ETC CCD30-11

CCD30–11 Open Electrode
High Performance CCD Sensor
FEATURES
*
1024 by 256 Pixel Format
*
26 mm Square Pixels
*
Image Area 26.6 x 6.7 mm
*
Wide Dynamic Range
*
Symmetrical Anti-static Gate Protection
*
Open Electrode Structure for Enhanced Quantum Efficiency
*
Advanced Inverted Mode Operation
*
Anti-blooming Readout Register
*
Zero Light Emitting Output Amplifier
APPLICATIONS
*
Spectroscopy
*
Scientific Imaging
*
TDI Operation
INTRODUCTION
The open electrode CCD30-11 is a high performance CCD
sensor designed as an upgrade for the standard CCD30-11, for
use in the scientific spectroscopy instrument market, where
enhanced quantum efficiency is required at near-ultraviolet
wavelengths. With an array of 1024 x 256 26 mm square pixels
it has an imaging area to suit most spectrometer outputs of 26.6
x 6.7 mm (1.05 x 0.26 inch).
The readout register is organised along the long (1024 pixel)
edge of the sensor and contains an anti-blooming drain to allow
high speed binning operations of low level signals which may be
adjacent to much stronger signals. The novel output amplifier
design has no light emission.
Standard three phase clocking and buried channel charge
transfer are employed and Inverted Mode Operation (IMO) is
included as standard.
The open electrode CCD30-11 is packaged in a 20-pin DIL
ceramic package and is pin compatible (but not completely
clock compatible) with the standard CCD30-11.
Designers are advised to consult e2v technologies should they
be considering using CCD sensors in abnormal environments or
if they require customised packaging.
TYPICAL PERFORMANCE
Pixel readout frequency .
Output amplifier sensitivity
Peak signal . . . . .
Dynamic range . . . .
Spectral range . . . .
Readout noise (at 140 K, 20
QE at 700 nm . . . .
Peak output voltage . .
. .
. .
. .
. .
. .
kHz)
. .
. .
.
.
.
.
.
.
.
.
. 20 – 1000
kHz
. . . . 1.5
mV/e7
. . . 300 ke7/pixel
.
75 000:1
200 – 1060
nm
. . . . 4
e7 rms
. . .
50
%
. . . 450
mV
GENERAL DATA
Format
Image area . .
Active pixels (H)
(V)
Pixel size . . .
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
26.6 x 6.7
. .
1024
. . . 256
. . 26 x 26
mm
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
. .
32.89 x 20.07 mm
. . . . . . .
20
. . . . .
2.54 mm
. . . . . 15.24 mm
quartz or removable glass
mm
Package
Package size . .
Number of pins .
Inter-pin spacing
Inter-row spacing
Window material
e2v technologies (uk) limited, Waterhouse Lane, Chelmsford, Essex CM1 2QU, UK Telephone: +44 (0)1245 493493 Facsimile: +44 (0)1245 492492
e-mail: [email protected] Internet: www.e2v.com
Holding Company: e2v technologies plc
e2v technologies inc. 4 Westchester Plaza, PO Box 1482, Elmsford, NY10523-1482 USA Telephone: (914) 592-6050 Facsimile: (914) 592-5148
e-mail: [email protected]
# e2v technologies (uk) limited 2005
A1A-100008 Issue 8, February 2005
411/8893
PERFORMANCE
Min
Peak charge storage (see note 1)
Peak output voltage (unbinned)
Dark signal at 293 K (see note 2)
Charge transfer efficiency (see note 3):
parallel
serial
Output amplifier sensitivity
Readout noise at 140 K (see note 4)
Readout frequency (see note 5)
Response non-uniformity (std. deviation)
Dark signal non-uniformity at 293 K
(std. deviation)
Output node capacity
relative to image section
Typical
200k
–
–
Max
300k
450
250
–
–
1.3
–
–
–
99.9999
99.9993
1.8
4
20
3
–
–
–
2.3
6
5000
10
100
–
e7/pixel
mV
e7/pixel/s
–
–
500
%
%
mV/e7
7
rms e /pixel
kHz
% of mean
e7/pixel/s
200
4.0
–
Typical
Max
ELECTRICAL INTERFACE CHARACTERISTICS
Electrode capacitances (measured at mid-clock level):
Min
I1/I1 interphase
R1/R1 interphase
I1/SS
R1/SS
Output impedance
–
–
–
–
–
NOTES
2.0
70
11
185
300
White spots
1. Signal level at which resolution begins to degrade.
2. The typical average (background) dark signal at any
temperature T (kelvin) between 230 and 300 K is given by:
Qd/Qd0 = 1.14 x 106T3e79080/T
where Qd0 is the dark current at 293 K. Note that this is
typical performance and some variation may be seen
between devices. Below 230 K additional dark current
components with a weaker temperature dependence may
become significant.
3. CCD characterisation measurements made using charge
generated by X-ray photons of known energy.
4. Measured using a dual-slope integrator technique (i.e.
correlated double sampling) with a 10 ms integration period.
5. Readout above 5000 kHz can be achieved but performance
to the parameters given cannot be guaranteed.
BLEMISH SPECIFICATION
Traps
Pixels where charge is temporarily held.
Traps are counted if they have a capacity
greater than 200 e7 at 233 K.
Slipped columns Are counted if they have an amplitude
greater than 200 e7.
Black spots
Are counted when they have a responsivity
of less than 90% of the local mean signal
illuminated at approximately half saturation.
–
–
–
–
–
nF
pF
nF
pF
O
Are counted when they have a generation
rate 100 times the specified maximum dark
signal generation rate at 293 K (measured
between 233 and 273 K). The typical
temperature dependence of white spot
blemishes is different from that of the
average dark signal and is given by:
Qd/Qd0 = 122T3e76400/T
White column
Black column
A column which contains at least 9 white
defects.
A column which contains at least 9 black
defects.
GRADE
Column defects:
black or slipped
white
Black spots:
53 pixels
55 pixels
510 pixels
410 pixels
Traps 4200 e7
White spots
0
1
2
0
0
1
0
6
0
2
1
0
0
1
10
3
2
0
0
2
10
15
8
1
0
5
15
Minimum separation between
adjacent black columns . . . . . . . . . 50 pixels
Note The effect of temperature on defects is that traps will be
observed less at higher temperatures but more may appear
below 233 K. The amplitude of white spots and columns will
decrease rapidly with temperature.
100008, page 2
# e2v technologies
TYPICAL OUTPUT CIRCUIT NOISE (Measured using clamp and sample)
15
NOISE EQUIVALENT SIGNAL (e— rms)
7180A
PREDICTED
10
5
MEASURED AT 180 K
0
10k
FREQUENCY (Hz)
50k
100k
500k
1M
5M
TYPICAL SPECTRAL RESPONSE (No window)
7386A
60
50
QUANTUM EFFICIENCY (%)
40
30
20
10
0
200
300
400
WAVELENGTH (nm)
500
600
700
800
900
1000
1100
Note
UV QE varies rapidly with wavelength over the 200 to 400 nm range due to the thick AR coating.
TYPICAL VARIATION OF DARK SIGNAL WITH SUBSTRATE VOLTAGE
105
7134C
DARK CURRENT (e7/pixel/s)
104
TYPICAL RANGE
103
102
0
1
2
SUBSTRATE VOLTAGE (V)
# e2v technologies
3
4
5
6
7
8
9
10
100008, page 3
TYPICAL VARIATION OF DARK CURRENT WITH TEMPERATURE
104
7329
103
102
DARK CURRENT (e7/pixel/s)
10
1
1071
1072
740
720
PACKAGE TEMPERATURE (8C)
0
20
40
DEVICE SCHEMATIC
7135A
20
SG
19
DD
18
17
SS
16
RD
15
OD
14
OS
13
OG
12
11
8 BLANK
ELEMENTS
8 BLANK
ELEMENTS
SUB
READ-OUT REGISTER
IMAGE SECTION
TOP VIEW
100008, page 4
1
2
I13
3
I12
4
I11
1024 X 256 ACTIVE ELEMENTS
5
SS
6
1R
7
R13
8
R12
9
R11
10
# e2v technologies
CONNECTIONS, TYPICAL VOLTAGES AND ABSOLUTE MAXIMUM RATINGS
PIN
1
REF
DESCRIPTION
PULSE AMPLITUDE OR
DC LEVEL (V) (see note 6)
Min
Typical
Max
–
No connection
–
MAXIMUM RATINGS
with respect to VSS
–
2
I13
Image section, phase 3 (clock pulse)
10
12
15
+20 V
3
I12
Image section, phase 2 (clock pulse)
10
12
15
+20 V
4
I11
Image section, phase 1 (clock pulse)
10
12
15
+20 V
5
SS
Substrate
11
–
6
1R
Output reset pulse
10
12
15
+20 V
7
R13
Readout register, phase 3 (clock pulse)
10
12
15
+20 V
8
R12
Readout register, phase 2 (clock pulse)
10
12
15
+20 V
9
R11
Readout register, phase 1 (clock pulse)
10
12
15
+20 V
10
–
No connection
see note 7
–
11
–
No connection
see note 7
–
12
OG
Output gate
13
OS
Output transistor source
14
OD
Output drain
27
29
31
70.3 to +25 V
15
RD
Reset transistor drain
17
18
19
70.3 to +25 V
16
SS
Substrate
11
70.3 to +25 V
17
–
No connection
18
DD
Diode drain
20
22
25
70.3 to +25 V
19
SG
Spare gates
0
0
20
–
No connection
8
9.5
2
3.5
5
8
9.5
+20 V
70.3 to +25 V
see note 8
–
–
VSS+19
–
+20 V
–
If all voltages are set to the ‘typical’ values, operation at or close to specification should be obtained. Some adjustment within the
minimum – maximum range specified may be required to optimise performance.
Voltage between pairs of pins: OS to OD + 15 V.
Maximum current through any source or drain pin: 10 mA.
OUTPUT CIRCUIT
6923B
RD
R13
1R
I13 (SEE
NOTE 9)
OD
OG
OS
OUTPUT
EXTERNAL
LOAD (SEE
NOTE 8)
SS
SS
0V
NOTES
6.
7.
8.
9.
All pulse low levels 0 + 0.5 V.
There is no access to the temperature sensing diodes in the back-thinned version of the CCD30-11.
Not critical; can be a 1 – 5 mA constant current source, or 5 – 10 kO resistor.
The amplifier has a DC restoration circuit, which is activated internally whenever I13 is pulsed high.
# e2v technologies
100008, page 5
FRAME READOUT TIMING DIAGRAM
SEE DETAIL OF
LINE TRANSFER
READOUT PERIOD 5256 CYCLES
I11
7131
CHARGE COLLECTION PERIOD
I12
I13
SEE DETAIL OF
OUTPUT CLOCKING
R11
R12
R13
1R
OUTPUT
SWEEPOUT
FIRST VALID DATA
DETAIL OF LINE TRANSFER
twi
7132A
I11
1
/3 Ti
toi
tli
I12
toi
tli
I13
tdri
Ti
tdir
R11
R12
R13
1R
100008, page 6
# e2v technologies
DETAIL OF OUTPUT CLOCKING
7133A
R11
Tr
tor
R12
R13
twx
tdx
1R
SIGNAL
OUTPUT
OUTPUT
VALID
OS
RESET FEEDTHROUGH
LINE OUTPUT FORMAT
7130A
8 BLANK
8 BLANK
1024 ACTIVE OUTPUTS
CLOCK TIMING REQUIREMENTS
Symbol
Ti
twi
tri
tfi
toi
tli
tdir
tdri
Tr
trr
tfr
tor
twx
trx, tfx
tdx
Description
Image clock period
Image clock pulse width
Image clock pulse rise time (10 to 90%)
Image clock pulse fall time (10 to 90%)
Image clock pulse overlap
Image clock pulse, two phase low
Delay time, I1 stop to R1 start
Delay time, R1 stop to I1 start
Output register clock cycle period
Clock pulse rise time (10 to 90%)
Clock pulse fall time (10 to 90%)
Clock pulse overlap
Reset pulse width
Reset pulse rise and fall times
Delay time, 1R low to R13 low
Min
50
25
5
tri
3
2
3
1
200
50
trr
20
30
20
30
Typical
90
45
20
20
10
10
10
2
see note 11
0.1Tr
0.1Tr
0.5trr
0.1Tr
0.5trr
0.5Tr
Max
see note
see note
0.5toi
0.5toi
0.2Ti
0.2Ti
see note
see note
see note
0.3Tr
0.3Tr
0.1Tr
0.2Tr
0.2Tr
0.8Tr
10
10
10
10
10
ms
ms
ms
ms
ms
ms
ms
ms
ns
ns
ns
ns
ns
ns
ns
NOTES
10. No maximum other than that necessary to achieve an acceptable dark signal at the longer readout times.
11. As set by the readout period.
# e2v technologies
100008, page 7
OUTLINE
(All dimensions without limits are nominal)
A
6911B
M
D
20
F
11
C
1
B
E
10
COVERGLASS
SEE NOTE
IMAGING AREA
L
Outline Note
PIN 1
G
H
The device is normally supplied with a temporary glass window
for protection purposes. It can also be supplied with a fixed,
quartz or fibre-optic window where required.
J
K
Ref
Millimetres
A
B
C
D
E
32.89 + 0.38
20.07 + 0.25
6.7
3.30 + 0.33
15.24 + 0.25
+ 0.051
0.254
7 0.025
5.21
0.46 + 0.05
2.54 + 0.13
22.86 + 0.13
1.65 + 0.56
26.6
F
G
H
J
K
L
M
100008, page 8
# e2v technologies
ORDERING INFORMATION
HANDLING CCD SENSORS
Options include:
CCD sensors, in common with most high performance MOS IC
devices, are static sensitive. In certain cases a discharge of
static electricity may destroy or irreversibly degrade the device.
Accordingly, full antistatic handling precautions should be
taken whenever using a CCD sensor or module. These include:-
*
Temporary Quartz Window
*
Permanent Quartz Window
*
Temporary Glass Window
For further information on the performance of these and other
options, please contact e2v technologies.
*
Working at a fully grounded workbench
*
Operator wearing a grounded wrist strap
*
All receiving socket pins to be positively grounded
*
Unattended CCDs should not be left out of their conducting
foam or socket.
Evidence of incorrect handling will invalidate the warranty. All
devices are provided with internal protection circuits to the gate
electrodes (pins 2, 3, 4, 6, 7, 8, 9, 12, 19) but not to the other
pins.
HIGH ENERGY RADIATION
Device parameters may begin to change if subject to an ionising
dose of greater than 104 rads.
Certain characterisation data are held at e2v technologies.
Users planning to use CCDs in a high radiation environment
are advised to contact e2v technologies.
TEMPERATURE LIMITS
Min
Typical Max
Storage . . . . . . . 73
–
373
K
Operating . . . . . . . 73
233
323
K
Operation or storage in humid conditions may give rise to ice on
the sensor surface, causing irreversible damage.
Device heating/cooling . . . . . . . 5 K/min max
Whilst e2v technologies has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for the consequences of any use
thereof and also reserves the right to change the specification of goods without notice. e2v technologies accepts no liability beyond that set out in its standard
conditions of sale in respect of infringement of third party patents arising from the use of tubes or other devices in accordance with information contained herein.
# e2v technologies
Printed in England
100008, page 9