TI VSP2270

VSP2270
SLES019 – DECEMBER 2001
CCD SIGNAL PROCESSOR
FOR DIGITAL CAMERAS
FEATURES
D CCD Signal Processing:
D
D
D
D
DESCRIPTION
– Correlated Double Sampling (CDS)
– Programmable Black Level Clamping
Programmable Gain Amplifier (PGA)
–6-dB to 42-dB Gain Ranging
10-Bit Digital Data Output:
– Up to 28-MHz Conversion Rate
– No Missing Codes
77-dB Signal-To-Noise Ratio
Portable Operation:
– Low Voltage: 2.7 V to 3.6 V
– Low Power: 93 mW (Typ) at 3 V
– Stand-By Mode: 6 mW
APPLICATIONS
D DSC, DVC, Security Camera
The VSP2270 device is a complete mixed-signal
processing IC for digital cameras providing signal
conditioning and analog-to-digital conversion for the
output of a charge-coupled device (CCD) array. The
primary CCD channel provides correlated double
sampling (CDS) to extract the video information from
the pixels, –6-dB to 42-dB gain range with digital control
for varying illumination conditions, and black level
clamping for an accurate black level reference. Input
signal clamping and offset correction of the input CDS
are also performed. The stable gain control is linear in
dB. Additionally, the black level is quickly recovered
after gain change.
The VSP2270Y device is available in a 48-lead LQFP
package and the VSP2270M device is available in a
48-lead P-VQFN package. Both devices operate from
a single 3-V/3.3-V supply.
AVAILABLE OPTIONS
PRODUCT
PACKAGE
PACKAGE
OUTLINE
DESIGNATOR†
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER‡
TRANSPORT
MEDIA
VSP2270Y
48-Lead LQFP
PT
–25°C to 85°C
VSP2270Y
VSP2270Y
250-piece tray
VSP2270Y
48-Lead LQFP
PT
–25°C to 85°C
VSP2270Y
VSP2270Y/2K
Tape and reel
VSP2270M
48-Lead P-VQFN
RGN
–25°C to 85°C
VSP2270M
VSP2270M
250-piece tray
VSP2270M
48-Lead P-VQFN
RGN
–25°C to 85°C
VSP2270M
VSP2270M/2K
Tape and reel
† A detailed drawing and a dimension table are located at the end of the data sheet.
‡ Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2,000 devices per reel). Ordering 2,000
pieces of the VSP2270Y/2K device will get a single 2,000-piece tape and reel.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
VSP2270
SLES019 – DECEMBER 2001
pin assignments
CCDIN
BYPP2
COB
VCC
GNDA
GNDA
GNDA
GNDA
VCC
VCC
BYPM
BYP
PT PACKAGE
(TOP VIEW)
36 35 34 33 32 31 30 29 28 27 26 25
CM
REFP
REFN
VCC
GNDA
GNDA
NC
NC
RESET
SLOAD
SDATA
SCLK
37
24
38
23
39
22
40
21
41
20
19
42
VSP2270Y
43
18
44
17
45
16
46
15
47
14
48
13
2 3 4
5 6 7
8
9 10 11 12
NC
NC
B0(LSB)
B1
B2
B3
B4
B5
B6
B7
B8
B9(MSB)
1
VCC
CLPDM
SHD
SHP
CLPOB
PBLK
VCC
GNDA
ADCCK
GNDA
DRVGND
DRVDD
NC – No internal connection
GNDA
GNDA
VCC
VCC
BYPM
BYP
CCDIN
BYPP2
COB
VCC
GNDA
GNDA
RGN PACKAGE
(TOP VIEW)
36 35 34 33 32 31 30 29 28 27 26 25
CM
REFP
REFN
VCC
GNDA
GNDA
NC
NC
RESET
SLOAD
SDATA
SCLK
37
24
38
23
39
22
40
21
41
20
42
43
19
VSP2270M
18
44
17
45
16
46
15
47
14
48
13
NC
NC
B0(LSB)
B1
B2
B3
B4
B5
B6
B7
B8
B9(MSB)
1 2 3 4 5 6 7 8 9 10 11 12
NC – No internal connection
2
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VCC
CLPDM
SHD
SHP
CLPOB
PBLK
VCC
GNDA
ADCCK
GNDA
DRVGND
DRVDD
VSP2270
SLES019 – DECEMBER 2001
functional block diagram
CLPDM
SHP SHD
SLOAD
SCLK
SDATA
RESET
DRVDD
ADCCK
VCC
Serial Interface
Timing Control
Input
Clamp
Correlated
Double
Sampling
(CDS)
CCDIN
CCD
Output
Signal
Preblanking
PBLK
Programmable
–6 to
Gain Amplifier
+42 dB
(PGA)
Optical Black (OB)
Level Clamping
COB
CLPOB
Output
Latch
Analog-to-Digital
Converter
10-Bit
Digital
Output
B[9:0]
Reference Voltage Generator
BYPP2
BYP
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BYPM
REFN
CM
REFP
DRVGND
GNDA
3
VSP2270
SLES019 – DECEMBER 2001
Terminal Functions
TERMINAL
NO.
1, 2, 43, 44
NAME
TYPE (see
Note 1)
NC
DESCRIPTION
Must be left open
3
B0 (LSB)
DO
A/D converter output, bit 0 (LSB)
4
B1
DO
A/D converter output, bit 1
5
B2
DO
A/D converter output, bit 2
6
B3
DO
A/D converter output, bit 3
7
B4
DO
A/D converter output, bit 4
8
B5
DO
A/D converter output, bit 5
9
B6
DO
A/D converter output, bit 6
10
B7
DO
A/D converter output, bit 7
11
B8
DO
A/D converter output, bit 8
12
B9 (MSB)
DO
A/D converter output, bit 9 (MSB)
13
DRVDD
DRVGND
P
Power supply for digital output
P
Digital ground for digital output
GNDA
P
Analog ground
ADCCK
DI
Clock for digital output buffer
VCC
PBLK
P
Analog power supply
19
DI
Preblanking: High = Normal operation mode
Low = Preblanking mode: digital outputs are all 0s
20
CLPOB
DI
Optical black clamp pulse (default = active low) (see Note 5)
21
SHP
DI
CDS reference level sampling pulse (default = active low) (see Note 5)
22
SHD
DI
CDS data level sampling pulse (default = active low) (see Note 5)
23
CLPDM
DI
Dummy pixel clamp pulse (default = active low) (see Note 5)
28
COB
AO
Optical black clamp loop reference (bypass to ground) (see Note 2)
29
BYPP2
AO
Internal reference P (bypass to ground) (see Note 3)
30
CCDIN
AI
CCD signal input
31
BYP
AO
Internal reference C (bypass to ground) (see Note 4)
32
BYPM
AO
Internal reference N (bypass to ground (see Note 3)
37
CM
AO
A/D converter common mode voltage (bypass to ground) (see Note 4)
38
REFP
AO
A/D converter positive reference (bypass to ground) (see Note 4)
39
REFN
AO
A/D converter negative reference (bypass to ground) (see Note 4)
45
RESET
DI
Asynchronous system reset (active low)
46
SLOAD
DI
Serial data latch signal (triggered at the rising edge)
47
SDATA
DI
Serial data input
48
SCLK
DI
Clock for serial data shift (triggered at the rising edge)
14
15, 17. 25, 26
35, 36, 41, 42
16
18, 24, 27, 33, 34, 40
NOTES: 1. Designators in TYPE: P: power supply and ground, DI: digital input, DO: digital output, AI: analog input, AO: analog output
2. Must be connected to ground with a bypass capacitor. The recommended value is 0.1 µF to 0.22 µF, however it depends on the
application environment. Refer to the optical black level clamp loop section for details.
3. Must be connected to ground with a bypass capacitor. The recommended value is 400 pF to 1000 pF, however it depends on the
application environment. Refer to the voltage reference section for details.
4. Must be connected to ground with a bypass capacitor (0.1 µF). Refer to the voltage reference section for details.
5. Refer to the serial interface section for details.
4
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VSP2270
SLES019 – DECEMBER 2001
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage: VCC, DRVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
Supply voltage differences: VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.1 V
Ground voltage differences: GNDA, DRVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.1 V
Digital input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 5.3 V
Analog input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V
Input current (any leads except supplies) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25°C to 85°C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (soldering, 5 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Package temperature (IR reflow, peak, 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
electrical characteristics all specifications at TA = 25°C, VCC = 3 V, DRVDD = 3 V, conversion rate
(fADCCK) = 20 MHz (unless otherwise noted)
VSP2270Y, VSP2270M
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
10
Maximum conversion rate
UNIT
Bits
28
MHz
DIGITAL INPUTS
Logic family
VT+
VT–
Input low-to-high threshold voltage
IIH
IIL
Input logic high current
TTL
1.7
Input high-to-low threshold voltage
Input logic low current
V
1
VI = 3 V
VI = 0 V
ADCCK clock duty cycle
V
±20
µA
±20
µA
50%
Input capacitance
5
Maximum input voltage
– 0.3
pF
5.3
V
DIGITAL OUTPUTS
Logic family
CMOS
Logic coding
VOH
VOL
Output logic high voltage
Output logic low voltage
Additional output data delay
Straight binary
IOH = –2 mA
IOL = 2 mA
2.4
V
0.4
J[1:0] = 00
0
J[1:0] = 01
5
J[1:0] = 10
10
J[1:0] = 11
13
V
ns
REFERENCE
Positive reference voltage
1.75
V
Negative reference voltage
1.25
V
ANALOG INPUT (CCDIN)
Input signal level for full-scale out
PGA gain = 0 dB
900
Input capacitance
mV
15
Input limit
–0.3
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pF
3.3
V
5
VSP2270
SLES019 – DECEMBER 2001
electrical characteristics all specifications at TA = 25°C, VCC = 3 V, DRVDD = 3 V, conversion rate
(fADCCK) = 20 MHz (unless otherwise noted) (continued)
VSP2270Y, VSP2270M
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TRANSFER CHARACTERISTICS
DNL
Differential nonlinearity
PGA gain = 0 dB
±0.5
LSB
INL
Integral nonlinearity
PGA gain = 0 dB
±1
LSB
No missing codes
Assured
Step response settling time
Full-scale step input
1
pixel
Overload recovery time
Step input from 1.8 V to 0 V
2
pixels
Data latency
Signal to noise ratio (see Note 1)
Signal-to-noise
Clock
Cycles
9 (fixed)
Grounded input capacitor, PGA gain = 0 dB
77
Grounded input capacitor, gain = 24 dB
53
CCD offset correction range
–180
dB
200
mV
CDS
Reference sample settling time
Within 1 LSB, driver impedance = 50 Ω
8.9
ns
Data sample settling time
Within 1 LSB, driver impedance = 50 Ω
8.9
ns
INPUT CLAMP
Clamp-on resistance
400
Ω
Clamp level
1.5
V
10
Bits
PROGRAMMABLE GAIN AMPLIFIER (PGA)
Gain control resolution
Maximum gain
Gain code = 1111111111
42
High gain
Gain code = 1101001000
34
Medium gain
Gain code = 1000100000
20
Low gain
Gain code = 0010000000
0
Minimum gain
Gain code = 0000000000
dB
–6
±0.5
Gain control error
OPTICAL BLACK CLAMP LOOP
Control DAC resolution
10
Programmable range of clamp level
Optical black clamp level
0
OBCLP level at CODE = 1000
Bits
60
LSB
32
Minimum output current for control DAC
COB pin
±0.15
µA
Maximum output current for control DAC
COB pin
±153
µA
Loop time constant
CCOB = 0.1 µF
40.7
µs
Slew rate
CCOB = 0.1 µF, Saturated output current of
control DAC
1530
V/s
POWER SUPPLY
Supply voltage
Power dissipation
VCC, DRVDD
Normal operation mode: No load
2.7
3
3.6
V
93
Stand-by mode: fADCCK = Does not apply
mW
6
TEMPERATURE RANGE
Operating temperature
θJA
Thermal resistance
–25
100
VSP2270M: 48-lead P-VQFN
107
NOTE 1: SNR = 20 log (full-scale voltage / rms noise)
6
85
VSP2270Y: 48-lead LQFP
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°C
°C/W
VSP2270
SLES019 – DECEMBER 2001
timing specification
VSP2270 CDS
CCD
Output
Signal
N
N+1
N+2
N+3
t(CKP)
tw(P)
SHP
(See
Note 9)
t(PD)
t(S)
t(DP)
t(CKP)
tw(D)
SHD
(See
Note 9)
t(S)
t(INHIBIT)
t(ADC)
t(ADC)
t(CKP)
ADCCK
th(O)
B[9:0]
N–11
td(O)
N–10
SYMBOL
N–9
PARAMETER
N–8
MIN
N–7
TYP
MAX
UNIT
t(CKP)
t(ADC)
Clock period
35
ns
ADCCK high/low pulse width
17
ns
tw(P)
tw(D)
SHP pulse width
8
ns
SHD pulse width
8
ns
t(PD)
t(DP)
SHP trailing edge to SHD leading edge (see Note 9)
8
ns
SHD trailing edge to SHP leading edge (see Note 9)
8
t(S)
t(INHIBIT)
Sampling delay
th(O)
td(O)
Output hold time
DL
Data latency, normal operation mode
ns
3
Inhibited clock period
ns
20
ns
2
ns
Output delay (no load)
22
9 (fixed)
ns
Clock
Cycles
NOTES: 9. The description and the timing diagrams in this data sheet are all based on the polarity of active low (default value).
10. The user can select the active polarity (active low or active high) through the serial interface, refer to the serial interface section for
details.
11. Output hold time is specified at additional output delay = 0 ns, refer to the serial interface section for details.
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7
VSP2270
SLES019 – DECEMBER 2001
timing specifications (continued)
VSP2270 serial interface
tsu(X)
th(X)
SLOAD
tw(CKL)
t(CKP)
tw(CKH)
SCLK
th(D)
tsu(D)
SDATA
MSB
LSB
2 Bytes
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
t(CKP)
tw(CKH)
Clock period
100
ns
Clock high pulse width
40
ns
tw(CKL)
tsu(D)
Clock low pulse width
40
ns
Data setup time
30
ns
th(D)
tsu(X)
Data hold time
30
ns
SLOAD to SCLK setup time
30
ns
th(X)
SCLK to SLOAD hold time
30
ns
NOTES: 12. Data shift operation must decode at the rising edges of SCLK while SLOAD is low. Two bytes of input data are loaded to the parallel
latch in the VSP2270 device at the rising edge of SLOAD.
13. When the input serial data is longer than 2 bytes (16 bits), the last 2 bytes become effective and the former bits are lost.
8
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VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
introduction
The VSP2270 device is a complete mixed-signal IC that contains all the key features associated with the
processing of CCD imager output signals in a video camera, a digital still camera, security camera, or similar
applications. A simplified block diagram is shown on page 3 of this data sheet. The VSP2270 device includes
correlated double sampler (CDS), programmable gain amplifier (PGA), analog-to-digital converter (ADC), input
clamp, optical black (OB) level clamp loop, serial interface, timing control, and reference voltage generator.
An off-chip emitter follower buffer is recommended between the CCD output and the VSP2270 CCDIN input.
The PGA gain control, the clock polarity setting, and the operation mode can be selected through the serial
interface. All parameters are reset to their default values when pin 45 (RESET) goes low asynchronously from
the clocks.
correlated double sampler (CDS)
The output signal of a CCD imager is sampled twice during one pixel period; once at the reference interval and
again at the data interval. Subtracting these two samples extracts the video information of the pixel and removes
any noise that is common—or correlated—to both intervals. Thus, the CDS reduces the reset noise and the low
frequency noises that are present on the CCD output signal. Figure 1 shows the simplified block diagram of the
CDS and input clamp.
VSP2270
SHP
C1 = 10 pF
+
CCDIN
OPA
CCD Output
–
CIN
C2 = 10 pF
CLPDM
SHD
SHP
CM (1.5 V)
Figure 1. Simplified Block Diagram of CDS and Input Clamp
The CDS is driven through an off-chip coupling capacitor CIN. AC-coupling is strongly recommended because
the dc level of the CCD output signal is usually too high (several volts) for the CDS to work properly. A 0.1-µF
capacitor is recommended for CIN, but it depends on the application environment.
Also, an off-chip emitter follower buffer is recommended to drive more than 10 pF, because the 10-pF sampling
capacitor and a few pF of stray capacitance can be seen at the input pin. The analog input signal range at pin 30
(CCDIN) is 1 Vp-p, and the appropriate common mode voltage for the CDS is around 0.5 to 1.5 V.
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9
VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
correlated double sampler (CDS) (continued)
The reference level is sampled during the SHP active period, and the voltage level is held by the sampling
capacitor C1 at the trailing edge of SHP. The data level is sampled during the SHD active period, and the voltage
level is held by the sampling capacitor C2 at the trailing edge of SHD. Then, the switched-capacitor amplifier
performs the subtraction of these two levels.
The user can select the active polarity of SHP/SHD (active high or active low) through the serial interface; refer
to the serial interface section for details. The default polarity of SHP/SHD is active low. Upon power on, this value
is not defined. For this reason, it must be set to the appropriate value by using the serial interface, and reset
to the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data sheet are
all based on active low polarity (default value).
input clamp and dummy pixel clamp
The buffered CCD output is capacitively coupled to the VSP2270 device. The input clamp restores the dc
component of the input signal that was lost with the ac-coupling and establishes the desired dc bias point for
the CDS. Figure 1 also shows a simplified block diagram of the input clamp. The input level is clamped to the
internal reference voltage CM (1.5 V) during the dummy pixel interval. Specifically, when both CLPDM and SHP
are active, the dummy clamp function becomes active. If the dummy pixels and/or the CLPDM pulse are not
available in your system, the CLPOB pulse can be used in place of the CLPDM pulse, as long as the clamping
takes place during black pixels. In this case, both the CPLDM (active at the same timing as CLPOB) and SHP
signals become active during the optical black pixel interval; then the dummy clamp function becomes active.
The user can select the active polarity of CLPDM and SHP (active high or active low) through the serial interface,
refer to the serial interface section for details. The default value of CLPDM and SHP is active low. Upon power
on, this value is not defined. For this reason, it must be set to the appropriate value by using the serial interface,
and reset to the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data
sheet are all based on active low polarity (default value).
high performance analog-to-digital converter (ADC)
The analog-to-digital converter (ADC) utilizes a fully differential and pipelined architecture. This ADC is well
suited for low voltage operation, low power consumption requirements, and high-speed applications. Ten-bit
resolution with no missing code is assured.
The VSP2270 device includes the reference voltage generator for the ADC. Positive reference voltage, pin 38
(REFP), negative reference voltage, pin 39 (REFN), and common-mode voltage, pin 37 (CM) must be bypassed
to the ground with a 0.1-µF ceramic capacitor. Do not use these voltages elsewhere in the system. They affect
the stability of these reference levels, which causes ADC performance degradation. Also, these are analog
output pins. Do not apply external voltages.
programmable gain amplifier (PGA)
Figure 2 shows the characteristics of the PGA gain. The PGA provides a gain range of –6 dB to 42 dB, which
is linear in dB. The gain is controlled by a digital code with 10-bit resolution, and it can be set through the serial
interface, refer to the serial interface section for details. The default value of the gain control code is 128 (PGA
gain = 0 dB).
Upon power on, this value is unknown. For this reason, it must be set to the appropriate value by using the serial
interface, and reset to the default value by strobing pin 45 (RESET).
10
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VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
optical black (OB) level clamp loop
To extract the video information correctly, the CCD signal must be referenced to a well-established optical black
(OB) level. The VSP2270 device has an auto-calibration loop to establish the OB level, using the optical black
pixel output from the CCD imager. The input signal level of the OB pixels is identified as the real OB level, and
the loop must be closed while CLPOB is active. During the effective pixel interval, the reference level of the CCD
output signal is clampled to the OB level by the OB level clamp loop. To determine the loop time constant, a
required off-chip capacitor must be connected to pin 28 (COB). The time constant T is given the following
equation:
T+
C
ǒ16384
I
Ǔ
min
where, C is the capacitor value connected to pin 28 (COB). Imin is the minimum current (0.15 µA) of the control
DAC in the OB level clamp loop, and 0.15 µA is equivalent to 1 LSB of the DAC output current. When C is 0.1 µF,
the time constant T is 40.7 µs. The slew rate SR is given the following equation:
I
SR + max
C
where, C is the capacitor value connected to pin 28 (COB). Imax is the maximum current (153 µA) of the control
DAC in the OB level clamp loop, and 153 µA is equivalent to 1023 LSB of the DAC output current.
Generally, the OB level clampling at high-speed causes clamp noise or white streak noise. However, the noise
is reduced by making C large. On the other hand, a large C requires a much longer time to restore from the
stand-by mode or right after the power goes ON. Therefore, 0.1 µF to 0.22 µF is considered the reasonable value
range for C. However, the value depends on the application environment. Make careful adjustments by the trial
and error method.
The OB clamp level (the pedestal level) is programmable through the serial interface, refer to the serial interface
section for details. Table 1 shows the relationship between input code and the OB clamp level.
The user can choose the active polarity of CLPOB (active high or active low) through the serial interface, refer
to the serial interface section for details. The default value of CLPOB is active low. Upon power on, this value
is unknown. For this reason, it must be set to the appropriate value by using the serial interface, and reset to
the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data sheet are
all based on a polarity of active low (default value).
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11
VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
Table 1. Programmable OB Clamp Level
INPUT CODE
OB CLAMP LEVEL, LSBS OF 10 BITS
0000
0 LSB
0001
4 LSB
0010
8 LSB
0011
12 LSB
0100
16 LSB
0101
20 LSB
0110
24 LSB
0111
28 LSB
1000 (Default)
32 LSB
1001
36 LSB
1010
40 LSB
1011
44 LSB
1100
48 LSB
1101
52 LSB
1110
56 LSB
1111
60 LSB
GAIN
vs
INPUT CODE
50
40
Gain – dB
30
20
10
0
–10
0
200
400
600
800
Input Code for Gain Control ( 0 to 1023)
Figure 2. The Characteristics of PGA Gain
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1000
VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
preblanking and data latency
The VSP2270 device has an input blanking (or preblanking) function.
When pin 19 (PBLK) goes low, the digital outputs go to all 0s at the 11th rising edge of ADCCK counting from
PBLK.
In this mode, the digital output data comes out on the rising edge of ADCCK with a delay of 11 clock cycles (data
latency is 11). This is different from the preblanking mode, in which the digital output data comes out on the rising
edge of ADCCK with a delay of 9 clock cycles (data latency is 9).
If the input voltage is higher than the supply rail by 0.3 V, or lower than the ground rail by 0.3 V, then protection
diodes are turned on to prevent the input voltage from going further. Such a high signal swing, which may cause
damage to the VSP2270 device, must be avoided.
stand-by mode
For the purpose of saving power, the VSP2270 device can be put into the stand-by mode (or power down mode)
through the serial interface when the device is not in operation. Refer to the serial interface section for details.
In this mode, all the function blocks are disabled and the digital outputs are all 0s. Current consumption drops
to 2 mA.
As all bypass capacitors discharge during this mode, a substantial time (usually of the order of 200 ms to
300 ms) is required to restore the device from the stand-by mode.
additional output delay control
The VSP2270 device can control the delay time of output data by setting the register through the serial interface.
In some cases, the transition of output data affects analog performance. Generally, this is avoided by adjusting
the timing of ADCCK. In case ADCCK timing cannot be adjusted, this output delay control is effective in reducing
the influence of transient noise. Refer to the serial interface section for details.
voltage reference
All reference voltages and bias currents needed by the VSP2270 device are generated by internal bandgap
circuitry. The CDS and the ADC mainly use three reference voltages, positive reference, pin 38 (REFP),
negative reference, pin 39 (REFN), and common-mode voltage, pin 37 (CM). All REFP, REFN, and CM voltages
must be heavily decoupled with appropriate capacitors (for example: 0.1-µF ceramic capacitor). Do not use
these voltages elsewhere in the system. They affect the stability of these reference levels, which causes ADC
performance degradation. These are analog output pins. Do not apply external voltages.
Pins 29 (BYPP2), 31 (BYP), and 32 (BYPM) are also reference voltages to be used in the analog circuit. Pin 31
must be connected to ground with a 0.1-µF ceramic capacitor. The capacitor values for pins 29 and 32 affect
the step response. For many applications, 400 pF to 1000 pF is a reasonable value.
Depending on the application environment, TI recommends careful adjustment by the trial-and-error method.
Pins 29 (BYPP2), 31 (BYP), and 32 (BYPM) must be heavily decoupled with the appropriate capacitors. Do not
use these voltages elsewhere in the system. They affect the stability of these reference levels, which causes
performance degradation. These are analog output pins. Do not apply external voltages.
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13
VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
serial interface
The serial interface has a 2-byte shift register and various parallel registers to control all the digitally
programmable features of the VSP2270 device. Writing to these registers is controlled by the signals at pins
46 (SLOAD), 48 (SCLK), 47 (SDATA), and 45 (RESET). To enable the shift register, SLOAD must be pulled low.
SDATA is the serial data input, and SCLK is the shift clock. The data at SDATA is taken into the shift register
at the rising edge of SCLK. The data length must be 2 bytes.
After the 2-byte shift operation, the data in the shift register is transferred to the parallel latch at the rising edge
of SLOAD. In addition to the parallel latch, there are several registers dedicated to the specific features of the
device, and they are synchronized with ADCCK clock. It takes 5 or 6 clock cycles for the data in the parallel latch
to be written to those registers. Thus, to complete the data updates requires 5 or 6 clock cycles after the parallel
latching by the rising edge of SLOAD.
Serial interface data format is shown in Table 2.
Table 2. Serial Interface Data Format
MSB
LSB
REGISTERS
TEST
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Configuration
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C0
PGA gain
0
0
0
1
0
0
G9
G8
G7
G6
G5
G4
G3
G2
G1
G0
OB clamp level
0
0
1
0
0
0
0
0
0
0
0
0
O3
O2
O1
O0
Clock polarity
0
0
1
1
0
0
0
0
0
0
0
0
0
P2
P1
P0
Output delay
0
1
0
0
0
0
0
0
0
0
0
0
0
0
J1
J0
Reserved
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
Reserved
0
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
Reserved
0
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
Reserved
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X = Don’t care
C0: Operation Mode, Normal/Stand-by
Serial interface and registers are always active, independent from the operation mode.
C0 = operation mode for the entire device without serial interface and registers. (C0 = 0 active, C0 = 1 stand-by)
G[9:0]: The Characteristics of PGA Gain (refer to Figure 2)
O[3:0]: Programmable OB Clamp Level (refer to Table 1)
P[2:0]: Clock Polarity
P0 = polarity for CLPDM
(P0 = 0 active low, P0 = 1 active high)
P1 = for CLPOB
(P0 = 0 active low, P0 = 1 active high)
P2 = for SHP/SHD
(P0 = 0 active low, P0 = 1 active high)
J[1:0]: Additional Output Delay Control
Control additional output data delay time.
14
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VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
serial interface (continued)
Table 3. Output Delay Control
J1
J0
OUTPUT DATA DELAY TIME
0
0
Additional delay = 0 ns
0
1
Additional delay = 5 ns (typical)
1
0
Additional delay = 10 ns (typical)
1
1
Additional delay = 13 ns (typical)
Upon power on, these values are not defined. These registers must be set to an appropriate value by using the
serial interface, and reset to the default values by strobing pin 45 (RESET).
Default values are:
C[0] = 0:
G[9:0] = 0010000000:
O[3:0] = 1000:
P[2:0] = 000:
J[1:0] = 00:
Normal operation mode
PGA gain = 0 dB
OB clamp level = 32 LSB
CLPDM, CLPOB, SHP/SHD are all active low. [The description and the timing
diagrams in this data sheet are all based on a polarity of active low (default
value).]
Additional output delay = 0 ns
timing
The CDS and the ADC are operated by SHP/SHD, and their derivative timing clocks generated by the on-chip
timing generator. The digital output data is synchronized with ADCCK. The timing relationship among the CCD
signal, SHP/SHD, ADCCK, and the output data is shown in the VSP2270 CDS timing specifications.
CLPOB activates the black level clamp loop during the OB pixel interval. CLPDM activates the input clamping
during the dummy pixel interval. If the CLPDM pulse is not available in your system, the CLPOB pulse can be
used in place of CLPDM, as long as the clamping takes place during black pixels, refer to the input clamp and
dummy pixel clamp section for details. When activating CLPOB and CLPDM on the same timing, the black level
may shift a few LSB on high gain. In this case, OB offset correction by the system is needed.
The clock polarities of SHP/SHD, CLPOB, and CLPDM can be independently set through the serial interface,
refer to the serial interface section for details. The description and the timing diagrams in this data sheet are
all based on active low polarity (default value). In order to keep a stable and accurate OB clamp level, CLPOB
must not be activated during the PBLK active period.
Refer to the preblanking and data latency section for details.
In the stand-by mode, all of ADCCK, SHP, SHD, CLPOB, and CLPDM are internally masked and pulled high.
power supply, grounding and device decoupling recommendations
The VSP2270 device incorporates a very high precision and high-speed ADC and analog circuitry that are
vulnerable to any extraneous noise from the rails or elsewhere. For this reason, although the VSP2270 device
has analog and digital supply pins, it must be treated as an analog component, and all supply pins except for
DRVDD must be powered by the only analog supply of the system. This will ensure the most consistent results,
since digital power lines often carry a high level of wide band noise that would otherwise be coupled into the
device and degrade the achievable performance.
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15
VSP2270
SLES019 – DECEMBER 2001
PRINCIPLES OF OPERATION
power supply, grounding and device decoupling recommendations (continued)
Proper grounding, short lead length, and the use of ground planes are also very important for high frequency
designs. Multilayer PC boards are recommended for the best performance, since they offer distinct advantages
like minimizing ground impedance, separation of signal layers by ground layers, etc. Join the analog and digital
ground pins of the VSP2270 device together at the device and connect them only to the analog ground of the
system.
The driver stage of the digital outputs (B[9:0]) is supplied through a dedicated supply at pin 13 (DRVDD), and
it must be separated from the analog supply (VCC) at pins 18, 24, 27, 33, 34, and 40 completely or at least with
a ferrite bead. Keep the capacitive loading on the output data lines (pins 3–12) as low as possible (typically less
than 15 pF). Larger capacitive loads demand higher charging current surges that can feed back into the analog
portion of the VSP2270 device and affect the performance. Use external buffers or latches to provide the added
benefit of isolating the VSP2270 device from any digital noise activities on the data lines.
Resistors in series with each data line may help minimize the surge current. Values in the range of 100 Ω to
200 Ω limit the instantaneous current the output stage has to provide for recharging the parasitic capacitances
as the output levels change from low to high or high to low. Because of the high operation speed, the converter
also generates high frequency current transients and noises that are fed back into the supply and reference
lines.
This requires the supply and reference pins be sufficiently bypassed. In most cases, 0.1-µF ceramic chip
capacitors are adequate to decouple the reference pins. Supply pins must be decoupled to the ground plane
with a parallel combination of tantalum (1 µF to 22 µF) and ceramic (0.1 µF) capacitors. The effectiveness of
the decoupling largely depends on the proximity to the individual pin. Pin 13 (DRVDD) must be decoupled to the
proximity of pin 14 (DRVGND).
Pay special attention to the bypassing of pins 28 (COB), 29 (BYPP2), and 32 (BYPM), since these capacitor
values determine important analog performance of the device.
16
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VSP2270
SLES019 – DECEMBER 2001
MECHANICAL DATA
PT (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
36
0,08 M
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,25
0,05 MIN
1,45
1,35
Seating Plane
1,60 MAX
0°–ā7°
0,75
0,45
0,10
4040052 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
This may also be a thermally enhanced plastic package with leads conected to the die pads.
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17
VSP2270
SLES019 – DECEMBER 2001
MECHANICAL DATA
RGN (S-PQFP-N48)
PLASTIC QUAD FLATPACK
7,30
7,10
7,05
6,95
+0,40
3X 0,50 –0,15
0, 17 " 0, 05
A
3x C0,20
”A”
B
7,30 7,05
7,10 6,95
0,50 NOM
48
0,75 NOM
1
C0,60
INDEX
0,50 NOM
0,75 NOM
+0,40
0,25 –0,15
0,27
0,17
0,05 M S AB
S
”B”
0,21
0,09
0,95
0,50
”C”
0,50 NOM/2
S
0,25
0,09
1,00
MAX
0,05
DETAIL ”A”
0,47
0,23
0,00
DETAIL ”B”
0,05 S
0,05
0,00
0,25
0,09
0,23
0,17
0,27
0,17
DETAIL ”C”
4202110/A 03/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. These dimensions include package bend.
18
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