CGB 240 Datasheet 2-Stage Bluetooth InGaP HBT Power Amplifier Description: Applications: • Bluetooth Class 1 The CGB240 GaAs Power Amplifier MMIC has been especially developed for wireless applications in the 2.4 - 2.5 GHz ISM band (e.g. Bluetooth class 1). Its high power added efficiency and single positive supply operation makes the device ideally suited to handheld applications. The device delivers 23 dBm output power at a supply voltage of 3.2 V, with an overall PAE of 50%. The output power can be adjusted using an analog control voltage (VCTR). Simple external input-, interstage-, and output matching circuits are used to adapt to the different requirements of linearity and harmonic suppression in various applications. For WLAN applications (IEEE802.11b) or applications serving both WLAN and Bluetooth, we recommend to use the CGB240B device. Features: • Single voltage supply. • Cordless Phones • Home RF Package Outline: 1 • Wide operating voltage range 2.0 - 5.5 V. • POUT = 23 dBm at VC = 3.2 V. • Overall power added efficiency (PAE) typically 50%. • High PAE at low–power mode. • Analog power control with four power steps. • Straight-Forward Matching; Few external components. For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 5 SOP-10-2 TSMSOP-10 Pin Configuration: 1 & 2: 3: 4, 5, & 10: 6: 7: 8 & 9: 11 (Paddle): Vc1 RF In NC Vcntrl1 Vcntrl2 Vc2 GND pg. 2/13 CGB 240 Datasheet Absolute Maximum Ratings: Parameter Supply voltage- CW Supply voltage- Pulsed Power control voltage DC supply current- Stage 1 DC supply current- Stage 2 Total Power Dissipation 2 RF Input Power RF Output Power 1 2 Symbol Min. Max. Units Vcc Vcc Vapc Icc Icc PTOT PIN, MAX 0 0 0 0 0 5.5 5.0 3.2 40.0 160.0 0.5 +10 Vdc Vdc V mA mA W dBm POUT, MAX Ta Ts Operating case temperature Storage temperature +25 dBm -20 85 ºC -55 150 ºC 1 Thermal resistance between junction and pad 11 ( = heatsink ): RTHCH = 100 K/W. No RF input signal should be applied before turn-on of DC Power. An output VSWR of 1:1 is assumed. 2 Electrical Characteristics of CGB240 Device used in Bluetooth PA Reference Design (See Application Note 1) TA = 25 °C; VCC = 3.2 V; f = 2.4 ... 2.5 GHz; ZIN = ZOUT = 50 Ohms Parameter Symbol Limit Values min Unit Test Conditions mA PIN = - 10 dBm VCTR = 2.5 V 26 dB PIN = - 10 dBm VCTR = 2.5 V typ 125 max Supply Current Small-Signal Operation ICC,SS Power Gain Small-Signal Operation GSS Output Power Power Step 1 POUT,1 7 dBm PIN = + 3 dBm VCTR = 1.15 V Supply Current Power Step 1 ICC,1 15 mA PIN = + 3 dBm VCTR = 1.15 V Power Added Efficiency Power Step 1 PAE 1 10 % PIN = + 3 dBm VCTR = 1.15 V 23 For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 150 pg. 3/13 CGB 240 Datasheet Electrical Characteristics of CGB240 used in PA Reference Design (cont.) Parameter Symbol Limit Values Min Typ Unit Test Conditions Max Output Power Power Step 2 POUT,2 12 dBm PIN = + 3 dBm VCTR = 1.3 V Supply Current Power Step 2 ICC,2 25 mA PIN = + 3 dBm VCTR = 1.3 V Power Added Efficiency Power Step 2 PAE 2 20 % PIN = + 3 dBm VCTR = 1.3 V Output Power Power Step 3 POUT,3 17 dBm PIN = + 3 dBm VCTR = 1.5 V Supply Current Power Step 3 ICC,3 52 mA PIN = + 3 dBm VCTR = 1.5 V Power Added Efficiency Power Step 3 PAE 3 32 % PIN = + 3 dBm VCTR = 1.5 V Output Power Power Step 4 POUT,4 dBm PIN = + 3 dBm VCTR = 2.5 V Supply Current Power Step 4 ICC,4 mA PIN = + 3 dBm VCTR = 2.5 V Power Added Efficiency Power Step 4 PAE 4 % PIN = + 3 dBm VCTR = 2.5 V 2nd Harm. Suppression Power Step 4 h2 - 35 dBc PIN = + 3 dBm VCTR = 2.5 V 3rd Harm. Suppression Power Step 4 h3 - 50 dBc PIN = + 3 dBm VCTR = 2.5 V Turn-Off Current ICC,OFF 1 uA VCC = 3.2 V; VCTR < 0.4 V; No RF Input Off-State Isolation S21,0 26 dB PIN = + 3 dBm VCTR = 0 V Rise Time 1 ) TR1 1 µs VCC = 5.0 V VCTR = 0 to 1V Step Rise Time 2 1) TR2 1 µs VCC = 5.0 V VCTR = 0 to 3V Step Fall Time 1 1) TF1 1 µs VCC = 5.0 V VCTR = 1 to 0V Step Fall Time 2 1) TF2 1 µs VCC = 5.0 V VCTR = 3 to 0V Step Maximum Load VSWR (no damage to device) allowed for 10s VSWR 6 22 23 24 125 40 50 - PIN = + 5 dBm; VCC = 4.8 V; VCTR = 2.5 V ZIN = 50 Ohms 1) Rise time TR: time between turn-on of VCTR voltage until reach of 90% of full output power level. Fall time TF: as time between turn-off of VCTR voltage until reach of 10% of full output power level. Please note: Reduced Vccp,max for pulsed operation applies (see “absolute maximum ratings”). For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 4/13 CGB 240 Datasheet S–Parameters for Linear Small-Signal Operation TA = 25 °C; VCC = 2.8 to 3.2 V; VCTR = 2.5 to 2.8 V; f = 2.4 ... 2.5 GHz PIN < - 4 dBm; Interstage match pin terminated with (1 + j 12.5) Ohms. Parameter (Target Data) Symbol Typ. Value Magnitude Input Reflection MAG (S11) 0.67 Unit ANG (S11) + 180 2) MAG (S21) 20 dB 2 Magnitude Reverse Power Gain ) MAG (S12) – 47 dB Magnitude Output Reflection ) MAG (S22) 0.59 Phase Output Reflection 2) ANG (S22) + 147 Phase Input Reflection Magnitude Forward Power Gain 2 Degrees Degrees ) Measured for small signal conditions in pure 50 Ohm environment. For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 5/13 CGB 240 Datasheet Typical Device Performance for Reference Design (see Application Note 1) Valid for all plots: TA = 25 °C; VCC = 3.2 V; VCTR = 2.5 V; f = 2.4 ... 2.5 GHz; ZIN = ZOUT = 50 Ohms. Changes from these values noted. Efficiency PAE = f ( VCC ) PIN = +3dBm Output Power POUT = f ( VCC ) PIN = +3dBm 60,0 25,0 % dBm 23,0 50,0 Output Power Pout Power Added Efficiency PAE 55,0 45,0 40,0 21,0 19,0 17,0 35,0 30,0 15,0 2,0 V 5,0 3,0 4,0 Supply Voltage Vcc 2,0 Supply Current ICC = f ( VCTR ) PIN = +3dBm V 5,0 3,0 4,0 Supply Voltage Vcc Output Power POUT = f ( VCTR ) PIN = +3dBm 140,0 25,0 mA dBm 120,0 Vcc=3.2V 20,0 Vcc=3.2V Vcc=2.8V 15,0 Output Power Pout Supply Current Icc 100,0 80,0 Vcc=2.8V 60,0 40,0 20,0 10,0 5,0 0,0 -5,0 0,0 -10,0 1,0 1,5 2,0 2,5 V 3,0 Vctr For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 1,0 1,5 2,0 2,5 V 3,0 Vctr pg. 6/13 CGB 240 Datasheet Output Power Compression POUT = f ( PCIN ) PIN = +3dBm 150 25,0 dBm mA Vcc=3.2V 140 15,0 Total Supply Current Icc Output Power Pout 20,0 Vcc=2.8V 10,0 5,0 0,0 -20,0 Supply Current ICC = f ( TA ) PIN = +3dBm, Vcc = 3.2V 130 120 110 100 -15,0 -10,0 -5,0 Input Power Pin 0,0 dBm 5,0 -40 Output Power POUT = f ( TA ) PIN = +3dBm 60 80 Deg C Small-Signal Gain S21 = f ( TA ) PIN = -10 dBm, Vcc = 3.2V 30 dBm dB 24 28 23 26 SS Gain 25 Output Power Pout -20 0 20 40 Ambient Temperature Ta 22 21 24 22 20 20 -40 -20 0 20 40 Ambient Temperature Ta 60 80 Deg C For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 -40 -20 0 20 40 Ambient Temperature Ta 60 80 Deg C pg. 7/13 CGB 240 Datasheet Pinning 1 5 TSSOP-10 MSOP-10 Figure 1 CGB240 Outline Pad Symbol Function 1 VC1 Supply voltage of 1st stage / interstage match 2 VC1 Supply voltage of 1st stage / interstage match 3 RFIN RF input 4 N.C. 5 N.C. 6 VCTR1 Control voltage 1st stage 7 VCTR2 Control voltage 2nd stage 8 VC2 Supply voltage of 2nd stage / RF output 9 VC2 Supply voltage of 2nd stage / RF output 10 N.C. 11 GND RF and DC ground (pad located on backside of package) Heatsink. Thermal resistance between junction – pad 11: RTHCH = 100 K/W. Functional Diagram (1,2) Vc1 (3) RFin (8,9) Vc2 (11) Gnd (6) Vctr1 Figure 2 (7) Vctr2 CGB240 Functional Diagram For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 8/13 CGB 240 Datasheet Application Note 1: Bluetooth CGB240 PA Reference Design (TRL matching) Vcc R1 C5 C6 TRL2 L1 CGB240 C1 TRL1 1 TRL3 10 C2 RF In RF Out 5 11 6 C4 C3 C7 Vctr Figure 3 Schematic of Bluetooth CGB240 PA reference design. Part Type Value Outline Source Part No. C1 Cer. Capacitor 22 pF 0402 Murata COG C2 Cer. Capacitor 22 pF 0402 Murata COG C3 ) Cer. Capacitor 1.5 pF 0603 AVX ACCU-P C4 Cer. Capacitor 2.2 pF 0402 Murata COG C5 Cer. Capacitor 10 pF 0402 Murata COG C6 Cer. Capacitor 1 µF 0603 Murata X7R C7 Cer. Capacitor 1 nF 0402 Murata X7R L1 Inductor 22 nH 0603 Toko R1 Resistor 10 R 0402 Mira TRL1 ) Microstrip Line l = 2,5 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm TRL2 4) Microstrip Line l = 1,8 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm TRL3 4) Microstrip Line l = 4,0 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm 06035J1R5BBT LL1608–FS 3 ) Cost optimization might take place by using lower-Q AVX-CU capacitors instead of the AccuP version. This will lead to better h2 performance, however resulting in a loss of about 2% PAE. 4 ) Line length measured from corner of capacitor to end of MMIC’s lead. For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 9/13 CGB 240 Datasheet TriQuint Semiconductor, Inc. R 1 C6 L1 C5 CGB240 C1 C 3 C2 C 4 „White Dots“ = Ground Vias C7 RF Out (SMA) Figure 4 Layout of Bluetooth CGB240 PA reference design using TRL matching (see application note 1). Vc1 and Vc2 are connected together on the PCB. Vctr1 and Vctr2 are connected together on the PCB. For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 10/13 CGB 240 Datasheet Application Note 2: Bluetooth Power Amplifier using Discrete Matching Vcc C6 C8 L1 L4 C1 L2 CGB240 1 C2 L3 10 RF In RF Out C4 C5 5 11 6 C3 C7 Vctr Figure 5 Bluetooth Amplifier using discrete matching. Part Type Value Outline Source C1 Cer. Capacitor 22 pF 0402 Murata COG C2 Cer. Capacitor 22 pF 0402 Murata COG C3 Cer. Capacitor 1.5 pF 0603 AVX ACCU-P C4 Cer. Capacitor 2.0 pF 0402 Murata COG C5 Cer. Capacitor 82 pF 0402 Murata COG C6 Cer. Capacitor 0.1 µF 0603 Murata X7R C7 Cer. Capacitor 1 nF 0402 Murata X7R C8 Cer. Capacitor 0.1 µF 0603 Murata X7R L1 Inductor 22 nH 0603 Toko LL1005–FH22NJ L2 Inductor 1.0 nH 0402 Coilcraft 0402CS-1N0X_BG L3 Inductor 1.0 nH 0402 Coilcraft 0402CS-1N0X_BG L4 Inductor 22 nH 0603 Toko LL1005–FH22NJ For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 Part No. 06035J1R5BBT pg. 11/13 CGB 240 Datasheet TriQuint Semiconductor, Inc. C6 L1 C8 L4 C5 C1 C 4 L2 „White Dots“ = Ground Vias CGB240 L3 C 3 C2 C7 RF In (SMA) Figure 6 RF Out (SMA) Layout of CGB240 Bluetooth evaluation board used in application note 2. For a discrete matching concept, the same evaluation board (V1.2) as shown in figure 5 might be used. However, to insert the series elements (L2, L3, L4), the pcb lines have to be cut mechanically. The use of a discrete matching concept saves pcb space but will lead to a lower output power (typ. 0.3dB lower) and higher BOM cost. For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 12/13 CGB 240 Datasheet Description of MSOP-10 Package In order to ensure maximum mounting yield and optimal reliability, special soldering conditions apply in volume production. Please ask for our information brochure on details or download the related document (TSSOP10_Soldering_Version01.pdf) from our website. The TSSOP-10-2 is a level 1 package. International standards for handling this type of package are described in the JEDEC standard J-STD-033 „STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES“, published May-1999. The original document is available from the JEDEC website www.jedec.org . For further information please visit www.triquint.com Rev. 1.6 October 20th, 2004 pg. 13/13 CGB 240 Datasheet Part Marking: Part Orientation on Reel: Ordering Information: Type Marking Package CGB240 CGB240 MSOP-10 ESD: Electrostatic discharge sensitive device Observe handling precautions ! Additional Information For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: (503) 615-9000 Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: [email protected] The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2003 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.5-December 16, 2003 For additional information and latest specifications, see our website: www.triquint.com pg. 14/14 CGB 240 Datasheet Additional Information For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: (503) 615-9000 Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: [email protected] The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2003 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.5-December 16, 2003 For additional information and latest specifications, see our website: www.triquint.com pg. 15/14