ETC XN05553|XN5553

Composite Transistors
XN05553 (XN5553)
Silicon NPN epitaxial planar type
Unit: mm
2.90+0.20
–0.05
1.9±0.1
(0.95) (0.95)
3
2
0.4±0.2
1
0.30+0.10
–0.05
0.50+0.10
–0.05
■ Basic Part Number
2.8+0.2
–0.3
6
(0.65)
• Two elements incorporated into one package
• Reduction of the mounting area and assembly cost by one half
5
1.50+0.25
–0.05
4
■ Features
0.16+0.10
–0.06
5˚
For low-frequency amplification
1.1+0.2
–0.1
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
100
V
Collector-emitter voltage (Base open)
VCEO
100
V
Emitter-base voltage (Collector open)
VEBO
15
V
Collector current
IC
20
mA
Peak collector current
ICP
50
mA
Total power dissipation
PT
300
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
1: Collector (Tr1)
2: Emitter (Tr2)
3: Collector (Tr2)
EIAJ : SC-74
0 to 0.1
■ Absolute Maximum Ratings Ta = 25°C
1.1+0.3
–0.1
10˚
• 2SD1149 × 2
4: Base (Tr2)
5: Base (Tr1)
6: Emitter (Tr1)
Mini6-G1 Package
Marking Symbol: 4U
Internal Connection
4
5
Tr2
3
6
Tr1
2
1
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
100
V
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
100
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
15
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 60 V, IE = 0
0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 60 V, IB = 0
1.0
µA
hFE
VCE = 10 V, IC = 2 mA
400
2 000

hFE(Small
VCE = 4 V, IC = 5 mA
0.50
Forward current transfer ratio
hFE ratio *
Conditions
Min
Typ
Max
Unit

0.99
/Large)
Collector-emitter saturation voltage
Noise voltage
Transition frequency
VCE(sat)
NV
fT
IC = 10 mA, IB = 1 mA
0.05
0.20
V
VCE = 10 V, IC = 1 mA, GV = 80 dB
Rg = 100 kΩ, Function = FLAT
80
mV
VCB = 10 V, IE = −2 mA, f = 200 MHz
150
MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between 2 elements
Note) The part number in the parenthesis shows conventional part number.
Publication date: February 2004
SJJ00091BED
1
XN05553
PT  Ta
IC  VCE
IC  VBE
80
500
60
VCE = 10 V
200
IB = 100 µA
80 µA
60 µA
50 µA
40 µA
60
40
30 µA
20 µA
20
100
10 µA
0
80
120
160
0
2
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
1
25°C Ta = 75°C
0.1
−25°C
10
IE = 0
f = 1 MHz
Ta = 25°C
Noise voltage NV (mV)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
25°C
−25°C
900
600
300
1
3
2
10
1
10
Collector-base voltage VCB (V)
100
160
120
80
40
−1
−10
−100
NV  VCE
Rg = 100 kΩ
80
22 kΩ
5 kΩ
60
22 kΩ
40
5 kΩ
20
0
0.1
Collector current IC (mA)
SJJ00091BED
2.0
100
60
0
0.01
1.6
Emitter current IE (mA)
20
1
1.2
VCB = 10 V
Ta = 25°C
0
− 0.1
100
NV  IC
100 V = 10 V
CE
GV = 80 dB
Function = FLAT
T = 25°C
80 a
Rg = 100 kΩ
40
0.8
fT  I E
VCE = 10 V
1 200
0.4
200
Collector current IC (mA)
4
0
0
Base-emitter voltage VBE (V)
Ta = 75°C
0
0.1
100
Cob  VCB
5
20
0
12
1 500
Collector current IC (mA)
6
10
30
hFE  IC
10
1
8
1 800
IC / IB = 10
0.01
0.1
6
−25°C
40
Collector-emitter voltage VCE (V)
VCE(sat)  IC
100
4
Transition frequency fT (MHz)
40
Ta = 75°C
10
Noise voltage NV (mV)
0
Ambient temperature Ta (°C)
2
Collector current IC (mA)
300
0
25°C
50
400
Collector current IC (mA)
Total power dissipation PT (mW)
Ta = 25°C
1
IC = 1 mA
GV = 80 dB
Function = FLAT
Ta = 25°C
1
10
100
Collector-emitter voltage VCE (V)
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and semiconductors described in this material
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the products or technical information described in this material and controlled under the "Foreign Exchange
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
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2003 SEP