Agilent HFCT-5951xxx/HFCT-5952xxx Single Mode Laser Small Form Factor Transceivers for ATM, SONET OC-12/ SDH STM-4 (S4.1) Data Sheet Description The HFCT-5951xxx/HFCT5952xxx transceivers are high performance, cost effective modules for serial optical data communications applications specified for a signal rate of 622 Mb/s. They are designed to provide SONET/SDH compliant links for 622 Mb/s intermediate reach links. All modules are designed for single mode fiber and operate at a nominal wavelength of 1300 nm. They incorporate high performance, reliable, long wavelength optical device and proven circuit technology to give long life and consistent service. The transmitter section consists of a Fabry Perot Laser (FP). The transmitter has full IEC 825 and CDRH Class 1 eye safety. The receiver section uses a MOVPE grown planar PIN photodetector for low dark current and excellent responsivity. A pseudo-ECL logic interface simplifies interface to external circuitry. These transceivers are supplied in 2 x 5 and 2 x 10 DIP style footprint with the LC fiber connector interface and are fully compliant with SFF Multi Source Agreement (MSA). Features • HFCT-5951xxx/HFCT-5952xxx are compliant to the intermediate reach SONET OC12/SDH STM-4 (S4.1) specifications • Multisourced 2 x 5 and 2 x 10 package styles with LC receptacle • Single +3.3 V power supply • Temperature range: HFCT-595xTL/TG: 0°C to +70°C HFCT-595xATL/ATG: -40°C to +85°C • Wave solder and aqueous wash process compatible • Manufactured in an ISO9002 certified facility • Performance HFCT-5951xxx/HFCT-5952xxx: Links of 15 km with 9/125 µm SMF • Fully Class 1 CDRH/IEC 825 compliant • Pin Outs: HFCT-5951xxx 2 x 5 HFCT-5952xxx 2 x 10 Applications • SONET/SDH equipment interconnect, STS-12/SDH STM-4 rate • Intermediate reach (up to 15 km) ATM links Functional Description Receiver Section Design The receiver section contains an InGaAs/InP photo detector and a preamplifier mounted in an optical subassembly. This optical subassembly is coupled to a postamp/decision circuit. The postamplifier is ac coupled to the preamplifier as illustrated in Figure 1. The coupling capacitors are large enough to pass the SONET/SDH test pattern at 622 MBd without significant distortion or performance penalty. If a lower signal rate, or a code which has significantly more low frequency content is used, sensitivity, jitter and pulse distortion could be degraded. Figure 1 also shows a filter function which limits the bandwidth of the preamp output signal. The filter is designed to bandlimit the preamp output noise and thus improve the receiver sensitivity. These components will reduce the sensitivity of the receiver as the signal bit rate is increased above 622 Mb/s. The device incorporates a photodetector bias circuit. This output must be connected to VCC and can be monitored by connecting through a series resistor (see application section). Noise Immunity The receiver includes internal circuit components to filter power supply noise. However under some conditions of EMI and power supply noise, external power supply filtering may be necessary (see application section). The Signal Detect Circuit The signal detect circuit works by sensing the peak level of the received signal and comparing this level to a reference. The SD output is low voltage TTL. PHOTODETECTOR BIAS PECL OUTPUT BUFFER AMPLIFIER GND Figure 1 - Receiver Block Diagram 2 DATA OUT FILTER TRANSIMPEDANCE PREAMPLIFIER SIGNAL DETECT CIRCUIT TTL OUTPUT BUFFER DATA OUT SD Functional Description Transmitter Section Design The transmitter section uses a Fabry Perot (FP) laser as its optical source, see Figure 2. The package has been designed to be compliant with IEC 825 eye safety requirements under any single fault condition. The optical output is controlled by a custom IC that detects the laser output via the monitor photodiode. This IC provides both dc and ac current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and operating life. The transmitter section also includes monitor circuitry for both the laser diode bias current and laser diode optical power. FP LASER DATA LASER MODULATOR DATA PECL INPUT LASER BIAS DRIVER BMON(+) BMON(-) Note 1 LASER BIAS CONTROL PMON(+) PMON(-) Note 1 Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN Figure 2 - Simplified Transmitter Schematic 3 PHOTODIODE (rear facet monitor) Note 1 Package The overall package concept for the Agilent transceiver consists of four basic elements; two optical subassemblies and two electrical subassemblies. They are housed as illustrated in the block diagram in Figure 3. The receiver electrical subassembly includes an internal shield for the electrical and optical subassemblies to ensure high immunity to external EMI fields. The package outline drawing and pin out are shown in Figures 4, 5 and 6. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 and 2 x 10 DIP. The electrical subassemblies consist of high volume multilayer printed circuit boards on which the IC and various surface-mounted passive circuit elements are attached. The optical subassemblies are each attached to their respective transmit or receive electrical subassemblies. These two units are than fitted within the outer housing of the transceiver that is molded of filled nonconductive plastic to provide mechanical strength. The housing is then encased with a metal EMI protective shield. Four ground connections are provided for connecting the EMI shield to signal ground. The PCB’s for the two electrical subassemblies both carry the signal pins that exit from the bottom of the transceiver. The solder posts are fastened into the molding of the device and are designed to provide the mechanical strength required to withstand the loads imposed on the transceiver by mating with the LC connectored fiber cables. Although they are not connected electrically to the transceiver, it is recommended to connect them to chassis ground. RX SUPPLY Note 3 PHOTO DETECTOR BIAS Note 2 DATA OUT PIN PHOTODIODE PREAMPLIFIER SUBASSEMBLY QUANTIZER IC DATA OUT RX GROUND SIGNAL DETECT TX GROUND DATA IN DATA IN Tx DISABLE BMON(+) Note 1 BMON(-) Note 1 PMON(+) Note 1 PMON(-) Note 1 LC RECEPTACLE Note 1 LASER BIAS MONITORING LASER DRIVER AND CONTROL CIRCUIT LASER DIODE OUTPUT POWER MONITORING Note 1 TX SUPPLY LASER OPTICAL SUBASSEMBLY CASE Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN Note 2: CONNECTED TO RXVCC IN 2 x 5 DESIGN Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION. Figure 3 - Block Diagram. 4 15.0 ± 0.2 (0.591 ± 0.008) 13.59 + 0 - 0.2 0.535 +0 -0.008 ( 13.59 (0.535) MAX ) TOP VIEW 48.2 (1.898) 6.25 (0.246) 9.8 (0.386) MAX 10.8 ± 0.2 9.6 ± 0.2 (0.425 ± 0.008)(0.378 ±0.008) 3.81 (0.15) 10.16 (0.4) FRONT VIEW Ø 1.07 (0.042) 19.5 ±0.3 (0.768 ±0.012) 1 (0.039) 20 x 0.5 (0.02) 1.78 (0.07) 0.25 (0.01) 1 (0.039) BACK VIEW SIDE VIEW 20 x 0.25 (PIN THICKNESS) (0.01) NOTE: END OF PINS CHAMFERED BOTTOM VIEW DIMENSIONS IN MILLIMETERS (INCHES) DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA. Figure 4 - HFCT-5951xxx/HFCT-5952xxx Package Outline Drawing (2 x 10 Design shown) 5 Connection Diagram (HFCT-5952xxx) RX TX Mounting Studs/ Solder Posts Package Grounding Tabs PHOTO DETECTOR BIAS RECEIVER SIGNAL GROUND RECEIVER SIGNAL GROUND NOT CONNECTED NOT CONNECTED RECEIVER SIGNAL GROUND RECEIVER POWER SUPPLY SIGNAL DETECT RECEIVER DATA OUTPUT BAR RECEIVER DATA OUTPUT o o o o o o o o o o 1 20 o 2 Top 19 o o 3 View 18 4 17 o 5 16 o 6 15 o 7 14 o 8 13 o 9 12 o 10 11 o LASER DIODE OPTICAL POWER MONITOR - POSITIVE END LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END LASER DIODE BIAS CURRENT MONITOR - POSITIVE END LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END TRANSMITTER SIGNAL GROUND TRANSMITTER DATA IN BAR TRANSMITTER DATA IN TRANSMITTER DISABLE TRANSMITTER SIGNAL GROUND TRANSMITTER POWER SUPPLY Figure 5 - Pin Out Diagram (Top View) Pin Descriptions: Pin 1 Photo Detector Bias, VpdR: This pin enables monitoring of photo detector bias current. It must be connected directly to VCCRX, or to VCCRX through a resistor (Max 200 R) for monitoring photo detector bias current. Pins 2, 3, 6 Receiver Signal Ground VEE RX: Directly connect these pins to the receiver ground plane. Pins 4, 5 DO NOT CONNECT Pin 7 Receiver Power Supply VCC RX: Provide +3.3 V dc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC RX pin. Note: the filter circuit should not cause VCC to drop below minimum specification. Pin 8 Signal Detect SD: Normal optical input levels to the receiver result in a logic “1” output. Low optical input levels to the receiver result in a logic “0” output. This Signal Detect output can be used to drive a low voltage TTL input on an upstream circuit, such as Signal Detect input or Loss of Signal-bar. 6 Pin 9 Receiver Data Out Bar RD-: No internal terminations are provided. See recommended circuit schematic. Pin 10 Receiver Data Out RD+: No internal terminations are provided. See recommended circuit schematic. Pin 11 Transmitter Power Supply VCC TX: Provide +3.3 V dc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC TX pin. Pins 12, 16 Transmitter Signal Ground VEE TX: Directly connect these pins to the transmitter signal ground plane. Pin 13 Transmitter Disable TDIS: Optional feature, connect this pin to +3.3 V TTL logic high “1” to disable module. To enable module connect to TTL logic low “0”. Pin 14 Transmitter Data In TD+: No internal terminations are provided. See recommended circuit schematic. Pin 15 Transmitter Data In Bar TD-: No internal terminations are provided. See recommended circuit schematic. Pin 17 Laser Diode Bias Current Monitor - Negative End BMON– The laser diode bias current is accessible by measuring the voltage developed across pins 17 and 18. Dividing the voltage by 10 Ohms (internal) will yield the value of the laser bias current. Pin 18 Laser Diode Bias Current Monitor - Positive End BMON+ See pin 17 description. Pin 19 Laser Diode Optical Power Monitor - Negative End PMON– The back facet diode monitor current is accessible by measuring the voltage developed across pins 19 and 20. The voltage across a 200 Ohm internal resistor between pins 19 and 20 will be proportional to the photo current. Pin 20 Laser Diode Optical Power Monitor - Positive End PMON+ See pin 19 description. Mounting Studs/Solder Posts The two mounting studs are provided for transceiver mechanical attachment to the circuit board. It is recommended that the holes in the circuit board be connected to chassis ground. Package Grounding Tabs Connect four package grounding tabs to signal ground. Connection Diagram (HFCT-5951xxx) RX TX Mounting Studs/ Solder Posts Package Grounding Tabs Top View RECEIVER SIGNAL GROUND RECEIVER POWER SUPPLY SIGNAL DETECT RECEIVER DATA OUT BAR RECEIVER DATA OUT o o o o o 1 2 3 4 5 10 9 8 7 6 o o o o o TRANSMITTER DATA IN BAR TRANSMITTER DATA IN TRANSMITTER DISABLE TRANSMITTER SIGNAL GROUND TRANSMITTER POWER SUPPLY Figure 6 - Pin Out Diagram (Top View) Pin Descriptions: Pin 1 Receiver Signal Ground VEE RX: Directly connect this pin to the receiver ground plane. Pin 2 Receiver Power Supply VCC RX: Provide +3.3 V dc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC RX pin. Note: the filter circuit should not cause VCC to drop below minimum specification. Pin 3 Signal Detect SD: Normal optical input levels to the receiver result in a logic “1” output. Low optical input levels to the receiver result in a logic “0” output. This Signal Detect output can be used to drive a low voltage TTL input on an upstream circuit, such as Signal Detect input or Loss of Signal-bar. 7 Pin 4 Receiver Data Out Bar RD-: No internal terminations are provided. See recommended circuit schematic. Pin 9 Transmitter Data In TD+: No internal terminations are provided. See recommended circuit schematic. Pin 5 Receiver Data Out RD+: No internal terminations are provided. See recommended circuit schematic. Pin 10 Transmitter Data In Bar TD-: No internal terminations are provided. See recommended circuit schematic. Pin 6 Transmitter Power Supply VCC TX: Provide +3.3 V dc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC TX pin. Mounting Studs/Solder Posts The two mounting studs are provided for transceiver mechanical attachment to the circuit board. It is recommended that the holes in the circuit board be connected to chassis ground. Pin 7 Transmitter Signal Ground VEE TX: Directly connect this pin to the transmitter signal ground plane. Pin 8 Transmitter Disable TDIS: Optional feature, connect this pin to +3.3 V TTL logic high “1” to disable module. To enable module connect to TTL logic low “0”. Package Grounding Tabs Connect four package grounding tabs to signal ground. Application Information The Applications Engineering Group at Agilent is available to assist you with technical understanding and design tradeoffs associated with these transceivers. You can contact them through your Agilent sales representative. The following information is provided to answer some of the most common questions about the use of the parts. transmitter output optical power (dBm avg) and the lowest receiver sensitivity (dBm avg). This OPB provides the necessary optical signal range to establish a working fiber-optic link. The OPB is allocated for the fiber-optic cable length and the corresponding link penalties. For proper link performance, all penalties that affect the link performance must be accounted for within the link optical power budget. Optical Power Budget and Link Penalties The worst-case Optical Power Budget (OPB) in dB for a fiberoptic link is determined by the difference between the minimum Electrical and Mechanical Interface Recommended Circuit Figures 7 and 8 shows the recommended interface for deploying the Agilent transceivers in a +3.3 V system. Data Line Interconnections Agilent’s HFCT-5951xxx/HFCT5952xxx fiber-optic transceivers are designed to couple to +3.3 V PECL signals. The transmitter driver circuit regulates the output optical power. The regulated light output will maintain a constant output optical power provided the data pattern is reasonably balanced in duty cycle. If the data duty cycle has long, continuous state times (low or high data duty cycle), then the output optical power will gradually change its average output optical power level to its preset value. VCC (+3.3 V) 82 W 100 nF TDIS (LVTTL) VCC (+3.3 V) 82 W BMON- 130 W 100 nF BMON+ Z = 50 W VCC (+3.3 V) 130 W Z = 50 W TD130 W 130 W PMON- NOTE A TD+ PMON+ 3 f 4 5 6 7 f TDIS VCC TX RD+ f f VEE TX f f 11 f RD- VEE TX DNC 2 f TD+ BMONDNC 1 f f VCC RX PMON- BMON+ VEERX f f SD f TD- f VEE RX f VEE RX RX f PMON+ TX 17 16 15 14 13 12 f VpdR 20 19 18 f 8 f 9 VCC (+3.3 V) 1 µH C2 10 µF C3 VCC (+3.3 V) 1 µH f RD+ C1 10 VCCRX (+3.3 V) 10 µF 100 nF 200 W Z = 50 W 100 W NOTE B RD- NOTE C 10 nF 100 nF 3k 130 W 130 W Z = 50 W VCC (+3.3 V) 10 kW SD Note: Note A: Note B: Note C: C1 = C2 = C3 = 10 nF or 100 nF CIRCUIT ASSUMES OPEN EMITTER OUTPUT CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ V CC - 1.3 V. THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 OHM. Figure 7 - Recommended Interface Circuit (HFCT-5952xxx) 8 THIS IS NOT REQUIRED BY THE HFCT-5952ATL/TL LVTTL VCC (+3.3 V) 82 W 100 nF 100 nF TDIS (LVTTL) 82 W 130 W 100 nF Z = 50 W VCC (+3.3 V) 130 W Z = 50 W TD130 W 130 W f TDIS VCC TX TD- 6 f VCC (+3.3 V) VCC (+3.3 V) 1 µH C2 10 µF C3 VCC (+3.3 V) 100 nF f f f f 1 2 3 4 5 RD- RD+ f SD VCC RX RX 7 f VEE RX TX 8 f VEE TX 9 f TD+ 10 NOTE A TD+ 1 µH 82 W 82 W RD+ C4 * 10 µF Z = 50 W 100 nF C1 130 W NOTE B RD- 100 nF 130 W Z = 50 W VCC (+3.3 V) 130 130 W W 10 k W SD LVTTL Note: C1 = C2 = C3 = 10 nF or 100 nF Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100 W TERMINATION * C4 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING. THIS IS NOT REQUIRED BY THE HFCT-5951ATL/TL Figure 8 - Recommended Interface Circuit (HFCT-5951xxx) The HFCT-5951xxx/HFCT5952xxx have a transmit disable function which is a single-ended +3.3 V TTL input which is dccoupled to pin 13 on the HFCT5952xxx and pin 8 on HFCT5951xxx. In addition the HFCT5952xxx offers the designer the option of monitoring the laser diode bias current and the laser diode optical power. The voltage measured between pins 17 and 18 is proportional to the bias current through an internal 10 W resistor. Similarly the optical power rear facet monitor circuit provides a photo current which is proportional to the voltage measured between pins 19 and 20 on the 2 x 10 version, this voltage is measured across an internal 200 W resistor. 9 As for the receiver section, it is internally ac-coupled between the preamplifier and the postamplifier stages. The actual Data and Data-bar outputs of the postamplifier are dc-coupled to their respective output pins (pins 9 and 10 on the HFCT-5951xxx and pins 14 and 15 on the HFCT-5952xxx). The two data outputs of the receiver should be terminated with identical load circuits to avoid unnecessarily large ac currents in VCC. If the outputs are loaded identically the ac current is largely nulled. Signal Detect is a single-ended, +3.3 V TTL compatible output signal that is dc-coupled to pin 3 on the HFCT-5951xxx and pin 8 on the HFCT-5952xxx modules. Signal Detect should not be accoupled externally to the follow- on circuits because of its infrequent state changes. The HFCT-5952xxx offers the designer the option of monitoring the PIN photo detector bias current. Figures 7 and 8 show a resistor network, which could be used to do this. Note that the photo detector bias current pin must be connected to VCC. Agilent also recommends that a decoupling capacitor is used on this pin. Power Supply Filtering and Ground Planes It is important to exercise care in circuit board layout to achieve optimum performance from these transceivers. Figures 7 and 8 show the power supply circuit which complies with the small form factor multisource agreement. It is further recommended that a continuous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices. Package footprint and front panel considerations The Agilent transceiver complies with the circuit board “Common Transceiver Footprint” hole pattern defined in the current multisource agreement which defined the 2 x 5 and 2 x 10 package styles. This drawing is reproduced in Figure 9 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Figure 10 shows the front panel dimensions associated with such a layout. Eye Safety Circuit For an optical transmitter device to be eye-safe in the event of a single fault failure, the transmitter must either maintain eye-safe operation or be disabled. The HFCT-5951xxx/HFCT5952xxx is intrinsically eye safe and does not require shut down circuitry. 10 2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1 (0.055 ±0.004) (0.09) 8.89 (0.35) 7.11 (0.28) 2 x Ø 1.4 ±0.1 (0.055 ±0.004) 3.56 (0.14) 4 x Ø 1.4 ±0.1 (0.055 ±0.004) 13.34 (0.525) 10.16 (0.4) 7.59 (0.299) 9.59 (0.378) 3 (0.118) 9 x 1.78 (0.07) 3 (0.118) 6 (0.236) 4.57 (0.18) 16 (0.63) 2 (0.079) 2 2 x Ø 2.29 (0.079) (0.09) 3.08 (0.121) 20 x Ø 0.81 ±0.1 (0.032 ±0.004) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER. 2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS. 3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS). PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND. 4. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS). PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND. 5. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS. 6. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND. Figure 9 - Recommended Board Layout Hole Pattern Signal Detect The Signal Detect circuit provides a deasserted output signal when the optical link is broken (or when the remote transmitter is OFF). The Signal Detect threshold is set to transition from a high to low state between the minimum receiver input optional power and -45 dBm avg. input optical power indicating a definite optical fault (e.g. unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). The Signal Detect does not detect receiver data error or error-rate. Data errors can be determined by signal processing offered by upstream PHY ICs. Electromagnetic Interference (EMI) One of a circuit board designer’s foremost concerns is the control of electromagnetic emissions from electronic equipment. Success in controlling generated Electromagnetic Interference (EMI) enables the designer to pass a governmental agency’s EMI regulatory standard and more importantly, it reduces the possibility of interference to neighboring equipment. Agilent has designed the HFCT-5951xxx/ HFCT-5952xxx to provide excellent EMI performance. The EMI performance of a chassis is dependent on physical design and features which help improve EMI suppression. Agilent encourages using standard RF suppression practices and avoiding poorly EMI-sealed enclosures. Agilent’s HFCT-5951ATL/TL/ HFCT-5952ATL/TL OC-12/STM-4 LC transceivers have nose shields which provide a convenient chassis connection to the nose of the transceiver. This nose shield improves system EMI performance by closing off the LC aperture. Localized shielding is also improved by tying the four metal housing package grounding tabs to signal ground on the PCB. Though not obvious by inspection, the nose shield and metal housing are electrically separated for customers who do not wish to directly tie chassis and signal grounds together. Figure 10 shows the recommended positioning of the transceivers with respect to the PCB and faceplate. 10.16 ±0.1 (0.4 ±0.004) 15.24 (0.6) TOP OF PCB B B DETAIL A 15.24 (0.6) 1 (0.039) A SOLDER POSTS 14.22 ±0.1 (0.56 ±0.004) 15.75 MAX. 15.0 MIN. (0.62 MAX. 0.59 MIN.) SECTION B - B Package and Handling Instructions Flammability The HFCT-5951xxx/HFCT5952xxx transceivers housing consist of high strength, heat resistant and UL 94 V-0 flame retardant plastic and metal packaging. Recommended Solder and Wash Process The HFCT-5951xxx/HFCT5952xxx are compatible with industry-standard wave processes. Process plug The transceivers are supplied with a process plug for protection of the optical port within the LC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping and storage. It is made of a hightemperature, molded sealing material. 11 DIMENSIONS IN MILLIMETERS (INCHES) 1. 2. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING. Figure 10 - Recommended Panel Mounting Recommended Solder fluxes Solder fluxes used with the HFCT-5951xxx/HFCT-5952xxx should be water-soluble, organic fluxes. Recommended solder fluxes include Lonco 3355-11 from London Chemical West, Inc. of Burbank, CA, and 100 Flux from Alpha-Metals of Jersey City, NJ. Recommended Cleaning/ Degreasing Chemicals Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane Other: naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Agilent does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. LC SFF Cleaning Recommendations In the event of contamination of the optical ports, the recommended cleaning process is the use of forced nitrogen. If contamination is thought to have remained, the optical ports can be cleaned using a NTT international Cletop stick type (diam. 1.25 mm) and HFE7100 cleaning fluid. Regulatory Compliance The Regulatory Compliance for transceiver performance is shown in Table 1. The overall equipment design will determine the certification level. The transceiver performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the LC connector receptacle is exposed to the outside of the equipment chassis it may be subject to whatever system-level ESD test criteria that the equipment is intended to meet. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet FCC regulations in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. Refer to EMI section (page 9) for more details. The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. Immunity Transceivers will be subject to radio-frequency electromagnetic fields following the IEC 61000-4-3 test method. Eye Safety These laser-based transceivers are classified as AEL Class I (U.S. 21 CFR(J) and AEL Class 1 per EN 60825-1 (+A11). They are eye safe when used within the data sheet limits per CDRH. They are also eye safe under normal operating conditions and under all reasonably foreseeable single fault conditions per EN60825-1. Agilent has tested the transceiver design for compliance with the requirements listed below under normal operating conditions and under single fault conditions where applicable. TUV Rheinland has granted certification to these transceivers for laser eye safety and use in EN 60950 and EN 60825-2 applications. Their performance enables the transceivers to be used without concern for eye safety up to 3.6 V transmitter VCC. Table 1: Regulatory Compliance - Targeted Specification Feature Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the LC Receptacle Electromagnetic Interference (EMI) Immunity Laser Eye Safety and Equipment Type Testing Component Recognition 12 Test Method MIL-STD-883 Method 3015 Performance Class 2 (>2 kV). Variation of IEC 61000-4-2 Tested to 8 kV contact discharge. FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class I Variation of IEC 61000-4-3 Margins are dependent on customer board and chassis designs. FDA CDRH 21-CFR 1040 Class 1 IEC 60825-1 Amendment 2 2001-01 Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment. Typically show no measurable effect from a 10 V/m field swept from 27 to 1000 MHz applied to the transceiver without a chassis enclosure. Accession Number: ) 9521220-43 License Number: ) 933/510104/02 UL File. E173874 CAUTION: There are no user serviceable parts nor any maintenance required for the HFCT-5951xxx/ HFCT-5952xxx. All adjustments are made at the factory before shipment to our customers. Tampering with or modifying the performance of the HFCT-5951xxx/HFCT-5952xxx will result in voided product warranty. It may also result in improper operation of the HFCT-5951xxx/HFCT-5952xxx circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the HFCT-5951xxx/ HFCT-5952xxx to a non-approved optical source, operating above the recommended absolute maximum conditions or operating the HFCT-5951xxx/ HFCT-5952xxx in a manner inconsistent with their design and function may result in hazardous radiation exposure and may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J). 13 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Storage Temperature Supply Voltage Data Input Voltage Data Output Current Relative Humidity Symbol TS VCC VI ID RH Min. -40 -0.5 -0.5 Typ. Symbol Min. Typ. TA TA VCC PSR VD RDL IOL IOH TDIS TDIS TASSERT TDEASSERT 0 -40 3.14 Symbol TSOLD/tSOLD Min. Max. +85 3.6 VCC 50 85 Unit °C V V mA % Reference Max. Unit Reference +70 +85 3.47 °C °C V mVPk-Pk V W 2 2 1 Recommended Operating Conditions Parameter Ambient Operating Temperature HFCT-5951TL/TG/HFCT-5952TL/TG HFCT-5951ATL/ATG/HFCT-5952ATL/ATG Supply Voltage Power Supply Rejection Transmitter Differential Input Voltage Data Output Load TTL Signal Detect Output Current - Low TTL Signal Detect Output Current - High Transmit Disable Input Voltage - Low Transmit Disable Input Voltage - High Transmit Disable Assert Time Transmit Disable Deassert Time 100 0.3 1.6 50 1.0 3 10 1.0 mA µA V V µs ms 4 5 Max. +260/10 Unit °C/sec. Reference 6 -400 0.6 2.2 Process Compatibility Parameter Wave Soldering and Aqueous Wash Typ. Notes: 1. The transceiver is class 1 eye safe up to V CC = 3.6 V. 2. Ambient operating temperature utilizes air flow of 2 ms-1 over the device. 3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place. Typically less than a 1 dB change in sensitivity is experienced. 4. Time delay from Transmit Disable Assertion to laser shutdown. 5. Time delay from Transmit Disable Deassertion to laser startup. 6. Aqueous wash pressure <110 psi. 14 Transmitter Electrical Characteristics HFCT-5951TL/TG/HFCT-5952TL/TG: TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: TA = -40°C to +85°C, VCC = 3.14 V to 3.47 V Parameter Supply Current Power Dissipation Data Input Voltage Swing (single-ended) Transmitter Differential Data Input Current - Low Transmitter Differential Data Input Current - High Laser Diode Bias Monitor Voltage Power Monitor Voltage Symbol ICCT PDIST VIH - VIL Min. IIL -350 250 Typ. 30 0.10 800 Max. 120 0.42 930 Unit mA W mV Reference 1 µA 350 700 200 IIH 10 µA mV mV 2, 3 2, 3 Receiver Electrical Characteristics HFCT-5951TL/TG/HFCT-5952TL/TG: TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: TA = -40°C to +85°C, VCC = 3.14 V to 3.47 V Parameter Supply Current Power Dissipation Data Output Voltage Swing (single-ended) Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect Assert Time (OFF to ON) Signal Detect Deassert Time (ON to OFF) Symbol ICCR PDISR VOH - VOL tr tf VOL VOH ASMAX ANSMAX Min. 575 Typ. 70 0.23 800 Max. 110 0.38 930 0.5 0.5 0.8 2.0 2.3 100 100 Unit mA W mV ns ns V V µs µs Reference 1 4 5 6 6 7 7 Notes: 1. Excludes data output termination currents. 2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors, 10 W and 200 W (see Figure 7). On the 2 x 10 version only. 3. On the 2 x 10 version only. 4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the products of the output voltages and currents. 5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs. 6. These are 20-80% values. 7. SD is LVTTL compatible. 15 Transmitter Optical Characteristics HFCT-5951TL/TG/HFCT-5952TL/TG: TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: TA = -40°C to +85°C, VCC = 3.14 V to 3.47 V Parameter Output Optical Power 9 µm SMF Center Wavelength Spectral Width - rms Optical Rise Time Optical Fall Time Extinction Ratio Output Optical Eye Back Reflection Sensitivity Jitter Generation Symbol Min. Typ. Max. Unit Reference -15 -8 dBm 1 POUT lC 1274 1356 nm s 2.5 nm rms 2 250 ps 3 tr tf 250 ps 3 8.2 dB ER Compliant with eye mask Bellcore GR-CORE-000253 and ITU-T G.957 -8.5 dB 4 pk to pk 25 70 mUI 5 RMS 2 7 mUI 5 Receiver Optical Characteristics HFCT-5951TL/TG/HFCT-5952TL/TG: TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: TA = -40°C to +85°C, VCC = 3.14 V to 3.47 V Parameter Receiver Sensitivity Receiver Overload Input Operating Wavelength Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Optical Return Loss, ORL Symbol PIN MIN PIN MAX l PA PD PH Min. Typ. -32 -8 1270 -45 0.5 -34 -34.3 1.7 -35 Max. -28 1570 -28 4 -14 Unit Reference dBm avg. 6 dBm avg. 6 nm dBm avg. dBm avg. dB dB Notes: 1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life. 2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which results in RMS = FWHM/2.35. 3. These are unfiltered 20-80% values. 4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver sensitivity. 5. For the jitter measurements, the device was driven with SONET OC-12C data pattern filled with a 2 23-1 PRBS payload. 6. Minimum sensitivity and saturation levels for a 223-1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10-10. 16 Design Support Materials Agilent has created a number of reference designs with major PHY IC vendors in order to demonstrate full functionality and interoperability. Such design information and results can be made available to the designer as a technical aid. Please contact your Agilent representative for further information if required. Ordering Information Temperature range 0°C to +70°C HFCT-5951TL 2 x 5 footprint HFCT-5952TL 2 x 10 footprint HFCT-5951TG 2 x 5 footprint HFCT-5952TG 2 x 10 footprint with EMI nose shield with EMI nose shield without EMI nose shield without EMI nose shield Temperature range -40°C to +85°C HFCT-5951ATL 2 x 5 footprint HFCT-5952ATL 2 x 10 footprint HFCT-5951ATG 2 x 5 footprint HFCT-5952ATG 2 x 10 footprint with EMI nose shield with EMI nose shield without EMI nose shield without EMI nose shield Class 1 Laser Product: This product conforms to the applicable requirements of 21 CFR 1040 at the date of manufacture Date of Manufacture: Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore Handling Precautions 1. The HFCT-5951xxx/HFCT-5952xxx can be damaged by current surges or overvoltage. Power supply transient precautions should be taken. 2. Normal handling precautions for electrostatic sensitive devices should be taken. 17 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 271 2451 India, Australia, New Zealand: (+65) 271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 271 2194 Malaysia, Singapore: (+65) 271 2054 Taiwan: (+65) 271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes: 5988-5223EN March 8, 2002 5988-5922EN