——紘康科技 技术推广服务 www.fosvos.com 技术服务热线：+86-21-58994470 销售服务热线：+86-21-58998693 HY11P13 Data Sheet 8bits RISC-like Mixed Signal Microcontroller Embedded High Resolution ΣΔADC Low Noise Amplifier 4x20 LCD Driver ©2007 Hycon Technology Corp. Preliminary HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor ϫᐂ 1. 特點 ......................................................................................................................................................... 4 2. 引腳定義 ................................................................................................................................................ 5 3. 4. 2.1 LQFP64 ͔ཙဦ ...........................................................................................................................................5 2.2 I/O͔ཙؠཌྷ...............................................................................................................................................6 應用電路 ................................................................................................................................................ 9 3.1 ёຏീጡ(Load Cell)................................................................................................................................9 3.2 ёຏീጡ(Pressure Sensor) ...................................................................................................................11 3.3 ࡓγቢຏീጡ ..........................................................................................................................................12 3.4 4‐20mA߹ᏻᐝ(ගё).................................................................................................................13 功能概述 ..............................................................................................................................................14 4.1 ̰ొ͞ဦ ..............................................................................................................................................14 4.2 ࠹ᙯᄲځᄃ͚೯͛І ...............................................................................................................................14 5. 暫存器列表 ..........................................................................................................................................15 6. 電氣特性 ..............................................................................................................................................17 6.1 Recommended operating conditions .........................................................................................................17 6.2 Internal RC Oscillator ................................................................................................................................18 6.3 Supply current into VDD excluding peripherals current..............................................................................19 6.4 Port1~2 ....................................................................................................................................................21 6.5 Reset(Brownout, External RST pin, Low Voltage Detect) ............................................................................22 6.6 Power System ...........................................................................................................................................23 6.7 LCD...........................................................................................................................................................25 ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page2 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.8 Low Noise OPAMP ....................................................................................................................................26 6.9 SD18,Power Supply and recommended operating conditions ....................................................................27 6.9.1 PGA,Power Supply and recommended operating conditions......................................................................27 6.9.2 SD18,performanceǶ(fSD18=250KHz)........................................................................................................27 6.9.3 SD18,Temperature sensor .........................................................................................................................29 7. ORDERING INFORMATION ............................................................................................................30 8. PACKAGE INFORMATION ...............................................................................................................31 8.1 LQFP64(L064)............................................................................................................................................31 注意： 1ă 本說明書中的內容，隨著產品的改進，有可能不經過預告而更改。請客戶及時到本公司網站下載更新 http://www.hycontek.com 2ă 本規格書中的圖形、應用電路等，因第三方工業所有權引發的問題，本公司不承擔其責任。 3ă 本產品在單獨應用的情況下，本公司保證它的性能、典型應用和功能符合說明書中的條件。當使用在客 戶的產品或設備中，以上條件我們不作保證，建議客戶做充分的評估和測試。 4ă 請注意輸入電壓、輸出電壓、負載電流的使用條件，使 IC 內的功耗不超過封裝的容許功耗。對於客戶在 超出說明書中規定額定值使用產品，即使是瞬間的使用，由此所造成的損失，本公司不承擔任何責任。 5ă 本產品雖內置防靜電保護電路，但請不要施加超過保護電路性能的過大靜電。 6ă 本規格書中的產品，未經書面許可，不可使用在要求高可靠性的電路中。例如健康醫療器械、防災器械、 車輛器械、車載器械及航空器械等對人體產生影響的器械或裝置，不得作為其部件使用。 7ă 本公司一直致力於提高產品的品質和可靠度，但所有的半導體產品都有一定的失效概率，這些失效概率 可能會導致一些人身事故、火災事故等。當設計產品時，請充分留意冗餘設計，採用安全指標，這樣可 以避免事故的發生。 8ă 本規格書中內容，未經本公司許可，嚴禁用於其他目的之轉載或複製。 ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page3 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 1. পᕇ z z 8 Ҝ̮ΐૻݭჟᖎ΄ะĂВѣ 68 ࣎΄ ᏮĂѣ Push-Pull ᜭજਕ˧ĂΞ೩ֻ 2.0V to 3.6V ̍үᑅቑಛĂ-40ƨ~85ƨ̍ ็ຏጡᜭજᑅ z z ྻҖሀё 300uAƧ2MHz ޞ፟ሀё 3uA@32KHz Ѓ্ሀё 1uA z z 4x20 LCD ୵ᜭજጡ Statică1/2ă1/3ă1/4 Duty ̈́ 1/2ă1/3 Bias హវᏴፄ 4KWord OTP (One Time Programmable) ̰ ޙCharge Pump ᘦᑅቢྮĂ೩ֻ 4 LCD ઐᑅ Type ёጸវĂ256Byte ྤफ़ጸវ z 10mA ҲᑅमᄃҲᛜܼᇴᘦᑅᏮĂ Ξѣ 4 ̙ТᏮᑅᏴፄ ྿זָ࠷ఢထ LVD ҲᑅᑭീΑਕ 14 ߱ᑭീᑅనཉ ᄃγొᏮˢᑅᑭീΑਕ γొϮࡻዩᒜጡ̰̈́ొჟ ޘRC ዩᒜጡĂ 6 CPU ̍үॡਔ̷ೱᏴፄĂΞឰֹϡ۰ z 1.2V Ҳᛜܼᇴ۞̰ొᙷͧྮВгᑅ Βӣർវࢷ΄ܑߤ̈́΄ڱ үޘቑಛ z z Brownout and Watch dog TimerĂΞ֨ͤ z 8-bit Timer A CPU ซˢѪ፟ሀё z 16-bit Timer B ሀ Capture/Compare Αਕ 18bit БमજᏮˢɐɂADC ᙷͧᇴҜᖼೱጡ z ̰ཉ PGA (Programmable Gain Αਕ Amplifier) ̈́Ξѣ 1/4ă1/2ă1. …..128 z ࢺ 10 Ꮾˢࢺ̂ٸཱིܫதᏴፄ 8-bit Timer C ሀ PWM/PFD گԛயϠ ҚЕ఼ੈ SPI ሀ ̰ཉᏮˢᕇአፋĂΞ੫၆̙Тᑕϡ ᆧΐณീቑಛ ̰ཉܡԩᏮˢቤጡ(32 ͽ˯Ꮾˢ ࢺத̙ዋϡ) z ̰ཉ၆ޘຏീጡ ҲᏮˢᗔੈ(<1uVpp)ྻზ̂ٸጡ, Ξ೩ ֻᏮܡԩ̈ੈཱི۞̈̈́̂ٸ߹۞ ᑅᖼೱ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page4 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 2. ͔ཙؠཌྷ NC NC NC VLCD COM0 54 OP0O SEG4 55 NC SEG3 AI0 SET5 56 NC 53 ACM AI1 SEG6 57 NC SEG2 AI2 SEG7 58 VDD 52 VDDA AI3 SEG8 59 XTO/PT2.0 SEG1/COM3 AI4 SEG9 60 XTI/PT2.1 51 NC AI5 SEG10 61 PFD/PWM0/PT2.2 SEG0/COM2 AI6 SEG11 62 TMCKI/PT2.3 50 NC AI7 SEG12 63 CCP0/PT2.4 COM1 NC SEG13 64 CCP1/PT2.5 49 NC VSS SEG14 17 33 18 34 19 35 20 36 21 37 22 38 23 39 24 40 25 41 26 42 27 43 28 44 29 45 30 46 31 47 32 48 NC 2.1 LQFP64 ͔ཙဦ HY11P13 LQFP64 SEG16 SEG15 15 16 SEG17 14 SEG18 SEG19 13 12 SEG20 11 SEG21 10 BZ/PT1.7 9 SCK/PT1.6 8 PSDO/SDO/PT1.5 6 7 TST/PT1.3 PT1.4 LVDIN/SDI/PT1.2 4 5 PSDI/SCE/INT1/PT1.1 3 PSCK/INT0/PT1.0 2 RST/VPP 1 ဦ 2-1 HY11P13 LQFP64 ͔ཙဦ ො 1ĈVPP ᄃ RST ೇϡТ˘ତ˾Ăܧ፵ᐂ EPROM ॡ༰ͤᏮˢᑅ࿅ 5.8V ො 2ĈTST ᄃ PT1.3 ೇϡТ˘ତ˾Ăፆүॡ༰ͤᏮˢᑅ࿅ VDD+0.3V ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page5 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 2.2 I/O ͔ཙؠཌྷ “I/O”Ꮾˢ/Ꮾ,“I”Ꮾˢ,“O”Ꮾ,“S”Ϋᛈ൴,“C”CMOS পّࣘटᏮᄃᏮˢ,“P”ᑅ,“A”ᙷ఼ͧ በཱི ͔ཙপّ ͔ཙЩჍ Αਕᄲځ ॾё ቤ RST I S ೇҜͯ VPP P P EPROM /ᆷॡ۞ᑅ PT1.0 I C ᇴҜᏮˢ INT0 I S ̚ᕝ INT0 PSCK I S OTP /ᆷ̬ࢬ SCK ତ˾ PT1.1 I C ᇴҜᏮˢ INT1 I S ̚ᕝ INT1 PSDI I S OTP /ᆷ̬ࢬ SDI ତ˾ SCE I S SPI ఼ੈ̬ࢬ SCE ତ˾ PT1.2 I C ᇴҜᏮˢ SDI I S SPI ఼ੈ̬ࢬ SDI ତ˾ LVDIN A A LVD γొཱིܫᏮˢତ˾ PT1.3 I C ᇴҜᏮˢ TST I S ࣧᇄܲΑਕ I/O C ᇴҜ输ˢ/Ꮾ PT1.5 I/O C ᇴҜ输ˢ/Ꮾ PSDO O C OTP /ᆷ̬ࢬ SDO ତ˾ SDO O C SPI ఼ੈ̬ࢬ SDO ତ˾ PT1.6 I/O C ᇴҜ输ˢ/Ꮾ SCK O S/C PT1.7 I/O C ᇴҜ输ˢ/Ꮾ BZ O C ཻ鸣ጡᏮბ RST/VPP 1 PT1.0/INT0/PSCK 2 PT1.1/INT1/PSDI/SCE 3 PT1.2/SDI/LVDIN 4 PT1.3/TST 5 6 PT1.4 PT1.5/PSDO/SDO 7 PT1.6/SCK 8 SPI ఼ੈ̬ࢬ SCK ତ˾ PT1.7/BZ 9 10 SEG21 O A LCD ۞ Segment Ꮾ 11 SEG20 O A LCD ۞ Segment Ꮾ 12 SEG19 O A LCD ۞ Segment Ꮾ 13 SEG18 O A LCD ۞ Segment Ꮾ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page6 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 14 SEG17 O A LCD ۞ Segment Ꮾ 15 SEG16 O A LCD ۞ Segment Ꮾ 16 SEG15 O A LCD ۞ Segment Ꮾ 17 SEG14 O A LCD ۞ Segment Ꮾ 18 SEG13 O A LCD ۞ Segment Ꮾ 19 SEG12 O A LCD ۞ Segment Ꮾ 20 SEG11 O A LCD ۞ Segment Ꮾ 21 SEG10 O A LCD ۞ Segment Ꮾ 22 SEG9 O A LCD ۞ Segment Ꮾ 23 SEG8 O A LCD ۞ Segment Ꮾ 24 SEG7 O A LCD ۞ Segment Ꮾ 25 SEG6 O A LCD ۞ Segment Ꮾ 26 SEG5 O A LCD ۞ Segment Ꮾ 27 SEG4 O A LCD ۞ Segment Ꮾ 28 SEG3 O A LCD ۞ Segment Ꮾ 29 SEG2 O A LCD ۞ Segment Ꮾ 30 COM3/SEG1 O A LCD ۞ COM ᄃ Segment ВϡᏮ 31 COM2/SEG0 O A LCD ۞ COM ᄃ Segment ВϡᏮ 32 COM1 O A LCD ۞ COM Ꮾ 33 COM0 O A LCD ۞ COM Ꮾ 34 VLCD P P LCD ۞ᑅ 35 NC - - Ϗֹϡ 36 NC - - Ϗֹϡ 37 NC - - Ϗֹϡ 38 NC - - Ϗֹϡ 39 NC - - Ϗֹϡ 40 NC - - Ϗֹϡ 41 VDD P P ͯ̍үᑅ I/O C ᇴҜᏮˢ/Ꮾ A A γତॎᒜጡᏮბ I/O C ᇴҜᏮˢ/Ꮾ A A γତॎᒜጡᏮˢბ PT2.2 I/O C ᇴҜᏮˢ/Ꮾ PWM0 O C PWM Ꮾତ˾ PT2.0/XTO 42 PT2.0 XTO PT2.1/XTI 43 PT2.1 XTI PT2.2/PWM0/PFD 44 ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page7 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor PFD O C PFD Ꮾତ˾ PT2.3 I/O C ᇴҜᏮˢ/Ꮾ TMCKI I S TIMERC ॡਔᏮˢତ˾ PT2.4 I/O C ᇴҜᏮˢ/Ꮾ CCP0 I S ॏ॓/ͧྵሀёཱིܫତ˾ PT2.5 I/O C ᇴҜᏮˢ/Ꮾ CCP1 I S ॏ॓/ͧྵሀёཱིܫତ˾ PT2.3/TMCKI 45 PT2.4/CCP0 46 PT2.5/CCP1 47 48 NC - - Ϗֹϡ 49 NC - - Ϗֹϡ 50 NC - - Ϗֹϡ 51 NC - - Ϗֹϡ 52 VDDA P P ᘦᑅጡᏮ 53 ACM P P ̰ొᙷͧྮВг 54 OPO A A ྻზ̂ٸጡᏮ 55 AI0 A A ᙷͧᏮˢ఼ 56 AI1 A A ᙷͧᏮˢ఼ 57 AI2 A A ᙷͧᏮˢ఼ 58 AI3 A A ᙷͧᏮˢ఼ 59 AI4 A A ᙷͧᏮˢ఼ 60 AI5 A A ᙷͧᏮˢ఼ 61 AI6 A A ᙷͧᏮˢ఼ 62 AI7 A A ᙷͧᏮˢ఼ 63 NC - - Ϗֹϡ 64 VSS P P ͯ̍үᑅତгბ ܑ 2-1 ͔ཙؠཌྷᄃΑਕᄲځ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page8 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 3. ᑕϡྮ NC NC NC COM0 NC NC NC VLCD VDD XTI/PT2.1 XTO/PT2.0 PFD/PWM0/PT2.2 CCP0/PT2.4 NC 49 TMCKI/PT2.3 31 50 32 SEG15 SEG18 SEG16 SEG19 SEG17 SEG20 LVDIN/SDI/PT1.2 SEG21 PSDI/SCE/INT1/PT1.1 BZ/PT1.7 PSCK/INT0/PT1.0 SCK/PT1.6 CCP1/PT2.5 3.1 ёຏീጡ(Load Cell) 29 52 51 30 26 55 27 54 53 28 22 59 58 23 0.1uF 24 57 56 25 60 21 63 18 17 64 19 62 61 20 PT1.4 PSDO/SDO/PT1.5 TST/PT1.3 RST/VPP ဦ 3-1(a) ྃޘᐺ۞ёຏീጡᑕϡྮ ොĈֹϡྃޘᐺ ܡNTC ૄώቢྮ ොĈLoad Cell ᕇᑅҜཉΞ࿅ DCSET[2:0]ซҖઐᑅአፋ ොĈֹϡ̰ొ PGA ၆ཱིܫซҖ̂ٸॡĂυืଳϡ ACM γొઐᑅనࢍĄ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page9 HY11P13 NC NC NC COM0 NC NC NC VLCD VDD XTI/PT2.1 XTO/PT2.0 PFD/PWM0/PT2.2 CCP0/PT2.4 NC 49 TMCKI/PT2.3 31 50 32 SEG15 SEG18 SEG16 SEG19 SEG17 SEG20 LVDIN/SDI/PT1.2 SEG21 PSDI/SCE/INT1/PT1.1 BZ/PT1.7 PSCK/INT0/PT1.0 SCK/PT1.6 CCP1/PT2.5 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 51 30 52 29 53 28 26 55 54 27 56 25 57 24 58 23 21 60 59 22 63 18 17 64 19 62 61 20 PT1.4 PSDO/SDO/PT1.5 TST/PT1.3 RST/VPP ဦ 3-1(b) ёຏീጡᑕϡྮ ොĈLoad Cell ᕇᑅҜཉΞ࿅ DCSET[2:0]ซҖઐᑅአፋ ොĈֹϡ̰ొ PGA ၆ཱིܫซҖ̂ٸॡĂυืଳϡ ACM γొઐᑅనࢍĄ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page10 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor NC NC NC COM0 NC NC NC VLCD VDD XTI/PT2.1 XTO/PT2.0 PFD/PWM0/PT2.2 CCP0/PT2.4 NC 49 TMCKI/PT2.3 31 50 32 SEG15 SEG18 SEG16 SEG19 SEG17 SEG20 LVDIN/SDI/PT1.2 SEG21 PSDI/SCE/INT1/PT1.1 BZ/PT1.7 PSCK/INT0/PT1.0 SCK/PT1.6 CCP1/PT2.5 3.2 ёຏീጡ(Pressure Sensor) 29 52 51 30 26 55 27 54 53 28 22 59 58 23 0.1uF 24 57 56 25 60 21 63 18 17 64 19 62 61 20 PT1.4 PSDO/SDO/PT1.5 TST/PT1.3 RST/VPP ဦ 3-1(c) ྃޘᐺ۞ёຏീጡᑕϡྮ(ֹ̙ϡ̰ొ PGA )̂ٸ ොĈֹϡྃޘᐺ ܡNTC ૄώቢྮ ොĈPressure srnsor ᕇᑅҜཉΞ࿅ DCSET[2:0]ซҖઐᑅአፋ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page11 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor NC NC NC NC NC NC VLCD COM0 VDD XTO/PT2.0 XTI/PT2.1 32 23 58 57 24 22 21 60 59 Thermister 25 56 55 26 Rref 27 54 28 53 29 52 30 51 31 PFD/PWM0/PT2.2 SEG16 CCP0/PT2.4 SEG17 TMCKI/PT2.3 SEG18 NC SEG19 49 SEG20 50 SEG21 LVDIN/SDI/PT1.2 BZ/PT1.7 PSCK/INT0/PT1.0 PSDI/SCE/INT1/PT1.1 SCK/PT1.6 CCP1/PT2.5 3.3 ࡓγቢຏീጡ 63 18 17 64 19 62 61 20 SEG15 PSDO/SDO/PT1.5 PT1.4 TST/PT1.3 RST/VPP ဦ 3-2 ࡓγቢຏീጡᑕϡྮ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page12 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor VDD NC NC NC NC NC NC VLCD COM0 XTI/PT2.1 XTO/PT2.0 SEG15 31 TMCKI/PT2.3 SEG16 PFD/PWM0/PT2.2 SEG17 CCP0/PT2.4 SEG18 NC SEG19 49 SEG20 50 SEG21 32 BZ/PT1.7 LVDIN/SDI/PT1.2 SCK/PT1.6 PSDI/SCE/INT1/PT1.1 CCP1/PT2.5 3.4 4-20mA ߹ᏻᐝ(ගё) 51 30 28 53 52 29 26 55 54 27 56 25 23 58 57 24 21 60 59 22 63 18 17 64 19 62 61 20 PT1.4 PSDO/SDO/PT1.5 TST/PT1.3 RST/VPP PSCK/INT0/PT1.0 ဦ 3-3 ͦืγତ۞ 4-20mA ᏻᐝ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page13 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 4. Αਕໄ 4.1 ̰ొ͞ဦ XTI XTO VDD VSS TMCKI/CCP/PPF PTn.x/BZ SPI C C P P C C C RC Oscillator (HAO) (LPO) Program Memory (OTP：4KW) RESET (BOR) (STACK) (WDT) (RST) Data Memory TIMER A/B/C (STK：6L) (SP：128B) (GPR：256B) (CCP) (PPF) HARDWARE MULTIPLIER 8x8 CPU H08A PORT (PT1、PT2) (BZ) Interface (SPI) LCD 4x20 Watch Dog D COMx D SEGx D VLCD SD18 Low Voltage Detect (LVD) (PGA) (ΣΔAD) (Network) (Temp.senor) Low Noise OPAMP (Network) C C C C RST LVDIN AIx LNOP P Power Pad D Digital Pad A Power System A A VDDA Analog Pad ACM C Common I/O Pad ဦ 4-1 HY11P13 ̰ొ͞ဦ 4.2 ࠹ᙯᄲځᄃ͚೯͛І ͯΑਕ࠹ᙯֹϡᄲځ३ DS-HY11P13-Vxx UG-HY11S14-Vxx APD-CORE002-Vxx ฟ൴̍࠹ᙯֹϡᄲځ३ APD-HY11000-Vxx APD-HYIDE-Vxx APD-OTP001-Vxx யݡϠய࠹ᙯֹϡᄲځ३ APD-HY10000-Vxx BDI-HY11P13-Vxx ©2007 Hycon Technology Corp. http://www.hycontek.com/ HY11P13 ᄲځ३ HY11Pxx րЕֹϡᄲځ३ H08A ΄ᄲځ३ HY11xxx րЕฟ൴̍ർវֹϡᄲځ३ HY11xxx րЕฟ൴̍హវֹϡᄲځ३ OTP யݡ፵ᐂ͔ཙᄲځ३ HY1xxxx րЕϠயቢϡ፵ᐂጡᄲځ३ HY11P13 ࣎Ҿய۞ݡᄥͯχቢྤੈ Preliminary DS-HY11P13-V03 page14 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 5. ᇶхጡЕܑ “-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1 “.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition Address 00H File Name INDF0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Contents of FSR0 to address data memoryvalue of FSR0 not changed Bit1 Bit0 A-RESET N/A i-RESET N/A R/W *,*,*,* *,*,*,* 01H POINC0 Contents of FSR0 to address data memoryvalue of FSR0 post-incremented N/A N/A *,*,*,* *,*,*,* 02H PODEC0 Contents of FSR0 to address data memoryvalue of FSR0 post-decremented N/A N/A *,*,*,* *,*,*,* 03H PRINC0 Contents of FSR0 to address data memoryvalue of FSR0 pre-incremented N/A N/A *,*,*,* *,*,*,* 04H PLUSW0 Contents of FSR0 to address data memoryvalue of FSR0 offset by W N/A N/A *,*,*,* *,*,*,* 05H INDF1 Contents of FSR1 to address data memoryvalue of FSR0 not changed N/A N/A *,*,*,* *,*,*,* 06H POINC1 Contents of FSR1 to address data memoryvalue of FSR0 post-incremented N/A N/A *,*,*,* *,*,*,* 07H PODEC1 Contents of FSR1 to address data memoryvalue of FSR0 post-decremented N/A N/A *,*,*,* *,*,*,* 08H PRINC1 Contents of FSR1 to address data memoryvalue of FSR0 pre-incremented N/A N/A *,*,*,* *,*,*,* 09H PLUSW1 Contents of FSR1 to address data memoryvalue of FSR0 offset by W N/A N/A *,*,*,* *,*,*,* 0FH FSR0H .... ...x .... ...u -,-,-,- -,-,-,* 10H FSR0L xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 11H FSR1H 12H FSR1L 16H TOSH 17H TOSL 18H STKPTR 1AH PCLATH 1BH PCLATL 1DH TBLPTRH 1EH TBLPTRL 1FH 20H FSR0[8] Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0] FSR1[8] Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0] TOS[11] TOS[10] TOS[9] TOS[8] Top-of-Stack Low Byte (TOS<7:0>) STKFL STKUN STKPRT[2:0] STKOV PC[11] PC[10] PC[9] PC[8] PC Low Byte for PC<7:0> .... ...x .... ...u '-,-,-,- -,-,-,* xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* .... 0000 .... 0000 -,-,-,- *,*,*,* 0000 0000 0000 0000 *,*,*,* *,*,*,* 000. .000 000. .000 r,rw0,rw0,- -,r,r,r .... 0000 .... 0000 -,-,-,- *,*,*,* 0000 0000 0000 0000 *,*,*,* *,*,*,* .... 0000 .... 0000 -,-,-,- *,*,*,* Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 0000 0000 *,*,*,* *,*,*,* TBLDH Program Memory Table Latch High Byte 0000 0000 0000 0000 *,*,*,* *,*,*,* TBLDL Program Memory Table Latch Low Byte 0000 0000 0000 0000 *,*,*,* *,*,*,* 21H PRODH Product Register of Multiply High Byte xxxx xxxx uuuu uuuu r,r,r,r r,r,r,r 22H PRODL Product Register of Multiply Low Byte xxxx xxxx uuuu uuuu r,r,r,r r,r,r,r 23H INTE1 *,*,*,* *,*,*,* 24H INTE2 26H INTF1 TBLPTR[11] TBLPTR[10] TBLPTR[9] TBLPTR[8] GIE ADCIE TMCIE ADCIF TMBIE TMCIF TMBIF TMAIE TMAIF 27H INTF2 29H WREG Working Register 2AH 2BH 2CH BSRCN STATUS Pstaus C BOR 2DH LVDCN 30H PWRCN 31H MCKCN1 32H MCKCN2 33H MCKCN3 34H CPACN1 35H CPACN2 36H CPACN3 PD ENVDDA TO IDL LVDFG LVD VDDAX[1:0] LVDON ADCCK LSCK HSCK LCDS[2:0] CPIST CPIX CPOX CPOFR E1IE E0IE 0000 0000 0000 0000 SSPIE CCP1IE CCP0IE .... .000 .... .000 -,-,-,- -,*,*,* WDTIF E1IF E0IF .000 0000 .000 0000 -,*,*,* *,*,*,* SSPIF CCP1IF CCP0IF N OV SKERR VLDX[3:0] BSR[0] Z ENACM ADCS[2:0] ENCPA DC WDTIE XTHSP XTSP HSS[1:0] PERCK CPIH[1:0] CS1 CPAT CS2 OPP[1:0] ENXT ENHAO CPUCK[1:0] .... .000 .... .000 -,-,-,- -,*,*,* xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* ..... ...0 ...x xxxx 000d .0.. ..... ...0 ...u uuuu uduu .d.. -,-,-,- -,-,-,* -,-,-,* *,*,*,* rw0,rw0,rw0,rw0 -,rw0,-,- .000 0000 .000 uuuu -,*,r,r *,*,*,* 0000 .... 0000 .... *,*,*,* -,-,-,- 0000 0001 0000 0001 *,*,*,* *,*,*,* ..00 0000 ..00 0000 -,-,*,* *,*,*,* BZS[2:0] 000. 0000 000. 0000 *,*,*,- *,*,*,* CPIL[2:0] *,*,*,* *,*,*,* 0000 0000 0000 0000 CPVCS[1:0] .000 000. .000 000. -,*,*,* r,*,*,- CPVRX[3:0] ...0 0000 ...0 0000 -,-,-,* *,*,*,*' 0000 0000 0000 0000 *,*,*,* *,*,*,* xxxx xxxx uuuu uuuu r,r,r,r r,r,r,r r,r,r,r r,r,r,r 37H OPCN1 39H ADCRH OPM[1:0] ENOP ADC conversion memory HighByte 3AH ADCRM ADC conversion memory Middle Byte xxxx xxxx uuuu uuuu 3BH ADCRL ADC conversion memory Low Byte xxxx xxxx uuuu uuuu r,r,r,r r,r,r,r 3CH ADCCN1 ADGN[2:0] 0000 0000 0000 0000 *,*,*,* *,*,*,* DCSET[2:0] ..00 0000 ..00 0000 -,-,*,* *,*,*,* 000. .... 000. .... *,*,*,- -,-,-,- 0000 0000 0000 0000 *,*,*,* *,*,*,* ENADC ENHIGH 3DH ADCCN2 3EH ADCCN3 OSR[2:0] 3FH AINET1 INH[2:0] 40H AINET2 41H TMACN OPN[2:0] PGAGN[1:0] ENCHP INBUF VRBUF VREGN INL[2:0] VRH[1:0] INIS VRL[1:0] INX[1:0] ENTMA TMACK TimerA data register TMAS[1:0] ENWDT TMBSYC 42H TMAR 43H TMBCN 44H TMBRH TMBS[1:0] ENTMB TMBCK TimerB High Byte data register 45H TMBRL TimerB Low Byte data register 46H TMCCN 47H PRC TMCCK[1:0] ENTMC TimerC programmable register 48H TMCR TimerC register 49H CCPCN 4AH CCP0RH 4BH CCP0RL 4CH OPIS WDTS[2:0] .000 000. .000 000. -,*,*,* *,*,*,- 0000 0000 0000 0000 *,*,*,* w1,*,*,* xxxx xxxx uuuu uuuu r,r,r,r r,r,r,r 0000 00.. 0000 00.. *,*,*,* *,*,-,- xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 0000 0000 0000 0000 *,*,*,* *,*,*,* 1111 1111 1111 1111 *,*,*,* *,*,*,* 0000 0000 0000 0000 r,r,r,r r,r,r,r 0000 0000 0000 0000 *,*,*,* *,*,*,* CCP0 High Byte data register xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* CCP0 Low Byte data register xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* CCP1RH CCP1 High Byte data register xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 4DH CCP1RL CCP1 Low Byte data register xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 4EH PASC 0000 …. 0000 …. *,*,*,* -,-,-,- 4FH PWMCN 0000 …. 0000 …. *,*,*,* -,-,-,- 51H PWMR xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* TMCS0[1:0] TMCS1[2:0] CCP0M[3:0] CCP1M[3:0] PASF TMBR2R PASCF[2:0] ENPWM ENPFD PWM MSB Byte register PWMRL[1:0] ܑ 5-1(a) HY11P13 ᇶхጡЕܑ ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page15 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor “-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1 “.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition Address 52H File Name LCDCN1 53H LCDCN2 54H LCD0 55H 56H Bit7 ENLCD Bit6 Bit5 Bit4 VLCDX[1:0] LCDPR LCDMX[1:0] Bit3 LCDBF Bit2 Bit1 LCDBI[1:0] Bit0 A-RESET 0000 000. i-RESET 0000 000. R/W *,*,*,* *,*,*,- LCDBL Segment SEG2@[3:0] and SEG3@[7:4] data register of LCD0 000. .... 000. .... *,*,*,- -,-,-,- xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* LCD1 Segment SEG4@[3:0] and SEG5@[7:4] data register of LCD1 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* LCD2 Segment SEG6@[3:0] and SEG7@[7:4] data register of LCD2 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 57H LCD3 Segment SEG8@[3:0] and SEG9@[7:4] data register of LCD3 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 58H LCD4 Segment SEG10@[3:0] and SEG11@[7:4] data register of LCD4 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 59H LCD5 Segment SEG12@[3:0] and SEG13@[7:4] data register of LCD5 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 5AH LCD6 Segment SEG14@[3:0] and SEG15@[7:4] data register of LCD6 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 5BH LCD7 Segment SEG16@[3:0] and SEG17@[7:4] data register of LCD7 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 5CH LCD8 Segment SEG18@[3:0] and SEG19@[7:4] data register of LCD8 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 5DH LCD9 Segment SEG20@[3:0] and SEG21@[7:4] data register of LCD9 xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 5EH SSPCON1 0000 ..00 uuuu ..uu *,*,*,* -,-,*,* 60H SSPSTA 00.. ...0 00.. ...0 r,r,-,- -,-,-,r 61H SSPBUF xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 6DH PT1 PT1.7 PT1.6 PT1.5 PT1.4 xxxx xxxx uuuu uuuu *,*,*,* r,r,r,r 6EH TRISC1 TC1.7 TC1.6 TC1.5 TC1.4 0000 .... 0000 .... *,*,*,* -,-,-,- 6FH PT1DA .... .000 .... .000 -,-,-,- -,-,*,- 70H PT1PU 0000 0000 0000 0000 *,*,*,* *,*,*,* .... 0000 .... 0000 -,-,-,- *,*,*,* .0.0 .0.. .0.0 .0.. -,*,-,* -,*,-,- PT2.0 xxxx xxxx uuuu uuuu -,-,*,* *,*,*,* 71H PT1M1 72H PT1M2 74H PT2 SSPEN CKP SSPBUY SSPOV CKE SMP － － SSPM<1:0> BF SSP Receive Buffer/Transmit Register PT1.3 PT1.2 PT1.1 PT1.0 DA1.2 PU1.7 PU1.6 PU1.5 PM1.7[0] PU1.4 PU1.3 PU1.2 INTEG1[1:0] PM1.6[0] PT2.5 PT2.4 PU1.1 PU1.0 INTEG0[1:0] PM1.5[0] PT2.3 PT2.2 PT2.1 75H TRISC2 TC2.5 TC2.4 TC2.3 TC2.2 TC2.1 TC2.0 0000 0000 0000 0000 -,-,*,* *,*,*,* 77H PT2PU PU2.5 PU2.4 PU2.3 PU2.2 PU2.1 PU2.0 0000 0000 0000 0000 -,-,*,* *,*,*,* 78H PT2M1 PM2.2[1] PM2.2[0] ..00 .... ..00 .... -,-,*,* -,-,-,- 79H PT2M2 PM2.5[1] PM2.5[0] PM2.4[1] PM2.4[0] 00.. 0000 00.. 0000 *,*,-,- *,*,*,* xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* xxxx xxxx uuuu uuuu *,*,*,* *,*,*,* 80H ~ FFH 100H~17FH PWMTR[1:0] GENERAL PURPOSE REGISTER @ 128Byte GENERAL PURPOSE REGISTER @ 128Byte ဦ 5-1(b) HY11P13 ᇶхጡЕܑ(ᜈ) ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page16 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6. ঈপّ Absolute maximum ratings over operating free-air temperature (unless otherwise noted) Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V Voltage applied to any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 0.3 V Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V Voltage applied to TST/PT1.3 pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.8 V Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ų2 mA Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55ƨ to 150ƨ (programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40ƨ to 85ƨ Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w Maximum output current sink by any PORT1 to PORT3 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA 6.1 Recommended operating conditions TA = -40ƨ ~ 85ƨ,unless otherwise noted Sym. VDD VSS Parameter Test Conditions Min. Typ. Max. All digital peripherals and CPU 2.2 3.6 Analog peripherals 2.4 3.6 0 0 unit Supply Voltage Supply Voltage External Watch crystal V 32.768K XTSP[0]=0, XTHSP[0]=0 VDD = 2.2V, XT Oscillator Ceramic resonator XTSP[0]=1, XTHSP[0]=0 450K 8M XTSP[0]=1, XTHSP[0]=0 1M 8M Hz ENXT[0]=1 Frequency ©2007 Hycon Technology Corp. http://www.hycontek.com/ Crystal Preliminary DS-HY11P13-V03 page17 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.2 Internal RC Oscillator TA = 25ƨ,VDD = 3.0V,unless otherwise noted Sym. Parameter Test Conditions Min. Typ. Max. unit HAO High Speed Oscillator frequency ENHAO[0]=1 1.8 2.0 2.2 MHz LPO Low Power Oscillator frequency VDD supply voltage be enable LPO 22 28 35 KHz HAO vs. VDD LPO vs. VDD 2.030 2.025 30.00 2.020 29.00 2.015 2.005 L P O (K H z ) HAO (MHz) 2.010 2.000 1.995 1.990 28.00 27.00 26.00 1.985 25.00 1.980 1.975 24.00 1.970 2.2V 2.4V 2.6V 2.8V 3.0V 3.2V 3.4V 2.2V 3.6V 2.4V 2.6V 2.8V 3.0V 3.2V 3.4V 3.6V VDD VDD Figure 6.2-1 HAO vs. VDD Figure 6.2-2 LPO vs. VDD HAO vs. TA@VDD= 3.0V LPO vs. Temperature @VDD 1.980 31.00 1.960 30.00 VDD= 3.6V 1.940 29.00 H A O (M H z) LP O (K H z) 1.920 28.00 1.900 27.00 1.880 VDD= 3.0V 26.00 1.860 25.00 VDD= 2.2V 1.840 24.00 1.820 -40℃ -15℃ 15℃ 25℃ 45℃ 75℃ -40 85℃ -15 5 25 45 65 85 Temperature (℃ ) Temperature(℃ ) Figure 6.2-4 LPO vs. Temperature Figure 6.2-3 HAO vs. Temperature ©2007 Hycon Technology Corp. http://www.hycontek.com/ -35 Preliminary DS-HY11P13-V03 page18 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.3 Supply current into VDD excluding peripherals current TA = 25ƨ,VDD = 3.0V,OSC_LPO = 28KHz,unless otherwise noted Sym. Parameter Test Conditions Min. Typ. Max. unit IAM1 Active mode 1 OSC_CY = 8MHz, OSC_HAO = off, CPU_CK = 8MHz 1.2 2 mA IAM2 Active mode 2 OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz 0.32 0.55 mA IAM3 Active mode 3 OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz 0.18 0.3 uA ILP1 Low Power 1 OSC_CY = 32768Hz, OSC_HAO = off, CPU_CK = 16384Hz 7 12 uA ILP2 Low Power 2 OSC_CY = off, OSC_HAO = off, CPU_CK = off, Idle state 1.65 3 uA ILP3 Low Power 3 OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state 0.65 1.2 uA OSC_CYĈExternal Oscillator frequency. OSC_HAOĈInternal High Accuracy Oscillator frequency. CPU_CKĈCPU core work frequency. IAM2 vs VDD IAM1 vs VDD 450 1.9 400 1.7 350 IAM2(uA) IAM 1(mA) 1.5 1.3 1.1 300 250 0.9 200 0.7 150 0.5 100 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 2.2 2.3 2.4 2.5 2.6 2.7 VDD(V) 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 VDD(V) Figure 6.3-1 IAM1 vs. VDD Figure 6.3-2 IAM2 vs. VDD ILP1 vs VDD IAM3 vs VDD 10 250 9 8 200 ILP1(uA) IAM 3(uA) 7 150 100 6 5 4 3 50 2 1 0 0 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 2.2 VDD(V) 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 VDD(V) Figure 6.3-3 IAM3 vs. VDD ©2007 Hycon Technology Corp. http://www.hycontek.com/ 2.3 Figure 6.3-4 ILP1 vs. VDD Preliminary DS-HY11P13-V03 page19 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor ILP2 vs VDD ILP3 vs VDD 2.50 0.80 0.75 2.00 0.70 0.65 ILP3(uA) ILP2(uA) 1.50 1.00 0.60 0.55 0.50 0.50 0.45 0.00 0.40 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 2.2 3.6 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.2 3.3 Figure 6.3-5 ILP2 vs. VDD Figure 6.3-6 ILP3 vs. VDD IAM1 with temperature at VDD= 3V ILP2 with temperature at VDD= 3V 1.30 3 1.29 2.6 1.28 2.2 ILP2 (uA) IAM 1 (mA) 3.0 3.1 3.4 3.5 3.6 VDD(V) VDD(V) 1.27 1.8 1.4 1.26 1 1.25 -40 -30 -20 -10 0 10 25 30 40 50 60 70 -40 85 -30 -20 -10 0 10 25 30 40 50 60 70 85 TA(℃ ) TA(℃ ) Figure 6.3-7 IAM1 vs. Temperature Figure 6.3-7 ILP2 vs. Temperature . ILP3 with temperature at VDD= 3V 1.4 1.2 ILP3 (uA) 1 0.8 0.6 0.4 0.2 0 -40 -30 -20 -10 0 10 25 30 40 50 60 70 85 TA(℃ ) Figure 6.3-7 ILP3 vs. Temperature ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page20 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.4 Port1~2 TA = 25ƨ,VDD = 3.0V,unless otherwise noted Sym. Parameter Test Conditions Min. Typ. Max. unit Input voltage and Schmitt trigger and leakage current and timing VIH High-Level input voltage VIL Low-Level input voltage Vhys Input Voltage hysteresis(VIH - VIL ) ILKG Leakage Current RPU Port pull high resistance 2.1 V 0.9 0.8 V uA 0.1 kɖ 180 Output voltage and current and frequency VOH High-level output voltage IOH=10mA VOL Low-level output voltage IOL=-10mA VDD -0.3 V VSS +0.3 VOH vs IOH @VDD= 3V VOH vs. IOH@VDD= 2.2V 3.00 2.70 VO H ( V ) VO H (V) 2.85 25℃ 2.55 2.40 85℃ 2.25 2.10 0MA -5MA -10MA -15MA -20MA -25MA -30MA 2.35 2.20 2.05 1.90 1.75 1.60 1.45 1.30 1.15 1.00 -35MA 25℃ 85℃ 0MA -5MA -10MA IOH -20MA -25MA -30MA -35MA IOH Figure 6.4-1 VOH vs. IOH @VDD=3.0V Figure 6.4-2 VOH vs. IOH @VDD=2.2V VOL vs. IOL@VDD= 3.0V VOL vs. IOL@VDD= 2.2V 0.9 0.9 0.8 0.8 VO L (V) 0.6 VO L (V) -15MA 85℃ 0.5 25℃ 0.3 85℃ 0.6 0.5 25℃ 0.3 0.2 0.2 0.0 0.0 0MA 5MA 10MA 15MA 20MA 25MA 30MA 35MA 0MA IOL 10MA 15MA 20MA 25MA 30MA 35MA IOL Figure 6.4-3 VOL vs. IOL@VDD=3.0V ©2007 Hycon Technology Corp. http://www.hycontek.com/ 5MA Figure 6.4-4 VOL vs. IOL@VDD=2.2V Preliminary DS-HY11P13-V03 page21 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.5 Reset(Brownout, External RST pin, Low Voltage Detect) TA = 25ƨ,VDD = 3.0V,unless otherwise noted Sym. Parameter Test Conditions VDD Start Voltage to accepted reset internally (LÎH),VLVR 1.6 Pulse length needed as RST/VPP pin to accepted reset internally, td-RST Input Voltage to accepted reset internally unit us 1.85 2.1 V mV 2 us 0.9 V Hysteresis, VHYS-RST 0.8 Operation current, ISVS 10 External input voltage to compare ACMerence voltage 1.2 V 100 ppm/ƨ Compare ACMerence voltage temperature drift LVD Max. 70 Hysteresis, VHYS-LVR RST Typ. 2 Pulse length needed to accepted reset internally, td-LVR BOR Min. TA = -40ƨ ~ 85 ƨ Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b 3.3 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b 3.2 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b 3.1 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b 3.0 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b 2.9 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b 2.8 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b 2.7 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b 2.6 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b 2.5 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b 2.4 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b 2.3 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b 2.2 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b 2.1 Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b 2.0 V 15 uA V BORĈBrownout Reset LVRĈLow Voltage Reset of BOR LVDĈLow Voltage Detect RSTĈExternal Reset pin ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page22 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor . Figure6.5-1 BOR reset diagram *1 Figure6.5-2 RST reset diagram rRSTĈPlease see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-V01). V L V R a n d V L V R R e le a s e V o lta g e (V ) VLVR and VLVR Release Voltaage vs. TA 1.98 1.96 1.94 VLVR Release Voltage 1.92 1.90 1.88 1.86 1.84 1.82 1.80 VLVR Voltage -40℃ -35℃ -15℃ 5℃ 25℃ 45℃ 65℃ 85℃ TA Figure6.5-3 LVR vs.Temperature 6.6 Power System TA = 25ƨ,VDD = 3.0V,unless otherwise noted Sym. Parameter VDDA operation current, IVDDA Test Conditions Min. Typ. Max. unit IL = 0mA VDDX[1:0]=00b 22 uA IL = 0.1mA, VDDX[1:0]=00b 3.3 V VDDŸVDDA+0.2V VDDX[1:0]=01b 2.9 V VDDX[1:0]=10b 2.6 V VDDX[1:0]=11b 2.4 V VDDX[1:0]=00b 135 mV VDDX[1:0]=01b 150 mV VDDX[1:0]=10b 165 mV VDDX[1:0]=11b 180 mV Select VDDA output voltage VDDA IL = 10mA Dropout voltage ACM Temperature drift VDDX[1:0]=11b TA=-40ƨ~85ƨ 100 ppm/ƨ VDD Voltage drift IL = 0.1mA VDD=2.5V~3.6V Ų0.2 %/V ACM operation current, IACM IL = 0mA 20 uA Output voltage ,VACM ENACM[0]=1 1.2 V ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary IL = 0uA DS-HY11P13-V03 page23 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor IL = Ų200uA Output voltage with Load Temperature drift ENACM[0]=1, VDDA Voltage drift IL = 10uA 0.98 1.02 TA=-40ƨ~85ƨ VACM 100 ppm/ƨ 100 uV/V VDDAĈAdjust Voltage Regulator ACMĈAnalog Common Voltage [email protected] with VDD 2.390 2.388 2.386 2.384 VD D A (V) VD D A (V) [email protected] with VDD 2.3900 2.3895 2.3890 2.3885 2.3880 2.3875 2.3870 2.3865 2.3860 2.3855 2.3850 2.3845 2.3840 IL= 0.1mA 2.382 IL= 10mA 2.380 2.378 2.376 2.374 2.372 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V VDD(V) 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V VDD(V) Figure6.6-1 VDDA lL=0.1mA vs. VDD Figure6.6-2 VDDA lL=10mA vs. VDD VDDA with temperature -40 IL= 0.1mA VD D A (V) V D D A (V ) VDDA with temperature 2.3910 2.3900 VDD= 3.0V 2.3890 2.3880 2.3870 VDD= 2.5V 2.3860 2.3850 2.3840 2.3830 2.3820 2.3810 -35 -15 5 25 TA(℃) 45 65 2.3880 2.3860 2.3840 2.3820 2.3800 2.3780 2.3760 2.3740 2.3720 2.3700 2.3680 2.3660 85 IL= 10mA VDD= 3.0V VDD= 2.6V -40 AC M (V) AC M (V) IL=0uA IL=-200uA 45 1.196 1.194 1.192 1.190 1.188 1.186 1.184 1.182 1.180 1.178 1.176 65 85 VDD=2.4~3.6V IL=10uA -40 2.9 2.8 2.7 2.6 2.5 VDD(V) -35 -15 5 25 45 65 85 TA(℃ ) Figure6.6-5 ACM Load vs. VDD ©2007 Hycon Technology Corp. http://www.hycontek.com/ 25 ACM vs. VDD w ith temperature IL=200uA 3 5 Figure6.6-4 VDDA lL=0.1mA vs. VDD ACM Load vs. VDD 3.6 3.5 3.4 3.3 3.2 3.1 -15 TA(℃) Figure6.6-3 VDDA lL=0.1mA vs. VDD 1.188 1.187 1.186 1.185 1.184 1.183 1.182 1.181 1.180 -35 Figure6.6-6 ACM vs. Temperature Preliminary DS-HY11P13-V03 page24 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.7 LCD TA = 25ƨ,VDD = 3.0V, CVLCD =4.7uF,unless otherwise noted. Sym. Parameter Test Conditions Operation supply current without ILCD LCDPR[0]=1 Min. Typ. Max. unit VDD = 2.2V 20 output buffer.(all segment turn on) Supply Voltage at VLCD pin VLCD uA VDD = 3.0V LCDPR[0]=0 2.2 3.6 VDD = 2.2V, VLCDX[1:0]=11b 2.295 2.55 2.805 Embedded Charge Pump output LCDPR[0]=1, VLCDX[1:0]=10b 2.52 2.8 3.08 voltage at VLCD pin CVLCD =4.7uF VLCDX[1:0]=01b 2.745 3.05 3.355 VLCDX[1:0]=00b 2.97 3.3 3.63 V V ZLCD Output impedance with LCD buffer fLCD =128Hz,VLCD=3.05V kɖ 10 VLCD vs. VDD VLCD Start Time 142 VDD=2.2V 122 3.08 3.05 VLCD (V) TVLC D (ms) 102 82 62 VDD=3.0V 42 3.02 2.99 2.96 2.93 22 VDD=3.6V 2.90 VLCD(V) Figure6.7-2 VLCD vs. VDD VLCD vs. Load VLCD vs. Load VDD=2.2V V L C D (V ) 2.9 2.7 2.5 2.3 2.1 20 30 40 50 60 70 80 90 100 3.5 3.3 3.1 2.9 2.7 2.5 2.3 2.1 VDD=3.0V 125 IL(uA) 150 175 200 225 250 275 300 325 350 IL(uA) Figure6.7-2 VLCD vs. IL @VDD=2.2V ©2007 Hycon Technology Corp. http://www.hycontek.com/ 3. 6V 3. 4V Figure6.7-1 LCD start time 3.1 V L C D (V ) 3. 2V VDD(V) 3.3 10 3. 0V 3.3 2. 8V 3.05 2. 6V 2.8 2. 4V 2.55 2. 2V 2 Figure6.7-3 VLCD vs. IL @VDD=3.0V Preliminary DS-HY11P13-V03 page25 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.8 Low Noise OPAMP TA = 25ƨ,VDD = 3.0V, VDDA=2.4V,unless otherwise noted Sym. Parameter Test Conditions Min. Typ. Max. unit 3.6 V VLNOP Supply voltage at VDDA ILNOP Operation supply current OPM[1:0]=xxb Input offset voltage without chopper. OPM[1:0]=1xb Input offset voltage with chopper OPM[1:0]=0xb 20 uV TA=-40ƨ~85ƨ 0.1 uV/ƨ 0.1 %VO ENVDDA[0]=0 2.4 200 -2 uA 2 mV VOS-OP OPM[1:0]=00b Input offset voltage temperature drift. OPM[1:0]=10 VOLR VO=1.2V, IL=+1mA VDDA=2.4V IL=-1mA Unit gain load regulation CMVR Common-mode voltage input range OPM[1:0]=xxb CMRR Common-mode rejection ratio OPM[1:0]=xxb 0.1 VDDA-1.1 90 V dB LNO P O ffset Voltage (mV) LNOP offset vs Temperature 0.195 0.190 0.185 no chopper VDDA=2.4V VDDA=3.3V 0.180 0.175 0.170 0.165 -40 -30 -20 -10 0 10 25 30 40 50 60 70 85 Temperature(℃) Figure6.8-1 LNOP Offset Temperature ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page26 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.9 SD18,Power Supply and recommended operating conditions TA = 25ƨ,VDD = 3.0V, VDDA=2.4V,unless otherwise noted Sym. VSD18 Parameter Test Conditions Supply Voltage at VDDA Min. ENVDDA[0]=0 Typ. 2.4 Modulator sample frequency, ADC_CK 25 Over Sample Ratio, OSR 256 250 Max. unit 3.6 V 300 KHz f SD18 32768 ENADC[0]=1 168 INBUF[0]=1,VRBUF[0]=0 I SD18 Operation supply current ENADC[0]=1 GAIN =4, without PGA INBUF[0]=0,VRBUF[0]=1 ADC_CK=250KHz uA 150 ENADC[0]=1 120 INBUF[0]=0,VRBUF[0]=0 6.9.1 PGA,Power Supply and recommended operating conditions TA = 25ƨ,VDD = 3.0V, VDDA=2.4V,unless otherwise noted Sym. Parameter Test Conditions VPGA Supply Voltage at VDDA ENVDDA[0]=0 I PGA Operation supply current PGAGN[1:0]=<01>or<1x> GPGA Gain temperature drift TA = -40ƨ~ 85ƨ Min. Typ. 2.4 GAIN=2 ~ 8 Max. unit 3.6 V 320 uA 8 ppm/ƨ 6.9.2 SD18,performanceǶ(fSD18=250KHz) TA = 25ƨ,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted Sym. Parameter Test Conditions Min. Typ. Max. unit Ų0.003 Ų0.01 %FSR VDDA=2.4V,VVR=1.0V,ɂSI=Ų200mV INL Integral Nonlinearity(INL) VDDA=2.4V,VVR=1.0V,ɂSI=Ų450mV No Missing Codes 3 ADC_CK=250KHz,OSR[2:0]=010b 23 Bits INBUF[0]=0b,VRBUF[0]=0b GSD18 Gain x1~x16 temperature INBUF[0]=1b,VRBUF[0]=0b drift INBUF[0]=0b,VRBUF[0]=1b TA = -40ƨ~ 85ƨ ppm/ƨ 10 INBUF[0]=1b,VRBUF[0]=1b EOS Offset error of Full Scale Rang input ɂAI=0V voltage range with Chopper and ɂVR=0.9V Buffer(INBUF,VRBUF) without PGA DCSET[2:0]=<000> Offset error of Full Scale Rang input * ɂ AI is external voltage range with Chopper without short Gain=2 1 %FSR Gain=2 1 PGA and Buffer(INBUF,VRBUF) ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page27 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor GAIN=1 2 GAIN=2 1 GAIN=4 0.5 GAIN=16 0.15 GAIN=1 2 GAIN=2 1 GAIN=4 0.5 Offset error temperature drift with chopper without PGA and Buffer (INBUF,VRBUF). uV/ƨ Offset error temperature drift with chopper and Buffer (INBUF,VRBUF) without PGA. VCM=0.7V to 1.7V, VSI=0V, VVR=1.0V,without PGA GAIN=1 VCM=0.7V to 1.7V, VSI=0V, 90 CMSD18 dB Common-mode rejection 75 GAIN=16 VVR=1.0V, without PGA GAIN=1 VDDA=3.0V,ɂVDDA=Ų PGA=off PSRR DC power supply rejection 75 100mV,VVR=1.0V, dB GAIN=16 VSI=1.2V,VSI-=1.2V, PGA=8 SD18 offset vs. temperature -3.800 -152.5 -40 -20 0 25 45 65 85 O ffset V o ltag e(u V ) O ffset V o lta g e (u V ) -3.600 SD18 offset vs. temperature -4.000 -4.200 -4.400 -4.600 -4.800 -5.000 TA(℃) -153.0 -40 0 25 45 65 85 -154.0 -154.5 -155.0 -155.5 Gain=1,SI and VR buffer off ΔAI=0V,ΔVR=0.9V VDDA=2.9V TA(℃) Figure6.9-1(a) SD18 Offset Temperature drift Gain=128,SI and VR buffer off ΔAI=0V,ΔVR=0.9V VDDA=2.4V Figure6.9-1(b) SD18 Offset Temperature drift SD18 Gain error vs. temperature SD18 Gain error vs. temperature 2.30 1.20 2.28 1.18 2.26 1.16 2.24 1.14 Gain error(%) Gain error(%) -20 -153.5 2.22 2.20 2.18 1.12 1.10 1.08 2.16 1.06 2.14 1.04 2.12 1.02 2.10 1.00 -40 -20 0 25 TA(℃) 45 65 85 -40 Figure6.9-2(a) SD18 Gain error Temperature drift ©2007 Hycon Technology Corp. http://www.hycontek.com/ -20 0 25 TA(℃) Gain=1,SI and VR buffer off ΔSI=300mV,ΔVR=0.9V VDDA=2.9V Preliminary 45 65 85 Gain=128,SI and VR buffer off ΔSI=4.6975mV,ΔVR=0.9V VDDA=2.4V Figure6.9-2(b) SD18 Gain error Temperature drift DS-HY11P13-V03 page28 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 6.9.3 SD18,Temperature sensor TA = 25ƨ,VDD = 3.0V, VDDA=3.3V,unless otherwise noted Sym. TCS KT TCERR Parameter Test Conditions Min. Typ. Max. unit Sensor temperature drift ɂVR=2.4V,VRGN[0]=1, 178 uV/ƨ Absolute Temperature Scale 0°K INBUF[0]=1 -289 ƨ One point calibrate error temperature Calibration at 25ƨ of -40ƨ~85ƨ Ų2 ƨ TPS Voltage vs. Temperature 70 60 50 V TPS (mV) 40 30 20 10 0 -45 -30 -15 0 15 30 45 60 75 90 TA(℃) Figure6.9-3 TPS output voltage vs. temperature drift ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page29 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 7. Ordering Information Orderable 1 MODEL NO. Status2 Package Type Pins Package Drawing Code3 Friendly MSL4 Classification 5 HY11P13D000 In Production Die 53 D 000 000 Green , Call HY Call HY HY11P13L064 In Production LQFP 64 L 064 000 Green, Call HY Call HY 1 Device No - Package Type Initail & Pin Amount - Standard/Customized Code. Example: The customer's customized code is 008 and they requires die. MODEL NO. is HY11P13D000-008 2 FUTURE PRODUCT: Device has been introduced and is not in production yet. IN PRODUCTION: Device recommended for new designs. 3 Code: ”000” is blank chip,”001”~”999” is Standard/Customized Code. 4 MSL: The Moisture Sensitivity Level ranking in accordance with JEDEC industry standard categorization and peak solder temperature 5 Green (RoHS & no Cl/Br): HYCON defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and chlorine(Cl) based flame retardants (Br or Cl do not exceed 0.1% by weight in homogeneous material) Important Information and Disclaimer: Information included in this document concerning device applications and analogous content is furnished only for user convenience and HYCON does not accountable for the content usage and any incurred outcome. The content of specification may be replaced by updates; it is users’ responsibility to assure that your application meets with your requirements and standards. ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page30 HY11P13 Embedded High Resolution ΣΔADC 8bits RISC-like Mixed Signal Microprocessor 8. Package Information 8.1 LQFP64(L064) JEDEC MS-026 compliant ——紘康科技 技术推广服务 www.fosvos.com 技术服务热线：+86-21-58994470 销售服务热线：+86-21-58998693 ©2007 Hycon Technology Corp. http://www.hycontek.com/ Preliminary DS-HY11P13-V03 page31