table I herein;
VGS(th)1, subgroup 2 of table I
herein.
IGSS1 = 20 nA dc or 100 percent
of initial value, whichever is
greater.
IDSS1 = 25 A dc or 100 percent of
initial value, whichever is greater.
Method 1042, test condition A,
Method 1042, test condition A
t = 240 hours
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
IGSS1 = 20 nA dc or 100 percent of
IGSS1 = 20 nA dc or 100 percent of
initial value, whichever is greater.
initial value, whichever is greater.
IDSS1 = 25 A dc or 100 percent of
IDSS1 = 25 A dc or 100 percent of
initial value, whichever is greater.
initial value, whichever is greater.
rDS(on)1 = 20 percent of initial
rDS(on)1 = 20 percent of initial
value.
value.
VGS(th)1 = 20 percent of initial
VGS(th)1 = 20 percent of initial
value.
value.
1/ Shall be performed anytime before screen 10.
2/ Method 3470 is optional if performed as a sample in group A, subgroup 5.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. Alternate flow is allowed for
conformance inspection in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I herein. Electrical
measurements (end-points) shall be in accordance with the inspections of table I, group A, subgroup 2 herein.
8
MIL-PRF-19500/557F
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VIa (JANS) and table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein. Electrical measurements (end-points) shall
be in accordance with the inspections of table I, group A, subgroup 2 herein.
4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
3
1051
Test condition G.
4
1042
Test condition D; 2,000 cycles. The heating cycle shall be 1 minute minimum.
5
1042
Accelerated steady-state operation life; test condition A; VDS = rated TA = +175(C, t = 120
hours. Read and record V(BR)DSS (pre and post) at 1 mA = ID. Read and record IDSS
(pre and post). Deltas for V(BR)DSS shall not exceed 10 percent and IDSS shall not
exceed 25 A. Accelerated steady-state gate stress; condition B, VGS = rated, TA =
+175(C, t = 24 hours.
5
2037
Bond strength (Al-Au die interconnects only); test condition A.
6
3161
See 4.5.2.
4.4.2.2 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
2
1051
Test condition G.
3
1042
Test condition D, 2,000 cycles. The heating cycle shall be 1 minute minimum.
3
2037
Test condition A. All internal bond wires for each device shall be pulled separately.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) shall be in accordance with the inspections of table I,
group A, subgroup 2 herein.
Subgroup
Condition
Method
2
2036
Test condition E (Not required for LCC).
6
1042
Test condition D, 6,000 cycles. The heating cycle shall be 1 minute minimum.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
4.5.2 Thermal resistance. Thermal resistance measurements shall be performed in accordance with method 3161 of MIL-STD-750.
RJC(max) = 5.0(C/W.
a.
Measuring current (IM) - - - - - - - - - - - -
10 mA.
b.
Drain heating current (IH) - - - - - - - - - -
1 A minimum, (1.3 A minimum for LCC.)
c.
Heating time (tH) - - - - - - - - - - - - - -
Steady-state (see MIL-STD-750, method 3161 for definition).
d.
Drain-source heating voltage (VH) - - - - - -
25 V dc, (15 V dc minimum for LCC).
e.
Measurement time delay (tMD) - - - - - - - - -
10 to 80 s.
f.
Sample window time (tSW ) - - - - - - - - - - -
10 s maximum.
9
MIL-PRF-19500/557F
4.5.3 Thermal impedance ( ZJC measurements). The ZJC measurements shall be performed in accordance with
MIL-STD-750, method 3161. The maximum limit (not to exceed figure 5, thermal impedance cures and the group A, subgroup 2 limits)
for ZJC in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by means of statistical process control. When the
process has exhibited control and capability, the capability data shall be used to establish the fixed screening limit. In addition to
screening, once a fixed limit has been established, monitor all future sealing lots using a random five piece sample from each lot to be
plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for
engineering evaluation and disposition. This procedure may be used in lieu of an inline process monitor.
a.
Measuring current (IM) - - - - - - - - - - - -
10 mA.
b.
Drain heating current (IH) - - - - - - - - - -
1 A minimum , (1.3 A minimum for LCC.).
c.
Heating time (tH) - - - - - - - - - - - - - -
10 ms.
d.
Drain-source heating voltage (VH) - - - - - -
25 V dc minimum, , (15 V dc minimum for LCC).
e.
Measurement time delay (tMD) - - - - - - - - -
30 to 60 s.
f.
tSW sample window time - - - - - - - - - - - -
10 s (maximum).
4.5.4 Unclamped inductive switching.
a.
Peak current (ID) - - - - - - - - - - - - - - -
rated ID1.
b.
Peak gate voltage (VGS) - - - - - - - - - - - -
10 V dc.
c.
Gate to source resistor (RGS) - - - - - - - - -
256 RGS 2006.
d.
Initial case temperature (TC) - - - - - - - - -
+25(C +10(C, -5(C.
e.
Inductance (L) - - - - - - - - - - - - - - - -
100 H 10 percent.
f.
Number of pulses to be applied - - - - - - - -
1 pulse minimum.
g.
Pulse repetition rate - - - - - - - - - - - -
None.
4.5.5 Gate stress test.
VGS = 30 V dc minimum.
t = 250 s minimum.
10
MIL-PRF-19500/557F
TABLE I. Group A inspection.
Inspection 1/, 4/
Subgroup 1
Visual and mechanical
inspection
Subgroup 2
Thermal impedance 2/
Breakdown voltage,
drain to source
2N6796
2N6798
2N6800
2N6802
Gate to source voltage
(threshold)
Gate current
Drain current
Static drain to source
on-state resistance
2N6796
2N6798
2N6800
2N6802
Drain to source
on-state resistance
2N6796
2N6798
2N6800
2N6802
Forward voltage
(source drain diode)
2N6796
2N6798
2N6800
2N6802
Method
2071
3161
3407
3403
3411
3413
3421
3421
4011
MIL-STD-750
Conditions
See 4.5.3
VGS = 0 V dc; ID = 1.0 mA dc;
Bias condition C
VDS VGS;
ID = 0.25 mA dc
Bias condition C; VDS = 0 V dc;
VGS = +20 V dc and -20 V dc
VGS = 0; bias condition C;
VDS = 0 V dc; VDS = 80 percent
of rated VDS
VGS = 10 V dc; condition A;
pulsed (see 4.5.1); ID = ID2
VGS = 10 V dc; condition A;
pulsed (see 4.5.1); ID = ID1
Pulsed (see 4.5.1);
VGS = 0 V dc; IS = ID1
See footnotes at end of table.
11
Symbol
ZJC
V(BR)DSS
VGS(th)1
IGSS1
IDSS1
rDS(on)1
rDS(on)2
VSD
Min
100
200
400
500
2.0
Limits
Max
1.4
4.0
100
25
0.18
0.40
1.00
1.50
0.195
0.420
1.100
1.600
1.5
1.4
1.4
1.4
Unit
(C/W
V dc
V dc
V dc
V dc
V dc
nA dc
A dc
6
6
6
6
6
6
6
6
V dc
V dc
V dc
V dc
MIL-PRF-19500/557F
TABLE I. Group A inspection - Continued.
Inspection 1/, 4/
Subgroup 3
High temperature
operation:
Gate current
Drain current
Gate to source voltage
(threshold)
Static drain to source
on-state resistance
2N6796
2N6798
2N6800
2N6802
Low temperature
operation:
Gate to source voltage
(threshold)
Subgroup 4
Switching time test
Turn-on delay time
2N6796
2N6798
2N6800
2N6802
Rise time
2N6796
2N6798
2N6800
2N6802
Method
3411
3413
3403
3421
3403
3472
MIL-STD-750
Conditions
TC = TJ = +125(C
Bias condition C; VDS = 0 V dc;
VGS = +20 V dc and -20 V dc
Bias condition C;
VGS = 0 V dc;
VDS = 80 percent rated VDS
VDS VGS;
ID = 0.25 mA
VGS = 10 V dc;
pulsed (see 4.5.1); ID = ID2
TC = TJ = -55(C
VDS VGS;
ID = 0.25 mA
ID = rated ID1 (see 1.3);
VGS = +10 V dc; RG = 7.5 6;
VDD = 30 V dc
VDD = 77 V dc
VDD = 176 V dc
VDD = 225 V dc
VDD = 30 V dc
VDD = 77 V dc
VDD = 176 V dc
VDD = 225 V dc
See footnotes at end of table.
12
Symbol
IGSS2
IDSS2
VGS(th)2
rDS(on)3
VGS(th)3
td(on)
tr
Min
1.0
Limits
Max
200
.25
0.35
0.75
2.40
3.50
5.0
30
30
30
30
75
50
35
30
Unit
nA dc
mA dc
V dc
ohms
ohms
ohms
ohms
V dc
ns
ns
ns
ns
ns
ns
ns
ns
MIL-PRF-19500/557F
TABLE I. Group A inspection - Continued.
Inspection 1/, 4/
Subgroup 4 - Continued
Turn-off delay time
2N6796
2N6798
2N6800
2N6802
Fall time
2N6796
2N6798
2N6800
2N6802
Subgroup 5
Single pulse unclamped
inductive switching 3/
Electrical measurements
Safe operating area test
Electrical measurements
Subgroup 6
Not applicable
Subgroup 7
Gate charge
Test 1
On-state gate charge
2N6796
2N6798
2N6800
2N6802
Method
3470
3474
3471
MIL-STD-750
Conditions
VDD = 30 V dc
VDD = 77 V dc
VDD = 176 V dc
VDD = 225 V dc
VDD = 30 V dc
VDD = 77 V dc
VDD = 176 V dc
VDD = 225 V dc
See 4.5.4
See table I, group A,
subgroup 2
See figure 6;
VDS = 80 percent of rated VDS;
VDS 200 V dc maximum
tp = 10 ms
See table I, group A, subgroup 2
Condition B
See footnotes at end of table.
13
Symbol
td(off)
tf
Qg(on)
Min
Limits
Max
40
50
55
55
45
40
35
30
28.51
42.07
32.97
29.53
Unit
ns
ns
ns
ns
ns
ns
ns
ns
nC
nC
nC
nC
MIL-PRF-19500/557F
TABLE I. Group A inspection - Continued.
Inspection 1/, 4/
Subgroup 7 - Continued
Test 2
Gate to source charge
2N6796
2N6798
2N6800
2N6802
Test 3
Gate to drain charge
2N6796
2N6798
2N6800
2N6802
Reverse recovery time
2N6796
2N6798
2N6800
2N6802
Method
3473
Symbol
Qgs
Qgd
trr
MIL-STD-750
Conditions
VDD 50 V dc
di/dt 100 A/s;
IF = 8.0 A
di/dt 100 A/s;
IF = 5.5 A
di/dt 100 A/s;
IF = 3.0 A
di/dt 100 A/s;
IF = 2.5 A
Min
Limits
Max
6.34
5.29
5.75
4.46
16.59
28.11
16.59
28.11
300
500
700
900
Unit
nC
nC
nC
nC
nC
nC
nC
nC
ns
ns
ns
ns
1/ For sampling plan, see MIL-PRF-19500.
2/ This test is required for the following end-point measurements only (not intended for screen 13):
JANS - group B, subgroups 3 and 4
JAN, JANTX and JANTXV - group B, subgroups 2 and 3;
group C, subgroup 6;
group E, subgroup 1
3/ This test is optional if performed as a 100 percent screen.
4/ Electrical characteristics for "U" suffix devices are identical to the corresponding non"U" suffix devices unless otherwise specified.
14
MIL-PRF-19500/557F
TABLE II. Group E inspection (all quality levels) for qualification only.
Inspection 1/
Subgroup 1
Thermal shock
(temperature cycling)
Electrical measurements
Subgroup 2 2/
Steady-state reverse bias
Electrical measurements
Steady-state gate bias
Electrical measurements
Subgroup 3
Not applicable
Subgroup 4
Thermal resistance
Subgroup 5
Not applicable
Method
1051
1042
1042
3161
MIL-STD-750
Conditions
Condition G, 500 cycles
See table 1, group A, subgroup 2
Condition A; 1,000 hours
See table 1, group A, subgroup 2
Condition B; 1,000 hours
See table 1, group A, subgroup 2
RJC = 5.0(C/W maximum, see 4.5.2
1/ JANHC and JANKC devices are qualified in accordance with MIL-PRF-19500.
2/ A separate sample may be pulled for each test.
15
Qualification
conformance
inspection
45 devices, c = 0
45 devices, c = 0
5 devices, c = 0
MIL-PRF-19500/557F
FIGURE 5. Normalized transient thermal impedance.
16
MIL-PRF-19500/557F
2N6796, 2N6796U
FIGURE 6. Maximum safe operating area.
17
MIL-PRF-19500/557F
2N6798, 2N6798U
FIGURE 6. Maximum safe operating area - Continued.
18
MIL-PRF-19500/557F
118
FIGURE 6. Maximum safe operating area - Continued.
19
MIL-PRF-19500/557F
2N6802, 2N6802U
FIGURE 6. Maximum safe operating area - Continued.
20
MIL-PRF-19500/557F
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When
actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to
ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity
within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is
available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-PRF-19500.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Cross-reference and complement list. Parts from this specification may be used to replace the following commercial Part or
Identifying Number (PIN). The term PIN is equivalent to the term part number which was previously used in this specification.
Preferred types 1/
2N6796
2N6798
2N6800
2N6802
2N6796U
2N6798U
2N6800U
2N6802U
Commercial types
IRFF130, IRFF131, IRFF132, IRFF133
IRFF230, IRFF231, IRFF232, IRFF233
IRFF330, IRFF331, IRFF332, IRFF333
IRFF430, IRFF431, IRFF432, IRFF433
IRFE130, IRFE131, IRFE132, IRFE133
IRFE230, IRFE231, IRFE232, IRFE233
IRFE330, IRFE331, IRFE332, IRFE333
IRFE430, IRFE431, IRFE432, IRFE433
1/ Prefixes are JAN, JANTX, JANTXV, or JANS
6.3 Acquisition requirements. Acquisition documents should specify the following:
a.
Issue of DODISS to be cited in the solicitation (see 2.1.1 and 2.2).
b.
The lead finish as specified (see 3.3.1).
c.
For die acquisition, specify the JANHC or JANKC letter version (see figure 3).
d.
Type designation and quality assurance level.
6.4 Suppliers of JANHC and JANKC die. The qualified die suppliers with the applicable letter version (example, JANHCA2N6802) will
be identified on the QPL.
6.5 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of
award of contract, qualified for inclusion in Qualified Products List QPL-19500 whether or not such products have actually been so listed
by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the
products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded
contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be
obtained from Defense Supply Center Columbus, DSCC-VQE, Columbus, OH 43216.
6.6 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous
issue due to the extensiveness of the changes.
21
MIL-PRF-19500/557F
CONCLUDING MATERIAL
Custodians:
Army - CR
Navy - EC
Air Force - 17
Preparing activity:
DLA - CC
(Project 5961-1928)
Review activities:
Army - AR, MI, SM
Navy - AS, CG, MC
Air Force - 19, 70, 80, 85
22
MIL-PRF-19500/557F
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
INSTRUCTIONS
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision
letter should be given.
2. The submitter of this form must complete blocks 4, 5, 6, and 7.
3. The preparing activity must provide a reply within 30 days from receipt of the form.
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of
requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to
waive any portion of the referenced document(s) or to amend contractual requirements.
I RECOMMEND A CHANGE:
1. DOCUMENT NUMBER
MIL-PRF-19500/557F
2. DOCUMENT DATE
(YYMMDD) 97/12/09
3. DOCUMENT TITLE
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as
needed.)
5. REASON FOR RECOMMENDATION
6. SUBMITTER
a. NAME (Last, First, Middle initial)
b. ORGANIZATION
c. ADDRESS (Include Zip Code)
d. TELEPHONE (Include Area Code)
(1) Commercial
7. DATE SUBMITTED
(YYMMDD)
(2) AUTOVON
(If applicable)
8. PREPARING ACTIVITY
a. NAME
Alan Barone
b. TELEPHONE (Include Area Code)
(1) Commercial
(2) AUTOVON
614-692-0510
850-0510
c. ADDRESS (Include Zip Code)
Defense Supply Center Columbus
ATTN: DSCC-VAT
Columbus, OH 43216-5000
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:
Defense Quality and Standardization Office
5203 Leesburg Pike, Suite 1403,
Falls Church, VA 22041-3466
Telephone (703) 756-2340 AUTOVON 289-2340
DD Form 1426, OCT 89
Previous editions are obsolete
23
198/290