REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED Add vendor CAGE 34333. Add vendor CAGE U4637. Editorial changes throughout. 87-04-16 M. A. Frye B Add device types 02, 03, and 04. Editorial changes throughout. 87-12-21 M. A. Frye C Change vendor CAGE 12969 to 48726. Change max duty cycle min limit. Add vendor CAGE U4637 for additional devices, also change name form Integrated Power to Seagate Microelectronics. Add vendor CAGE 34333 for additional devices. Add testing for delay to output, rise time, and fall time tests. Editorial changes throughout. 89-10-10 M. A. Frye D Add packages C, E, F, 2, H, and X. Changes unity gain bandwidth limit. Editorial changes throughout. 92-11-23 M. A. Frye E Add device types 05, 06, 07, and 08. Add vendor CAGE 48726 for device type 05, 06, 07, and 08. Changes to table I electricals. Delete vendor CAGE U4637 from drawing. Add vendor CAGE U3158. Editorial changes throughout. 93-09-10 M. A. Frye F Changes in accordance with NOR 5962-R146-94. 94-05-17 M. A. Frye G Changes in accordance with NOR 5962-R251-97. 97-03-19 M. A. Frye H Change vendor CAGE 48726 to 01295. Add class V for vendor CAGE 01295. . Editorial changes throughout. – lgt 00-11-08 R. Monnin J Correction to the VMIN limit in table I for device types 03 and 06. Editorial changes throughout. - rrp 01-10-10 R. Monnin K Add case outline D. - ro 02-05-30 R. Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV K K K K K K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY DONALD R. OSBORNE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY D. A. DiCENZO APPROVED BY N. A. HAUCK DRAWING APPROVAL DATE 86-11-10 REVISION LEVEL K MICROCIRCUIT, LINEAR, PROGRAMMABLE PRIMARY SIDE PULSE WIDTH MODULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-86704 13 5962-E410-02 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 86704 01 Device type (see 1.2.2) C Case outline (see 1.2.4) X Lead finish (see 1.2.5) 01 Device type (see 1.2.2) V Device class designator (see 1.2.3) C Case outline (see 1.2.4) / \/ Drawing number For device class V: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 86704 / X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 Generic number 1842 1843 1844 1845 1842A 1843A 1844A 1845A STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 Circuit function Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller Off-line current mode pulse width modulator controller SIZE 5962-86704 A REVISION LEVEL K SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C D E F H P X 2 Descriptive designator GDIP1-T14 or CDIP2-T14 GDFP1-F14 or CDFP2-F14 GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 GDFP1-F10 or CDFP2-F10 GDIP1-T8 or CDIP2-T8 CQCC1-N20 CQCC1-N20 Terminals Package style 14 14 16 16 10 8 20 20 Dual-in-line Flat pack Dual-in-line Flat pack Flat pack Dual-in-line Square leadless chip carrier (see figure 1) Square leadless chip carrier (see figure 1) 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage (VCC) .................................................................................. Output current ............................................................................................. Output energy (capacitance load) ............................................................... Analog input voltage (pins 2 and 3) ............................................................ Error amplifier output sink current ............................................................... Power dissipation (PD)(TA = +25°C): Cases C, E, F, H, P, X, and 2 .................................................................. Case D .................................................................................................... Storage temperature range ......................................................................... Lead temperature (soldering, 10 seconds) ................................................. Junction temperature (TJ) ........................................................................... 30 V ±1.0 A 5.0 µ j -0.3 V to +6.3 V 10 mA 1.0 W 4/ 700 mW 4/ -65°C to +150°C +300°C +150°C Thermal resistance, junction-to-case (θJC) ................................................ See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (VCC) .................................................................................. +15 V ±5.0 percent Ambient operating temperature range (TA) ................................................ -55°C to +125°C 1/ 2/ 3/ 4/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. All voltages are with respect to ground, and all currents are positive when flowing into the specified terminal. All references to pin numbers are for case outline P. Derate at 8.0 mW/°C above TA = +25°C for case P, 10 mW/°C above TA = +50°C for cases C and E, 5.5 mW/°C above TA = +25°C for case D, 8.7 mW/°C above TA = +25°C for case F, 9.0 mW/°C above TA = +40°C for cases 2 and X, and 6.9 mW/°C above TA = +25°C for case H. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 4 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 4.95 5.05 V REFERENCE SECTION 1 All 12 V ≤ VIN ≤ 25 V 1, 2, 3 All 20 mV 1.0 mA ≤ IO ≤ 20 mA 1, 2, 3 All 25 mV Line, load, and temperature 1, 2, 3 All 5.10 V 2 All 25 mV 1, 2, 3 All -30 -180 mA 4 All 47 57 kHz 4, 5, 6 All 1.0 % 1 All 7.8 8.8 mA 7.5 8.8 2.45 2.55 V -1.0 µA Reference output voltage VREF IO = 1.0 mA, TJ = +25°C Line regulation VRLINE Load regulation VRLOAD Total output variation Long term stability TA = +125°C, 1000 hours, 2/ 4.90 2/ VREF Output short-circuit current IOS OSCILLATOR SECTION Initial accuracy TJ = +25°C Voltage stability 12 V ≤ VCC ≤ 25 V Discharge current VRT/CT = 2 V Device types 05, 06, 07, and 08 3/ 2, 3 ERROR AMP SECTION Input voltage VIN Input bias current IIB Open loop voltage gain AVOL Unity gain bandwidth GBW Power supply rejection ratio Output sink current PSRR ISINK 1, 2, 3 All 1, 2, 3 All 4, 5, 6 All 65 dB 4, 5, 6 All 0.55 MHz 12 V ≤ VCC ≤ 25 V 4, 5, 6 All 60 dB VVFB = 2.7 V, 1, 2, 3 All 2.0 mA 1, 2, 3 All -0.5 mA 1, 2, 3 All 5.0 V 1, 2, 3 All VCOMP = 2.5 V 2.0 V ≤ VO ≤ 4.0 V 2/ VCOMP = 1.1 V Output source current ISOURCE VVFB = 2.3 V, VCOMP = 5.0 V VOUT high VOH VVFB = 2.3 V, RL = 15 kΩ to ground VOUT low VOL VVFB = 2.7 V, RL = 15 kΩ 1.1 V to VREF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max CURRENT SENSE SECTION Gain A Maximum input signal 4/ 5/ VCOMP = 5.0 V Input bias current IIB Delay to output TD VVFB = 0 V, 4/ 2/ 4, 5, 6 All 2.85 3.15 V/V 4, 5, 6 All 0.9 1.1 V 1, 2, 3 All -10 µA 9 All 300 ns VISENSE = 2 V (step input) 10, 11 ISINK = 20 mA 1, 2, 3 400 OUTPUT SECTION Output low voltage VOL All 0.4 2.2 ISINK = 200 mA Output high voltage VOH 1, 2, 3 ISOURCE = 20 mA All 13 tr CL = 1000 pF 9 2/ All 150 10, 11 Fall time tf CL = 1000 pF 9 2/ UVLOSAT VCC = 5 V, ISINK = 10 mA, ns 200 All 150 10, 11 UVLO saturation voltage V 12 ISOURCE = 200 mA Rise time V ns 200 1, 2, 3 All 1.2 V 1, 2, 3 01, 03 05, 07 15 17 V 02, 04 06, 08 7.8 9.0 01 05, 03 9.0 11 06 07, 08 7.0 8.2 02, 04 7.0 8.3 Device types 05, 06, 07, and 08. UNDER-VOLTAGE LOCKOUT SECTION Start threshold Minimum operating voltage VTH VMIN After turn-on 1, 2, 3 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 01, 02 05, 06 93 100 03, 04 07, 08 46 50 PWM SECTION Maximum duty cycle 1, 2, 3 tON / tOSC (max) Minimum duty cycle tON / % 1, 2, 3 All 0 % 1, 2, 3 All 1.0 mA 1, 2, 3 All 17 mA tOSC (min) TOTAL STANDBY CURRENT Start-up current ISTART Operating supply current ICC 1/ VVFB = VISENSE = 0 V TA = TJ. Characteristics apply at VCC = 15 V (adjust VCC above the start threshold before setting at 15 V), RT = 10 kΩ and CT = 3.3 nF unless otherwise specified. 2/ These parameters are guaranteed if not tested. 3/ Output frequency equals oscillator frequency for device types 01, 02, 05, and 06. Output frequency is one half oscillator frequency for device types 03, 04, 07, and 08. 4/ Parameter measured at trip point of latch with VFB = 0 V. 5/ Gain is defined as : A= ∆VCOMP ; 0 V ≤ VISENSE ≤ 0.8 V ∆VSENSE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 8 Device types All All All 01, 02 03, 04 All Case outlines C and D H P 2 2 X Terminal number 1 Terminal symbol COMP COMP COMP NC NC NC 2 NC VFB VFB COMP NC COMP 3 VFB ISENSE ISENSE NC COMP NC 4 NC RT/CT RT/CT NC NC NC 5 ISENSE POWER GND GROUND VFB VFB VFB 6 NC GROUND OUTPUT NC NC NC 7 RT/CT OUTPUT VCC ISENSE ISENSE ISENSE 8 POWER GND VC VREF NC RT/CT NC 9 GROUND VCC --- NC NC NC 10 OUTPUT VREF --- RT/CT NC RT/CT 11 VC --- --- NC NC NC 12 VCC --- --- GROUND POWER GND POWER GND 13 NC --- --- NC GROUND GROUND 14 VREF --- --- NC NC NC 15 --- --- --- OUTPUT OUTPUT OUTPUT 16 --- --- --- NC NC NC 17 --- --- --- VCC VC VC 18 --- --- --- NC VCC VCC 19 --- --- --- NC NC NC 20 --- --- --- VREF VREF VREF NOTE : Case outlines E and F are not available from an approved source. NC = No connect. FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 9 NOTE : Toggle flip flop used only in device types 03, 04, 07, and 08. FIGURE 2. Logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 10 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 11 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V --- --- --- Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) 1, 2, 3, 4 Group A test requirements (see 4.4) 1, 2, 3, 4, 5, 6, 1, 2, 3, 4, 5, 6, 1, 2, 3, 4, 5, 6, 9, 10, 11 9, 10, 11 9, 10, 11 1/ 1, 2, 3, 4 2/ 1/ 1, 2, 3, 4 2/ Group C end-point electrical parameters (see 4.4) 1 1 1 Group D end-point electrical parameters (see 4.4) 1 1 1 Group E end-point electrical parameters (see 4.4) --- --- 1/ 2/ --- 1/ PDA applies to subgroup 1. 2/ Subgroups 9, 10, and 11 are guaranteed if not tested to the limits specified in table I. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 12 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-86704 A REVISION LEVEL K SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-05-30 Approved sources of supply for SMD 5962-86704 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8670401CA 34333 SG1842J/883B 5962-8670401DA 01295 UC1842W/883B 5962-8670401EA 3/ SG1842J/883B 5962-8670401FA 3/ SG1842F/883B 5962-8670401HA 34333 SG1842F/883B 5962-8670401PA 01295 UC1842J/883B 34333 SG1842Y/883B U3158 IP1842J/883B 5962-8670401XA 01295 UC1842L/883B 5962-86704012A 34333 SG1842L/883B 5962-8670401VPA 01295 UC1842JQMLV 5962-8670401V2A 01295 UC1842LQMLV 5962-8670402CA 34333 SG1843J/883B 5962-8670402DA 01295 UC1843W/883B 5962-8670402EA 3/ SG1843J/883B 5962-8670402FA 3/ SG1843F/883B See footnotes at end of table. 1 of 5 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8670402HA 34333 SG1843F/883B 5962-8670402PA 01295 UC1843J/883B 34333 SG1843Y/883B U3158 IP1843J/883B 5962-8670402XA 01295 UC1843L/883B 5962-86704022A 34333 SG1843L/883B 5962-8670402VPA 01295 UC1843JQMLV 5962-8670402V2A 01295 UC1843LQMLV 5962-8670403CA 34333 SG1844J/883B 5962-8670403DA 01295 UC1844W/883B 5962-8670403EA 3/ SG1844J/883B 5962-8670403FA 3/ SG1844F/883B 5962-8670403HA 34333 SG1844F/883B 5962-8670403PA 01295 UC1844J/883B 34333 SG1844Y/883B U3158 IP1844J/883B 5962-8670403XA 01295 UC1844L/883B 5962-86704032A 34333 SG1844L/883B 5962-8670403VPA 01295 UC1844JQMLV 5962-8670403V2A 01295 UC1844LQMLV See footnotes at end of table. 2 of 5 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8670404CA 34333 SG1845J/883B 5962-8670404DA 01295 UC1845W/883B 5962-8670404EA 3/ SG1845J/883B 5962-8670404FA 3/ SG1845F/883B 5962-8670404HA 34333 SG1845F/883B 5962-8670404PA 01295 UC1845J/883B 34333 SG1845Y/883B U3158 IP1845J/883B 5962-8670404XA 01295 UC1845L/883B 5962-86704042A 34333 SG1845L/883B 5962-8670404VPA 01295 UC1845JQMLV 5962-8670404V2A 01295 UC1845LQMLV 5962-8670405PA 01295 UC1842AJ/883B 5962-8670405XA 01295 UC1842AL/883B 5962-8670405VPA 01295 UC1842AJQMLV 5962-8670405V2A 01295 UC1842ALQMLV See footnotes at end of table. 3 of 5 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8670406PA 01295 UC1843AJ/883B 5962-8670406XA 01295 UC1843AL/883B 5962-8670406VPA 01295 UC1843AJQMLV 5962-8670406V2A 01295 UC1843ALQMLV 5962-8670407PA 01295 UC1844AJ/883B 5962-8670407XA 01295 UC1844AL/883B 5962-8670407VPA 01295 UC1844AJQMLV 5962-8670407V2A 01295 UC1844ALQMLV 5962-8670408PA 01295 UC1845AJ/883B 5962-8670408XA 01295 UC1845AL/883B 5962-8670408VPA 01295 UC1845AJQMLV 5962-8670408V2A 01295 UC1845ALQMLV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. 4 of 5 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. Vendor CAGE number Vendor name and address 01295 Texas Instruments, Incorporated Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-0084 34333 Microsemi Integrated Products 11861 Western Avenue Garden Grove, CA 92641-1816 U3158 Semelab PLC Coventry Road, Lutterworth, Leicestershire LE174JB United Kingdom Point of contact : Martinez & Associates 234 Boston Post Road Wayland, MA 01778 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 5 of 5