BGM1014 MMIC wideband amplifier Rev. 01 — 11 March 2005 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. MSC895 1.2 Features ■ ■ ■ ■ ■ Internally matched to 50 Ω Good output match to 75 Ω 32 dB to 34 dB positive sloped gain for Low Noise Block (LNB) application 12.9 dBm saturated load power at 1 GHz 40 dB isolation 1.3 Applications ■ LNB Intermediate Frequency (IF) amplifiers ■ Cable systems ■ General purpose 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter Conditions Min Typ Max Unit VS DC supply voltage RF input; AC coupled - 5 6 V IS DC supply current 17 21.0 25 mA |s21|2 insertion power gain f = 1 GHz 31.5 32.3 33.0 dB NF noise figure f = 1 GHz - 4.2 4.3 dB PL(sat) saturated load power f = 1 GHz 12.5 12.9 - dBm BGM1014 Philips Semiconductors MMIC wideband amplifier 2. Pinning information Table 2: Pinning Pin Description 1 VS 2, 5 GND2 3 RF_OUT 4 GND1 6 RF_IN Simplified outline 6 5 Symbol 1 4 6 1 2 3 4 3 2, 5 sym062 3. Ordering information Table 3: Ordering information Type number BGM1014 Package Name Description Version SC-88 plastic surface mounted package; 6 leads SOT363 4. Marking Table 4: Marking Type number Marking code BGM1014 C5- 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VS DC supply voltage RF input; AC coupled - 6 V IS supply current - 30 mA Ptot total power dissipation - 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C PD maximum drive power - −10 dBm Tsp ≤ 90 °C 6. Recommended operating conditions Table 6: Operating conditions Symbol Parameter Min Typ Max Unit VS DC supply voltage Conditions 4.5 5.0 5.5 V Tamb ambient temperature −40 +25 +85 °C 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 2 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 7. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point Ptot = 200 mW; Tsp ≤ 90 °C 300 K/W 8. Characteristics Table 8: Characteristics VS = 5 V; IS = 21.1 mA; Tj = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter VS DC supply voltage IS supply current |s21|2 insertion power gain Conditions RF input; AC coupled |s22|2 input return loss output return loss Typ Max Unit - 5 6 V 17 21.0 25 mA f = 100 MHz 29.0 30.0 31.0 dB f = 1 GHz 31.5 32.3 33.0 dB f = 1.8 GHz 34.0 35.2 36.5 dB f = 2.2 GHz 33.0 34.1 35.5 dB f = 2.6 GHz 29.0 30.5 32.0 dB see Figure 4 f = 3 GHz |s11|2 Min 25.0 26.4 28.0 dB f = 1 GHz 11 12.2 - dB f = 2.2 GHz 7.5 8.8 - dB f = 1 GHz 15 18.9 - dB f = 2.2 GHz 12 16.7 - dB f = 1 GHz 12 16.8 - dB f = 2.2 GHz 12 17.7 - dB f = 1 GHz 40 42 - dB f = 2.2 GHz 35 37 - dB f = 1 GHz - 4.2 4.3 dB f = 2.2 GHz - 4.1 4.3 dB - 2.5 - GHz f = 1 GHz 1.5 1.6 - f = 2.2 GHz 0.9 1.0 - 12.5 12.9 - ZL = 50 Ω ZL = 75 Ω |s12|2 NF isolation noise figure see Figure 3 see Figure 7 B bandwidth 3 dB below flat gain at f = 1 GHz K stability factor see Figure 8 PL(sat) saturated load power PL(1dB) load power at 1 dB gain compression f = 1 GHz f = 2.2 GHz 8.8 9.3 - dBm f = 1 GHz 10.5 11.2 - dBm f = 2.2 GHz 5.0 5.7 - dBm 9397 750 14499 Product data sheet dBm © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 3 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier Table 8: Characteristics …continued VS = 5 V; IS = 21.1 mA; Tj = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IP3in f = 1 GHz −13 −11.8 - dBm f = 2.2 GHz −21 −19 - dBm IP3out IM2 input third order intercept point output third order intercept point f = 1 GHz second order intermodulation distortion 19.5 20.5 - dBm f = 2.2 GHz 14 15.1 - dBm f0 = 1 GHz; PL = −10 dBm 36 37 - dBc f0 = 1 GHz; PL = −5 dBm 33 34 - dBc 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 +0.2 0.4 +5 0.2 100MHz 180° 0 0.2 1 0.5 2 5 10 0° 0 3GHz −5 −0.2 −135° −2 −0.5 −45° −1 −90° 1.0 001aac489 IS = 21.1 mA; VS = 5 V; PD = −35 dBm; Zo = 50 Ω Fig 1. Input reflection coefficient (s11); typical values 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 4 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 100MHz +0.2 0.4 +5 0.2 180° 0 1 0.5 0.2 2 5 10 0° 0 3GHz −5 −0.2 −135° −2 −0.5 −45° −1 1.0 −90° 001aac490 IS = 21.1 mA; VS = 5 V; PD = −35 dBm; Zo = 50 Ω Fig 2. Output reflection coefficient (s22); typical values 001aac491 0 s12 2 (dB) −10 001aac492 50 s21 2 (dB) 40 (1) (2) (3) −20 30 −30 20 −40 −50 10 0 1000 2000 3000 0 1000 2000 f (MHz) 3000 f (MHz) IS = 21.1 mA; VS = 5 V; PD = −35 dBm; Zo = 50 Ω PD = −35 dBm; Zo = 50 Ω (1) IS = 25.6 mA; VS = 5.5 V (2) IS = 21.5 mA; VS = 5 V (3) IS = 16.6 mA; VS = 4.5 V |2) Fig 3. Isolation (|s12 typical values as a function of frequency; Fig 4. Insertion gain (|s21|2) as a function of frequency; typical values 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 5 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 001aac493 20 PL (dBm) 15 001aac494 15 PL (dBm) (1) (2) (3) (1) (2) (3) 5 10 5 −5 0 −5 −40 −30 −20 −10 −15 −50 −40 −30 −20 −10 PD (dBm) PD (dBm) f = 1 GHz; Zo = 50 Ω f = 2.2 GHz; Zo = 50 Ω (1) VS = 5.5 V (1) VS = 5.5 V (2) VS = 5 V (2) VS = 5 V (3) VS = 4.5 V (3) VS = 4.5 V Fig 5. Load power as a function of drive power at 1 GHz; typical values Fig 6. Load power as a function of drive power at 2.2 GHz; typical values 001aac495 5 001aac496 5 K NF (dB) 4 4.5 (1) (2) (3) 3 2 4 1 0 3.5 0 500 1000 1500 2000 2500 f (MHz) Zo = 50 Ω 0 1000 2000 3000 4000 f (MHz) IS = 21.1 mA; VS = 5 V; Zo = 50 Ω (1) VS = 5.5 V (2) VS = 5 V (3) VS = 4.5 V Fig 7. Noise figure as a function of frequency; typical values Fig 8. Stability factor as a function of frequency; typical values 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 6 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 9. Application information Figure 9 shows a typical application circuit for the BGM1014 MMIC. The device is internally matched to 50 Ω and therefore does not need any external matching. Good impedance matching is also achieved with a 75 Ω load. The value of the input and output DC blocking capacitors C1 and C2 should be not more than 100 pF for applications above 100 MHz. Their values can be used to fine-tune the input and output impedance. For the RF choke, optimal results are obtained with a good quality chip inductor like the TDK MLG1608 (0603) or a wire-wound SMD. The value of the inductor can be used to fine-tune the output impedance. The RF choke and supply decoupling components should be located as close as possible to the MMIC. Ground paths must be as short as possible. The printed-circuit board (PCB) top ground plane must be as close as possible to the MMIC, and ideally directly beneath it. When using vias, use at least 3 vias for the top ground plane in order to limit ground path inductance. Supply decoupling with C3 should be from pin 1 to the same top ground plane. VS VS 1 IN 6 RF in L1 C2 3 OUT C1 C3 RF out BGM1014 SOT363 4 2, 5 GND1 GND2 001aac488 Fig 9. Typical application circuit 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 7 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier Figure 10 shows the PCB layout used for the typical application. 30 mm PH 30 mm IN OUT V+ PH IC1 C2 C1 L1 IN OUT C3 V+ 001aab395 Material = FR4; thickness = 0.6 mm; εr = 4.6 Fig 10. Printed-circuit board layout and component view for typical application Table 9: List of components used for the typical application Component Description Value C1, C2 multilayer ceramic chip capacitor 100 pF 0603 C3 multilayer ceramic chip capacitor 22 nF 0603 L1 SMD inductor 100 nH 0603 9397 750 14499 Product data sheet Dimensions © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 8 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier Table 10: Scattering parameters VS = 5 V; IS = 21.1 mA; PD = −35 dBm; Zo = 50 Ω; Tamb = 25 °C; measured on demo board. f (MHz) s11 s21 s12 s22 K-factor Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) 100 0.287 16.1 31.28 9.1 0.02196 9.4 0.355 125.5 1.0 200 0.328 −3.9 32.14 −7.1 0.01734 −3.3 0.258 115.3 1.1 400 0.319 −28.8 33.57 −30.9 0.01287 −21.1 0.208 87.6 1.2 600 0.299 −50.3 35.61 −52.3 0.00969 −35.3 0.179 62.1 1.5 800 0.272 −68.6 38.05 −73.3 0.00808 −42.7 0.149 34.7 1.6 1000 0.243 −84.7 41.37 −95.5 0.00751 −44.8 0.113 10.3 1.6 1200 0.225 −98.9 45.48 −119.1 0.00711 −43.7 0.084 −8.1 1.6 1400 0.229 −106.9 49.78 −144.8 0.00792 −37.3 0.042 −4.5 1.4 1600 0.261 −127.8 54.37 −173.0 0.00991 −37.9 0.042 34.4 1.1 1800 0.317 −154.4 57.96 154.4 0.01171 −37.2 0.059 41.5 1.0 2000 0.364 167.7 56.65 120.1 0.01302 −45.7 0.123 15.9 1.0 2200 0.362 126.7 50.11 85.0 0.01493 −60.5 0.130 −4.6 1.0 2400 0.354 87.5 41.68 54.6 0.01647 −69.8 0.130 −32.5 1.0 2600 0.325 47.6 33.47 25.9 0.01878 −81.7 0.137 −57.1 1.0 2800 0.282 7.7 26.34 1.4 0.02094 −94.0 0.135 −74.9 1.1 3000 0.231 −32.0 20.81 −20.3 0.02184 −112.2 0.112 −104.3 1.2 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 9 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 10. Package outline Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 97-02-28 04-11-08 Fig 11. Package outline SOT363 (SC-88) 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 10 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 11. Revision history Table 11: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes BGM1014_1 20050311 product data sheet - 9370 750 14499 - 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 11 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 12. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. Definitions 14. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 15. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 14499 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 March 2005 12 of 13 BGM1014 Philips Semiconductors MMIC wideband amplifier 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Recommended operating conditions. . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information . . . . . . . . . . . . . . . . . . . . 12 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 March 2005 Document number: 9397 750 14499 Published in The Netherlands