Surface-mount Fuses – Fundamentals Surface-mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A. TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition. Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc. Figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach. Figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure. Figure 1 Glass/Ceramic Substrate Multiple Fuse Elements Multi-layer Design Substrate Material Single Fuse Glass Element Coating Single-layer Glass Coated Design Figure 2 Fault Zones 11 Multi-layer Design Single-layer Glass Coated Design Wire-In-Air Design for 2410SFV Fuses The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications. Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability. Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse. Figure 3 Glass fiber enforced epoxy body Straight wire element Copper terminal plated with Ni and Tin Ceramic body Corrugate wire element End cap plated with Tin 75 Temperature Derating A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime. Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure 4. Use it to determine the derating percentage based on operating temperature and apply it to the derated system current. Figure 4 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -55 2410 Series Temperature Effect On Current Rating 110 105 100 95 % De-rating % De-rating 1206/0603/0402 Series Temperature Effect on Current Rating 90 85 80 75 70 65 60 55 -35 -15 5 25 45 65 85 105 125 145 50 -55 -35 Maximum Operating Temperature (°C) -15 5 25 45 65 85 105 125 Maximum Operating Temperature (°C) Pulse Cycle Derating Figure 5 Surface-mount Fuse Pulse Derating Curve 100% % of Minimum I2t Once the I2t value for the application waveform has been determined, it must be derated based on the number of cycles expected over the system lifetime. Since the stress induced by the current pulse is mechanical in nature, the number of times the stress is applied has significant bearing on how much derating must be applied to the fuse rating. Figure 5 presents the current pulse derating curve for our surface-mount chip fuses up to 100,000 cycles. 10% 100 1000 10000 100000 Number of Pulses Selecting Surface-mount Fuses 11 Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system operating current. Unfortunately, it’s not that simple. There are derating considerations for operating current and application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as knowing the nominal current drawn by the system. Fuse Selection Flowchart However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart will help you select a fuse best suited for your application conditions. Figure 6 Step 1 – Determine Steady State Fuse Current Rating Step 2 – Determine Pulse Waveform by Calculating I2t Apply Standard Steady State Derating (75%) [Ifuse ≥ Isys/0.75] Step 3 – Apply Pulse Cycle Derating Step 7 – Select Fuse Current Rating (use higher value between Step 1 and Step 6) 76 Step 4 – Apply Pulse Temperature Derating Apply Temperature Derating [Ifuse ≥ Isys/0.75/Ktemp] Step 5 – Apply Derating for Variance in the Circuit Steady State Fuse Current Rating Step 6 – Select Fuse Current Rating for Pulse Environment Step 8 – Check Voltage Rating Surface-mount Fuses – Pulse Tolerant Chip Fuses Surface-mount Fuses Pulse Tolerant Chip Fuses NEW Pulse Tolerant chip fuses has high inrush current withstand capability and provide overcurrent protection on DC power systems. Silver fusing element, monolithic and multilayer design provides strong arc suppression characteristics. These RoHS-compliant surface-mount devices facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. Benefits Features • High inrush current withstanding capability • Lead free materials and RoHS compliant • Ceramic Monolithic structure • Halogen free (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) • Silver fusing element and silver termination with nickel and tin plating • Monolithic, multilayer design • Excellent temperature stability • High-temperature performance • Strong arc suppression characteristics • -55°C to +125°C operating temperature range 11 Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 77 Table FP1 Clear Time Characteristics for Pulse Tolerant Chip Fuses % of rated current 100% 200% 1000% Clear time at 25°C 4 hours (min.) 1 seconds (min.) 0.0002 second (min.) 60 seconds (max.) 0.02 seconds (max.) Table FP2 Typical Electrical Characteristics and Dimensions for Pulse Tolerant Chip Fuses 0603 (1608 mm) Pulse Tolerant Chip Fuses Typical Electrical Characteristics D A Part Number Shape and Dimensions mm (Inch) B C A mm in B C D Min Max Min Max Min Max Min Max 1.45 1.75 0.65 0.95 0.21 0.51 0.65 0.95 (0.057) (0.069) (0.026) (0.037) (0.008) (0.020) (0.026) (0.037) Rated Current (A) Nominal Nominal I2t Cold DCR (A2sec)† (Ω)* Max. Interrupt Ratings Voltage (VDC) Current (A) 0603SFP100F/32-2 1.0 0.210 0.080 32 50 0603SFP150F/32-2 1.5 0.101 0.11 32 50 0603SFP200F/32-2 2.0 0.057 0.24 32 50 0603SFP250F/32-2 2.5 0.042 0.56 32 50 0603SFP300F/32-2 3.0 0.030 0.72 32 50 0603SFP350F/32-2 3.5 0.022 1.10 32 50 0603SFP400F/32-2 4.0 0.018 2.08 32 50 0603SFP450F/32-2 4.5 0.014 2.63 32 50 0603SFP500F/32-2 5.0 0.013 3.25 32 50 1206 (3216 mm) Pulse Tolerant Chip Fuses Typical Electrical Characteristics Max. Interrupt Ratings D A 11 Part Number Shape and Dimensions mm (Inch) B C A mm in B C D Min Max Min Max Min Max Min Max 3.00 3.40 0.77 1.17 0.26 0.76 1.40 1.80 (0.118) (0.134) (0.030) (0.046) (0.010) (0.030) (0.055) (0.071) Rated Current (A) Nominal Nominal I2t Cold DCR (A2sec)† (Ω)* Voltage (VDC) Current (A) 1206SFP100F/63-2 1.0 0.340 0.11 63 50 1206SFP150F/63-2 1.5 0.150 0.33 63 50 1206SFP200F/63-2 2.0 0.090 0.80 63 50 1206SFP250F/32-2 2.5 0.070 1.19 32 50 1206SFP300F/32-2 3.0 0.035 1.35 32 50 1206SFP350F/32-2 3.5 0.029 1.84 32 50 1206SFP400F/32-2 4.0 0.023 2.74 32 50 1206SFP450F/32-2 4.5 0.021 3.20 32 50 1206SFP500F/32-2 5.0 0.017 5.50 32 50 * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. 78 RoHS Compliant, ELV Compliant HF Halogen Free Surface-mount Fuses – Pulse Tolerant Chip Fuses Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Figure FP1 4.5 A 5.0 A A A A 3.0 4.0 A 2. 5 3.5 A 2. 0 1.5 A 1.0 A 0603SFP Average Time Current Curves 100 10 Clear Time (s) 1 0.1 0.01 0.001 0.0001 1 10 100 Current (A) Figure FP2 0603SFP I2T vs. t Curves 10,000 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1000 11 1.5A 1.0A I2t (A2s) 100 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 79 Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Cont’d Figure FP3 A 2. 5 3.0 A 3.5 A 4.0 A 4.5 A 5.0 A A 2. 0 1.0 A 1.5 A 1206SFP Average Time Current Curves 10,000 Clear Time (s) 100 1 0.01 0.001 1 10 100 Current (A) Figure FP4 1206SFP I2T vs. t Curves 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.0A 10,000 11 I2t (A2s) 100 1 0.01 0.0001 0.01 1 Time (s) Note: Curves are nominal Please go to page 97 for more information for Pulse Tolerant Chip Fuses. 80 RoHS Compliant, ELV Compliant HF Halogen Free 100 10,000 Surface-mount Fuses – 0603 Very Fast-Acting Chip Fuses Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses NEW Very Fast-acting chip fuses help provide overcurrent protection on systems using DC power sources up to 32VDC. The fuse’s monolithic, multilayer design provides the highest hold current in the smallest footprint, reduces diffusion-related aging, improves product reliability and resilience, and enhances high-temperature performance in a wide range of circuit designs. These RoHS-compliant surface-mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. Benefits Features • Very fast acting at 200% and 300% overloads • Lead free materials and RoHS compliant • Excellent inrush current withstanding capability at high overloads • Halogen free • Thin body for space limiting applications • Monolithic, multilayer design • Glass ceramic monolithic structure • High-temperature performance • Silver fusing element and silver termination with nickel and tin plating • -55°C to +125°C operating temperature range (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) 11 • RoHS compliant and lead-free materials • Symmetrical design with marking on both sides (optional) Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 81 Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses % of rated current 100% 200% 300% Clear time at 25°C 4 hours (min.) 0.01 second (min.) 0.001 second (min.) 5 seconds (max.) 0.2 seconds (max.) Table FV2 Typical Electrical Characteristics and Dimensions for Very Fast-Acting Chip Fuses 0603 (1608 mm) Very Fast-Acting Chip Fuses Typical Electrical Characteristics D Nominal Cold DCR (Ω)* Nominal I2t (A2sec) Voltage (VDC) Current (A) 0603SFV050F/32-2 0.5 0.860 0.0093 32 50 0603SFV075F/32-2 0.8 0.450 0.0191 32 50 0603SFV100F/32-2 1.0 0.280 0.0360 32 50 0603SFV125F/32-2 1.3 0.205 0.0630 32 35 0603SFV150F/32-2 1.5 0.143 0.0950 32 35 Max 0603SFV175F/32-2 1.8 0.095 0.1400 32 35 0.95 0603SFV200F/32-2 2.0 0.073 0.2100 32 35 0603SFV250F/32-2 2.5 0.046 0.3000 32 35 0603SFV300F/32-2 3.0 0.039 0.4600 32 35 0603SFV350F/32-2 3.5 0.028 0.7300 32 35 0603SFV400F/32-2 4.0 0.023 1.1500 32 35 0603SFV450F/32-2 4.5 0.019 1.6800 32 35 0603SFV500F/32-2 5.0 0.015 2.6200 32 35 A Part Number Shape and Dimensions mm (Inch) B C A Min mm in B Max 1.45 1.75 Min 0.22 C Max 0.48 Min 0.21 D Max 0.51 Min 0.65 Max. Interrupt Ratings Rated Current (A) (0.057) (0.069) (0.009) (0.019) (0.008) (0.020) (0.025) (0.037) * Measured at 10% of rated current and 25°C Figure FV1-FV2 Family Performance Curves for Very Fast-Acting Chip Fuses Figure FV1 Figure FV2 0603SFV Average Time Current Curves 0603SFV I²t vs. t Curves 0.0 5A 0.7 5 1.0 A 0 1. 2 A 5 1.5 A 1.7 0A 2.05 A 2. 5 0 A 3.0 0A 3.5 0A 4.0 0A 4.5 0A 5.0 0A 0A 11 100 1000 5.00A 4.50A 4.00A 3.50A 3.00A 2.50A 2.00A 1.75A 1.50A 1.25A 1.00A 0.75A 0.05A 100 10 10 1 I²t (A²s) Clear Time (s) 1 0.1 0.1 0.01 0.01 0.001 0.001 0.0001 1 10 Current (A) 100 0.0001 0.0001 Note: Curves are nominal Please go to page 97 for more information for Very Fast-Acting Chip Fuses. 82 RoHS Compliant, ELV Compliant HF Halogen Free 0.001 0.01 0.1 Time (s) 1 10 Surface-mount Fuses – Fast-Acting Chip Fuses Surface-mount Fuses Fast-Acting Chip Fuses Fast-acting chip fuses help provide overcurrent protection on systems using DC power sources up to 63VDC. The fuse’s monolithic, multilayer design provides the highest hold current in the smallest footprint, reduces diffusionrelated aging, improves product reliability and resilience, and enhances high-temperature performance in a wide range of circuit designs. These RoHS-compliant surface-mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. Benefits Features • Small size with high-current ratings • Lead free materials and RoHS compliant • Excellent temperature stability • Halogen free • High reliability and resilience • Strong arc suppression characteristics (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) • Monolithic, multilayer design 11 • High-temperature performance • -55°C to +125°C operating temperature range Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 83 Table FF1 Clear Time Characteristics for Fast-Acting Chip Fuses % of rated current 100% 250% 400% Table FF2 Clear time at 25°C 4 hours min. 5 seconds max. 0.05 seconds max. Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for Fast-Acting Chip Fuses 0402 (1005mm) Fast-Acting Chip Fuses Shape and Dimensions Inch (mm) 0.020±0.004 (0.51±0.10) Typical Electrical Characteristics 0.039±0.004 (1.00±0.10) 0.010±0.004 (0.25±0.10) 0.063 (1.60) Recommended Pad Layout Inch (mm) 0.016 (0.40) Nominal Cold DCR (Ω)* Nominal I2t (A2sec)† Voltage (VDC) Current (A) 0402SFF050F/24 0.50 0.380 0.0043 24 35 0402SFF075F/24 0.75 0.210 0.0076 24 35 0402SFF100F/24 1.00 0.120 0.0170 24 35 0402SFF150F/24 1.50 0.056 0.0490 24 35 0402SFF200F/24 2.00 0.035 0.0700 24 35 0402SFF300F/24 3.00 0.021 0.1250 24 35 0402SFF400F/24 4.00 0.014 0.2250 24 35 Part Number 0.020±0.004 (0.51±0.10) 0 0.028 (0.70) Max. Interrupt Ratings Rated Current (A) 0.024 (0.60) 0603 (1608mm) Fast-Acting Chip Fuses Typical Electrical Characteristics Shape and Dimensions Inch (mm) 0.031±0.006 (0.80±0.15) Nominal Cold DCR (Ω)* Nominal I2t (A2sec)† Voltage (VDC) Current (A) 0603SFF050F/32 0.50 0.485 0.0029 32 50 0603SFF075F/32 0.75 0.254 0.0064 32 50 0603SFF100F/32 1.00 0.131 0.0160 32 50 0603SFF150F/32 1.50 0.059 0.0300 32 35 0603SFF200F/32 2.00 0.044 0.0600 32 35 0603SFF250F/32 2.50 0.032 0.1150 32 35 0603SFF300F/32 3.00 0.025 0.1900 32 35 0603SFF350F/32 3.50 0.024 0.2950 32 35 0603SFF400F/32 4.00 0.018 0.4000 32 35 0603SFF500F/32 5.00 0.013 0.7000 32 35 0603SFF600F/24 6.00 0.010 1.1250 24 35 Part Number 1206SFF050F/63 Rated Current (A) 0.50 Nominal Cold DCR (Ω)* 0.730 Nominal I2t (A2sec)† 0.0021 Voltage (VDC) 63 Current (A) 50 1206SFF075F/63 0.75 0.513 0.0052 63 50 1206SFF100F/63 1.00 0.220 0.0120 63 50 1206SFF150F/63 1.50 0.120 0.0250 63 50 1206SFF175F/63 1.75 0.100 0.0450 63 50 1206SFF200F/63 2.00 0.050 0.0700 63 50 1206SFF250F/32 2.50 0.035 0.1400 32 50 1206SFF300F/32 3.00 0.031 0.2200 32 50 1206SFF400F/32 4.00 0.022 0.3800 32 45 1206SFF500F/32 5.00 0.015 0.6000 32 45 1206SFF600F/32 6.00 0.013 1.0000 32 50 1206SFF700F/32 7.00 0.011 1.7500 32 50 1206SFF800F/32 8.00 0.008 2.5000 32 50 1206SFF600F/24 6.00 0.013 1.0000 24 45 1206SFF700F/24 7.00 0.011 1.7500 24 45 1206SFF800F/24 8.00 0.008 2.5000 24 45 Part Number 0.031±0.006 (0.80±0.15) 0.014±0.006 (0.36±0.15) 0.110 (2.80) Recommended Pad Layout Inch (mm) 0.024 0 (0.60) 11 0.039 (1.00) 0.043 (1.09) Max. Interrupt Ratings Rated Current (A) 0.063±0.006 (1.60±0.15) 1206 (3216mm) Fast-Acting Chip Fuses Typical Electrical Characteristics Shape and Dimensions S (mm) Inch 0 0.063±0.008 (1.60±0.20) 0.126±0.008 (3.20±0.20) 0.043±0.008 (1.10±0.20) 0.020±0.010 (0.51±0.25) 0 0.173 (4.40) Recommended Pad Layout Inch (mm) 0.059 (1.50) 0.071 (1.80) 0.057 (1.45) * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. 84 RoHS Compliant, ELV Compliant HF Halogen Free Max. Interrupt Ratings Surface-mount Fuses – Fast-Acting Chip Fuses Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses Figure FF1 Figure FF2 0402SFF I²t vs. t Curves 2. 0 A 3.0 4.0 A A 0.5 A 0.7 5 1.0 A 1.5A A 0402SFF Average Time Current Curves 1000 10 4.0A 3.0A 2.0A 1.5A 100 1.0A 0.75A 1 0.5A I²t (A²s) Clear-Time (s) 10 0.1 1 0.1 0.01 0.01 0.001 0.1 1 10 0.001 0.001 100 0.01 Current (A) 0.1 1 10 Time (s) Note: Curves are nominal Figure FF3 Figure FF4 0.5 A 0.7 5 1.0 A A 1.5 2 . 0A 2. 5 A 3.0A 3.5A 4. A 5.00A 6 .0A A 0603SFF Average Time Current Curves 0603SFF I²t vs. t Curves 10 10000 11 6.0A 5.0A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.0A 0.75A 1000 1 10 0.5A I²t (A²s) Clear-Time (s) 100 0.1 1 0.1 0.01 0.01 0.001 0.1 1 10 Current (A) RoHS Compliant, ELV Compliant HF Halogen Free 100 0.001 0.001 Note: Curves are nominal 0.01 0.1 1 10 Time (s) 85 Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses Figure FF5 Cont’d Figure FF6 1206SFF Average Time Current Curves 0.5 A 0.7 5 1.0 A A 1.5 1.7 A 2.05 A 2. 5 A 3.0A 4. A 5.00A 6 .0A 7.0 A 8 .0A A 1206SFF I²t vs. t Curves 10000 10 8.0A 7.0A 6.0A 5.0A 4.0A 3.0A 2.5A 2.0A 1.75A 1.5A 1.0A 1000 1 100 0.5A I²t (A²s) Clear-Time (s) 0.75A 10 0.1 1 0.1 0.01 0.01 0.001 0.1 1 10 0.001 0.001 100 Note: Curves are nominal Please go to page 97 for more information for Fast-Acting Chip Fuses. 11 86 RoHS Compliant, ELV Compliant HF Halogen Free 0.01 0.1 Time (s) Current (A) 1 10 High-Current Rated Chip Fuses Surface-mount Fuses High-Current-Rated Chip Fuses The monolithic multilayer design of the TE Circuit Protection high-current-rated chip fuses helps to provide some of the highest current ratings available in the 1206 size and enhances high-temperature performance in a wide range of circuit protection designs. The devices’ small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, servers, communications equipment, voltage regulator modules, and other high-current, small size applications. Benefits • Glass ceramic monolithic structure provides stability in application cycling Features • Lead free materials and RoHS compliant • Halogen free • High-current rating in a small package allows more efficient use in system space • Monolithic multilayer design • Strong arc suppression in overcurrent conditions • High-temperature performance (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) 11 • -55°C to +125°C operating temperature range Applications • Communications equipment • Voltage regulator modules • Power supplies • Servers 87 Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses 1206SFH Series % of rated current 100% 250% Table FH2 Clear time at 25°C 4 hours (min.) 5 seconds (max.) Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for High-Current-Rated Chip Fuses 1206 (3216mm) High-Current-Rated Chip Fuses Shape and Dimensions Inch (mm) 0.063±0.008 (1.60±0.20) Typical Electrical Characteristics Rated Nominal Nominal Current Cold DCR I2t (A) (Ω)* (A2sec)† 0.126±0.008 (3.20±0.20) Part Number 0.038±0.008 (0.97±0.20) 0.020±0.010 (0.51±0.25) Recommended Pad Layout Inch (mm) Max. Interrupt Ratings Voltage (VDC) Current (A) 1206SFH100F/24 10 0.010 9 24 100 1206SFH120F/24 12 0.008 14 24 100 1206SFH150F/24 15 0.005 26 24 100 1206SFH200F/24 20 0.003 56 24 100 * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. 0.173 (4.40) 0.059 (1.50) 0.071 (1.80) 0.057 (1.45) Figure FH1-FH2 Family Performance Curves for High-Current-Rated Chip Fuses Figure FH1 Figure FH2 1206SFH Average Time Current Curves A 1206SFH I²t vs. t Curves 20 10 A 12 A 15 A 11 10 10000 20A 15A 12A 10A 1000 I²t (A²s) Clear Time (s) 1 0.1 0.01 100 10 0.001 10 100 Current (A) 1000 1 0.001 Note: Curves are nominal Please go to page 97 for more information for High-Current-Rated Chip Fuses. 88 RoHS Compliant, ELV Compliant HF Halogen Free 0.01 0.1 Time (s) 1 10 Surface-mount Fuses – Slow-Blow Chip Fuses Surface-mount Fuses Slow-Blow Chip Fuses Available in industry standard 1206 and 0603 chip sizes, TE Circuit Protection’s slow-blow chip fuses help provide overcurrent protection on systems that experience large and frequent current surges as part of their normal operation. The slow-blow chip fuse’s monolithic, multilayer design helps provide some of the highest current ratings available in the 1206 and 0603 footprints and enhances high-temperature performance in a wide range of circuit protection designs. The devices’ small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, capacitor filter banks, LCD (Liquid Crystal Display) backlight inverters, electric motors and portable electronics. Benefits Features • Time-delayed design prevents nuisance openings in pulsed and high inrush current applications • Lead free materials and RoHS compliant • Halogen free (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) • Small size with high-current ratings • Strong arc suppression characteristics • Monolithic multilayer design 11 • High-temperature performance • -55°C to +125°C operating temperature range Applications • Small motors systems • Power over Ethernet (POE) • Computer drives • Portable electronics • Test equipment • Displays • Input power ports • POL converter protection • Printers 89 0 Table FS1 Clear Time Characteristics for Slow-Blow Chip Fuses 0603SFS Series % of rated current 100% 200% 300% 800%(1.0A-1.5A) 800%(2.0A-5.0A) Table FS2 1206SFS Series Clear time at 25°C 4 hours (min.) 1 second (min.) 120 seconds (max.) 0.1 second (min.) 3 seconds (max.) 0.0005 second (min.) 0.05 seconds (max.) 0 0.001 second (min.) 0.05 seconds (max.) % of rated current 100% 200% 300% 800%(1.0A-1.5A) 800%(2.0A-8.0A) Clear time at 25°C 4 hours (min.) 1 second (min.) 120 seconds (max.) 0.1 second (min.) 3 seconds (max.) 0.0016 second (min.) 0.05 seconds (max.) 0.002 second (min.) 0.05 seconds (max.) Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for Slow-Blow Chip Fuses 0603 (1608mm) Slow-Blow Chip Fuses Shape and Dimensions Inch (mm) 0.031±0.006 (0.80±0.15) 0.063±0.006 (1.60±0.15) Part Number 0.031±0.006 (0.80±0.15) Max. Interrupt Ratings Voltage (VDC) Current (A) 0603SFS100F/32 1.0 0.200 0.093 32 50 0603SFS150F/32 1.5 0.100 0.18 32 50 0603SFS200F/32 2.0 0.052 0.32 32 50 0603SFS250F/32 2.5 0.041 0.63 32 50 0.110 (2.80) 0603SFS300F/32 3.0 0.031 0.87 32 50 0.024 (0.60) 0603SFS350F/32 3.5 0.021 1.20 32 50 0603SFS400F/32 4.0 0.017 2.30 32 50 0603SFS450F/32 4.5 0.015 2.70 32 50 0603SFS500F/32 5.0 0.013 3.20 32 50 0.014±0.006 (0.36±0.15) Recommended Pad Layout Inch (mm) Typical Electrical Characteristics Rated Nominal Nominal Current Cold DCR I2t (A) (Ω)* (A2sec)† 0.039 (1.00) 0.043 (1.09) 1206 (3216mm) Slow-Blow Chip Fuses 11 Shape and Dimensions Inch (mm) 0.063±0.008 (1.60±0.20) 0.126±0.008 (3.20±0.20) Part Number Current (A) 1.0 0.360 0.11 63 50 1.25 0.200 0.22 63 50 1206SFS150F/63 1.5 0.150 0.23 63 50 1206SFS200F/63 2.0 0.088 0.63 63 50 1206SFS250F/32 2.5 0.065 0.90 32 50 1206SFS300F/32 3.0 0.034 1.20 32 50 1206SFS350F/32 3.5 0.028 1.60 32 50 0.173 (4.40) 1206SFS400F/32 4.0 0.024 2.20 32 50 0.059 (1.50) 1206SFS450F/32 4.5 0.020 3.60 32 50 1206SFS500F/32 5.0 0.016 5.30 32 50 1206SFS550F/24 5.5 0.014 6.40 24 50 1206SFS600F/24 6.0 0.011 8.50 24 60 1206SFS700F/24 7.0 0.010 10.00 24 60 1206SFS800F/24 8.0 0.009 16.90 24 60 0.071 (1.80) 0.057 (1.45) * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. RoHS Compliant, ELV Compliant Voltage (VDC) 1206SFS125F/63 0.020±0.010 (0.51±0.25) 90 Max. Interrupt Ratings 1206SFS100F/63 0.038±0.008 (0.97±0.20) Recommended Pad Layout Inch (mm) Typical Electrical Characteristics Rated Nominal Nominal Current Cold DCR I2t (A) (Ω)* (A2sec)† HF Halogen Free Surface-mount Fuses – Slow-Blow Chip Fuses Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses Figure FS1 A 2. 5 3.0A A 3.5 A 4.0 A 4.5 A 5.0 A 2. 0 1.5 A 1.0 A 0603SFS Average Time Current Curves 100 Clear Time (s) 10 1 0.1 0.01 0.001 1 10 100 Current (A) Figure FS2 0603SFS I²t vs. t Curves 10,000 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1000 11 1.0A I2t (A2s) 100 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 91 Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses Cont’d Figure FS3 A A 3.0 3.5A 4.0 A 4.5A 5.0 A 5.5A 6 .0 A 7.0 A A 8 .0 A 2. 5 2. 0 1. 2 5A 1.5 A 1.0 A 1206SFS Average Time Current Curves 100 10 Clear Time (s) 1 0.1 0.01 0.001 1 10 1000 100 Current (A) Figure FS4 1206SFS I²t vs. t Curves 100000 8.0A 7.0A 6.0A 5.5A 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.25A 1.0A 10000 11 1000 I2t (A2s) 100 10 1 0.1 0.01 0.001 0.01 0.1 1 Time (s) Note: Curves are nominal Please go to page 97 for more information for Slow-Blow Chip Fuses. 92 RoHS Compliant, ELV Compliant HF Halogen Free 10 100 Surface-mount Fuses – 2410 Very Fast-Acting Fuses Surface-mount Fuses 2410 Very Fast-Acting Fuses NEW The 2410(6125) is Wire-in Air SMD Fuse which is very suitable for secondary level overcurrent protection applications. These lead-free surface mount devices offer more reliability and have no end cap falling off risk. Straight wire element in air performs consistent fusing and cutting characteristics. Benefits Features • Very fast acting at 200% overload current level • Halogen free, RoHS compliant and 100% lead-free • Excellent inrush current withstanding capability • Copper or copper alloy composite fuse link • High reliability and resilience • Fiberglass enforced epoxy fuse body • Strong arc suppression characteristics • Wide range of current rating • Copper terminal with nickel and tin plated • -55°C to +125°C operating temperature range (with de-rating) 11 Applications • Industrial equipment • Power supplier • Game systems • LCD/PDP TV • Telecom system • White goods • Backlight inverter • Networking • Automotive 93 Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses % of rated current 100% 200% (0.5A-10.0A) 200% (12.0A-20.0A) Table SFV2 Clear time at 25°C 4 hours (min.) 0.01 second (min.) 0.01 second (min.) 5 seconds (max.) 20 seconds (max.) Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for 2410 Very Fast-Acting Fuses 2410 (6125 mm) Very Fast-Acting Fuse Shape and Dimensions mm (Inch) A D B C Recommended Pad Layout mm (Inch) D Min Max Min Max Min Max Min Max 6.86 (0.270) 5.95 6.25 1.96 2.36 0.97 1.73 2.34 2.64 2.95 (0.116) A C B mm in (0.234) (0.246) (0.077) (0.093) (0.038) (0.068) (0.092) (0.104) 3.15 (0.124) 1.96 (0.077) Typical Electrical Characteristics Marking Code Rated Current (A) Nominal Cold DCR (Ω)* Nominal I2t (A2sec) (VAC) (VDC) C 0.5 0.2310 0.10 250 125 2410SFV0.63FM/125-2 S 0.6 0.1740 0.16 250 125 2410SFV0.75FM/125-2 D 0.8 0.1480 0.23 250 125 2410SFV1.00FM/125-2 E 1.0 0.0930 0.59 250 125 2410SFV1.25FM/125-2 F 1.3 0.0700 0.96 250 125 Part Number 2410SFV0.50FM/125-2 11 Voltage 2410SFV1.50FM/125-2 G 1.5 0.0620 1.19 125 125 2410SFV2.00FM/125-2 I 2.0 0.0420 2.75 125 125 2410SFV2.50FM/125-2 J 2.5 0.0310 1.21 125 125 2410SFV3.00FM/125-2 K 3.0 0.0249 1.73 125 125 2410SFV3.15FM/125-2 V 3.2 0.0232 2.20 125 125 2410SFV3.50FM/125-2 L 3.5 0.0220 2.50 125 125 2410SFV4.00FM/125-2 M 4.0 0.0172 4.10 125 125 2410SFV5.00FM/125-2 N 5.0 0.0143 5.90 125 125 2410SFV6.30FM/125-2 O 6.3 0.0100 12.50 125 125 2410SFV7.00FM/125-2 P 7.0 0.0094 14.20 125 125 2410SFV8.00FM/125-2 R 8.0 0.0086 20.30 125 125 2410SFV10.0FM/125-2 Q 10.0 0.0066 29.20 125 125 2410SFV12.0FM/065-2 X 12.0 0.0053 49.20 65 65 2410SFV15.0FM/065-2 Y 15.0 0.0038 102.50 65 65 2410SFV20.0FM/065-2 Z 20.0 0.0034 126.20 65 65 * Measured at ⱕ10% of rated current and 25°C ambient temperature. 94 Max. Interrupt Ratings RoHS Compliant, ELV Compliant HF Halogen Free Current (A) 50A @ 250VAC 50A @ 125VDC 300A @ 32VDC 50A @ 125VAC 50A @ 125VDC 300A @ 32VDC 35A @ 125VAC 50A @ 125VDC 300A @ 32VDC 50A @ 65VAC 50A @ 65VDC 300A @ 32VDC 50A @ 65VAC 50A @ 65VDC 300A @ 32VDC Surface-mount Fuses – 2410 Very Fast-Acting Fuses Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses Figure SFV1 1.0 0A 1. 2 1.55 A 0A 2. 0 2. 5 0 A 0 3.0 A 3.1 0A 3.55 A 4.0 0A 5.0 0A 0A 6.3 7.0 0A 0 8 .0 A 10 0A . 12 0A . 15 0A .0A 20 .0A 3A 5A 0.7 0.6 0.5 0A 2410SFV Average Time Current Curves 100 10 Clear Time (s) 1 0.1 0.01 0.001 0.1 1 10 100 1000 Current (A) Figure SFV2 2410SFV I2T vs. t Curves 20.0A 15.0A 12.0A 10.0A 8.00A 7.00A 6.30A 5.00A 4.00A 3.50A 3.15A 3.00A 2.50A 2.00A 1.50A 1.25A 1.00A 0.75A 0.63A 0.50A 100,000 10,000 1000 I2t (A2s) 100 11 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal Please go to page 97 for more information for 2410 Fast-Acting Fuses. RoHS Compliant, ELV Compliant HF Halogen Free 95 11 96 Surface-mount Fuses - Specifications for All Fuses Specifications, Packaging Information, Agency Approvals and Part Numbering Systems for All Fuses Table F1 Environmental Specifications for All Fuses Operating temperature -55°C to +125°C Mechanical vibration Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202 Mechanical shock Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202 Thermal shock Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202 Resistance to soldering heat Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202 Solderability Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202 Moisture resistance Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202 Salt spray Storage temperature Storage humidity Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202 ⱕ30°C/ 85% RH Per MIL-STD-202F, Method 106F Table F2 Material Specifications for All Fuses Construction body material Termination material Fuse element Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410) Silver, Nickel, Tin Silver(1206/0603/0402); Copper/Copper Alloy (2410) Figure F1 Thermal Derating Current for All Fuses 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -55 2410 Series Temperature Effect on Current Rating 110 105 11 100 95 90 % De-rating % De-rating 1206/0603/0402 Series Temperature Effect on Current Rating 85 80 75 70 65 60 55 -35 -15 5 25 45 65 85 105 125 145 50 -55 -35 Maximum Operating Temperature (˚C) -15 5 25 45 65 85 105 125 Maximum Operating Temperature (˚C) Table F3 Electrical Specifications for All Fuses Insulation resistance after opening 20,000Ω minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide sufficient insulation resistance for circuit protection. Current carrying capacity RoHS Compliant, ELV Compliant Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419. HF Halogen Free 97 Table F4 Packaging Information for All Fuses Size Reel Quantity (pcs) Reel Diameter Reel Width Carrier Tape Size Tape Type Reels per Outside Shipment Box Outside Shipment Boxes per Overpack 0402(1005) 10,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper 5 1 to 10 0603(1608) 4,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper 5 1 to 10 0603SFV(1608) 6,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper 5 1 to 10 1206(3216) 3,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Plastic 5 1 to 10 2410(6125) 2,000 178mm white plastic 13.4 ± 0.5mm 12.00 ± 0.10mm Plastic 4 1 to 10 Figure F2 Recommended Soldering Temperature Profile for All Fuses tp Critical Zone TL to Tp Tp Ramp up Temperature TL tL TsMAX TsMIN ts Preheat 25 Reflow Profile Ramp down t 25˚C to Peak Time Classification Reflow Profiles Profile Feature Average ramp up rate (TsMAX to Tp) Preheat • Temperature min. (TsMIN) • Temperature max. (TsMAX) • Time (tsMIN to tsMAX) Time maintained above: • Temperature (TL) • Time (tL) Peak/Classification temperature (Tp) Time within 5°C of actual peak temperature Time (tp) From 25°C to preheating (150°C) Ramp down rate 11 1206/0603/0402 3°C/second max. 2410 3°C/second max. 150°C 200°C 60-180 seconds 150°C 200°C 40-100 seconds 217°C 60-150 seconds 260°C max. 200°C 30-90 seconds 250°C max. 20-40 seconds 8 minutes max. 4°C/second max. 30-40 seconds 40-100 seconds Natural cooling Recommended conditions for hand soldering: 1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended, do not directly contact the chip termination with the tip of soldering iron. 2. Preheating: 150°C, 60s (min). Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s. 98 RoHS Compliant, ELV Compliant HF Halogen Free Surface-mount Fuses - Specifications for All Fuses Table F5 Tape and Reel Specifications for All Fuses Dimension in inches (mm) Mark 0402 (1005) 0603 (1608) 1206 (3216) 0603SFV (1608) 2410 (6125) E1 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) F 0.138 ± 0.002 0.138 ± 0.002 0.138 ± 0.002 0.138 ± 0.002 0.217 ± 0.004 (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) (5.50 ± 0.10) W 0.315 ± 0.004 0.315 ± 0.004 0.315 ± 0.004 0.315 ± 0.004 0.472 ± 0.004 (8.00 ± 0.10) (8.00 ± 0.10) (8.00 ± 0.10) (8.00 ± 0.10) (12.00 ± 0.10) P1 0.079 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 (2.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) P0 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) P2 0.079 ± 0.002 0.079 ± 0.002 0.079 ± 0.002 0.079 ± 0.002 0.079 ± 0.004 (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.10) D0 0.059 ± 0.004 0.059 ± 0.004 0.059 ± 0.004 0.059 ± 0.004 0.059 ± 0.004 (1.50+0.10/-0.00) (1.50+0.10/-0.00) (1.50+0.10/-0.00) (1.50+0.10/-0.00) (1.50+0.10/-0.00) — — 0.039 max — 0.61 ± 0.004 — 0.010 ± 0.002 0.039 ± 0.004 0.112 ± 0.004 D1 (1.00 max) t (1.55 ± 0.10) — — 0.009 ± 0.001 A0 0.026 ± 0.004 0.039 ± 0.004 0.071 ± 0.004 (0.67 ± 0.10) (0.98 ± 0.10) (1.80 ± 0.10) (0.98 ± 0.10) (2.85 ± 0.10) B0 0.046 ± 0.004 0.071 ± 0.004 0.138 ± 0.004 0.071 ± 0.004 0.252 ± 0.004 (1.17 ± 0.10) (1.80 ± 0.10) (3.50 ± 0.10) (1.80 ± 0.10) (6.40 ± 0.10) K0 0.025 ± 0.004 0.037 ± 0.003 0.050 ± 0.004 0.024 ± 0.003 0.093 ± 0.004 (0.63 ± 0.10) (0.95 ± 0.08) (1.27 ± 0.10) (0.60 ± 0.08) (2.35 ± 0.10) (0.23 ± 0.02) (0.25 ± 0.05) Figure F3 Component Tape Dimensions for All Fuses Paper Carrier Tape Specifications P0 D0 11 P2 E1 F W B0 P1 D1 A0 K0 Plastic Carrier Tape Specifications D0 P0 t P2 E1 F W B0 D1 RoHS Compliant, ELV Compliant HF Halogen Free P1 A0 K0 99 Figure F4 Reel Dimensions for All Fuses Dimension Description Hub outer diameter Dimension (mm) Mark 1206/0603/0402 2410 B 60 60.2 Reel inside width W1 9 13.4 Reel outside width W2 11.4 16 Tape width W2 B 8 W1 Agency Approvals for All Fuses UL File # E197536 Part Numbering System for Fast-Acting, Slow-Blow And 0603 Very Fast-Acting Chip Fuses 1206 SF F 400 F / 24 -2 Packaging -2 = Tape and Reel Voltage Rating 24 = 24VDC Special Code F = RoHS Compliant FM = RoHS Compliant + Marked Part Rated Current 050 = 0.50 Amps 400 = 4 Amps Fuse Blow Type F = Fast Acting S = Slow Blow 11 SF = Surface Mount Fuse Size (1206, 0603, 0402) Part Numbering System for High-Current-Rated Chip Fuses 1206 SF H 100 F / 24 -2 Packaging -2 = Tape and Reel Voltage Rating 24 = 24VDC Special Code F = RoHS Compliant FM = RoHS Compliant + Marked Part Rated Current 100 = 10 Amps Fuse Blow Type H = High Current SF = Surface Mount Fuse Size (1206) 100 RoHS Compliant, ELV Compliant HF Halogen Free Surface-mount Fuses - Specifications for All Fuses Part Numbering System for 2410 Very Fast-Acting Fuses 2410 SF V 6.30 FM / 125 -2 Packaging -2 = Tape and Reel Voltage Rating 125 = 125VDC Special Code F = RoHS Compliant M = Marked Part Rated Current 6.30= 6.30 Amps Fuse Blow Type V = Very Fast Acting SF = Surface Mount Fuse Size (0.24*0.10 inch) 11 Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies (“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. RoHS Compliant, ELV Compliant HF Halogen Free 101 11 102