REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Added footnote 9 to table I for IIL3, IIL4, IIH3, and IIH4. Figure 1; Made corrections to case outlines X and Y. Redrew entire document. -sld 01-12-10 Raymond Monnin B Figure 1, case outline X; corrected the dimension L in the conversion table from .024 (0.61 mm) min and .026 (0.66 mm) max to .240 (6.10 mm) min and .260 (6.60 mm) max. -sld 02-02-25 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DOCUMENT HAS BEEN REPLACED REV SHEET REV B B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Robert M. Heber STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 CHECKED BY Ray Monnin http://www.dscc.dla.mil APPROVED BY Michael A. Frye MICROCIRCUIT, HYBRID, LINEAR, MIL-STD-1553 BUS CONTROLLER, RTU, AND MONITOR UNIT DRAWING APPROVAL DATE 88-12-20 REVISION LEVEL B SIZE A SHEET CAGE CODE 5962-88585 67268 1 OF DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 24 5962-E275-02 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to processed in accordance with MIL-PRF-38534. 1.2 PIN. The PIN shall be as shown in the following example: 01 Device type (see 1.2.1) 5962-88585 Drawing number X Case outline (see 1.2.2) X Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 Generic number Circuit function BUS-65600, CT2565 CT2565-001 MIL-STD-1553, BUS controller, RTU, and monitor unit MIL-STD-1553, BUS controller, RTU, and monitor unit 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Descriptive designator See figure 1 See figure 1 Terminals Package style 78 82 Dual-in-line Flat pack 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) ..................................................... Input voltage range (VIN) ......................................................... Supply current (ICC) ................................................................. Power dissipation (PD) ............................................................ Storage temperature range..................................................... Lead temperature (soldering, 10 seconds) ............................. Thermal rise, junction-to-case (∆TJ) ........................................ -0.5 V dc to +7.0 V dc GND -0.3 V dc to VCC +0.3 V dc 70 mA 2/ 385 mW 2/ -65°C to +150°C +300°C +5°C 1.4 Recommended operating conditions. Supply voltage range (VCC) ..................................................... Minimum logic high input voltage (VIH).................................... Maximum logic low input voltage (VIL)..................................... Case operating temperature range (TC).................................. Operating frequency (FOP) ...................................................... 1/ 2/ 4.5 V dc to 5.5 V dc 2.4 V dc 0.7 V dc -55°C to 125°C 12.0 MHz Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Applies up to TC = +125°C with all outputs open. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1553 - Aircraft Internal Time Division Command/Response Multiplex Data Bus. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38534. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Timing diagram(s). The timing diagram(s) shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 3 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Group A subgroups 1/ Conditions -55°C ≤ TC ≤+125°C unless otherwise specified Device types Limits Min Unit Max Supply current ICC VCC = 5.5 V, FIN = 12 MHz, measured at pin 20 for case outline X and pin 40 for case outline Y with all outputs open 1, 2, 3 01,02 High level output voltage 2/ VOH1 IOH = -5.2 mA 1,2,3 01,02 2.7 High level output voltage 3/ VOH2 VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V IOH = -40 µA 1,2,3 01,02 2.7 High level output voltage 4/ VOH3 IOH = -80 µA 1,2,3 01,02 2.7 Low level output voltage 2/ VOL1 IOL = 5.2 mA 1,2,3 01,02 0.4 Low level output voltage 3/ VOL2 IOL = 1.6 mA 1,2,3 01,02 0.4 Low level output voltage 4/ VOL3 IOL = 2.4 mA 1,2,3 01,02 0.4 High level input current 5/ IIH1 1,2,3 01,02 -20 +20 High level input current 6/ IIH2 1,2,3 01,02 -10 +10 High level input current 7/ IIH3 9/ 1,2,3 01,02 0.0 -250 High level input current 8/ IIH4 9/ 1,2,3 01,02 0.0 -800 Low level input current 5/ IIL1 1,2,3 01,02 -20 +20 Low level input current 6/ IIL2 1,2,3 01,02 -10 +10 Low level input current 7/ IIL3 9/ 1,2,3 01,02 0.0 -500 Low level input current 8/ IIL4 9/ 1,2,3 01,02 0.0 1.6 7,8 01,02 Functional tests 10/ Maximum clock frequency VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V VCC = 5.5 V, VIN = 2.5 V VCC = 5.5 V, VIN = 0.4 V VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V, fIN = 12 MHz 70 mA V V µA µA mA Pass/ fail fMAX 50% duty cycle 11/ 9,10,11 01,02 12.0 MHz BUSGRNT delay, CMD word td1 9,10,11 01,02 1.5 µs BUSGRNT delay, TX data word td2 VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V, fIN = 12 MHz, See figure 3 11/ 12/ 9,10,11 01,02 15.5 µs BUSGRNT delay, RX data td3 9,10,11 01,02 2.33 µs BUSGRNT to BUSACK delay (RTU handshake) td4 9,10,11 01,02 250 ns DELAY TIMING See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups 1/ Conditions -55°C ≤ TC ≤+125°C unless otherwise specified Device types Limits Min Unit Max DELAY TIMING - CONTINUED BUSACK to OE delay td5 OE to CS delay td6 CS to ADRINC delay VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V, fIN = 12 MHz, See figure 3 11/ 12/ 9,10,11 01,02 25 ns 9,10,11 01,02 25 ns td7 9,10,11 01,02 110 ns BUSACK to WR delay ( BC write) td8 9,10,11 01,02 378 ns WR to CS delay td9 9,10,11 01,02 25 ns NBGRNT to LMC, WC, T/ R delay td10 9,10,11 01,02 500 667 ns LMC to ILLCMD latch tD11 9,10,11 01,02 250 NBGRNT to INCMD delay tD12 9,10,11 01,02 0.9 1.1 µs BUSACK to SOM delay tD13 9,10,11 01,02 140 190 ns NBGRNT low to status latch tD14 9,10,11 01,02 2.5 3.5 µs CS to ADRINC delay (RTU read) tD15 9,10,11 01,02 110 ns BUSACK to WR delay (RTU write) tD16 9,10,11 01,02 225 ns WR to CS delay (RTU write) tD17 9,10,11 01,02 25 ns BUSREQ to BUSGRNT delay tD18 9,10,11 01,02 2.0 µs BUSGRNT to BUSACK delay (MT transfer) tD19 9,10,11 01,02 250 ns BUSACK to WR delay (MT transfer) tD20 9,10,11 01,02 378 ns 300 140 300 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups 1/ Conditions -55°C ≤ TC ≤+125°C unless otherwise specified Device types Limits Min Unit Max PULSE WIDTH TIMING BUSREQ pulse width (RTU handshake) tPW1 BUSACK pulse width (RTU handshake) VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V, fIN = 12 MHz, See figure 3 10/ 12/ 9,10,11 01,02 667 ns tPW2 9,10,11 01,02 475 600 ns CS , ( OE ) pulse width (BC read) tPW3 9,10,11 01,02 640 690 ns ADRINC pulse width tPW4 9,10,11 01,02 60 110 ns CS and WR pulse width (BC write) tPW5 9,10,11 01,02 140 190 ns NBGRNT pulse width tPW6 9,10,11 01,02 140 190 ns SOM pulse width tPW7 9,10,11 01,02 140 190 ns CS , OE , and BUSACK pulse width (RTU read) tPW8 9,10,11 01,02 475 600 ns CS and WR pulse width (RTU write) tPW9 9,10,11 01,02 140 190 ns BUSREQ pulse width (BC handshake) tPW10 9,10,11 01,02 752 ns BUSGRNT pulse width (BC handshake) tPW11 9,10,11 01,02 250 ns BUSACK pulse width (BC handshake) tPW12 9,10,11 01,02 640 BUSGRNT pulse width (MT transfer) tPW13 9,10,11 01,02 250 690 ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups 1/ Conditions -55°C ≤ TC ≤+125°C unless otherwise specified Device types Limits Min Unit Max SET-UP TIMING BC read data set-up time tS1 9,10,11 01,02 BC write data valid set-up time tS2 9,10,11 01,02 100 ns CMD valid set-up time tS3 9,10,11 01,02 100 ns RTU read data set-up time tS4 9,10,11 01,02 RTU write data valid set-up tS5 9,10,11 01,02 100 ns tS6 9,10,11 01,02 100 ns VCC = 4.5 V, VIH = 2.5 V, VIL = 0.4 V, fIN = 12 MHz, See figure 3 10/ 12/ 250 ns 166 ns prior to leading edge of WR ID word valid set-up time See footnotes on next page. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 8 TABLE I. Electrical performance characteristics - Continued. 1/ All Group A subgroup testing may be performed concurrently. 2/ Measured at the following pins: Case X: Pins 14, 21 - 28, 54, and 60 - 67. Case Y: Pins 28, 29, and 66 - 81. 3/ Measured at the following pins: Case X: Pins 3 - 5, 9, 12, 13, 15 -19, 29, 30, 42 - 44, 46, 49, 51 - 53, 55, 57, 59, 68, 71, 75, and 78. Case Y: Pins 5 - 10, 18, 23 - 27, 30 - 32, 34 - 36, 38, 39, 44, 50, 58, and 63 - 65. 4/ Measured at the following pins: Case X: Pins 31, 37, 69, and 76. Case Y: Pins 48, 49, 61, and 62. 5/ Measured at the following pins: Case X: Pins 1 and 45. Case Y: Pins 2 and 11. 6/ Measured at the following pins: Case X: Pins 2, 6 - 8, 10, 21 - 28, 32, 36, 38, 39, 41, 47, 48, 60 - 67, 70, and 77. Case Y: Pins 3, 4, 12, 14 - 17, 20, 45 - 47, 51, 59, 60, and 66 - 81. 7/ Measured at the following pins: Case X: Pins 33 and 58. Case Y: Pins 37 and 57. 8/ Measured at the following pins: Case X: Pins 34, 35, and 72 - 74. Case Y: Pins 52 - 56. 9/ For device type 02, case X, pins 33 - 35 and 72 - 74, and case Y pins 52 - 57 have a 0.01 µF capacitor to ground. 10/ Functional tests performed to verify functionality of the device as a MIL-STD-1553 Bus Controller (BC), Remote Terminal Unit (RTU), and Bus Monitor (BM). These tests shall be a part of the manufacturer's test tapes and shall be made available to the acquiring activity upon request. 11/ If not tested, parameter(s) shall be guaranteed to the limits specified in table I. 12/ All timing characteristics measured at 2.7 V and 0.4 V, unless otherwise specified. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 9 Case outline X Symbol A Φb D D1 D2 E E1 E2 e e1 e2 L S S1 Millimeters Min Max 6.35 0.33 0.58 47.50 41.78 42.04 37.97 38.23 53.34 48.13 48.39 45.59 45.85 2.54 TYP 2.41 2.67 1.14 1.40 6.10 6.60 1.78 2.03 1.91 TYP Inches Min Max .250 .013 .023 1.870 1.645 1.655 1.495 1.505 2.100 1.895 1.905 1.795 1.805 .100 TYP .095 .105 .045 .055 .240 .260 .070 .080 .075 TYP NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 10 Case outline Y Symbol Millimeters Min A Inches Max Min 4.72 A1 .186 2.03 REF Φb 0.30 Max .080 REF 0.46 .012 .018 Φc 0.20 0.30 D 40.51 40.77 1.595 1.605 E 55.50 55.75 2.185 2.195 e L .008 1.27 TYP .050 TYP 10.16 S1 .012 .400 2.41 REF .095 REF NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 11 Device types All Case outline X Device types All Case outline X Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 RT/ BC 27 DB12 53 WC4 2 MT 28 DB14 54 TXINH A 3 STATEN 29 LWORD 55 LMC 4 TIMEOUT 30 MSGERR 56 TESTIN 5 HSFAIL 31 TXDATA A 57 EOM 6 DBACCEPT 32 RXDATA A 58 BUFENA 7 SSFLAG 33 RTADP 59 BUSACK 8 SVCREQ 34 RTAD1 60 DB1 9 INCMD 35 RTAD3 61 DB3 10 SSER 36 RESET 62 DB5 11 TESTOUT 37 TXDATA B 63 DB7 12 WC1 38 RXDATA B 64 DB9 13 WC3 39 12MHz 65 DB11 14 TXINH B 40 GND 66 DB13 15 T/ R 41 BCSTART 67 DB15 (MSB) 16 CHA /CHB 42 NBGRNT 68 STATERR 17 CS 43 BITEN 69 TXDATA A 18 OE 44 WR 70 RXDATA A 19 BUSREQ 45 BUSGRNT 71 NO DT 20 +5 V 46 LOOPERR 72 RTAD0 21 DB0 (LSB) 47 SSBUSY 73 RTAD2 22 DB2 48 ILLCMD 74 RTAD4 23 DB4 49 ADRINC 75 BCSTRCV 24 DB6 50 CHASSIS 76 TXDATA B 25 DB8 51 WC0 77 RXDATA B 26 DB10 52 WC2 78 SOM FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 12 Device types All Case outline Y Device types All Case outline Y Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 NC 29 TXINH A 57 RTADP 2 RT/ BC 30 T/ R 58 NO DT 3 BCSTART 31 LMC 59 RXDATA A 4 MT 32 CHA /CHB 60 RXDATA A 5 NBGRNT 33 TESTIN 61 TXDATA A 6 STATEN 34 CS 62 TXDATA A 7 BITEN 35 EOM 63 MSGERR 8 TIMEOUT 36 OE 64 STATERR 9 WR 37 BUFENA 65 LWORD 10 HSFAIL 38 BUSREQ 66 DB15 (MSB) 11 BUSGRNT 39 BUSACK 67 DB14 12 DBACCEPT 40 +5 V 68 DB13 13 LOOPERR 41 NC 69 DB12 14 SSFLAG 42 NC 70 DB11 15 SSBUSY 43 GROUND 71 DB10 16 SVCREQ 44 SOM 72 DB9 17 ILLCMD 45 12MHz 73 DB8 18 INCMD 46 RXDATA B 74 DB7 19 ADRINC 47 RXDATA B 75 DB6 20 SSER 48 TXDATA B 76 DB5 21 CHASSIS 49 TXDATA B 77 DB4 22 TESTOUT 50 BCSTRCV 78 DB3 23 WC0 51 RESET 79 DB2 24 WC1 52 RTAD4 80 DB1 25 WC2 53 RTAD3 81 DB0 (LSB) 26 WC3 54 RTAD2 82 NC 27 WC4 55 RTAD1 28 TXINH B 56 RTAD0 FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 13 FIGURE 3. Timing diagram - RTU handshake. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 14 FIGURE 3. Timing diagram - BC read/write - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 15 FIGURE 3. Timing diagram - RTU command word handling/status inputs - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 16 FIGURE 3. Timing diagram - RTU read/write - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 17 FIGURE 3. Timing diagram - BC handshake - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 18 FIGURE 3. Timing diagram - MT transfer - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 19 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1, 7, 9 Final electrical parameters 1*, 2, 3, 7*, 8, 9*, 10, 11 Group A test requirements 1, 2, 3, 7, 8, 9, 10, 11 Group C end-point electrical parameters 1, 2, 3, 7, 8, 9, 10, 11 Not applicable End-point electrical parameters for Radiation Hardness Assurance (RHA) devices * PDA applies to subgroups 1, 7, and 9. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 20 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Pin functions. Microcircuits conforming to this drawing shall have pin functions as specified in table III herein. TABLE III. Pin functions. Pin name I/O Description RT/ BC I Remote Terminal/Bus controller. Logic "1" for RT mode, logic "0" for BC mode. MT I Bus monitor. Logic "0" for MT mode, Logic "1" for BC mode. STATEN O Status Enable. Indicates status word being transferred on internal bus. TIMEOUT O Indicates no response timeout has occurred during BC or RTU (RT to RT transfer). HSFAIL O Handshake failure. Indicates subsystem failed to grant a bus request (DMA handshake) within the required time period. DBACCEPT I Dynamic Bus Control Accept. Controls the DBACCEPT bit in RTU status word for response to valid mode command on 1553 bus. SSFLAG I Subsystem flag. Controls SSFLAG in RTU status word. SVCREQ I Service Request. Controls SVCREQ bit in RTU status word. INCMD O In Command. Indicates BC/RTU currently in message transfer sequence. SSER I Subsystem Error. Controls terminal flag bit in status word. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 21 TABLE III. Pin functions - Continued. Pin name I/O Description TESTOUT -- Factory test pin, no connection. WC1 O Word Count bit 1. Received from Command Word. WC3 O Word Count bit 3. Received from Command Word. TXINH B O Transmitter Inhibit Channel B. T/ R O Transmit/Receive. Indicates T/ R bit of current Command Word in RTU mode. CHA /CHB O Channel A/Channel B. Indicates current selected channel. CS O Chip select. Used for external memory operations. OE O Output enable. Used for memory read operations. BUSREQ O Bus Request. Initiates handshaking prior to all subsystem transfers. +5V I + 5 V dc input. DB0 (LSB) I/O Data Bus Bit 0. DB2 I/O Data Bus Bit 2. DB4 I/O Data Bus Bit 4. DB6 I/O Data Bus Bit 6. DB8 I/O Data Bus Bit 8. DB10 I/O Data Bus Bit 10. DB12 I/O Data Bus Bit 12. DB14 I/O Data Bus Bit 14. LWORD -- For factory use only. Last word output in BC mode indicates last data word of current message transfer has been transferred on the data bus. MSGERR O Indicates error occurred during current message sequence in BC/RTU mode. TXDATA A O Transmit data A. Data output to tranceiver input. RXDATA A I Receive data A. Data input from transceiver. RTADP I RT Address Parity Bit. RTAD1 I RT Address Bit 1. RTAD3 I RT Address Bit 3. RESET I Resets all unit parameters (200 ns minimum pulse). TXDATA B O Transmit Data B. Data output to transmitter input. RXDATA B I Receive Data B. Data input from transceiver. 12 MHz I 12 MHz TTL clock. GND -- Signal ground. BCSTART I Bus Controller Start. Initiates BC message transfer and begins MT operation (on rising edge). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 22 TABLE III. Pin functions - Continued. Pin name I/O Description NBGRNT O New Bus Grant. Indicates start of message transfer sequence. BITEN O Built In Test Enable. Indicates RT transfer of BIT word on internal 16 bit bus. WR O Write Enable. Enables memory write operation from unit. BUSGRNT I Bus Grant. Response to BUSREQ output. (DMA-type handshake). LOOPERR O Loop Error. Logic "0" indicates failure during loop back of last transmitted data in BC/RTU mode. SSBUSY I Subsystem Busy. Controls the (Subsystem) Busy Bit in status word ILLCMD I Illegal Command. Used to block RT response to illegal command. ADRINC O Address Increment. Low level pulse which returns high after the rising edge of CS (memory read/write). Used to increment external address counter. CHASSIS -- Chassis ground. WC0 O Word Count Bit 0. Received from Command Word. WC2 O Word Count Bit 2. Received from Command Word. WC4 O Word Count Bit 4. Received from Command Word. TXINH A O Transmitter Inhibit Channel A. LMC O Latched Mode Command. Logic "1" indicates current command word is a mode code; WC0 through WC4 specifies mode. TESTIN -- Factory test input-enable fail safe counter for selected channel. EOM O End of Message. Logic "0" (pulse) occurs when BC/RTU message is completed. BUFENA I Buffer Enable. May be driven low during STATEN or BITEN low. Allows subsystem to read status or BIT words. Enables internal 16 bit bus onto subsystem bus. BUSACK O Bus Acknowledge. Low during DMA handshake, in response to BUSGRNT . DB1 I/O Data Bus Bit 1. DB3 I/O Data Bus Bit 3. DB5 I/O Data Bus Bit 5. DB7 I/O Data Bus Bit 7. DB9 I/O Data Bus Bit 9. DB11 I/O Data Bus Bit 11. DB13 I/O Data Bus Bit 13. DB15 (MSB) I/O Data Bus Bit 15. STATERR O Status error. Indicates one or more bits set or address mismatch in received status word. TXDATA A O Transmit Data A. Data output to transceiver input. RXDATA A I Receive Data A. Data input from transceiver. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 23 TABLE III. Pin functions - Continued. Pin name I/O Description NO DT O No Data. Logic "0" indicates idle 1553, Logic "1" indicates selected bus channel active. RTAD0 I RT Address Bit 0. RTAD2 I RT Address Bit 2. RTAD4 I RT Address Bit 4. BCSTRCV O Broadcast Receive. Indicates current command is broadcast. TXDATA B O Transmit Data B. Data output to transmitter input. RXDATA B I Receive Data B. Data input from transceiver. SOM O Start of message. Indicates Command Word available to subsystem on parallel data bus. Active during the Command Word DMA handshake period. 6.4 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.5 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.6 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0512. 6.7 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88585 A REVISION LEVEL B SHEET 24 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-02-25 Approved sources of supply for SMD 5962-88585 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8858501XA 5962-8858501XA 5962-8858501XC 5962-8858501XC 3/ 88379 3/ 88379 BUS-65600-883B CT2565-001-2 BUS-65600-883B CT2565-001-1 5962-8858501YA 5962-8858501YA 5962-8858501YC 5962-8858501YC 3/ 88379 3/ 88379 BUS-65601-883B CT2565-201-2 BUS-65601-883B CT2565-201-1 5962-8858502XA 5962-8858502XC 5962-8858502YA 5962-8858502YC 88379 88379 88379 88379 CT2565-002-2 CT2565-002-1 CT2565-202-2 CT2565-202-1 Vendor similar PIN 2/ 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ No longer available. Vendor CAGE number 88379 Vendor name and address Aeroflex Circuit Technology Corporation 35 South Service Road Plainview, NY 11803 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.