ETC NCP4413P

NCP4413, NCP4414
3 A High-Speed MOSFET
Drivers
The NCP4413/4414 are 3 A CMOS buffer/drivers. They will not
latch up under any conditions within their power and voltage ratings.
They are not subject to damage when up to 5 V of noise spiking of
either polarity that occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current of either
polarity being forced back into their output. All terminals are fully
protected against up to 4 kV of electrostatic discharge.
As MOSFET drivers, the NCP4413/4414 can easily switch
1800 pF gate capacitance in 20 nsec with matched rise and fall times,
and provide low enough impedance in both the ON and the OFF
states to ensure the MOSFET’s intended state will not be affected,
even by large transients. The rise and fall time edges are matched to
allow driving short–duration inputs with greater output accuracy.
http://onsemi.com
MARKING
DIAGRAM
8
SO–8
D SUFFIX
CASE 751
8
1
1
8
Features
•
•
•
•
•
•
•
•
•
•
•
NCP
441x
YWWXZ
Latch–up Protected: Will Withstand 500 mA Reverse Current
Input Will Withstand Negative Inputs Up to 5 V
ESD Protected (4 kV)
High Peak Output Current (3 A)
Wide Operating Range (4.5 V to 16 V)
High Capacitive Load Drive Capability (1800 pF in 20 nsec)
Short Delay Time (35 nsec Typ)
Consistent Delay Times with Changes in Supply Voltage
Matched Delay Times
Low Supply Current
With Logic “1” Input (500 A)
With Logic “0” Input (100 A)
Low Output Impedance (2.7 )
m
m
W
8
1
1
x
= Device Number (3 or 4)
YY, Y = Year
WW, W = Work Week
X
= Assembly ID Code
Z
= Subcontractor ID Code
CO
= Country of Origin
ORDERING INFORMATION
Device
Package
Shipping
NCP4413DR2
Inverting
SO–8
2500 Tape & Reel
PDIP–8
50 Units/Rail
NCP4414DR2
Non–Inverting
SO–8
2500 Tape & Reel
NCP4414P
Non–Inverting
PDIP–8
50 Units/Rail
NCP4413P
Inverting
Functional Block Diagram
VDD
NCP4413
INVERTING
OUTPUTS
NCP441x
YYWWXZ
CO
PDIP–8
P SUFFIX
CASE 626
300 mV
OUTPUT
NONINVERTING
OUTPUTS
INPUT
4.7 V
NCP4414
GND
EFFECTIVE
INPUT
C = 10 pF
 Semiconductor Components Industries, LLC, 2000
June, 2000 – Rev. 0
Powered by ICminer.com Electronic-Library Service CopyRight 2003
1
Publication Order Number:
NCP4413/D
NCP4413, NCP4414
PIN CONNECTIONS
8–Pin SOIC/PDIP–8
VDD
1
IN
2
NC
3
GND
4
NCP4413
8
VDD
7
OUT
6
OUT
5
GND
8–Pin SOIC/PDIP–8
2
VDD
1
6, 7
INVERTING
IN
2
NC
3
GND
4
(Top View)
(Top View)
NC = NO INTERNAL CONNECTION
http://onsemi.com
2
Powered by ICminer.com Electronic-Library Service CopyRight 2003
NCP4414
8
VDD
7
OUT
6
OUT
5
GND
2
6, 7
NONINVERTING
NCP4413, NCP4414
ABSOLUTE MAXIMUM RATINGS*
Symbol
Value
Unit
Supply Voltage
Rating
VDD
+20
V
Input Voltage, IN A or IN B
VIN
VDD + 0.3 to GND – 5.0
V
+150
°C
Maximum Chip Temperature
Storage Temperature Range
Tstg
–65 to +150
°C
Lead Temperature (Soldering, 10 sec)
TSOI
+300
°C
Package Thermal Resistance
SOIC
SOIC
RθJA
RθJC
155
45
Operating Temperature Range
TA
–40 to +85
°C
Power Dissipation (TA
SOIC
PD
470
mW
°C/W
v 70°C)
*Static–sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses
above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions above those indicated in the operation section of the specifications is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS (Over operating temperature range with 4.5 V
v
v
VDD
16 V, unless otherwise specified.
Typical values are measured at TA = 25°C; VDD = 16 V.)
Characteristic
Symbol
Test Conditions
Min
Typ
Logic 1 High Input Voltage
VIH
–
2.0
Logic 0 Low Input Voltage
VIL
–
–
Input Current
IIN
Max
Unit
–
–
V
–
0.8
V
–1.0
–10
–
–
1.0
10
Input
0V
v VIN v VDD
TA = 25°C
– 40°C
TA
v v 85°C
mA
Output
High Output Voltage
VOH
DC Test
VDD – 0.025
–
–
V
Low Output Voltage
VOL
DC Test
–
–
0.025
v
Output Resistance
RO
–
–
2.7
3.3
4.0
5.0
Peak Output Current
IPK
VDD = 16 V
–
3.0
–
A
IREV
Duty Cycle
2%
t
300 sec
0.5
–
–
A
Rise Time
tR
Figure 1
TA = 25°C
– 40°C
TA
–
–
20
24
28
33
nsec
Fall Time
tF
Figure 1
TA = 25°C
– 40°C
TA
–
–
20
24
28
33
nsec
Delay Time
tD1
Figure 1
TA = 25°C
– 40°C
TA
–
–
35
40
45
50
nsec
Delay Time
tD2
Figure 1
TA = 25°C
– 40°C
TA
–
–
35
40
45
50
nsec
IS
VIN = 3 V
VIN = 0 V
–
–
0.5
0.1
1.0
0.15
mA
Latch–Up Protection
Withstand Reverse Current
VDD = 16 V, IO = 10 mA TA = 25°C
– 40°C
TA
v v 85°C
v
v
m
VDD = 16 V
W
Switching Time (Note 1.)
v v 85°C
v v 85°C
v v 85°C
v v 85°C
Power Supply
Power Supply Current
VDD = 16 V
1. Switching times are guaranteed by design.
http://onsemi.com
3
Powered by ICminer.com Electronic-Library Service CopyRight 2003
NCP4413, NCP4414
+5 V
INPUT
VDD = 16 V
0V
4.7 µF
0.1 µF
10%
V DD
1, 8
tD1
tD2
tF
tR
90%
90%
OUTPUT
2
INPUT
90%
6, 7
10%
0V
OUTPUT
10%
Inverting Driver
NCP4413
CL = 1800 pF
NCP4413
NCP4414
+5 V
90%
INPUT
4, 5
0V
10%
V DD
INPUT: 100 kHz, square wave,
tRISE = tFALL≤10 nsec
90%
tD1
OUTPUT
10%
0V
tR
90%
tD2
tF
10%
Noninverting driver
NCP4414
Figure 1. Switching Time Test Circuit
1600
MAX. POWER (mV)
1400
1200
1000
800
8 Pin SOIC
600
400
200
0
0
10
20
30
40
50
60
70
AMBIENT TEMOERATURE (°C)
Figure 2. Thermal Derating Curves
http://onsemi.com
4
Powered by ICminer.com Electronic-Library Service CopyRight 2003
80
90
100
110
120
NCP4413, NCP4414
TYPICAL CHARACTERISTICS
500
500
400
400
VIN = 3 V
I SUPPLY (m A)
I SUPPLY (m A)
VIN = 3 V
300
200
100
0
6
8
10
12
VDD (VOLTS)
14
200
VIN = 0 V
100
VIN = 0 V
4
300
0
–40
16
60
80
1.6
1.5
VTHRESHOLD,(VOLTS)
VTHRESHOLD,(VOLTS)
1.6
VIH
1.4
1.3
VIL
1.2
1.1
4
6
8
10
12
VDD (VOLTS)
14
1.5
VIH
1.4
1.3
VIL
1.2
1.1
–40
16
9
8
8
7
7
R ds, (ON) W
9
6
TA = 85°C
5
–20
0
20
40
TEMPERATURE (°C)
60
80
Figure 6. Input Threshold vs. Temperature
VSUPPLY = 16 V
Figure 5. Input Threshold vs. Supply Voltage
TA = 25°C
R ds, (ON) W
0
20
40
TEMPERATURE (°C)
Figure 4. Quiescent Supply Current
vs. Temperature
VSUPPLY = 16 V
Figure 3. Quiescent Supply Current
vs. Supply Voltage
TA = 25°C
TA = 25°C
4
3
6
TA = 85°C
5
TA = 25°C
4
3
2
1
–20
2
TA = – 40°C
4
6
8
10
12
14
1
16
TA = – 40°C
4
VDD (VOLTS)
8
10
12
14
VDD (VOLTS)
Figure 7. High–State Output Resistance
Figure 8. Low–State Output Resistance
http://onsemi.com
5
Powered by ICminer.com Electronic-Library Service CopyRight 2003
6
16
NCP4413, NCP4414
70
70
60
60
50
50
T FALL,(nsec)
TRISE,(nsec)
TYPICAL CHARACTERISTICS
TA = 85°C
40
30
TA = 25°C
20
TA = 85°C
40
30
TA = 25°C
20
TA = – 40°C
TA = – 40°C
10
10
4
6
8
10
12
VDD (VOLTS)
14
4
16
Figure 9. Rise Time vs. Supply Voltage
CLOAD = 1800 pF
100
90
90
80
80
T D2, (nsec)
100
T D1,(nsec)
110
TA = 85°C
60
TA = 25°C
70
50
40
40
16
TA = 25°C
TA = – 40°C
20
4
6
8
10
12
VDD (VOLTS)
14
4
16
6
8
10
12
VDD (VOLTS)
14
16
Figure 12. TD2 Propagation Delay
vs. Supply Voltage
CLOAD = 1800 pF
Figure 11. TD1 Propagation Delay
vs. Supply Voltage
CLOAD = 1800 pF
35
40
PROPAGATION DELAYS (nsec)
TRISE
T RISE,T FALL, (nsec)
14
TA = 85°C
30
TA = – 40°C
20
TFALL
30
20
10
0
10
12
VDD (VOLTS)
60
50
30
8
Figure 10. Fall Time vs. Supply Voltage
CLOAD = 1800 pF
110
70
6
0
1000
3000
2000
CLOAD (pF)
4000
33
TD1
32
31
30
29
28
5000
TD2
34
0
2000
3000
CLOAD (pF)
4000
Figure 14. Propagation Delays
vs. Capacitive Load
TA = 25°C, VDD = 16 V
Figure 13. Rise and Fall Times
vs. Capacitive Load
TA = 25°C, VDD = 16 V
http://onsemi.com
6
Powered by ICminer.com Electronic-Library Service CopyRight 2003
1000
5000
NCP4413, NCP4414
PACKAGE DIMENSIONS
PDIP–8
P SUFFIX
CASE 626–05
ISSUE K
8
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5
–B–
1
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
4
DIM
A
B
C
D
F
G
H
J
K
L
M
N
F
–A–
NOTE 2
L
C
J
–T–
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
M
T A
M
B
M
SO–8
D SUFFIX
CASE 751–06
ISSUE T
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
S
q
http://onsemi.com
7
Powered by ICminer.com Electronic-Library Service CopyRight 2003
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
NCP4413, NCP4414
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European Support
German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)
Email: ONlit–[email protected]
French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)
Email: ONlit–[email protected]
English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)
Email: [email protected]
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, England, Ireland
CENTRAL/SOUTH AMERICA:
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email: ONlit–[email protected]
ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:
001–800–4422–3781
Email: ONlit–[email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2745
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
http://onsemi.com
8
Powered by ICminer.com Electronic-Library Service CopyRight 2003
NCP4413/D