ETC LC898093KL

Ordering number : ENN*6615A
CMOS IC
LC898093KW, 898093KL
40× Playback/16× Write CD-R/RW Encoder/Decoder IC
with Built-in ATAPI Interface
Preliminary
Functions
•
•
•
•
•
•
•
•
•
CD-ROM decoder/encoder functions
CD decoder/encoder functions
Pit and wobble CLV servo
CAV audio functions
ATAPI interface (includes the register block)
Subcode encoder/decoder functions
ATIP demodulator/ATIP decoder
Supports BURN-Proof recording
Write strategy function (CD-R/RW)
Features
• ECC and EDC correction/addition (decoding/encoding)
for CD-ROM data.
• ECC error correction/addition (decoding/encoding) for
subcode data
• Servo control implemented in a digital servo system
(decoding/encoding)
• CLV servo control using ATIP data (encoding)
• ATIP decoding function and CRC check function
(decoding/encoding)
• CIRC code generation and addition and EFM
modulation (encoding)
• CAV audio functions
• Provides 16× write for CD-R/RW due to write strategy
function
• Built-in ATAPI interface (with Ultra DMA 33 support)
• Supports 40× decoding and 16× encoding.
Clock frequency: 33.8688 MHz
• Transfer rates: Up to 16.6 MB/s (when 32× IORDY
used), up to 33 MB/s when Ultra DMA used. These
values apply when 16-bit 45 ns EDO DRAM is used.
• From 1 to 64 Mbits of buffer RAM can be used. (16-bit
data bus EDO DRAM)
• The user can freely set up the CD main channel, C2 flag,
and subcode areas in buffer RAM.
• Batch transfer function (Function for transferring the CD
main channel, C2 flag, subcode, and other data in a
single operation)
• Multi-transfer function (Function for automatically
transferring multiple block to the host in a single
operation)
• CAV audio functions
• Supports Ultra DMA modes 0, 1, and 2.
“BURN-Proof” stands for Proof against Buffer Under RuN
error, not for proof against burning.
“BURN-Proof” is a trademark of SANYO Electric Co., Ltd.
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
20802TN (OT)/11201RM (OT) No. 6615-1/14
LC898093KW, 898093KL
Package Dimensions
unit: mm
unit: mm
3261-SQFP208J (28 × 28)
3264-LQFP208
[LC898093KW]
[LC898093KL]
30.0
28.0
28.0
0.8
31.2
156
25.5
105
156
(1.4)
105
0.10
208
53
25.5
53
1
0.2
0.15
52
1
(3.2)
(0.5)
0.5
0.22
52
0.09
0.1
1.6max
3.56max
(1.25)
30.0
104
31.2
28.0
208
157
28.0
104
157
0.5
(0.5)
SANYO: SQFP208J (28 × 28)
SANYO: LQFP208
Specifications
Absolute Maximum Ratings at VSS = 0 V
Parameter
Symbol
Supply voltage
I/O voltages
Allowable power dissipation
Conditions
Ratings
Unit
VDD5 max
Ta ≤ 25°C
–0.3 to +6.0
V
VDD3 max
Ta ≤ 25°C
–0.3 to +4.6
V
VI5, VO5
Ta ≤ 25°C
–0.3 to VDD5 + 0.3
V
VI3, VO3
Ta ≤ 25°C
–0.3 to VDD3 + 0.3
Pd max
Ta ≤ 70°C
900
V
mW
Operating temperature
Topr
–30 to +70
Storage temperature
Tstg
–55 to +125
°C
260
°C
Soldering conditions (pins only)
10 seconds
°C
Allowable Operating Ranges at Ta = –30 to +70°C, VSS = 0 V
Parameter
Symbol
Conditions
Ratings
min
typ
max
Unit
[I/O cells, 5.0 V power supply]
Supply voltage
Input voltage range
VDD5
VIN
4.5
5.0
0
5.5
V
VDD5
V
[Internal cells, 3.3 V power supply]
Supply voltage
Input voltage range
VDD3
VIN
3.0
0
3.3
3.6
V
VDD3
V
No. 6615-2/14
LC898093KW, 898093KL
Electrical Characteristics at Ta = –30 to +70°C, VSS = 0 V, VDD = 4.5 to 5.5 V
Parameter
Symbol
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Input high-level voltage
VIH
Input low-level voltage
VIL
Conditions
TTL level inputs: (1)
TTL level inputs with built-in pull-up resistors: (4), (17)
TTL level inputs with built-in pull-down resistors: (16)
TTL level Schmitt trigger inputs: (0), (7)
TTL level Schmitt trigger inputs
Built-in pull-up resistors: (9), (14)
CMOS level Schmitt trigger inputs: (19)
CMOS level inputs with built-in pull-up resistors: (10)
Ratings
min
typ
Unit
max
2.2
V
0.8
2.2
0.8
2.2
0.8
2.4
V
V
0.8
2.4
V
V
0.8
V
V
0.7 VDD
0.3 VDD
V
V
0.7 VDD
0.3 VDD
VANI
(11)
Output high-level voltage
VOH
IOH = –12 mA: (20)
Output low-level voltage
VOL
IOL = 12 mA: (20)
Output high-level voltage
VOH
IOH = –4 mA: (21)
Output low-level voltage
VOL
IOL = 4 mA: (21)
Output high-level voltage
VOH
IOH = –8 mA: (3), (8)
Output low-level voltage
VOL
IOL = 8 mA: (3), (8)
Output high-level voltage
VOH
IOH = –2 mA: (2), (4), (6)
Output low-level voltage
VOL
IOL = 2 mA: (2), (4), (6)
0.4
Output low-level voltage
VOL
IOL = 2 mA: (5)
0.4
Output high-level voltage
VOH
IOH = –8 mA: (7), (12), (14), (15)
Output low-level voltage
VOL
IOL = 24 mA: (7), (12), (14), (15)
Output high-level voltage
VOH
IOH = –6 mA: (17), (18)
VOL
IOL = 6 mA: (17), (18)
1/4 VDD
3/4 VDD
VDD – 2.1
V
V
V
0.4
VDD – 2.1
V
V
0.4
VDD – 2.1
V
V
0.4
VDD – 2.1
V
V
VDD – 2.1
V
V
V
0.4
2.4
V
V
0.4
V
1/4 VDD
3/4 VDD
V
VI = VSS, VDD: (0), (1), (7), (9)
–10
+10
µA
IOZ
In the high-impedance output state: (2), (7), (8), (12), (13)
(14), (15)
–10
+10
µA
Analog output voltage
VANO
Input leakage current
IIL
Output leakage current
V
V
Analog input voltage
Output low-level voltage
V
V
(22)
Pull-up resistance
RUP
(10)
50
100
200
kΩ
Pull-up resistance
RUP
(4), (5)
40
80
160
kΩ
Pull-up resistance
RUP
(9), (13), (14)
7
10
13
kΩ
Pull-up resistance
RUP
(15)
7
10
13
kΩ
The applicable pin groups are listed on the following page.
No. 6615-3/14
LC898093KW, 898093KL
Applicable Pins
[INPUT]
(0) · · · · · · CS, RD, WR, RESET, WOBBLE, CS1FX, CS3FX, DIOR, DIOW, HRST, DA0 to DA2, DMACK
(9) · · · · · · DMACK
(1) · · · · · · TEST0 to TEST3, SUA0 to SUA7
(16) · · · · · TEST4
(10) · · · · · FG
(11) · · · · AD0, AD1, RREC, FE, TE, VREF, FR, OPP, CSS, PCKISTF, PCKISTP, EFMIN, EFMIN2, SLCIST1,
SLCIST2
(19) · · · · · WRITE
[OUTPUT]
(2) · · · · · · PDS1 to PDS3
(18) · · · · · RA0 to RA9, CAS0 and CAS1, RAS0 to RAS2, LWE, UWE, OE
(3) · · · · · · SSP2/1, RAPC, WAPC, H11T0, LDH, ATEST3/1, WDAT, NWDAT, EFMG, SHOCK, LOCK, EFMO
(5) · · · · · · INT0 to INT1, SWAIT
(6) · · · · · · LDON
(12) · · · · · INTRQ, IOCS16
(13) · · · · · IORDY
(15) · · · · · DMARQ
(20) · · · · · PCK2, SUBSYNC
(21) · · · · · DSLB
(22) · · · · · SDA0 to SDA2, TDO, FDO, SLDO, SPDO, JITC, LOUT, ROUT, PDO, RPO, SLDO, SLCO1 to SLCO3
[INOUT]
(4) · · · · · · D0 to D7
(17) · · · · · IO0 to IO15
(7) · · · · · · DD0 to DD15
(8) · · · · · · BIDATA, BICLK, ATIPSYNC, ACRCNG
(14) · · · · · DASP, PDIAG
Note: The XTAL0 pin is not specified in the DC characteristics.
The pull-up and pull-down resistors on pins (9), (13), (14), and (15) are disabled after a reset.
No. 6615-4/14
LC898093KW, 898093KL
Block Diagram
LC898093K
RAM
Data bus[0:15] Address bus[0:21]
Data bus[0:7]
*12
Write Strategy
&
Link-position
*10
ATIP/CLV servo
ATIPSYNC
*1
*2
Sub-code I/F
de-interleve/interleve
Digital Servo
&
CIRC EnDec
Address generator
Sub-code ECC
Address generator
CAV-Audio
CD-DSP I/F
& SYNC
Detector
Address generator
Address generator
*6
Micro
controller
IDE I/F Block
based HISIDE
Each Block
Register
R0-R255
*8
*9
Buffer
DRAM
Data output input I/F
Address generator
ZSWAIT
XTAL0
Bus
Arbiter
&
DRAM
controller
decoder
*7
XTALCK0
Each Block
Bus control
signal
External
*3
*4
*5
INT0, INT1
*13
De-scramble &
Buffering
ECC & EDC
HOST
DAC
PLL
&
Clock
generator
Microcontroller
RAM access
Address generator
Each Block
A13486
*1
*2
*3
*4
*5
*6
*7
*8
*9
*10
*12
*13
**1
DSLB (pin96) to FR (pin123), CSS (pin126) to SPD (pin142), SHOCK (pin147) to PCK2 (pin155)
SUBSYNC
DD0 to DD15, DASP, PDIAG
CS1FX, CS3FX, DA0 to DA2, DIOR, DIOW, DMACK
DMARQ, HINTRQ, IOCS16, IORDY
RD, WR, SUA0 to SUA7, CS
D0 to D7
IO0 to IO15
RA0 to RA9, RAS0, RAS1, RAS2, CAS0, CAS1, OE, UWE, LWE
WOBBLE, ATIPSYNC, BIDATA, BICLK
WRITE, SSP2/1, RAPC, WAPC, H11T0, LDH, ATEST3, ATEST1, WDAT, NWDAT, EFMG
LOUT, ROUT
HISIDE (WD25C32) is made by WESTERN DIGITAL.
No. 6615-5/14
LC898093KW, 898093KL
Pin Functions
Pin type
I
Input
B
Bidirectional pin
NC
Not connected
O
Output
P
Power supply
A
Analog pin
Pin No.
Pin name
Type
1
VSS
P
Pin function
2
RA4
O
3
RA5
O
4
RA6
O
5
RA7
O
6
RA8
O
7
RA9
O
8
VDD
P
Digital system power supply (5 V)
9
VSS
P
Digital system ground (VSS)
10
IO0
B
11
IO1
B
12
IO2
B
CD-ROM encoder/decoder buffer RAM data lines
13
IO3
B
These pins have built-in pull-up resistors.
14
IO4
B
Digital system ground (VSS)
CD-ROM encoder/decoder DRAM address lines
15
IO5
B
16
VDD
P
Digital system power supply (3.3 V)
17
VSS
P
Digital system ground (VSS)
18
IO6
B
19
IO7
B
20
IO8
B
21
IO9
B
CD-ROM encoder/decoder buffer RAM data lines
These pins have built-in pull-up resistors.
22
IO10
B
23
VSS
P
Digital system ground (VSS)
24
VDD
P
Digital system power supply (3.3 V)
25
IO11
B
26
IO12
B
27
IO13
B
28
IO14
B
29
IO15
B
30
ATIPSYNC
O
31
BIDATA
B
CD-ROM encoder/decoder buffer RAM data lines
These pins have built-in pull-up resistors.
ATIP SYNC detection signal
32
BICLK
B
33
WOBBLE
I
ATIP demodulator signals
34
VDD
P
Digital system power supply (5 V)
35
VSS
P
Digital system ground (VSS)
36
ACRCNG
O
ATIP CRC result output signal
37
WRITE
I
Write strategy signal control input
38
SSP2
O
Servo sampling pulse output
39
SSP1
O
Servo sampling pulse output
40
RAPC
O
Laser control sampling pulse output
41
WAPC
O
Laser control sampling pulse output
42
H11T0
O
Running OPC sampling pulse
43
LDH
O
Recording laser diode control signal output
44
VDD
P
Analog system power supply (3.3 V)
45
VSS
P
Analog system ground (VSS)
46
ATEST3
O
RW output
47
ATEST1
O
Internal monitor test output
48
WDAT
O
Recording laser diode control signal output
49
NWDAT
O
Recording laser diode control signal output (WDAT inverted)
50
VDD
P
Analog system power supply (3.3 V)
51
VSS
P
Analog system ground (VSS)
Continued on next page.
No. 6615-6/14
LC898093KW, 898093KL
Continued from preceding page.
Pin No.
Pin name
Type
52
VDD
P
Digital system power supply (5 V)
53
VSS
P
Digital system ground (VSS)
54
R1
I
55
VCNT1
I
56
MDC1
O
57
PD1
O
58
SWAIT
O
Wait signal to the microcontroller
59
INT0
O
60
INT1
O
Interrupt request signal outputs to the microcontroller
These are open-drain outputs with built-in pull-up resistors.
61
D0
B
62
D1
B
63
D2
B
64
D3
B
65
D4
B
66
D5
B
Pin function
Write strategy analog signals
Microcontroller data signal lines
These pins have built-in pull-up resistors.
67
D6
B
68
VDD
P
69
VSS
P
Digital system ground (VSS)
70
D7
B
Microcontroller data signal line
71
SUA0
I
72
SUA1
I
73
SUA2
I
74
SUA3
I
75
SUA4
I
76
SUA5
I
77
SUA6
I
78
SUA7
I
79
CS
I
80
RD
I
Data read signal input from the microcontroller
81
WR
I
Data write signal input from the microcontroller
82
TEST0
I
Test pin. This pin must be tied to VSS.
83
VCNT
I
VCO control voltage
84
R
I
VCO bias resistor connection
85
PD
O
Charge pump output
86
VDD
P
Analog system power supply (3.3 V)
87
VSS
P
Analog system ground (VSS)
88
TEST1
I
Test pin. This pin must be tied to VSS.
89
RESET
I
Reset input
90
XTALCK0
I
Crystal oscillator circuit input (33.8688 MHz)
91
XTAL0
O
Crystal oscillator circuit output
92
ROUT
O
D/A converter output
93
VSS
P
Analog system ground (VSS)
94
VDD
P
Analog system power supply (5 V)
95
LOUT
O
D/A converter output
96
DSLB
O
SLC PWM output
97
SLCIST1
I
98
SLCIST2
I
Digital system power supply (5 V)
Command register selection address
Chip select signal input from the microcontroller
EFM slice level setting input
99
VSS
P
Analog system ground (VSS)
100
VDD
P
Analog system power supply (3.3 V)
101
SLCO0
O
102
SLCO1
O
103
SLCO2
O
EFM slice level output
104
VDD
P
Digital system power supply (5 V)
105
VSS
P
Digital system ground (VSS)
106
SLCO3
O
EFM slice level output
Continued on next page.
No. 6615-7/14
LC898093KW, 898093KL
Continued from preceding page.
Pin No.
Pin name
Type
107
EFMIN
I
108
EFMIN2
I
Pin function
EFM input
109
TEST4
I
Test pin. This pin must be tied to VSS
110
JITC
O
Jitter output
111
RPO
O
112
OPP
I
113
PCKISTF
I
Frequency comparator charge pump
114
PCKISTP
I
Phase comparator charge pump
Analog system ground (VSS)
P/N balance adjustment
115
VSS
P
116
VDD
P
Analog system power supply (3.3 V)
117
PDO
O
Charge pump filter
118
PDS1
O
119
PDS2
O
120
VDD
P
Digital system power supply (3.3 V)
121
VSS
P
Digital system ground (VSS)
122
PDS3
O
Charge pump selection
123
FR
I
VCO frequency setting
Charge pump selection
124
TEST2
I
Test pin. This pin must be tied to VSS.
125
TEST3
I
DRAM voltage (5 V/3.3 V) selection pin
126
CSS
I
Center servo input
127
AD0
I
AD input
128
RREC
I
Optical signal discrimination input
129
FE
I
FE input
130
TE
I
TE input
131
VREF
I
VREF input
132
AD1
I
AD input
133
VSS
P
Analog system ground (VSS)
134
DA0
O
DA output
135
DA1
O
DA output
136
DA2
O
DA output
137
TDO
O
Tracking output
138
VDD
P
Analog system power supply (5 V)
139
VSS
P
Analog system ground (VSS)
140
FDO
O
Focus output
141
SLDO
O
Sled output
142
SPDO
O
Spindle output
143
VSS
P
Digital system ground (VSS)
144
VDD
P
Digital system power supply (3.3 V)
145
SUBSYNC
O
Subcode SYNC signal
Write gate signal
146
EFMG
O
147
SHOCK
O
Shock detection signal
148
LOCK
O
PLL lock state output
Defect detection signal input
149
DEF
I
150
HFL
I
Mirror detection signal input
151
TES
I
Tracking zero cross signal input
152
EFMO
O
Post-binarization EFM signal output
153
LDON
O
Laser control
154
FG
I
FG input
155
PCK2
O
PCK output
156
VDD
P
Digital system power supply (5 V)
157
VSS
P
Digital system ground (VSS)
158
HRST
I
159
DASP
B
160
CS3FX
I
161
CS1FX
I
IDE interface signals
Continued on next page.
No. 6615-8/14
LC898093KW, 898093KL
Continued from preceding page.
Pin No.
Pin name
Type
162
DA2
I
163
DA0
I
164
PDIAG
B
165
DAI
I
166
IOCS16
O
167
INTRQ
O
168
DMACK
I
169
IORDY
O
I
Pin function
IDE interface signals
170
DIOR
171
DIOW
I
172
VDD
P
Digital system power supply (5 V)
173
VSS
P
Digital system ground (VSS)
174
DMARQ
O
B
175
DD15
176
DD0
B
177
DD14
B
178
DD1
B
179
DD13
B
180
DD2
B
181
VSS
P
182
DD12
B
183
DD3
B
184
DD11
B
IDE interface signals
Digital system ground (VSS)
185
DD4
B
186
DD10
B
187
DD5
B
188
DD9
B
189
DD6
B
190
VDD
P
Digital system power supply (3.3 V)
191
VSS
P
Digital system ground (VSS)
192
DD8
B
193
DD7
B
194
RAS0
O
195
RAS1
O
196
RAS2
O
197
LWE
O
DRAM lower write enable
198
VDD
P
Digital system power supply (3.3 V)
IDE interface signals
IDE interface signals
DRAM RAS signal outputs
199
VSS
P
Digital system ground (VSS)
200
UWE
O
DRAM upper write enable
201
CAS0
O
202
CAS1
O
203
OE
O
204
RA0
O
205
RA1
O
206
RA2
O
207
RA3
O
208
VDD
P
DRAM CAS signal output
DRAM output enable
CD-ROM encoder/decoder DRAM address lines
Digital system power supply (3.3 V)
No. 6615-9/14
LC898093KW, 898093KL
Pin Functions
<ATAPI Pins>
CS1FX (input)
Chip select signal that selects the command block register.
CS3FX (input)
Chip select signal that selects the control block register.
DA0 to DA2 (input)
Address for accessing the ATAPI interface registers.
DASP (input/output)
Drive 1 is output and drive 0 is input.
Signal used to indicate to drive 0 that drive 1 exists.
DD0 to DD15 (input/output)
16-bit data bus. This interface supports both 8-bit and 16-bit transfers.
DIOR (input)
Read strobe from the host.
DIOW (input)
Write strobe from the host.
DMACK (input)
Acknowledge signal from the host used during DMA transfers. Corresponds to the DMARQ request signal from the
drive.
DMARQ (input)
Drive request signal used during DMA transfers.
HINTRQ (output)
Drive interrupt request signal to the host.
IOCS16 (output)
Signal asserted by the drive when the drive supports 16-bit transfers.
This signal is not asserted during DMA transfers.
IORDY (output)
Indicates that the drive is ready to respond. Used during data transfers.
This signal will be low when the drive is not ready.
PDIAG (input/output)
Signal asserted by drive 1 to indicate to drive 0 that diagnostics have completed.
HRST (input)
Reset signal from the host. The IDE interface is reset by a low-level input to this pin.
<Microcontroller Interface Pins>
CS (input)
Chip select signal from the microcontroller. The microcontroller interface is active when this pin is low.
RD, WR (input)
Connect the microcontroller read and write lines to these inputs.
SWAIT (input)
Wait signal output to the microcontroller. When accessing buffer RAM, the microcontroller must wait if this pin is
low.
SUA0 to SUA7 (input)
Internal register address lines
D0 to D7 (input)
Microcontroller data bus. These pins have built-in pull-up resistors.
INT0, INT1 (output)
Interrupt request signals output to the microcontroller. INT1 can be set to output the ATAPI interrupt by setting
INT1EN (Conf-R11 bit 7)
These are open drain outputs with built-in 80 kΩ (at room temperature, 5 V) pull-up resistors.
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<Buffer RAM Pins>
I/O0 to I/O15 (input/output)
Buffer RAM data bus. These pins have built-in pull-up resistors.
RA0 to RA9 (output)
Buffer RAM address lines.
RAS0, RAS1, RAS2 (output)
Buffer DRAM RAS outputs. Normally, RAS0 is used. However, if two 16-Mbit DRAMs are used, connect the RAS0
and RAS1 lines to the RAS pins on the DRAMs. If four 16-Mbit DRAMs are used, connect the RAS0, RAS1, RAS2,
and LWE lines to the RAS pins on the DRAMs.
CAS0, CAS1 (output)
Buffer DRAM CAS outputs. Normally, CAS0 is used. However, if two 16-Mbit DRAMs are used, connect the CAS0
output to the CAS pins on the DRAMs. If 2-CAS type DRAMs are used, connect CAS0 to UCAS and CAS1 to
LCAS.
OE (output)
Buffer RAM read output.
UWE, LWE (output)
Buffer RAM write outputs. Connect these to the corresponding pins. If 2-CAS type DRAMs are used, UWE must be
connected. (Leave LWE open.)
1. Analog Interface Pins
CCS (input)
Midpoint servo input pin.
RREC (input)
Optical discrimination input.
FE (input)
Focus error signal input.
TE (input)
Tracking error signal input.
VREF (input)
Input for the servo system reference voltage.
SAD0, SAD1 (input)
A/D converter auxiliary inputs.
SDA0, SDA1, SDA2 (input)
D/A converter auxiliary inputs.
TES (input)
TES comparator input.
TDO (output)
Tracking control signal output.
FDO (output)
Focus control signal output.
SLDO (output)
Sled control signal output.
SPDO (output)
Spindle control signal output.
2. EFM Input Block Pins
EFMIN (input)
EFM signal input.
The high-frequency components of the RF signal acquired from the RF amplifier are cut with a capacitor, and this
pin inputs that signal biased by the value of the SLCO0 to SLCO3 outputs passed through a low-pass filter.
EFMIN2 (input)
Used to change the time constant of the low-pass filter.
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SLCIST1, SLCIST2 (input)
Slice level controller charge pump bias resistor connection.
SLCO0, SLCO1, SLCO2, SLCO3 (output)
Slice level controller charge pump outputs.
These levels bias the RF signal input to the EFMIN pin after being passed through a low-pass filter.
DSLB (output)
Slice level control PWM output.
EFMO (output)
Post-binarization EFM signal output. (For monitoring)
3. EFM Clock Generation Block Pins
FR (input)
EFM reproduction PLL VCO bias resistor connection.
PDO, PDS1, PDS2, PDS3 (output)
EFM reproduction PLL lag-lead filter connection.
PCKISTF (input)
EFM reproduction PLL frequency comparator charge pump bias resistor connection.
PCKISTP (input)
EFM reproduction PLL phase comparator charge pump bias resistor connection.
RPO (output)
P/N balance adjustment.
OPP (input)
P/N balance adjustment.
PCK2 (output)
EFM reproduction bit clock output.
4. Jitter Discrimination Pins
JITC (output)
Jitter output.
5. Spindle Speed Detection Pins
FG (input)
Input for the speed monitor signal from the spindle driver.
6. Audio Interface Pins
LOUT, ROUT (output)
Left and right channel audio signal outputs.
7. RF Amplifier Interface Pins
LDON (output)
RF amplifier interface.
8. Write Strategy Pins
WRITE, SSP2/1, RAPC, WAPC, H11T0, LDH, ATEST3, 1, WDAT, NWDAT (I/O)
Write strategy signal connections.
9. ATIP Decoder Related Pins
ATIPSYNC (output)
ATIP synchronization detection signal. (For monitoring)
BIDATA, BICLK (I/O)
Input mode: Input for the biphase data and biphase clock when an external ATIP demodulator is used.
Output mode: Output of the biphase data and biphase clock when the internal ATIP demodulator is used. (For
monitoring)
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WOBBLE (input)
Wobble signal input when the internal ATIP demodulator is used.
ACRCNG (output)
Outputs the result of the ATIP decoder CRC check. (For monitoring)
<Other Pins>
RESET (input)
The LC898093K reset input. A low level input resets the LC898093K.
This pin must be held low for at least 1 µs when power is first applied.
TEST4 to TEST0 (input)
Test inputs. These pins must be connected to ground.
XTALCK0 (input), XTAL0 (output)
Drive these pins at 33.8688 MHz. This signal is used, without modification, as main clock for the CD-ROM encoder
and decoder blocks, including the DRAM interface.
Consult the manufacturer of the oscillator element concerning the design of the oscillator circuit.
R, VCNT, PDO, R1, VCNT1, PD1, MDC1 (I/O)
Clock reproduction PLL circuit pins.
SUBSYNC (output)
Subcode SYNC output signal from the CIRC encoder during encoding. (For monitoring)
EFMG (output)
Outputs a high-level signal (5 V) during write operations.
SHOCK (output)
Outputs a high level (5 V) when a mechanical shock is detected during decodeing.
LOCK (output)
Outputs a high level (5 V) when the PLL circuit is locked.
DEF (input)
Inputs the defect detection signal.
HFL (input)
Inputs the mirror detection signal.
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Specifications of any and all SANYO products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees
of the performance, characteristics, and functions of the described products as mounted in the customer’s
products or equipment. To verify symptoms and states that cannot be evaluated in an independent device,
the customer should always evaluate and test devices mounted in the customer’s products or equipment.
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire,
or that could cause damage to other property. When designing equipment, adopt safety measures so
that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective
circuits and error prevention circuits for safe design, redundant design, and structural design.
In the event that any or all SANYO products (including technical data, services) described or contained
herein are controlled under any of applicable local export control laws and regulations, such products must
not be exported without obtaining the export license from the authorities concerned in accordance with the
above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system,
or otherwise, without the prior written permission of SANYO Electric Co., Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification”
for the SANYO product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO believes information herein is accurate and reliable, but
no guarantees are made or implied regarding its use or any infringements of intellectual property rights
or other rights of third parties.
This catalog provides information as of February, 2002. Specifications and information herein are subject
to change without notice.
PS No. 6615-14/14