ETC AN2051

AN2051
Multilayer Chip Antenna for
2.4GHz Wireless Communication
技术:+86 158-1062-2705
销售:+86 131-4671-3331
RainSun Corporation
http://www.rainsun.com
1 of 9
Jan, 2008
Ver.2.2
AN2051 Multilayer Chip Antenna
◆ Features
y Light weight and low profile 5.05mm(L)X2.0mm(W)X1.07mm(H)
y Omni‐directional in azimuth
y Lead (Pb) Free
◆ Applications
y 2.4GHz wireless communications
y 2.4GHz Modules
y Bluetooth System
y 802.11b/g Wireless LAN System
Specifications
Center frequency
Peak gain
Operation temperature
Storage temperature
VSWR
Input Impedance
Power handling
Bandwidth
Azimuth beamwidth Polarization
RainSun Corporation
http://www.rainsun.com
2.45GHz
0.5dBi
‐40 ~ +85 °C
‐40 ~ +85 °C
2.0 (max)
50 Ohm
2W (max)
110MHz
Omni‐directional
Linear
2 of 9
Jan, 2008
Ver.2.2
Pin configuration Top view
1
2
Pin No
Pin assignment
1
Feed termination
2
Feed point mark
3
Solder termination
3
Dimensions
RainSun Corporation
http://www.rainsun.com
Symbol
Dimensions (mm)
A
5.05 ± 0.10
B
2.00 ± 0.10
C
0.50 ± 0.05
H
1.07 ± 0.20
3 of 9
Jan, 2008
Ver.2.2
Recommended Test Board Pattern Bottom view
Top view
50 Ohm
Transmission line
Ground Plane
SMA connector
Unit : mm
Board thickness : 0.6mm
Board material : FR4 Fig-1
Testing Setup
Measurement Testing Instrument:
Anritsu 37369C VNA(Vector Network Analyzer)
VNA calibrate with 1 path reflection only calibration sequence on test board feed point.
The test board dimension and it’s layout is the same as Fig‐1. RainSun Corporation
http://www.rainsun.com
4 of 9
Jan, 2008
Ver.2.2
Typical Electrical Characteristics
Return loss Smith Chart
Marker data:
1 : f=2.389 GHz
2 : f=2.450 GHz
3 : f=2.504 GHz
RainSun Corporation
http://www.rainsun.com
5 of 9
Jan, 2008
Ver.2.2
Typical Radiation Patterns
2.45 GHz H‐Plane
2.45 GHz E‐Plane
RainSun Corporation
http://www.rainsun.com
6 of 9
Jan, 2008
Ver.2.2
Typical Soldering Profile for Lead‐free Process
Peak temp 340°C
Temperature ( °C )
340°C
300°C
150°C
5 sec.
25 sec.
Pre-heating
Time (sec.)
Do not exceed 30 secs.
Reflow Soldering
10 sec, max
Temperature ( °C )
260°C
230°C
180°C
30 sec.
60 sec.
Pre-heating
Time (sec.)
RainSun Corporation
http://www.rainsun.com
7 of 9
Jan, 2008
Ver.2.2
Packing
Blister Tape Specifications
Symbol
Dimension
Tolerance
Unit
W
12.00
± 0.30
mm
P1
4.00
± 0.10
mm
P2
5.50
± 0.10
mm
P3
1.75
± 0.10
mm
P4
4.00
± 0.10
mm
P5
2.00
± 0.10
mm
D
1.50
± 0.10
mm
T1
5.40
± 0.10
mm
T2
0.30
± 0.05
mm
T3
2.40
± 0.10
mm
T4
1.40
± 0.10
mm
RainSun Corporation
http://www.rainsun.com
8 of 9
Jan, 2008
Ver.2.2
Reel Specifications
Quantity Tape Width Per Reel
(mm)
3,000
12
RainSun Corporation
http://www.rainsun.com
A (mm)
C (mm)
B (mm)
E (mm)
W (mm)
W1
(mm)
180±1
13.0±0.2
62±0.5
2.2±0.5
12±0.5
16±0.2
9 of 9
Jan, 2008
Ver.2.2