ETC XP0411M

Composite Transistors
XP0411M (XP411M)
Silicon PNP epitaxial planar transistor
0.2±0.05
5
6
Unit: mm
(0.425)
For digital circuits
0.12+0.05
–0.02
4
5˚
• Two elements incorporated into one package (Transistors with
built-in resistor)
• Reduction of the mounting area and assembly cost by one half
0.2±0.1
1.25±0.10
2.1±0.1
■ Features
1
3
2
(0.65) (0.65)
1.3±0.1
2.0±0.1
■ Basic Part Number of Element
• UNR111M (UN111M) × 2 elements
0.9±0.1
Symbol
Rating
Unit
Collector to base voltage
Parameter
VCBO
−50
V
of
Collector to emitter voltage
VCEO
−50
V
element
Collector current
IC
−100
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Rating
Total
1: Emitter (Tr1)
2: Base (Tr1)
3: Collector (Tr2)
EIAJ: SC-88
0 to 0.1
■ Absolute Maximum Ratings Ta = 25°C
0.9+0.2
–0.1
10˚
4: Emitter (Tr2)
5: Base (Tr2)
6: Collector (Tr1)
SMini6-G1 Package
Marking Symbol: EA
Internal Connection
6
5
4
Tr1
Tr2
1
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
2
Typ
3
Max
Unit
Collector to base voltage
VCBO
IC = −10 µA, IE = 0
−50
V
Collector to emittter voltage
VCEO
IC = −2 mA, IB = 0
−50
V
Collector cutoff current
ICBO
VCB = −50 V, IE = 0
− 0.1
ICEO
VCE = −50 V, IB = 0
− 0.5
Emitter cutoff current
IEBO
VEB = −6 V, IC = 0
DC current gain
hFE
VCE = −10 V, IC = −5 mA
Collector to emitter saturation voltage
VCE(sat)
VOH
VCC = −5 V, VB = − 0.5 V, RL = 1 kΩ
Low level output voltage
VOL
VCC = −5 V, VB = −2.5 V, RL = 1 kΩ
R1
Resistance ratio
R1 / R2
Gain bandwidth product
fT
mA
80
IC = −10 mA, IB = − 0.3 mA
High level output voltage
Input resistance
− 0.2
µA
− 0.25
−4.9
−30%
V
V
2.2
− 0.2
V
+30%
kΩ
0.047
VCB = −10 V, IE = 1 mA, f = 200 MHz
80
MHz
Note) The part number in the parenthesis shows conventional part number.
Publication date: July 2002
SJJ00239BED
1
XP0411M
IC  VCE
Total power dissipation PT (mW)
Collector current IC (mA)
200
150
100
− 0.6 mA
− 0.5 mA
−80
− 0.4 mA
−60
− 0.3 mA
−40
− 0.2 mA
−20
− 0.1 mA
0
20
40
60
80 100 120 140 160
0
120
80
40
−10
−30
−100 −300 −1 000
Collector current IC (mA)
−6
1
0
Input voltage VIN (V)
−12
−5 −10 −15 −20 −25 −30 −35 −40
Collector to base voltage VCB (V)
−10
−3
−1
− 0.3
− 0.1
− 0.03
−10
−10
3
VO = − 0.2 V
Ta = 25°C
−3
25°C
−25°C
− 0.01
−1
−3
−30
−10
−30
−100 −300 −1 000
Collector current IC (mA)
IO  VIN
−1 000
VO = −5 V
Ta = 25°C
−100
−30
− 0.01
−1
−8
f = 1 MHz
Ta = 25°C
VIN  IO
−100
Ta = 75°C
−1
− 0.03
Output current IO (mA)
Collector output capacitance Cob (pF)
DC current gain hFE
−4
VCE = −10 V
25°C
−3
−3
Cob  VCB
−25°C
0
−1
−2
10
160
−10
− 0.1
hFE  IC
Ta = 75°C
−30
Collector to emitter voltage VCE (V)
Ambient temperature Ta (°C)
200
IC / IB = 33.3
− 0.3
50
0
−100
Ta = 25°C
IB = −1.0 mA
− 0.9 mA
−120
− 0.8 mA
− 0.7 mA
−100
0
−100
Output current IO (mA)
2
VCE(sat)  IC
−140
Collector to emitter saturation voltage VCE(sat) (V)
PT  Ta
250
SJJ00239BED
−10
−1
− 0.1
0
− 0.5
−1.0
−1.5
−2.0
Input voltage VIN (V)
−2.5
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL