PH230 High Linearity InGaP HBT Amplifier Features Functional Diagram Applications 1500MHz - 3000MHz Mobile Infrastructure 16.3 dB Gain at 2.3GHz PCS, WCDMA, WiBro +22.5 dBm P1dB W-LAN / ISM +39 dBm Output IP3 RFID / Fixed Wireless 4 3 2 1 Single Voltage Supply Lead-free / Green / RoHScompliant SOT-89 Package Function Pin No. RF IN 1 RF OUT / Bias 3 Ground 2,4 Description The PH230 is a high performance InGaP HBT MMIC Amplifier and high linearity driver amplifier in a high quality SOT-89 package. The device features excellent Input and output return loss, highly linear performance. The device can be easily matched to obtain optimum power and linearity. The product is targeted for use as driver amplifier for wireless infrastructure applications. The PH230 operates from a single +5 voltage supply and have an internal active bias. All devices are 100% RF and DC tested Specifications Symbol Parameters Units S21 Gain dB S11 S22 P1dB OIP3 NF Input Return Loss Output Return Loss Output Power @1dB compression Output Third Order intercept Noise Figure dB dB dBm dBm dB Freq. Min. Typ. 1900 MHz 17.2 2300 MHz 16.3 2550 MHz 15.5 1900 MHz -16 2300 MHz -15 2550 MHz -20 1900 MHz -12 2300 MHz -11 2550 MHz -8 1900 MHz 22.5 2300 MHz 22.0 2550 MHz 21.5 1900 MHz 38 2300 MHz 39 2550 MHz 39 1900 MHz 3.2 2300 MHz 3.1 2550 MHz 3.4 V/I Device voltage / current V/mA 5/82 Rth Thermal Resistance °C/W 106 Tj Junction Temperature °C 128 Max. Test Conditions : T=25°C, Supply Voltage=+5V, 50ohm System, OIP3 measured with two tones at an output power of +5dBm/tone separated by 1MHz. http://www.prewell.com 1 December 2005 PH230 High Linearity InGaP HBT Amplifier 1900 MHz Application Circuit Frequency 1900 MHz S21 : Gain 17.4 dB +5 V 1uF S11 : Input Return Loss -18 dB S22 : Output Return Loss -13 dB Output P1dB +23 dBm Output IP3 @5dBm +39 dBm 82pF 100nH RF IN RF OUT 15pF 82pF 50Ω/5mm 1.5pF 3.0pF 3.2dB 5V Current 82 mA Output Return Loss Input Return Loss 0 18 -5 -5 16 -10 -10 14 S22(dB) 0 S11(dB) 20 -15 -15 o 1850 -20 1900 1950 2000 -25 1800 1850 Freqency(MHz) +25 C o -40 C o +85 C -20 1900 1950 -25 1800 2000 1850 Frequency(MHz) 1900 1950 2000 Frequency(MHz) P1dB vs. Frequency Noise Figure vs. Frequency 28 6 5 24 P1dB(dBm) 4 3 2 20 o +25 C o -40 C o +85 C 16 1 0 1800 o +25 C 1850 1900 1950 12 1800 2000 1850 Frequency(MHz) Output IP3 vs. Frequency o 45 1900 1950 2000 Frequency(MHz) OIP3 vs. Temperature +5dBm/tone, +25 C 44 40 Freq=1900MHz, +5dBm/tone 40 OIP3(dBm) 10 1800 +25 C o -40 C o +85 C NF(dB) 12 o +25 C o -40 C o +85 C o OIP3(dBm) Gain(dB) Gain vs. Frequency Noise Figure Supply Voltage 35 36 o +25 C o -40 C o +85 C 30 25 1800 1850 1900 1950 32 28 -40 2000 -20 0 20 40 60 80 o Temperature( C) Freuquency(MHz) http://www.prewell.com 2 December 2005 PH230 High Linearity InGaP HBT Amplifier 2300 MHz Application Circuit +5 V 1uF 82pF 82pF 50Ω/5mm 2.2pF 16.2 dB -16 dB -14 dB Output P1dB +22.4 dBm Output IP3 @5dBm +39 dBm 0.75pF Noise Figure 3.1dB Supply Voltage 5V Current 82 mA Output Return Loss Input Return Loss 0 18 -5 -5 16 -10 -10 14 -15 +25 C o -40 C o +85 C 2250 -20 2300 2350 -25 2200 2400 o +25 C o -40 C o +85 C 2250 +25 C o -40 C o +85 C -20 2300 2350 -25 2200 2400 2250 Frequency(MHz) Frequency(MHz) 2300 2350 2400 Frequency(MHz) Noise Figure vs. Frequency 6 P1dB vs. Frequency 28 5 24 P1dB(dBm) 4 NF(dB) 3 20 o 2 16 o 1 +25 C 0 2200 2250 2300 2350 12 2200 2400 +25 C o -40 C o +85 C 2250 Frequency(MHz) o +5dBm/tone, +25 C 44 44 2400 Freq=2300MHz, +5dBm/tone 40 40 36 32 o 2200 2350 OIP3 vs. Temperature Output IP3 vs. Frequency 28 2300 Frequency(MHz) OIP3(dBm) 10 2200 -15 o o 12 0 S22(dB) S11(dB) 20 OIP3(dBm) Gain(dB) Gain vs. Frequency S21 : Gain S11 : Input Return Loss RF OUT 5.6pF 2300 MHz S22 : Output Return Loss 100nH RF IN Frequency +25 C o -40 C o +85 C 2250 36 32 2300 2350 28 -40 2400 -20 0 20 40 60 80 o Temperature( C) Frequency(MHz) http://www.prewell.com 3 December 2005 PH230 High Linearity InGaP HBT Amplifier 2500/2600 MHz Application Circuit +5V 1uF 82pF 1.5pF -9 dB Output P1dB +21.5 dBm Output IP3 @5dBm +39 dBm 14 Current 82 mA 0 -10 -5 -10 o o 2575 Output Return Loss 0 -20 +25 C o -40 C o +85 C 2550 5V S22(dB) S11(dB) 16 -40 2500 2600 o +25 C o -40 C o +85 C -30 2525 Frequency(MHz) 2550 2575 +25 C o -40 C o +85 C -15 -20 2500 2600 2525 Frequency(MHz) 2550 2575 2600 Frequency(MHz) P1dB vs. Frequency Noise Figure vs. Frequency 6 28 5 24 P1dB(dBm) NF(dB) 4 3 2 20 o +25 C o -40 C o +85 C 16 1 o +25 C 0 2500 2525 2550 2575 12 2500 2600 2525 Frequency(MHz) 2550 2575 2600 Frequency(MHz) OIP3 vs. Temperature Output IP3 vs. Frequency o +5dBm/tone, +25 C 44 Freq=2550MHz, +5dBm/tone 45 OIP3(dBm) 40 OIP3(dBm) Gain(dB) 18 2525 3.4 dB Input Return Loss Gain vs. Frequency 20 10 2500 Noise Figure Supply Voltage 0.75pF 1.2pF 12 15.6 dB -22 dB 50Ω/5mm 0.75pF S21 : Gain S11 : Input Return Loss RF OUT 20pF 2550 MHz S22 : Output Return Loss 22nH RF IN Frequency 40 35 o 2500 32 +25 C o -40 C o +85 C 30 2525 2550 2575 36 28 -40 2600 -20 0 20 40 60 80 o Frequency(MHz) Temperature( C) http://www.prewell.com 4 December 2005 PH230 High Linearity InGaP HBT Amplifier Absolute Maximum Ratings Parameter Rating Unit Supply Voltage +6 V Supply Current 150 mA RF Power Input 10 dBm Storage Temperature -55 to +125 °C Ambient Operating Temperature -40 to +85 °C Operation of this device above any of these parameters may cause permanent damage. Lead-free /RoHS Compliant / Green SOT-89 Package Outline ESD / MSL Ratings 1. ESD sensitive device. Observe Handling Precautions. 2. ESD Rating : Class 1C(Passes at 1000V min.) Human Body Model (HBM), JESD22-A114 3. ESD Rating : Class IV (Passes at 1000V min.) Charged Device Model (CDM), JESD22-C101 4. MSL (Moisture Sensitive Level) Rating : Level 3 at +260°C Convection reflow, J-STD-020 Evaluation Board Layout (4x4) Mounting Instructions 1. Use a large ground pad area with many plated through-holes as shown. 2. We recommend 1 oz copper minimum. 3. Measurement for our data sheet was made on 0.8mm thick FR-4 Board. 4. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 5. RF trace width depends on the board material and construction. 6. Add mounting screws near the part to fasten the board to a heatsink. http://www.prewell.com 5 December 2005