The documentation and process conversion measures necessary to comply with this revision shall be completed by 5 December 1997. INCH POUND MIL-PRF-19500/510C 5 September 1997 SUPERSEDING MIL-S-19500/510B 18 April 1995 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER TYPES 2N6249, 2N6250, AND 2N6251 JAN, JANTX, JANTXV, JANS, JANHC AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for NPN, silicon power transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. 1.2 Physical dimensions. See figure 1 (Similar to TO-3) and figure 2 (JANHC and JANKC). 1.3 Maximum ratings. PT 1/ TA = +25(C W 2N6249 5.5 2N6250 5.5 2N6251 5.5 Type PT 2/ TC = +25(C W 175 175 175 VCBO V dc 300 375 450 1/ Derate linearly at 34.2 mW/(C for TA > 25(C. 2/ Derate linearly at 1.0 W/(C for TC > 25(C. VCEO V dc 200 275 350 VEBO V dc 6.0 6.0 6.0 IC A dc 10 10 10 IB A dc 5.0 5.0 5.0 Top and TSTG (C -55 to +200 R JC max (C/W 1.0 1.0 1.0 1.4 Primary electrical characteristics at TA = 25(C. Types 2N6249 2N6250 2N6251 Limits Minimum Maximum Minimum Maximum Minimum Maximum hFE IC = 10 A dc VCE = 3 V dc 10 50 8 50 6 50 Cobo VCB= 10 V dc IE = 0 V dc 100 kHz f 1 Mhz pF 500 500 500 hfe VCE = 10 V dc IC = 1 A dc f = 1 MHz 2.5 15.0 2.5 15.0 2.5 15.0 Pulse response ton toff µs µs 2.0 4.5 2.0 4.5 2.0 4.5 Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad St., Columbus, OH 43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/510C Symbol CD CH HR HR1 HT LD LL L1 MHD MHS PS PS1 S1 Min Max .875 .250 .450 .495 .525 .131 .188 .050 .135 .038 .053 .312 .500 -- .050 .151 .161 1.177 1.197 .420 .440 .205 .225 .665 .675 Inches Millimeters Min 6.35 12.57 3.33 1.27 0.97 7.92 --- 3.84 29.90 10.67 5.21 16.64 Max 22.23 11.43 13.34 4.78 3.43 1.35 12.70 1.27 4.09 30.40 11.18 5.72 17.15 Note 3, 5 3 5 2 2, 3 2 NOTES: 1. Dimension are in inches. Metric equivalents are given for general information only. 2. These dimensions should be measured at points .050 (1.27 mm) to .055 (1.40 mm) below seating plane. When gage is not used, measurement will be made at seating plane. 3. Two leads. 4. Collector shall be electrically connected to the case. 5. LD applies between L1 and LL max. Diameter is uncontrolled in L1. FIGURE 1. Physical dimensions (similar to T0-3). 2 MIL-PRF-19500/510C Symbol A, C Dimension Millimeters Min Max 5.29 6.05 Inches Min .228 DESIGN DATA Max Metallization: .238 Top: . . . . . . . . . . Aluminum 40,000 Å minimum, 50,000 Å nominal Back: . . . . . . . . . . Gold 2,500 Å minimum, 3,000 Å nominal Back side . . . . . . . . Collector Chip thickness . . . . . . 10 mils ±2 mils Bonding pad : B = .016 (0.41 mm) x .060 (1.52 mm). E = .016 (0.41 mm) x .070 (1.78 mm). FIGURE 2. JANC (A-version) die dimensions. 3 MIL-PRF-19500/510C 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-19500. 3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in MIL-PRF-19500, and figures 1 (T0-3 ) and 2 (die) herein. 3.3.1 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. 3.4 Marking. Devices shall be marked in accordance with MIL-PRF-19500. At the option of the manufacturer, the marking of the country of origin may be omitted from the body of the transistor. 3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4, and table I. 3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3. 3.7 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.2 ). 4. VERIFICATION 4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3) c. Conformance inspection (see 4.4). 4 MIL-PRF-19500/510C 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.2.1 JANHC and JANKC devices. Qualification for JANHC and JANKC devices shall be in accordance with MIL-PRF-19500. 4.3 Screening (JANS, JANTX, AND JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (table IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table IV of MIL-PRF-19500) 9 11 12 13 Measurement JANS level JANTX and JANTXV levels ICEX1 and hFE1 ICEX1 and hFE1 ICEX1 and hFE1 ICEX1 and hFE1; ICEX1 = 100 percent of initial value or 10 µA dc, whichever is greater; hFE1 = ±15 percent. See 4.3.1 See 4.3.1 Subgroups 2 and 3 of table I Subgroup 2 of table I herein; ICEX1 = 100 percent of herein; ICEX1 = 100 percent of initial value or 10 µA dc, initial value or 10 µA dc, whichever is greater; whichever is greater; hFE1 = ±25 percent of hFE1 = ±25 percent of initial value. initial value. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 100 V dc TJ = +187.5(C ±12.5(C 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein. Group A inspection shall be performed on each sublot. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table VIa (JANS) and table VIb (JAN, JANTX, JANTXV), of MIL-PRF-19500. Electrical measurements (end points) shall be in accordance with table I, group A, subgroup 2 herein. 5 MIL-PRF-19500/510C 4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500. Subgroup Method Condition B3 2037 Test condition A, all internal leads for each device shall be pulled separately. B4 1037 VCE 20 V dc minimum; ton = toff = 3 minutes minimum for 2,000 cycles. B5 1027 VCB = 10 V dc minimum; TA = +150(C maximum. B6 3131 See 4.5.2. 4.4.2.2 Group B inspection, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup Method Condition B3 1031 VCE 20 V dc minimum; ton = toff = 3 minutes minimum for 2,000 cycles. B5 3131 See 4.5.2. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table VII of MIL-PRF-19500. Electrical measurements (end points) shall be in accordance with table I, group A, subgroup 2 herein. 4.4.3.1 Group C inspection, table V of MIL-PRF-19500. Subgroup Method Condition C2 2036 Test condition A; weight - 10 pounds; time - 15 seconds. C3 2016 Non-operating 1,500 G; 0.5 ms, 5 blows in each orientation: X1, Y1, Y2, Z1 (total 20 blows) C6 1026 VCE = 20 V dc; TJ = +187.5(C ±12.5(C; ton = toff = 3 minutes minimum or 6,000 cycles. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.5.2 Thermal resistance. Thermal resistance measurement shall be conducted in accordance with test method 3131 of MIL-STD-750. The following details shall apply: a. Collector current magnitude during power applications shall be 3.0 A dc. b. Collector to emitter voltage magnitude shall be 10 V dc. c. Reference temperature measuring point shall be the case. d. Reference point temperature shall be 25(C tr 75(C and recorded before the test is started. e. Mounting arrangement shall be with heat sink to header. f. Maximum limit for RJC shall be 1.0(C/W. 4.5.3 Coil selection for safe operating area (SOAR) tests. In selecting coils for use in the clamped and unclamped inductive SOAR tests, prime consideration should be given to the recommended commercially available coil. However, due to the extreme critical nature of the coil in these circuits and the wide tolerance of some commercially available coils (+100, -50 percent), it shall be the semiconductor manufacturer's responsibility, to prove upon request, compliance or equivalency of any coil used (commercial or in-plant designed) to within (+20,-10 percent), of the specified inductance at the rated current and dc resistance. 6 MIL-PRF-19500/510C TABLE I. Group A inspection. Inspection 1/ Subgroup 1 Visual and mechanical examination Subgroup 2 Breakdown voltage, collector to emitter 2N6249 2N6250 2N6251 Breakdown voltage, collector to emitter 2N6249 2N6250 2N6251 Emitter to base cutoff current Collector to emitter cutoff current 2N6249 2N6250 2N6251 Collector to emitter cutoff current 2N6249 2N6250 2N6251 Collector to base cutoff current 2N6249 2N6250 2N6251 Forward-current transfer ratio 2N6249 2N6250 2N6251 Method 2071 3011 3011 3061 3041 3041 3036 3076 MIL-STD-750 Conditions Bias condition D, IC = 200 mA dc, L = 42 mH; f = 30-60 Hz (see figure 3) Bias condition B, IC = 200 mA dc L = 14 mH; f = 30-60 Hz; RBE = 50 ohms (see figure 3) Bias condition D, VEB = 6 V dc Bias condition D VCE = 150 V dc VCE = 225 V dc VCE = 300 V dc Bias condition A, VBE = -1.5 V dc VCE = 225 V dc VCE = 300 V dc VCE = 375 V dc Bias condition D VCB = 300 V dc VCB = 375 V dc VCB = 450 V dc VCE = 3 V dc; IC = 10 A dc; pulsed (see 4.5.1) See footnotes at end of table. 7 Symbol V(BR)CEO V(BR)CER IEBO ICEO ICEX ICBO hFE Limits Min 200 275 350 225 300 375 10 8 6 Max 100 1.0 1.0 1.0 100 100 100 0.5 0.5 0.5 50 50 50 Unit V dc V dc V dc V dc V dc V dc µA dc mA dc mA dc mA dc µA dc µA dc µA dc mA dc mA dc mA dc MIL-PRF-19500/510C TABLE I. Group A inspection - Continued. Inspection 1/ Subgroup 2 - Continued Collector to emitter saturation voltage 2N6249 2N6250 2N6251 Base to emitter saturation voltage 2N6249 2N6250 2N6251 Subgroup 3 High temperature operation Collector to emitter cutoff current 2N6249 2N6250 2N6251 Low-temperature operation Forward-current transfer ratio 2N6249 2N6250 2N6251 Subgroup 4 Pulse response: Turn-on time 2N6249 2N6250 2N6251 Method 3071 3066 3041 3076 3251 MIL-STD-750 Conditions IC = 10 A dc; pulsed (see 4.5.1) IB = 1.0 A dc IB = 1.25 A dc IB = 1.67 A dc Test condition A; IC = 10 A dc; pulsed (see 4.5.1) IB = 1.0 A dc IB = 1.25 A dc IB = 1.67 A dc TA = +125(C Bias condition A, VBE = -1.5 V dc VCE = 225 V dc VCE = 300 V dc VCE = 375 V dc TA = -55(C VCE = 3.0 V; IC = 10 A dc; pulsed (see 4.5.1) Test condition A except test circuit and pulse requirements in accordance with figure 4. VCC = 200V dc; IC = 10 A dc IB = 1.0 A dc IB = 1.25 A dc IB = 1.67 A dc See footnotes at end of table. 8 Symbol VCE(SAT) VBE(SAT) ICEX1 ton Limits Min Max 1.5 1.5 1.5 2.25 2.25 2.25 1 1 1 5 4 3 2.0 2.0 2.0 V dc V dc V dc V dc V dc V dc mA dc mA dc mA dc µs µs µs Unit MIL-PRF-19500/510C TABLE I. Group A inspection - Continued. Inspection 1/ Subgroup 4 - Continued Turn-off time 2N6249 2N6250 2N6251 Magnitude of small signal short circuit forward current transfer ratio Open capacitance open circuit Subgroup 5 Safe operating area (dc operation) Test 1 Test 2 Test 3 Test 4 Test 5 Test 6 Subgroup 6 Safe operating area (switching) Test 1 Method 3306 3236 3051 3053 MIL-STD-750 Conditions VCC = 200 V dc; IC = 10 A dc IB = 1.0 A dc IB = 1.25 A dc IB = 1.67 A dc VCE = 10 V dc; IC = 1.0 A dc; f = 1 MHz VCB = 10 V dc; IC = 0; 100 kHz f 1 MHz TC = +25(C; t = 1 s; 1 cycle (see figure 5) IC = 10 A dc; VCE = 17.5 V dc IC = 5.8 A dc; VCE = 30 V dc IC = 0.3 A dc; VCE = 100 V dc 2N6249 only: IC = 0.13 A dc VCE = 200 V dc 2N6250 only: IC = 0.09 A dc VCE = 275 V dc 2N6251 only: IC = 0.065 A dc VCE = 350 V dc Load condition C; (unclamped inductive load) see figure 6 TC = +25(C; duty cycle 10 percent; Rs = 0.1 ; tp 5 ms (vary to obtain IC); RBB1 = 2 VBB1 = 10 V dc RBB2 = 50 VBB2 = 4 V dc VCC = 10 V dc IC = 10 A dc L = 50 µH at 10 A dc 6 6 6 See footnotes at end of table. 9 Symbol toff hFE Cobo Limits Min Max 4.5 4.5 4.5 2.5 15 500 Unit µs µs µs pF MIL-PRF-19500/510C TABLE I. Group A inspection - Continued. Inspection 1/ Subgroup 6 - Continued Test 2 Subgroup 7 Safe operating area (switching) Method MIL-STD-750 Conditions tp 5 ms (vary to obtain IC); RBB1 = 40 VBB1 = 10 V dc RBB2 = 50 VBB2 = 4 V dc VCC = 10 V dc IC = 2.0 A dc L = 500 µH at 2.0 A dc RL .01 (See figure 7) TC = +25(C; duty cycle 10 percent; tp 5 ms (vary to obtain IC); Rs = 0.1 VCC = 10 V dc IC = 10 A dc Clamp voltage: 2N6249 = 200 V dc 2N6250 = 275 V dc 2N6251 = 350 V dc 6 6 6 6 1/ For sampling plan, see MIL-PRF-19500. 10 Symbol Limits Min Max Unit MIL-PRF-19500/510C NOTE: The sustaining voltages VCEO and VCER are acceptable when the traces fall to the right of point "A" for type 2N6249, point "B" for type 2N6250, and point "C" for type 2N6251 (IC = 0.2 A). FIGURE 3. VCEO, VCER measurement circuit. 11 MIL-PRF-19500/510C NOTES: 1. The rise time (tr) and fall time (tf) of the applied pulse shall be each < 20 ns, duty cycle 2 percent; generator source impedance shall be 50 ohms; pulse width = 20 µs. 2. Output sampling oscilloscope; Zin 100 k6; Cin 50 pF, rise time < 2 ns. FIGURE 4. Pulse response test circuit. 12 MIL-PRF-19500/510C FIGURE 5. Maximum safe operating area graph (continuous dc). 13 MIL-PRF-19500/510C FIGURE 6. Safe operating area for switching between saturation and cutoff (unclamped inductive load). 14 MIL-PRF-19500/510C NOTES: 1. Either a clamping circuit or clamping diode may be used. 2. The coil used shall provide a minimum inductance of 50 µH at 10 A with a maximum dc resistance of 0.16 (see 4.5.3). 3. RS 0.16, 12 W, 1 percent tolerance maximum (noninductive). Procedure: 1. With switch S1 closed, set the specified test conditions. 2. Open S1. Device fails if clamp voltage not reached and maintained until the current returns to zero. 3. Perform specified end-point tests. FIGURE 7. Clamped inductive sweep test circuit. 15 MIL-PRF-19500/510C 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Issue of DODISS to be cited in the solicitation and, if required, the specific issue of individual documents referenced (see 2.2.1). b. Lead finish (see 3.3.1). c. Type designation and product assurance level. d. Packaging requirements (see 5.1). 6.3 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Products List QPL-19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center Columbus, DSCC-VQE, Columbus, OH 43216. 6.5 Suppliers of JANC die. The qualified JANC suppliers with the applicable letter version (example, JANHCA6249) will be identified on the QPL. The Part or Identifying Number (PIN) is listed below: PIN 2N6249 2N6250 2N6251 JANC ordering information Manufacturer 33178 A6249 A6250 A6251 CONCLUDING MATERIAL Custodians: Air Force - 17 Preparing activity: DLA-CC Review activities: Air Force - 19, 85, 99 (Project 5961-1820) 16 MIL-PRF-19500/510C 67$1'$5',=$7,21'2&80(17,03529(0(17352326$/ INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. ,5(&200(1'$&+$1*( 1. DOCUMENT NUMBER MIL-PRF-19500/510C 2. DOCUMENT DATE (YYMMDD) 97/09/05 3. DOCUMENT TITLE SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER TYPES 2N6249, 2N6250, AND 2N6251 JAN, JANTX, JANTXV, JANS, JANHC AND JANKC 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) b. ORGANIZATION c. ADDRESS (Include Zip Code) d. TELEPHONE (Include Area Code) (1) Commercial 7. DATE SUBMITTED (YYMMDD) (2) AUTOVON (If applicable) 8. PREPARING ACTIVITY a. NAME Alan Barone b. TELEPHONE (Include Area Code) (1) Commercial (2) AUTOVON 614-692-0510 850-0510 c. ADDRESS (Include Zip Code) Defense Supply Center Columbus ATTN: DSCC-VAT Columbus, OH 43216-5000 IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Quality and Standardization Office 5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466 Telephone (703) 756-2340 AUTOVON 289-2340 '')RUP2&7 Previous editions are obsolete 198/290