VISHAY SI4300DY

Si4300DY
Vishay Siliconix
N-Channel 30-V (D-S), Reduced Qg
Fast Switching MOSFET with Schottky Diode
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
ID (A)
0.0185 @ VGS = 10 V
9
0.033 @ VGS = 4.5 V
7
FEATURES
D TrenchFETr Power MOSFET
D LITTLE FOOT Plust Integrated Schottky
D PWM Optimized
APPLICATIONS
SCHOTTKY PRODUCT SUMMARY
D Low Power Sychronous Rectification
VDS (V)
VSD (v)
Diode Forward Voltage
IF (A)
30
0.5 V @ 1 A
2.0
SO-8
D
S/A
1
8
D/K
S/A
2
7
D/K
S/A
3
6
D/K
G
4
5
D/K
K
Schottky Diode
G
N-Channel MOSFET
Top View
Ordering Information: Si4300DY
Si4300DY-T1 (with Tape and Reel)
A
S
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage (MOSFET)
VDS
30
Reverse Voltage (Schottky)
VDA
30
Gate-Source Voltage
TA = 25_C
TA = 70_C
Pulsed Drain Current (MOSFET)
Average Foward Current (Schottky)
Pulsed Foward Current (Schottky)
Maximum Power Dissipation (MOSFET)a
Maximum Power Dissipation (Schottky)a
9
ID
6.4
7
5.1
IDM
Continuous Source Current (MOSFET Diode Conduction)a
40
IS
2.3
IF
2.3
1.25
20
TA = 25_C
TA = 25_C
PD
TA = 70_C
Operating Junction and Storage Temperature Range
A
1.25
IFM
TA = 70_C
V
"20
VGS
Continuous Drain Current (TJ = 150
150_C)
C)
(MOSFET)a
Unit
2.5
1.38
1.6
0.88
2.2
1.25
1.4
W
0.80
TJ, Tstg
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
MOSFET
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady-State
Steady-State
RthJA
RthJF
Schottky
Typ
Max
Typ
Max
40
50
45
55
70
90
78
100
18
23
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71772
S-03951—Rev. B, 26-May-03
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2-1
Si4300DY
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED).
Parameter
Symbol
Test Condition
Min
0.8
Typa
Max
Unit
"100
nA
Static
VGS(th)
VDS = VGS, ID = 250 mA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
Gate Threshold Voltage
Drain Source On-State
Drain-Source
On State Resistanceb
Forward Transconductanceb
Schottky Diode Forward Voltageb
rDS(on)
DS( )
V
VDS = 24 V, VGS = 0 V
100
VDS = 24 V, VGS = 0 V, TJ = 85_C
2000
VDS w 5 V, VGS = 10 V
30
mA
A
VGS = 10 V, ID = 9 A
0.0155
0.0185
VGS = 4.5 V, ID = 7 A
0.0275
0.033
gfs
VDS = 15 V, ID = 9 A
16
VSD
IS = 1.0 A, VGS = 0 V
0.47
0.5
8.7
13
VDS = 15 V,, VGS = 5 V,, ID = 9 A
2.25
W
S
V
Dynamica
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Turn-On Delay Time
Rise Time
Rg
0.5
2.7
td(on)
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
4.2
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
IF = 2.3 A, di/dt = 100 A/ms
11
16
8
15
22
30
9
15
32
60
W
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
SCHOTTKY SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Forward Voltage Drop
Maximum Reverse Leakage
g Current
Junction Capacitance
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Symbol
VF
Irm
CT
Test Condition
Typ
Max
IF = 1.0 A
Min
0.47
0.5
IF = 1.0 A, TJ = 125_C
0.36
0.42
Vr = 24 V
0.004
0.100
Vr = 24 V, TJ = 100_C
0.7
10
Vr = - 24 V, TJ = 125_C
3.0
20
Vr = 10 V
50
Unit
V
mA
pF
Document Number: 71772
S-03951—Rev. B, 26-May-03
Si4300DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Output Characteristics
Transfer Characteristics
40
40
VGS = 10 thru 5 V
32
32
I D - Drain Current (A)
I D - Drain Current (A)
4V
24
16
3V
8
24
16
TC = 125_C
8
25_C
- 55_C
0
0
0
2
4
6
8
10
0
1
VDS - Drain-to-Source Voltage (V)
2
4
5
VGS - Gate-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current
1200
0.15
1000
0.12
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
3
0.09
0.06
VGS = 4.5 V
0.03
VGS = 10 V
Ciss
800
600
Coss
400
200
Crss
0.00
0
0
8
16
24
32
40
0
5
ID - Drain Current (A)
15
20
25
30
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
10
1.8
VDS = 15 V
ID = 9 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
10
8
6
4
1.6
VGS = 10 V
ID = 9 A
1.4
1.2
1.0
0.8
2
0.6
0
0
3
6
9
Qg - Total Gate Charge (nC)
Document Number: 71772
S-03951—Rev. B, 26-May-03
12
15
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si4300DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
50
TJ = 150_C
10
TJ = 25_C
1
0.0
0.16
ID = 9 A
0.12
0.08
0.04
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
VSD - Source-to-Drain Voltage (V)
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.6
30
0.4
ID = 250 mA
25
Power (W)
V GS(th) Variance (V)
0.2
- 0.0
- 0.2
- 0.4
20
15
10
- 0.6
5
- 0.8
- 1.0
- 50
0
- 25
0
25
50
75
100
125
150
0.01
0.1
TJ - Temperature (_C)
10
1
30
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
0.02
2. Per Unit Base = RthJA = 70_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
t1
t2
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 71772
S-03951—Rev. B, 26-May-03
Si4300DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Reverse Current vs. Junction Temperature
20
Forward Voltage Drop
10
10
TJ = 150_C
I F - Forward Current (A)
I R - Reverse Current (mA)
SCHOTTKY
1
30 V
0.1
24 V
0.01
TJ = 25_C
0.001
0.0001
0
25
50
75
100
125
150
TJ - Temperature (_C)
1
0.0
0.3
0.6
0.9
1.2
1.5
VF - Forward Voltage Drop (V)
Capacitance
200
C - Capacitance (pF)
160
120
80
Coss
40
0
0
6
12
18
24
30
VDS - Drain-to-Source Voltage (V)
Document Number: 71772
S-03951—Rev. B, 26-May-03
www.vishay.com
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