CONTENTS Mobile RAM Specialty DRAM Flash Memory 03 05 06 07 09 12 13 15 16 17 27 28 28 Low Power SDR SDRAM Low Power DDR SDRAM Low Power DDR2 SDRAM Pseudo SRAM (KGD) SDRAM DDR SDRAM DDR2 SDRAM DDR3 SDRAM KGD Serial Flash Parallel Flash NAND Flash KGD Mobile RAM ▪ Low Power SDR SDRAM ▪ Low Power DDR SDRAM ▪ Low Power DDR2 SDRAM ▪ Pseudo SRAM (KGD) • The products listed above may not be available for all regions.Please contact your local Winbound Sales Representative. • 03 www.winbond.com Low Power SDR SDRAM Winbond’s LPSDR SDRAM(Low Power SDR SDRAM) product family is designed with specific features to reduce power consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power down mode, Deep power down mode and Programmable output buffer driving strength. Note: If any request of KGD, please contact sales. Low Power SDR SDRAM Part No. Density Organization Voltage 7E W987D6HBGX 6I W987D2HBJX X16 128 Mbit 6E 166MHz, -25 to 85C 1.8V / 1.8V X32 W988D2FBJX W989D6CBGX W989D2CBJX W989D2KBJX 256 Mbit 6E 166MHz, -25 to 85C 1.8V / 1.8V - P - X32 166MHz, -25 to 85C 166MHz, -40 to 85C 133MHz, -25 to 85C 6E X16 P P 166MHz, -25 to 85C 6I 166MHz, -40 to 85C 7E 133MHz, -25 to 85C 512 Mbit 6E 6I 6E 6I X32 X16 X32 1.8V / 1.8V P UD 54VFBGA 133MHz, -25 to 85C 6I 6E P 90VFBGA 166MHz, -40 to 85C 7E 6I W989D6KBGX 133MHz, -25 to 85C 133MHz, -25 to 85C X16 6E 7E Automotive 166MHz, -40 to 85C 7E 6I Status1,2 54VFBGA 166MHz, -40 to 85C 166MHz, -25 to 85C 6I W988D6FBGX Package 133MHz, -25 to 85C 6E 7E Speed Grade 166MHz, -25 to 85C 90VFBGA 54VFBGA 90VFBGA 166MHz, -40 to 85C 166MHz, -25 to 85C 166MHz, -40 to 85C 166MHz, -25 to 85C 166MHz, -40 to 85C 60VFBGA 90VFBGA Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 04 Mobile RAM Low Power DDR SDRAM Winbond’s LPDDR SDRAM(Low Power DDR SDRAM) product family is designed with specific features to reduce power consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power down mode, Deep power down mode and Programmable output buffer driving strength. Note: If any request of KGD, please contact sales. Low Power DDR SDRAM Part No. Density Organization Voltage 6E W947D6HBHX W947D2HBJX W948D6FBHX 1.8V / 1.8V 200MHz, -25 to 85C 166MHz, -40 to 85C 6E 166MHz, -25 to 85C 5E 200MHz, -25 to 85C x16 6I 256 Mbit 5E 166MHz, -40 to 85C 1.8V / 1.8V 6I W949D2KBJX 166MHz, -40 to 85C 5I 200MHz, -40 to 85C 166MHz, -25 to 85C 5E 200MHz, -25 to 85C x16 6I 512 Mbit 5E 166MHz, -40 to 85C 1.8V / 1.8V W94AD6KBHX W94AD2KBJX P P P UD UD(Q1/'13) UD 90VFBGA 60VFBGA 166MHz, -25 to 85C 166MHz, -40 to 85C 200MHz, -25 to 85C X16 512 Mbit 1.8V / 1.8V X32 5I 5E 5E - 60VFBGA 90VFBGA 200MHz, -40 to 85C 5E 5I P 90VFBGA 200MHz, -40 to 85C 200MHz, -25 to 85C x32 6I 5E - 166MHz, -25 to 85C 6E 5I P 60VFBGA 200MHz, -40 to 85C 200MHz, -25 to 85C x32 5I W949D6KBHX Automotive 166MHz, -25 to 85C 200MHz, -40 to 85C 5I Status1,2 200MHz, -40 to 85C 5I 6E W949D2CBJX 166MHz, -40 to 85C x32 6I 6E W949D6CBHX 128 Mbit 5E 5I W948D2FBJX 200MHz, -25 to 85C x16 6I 6E Package 166MHz, -25 to 85C 5E 5I Speed Grade 200MHz, -25 to 85C 5I 1.8V / 1.8V X32 200MHz, -25 to 85C 200MHz, -40 to 85C X16 1Gbit 200MHz, -40 to 85C 200MHz, -40 to 85C 200MHz, -25 to 85C 200MHz, -40 to 85C 60VFBGA 90VFBGA 60VFBGA 90VFBGA Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Contact us: [email protected] 05 www.winbond.com Low Power DDR2 SDRAM Winbond’s LPDDR2 SDRAM(Low Power DDR2 SDRAM) product family is designed with specific features to reduce power consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power down mode, Deep power down mode and Programmable output buffer driving strength. Note: If any request of KGD, please contact sales. Low Power DDR2 SDRAM Part No. W979H6KBQX W979H2KBQX W97AH6KBQX W97AH2KBQX W97BH6KBQX W97BH2KBQX Density 3I 2I 3I 3I 2I 400MHz, -40 to 85C 333MHz, -40 to 85C 1.8V / 1.2V / 1.2V x32 3I 2I 333MHz, -40 to 85C x16 2I x16 2Gbit x32 Package 400MHz, -40 to 85C x32 1Gbit Speed Grade 333MHz, -40 to 85C 512 Mbit 2I 3I Voltage x16 3I 2I Organization 400MHz, -40 to 85C 333MHz, -40 to 85C 400MHz, -40 to 85C 333MHz, -40 to 85C 400MHz, -40 to 85C 333MHz, -40 to 85C 400MHz, -40 to 85C Status1,2 Automotive UD(Q1/'13) UD UD(Q2/'13) UD UD(Q1/'13) UD 168 PoP 168 PoP 168 PoP 168 PoP 168 PoP 168 PoP Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 06 Mobile RAM Pseudo SRAM (KGD) Pseudo SRAM (Static Random Access Memory) consists of a DRAM macro core with a traditional SRAM interface; an on-chip refresh circuit that frees the user from the need to take care of this task. Comparing to traditional CMOS SRAM, PSRAM has advantage in higher density, higher speed, smaller die size, and DRAM compatible process. Pseudo SRAM (KGD) Part No. Density W965D6GKA W955D6GKA 32 Mbit Organization Voltage X16 CRAM 1.8V / 1.8V Speed Grade Status1,2 Automotive - P - X16 CRAM-ADM 1.8V / 1.8V - P - W955D6GKS X16 CRAM-AADM 1.8V / 1.8V - P - W966D6HKA X16 CRAM 1.8V / 1.8V - P - W956D6HKA X16 CRAM-ADM 1.8V / 1.8V - P - X16 CRAM-AADM 1.8V / 1.8V - P - X16 CRAM-ADM 1.8V / 1.8V - P - W956D6KKS X16 CRAM-AADM 1.8V / 1.8V - P - W956D6KKE X16 CRAM-ADM_DDR 1.8V / 1.8V - P - W956D6KKW X16 CRAM-AADM_DDR 1.8V / 1.8V - P - W967D6HKA X16 CRAM - P - - P - - P - - P - - P - - P - W956D6HKS W956D6KKA W957D6HKA 64 Mbit 128 Mbit W957D6HKS W958D6DKS 1.8V / 1.8V 133MHz / 70ns, -25 to 85C 133MHz / 70ns, -25 to 85C X16 CRAM-AADM W968D6DKA W958D6DKA X16 CRAM-ADM 133MHz / 70ns, -25 to 85C Package X16 CRAM 256Mbit X16 CRAM-ADM X16 CRAM-AADM 1.8V / 1.8V 133MHz / 70ns, -25 to 85C Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Contact us: [email protected] 07 www.winbond.com 擔當 創新 群效 Accountability / Innovation / Teamwork 08 Specialty DRAM ▪ SDRAM ▪ DDR SDRAM ▪ DDR2 SDRAM ▪ DDR3 SDRAM ▪ KGD • The products listed above may not be available for all regions.Please contact your local Winbound Sales Representative. 09 www.winbond.com SDRAM Synchronous DRAM is designed to process data at the same clock speed as the CPU. Therefore, synchronous DRAM is regarded as the core component that is used in high speed processing of large volumes of data. Currently, its usage is expanding to various consumer electronics such as DTV, DSC, HDD and STB. 16Mb SDRAM Part No. W9816G6IB W9816G6IH Organization 1Mbit x16 1Mbit x16 2 Banks 2 Banks Voltage Speed Grade 3.3V±0.3V -6/-6I 166 MHz 2.7V~3.6V -7 143 MHz 3.3V±0.3V -5 3.3V±0.3V -6/-6I/-6A 166 MHz 2.7V~3.6V -7/-7I 143 MHz 143 MHz Status1,2 Automotive VFBGA 60 Ball, RoHS compliant P P TSOP II 50-pin, 400 mil, RoHS compliant P P Status1,2 Automotive Package CL3 CL2 200 MHz CL3 64Mb SDRAM Part No. W9864G2JB W9864G2JH Organization 2Mbit x32 2Mbit x32 4 Banks 4 Banks Voltage 3.3V±0.3V -6/-6I/-6K/-6A 166 MHz 2.7V~3.6V -7/-7I 143 MHz -5 200 MHz -6/-6I/-6A 166 MHz -7 143 MHz -5 200 MHz -6/-6I/-6A 166 MHz 2.7V~3.6V -7/-7S 143 MHz 3.3V±0.3V -6/-6I/-6A 166 MHz 2.7V~3.6V -7 143 MHz 3.3V±0.3V -6/-6I/-6A/-6K 166 MHz 3.3V±0.3V 2.7V~3.6V W9864G6JH 4Mbit x16 4 Banks W9864G6JB 4Mbit x16 4 Banks W9864G6JT 4Mbit x16 4 Banks Speed Grade 3.3V±0.3V Package CL3 TFBGA 90 Ball (8x13mm²), RoHS compliant P P CL3 TSOP II 86-pin, RoHS compliant P P CL3 TSOP II 54-pin, 400 mil, RoHS compliant P P CL3 VFBGA 60 Ball, RoHS compliant P P CL3 TFBGA 54 Ball, RoHS compliant P P Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. 擔當 創新 群效 Accountability / Innovation / Teamwork 10 Specialty DRAM 128Mb SDRAM Part No. W9812G6JH W9812G6JB Organization 8Mbit x16 8Mbit x16 4 Banks 4 Banks Voltage 3.3V±0.3V 3.3V±0.3V Speed Grade -5 200 MHz -6/-6I/-6A 166 MHz -75 133 MHz -6/-6I 166 MHz -75/75I 133 MHz Package Status1,2 Automotive CL3 TSOP II 54-pin, 400 mil, RoHS compliant P P CL3 TFBGA 54 Ball (8x8mm²), RoHS compliant P P 256Mb SDRAM Part No. Organization Voltage 3.3V±0.3V W9825G2JB W9825G6JH 8Mbit x32 16Mbit x16 4 Banks 4 Banks Speed Grade 16Mbit x16 4 Banks 166 MHz CL3 2.7V~3.6V -75/75I 133 MHz -5 200 MHz -6/-6I/-6L/-6A 166 MHz -6 -75/75L W9825G6JB 3.3V±0.3V Automotive TFBGA 90 Ball, ROHS compliant P P TSOP II 54-pin, 400 mil - 0.80, RoHS compliant P P TFBGA 54 Ball (8x8mm²), RoHS compliant P P -6 -6I 3.3V±0.3V Status1,2 Package 133 MHz -6/-6I/-6A/-6K 166 MHz -75 133 MHz CL3 CL2 CL3 CL3 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs' RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Winbond also provides Automotive DRAM. Contact us: [email protected] 11 www.winbond.com DDR SDRAM DDR SDRAM or double-data-rate synchronous dynamic random access memory is a type of memory used in computers and consumer electronics. It achieves greater bandwidth than the preceding single-data-rate SDRAM by transferring data on both the rising and falling edges of the clock signal. 64Mb DDR Part No. W9464G6JH Organization 4Mbitx16 Voltage 4 Banks Speed Grade Status1,2 Automotive P P Status1,2 Automotive TSOP II 66-pin, RoHS compliant P P TFBGA 60 Ball (8x13mm²), RoHS compliant P P Status1,2 Automotive TSOP II 66-pin, RoHS compliant P P TFBGA 60 Ball, RoHS compliant P P Package 2.4V~2.7V -4 250 MHz CL3/CL4 2.5V±0.2V -5/-5I 200 MHz CL3 TSOP II 66-pin, RoHS compliant 128Mb DDR Part No. Organization Voltage 2.4V~2.7V W9412G6JH 8Mbitx16 4 Banks Speed Grade -4 Package 250 MHz CL3/CL4 200 MHz CL3 -5/-5I/-5K 2.5V±0.2V -6I W9412G6JB 8Mbitx16 4 Banks 2.4V~2.7V -4 250 MHz CL3/CL4 2.5V±0.2V -5/-5I 200 MHz CL3 256Mb DDR Part No. Organization W9425G6JH 16Mbitx16 4 Banks W9425G6JB 16Mbitx16 4 Banks Voltage Speed Grade Package 2.4V~2.7V -4 250 MHz CL3/CL4 2.5V ±0.2V -5/-5I/-5A 200 MHz CL3 2.5V ±0.2V -5/-5I 200MHz CL3 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Winbond also provides Automotive DRAM. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 12 Specialty DRAM DDR2 SDRAM DDR2 SDRAM ( double-data-rate synchronous dynamic random access memory generation 2 ) is a type of memory used in computers and consumer electronics. It achieves greater bandwidth than the preceding DDR SDRAM by higher clock rate 128Mb DDR2 Part No. W9712G6KB W9712G6KT W9712G8JB Organization 8Mbit x16 16Mbitx8 Voltage 4 Banks 4 Banks Speed Grade 1.8V±0.1V 1.8V±0.1V CL-tRCD-tRP -18 DDR2-1066 7-7-7 -25 DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 -18 DDR2-1066 7-7-7 -25 DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 Status1,2 Automotive TFBGA 84 Ball (8x12.5mm²), RoHS compliant P P WBGA 60 Ball (8x12.5mm²), RoHS compliant P P Package 256Mb DDR2 Part No. Organization W9725G2JB 8Mbit x32 Voltage 4 Banks 1.8V±0.1V Speed Grade -25 DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 -18 DDR2-1066 W9725G6KB 16Mbit x16 4 Banks 1.8V±0.1V -25/25I/25A/25K DDR2-800 W9725G6KT -3 DDR2-667 W9725G8KB 32Mbitx8 4 Banks 1.8V±0.1V CL-tRCD-tRP Package TFBGA 128 Ball(10.5X13.5 mm²), RoHS compliant P P WBGA 84 Ball (8X12.5 mm²), RoHS compliant P P WBGA 60 Ball (8X12.5 mm²), RoHS compliant P P 7-7-7 5-5-5/6-6-6 5-5-5 -18 DDR2-1066 7-7-7 -25 DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. 13 www.winbond.com Status1,2 Automotive 512Mb DDR2 Part No. Organization W9751G6KB 32Mbitx16 W9751G8KB Voltage 4 Banks 64Mbitx8 Speed Grade 1.8V±0.1V 4 Banks 1.8V±0.1V Package Status1,2 Automotive WBGA 84 Ball (8X12.5 mm²), RoHS compliant P P WBGA 60 Ball (8X12.5 mm²), RoHS compliant P P Package Status1,2 Automotive WBGA 84 Ball (8x12.5mm²), RoHS compliant P P WBGA 60 Ball (8x12.5mm²), RoHS compliant P P CL-tRCD-tRP -18 DDR2-1066 7-7-7 -25/25I/ 25A/25K DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 -18 DDR2-1066 7-7-7 -25/25I DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 1Gb DDR2 Part No. Organization W971GG6KB 64Mbitx16 W971GG8KB 128Mbitx8 8 Banks 8 Banks Voltage 1.8V±0.1V 1.8V±0.1V Speed Grade CL-tRCD-tRP -18 DDR2-1066 6-6-6 -25/25I/ 25L/25A/ 25K DDR2-800 5-5-5 -3 DDR2-667 5-5-5 -18 DDR2-1066 6-6-6 -25/25I/ 25A/25K DDR2-800 5-5-5 -3 DDR2-667 5-5-5 2Gb DDR2 Part No. W972GG6JB W972GG8JB Organization 128Mbitx16 256Mbitx8 8 Banks 8 Banks Voltage 1.8V±0.1V 1.8V±0.1V Speed Grade CL-tRCD-tRP -18 DDR2-1066 7-7-7 -25/25I/ 25A/25K DDR2-800 5-5-5/6-6-6 -3/-3A DDR2-667 5-5-5 -18 DDR2-1066 7-7-7 -25/25I DDR2-800 5-5-5/6-6-6 -3 DDR2-667 5-5-5 Status1,2 Automotive Package WBGA 84 Ball (11x13mm²), RoHS compliant P P WBGA 60 Ball (11x11.5mm²), RoHS compliant P P Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Winbond also provides Automotive DRAM. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 14 Specialty DRAM DDR3 SDRAM DDR3 SDRAM ( double-data-rate synchronous dynamic random access memory generation 3 ) is a type of memory used in electronics. Such as TV, STB, Network, BD-Player and so on. It achieves greater bandwidth than the preceding DDR2 SDRAM by higher clock rate. 1Gb DDR3 Part No. Organization Voltage W631GG6KB 64Mbitx16 8 Banks 1.5V±0.075V W631GU6KB 64Mbitx16 8 Banks 1.283V ~1.45V W631GG8KB 128Mbitx8 8 Banks 1.5V±0.075V W631GU8KB 128Mbitx8 8 Banks 1.283V ~1.45V Speed Grade CL-tRCD-tRP -11 DDR3-1866 13-13-13 -12/12I/12A/12K DDR3-1600 11-11-11 -15/15I/15A/15K DDR3-1333 9-9-9 -15/15I/15A/15K DDR3-1333 9-9-9 -11 DDR3-1866 13-13-13 -12 DDR3-1600 11-11-11 -15/15I DDR3-1333 9-9-9 -15/15I DDR3-1333 9-9-9 Status1,2 Automotive WBGA 96 Ball (9x13mm²), RoHS compliant P P WBGA 96 Ball (9x13mm²), RoHS compliant P P WBGA 78 Ball (8x10.5mm²), RoHS compliant P P WBGA 78 Ball (8x10.5mm²), RoHS compliant P P Package 2Gb DDR3 Part No. Organization W632GG6KB 128Mbitx16 8 Banks Voltage 1.5V±0.075V Speed Grade CL-tRCD-tRP -11 DDR3-1866 13-13-13 -12/12I DDR3-1600 11-11-11 -15/15I/15A/15K DDR3-1333 9-9-9 W632GU6KB 128Mbitx16 8 Banks 1.283V ~1.45V -15/15I/15A/15K DDR3-1333 9-9-9 W632GG8KB 256Mbitx8 8 Banks 1.5V±0.075V W632GU8KB 256Mbitx8 8 Banks 1.283V ~1.45V -11 DDR3-1866 13-13-13 -12 DDR3-1600 11-11-11 -15 DDR3-1333 9-9-9 -15 DDR3-1333 9-9-9 Package WBGA 96 Ball (9x13mm²), RoHS compliant P S WBGA 96 Ball (9x13mm²), RoHS compliant P S WBGA 78 Ball (8x10.5mm²), RoHS compliant P S WBGA 78 Ball (8x10.5mm²), RoHS compliant P S Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. 15 www.winbond.com Status1,2 Automotive 4Gb DDR3 Part No. Organization Voltage Speed Grade W634GG6LB 256Mbitx16 8 Banks 1.5V±0.075V W634GU6LB 256Mbitx16 8 Banks 1.35V Status1,2 Automotive WBGA 96 Ball (9x13.5mm²), RoHS compliant P - WBGA 96 Ball (9x13.5mm²), RoHS compliant P - CL-tRCD-tRP -12 DDR3-1600 11-11-11 -15 DDR3-1333 9-9-9 -15 DDR3-1333 9-9-9 Package 1Gb GDDR3 Part No. Density Organization Voltage W641GG2KB 1Gbit 32Mbit x32 1.8V ± 0.1V Speed Grade -12/-14 1G/800/700MHz Package Status1,2 Automotive WBGA-136 P - Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Winbond also provides Automotive DRAM. Contact us: [email protected] KGD Fully Cover all Consumer Applications: TV, STB, Networking, Storage, Printer, DSC/DV, GPS, Automotive…etc. Providing KGD services to SiP customers with complete DRAM product portfolio such as SDRAM, DDR, DDR2, DDR3, mSDR, mDDR, mDDR2 and PSRAM. Wafer Level high speed test: Up to DDR3 1600Mbps, DDR2 1066Mbps, DDR 500Mbps. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation,…etc. Excellent Quality Control: 100% Burn-In and Test. AECQ-100, TS16949, ISO9001/14001, OHSAS18001 certificated for Automotive customers. Product Life Time and Strong Engineering Support: Owning a 12-inch Feb to guarantee stable long term support with EFA/PFA capability. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 16 Flash Memory ▪ Serial Flash ▪ Parallel Flash ▪ NAND Flash ▪ KGD • The products listed above may not be available for all regions.Please contact your local Winbound Sales Representative. • 17 www.winbond.com SpiFlash® Memories with SPI, Dual-SPI, Quad-SPI and QPI Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/ S transfer rate) when using Quad-SPI. This is more than eight times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for space constrained mobile and handheld applications. Leading the Serial Flash Market in unit sales and revenue, Winbond TS16949 certified AEC-Q100 qualified memories now support automotive applications. The automobile has transformed into the most sophisticated electronic device in the market. Digital displays in automotive dashboards provide more information about the car, and improve safety. Instant-on and real time 2D/3D image rendering is achieved with fast processors and SpiFlash memories. ADAS (Advanced Driver Assist Systems), comfort, entertainment, and navigation is now available in the center console and this is addressed with SpiFlash memories using small packages for space constrained systems and high density for advanced applications. Tiny Serial Flash Packages Winbond Industrial and Automotive Grade Memory Temperature Range Part# Example industrial industrial Plus Automotive Grade 3 Automotive Grade 2 -40℃~85℃ -40℃~105℃ -40℃~85℃ -40℃~105℃ W25Q80BVSSIG W25Q80BVSSJG W25Q80BVSSBG W25Q80BVSSAG AEC-Q100 Compliant No No Yes Yes Change Control (PPAP) No No Optional Optional 擔當 創新 群效 Accountability / Innovation / Teamwork 18 Flash Memory W25X SpiFlash Family - Serial Peripheral Interface (SPI), Dual Output SPI - Uniform 4KB, 32KB & 64KB erase W25Q SpiFlash Family - 512K-bit to 512M-bit, superset compatible with 25X - SPI, Dual-SPI, Quad-SPI and QPI (for some devices) - Uniform 4KB, 32KB & 64KB erase - Erase and Program Suspend/Resume - Quad Page Program - Security: Lock-down, ID#, OTP Registers - Serial Flash Discoverable Parameters (SFDP) High Performance - 104MHz Clock, 416MHz Quad-SPI (50MB/S) - >8X speed of most Serial Flash - Fast-boot or execute code (XIP) from SPI Voltage & Package Options - 3V, 2.5V and 1.8V operation - Space saving packages: 8-pin SOIC, WSON, DIP, USON, WLBGA(CSP), TSSOP 16-pin SOIC, 24-ball TFBGA - Known Good Die (KGD) Wafers Wide Range of Applications - PCs, DVD, BluRay, WLAN, DSL/Cable Modem, Printers, - Hard Disk Drives, Set Top Box, LCD-TV, Mobile Phones, - Bluetooth, GPS, MP3, Meters, DSP, FPGAs and more 19 www.winbond.com SpiFlash W25X & W25Q Memory Overview & Selection Guide Serial Flash Status1,2 Automotive Part No. Density Organization Voltage Temp. Speed Package(s) W25X05CL 512Kbit (64KB) 256 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, VSOP8 150mil, WSON 6X5mm4, USON8 2X3mm, TSSOP8 173mil P - W25Q05CL4 512Kbit (64KB) 256 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual/Quad SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 150mil, VSOP8 150mil, WSON 6X5mm, USON8 2X3mm, TSSOP8 173mil P - W25X10BV 1Mbit (128KB) 512 pages, 4KB sectors, 32/64KB blocks, Dual SPI 2.7V - 3.6V -40 to +85 104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm4, VSOP8 150mil, USON8 2X3mm N - W25X10CL 1Mbit (128KB) 512 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, VSOP8 150mil, WSON 6X5mm4, USON8 2X3mm, TSSOP8 173mil P - W25Q10CL 1Mbit (128KB) 512 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual/Quad SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 150mil, VSOP8 150mil, WSON 6X5mm, USON8 2X3mm, TSSOP8 173mil P - W25X20BV 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Dual SPI 2.7V - 3.6V -40 to +85 104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm, USON8 2X3mm N - W25X20BL 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Dual SPI 2.3V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm N - W25X20CV (Automotive Only) 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.3V - 3.6V -40 to +85 -40 to +105 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm, SOIC8 208mil, USON8 2X3mm - P 4 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 20 Flash Memory SpiFlash W25X & W25Q Memory Overview & Selection Guide Serial Flash Density Organization Voltage Temp. Speed W25X20CL 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm P - 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual/Quad SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 150mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm P - W25Q20BW 2Mbit (256KB) 1024 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI, Fast Write, Enhanced3 1.65V -1.95V -40 to +85 80MHz (160/320MHz Dual/ Quad-SPI) SOIC8 150mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm P - W25X40BV 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual SPI 2.7V - 3.6V -40 to +85 80/104MHz (208MHz Dual-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm N - W25X40BL 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual SPI 2.3V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm N - W25X40CV (Automotive Only) 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.7V - 3.6V -40 to +85 -40 to +105 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, WSON 6X5mm, SOIC8 208mil, USON8 2X3mm - P W25X40CL 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Fast Write, Dual SPI 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 50/104MHz (208MHz Dual-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm P - W25Q40BV 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 2.7V - 3.6V -40 to +85 80/104MHz (160/320MHzDual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm N - W25Q20CL 4 Package(s) Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 21 Status1,2 Automotive Part No. www.winbond.com Serial Flash Part No. W25Q40BL W25Q40CL4 W25Q40BW W25Q80BV W25Q80BL W25Q80BW SpiFlash W25X & W25Q Memory Overview & Selection Guide Organization Voltage Temp. Speed 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI, Fast Write, Enhanced3 2.3V - 3.6V -40 to +85 50/80MHz (100/200MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm N - 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI Fast Write, Enhanced3 2.3V - 3.6V and 2.7V - 3.6V -40 to +85 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, USON8 2X3mm P - 4Mbit (512KB) 2048 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Fast Write, Enhanced3 1.65V -1.95V -40 to +85 80MHz (160/320MHzDual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm P - 8Mbit (1MB) 4096 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 -40 to +85 -40 to +105 80/104MHz (160/320MHzDual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, VSOP8 208mil, USON8 2X3mm, TFBGA24 8x6mm (8x6 Matrix), TFBGA24 8x6mm (5x5 Matrix) P P 8Mbit (1MB) 4096 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI, Fast Write, Enhanced3 2.3V - 3.6V -40 to +85 50/80MHz (100/200MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, PDIP8 300mil, VSOP8 150mil, VSOP8 208mil, USON8 2X3mm P - 8Mbit (1MB) 4096 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI, Fast Write Enhanced3 1.65V -1.95V -40 to +85 80MHz (160/320MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, WSON 6X5mm, VSOP8 150mil, VSOP8 208mil, WLBGA8 P - 2.7V - 3.6V Package(s) Status1,2 Automotive Density Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 22 Flash Memory SpiFlash W25X & W25Q Memory Overview & Selection Guide Serial Flash Part No. W25Q16CV W25Q16DV W25Q16CL W25Q16DW Density Organization 16Mbit (2MB) 8192 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 16Mbit (2MB) 8192 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 16Mbit (2MB) 8192 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI, Enhanced3 16Mbit (2MB) 8192 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI,QPI, Enhanced3 Voltage 2.7V - 3.6V 2.7V - 3.6V 2.3V - 3.6V 1.65V -1.95V Temp. Speed Package(s) -40 to +85 -40 to +105 80/104MHz (160/320MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 150mil, VSOP8 208mil -40 to +85 -40 to +105 80/104MHz (160/320MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 150mil, VSOP8 208mil P - -40 to +85 50/80MHz (100/200MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 150mil, VSOP8 208mil P - -40 to +85 -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 150mil, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 150mil, VSOP8 208mil, USON8 4x3mm, WLBGA8 P P Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 23 www.winbond.com Status1,2 Automotive N P Serial Flash Part No. W25Q32BV W25Q32FV W25Q32DW W25Q32FW SpiFlash W25X & W25Q Memory Overview & Selection Guide Density Organization 32Mbit (4MB) 16384 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 32Mbit (4MB) 16384 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI, Enhanced3 Voltage Status1,2 Automotive Speed Package(s) 80/104MHz (208/320MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil, WSON8 8X6mm, PDIP8 300mil N P -40 to +85 -40 to +105 104MHz (208/320MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil P UD 32Mbit (4MB) 16384 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI,QPI, Enhanced3 -40 to +85 1.65V -1.95V -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil N UD 32Mbit (4MB) 16384 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI,QPI, Enhanced3 -40 to +85 1.65V -1.95V -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), USON8 4x3mm, VSOP8 208mil UD UD 2.7V - 3.6V 2.7V - 3.6V Temp. -40 to +85 -40 to +105 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 24 Flash Memory SpiFlash W25X & W25Q Memory Overview & Selection Guide Serial Flash Part No. W25Q64CV W25Q64FV W25Q64DW W25Q64FW Temp. Speed Package(s) Status1,2 Automotive -40 to +85 -40 to +105 80MHz (160/320MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil N P -40 to +85 -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil P UD 64Mbit (8MB) 32768 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI,QPI, Enhanced3 -40 to +85 1.65V -1.95V -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil N UD 64Mbit (8MB) 32768 pages, 4KB sectors, 32/64KB blocks, Dual/Quad SPI,QPI, Enhanced3 -40 to +85 1.65V -1.95V -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), USON 4x3mm, VSOP8 208mil P UD Density Organization 64Mbit (8MB) 32768 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 64Mbit (8MB) 32768 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI Enhanced3 Voltage 2.7V - 3.6V 2.7V - 3.6V Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 25 www.winbond.com Serial Flash SpiFlash W25X & W25Q Memory Overview & Selection Guide Status1,2 Automotive Part No. Density Organization Voltage Temp. Speed Package(s) W25Q128BV 128Mbit (16MB) 65536 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI Enhanced3 2.7V - 3.6V -40 to +85 -40 to +105 70/104MHz (208/280MHz Dual/ Quad-SPI) SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) N P 128Mbit (16MB) 65536 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI, Enhanced3 -40 to +85 -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil P UD 128Mbit (16MB) 65536 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI, Enhanced3 -40 to +85 1.65V -1.95V -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil P UD 256Mbit (32MB) 131072 pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI, Enhanced3 2.7V - 3.6V -40 to +85 -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) P UD 512Mbit (64MB) 262144pages, 4KB sectors, 32/64KB blocks, Dual/Quad-SPI, QPI, Enhanced3 2.7V - 3.6V -40 to +85 -40 to +105 104MHz (208/416MHz Dual/ Quad-SPI) SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) UD UD W25Q128FV W25Q128FW W25Q256FV W25Q512JV 2.7V - 3.6V Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package. Contact us: [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 26 Flash Memory Parallel Flash Memory –W29GL Family Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular “x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash products are ideal for a wide variety of applications requiring the higher performance of a parallel bus width and page mode operation. W29GL Page Mode Parallel Flash Family - 32Mb to 512Mb densities - Compatible with Industry Standard x29GL products - 2.7V to 3.6V operation; also supports VIO at 1.8V - x8/x16 data bus configuration - 70/90ns read access time, 25ns page mode access time - Provides many sector protection mechanisms * Offers additional security of code/data Package Options - Industry standard packages for 32Mb & 64Mb densities * 48-pin TSOP (Top/Bottom Boot) * 48-ball VFBGA (Top/Bottom Boot) * 56-pin TSOP (High/Low Sector protect) * 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect) - Industry standard packages for 128Mb to 512Mb densities * 56-pin TSOP (High/Low Sector protect) * 64-ball LFBGA (High/Low Sector protect) Special Features - Drop-in replacement of Industry Standard x29GL * No firmware change needed - Saves 40% erase time and 60% program time * Improves production throughput * Faster firmware updates Wide Range of Applications - Networking, Storage, Set-Top-Box, DSL and Cable modems - Wireless routers, Digital TV, Industrial, Automotive - PC peripherals, Printer, Mobile phones, Cameras and more 27 www.winbond.com Parallel Flash Part No. Parallel Flash Product Selection Guide (Page Mode Parallel Flash) Speed Remark Package Status1,2 Automotive 70ns Top Boot Bottom Boot High Sector Low Sector TSOP 563 LFBGA 643 TSOP 48 TFBGA 48 P UD -40 to +85 70ns Top Boot Bottom Boot High Sector Low Sector TSOP 56 LFBGA 64 TSOP 48 TFBGA 48 P UD 3V/3.3V -40 to +85 90ns High Sector Low Sector TSOP 56 LFBGA 64 P UD 32Mbit x 8/ 16Mbit x 16 3V/3.3V -40 to +85 90ns High Sector Low Sector TSOP 56 LFBGA 64 UD UD 32Mbit x 8/ 16Mbit x 16 3V/3.3V -40 to +85 90ns High Sector Low Sector TSOP 56 LFBGA 64 UD UD Density Organization 32Mbit 4Mbit x 8/ 2Mbit x 16 W29GL064C 64Mbit 8Mbit x 8/ 4Mbit x 16 3V/3.3V W29GL128C 128Mbit 16Mbit x 8/ 8Mbit x 16 W29GL256C3 256Mbit W29GL512C3 512Mbit W29GL032C Voltage 3V/3.3V Temp. -40 to +85 Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications. Availability3: Please contact Winbond for avaliability of these products and packages. Contact us: [email protected] NAND Flash We will be offering SLC NAND Flash products starting in 2013. For further information please contact Winbond sales. [email protected] KGD We offer various KGD type Parallel Flash and Serial Flash, further information please contact [email protected] 擔當 創新 群效 Accountability / Innovation / Teamwork 28 Product Selection Guide 2013 Note 29 www.winbond.com