STMUX7000 7-channel MUX/DEMUX for analog video signal Features ■ Low RON: 4.0 Ω typical ■ VCC operating range: 3.0 to 3.6 V ■ Enhanced ESD protection: > 8 kV (contact) and 8 kV (HBM) ■ Channel on capacitance: 7.8 pF typical ■ Designed for VGA signal switching ■ Integrated switches for RGB, HSYNC, VSYNC and DDC signals ■ Very low crosstalk: -45 dB at 250 MHz ■ > 1000 MHz -3 dB typical bandwidth (or data frequency) ■ Low power mode for minimum power consumption ■ Package: QFN32L Applications ■ Audio/video switching QFN32 (3 x 6 mm) Description The STMUX7000 is a 7-channel multiplexer/demultiplexer low RON bidirectional designed for analog video signal, such as VGA. It is designed for very low crosstalk, and high bandwidth to maintain high signal integrity. The analog video signal multiplexed from one of two selected sources in the notebook and docking station while the unselected switch goes to Hi-Z status. The device is also protected against high ESD that supports up to 8 kV contact on all I/O pins. The device can be put into low power mode consuming minimum power. Table 1. Device summary Order code Package Packing STMUX7000QTR QFN32 (3 x 6 x 0.8 mm) Tape and reel March 2011 Doc ID 17177 Rev 3 1/20 www.st.com 20 Contents STMUX7000 Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/20 Doc ID 17177 Rev 3 STMUX7000 Pin description ,0 3%, 6$$ '.$ Pin connection (top through view) 6$$ ! " ! " '.$ " 6$$ " ! 6$$ ! " ! " 3%, " ! " ! " '.$ " 6$$ " " " Figure 1. " 1 Pin description !-6 Table 2. Pin description Pin Symbol Name and function 8 SEL 1 Selecion for bit 0, 1, 2, 3, 4 30 SEL 2 Selection for bit 5, 6 1, 2, 5, 6, 7, 9, 10 A0, A1, A2, A3, A4, A5, A6 4, 16, 23, 29, 32 VDD Supply voltage 3, 11, 28 GND Ground 8-bit bus 27, 25, 22, 20, 18, 14, 12 0B1, 1B1, 2B1, 3B1, 4B1, 5B1, 8-bit multiplexed to bus 1 6B1 26, 24, 21, 19, 17, 15, 13 0B2, 1B2, 2B2, 3B2, 4B2, 5B2, 8-bit multiplexed to bus 2 6B2 31 LP Doc ID 17177 Rev 3 Low power mode enable 3/20 Pin description STMUX7000 Figure 2. Input equivalent circuit A0 0B1 A1 1B1 A2 2B1 A3 3B1 A4 4B1 0B2 1B2 2B2 3B2 4B2 SEL1 A5 5B1 A6 6B1 5B2 6B2 SEL2 LP Low Power Management AM08684V1 Table 3. Bit 0, 1, 2, 3, 4 switch function table LP SEL 1 L L Bit 0, 1, 2, 3, 4 multiplexed to bus 1, bus 2 in Hi-Z L H Bit 0, 1, 2, 3, 4 multiplexed to bus 2, bus 1 in Hi-Z H X Bus 1 and 2 in Hi-Z Table 4. 4/20 Function Bit 5, 6 switch function table LP SEL 2 L L Function Bit 5,6 multiplexed to bus 1, bus 2 in Hi-Z Doc ID 17177 Rev 3 STMUX7000 Pin description Table 4. Bit 5, 6 switch function table LP SEL 2 Function L H Bit 5,6 multiplexed to bus 2, bus 1in Hi-Z H X Bus 1 and 2 in Hi-Z Doc ID 17177 Rev 3 5/20 Maximum rating 2 STMUX7000 Maximum rating Stressing the device above the rating listed in the “absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Parameter Value Unit VCC Supply voltage to ground -0.5 to 4.6 V VIO DC input output voltage -0.5 to 4.6 V VIC DC control input voltage -0.5 to 4.6 V 120 mA 0.5 W -65 to 150 °C 300 °C current(1) IO DC output PD Power dissipation Tstg Storage temperature TL Lead temperature (10 sec) 1. If VIO x IO does not exceed the maximum limit of PD. 2.1 Recommended operating conditions Table 6. Recommended operating conditions Value Symbol 6/20 Parameter Unit Min Typ Max VCC Supply voltage to ground 3 - 3.6 V VIC DC control input voltage (SEL, LP) 0 - 5 V VIO DC input/output voltage 0 - VCC V TA Operating temperature -40 - 85 °C Doc ID 17177 Rev 3 STMUX7000 Electrical characteristics 3 Electrical characteristics Table 7. DC electrical characteristics (VCC = 3.3 V ±10%) Value Symbol Parameter Test condition -40 to 85 °C Unit Min Typ Max VIH Voltage input high (SEL, LP) High level guaranteed 2 - - V VIL Voltage input low (SEL, LP) Low level guaranteed -0.5 - 0.8 V VIK Clamp diode voltage (SEL, LP) VCC = 3.6 V IIN = -18 mA - -0.8 -1.2 V IIH Input high current (SEL, LP) VCC = 3.6 V VIN = VCC - - ±5 µA IIL Input low current (SEL, LP) VCC = 3.6 V VIN = GND - - ±5 µA Leakage current through the switch common terminals (A to H) (LED1 to LED3) VCC = 3.6 V A to H = VCC LED1 to LED3 = VCC A0 to H0 = 0 V A1 to H1 = floating LEDx_0 = 0 V LEDx1 = floating SEL = VCC - - ±1 µA SEL, LP pin leakage current VCC = 0 V SEL = 0 to 3.6 V - - ±1 µA VCC = 3.0 V VIN = 0 to 1.2 V IIN = -40 mA - 4.0 6.5 Ω VCC = 3.0 V VIN at 0 and 1.2V IIN = -40 mA - 0.5 - Ω - 0.4 1 Ω IOFF(SW) (1) IOFF(SEL, LP) RON RFLAT ΔRON Switch ON resistance(2) ON resistance flatness (2) (3) ON resistance match VCC = 3.0 V between channel V = 0 to 1.2 V ΔRON = RONMAX-RONMIN IN I (2)(4) IN = -40 mA 1. Refer to Figure 4: Test circuit for leakage current (IOFF) on page 10 2. Measured by voltage drop between channels at indicated current through the switch. ON resistance is determined by the lower of the voltages. 3. Flatness is defined as the difference between the RONMAX and RONMIN of ON resistance over the specified range. 4. ΔRON measured at same VCC, temperature and voltage level. Doc ID 17177 Rev 3 7/20 Electrical characteristics Table 8. STMUX7000 Capacitance (TA = 25 °C, f = 1 MHz) Value Symbol Parameter Test condition Unit Min Typ Max SEL, LP pin input capacitance(1) DC = 0.25 V AC = 0.5 VPP f = 1 MHz - 2 3 pF COFF Switch off capacitance(2) DC = 0.25 V AC = 0.5 VPP f = 1 MHz - 2.8 6.5 pF CON Switch on capacitance(3) DC = 0.25 V AC = 0.5 VPP f = 1 MHz - 7.8 - pF CIN 1. Refer to Figure 5 on page 11. 2. Refer to Figure 6 on page 11. 3. Refer to Figure 7 on page 12. Table 9. Power supply characteristics Value Symbol Parameter Test condition -40 to 85 °C Unit Min Typ Max ICC Active mode power supply current VCC = 3.6 V, VIN = VCC or GND, LP = GND - 150 500 µA ICC Low power mode VCC = 3.6 V, VIN = VCC or power supply current GND, LP = VCC - 10 15 µA Table 10. Dynamic electrical characteristics (VCC = 3.3 V ±10%) Value Symbol Parameter Unit Min Typ Max Xtalk Crosstalk(1) RL = 50 Ω, RS = 50 Ω f = 250 MHz - -45 - dB OIRR Off isolation(2) RL = 50 Ω, RS = 50 Ω f = 250 MHz - -32 - dB BW -3 dB bandwidth(3) RL = 50 Ω, RS = 50 Ω 0 < VIN ≤1.2 V - 1000 - MHz 1. Refer to Figure 9 on page 13. 2. Refer to Figure 10 on page 14. 3. Refer to Figure 8 on page 12. 8/20 -40 to 85 °C Test condition Doc ID 17177 Rev 3 STMUX7000 Electrical characteristics Table 11. Switching characteristics (TA = 25 °C, VCC = 3.3 V ±10%) Value Symbol tPD Parameter Test condition Propagation delay VCC = 3 to 3.6 V Unit Min Typ Max - 0.25 - ns 15 ns tPZH, tPZL VCC = 3 to 3.6 V Line enable time, SE 1 KΩ pull up/down to x to x0 or x to x1 resistor at xb1 or xB2 0.5 6.5 tPHZ, tPLZ VCC = 3 to 3.6 V Line disable time, SE 1 KΩ pull up/down to x to x0 or x to x1 resistor at xb1 or xB2 0.5 16 tSK(O) Output skew between center port to any other port VCC = 3 to 3.6 V - 0.1 0.2 ns tSK(P) Skew between opposite transition of VCC = 3 to 3.6 V the same output (tPHL, tPLH) - 0.1 0.2 ns Table 12. ns ESD performance Value Symbol Test condition Unit Min Typ Max Contact discharge(1) IEC61000-4-2 - ±8 - kV Human body model (JESD22-A114) - ±8 - kV ESD 1. Refer to Figure 3: Diagram for suggested VDD decoupling on page 10. Doc ID 17177 Rev 3 9/20 Electrical characteristics VDD 32 31 GND VDD GND VDD Diagram for suggested VDD decoupling GND Figure 3. STMUX7000 29 28 3 4 23 DUT VDD C=2uF or 4.7uF GND 11 VDD 16 Note: 100nF Capacitors must be used as local bypass capacitors between the adjacent VDD and GND pairs (total 7) 1. Applicable for system level ESD test Figure 4. Test circuit for leakage current (IOFF) 3.6 V VDD IOFF(SW) " ! FLOAT " 3.6 V 3.6 V SEL, LP GND 10/20 Doc ID 17177 Rev 3 STMUX7000 Figure 5. Electrical characteristics Test circuit for SEL pin input capacitance (CIN) 6 6$$ ,#2METER $#6 !#6PP F-(Z 3%, , LP $54 '.$ Figure 6. Test circuit for switch off capacitance (COFF) 6 ,OR( (FORCHANNEL AND,FORCHANNEL 3%, ,#2METER $#6 !#6PP F-(Z 6$$ " ! $54 " '.$ Doc ID 17177 Rev 3 11/20 Electrical characteristics Figure 7. STMUX7000 Test circuit for switch on capacitance (CON) 6 ,OR( (FORCHANNEL AND,FORCHANNEL 3%, ,#2METER $#6 !#6PP F-(Z 6$$ " ! $54 " '.$ Figure 8. Test circuit for bandwidth measurement (BW) A0 0B1 SEL1 Frequency response is measured at the output of the ON channel. For example, when VSEL1 = 0 and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES setup: Average = 4 12/20 Doc ID 17177 Rev 3 STMUX7000 Electrical characteristics RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm Figure 9. Test circuit for crosstalk measurement (xtalk) A0 0B1 A1 101 0B2 1B2 A2 2B1 A3 3B1 2B2 SEL1 3B2 AM08685V1 Crosstalk is measured at the output of the non-adjacent ON channel. For example, when VSEL1 = 0, and A1 is the input, the output is measured at A3. All unused analog input ports are connected to GND and output ports are left open. HP8753ES setup: Average = 4 Doc ID 17177 Rev 3 13/20 Electrical characteristics STMUX7000 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm Figure 10. Test circuit for off isolation measurement (OIRR) A0 0B1 A1 1B1 1B2 SEL1 Off isolation is measured at the output of the OFF channel. For example, when VSEL1 = 0, and A1 is the input, the output is measured at 1B2. All unused analog input ports are connected to GND and output ports are left open. HP8753ES setup: Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm 14/20 Doc ID 17177 Rev 3 STMUX7000 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package outline for QFN32L (3 x 6 x 0.8 mm) - pitch 0.4 mm A0BZ_ME Doc ID 17177 Rev 3 15/20 Package mechanical data Table 13. STMUX7000 Mechanical data for QFN32L (3 x 6 x 0.8 mm) - pitch 0.4 mm Millimeters Symbol Min Typ Max A 0.70 0.80 0.90 A1 0.00 0.05 0.08 A3 16/20 0.25 T 0.00 b 0.15 12.00 0.20 e 0.40 e1 4.00 K 0.75 D 3.00 E 6.00 0.25 L 0.25 0.30 0.35 D2 1.50 1.60 1.79 E2 3.80 3.90 4.00 Doc ID 17177 Rev 3 STMUX7000 Package mechanical data Figure 12. Footprint recommendation A0BZ_FR Doc ID 17177 Rev 3 17/20 Package mechanical data STMUX7000 Figure 13. Carrier tape and reel information 1.75 .10 SEE NOTE 3 A0BZ_CT 18/20 Doc ID 17177 Rev 3 STMUX7000 5 Revision history Revision history Table 14. Document revision history Date Revision Changes 23-Apr-2010 1 Initial release. 16-Jun-2010 2 Modified: Figure 12. 09-Mar-2011 3 Updated: Table 8, Table 11 and Table 12. Doc ID 17177 Rev 3 19/20 STMUX7000 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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