ABS2 THRU ABS10 Voltage Range 200 to 1000 Volts Current 1.0 Ampere Thin Mini-Dip Features Glass passivated junction Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260℃ / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension Small size, simple installation Leads solderable per MIL-STD-202, Method 208 High surge current capability Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol ABS2 ABS4 Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current On glass-epoxy P.C.B. On aluminum substrate Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 0.4A Maximum DC Reverse Current @ TA=25℃ at Rated DC Blocking Voltage Typical Thermal resistance Junction to Lead On aluminum substrate On Glass-Epoxy substrate Operating Temperature Range Storage Temperature Range ＷＷＷ．ＡＳＥＭＩ．ＴＷ VRRM VRMS VDC 200 140 200 400 280 400 ABS6 ABS8 ABS10 Units 600 420 600 800 560 800 1000 700 1000 V V V I(AV) 0.8 IFSM 30 A VF 095 V IR 10 RθJL RθJA TJ 25 62.5 80 -55 to +150 uA uA ℃/W TSTG -55 to +150 A 1.0 ℃ ℃ RATINGS AND CHARACTERISTIC CURVES (ABS2 THRU ABS10) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT. AMPERES INSTANTANEOUS FORWARD CURRENT. (A) FIG.2- TYPICAL FORWARD CHARACTERISTICS o LEAD TEMPERATURE. ( C) FORWARD VOLTAGE. (V) FIG.4- FORWARD POWER DISSIPATION AVERAGE FORWARD CURRENT. AMPERES FORWARD POWER DISSIPATION .(pF) FIG.3- MAXIMUM FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT (A) o AMBIENT TEMPERATURE. ( C) PEAK FORWARD SURGE CURRENT AMPERES FIG.5- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT NUMBER OF CYCLES (CYCLE) ＷＷＷ．ＡＳＥＭＩ．ＴＷ