a SHARC® DSP Microcomputer ADSP-21160M SUMMARY High-Performance 32-Bit DSP—Applications in Audio, Medical, Military, Graphics, Imaging, and Communication Super Harvard Architecture—Four Independent Buses for Dual Data Fetch, Instruction Fetch, and Nonintrusive, Zero-Overhead I/O Backwards-Compatible—Assembly Source Level Compatible with Code for ADSP-2106x DSPs Single-Instruction-Multiple-Data (SIMD) Computational Architecture—Two 32-Bit IEEE Floating-Point Computation Units, Each with a Multiplier, ALU, Shifter, and Register File Integrated Peripherals—Integrated I/O Processor, 4 M Bit On-Chip Dual-Ported SRAM, Glueless Multiprocessing Features, and Ports (Serial, Link, External Bus, and JTAG) KEY FEATURES 80 MHz (12.5 ns) Core Instruction Rate Single-Cycle Instruction Execution, Including SIMD Operations in Both Computational Units 480 MFLOPS Peak and 320 MFLOPS Sustained Performance (Based on FIR) Dual Data Address Generators (DAGs) with Modulo and Bit-Reverse Addressing Zero-Overhead Looping and Single-Cycle Loop Setup, Providing Efficient Program Sequencing IEEE 1149.1 JTAG Standard Test Access Port and On-Chip Emulation 400-Ball 27 ⴛ 27 mm Metric PBGA Package FUNCTIONAL BLOCK DIAGRAM ! '$7$ [[ '$7$ " $''5 % % $ # % "%""$" 6 $''5 & [[ # %"" SHARC is a registered trademark of Analog Devices, Inc. REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106, U.S.A. Tel:781/329-4700 World Wide Web Site: http://www.analog.com Fax:781/326-8703 © Analog Devices, Inc., 2001 ADSP-21160M FEATURES (CONTINUED) Single Instruction Multiple Data (SIMD) Architecture Provides: Two Computational Processing Elements Concurrent Execution—Each Processing Element Executes the Same Instruction, but Operates on Different Data Code Compatibility—at Assembly Level, Uses the Same Instruction Set as the ADSP-2106x SHARC DSPs Parallelism in Buses and Computational Units Allows: Single-cycle Execution (with or without SIMD) of: A Multiply Operation, An ALU Operation, A Dual Memory Read or Write, and An Instruction Fetch Transfers Between Memory and Core at up to Four 32-Bit Floating- or Fixed-Point Words per Cycle Accelerated FFT Butterfly Computation Through a Multiply with Add and Subtract 4M Bit On-Chip Dual-Ported SRAM for Independent Access by Core Processor, Host, and DMA DMA Controller supports: 14 Zero-Overhead DMA Channels for Transfers Between ADSP-21160M Internal Memory and External Memory, External Peripherals, Host Processor, Serial Ports, or Link Ports 64-Bit Background DMA Transfers at Core Clock Speed, in Parallel with Full-Speed Processor Execution 560M Bytes/s Transfer Rate Over IOP Bus Host Processor Interface to 16- and 32-Bit Microprocessors 4G Word Address Range for Off-Chip Memory Memory Interface Supports Programmable Wait State Generation and Page-Mode for Off-Chip Memory Multiprocessing Support Provides: Glueless Connection for Scalable DSP Multiprocessing Architecture Distributed On-Chip Bus Arbitration for Parallel Bus Connect of up to Six ADSP-21160Ms plus Host Six Link Ports for Point-To-Point Connectivity and Array Multiprocessing Serial Ports Provide: Two 40M Bit/s Synchronous Serial Ports with Companding Hardware Independent Transmit and Receive Functions TDM Support for T1 and E1 Interfaces 64-Bit Wide Synchronous External Port Provides: Glueless Connection to Asynchronous and SBSRAM External Memories Up to 40 MHz Operation GENERAL DESCRIPTION The ADSP-21160M SHARC DSP is the first processor in a new family featuring Analog Devices’ Super Harvard Architecture. Easing portability, the ADSP-21160M is application source code compatible with first generation ADSP-2106x SHARC DSPs in SISD (Single Instruction, Single Data) mode. To take advantage of the processor’s SIMD (Single Instruction, Multiple Data) capability, some code changes are needed. Like other SHARCs, the ADSP-21160M is a 32-bit processor that is optimized for high performance DSP applications. The ADSP-21160M includes an 80 MHz core, a dual-ported on-chip SRAM, an integrated I/O processor with multiprocessing support, and multiple internal buses to eliminate I/O bottlenecks. The ADSP-21160M introduces Single-Instruction, Multiple-Data (SIMD) processing. Using two computational units (ADSP-2106x SHARC DSPs have one), the ADSP-21160M can double performance versus the ADSP-2106x on a range of DSP algorithms. Fabricated in a state of the art, high speed, low power CMOS process, the ADSP-21160M has a 12.5 ns instruction cycle time. With its SIMD computational hardware running at 80 MHz, the ADSP-21160M can perform 480 million math operations per second. Table 1 shows performance benchmarks for the ADSP-21160M. Table 1. ADSP-21160M Benchmarks Benchmark Algorithm Speed 1024 Point Complex FFT (Radix 4, with reversal) FIR Filter (per tap) IIR Filter (per biquad) Matrix Multiply (pipelined) [3ⴛ3] ⴛ [3ⴛ1] Matrix Multiply (pipelined) [4ⴛ4] ⴛ [4ⴛ1] Divide (y/x) Inverse Square Root DMA Transfer Rate 115 µs 6.25 ns 25 ns 56.25 ns 100 ns 37.5 ns 56.25 ns 560M Bytes/s These benchmarks provide single-channel extrapolations of measured dual-channel processing performance. For more information on benchmarking and optimizing DSP code for single- and dual-channel processing, see Analog Devices’s website. The ADSP-21160M continues SHARC’s industry-leading standards of integration for DSPs, combining a high-performance 32-bit DSP core with integrated, on-chip system features. These features include a 4M bit dual ported SRAM memory, host processor interface, I/O processor that supports 14 DMA channels, two serial ports, six link ports, external parallel bus, and glueless multiprocessing. –2– REV. 0 ADSP-21160M The functional block diagram on page 1 shows a block diagram of the ADSP-21160M, illustrating the following architectural features: • Two processing elements, each made up of an ALU, Multiplier, Shifter, and Data Register File • Data Address Generators (DAG1, DAG2) • Program sequencer with instruction cache • PM and DM buses capable of supporting four 32-bit data transfers between memory and the core every core processor cycle • Interval timer • On-Chip SRAM (4 Mbit) • External port that supports: • Interfacing to off-chip memory peripherals • Glueless multiprocessing support for six ADSP-21160M SHARCs • Host port • DMA controller • Serial ports and link ports • JTAG test access port Figure 1 shows a typical single-processor system. A multiprocessing system appears in Figure 4. & " $ " " ' $ " " $ $ ( ( $ # % $ " $ " SIMD Computational Engine The ADSP-21160M contains two computational processing elements that operate as a Single Instruction Multiple Data (SIMD) engine. The processing elements are referred to as PEX and PEY, and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY may be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on different data. This architecture is efficient at executing math-intensive DSP algorithms. Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file. $ ! ! ! " $ $ Figure 1. Single-Processor System Within each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform single-cycle instructions. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit single-precision floating-point, 40-bit extended precision floating-point, and 32-bit fixed-point data formats. Data Register File $ The ADSP-21160M includes the following architectural features of the ADSP-2116x family core. The ADSP-21160M is code compatible at the assembly level with the ADSP-21060, ADSP-21061, and ADSP-21062. Independent, Parallel Computation Units ADSP-21160M Family Core Architecture A general-purpose data register file is contained in each processing element. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) register files, combined with the ADSP-2116x enhanced Harvard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0–R15 and in PEY as S0–S15. Single-Cycle Fetch of Instruction and Four Operands The ADSP-21160M features an enhanced Harvard architecture in which the data memory (DM) bus transfers data, and the program memory (PM) bus transfers both instructions and data (see the functional block diagram on page 1). REV. 0 –3– ADSP-21160M With the ADSP-21160M’s separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands and an instruction (from the cache), all in a single cycle. Instruction Cache The ADSP-21160M includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective—only the instructions whose fetches conflict with PM bus data accesses are cached. This cache allows full-speed execution of core, providing looped operations such as digital filter multiply- accumulates and FFT butterfly processing. Data Address Generators with Hardware Circular Buffers The ADSP-21160M’s two data address generators (DAGs) are used for indirect addressing and provide for implementing circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs of the ADSP-21160M contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reducing overhead, increasing performance, and simplifying implementation. Circular buffers can start and end at any memory location. Flexible Instruction Set The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP-21160M can conditionally execute a multiply, an add, and subtract, in both processing elements, while branching, all in a single instruction. ADSP-21160M Memory and I/O Interface Features Augmenting the ADSP-2116x family core, the ADSP-21160M adds the following architectural features: Dual-Ported On-Chip Memory The ADSP-21160M contains four megabits of on-chip SRAM, organized as two blocks of 2 Mbits each, which can be configured for different combinations of code and data storage. Each memory block is dual-ported for single-cycle, independent accesses by the core processor and I/O processor. The dual-ported memory in combination with three separate on-chip buses allows two data transfers from the core and one from I/O processor, in a single cycle. On the ADSP-21160M, the memory can be configured as a maximum of 128K words of 32-bit data, 256K words of 16-bit data, 85K words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to four megabits. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles the amount of data that may be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point formats is done in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data, using the DM bus for transfers, and the other block stores instructions and data, using the PM bus for transfers. Using the DM bus and PM bus in this way, with one dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Off-Chip Memory and Peripherals Interface The ADSP-21160M’s external port provides the processor’s interface to off-chip memory and peripherals. The 4G word off-chip address space is included in the ADSP-21160M’s unified address space. The separate on-chip buses—for PM addresses, PM data, DM addresses, DM data, I/O addresses, and I/O data—are multiplexed at the external port to create an external system bus with a single 32-bit address bus and a single 64-bit data bus. The lower 32 bits of the external data bus connect to even addresses and the upper 32 bits of the 64 connect to odd addresses. Every access to external memory is based on an address that fetches a 32-bit word, and with the 64-bit bus, two address locations can be accessed at once. When fetching an instruction from external memory, two 32-bit data locations are being accessed (16 bits are unused). Figure 3 shows the alignment of various accesses to external memory. The external port supports asynchronous, synchronous, and synchronous burst accesses. ZBT synchronous burst SRAM can be interfaced gluelessly. Addressing of external memory devices is facilitated by on-chip decoding of high-order address lines to generate memory bank select signals. Separate control lines are also generated for simplified addressing of page-mode DRAM. The ADSP-21160M provides programmable memory wait states and external memory acknowledge controls to allow interfacing to DRAM and peripherals with variable access, hold, and disable time requirements. DMA Controller The ADSP-21160M’s on-chip DMA controller allows zero-overhead data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP-21160M’s internal memory and external memory, external peripherals, or a host processor. DMA transfers can also occur between the ADSP-21160M’s internal memory and its serial ports or link ports. External bus packing to 16-, 32-, 48-, or 64-bit words is performed during DMA transfers. Fourteen channels of DMA are available on the ADSP-21160M—six via the link ports, four via the serial ports, and four via the processor’s external port (for either –4– REV. 0 ADSP-21160M +,-.+/0 -12.3 4/5- -678 2+6(2.9 2.1/0(2.9 :2.,(2.9 +,-.+/0 ) /+; ) ' -12.3 4/5- ' " ### " /+; ! = +,-.+/0 $% & -12.3 4/5- /+; $ & = +,-.+/0 -12.3 /+; 4/5- = 0XOWLSURFHVVRU 0HPRU\ 6SDFH +,-.+/0 -12.3 ,-.+/0 -12.3 4/5- 4/5 = +,-.+/0 * -12.3 4/5 = +,-.+/0 2+</+;-9 -12.3 4/5 = .2/95/8, ' (.>,-,2 008 = '""""" """""""" Figure 3. ADSP-21160M External Data Alignment Options or rotating priority. Bus lock allows indivisible read-modify-write sequences for semaphores. A vector interrupt is provided for interprocessor commands. Maximum throughput for interprocessor data transfer is 320M bytes/s over the external port. Broadcast writes allow simultaneous transmission of data to all ADSP-21160Ms and can be used to implement reflective semaphores. Six link ports provide for a second method of multiprocessing communications. Each link port can support communications to another ADSP-21160M. Using the links, a large multiprocessor system can be constructed in a 2D or 3D fashion. Systems can use the link ports and cluster multiprocessing concurrently or independently. Figure 2. ADSP-21160M Memory Map Link Ports host processor, other ADSP-21160Ms, memory or I/O transfers). Programs can be downloaded to the ADSP-21160M using DMA transfers. Asynchronous off-chip peripherals can control two DMA channels using DMA Request/Grant lines (DMAR1–2, DMAG1–2). Other DMA features include interrupt generation upon completion of DMA transfers, two-dimensional DMA, and DMA chaining for automatic linked DMA transfers. Multiprocessing The ADSP-21160M offers powerful features tailored to multiprocessing DSP systems as shown in Figure 4. The external port and link ports provide integrated glueless multiprocessing support. The external port supports a unified address space (see Figure 2) that allows direct interprocessor accesses of each ADSP-21160M’s internal memory. Distributed bus arbitration logic is included on-chip for simple, glueless connection of systems containing up to six ADSP-21160Ms and a host processor. Master processor changeover incurs only one cycle of overhead. Bus arbitration is selectable as either fixed REV. 0 The ADSP-21160M features six 8-bit link ports that provide additional I/O capabilities. With the capability of running at 80 MHz rates, each link port can support 80M bytes/s. Link port I/O is especially useful for point-to-point interprocessor communication in multiprocessing systems. The link ports can operate independently and simultaneously. Link port data is packed into 48- or 32-bit words, and can be directly read by the core processor or DMA-transferred to on-chip memory. Each link port has its own double-buffered input and output registers. Clock/acknowledge handshaking controls link port transfers. Transfers are programmable as either transmit or receive. For data throughput information, see link port timing details in Table 18 on page 34. Serial Ports The ADSP-21160M features two synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices. The serial ports can operate up to half the clock rate of the core, providing each with a maximum data rate of 40M bit/s. Independent –5– ? tle-endian or big-endian transmission formats, with word lengths selectable from 3 bits to 32 bits. They offer selectable synchronization and transmit modes as well as optional µ-law or A-law companding. Serial port clocks and frame syncs can be internally or externally generated. ? ?* ? ADSP-21160M $ Host Processor Interface $ The ADSP-21160M host interface allows easy connection to standard microprocessor buses, both 16-bit and 32-bit, with little additional hardware required. The host interface is accessed through the ADSP-21160M’s external port and is memory-mapped into the unified address space. Four channels of DMA are available for the host interface; code and data transfers are accomplished with low software overhead. The host processor communicates with the ADSP-21160M’s external bus with host bus request (HBR), host but grant (HBG), ready (REDY), acknowledge (ACK), and chip select (CS) signals. The host can directly read and write the internal memory of the ADSP-21160M, and can access the DMA channel setup and mailbox registers. Vector interrupt support provides efficient execution of host commands. $ $ @ $ * ? $ $ Program Booting $ $ Power Supplies The ADSP-21160M has separate power supply connections for the internal (VDDINT), external (VDDEXT), and analog (AVDD/AGND) power supplies. The internal and analog supplies must meet the 2.5 V requirement. The external supply must meet the 3.3 V requirement. All external supply pins must be connected to the same supply. ( ( # ! " ! ! $ $ $ * Phased Locked Loop The ADSP-21160M uses an on-chip PLL to generate the internal clock for the core. Ratios of 2:1, 3:1, and 4:1 between the core and CLKIN are supported. The CLK_CFG pins are used to select the ratio. The CLKIN rate is the rate at which the synchronous external port operates. ! $ ? * @$ The internal memory of the ADSP-21160M can be booted at system power-up from an 8-bit EPROM, a host processor, or through one of the link ports. Selection of the boot source is controlled by the BMS (Boot Memory Select), EBOOT (EPROM Boot), and LBOOT (Link/Host Boot) pins. 32-bit and 16-bit host processors can be used for booting. Figure 4. Shared Memory Multiprocessing System transmit and receive functions provide greater flexibility for serial communications. Serial port data can be automatically transferred to and from on-chip memory via a dedicated DMA. Each of the serial ports offers a TDM multichannel mode. The serial ports can operate with lit- Note that the analog supply (AVDD) powers the ADSP-21160M’s clock generator PLL. To produce a stable clock, the system must provide an external circuit to filter the power input to the AVDD pin. Place the filter as close as possible to the pin. For an example circuit, see Figure 5. To prevent noise coupling, use a wide trace for the analog ground (AGND) signal and install a decoupling capacitor as close as possible to the pin. –6– REV. 0 ADSP-21160M ⍀ '',17 '' Figure 5. Analog Power (AVDD) Filter Circuit Development Tools The ADSP-21160M is supported with a complete set of software and hardware development tools, including Analog Devices’ emulators and VisualDSP++1 development environment. The same emulator hardware that supports other ADSP-2116x DSPs, also fully emulates the ADSP-21160M. The VisualDSP++ project management environment lets programmers develop and debug an application. This environment includes an easy-to-use assembler that is based on an algebraic syntax; an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ run-time library that includes DSP and mathematical functions. Two key points for these tools are: • Compiled ADSP-2116x C/C++ code efficiency—the compiler has been developed for efficient translation of C/C++ code to ADSP-2116x assembly. The DSP has architectural features that improve the efficiency of compiled C/C++ code. • ADSP-2106x family code compatibility—The assembler has legacy features to ease the conversion of existing ADSP-2106x applications to the ADSP-2116x. Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can: • View mixed C/C++ and assembly code (interleaved source and object information) • Insert break points • Set conditional breakpoints on registers, memory, and stacks • Trace instruction execution • Perform linear or statistical profiling of program execution • Fill, dump, and graphically plot the contents of memory • Source level debugging • Create custom debugger windows The VisualDSP++ IDE lets programmers define and manage DSP software development. Its dialog boxes and property pages let programmers configure and manage all 1 of the ADSP-2116x development tools, including the syntax highlighting in the VisualDSP++ editor. This capability permits: • Control how the development tools process inputs and generate outputs. • Maintain a one-to-one correspondence with the tool’s command line switches. Analog Devices’ DSP emulators use the IEEE 1149.1 JTAG test access port of the ADSP-21160M processor to monitor and control the target board processor during emulation. The emulator provides full-speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or timing. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the ADSP-2116x processor family. Hardware tools include ADSP-2116x PC plug-in cards. Third Party software tools include DSP libraries, real-time operating systems, and block diagram design tools. Designing an Emulator-Compatible DSP Board (Target) The White Mountain DSP (Product Line of Analog Devices, Inc.) family of emulators are tools that every DSP developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on each JTAG DSP. The emulator uses the TAP to access the internal features of the DSP, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The DSP must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing. To use these emulators, the target’s design must include the interface between an Analog Devices’ JTAG DSP and the emulation header on a custom DSP target board. Target Board Header The emulator interface to an Analog Devices’ JTAG DSP is a 14-pin header, as shown in Figure 6. The customer must supply this header on the target board in order to communicate with the emulator. The interface consists of a standard dual row 0.025" square post header, set on 0.1" ⴛ 0.1" spacing, with a minimum post length of 0.235". Pin 3 is the key position used to prevent the pod from being inserted backwards. This pin must be clipped on the target board. VisualDSP++ is a registered trademark of Analog Devices, Inc. REV. 0 –7– ADSP-21160M Also, the clearance (length, width, and height) around the header must be considered. Leave a clearance of at least 0.15" and 0.10" around the length and width of the header, and reserve a height clearance to attach and detach the pod connector. * * ' A A A ) ) ' # # A ( Figure 7. JTAG Target Board Connector with No Local Boundary Scan ( Figure 6. JTAG Target Board Connector for JTAG Equipped Analog Devices DSP (Jumpers in Place) As can be seen in Figure 6, there are two sets of signals on the header. There are the standard JTAG signals TMS, TCK, TDI, TDO, TRST, and EMU used for emulation purposes (via an emulator). There are also secondary JTAG signals BTMS, BTCK, BTDI, and BTRST that are optionally used for board-level (boundary scan) testing. When the emulator is not connected to this header, place jumpers across BTMS, BTCK, BTRST, and BTDI as shown in Figure 7. This holds the JTAG signals in the correct state to allow the DSP to run free. Remove all the jumpers when connecting the emulator to the JTAG header. JTAG Emulator Pod Connector Figure 8 details the dimensions of the JTAG pod connector at the 14-pin target end. Figure 9 displays the keep-out area for a target board header. The keep-out area allows the pod connector to properly seat onto the target board header. This board area should contain no components (chips, resistors, capacitors, etc.). The dimensions are referenced to the center of the 0.25" square post pin. BC B*C Figure 9. JTAG Pod Connector Keep-Out Area B C B C B))C Figure 8. JTAG Pod Connector Dimensions Design-for-Emulation Circuit Information For details on target board design issues including: single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices website—use site search on “EE-68” (www.analog.com). This document is updated regularly to keep pace with improvements to emulator support. Additional Information This data sheet provides a general overview of the ADSP-21160M architecture and functionality. For detailed information on the ADSP-2116x Family core architecture and instruction set, refer to the ADSP-2116x SHARC DSP Hardware Reference. PIN FUNCTION DESCRIPTIONS ADSP-21160M pin definitions are listed below. Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST). –8– REV. 0 ADSP-21160M Unused inputs should be tied or pulled to VDD or GND, except for ADDR31–0, DATA63–0, FLAG3–0, and inputs that have internal pull-up or pull-down resistors (PA, ACK, BRST, PAGE, CLKOUT, MS3–0, RDx, WRx, DMARx, DMAGx, DTx, DRx, TCLKx, RCLKx, LxDAT7–0, LxCLK, LxACK, TMS, TRST and TDI)—these pins can be left floating. These pins have a logic-level hold circuit (only enabled on the ADSP-21160M with ID2–0 = 00x) that prevents input from floating internally. The following symbols appear in the Type column of Table 2: A = Asynchronous, G = Ground, I = Input, O = Output, P = Power Supply, S = Synchronous, (A/D) = Active Drive, (O/D) = Open Drain, and T = Three-State (when SBTS is asserted, or when the ADSP-21160M is a bus slave). Table 2. Pin Function Descriptions Pin Type Function ADDR31–0 I/O/T DATA63–0 I/O/T MS3–0 O/T RDL I/O/T RDH I/O/T WRL I/O/T WRH I/O/T PAGE O/T External Bus Address. The ADSP-21160M outputs addresses for external memory and peripherals on these pins. In a multiprocessor system, the bus master outputs addresses for read/writes of the internal memory or IOP registers of other ADSP-21160Ms. The ADSP-21160M inputs addresses when a host processor or multiprocessing bus master is reading or writing its internal memory or IOP registers. A keeper latch on the DSP’s ADDR31–0 pins maintains the input at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). External Bus Data. The ADSP-21160M inputs and outputs data and instructions on these pins. Pull-up resistors on unused DATA pins are not necessary. A keeper latch on the DSP’s DATA63-0 pins maintains the input at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). Memory Select Lines. These outputs are asserted (low) as chip selects for the corresponding banks of external memory. Memory bank size must be defined in the SYSCON control register. The MS3–0 outputs are decoded memory address lines. In asyn- chronous access mode, the MS3–0 outputs transition with the other address outputs. In synchronous access modes, the MS3–0 outputs assert with the other address lines; however, they de-assert after the first CLKIN cycle in which ACK is sampled asserted. Memory Read Low Strobe. RDL is asserted whenever ADSP-21160M reads from the low word of external memory or from the internal memory of other ADSP-21160Ms. External devices, including other ADSP-21160Ms, must assert RDL for reading from the low word of ADSP-21160M internal memory. In a multiprocessing system, RDL is driven by the bus master. Memory Read High Strobe. RDH is asserted whenever ADSP-21160M reads from the high word of external memory or from the internal memory of other ADSP-21160Ms. External devices, including other ADSP-21160Ms, must assert RDH for reading from the high word of ADSP-21160M internal memory. In a multiprocessing system, RDH is driven by the bus master. Memory Write Low Strobe. WRL is asserted when ADSP-21160M writes to the low word of external memory or internal memory of other ADSP-21160Ms. External devices must assert WRL for writing to ADSP-21160M’s low word of internal memory. In a multiprocessing system, WRL is driven by the bus master. Memory Write High Strobe. WRH is asserted when ADSP-21160M writes to the high word of external memory or internal memory of other ADSP-21160Ms. External devices must assert WRH for writing to ADSP-21160M’s high word of internal memory. In a multiprocessing system, WRH is driven by the bus master. DRAM Page Boundary. The ADSP-21160M asserts this pin to signal that an external DRAM page boundary has been crossed. DRAM page size must be defined in the ADSP-21160M’s memory control register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can only be activated for Bank 0 accesses. In a multiprocessing system PAGE is output by the bus master. A keeper latch on the DSP’s PAGE pin maintains the output at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). REV. 0 –9– ADSP-21160M Table 2. Pin Function Descriptions (Continued) Pin Type Function BRST I/O/T ACK I/O/S SBTS I/S IRQ2–0 I/A FLAG3–0 I/O/A TIMEXP O HBR I/A HBG I/O CS REDY I/A O (O/D) DMAR1 I/A DMAR2 I/A ID2–0 I DMAG1 O/T Sequential Burst Access. BRST is asserted by ADSP-21160M or a host to indicate that data associated with consecutive addresses is being read or written. A slave device samples the initial address and increments an internal address counter after each transfer. The incremented address is not pipelined on the bus. If the burst access is a read from host to ADSP-21160M, ADSP-21160M automatically increments the address as long as BRST is asserted. BRST is asserted after the initial access of a burst transfer. It is asserted for every cycle after that, except for the last data request cycle (denoted by RDx or WRx asserted and BRST negated). A keeper latch on the DSP’s BRST pin maintains the input at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). Memory Acknowledge. External devices can de-assert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. The ADSP-21160M deasserts ACK as an output to add wait states to a synchronous access of its internal memory. A keeper latch on the DSP’s ACK pin maintains the input at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). Suspend Bus and Three-State. External devices can assert SBTS (low) to place the external bus address, data, selects, and strobes in a high impedance state for the following cycle. If the ADSP-21160M attempts to access external memory while SBTS is asserted, the processor will halt and the memory access will not be completed until SBTS is deasserted. SBTS should only be used to recover from host processor and/or ADSP-21160M deadlock or used with a DRAM controller. Interrupt Request Lines. These are sampled on the rising edge of CLKIN and may be either edge-triggered or level-sensitive. Flag Pins. Each is configured via control bits as either an input or output. As an input, it can be tested as a condition. As an output, it can be used to signal external peripherals. Timer Expired. Asserted for four CLKIN cycles when the timer is enabled and TCOUNT decrements to zero. Host Bus Request. Must be asserted by a host processor to request control of the ADSP-21160M’s external bus. When HBR is asserted in a multiprocessing system, the ADSP-21160M that is bus master will relinquish the bus and assert HBG. To relinquish the bus, the ADSP-21160M places the address, data, select, and strobe lines in a high impedance state. HBR has priority over all ADSP-21160M bus requests (BR6–1) in a multiprocessing system. Host Bus Grant. Acknowledges an HBR bus request, indicating that the host processor may take control of the external bus. HBG is asserted (held low) by the ADSP-21160M until HBR is released. In a multiprocessing system, HBG is output by the ADSP-21160M bus master and is monitored by all others. Chip Select. Asserted by host processor to select the ADSP-21160M. Host Bus Acknowledge. The ADSP-21160M deasserts REDY (low) to add waitstates to a host access when CS and HBR inputs are asserted. DMA Request 1 (DMA Channel 11). Asserted by external port devices to request DMA services. DMA Request 2 (DMA Channel 12). Asserted by external port devices to request DMA services. Multiprocessing ID. Determines which multiprocessing bus request (BR1–BR6) is used by ADSP-21160M. ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, and so on. Use ID = 000 or ID = 001 in single-processor systems. These lines are a system configuration selection which should be hardwired or only changed at reset. DMA Grant 1 (DMA Channel 11). Asserted by ADSP-21160M to indicate that the requested DMA starts on the next cycle. Driven by bus master only. –10– REV. 0 ADSP-21160M Table 2. Pin Function Descriptions (Continued) Pin Type Function DMAG2 O/T BR6–1 I/O/S RPBA I/S PA I/O/T DTx DRx TCLKx O I I/O RCLKx TFSx RFSx LxDAT7–0 I/O I/O I/O I/O LxCLK I/O LxACK I/O EBOOT I LBOOT I BMS I/O/T CLKIN I CLK_CFG3–0 I CLKOUT O/T RESET I/A DMA Grant 2 (DMA Channel 12). Asserted by ADSP-21160M to indicate that the requested DMA starts on the next cycle. Driven by bus master only. Multiprocessing Bus Requests. Used by multiprocessing ADSP-21160Ms to arbitrate for bus mastership. An ADSP-21160M only drives its own BRx line (corresponding to the value of its ID2–0 inputs) and monitors all others. In a multiprocessor system with less than six ADSP-21160Ms, the unused BRx pins should be pulled high; the processor’s own BRx line must not be pulled high or low because it is an output. Rotating Priority Bus Arbitration Select. When RPBA is high, rotating priority for multiprocessor bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system configuration selection which must be set to the same value on every ADSP-21160M. If the value of RPBA is changed during system operation, it must be changed in the same CLKIN cycle on every ADSP-21160M. Priority Access. Asserting its PA pin allows an ADSP-21160M bus slave to interrupt background DMA transfers and gain access to the external bus. PA is connected to all ADSP-21160Ms in the system. If access priority is not required in a system, the PA pin should be left unconnected. Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 kΩ internal pull-up resistor. Data Receive (Serial Ports 0, 1). Each DR pin has a 50 kΩ internal pull-up resistor. Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 kΩ internal pull-up resistor. Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 kΩ internal pull-up resistor. Transmit Frame Sync (Serial Ports 0, 1). Receive Frame Sync (Serial Ports 0, 1). Link Port Data (Link Ports 0–5). Each LxDAT pin has a 50 kΩ internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCTL0–1 register. Link Port Clock (Link Ports 0–5). Each LxCLK pin has a 50 kΩ internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCTL0–1 register. Link Port Acknowledge (Link Ports 0–5). Each LxACK pin has a 50 kΩ internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register. EPROM Boot Select. For a description of how this pin operates, see Table 3. This signal is a system configuration selection that should be hardwired. Link Boot. For a description of how this pin operates, see Table 3. This signal is a system configuration selection that should be hardwired. Boot Memory Select. Serves as an output or input as selected with the EBOOT and LBOOT pins; see Table 3. This input is a system configuration selection that should be hardwired. Local Clock In. CLKIN is the ADSP-21160M clock input. The ADSP-21160M external port cycles at the frequency of CLKIN. The instruction cycle rate is a multiple of the CLKIN frequency; it is programmable at power-up. CLKIN may not be halted, changed, or operated below the specified frequency. Core/CLKIN Ratio Control. ADSP-21160M core clock (instruction cycle) rate is equal to n ⴛ CLKIN where n is user-selectable to 2, 3, or 4, using the CLK_CFG3–0 inputs. For clock configuration definitions, see the RESET & CLKIN section of the System Design chapter of the ADSP-21160 SHARC DSP Hardware Reference manual. Local Clock Out. CLKOUT is driven at the CLKIN frequency by the current bus master. This output is three-stated when the ADSP-21160M is not the bus master, or when the host controls the bus (HBG asserted). A keeper latch on the DSP’s CLKOUT pin maintains the output at the level it was last driven (only enabled on the ADSP-21160M with ID2–0 = 00x). Processor Reset. Resets the ADSP-21160M to a known state and begins execution at the program memory location specified by the hardware reset vector address. The RESET input must be asserted (low) at power-up. REV. 0 –11– ADSP-21160M Table 2. Pin Function Descriptions (Continued) Pin Type Function TCK TMS I I/S TDI I/S TDO TRST O I/A EMU O (O/D) CIF O/T VDDINT P VDDEXT AVDD P P AGND GND NC G G Test Clock (JTAG). Provides a clock for JTAG boundary scan. Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 kΩ internal pull-up resistor. Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 kΩ internal pull-up resistor. Test Data Output (JTAG). Serial scan output of the boundary scan path. Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-21160M. TRST has a 20 kΩ internal pull-up resistor. Emulation Status. Must be connected to the ADSP-21160M emulator target board connector only. EMU has a 50 kΩ internal pull-up resistor. Core Instruction Fetch. Signal is active low when an external instruction fetch is performed. Driven by bus master only. Three-state when host is bus master. Core Power Supply. Nominally 2.5 V dc and supplies the DSP’s core processor (40 pins). I/O Power Supply. Nominally 3.3 V dc (46 pins). Analog Power Supply. Nominally 2.5 V dc and supplies the DSP’s internal PLL (clock generator). This pin has the same specifications as VDDINT, except that added filtering circuitry is required. For more information, see Power Supplies on page 6. Analog Power Supply Return. Power Supply Return. (83 pins) Do Not Connect. Reserved pins that must be left open and unconnected (5 pins). Table 3. Boot Mode Selection EBOOT LBOOT BMS Booting Mode 1 0 0 0 0 1 0 0 1 0 1 1 Output 1 (Input) 1 (Input) 0 (Input) 0 (Input) x (Input) EPROM (Connect BMS to EPROM chip select.) Host Processor Link Port No Booting. Processor executes from external memory. Reserved Reserved –12– REV. 0 ADSP-21160M ADSP-21160M SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS 1 Signal K Grade Parameter1 Min Max Unit VDDINT AVDD VDDEXT VIH1 VIH2 VIL TCASE Internal (Core) Supply Voltage Analog (PLL) Supply Voltage External (I/O) Supply Voltage High Level Input Voltage2, @ VDDEXT =Max High Level Input Voltage3, @ VDDEXT =Max Low Level Input Voltage2,3, @ VDDEXT =Min Case Operating Temperature4 2.37 2.37 3.13 2.2 2.3 –0.5 0 2.63 2.63 3.47 VDDEXT +0.5 VDDEXT +0.5 0.8 85 V V V V V V ºC Specifications subject to change without notice. 2 Applies to input and bidirectional pins: DATA63–0, ADDR31–0, RDx, WRx, ACK, SBTS, IRQ2–0, FLAG3–0, HBG, CS, DMAR1, DMAR2, BR6–1, ID2–0, RPBA, PA, BRST, TFS0, TFS1, RFS0, RFS1, LxDAT3–0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 3 Applies to input pins: CLKIN, RESET, TRST. 4 See Environmental Conditions on page 45 for information on thermal specifications. ELECTRICAL CHARACTERISTICS Parameter1 VOH VOL IIH IIL IILPU1 IILPU2 IOZH IOZL IOZHPD IOZLPU1 IOZLPU2 IOZHA IOZLA IDD-INPEAK IDD-INHIGH IDD-INLOW IDD-IDLE AIDD CIN 1 Test Conditions 2 High Level Output Voltage Low Level Output Voltage2 High Level Input Current4,5,6 Low Level Input Current4 Low Level Input Current Pull-Up15 Low Level Input Current Pull-Up26 Three-State Leakage Current7,8,9,10 Three-State Leakage Current7 Three-State Leakage Current Pull-Down10 Three-State Leakage Current Pull-Up18 Three-State Leakage Current Pull-Up29 Three-State Leakage Current11 Three-State Leakage Current11 Supply Current (Internal)12 Supply Current (Internal)13 Supply Current (Internal)14 Supply Current (Idle)15 Supply Current (Analog)16 Input Capacitance17,18 Min Max Unit 0.4 10 10 250 V V µA µA µA @ VDDEXT =Max, VIN =0 V 500 µA @ VDDEXT =Max, VIN =VDD Max @ VDDEXT =Max, VIN =0 V @ VDDEXT =Max, VIN =VDD Max 10 10 250 µA µA µA @ VDDEXT =Max, VIN =0 V 250 µA @ VDDEXT =Max, VIN =0 V 500 µA @ VDDEXT =Max, VIN =VDD Max @ VDDEXT =Max, VIN =0 V tCCLK =12.5 ns, VDDINT =Max tCCLK =12.5 ns, VDDINT =Max tCCLK =12.5 ns, VDDINT =Max tCCLK =12.5 ns, VDDINT =Max @AVDD =Max fIN =1 MHz, TCASE =25°C, VIN =2.5 V 25 4 1400 875 625 80 10 4.7 µA mA mA mA mA mA mA pF 3 @ VDDEXT =Min, IOH =–2.0 mA @ VDDEXT =Min, IOL =4.0 mA3 @ VDDEXT =Max, VIN =VDD Max @ VDDEXT =Max, VIN =0 V @ VDDEXT =Max, VIN =0 V 2.4 Specifications subject to change without notice. 2 Applies to output and bidirectional pins: DATA63–0, ADDR31–0, MS3–0, RDx, WRx, PAGE, CLKOUT, ACK, FLAG3–0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR6–1, PA, BRST, CIF, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3–0, LxCLK, LxACK, BMS, TDO, EMU. 3 See Output Drive Currents on page 42 for typical drive current capabilities. 4 Applies to input pins: ACK, SBTS, IRQ2–0, HBR, CS, ID2–0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK, CLK_CFG3-0. REV. 0 –13– ADSP-21160M 5 Applies to input pins with internal pull-ups: DR0, DR1. 6 Applies to input pins with internal pull-ups: DMARx, TMS, TDI, TRST. 7 Applies to three-statable pins: DATA63–0, ADDR31–0, PAGE, CLKOUT, ACK, FLAG3–0, REDY, HBG, BMS, BR6–1, TFSx, RFSx, TDO. 8 Applies to three-statable pins with internal pull-ups: DTx, TCLKx, RCLKx, EMU. 9 Applies to three-statable pins with internal pull-ups: MS3–0, RDx, WRx, DMAGx, PA, CIF. 10 Applies to three-statable pins with internal pull-downs: LxDAT7–0, LxCLK, LxACK. 11 Applies to ACK pulled up internally with 2 kΩ during reset or ID2–0 = 00x. 12 The test program used to measure IDD-INPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified. For more information, see Power Dissipation on page 42. 13 IDDINHIGH is a composite average based on a range of high activity code. For more information, see Power Dissipation on page 42. 14 IDDINLOW is a composite average based on a range of low activity code. For more information, see Power Dissipation on page 42. 15 Idle denotes ADSP-21160M state during execution of IDLE instruction. For more information, see Power Dissipation on page 42. 16 Characterized, but not tested. 17 Applies to all signal pins. 18 Guaranteed, but not tested. ABSOLUTE MAXIMUM RATINGS Internal (Core) Supply Voltage (VDDINT)1 . . .–0.3 V to +3.0 V Analog (PLL) Supply Voltage (AVDD) . . . . .–0.3 V to +3.0 V External (I/O) Supply Voltage (VDDEXT) . . . .–0.3 V to +4.6 V Input Voltage. . . . . . . . . . . . . . . . . . –0.5 V to VDDEXT +0.5 V Output Voltage Swing . . . . . . . . . . . –0.5 V to VDDEXT +0.5 V Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF Storage Temperature Range . . . . . . . . . . . –65ºC to +150ºC Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . 185ºC 1 Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD SENSITIVITY CAUTION: ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADSP-21160M features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –14– REV. 0 ADSP-21160M Timing Specifications The ADSP-21160M’s internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the DSP uses an internal phase-locked loop (PLL). This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the DSP’s internal clock (the clock source for the external port logic and I/O pads). The ADSP-21160M’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor core, link ports, serial ports, and external port (as required for read/write strobes in asynchronous access mode). During reset, program the ratio between the DSP’s internal clock frequency and external (CLKIN) clock frequency with the CLK_CFG3–0 pins. Even though the internal clock is the clock source for the external port, the external port clock always switches at the CLKIN frequency. To determine switching frequencies for the serial and link ports, divide down the internal clock, using the programmable divider control of each port (TDIVx/RDIVx for the serial ports and LxCLKD1–0 for the link ports). Switching Characteristics specify how the processor changes its signals. Circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given circumstance. Use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices. Note the following definitions of various clock periods that are a function of CLKIN and the appropriate ratio control: • tCCLK = (tCK) / CR • tLCLK = (tCCLK) ⴛ LR • tSCLK = (tCCLK) ⴛ SR Where: • • • • • • • LCLK = Link Port Clock SCLK = Serial Port Clock tCK = CLKIN Clock Period tCCLK = (Processor) Core Clock Period tLCLK = Link Port Clock Period tSCLK = Serial Port Clock Period CR = Core/CLKIN Ratio (2, 3, or 4:1, determined by CLK_CFG3–0 at reset) • LR = Link Port/Core Clock Ratio (1, 2, 3, or 4:1, determined by LxCLKD) • SR = Serial Port/Core Clock Ratio (wide range, determined by ⴛCLKDIV) Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, it is not meaningful to add parameters to derive longer times. See Figure 32 under Test Conditions for voltage reference levels. REV. 0 –15– ADSP-21160M Clock Input Table 4. Clock Input 80 MHz Parameter Timing Requirements: CLKIN Period tCK tCKL CLKIN Width Low tCKH CLKIN Width High tCKRF CLKIN Rise/Fall (0.4V–2.0V) Min Max 25 10.5 10.5 80 40 40 3 Unit ns ns ns ns , , ! , Figure 10. Clock Input Reset Table 5. Reset Parameter Min Timing Requirements: RESET Pulsewidth Low1 tWRST tSRST RESET Setup Before CLKIN High2 4tCK 8 Max Unit ns ns 1 Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 ms while RESET is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator). 2 Only required if multiple ADSP-21160Ms must come out of reset synchronous to CLKIN with program counters (PC) equal. Not required for multiple ADSP-21160Ms communicating over the shared bus (through the external port), because the bus arbitration logic automatically synchronizes itself after reset. ,( , Figure 11. Reset –16– REV. 0 ADSP-21160M Interrupts Table 6. Interrupts 1 2 Parameter Min Timing Requirements: IRQ2–0 Setup Before CLKIN High1 tSIR tHIR IRQ2–0 Hold After CLKIN High1 tIPW IRQ2–0 Pulsewidth2 6 0 2+tCK Max Unit ns ns ns Only required for IRQx recognition in the following cycle. Applies only if tSIR and tHIR requirements are not met. , , ! % $ , ( Figure 12. Interrupts Timer Table 7. Timer Parameter Min Max Unit Switching Characteristic: CLKIN High to TIMEXP tDTEX 1 7 ns , , Figure 13. Timer REV. 0 –17– ADSP-21160M Flags Table 8. Flags Parameter Min Timing Requirements: FLAG3–0 IN Setup Before CLKIN High1 tSFI tHFI FLAG3–0 IN Hold After CLKIN High1 tDWRFI FLAG3–0 IN Delay After RDx/WRx Low1 tHFIWR FLAG3–0 IN Hold After RDx/WRx Deasserted1 Switching Characteristics: FLAG3–0 OUT Delay After CLKIN High tDFO FLAG3–0 OUT Hold After CLKIN High tHFO tDFOE CLKIN High to FLAG3–0 OUT Enable tDFOD CLKIN High to FLAG3–0 OUT Disable 1 Max 4 1 Unit ns ns ns ns 12 0 9 ns ns ns ns 1 1 5 Flag inputs meeting these setup and hold times for instruction cycle N will affect conditional instructions in instruction cycle N+2. , " , " , " , " , !" " $ # " # # , " , ! " " $ , ( " , !" ( @ ( " # Figure 14. Flags –18– REV. 0 ADSP-21160M Memory Read—Bus Master Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) without reference to CLKIN. These specifications apply when the ADSP-21160M is the bus master accessing external memory space in asynchronous access mode. Note that timing for ACK, DATA, RDx, WRx, and DMAG strobe timing parameters only applies to asynchronous access mode. Table 9. Memory Read—Bus Master Parameter Min Max Unit Timing Requirements: Address, CIF, Selects Delay to Data tCK – 0.25tCCLK – 11+W tDAD Valid1,2 RDx Low to Data Valid1,3 0.75tCK – 11+W tDRLD tHDA Data Hold from Address, Selects4 0 tSDS Data Setup to RDx High1 8 tHDRH Data Hold from RDx High3,4 1 tDAAK ACK Delay from Address, Selects2,5 tCK – 0.5tCCLK – 12+W ACK Delay from RDx Low3,5 tCK – 0.75tCCLK – 11+W tDSAK tSAKC ACK Setup to CLKIN3,5 0.5tCCLK +3 tHAKC ACK Hold After CLKIN3 1 Switching Characteristics: Address, CIF, Selects Hold After RDx 0.25tCCLK – 1+H tDRHA High3 tDARL Address, CIF, Selects to RDx Low2 0.25tCCLK – 3 tRW RDx Pulse width3 tCK – 0.5tCCLK – 1+W RDx High to WRx, RDx, DMAGx Low3 0.5tCCLK – 1+HI tRWR W = (number of wait states specified in WAIT register) ⴛ tCK. HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0). H = tCK (if an address hold cycle occurs as specified in WAIT register; otherwise H = 0). 1 ns ns ns ns ns ns ns ns ns ns ns ns ns Data Delay/Setup: User must meet tDAD, tDRLD, or tSDS. The falling edge of MSx, BMS is referenced. 3 Note that timing for ACK, DATA, RDx, WRx, and DMAG strobe timing parameters only applies to asynchronous access mode. 4 Data Hold: User must meet tHDA or tHDRH in asynchronous access mode. See Example System Hold Time Calculation on page 44 for the calculation of hold times given capacitive and dc loads. 5 ACK Delay/Setup: User must meet tDAAK, tDSAK, or tSAKC for deassertion of ACK (Low), all three specifications must be met for assertion of ACK (High). 2 @" , , ! , ( , , , , ! ! , , ( , , , ! ( @ Figure 15. Memory Read—Bus Master REV. 0 , ! –19– ADSP-21160M Memory Write—Bus Master Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) without reference to CLKIN. These specifications apply when the ADSP-21160M is the bus master accessing external memory space in asynchronous access mode. Note that timing for ACK, DATA, RDx, WRx, and DMAG strobe timing parameters only applies to asynchronous access mode. Table 10. Memory Write—Bus Master Parameter Min Max Timing Requirements: ACK Delay from Address, Selects1,2 tCK – 0.5tCCLK–12+W tDAAK tDSAK ACK Delay from WRx Low1,3 tCK – 0.75tCCLK – 11+W ACK Setup to CLKIN1,3 0.5tCCLK +3 tSAKC tHAKC ACK Hold After CLKIN1,3 1 Switching Characteristics: Address, CIF, Selects to WRx tCK – 0.25tCCLK – 3+W tDAWH Deasserted2,3 tDAWL Address, CIF, Selects to WRx Low2 0.25tCCLK – 3 tWW WRx Pulse width3 tCK – 0.5tCCLK – 1+W Data Setup before WRx High3 tCK – 0.25tCCLK – 12.5+W tDDWH tDWHA Address Hold after WRx Deasserted3 0.25tCCLK – 1+H tDWHD Data Hold after WRx Deasserted3 0.25tCCLK – 1+H tDATRWH Data Disable after WRx Deasserted3,4 0.25tCCLK – 2+H 0.25tCCLK+2+H tWWR WRx High to WRx, RDx, DMAGx 0.5tCCLK – 1+HI Low3 tDDWR Data Disable before WRx or RDx Low 0.25tCCLK – 1+I tWDE WRx Low to Data Enabled –0.25tCCLK – 1 W = (number of wait states specified in WAIT register) × tCK. H = tCK (if an address hold cycle occurs, as specified in WAIT register; otherwise H = 0). HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0). I = tCK (if a bus idle cycle occurs, as specified in WAIT register; otherwise I = 0). Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 ACK Delay/Setup: User must meet tDAAK or tDSAK or tSAKC for deassertion of ACK (Low), all three specifications must be met for assertion of ACK (High). The falling edge of MSx, BMS is referenced. 3 Note that timing for ACK, DATA, RDx, WRx, and DMAG strobe timing parameters only applies to asynchronous access mode. 4 See Example System Hold Time Calculation on page 44 for calculation of hold times given capacitive and dc loads. 2 –20– REV. 0 ADSP-21160M @ @ " , ( ! , ( , ( ! ,( ( ( , ( , ( ! , ( ! , , ( ! , , , ! @ Figure 16. Memory Write—Bus Master REV. 0 –21– ,( ( , ( ADSP-21160M Synchronous Read/Write—Bus Master Use these specifications for interfacing to external memory systems that require CLKIN—relative timing or for accessing a slave ADSP-21160M (in multiprocessor memory space). These synchronous switching characteristics are also valid during asynchronous memory reads and writes except where noted (see Memory Read—Bus Master on page 19 and Memory Write—Bus Master on page 20). When accessing a slave ADSP-21160M, these switching characteristics must meet the slave’s timing requirements for synchronous read/writes (see Synchronous Read/Write—Bus Slave on page 24). The slave ADSP-21160M must also meet these (bus master) timing requirements for data and acknowledge setup and hold times. Table 11. Synchronous Read/Write—Bus Master Parameter Min Timing Requirements: Data Setup Before CLKIN1 tSSDATI tHSDATI Data Hold After CLKIN1 tSACKC ACK Setup Before CLKIN1 tHACKC ACK Hold After CLKIN1 Switching Characteristics: tDADDO Address, MSx, BMS, BRST, CIF Delay After CLKIN tHADDO Address, MSx, BMS, BRST, CIF Hold After CLKIN tDPGO PAGE Delay After CLKIN tDRDO RDx High Delay After CLKIN1 tDWRO WRx High Delay After CLKIN1 tDRWL RDx/WRx Low Delay After CLKIN tDDATO Data Delay After CLKIN tHDATO Data Hold After CLKIN tDACKMO ACK Delay After CLKIN2 tACKMTR ACK Disable Before CLKIN2 tDCKOO CLKOUT Delay After CLKIN tCKOP CLKOUT Period CLKOUT Width High tCKWH tCKWL CLKOUT Width Low Max 5.5 1 0.5tCCLK +3 1 ns ns ns ns 10 1.5 1.5 0.25tCCLK – 1 0.25tCCLK – 1 0.25tCCLK – 1 1.5 0.25tCCLK +3 0.25tCCLK – 3 2 tCK – 1 tCK/2 – 2 tCK/2 – 2 Unit 11 0.25tCCLK+9 0.25tCCLK +9 0.25tCCLK +9 12.5 0.25tCCLK +9 5 tCK3 +1 tCK/2+23 tCK/2+23 ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 Note that timing for ACK, DATA, RDx, WRx, and DMAG strobe timing parameters only applies to synchronous access mode. Applies to broadcast write, master precharge of ACK. 3 Applies only when the DSP drives a bus operation; CLKOUT held inactive or three-state otherwise, For more information, see the System Design chapter in the ADSP-2116x SHARC DSP Hardware Reference. 2 –22– REV. 0 ADSP-21160M , , ( ! , , ( # , , ! @ @ " , , ! , , , # , ( , , , ! ( , ( , ( ( , ! , # Figure 17. Synchronous Read/Write—Bus Master REV. 0 –23– ADSP-21160M Synchronous Read/Write—Bus Slave Use these specifications for ADSP-21160M bus master accesses of a slave’s IOP registers or internal memory (in multiprocessor memory space). The bus master must meet these (bus slave) timing requirements. Table 12. Synchronous Read/Write—Bus Slave Parameter Min Timing Requirements: Address, BRST Setup Before CLKIN tSADDI tHADDI Address, BRST Hold After CLKIN RDx/WRx Setup Before CLKIN tSRWI tHRWI RDx/WRx Hold After CLKIN tSSDATI Data Setup Before CLKIN tHSDATI Data Hold After CLKIN Switching Characteristics: Data Delay After CLKIN tDDATO tHDATO Data Hold After CLKIN tDACKC ACK Delay After CLKIN ACK Hold After CLKIN tHACKO Max 5 1 5 1 5.5 1 ns ns ns ns ns ns 12.5 1.5 10 1.5 –24– Unit ns ns ns ns REV. 0 ADSP-21160M , , ! , ! , , ( , ! ( , ! , # ( , ! ( , ( ( , Figure 18. Synchronous Read/Write—Bus Slave REV. 0 –25– , ! ADSP-21160M Multiprocessor Bus Request and Host Bus Request Use these specifications for passing of bus mastership between multiprocessing ADSP-21160Ms (BRx) or a host processor (HBR, HBG). Table 13. Multiprocessor Bus Request and Host Bus Request Parameter Min Timing Requirements: HBG Low to RDx/WRx/CS Valid tHBGRCSV HBR Setup Before CLKIN1 tSHBRI tHHBRI HBR Hold After CLKIN1 tSHBGI HBG Setup Before CLK/=’]IN tHHBGI HBG Hold After CLKIN High tSBRI BRx, PA Setup Before CLKIN tHBRI BRx, PA Hold After CLKIN High tSPAI PA Setup Before CLKIN tHPAI PA Hold After CLKIN High tSRPBAI RPBA Setup Before CLKIN tHRPBAI RPBA Hold After CLKIN Switching Characteristics: tDHBGO HBG Delay After CLKIN tHHBGO HBG Hold After CLKIN tDBRO BRx Delay After CLKIN tHBRO BRx Hold After CLKIN tDPASO PA Delay After CLKIN, Slave tTRPAS PA Disable After CLKIN, Slave tDPAMO PA Delay After CLKIN, Master tPATR PA Disable Before CLKIN, Master tDRDYCS REDY (O/D) or (A/D) Low from CS and HBR Low2 REDY (O/D) Disable or REDY (A/D) High from HBG2 tTRDYHG tARDYTR REDY (A/D) Disable from CS or HBR High2 Max Unit 19 ns ns ns ns ns ns ns ns ns ns ns 7 ns ns ns ns ns ns ns ns ns ns ns 6 1 6 1 9 1 9 1 6 2 2 8 1.5 8 1.5 0.25tCCLK +9 0.25tCCLK – 5 0.5tCK tCK +25 11 1 Only required for recognition in the current cycle. 2 (O/D) = open drain, (A/D) = active drive. –26– REV. 0 ADSP-21160M , ! , ! ! ! , ! , !! ! # , , ! # , , # , , # , ! , !! ! , , ! , , ! , , ! ! , ! , , , ! ! # ( = @ = Figure 19. Multiprocessor Bus Request and Host Bus Request REV. 0 –27– ADSP-21160M is returned by the ADSP-21160M, the host can drive the RDx and WRx pins to access the ADSP-21160M’s internal memory or IOP registers. HBR and HBG are assumed low for this timing Asynchronous Read/Write—Host to ADSP-21160M Use these specifications (Table 14 and Table 15) for asynchronous host processor accesses of an ADSP-21160M, after the host has asserted CS and HBR (low). After HBG Table 14. Read Cycle Parameter Min Timing Requirements: Address Setup/CS Low Before RDx Low tSADRDL tHADRDH Address Hold/CS Hold Low After RDx tWRWH RDx/WRx High Width tDRDHRDY RDx High Delay After REDY (O/D) Disable RDx High Delay After REDY (A/D) Disable tDRDHRDY Switching Characteristics: Data Valid Before REDY Disable from Low tSDATRDY tDRDYRDL REDY (O/D) or (A/D) Low Delay After RDx Low tRDYPRD REDY (O/D) or (A/D) Low Pulsewidth for Read tHDARWH Data Disable After RDx High Max 0 2 5 0 0 Unit ns ns ns ns ns 2 10 tCK 2 6 ns ns ns ns , , ! ! ,( ( ! , ! ( ! # , , , ! , Figure 20. Read Cycle (Asynchronous Read—Host to ADSP-21160M) –28– REV. 0 ADSP-21160M Table 15. Write Cycle Parameter Min Timing Requirements: CS Low Setup Before WRx Low tSCSWRL tHCSWRH CS Low Hold After WRx High tSADWRH Address Setup Before WRx High tHADWRH Address Hold After WRx High WRx Low Width tWWRL tWRWH RDx/WRx High Width tDWRHRDY WRx High Delay After REDY (O/D) or (A/D) Disable tSDATWH Data Setup Before WRx High tHDATWH Data Hold After WRx High Switching Characteristics: REDY (O/D) or (A/D) Low Delay After WRx/CS Low tDRDYWRL tRDYPWR REDY (O/D) or (A/D) Low Pulsewidth for Write Max 0 0 6 2 7 5 0 5 4 ns ns ns ns ns ns ns ns ns 11 12 ( , ( ! , ( , ! ( ! , ! ( ! , ( ( ,( ( ! ( , ! ( ! , ( ! , ( , ( , ( ! = @ = Figure 21. Write Cycle (Asynchronous Write—Host to ADSP-21160M) REV. 0 –29– Unit ns ns ADSP-21160M Three-State Timing—Bus Master and Bus Slave These specifications show how the memory interface is disabled (stops driving) or enabled (resumes driving) relative to CLKIN and the SBTS pin. This timing is applicable to bus master transition cycles (BTC) and host transition cycles (HTC) as well as the SBTS pin. Table 16. Three-State Timing—Bus Slave, HBR, SBTS Parameter Timing Requirements: tSTSCK SBTS Setup Before CLKIN tHTSCK SBTS Hold After CLKIN Switching Characteristics: Address/Select Enable After CLKIN tMIENA tMIENS Strobes Enable After CLKIN1 tMIENHG HBG Enable After CLKIN tMITRA Address/Select Disable After CLKIN tMITRS Strobes Disable After CLKIN1 HBG Disable After CLKIN tMITRHG tDATEN Data Enable After CLKIN2 tDATTR Data Disable After CLKIN2 tACKEN ACK Enable After CLKIN2 tACKTR ACK Disable After CLKIN2 tCDCEN CLKOUT Enable After CLKIN tCDCTR CLKOUT Disable After CLKIN tMTRHBG Memory Interface Disable Before HBG Low3 tMENHBG Memory Interface Enable After HBG High3 Min Max 6 1 Unit ns ns 1.5 1.5 1.5 0.25tCCLK – 1 0.25tCCLK – 4 3.5 1.5 1.5 1.5 1.5 1.5 tCCLK – 3 tCK – 6 9 9 9 0.25tCCLK +4 0.25tCCLK 8 10 5 9 5 9 tCCLK +1 tCK +2 ns ns ns ns ns ns ns ns ns ns ns ns ns tCK – 5 tCK +5 ns 1 Strobes = RDx, WRx, DMAGx. In addition to bus master transition cycles, these specs also apply to bus master and bus slave synchronous read/write. 3 Memory Interface = Address, RDx, WRx, MSx, PAGE, DMAGx, and BMS (in EPROM boot mode). 2 –30– REV. 0 ADSP-21160M , , ! , @, @, ! , @ , @, ! " , , , , , , # ! , ! , ! " " = @ @( @ @"@! @ @ B Figure 22. Three-State Timing—Bus Slave, HBR, SBTS REV. 0 –31– ADSP-21160M DMA Handshake These specifications describe the three DMA handshake modes. In all three modes DMAR is used to initiate transfers. For handshake mode, DMAG controls the latching or enabling of data externally. For external handshake mode, the data transfer is controlled by the ADDR31–0, RDx, WRx, PAGE, MS3–0, ACK, and DMAG signals. For Paced Master mode, the data transfer is controlled by ADDR31–0, RDx, WRx, MS3–0, and ACK (not DMAG). For Paced Master mode, the Memory Read-Bus Master, Memory Write-Bus Master, and Synchronous Read/Write-Bus Master timing specifications for ADDR31–0, RDx, WRx, MS3–0, PAGE, DATA63–0, and ACK also apply. Table 17. DMA Handshake Parameter Min Max Timing Requirements: DMARx Setup Before CLKIN1 3 tSDRC tWDR DMARx Width Low (Nonsynchronous)2 tCCLK +4.5 tSDATDGL Data Setup After DMAGx Low3 0.75tCK – 7 tHDATIDG Data Hold After DMAGx High 2 tDATDRH Data Valid After DMARx High3 tCK +10 tDMARLL DMARx Low Edge to Low Edge4 tCK tDMARH DMARx Width High2 tCCLK +4.5 Switching Characteristics: tDDGL DMAGx Low Delay After CLKIN 0.25tCCLK +1 0.25tCCLK +9 tWDGH DMAGx High Width 0.5tCCLK – 1+HI tWDGL DMAGx Low Width tCK – 0.5tCCLK – 1 tHDGC DMAGx High Delay After CLKIN tCK – 0.25tCCLK +1.5 tCK – 0.25tCCLK +9 tVDATDGH Data Valid Before DMAGx High5 tCK – 0.25tCCLK – 8 tCK – 0.25tCCLK +5 tDATRDGH Data Disable After DMAGx High6 0.25tCCLK – 3 0.25tCCLK +1.5 tDGWRL WRx Low Before DMAGx Low –1.5 2 tDGWRH DMAGx Low Before WRx High tCK – 0.5tCCLK – 2 +W tDGWRR WRx High Before DMAGx High7 –1.5 2 tDGRDL RDx Low Before DMAGx Low –1.5 2 tDRDGH RDx Low Before DMAGx High tCK – 0.5tCCLK –2+W RDx High Before DMAGx High7 –1.5 2 tDGRDR tDGWR DMAGx High to WRx, RDx, DMAGx 0.5tCCLK – 2+HI Low Address/Select Valid to DMAGx High 18 tDADGH tDDGHA Address/Select Hold after DMAGx High 1 W = (number of wait states specified in WAIT register) ⴛ tCK. HI = tCK (if data bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0). Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 Only required for recognition in the current cycle. Maximum throughput using DMARx/DMAGx handshaking equals tWDR + tDMARH = (tCCLK +4.5) + (tCCLK +4.5)=34ns (29.4 MHz). This throughput limit applies to non-synchronous access mode only. 3 tSDATDGL is the data setup requirement if DMARx is not being used to hold off completion of a write. Otherwise, if DMARx low holds off completion of the write, the data can be driven tDATDRH after DMARx is brought high. 4 Use tDMARLL if DMARx transitions synchronous with CLKIN. Otherwise, use tWDR and tDMARH. 5 tVDATDGH is valid if DMARx is not being used to hold off completion of a read. If DMARx is used to prolong the read, then tVDATDGH = tCK – .25tCCLK – 8 + (n × tCK) where n equals the number of extra cycles that the access is prolonged. 6 See Example System Hold Time Calculation on page 44 for calculation of hold times given capacitive and dc loads. 7 This parameter applies for synchronous access mode only. 2 –32– REV. 0 ADSP-21160M , , , , ( , ! , ! , ,( ,( ! " ( , ! , ! " , ! , , ! " " ( D ! ! , ( , ( ! ( , ( , , , ! , ! D # @ ( # @ ! # ( # " " $@ @( @ $ ! B Figure 23. DMA Handshake Timing REV. 0 –33– , ! ADSP-21160M Link Ports Calculation of link receiver data setup and hold relative to link clock is required to determine the maximum allowable skew that can be introduced in the transmission path between LDATA and LCLK. Setup skew is the maximum delay that can be introduced in LDATA relative to LCLK (setup skew = tLCLKTWH Min – tDLDCH – tSLDCL). Hold skew is the maximum delay that can be introduced in LCLK relative to LDATA (hold skew = tLCLKTWL Min – tHLDCH – tHLDCL). Calculations made directly from speed specifications will result in unrealistically small skew times because they include multiple tester guardbands. Table 18. Link Port—Maximum Data Throughput for Transmit/Receive Pairs (Continued) Transmit Link Port Receive Link Port Maximum Operating Frequency (MHz) 2 0 1 2 3 4 5 0 1 2 3 4 5 0 1 2 3 4 5 0 1 2 3 4 5 68.97 71.43 71.43 80 76.92 74.07 64.52 66.67 66.67 71.43 71.43 71.43 64.52 66.67 66.67 74.07 74.07 71.43 62.5 66.67 64.52 71.43 71.43 71.43 3 Note that there is a two-cycle effect latency between the link port enable instruction and the DSP enabling the link port. Maximum throughput varies across link port transmit/receive pairs. Table 18 shows maximum throughput for all transmit/receive pairs based on setup skew of 0.5 ns (setup skew=tLCLKTWH min–tDLDCH –tSLDCL =0.5 ns). Hold skew results indicate 80 MHz operation across all link ports. All hold time skews are equal to 0.5 ns or greater for all link port transmit/receive pairs at 80 MHz. Based upon these values, all link port transmit/receive pairs can be operated at maximum throughput for LxCLK:CCLK ratios of 2:1, 3:1, and 4:1 at 80 MHz CCLK. To operate all link port transmit/receive pairs at LxCLK:CCLK ratio of 1:1, the core clock frequency must be no greater than 62.5 MHz. 4 5 Maximum data throughput values are based upon the reset value of the LAR Link Port Assignment Register (Link Buffer 0 assigned to Link Port 0, Link Buffer 1 assigned to Link Port 1, etc.). Throughputs are not guaranteed for LAR settings other than the reset LAR value. For additional details on LAR, refer to the ADSP-21160 DSP Hardware Reference manual. Table 18. Link Port—Maximum Data Throughput for Transmit/Receive Pairs Transmit Link Port Receive Link Port Maximum Operating Frequency (MHz) 0 0 1 2 3 4 5 0 1 2 3 4 5 71.43 74.07 71.43 80 80 76.92 68.97 71.43 68.97 80 76.92 74.07 1 –34– REV. 0 ADSP-21160M Table 19. Link Ports—Receive Parameter Min Timing Requirements: Data Setup Before LCLK Low tSLDCL tHLDCL Data Hold After LCLK Low tLCLKIW LCLK Period tLCLKRWL LCLK Width Low LCLK Width High tLCLKRWH Switching Characteristics: LACK Low Delay After LCLK High1 tDLALC 1 Max 2.5 2.5 tLCLK 6.0 6.0 ns ns ns ns ns 12 17 LACK goes low with tDLALC relative to rise of LCLK after first nibble, but doesn’t go low if the receiver’s link buffer is not about to fill. , ( , ( ! , ( , ! , 'E , # Figure 24. Link Ports—Receive REV. 0 –35– Unit ns ADSP-21160M Table 20. Link Ports—Transmit Parameter Min Timing Requirements: LACK Setup Before LCLK High tSLACH tHLACH LACK Hold After LCLK High Switching Characteristics: Data Delay After LCLK High tDLDCH tHLDCH Data Hold After LCLK High tLCLKTWL LCLK Width Low LCLK Width High tLCLKTWH tDLACLK LCLK Low Delay After LACK High Max Unit 14 –2 ns ns 6.0 –2 0.5tLCLK – 1.5 0.5tLCLK – 1.5 0.5tLCLK +5 0.5tLCLK +1.5 0.5tLCLK +1.5 3tLCLK +11 ns ns ns ns ns , ( ! , ( " ! ! , ! , ! ! 'E # , ! , ! ! , ! , ! % # ! " " ! " B Figure 25. Link Ports—Transmit –36– REV. 0 ADSP-21160M Serial Ports To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) SCLK width. Table 21. Serial Ports—External Clock 1 2 Parameter Min Timing Requirements: TFS/RFS Setup Before TCLK/RCLK1 tSFSE tHFSE TFS/RFS Hold After TCLK/RCLK1,2 tSDRE Receive Data Setup Before RCLK1 tHDRE Receive Data Hold After RCLK1 tSCLKW TCLK/RCLK Width tSCLK TCLK/RCLK Period 3.5 4 1.5 4 14 2tCCLK Max Unit ns ns ns ns ns ns Referenced to sample edge. RFS hold after RCK when MCE = 1, MFD = 0 is 0 ns minimum from drive edge. TFS hold after TCK for late external TFS is 0 ns minimum from drive edge. Table 22. Serial Ports—Internal Clock 1 2 Parameter Min Timing Requirements: TFS Setup Before TCLK1; RFS Setup Before RCLK1 tSFSI TFS/RFS Hold After TCLK/RCLK1,2 tHFSI tSDRI Receive Data Setup Before RCLK1 tHDRI Receive Data Hold After RCLK1 8 1 6.5 3 Max Unit ns ns ns ns Referenced to sample edge. RFS hold after RCK when MCE = 1, MFD = 0 is 0 ns minimum from drive edge. TFS hold after TCK for late external TFS is 0 ns minimum from drive edge. Table 23. Serial Ports—External or Internal Clock 1 Parameter Min Switching Characteristics: RFS Delay After RCLK (Internally Generated RFS)1 tDFSE tHOFSE RFS Hold After RCLK (Internally Generated RFS)1 3 Max Unit 13 ns ns Max Unit 13 ns ns ns ns Referenced to drive edge. Table 24. Serial Ports—External Clock 1 Parameter Min Switching Characteristics: TFS Delay After TCLK (Internally Generated TFS)1 tDFSE tHOFSE TFS Hold After TCLK (Internally Generated TFS)1 tDDTE Transmit Data Delay After TCLK1 tHDTE Transmit Data Hold After TCLK1 3 16 0 Referenced to drive edge. Table 25. Serial Ports—Internal Clock Parameter Min Switching Characteristics: tDFSI TFS Delay After TCLK (Internally Generated TFS)1 tHOFSI TFS Hold After TCLK (Internally Generated TFS)1 –1.5 REV. 0 –37– Max Unit 4.5 ns ns ADSP-21160M Table 25. Serial Ports—Internal Clock (Continued) Parameter tDDTI tHDTI tSCLKIW 1 Min 1 Transmit Data Delay After TCLK Transmit Data Hold After TCLK1 TCLK/RCLK Width Max Unit 7.5 0 0.5tSCLK – 2.5 0.5tSCLK +2 ns ns ns Min Max Unit Referenced to drive edge. Table 26. Serial Ports—Enable and Three-State Parameter Switching Characteristics: Data Enable from External TCLK1 tDDTEN tDDTTE Data Disable from External TCLK1 tDDTIN Data Enable from Internal TCLK1 tDDTTI Data Disable from Internal TCLK1 1 4 10 0 3 ns ns ns ns Referenced to drive edge. –38– REV. 0 ADSP-21160M F F , ( , ( , " , " , " , ! " , ! " , !" " , " , ! " , , ! " , ! , E ! ! " " @ # ! B F F , ( , ( , " , " , ! " , " , !" , ! " " , " " , , , ! , ! E ! ! " " @ # ! B , , , , Figure 26. Serial Ports REV. 0 –39– , ! " ADSP-21160M Table 27. Serial Ports—External Late Frame Sync Parameter Min Switching Characteristics: Data Delay from Late External TFS or External RFS with tDDTLFSE MCE = 1, MFD = 01 tDDTENFS Data Enable from late FS or MCE = 1, MFD = 01 1 1.0 Max Unit 13 ns ns MCE = 1, TFS enable and TFS valid follow tDDTLFSE and tDDTENFS. " ( ! = @ " = , " , ! " " , , " , ! , " " , " , ! " " , " , , ! , " Figure 27. External Late Frame Sync –40– REV. 0 ADSP-21160M JTAG Test Access Port and Emulation Table 28. JTAG Test Access Port and Emulation Parameter Min Timing Requirements: TCK Period tTCK tSTAP TDI, TMS Setup Before TCK High tHTAP TDI, TMS Hold After TCK High tSSYS System Inputs Setup Before TCK Low1 System Inputs Hold After TCK Low1 tHSYS tTRSTW TRST Pulsewidth Switching Characteristics: TDO Delay from TCK Low tDTDO tDSYS System Outputs Delay After TCK Low2 Max tCK 5 6 7 18 4tCK Unit ns ns ns ns ns ns 13 30 1 ns ns System Inputs = DATA63–0, ADDR31–0, RDx, WRx, ACK, SBTS, HBR, HBG, CS, DMAR1, DMAR2, BR6–1, ID2–0, RPBA, IRQ2–0, FLAG3–0, PA, BRST, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT7–0, LxCLK, LxACK, EBOOT, LBOOT, BMS, CLKIN, RESET. 2 System Outputs = DATA63–0, ADDR31–0, MS3–0, RDx, WRx, ACK, PAGE, CLKOUT, HBG, REDY, DMAG1, DMAG2, BR6–1, PA, BRST, CIF, FLAG3–0, TIMEXP, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT7–0, LxCLK, LxACK, BMS. , , , ! , , # , # # Figure 28. IEEE 11499.1 JTAG Test Access Port REV. 0 –41– , ! ADSP-21160M Output Drive Currents Figure 29 shows typical I–V characteristics for the output drivers of the ADSP-21160M. The curves represent the current drive capability of the output drivers as a function of output voltage. # #$1 =B ' @G ) =B@ *G =B @)*G $ $ =B ' @G $ =B@ *G $) =B @)*G $ $ B* B* B* # $ B* Figure 29. ADSP-21160M Typical Drive Currents Power Dissipation Total power dissipation has two components, one due to internal circuitry and one due to the switching of external output drivers. Internal power dissipation is dependent on the instruction execution sequence and the data operands involved. Using the current specifications (IDDINPEAK, IDDINHIGH, IDDINLOW, IDDIDLE) from Electrical Characteristics on page 13 and the current-versus-operation information in Table 29, engineers can estimate the ADSP-21160M’s internal power supply (VDDINT) input current for a specific application, according to the following formula: % Peak × IDDINPEAK % High × I DDINHIGH % Low × I DDINLOW + % Idle × I DDIDLE -------------------------------------------------I DDINT The external component of total power dissipation is caused by the switching of output pins. Its magnitude depends on: • • • • the number of output pins that switch during each cycle (O) the maximum frequency at which they can switch (f) their load capacitance (C) their voltage swing (VDD) and is calculated by: PEXT = O × C × VDD2 × f –42– REV. 0 ADSP-21160M The load capacitance should include the processor’s package capacitance (CIN). The switching frequency includes driving the load high and then back low. Address and data pins can drive high and low at a maximum rate of 1/(2tCK). The write strobe can switch every cycle at a frequency of 1/tCK. Select pins switch at 1/(2tCK), but selects can switch on each cycle. Table 29. ADSP-21160M Operation Types vs. Input Current Operation Peak Activity1 High Activity1 Low Activity1 Instruction Type Instruction Fetch Core Memory Access2 Multifunction Cache 2 per tCK cycle (DMⴛ64 and PMⴛ64) 1 per 2 tCCLK cycles 1 per external port cycle (ⴛ64) Worst case Multifunction Internal Memory 1 per tCK cycle (DMⴛ64) 1 per 2 tCCLK cycles 1 per external port cycle (ⴛ64) Random Single Function Internal Memory None Internal Memory DMA External Memory DMA Data bit pattern for core memory access and DMA 1 None None N/A Peak Activity=IDDINPEAK, High Activity=IDDINHIGH, and Low Activity=IDDINLOW. The state of the PEYEN bit (SIMD versus SISD mode) does not influence these calculations. 2 These assume a 2:1 core clock ratio. For more information on ratios and clocks (tCK and tCCLK), see the timing ratio definitions on page 15. REV. 0 –43– ADSP-21160M • External data memory writes occur every other cycle, a rate of 1/(4 tCK), with 50% of the pins switching • The bus cycle time is 40 MHz (tCK = 25 ns). Example: Estimate PEXT with the following assumptions: • A system with one bank of external data memory—asynchronous RAM (64-bit) • Four 64K × 16 RAM chips are used, each with a load of 10 pF The PEXT equation is calculated for each class of pins that can drive: Table 30. External Power Calculations (3.3 V Device) Pin Type # of Pins % Switching ×C ×f × VDD2 = PEXT Address MS0 WRx Data CLKOUT 15 1 2 64 1 50 0 – 50 – × 44.7 pF × 44.7 pF × 44.7 pF × 14.7 pF × 4.7 pF × 12.5 MHz × 12.5 MHz × 25 MHz × 12.5 MHz × 25 MHz × 10.9 V × 10.9 V × 10.9 V × 10.9 V × 10.9 V = 0.046 W = 0.000 W = 0.024 W = 0.064 W = 0.001 W PEXT = 0.135 W A typical power consumption can now be calculated for these conditions by adding a typical internal power dissipation: PTOTAL = PEXT + PINT + PPLL Where: • PEXT is from Table 30 • PINT is IDDINT × 2.5V, using the calculation IDDINT listed in Power Dissipation on page 42 • PPLL is AIDD × 2.5V, using the value for AIDD listed in ABSOLUTE MAXIMUM RATINGS on page 14 Note that the conditions causing a worst-case PEXT are different from those causing a worst-case PINT. Maximum PINT cannot occur while 100% of the output pins are switching from all ones to all zeros. Note also that it is not common for an application to have 100% or even 50% of the outputs switching simultaneously. Test Conditions The test conditions for timing parameters appearing in ADSP-21160M specifications on page 13 include output disable time, output enable time, and capacitive loading. Output Enable Time Output pins are considered to be enabled when they have made a transition from a high impedance state to when they start driving. The output enable time tENA is the interval from when a reference signal reaches a high or low voltage level to when the output has reached a specified high or low trip point, as shown in the Output Enable/Disable diagram (Figure 30). If multiple pins (such as the data bus) are enabled, the measurement value is that of the first pin to start driving. Example System Hold Time Calculation To determine the data output hold time in a particular system, first calculate tDECAY using the equation given above. Choose –V to be the difference between the ADSP-21160M’s output voltage and the input threshold for the device requiring the hold time. A typical –V will be 0.4 V. CL is the total bus capacitance (per data line), and IL is the total leakage or three-state current (per data line). The hold time will be tDECAY plus the minimum disable time (i.e., tDATRWH for the write cycle). Output Disable Time RE F E R E NCE S IG NA L Output pins are considered to be disabled when they stop driving, go into a high impedance state, and start to decay from their output high or low voltage. The time for the voltage on the bus to decay by –V is dependent on the capacitive load, CL and the load current, IL. This decay time can be approximated by the following equation: tDECAY = (CL∆V)/IL The output disable time tDIS is the difference between tMEASURED and tDECAY as shown in Figure 30. The time tMEASURED is the interval from when the reference signal switches to when the output voltage decays –V from the measured output high or output low voltage. tDECAY is calculated with test loads CL and IL, and with –V equal to 0.5 V. t MEASURED t ENA t DIS V OH (MEASURED) V OH (MEASURED) – D V 2.0V V OL (MEASURED) + D V 1.0V V OL (MEASURED) t DECAY O UT P UT S T O PS DR IV IN G O UT P UT S T AR T S DR IV IN G HIG H -IM P E D AN CE S T AT E . T E S T CO ND ITIO N S CA US E T HIS V O L T AG E T O BE A PP R O X IM A TE L Y 1.5V Figure 30. Output Enable/Disable –44– REV. 0 ADSP-21160M *B # # " $ +8 B B* *4" ! B* =B)AHB *B " B =B' HB* *B Figure 31. Equivalent Device Loading for AC Measurements (Includes All Fixtures) # # # B * * $4" * Figure 34. Typical Output Rise Time (10%–90%, VDDEXT = Min) vs. Load Capacitance B* B ## ! $ +8 Figure 32. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) Capacitive Loading Output delays and holds are based on standard capacitive loads: 50 pF on all pins (see Figure 31). The delay and hold specifications given should be derated by a factor of 1.5 ns/50 pF for loads other than the nominal value of 50 pF. Figure 33 and Figure 34 show how output rise time varies with capacitance. Figure 35 graphically shows how output delays and holds vary with load capacitance. (Note that this graph or derating does not apply to output disable delays; see Output Disable Time on page 44.) The graphs of Figure 33, Figure 34, and Figure 35 may not be linear outside the ranges shown. *B B =B)**$B)' *B B $*B * * $4" * Figure 35. Typical Output Delay or Hold vs. Load Capacitance (at Max Case Temperature) B Environmental Conditions The ADSP-21160M is tested for performance over the commercial temperature range, 0°C to 85°C. " $ +8 *B B Thermal Characteristics =B))'HB) *B " B =B'')HBAA *B B * * $4" * The ADSP-21160M is packaged in a 400-ball Plastic Ball Grid Array (PBGA). The ADSP-21160M is specified for a case temperature (TCASE). To ensure that the TCASE data sheet specification is not exceeded, a heatsink and/or an air flow source may be used. Use the center block of ground pins (PBGA balls: H8–13, J8–13, K8–13, L8–13, M8–13, and N8–13) to provide thermal pathways to the printed circuit board’s ground plane. A heatsink should be attached to the ground plane (as close as possible to the thermal pathways) with a thermal adhesive. Figure 33. Typical Output Rise Time (10%–90%, VDDEXT = Max) vs. Load Capacitance REV. 0 –45– ADSP-21160M T CASE = T AMB + ( PD × θ CA ) • TCASE = Case temperature (measured on top surface of package) • PD = Power dissipation in W (this value depends upon the specific application; a method for calculating PD is shown under Power Dissipation). • θCA = Value from Table 31. • θ JB= 6.46°C/W Table 31. Airflow Over Package Versus θCA Airflow (Linear Ft./Min.) θCA (°C/W)1 1 θJC = 3.6 °C/W. 0 12.13 200 9.86 400 8.7 400-BALL METRIC PBGA PIN CONFIGURATIONS Table 32 lists the pin assignments for the PBGA package, and the pin configurations diagram on page 51 shows the pin assignment summary. –46– REV. 0 ADSP-21160M Table 32. 400-ball Metric PBGA Pin Assignments Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# DATA DATA DATA DATA DATA DATA TDI TRST RESET RPBA IRQ0 FLAG1 TIMEXP VDDEXT NC TFS1 RFS1 RCLK0 DT0 L0DAT DATA DATA DATA DATA VDDEXT VDDINT VDDINT VDDINT VDDINT VDDINT GND VDDINT VDDINT VDDINT VDDINT VDDEXT L1DAT L1DAT L1ACK L1DAT A01 A02 A03 A04 A05 A06 A07 A08 A09 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 E01 E02 E03 E04 E05 E06 E07 E08 E09 E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E20 DATA DATA DATA DATA DATA DATA DATA TCK EMU IRQ2 FLAG3 FLAG0 VDDEXT NC DT1 RCLK1 RFS0 TCLK0 L0DAT L0DAT DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L1DAT L1DAT L1DAT L2DAT B01 B02 B03 B04 B05 B06 B07 B08 B09 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 F01 F02 F03 F04 F05 F06 F07 F08 F09 F10 F11 F12 F13 F14 F15 F16 F17 F18 F19 F20 DATA DATA DATA DATA DATA DATA DATA TMS TD0 IRQ1 FLAG2 VDDEXT NC TCLK1 DR1 DR0 L0DAT L0DAT L0ACK L0DAT DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L1DAT L2DAT L2DAT L2CLK C01 C02 C03 C04 C05 C06 C07 C08 C09 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 G01 G02 G03 G04 G05 G06 G07 G08 G09 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 DATA DATA DATA DATA DATA VDDEXT VDDINT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDINT VDDEXT TFS0 L1DAT L0CLK L0DAT L0DAT L1CLK DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L2DAT L2ACK L2DAT L2DAT D01 D02 D03 D04 D05 D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 H01 H02 H03 H04 H05 H06 H07 H08 H09 H10 H11 H12 H13 H14 H15 H16 H17 H18 H19 H20 REV. 0 –47– ADSP-21160M Table 32. 400-ball Metric PBGA Pin Assignments (Continued) Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L2DAT L2DAT HBG HBR NC NC DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L3DAT L3DAT L3DAT L3CLK J01 J02 J03 J04 J05 J06 J07 J08 J09 J10 J11 J12 J13 J14 J15 J16 J17 J18 J19 J20 N01 N02 N03 N04 N05 N06 N07 N08 N09 N10 N11 N12 N13 N14 N15 N16 N17 N18 N19 N20 CLK_CFG_0 DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT BR6 BR5 BR4 BR3 DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT L3DAT L3DAT L3DAT L3ACK K01 K02 K03 K04 K05 K06 K07 K08 K09 K10 K11 K12 K13 K14 K15 K16 K17 K18 K19 K20 P01 P02 P03 P04 P05 P06 P07 P08 P09 P10 P11 P12 P13 P14 P15 P16 P17 P18 P19 P20 CLKIN CLK_CFG_1 AGND CLK_CFG_2 VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT BR2 BR1 ACK REDY DATA DATA DATA DATA VDDEXT VDDINT GND GND GND GND GND GND GND GND GND VDDEXT L4DAT L4DAT L4DAT L3DAT L01 L02 L03 L04 L05 L06 L07 L08 L09 L10 L11 L12 L13 L14 L15 L16 L17 L18 L19 L20 R01 R02 R03 R04 R05 R06 R07 R08 R09 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 AVDD CLK_CFG_3 CLKOUT GND VDDEXT VDDINT GND GND GND GND GND GND GND GND VDDINT VDDEXT PAGE SBTS PA L3DAT DATA DATA DATA DATA VDDEXT VDDINT VDDINT VDDINT VDDINT VDDINT VDDINT VDDINT VDDINT VDDINT VDDINT VDDEXT L4DAT L4ACK L4CLK L4DAT M01 M02 M03 M04 M05 M06 M07 M08 M09 M10 M11 M12 M13 M14 M15 M16 M17 M18 M19 M20 T01 T02 T03 T04 T05 T06 T07 T08 T09 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 –48– REV. 0 ADSP-21160M Table 32. 400-ball Metric PBGA Pin Assignments (Continued) Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# Pin Name PBGA Pin# DATA DATA ADDR ADDR VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT L5DAT L4DAT L4DAT L4DAT U01 U02 U03 U04 U05 U06 U07 U08 U09 U10 U11 U12 U13 U14 U15 U16 U17 U18 U19 U20 ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ID0 ADDR MS1 CS RDL DMAR2 L5DAT L5DAT L5ACK L5DAT L5DAT V01 V02 V03 V04 V05 V06 V07 V08 V09 V10 V11 V12 V13 V14 V15 V16 V17 V18 V19 V20 ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ID1 ADDR BMS MS2 CIF RDH DMAG2 LBOOT L5DAT L5DAT L5DAT W01 W02 W03 W04 W05 W06 W07 W08 W09 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ADDR ID2 BRST MS0 MS3 WRH WRL DMAG1 DMAR1 EBOOT L5CLK Y01 Y02 Y03 Y04 Y05 Y06 Y07 Y08 Y09 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 Y19 Y20 REV. 0 –49– ADSP-21160M 400-BALL METRIC PBGA PIN CONFIGURATIONS (BOTTOM VIEW, SUMMARY) ) A ' * ) A ' * " ! # ( E D D # ! " # E ! )$@)$@ )$@)$@ )$@ )$ ! ! ( # # 7 # B –50– REV. 0 ADSP-21160M OUTLINE DIMENSIONS The ADSP-21160M comes in a 27mm ⴛ 27mm, 400-ball Metric PBGA package with 20 rows of balls. 400-BALL METRIC PBGA (B-400) 'B 'B % ) ) A ' * A ' * B) " ! # ( B % B B % BA B' B * ! ( ( BA B A B B* B B' B** B* B* E B @ B* ! ! B B " # B B ! # " ! ( ! B " ! B B' BA B B'* B B ! # " ! ( ! B " ! B REV. 0 –51– B* B ADSP-21160M ORDERING GUIDE Part Number1, 2 Case Temperature Range Instruction Rate On-Chip SRAM Operating Voltage ADSP-21160MKB-80 0°C to 85°C 80 MHz 4 Mbit 2.5 INT/3.3 EXT V 1 PRINTED IN U.S.A. C02426–2.5–4/01(0) B = Plastic Ball Grid Array (PBGA) package. 2 See ADSP-21160N data sheet for ordering information for higher-performance derivative. –52– REV. 0 This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.