VISHAY SI1413DH

Si1413DH
New Product
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
–20
rDS(on) (W)
ID (A)
0.115 @ VGS = –4.5 V
–2.9
0.155 @ VGS = –2.5 V
–2.4
0.220 @ VGS = –1.8 V
–2.0
D TrenchFETr Power MOSFETS: 1.8-V Rated
D Thermally Enhanced SC-70 Package
APPLICATIONS
D Load Switching
D PA Switch
D Level Switch
SOT-363
SC-70 (6-LEADS)
D
1
6
D
D
2
5
D
G
3
4
S
Marking Code
BC
XX
YY
D
G
Lot Traceability
and Date Code
Part # Code
S
Top View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
–20
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
–2.3
–2.9
ID
TA = 85_C
Pulsed Drain Current
–2.0
–1.6
IDM
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
–8
–1.4
–0.9
1.56
1.0
0.81
0.52
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
60
80
100
125
34
45
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71878
S-20952—Rev. A, 01-Jul-02
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1
Si1413DH
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS = VGS, ID = –100 mA
–0.45
Typ
Max
Unit
0.8
V
"100
nA
Static
Gate Threshold Voltage
VGS(th)
Gate-Body Leakage
VDS = 0 V, VGS = "8 V
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Diode Forward Voltagea
–1
VDS = –16 V, VGS = 0 V, TJ = 85_C
–5
VDS = –5 V, VGS = –4.5 V
rDS(on)
Forward Transconductancea
VDS = –16 V, VGS = 0 V
m
mA
–4
A
VGS = –4.5 V, ID = –2.9 A
0.095
0.115
VGS = –2.5 V, ID = –2.4 A
0.125
0.155
VGS = –1.8 V, ID = –1.0 A
0.180
0.220
gfs
VDS = –10 V, ID = –2.9 A
6
VSD
IS = –1.4 A, VGS = 0 V
–0.80
–1.1
6
8.5
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
1.2
Turn-On Delay Time
td(on)
13
20
32
50
34
50
42
65
Rise Time
VDS = –10 V, VGS = –4.5 V, ID = –2.9 A
tr
Turn-Off Delay Time
VDD = –10 V, RL = 10 W
ID ^ –1 A, VGEN = –4.5 V, RG = 6 W
td(off)
Fall Time
1.2
tf
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
8
8
VGS = 5 thru 2.5 V
TC = –55_C
6
2V
I D – Drain Current (A)
I D – Drain Current (A)
6
4
1.5 V
2
25_C
125_C
4
2
1V
0
0
1
2
3
4
VDS – Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VGS – Gate-to-Source Voltage (V)
Document Number: 71878
S-20952—Rev. A, 01-Jul-02
Si1413DH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
1000
0.4
800
0.3
C – Capacitance (pF)
r DS(on) – On-Resistance ( W )
On-Resistance vs. Drain Current
0.5
VGS = 1.8 V
0.2
VGS = 2.5 V
Ciss
600
400
VGS = 4.5 V
0.1
200
0.0
0.0
Coss
Crss
0
1.5
3.0
4.5
6.0
7.5
0
4
Gate Charge
16
20
On-Resistance vs. Junction Temperature
6
1.6
VDS = 10 V
ID = –2.9 A
5
r DS(on) – On-Resistance (W)
(Normalized)
V GS – Gate-to-Source Voltage (V)
12
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
4
3
2
1
0
0.0
1.6
3.2
4.8
6.4
VGS = 4.5 V
ID = –2.9 A
1.4
1.2
1.0
0.8
0.6
–50
8.0
–25
0
Qg – Total Gate Charge (nC)
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
r DS(on) – On-Resistance ( W )
10
I S – Source Current (A)
8
TJ = 150_C
TJ = 25_C
1
0.4
0.3
ID = –2.9 A
0.2
0.1
0.0
0.1
0
0.3
0.6
0.9
1.2
VSD – Source-to-Drain Voltage (V)
Document Number: 71878
S-20952—Rev. A, 01-Jul-02
1.5
0
1
2
3
4
5
6
VGS – Gate-to-Source Voltage (V)
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Si1413DH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
35
ID = 250 mA
28
0.2
21
Power (W)
V GS(th) Variance (V)
0.3
0.1
14
0.0
7
–0.1
–0.2
–50
–25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
Time (sec)
TJ – Temperature (_C)
Safe Operating Area
10
1 ms
I D – Drain Current (A)
Limited by
rDS(on)
1
10 ms
100 ms
1s
0.1
10 s
dc
TC = 25_C
Single Pulse
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 100_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
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4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71878
S-20952—Rev. A, 01-Jul-02
Si1413DH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
Document Number: 71878
S-20952—Rev. A, 01-Jul-02
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
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