AD AD9852/PCB

a
CMOS 300 MHz
Complete-DDS
AD9852
FEATURES
300 MHz Internal Clock Rate
Integrated 12-Bit Output DACs
Ultrahigh-Speed, 3 ps RMS Jitter Comparator
Excellent Dynamic Performance: 80 dB SFDR @ 100 MHz
(ⴞ1 MHz) AOUT
4ⴛ to 20ⴛ Programmable Reference Clock Multiplier
Dual 48-Bit Programmable Frequency Registers
Dual 14-Bit Programmable Phase Offset Registers
12-Bit Amplitude Modulation and Programmable
Shaped On/Off Keying Function
Single Pin FSK and PSK Data Interface
Linear or Nonlinear FM Chirp Functions with Single
Pin Frequency “Hold” Function
Frequency-Ramped FSK
<25 ps RMS Total Jitter in Clock Generator Mode
Automatic Bidirectional Frequency Sweeping
SIN(x)/x Correction
Simplified Control Interface
10 MHz Serial, 2-Wire or 3-Wire SPI-Compatible or
100 MHz Parallel 8-Bit Programming
3.3 V Single Supply
Multiple Power-Down Functions
Single-Ended or Differential Input Reference Clock
Small 80-Lead LQFP Packaging
APPLICATIONS
Agile, L.O. Frequency Synthesis
Programmable Clock Generator
FM Chirp Source for Radar and Scanning Systems
Test and Measurement Equipment
Commercial and Amateur RF Exciter
GENERAL DESCRIPTION
The AD9852 digital synthesizer is a highly integrated device
that uses advanced DDS technology, coupled with an internal
high-speed, high-performance D/A converters and a comparator
to form a digitally-programmable agile synthesizer function. When
referenced to an accurate clock source, the AD9852 generates a
highly stable, frequency-phase amplitude-programmable sine
wave output that can be used as an agile L.O. in communications,
radar, and many other applications. The AD9852’s innovative
high-speed DDS core provides 48-bit frequency resolution
(1 microHertz tuning steps). Phase truncation to 17 bits assures
excellent SFDR. The AD9852’s circuit architecture allows the
(continued on page 13)
FUNCTIONAL BLOCK DIAGRAM
DDS
PHASE
ACCUMULATOR
FREQUENCY
ACCUMULATOR
REFERENCE
CLOCK IN
43–203
REF CLK
MULTIPLEXER
PHASE/OFFSET
MODULATION
FSK/BPSK/HOLD
DATA IN
SINE-TO-AMPLITUDE
CONVERTER
300MHz
DIFF/SINGLE
SELECT
DIGITAL
MULTIPLIER
I
BIDIRECTIONAL
I/O UPDATE
12
12-BIT DDS
DAC
12
RAMP-UP/-DOWN
CLOCK/LOGIC
AND
MULTIPLEXER
Q
FREQUENCY TUNING WORD/PHASE WORD
MULTIPLEXER AND RAMP START STOP LOGIC
48-BIT
FREQUENCY
TUNING WORD
INV.
SINC
FILTER
14-BIT PHASE
OFFSET/
MODULATION
DAC RSET
12-BIT
DATA
12-BIT CONTROL
DAC
AD9852
AMPLITUDE
MODULATION
DATA
ANALOG OUT
ANALOG OUT
SHAPED
ON/OFF KEYING
12
ANALOG IN
PROGRAMMING REGISTERS
READ
CLOCK OUT
PROGRAMMABLE RATE
AND UPDATE CLOCKS
I/O PORT BUFFERS
WRITE
COMPARATOR
SERIAL/PARALLEL
SELECT
6-BIT ADDRESS
OR SERIAL
PROGRAMMING
LINES
8-BIT PARALLEL
LOAD
MASTER
RESET
+VS
GND
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 1999
AD9852–SPECIFICATIONS
(VS = 3.3 V ⴞ 5%, RSET = 3.9 k⍀ external reference clock frequency = 30 MHz with
REFCLK Multiplier enabled at 10ⴛ for AD9852ASQ, external reference clock frequency = 20 MHz with REFCLK Multiplier enabled at 10ⴛ for
AD9852AST, unless otherwise noted.)
Parameter
Temp
Test
Level
Min
AD9852ASQ
Typ
Max
FULL
VI
5
300
5
200
MHz
75
300
5
5
50
200
MHz
MHz
%
pF
kΩ
Min
AD9852AST
Typ
Max
Unit
REF CLOCK INPUT CHARACTERISTICS1
Internal Clock Frequency Range
External REF Clock Frequency Range
REFCLK Multiplier Enabled
REFCLK Multiplier Disabled
Duty Cycle
Input Capacitance
Input Impedance
Differential Mode Common-Mode Voltage Range
Minimum Signal Amplitude
Common-Mode Range
VIH (Single-Ended Mode)
VIL (Single-Ended Mode)
FULL
FULL
25°C
25°C
25°C
VI
VI
V
IV
IV
5
5
25°C
25°C
25°C
25°C
IV
IV
IV
IV
800
1.6
2.3
DAC STATIC OUTPUT CHARACTERISTICS
Output Update Speed
Resolution
Sine and Aux. DAC Full-Scale Output Current
Gain Error
Output Offset
Differential Nonlinearity
Integral Nonlinearity
Output Impedance
Voltage Compliance Range
FULL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
I
IV
IV
I
I
I
I
I
I
DAC WIDEBAND SFDR
1 MHz to 20 MHz AOUT
20 MHz to 40 MHz AOUT
40 MHz to 60 MHz AOUT
60 MHz to 80 MHz AOUT
80 MHz to 100 MHz AOUT
100 MHz to 120 MHz AOUT
25°C
25°C
25°C
25°C
25°C
25°C
V
V
V
V
V
V
58
56
52
48
48
50
58
56
52
48
48
dBc
dBc
dBc
dBc
dBc
dBc
DAC NARROWBAND SFDR
10 MHz AOUT (± 1 MHz)
10 MHz AOUT (± 250 kHz)
10 MHz AOUT (± 50 kHz)
41 MHz AOUT (± 1 MHz)
41 MHz AOUT (± 250 kHz)
41 MHz AOUT (± 50 kHz)
119 MHz AOUT (± 1 MHz)
119 MHz AOUT (± 250 kHz)
119 MHz AOUT (± 50 kHz)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V
V
V
V
V
V
V
V
V
83
83
91
82
84
89
71
77
83
83
83
91
82
84
89
71
77
83
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
25°C
25°C
25°C
V
V
V
140
138
142
140
138
142
dBc/Hz
dBc/Hz
dBc/Hz
25°C
25°C
25°C
V
V
V
142
148
152
142
148
152
dBc/Hz
dBc/Hz
dBc/Hz
25°C
25°C
25°C
IV
IV
IV
17
12
10
17
12
10
SysClk Cycles
SysClk Cycles
SysClk Cycles
RESIDUAL PHASE NOISE
(AOUT = 5 MHz, Ext. CLK = 30 MHz,
REFCLK Multiplier Engaged at 10×)
1 kHz Offset
10 kHz Offset
100 kHz Offset
(AOUT = 5 MHz, Ext. CLK = 300 MHz,
REFCLK Multiplier Bypassed)
1 kHz Offset
10 kHz Offset
100 kHz Offset
PIPELINE DELAYS
Phase Accumulator and DDS Core
Inverse Sinc Filter
Digital Multiplier
50
3
100
1.75
50
3
100
1.9
800
1.6
2.3
1.75
1
1
300
5
–6
12
10
0.3
0.6
100
–0.5
–2–
1.9
200
20
+2.25
2
1.25
1.66
5
–6
+1.0
–0.5
12
10
0.3
1
100
20
+2.25
2
1.25
1.66
+1.0
mV p-p
V
V
V
MSPS
Bits
mA
% FS
µA
LSB
LSB
kΩ
V
REV. 0
AD9852
Parameter
Temp
Test
Level
Min
AD9852ASQ
Typ
Max
MASTER RESET DURATION
25°C
IV
10
COMPARATOR INPUT CHARACTERISTICS
Input Capacitance
Input Resistance
Input Current
Hysteresis
25°C
25°C
25°C
25°C
V
IV
I
IV
COMPARATOR OUTPUT CHARACTERISTICS
Logic “1” Voltage, High Z Load
Logic “0” Voltage, High Z Load
Output Power, 50 Ω Load, 120 MHz Toggle Rate
Propagation Delay
Output Duty Cycle Error2
Rise/Fall Time, 5 pF Load
Toggle Rate, High Z Load
Toggle Rate, 50 Ω Load
Output Cycle-to-Cycle Jitter3
FULL
FULL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
VI
VI
I
IV
I
V
IV
IV
IV
COMPARATOR NARROWBAND SFDR
10 MHz (± 1 MHz)
10 MHz (± 250 kHz)
10 MHz (± 50 kHz)
41 MHz (± 1 MHz)
41 MHz (± 250 kHz)
41 MHz (± 50 kHz)
119 MHz (± 1 MHz)
119 MHz (± 250 kHz)
119 MHz (± 50 kHz)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V
V
V
V
V
V
V
V
V
84
84
92
76
82
89
73
73
83
84
84
92
76
82
89
73
73
83
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
CLOCK GENERATOR OUTPUT JITTER4
5 MHz AOUT
40 MHz AOUT
100 MHz AOUT
25°C
25°C
25°C
V
V
V
23
12
7
23
12
7
ps rms
ps rms
ps rms
PARALLEL I/O TIMING CHARACTERISTICS
TASU (Address Setup Time to WR Signal Active)
TADHW (Address Hold Time to WR Signal Inactive)
TDSU (Data Setup Time to WR Signal Inactive)
TDHD (Data Hold Time to WR Signal Inactive)
TWRLOW (WR Signal Minimum Low Time)
TWRHIGH (WR Signal Minimum High Time)
TWR (WR Signal Minimum Period)
TADV (Address to Data Valid Time)
TADHR (Address Hold Time to RD Signal Inactive)
TRDLOV (RD Low-to-Output Valid)
TRDHOZ (RD High-to-Data Three-State)
FULL
FULL
FULL
FULL
FULL
FULL
FULL
FULL
FULL
FULL
FULL
IV
IV
IV
IV
IV
IV
IV
V
IV
IV
IV
4
3
2
0
3
7
10
15
5
SERIAL I/O TIMING CHARACTERISTICS
TPRE (CS Setup Time)
TSCLK (Period of Serial Data Clock)
TDSU (Serial Data Setup Time)
TSCLKPWH (Serial Data Clock Pulsewidth High)
TSCLKPWL (Serial Data Clock Pulsewidth Low)
TDHLD (Serial Data Hold Time)
TDV (Data Valid Time)
FULL
FULL
FULL
FULL
FULL
FULL
FULL
IV
IV
IV
IV
IV
IV
V
30
100
30
40
40
0
CMOS LOGIC INPUTS
Logic “1” Voltage
Logic “0” Voltage
Logic “1” Current
Logic “0” Current
Input Capacitance
25°C
25°C
25°C
25°C
25°C
I
I
IV
IV
V
2.7
Min
AD9852AST
Typ
Max
10
3
500
±1
10
3.10
SysClk Cycles
3
500
±1
10
±5
20
–10
300
375
±1
±5
20
3.10
0.16
9
11
3
±1
2
350
400
0.16
9
+10
–10
300
375
Unit
11
3
±1
2
350
400
3
+10
3
pF
kΩ
µA
mV p-p
V
V
dBm
ns
%
ns
MHz
MHz
ps rms
4
REV. 0
15
4
3
2
0
3
7
10
15
5
15
15
10
15
10
30
100
30
40
40
0
30
2.7
3
–3–
ns
ns
ns
ns
ns
ns
ns
30
0.4
±5
±5
0.4
±5
±5
3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
V
µA
µA
pF
AD9852–SPECIFICATIONS
Parameter
Temp
Test
Level
25°C
25°C
25°C
25°C
25°C
25°C
25°C
I
I
I
I
I
I
I
Min
AD9852ASQ
Typ
Max
Min
AD9852AST
Typ
Max
Unit
5
POWER SUPPLY
+VS Current6
+VS Current7
+VS Current8
P DISS6
P DISS7
P DISS8
P DISS Power-Down Mode
815
640
585
2.7
2.115
1.930
922
725
660
3.195
2.515
2.285
50
585
465
425
1.93
1.53
1.400
660
520
475
2.385
1.805
1.650
50
mA
mA
mA
W
W
W
mW
NOTES
1
The reference clock inputs are configured to accept a 1 V p-p (minimum) dc offset sine wave centered at one-half the applied VDD or a 3 V TTL-level pulse input.
2
Change in duty cycle from 1 MHz to 100 MHz with 1 V p-p sine wave input and 0.5 V threshold.
3
Represents comparator’s inherent cycle-to-cycle jitter contribution. Input signal is a 1 V, 40 MHz square wave. Measurement device Wavecrest DTS – 2075.
4
Comparator input originates from Analog Out section via external 7-pole elliptic LPF. Single-ended input, 0.5 V p-p. Comparator output terminated in 50 Ω.
5
Important: In the 80-lead LQFP package simultaneous operation at the maximum ambient temperature of 85°C and at the maximum internal clock frequency at
200 MHz may cause the maximum die junction temperature of 150°C to be exceeded. Refer to the section of the data sheet entitled Power Dissipation section and
Thermal Considerations section for derating and thermal management information.
6
All functions engaged.
7
All functions except inverse sinc engaged.
8
All functions except inverse sinc and digital multipliers engaged.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
EXPLANATION OF TEST LEVELS
Test Level
I
– 100% Production Tested.
III – Sample Tested Only.
IV – Parameter is guaranteed by design and characterization
testing.
V – Parameter is a typical value only.
VI – Devices are 100% production tested at 25°C and
guaranteed by design and characterization testing
for industrial operating temperature range.
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . –0.7 V to +VS
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature . . . . . . . . . . . . . . . . . –40°C to +85°C
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . 300°C
Maximum Clock Frequency . . . . . . . . . . . . . . . . . . 300 MHz
*Absolute maximum ratings are limiting values, to be applied individually, and
beyond which the serviceability of the circuit may be impaired. Functional
operability under any of these conditions is not necessarily implied. Exposure of
absolute maximum rating conditions for extended periods of time may affect device
reliability.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9852ASQ
AD9852AST
AD9852/PCB
–40°C to +85°C
–40°C to +85°C
0°C to 70°C
Thermally-Enhanced 80-Lead LQFP
80-Lead LQFP
Evaluation Board
SQ-80
ST-80
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9852 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. 0
AD9852
PIN FUNCTION DESCRIPTIONS
Pin
No.
1–8
9, 10, 23,
24, 25, 73,
74, 79, 80
11, 12, 26,
27, 28, 72,
75, 76, 77,
78
13, 35, 57
58, 63
14–19
Pin Name
D7–D0
DVDD
Function
Eight-Bit Bidirectional Parallel Programming Data Inputs. Used only in parallel programming mode.
Connections for the Digital Circuitry Supply Voltage. Nominally 3.3 V more positive than AGND
and DGND.
DGND
Connections for Digital Circuitry Ground Return. Same potential as AGND.
NC
No Internal Connection.
A5–A0
Six-Bit Parallel Address Inputs for Program Registers. Used only in parallel programming mode. A0, A1,
and A2 have a second function when the serial programming mode is selected. See immediately below.
Allows a RESET of the serial communications bus that is unresponsive due to improper programming protocol. Resetting the serial bus in this manner does not affect previous programming nor
does it invoke the “default” programming values seen in the Table V. Active HIGH.
Unidirectional Serial Data Output for Use in 3-Wire Serial Communication Mode.
Bidirectional Serial Data Input/Output for Use in 2-Wire Serial Communication Mode.
Bidirectional Frequency Update Signal. Direction is selected in control register. If selected as an input,
a rising edge will transfer the contents of the programming registers to the internal works of the IC for
processing. If I/O UD is selected as an output, an output pulse (low to high) of eight system clock cycle
duration indicates that an internal frequency update has occurred.
Write Parallel Data to Programming Registers. Shared function with SCLK. Serial clock signal
associated with the serial programming bus. Data is registered on the rising edge. This pin is shared with
WRB when the parallel mode is selected.
Read Parallel Data from Programming Registers. Shared function with CSB. Chip-select signal
associated with the serial programming bus. Active LOW. This pin is shared with RDB when
the parallel mode is selected.
Multifunction Pin According to the Mode of Operation Selected in the Programming Control Register.
If in the FSK mode logic low selects F1, logic high selects F2. If in the BPSK mode, logic low selects
Phase 1, logic high selects Phase 2. If in the Chirp mode, logic high engages the HOLD function
causing the frequency accumulator to halt at its current location. To resume or commence Chirp,
logic low is asserted.
Must First Be Selected in the Programming Control Register to Function. A logic high will cause the
cosine DAC output to ramp-up from zero-scale to full-scale amplitude at a preprogrammed rate.
Logic low causes the full-scale output to ramp-down to zero-scale at the preprogrammed rate.
Connections for the Analog Circuitry Supply Voltage. Nominally 3.3 V more positive than AGND
and DGND.
(17)
A2/IO RESET
(18)
(19)
20
A1/SDO
A0/SDIO
I/O UD
21
WRB/SCLK
22
RDB/CSB
29
FSK/BPSK/
HOLD
30
SHAPED
KEYING
31, 32, 37 AVDD
38, 44, 50,
54, 60, 65
33, 34, 39, AGND
40, 41, 45,
46, 47, 53,
59, 62, 66,
67
36
VOUT
42
43
48
49
51
52
REV. 0
VINP
VINN
IOUT1
IOUT1B
IOUT2B
IOUT2
Connections for Analog Circuitry Ground Return. Same potential as DGND.
Internal High-Speed Comparator’s Noninverted Output Pin. Designed to drive 10 dBm to 50 Ω load
as well as standard CMOS logic levels.
Voltage Input Positive. The internal high-speed comparator’s noninverting input.
Voltage Input Negative. The internal high-speed comparator’s inverting input.
Unipolar Current Output of the Cosine DAC.
Complementary Unipolar Current Output of the Cosine DAC.
Complementary Unipolar Current Output of the Auxiliary DAC.
Unipolar Current Output of the Auxiliary DAC.
–5–
AD9852
Pin
No.
Pin Name
Function
55
DACBP
56
DAC RSET
61
PLL FILTER
64
DIFF CLK
68
REFCLKB
69
REFCLK
70
S/P SELECT
71
MASTER
RESET
Common Bypass Capacitor Connection for Both DACs. A 0.01 µF chip cap from this pin to AVDD
improves harmonic distortion and SFDR slightly. No connect is permissible (slight SFDR degradation).
Common Connection for Both DACs to Set the Full-Scale Output Current. RSET = 39.9/IOUT.
Normal RSET range is from 8 kΩ (5 mA) to 2 kΩ (20 mA).
This pin provides the connection for the external zero compensation network of the REFCLK
Multiplier’s PLL loop filter. The zero compensation network consists of a 1.3 kΩ resistor in series
with a 0.01 µF capacitor. The other side of the network should be connected to AVDD as close as
possible to Pin 60. For optimum phase noise performance, the REFCLK Multiplier can be bypassed
by setting the “Bypass PLL” bit in control register 1E.
Differential REFCLK Enable. A high level of this pin enables the differential clock inputs, REFCLK
and REFCLKB ENABLE (Pins 69 and 68 respectively). The minimum differential signal amplitude
required is 800 mV p-p. The centerpoint or common-mode range of the differential signal ranges
from 1.6 V to 1.9 V.
The Complementary (180 Degrees Out-of-Phase) Differential Clock Signal. User should tie this pin
high or low when single-ended clock mode is selected. Same signal levels as REFCLK.
Single-Ended Reference Clock Input or One of Two Differential Clock Signals. Normal 3.3 V CMOS
logic levels or 1 V p-p sine wave centered about 1.6 V.
Selects Between Serial Programming Mode (Logic LOW) and Parallel Programming Mode
(Logic High).
Initializes the serial/parallel programming bus to prepare for user programming; sets programming
registers to a “do-nothing” state defined by the default values seen in the Table V. Active on logic
high. Asserting MASTER RESET is essential for proper operation upon power-up.
–6–
REV. 0
AD9852
DVDD
DVDD
DGND
DGND
DGND
DGND
DVDD
DVDD
DGND
MASTER RESET
S/P SELECT
REFCLOCK
REFCLOCKB
AGND
AGND
AVDD
DIFF CLK ENABLE
NC
AGND
PLL FILTER
PIN CONFIGURATION
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
AVDD
59
AGND
3
58
NC
D4 4
57
NC
D3 5
56
DAC RSET
D2 6
55
DACBP
D1 7
54
AVDD
D0 8
53
AGND
52
IOUT2
51
IOUT2B
50
AVDD
49
IOUT1B
NC 13
48
IOUT1
A5 14
47
AGND
A4 15
46
AGND
A3 16
45
AGND
A2/IO RESET 17
44
AVDD
A1/SDO 18
43
VINN
A0/SDIO 19
42
VINP
I/O UD 20
40
AGND
AD9852
DVDD 10
TOP VIEW
(Not to Scale)
80-PIN LQFP 14 3 14 3 1.4
DGND 11
26
27
28
29
30
31
32
33
34
35
36
DGND
FSK/BPSK/HOLD
SHAPED KEYING
AVDD
AVDD
AGND
AGND
NC
VOUT
DVDD
25
DGND
RDB/CSB
24
DGND
23
DVDD
22
DVDD
21
WRB/SCLK
DGND 12
37
38
39
40
AGND
DVDD
9
AGND
D5
AVDD
D6 2
PIN 1
IDENTIFIER
AVDD
D7 1
NC = NO CONNECT
VDD
VDD
DIGITAL
OUT
IOUT
VINP/
VINN
DIGITAL
IN
IOUTB
a. DAC Outputs
b. Comparator Output
c. Comparator Input
Figure 1. Equivalent Input and Output Circuits
REV. 0
VDD
VDD
–7–
d. Digital Input
AD9852
Figures 2–7 indicate the wideband harmonic distortion Performance of the AD9852 from 19.1 MHz to 119.1 MHz Fundamental Output, Reference Clock = 30 MHz, REFCLK Multiplier = 10. Each graph plotted from 0 MHz to 150 MHz.
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
START 0Hz
15MHz/
START 0Hz
STOP 150MHz
Figure 2. Wideband SFDR, 19.1 MHz
15MHz/
STOP 150MHz
Figure 5. Wideband SFDR, 79.1 MHz
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
START 0Hz
15MHz/
STOP 150MHz
START 0Hz
Figure 3. Wideband SFDR, 39.1 MHz
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
15MHz/
STOP 150MHz
Figure 6. Wideband SFDR, 99.1 MHz
0
START 0Hz
15MHz/
STOP 150MHz
START 0Hz
Figure 4. Wideband SFDR, 59.1 MHz
15MHz/
STOP 150MHz
Figure 7. Wideband SFDR, 119.1 MHz
–8–
REV. 0
AD9852
Figures 8–11 show the tradeoff in elevated noise floor, increased phase noise, and occasional discrete spurious energy when the
internal REFCLK Multiplier circuit is engaged. Plots with wide (1 MHz) and narrow (50 kHz) spans are shown.
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
CENTER 39.1MHz
100kHz/
CENTER 39.1MHz
SPAN 1MHz
Figure 8. Narrowband SFDR, 39.1 MHz, 1 MHz BW,
300 MHz EXTCLK with REFCLK Multiply Bypassed
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
5kHz/
SPAN 1MHz
Figure 10. Narrowband SFDR, 39.1 MHz, 1 MHz BW,
30 MHz EXTCLK with REFCLK Multiply = 10 ×
0
CENTER 39.1MHz
100kHz/
SPAN 50kHz
CENTER 39.1MHz
Figure 9. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
300 MHz EXTCLK with REFCLK Multiplier Bypassed
5kHz/
SPAN 50kHz
Figure 11. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
30 MHz EXTCLK/REFCLK Multiplier = 10 ×
Figures 12 and 13 show the slight increase in noise floor both with and without the PLL when slower clock speeds are used to
generate the same fundamental frequency, that is, with a 100 MHz clock as opposed to a 300 MHz clock in Figures 9 and 11.
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
CENTER 39.1MHz
5kHz/
SPAN 50kHz
CENTER 39.1MHz
Figure 12. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
100 MHz EXTCLK with REFCLK Multiplier Bypassed
REV. 0
5kHz/
SPAN 50kHz
Figure 13. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
10 MHz EXTCLK with REFCLK Multiplier = 10 ×
–9–
AD9852
Figures 14 and 15 show the effects of utilizing “sweet spots” in the tuning range of a DDS. Figure 14 represents a tuning word that
accentuates the aberrations associated with truncation in the DDS algorithm. Figure 15 is essentially the same output frequency (a few
tuning codes over), but it displays much fewer spurs on the output due to the selection of a tuning “sweet spot.” Consideration
should be given to all DDS applications to exploit the benefit of sweet spot tuning.
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
CENTER 112.499MHz
50kHz/
SPAN 500kHz
Figure 14. The Opposite of a “Sweet Spot.” 112.469 MHz
with multiple high energy spurs close around the
fundamental.
CENTER 112.469MHz
50kHz/
SPAN 500kHz
Figure 15. A slight change in tuning word yields
dramatically better results. 112.499 MHz with all
spurs shifted out-of-band.
Figures 16 and 17 show the narrowband performance of the AD9852 when operating with a 20 MHz reference clock and the
REFCLK Multiplier enabled at 10× vs. a 200 MHz external reference clock.
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
CENTER 39.1MHz
5kHz/
SPAN 50kHz
Figure 16. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
200 MHz EXTCLK with REFCLK Multiplier Bypassed
CENTER 39.1MHz
5kHz/
SPAN 50kHz
Figure 17. Narrowband SFDR, 39.1 MHz, 50 kHz BW,
10 MHz EXTCLK with REFCLK Multiplier = 10 ×
–10–
REV. 0
AD9852
–110
–110
–115
–115
–120
–120
PHASE NOISE – dBc/Hz
PHASE NOISE – dBc/Hz
80MHz
–125
–130
80MHz
–135
–140
5MHz
–145
–125
–130
–135
5MHz
–140
–145
–150
–150
–155
100
1k
10k
FREQUENCY – Hz
–155
100
100k
1k
10k
FREQUENCY – Hz
100k
b. Residual Phase Noise, 300 MHz (10× REFCLK Multiplier
Enabled)
Figure 18. Residual Phase Noise, EXTCLK = 300 MHz, REFCLK Multiplier Disabled/Enabled at 10 ×
a. Residual Phase Noise 300 MHz Direct Clocking
55
54
53
SFDR – dBc
RISE TIME
1.04ns
52
JITTER
[10.6ps RMS]
51
50
–33ps
49
48
0
5
10
15
DAC CURRENT – mA
20
500ps/DIV
25
Figure 19. SFDR vs. DAC Current, 59.1 MHz AOUT, 300 MHz
EXTCLK
232mV/DIV
0ps
+33ps
50V INPUT
Figure 21. Typical Comparator Output Jitter, 40 MHz
AOUT, 300 MHz EXTCLK/REFCLK Multiplier Disabled
SUPPLY CURRENT – mA
620
615
REF1 RISE
1.174ns
610
C1 FALL
1.286ns
605
600
595
590
0
20
40
60
80
100
FREQUENCY – MHz
120
CH1
140
Figure 20. Supply Current vs. Output Frequency; Variation
Is Minimal as a Percentage and Heavily Dependent on
Tuning Word
REV. 0
500mVV
M 500ps CH1
980mV
Figure 22. Comparator Rise/Fall Times
–11–
AD9852
1200
AMPLITUDE – mV p-p
1000
MINIMUM COMPARATOR
INPUT DRIVE
VCM = 0.5V
800
RF/IF
INPUT
BASEBAND
600
SIN
AD9852
LPF
REFCLK
400
200
0
0
100
200
300
FREQUENCY – MHz
400
500
Figure 23. Comparator Toggle Voltage Requirement
I/Q MIXER
AND
LOW-PASS
FILTER
Rx
RF IN
Figure 24. Synthesized L.O. Application for the AD9852
8
I
DUAL
8-/10-BIT
ADC
Q
DIGITAL
DEMODULATOR
8
Rx BASEBAND
DIGITAL DATA
OUT
VCA
ADC CLOCK FREQUENCY
LOCKED TO Tx CHIP/
SYMBOL/PN RATE
ADC ENCODE
AD9852
CLOCK
GENERATOR
REFERENCE
CLOCK
48
CHIP/SYMBOL/PN
RATE DATA
Figure 25. Chip Rate Generator in Spread Spectrum Application
BANDPASS
FILTER
AD9852
IOUT
50V
REFERENCE
CLOCK
50V
PHASE
COMPARATOR
LOOP
FILTER
AD9852
REF CLK IN
RF
FREQUENCY
OUT
VCO
FILTER
AD9852
SPECTRUM
FINAL OUTPUT
SPECTRUM
FUNDAMENTAL
DAC OUT
FC + FO
IMAGE
FC – FO
IMAGE
FCLK
DDS
FC + FO
IMAGE
TUNING
WORD
BANDPASS
FILTER
Figure 26. Using an Aliased Image to Generate a High
Frequency
Figure 27. Programmable “Divide-by-N” Synthesizer
–12–
REV. 0
AD9852
REF
CLOCK
AD9852
DDS
FILTER
PHASE
COMPARATOR
LOOP
FILTER
RF
FREQUENCY
OUT
VCO
DIFFERENTIAL
TRANSFORMER-COUPLED
OUTPUT
IOUT
FILTER
REFERENCE
CLOCK
DDS
AD9852
TUNING
WORD
50V
IOUT
DIVIDE-BY-N
50V
1:1 TRANSFORMER
I.E. MINI-CIRCUITS T1–1T
Figure 28. Agile High-Frequency Synthesizer
Figure 29. Differential Output Connection for Reduction of
Common-Mode Signals
LOW-PASS
FILTER
AD9852
8-BIT PARALLEL OR
SERIAL PROGRAMMING
DATA AND CONTROL
SIGNALS
mPROCESSOR/
CONTROLLER
FPGA, ETC.
"I" DAC
1
LOW-PASS
FILTER
2
CONTROL
300MHz MAX DIRECT
MODE OR 15 TO 75MHz
MAX IN THE 43-203 CLOCK
MULTIPLIER MODE
REFERENCE
CLOCK
+
2kV
RSET
CMOS LOGIC "CLOCK" OUT
NOTES:
IOUT = APPROX 20mA MAX WHEN RSET = 2kV
SWITCH POSTION 1 PROVIDES COMPLEMENTARY SINUSOIDAL SIGNALS TO THE COMPARATOR
TO PRODUCE A FIXED 50% OUTPUT DUTY CYCLE FROM THE COMPARATOR.
SWITCH POSTION 2 PROVIDES A USER PROGRAMMABLE DC THRESHOLD VOLTAGE TO ALLOW
SETTING OF THE COMPARATOR OUTPUT DUTY CYCLE.
Figure 30. Frequency Agile Clock Generator Applications for the AD9852
(continued from page 1)
generation of a sine output at frequencies up to 150 MHz, which
can be digitally tuned at a rate of up to 100 million new frequencies
per second. The (externally filtered) sine wave output can be
converted to a square wave by the internal comparator for agile
clock generator applications. The device provides 14 bits of
digitally-controlled phase modulation and single-pin PSK. The
on-board 12-bit DAC, coupled with the innovative DDS
architecture, provide excellent wideband and narrowband output SFDR. There is also an auxiliary DAC that can be configured
as a user-programmable control DAC. When configured with
the on-board comparator, the 12-bit control DAC facilitates
duty cycle control, in the high-speed clock generator application. A
12-bit digital multiplier permits programmable amplitude modulation, shaped on/off keying and precise amplitude control of
the output. Chirp functionality is also included which facilitates
wide bandwidth frequency sweeping applications. The AD9852’s
programmable 4×–20× REFCLK multiplier circuit generates
the 300 MHz clock internally from a lower frequency external
reference clock. This saves the user the expense and difficulty of
implementing a 300 MHz clock source. Direct 300 MHz clocking
is also accommodated with either single-ended or differential
inputs. Single-pin conventional FSK and the enhanced spectral
qualities of “ramped” FSK are supported. The AD9852 uses
advanced 0.35 micron CMOS technology to provide this high
level of functionality on a single 3.3 V supply.
REV. 0
The AD9852 is available in a space-saving 80-lead LQFP
surface-mount package and a thermally-enhanced 80-lead LQFP
package. The AD9852 is pin-for-pin compatible with the AD9854
quadrature output synthesizer device. It is specified to operate over
the extended industrial temperature range of –40°C to +85°C.
OVERVIEW
The AD9852 digital synthesizer is a highly flexible device that
will address a wide range of applications. The device consists
of an NCO with 48-bit phase accumulator, programmable reference clock multiplier, inverse sinc filters, digital multipliers,
two 12-bit/300 MHz DACs, high-speed analog comparator,
and interface logic. This highly integrated device can be configured to serve as a synthesized L.O., agile clock generator, and
FSK/BPSK modulator. The theory of operation of the functional blocks of the device, and a technical description of the
signal flow through a DDS device, can be found in a tutorial
from Analog Devices, called, “A Technical Tutorial on Digital
Signal Synthesis.” This tutorial is available on CD-ROM and
information on obtaining it can be found at the Analog Devices
DDS website at www.analog.com/dds. The tutorial also
provides basic applications information for a variety of digital
synthesis implementations. The DDS background subject matter is
not covered in this data sheet; the functions and features of
the AD9852 will be individually discussed herein.
–13–
AD9852
USING THE AD9852
Internal and External Update Clock
This function is comprised of a bidirectional I/O pin, Pin 20, and a
programmable 32-bit down-counter. In order for programming
changes to be transferred from the I/O Buffer registers to the active
core of the DDS, a clock signal (low-to-high edge) must be externally
supplied to Pin 20 or internally generated by the 32-bit Update Clock.
An externally generated Update Clock is internally synchronized
with the system clock to prevent partial transfer of program
register information due to violation of data setup or hold times.
This mode gives the user complete control of when updated
program information becomes effective. The default mode is set
for internal update clock (Int Update Clk control register bit is
logic high). To switch to external update clock mode, the Int
Update Clk register bit must be set to logic low. The internal
update mode generates automatic, periodic update pulses whose
time period is set by the user.
An internally generated Update Clock can be established by
programming the 32-bit Update Clock registers (address 16–19
hex) and setting the Int Update Clk (address 1F hex) control
register bit to logic high. The update clock down-counter function
operates at the system clock/2 (150 MHz maximum) and counts
down from a 32-bit binary value (programmed by the user).
When the count reaches 0, an automatic I/O Update of the DDS
output or functions is generated. The update clock is routed
internally and externally on Pin 20 to allow users to synchronize
programming of update information with the update clock rate.
The time period between update pulses is given as:
the digital multipliers to user programmable 12-bit registers
allowing users to dynamically shape the amplitude transition in
practically any fashion. These 12-bit registers, labeled “Output Shape Key” are located at addresses 21 through 24 hex in
Table V. The maximum output amplitude is a function of the
RSET resistor and is not programmable when OSK INT is enabled.
Next, the transition time from zero-scale to full-scale must
be programmed. The transition time is a function of two fixed
elements and one variable. The variable element is the program
mable 8-bit RAMP RATE COUNTER. This is a down-counter
being clocked at the system clock rate (300 MHz max) that
outputs one pulse whenever the counter reaches zero. This pulse
is routed to a 12-bit counter that increments one LSB for every
pulse received. The outputs of the 12-bit counter are connected
to the 12-bit digital multiplier. When the digital multiplier has a
value of all zeros at its inputs, the input signal is multiplied by
zero, producing zero-scale. When the multiplier has a value of
all ones, the input signal is multiplied by a value of one, producing
full-scale. There are 4094 remaining fractional multiplier values
that will produce output amplitudes corresponding to their
binary values.
(BYPASS MULTIPLIER)
DIGITAL
SIGNAL IN
OSK EN = 0
OSK EN = 0
12
12-BIT DIGITAL
MULTIPLIER
12
SINE DAC
OSK EN = 1
OSK EN = 1
12
USER PROGRAMMABLE
12-BIT Q-CHANNEL
MULTIPLIER
"OUTPUT SHAPE
KEY Q MULT"
REGISTER
(N+1) × (SYSTEM CLOCK PERIOD × 2)
where N is the 32-bit value programmed by the user. Allowable range of N is from 1 to (232 –1). The internally generated
update pulse output on Pin 20 has a fixed high time of eight system
clock cycles.
OSK EN = 1
12
OSK EN = 0
12
12-BIT
COUNTER
1 8-BIT DOWNCOUNTER
SYSTEM
CLOCK
Shaped On/Off Keying
Allows user to control the ramp-up and ramp-down time of an
“on/off” emission from the I and Q DACs. This function is
used in “burst transmissions” of digital data to reduce the adverse
spectral impact of short, abrupt bursts of data. Users must first
enable the digital multipliers by setting the OSK EN bit (control register address 20 hex) to logic high in the control register.
Otherwise, if the OSK EN bit is set low, the digital multipliers
responsible for amplitude control are bypassed and the I and Q
DAC outputs are set to full-scale amplitude. In addition to
setting the OSK EN bit, a second control bit, OSK INT (also at
address 20 hex) must be set to logic high. Logic high selects the
linear internal control of the output ramp-up or ramp-down
function. A logic low in the OSK INT bit switches control of
SHAPING
KEYING PIN
Figure 32. Block Diagram of Data Pathway of the Digital
Multiplier Section Responsible for Shaped Keying Function
The two fixed elements are the clock period of the system clock,
which drives the Ramp Rate Counter, and the 4096 amplitude
steps between zero-scale and full-scale. To give an example,
assume that the System Clock of the AD9852 is 100 MHz (10 ns
period). If the Ramp Rate Counter is programmed for a minimum
count of five, it will take two system clock periods (one rising
edge loads the count-down value, the next edge decrements the
counter from five to four). The relationship of the 8-bit countdown value to the time period between output pulses is given as:
(N+1) × SYSTEM CLOCK PERIOD,
ABRUPT ON/OFF KEYING
where N is the 8-bit count-down value. It will take 4096 of these
pulses to advance the 12-bit up-counter from zero-scale to fullscale. Therefore, the minimum shaped keying ramp time for a
100 MHz system clock is 4096 × 6 × 10 ns = approximately
246 µs. The maximum ramp time will be 4096 × 256 × 10 ns =
approximately 10.5 µs.
SHAPED ON/OFF KEYING
Figure 31. Shaped On/Off Keying
–14–
REV. 0
AD9852
0
Finally, changing the logic state of Pin 30, “shaped keying” will
automatically perform the programmed output envelope functions
when OSK INT is high. A logic high on Pin 30 causes the outputs to linearly ramp up to full-scale amplitude and hold until
the logic level is changed to low, causing the outputs to ramp
down to zero-scale.
–20
–30
–40
Cosine DAC
The cosine DAC generates the 300 MSPS (maximum) cosine
output of the DDS. The maximum output amplitude is set
by the DAC RSET resistor at Pin 56. This is a current-out DAC
with a full-scale maximum output of 20 mA; however, a nominal 10 mA output current provides best spurious-free dynamic
range (SFDR) performance. The value of RSET = 39.93/IOUT ,
where IOUT is in amps. DAC output compliance specification limits the maximum voltage developed at the outputs to –0.5 V to
+1 V. Voltages developed beyond this limitation will cause excessive DAC distortion and possibly permanent damage. The user
must choose a proper load impedance to limit the output voltage
swing to the compliance limits. For best SFDR, both DAC outputs
should be terminated equally, especially at higher output frequencies where harmonic distortion errors are more prominent.
–50
–60
–70
–90
–100
CENTER 50MHz
REV. 0
10MHz/
SPAN 100MHz
Figure 33. Normal SIN(x)/x DAC Output Power Envelope
Filter
0
–10
–20
–30
–40
–50
–60
–70
FUNDAMENTAL OUTPUT POWER IS
"FLAT" FROM DC TO 1/2 FCLK
–80
–90
–100
CENTER 50MHz
Cosine DAC outputs are designated as IOUT1 and IOUT1B,
Pins 48 and 49 respectively.
The 12-bit auxiliary, or control DAC can provide dc control
levels to external circuitry, generate ac signals, or duty cycle control, of the on-board comparator. The input twos complement
data is channeled through the serial or parallel interface to the
12-bit register (address 26 and 27 hex) at a maximum 100 MHz
data rate. This DAC is clocked at the system clock, 300 MSPS
(maximum), and has the same maximum output current capability as that of the cosine DAC. The single RSET resistor on the
AD9852 sets the full-scale output current for both cosine DAC
and the control DACs. The control DAC can be separately
powered down for power conservation when not needed by
setting the Control DAC POWER-DOWN bit high (address
1D hex). Control DAC outputs are designated as IOUT2 and
IOUT2B (Pins 52 and 51 respectively).
FUNDAMENTAL OUTPUT POWER DECREASES
WITH INCREASING FREQUENCY
–80
The cosine DAC is preceded by inverse SIN(x)/x filters (a.k.a.
inverse sinc filter) that precompensate for DAC output amplitude
variations over frequency to achieve flat amplitude response from
dc to Nyquist. A digital multiplier follows the inverse sinc filters
to allow amplitude control, amplitude modulation and amplitude shaped keying. The inverse sinc filter (address 20 hex, Bypass
Inv Sinc bit)) and digital multiplier (address 20 hex, OSK EN
bit) can be bypassed for power conservation by setting those bits
high. Both DACs can be powered down by setting the DAC PD
bit high (address 1D of control register) when not needed.
Control DAC
IMAGES
–10
10MHz/
SPAN 100MHz
Figure 34. Inverse SIN(x)/x (Inverse Sinc) Filter Engaged
Inverse SINC Function
This filter precompensates input data to the cosine DAC for
the SIN(x)/x roll-off function to allow wide bandwidth signals
(such as QPSK) to be output from the DACs without appreciable
amplitude variations that will cause increased EVM (error vector
magnitude). The inverse SINC function may be bypassed to
significantly reduce power consumption, especially at higher
clock speeds. Inverse sinc is engaged by default and is bypassed
by bringing the “Bypass Inv Sinc” bit high in control register 20
(hex) in Table V.
REFCLK Multiplier
This is a programmable PLL-based reference clock multiplier
that allows the user to select an integer clock multiplying value
over the range of 4× to 20× by which the REFCLK input will be
multiplied. Use of this function allows users to input as little as
15 MHz to produce a 300 MHz internal system clock. Five bits
in control register 1E hex set the multiplier value as follows in
Table I.
–15–
AD9852
Table I. REFCLK Multiplier Control Register Values
Multiplier Value
Ref Mult 4
Ref Mult 3
Ref Mult 2
Ref Mult 1
Ref Mult 0
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
The REFCLK Multiplier function can be bypassed to allow
direct clocking of the AD9852 from an external clock source.
The system clock for the AD9852 is either the output of the
REFCLK Multiplier (if it is engaged) or the REFCLK inputs.
REFCLK may be either a single-ended or differential input by
setting Pin 64, DIFF CLK ENABLE, low or high respectively.
Parallel/ Serial Programming Mode
Setting Pin 70 high invokes parallel mode, whereas setting Pin
70 low will invoke the serial programming mode. Please refer
to the text describing the serial and parallel programming
protocol contained in this data sheet for further information.
PLL Range Bit
The PLL Range Bit selects the frequency range of the REFCLK
Multiplier PLL. For operation from 200 MHz to 300 MHz
(internal system clock rate) the PLL Range Bit should be set to
Logic 1. For operation below 200 MHz, the PLL Range Bit
should be set to Logic 0. The PLL Range Bit adjusts the PLL
loop parameters for optimized phase noise performance within
each range.
Pin 61, PLL FILTER
This pin provides the connection for the external zero compensation network of the PLL loop filter. The zero compensation
network consists of a 1.3 kΩ resistor in series with a 0.01 µF
capacitor. The other side of the network should be connected to
as close as possible to Pin 60, AVDD. For optimum phase noise
performance the clock multiplier can be bypassed by setting the
“Bypass PLL” bit in control register address 1E.
Differential REFCLK Enable
A high level on this pin enables the differential clock Inputs,
REFCLOCK and REFCLOCKB (Pins 69 and 68 respectively). The minimum differential signal amplitude required
is 800 mV p-p. The centerpoint or common-mode range of the
differential signal can range from 1.6 V to 1.9 V.
When Pin 64 (DIFF CLK ENABLE) is tied low, REFCLK
(Pin 69) is the only active clock input. This is referred to as
the single-ended mode. In this mode, Pin 68 (REFCLKB) should
be tied low or high, but not left floating.
Two control bits located at address 20 hex in the Table V apply
only to the serial programming mode. LSB First when high,
dictates that serial data will be loaded starting with the LSB of
the word. When low (the default value), serial data is loaded
starting with the MSB of the word. SDO Active when high
indicates that the SDO pin, Pin 18, is dedicated to reading back
data from the AD9852 registers. When SDO Active is low
(default value), this indicates that the SDIO pin, Pin 19, acts
as a bidirectional serial data input and output pin and Pin 18
has no function in the serial mode.
DESCRIPTION OF AD9852 MODES OF OPERATION
There are five programmable modes of operation of the AD9852.
Selecting a mode requires that three bits in the Control Register
(parallel address 1F hex) be programmed as follows in Table II.
Table II. Mode Selection Table
Mode 2
Mode 1
Mode 0
Result
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
SINGLE-TONE
FSK
RAMPED FSK
CHIRP
BPSK
In each mode, engaging certain functions may or may not be
permitted. Shown in Table III is a listing of some important
functions and their availability for each mode.
–16–
REV. 0
AD9852
Single-Tone (Mode 000)
This is the default mode when master reset is asserted or when
it is user-programmed into the control register. The Phase
Accumulator, responsible for generating an output frequency, is
presented with a 48-bit value from Frequency Tuning Word 1
registers whose default values are zero. Default values from the
remaining applicable registers will further define the single-tone
output signal qualities.
The default values after a master reset, define a safe, “no output”
value resulting in an output signal of 0 Hertz, 0 phase. Upon
power-up and reset the output from both I and Q DACs will be
a dc value equal to the midscale output current. This is the
default mode amplitude setting of zero. Refer to the digital multiplier section for further explanation of the output amplitude
control. It will be necessary to program all or some of the 28
program registers to realize a user-defined output signal.
Figure 35 graphically shows the transition from the default condition (0 Hz) to a user-defined output frequency (F1).
As with all Analog Devices DDSs, the value of the frequency
tuning word is determined using the following equation:
Where N is the phase accumulator resolution (48 bits in this
instance), frequency is expressed in Hertz, and the FTW,
Frequency Tuning Word, is a decimal number. Once a decimal
number has been calculated, it must be rounded to an integer
and then converted to binary format—a series of 48 binaryweighted 1s or 0s. The fundamental sine wave DAC output
frequency range is from dc to 1/2 SYSCLK.
Changes in frequency are phase continuous—that is, the new
frequency uses the last phase of the old frequency as the reference
point to compute the first new frequency phase.
The single-tone mode allows the user to control the following
signal qualities:
• Output Frequency to 48-Bit Accuracy
• Output Amplitude to 12-Bit Accuracy
– Fixed, User-Defined, Amplitude Control
– Variable, Programmable Amplitude Control
– Automatic, Programmable, Single-Pin-Controlled, “Shaped
On/Off Keying”
• Output Phase to 14-Bit Accuracy
Furthermore, all of these qualities can be changed or modulated
via the 8-bit parallel programming port at a 100 MHz parallel-byte
rate, or at a 10 MHz serial rate. Incorporating this attribute will
permit FM, AM, PM, FSK, PSK, ASK operation in the singletone mode.
FREQUENCY
FTW = (Desired Output Frequency × 2N)/SYSCLK.
F1
0
MODE
000 (DEFAULT)
000 (SINGLE TONE)
0
F1
TW1
Figure 35. Default State to User-Defined Output Transition
Table III. Function Availability vs. Mode of Operation
Mode
Phase
Adjust 1
Phase
Adjust 2
Single-Pin
FSK/BPSK
or HOLD
Single-Pin
ShapedKeying
Phase
Offset or
Modulation
Amplitude
Control or
Modulation
Inverse
SINC
Filter
Frequency Frequency Automatic
Tuning
Tuning
Frequency
Word 1
Word 2
Sweep
Single-Tone
FSK
Ramped FSK
CHIRP
BPSK
✓
✓
✓
✓
✓
X
X
X
X
✓
X
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
X
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
REV. 0
–17–
X
✓
✓
X
X
X
X
✓
✓
X
AD9852
Unramped FSK (Mode 001)
When selected, the output frequency of the DDS is a function
of the values loaded into Frequency Tuning Word registers 1
and 2 and the logic level of Pin 29 (FSK/BPSK/HOLD). A logic
low on Pin 29 chooses F1 (frequency tuning word 1, parallel
address 4–9 hex) and a logic high chooses F2 (frequency tuning
word 2, parallel register address A–F hex). Changes in frequency
are phase-continuous and practically instantaneous. (Please refer to
pipeline delays in specification table.) Other than F2 and Pin 29
becoming active, this mode is identical to single-tone.
The unramped FSK mode, Figure 36, is representative of
traditional FSK, RTTY (Radio Teletype) or TTY (Teletype)
transmission of digital data. Frequency transitions occur nearly
instantaneously from F1 to F2. This simple method works
extremely well and is the most reliable form of digital communication, but it is also wasteful of RF spectrum.
See the following Ramped FSK section for an alternative FSK
method that conserves bandwidth.
Ramped FSK (Mode = 010)
A method of FSK whereby changes from F1 to F2 are not
instantaneous but instead are accomplished in a frequency
sweep or “ramped” fashion. The “ramped” notation implies
that the sweep is linear. While linear sweeping or frequency
ramping is easily and automatically accomplished, it is only one
of many possibilities. Other frequency transition schemes may
be implemented by changing the ramp rate and ramp step size
“on-the-fly,” in piecewise fashion.
Frequency ramping, whether linear or nonlinear, necessitates
that many intermediate frequencies between F1 and F2 will be
output in addition to the primary F1 and F2 frequencies. Figures 37 and 38 graphically depict the frequency versus time
characteristics of a linear ramped FSK signal.
The purpose of ramped FSK is to provide better bandwidth
containment than traditional FSK by replacing the instantaneous
frequency changes with more gradual, user-defined frequency
changes. The dwell time at F1 and F2 can be equal to or much
greater than the time spent at each intermediate frequency. The
user controls the dwell time at F1 and F2, the number of intermediate frequencies and time spent at each frequency. Unlike
unramped FSK, ramped FSK requires the lowest frequency to be
loaded into F1 registers and the highest frequency into F2 registers.
Several registers must be programmed to instruct the DDS
regarding the resolution of intermediate frequency steps (48
bits) and the time spent at each step (20 bits). Furthermore, the
CLR ACC1 bit in the control register should be toggled (low-highlow) prior to operation to assure that the frequency accumulator
is starting from an “all zeros” output condition. For piecewise,
nonlinear frequency transitions, it is necessary to reprogram the
registers while the frequency transition is in progress to affect the
desired response.
FREQUENCY
F2
F1
0
000 (DEFAULT)
001 (FSK NO RAMP)
TW1
0
F1
TW2
0
F2
MODE
FSK DATA (PIN 29)
Figure 36. Traditional FSK Mode
FREQUENCY
F2
F1
0
000 (DEFAULT)
010 (RAMPED FSK)
TW1
0
F1
TW2
0
F2
MODE
FSK DATA (PIN 29)
Figure 37. Ramped FSK Mode
–18–
REV. 0
AD9852
FREQUENCY
F2
F1
0
MODE
010 (RAMPED FSK)
000 (DEFAULT)
TW1
0
F1
TW2
0
F2
FSK DATA
Figure 38. Ramped FSK Mode
Parallel register addresses 1A–1C hex comprise the 20-bit “Ramp
Rate Clock” registers. This is a count-down counter that outputs a
single pulse whenever the count reaches zero. The counter is
activated any time a logic level change occurs on FSK input
Pin 29. This counter is run at the System Clock Rate, 300 MHz
maximum. The time period between each output pulse is given as
(N+1) × (SYSTEM CLOCK PERIOD)
where N is the 20-bit ramp rate clock value programmed by the
user. Allowable range of N is from 1 to (220 –1). The output of
this counter clocks the 48-bit Frequency Accumulator shown below in Figure 39. The Ramp Rate Clock determines the amount
of time spent at each intermediate frequency between F1 and F2.
The counter stops automatically when the destination frequency
is achieved. The “dwell time” spent at F1 and F2 is determined
by the duration that the FSK input, Pin 29, is held high or low
after the destination frequency has been reached.
OUT
ADDER
PHASE
ACCUMULATOR
FREQUENCY
ACCUMULATOR
48-BIT DELTAFREQUENCY
WORD
20-BIT
RAMP RATE
CLOCK
Generally speaking, the Delta Frequency Word will be a much
smaller value as compared to that of the F1 or F2 tuning word.
For example, if F1 and F2 are 1 kHz apart at 13 MHz, the Delta
Frequency Word might be only 25 Hz.
Figure 41 shows that premature toggling causes the ramp to
immediately reverse itself and proceed at the same rate and resolution back to originating frequency.
The control register contains a Triangle bit at parallel register
address 1F hex. Setting this bit high in Mode 010 causes an
automatic ramp-up and ramp-down between F1 and F2 to occur
without having to toggle Pin 29 as shown in Figure 40. In fact,
the logic state of Pin 29 has no effect once the Triangle bit is set
high. This function uses the ramp-rate clock time period and the
delta-frequency-word step size to form a continuously sweeping
linear ramp from F1 to F2 and back to F1 with equal dwell times
at every frequency. Using this function, one can automatically
sweep from dc to the Nyquist limit or any other two frequencies
between dc and Nyquist.
F2
FREQUENCY
TUNING
WORD 2
FSK
(PIN 29)
FREQUENCY
FREQUENCY
TUNING
WORD 1
is ramped up and down in frequency, according to the logicstate of Pin 29. The rate at which this happens is a function of
the 20-bit ramp rate clock. Once the destination frequency is
achieved, the ramp rate clock is stopped, which halts the frequency
accumulation process.
F1
SYSTEM
CLOCK
0
MODE
010 (RAMPED FSK)
Figure 39. Block Diagram of Ramped FSK Function
Parallel register addresses 10–15 hex comprise the 48-bit, straight
binary, “Delta Frequency Word” registers. This 48-bit word
is accumulated (added to the accumulator’s output) every time
it receives a clock pulse from the ramp rate counter. The output
of this accumulator is then added to or subtracted from the F1
or F2 frequency word, which is then fed to the input of the 48-bit
Phase Accumulator that forms the numerical phase steps for the
sine and cosine wave outputs. In this fashion, the output frequency
REV. 0
TW1
F1
TW2
F2
FSK DATA
TRIANGLE
BIT
Figure 40. Effect of Triangle Bit in Ramped FSK Mode
–19–
AD9852
FREQUENCY
F2
F1
0
MODE
000 (DEFAULT)
010 (RAMPED FSK)
TW1
0
F1
TW2
0
F2
FSK DATA
Figure 41. Effect of Premature Ramped FSK Data
In the ramped FSK mode with the triangle bit set high an automatic frequency sweep will begin at either F1 or F2, according
to the logic level on Pin 29 (FSK input pin) when the triangle
bit’s rising edge occurs as shown in Figure 42. If the FSK data bit
had been high instead of low, F2 would have been chosen instead
of F1 as the start frequency.
FREQUENCY
F2
F1
0
MODE 000 (DEFAULT)
0
F1
TW2
0
F2
Two additional control bits are available in the ramped FSK mode
that allow even more options. CLR ACC1, register address 1F
hex, will, if set high, clear the 48-bit frequency accumulator (ACC1)
output with a retriggerable one-shot pulse of one system clock
duration. If the CLR ACC1 bit is left high, a one-shot pulse will
be delivered on the rising edge of every Update Clock. The
effect is to interrupt the current ramp, reset the frequency back
to the start point, F1 or F2, and then continue to ramp up (or
down) at the previous rate. This will occur even when a static F1
or F2 destination frequency has been achieved. (See Figure 43.)
Next, CLR ACC2 control bit (register address 1F hex) is available to clear both the frequency accumulator (ACC1) and the phase
accumulator (ACC2). When this bit is set high, the output of the
phase accumulator will result in 0 Hz output from the DDS. As
long as this bit is set high, the frequency and phase accumulators will be cleared, resulting in 0 Hz output. To return to
previous DDS operation, CLR ACC2 must be set to logic low.
010 (RAMPED FSK)
TW1
Nonlinear ramped FSK will have the appearance of a chirp
function that is graphically illustrated in Figure 43. The major
difference between a ramped FSK function and a chirp function
is that FSK is limited to operation between F1 and F2. Chirp
operation has no F2 limit frequency.
FSK DATA
Chirp (Mode 011)
TRIANGLE BIT
Figure 42. Automatic Linear Ramping Using the Triangle Bit
Additional flexibility in the ramped FSK mode is provided in
the ability to respond to changes in the 48-bit delta frequency
word and/or the 20-bit ramp-rate counter on-the-fly during the
ramping from F1 to F2 or vice versa. To create these nonlinear
frequency changes it is necessary to combine several linear
ramps in a piecewise fashion whose slopes are different. This is
done by programming and executing a linear ramp at some rate
or “slope” and then altering the slope (by changing the ramp
rate clock or delta frequency word or both). Changes in slope are
made as often as needed to form the desired nonlinear frequency
sweep response before the destination frequency has been reached.
These piecewise changes can be precisely timed using the 32-bit
Internal Update Clock (see detailed description elsewhere in
this data sheet).
This mode is also known as pulsed FM. Most chirp systems use
a linear FM sweep pattern although any pattern may be used.
This is a type of spread spectrum modulation that can realize
“processing gain.” In radar applications, use of chirp or pulsed
FM allows operators to significantly reduce the output power
needed to achieve the same result as a single-frequency radar
system would produce. Figure 43 represents a very low-resolution
nonlinear chirp meant to demonstrate the different “slopes” that
are created by varying the time steps (ramp rate) and frequency
steps (delta frequency word).
The AD9852 permits precise, internally generated linear or
externally programmed nonlinear pulsed or continuous FM over
a user-defined frequency range, duration, frequency resolution and
sweep direction(s). A block diagram of the FM chirp components
is shown in Figure 44.
–20–
REV. 0
FREQUENCY
AD9852
F1
0
MODE
000 (DEFAULT)
010 (RAMPED FSK)
0
F1
TW1
DFW
RAMP RATE
Figure 43. Example of a Nonlinear Chirp
OUT
ADDER
PHASE
ACCUMULATOR
FREQUENCY
ACCUMULATOR
48-BIT DELTAFREQUENCY
WORD
CLR ACC2
CLR ACC1
FREQUENCY
TUNING
WORD 1
HOLD
20-BIT
RAMP RATE
CLOCK
SYSTEM
CLOCK
Figure 44. FM Chirp Components
Basic FM Chirp Programming Steps
1. Program a start frequency into Frequency Tuning Word 1
(parallel register addresses 4–9 hex) hereafter called FTW1.
2. Program the frequency step resolution into the 48-bit, twos
complement, Delta Frequency Word (parallel register addresses
10–15 hex).
3. Program the rate of change (time at each frequency) into the
20-bit Ramp Rate Clock (parallel register addresses 1A–C).
4. When programming is complete, an I/O update pulse at Pin
20 will engage the program commands.
The necessity for a twos complement Delta Frequency Word is
to define the direction in which the FM chirp will move. If the
48-bit delta frequency word is negative (MSB is high), the
incremental frequency changes will be in a negative direction from
FTW1. If the 48-bit word is positive (MSB is low), the incremental frequency changes will be in a positive direction.
REV. 0
It is important to note that the FTW1 is only a starting point for
FM chirp. There is no built-in restraint requiring a return to
FTW1. Once the FM chirp has left FTW1 it is free to move
(under program control) within the Nyquist bandwidth (dc to
1/2 system clock). Instant return to FTW1 is easily achieved,
though, and this option is explained in the next few paragraphs.
Two control bits are available in the FM Chirp mode that will
allow practically instantaneous return to the beginning frequency,
FTW1, or to 0 Hz. First, CLR ACC1 bit, register address 1F
hex will, if set high, clear the 48-bit frequency accumulator (ACC1)
output with a retriggerable one-shot pulse of one system clock
duration. The 48-bit Delta Frequency Word input to the accumulator is unaffected by CLR ACC1 bit. If the CLR ACC1 bit
is left high, a one-shot pulse will be delivered to the Frequency
Accumulator (ACC1) on every rising edge of the I/O Update
Clock. The effect is to interrupt the current chirp, reset the
frequency back to FTW1, and continue the chirp at the previously
programmed rate and direction. Clearing the Frequency
Accumulator in the chirp mode is illustrated in Figure 45. Not
shown in the diagram is the I/O update signal, which is either
user-supplied or internally generated. A discussion of I/O Update
is presented elsewhere in this data sheet.
Next, CLR ACC2 control bit (register address 1F hex) is available to
clear both the frequency accumulator (ACC1) and the phase
accumulator (ACC2). When this bit is set high, the output of the
phase accumulator will result in 0 Hz output from the DDS. As
long as this bit is set high, the frequency and phase accumulators
will be cleared, resulting in 0 Hz output. To return to previous
DDS operation, CLR ACC2 must be set to logic low. This bit is
useful in generating pulsed FM.
–21–
FREQUENCY
AD9852
F1
0
MODE
000 (DEFAULT)
011 (CHIRP)
FTW1
0
F1
DELTA FREQUENCY WORD
DFW
RAMP RATE
RAMP RATE
UPDATE
CLOCK
CLR ACC1
FREQUENCY
Figure 45. Effect of CLR ACC1 in FM Chirp Mode
F1
0
MODE
TW1
000 (DEFAULT)
011 (CHIRP)
0
DPW
RAMP RATE
CLR ACC2
Figure 46. Effect of CLR ACC2 in FM Chirp Mode
Clock, it allows precisely timed program changes to be invoked.
In this manner, user is only required to reprogram the desired
registers before the automatic I/O Update pulse is generated.
A complete discussion of this function is presented elsewhere in
this data sheet.
FM Chirp
Figure 46 graphically illustrates the effect of CLR ACC2 bit
upon the DDS output frequency. Note that reprogramming the
registers while the CLR ACC2 bit is high allows a new FTW1
frequency and slope to be loaded.
Another function available only in the chirp mode is the HOLD
pin, Pin 29. This function will stop the clocking signal to the ramp
rate counter that will, in turn, halt any further clocking pulses to
the frequency accumulator, ACC1. The effect is to halt the
chirp and hold the output frequency in a static condition at
the frequency existing just before HOLD was pulled high. When
the HOLD pin is returned low, the clocks are resumed and chirp
continues. During a hold condition, user may change the
programming registers; however, the ramp rate counter must
resume operation at its previous rate until a count of zero is
obtained before a new ramp rate count can be loaded. Figure 47
illustrates the effect of the hold function on the DDS output
frequency.
Users may utilize the 32-bit automatic I/O Update counter when
constructing complex chirp or ramped FSK sequences. Since
this internal counter is synchronized with the AD9852 System
In the chirp mode, the destination frequency is not directly
specified. If the user fails to control the chirp, the DDS will control
itself by naturally confining its output between dc and Nyquist;
however, unless terminated by the user, the chirp will continue
until power is removed.
It is the user’s choice as to what occurs when the chirp destination
frequency is reached. Here are a few of the choices:
1. Stop and hold at the destination frequency using the HOLD
pin, or by loading all zeros into the Delta Frequency Word
registers of the frequency accumulator (ACC1).
2. Stop using the hold pin function, then ramp-down the output amplitude using the digital multiplier stages and the
Shaped Keying pin, Pin 30, or via program register control
(addresses 21–24 hex).
3. Stop and abruptly terminate the transmission using the CLR
ACC2 bit.
REV. 0
–22–
FREQUENCY
AD9852
F1
0
MODE
TW1
000 (DEFAULT)
011 (CHIRP)
0
F1
DELTA FREQUENCY WORD
DFW
RAMP RATE
RAMP RATE
HOLD
Figure 47. Illustration of HOLD Function
4. Continue chirp by reversing direction and returning to the
previous, or another, destination frequency in a linear or userdirected manner. If this involves going down in frequency, a
negative 48-bit Delta Frequency Word (the MSB is set to “1”)
must be loaded into registers 10–15 hex. Any decreasing frequency step of the Delta Frequency Word requires the MSB to
be set to logic high.
Phase Adjust register 1; when high, Phase Adjust register 2 is
selected. Figure 48 illustrates phase changes made to four cycles
of an output carrier.
Basic BPSK programming steps:
1. Program a carrier frequency into Frequency Tuning Word 1.
5. Continue chirp by immediately returning to the F1 beginning
frequency in a sawtooth fashion and repeat the previous chirp
process again. This is where CLR ACC1 control bit is used.
An automatic, repeating chirp can be setup using the 32-bit
Update Clock to issue CLR ACC1 commands at precise time
intervals. Adjusting the timing intervals or changing the Delta
Frequency Word will change the chirp range. It is incumbent
upon the user to balance the chirp duration and frequency
resolution to achieve the proper frequency range.
BPSK (Mode 100)
Binary, biphase, or bipolar phase shift keying is a means to rapidly
select between two preprogramming 14-bit output phase offsets
that will identically affect both the I and Q outputs of the AD9852.
The logic-state of Pin 29, BPSK pin, controls the selection of
Phase Adjust register number 1 or 2. When low, Pin 29 selects
2. Program appropriate 14-bit phase words in Phase Adjust
registers 1 and 2.
3. Attach BPSK data source to Pin 29.
4. Activate I/O Update pulse when ready.
If phase shift keying is not the objective, but rather a broader
range of phase offsets is needed, the user should select the SingleTone mode and program Phase Adjust register 1 using the serial or
high-speed parallel programming bus.
I/O Port Buffers—100 MHz, 8-bit parallel or 10 MHz serial
loading, SPI-compatible. The programming mode is selected
externally via the serial/parallel (S/P Select) pin. I/O Buffers can
be written to, or read from, according to the signals supplied to
the Read (RDB) and Write pins (WRB) and the 6-bit address
(A0–A5) in the parallel mode or to CSB, SCLK and SDIO pins
in the Serial mode.
360
PHASE
PHASE AFTER
ONSET
PHASE BEFORE
ONSET
0
MODE
000 (DEFAULT)
100 (BPSK)
FTW1
0
F1
PHASE ADJUST 1
270 DEGREES
PHASE ADJUST 2
90 DEGREES
BPSK DATA
Figure 48. BPSK Mode
REV. 0
–23–
AD9852
Data in the I/O Port Buffers is stored until overwritten by changes
in program instructions supplied by the user or until power is
removed. An I/O Update clocks-in the data from the I/O Buffers
to the DDS Programming Registers where it is executed.
AM—amplitude modulation of the sine DACs is possible using
the I/O port to control 12-bit digital multiplier stages that precede
the DACs. The multipliers can also be used to set the DAC
outputs between zero- and full-scale for static amplitude adjustment. See the “Shaped On/Off Keying” description for more
information. Shaped keying function does not apply to the
Control DAC.
Forty-Eight-Bit Delta Frequency Register—is programmed
with a 48-bit Frequency Tuning Word that is input to the 48-bit
Phase Accumulator (ACCU 2) and determines the output frequency of the DDS in the single-tone mode. When ramped-FSK
or Chirp are selected, this register is sent to a digital adder where
it is summed with the output of ACCU 1 before being input
to ACCU 2. Therefore, the signal sent to ACCU 2 may be
either static or changing at a rate of up to 150 million 48-bit
frequency tuning words per second.
Power-Down—Several individual stages, when not needed,
can be powered down to reduce power consumption via the
programming registers while still maintaining functionality of
desired stages. These stages are identified in the Register Layout
table, address 1D hex. Power-down is achieved by setting the
specified bits to logic high. A logic low indicates that the stages are
powered up.
High-Speed Comparator—optimized for high speed, >300 MHz
toggle rate, low jitter, sensitive input, built-in hysteresis and
an output level of 1 V p-p minimum into 50 Ω or CMOS logic
levels into high impedance loads. The comparator can be separately powered down to conserve power. This comparator is
used in “clock generator” applications to square up a bandpass
or low-pass filtered sine wave.
Eight-Bit Ramp Rate Clock—when Shaped On/Off Keying is
engaged, this down-counter takes the system clock (300 MHz
maximum), and divides it by an 8-bit binary value (programmed
by the user) to produce a user-defined clock. The clock outputs
one pulse every time the counter counts down to zero. This clock is
used to set the rate-of-change of the 12-bit digital multipliers of
the I and Q DACs to perform an output shaping function.
Twenty-Bit Ramp Rate Clock—when selected, this downcounter takes the system clock (300 MHz maximum) and
divides it by a 20-bit binary value (programmed by the user) to
produce a user-defined clock. The clock outputs one pulse every
time the counter counts down to zero. This clock is used to
set the rate-of-frequency-change of the ramped FSK or FM
Chirp modes.
Furthermore, and perhaps most significantly, two intensely digital
stages, the Inverse Sinc filters and the Digital Multiplier stages,
can be bypassed to achieve significant power reduction through
programming of the control registers in address 20 hex. Again,
logic high will cause the stage to be bypassed. Of particular
importance is the Inverse Sinc filter as this stage consumes a
significant amount of power.
A full power-down occurs when all four PD Bits in control
register 1D hex are set to logic high. This reduces power
consumption to approximately 10 mW (3 mA).
Master RESET—logic high active, must be held high for a
minimum of 10 system clock cycles. This causes the communications bus to be initialized and loads default values listed in the
Table V.
Forty-Eight-Bit Delta Frequency Register—is used only in
the Chirp and ramped-FSK modes. This register is loaded with a
48-bit word that represents the frequency increment value of
Frequency Accumulator (ACCU 1) whose output will be added
to a frequency that is set in either F1 or F2 frequency registers.
This register is periodically incremented at a rate set by the
20-bit ramp rate clock (150 MHz maximum).
–24–
REV. 0
AD9852
Table V. Register Layout. Shaded Sections Comprise the Control Register
Parallel
Address
Serial
Address
Hex
Hex
Bit 7
00
01
0
Phase Adjust Register #1 <13:8> (Bits 15, 14 don’t care)
Phase Adjust Register #1 <7:0>
Phase 1
00h
00h
02
03
1
Phase Adjust Register #2 <13:8:> (Bits 15, 14 don’t care)
Phase Adjust Register #2 <7:0>
Phase 2
00h
00h
04
05
06
07
08
09
2
Frequency Tuning Word 1 <47:0>
Frequency Tuning Word 1 <39:32>
Frequency Tuning Word 1 <31:24>
Frequency Tuning Word 1 <23:16>
Frequency Tuning Word 1 <15:8>
Frequency Tuning Word 1 <7:0>
0A
0B
0C
0D
0E
0F
3
Frequency Tuning Word 2 <47:40>
Frequency Tuning Word 2 <39:32>
Frequency Tuning Word 2 <31:24>
Frequency Tuning Word 2 <23:16>
Frequency Tuning Word 2 <15:8>
Frequency Tuning Word 2 <7:0>
10
11
12
13
14
15
4
Delta Frequency Word <47:40>
Delta Frequency Word <39:32>
Delta Frequency Word <31:24>
Delta Frequency Word <23:16>
Delta Frequency Word <15:8>
Delta Frequency Word <7:0>
00h
00h
00h
00h
00h
00h
16
17
18
19
5
Update Clock <31:24>
Update Clock <23:16>
Update Clock <15:8>
Update Clock <7:0>
00h
00h
00h
40h
1A
1B
1C
6
Ramp Rate Clock <19:16> (Bits 23, 22, 21, 20 don’t care)
Ramp Rate Clock <15:8>
Ramp Rate Clock <7:0>
00h
00h
00h
1D
7
Don’t
Care
Don’t
Care
Don’t
Care
Comp PD
Reserved,
Always
Low
Control
DAC PD
DAC PD
DIG PD
00h
1F
Don’t
Care
PLL
Range
Bypass
PLL
Ref Mult 4
Ref Mult 3
Ref Mult 2
Ref Mult 1
Ref Mult 0
64h
20
CLR
ACC 1
CLR
ACC 2
Triangle
Don’t Care
Mode 2
Mode 1
Mode 0
Int Update
Clk
01h
Don’t
Care
Bypass
Inv
Sinc
OSK EN
OSK INT
Don’t
Care
Don’t
Care
LSB First
SDO
Active
20h
AD9852 Register Layout
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Frequency 1
00h
00h
00h
00h
00h
00h
Frequency 2
1E
Default
Value
00h
00h
00h
00h
00h
00h
21
22
8
Output Shape Key I Mult <11:8> (Bits 15, 14, 13, 12 don’t care)
Output Shape Key I Mult <7:0>
00h
00h
23
24
9
Output Shape Key Q Mult <11:8> (Bits 15, 14, 13, 12 don’t care)
Output Shape Key Q Mult <7:0>
00h
00h
25
A
Output Shape Key Ramp Rate <7:0>
80h
26
27
B
QDAC <11:8> (Bits 15, 14, 13, 12 don’t care)
QDAC <7:0> (Data is required to be in twos-complement format)
00h
00h
REV. 0
–25–
AD9852
Interfacing and Programming the AD9852
1. Internally, controlled at a rate programmable by the user or,
The AD9852 Register Layout, shown in Table V, contains the
information that programs the chip for the desired functionality.
While many applications will require very little programming to
configure the AD9852, some will make use of all twelve accessible register banks. The AD9852 supports an 8-bit byte parallel
I/O operation or an SPI-compatible serial I/O operation. All
accessible registers can be written and read back in either
I/O operating mode.
2. Externally, controlled by the user. I/O operations can occur in
the absence of REFCLK but the data cannot be moved from
the buffer memory to the register bank without REFCLK.
See the Update Clock Operation section of this document
for details.
An external pin, S/P SELECT, is used to configure the I/O mode.
Systems that use the parallel I/O mode must connect the S/P
SELECT pin to VDD. Systems that operate in the serial I/O mode
must tie the S/P SELECT pin to GND.
Regardless of mode, the I/O port data is written to a buffer
memory that does NOT affect operation of the part until the
contents of the buffer memory are transferred to the register
banks. This transfer of information occurs, synchronously, to the
system clock and occurs in one of two ways:
Parallel I/O Operation
With the S/P SELECT pin tied high, the parallel I/O mode is
active. The I/O port is compatible with industry standard DSPs
and microcontrollers. Six address bits, eight bidirectional data
bits and separate write/read control inputs make up the I/O
port pins.
Parallel I/O operation allows write access to each byte of any
register in a single I/O operation at 100 MHz. Readback capability
for each register is included to ease designing with the AD9852.
Reads are not guaranteed at 100 MHz as they are intended for
software debug only.
Parallel I/O operation timing diagrams are shown in the Figures
49 and 50.
A<5:0>
A1
A2
A3
D<7:0>
D1
D2
D3
RD
TRDHOZ
TRDLOV
TAHD
TADV
SPECIFICATION
TADV
TAHD
TRDLOV
TRDHOZ
VALUE
15
5
15
10
DESCRIPTION
ADDRESS TO DATA VALID TIME (MAXIMUM)
ADDRESS HOLD TIME TO RD SIGNAL INACTIVE (MINIMUM)
RD LOW TO OUTPUT VALID (MAXIMUM)
RD HIGH TO DATA THREE-STATE (MAXIMUM)
Figure 49. Parallel Port Read Timing Diagram
A<5:0>
D<7:0>
A1
A2
D1
A3
D2
D3
WR
TDSU
TASU
TWRHIGH
TWRLOW
TAHD
TDHD
TWR
SPECIFICATION
TASU
TDSU
TADH
TDHD
TWRLOW
TWRHIGH
TWR
VALUE
4ns
2ns
5ns
0ns
3ns
7ns
3ns
DESCRIPTION
ADDRESS SETUP TIME TO WR SIGNAL ACTIVE
DATA SETUP TIME TO WR SIGNAL INACTIVE
ADDRESS HOLD TIME TO WR SIGNAL INACTIVE
DATA HOLD TIME TO WR SIGNAL INACTIVE
WR SIGNAL MINIMUM LOW TIME
WR SIGNAL MINIMUM HIGH TIME
WR SIGNAL MINIMUM PERIOD
Figure 50. Parallel Port Write Timing Diagram
–26–
REV. 0
AD9852
Serial Port I/O Operation
With the S/P SELECT pin tied low, the serial I/O mode is
active. The AD9852 serial port is a flexible, synchronous,
serial communications port allowing easy interface to many
industry-standard microcontrollers and microprocessors. The
serial I/O is compatible with most synchronous transfer formats,
including both the Motorola 6905/11 SPI and Intel 8051 SSR
protocols. The interface allows read/write access to all twelve
registers that configure the AD9852 and can be configured as a
single pin I/O (SDIO) or two unidirectional pins for in/out (SDIO/
SDO). Data transfers are supported in most significant bit (MSB)
first format or least significant bit (LSB) first format at up to
10 MHz.
When configured for serial I/O operation, most pins from the
AD9852 parallel port are inactive; some are used for the serial
I/O. Table VI describes pin requirements for serial I/O.
Table VI. Serial I/O Pin Requirements
Pin
Number
Pin
Name
1, 2, 3, 4,
5, 6, 7, 8
14, 15, 16
D[7:0]
A[5:3]
17
18
19
20
A2
A1
A0
I/O UD
21
22
WRB
RDB
Serial I/O Description
The parallel data pins are not active, tie
to VDD or GND.
The parallel address Pins A5, A4, A3
are not active, tie to VDD or GND.
IORESET
SDO
SDIO
Update Clock. Same functionality for
Serial Mode as Parallel Mode.
SCLK
CSB—Chip Select
Table VII. Register Address vs. Data Bytes Transferred
Serial
Register
Address
Register Name
Number
of Bytes
Transferred
0
1
2
3
4
5
6
7
8
9
A
B
Phase Offset Tuning Word Register #1
Phase Offset Tuning Word Register #2
Frequency Tuning Word #1
Frequency Tuning Word #2
Delta Frequency Register
Update Clock Rate Register
Ramp Rate Clock Register
Control Register
I Path Digital Multiplier Register
Q Path Digital Multiplier Register
Shaped On/Off Keying Ramp Rate Register
Q DAC Register
2 Bytes
2 Bytes
6 Bytes
6 Bytes
6 Bytes
4 Bytes
3 Bytes
4 bytes
2 Bytes
2 Bytes
2 Bytes
2 Bytes
At the completion of any communication cycle, the AD9852
serial port controller expects the next eight rising SCLK edges
to be the instruction byte of the next communication cycle. In
addition, an active high input on the IORESET pin immediately
terminates the current communication cycle. After IORESET
returns low, the AD9852 serial port controller requires the next
eight rising SCLK edges to be the instruction byte of the next
communication cycle.
All data input to the AD9852 is registered on the rising edge of
SCLK. All data is driven out of the AD9852 on the falling edge
of SCLK.
Figures 51 and 52 are useful in understanding the general operation of the AD9852 Serial Port.
CS
INSTRUCTION
BYTE
GENERAL OPERATION OF THE SERIAL INTERFACE
There are two phases to a communication cycle with the AD9852.
Phase 1 is the instruction cycle, which is the writing of an
instruction byte into the AD9852, coincident with the first eight
SCLK rising edges. The instruction byte provides the AD9852
serial port controller with information regarding the data transfer
cycle, which is Phase 2 of the communication cycle. The Phase
1 instruction byte defines whether the upcoming data transfer is
read or write, and the register address in which to transfer data
to/from.
INSTRUCTION
CYCLE
DATA BYTE 2
DATA BYTE 3
DATA TRANSFER
Figure 51. Using SDIO as a Read/Write Transfer
CS
INSTRUCTION
BYTE
The first eight SCLK rising edges of each communication cycle
are used to write the instruction byte into the AD9852. The
remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the AD9852
and the system controller. The number of data bytes transferred
in Phase 2 of the communication cycle is a function of the register address. The AD9852 internal serial I/O controller expects
every byte of the register being accessed to be transferred. Table
VII describes how many bytes must be transferred.
REV. 0
DATA BYTE 1
SDIO
SDIO
INSTRUCTION
CYCLE
DATA TRANSFER
DATA BYTE 1
DATA BYTE 2
DATA BYTE 3
SDO
DATA TRANSFER
Figure 52. Using SDIO as an Input, SDO as an Output
–27–
AD9852
Instruction Byte
The instruction byte contains the following information.
middle of a communication cycle. Care must be taken to compensate for this new configuration for the remainder of the
current communication cycle.
Table VIII. Instruction Byte Information
MSB
D6
D5
D4
D3
D2
D1
LSB
R/W
X
X
X
A3
A2
A1
A0
R/W—Bit 7 of the instruction byte determines whether a read or
write data transfer will occur after the instruction byte write. Logic
high indicates read operation. Logic zero indicates a write operation.
Bits 6, 5, and 4 of the instruction byte are don’t care.
A3, A2, A1, A0—Bits 3, 2, 1, 0 of the instruction byte determine
which register is accessed during the data transfer portion of the
communications cycle. See Table VIII for register address details.
SERIAL INTERFACE PORT PIN DESCRIPTION
SCLK
Serial Clock (Pin 21). The serial clock pin is used to synchronize
data to and from the AD9852 and to run the internal state
machines. SCLK maximum frequency is 10 MHz.
CS
Chip Select (Pin 22). Active low input that allows more than
one device on the same serial communications lines. The SDO
and SDIO pins will go to a high impedance state when this
input is high. If driven high during any communications cycle,
that cycle is suspended until CS is reactivated low. Chip Select
can be tied low in systems that maintain control of SCLK.
The system must maintain synchronization with the AD9852 or
the internal control logic will not be able to recognize further
instructions. For example, if the system sends the instruction to
write a 2-byte register, then pulses the SCLK pin for a 3-byte
register (24 additional SCLK rising edges), communication
synchronization is lost. In this case, the first 16 SCLK rising edges
after the instruction cycle will properly write the first two data
bytes into the AD9852, but the next eight rising SCLK edges
are interpreted as the next instruction byte, NOT the final byte
of the previous communication cycle.
In the case where synchronization is lost between the system and
the AD9852, the IO RESET pin provides a means to reestablish
synchronization without reinitializing the entire chip. Asserting
the IO RESET pin (active high) resets the AD9852 serial port state
machine, terminating the current IO operation and putting the
device into a state in which the next eight SCLK rising edges
are understood to be an instruction byte. The SYNC IO pin
must be deasserted (low) before the next instruction byte write can
begin. Any information that had been written to the AD9852
registers during a valid communication cycle prior to loss of
synchronization will remain intact.
tPRE
tSCLK
CS
tDSU
tSCLKPWH tSCLKPWL
SCLK
SDIO
Serial Data I/O (Pin 19). Data is always written into the AD9852
on this pin. However, this pin can be used as a bidirectional
data line. The configuration of this pin is controlled by Bit 0 of
register address 20h. The default is logic zero, which configures
the SDIO pin as bidirectional.
tDHLD
SDIO
1ST BIT
SYMBOL
TPRE
TSCLK
TDSU
TSCLKPWH
TSCLKPWL
TDHLD
SDO
Serial Data Out (Pin 18). Data is read from this pin for protocols that use separate lines for transmitting and receiving data.
In the case where the AD9852 operates in a single bidirectional
I/O mode, this pin does not output data and is set to a high
impedance state.
2ND BIT
MIN
DEFINITION
30ns
100ns
30ns
40ns
40ns
0ns
CS SETUP TIME
PERIOD OF SERIAL DATA CLOCK
SERIAL DATA SETUP TIME
SERIAL DATA CLOCK PULSEWIDTH HIGH
SERIAL DATA CLOCK PULSEWIDTH LOW
SERIAL DATA HOLD TIME
Figure 53. Timing Diagram for Data Write to AD9852
IO RESET
Synchronize I/O Port (Pin 17). Synchronizes the I/O port state
machines without affecting the addressable registers contents.
An active high input on IO RESET pin causes the current communication cycle to terminate. After IO RESET returns low (Logic
0) another communication cycle may begin, starting with the
instruction byte write.
CS
SCLK
SDIO
SDO
1ST BIT
NOTES ON SERIAL PORT OPERATION
The AD9852 serial port configuration bits reside in Bits 1 and 0
of register address 20h. It is important to note that the configuration changes immediately upon a valid I/O update. For
multibyte transfers, writing this register may occur during the
–28–
2ND BIT
tDV
SYMBOL
TDV
MAX
DEFINITION
30ns
DATA VALID TIME
Figure 54. Timing Diagram for Read from AD9852
REV. 0
AD9852
IR WRITE PHASE
DATA TRANSFER – TWO-BYTE WRITE
CS
SCLK
10
SDIO
11
12
13
14
15
16
17
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9 B10 B11 B12 B13 B14 B15
Figure 55. Data Write Cycle, SCLK Idle High
IR WRITE PHASE
DATA TRANSFER – TWO-BYTE READ
CS
SCLK
SDIO
10
11
SDO
12
13
14
15
16
17
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9 B10 B11 B12 B13 B14 B15
Figure 56. Data Read Cycle, 3-Wire Configuration, SCLK Idle Low
MSB/LSB TRANSFERS
The AD9852 serial port can support both most significant bit
(MSB) first or least significant bit (LSB) first data formats. This
functionality is controlled by Bit 1 of serial register bank 20h.
When this bit is set active high, the AD9852 serial port is in
LSB first format. This bit defaults low, to the MSB first format.
The instruction byte must be written in the format indicated by
Bit 1 of serial register bank 20h. That is, if the AD9852 is in
LSB first mode, the instruction byte must be written from
least significant bit to most significant bit.
Update Clock Operation
Programming the AD9852 is asynchronous to the system clock
with all data being stored in a buffer memory that does not
immediately affect the part operation. The buffer memory is
transferred to the register bank synchronous to system clock.
The register bank information affects part operation.
This transfer of data can occur automatically, with frequency of
updates programmable by the user, or can occur completely under
user control.
Complete user control, referred to as external update mode,
allows the user to drive the I/O UD signal from their ASIC or
DSP. The AD9852 I/O UD pin is configured as an input in
external update mode. A rising edge on I/O UD indicates to
the AD9852 that the contents of the buffer memory is to be
transferred to the register bank. The design uses an edge detector
to signal the AD9852 to transfer data which allows a very small
minimum high pulse width requirement (two system clock periods). Its important to note that if the user keeps I/O UD high,
the AD9852 will NOT continuously update the register bank.
REV. 0
Internal update mode, in which the AD9852 transfers data from
the buffer memory to the register bank automatically, configures
the AD9852 I/O UD pin as an output. The AD9852 generates a
high pulse on I/O UD pin to signal the user that the buffer memory
has just been transferred to the register bank. The minimum
high pulsewidth is designed to be eight system clock cycles (min).
The I/O UD signal can be used as an interrupt within the system.
Its important to note that as an output I/O UD pin will not have
anything approaching a 50/50 duty cycle for slower update rates.
Programming the Update Clock register for values less than five
will cause the I/O UD pin to remain high. The update clock functionality still works, its just that the user cannot use the signal as
an indication that data is transferring. This is an affect of the
minimum high pulse time when I/O UD is an output.
For internal update clock operation, the rate which the updates
occur is programmed into the update clock register. The update
clock register is 32 bits and the value written into the register
corresponds to HALF the number of clock cycles between updates.
That is, if a value of 00_00_00_0A (hex), is written into the update
clock register the rising edge of the I/O UD pin will occur every
20 cycles (0A hex equals 10 decimal).
CONTROL REGISTER
The Control Register is located in the shaded portion of the
Table V at address 1D through 20 hex. It is composed of 32
bits. Bit 31 is located at the top left position and Bit 0 is located
in the lower right position of the shaded table portion. The register has been subdivided below to make it easier to locate the
text associated with specific control categories.
–29–
AD9852
Power-Down Functions
Four bits are available to power down the AD9852. Each bit is
active high, that is, they default low and a Logic 1 causes the
power-down function to be working, The four bits all reside in
the same control byte such that one IO write cycle can complete
a full power-down by writing all four bits true simultaneously.
The four bits are located in Control Register [28, 26:24] and
are described below. The default state for these bits is Logic 0,
inactive.
CR[31:29] are open.
CR[28] is the comparator power-down bit. When set (Logic 1),
this signal indicates to the comparator that a power-down mode
is active.
frequency sweep pattern with very little (or no) user input
required. This bit is intended for chirp mode only, but there is
no logic to suppress its functionality in other modes.
CR[14] is the clear accumulator bit. This bit, active high, holds
both the accumulator 1 and accumulator 2 values at zero for as
long as the bit is active. This allows the DDS phase to be initialized via the I/O port.
CR[13] is the triangle bit. When this bit is set, the AD9852 will
automatically perform a continuous frequency sweep from the
Frequency 1 to Frequency 2 and back. The effect is a triangular
frequency sweep. When this bit is set, the operating mode must
be set to ramped FSK.
CR[11:9] are the three bits that describe the five operating modes
of the AD9852:
CR[27] must always be written to logic zero. Writing this bit to
Logic 1 causes the AD9852 to stop working until a master reset
is applied.
0h = Single-Tone Mode
1h = FSK Mode
2h = Ramped FSK mode
3h = Chirp Mode
4h = PSK Mode
CR[26] is the Control DAC power-down bit. When set (Logic
1), this signal indicates to the Control DAC that a power-down
mode is active.
CR[25] is the full DAC power-down bit. When set (Logic 1), this
signal indicates to both the cosine and Control DACs, as well as
the reference, that a power-down mode is active.
CR[24] is the digital power-down bit. When set (Logic 1), this
signal indicates to the digital section that a power-down mode is
active. Within the digital section, the clocks will be forced to dc,
effectively powering down the digital section. The REFCLK
input will still be seen by the PLL and the PLL will continue to
output the higher frequency.
REFCLK Multiplier PLL Functions
CR[8] is the internal update active bit. When this bit is set to
Logic 1, the I/O UD pin is an output and the AD9852 generates
the I/O UD signal. When Logic 0, external I/O UD functionality
is performed, the I/O UD pin is configured as an input.
CR[7] reserved, write to zero.
CR[6] is the bypass of the inverse sinc filter bit. When set, the
data from the DDS block goes directly to the shaped keying
logic and the clock to the inverse sinc filter is stopped. Default
is clear, filter enabled.
CR[5] is the shaped keying enable bit. When set the output
ramping function is enabled and is performed in accordance with
the CR[4] bit requirements.
Seven control register bits, located in the Control Register
[22:16] positions, relate to the PLL.
CR[23] is reserved, write to zero.
CR[22] is the PLL range bit. The PLL range bit controls the
VCO gain. The power-up state of the PLL range bit is Logic 1,
higher gain for frequencies above 200 MHz.
CR[21] is the bypass PLL bit, active high. When active, the PLL is
powered down and the REFCLK input is used to drive the system
clock signal. The power-up state of the bypass PLL bit is Logic 1,
PLL bypassed.
CR[4] is the internal/external shaped keying control bit. When set
Logic 1, the shaped keying factor will be internally generated and
applied to the I path. When clear, the shaped keying function is
externally controlled by the user and the shaped keying factor is
the I output shaped keying register values. The two registers
that are the ramp factors also default low such that the output is
off at power-up and until the device is programmed by the user.
CR[3:2] reserved, write to zero.
CR[1] is the serial port MSB/LSB first bit. Defaults low, MSB
first.
CR[20:16] bits are the PLL multiplier factor. These bits are the
REFCLK multiplication factor unless the bypass PLL bit is set.
The PLL multiplier valid range is from 4 to 20, inclusive.
CR[0] is the serial port SDO active bit. Defaults low, inactive.
Other Operational Functions
CR[15] is the clear accumulator 1 bit. This bit has a one-shot
type function. When written active, Logic 1, a clear accumulator
1 signal is sent to the DDS logic, resetting the accumulator value to
zero. The bit is then automatically reset, but the buffer memory
is not reset. This bit allows the user to easily create a sawtooth
–30–
REV. 0
AD9852
POWER DISSIPATION AND THERMAL
CONSIDERATIONS
The AD9852 is a multifunctional, very high-speed device that
targets a wide variety of synthesizer and agile clock applications.
The set of numerous innovative features contained in the device
each consume incremental power, the sum of which, if enabled
in combination, may exceed the safe thermal operating conditions of the device. Careful analysis and consideration of power
dissipation and thermal management is a critical element in the
successful application of the AD9852 device.
The AD9852 device is specified to operate within the industrial
temperature range of –40°C to +85°C. This specification is
conditional, however, such that the absolute maximum junction
temperature of 150°C is not exceeded. At high operating temperatures, extreme care must be taken in the operation of the device
to avoid exceeding the junction temperature which results in a
potentially damaging thermal condition.
Many variables contribute to the operating junction temperature
within the device, including:
1. Package Style
2. Selected Mode of Operation
3. Internal System Clock Speed
4. Supply Voltage
5. Ambient Temperature.
The combination of these variables determines the junction
temperature within the AD9852 device for a given set of operating
conditions.
The AD9852 device is available in two package styles: a thermallyenhanced surface-mount package with an exposed heat sink,
and a nonthermally-enhanced surface-mount package. The
thermal impedance of these packages are 16°C/W and 38°C/W
respectively, measured under still air conditions.
THERMAL IMPEDANCE
The thermal impedance of a package can be thought of as a
thermal resistor that exists between the semiconductor surface
and the ambient air. The thermal impedance of a package is
determined by package material and its physical dimensions. The
dissipation of the heat from the package is directly dependent upon
the ambient air conditions and the physical connection made
between the IC package and the PCB. Adequate dissipation of
power from the AD9852 relies upon all power and ground pins
of the device being soldered directly to a copper plane on a PCB.
In addition, the thermally-enhanced package of the AD9852ASQ
contains a heat sink on the bottom of the package that must be
soldered to a ground pad on the PCB surface. This pad must be
connected to a large copper plane which, for convenience, may be
ground plane. Sockets for either package style of the AD9852
device are not recommended.
REV. 0
JUNCTION TEMPERATURE CONSIDERATIONS
The power dissipation (PDISS) of the AD9852 device in a given
application is determined by many operating conditions. Some
of the conditions have a direct relationship with PDISS, such as
supply voltage and clock speed, but others are less deterministic.
The total power dissipation within the device, and its effect
on the junction temperature, must be considered when using the
device. The junction temperature of the device is given by:
Junction Temperature = (Thermal Impedance ×
Power Consumption) + Ambient Temperature
Given that the junction temperature should never exceed 150°C
for the AD9852, and that the ambient temperature can be 85°C,
the maximum power consumption for the AD9852AST is 1.7 W
and the AD9852ASQ (thermally-enhanced package) is 4.1 W.
Factors affecting the power dissipation are:
Supply Voltage—this obviously affects power dissipation and
junction temperature since PDISS equals V × I. Users should
design for 3.3 V nominal, however the device is guaranteed to
meet specifications over the full temperature range and over
the supply voltage range of 3.135 V to 3.465 V.
Clock Speed—this directly and linearly influences the total power
dissipation of the device and, therefore, junction temperature.
As a rule, to minimize power dissipation, the user should always
select the lowest internal clock speed possible to support a given
application. Normally the usable frequency output bandwidth
from a DDS is limited to 40% of the clock rate to keep reasonable
requirements on the output low-pass filter. For the typical DDS
application, the system clock frequency should be 2.5 times
the highest desired output frequency.
Mode of Operation—the selected mode of operation for the
AD9852 has a great influence on total power consumption. The
AD9852 offers many features and modes, each of which imposes
an additional power requirement. The collection of features
contained in the AD9852 target a wide variety of applications
and the device was designed under the assumption that only a
few would be enabled for any given application. In fact, the user
must understand that enabling multiple features at higher clock
speeds may cause the junction temperature of the die to be
exceeded. This can severely limit the long-term reliability of the
device. Figure 57 provides a summary of the power requirements associated with the individual features of the AD9852.
This table should be used as a guide in determining the optimum
application of the AD9852 for reliable operation.
As can be seen in the Figure 57, the Inverse Sinc filter function
requires a significant amount of power, and much forethought
and scrutiny should be given to its use. As an alternate approach
to maintaining flatness across the output bandwidth, the Digital
Multiplier function may be used to adjust the output signal
level, at a dramatic savings in power consumption. Careful planning and management in the use of the feature set will minimize
power dissipation and avoid exceeding junction temperature
requirements within the IC.
–31–
AD9852
1400
450
400
1200
SUPPLY CURRENT – mA
SUPPLY CURRENT – mA
350
1000
800
600
400
INVERSE SINC
300
250
200
MULTIPLIERS
150
AUX DAC
100
COMPARATOR
200
50
0
0
20
60
100
140
180
220
FREQUENCY – MHz
260
300
20
60
100
140
180
220
FREQUENCY – MHz
260
300
Figure 57a. Power Consumption vs. Clock Frequency
Showing Supply Current Consumption When All Optional
Circuitry Is Enabled
Figure 57b. Decrease in Current Consumption When Various Circuitry Is Disabled
EVALUATION OF OPERATING CONDITIONS
THERMALLY ENHANCED PACKAGE MOUNTING
GUIDELINES
The second step is to determine the maximum required operating
temperature for the AD9852 in the given application. Subtract
this value from 150°C, which is the maximum junction temperature allowed for the AD9852. For the extended industrial
temperature range of 85°C, the result will be 65°C. This is the
maximum rise in temperature that the junction may experience
due to power dissipation.
The third step is to divide this maximum rise number by the
thermal impedance, to arrive at the maximum power dissipation
allowed for the application. For the example, so far, 65°C divided
by both versions of the AD9852 package’s thermal impedances
of 38°C/W and 16°C/W, yields a total power dissipation limit
of 1.7 W and 4.1 W (respectively). This means that for a 3.3 V
nominal power supply voltage, the current consumed by the device
under full operating conditions must not exceed 515 mA in the
standard plastic package and 1242 mA in the thermally-enhanced
package. The total set of enabled functions and operating conditions of the AD9852 application must support these current
consumption limits.
The following are general recommendations for mounting the
thermally enhanced exposed heat sink package (AD9852ASQ)
to printed circuit boards. The exceptional thermal characteristics of
this package depend entirely upon proper mechanical attachment.
Figure 58 depicts the package from the bottom and shows the
dimensions of the exposed heat sink. A solid conduit of solder
needs to be established between this pad and the surface of
the PCB.
Figure 59 depicts a general PCB land pattern for such an exposed
heat sink device. Note that this pattern is for a 64-lead device not
an 80-lead, but the relative shapes and dimensions still apply.
In this land pattern, a solid copper plane exists inside of the
individual lands for device leads. Note also that the solder mask
opening is conservatively dimensioned to avoid any assembly
problems.
10mm
14mm
U NT
RY
Figure 57a and 57b may be used to determine the suitability
of a given AD9852 application vs. power dissipation requirements.
These graphs assume that the AD9852 device will be soldered to
a multilayer PCB per the recommended best manufacturing
practices and procedures for the given package type. This ensures
that the specified thermal impedance specifications will be
achieved.
CO
The first step in applying the AD9852 is to select the internal
clock frequency. Clock frequency selections above 200 MHz
will require the thermally-enhanced package (AD9852ASQ);
clock frequency selections of 200 MHz and below may allow the
user to use the standard plastic surface-mount package, but more
information will be needed to make that determination.
Figure 58.
–32–
REV. 0
AD9852
SOLDER MASK
OPENING
THERMAL LAND
Figure 59.
The thermal land itself must be able to distribute heat to an even
larger copper plane such as an internal ground plane. Vias must be
uniformly provided over the entire thermal pad to connect to this
internal plane. A proposed via pattern is shown in Figure 60. Via
holes should be small (12 mils, 0.3 mm) such that they can be
plated and plugged. These will provide the mechanical conduit
for heat transfer.
Figure 61.
EVALUATION BOARD
An evaluation board is available that supports the AD9852 DDS
devices. This evaluation board consists of a PCB, software, and
documentation to facilitate bench analysis of the performance of
the AD9852 device. It is recommended that users of the AD9852
familiarize themselves with the operation and performance
capabilities of the device with the evaluation board. The evaluation
board should also be used as a PCB reference design to ensure
optimum dynamic performance from the device.
OPERATING INSTRUCTIONS
To assist in proper placement of the pin-header shorting-jumpers,
the instructions will refer to direction (left, right, top, bottom)
as well as header pins to be shorted. Pin #1 for each three pinheader has been marked on the PCB corresponding with the
schematic diagram. When following these instructions, position
the PCB so that the text can be read from left to right. The
board is shipped with the pin-headers configuring the board
as follows:
1. REFCLK for the AD9852 is configured as differential. The
differential clock signals are provided by the 100LVEL16
differential receiver.
2. Input clock for the 100LVEL16 is single-ended via J5. This
signal may be 3.3 V CMOS or a 2 V p-p sine wave capable of
driving 50 Ω (R8).
Figure 60.
Finally, a proposed stencil design is depicted for screen solder
placement. Note that if vias are not plugged, wicking will occur
which will displace solder away from the exposed heat sink and
the necessary mechanical bond will not be established.
3. Both DAC outputs from the AD9852 are routed through
the two 120 MHz elliptical LP filters and their outputs connected to J3 (Q) and J4 (I).
4. The board is set up for software control via the printer port
connector.
5. Configured for AD9852 operation.
Load the software from the CD onto the host PC’s hard disk.
Only Windows 9X/NT operating system is supported. Connect
a printer cable from the PC to the AD9852 Evaluation Board
printer port connector labeled “J11.”
REV. 0
–33–
AD9852
Attach power wires to connector labeled “TB1” using the screwdown terminals. This is a plastic connector that press-fits over a
4-pin header soldered to the board. Table IX below shows connections to each pin. DUT = “device under test.”
If programming of the AD9852 is not to be provided by the host
PC via the ADI software, then headers W11, W12, W14, and W15
should be opened (shorting jumpers removed). This effectively
detaches the PC interface and allows the 40-pin header, J10, to
assume control without bus contention. Input signals on J10 going
to the AD9852 should be 3.3 V CMOS logic levels.
Table IX. Power Requirements for DUT Pins
AVDD 3.3 V
for All DUT
Analog Pins
DVDD 3.3 V
for All DUT
Digital Pins
VCC 3.3 V
for All Other
Devices
Low-Pass Filter Testing
Ground
—for All
Devices
Attach REFCLK
There are three possibilities to choose from:
1. On-Board (But Optional) Crystal Clock Oscillator, Y1.
Insert an appropriate 3.3 V CMOS clock oscillator. See that
the shorting jumper at W5 is located on Pins 1 and 2 (the left
two pins). This routes the single-ended oscillator output to a
very high speed “Differential Receiver” (the MC100LVEL16),
where the signal is transformed to a differential PECL output.
To route the differential output signals to AD9852, two more
switches must be configured. W9 must have a shorting jumper
on Pins 2 and 3 (the right two pins). To engage the differential clocking mode of the AD9852 W3, Pins 2 and 3 (the right
two pins) must be connected with a shorting jumper.
2. External Differential Clock Input, J5.
This is actually just another single-ended input that will be
routed to the MC100LVEL16 for conversion to differential
PECL output. This is accomplished by attaching a 2 V p-p
clock or sine wave source to J5. Note that this is a 50 Ω
impedance point set by R8. The input signal will be accoupled and then biased to the center switching threshold
of the MC100LVEL16. Position the shorting jumper of W5
to Pins 2 and 3 (the right two pins) to route the signal at J5
to the differential receiver IC. To route the differential output
signals to AD9852, two more switches must be configured.
W9 must have a shorting jumper on Pins 2 and 3 (the right
two pins). To engage the differential clocking mode of the
AD9852 W3, Pins 2 and 3 (the right two pins) must be
connected with a shorting jumper.
3. External Single-Ended Clock Input, J7.
This mode bypasses the MC100LVEL16 and directly drives
the AD9852 with your reference clock. Attach a 50 Ω, 2 V p-p
sine source that is dc offset to 1.65 V, or a 50 Ω CMOS-level
clock source to J7. Remove the shorting jumper from W5
altogether to make certain that the device (U3) is not Toggling
or Self-Oscillating. Set the shorting jumper at W9 on Pins 1
and 2 (the left two pins) to route the REFCLK signal from J7
to Pin 69 of the AD9852. Finally, set the shorting jumper at
W3 to Pins 1 and 2 (the left two pins) to place the AD9852
in the single-ended clock mode.
The purpose of 2-pin headers W7 and W10 (associated with J1
and J2) are to allow the two 50 Ω, 120 MHz filters to be tested
during PCB assembly without interference from other circuitry
attached to the filter inputs. Normally, a shorting jumper will be
attached to each header to allow the DAC signals to be routed to the
filters. If the user wishes to test the filters, the shorting jumpers
at W7 and W10 should be removed and 50 Ω test signals applied
at J1 and J2 inputs to the 50 Ω elliptic filters. User should refer
to Figure 62 and the following sections to properly position the
remaining shorting jumpers.
Observing the Unfiltered IOUT1 and the Unfiltered IOUT2
DAC Signals
This allows the viewer to observe the unfiltered DAC outputs at
J2 (the “I” signal) and J1 (the “Q” signal). The procedure below
simply routes the two 50 Ω terminated analog DAC outputs to
the BNC connectors and disconnects any other circuitry. The
“raw” DAC outputs will be a series of quantized (stepped) output
levels. The default 10 mA output current will develop a 0.5 V p-p
signal across the on-board 50 Ω termination. When connected
to an external 50 Ω input, the DAC will therefore develop 0.25 V p-p
due to the double termination.
1. Install shorting jumpers at W7 and W10.
2. Remove shorting jumper at W16.
3. Remove shorting jumper from 3-pin header W1.
4. Install shorting jumper on Pins 1 and 2 (bottom two pins) of
3-pin header W4.
Observing the Filtered IOUT1 and the Filtered IOUT2
This allows viewer to observe the filtered sine DAC and control
DAC outputs at J4 (the sine signal) and J3 (the control DAC
signal). This places the 50 Ω (input and output Z) low-pass
filters in the I and Q DAC pathways to remove images and
aliased harmonics and other spurious signals above the dc to
approximately 120 MHz bandpass. These filters are designed
with the assumption that the system clock speed is at or near
maximum (300 MHz). If the system clock utilized is much less
than 300 MHz, for example, 200 MHz, unwanted DAC products
other than the fundamental signal will be passed by the lowpass filters.
1. Install shorting jumpers at W7 and W10.
2. Install shorting jumper at W16.
3. Install shorting jumper on Pins 1 and 2 (bottom two pins) of
3-pin header W1.
Regardless of the origination, the signals arriving at the AD9852
are called the Reference Clock. If you choose to engage the
on-chip REFCLK Multiplier, this signal is the reference clock
for the REFCLK Multiplier and the REFCLK Multiplier output
becomes the SYSTEM CLOCK. If you choose to bypass the
REFCLK Multiplier, the reference clock that you have supplied is
directly operating the AD9852 and is, therefore, the system clock.
Observing the Filtered I OUT and the Filtered IOUTB
Three-state control or switch headers W11, W12, W14, and
W15 must be shorted to allow the provided software to control
the AD9852 evaluation board via the printer port connector J11.
This allows viewer to observe only the filtered sine DAC
outputs at J4 (the “true” signal) and J3 (the “complementary”
signal). This places the 120 MHz low-pass filters in the true
4. Install shorting jumper on Pins 1 and 2 (bottom two pins) of
3-pin header W4.
5. Install shorting jumper on Pins 1 and 2 (top two pins) of 3pin header W2 and W8.
–34–
REV. 0
AD9852
and complementary output paths of the sine DAC to remove
images and aliased harmonics and other spurious signals above
approximately 120 MHz. These signals will appear as nearly pure
sine waves and exactly 180 degrees out-of-phase with each other.
Again, if the system clock utilized is much less than 300 MHz, for
example, 200 MHz, unwanted DAC products other than the
fundamental signal will be passed by the low-pass filters.
1. Install shorting jumpers at W7 and W10.
2. Install shorting jumper at W16.
3. Install shorting jumper on Pins 2 and 3 (top two pins) of 3pin header W1.
4. Install shorting jumper on Pins 2 and 3 (top two pins) of 3pin header W4.
5. Install shorting jumper on Pins 1 and 2 (top two pins) of 3pin header W2 and W8.
Connecting the High-Speed Comparator in a Single-Ended
Configuration
This will allow duty cycle or pulsewidth control and requires
that a dc threshold voltage be present at one of the comparator
inputs. You may supply this voltage using the control DAC. A
12-bit, twos-complement value is written to the control DAC
register that will set the IOUT2 output to a static dc level.
Allowable hexadecimal values are 7FF (maximum) to 800
(minimum) with all 0s being midscale. The IOUT1 channel will
continue to output a filtered sine wave programmed by the user.
These two signals are routed to the comparator inputs using
W2 and W8 3-pin header switches. The configuration described
above entitled “Observing the Filtered IOUT1 and the Filtered
IOUT2” must be used. Follow steps 1 through 4 above and
then the following Step 5.
5. Install shorting jumper on Pins 2 and 3 (bottom two pins) of
3-pin header W2 and W8
User should elect to change the RSET resistor from 3900 Ω to
1950 Ω to obtain a more robust signal at the comparator inputs.
This will decrease jitter and extend comparator operating range.
User can accomplish this by soldering a second 3.9 kΩ chip
resistor in parallel with the provided R2.
USING THE CONTROL SOFTWARE
The control software for the AD9852/PCB evaluation board is
provided on a CD. This brief set of instructions should be used
in conjunction with the AD9852/PCB evaluation board schematic.
Several numerical entries, such as frequency and phase information, require that the ENTER key by pressed to register
that information.
REV. 0
1. Select the proper printer port. Click the “Parallel Port”
selection in the menu bar. Select the port that matches your
PC. If unknown, experiment by performing the following on
the selected port. With the part powered up, properly clocked
and connected to the PC, select a port and go to the “Mode
and Frequency” menu and click the “Reset DUT and Initialize
Registers” button. Then go to the “Clock and Amplitude”
menu. Once there, click the box next to “Bypass Inverse Sinc
Filter” . . . a check mark will appear in the box . . . next click
the button “Send Control Info to DUT.” If the proper port
has been selected, the supply current going to the AD9852/
PCB evaluation board should drop by approximately 1/3 when
the inverse sinc filters are bypassed. Conversely, the supply
current will increase approximately 1/3 when the inverse sinc
filters are engaged.
2. Normal operation of the AD9852/PCB evaluation board
begins with a master reset. Many of the default register values
after reset are depicted in the software “control panel.” The
reset command sets the DDS output amplitude to minimum
and 0 Hz, 0 phase-offset as well as other states listed in the
AD9852 Register Layout table in the preliminary data sheet.
3. The next programming block should be the “Reference Clock
and Multiplier” since this information is used to determine
the proper 48-bit frequency tuning words that will be entered
and calculated later.
4. The output amplitude defaults to the 12-bit straight binary
multiplier values of the I and Q multiplier registers of 000hex
and no output should be seen from the DACs. User should
now set both multiplier amplitudes in the Output Amplitude
window to a substantial value, such as FFFhex. You may
bypass the digital multiplier by clicking the box “Output
Amplitude is always Full-Scale” but experience has shown
that doing so does not result in best SFDR It is interesting
to note that best SFDR, as much as 11 dB better, is obtained
by routing the signal through the digital multiplier and “backing
off” on the multiplier amplitude. For instance, FC0 hex
produces less spurious signal amplitude than FFF hex. Its a
repeatable phenomenon that should be investigated exploited
for maximum SFDR (spurious-free dynamic range).
5. Refer to this data sheet and evaluation board schematic to
understand all the functions of the AD9852 available to the
user and to gain an understanding of what the software is
doing in response to programming commands.
Applications assistance is available for the AD9852, the
AD9852/PCB evaluation board, and all other Analog Devices
products. Please call 1/800-ANALOGD.
–35–
AD9852
Figure 62a. Evaluation Board Schematic
–36–
REV. 0
AD9852
Figure 62b. Evaluation Board Schematic
REV. 0
–37–
AD9852
Customer Evaluation Board REV C, Bill of Material
#
Quantity
REFDES
Device
Package
Value
1
2
5
23
Chip Cap
Chip Cap
0805
0805
0.1 µF
3
4
5
6
2
2
3
2
2
2
2
2
7
1
1
4
2
2
2
2
1
3
2
2
2
4
1
1
1
1
1
4
3
1
7
8
1
4
C1, C2, C35, C36, C45
C3, C7, C8, C9, C10, C11, C12, C13, C14,
C15, C16, C17, C18, C19, C20, C22, C23,
C24, C26, C27, C28, C29, C44
C4, C37
C5, C38
C6, C21, C25
C30, C39
C31, C40
C32, C41
C33, C42
C34, C43
J1, J2, J3, J4, J5, J6, J7
0805
0805
BCAPTAJD
0805
0805
0805
0805
0805
Conn
PCB
40CONN
Chip Ind
Chip Ind
RES_SM
RES_SM
RES_SM
RES_SM
RES_SM
RES_SM
RES_SM
RES_SM
RES_SM
RP1
TB4
AD9852
74HC125A
MC100LVEL1
74HC14
74HC574
36PINCONN
JUMP3PIN
2PINJUMP
XTAL
PIN SOCK
0805
0805
TAJD
0805
0805
0805
0805
0805
BNC
GS02669REVC
SAM5-40
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
SIP-10P
TB4
80LQFP
SO14
SO8NB
SO14
SO20WB
CONN
SIP-3P
2PINJUMP
COSC
Amp 5-330808-6
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
J10
L1, L2, L3, L5
L4, L6
R1, R5
R2, R20
R3, R7
R4
R6, R8, R19
R9, R10
R11, R14
R12, R13
R15, R16, R17, R18
RP1
TB
U1
U2
U3
U4, U5, U6, U7
U8, U9, U10
U11
W1, W2, W3, W4, W5, W8, W9
W6, W7, W10, W11, W12, W14, W15, W16
Y1
–38–
27 pF
47 pF
10 µF
39 pF
22 pF
2.2 pF
12 pF
8.2 pF
68NH
82NH
51
3900
24
1300
50
100
160
260
10K
10K
REV. 0
AD9852
Figure 63. Assembly Drawing
Figure 64. Top Routing Layer, Layer 1
REV. 0
–39–
AD9852
Figure 65. Power Plane Layer, Layer 2
Figure 66. Ground Plane Layer, Layer 3
–40–
REV. 0
AD9852
Figure 67. Bottom Routing, Layer 4
REV. 0
–41–
AD9852
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
0.063 (1.60)
MAX
0.030 (0.75)
0.024 (0.60)
0.018 (0.45)
C3727–8–10/99
80-Lead LQFP_ED
(SQ-80)
0.630 (16.00) BSC SQ
0.394 (10.00)
REF SQ
0.551 (14.00) BSC SQ
80
60
SEATING
PLANE
80
61
61
1
60
1
PIN 1
THERMAL
SLUG
TOP VIEW
(PINS DOWN)
COPLANARITY
0.004 (0.10)
MAX
BOTTOM VIEW
20
41
21
20
41
40
40
0.006 (0.15)
0.002 (0.05)
21
0.057 (1.45)
0.055 (1.40)
0.053 (1.35)
0.008 (0.20)
0.004 (0.09)
0.0256 (0.65)
BSC
0.015 (0.38)
0.013 (0.32)
0.009 (0.22)
78
3.58
08
CONTROLLING DIMENSIONS IN MILLIMETERS.
CENTER FIGURES ARE NOMINAL UNLESS OTHERWISE NOTED.
80-Lead LQFP
(ST-80)
0.640 (16.25)
SQ
0.620 (15.75)
0.553 (14.05)
SQ
0.549 (13.95)
0.063 (1.60)
MAX
0.030 (0.75)
0.020 (0.50)
80
1
61
60
SEATING
PLANE
0.486
(12.35)
TYP
SQ
TOP VIEW
(PINS DOWN)
20
21
41
40
0.029 (0.73)
0.022 (0.57)
–42–
PRINTED IN U.S.A.
0.004 (0.10)
MAX
0.006 (0.15)
0.002 (0.05)
0.057 (1.45)
0.053 (1.35)
0.014 (0.35)
0.010 (0.25)
REV. 0