TI ADC12D1800RFIUT

ADC12D1800RF
ADC12D1800RF 12-Bit, Single 3.6 GSPS RF Sampling ADC
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: SNAS518H
July 2011 – Revised April 2013
ADC12D1800RF
www.ti.com
SNAS518H – JULY 2011 – REVISED APRIL 2013
Contents
1
Introduction
1.1
1.2
1.3
2
3
.............................................................................................................. 8
2.1
Block Diagram ............................................................................................................... 8
2.2
RF Performance ............................................................................................................. 9
2.3
Connection Diagram ...................................................................................................... 10
2.4
Ball Descriptions and Equivalent Circuits .............................................................................. 11
Electrical Specifications ..................................................................................................... 19
3.1
Absolute Maximum Ratings .............................................................................................. 19
3.2
Operating Ratings ......................................................................................................... 19
3.3
Package Thermal Resistance ............................................................................................ 20
Device Information
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
4
5
6
2
........................................................................................................................ 7
Features ...................................................................................................................... 7
Applications .................................................................................................................. 7
Description ................................................................................................................... 7
Converter Electrical Characteristics
Static Converter Characteristics .........................................................................................
Converter Electrical Characteristics
Dynamic Converter Characteristics .....................................................................................
Converter Electrical Characteristics
Analog Input / Output and Reference Characteristics ................................................................
Converter Electrical Characteristics
I-Channel to Q-Channel Characteristics ................................................................................
Converter Electrical Characteristics
Sampling Clock Characteristics .........................................................................................
Converter Electrical Characteristics
AutoSync Feature Characteristics .......................................................................................
Converter Electrical Characteristics
Digital Control and Output Pin Characteristics ........................................................................
Converter Electrical Characteristics
Power Supply Characteristics ............................................................................................
Converter Electrical Characteristics
AC Electrical Characteristics .............................................................................................
Converter Electrical Characteristics
Serial Port Interface .......................................................................................................
Converter Electrical Characteristics Calibration .......................................................................
20
21
24
25
25
25
26
27
27
29
29
.................................................................................................... 30
4.1
Transfer Characteristic .................................................................................................... 32
4.2
Timing Diagrams .......................................................................................................... 33
Typical Performance Plots .................................................................................................. 36
Functional Description ....................................................................................................... 41
6.1
OVERVIEW ................................................................................................................ 41
6.2
CONTROL MODES ....................................................................................................... 41
6.2.1
Non-Extended Control Mode .................................................................................. 41
6.2.1.1
Dual Edge Sampling Pin (DES) .................................................................. 42
6.2.1.2
Non-Demultiplexed Mode Pin (NDM) ............................................................ 42
6.2.1.3
Dual Data Rate Phase Pin (DDRPh) ............................................................ 42
6.2.1.4
Calibration Pin (CAL) .............................................................................. 43
6.2.1.5
Calibration Delay Pin (CalDly) .................................................................... 43
6.2.1.6
Power Down I-channel Pin (PDI) ................................................................ 43
6.2.1.7
Power Down Q-channel Pin (PDQ) .............................................................. 43
6.2.1.8
Test Pattern Mode Pin (TPM) .................................................................... 43
6.2.1.9
Full-Scale Input Range Pin (FSR) ............................................................... 43
6.2.1.10 AC / DC-Coupled Mode Pin (VCMO) .............................................................. 44
6.2.1.11 LVDS Output Common-mode Pin (VBG) ........................................................ 44
Specification Definitions
Contents
Copyright © 2011–2013, Texas Instruments Incorporated
ADC12D1800RF
www.ti.com
SNAS518H – JULY 2011 – REVISED APRIL 2013
Extended Control Mode ........................................................................................
6.2.2.1
The Serial Interface ................................................................................
FEATURES .................................................................................................................
6.3.1
Input Control and Adjust .......................................................................................
6.3.1.1
AC/DC-coupled Mode .............................................................................
6.3.1.2
Input Full-Scale Range Adjust ....................................................................
6.3.1.3
Input Offset Adjust .................................................................................
6.3.1.4
DES/Non-DES Mode ..............................................................................
6.3.1.5
DES Timing Adjust .................................................................................
6.3.1.6
Sampling Clock Phase Adjust ....................................................................
6.3.2
Output Control and Adjust .....................................................................................
6.3.2.1
SDR / DDR Clock ..................................................................................
6.3.2.2
LVDS Output Differential Voltage ................................................................
6.3.2.3
LVDS Output Common-Mode Voltage ..........................................................
6.3.2.4
Output Formatting ..................................................................................
6.3.2.5
Demux/Non-demux Mode .........................................................................
6.3.2.6
Test Pattern Mode .................................................................................
6.3.2.7
Time Stamp .........................................................................................
6.3.3
Calibration Feature .............................................................................................
6.3.3.1
Calibration Control Pins and Bits ................................................................
6.3.3.2
How to Execute a Calibration ....................................................................
6.3.3.3
Power-on Calibration ..............................................................................
6.3.3.4
On-command Calibration .........................................................................
6.3.3.5
Calibration Adjust ..................................................................................
6.3.3.6
Read / Write Calibration Settings ................................................................
6.3.3.7
Calibration and Power-Down .....................................................................
6.3.3.8
Calibration and the Digital Outputs ..............................................................
6.3.4
Power Down .....................................................................................................
Applications Information ..................................................................................................
6.4.1
THE ANALOG INPUTS ........................................................................................
6.4.1.1
Acquiring the Input .................................................................................
6.4.1.2
Driving the ADC in DES Mode ...................................................................
6.4.1.3
FSR and the Reference Voltage .................................................................
6.4.1.4
Out-Of-Range Indication ..........................................................................
6.4.1.5
Maximum Input Range ............................................................................
6.4.1.6
AC-coupled Input Signals .........................................................................
6.4.1.7
DC-coupled Input Signals .........................................................................
6.4.1.8
Single-Ended Input Signals .......................................................................
6.4.2
THE CLOCK INPUTS ..........................................................................................
6.4.2.1
CLK Coupling .......................................................................................
6.4.2.2
CLK Frequency .....................................................................................
6.4.2.3
CLK Level ...........................................................................................
6.4.2.4
CLK Duty Cycle ....................................................................................
6.4.2.5
CLK Jitter ............................................................................................
6.4.2.6
CLK Layout .........................................................................................
6.4.3
THE LVDS OUTPUTS .........................................................................................
6.4.3.1
Common-mode and Differential Voltage ........................................................
6.4.3.2
Output Data Rate ..................................................................................
6.4.3.3
Terminating Unused LVDS Output Pins ........................................................
6.4.4
SYNCHRONIZING MULTIPLE ADC12D1800RFS IN A SYSTEM .......................................
6.4.4.1
AutoSync Feature ..................................................................................
6.4.4.2
DCLK Reset Feature ..............................................................................
6.4.5
SUPPLY / GROUNDING, LAYOUT AND THERMAL RECOMMENDATIONS .........................
6.2.2
6.3
6.4
Copyright © 2011–2013, Texas Instruments Incorporated
Contents
44
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48
49
49
49
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50
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50
51
52
52
52
52
52
53
53
53
54
54
54
54
54
55
55
56
56
56
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59
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59
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60
61
61
3
ADC12D1800RF
SNAS518H – JULY 2011 – REVISED APRIL 2013
6.5
6.4.5.1
Power Planes .......................................................................................
6.4.5.2
Bypass Capacitors .................................................................................
6.4.5.3
Ground Planes .....................................................................................
6.4.5.4
Power System Example ...........................................................................
6.4.5.5
Thermal Management .............................................................................
6.4.6
SYSTEM POWER-ON CONSIDERATIONS ................................................................
6.4.6.1
Power-on, Configuration, and Calibration .......................................................
6.4.6.2
Power-on and Data Clock (DCLK) ...............................................................
6.4.7
RECOMMENDED SYSTEM CHIPS .........................................................................
6.4.7.1
Temperature Sensor ...............................................................................
6.4.7.2
Clocking Device ....................................................................................
6.4.7.3
Amplifiers for Analog Input ........................................................................
6.4.7.4
Balun Recommendations for Analog Input .....................................................
Register Definitions .......................................................................................................
Revision History
4
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Contents
61
62
62
62
63
64
64
66
67
67
68
68
68
69
......................................................................................................................... 75
Copyright © 2011–2013, Texas Instruments Incorporated
ADC12D1800RF
www.ti.com
SNAS518H – JULY 2011 – REVISED APRIL 2013
List of Figures
2-1
ADC12D1800RF Non-DES Mode IMD3......................................................................................... 9
2-2
ADC12D1800RF DES Mode FFT .............................................................................................. 10
2-3
ADC12D1800RF Connection Diagram ........................................................................................ 10
4-1
LVDS Output Signal Levels ..................................................................................................... 31
4-2
Input / Output Transfer Characteristic
4-3
Clocking in 1:2 Demux Non-DES Mode* ...................................................................................... 33
4-4
Clocking in Non-Demux Non-DES Mode*..................................................................................... 33
4-5
Clocking in 1:4 Demux DES Mode* ............................................................................................ 34
4-6
Clocking in Non-Demux Mode DES Mode* ................................................................................... 34
4-7
Data Clock Reset Timing (Demux Mode) ..................................................................................... 35
4-8
Power-on and On-Command Calibration Timing............................................................................. 35
4-9
Serial Interface Timing ........................................................................................................... 35
6-1
Serial Data Protocol - Read Operation ........................................................................................ 46
6-2
Serial Data Protocol - Write Operation ........................................................................................ 46
6-3
DDR DCLK-to-Data Phase Relationship ...................................................................................... 49
6-4
SDR DCLK-to-Data Phase Relationship ...................................................................................... 50
6-5
Driving DESIQ Mode ............................................................................................................. 55
6-6
AC-coupled Differential Input ................................................................................................... 57
6-7
Single-Ended to Differential Conversion Using a Balun ..................................................................... 57
6-8
Differential Input Clock Connection ............................................................................................ 58
6-9
AutoSync Example ............................................................................................................... 61
6-10
Power and Grounding Example ................................................................................................ 63
6-11
HSBGA Conceptual Drawing ................................................................................................... 63
6-12
Power-on with Control Pins set by Pull-up / down Resistors ............................................................... 66
6-13
Power-on with Control Pins set by FPGA pre Power-on Cal ............................................................... 66
6-14
Power-on with Control Pins set by FPGA post Power-on Cal .............................................................. 66
6-15
Supply and DCLK Ramping ..................................................................................................... 67
6-16
Typical Temperature Sensor Application ...................................................................................... 68
Copyright © 2011–2013, Texas Instruments Incorporated
........................................................................................
List of Figures
33
5
ADC12D1800RF
SNAS518H – JULY 2011 – REVISED APRIL 2013
www.ti.com
List of Tables
2-1
Analog Front-End and Clock Balls ............................................................................................. 11
2-2
Control and Status Balls ......................................................................................................... 13
2-3
Power and Ground Balls
2-4
High-Speed Digital Outputs ..................................................................................................... 17
6-1
Non-ECM Pin Summary ......................................................................................................... 42
6-2
Serial Interface Pins.............................................................................................................. 44
6-3
Command and Data Field Definitions
6-4
6-5
........................................................................................................
.........................................................................................
Features and Modes ............................................................................................................
Supported Demux, Data Rate Modes .........................................................................................
16
45
46
50
6-6
Test Pattern by Output Port in
Demux Mode ...................................................................................................................... 51
6-7
Test Pattern by Output Port in
Non-Demux Mode ................................................................................................................ 51
6-8
Calibration Pins ................................................................................................................... 52
6-9
Unused Analog Input Recommended Termination .......................................................................... 56
6-10
Unused AutoSync and DCLK Reset Pin Recommendation ................................................................ 60
6-11
Temperature Sensor Recommendation ....................................................................................... 67
6-12
Amplifier Recommendation
6-13
Balun Recommendations ........................................................................................................ 68
6-14
Register Addresses .............................................................................................................. 69
6-15
Configuration Register 1......................................................................................................... 69
6-16
Reserved .......................................................................................................................... 70
6-17
I-channel Offset Adjust
6-18
I-channel Full Scale Range Adjust ............................................................................................. 71
6-19
Calibration Adjust ................................................................................................................. 71
6-20
Calibration Values ................................................................................................................ 71
6-21
Bias Adjust ........................................................................................................................ 72
6-22
DES Timing Adjust ............................................................................................................... 72
6-23
Reserved .......................................................................................................................... 72
6-24
Reserved .......................................................................................................................... 72
6-25
Q-channel Offset Adjust ......................................................................................................... 72
6-26
Q-channel Full-Scale Range Adjust
6-27
Aperture Delay Coarse Adjust .................................................................................................. 73
6-28
Aperture Delay Fine Adjust
6-29
6-30
6
.....................................................................................................
..........................................................................................................
...........................................................................................
.....................................................................................................
AutoSync .........................................................................................................................
Reserved ..........................................................................................................................
List of Tables
68
70
73
73
74
74
Copyright © 2011–2013, Texas Instruments Incorporated
ADC12D1800RF
www.ti.com
SNAS518H – JULY 2011 – REVISED APRIL 2013
ADC12D1800RF 12-Bit, Single 3.6 GSPS RF Sampling ADC
Check for Samples: ADC12D1800RF
1
Introduction
1.1
Features
12
• Excellent Noise and Linearity up to and Above
fIN = 2.7 GHz
• Configurable to Either 3.6 GSPS Interleaved or
1800 MSPS Dual ADC
• New DESCLKIQ Mode for High Bandwidth, High
Sampling Rate Apps
• Pin-Compatible with ADC1xD1x00,
ADC12Dx00RF
• AutoSync Feature for Multi-Chip
Synchronization
• Internally Terminated, Buffered, Differential
Analog Inputs
• Interleaved Timing Automatic and Manual Skew
Adjust
• Test Patterns at Output for System Debug
• Time Stamp Feature to Capture External
Trigger
• Programmable Gain, Offset, and tAD Adjust
Feature
• 1:1 Non-demuxed or 1:2 Demuxed LVDS
Outputs
1.2
•
•
•
•
Applications
3G/4G Wireless Basestation
– Receive Path
– DPD Path
Wideband Microwave Backhaul
RF Sampling Software Defined Radio
Military Communications
1.3
• Key Specifications
– Resolution: 12 Bits
– Interleaved 3.6 GSPS ADC
• IMD3 (Fin = 2.7GHz @ -13dBFS) -62 dBc
(typ)
• IMD3 (Fin = 2.7GHz @ -16dBFS) -64 dBc
(typ)
• Noise Floor Density -155.0 dBm/Hz (typ)
• Power 4.29 W (typ)
– Dual 1800 MSPS ADC, Fin = 498 MHz
• ENOB 9.3 Bits (typ)
• SNR 58.1 dB (typ)
• SFDR 71.7 dBc (typ)
• Power per Channel 2.15 W (typ)
•
•
•
•
•
SIGINT
RADAR / LIDAR
Wideband Communications
Consumer RF
Test and Measurement
Description
The 12-bit 1.8 GSPS ADC12D1800RF is an RF-sampling GSPS ADC that can directly sample input
frequencies up to and above 2.7 GHz. The ADC12D1800RF augments the very large Nyquist zone of TI’s
GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range
beyond the 3rd Nyquist zone.
The ADC12D1800RF provides a flexible LVDS interface which has multiple SPI programmable options to
facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.31996 and supports programmable common mode voltage. The product is packaged in a lead-free 292-ball
thermally enhanced BGA package over the rated industrial temperature range of -40°C to +85°C.
To achieve the full rated performance for Fclk > 1.6 GHz, it is necessary to write the max power
settings once to Register 6h via the Serial Interface; see Register Definitions for more information.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
ADC12D1800RF
SNAS518H – JULY 2011 – REVISED APRIL 2013
2
Device Information
2.1
Block Diagram
8
Device Information
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2.2
SNAS518H – JULY 2011 – REVISED APRIL 2013
RF Performance
-40
-7 dBFS
-10 dBFS
-13 dBFS
-16 dBFS
IMD3(dBFS)
-50
-60
-70
-80
-90
-100
0
1
2
3
INPUT FREQUENCY (GHz)
4
CW Blocker: Fin = 2675 MHz; Total Power = -13 dBFS
WCDMA Blocker: Fc = 2685 MHz; Bandwidth = 3.84 MHz; Total Power = -13 dBFS
IMD3 Product Power = -75 dBFS
Figure 2-1. ADC12D1800RF Non-DES Mode IMD3
0
MAGNITUDE (dBFS)
Fin = 2.7 GHz
-30
-60
-90
-120
905 910 915 920 925 930 935 940
FREQUENCY (MHz)
Figure 2-2. ADC12D1800RF DES Mode FFT
Device Information
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ADC12D1800RF
SNAS518H – JULY 2011 – REVISED APRIL 2013
2.3
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Connection Diagram
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
A
GND
V_A
SDO
TPM
NDM
V_A
GND
V_E
GND_E
DId0+
V_DR
DId3+
GND_DR
DId6+
V_DR
DId9+
B
Vbg
GND
ECEb
SDI
CalRun
V_A
GND
GND_E
V_E
DId0-
DId2+
DId3-
DId5+
DId6-
DId8+
DId9-
DId10+
C
Rtrim+
Vcmo
Rext+
SCSb
SCLK
V_A
NC
V_E
GND_E
DId1+
DId2-
DId4+
DId5-
DId7+
DId8-
DId10-
D
DNC
Rtrim-
Rext-
GND
GND
CAL
DNC
V_A
V_A
DId1-
V_DR
DId4-
GND_DR
DId7-
V_DR
GND_DR
E
V_A
Tdiode+
DNC
F
V_A
G
18
19
20
DId11-
GND_DR
A
DI0+
DI1+
DI1-
B
DI0-
V_DR
DI2+
DI2-
C
V_DR
DI3+
DI4+
DI4-
D
GND
GND_DR
DI3-
DI5+
DI5-
E
GND_TC Tdiode-
DNC
GND_DR
DI6+
DI6-
GND_DR
F
V_TC
GND_TC
V_TC
V_TC
DI7+
DI7-
DI8+
DI8-
G
H
VinI+
V_TC
GND_TC
V_A
GND
GND
GND
GND
GND
GND
DI9+
DI9-
DI10+
DI10-
H
J
VinI-
GND_TC
V_TC
VbiasI
GND
GND
GND
GND
GND
GND
V_DR
DI11+
DI11-
V_DR
J
K
GND
VbiasI
V_TC
GND_TC
GND
GND
GND
GND
GND
GND
ORI+
ORI-
DCLKI+
DCLKI-
K
L
GND
VbiasQ
V_TC
GND_TC
GND
GND
GND
GND
GND
GND
ORQ+
ORQ-
DCLKQ+ DCLKQ-
L
M
VinQ-
GND_TC
V_TC
VbiasQ
GND
GND
GND
GND
GND
GND
N
VinQ+
V_TC
GND_TC
V_A
GND
GND
GND
GND
GND
GND
P
V_TC
GND_TC
V_TC
R
V_A
GND_TC
V_TC
T
V_A
GND_TC GND_TC
U
GND_TC
CLK+
PDI
GND
GND
RCOut1-
V
CLK-
DCLK
_RST+
PDQ
CalDly
DES
RCOut2+ RCOut2-
W
DCLK
_RST-
GND
DNC
DDRPh
RCLK-
Y
GND
V_A
FSR
RCLK+ RCOut1+
1
2
3
GND_DR DId11+
GND_DR DQ11+
DQ11-
GND_DR
M
DQ9+
DQ9-
DQ10+
DQ10-
N
V_TC
DQ7+
DQ7-
DQ8+
DQ8-
P
V_TC
V_DR
DQ6+
DQ6-
V_DR
R
GND
V_DR
DQ3-
DQ5+
DQ5-
T
4
5
DNC
V_A
V_A
DQd1-
V_DR
DQd4-
V_E
GND_E
DQd1+
DQd2-
DQd4+
DQd5-
DQd5+
V_DR
V_DR
GND_DR
DQ3+
DQ4+
DQ4-
U
DQd7+
DQd8-
DQd10-
DQ0-
GND_DR
DQ2+
DQ2-
V
DQd6-
DQd8+
DQd9-
DQd10+
DQ0+
DQ1+
DQ1-
W
V_DR
DQd9+ GND_DR DQd11+ DQd11- GND_DR
GND_DR DQd7-
V_A
GND
GND_E
V_E
DQd0-
DQd2+
DQd3-
V_A
GND
V_E
GND_E
DQd0+
V_DR
DQd3+ GND_DR DQd6+
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Y
20
Figure 2-3. ADC12D1800RF Connection Diagram
The center ground pins are for thermal dissipation and must be soldered to a ground plane to
ensure rated performance. See SUPPLY / GROUNDING, LAYOUT AND THERMAL
RECOMMENDATIONS for more information.
10
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2.4
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Ball Descriptions and Equivalent Circuits
Table 2-1. Analog Front-End and Clock Balls
Ball No.
Name
Equivalent Circuit
Description
Differential signal I- and Q-inputs. In the Non-Dual
Edge Sampling (Non-DES) Mode, each I- and Qinput is sampled and converted by its respective
channel with each positive transition of the CLK
input. In Non-ECM (Non-Extended Control Mode)
and DES Mode, both channels sample the I-input.
In Extended Control Mode (ECM), the Q-input
may optionally be selected for conversion in DES
Mode by the DEQ Bit (Addr: 0h, Bit 6).
VA
50k
AGND
H1/J1
N1/M1
VinI+/VinQ+/-
VCMO
100
Control from VCMO
VA
50k
Each I- and Q-channel input has an internal
common mode bias that is disabled when DCcoupled Mode is selected. Both inputs must be
either AC- or DC-coupled. The coupling mode is
selected by the VCMO Pin.
In Non-ECM, the full-scale range of these inputs is
determined by the FSR Pin; both I- and Qchannels have the same full-scale input range. In
ECM, the full-scale input range of the I- and Qchannel inputs may be independently set via the
Control Register (Addr: 3h and Addr: Bh).
AGND
The input offset may also be adjusted in ECM.
VA
U2/V1
CLK+/-
50k
AGND
VA
100
VBIAS
50k
Differential Converter Sampling Clock. In the NonDES Mode, the analog inputs are sampled on the
positive transitions of this clock signal. In the DES
Mode, the selected input is sampled on both
transitions of this clock. This clock must be ACcoupled.
AGND
VA
V2/W1
DCLK_RST+/-
AGND
100
VA
Differential DCLK Reset. A positive pulse on this
input is used to reset the DCLKI and DCLKQ
outputs of two or more ADC12D1800RFs in order
to synchronize them with other ADC12D1800RFs
in the system. DCLKI and DCLKQ are always in
phase with each other, unless one channel is
powered down, and do not require a pulse from
DCLK_RST to become synchronized. The pulse
applied here must meet timing relationships with
respect to the CLK input. Although supported, this
feature has been superseded by AutoSync.
AGND
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Table 2-1. Analog Front-End and Clock Balls (continued)
Ball No.
Name
Equivalent Circuit
Description
VA
VCMO
C2
200k
VCMO
Enable AC
Coupling
8 pF
GND
Bandgap Voltage Output or LVDS Common-mode
Voltage Select. This pin provides a buffered
version of the bandgap output voltage and is
capable of sourcing / sinking 100 uA and driving a
load of up to 80 pF. Alternately, this pin may be
used to select the LVDS digital output commonmode voltage. If tied to logic-high, the 1.2V LVDS
common-mode voltage is selected; 0.8V is the
default.
VA
B1
Common Mode Voltage Output or Signal Coupling
Select. If AC-coupled operation at the analog
inputs is desired, this pin should be held at logiclow level. This pin is capable of sourcing/ sinking
up to 100 µA. For DC-coupled operation, this pin
should be left floating or terminated into highimpedance. In DC-coupled Mode, this pin provides
an output voltage which is the optimal commonmode voltage for the input signal and should be
used to set the common-mode voltage of the
driving buffer.
VBG
GND
VA
C3/D3
Rext+/-
V
External Reference Resistor terminals. A 3.3 kΩ
±0.1% resistor should be connected between
Rext+/-. The Rext resistor is used as a reference
to trim internal circuits which affect the linearity of
the converter; the value and precision of this
resistor should not be compromised.
GND
VA
C1/D2
Rtrim+/-
V
Input Termination Trim Resistor terminals. A 3.3
kΩ ±0.1% resistor should be connected between
Rtrim+/-. The Rtrim resistor is used to establish
the calibrated 100Ω input impedance of VinI, VinQ
and CLK. These impedances may be fine tuned
by varying the value of the resistor by a
corresponding percentage; however, the tuning
range and performance is not ensured for such an
alternate value.
GND
VA
Tdiode_P
E2/F3
GND
Tdiode+/-
VA
Temperature Sensor Diode Positive (Anode) and
Negative (Cathode) Terminals. This set of pins is
used for die temperature measurements. It has
not been fully characterized.
Tdiode_N
GND
12
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Table 2-1. Analog Front-End and Clock Balls (continued)
Ball No.
Name
Equivalent Circuit
Description
VA
Y4/W5
50k
AGND
RCLK+/-
100
VA
VBIAS
50k
Reference Clock Input. When the AutoSync
feature is active, and the ADC12D1800RF is in
Slave Mode, the internal divided clocks are
synchronized with respect to this input clock. The
delay on this clock may be adjusted when
synchronizing multiple ADCs. This feature is
available in ECM via Control Register (Addr: Eh).
AGND
VA
100:
Y5/U6
V6/V7
100:
RCOut1+/RCOut2+/-
+
Reference Clock Output 1 and 2. These signals
provide a reference clock at a rate of CLK/4, when
enabled, independently of whether the ADC is in
Master or Slave Mode. They are used to drive the
RCLK of another ADC12D1800RF, to enable
automatic synchronization for multiple ADCs
(AutoSync feature). The impedance of each trace
from RCOut1 and RCOut2 to the RCLK of another
ADC12D1800RF should be 100Ω differential.
Having two clock outputs allows the autosynchronization to propagate as a binary tree. Use
the DOC Bit (Addr: Eh, Bit 1) to enable/ disable
this feature; default is disabled.
A GND
Table 2-2. Control and Status Balls
Ball No.
Name
Equivalent Circuit
VA
V5
DES
GND
Description
Dual Edge Sampling (DES) Mode select. In the
Non-Extended Control Mode (Non-ECM), when
this input is set to logic-high, the DES Mode of
operation is selected, meaning that the VinI input
is sampled by both channels in a time-interleaved
manner. The VinQ input is ignored. When this
input is set to logic-low, the device is in Non-DES
Mode, i.e. the I- and Q-channels operate
independently. In the Extended Control Mode
(ECM), this input is ignored and DES Mode
selection is controlled through the Control Register
by the DES Bit (Addr: 0h, Bit 7); default is NonDES Mode operation.
VA
V4
Calibration Delay select. By setting this input logichigh or logic-low, the user can select the device to
wait a longer or shorter amount of time,
respectively, before the automatic power-on selfcalibration is initiated. This feature is pin-controlled
only and is always active during ECM and NonECM.
CalDly
GND
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Table 2-2. Control and Status Balls (continued)
Ball No.
Name
Equivalent Circuit
VA
D6
CAL
GND
Description
Calibration cycle initiate. The user can command
the device to execute a self-calibration cycle by
holding this input high a minimum of tCAL_H after
having held it low a minimum of tCAL_L. If this input
is held high at the time of power-on, the automatic
power-on calibration cycle is inhibited until this
input is cycled low-then-high. This pin is active in
both ECM and Non-ECM. In ECM, this pin is
logically OR'd with the CAL Bit (Addr: 0h, Bit 15)
in the Control Register. Therefore, both pin and bit
must be set low and then either can be set high to
execute an on-command calibration.
VA
B5
Calibration Running indication. This output is
logic-high while the calibration sequence is
executing. This output is logic-low otherwise.
CalRun
GND
VA
50 k:
U3
V3
PDI
PDQ
Power Down I- and Q-channel. Setting either input
to logic-high powers down the respective I- or Qchannel. Setting either input to logic-low brings the
respective I- or Q-channel to an operational state
after a finite time delay. This pin is active in both
ECM and Non-ECM. In ECM, each Pin is logically
OR'd with its respective Bit. Therefore, either this
pin or the PDI and PDQ Bit in the Control Register
can be used to power-down the I- and Q-channel
(Addr: 0h, Bit 11 and Bit 10), respectively.
GND
VA
A4
Test Pattern Mode select. With this input at logichigh, the device continuously outputs a fixed,
repetitive test pattern at the digital outputs. In the
ECM, this input is ignored and the Test Pattern
Mode can only be activated through the Control
Register by the TPM Bit (Addr: 0h, Bit 12).
TPM
GND
VA
A5
Non-Demuxed Mode select. Setting this input to
logic-high causes the digital output bus to be in
the 1:1 Non-Demuxed Mode. Setting this input to
logic-low causes the digital output bus to be in the
1:2 Demuxed Mode. This feature is pin-controlled
only and remains active during ECM and NonECM.
NDM
GND
14
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Table 2-2. Control and Status Balls (continued)
Ball No.
Name
Equivalent Circuit
VA
Y3
FSR
GND
VA
W4
DDRPh
GND
Description
Full-Scale input Range select. In Non-ECM, this
input must be set to logic-high; the full-scale
differential input range for both I- and Q-channel
inputs is set by this pin. In the ECM, this input is
ignored and the full-scale range of the I- and Qchannel inputs is independently determined by the
setting of Addr: 3h and Addr: Bh, respectively.
Note that the logic-high FSR value in Non-ECM
corresponds to the minimum allowed selection in
ECM.
DDR Phase select. This input, when logic-low,
selects the 0° Data-to-DCLK phase relationship.
When logic-high, it selects the 90° Data-to-DCLK
phase relationship, i.e. the DCLK transition
indicates the middle of the valid data outputs. This
pin only has an effect when the chip is in 1:2
Demuxed Mode, i.e. the NDM pin is set to logiclow. In ECM, this input is ignored and the DDR
phase is selected through the Control Register by
the DPS Bit (Addr: 0h, Bit 14); the default is 0°
Mode.
VA
50 k:
B3
ECE
Extended Control Enable bar. Extended feature
control through the SPI interface is enabled when
this signal is asserted (logic-low). In this case,
most of the direct control pins have no effect.
When this signal is de-asserted (logic-high), the
SPI interface is disabled, all SPI registers are
reset to their default values, and all available
settings are controlled via the control pins.
GND
VA
100 k:
C4
SCS
Serial Chip Select bar. In ECM, when this signal is
asserted (logic-low), SCLK is used to clock in
serial data which is present on SDI and to source
serial data on SDO. When this signal is deasserted (logic-high), SDI is ignored and SDO is in
TRI-STATE.
GND
VA
100 k:
C5
SCLK
Serial Clock. In ECM, serial data is shifted into
and out of the device synchronously to this clock
signal. This clock may be disabled and held logiclow, as long as timing specifications are not
violated when the clock is enabled or disabled.
GND
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Table 2-2. Control and Status Balls (continued)
Ball No.
Name
Equivalent Circuit
Description
VA
100 k:
B4
Serial Data-In. In ECM, serial data is shifted into
the device on this pin while SCS signal is asserted
(logic-low).
SDI
GND
VA
A3
Serial Data-Out. In ECM, serial data is shifted out
of the device on this pin while SCS signal is
asserted (logic-low). This output is at TRI-STATE
when SCS is de-asserted.
SDO
GND
D1, D7, E3, F4,
W3, U7
DNC
NONE
Do Not Connect. These pins are used for internal
purposes and should not be connected, i.e. left
floating. Do not ground.
C7
NC
NONE
Not Connected. This pin is not bonded and may
be left floating or connected to any potential.
Table 2-3. Power and Ground Balls
Ball No.
Name
Equivalent Circuit
A2, A6, B6, C6,
D8, D9, E1, F1,
H4, N4, R1, T1,
U8, U9, W6, Y2,
Y6
VA
NONE
Power Supply for the Analog circuitry. This supply
is tied to the ESD ring. Therefore, it must be
powered up before or with any other supply.
G1, G3, G4, H2,
J3, K3, L3, M3,
N2, P1, P3, P4,
R3, R4
VTC
NONE
Power Supply for the Track-and-Hold and Clock
circuitry.
A11, A15, C18,
D11, D15, D17,
J17, J20, R17,
R20, T17, U11,
U15, U16, Y11,
Y15
VDR
NONE
Power Supply for the Output Drivers.
A8, B9, C8, V8,
W9, Y8
VE
NONE
Power Supply for the Digital Encoder.
NONE
Bias Voltage I-channel. This is an externally
decoupled bias voltage for the I-channel. Each pin
should individually be decoupled with a 100 nF
capacitor via a low resistance, low inductance
path to GND.
NONE
Bias Voltage Q-channel. This is an externally
decoupled bias voltage for the Q-channel. Each
pin should individually be decoupled with a 100 nF
capacitor via a low resistance, low inductance
path to GND.
J4, K2
L2, M4
16
VbiasI
VbiasQ
Description
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Table 2-3. Power and Ground Balls (continued)
Ball No.
Name
Equivalent Circuit
A1, A7, B2, B7,
D4, D5, E4, K1,
L1, T4, U4, U5,
W2, W7, Y1, Y7,
H8:N13
Description
GND
NONE
Ground Return for the Analog circuitry.
F2, G2, H3, J2,
K4, L4, M2, N3,
P2, R2, T2, T3,
U1
GNDTC
NONE
Ground Return for the Track-and-Hold and Clock
circuitry.
A13, A17, A20,
D13, D16, E17,
F17, F20, M17,
M20, U13, U17,
V18, Y13, Y17,
Y20
GNDDR
NONE
Ground Return for the Output Drivers.
A9, B8, C9, V9,
W8, Y9
GNDE
NONE
Ground Return for the Digital Encoder.
Table 2-4. High-Speed Digital Outputs
Ball No.
Name
Equivalent Circuit
Description
VDR
K19/K20
L19/L20
DCLKI+/DCLKQ+/-
-
+
+
-
Data Clock Output for the I- and Q-channel data
bus. These differential clock outputs are used to
latch the output data and, if used, should always
be terminated with a 100Ω differential resistor
placed as closely as possible to the differential
receiver. Delayed and non-delayed data outputs
are supplied synchronously to this signal. In 1:2
Demux Mode or Non-Demux Mode, this signal is
at ¼ or ½ the sampling clock rate, respectively.
DCLKI and DCLKQ are always in phase with each
other, unless one channel is powered down, and
do not require a pulse from DCLK_RST to
become synchronized.
DR GND
VDR
K17/K18
L17/L18
ORI+/ORQ+/-
-
+
+
-
Out-of-Range Output for the I- and Q-channel.
This differential output is asserted logic-high while
the over- or under-range condition exists, i.e. the
differential signal at each respective analog input
exceeds the full-scale value. Each OR result
refers to the current Data, with which it is clocked
out. If used, each of these outputs should always
be terminated with a 100Ω differential resistor
placed as closely as possible to the differential
receiver. ORQ (1).
DR GND
(1)
This pin / bit functionality is not tested in production test; performance is tested in the specified / default mode only.
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Table 2-4. High-Speed Digital Outputs (continued)
18
Ball No.
Name
J18/J19
H19/H20
H17/H18
G19/G20
G17/G18
F18/F19
E19/E20
D19/D20
D18/E18
C19/C20
B19/B20
B18/C17
·
M18/M19
N19/N20
N17/N18
P19/P20
P17/P18
R18/R19
T19/T20
U19/U20
U18/T18
V19/V20
W19/W20
W18/V17
DI11+/DI10+/DI9+/DI8+/DI7+/DI6+/DI5+/DI4+/DI3+/DI2+/DI1+/DI0+/·
DQ11+/DQ10+/DQ9+/DQ8+/DQ7+/DQ6+/DQ5+/DQ4+/DQ3+/DQ2+/DQ1+/DQ0+/-
A18/A19
B17/C16
A16/B16
B15/C15
C14/D14
A14/B14
B13/C13
C12/D12
A12/B12
B11/C11
C10/D10
A10/B10
·
Y18/Y19
W17/V16
Y16/W16
W15/V15
V14/U14
Y14/W14
W13/V13
V12/U12
Y12/W12
W11/V11
V10/U10
Y10/W10
DId11+/DId10+/DId9+/DId8+/DId7+/DId6+/DId5+/DId4+/DId3+/DId2+/DId1+/DId0+/·
DQd11+/DQd10+/DQd9+/DQd8+/DQd7+/DQd6+/DQd5+/DQd4+/DQd3+/DQd2+/DQd1+/DQd0+/-
Equivalent Circuit
Description
VDR
-
+
+
-
I- and Q-channel Digital Data Outputs. In NonDemux Mode, this LVDS data is transmitted at the
sampling clock rate. In Demux Mode, these
outputs provide ½ the data at ½ the sampling
clock rate, synchronized with the delayed data, i.e.
the other ½ of the data which was sampled one
clock cycle earlier. Compared with the DId and
DQd outputs, these outputs represent the later
time samples. If used, each of these outputs
should always be terminated with a 100Ω
differential resistor placed as closely as possible
to the differential receiver.
DR GND
VDR
-
+
+
-
Delayed I- and Q-channel Digital Data Outputs. In
Non-Demux Mode, these outputs are at TRISTATE. In Demux Mode, these outputs provide ½
the data at ½ the sampling clock rate,
synchronized with the non-delayed data, i.e. the
other ½ of the data which was sampled one clock
cycle later. Compared with the DI and DQ outputs,
these outputs represent the earlier time samples.
If used, each of these outputs should always be
terminated with a 100Ω differential resistor placed
as closely as possible to the differential receiver.
DR GND
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
3
Electrical Specifications
3.1
Absolute Maximum Ratings (1) (2)
Supply Voltage (VA, VTC, VDR, VE)
2.2V
Supply Difference
max(VA/TC/DR/E)- min(VA/TC/DR/E)
0V to 100 mV
Voltage on Any Input Pin
(except VIN+/-)
−0.15V to
(VA + 0.15V)
VIN+/- Voltage Range
-0.5V to 2.5V
Ground Difference
max(GNDTC/DR/E) -min(GNDTC/DR/E)
0V to 100 mV
Input Current at Any Pin (3)
±50 mA
ADC12D1800RF Package Power Dissipation at TA ≤ 65°C (3)
4.95 W
ESD Susceptibility
(4)
Human Body Model
2500V
Charged Device Model
1000V
Machine Model
(1)
(2)
(3)
(4)
3.2
250V
−65°C to +150°C
Storage Temperature
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the
Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific
performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0V, unless otherwise specified.
When the input voltage at any pin exceeds the power supply limits, i.e. less than GND or greater than VA, the current at that pin should
be limited to 50 mA. In addition, over-voltage at a pin must adhere to the maximum voltage limits. Simultaneous over-voltage at multiple
pins requires adherence to the maximum package power dissipation limits. These dissipation limits are calculated using JEDEC
JESD51-7 thermal model. Higher dissipation may be possible based on specific customer thermal situation and specified package
thermal resistances from junction to case.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
Charged device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated
assembler) then rapidly being discharged.
Operating Ratings (1) (2)
Ambient Temperature Range
ADC12D1800RF (Standard JEDEC thermal model)
−40°C ≤ TA ≤ +50°C
ADC12D1800RF (Enhanced thermal model / heatsink)
−40°C ≤ TA ≤ +85°C
Junction Temperature Range - applies only to
maximum operating speed
TJ ≤ +120°C
Supply Voltage (VA, VTC, VE)
+1.8V to +2.0V
Driver Supply Voltage (VDR)
VIN+/- Voltage Range
+1.8V to VA
(3)
-0.4V to 2.4V (d.c.-coupled)
VIN+/- Differential Voltage Range (4)
1.0V (d.c.-coupled @100% duty cycle)
2.0V (d.c.-coupled @20% duty cycle)
2.8V (d.c.-coupled @10% duty cycle)
VIN+/- Current Range (3)
(1)
(2)
(3)
(4)
±50 mA peak (a.c.-coupled)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the
Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific
performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0V, unless otherwise specified.
Proper common mode voltage must be maintained to ensure proper output codes, especially during input overdrive.
This rating is intended for d.c.-coupled applications; the voltages listed may be safely applied to VIN+/- for the life-time duty-cycle of the
part.
Electrical Specifications
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Operating Ratings(1)(2) (continued)
VIN+/- Power
15.3 dBm (maintaining common mode voltage, a.c.-coupled)
17.1 dBm (not maintaining common mode voltage, a.c.-coupled)
Ground Difference
max(GNDTC/DR/E) -min(GNDTC/DR/E)
0V
CLK+/- Voltage Range
0V to VA
Differential CLK Amplitude
0.4VP-P to 2.0VP-P
Common Mode Input Voltage
Package Thermal Resistance (1)
3.3
(1)
VCMO - 150mV < VCMI < VCMO +150mV
Package
θJA
θJC1
θJC2
292-Ball BGA Thermally Enhanced Package
16°C/W
2.9°C/W
2.5°C/W
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
3.4
Converter Electrical Characteristics
Static Converter Characteristics
Unless otherwise specified, the following apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, ACcoupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave
Sampling Clock, fCLK = 1.8 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Extended Control Mode with
Register 6h written to 1C0Eh; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2
Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX and for TJ < 105°C. All
other limits TA = 25°C, unless otherwise noted. (1) (2) (3)
Symbol
Parameter
Conditions
ADC12D1800RF
Typ
Resolution with No Missing Codes
Lim
Units
(Limits)
12
bits
INL
Integral Non-Linearity
(Best fit)
1 MHz DC-coupled over-ranged
sine wave
±2.5
LSB
DNL
Differential Non-Linearity
1 MHz DC-coupled over-ranged
sine wave
±0.4
LSB
VOFF
Offset Error
5
LSB
VOFF_ADJ
Input Offset Adjustment Range
Extended Control Mode
±45
PFSE
Positive Full-Scale Error
See
(4)
±25
mV (max)
NFSE
Negative Full-Scale Error
See
(4)
±25
mV (max)
Out-of-Range Output Code
(1)
(5)
mV
(VIN+) − (VIN−) > + Full Scale
4095
(VIN+) − (VIN−) < − Full Scale
0
The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may
damage this device.
V
A
TO INTERNAL
CIRCUITRY
I/O
GND
(2)
(3)
(4)
(5)
20
To ensure accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass
capacitors.
Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for
this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 4-2. For relationship between Gain
Error and Full-Scale Error, see Specification Definitions for Gain Error.
This parameter is specified by design and is not tested in production.
Electrical Specifications
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Converter Electrical Characteristics
Dynamic Converter Characteristics (1)
Symbol
Parameter
Bandwidth
Conditions
ADC12D1800RF
Typ
Lim
Units
(Limits)
Non-DES Mode, DESCLKIQ Mode
-3 dB (2)
2.7
GHz
-6 dB
3.1
GHz
-9 dB
3.5
GHz
-12 dB
4.0
GHz
-3 dB (2)
1.2
GHz
-6 dB
2.3
GHz
-9 dB
2.7
GHz
-12 dB
3.0
GHz
-3 dB (2)
1.75
GHz
-6 dB
2.7
GHz
D.C. to Fs/2
±0.4
dB
D.C. to Fs
±1.1
dB
D.C. to 3Fs/2
±1.7
dB
D.C. to 2Fs
±5.7
dB
D.C. to Fs/2
±2.7
dB
D.C. to Fs
±9.2
dB
±1.6
dB
DESI Mode, DESQ Mode
DESIQ Mode
Gain Flatness
Non-DES Mode
DESI, DESQ Mode
DESIQ Mode
D.C. to Fs/2
DESCLKIQ Mode
D.C. to Fs/2
CER
Code Error Rate
IMD3
3rd order Intermodulation
Distortion
Noise Floor Density
(1)
(2)
±1.2
-18
10
dB
Error/Sam
ple
DES Mode
FIN = 2670 MHz ± 2.5MHz
@ -13 dBFS
-75
-62
dBc
FIN = 2070 MHz ± 2.5MHz
@ -13 dBFS
-85
dBFS
-72
dBc
FIN = 2670 MHz ± 2.5MHz
@ -16 dBFS
-80
dBFS
-64
dBc
FIN = 2070 MHz ± 2.5MHz
@ -16 dBFS
-83
dBFS
50Ω single-ended termination, DES
Mode
dBFS
-67
dBc
-155.0
dBm/Hz
-154.0
dBFS/Hz
This parameter is specified by design and/or characterization and is not tested in production.
The -3 dB point is the traditional Full-Power Bandwidth (FPBW) specification. Although the insertion loss is approximately half the power
at this frequency, the dynamic performance of the ADC does not necessarily begin to degrade to a level below which it may be
effectively used in an application. The ADC may be used at input frequencies above the -3 dB FPBW point, for example, into the 3rd
Nyquist zone. Depending on system requirements, it is only necessary to compensate for the insertion loss.
Electrical Specifications
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Converter Electrical Characteristics
Dynamic Converter Characteristics (1) (continued)
Symbol
Parameter
Conditions
ADC12D1800RF
Typ
Lim
Units
(Limits)
Non-DES Mode (1) (2) (3)
ENOB
Effective Number of Bits
SINAD
Signal-to-Noise Plus Distortion
Ratio
SNR
Signal-to-Noise Ratio
THD
Total Harmonic Distortion
2nd Harm
3rd Harm
SFDR
(1)
(2)
(3)
22
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free Dynamic Range
AIN = 125 MHz @ -0.5 dBFS
9.3
AIN = 248 MHz @ -0.5 dBFS
9.3
bits
AIN = 498 MHz @ -0.5 dBFS
9.3
AIN = 1147 MHz @ -0.5 dBFS
8.7
bits
AIN = 1448 MHz @ -0.5 dBFS
8.7
bits
AIN = 125 MHz @ -0.5 dBFS
57.7
dB
AIN = 248 MHz @ -0.5 dBFS
57.7
AIN = 498 MHz @ -0.5 dBFS
57.7
AIN = 1147 MHz @ -0.5 dBFS
54.1
dB
AIN = 1448 MHz @ -0.5 dBFS
54
dB
AIN = 125 MHz @ -0.5 dBFS
58.6
dB
AIN = 248 MHz @ -0.5 dBFS
58.2
AIN = 498 MHz @ -0.5 dBFS
58.1
AIN = 1147 MHz @ -0.5 dBFS
54.9
dB
AIN = 1448 MHz @ -0.5 dBFS
54.3
dB
AIN = 125 MHz @ -0.5 dBFS
-64.9
dB
AIN = 248 MHz @ -0.5 dBFS
-65.7
AIN = 498 MHz @ -0.5 dBFS
-67
AIN = 1147 MHz @ -0.5 dBFS
-61.5
AIN = 1448 MHz @ -0.5 dBFS
-64.9
dB
AIN = 125 MHz @ -0.5 dBFS
-68.8
dBc
AIN = 248 MHz @ -0.5 dBFS
-85.6
dBc
AIN = 498 MHz @ -0.5 dBFS
-72.5
dBc
AIN = 1147 MHz @ -0.5 dBFS
-81.2
dBc
AIN = 1448 MHz @ -0.5 dBFS
-70.4
dBc
AIN = 125 MHz @ -0.5 dBFS
-70.4
dBc
AIN = 248 MHz @ -0.5 dBFS
-67.5
dBc
AIN = 498 MHz @ -0.5 dBFS
-69.8
dBc
AIN = 1147 MHz @ -0.5 dBFS
-70.4
dBc
AIN = 1448 MHz @ -0.5 dBFS
-73
dBc
AIN = 125 MHz @ -0.5 dBFS
68.1
dBc
AIN = 248 MHz @ -0.5 dBFS
67
AIN = 498 MHz @ -0.5 dBFS
71.7
AIN = 1147 MHz @ -0.5 dBFS
60
dBc
AIN = 1448 MHz @ -0.5 dBFS
61
dBc
bits
8.4
bits (min)
dB
52.1
dB (min)
dB
52.9
dB (min)
dB
-60
dB (max)
dB
dBc
54
dBc (min)
The Dynamic Specifications are ensured for room to hot ambient temperature only (25°C to 85°C). Refer to the plots of the dynamic
performance vs. temperature in Typical Performance Plots to see typical performance from cold to room temperature (-40°C to 25°C).
The Fs/2 spur was removed from all the dynamic performance specifications.
Typical dynamic performance is only tested at Fin = 498 MHz; other input frequencies are specified by design and / or characterization
and are not tested in production.
Electrical Specifications
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Converter Electrical Characteristics
Dynamic Converter Characteristics (1) (continued)
Symbol
Parameter
Conditions
ADC12D1800RF
Typ
Lim
Units
(Limits)
DES Mode (1) (2) (3) (4)
ENOB
SINAD
SNR
THD
2nd Harm
3rd Harm
SFDR
(1)
(2)
(3)
(4)
Effective Number of Bits
Signal-to-Noise Plus Distortion
Ratio
Signal-to-Noise Ratio
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free Dynamic Range
AIN = 125 MHz @ -0.5 dBFS
9
bits
AIN = 248 MHz @ -0.5 dBFS
9
bits
AIN = 498 MHz @ -0.5 dBFS
9.1
bits
AIN = 1147 MHz @ -0.5 dBFS
8.6
bits
AIN = 1448 MHz @ -0.5 dBFS
8.6
bits
AIN = 125 MHz @ -0.5 dBFS
56
dB
AIN = 248 MHz @ -0.5 dBFS
56
dB
AIN = 498 MHz @ -0.5 dBFS
56.5
dB
AIN = 1147 MHz @ -0.5 dBFS
53.6
dB
AIN = 1448 MHz @ -0.5 dBFS
53.6
dB
AIN = 125 MHz @ -0.5 dBFS
57.2
dB
AIN = 248 MHz @ -0.5 dBFS
57.3
dB
AIN = 498 MHz @ -0.5 dBFS
57.3
dB
AIN = 1147 MHz @ -0.5 dBFS
54.7
dB
AIN = 1448 MHz @ -0.5 dBFS
54
dB
AIN = 125 MHz @ -0.5 dBFS
-62.1
dB
AIN = 248 MHz @ -0.5 dBFS
-61.6
dB
AIN = 498 MHz @ -0.5 dBFS
-64
dB
AIN = 1147 MHz @ -0.5 dBFS
-59.7
dB
AIN = 1448 MHz @ -0.5 dBFS
-62.8
dB
AIN = 125 MHz @ -0.5 dBFS
-82
dBc
AIN = 248 MHz @ -0.5 dBFS
-78.5
dBc
AIN = 498 MHz @ -0.5 dBFS
-71.1
dBc
AIN = 1147 MHz @ -0.5 dBFS
-76.9
dBc
AIN = 1448 MHz @ -0.5 dBFS
-75.3
dBc
AIN = 125 MHz @ -0.5 dBFS
-64.7
dBc
AIN = 248 MHz @ -0.5 dBFS
-62.5
dBc
AIN = 498 MHz @ -0.5 dBFS
-71.4
dBc
AIN = 1147 MHz @ -0.5 dBFS
-60.4
dBc
AIN = 1448 MHz @ -0.5 dBFS
-65.8
dBc
AIN = 125 MHz @ -0.5 dBFS
64.2
dBc
AIN = 248 MHz @ -0.5 dBFS
62.4
dBc
AIN = 498 MHz @ -0.5 dBFS
68.1
dBc
AIN = 1147 MHz @ -0.5 dBFS
60.3
dBc
AIN = 1448 MHz @ -0.5 dBFS
63.6
dBc
The Dynamic Specifications are ensured for room to hot ambient temperature only (25°C to 85°C). Refer to the plots of the dynamic
performance vs. temperature in Typical Performance Plots to see typical performance from cold to room temperature (-40°C to 25°C).
These measurements were taken in Extended Control Mode (ECM) with the DES Timing Adjust feature enabled (Addr: 7h). This feature
is used to reduce the interleaving timing spur amplitude, which occurs at fs/2-fin, and thereby increase the SFDR, SINAD and ENOB.
The Fs/2 spur was removed from all the dynamic performance specifications.
Typical dynamic performance is only tested at Fin = 498 MHz; other input frequencies are specified by design and / or characterization
and are not tested in production.
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Converter Electrical Characteristics
Analog Input / Output and Reference Characteristics
Symbol
Parameter
ADC12D1800RF
Conditions
Typ
Lim
Units
(Limits)
Analog Inputs
VIN_FSR
Analog Differential Input Full Scale
Range
Non-Extended Control Mode
FSR Pin High
740
mVP-P
(min)
860
mVP-P
(max)
800
Extended Control Mode
CIN
RIN
FM(14:0) = 4000h (default)
800
mVP-P
FM(14:0) = 7FFFh
1000
mVP-P
Analog Input Capacitance,
Non-DES Mode (1) (2)
Differential
0.02
pF
Each input pin to ground
1.6
pF
Analog Input Capacitance,
DES Mode (1) (2)
Differential
0.08
pF
Each input pin to ground
2.2
Differential Input Resistance
100
pF
91
Ω (min)
109
Ω (max)
1.15
V (min)
1.35
V (max)
Common Mode Output
VCMO
Common Mode Output Voltage
ICMO = ±100 µA
TC_VCMO
Common Mode Output Voltage
Temperature Coefficient
ICMO = ±100 µA (3)
VCMO_LVL
VCMO input threshold to set
DC-coupling Mode
See
(3)
CL_VCMO
Maximum VCMO Load Capacitance
See
(1)
1.25
38
ppm/°C
0.63
V
80
pF
Bandgap Reference
VBG
Bandgap Reference Output
Voltage
IBG = ±100 µA
TC_VBG
Bandgap Reference Voltage
Temperature Coefficient
IBG = ±100 µA (3)
CL_VBG
Maximum Bandgap Reference load See
Capacitance
(1)
(2)
1.25
1.15
V (min)
1.35
V (max)
32
ppm/°C
(1)
80
pF
This parameter is specified by design and is not tested in production.
The differential and pin-to-ground input capacitances are lumped capacitance values from design; they are defined as shown below.
VIN+
CIN, PIN-TO-GND
CIN, DIFF
VINCIN, PIN-TO-GND
(3)
24
This parameter is specified by design and/or characterization and is not tested in production.
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3.7
Converter Electrical Characteristics
I-Channel to Q-Channel Characteristics
Symbol
X-TALK
(1)
SNAS518H – JULY 2011 – REVISED APRIL 2013
Parameter
Conditions
(1)
Lim
Units
(Limits)
Offset Match
See
2
LSB
Positive Full-Scale Match
Zero offset selected in
Control Register
2
LSB
Negative Full-Scale Match
Zero offset selected in
Control Register
2
LSB
Phase Matching (I, Q)
fIN = 1.0 GHz (1)
<1
Degree
Crosstalk from I-channel
(Aggressor) to Q-channel (Victim)
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
−70
dB
Crosstalk from Q-channel
(Aggressor) to I-channel (Victim)
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
−70
dB
This parameter is specified by design and/or characterization and is not tested in production.
3.8
Converter Electrical Characteristics
Sampling Clock Characteristics
Symbol
VIN_CLK
Parameter
Conditions
Differential Sampling Clock Input
Level (1)
ADC12D1800RF
Typ
Lim
Units
(Limits)
Sine Wave Clock
Differential Peak-to-Peak
0.6
Square Wave Clock
Differential Peak-to-Peak
0.6
0.1
pF
1
pF
100
Ω
CIN_CLK
Sampling Clock Input
Capacitance (2)
Differential
RIN_CLK
Sampling Clock Differential Input
Resistance
See
(1)
(2)
ADC12D1800RF
Typ
Each input to ground
0.4
VP-P (min)
2.0
VP-P (max)
0.4
VP-P (min)
2.0
VP-P (max)
(1)
This parameter is specified by design and/or characterization and is not tested in production.
This parameter is specified by design and is not tested in production.
3.9
Converter Electrical Characteristics
AutoSync Feature Characteristics
Symbol
Parameter
Conditions
ADC12D1800RF
Typ
Lim
Units
(Limits)
VIN_RCLK
Differential RCLK Input Level (1)
Differential Peak-to-Peak
360
mVP-P
CIN_RCLK
RCLK Input Capacitance (1)
Differential
0.1
pF
1
pF
Each input to ground
(1)
RIN_RCLK
RCLK Differential Input Resistance
100
Ω
IIH_RCLK
Input Leakage Current;
VIN = VA
22
µA
IIL_RCLK
Input Leakage Current;
VIN = GND
-33
µA
VO_RCOUT
Differential RCOut Output Voltage
360
mV
(1)
See
This parameter is specified by design and/or characterization and is not tested in production.
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3.10 Converter Electrical Characteristics
Digital Control and Output Pin Characteristics
Symbol
Parameter
ADC12D1800RF
Conditions
Typ
Lim
Units
(Limits)
Digital Control Pins (DES, CalDly, CAL, PDI, PDQ, TPM, NDM, FSR, DDRPh, ECE, SCLK, SDI, SCS)
VIH
Logic High Input Voltage
0.7×VA
V (min)
VIL
Logic Low Input Voltage
0.3×VA
V (max)
IIH
Input Leakage Current;
VIN = VA
IIL
Input Leakage Current;
VIN = GND
CIN_DIG
0.02
μA
-0.02
μA
SCS, SCLK, SDI
-17
μA
PDI, PDQ, ECE
-38
μA
Measured from each control pin to
GND
1.5
pF
FSR, CalDly, CAL, NDM, TPM,
DDRPh, DES
Digital Control Pin Input
Capacitance (1)
Digital Output Pins (Data, DCLKI, DCLKQ, ORI, ORQ)
VOD
LVDS Differential Output Voltage
VBG = Floating, OVS = High
400
mVP-P
(min)
800
mVP-P
(max)
230
mVP-P
(min)
630
mVP-P
(max)
630
VBG = Floating, OVS = Low
460
ΔVO
DIFF
VBG = VA, OVS = High
670
mVP-P
VBG = VA, OVS = Low
500
mVP-P
±1
mV
VBG = Floating
0.8
V
VBG = VA
1.2
V
±1
mV
±4
mA
Change in LVDS Output Swing
Between Logic Levels
VOS
Output Offset Voltage (2)
ΔVOS
Output Offset Voltage Change
Between Logic Levels
See
IOS
Output Short Circuit Current (2)
VBG = Floating;
D+ and D− connected to 0.8V
(1)
(2)
ZO
Differential Output Impedance
See
100
Ω
VOH
Logic High Output Level
CalRun, IOH = −100 µA, (2)
SDO, IOH = −400 µA (2)
1.65
V
VOL
Logic Low Output Level
CalRun, IOL = 100 µA, (2)
SDO, IOL = 400 µA (2)
0.15
V
1.25
V
VIN_CLK
VP-P
100
Ω
Differential DCLK Reset Pins (DCLK_RST)
VCMI_DRST
DCLK_RST Common Mode Input
Voltage
See
(2)
VID_DRST
Differential DCLK_RST Input
Voltage
See
(2)
RIN_DRST
Differential DCLK_RST Input
Resistance
See
(2)
(1)
(2)
26
This parameter is specified by design and is not tested in production.
This parameter is specified by design and/or characterization and is not tested in production.
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3.11 Converter Electrical Characteristics
Power Supply Characteristics
Symbol
IA
Parameter
Conditions
Analog Supply Current
ITC
Track-and-Hold and Clock Supply
Current
IDR
Output Driver Supply Current
IE
Digital Encoder Supply Current
ITOTAL
PC
Total Supply Current
Power Consumption
ADC12D1800RF
Typ
Lim
Units
(Limits)
PDI = PDQ = Low
1360
mA
PDI = Low; PDQ = High
745
mA
PDI = High; PDQ = Low
745
mA
PDI = PDQ = High
2.7
mA
PDI = PDQ = Low
515
mA
PDI = Low; PDQ = High
305
mA
PDI = High; PDQ = Low
305
mA
PDI = PDQ = High
650
µA
PDI = PDQ = Low
275
mA
PDI = Low; PDQ = High
145
mA
PDI = High; PDQ = Low
145
mA
PDI = PDQ = High
6
µA
PDI = PDQ = Low
110
mA
PDI = Low; PDQ = High
65
mA
PDI = High; PDQ = Low
65
mA
PDI = PDQ = High
34
µA
1:2 Demux Mode
PDI = PDQ = Low
2260
Non-Demux Mode
PDI = PDQ = Low
2220
2481
mA (max)
mA
1:2 Demux Mode
PDI = PDQ = Low
4.29
PDI = Low; PDQ = High
2.39
4.7
W (max)
W
PDI = High; PDQ = Low
2.39
W
PDI = PDQ = High
6.5
mW
4.22
W
Non-Demux Mode
PDI = PDQ = Low
3.12 Converter Electrical Characteristics
AC Electrical Characteristics
ADC12D1800RF
Lim
Units
(Limits)
1.8
GHz
Non-DES Mode; LFS = 0b
300
MHz
Non-DES Mode; LFS = 1b
150
MHz
DES Mode
500
MHz
Sampling Clock Duty Cycle
fCLK(min) ≤ fCLK ≤ fCLK(max) (1)
20
% (min)
80
% (max)
tCL
Sampling Clock Low Time
See
(2)
278
111
ps (min)
tCH
Sampling Clock High Time
See
(2)
278
111
ps (min)
Symbol
Parameter
Conditions
Typ
Sampling Clock (CLK)
fCLK
(max)
Maximum Sampling Clock
Frequency
fCLK
(min)
Minimum Sampling Clock
Frequency
(1)
(2)
50
This parameter is specified by design and/or characterization and is not tested in production.
This parameter is specified by design and is not tested in production.
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Converter Electrical Characteristics
AC Electrical Characteristics (continued)
Symbol
Parameter
ADC12D1800RF
Conditions
Typ
Lim
Units
(Limits)
Data Clock (DCLKI, DCLKQ)
DCLK Duty Cycle
tSR
See
Setup Time DCLK_RST±
(1)
50
See
(2)
45
45
tHR
Hold Time DCLK_RST±
See
(2)
tPWR
Pulse Width DCLK_RST±
See
(1)
45
% (min)
55
% (max)
ps
ps
5
tSYNC_DLY
90° Mode (1)
DCLK Synchronization Delay
4
0° Mode (1)
5
Sampling
Clock
Cycles
(min)
Sampling
Clock
Cycles
(2)
tLHT
Differential Low-to-High Transition
Time
10%-to-90%, CL = 2.5 pF
tHLT
Differential High-to-Low Transition
Time
10%-to-90%, CL = 2.5 pF (2)
200
ps
200
ps
(1)
tSU
Data-to-DCLK Setup Time
90° Mode
430
ps
tH
DCLK-to-Data Hold Time
90° Mode (1)
430
ps
tOSK
DCLK-to-Data Output Skew
50% of DCLK transition to 50% of
Data transition (1)
±50
ps
Sampling CLK+ Rise to Acquisition
of Data
1.29
ns
0.2
ps (rms)
3.2
ns
Data Input-to-Output
Aperture Delay (2)
tAD
(2)
tAJ
Aperture Jitter
See
tOD
Sampling Clock-to Data Output
Delay (in addition to Latency)
50% of Sampling Clock transition
to 50% of Data transition (2)
tLAT
Latency in 1:2 Demux Non-DES
Mode (1)
DI, DQ Outputs
34
DId, DQd Outputs
35
Latency in 1:4 Demux DES
Mode (1)
DI Outputs
34
DQ Outputs
34.5
DId Outputs
35
DQd Outputs
35.5
tORR
tWU
(1)
(2)
28
Latency in Non-Demux Non-DES
Mode (1)
DI Outputs
34
DQ Outputs
34
Latency in Non-Demux DES
Mode (1)
DI Outputs
34
DQ Outputs
34.5
Over Range Recovery Time
Differential VIN step from ±1.2V to
0V to accurate conversion (2)
Wake-Up Time (PDI/PDQ low to
Rated Accuracy Conversion)
Non-DES Mode (1)
DES Mode (1)
Sampling
Clock
Cycles
1
Sampling
Clock
Cycle
500
ns
1
µs
This parameter is specified by design and is not tested in production.
This parameter is specified by design and/or characterization and is not tested in production.
Electrical Specifications
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3.13 Converter Electrical Characteristics
Serial Port Interface
Symbol
fSCLK
Parameter
ADC12D1800RF
Conditions
Serial Clock Frequency
See
Typ
(1)
Serial Clock High Time
Serial Data-to-Serial Clock Rising
Setup Time
See
(2)
tSH
Serial Data-to-Serial Clock Rising
Hold Time
See
(1)
tSCS
SCS-to-Serial Clock Rising Setup
Time
See
(2)
tHCS
SCS-to-Serial Clock Falling Hold
Time
See
(2)
tBSU
Bus turn-around time
See
(2)
(1)
(2)
Units
(Limits)
30
ns (min)
30
ns (min)
15
Serial Clock Low Time
tSSU
Lim
MHz
2.5
ns (min)
1
ns (min)
2.5
ns
1.5
ns
10
ns
This parameter is specified by design and is not tested in production.
This parameter is specified by design and/or characterization and is not tested in production.
3.14 Converter Electrical Characteristics Calibration
Symbol
tCAL
Parameter
Calibration Cycle Time
Conditions
ADC12D1800RF
Typ
Lim
Non-ECM
ECM CSS = 0b
Sampling
Clock
Cycles
4.1·107
ECM CSS = 1b
tCAL_L
CAL Pin Low Time
See
(1)
tCAL_H
CAL Pin High Time
See
(1)
tCalDly
Calibration delay determined by
CalDly Pin (1)
CalDly = Low
(1)
CalDly = High
Units
(Limits)
1280
1280
224
230
Sampling
Clock
Cycles
(min)
Sampling
Clock
Cycles
(max)
This parameter is specified by design and is not tested in production.
Electrical Specifications
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Specification Definitions
APERTURE JITTER (tAJ) is the variation in aperture delay from sample-to-sample. Aperture jitter can be
effectively considered as noise at the input.
CODE ERROR RATE (CER) is the probability of error and is defined as the probable number of word
errors on the ADC output per unit of time divided by the number of words seen in that amount of time. A
CER of 10-18 corresponds to a statistical error in one word about every 31.7 years.
CLOCK DUTY CYCLE is the ratio of the time that the clock waveform is at a logic high to the total time of
one clock period.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step
size of 1 LSB. It is measured at the relevant sample rate, fCLK, with fIN = 1MHz sine wave.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-toNoise and Distortion Ratio, or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and states that the
converter is equivalent to a perfect ADC of this many (ENOB) number of bits.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Offset
and Full-Scale Errors. The Positive Gain Error is the Offset Error minus the Positive Full-Scale Error. The
Negative Gain Error is the Negative Full-Scale Error minus the Offset Error. The Gain Error is the
Negative Full-Scale Error minus the Positive Full-Scale Error; it is also equal to the Positive Gain Error
plus the Negative Gain Error.
GAIN FLATNESS is the measure of the variation in gain over the specified bandwidth. For example, for
the ADC12D1800RF, from D.C. to Fs/2 is to 900 MHz for the Non-DES Mode and from D.C. to Fs/2 is
1800 MHz for the DES Mode.
INTEGRAL NON-LINEARITY (INL) is a measure of worst case deviation of the ADC transfer function
from an ideal straight line drawn through the ADC transfer function. The deviation of any given code from
this straight line is measured from the center of that code value step. The best fit method is used.
INSERTION LOSS is the loss in power of a signal due to the insertion of a device, e.g. the
ADC12D1800RF, expressed in dB.
INTERMODULATION DISTORTION (IMD) is a measure of the near-in 3rd order distortion products (2f2 f1, 2f1 - f2) which occur when two tones which are close in frequency (f1, f2) are applied to the ADC input. It
is measured from the input tones level to the higher of the two distortion products (dBc) or simply the level
of the higher of the two distortion products (dBFS). The input tones are typically -7dBFS.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is
VFS / 2N
(1)
where VFS is the differential full-scale amplitude VIN_FSR as set by the FSR input and "N" is the ADC
resolution in bits, which is 12 for the ADC12D1800RF.
LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS) DIFFERENTIAL OUTPUT VOLTAGE (VID and
VOD) is two times the absolute value of the difference between the VD+ and VD- signals; each signal
measured with respect to Ground. VOD peak is VOD,P= (VD+ - VD-) and VOD peak-to-peak is VOD,P-P=
2*(VD+ - VD-); for this product, the VOD is measured peak-to-peak.
VD+
VDVOS
½×VOD
VD+
VD -
GND
½×VOD = | VD+ - VD- |
Figure 4-1. LVDS Output Signal Levels
30
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LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint between the D+ and D- pins output voltage
with respect to ground; i.e., [(VD+) +( VD-)]/2. See Figure 4-1.
MISSING CODES are those output codes that are skipped and will never appear at the ADC outputs.
These codes cannot be reached with any input value.
MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full
scale.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of how far the first code transition is from the
ideal 1/2 LSB above a differential −VIN/2. For the ADC12D1800RF the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and reference voltage error.
NOISE FLOOR DENSITY is a measure of the power density of the noise floor, expressed in dBFS/Hz and
dBm/Hz. '0 dBFS' is defined as the power of a sinusoid which precisely uses the full-scale range of the
ADC.
NOISE POWER RATIO (NPR) is the ratio of the sum of the power outside the notched bins to the sum of
the power in an equal number of bins inside the notch, expressed in dB.
OFFSET ERROR (VOFF) is a measure of how far the mid-scale point is from the ideal zero voltage
differential input.
Offset Error = Actual Input causing average of 8k samples to result in an average code of 2047.5.
OUTPUT DELAY (tOD) is the time delay (in addition to Latency) after the rising edge of CLK+ before the
data update is present at the output pins.
OVER-RANGE RECOVERY TIME is the time required after the differential input voltages goes from ±1.2V
to 0V for the converter to recover and make a conversion with its rated accuracy.
PIPELINE DELAY (LATENCY) is the number of input clock cycles between initiation of conversion and
when that data is presented to the output driver stage. The data lags the conversion by the Latency plus
the tOD.
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of how far the last code transition is from the ideal
1-1/2 LSB below a differential +VIN/2. For the ADC12D1800RF the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and reference voltage error.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the fundamental for a
single-tone to the rms value of the sum of all other spectral components below one-half the sampling
frequency, not including harmonics or DC.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms
value of the fundamental for a single-tone to the rms value of all of the other spectral components below
half the input clock frequency, including harmonics but excluding DC.
SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values
of the input signal at the output and the peak spurious signal, where a spurious signal is any signal
present in the output spectrum that is not present at the input, excluding DC.
θJA is the thermal resistance between the junction to ambient.
θJC1 represents the thermal resistance between the die and the exposed metal area on the top of the
HSBGA package.
θJC2 represents the thermal resistance between the die and the center group of balls on the bottom of the
HSBGA package.
Specification Definitions
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TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine
harmonic levels at the output to the level of the fundamental at the output. THD is calculated as
A 2 +... +A 2
f2
f10
A f12
THD = 20 x log
where
Af1 is the RMS power of the fundamental (output) frequency and Af2 through Af10 are the RMS power of the first
9 harmonic frequencies in the output spectrum.
(2)
Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in
the input frequency seen at the output and the power in its 2nd harmonic level at the output.
Third Harmonic Distortion (3rd Harm) is the difference expressed in dB between the RMS power in the
input frequency seen at the output and the power in its 3rd harmonic level at the output.
4.1
Transfer Characteristic
IDEAL
POSITIVE
FULL-SCALE
TRANSITION
Output
Code
ACTUAL
POSITIVE
FULL-SCALE
TRANSITION
1111 1111 1111 (4095)
1111 1111 1110 (4094)
1111 1111 1101 (4093)
POSITIVE
FULL-SCALE
ERROR
MID-SCALE
TRANSITION
1000 0000 0000 (2048)
0111 1111 1111 (2047)
OFFSET
ERROR
IDEAL NEGATIVE
FULL-SCALE TRANSITION
NEGATIVE
FULL-SCALE
ERROR
0000 0000 0010 (2)
0000 0000 0001 (1)
0000 0000 0000 (0)
-VIN/2
ACTUAL NEGATIVE
FULL-SCALE TRANSITION
(VIN+) < (VIN-)
(VIN+) > (VIN-)
0.0V
+VIN/2
Differential Analog Input Voltage (+VIN/2) - (-VIN/2)
Figure 4-2. Input / Output Transfer Characteristic
32
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Timing Diagrams
Sample N
DI
Sample N-1
DId
VINI+/-
Sample N+1
tAD
CLK+
tOD
DId, DI
Sample N-39 and
Sample N-38
Sample N-37 and Sample N-36
Sample N-35 and Sample N-34
tOSK
DCLKI+/(0° Phase)
tSU
tH
DCLKI+/(90° Phase)
Figure 4-3. Clocking in 1:2 Demux Non-DES Mode*
Sample N
Sample N-1
DQ
DQ
VINQ+/-
Sample N+1
tAD
CLK+
tOD
DQ
Sample N-37
Sample N-36
Sample N-35
Sample N-34
Sample N-33
tOSK
DCLKQ+/(0° Phase)
Figure 4-4. Clocking in Non-Demux Non-DES Mode*
Specification Definitions
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DId
VINQ+/-
DQd
c
Sample
N-1.5
Sample N-1
www.ti.com
DQ
DI
c
c Sample N
Sample N-0.5
c
Sample N+1
tAD
c
c
CLK+/tOD
DQd, DId,
DQ, DI
Sample N-37.5, N-37,
N-36.5, N-36
Sample N-39.5, N-39,
N-38.5, N-38
Sample N-35.5, N-35,
N-34.5, N-34
tOSK
DCLKQ+/(0° Phase)
tSU
tH
DCLKQ+/(90° Phase)
Figure 4-5. Clocking in 1:4 Demux DES Mode*
Sample N-1
DI
Sample N - 0.5
DQ
Sample N
DI
VINQ+/-
Sample N + 0.5
DQ
Sample N+1
tAD
CLK+
tOD
DQ, DI Sample N-37.5, N-37
Sample N-36.5, N-36
Sample N-35.5, N-35
Sample N-34.5, N-34
Sample N-33.5, N-33
tOSK
DCLKQ+/(0° Phase)
Figure 4-6. Clocking in Non-Demux Mode DES Mode*
NOTE
*The timing for these figures is shown for the one input only (I or Q). However, both I- and Qinputs may be used. For this case, the I-channel functions precisely the same as the Qchannel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ. Both I- and Qchannel use the same CLK.
34
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Synchronizing Edge
tSYNC_DLY
CLK
tHR
tSR
DCLK_RSTtOD
DCLK_RST+
tPWR
DCLKI+
DCLKQ+
Figure 4-7. Data Clock Reset Timing (Demux Mode)
tCAL
tCAL
CalRun
tCAL_H
tCalDly
Calibration Delay
determined by
CalDly (Pin V4)
CAL
tCAL_L
POWER
SUPPLY
Figure 4-8. Power-on and On-Command Calibration Timing
Single Register Access
SCS
tSCS
tHCS
tHCS
1
8
24
9
SCLK
SDI
Command Field
Data Field
LSB
MSB
tSH
tSSU
tBSU
SDO
read mode)
Data Field
High Z
MSB
High Z
LSB
Figure 4-9. Serial Interface Timing
Specification Definitions
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Typical Performance Plots
VA = VDR = VTC = VE = 1.9V, fCLK = 1.8 GHz, fIN = 498 MHz, TA= 25°C, I-channel, 1:2 Demux Non-DES Mode (1:1 Demux
Non-DES Mode has similar performance), unless otherwise stated.
INL vs. CODE (ADC12D1800RF)
INL vs. TEMPERATURE (ADC12D1800RF)
3
1.0
+INL
-INL
2
INL (LSB)
INL (LSB)
0.5
1
0
0.0
-1
-0.5
-2
-3
-1.0
0
4095
-50
OUTPUT CODE
0
50
TEMPERATURE (°C)
100
Figure 5-1.
Figure 5-2.
DNL vs. CODE (ADC12D1800RF)
DNL vs. TEMPERATURE (ADC12D1800RF)
0.75
0.50
+DNL
-DNL
0.50
DNL (LSB)
DNL (LSB)
0.25
0.25
0.00
0.00
-0.25
-0.25
-0.50
-0.75
-0.50
0
4095
-50
OUTPUT CODE
100
Figure 5-4.
ENOB vs. TEMPERATURE (ADC12D1800RF)
ENOB vs. SUPPLY VOLTAGE (ADC12D1800RF)
10
10
9
9
ENOB
ENOB
Figure 5-3.
8
7
8
7
NON-DES MODE
DES MODE
6
-50
0
50
TEMPERATURE (°C)
NON-DES MODE
DES MODE
6
100
Figure 5-5.
36
0
50
TEMPERATURE (°C)
1.8
1.9
2.0
VA(V)
2.1
2.2
Figure 5-6.
Typical Performance Plots
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ENOB vs. CLOCK FREQUENCY (ADC12D1800RF)
10
ENOB vs. INPUT FREQUENCY (ADC12D1800RF)
10
NON-DES MODE
DES MODE
9
ENOB
ENOB
9
8
7
7
6
NON-DES MODE
DES MODE
6
0
600
1200
CLOCK FREQUENCY (MHz)
1800
0
1000
2000
INPUT FREQUENCY (MHz)
3000
Figure 5-7.
Figure 5-8.
ENOB vs. VCMI (ADC12D1800RF)
SNR vs. TEMPERATURE (ADC12D1800RF)
10
60
NON-DES MODE
DES MODE
58
SNR (dB)
9
ENOB
8
8
7
56
54
52
6
NON-DES MODE
DES MODE
50
0.75
1.00
1.25
VCMI(V)
1.50
1.75
-50
0
50
TEMPERATURE (°C)
100
Figure 5-10.
SNR vs. SUPPLY VOLTAGE (ADC12D1800RF)
SNR vs. CLOCK FREQUENCY (ADC12D1800RF)
60
60
58
58
SNR (dB)
SNR (dB)
Figure 5-9.
56
54
52
50
1.8
NON-DES MODE
DES MODE
56
54
52
NON-DES MODE
DES MODE
1.9
2.0
VA(V)
50
2.1
2.2
Figure 5-11.
0
600
1200
CLOCK FREQUENCY (MHz)
1800
Figure 5-12.
Typical Performance Plots
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SNR vs. INPUT FREQUENCY (ADC12D1800RF)
THD vs. TEMPERATURE (ADC12D1800RF)
60
-40
-50
SNR (dB)
THD (dBc)
55
-60
50
-70
NON-DES MODE
DES MODE
45
0
1000
2000
INPUT FREQUENCY (MHz)
3000
-50
0
50
TEMPERATURE (°C)
100
Figure 5-14.
THD vs. SUPPLY VOLTAGE (ADC12D1800RF)
THD vs. CLOCK FREQUENCY (ADC12D1800RF)
-40
-40
-50
-50
THD (dBc)
THD (dBc)
Figure 5-13.
-60
-70
NON-DES MODE
DES MODE
-60
-70
NON-DES MODE
DES MODE
-80
1.8
1.9
2.0
VA(V)
-80
2.1
2.2
0
600
1200
CLOCK FREQUENCY (MHz)
1800
Figure 5-15.
Figure 5-16.
THD vs. INPUT FREQUENCY (ADC12D1800RF)
SFDR vs. TEMPERATURE (ADC12D1800RF)
-40
80
NON-DES MODE
DES MODE
70
SFDR (dBc)
THD (dBc)
-50
-60
60
-70
50
-80
40
0
1000
2000
INPUT FREQUENCY (MHz)
3000
NON-DES MODE
DES MODE
-50
Figure 5-17.
38
NON-DES MODE
DES MODE
-80
0
50
TEMPERATURE (°C)
100
Figure 5-18.
Typical Performance Plots
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SFDR vs. CLOCK FREQUENCY (ADC12D1800RF)
80
80
70
70
SFDR (dBc)
SFDR (dBc)
SFDR vs. SUPPLY VOLTAGE (ADC12D1800RF)
60
50
NON-DES MODE
DES MODE
60
50
NON-DES MODE
DES MODE
40
1.8
1.9
2.0
VA(V)
40
2.1
2.2
0
600
1200
CLOCK FREQUENCY (MHz)
1800
Figure 5-20.
SFDR vs. INPUT FREQUENCY (ADC12D1800RF)
SPECTRAL RESPONSE NON-DES MODE (ADC12D1800RF)
80
0
70
-25
AMPLITUDE (dBFS)
SFDR (dBc)
Figure 5-19.
60
50
NON-DES MODE
DES MODE
40
0
1000
2000
INPUT FREQUENCY (MHz)
NON-DES MODE
-50
-75
-100
3000
0
300
600
FREQUENCY (MHz)
900
Figure 5-21.
Figure 5-22.
SPECTRAL RESPONSE DESI MODE (ADC12D1800RF)
SPECTRAL RESPONSE DESCLKIQ MODE (ADC12D1800RF)
0
0
-25
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
DESI MODE
-50
-75
-100
-25
-50
-75
-100
0
600
1200
FREQUENCY (MHz)
1800
Figure 5-23.
0
600
1200
FREQUENCY (MHz)
1800
Figure 5-24.
Typical Performance Plots
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CROSSTALK vs. SOURCE FREQUENCY (ADC12D1800RF)
-30
INSERTION LOSS (ADC12D1800RF)
0
NON-DES MODE
-3
SIGNAL GAIN (dB)
CROSSTALK (dB)
-40
-50
-60
-70
-6
-9
-12
-80
-90
DESI MODE
DESIQ MODE
NON-DES, DESCLKIQ MODE
-15
0
1000
2000
3000
AGGRESSOR INPUT FREQUENCY (MHz)
0
Figure 5-25.
1000
2000
3000
INPUT FREQUENCY (MHz)
4000
Figure 5-26.
POWER CONSUMPTION vs. CLOCK FREQUENCY (ADC12D1800RF)
5.0
NON-DEMUX MODE
DEMUX MODE
POWER (W)
4.5
4.0
3.5
3.0
2.5
2.0
0
600
1200
CLOCK FREQUENCY (MHz)
1800
Figure 5-27.
40
Typical Performance Plots
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Functional Description
The ADC12D1800RF is a versatile A/D converter with an innovative architecture which permits very high
speed operation. The controls available ease the application of the device to circuit solutions. Optimum
performance requires adherence to the provisions discussed here and in the Applications Information
Section. This section covers an overview, a description of control modes (Extended Control Mode and
Non-Extended Control Mode), and features.
6.1
OVERVIEW
The ADC12D1800RF uses a calibrated folding and interpolating architecture that achieves a high Effective
Number of Bits (ENOB). The use of folding amplifiers greatly reduces the number of comparators and
power consumption. Interpolation reduces the number of front-end amplifiers required, minimizing the load
on the input signal and further reducing power requirements. In addition to correcting other non-idealities,
on-chip calibration reduces the INL bow often seen with folding architectures. The result is an extremely
fast, high performance, low power converter.
The analog input signal (which is within the converter's input voltage range) is digitized to twelve bits at
speeds of 150 MSPS to 3.6 GSPS, typical. Differential input voltages below negative full-scale will cause
the output word to consist of all zeroes. Differential input voltages above positive full-scale will cause the
output word to consist of all ones. Either of these conditions at the I- or Q-input will cause the Out-ofRange I-channel or Q-channel output (ORI or ORQ), respectively, to output a logic-high signal.
In ECM, an expanded feature set is available via the Serial Interface. The ADC12D1800RF builds upon
previous architectures, introducing a new DES Mode Timing Adjust, AutoSync feature for multi-chip
synchronization and increasing to 15-bit for gain and 12-bit plus sign for offset the independent
programmable adjustment for each channel.
Each channel has a selectable output demultiplexer which feeds two LVDS buses. If the 1:2 Demux Mode
is selected, the output data rate is reduced to half the input sample rate on each bus. When Non-Demux
Mode is selected, the output data rate on each channel is at the same rate as the input sample clock and
only one 12-bit bus per channel is active.
6.2
CONTROL MODES
The ADC12D1800RF may be operated in one of two control modes: Non-extended Control Mode (NonECM) or Extended Control Mode (ECM). In the simpler Non-ECM (also sometimes referred to as Pin
Control Mode), the user affects available configuration and control of the device through the control pins.
The ECM provides additional configuration and control options through a serial interface and a set of 16
registers, most of which are available to the customer.
6.2.1
Non-Extended Control Mode
In Non-extended Control Mode (Non-ECM), the Serial Interface is not active and all available functions are
controlled via various pin settings. Non-ECM is selected by setting the ECE Pin to logic-high. Note that, for
the control pins, "logic-high" and "logic-low" refer to VA and GND, respectively. Nine dedicated control pins
provide a wide range of control for the ADC12D1800RF and facilitate its operation. These control pins
provide DES Mode selection, Demux Mode selection, DDR Phase selection, execute Calibration,
Calibration Delay setting, Power Down I-channel, Power Down Q-channel, Test Pattern Mode selection,
and Full-Scale Input Range selection. In addition to this, two dual-purpose control pins provide for AC/DCcoupled Mode selection and LVDS output common-mode voltage selection. See Table 6-1 for a summary.
Functional Description
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Table 6-1. Non-ECM Pin Summary
Pin Name
Logic-Low
Logic-High
Floating
DES
Non-DES Mode
DES
Mode
Not valid
NDM
Demux
Mode
Non-Demux Mode
Not valid
DDRPh
0° Mode
90° Mode
Not valid
Dedicated Control Pins
CAL
CalDly
See Calibration Pin (CAL)
Not valid
Shorter delay
Longer delay
Not valid
PDI
I-channel active
Power Down
I-channel
Power Down
I-channel
PDQ
Q-channel active
Power Down
Q-channel
Power Down
Q-channel
TPM
Non-Test Pattern Mode
Test Pattern Mode
Not valid
FSR
Not allowed
Nominal FS input Range
Not valid
Dual-purpose Control Pins
VCMO
VBG
6.2.1.1
AC-coupled operation
Not allowed
DC-coupled operation
Not allowed
Higher LVDS common-mode
voltage
Lower LVDS common-mode
voltage
Dual Edge Sampling Pin (DES)
The Dual Edge Sampling (DES) Pin selects whether the ADC12D1800RF is in DES Mode (logic-high) or
Non-DES Mode (logic-low). DES Mode means that a single analog input is sampled by both I- and Qchannels in a time-interleaved manner. One of the ADCs samples the input signal on the rising sampling
clock edge (duty cycle corrected); the other ADC samples the input signal on the falling sampling clock
edge (duty cycle corrected). In Non-ECM, only the I-input may be used for DES Mode, a.k.a. "DESI
Mode". In ECM, the Q-input may be selected via the DEQ Bit (Addr: 0h, Bit: 6), a.k.a. "DESQ Mode". In
ECM, both the I- and Q-inputs maybe selected, a.k.a. "DESIQ Mode".
To use this feature in ECM, use the DES bit in the Configuration Register (Addr: 0h; Bit: 7). See
DES/Non-DES Mode for more information.
6.2.1.2
Non-Demultiplexed Mode Pin (NDM)
The Non-Demultiplexed Mode (NDM) Pin selects whether the ADC12D1800RF is in Demux Mode (logiclow) or Non-Demux Mode (logic-high). In Non-Demux Mode, the data from the input is produced at the
sampled rate at a single 12-bit output bus. In Demux Mode, the data from the input is produced at half the
sampled rate at twice the number of output buses. For Non-DES Mode, each I- or Q-channel will produce
its data on one or two buses for Non-Demux or Demux Mode, respectively. For DES Mode, the selected
channel will produce its data on two or four buses for Non-Demux or Demux Mode, respectively.
This feature is pin-controlled only and remains active during both Non-ECM and ECM. See Demux/Nondemux Mode for more information.
6.2.1.3
Dual Data Rate Phase Pin (DDRPh)
The Dual Data Rate Phase (DDRPh) Pin selects whether the ADC12D1800RF is in 0° Mode (logic-low) or
90° Mode (logic-high) for DDR Mode. If the device is in SDR Mode, then the DDRPh Pin selects whether
the ADC12D1800RF is in Falling Mode (logic low) or Rising Mode (logic high). For DDR Mode, the Data
may transition either with the DCLK transition (0° Mode) or halfway between DCLK transitions (90° Mode).
The DDRPh Pin selects 0° Mode or 90° Mode for both the I-channel: DI- and DId-to-DCLKI phase
relationship and for the Q-channel: DQ- and DQd-to-DCLKQ phase relationship.
To use this feature in ECM, use the DPS bit in the Configuration Register (Addr: 0h; Bit: 14). See SDR /
DDR Clock for more information.
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Calibration Pin (CAL)
The Calibration (CAL) Pin may be used to execute an on-command calibration or to disable the power-on
calibration. The effect of calibration is to maximize the dynamic performance. To initiate an on-command
calibration via the CAL pin, bring the CAL pin high for a minimum of tCAL_H input clock cycles after it has
been low for a minimum of tCAL_L input clock cycles. Holding the CAL pin high upon power-on will prevent
execution of the power-on calibration. In ECM, this pin remains active and is logically OR'd with the CAL
bit.
To use this feature in ECM, use the CAL bit in the Configuration Register (Addr: 0h; Bit: 15). See
Calibration Feature for more information.
6.2.1.5
Calibration Delay Pin (CalDly)
The Calibration Delay (CalDly) Pin selects whether a shorter or longer delay time is present, after the
application of power, until the start of the power-on calibration. The actual delay time is specified as tCalDly
and may be found in Converter Electrical Characteristics Calibration. This feature is pin-controlled only
and remains active in ECM. It is recommended to select the desired delay time prior to power-on and not
dynamically alter this selection.
See Calibration Feature for more information.
6.2.1.6
Power Down I-channel Pin (PDI)
The Power Down I-channel (PDI) Pin selects whether the I-channel is powered down (logic-high) or active
(logic-low). The digital data output pins, DI and DId, (both positive and negative) are put into a high
impedance state when the I-channel is powered down. Upon return to the active state, the pipeline will
contain meaningless information and must be flushed. The supply currents (typicals and limits) are
available for the I-channel powered down or active and may be found in Converter Electrical
Characteristics Power Supply Characteristics. The device should be recalibrated following a power-cycle
of PDI (or PDQ).
This pin remains active in ECM. In ECM, either this pin or the PDI bit (Addr: 0h; Bit: 11) in the Control
Register may be used to power-down the I-channel. See Power Down for more information.
6.2.1.7
Power Down Q-channel Pin (PDQ)
The Power Down Q-channel (PDQ) Pin selects whether the Q-channel is powered down (logic-high) or
active (logic-low). This pin functions similarly to the PDI pin, except that it applies to the Q-channel. The
PDI and PDQ pins function independently of each other to control whether each I- or Q-channel is
powered down or active.
This pin remains active in ECM. In ECM, either this pin or the PDQ bit (Addr: 0h; Bit: 10) in the Control
Register may be used to power-down the Q-channel. See Power Down for more information.
6.2.1.8
Test Pattern Mode Pin (TPM)
The Test Pattern Mode (TPM) Pin selects whether the output of the ADC12D1800RF is a test pattern
(logic-high) or the converted analog input (logic-low). The ADC12D1800RF can provide a test pattern at
the four output buses independently of the input signal to aid in system debug. In TPM, the ADC is
disengaged and a test pattern generator is connected to the outputs, including ORI and ORQ. See Test
Pattern Mode for more information.
6.2.1.9
Full-Scale Input Range Pin (FSR)
The Full-Scale Input Range (FSR) Pin sets the full-scale input range for both the I- and Q-channel; for the
ADC12D1800RF, only the logic-high setting is available. The input full-scale range is specified as VIN_FSR
in Converter Electrical Characteristics Analog Input / Output and Reference Characteristics. In Non-ECM,
the full-scale input range for each I- and Q-channel may not be set independently, but it is possible to do
so in ECM. The device must be calibrated following a change in FSR to obtain optimal performance.
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To use this feature in ECM, use the Configuration Registers (Addr: 3h and Bh). See Input Control and
Adjust for more information.
6.2.1.10 AC / DC-Coupled Mode Pin (VCMO)
The VCMO Pin serves a dual purpose. When functioning as an output, it provides the optimal commonmode voltage for the DC-coupled analog inputs. When functioning as an input, it selects whether the
device is AC-coupled (logic-low) or DC-coupled (floating). This pin is always active, in both ECM and NonECM.
6.2.1.11 LVDS Output Common-mode Pin (VBG)
The VBG Pin serves a dual purpose. When functioning as an output, it provides the bandgap reference.
When functioning as an input, it selects whether the LVDS output common-mode voltage is higher (logichigh) or lower (floating). The LVDS output common-mode voltage is specified as VOS and may be found in
Converter Electrical Characteristics Digital Control and Output Pin Characteristics. This pin is always
active, in both ECM and Non-ECM.
6.2.2
Extended Control Mode
In Extended Control Mode (ECM), most functions are controlled via the Serial Interface. In addition to this,
several of the control pins remain active. See Table 6-4 for details. ECM is selected by setting the ECE
Pin to logic-low. If the ECE Pin is set to logic-high (Non-ECM), then the registers are reset to their default
values. So, a simple way to reset the registers is by toggling the ECE pin. Four pins on the
ADC12D1800RF control the Serial Interface: SCS, SCLK, SDI and SDO. This section covers the Serial
Interface. The Register Definitions are located at the end of the datasheet so that they are easy to find,
see Register Definitions.
6.2.2.1
The Serial Interface
The ADC12D1800RF offers a Serial Interface that allows access to the sixteen control registers within the
device. The Serial Interface is a generic 4-wire (optionally 3-wire) synchronous interface that is compatible
with SPI type interfaces that are used on many micro-controllers and DSP controllers. Each serial
interface access cycle is exactly 24 bits long. A register-read or register-write can be accomplished in one
cycle. The signals are defined in such a way that the user can opt to simply join SDI and SDO signals in
his system to accomplish a single, bidirectional SDI/O signal. A summary of the pins for this interface may
be found in Table 6-2. See Figure 4-9 for the timing diagram and Converter Electrical Characteristics
Serial Port Interface for timing specification details. Control register contents are retained when the device
is put into power-down mode. If this feature is unused, the SCLK, SDI, and SCS pins may be left floating
because they each have an internal pull-up.
Table 6-2. Serial Interface Pins
Pin
Name
C4
SCS (Serial Chip Select bar)
C5
SCLK (Serial Clock)
B4
SDI (Serial Data In)
A3
SDO (Serial Data Out)
SCS: Each assertion (logic-low) of this signal starts a new register access, i.e. the SDI command field
must be ready on the following SCLK rising edge. The user is required to de-assert this signal after the
24th clock. If the SCS is de-asserted before the 24th clock, no data read / write will occur. For a read
operation, if the SCS is asserted longer than 24 clocks, the SDO output will hold the D0 bit until SCS is
de-asserted. For a write operation, if the SCS is asserted longer than 24 clocks, data write will occur
normally through the SDI input upon the 24th clock. Setup and hold times, tSCS and tHCS, with respect to
the SCLK must be observed. SCS must be toggled in between register access cycles.
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SCLK: This signal is used to register the input data (SDI) on the rising edge; and to source the output
data (SDO) on the falling edge. The user may disable the clock and hold it at logic-low. There is no
minimum frequency requirement for SCLK; see fSCLK in Converter Electrical Characteristics Serial Port
Interface for more details.
SDI: Each register access requires a specific 24-bit pattern at this input, consisting of a command field
and a data field. If the SDI and SDO wired are shared (3-wire mode), then during read operations it is
necessary to tri-state the master which is driving SDI while the data field is being output by the ADC on
SDO. The master must be at TRI-STATE before the falling edge of the 8th clock. If SDI and SDO are not
shared (4-wire mode), then this is not necessary. Setup and hold times, tSH and tSSU, with respect to the
SCLK must be observed.
SDO: This output is normally at TRI-STATE and is driven only when SCS is asserted, the first 8 bits of
command data have been received and it is a READ operation. The data is shifted out, MSB first, starting
with the 8th clock's falling edge. At the end of the access, when SCS is de-asserted, this output is at TRISTATE once again. If an invalid address is accessed, the data sourced will consist of all zeroes. If it is a
read operation, there will be a bus turnaround time, tBSU, from when the last bit of the command field was
read in until the first bit of the data field is written out.
Table 6-3 shows the Serial Interface bit definitions.
Table 6-3. Command and Data Field Definitions (1)
Bit No.
(1)
Name
Comments
1
Read / Write (R/W)
1b indicates a read operation
0b indicates a write operation
2-3
Reserved
Bits must be set to 10b
4-7
A<3:0>
16 registers may be addressed.
The order is MSB first
8
X
This is a "don't care" bit
9-24
D<15:0>
Data written to or read from
addressed register
The serial data protocol is shown for a read and write operation in Figure 6-1 and Figure 6-2,
respectively.
1
2
3
4
5
6
7
8
R/W
1
0
A3
A2
A1
A0
X
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
D5
D4
D3
D2
D1
D0
25
SCSb
SCLK
SDI
SDO
*Only required to be tri-stated in 3-wire mode.
D15 D14 D13 D12 D11 D10
D9
D8
D7
D6
Figure 6-1. Serial Data Protocol - Read Operation
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1
2
3
4
5
6
7
8
R/W
1
0
A3
A2
A1
A0
X
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
D15 D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
25
SCSb
SCLK
SDI
SDO
Figure 6-2. Serial Data Protocol - Write Operation
6.3
FEATURES
The ADC12D1800RF offers many features to make the device convenient to use in a wide variety of
applications. Table 6-4 is a summary of the features available, as well as details for the control mode
chosen. "N/A" means "Not Applicable."
Table 6-4. Features and Modes
Feature
Control Pin
Active in ECM
Non-ECM
ECM
Default ECM State
Input Control and Adjust
AC/DC-coupled Mode
Selection
Selected via VCMO
(Pin C2)
Yes
Not available
N/A
Input Full-scale Range Adjust
Selected via FSR
(Pin Y3)
No
Selected via the Config Reg
(Addr: 3h and Bh)
Low FSR value
Input Offset Adjust Setting
Not available
N/A
Selected via the Config Reg
(Addr: 2h and Ah)
Offset = 0 mV
DES/Non-DES Mode Selection
Selected via DES
(Pin V5)
No
Selected via the DES Bit
(Addr: 0h; Bit: 7)
Non-DES Mode
DES Mode Input Selection
Not available
N/A
Selected via the DCK Bit
(Addr: Eh; Bit: 6)
N/A
DESCLKIQ Mode (1)
Not available
N/A
Selected via the DES Timing
Adjust Reg
(Addr: 7h)
N/A
DES Timing Adjust
Not available
N/A
Selected via the DES Timing
Adjust Reg (Addr: 7h)
Mid skew offset
Sampling Clock Phase Adjust
Not available
N/A
Selected via the Config Reg
(Addr: Ch and Dh)
tAD adjust disabled
DDR Clock Phase Selection
Selected via DDRPh
(Pin W4)
No
Selected via the DPS Bit
(Addr: 0h; Bit: 14)
0° Mode
DDR / SDR DCLK Selection
Not available
N/A
Selected via the SDR Bit
(Addr: 0h; Bit: 2)
DDR Mode
SDR Rising / Falling DCLK
Selection (1)
Not available
N/A
Selected via the DPS Bit
(Addr: 0h; Bit: 14)
N/A
LVDS Differential Voltage
Amplitude Selection
Higher amplitude only
N/A
Selected via the OVS Bit
(Addr: 0h; Bit: 13)
Higher amplitude
Output Control and Adjust
(1)
46
The -3 dB point is the traditional Full-Power Bandwidth (FPBW) specification. Although the insertion loss is approximately half the power
at this frequency, the dynamic performance of the ADC does not necessarily begin to degrade to a level below which it may be
effectively used in an application. The ADC may be used at input frequencies above the -3 dB FPBW point, for example, into the 3rd
Nyquist zone. Depending on system requirements, it is only necessary to compensate for the insertion loss.
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Table 6-4. Features and Modes (continued)
Feature
Non-ECM
Control Pin
Active in ECM
ECM
Default ECM State
LVDS Common-Mode Voltage
Amplitude Selection (1)
Selected via VBG
(Pin B1)
Yes
Not available
N/A
(1)
Offset Binary only
N/A
Selected via the 2SC Bit
(Addr: 0h; Bit: 4)
Offset Binary
Test Pattern Mode at Output
Selected via TPM
(Pin A4)
No
Selected via the TPM Bit
(Addr: 0h; Bit: 12)
TPM disabled
Demux/Non-Demux Mode
Selection
Selected via NDM
(Pin A5)
Yes
Not available
N/A
AutoSync
Not available
N/A
Selected via the Config Reg
(Addr: Eh)
Master Mode,
RCOut1/2 disabled
DCLK Reset
Not available
N/A
Selected via the Config Reg
(Addr: Eh; Bit 0)
DCLK Reset disabled
Time Stamp
Not available
N/A
Selected via the TSE Bit
(Addr: 0h; Bit: 3)
Time Stamp disabled
On-command Calibration
Selected via CAL
(Pin D6)
Yes
Selected via the CAL Bit
(Addr: 0h; Bit: 15)
N/A
(CAL = 0)
Power-on Calibration Delay
Selection (2)
Selected via CalDly
(Pin V4)
Yes
Not available
N/A
Calibration Adjust (2)
Not available
N/A
Selected via the Config Reg
(Addr: 4h)
tCAL
Read / Write Calibration
Settings (2)
Not available
N/A
Selected via the SSC Bit
(Addr: 4h; Bit: 7)
R/W calibration values
disabled
Power down I-channel
Selected via PDI
(Pin U3)
Yes
Selected via the PDI Bit
(Addr: 0h; Bit: 11)
I-channel operational
Power down Q-channel
Selected via PDQ
(Pin V3)
Yes
Selected via the PDQ Bit
(Addr: 0h; Bit: 10)
Q-channel operational
Output Formatting Selection
Calibration
Power-Down
(2)
The -3 dB point is the traditional Full-Power Bandwidth (FPBW) specification. Although the insertion loss is approximately half the power
at this frequency, the dynamic performance of the ADC does not necessarily begin to degrade to a level below which it may be
effectively used in an application. The ADC may be used at input frequencies above the -3 dB FPBW point, for example, into the 3rd
Nyquist zone. Depending on system requirements, it is only necessary to compensate for the insertion loss.
6.3.1
Input Control and Adjust
There are several features and configurations for the input of the ADC12D1800RF so that it may be used
in many different applications. This section covers AC/DC-coupled Mode, input full-scale range adjust,
input offset adjust, DES/Non-DES Mode, DES Timing Adjust, and sampling clock phase adjust.
6.3.1.1
AC/DC-coupled Mode
The analog inputs may be AC or DC-coupled. See AC / DC-Coupled Mode Pin (VCMO) for information on
how to select the desired mode and DC-coupled Input Signals and AC-coupled Input Signals for
applications information.
6.3.1.2
Input Full-Scale Range Adjust
The input full-scale range for the ADC12D1800RF may be adjusted in ECM. In Non-ECM, the control pin
must be set to logic-high; see Full-Scale Input Range Pin (FSR). In ECM, the input full-scale range may
be adjusted with 15-bits of precision. See VIN_FSR in Converter Electrical Characteristics Analog Input /
Output and Reference Characteristics for electrical specification details. Note that the full-scale input
range setting in Non-ECM (logic-high only) corresponds to the lowest full-scale input range settings in
ECM. It is necessary to execute an on-command calibration following a change of the input full-scale
range. See Register Definitions for information about the registers.
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Input Offset Adjust
The input offset adjust for the ADC12D1800RF may be adjusted with 12-bits of precision plus sign via
ECM. See Register Definitions for information about the registers.
6.3.1.4
DES/Non-DES Mode
The ADC12D1800RF can operate in Dual-Edge Sampling (DES) or Non-DES Mode. The DES Mode
allows for a single analog input to be sampled by both I- and Q-channels. One channel samples the input
on the rising edge of the sampling clock and the other samples the same input signal on the falling edge
of the sampling clock. A single input is thus sampled twice per clock cycle, resulting in an overall sample
rate of twice the sampling clock frequency, e.g. 3.6 GSPS with a 1.8 GHz sampling clock. Since DES
Mode uses both I- and Q-channels to process the input signal, both channels must be powered up for the
DES Mode to function properly.
In Non-ECM, only the I-input may be used for the DES Mode input. See Dual Edge Sampling Pin (DES)
for information on how to select the DES Mode. In ECM, either the I- or Q-input may be selected by first
using the DES bit (Addr: 0h, Bit 7) to select the DES Mode. The DEQ Bit (Addr: 0h, Bit: 6) is used to
select the Q-input, but the I-input is used by default. Also, both I- and Q-inputs may be driven externally,
i.e. DESIQ Mode, by using the DIQ bit (Addr: 0h, Bit 5). See THE ANALOG INPUTS for more information
about how to drive the ADC in DES Mode.
In DESCLKIQ Mode, the I- and Q-channels sample their inputs 180° out-of-phase with respect to one
another, similar to the other DES Modes. DESCLKIQ Mode is similar to the DESIQ Mode, except that the
I- and Q-channels remain electrically separate internal to the ADC12D1800RF. For this reason, both Iand Q-inputs must be externally driven for the DESCLKIQ Mode. The DCLK Bit (Addr: Eh, Bit 6) is used to
select the 180° sampling clock mode.
The DESCLKIQ Mode results in the best bandwidth for the interleaved modes. In general, the bandwidth
decreases from Non-DES Mode to DES Mode (specifically, DESI or DESQ) because both channels are
sampling off the same input signal and non-ideal effects introduced by interleaving the two channels lower
the bandwidth. Driving both I- and Q-channels externally (DESIQ Mode and DESCLKIQ Mode) results in
better bandwidth for the DES Mode because each channel is being driven, which reduces routing losses.
The DESCLKIQ Mode has better bandwidth than the DESIQ Mode because the routing internal to the
ADC12D1800RF is simpler, which results in less insertion loss.
In the DES Mode, the outputs must be carefully interleaved in order to reconstruct the sampled signal. If
the device is programmed into the 1:4 Demux DES Mode, the data is effectively demultiplexed by 1:4. If
the sampling clock is 1.8 GHz, the effective sampling rate is doubled to 3.6 GSPS and each of the 4
output buses has an output rate of 900 MSPS. All data is available in parallel. To properly reconstruct the
sampled waveform, the four bytes of parallel data that are output with each DCLK must be correctly
interleaved. The sampling order is as follows, from the earliest to the latest: DQd, DId, DQ, DI. See
Figure 4-5. If the device is programmed into the Non-Demux DES Mode, two bytes of parallel data are
output with each edge of the DCLK in the following sampling order, from the earliest to the latest: DQ, DI.
See Figure 4-6.
6.3.1.5
DES Timing Adjust
The performance of the ADC12D1800RF in DES Mode depends on how well the two channels are
interleaved, i.e. that the clock samples either channel with precisely a 50% duty-cycle, each channel has
the same offset (nominally code 2047/2048), and each channel has the same full-scale range. The
ADC12D1800RF includes an automatic clock phase background adjustment in DES Mode to automatically
and continuously adjust the clock phase of the I- and Q-channels. In addition to this, the residual fixed
timing skew offset may be further manually adjusted, and further reduce timing spurs for specific
applications. See the DES Timing Adjust (Addr: 7h). As the DES Timing Adjust is programmed from 0d to
127d, the magnitude of the Fs/2-Fin timing interleaving spur will decrease to a local minimum and then
increase again. The default, nominal setting of 64d may or may not coincide with this local minimum. The
user may manually skew the global timing to achieve the lowest possible timing interleaving spur.
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Sampling Clock Phase Adjust
The sampling clock (CLK) phase may be delayed internally to the ADC up to 825 ps in ECM. This feature
is intended to help the system designer remove small imbalances in clock distribution traces at the board
level when multiple ADCs are used, or to simplify complex system functions such as beam steering for
phase array antennas.
Additional delay in the clock path also creates additional jitter when using the sampling clock phase adjust.
Because the sampling clock phase adjust delays all clocks, including the DCLKs and output data, the user
is strongly advised to use the minimal amount of adjustment and verify the net benefit of this feature in his
system before relying on it.
Using this feature at its maximum setting, for the maximum sampling clock rate, may affect the integrity of
the sampling clock on chip. Therefore, it is not recommended to do so. The maximum setting for the
coarse adjust is 825ps. The period for the maximum sampling clock rate of is 555ps, so it should not be
necessary to exceed this value in any case.
6.3.2
Output Control and Adjust
There are several features and configurations for the output of the ADC12D1800RF so that it may be used
in many different applications. This section covers DDR clock phase, LVDS output differential and
common-mode voltage, output formatting, Demux/Non-demux Mode, Test Pattern Mode, and Time Stamp.
6.3.2.1
SDR / DDR Clock
The ADC12D1800RF output data can be delivered in Double Data Rate (DDR) or Single Data Rate
(SDR). For DDR, the DCLK frequency is half the data rate and data is sent to the outputs on both edges
of DCLK; see Figure 6-3. The DCLK-to-Data phase relationship may be either 0° or 90°. For 0° Mode, the
Data transitions on each edge of the DCLK. Any offset from this timing is tOSK; see Converter Electrical
Characteristics AC Electrical Characteristics for details. For 90° Mode, the DCLK transitions in the middle
of each Data cell. Setup and hold times for this transition, tSU and tH, may also be found in Converter
Electrical Characteristics AC Electrical Characteristics. The DCLK-to-Data phase relationship may be
selected via the DDRPh Pin in Non-ECM (see Dual Data Rate Phase Pin (DDRPh)) or the DPS bit in the
Configuration Register (Addr: 0h; Bit: 14) in ECM. Note that for Non-Demux Mode, 90° DDR Mode is not
available.
Data
DCLK
0° Mode
DCLK
90° Mode
Figure 6-3. DDR DCLK-to-Data Phase Relationship
For SDR, the DCLK frequency is the same as the data rate and data is sent to the outputs on a single
edge of DCLK; see Figure 6-4. The Data may transition on either rising or falling edge of DCLK. Any offset
from this timing is tOSK; see Converter Electrical Characteristics AC Electrical Characteristics for details.
The DCLK rising / falling edge may be selected via the SDR bit in the Configuration Register (Addr: 0h;
Bit: 2) in ECM only. Note that SDR is available in Demux Mode, but not in Non-Demux Mode.
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Data
DCLK
SDR Rising
DCLK
SDR Falling
Figure 6-4. SDR DCLK-to-Data Phase Relationship
6.3.2.2
LVDS Output Differential Voltage
The ADC12D1800RF is available with a selectable higher or lower LVDS output differential voltage. This
parameter is VOD and may be found in Converter Electrical Characteristics Digital Control and Output Pin
Characteristics. The desired voltage may be selected via the OVS Bit (Addr: 0h, Bit 13). For many
applications, in which the LVDS outputs are very close to an FPGA on the same board, for example, the
lower setting is sufficient for good performance; this will also reduce the possibility for EMI from the LVDS
outputs to other signals on the board. See Register Definitions for more information.
6.3.2.3
LVDS Output Common-Mode Voltage
The ADC12D1800RF is available with a selectable higher or lower LVDS output common-mode voltage.
This parameter is VOS and may be found in Converter Electrical Characteristics Digital Control and Output
Pin Characteristics. See LVDS Output Common-mode Pin (VBG) for information on how to select the
desired voltage.
6.3.2.4
Output Formatting
The formatting at the digital data outputs may be either offset binary or two's complement. The default
formatting is offset binary, but two's complement may be selected via the 2SC Bit (Addr: 0h, Bit 4); see
Register Definitions for more information.
6.3.2.5
Demux/Non-demux Mode
The ADC12D1800RF may be in one of two demultiplex modes: Demux Mode or Non-Demux Mode (also
sometimes referred to as 1:1 Demux Mode). In Non-Demux Mode, the data from the input is simply output
at the sampling rate on one 12-bit bus. In Demux Mode, the data from the input is output at half the
sampling rate, on twice the number of buses. Demux/Non-Demux Mode may only be selected by the NDM
pin; see Non-Demultiplexed Mode Pin (NDM). In Non-DES Mode, the output data from each channel may
be demultiplexed by a factor of 1:2 (1:2 Demux Non-DES Mode) or not demultiplexed (Non-Demux NonDES Mode). In DES Mode, the output data from both channels interleaved may be demultiplexed (1:4
Demux DES Mode) or not demultiplexed (Non-Demux DES Mode).
Note that for Non-Demux Mode, 90° DDR Mode and SDR Mode are not available. See Table 6-5 for a
selection of available modes.
Table 6-5. Supported Demux, Data Rate Modes
50
Non-Demux Mode
1:2 Demux Mode
DDR
0° Mode only
0° Mode / 90° Mode
SDR
Not Available
Rising / Falling Mode
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Test Pattern Mode
The ADC12D1800RF can provide a test pattern at the four output buses independently of the input signal
to aid in system debug. In Test Pattern Mode, the ADC is disengaged and a test pattern generator is
connected to the outputs, including ORI and ORQ. The test pattern output is the same in DES Mode or
Non-DES Mode. Each port is given a unique 12-bit word, alternating between 1's and 0's. When the part is
programmed into the Demux Mode, the test pattern’s order is described in Table 6-6. If the I- or Q-channel
is powered down, the test pattern will not be output for that channel.
Table 6-6. Test Pattern by Output Port in
Demux Mode (1)
(1)
Time
Qd
Id
Q
I
ORQ
ORI
T0
000h
004h
008h
010h
0b
0b
T1
FFFh
FFBh
FF7h
FEFh
1b
1b
T2
000h
004h
008h
010h
0b
0b
T3
FFFh
FFBh
FF7h
FEFh
1b
1b
T4
000h
004h
008h
010h
0b
0b
T5
000h
004h
008h
010h
0b
0b
T6
FFFh
FFBh
FF7h
FEFh
1b
1b
T7
000h
004h
008h
010h
0b
0b
T8
FFFh
FFBh
FF7h
FEFh
1b
1b
T9
000h
004h
008h
010h
0b
0b
T10
000h
004h
008h
010h
0b
0b
T11
FFFh
FFBh
FF7h
FEFh
1b
1b
T12
000h
004h
008h
010h
0b
0b
T13
...
...
...
...
...
...
Comments
Pattern
Sequence
n
Pattern
Sequence
n+1
Pattern
Sequence
n+2
When the part is programmed into the Non-Demux Mode, the test pattern’s order is described in Table 6-7.
Table 6-7. Test Pattern by Output Port in
Non-Demux Mode
Time
Q
I
ORQ
ORI
T0
000h
004h
0b
0b
T1
000h
004h
0b
0b
T2
FFFh
FFBh
1b
1b
T3
FFFh
FFBh
1b
1b
T4
000h
004h
0b
0b
T5
FFFh
FFBh
1b
1b
T6
000h
004h
0b
0b
T7
FFFh
FFBh
1b
1b
T8
FFFh
FFBh
1b
1b
T9
FFFh
FFBh
1b
1b
T10
000h
004h
0b
0b
T11
000h
004h
0b
0b
T12
FFFh
FFBh
1b
1b
T13
FFFh
FFBh
1b
1b
T14
...
...
...
...
Comments
Pattern
Sequence
n
Pattern
Sequence
n+1
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Time Stamp
The Time Stamp feature enables the user to capture the timing of an external trigger event, relative to the
sampled signal. When enabled via the TSE Bit (Addr: 0h; Bit: 3), the LSB of the digital outputs (DQd, DQ,
DId, DI) captures the trigger information. In effect, the 12-bit converter becomes an 11-bit converter and
the LSB acts as a 1-bit converter with the same latency as the 11-bit converter. The trigger should be
applied to the DCLK_RST input. It may be asynchronous to the ADC sampling clock.
6.3.3
Calibration Feature
The ADC12D1800RF calibration must be run to achieve specified performance. The calibration procedure
is exactly the same regardless of how it was initiated or when it is run. Calibration trims the analog input
differential termination resistors, the CLK input resistor, and sets internal bias currents which affect the
linearity of the converter. This minimizes full-scale error, offset error, DNL and INL, which results in the
maximum dynamic performance, as measured by: SNR, THD, SINAD (SNDR) and ENOB.
6.3.3.1
Calibration Control Pins and Bits
Table 6-8 is a summary of the pins and bits used for calibration. See Ball Descriptions and Equivalent
Circuits for complete pin information and Figure 4-8 for the timing diagram.
Table 6-8. Calibration Pins
6.3.3.2
Pin (Bit)
Name
Function
D6
(Addr: 0h; Bit 15)
CAL
(Calibration)
Initiate calibration
V4
CalDly
(Calibration Delay)
Select power-on calibration delay
(Addr: 4h)
Calibration Adjust
Adjust calibration sequence
B5
CalRun
(Calibration Running)
Indicates while calibration is
running
C1/D2
Rtrim+/(Input termination trim resistor)
External resistor used to calibrate
analog and CLK inputs
C3/D3
Rext+/(External Reference resistor)
External resistor used to calibrate
internal linearity
How to Execute a Calibration
Calibration may be initiated by holding the CAL pin low for at least tCAL_L clock cycles, and then holding it
high for at least another tCAL_H clock cycles, as defined in Converter Electrical Characteristics Calibration.
The minimum tCAL_L and tCAL_H input clock cycle sequences are required to ensure that random noise does
not cause a calibration to begin when it is not desired. The time taken by the calibration procedure is
specified as tCAL. The CAL Pin is active in both ECM and Non-ECM. However, in ECM, the CAL Pin is
logically OR'd with the CAL Bit, so both the pin and bit are required to be set low before executing another
calibration via either pin or bit.
6.3.3.3
Power-on Calibration
For standard operation, power-on calibration begins after a time delay following the application of power,
as determined by the setting of the CalDly Pin and measured by tCalDly (see Converter Electrical
Characteristics Calibration). This delay allows the power supply to come up and stabilize before the
power-on calibration takes place. The best setting (short or long) of the CalDly Pin depends upon the
settling time of the power supply.
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It is strongly recommended to set CalDly Pin (to either logic-high or logic-low) before powering the device
on since this pin affects the power-on calibration timing. This may be accomplished by setting CalDly via
an external 1kΩ resistor connected to GND or VA. If the CalDly Pin is toggled while the device is poweredon, it can execute a calibration even though the CAL Pin / Bit remains logic-low.
The power-on calibration will be not be performed if the CAL pin is logic-high at power-on. In this case, the
calibration cycle will not begin until the on-command calibration conditions are met. The ADC12D1800RF
will function with the CAL pin held high at power up, but no calibration will be done and performance will
be impaired.
If it is necessary to toggle the CalDly Pin during the system power up sequence, then the CAL Pin / Bit
must be set to logic-high before the toggling and afterwards for 109 Sampling Clock cycles. This will
prevent the power-on calibration, so an on-command calibration must be executed or the performance will
be impaired.
6.3.3.4
On-command Calibration
In addition to the power-on calibration, it is recommended to execute an on-command calibration
whenever the settings or conditions to the device are altered significantly, in order to obtain optimal
parametric performance. Some examples include: changing the FSR via ECM, power-cycling either
channel, and switching into or out of DES Mode. For best performance, it is also recommended that an
on-command calibration be run 20 seconds or more after application of power and whenever the operating
temperature changes significantly, relative to the specific system performance requirements.
Due to the nature of the calibration feature, it is recommended to avoid unnecessary activities on the
device while the calibration is taking place. For example, do not read or write to the Serial Interface or use
the DCLK Reset feature while calibrating the ADC. Doing so will impair the performance of the device until
it is re-calibrated correctly. Also, it is recommended to not apply a strong narrow-band signal to the analog
inputs during calibration because this may impair the accuracy of the calibration; broad spectrum noise is
acceptable.
6.3.3.5
Calibration Adjust
The sequence of the calibration event itself may be adjusted. This feature can be used if a shorter
calibration time than the default is required; see tCAL in Converter Electrical Characteristics Calibration.
However, the performance of the device, when using this feature is not ensured.
The calibration sequence may be adjusted via CSS (Addr: 4h, Bit 14). The default setting of CSS = 1b
executes both RIN and RIN_CLK Calibration (using Rtrim) and internal linearity Calibration (using Rext).
Executing a calibration with CSS = 0b executes only the internal linearity Calibration. The first time that
Calibration is executed, it must be with CSS = 1b to trim RIN and RIN_CLK. However, once the device is at
its operating temperature and RIN has been trimmed at least one time, it will not drift significantly. To save
time in subsequent calibrations, trimming RIN and RIN_CLK may be skipped, i.e. by setting CSS = 0b.
6.3.3.6
Read / Write Calibration Settings
When the ADC performs a calibration, the calibration constants are stored in an array which is accessible
via the Calibration Values register (Addr: 5h). To save the time which it takes to execute a calibration, tCAL,
or to allow for re-use of a previous calibration result, these values can be read from and written to the
register at a later time. For example, if an application requires the same input impedance, RIN, this feature
can be used to load a previously determined set of values. For the calibration values to be valid, the ADC
must be operating under the same conditions, including temperature, at which the calibration values were
originally determined by the ADC.
To read calibration values from the SPI, do the following:
1. Set ADC to desired operating conditions.
2. Set SSC (Addr: 4h, Bit 7) to 1.
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3. Read exactly 240 times the Calibration Values register (Addr: 5h). The register values are R0, R1, R2...
R239 where R0 is a dummy value. The contents of R<239:1> should be stored.
4. Set SSC (Addr: 4h, Bit 7) to 0.
5. Continue with normal operation.
To write calibration values to the SPI, do the following:
1. Set ADC to operating conditions at which Calibration Values were previously read.
2. Set SSC (Addr: 4h, Bit 7) to 1.
3. Write exactly 239 times the Calibration Values register (Addr: 5h). The registers should be written R1,
R2, ... , R239.
4. Make two additional dummy writes of 0000h.
5. Set SSC (Addr: 4h, Bit 7) to 0.
6. Continue with normal operation.
6.3.3.7
Calibration and Power-Down
If PDI and PDQ are simultaneously asserted during a calibration cycle, the ADC12D1800RF will
immediately power down. The calibration cycle will continue when either or both channels are powered
back up, but the calibration will be compromised due to the incomplete settling of bias currents directly
after power up. Therefore, a new calibration should be executed upon powering the ADC12D1800RF back
up. In general, the ADC12D1800RF should be recalibrated when either or both channels are powered
back up, or after one channel is powered down. For best results, this should be done after the device has
stabilized to its operating temperature.
6.3.3.8
Calibration and the Digital Outputs
During calibration, the digital outputs (including DI, DId, DQ, DQd and OR) are set logic-low, to reduce
noise. The DCLK runs continuously during calibration. After the calibration is completed and the CalRun
signal is logic-low, it takes an additional 60 Sampling Clock cycles before the output of the
ADC12D1800RF is valid converted data from the analog inputs. This is the time it takes for the pipeline to
flush, as well as for other internal processes.
6.3.4
Power Down
On the ADC12D1800RF, the I- and Q-channels may be powered down individually. This may be
accomplished via the control pins, PDI and PDQ, or via ECM. In ECM, the PDI and PDQ pins are logically
OR'd with the Control Register setting. See Power Down I-channel Pin (PDI) and Power Down Q-channel
Pin (PDQ) for more information.
6.4
6.4.1
Applications Information
THE ANALOG INPUTS
The ADC12D1800RF will continuously convert any signal which is present at the analog inputs, as long as
a CLK signal is also provided to the device. This section covers important aspects related to the analog
inputs including: acquiring the input, driving the ADC in DES Mode, the reference voltage and FSR, out-ofrange indication, AC/DC-coupled signals, and single-ended input signals.
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Acquiring the Input
The Aperture Delay, tAD, is the amount of delay, measured from the sampling edge of the clock input, after
which the signal present at the input pin is sampled inside the device. Data is acquired at the rising edge
of CLK+ in Non-DES Mode and both the falling and rising edge of CLK+ in DES Mode. In Non-DES Mode,
the I- and Q-channels always sample data on the rising edge of CLK+. In DES Mode, i.e. DESI, DESQ,
DESIQ, and DESCLKIQ, the I-channel samples data on the rising edge of CLK+ and the Q-channel
samples data on the falling edge of CLK+. The digital equivalent of that data is available at the digital
outputs a constant number of sampling clock cycles later for the DI, DQ, DId and DQd output busses,
a.k.a. the latency, depending on the demultiplex mode which is selected. In addition to the latency, there is
a constant output delay, tOD, before the data is available at the outputs. See tOD in the Timing Diagrams.
See tLAT, tAD, and tOD in Converter Electrical Characteristics AC Electrical Characteristics.
6.4.1.2
Driving the ADC in DES Mode
The ADC12D1800RF can be configured as either a 2-channel, 1.8 GSPS device (Non-DES Mode) or a 1channel 3.6 GSPS device (DES Mode). When the device is configured in DES Mode, there is a choice for
with which input to drive the single-channel ADC. These are the 3 options:
DES – externally driving the I-channel input only. This is the default selection when the ADC is configured
in DES Mode. It may also be referred to as “DESI” for added clarity.
DESQ – externally driving the Q-channel input only.
DESIQ, DESCLKIQ – externally driving both the I- and Q-channel inputs. VinI+ and VinQ+ should be
driven with the exact same signal. VinI- and VinQ- should be driven with the exact same signal, which is
the differential complement to the one driving VinI+ and VinQ+.
The input impedance for each I- and Q-input is 100Ω differential (or 50Ω single-ended), so the trace to
each VinI+, VinI-, VinQ+, and VinQ- should always be 50Ω single-ended. If a single I- or Q-input is being
driven, then that input will present a 100Ω differential load. For example, if a 50Ω single-ended source is
driving the ADC, then a 1:2 balun will transform the impedance to 100Ω differential. However, if the ADC
is being driven in DESIQ Mode, then the 100Ω differential impedance from the I-input will appear in
parallel with the Q-input for a composite load of 50Ω differential and a 1:1 balun would be appropriate.
See Figure 6-5 for an example circuit driving the ADC in DESIQ Mode. A recommended part selection is
using the Mini-Circuits TC1-1-13MA+ balun with Ccouple = 0.22µF.
Ccouple
50:
Source
VINI+
100:
1:1 Balun
Ccouple
VINI-
Ccouple
VINQ+
100:
Ccouple
VINQADC1XD1X00
Figure 6-5. Driving DESIQ Mode
In the case that only one channel is used in Non-DES Mode or that the ADC is driven in DESI or DESQ
Mode, the unused analog input should be terminated to reduce any noise coupling into the ADC. See
Table 6-9 for details.
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Table 6-9. Unused Analog Input Recommended Termination
6.4.1.3
Mode
Power Down
Coupling
Recommended Termination
Non-DES
Yes
AC/DC
Tie Unused+ and Unused- to Vbg
DES/Non-DES
No
DC
Tie Unused+ and Unused- to Vbg
DES/Non-DES
No
AC
Tie Unused+ to Unused-
FSR and the Reference Voltage
The full-scale analog differential input range (VIN_FSR) of the ADC12D1800RF is derived from an internal
bandgap reference. In Non-ECM, this full-scale range must be set by the logic-high setting of the FSR Pin;
see Full-Scale Input Range Pin (FSR). The FSR Pin operates on both I- and Q-channels. In ECM, the fullscale range may be independently set for each channel via Addr:3h and Bh with 15 bits of precision; see
Register Definitions. The best SNR is obtained with a higher full-scale input range, but better distortion
and SFDR are obtained with a lower full-scale input range. It is not possible to use an external analog
reference voltage to modify the full-scale range, and this adjustment should only be done digitally, as
described.
A buffered version of the internal bandgap reference voltage is made available at the VBG Pin for the user.
The VBG pin can drive a load of up to 80 pF and source or sink up to 100 μA. It should be buffered if more
current than this is required. This pin remains as a constant reference voltage regardless of what full-scale
range is selected and may be used for a system reference. VBG is a dual-purpose pin and it may also be
used to select a higher LVDS output common-mode voltage; see LVDS Output Common-mode Pin (VBG).
6.4.1.4
Out-Of-Range Indication
Differential input signals are digitized to 12 bits, based on the full-scale range. Signal excursions beyond
the full-scale range, i.e. greater than +VIN_FSR/2 or less than -VIN_FSR/2, will be clipped at the output. An
input signal which is above the FSR will result in all 1's at the output and an input signal which is below
the FSR will result in all 0's at the output. When the conversion result is clipped for the I-channel input, the
Out-of-Range I-channel (ORI) output is activated such that ORI+ goes high and ORI- goes low while the
signal is out of range. This output is active as long as accurate data on either or both of the buses would
be outside the range of 000h to FFFh. The Q-channel has a separate ORQ which functions similarly.
6.4.1.5
Maximum Input Range
The recommended operating and absolute maximum input range may be found in Operating Ratings and
Absolute Maximum Ratings, respectively. Under the stated allowed operating conditions, each Vin+ and
Vin- input pin may be operated in the range from 0V to 2.15V if the input is a continuous 100% duty cycle
signal and from 0V to 2.5V if the input is a 10% duty cycle signal. The absolute maximum input range for
Vin+ and Vin- is from -0.15V to 2.5V. These limits apply only for input signals for which the input common
mode voltage is properly maintained.
6.4.1.6
AC-coupled Input Signals
The ADC12D1800RF analog inputs require a precise common-mode voltage. This voltage is generated
on-chip when AC-coupling Mode is selected. See AC / DC-Coupled Mode Pin (VCMO) for more
information about how to select AC-coupled Mode.
In AC-coupled Mode, the analog inputs must of course be AC-coupled. For an ADC12D1800RF used in a
typical application, this may be accomplished by on-board capacitors, as shown in Figure 6-6. For the
ADC12D1800RFRB, the SMA inputs on the Reference Board are directly connected to the analog inputs
on the ADC12D1800RF, so this may be accomplished by DC blocks (included with the hardware kit).
When the AC-coupled Mode is selected, an analog input channel that is not used (e.g. in DES Mode)
should be connected to AC ground, e.g. through capacitors to ground . Do not connect an unused analog
input directly to ground.
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Ccouple
VIN+
Ccouple
VINVCMO
ADC12D1XXX
Figure 6-6. AC-coupled Differential Input
The analog inputs for the ADC12D1800RF are internally buffered, which simplifies the task of driving
these inputs and the RC pole which is generally used at sampling ADC inputs is not required. If the user
desires to place an amplifier circuit before the ADC, care should be taken to choose an amplifier with
adequate noise and distortion performance, and adequate gain at the frequencies used for the application.
6.4.1.7
DC-coupled Input Signals
In DC-coupled Mode, the ADC12D1800RF differential inputs must have the correct common-mode
voltage. This voltage is provided by the device itself at the VCMO output pin. It is recommended to use this
voltage because the VCMO output potential will change with temperature and the common-mode voltage of
the driving device should track this change. Full-scale distortion performance falls off as the input common
mode voltage deviates from VCMO. Therefore, it is recommended to keep the input common-mode voltage
within 100 mV of VCMO (typical), although this range may be extended to ±150 mV (maximum). See VCMI
in Converter Electrical Characteristics Analog Input / Output and Reference Characteristics and ENOB vs.
VCMI in Typical Performance Plots. Performance in AC- and DC-coupled Mode are similar, provided that
the input common mode voltage at both analog inputs remains within 100 mV of VCMO.
6.4.1.8
Single-Ended Input Signals
The analog inputs of the ADC12D1800RF are not designed to accept single-ended signals. The best way
to handle single-ended signals is to first convert them to differential signals before presenting them to the
ADC. The easiest way to accomplish single-ended to differential signal conversion is with an appropriate
balun-transformer, as shown in Figure 6-7.
Ccouple
50:
Source
VIN+
100:
1:2 Balun
Ccouple
VINADC12D1XXX
Figure 6-7. Single-Ended to Differential Conversion Using a Balun
When selecting a balun, it is important to understand the input architecture of the ADC. The impedance of
the analog source should be matched to the ADC12D1800RF's on-chip 100Ω differential input termination
resistor. The range of this termination resistor is specified as RIN in Converter Electrical Characteristics
Analog Input / Output and Reference Characteristics.
6.4.2
THE CLOCK INPUTS
The ADC12D1800RF has a differential clock input, CLK+ and CLK-, which must be driven with an ACcoupled, differential clock signal. This provides the level shifting necessary to allow for the clock to be
driven with LVDS, PECL, LVPECL, or CML levels. The clock inputs are internally terminated to 100Ω
differential and self-biased. This section covers coupling, frequency range, level, duty-cycle, jitter, and
layout considerations.
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CLK Coupling
The clock inputs of the ADC12D1800RF must be capacitively coupled to the clock pins as indicated in
Figure 6-8.
Ccouple
CLK+
Ccouple
CLK-
ADC12D1XXX
Figure 6-8. Differential Input Clock Connection
The choice of capacitor value will depend on the clock frequency, capacitor component characteristics and
other system economic factors. For example, on the ADC12D1800RFRB, the capacitors have the value
Ccouple = 4.7 nF which yields a high pass cutoff frequency, fc = 677.2 kHz.
6.4.2.2
CLK Frequency
Although the ADC12D1800RF is tested and its performance is ensured with a differential 1.8 GHz
sampling clock, it will typically function well over the input clock frequency range; see fCLK(min) and
fCLK(max) in Converter Electrical Characteristics AC Electrical Characteristics. Operation up to fCLK(max) is
possible if the maximum ambient temperatures indicated are not exceeded. Operating at sample rates
above fCLK(max) for the maximum ambient temperature may result in reduced device reliability and
product lifetime. This is due to the fact that higher sample rates results in higher power consumption and
die temperatures. If fCLK < 300 MHz, enable LFS in the Control Register (Addr: 0h, Bit 8).
6.4.2.3
CLK Level
The input clock amplitude is specified as VIN_CLK in Converter Electrical Characteristics Sampling Clock
Characteristics. Input clock amplitudes above the max VIN_CLK may result in increased input offset voltage.
This would cause the converter to produce an output code other than the expected 2047/2048 when both
input pins are at the same potential. Insufficient input clock levels will result in poor dynamic performance.
Both of these results may be avoided by keeping the clock input amplitude within the specified limits of
VIN_CLK.
6.4.2.4
CLK Duty Cycle
The duty cycle of the input clock signal can affect the performance of any A/D converter. The
ADC12D1800RF features a duty cycle clock correction circuit which can maintain performance over the
20%-to-80% specified clock duty-cycle range. This feature is enabled by default and provides improved
ADC clocking, especially in the Dual-Edge Sampling (DES) Mode.
6.4.2.5
CLK Jitter
High speed, high performance ADCs such as the ADC12D1800RF require a very stable input clock signal
with minimum phase noise or jitter. ADC jitter requirements are defined by the ADC resolution (number of
bits), maximum ADC input frequency and the input signal amplitude relative to the ADC input full scale
range. The maximum jitter (the sum of the jitter from all sources) allowed to prevent a jitter-induced
reduction in SNR is found to be
tJ(MAX) = ( VIN(P-P)/ VFSR) x (1/(2(N+1) x π x fIN))
(3)
where tJ(MAX) is the rms total of all jitter sources in seconds, VIN(P-P) is the peak-to-peak analog input signal,
VFSR is the full-scale range of the ADC, "N" is the ADC resolution in bits and fIN is the maximum input
frequency, in Hertz, at the ADC analog input.
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tJ(MAX) is the square root of the sum of the squares (RSS) sum of the jitter from all sources, including: the
ADC input clock, system, input signals and the ADC itself. Since the effective jitter added by the ADC is
beyond user control, it is recommended to keep the sum of all other externally added jitter to a minimum.
6.4.2.6
CLK Layout
The ADC12D1800RF clock input is internally terminated with a trimmed 100Ω resistor. The differential
input clock line pair should have a characteristic impedance of 100Ω and (when using a balun), be
terminated at the clock source in that (100Ω) characteristic impedance.
It is good practice to keep the ADC input clock line as short as possible, tightly coupled, keep it well away
from any other signals, and treat it as a transmission line. Otherwise, other signals can introduce jitter into
the input clock signal. Also, the clock signal can introduce noise into the analog path if it is not properly
isolated.
6.4.3
THE LVDS OUTPUTS
The Data, ORI, ORQ, DCLKI and DCLKQ outputs are LVDS. The electrical specifications of the LVDS
outputs are compatible with typical LVDS receivers available on ASIC and FPGA chips; but they are not
IEEE or ANSI communications standards compliant due to the low +1.9V supply used on this chip. These
outputs should be terminated with a 100Ω differential resistor placed as closely to the receiver as possible.
If the 100Ω differential resistor is built in to the receiver, then an externally placed resistor is not
necessary. This section covers common-mode and differential voltage, and data rate.
6.4.3.1
Common-mode and Differential Voltage
The LVDS outputs have selectable common-mode and differential voltage, VOS and VOD; see Converter
Electrical Characteristics Digital Control and Output Pin Characteristics. See Output Control and Adjust for
more information.
Selecting the higher VOS will also increase VOD slightly. The differential voltage, VOD, may be selected for
the higher or lower value. For short LVDS lines and low noise systems, satisfactory performance may be
realized with the lower VOD. This will also result in lower power consumption. If the LVDS lines are long
and/or the system in which the ADC12D1800RF is used is noisy, it may be necessary to select the higher
VOD.
6.4.3.2
Output Data Rate
The data is produced at the output at the same rate it is sampled at the input. The minimum
recommended input clock rate for this device is fCLK(MIN); see Converter Electrical Characteristics AC
Electrical Characteristics. However, it is possible to operate the device in 1:2 Demux Mode and capture
data from just one 12-bit bus, e.g. just DI (or DId) although both DI and DId are fully operational. This will
decimate the data by two and effectively halve the data rate.
6.4.3.3
Terminating Unused LVDS Output Pins
If the ADC is used in Non-Demux Mode, then only the DI and DQ data outputs will have valid data present
on them. The DId and DQd data outputs may be left not connected; if unused, they are internally at TRISTATE.
Similarly, if the Q-channel is powered-down (i.e. PDQ is logic-high), the DQ data output pins, DCLKQ and
ORQ may be left not connected.
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SYNCHRONIZING MULTIPLE ADC12D1800RFS IN A SYSTEM
The ADC12D1800RF has two features to assist the user with synchronizing multiple ADCs in a system;
AutoSync and DCLK Reset. The AutoSync feature and designates one ADC12D1800RF as the Master
ADC and other ADC12D1800RFs in the system as Slave ADCs. The DCLK Reset feature performs the
same function as the AutoSync feature, but is the first generation solution to synchronizing multiple ADCs
in a system; it is disabled by default. For the application in which there are multiple Master and Slave
ADC12D1800RFs in a system, AutoSync may be used to synchronize the Slave ADC12D1800RF(s) to
each respective Master ADC12D1800RF and the DCLK Reset may be used to synchronize the Master
ADC12D1800RFs to each other.
If the AutoSync or DCLK Reset feature is not used, see Table 6-10 for recommendations about
terminating unused pins.
Table 6-10. Unused AutoSync and DCLK Reset Pin
Recommendation
6.4.4.1
Pin(s)
Unused termination
RCLK+/-
Do not connect.
RCOUT1+/-
Do not connect.
RCOUT2+/-
Do not connect.
DCLK_RST+
Connect to GND via 1kΩ resistor.
DCLK_RST-
Connect to VA via 1kΩ resistor.
AutoSync Feature
AutoSync is a feature which continuously synchronizes the outputs of multiple ADC12D1800RFs in a
system. It may be used to synchronize the DCLK and data outputs of one or more Slave
ADC12D1800RFs to one Master ADC12D1800RF. Several advantages of this feature include: no special
synchronization pulse required, any upset in synchronization is recovered upon the next DCLK cycle, and
the Master / Slave ADC12D1800RFs may be arranged as a binary tree so that any upset will quickly
propagate out of the system.
An example system is shown below in Figure 6-9 which consists of one Master ADC and two Slave ADCs.
For simplicity, only one DCLK is shown; in reality, there is DCLKI and DCLKQ, but they are always in
phase with one another.
Master
ADC12D1XXX
RCOut1
RCOut2
CLK
DCLK
Slave 2
ADC12D1XXX
RCLK
RCOut1
RCOut2
CLK
RCLK
Slave 1
ADC12D1XXX
DCLK
RCOut1
CLK
RCLK
RCOut2
DCLK
CLK
Figure 6-9. AutoSync Example
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In order to synchronize the DCLK (and Data) outputs of multiple ADCs, the DCLKs must transition at the
same time, as well as be in phase with one another. The DCLK at each ADC is generated from the CLK
after some latency, plus tOD minus tAD. Therefore, in order for the DCLKs to transition at the same time,
the CLK signal must reach each ADC at the same time. To tune out any differences in the CLK path to
each ADC, the tAD adjust feature may be used. However, using the tAD adjust feature will also affect when
the DCLK is produced at the output. If the device is in Demux Mode, then there are four possible phases
which each DCLK may be generated on because the typical CLK = 1.8 GHz and DCLK = 450 MHz for this
case. The RCLK signal controls the phase of the DCLK, so that each Slave DCLK is on the same phase
as the Master DCLK.
The AutoSync feature may only be used via the Control Registers. For more information, see AN-2132.
6.4.4.2
DCLK Reset Feature
The DCLK reset feature is available via ECM, but it is disabled by default. DCLKI and DCLKQ are always
synchronized, by design, and do not require a pulse from DCLK_RST to become synchronized.
The DCLK_RST signal must observe certain timing requirements, which are shown in Figure 4-7 of the
Timing Diagrams. The DCLK_RST pulse must be of a minimum width and its deassertion edge must
observe setup and hold times with respect to the CLK input rising edge. These timing specifications are
listed as tPWR, tSR and tHR and may be found in Converter Electrical Characteristics AC Electrical
Characteristics.
The DCLK_RST signal can be asserted asynchronously to the input clock. If DCLK_RST is asserted, the
DCLK output is held in a designated state (logic-high) in Demux Mode; in Non-Demux Mode, the DCLK
continues to function normally. Depending upon when the DCLK_RST signal is asserted, there may be a
narrow pulse on the DCLK line during this reset event. When the DCLK_RST signal is de-asserted, there
are tSYNC_DLY CLK cycles of systematic delay and the next CLK rising edge synchronizes the DCLK output
with those of other ADC12D1800RFs in the system. For 90° Mode (DDRPh = logic-high), the
synchronizing edge occurs on the rising edge of CLK, 4 cycles after the first rising edge of CLK after
DCLK_RST is released. For 0° Mode (DDRPh = logic-low), this is 5 cycles instead. The DCLK output is
enabled again after a constant delay of tOD.
For both Demux and Non-Demux Modes, there is some uncertainty about how DCLK comes out of the
reset state for the first DCLK_RST pulse. For the second (and subsequent) DCLK_RST pulses, the DCLK
will come out of the reset state in a known way. Therefore, if using the DCLK Reset feature, it is
recommended to apply one "dummy" DCLK_RST pulse before using the second DCLK_RST pulse to
synchronize the outputs. This recommendation applies each time the device or channel is powered-on.
When using DCLK_RST to synchronize multiple ADC12D1800RFs, it is required that the Select Phase
bits in the Control Register (Addr: Eh, Bits 3,4) be the same for each Master ADC12D1800RF.
6.4.5
SUPPLY / GROUNDING, LAYOUT AND THERMAL RECOMMENDATIONS
6.4.5.1
Power Planes
All supply buses for the ADC should be sourced from a common linear voltage regulator. This ensures
that all power buses to the ADC are turned on and off simultaneously. This single source will be split into
individual sections of the power plane, with individual decoupling and connection to the different power
supply buses of the ADC. Due to the low voltage but relatively high supply current requirement, the
optimal solution may be to use a switching regulator to provide an intermediate low voltage, which is then
regulated down to the final ADC supply voltage by a linear regulator. Please refer to the documentation
provided for the ADC12D1800RFRB for additional details on specific regulators that are recommended for
this configuration.
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Power for the ADC should be provided through a broad plane which is located on one layer adjacent to
the ground plane(s). Placing the power and ground planes on adjacent layers will provide low impedance
decoupling of the ADC supplies, especially at higher frequencies. The output of a linear regulator should
feed into the power plane through a low impedance multi-via connection. The power plane should be split
into individual power peninsulas near the ADC. Each peninsula should feed a particular power bus on the
ADC, with decoupling for that power bus connecting the peninsula to the ground plane near each power /
ground pin pair. Using this technique can be difficult on many printed circuit CAD tools. To work around
this, zero ohm resistors can be used to connect the power source net to the individual nets for the different
ADC power buses. As a final step, the zero ohm resistors can be removed and the plane and peninsulas
can be connected manually after all other error checking is completed.
6.4.5.2
Bypass Capacitors
The general recommendation is to have one 100nF capacitor for each power / ground pin pair. The
capacitors should be surface mount multi-layer ceramic chip capacitors similar to Panasonic part number
ECJ-0EB1A104K.
6.4.5.3
Ground Planes
Grounding should be done using continuous full ground planes to minimize the impedance for all ground
return paths, and provide the shortest possible image/return path for all signal traces.
6.4.5.4
Power System Example
The ADC12D1800RFRB uses continuous ground planes (except where clear areas are needed to provide
appropriate impedance management for specific signals), see Figure 6-10. Power is provided on one
plane, with the 1.9V ADC supply being split into multiple zones or peninsulas for the specific power buses
of the ADC. Decoupling capacitors are connected between these power bus peninsulas and the adjacent
ground planes using vias. The capacitors are located as close to the individual power / ground pin pairs of
the ADC as possible. In most cases, this means the capacitors are located on the opposite side of the
PCB to the ADC.
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Linear
Regulator
Cross Section
Line
HV or Unreg
Voltage
Switching
Regulator
Intermediate
Voltage
1.9V ADC Main
VTC VA
VE
VDR
ADC
Top Layer ± Signal 1
Dielectric 1
Ground 1
Dielectric 2
Signal 2
Dielectric 3
Ground 2
Dielectric 4
Signal 3
Dielectric 5
Power 1
Dielectric 6
Ground 3
Dielectric 7
Bottom Layer ± Signal X
Figure 6-10. Power and Grounding Example
6.4.5.5
Thermal Management
The Heat Slug Ball Grid Array (HSBGA) package is a modified version of the industry standard plastic
BGA (Ball Grid Array) package. Inside the package, a copper heat spreader cap is attached to the
substrate top with exposed metal in the center top area of the package. This results in a 20%
improvement (typical) in thermal performance over the standard plastic BGA package.
4JC_1
Copper Heat Slug
Mold Compound
Not to Scale
Cross Section Line
IC Die
Substrate
4JC_2
Figure 6-11. HSBGA Conceptual Drawing
The center balls are connected to the bottom of the die by vias in the package substrate, Figure 6-11. This
gives a low thermal resistance between the die and these balls. Connecting these balls to the PCB ground
planes with a low thermal resistance path is the best way dissipate the heat from the ADC. These pins
should also be connected to the ground plane via a low impedance path for electrical purposes. The direct
connection to the ground planes is an easy method to spread heat away from the ADC. Along with the
ground plane, the parallel power planes will provide additional thermal dissipation.
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The center ground balls should be soldered down to the recommended ball pads (See AN-1126). These
balls will have wide traces which in turn have vias which connect to the internal ground planes, and a
bottom ground pad / pour if possible. This ensures a good ground is provided for these balls, and that the
optimal heat transfer will occur between these balls and the PCB ground planes.
In spite of these package enhancements, analysis using the standard JEDEC JESD51-7 four-layer PCB
thermal model shows that ambient temperatures must be limited to a max of 65°C to ensure a safe
operating junction temperature for the ADC12D1800RF. However, most applications using the
ADC12D1800RF will have a printed circuit board which is more complex than that used in JESD51-7.
Typical circuit boards will have more layers than the JESD51-7 (eight or more), several of which will be
used for ground and power planes. In those applications, the thermal resistance parameters of the
ADC12D1800RF and the circuit board can be used to determine the actual safe ambient operating
temperature up to a maximum of 85°C.
Three key parameters are provided to allow for modeling and calculations. Because there are two main
thermal paths between the ADC die and external environment, the thermal resistance for each of these
paths is provided. θJC1 represents the thermal resistance between the die and the exposed metal area on
the top of the HSBGA package. θJC2 represents the thermal resistance between the die and the center
group of balls on the bottom of the HSBGA package. The final parameter is the allowed maximum junction
temperature, which is TJ.
In other applications, a heat sink or other thermally conductive path can be added to the top of the
HSBGA package to remove heat. In those cases, θJC1 can be used along with the thermal parameters for
the heat sink or other thermal coupling added. Representative heat sinks which might be used with the
ADC12D1800RF include the Cool Innovations p/n 3-1212XXG and similar products from other vendors. In
many applications, the printed circuit board will provide the primary thermal path conducting heat away
from the ADC package. In those cases, θJC2 can be used in conjunction with printed circuit board thermal
modeling software to determine the allowed operating conditions that will maintain the die temperature
below the maximum allowable limit. Additional dissipation can be achieved by coupling a heat sink to the
copper pour area on the bottom side of the printed circuit board.
Typically, dissipation will occur through one predominant thermal path. In these cases, the following
calculations can be used to determine the maximum safe ambient operating temperature:
TJ = TA + PD × (θJC+θCA)
TJ = TA + PC(MAX) × (θJC+θCA)
For θJC, the value for the primary thermal path in the given application environment should be used (θJC1
or θJC2). θCA is the thermal resistance from the case to ambient, which would typically be that of the heat
sink used. Using this relationship and the desired ambient temperature, the required heat sink thermal
resistance can be found. Alternately, the heat sink thermal resistance can be used to find the maximum
ambient temperature. For more complex systems, thermal modeling software can be used to evaluate the
printed circuit board system and determine the expected junction temperature given the total system
dissipation and ambient temperature.
6.4.6
SYSTEM POWER-ON CONSIDERATIONS
There are a couple important topics to consider associated with the system power-on event including
configuration and calibration, and the Data Clock.
6.4.6.1
Power-on, Configuration, and Calibration
Following the application of power to the ADC12D1800RF, several events must take place before the
output from the ADC12D1800RF is valid and at full performance; at least one full calibration must be
executed with the device configured in the desired mode.
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Following the application of power to the ADC12D1800RF, there is a delay of tCalDly and then the Poweron Calibration is executed. This is why it is recommended to set the CalDly Pin via an external pull-up or
pull-down resistor. This ensured that the state of that input will be properly set at the same time that power
is applied to the ADC and tCalDly will be a known quantity. For the purpose of this section, it is assumed
that CalDly is set as recommended.
The Control Bits or Pins must be set or written to configure the ADC12D1800RF in the desired mode. This
must take place via either Extended Control Mode or Non-ECM (Pin Control Mode) before subsequent
calibrations will yield an output at full performance in that mode. Some examples of modes include
DES/Non-DES Mode, Demux/Non-demux Mode, and Full-Scale Range.
The simplest case is when device is in Non-ECM and the Control Pins are set by pull-up / down resistors,
see Figure 6-12. For this case, the settings to the Control Pins ramp concurrently to the ADC voltage.
Following the delay of tCalDly and the calibration execution time, tCAL, the output of the ADC12D1800RF is
valid and at full performance. If it takes longer than tCalDly for the system to stabilize at its operating
temperature, it is recommended to execute an on-command calibration at that time.
Another case is when the FPGA configures the Control Pins (Non-ECM) or writes to the SPI (ECM), see
Figure 6-13. It is always necessary to comply with the Operating Ratings and Absolute Maximum ratings,
i.e. the Control Pins may not be driven below the ground or above the supply, regardless of what the
voltage currently applied to the supply is. Therefore, it is not recommended to write to the Control Pins or
SPI before power is applied to the ADC12D1800RF. As long as the FPGA has completed writing to the
Control Pins or SPI, the Power-on Calibration will result in a valid output at full performance. Once again,
if it takes longer than tCalDly for the system to stabilize at its operating temperature, it is recommended to
execute an on-command calibration at that time.
Due to system requirements, it may not be possible for the FPGA to write to the Control Pins or SPI
before the Power-on Calibration takes place, see Figure 6-14. It is not critical to configure the device
before the Power-on Calibration, but it is critical to realize that the output for such a case is not at its full
performance. Following an On-command Calibration, the device will be at its full performance.
Pull-up/down
resistors set
Control Pins
Power to
ADC
CalDly
ADC output
valid
Calibration
Power-on
Calibration
On-command
Calibration
Figure 6-12. Power-on with Control Pins set by Pull-up / down Resistors
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FPGA writes
Control Pins
Power to
ADC
ADC output
valid
CalDly
Calibration
Power-on
Calibration
On-command
Calibration
Figure 6-13. Power-on with Control Pins set by FPGA pre Power-on Cal
FPGA writes
Control Pins
Power to
ADC
CalDly
Calibration
Power-on
Calibration
On-command
Calibration
Figure 6-14. Power-on with Control Pins set by FPGA post Power-on Cal
6.4.6.2
Power-on and Data Clock (DCLK)
Many applications use the DCLK output for a system clock. For the ADC12D1800RF, each I- and Qchannel has its own DCLKI and DCLKQ, respectively. The DCLK output is always active, unless that
channel is powered-down or the DCLK Reset feature is used while the device is in Demux Mode. As the
supply to the ADC12D1800RF ramps, the DCLK also comes up, see this example from the
ADC12D1800RFRB: Figure 6-15. While the supply is too low, there is no output at DCLK. As the supply
continues to ramp, DCLK functions intermittently with irregular frequency, but the amplitude continues to
track with the supply. Much below the low end of operating supply range of the ADC12D1800RF, the
DCLK is already fully operational.
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Slope = 1.22V/ms
1900
1710
VA
1490
1210
660
635
520
DCLK
300
time
Figure 6-15. Supply and DCLK Ramping
6.4.7
RECOMMENDED SYSTEM CHIPS
TI recommends these other chips including temperature sensors, clocking devices, and amplifiers in order
to support the ADC12D1800RF in a system design.
6.4.7.1
Temperature Sensor
The ADC12D1800RF has an on-die temperature diode connected to pins Tdiode+/- which may be used to
monitor the die temperature. TI also provides a family of temperature sensors for this application which
monitor different numbers of external devices, see Table 6-11.
Table 6-11. Temperature Sensor Recommendation
Number of External Devices
Monitored
Recommended Temperature Sensor
1
LM95235
2
LM95213
4
LM95214
The temperature sensor (LM95235/13/14) is an 11-bit digital temperature sensor with a 2-wire System
Management Bus (SMBus) interface that can monitor the temperature of one, two, or four remote diodes
as well as its own temperature. It can be used to accurately monitor the temperature of up to one, two, or
four external devices such as the ADC12D1800RF, a FPGA, other system components, and the ambient
temperature.
The temperature sensor reports temperature in two different formats for +127.875°C/-128°C range and
0°/255°C range. It has a Sigma-Delta ADC core which provides the first level of noise immunity. For
improved performance in a noisy environment, the temperature sensor includes programmable digital
filters for Remote Diode temperature readings. When the digital filters are invoked, the resolution for the
Remote Diode readings increases to 0.03125°C. For maximum flexibility and best accuracy, the
temperature sensor includes offset registers that allow calibration for other types of diodes.
Diode fault detection circuitry in the temperature sensor can detect the absence or fault state of a remote
diode: whether D+ is shorted to the power supply, D- or ground, or floating.
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In the following typical application, the LM95213 is used to monitor the temperature of an ADC12D1800RF
as well as an FPGA, see Figure 6-16. If this feature is unused, the Tdiode+/- pins may be left floating.
7
ADC12D1XXX
IE = IF
D1+
100 pF
IR
5
IE = IF
FPGA
D-
100 pF
6
D2+
IR
LM95213
Figure 6-16. Typical Temperature Sensor Application
6.4.7.2
Clocking Device
The clock source can be a PLL/VCO device such as the LMX2531LQxxxx family of products. The specific
device should be selected according to the desired ADC sampling clock frequency. The
ADC12D1800RFRB uses the LMX2531LQ1778E, with the ADC clock source provided by the Aux PLL
output. Other devices which may be considered based on clock source, jitter cleaning, and distribution
purposes are the LMK01XXX, LMK02XXX, LMK03XXX and LMK04XXX product families.
6.4.7.3
Amplifiers for Analog Input
The following amplifiers can be used for ADC12D1800RF applications which require DC coupled input or
signal gain, neither of which can be provided with a transformer coupled input circuit:
Table 6-12. Amplifier Recommendation
6.4.7.4
Amplifier
Bandwidth
Brief features
LMH6552
1.5 GHz
Configurable gain
LMH6553
900 MHz
Output clamp and configurable gain
LMH6554
2.8 GHz
Configurable gain
LMH6555
1.2 GHz
Fixed gain
Balun Recommendations for Analog Input
The following baluns are recommended for the ADC12D1800RF for applications which require no gain.
When evaluating a balun for the application of driving an ADC, some important qualities to consider are
phase error and magnitude error.
Table 6-13. Balun Recommendations
68
Balun
Bandwidth
Mini-Circuits TC1-1-13MA+
4.5 - 3000 MHz
Anaren B0430J50100A00
400 - 3000 MHz
Mini-Circuits ADTL2-18
30 - 1800 MHz
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Register Definitions
Twelve read / write registers provide several control and configuration options in the Extended Control
Mode. These registers have no effect when the device is in the Non-extended Control Mode. Each register
description below also shows the Power-On Reset (POR) state of each control bit. See Table 6-14 for a
summary. For a description of the functionality and timing to read / write the control registers, see The
Serial Interface.
NOTE
Register 6h must be written to 1C0Eh for the device to perform at full rated performance for
Fclk > 1.6GHz.
Table 6-14. Register Addresses
A3
A2
A1
A0
Hex
Register Addressed
0
0
0
0
0h
Configuration Register 1
0
0
0
1
1h
Reserved
0
0
1
0
2h
I-channel Offset
0
0
1
1
3h
I-channel Full-Scale Range
0
1
0
0
4h
Calibration Adjust
0
1
0
1
5h
Calibration Values
0
1
1
0
6h
Bias Adjust
0
1
1
1
7h
DES Timing Adjust
1
0
0
0
8h
Reserved
1
0
0
1
9h
Reserved
1
0
1
0
Ah
Q-channel Offset
1
0
1
1
Bh
Q-channel Full-Scale Range
1
1
0
0
Ch
Aperture Delay Coarse Adjust
1
1
0
1
Dh
Aperture Delay Fine Adjust
1
1
1
0
Eh
AutoSync
1
1
1
1
Fh
Reserved
Table 6-15. Configuration Register 1
Addr: 0h (0000b)
POR state: 2000h
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Name
CAL
DPS
OVS
TPM
PDI
PDQ
Res
LFS
DES
DEQ
DIQ
2SC
TSE
SDR
POR
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
Res
0
0
Bit 15
CAL: Calibration Enable. When this bit is set to 1b, an on-command calibration is initiated. This bit is not reset automatically
upon completion of the calibration. Therefore, the user must reset this bit to 0b and then set it to 1b again to execute another
calibration. This bit is logically OR'd with the CAL Pin; both bit and pin must be set to 0b before either is used to execute a
calibration. (1)
Bit 14
DPS: DCLK Phase Select. In DDR Mode, set this bit to 0b to select the 0° Mode DDR Data-to-DCLK phase relationship and to
1b to select the 90° Mode. In SDR Mode, set this bit to 0b to transition the data on the Rising edge of DCLK; set this bit to 1b
to transition the data on the Falling edge of DCLK.
Bit 13
OVS: Output Voltage Select. This bit sets the differential voltage level for the LVDS outputs including Data, OR, and DCLK. 0b
selects the lower level and 1b selects the higher level. See VOD in Converter Electrical Characteristics Digital Control and
Output Pin Characteristics for details.
Bit 12
TPM: Test Pattern Mode. When this bit is set to 1b, the device will continually output a fixed digital pattern at the digital Data
and OR outputs. When set to 0b, the device will continually output the converted signal, which was present at the analog
inputs. See Test Pattern Mode for details about the TPM pattern.
(1)
This pin / bit functionality is not tested in production test; performance is tested in the specified / default mode only.
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Bit 11
PDI: Power-down I-channel. When this bit is set to 0b, the I-channel is fully operational; when it is set to 1b, the I-channel is
powered-down. The I-channel may be powered-down via this bit or the PDI Pin, which is active, even in ECM.
Bit 10
PDQ: Power-down Q-channel. When this bit is set to 0b, the Q-channel is fully operational; when it is set to 1b, the Q-channel
is powered-down. The Q-channel may be powered-down via this bit or the PDQ Pin, which is active, even in ECM.
Bit 9
Reserved. Must be set to 0b.
Bit 8
LFS: Low-Frequency Select. If the sampling clock (CLK) is at or below 300 MHz, set this bit to 1b for improved performance.
Bit 7
DES: Dual-Edge Sampling Mode select. When this bit is set to 0b, the device will operate in the Non-DES Mode; when it is set
to 1b, the device will operate in the DES Mode. See DES/Non-DES Mode for more information.
Bit 6
DEQ: DES Q-input select, a.k.a. DESQ Mode. When the device is in DES Mode, this bit selects the input that the device will
operate on. The default setting of 0b selects the I-input and 1b selects the Q-input.
Bit 5
DIQ: DES I- and Q-input, a.k.a. DESIQ Mode. When in DES Mode, setting this bit to 1b shorts the I- and Q-inputs internally to
the device. If the bit is left at its default 0b, the I- and Q-inputs remain electrically separate. To operate the device in DESIQ
Mode, Bits<7:5> must be set to 101b. In this mode, both the I- and Q-inputs must be externally driven; see DES/Non-DES
Mode for more information.
The allowed DES Modes settings are shown below: For DESCLKIQ Mode, see Addr Eh.
Mode
Addr 0h, Bits<7:5>
Addr Eh, Bit<6>
Non-DES Mode
000b
0b
DESI Mode
100b
0b
DESQ Mode
110b
0b
DESIQ Mode
101b
0b
DESCLKIQ Mode
000b
1b
Bit 4
2SC: Two's Complement output. For the default setting of 0b, the data is output in Offset Binary format; when set to 1b, the
data is output in Two's Complement format. (2)
Bit 3
TSE: Time Stamp Enable. For the default setting of 0b, the Time Stamp feature is not enabled; when set to 1b, the feature is
enabled. See Output Control and Adjust for more information about this feature.
Bit 2
SDR: Single Data Rate. For the default setting of 0b, the data is clocked in Dual Data Rate; when set to 1b, the data is clocked
in Single Data Rate. See Output Control and Adjust for more information about this feature. Note that for Non-Demux Mode,
only 0° DDR Mode is available. See Table 6-5 for a selection of available modes.
Bits 1:0
Reserved. Must be set as shown.
(2)
This pin / bit functionality is not tested in production test; performance is tested in the specified / default mode only.
Table 6-16. Reserved
Addr: 1h (0001b)
Bit
POR state: 2907h
15
14
13
12
11
10
9
8
0
0
1
0
1
0
0
1
Name
7
6
5
4
3
2
1
0
0
0
0
0
0
1
1
1
5
4
3
2
1
0
0
0
0
0
0
Res
POR
Bits 15:0
Reserved. Must be set as shown.
Table 6-17. I-channel Offset Adjust
Addr: 2h (0010b)
Bit
POR state: 0000h
15
Name
14
13
Res
POR
0
0
12
11
10
9
8
7
OS
0
0
6
OM(11:0)
0
0
0
0
0
0
0
Bits 15:13
Reserved. Must be set to 0b.
Bit 12
OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting
this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0
OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding).
The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of ~11 µV. Monotonicity is specified by
design only for the 9 MSBs.
70
Code
Offset [mV]
0000 0000 0000 (default)
0
1000 0000 0000
22.5
1111 1111 1111
45
Functional Description
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Table 6-18. I-channel Full Scale Range Adjust
Addr: 3h (0011b)
Bit
15
Name
Res
POR
0
POR state: 4000h
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
FM(14:0)
1
0
0
0
0
0
0
0
Bit 15
Reserved. Must be set to 0b.
Bits 14:0
FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The allowable
range is from 800 mV (16384d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by
design only for the 9 MSBs. A greater range of FSR values is available in ECM, i.e. FSR values above 800 mV. See VIN_FSR in
Converter Electrical Characteristics Analog Input / Output and Reference Characteristics for characterization details.
Code
FSR [mV]
100 0000 0000 0000 (default)
800
111 1111 1111 1111
1000
Table 6-19. Calibration Adjust (1)
Addr: 4h (0100b)
POR state: DB4Bh
Bit
15
14
Name
Res
CSS
POR
1
1
13
12
11
10
9
8
Res
0
1
1
7
6
5
4
SSC
0
1
1
0
3
2
1
0
0
1
1
Res
1
0
0
1
(1) This feature functionality is not tested in production test; performance is tested in the specified / default mode only.
Bit 15
Reserved. Must be set as shown.
Bit 14
CSS: Calibration Sequence Select. The default 1b selects the following calibration sequence: reset all previously calibrated
elements to nominal values, do RIN Calibration, do internal linearity Calibration. Setting CSS = 0b selects the following
calibration sequence: do not reset RIN to its nominal value, skip RIN calibration, do internal linearity Calibration. The calibration
must be completed at least one time with CSS = 1b to calibrate RIN. Subsequent calibrations may be run with CSS = 0b (skip
RIN calibration) or 1b (full RIN and internal linearity Calibration).
Bits 13:8
Reserved. Must be set as shown.
Bit 7
SSC: SPI Scan Control. Setting this control bit to 1b allows the calibration values, stored in Addr: 5h, to be read / written.
When not reading / writing the calibration values, this control bit should left at its default 0b setting. See Calibration Feature for
more information.
Bits 6:0
Reserved. Must be set as shown.
Table 6-20. Calibration Values (1)
Addr: 5h (0101b)
Bit
15
POR state: XXXXh
14
13
12
11
10
9
Name
POR
(1)
8
7
6
5
4
3
2
1
0
X
X
X
X
X
X
X
SS(15:0)
X
X
X
X
X
X
X
X
X
This feature functionality is not tested in production test; performance is tested in the specified / default mode only.
Bits 15:0
SS(15:0): SPI Scan. When the ADC performs a self-calibration, the values for the calibration are stored in this register and may
be read from/ written to it. Set SSC (Addr: 4h, Bit 7) to read / write. See Calibration Feature for more information.
Functional Description
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Table 6-21. Bias Adjust
Addr: 6h (0110b)
Bit
POR state: 1C2Eh
15
14
13
12
11
10
9
Name
8
7
6
5
4
3
2
1
0
0
1
0
1
1
1
0
MPA(15:0)
POR
0
Bits 15:0
0
0
1
1
1
0
0
0
MPA(15:0): Max Power Adjust. This register must be written to 1C0Eh to achieve full rated performance for Fclk >
1.6GHz.
Table 6-22. DES Timing Adjust
Addr: 7h (0111b)
Bit
POR state: 8142h
15
14
13
1
0
0
Name
12
11
10
9
8
7
6
5
0
0
0
1
0
1
0
DTA(6:0)
POR
0
4
3
2
1
0
0
0
1
0
Res
0
Bits 15:9
DTA(6:0): DES Mode Timing Adjust. In the DES Mode, the time at which the falling edge sampling clock samples relative to
the rising edge of the sampling clock may be adjusted; the automatic duty cycle correction continues to function. See Input
Control and Adjust for more information. The nominal step size is 30fs.
Bits 8:0
Reserved. Must be set as shown.
Table 6-23. Reserved
Addr: 8h (1000b)
Bit
POR state: 0F0Fh
15
14
13
12
11
10
9
8
Name
7
6
5
4
3
2
1
0
0
0
0
0
1
1
1
1
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
5
4
3
2
1
0
0
0
0
0
0
Res
POR
0
Bits 15:0
0
0
0
1
1
1
1
Reserved. Must be set as shown.
Table 6-24. Reserved
Addr: 9h (1001b)
Bit
POR state: 0000h
15
14
13
12
11
10
9
8
Name
Res
POR
0
Bits 15:0
0
0
0
0
0
0
0
Reserved. Must be set as shown.
Table 6-25. Q-channel Offset Adjust
Addr: Ah (1010b)
Bit
POR state: 0000h
15
Name
14
13
Res
POR
0
0
12
11
10
9
8
7
6
0
0
0
0
0
0
OS
0
0
OM(11:0)
0
Bits 15:13
Reserved. Must be set to 0b.
Bit 12
OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting
this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0
OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding).
The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of ~11 µV. Monotonicity is specified by
design only for the 9 MSBs.
72
Code
Offset [mV]
0000 0000 0000 (default)
0
1000 0000 0000
22.5
1111 1111 1111
45
Functional Description
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Table 6-26. Q-channel Full-Scale Range Adjust
Addr: Bh (1011b)
Bit
15
Name
Res
POR
0
POR state: 4000h
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
FM(14:0)
1
0
0
0
0
0
0
0
Bit 15
Reserved. Must be set to 0b.
Bits 14:0
FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The allowable
range is from 800 mV (16384d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by
design only for the 9 MSBs. A greater range of FSR values is available in ECM, i.e. FSR values above 800 mV. See VIN_FSR in
Converter Electrical Characteristics Analog Input / Output and Reference Characteristics for characterization details.
Code
FSR [mV]
100 0000 0000 0000 (default)
800
111 1111 1111 1111
1000
Table 6-27. Aperture Delay Coarse Adjust
Addr: Ch (1100b)
Bit
15
POR state: 0004h
14
13
12
11
Name
10
9
8
7
6
5
4
CAM(11:0)
POR
0
0
0
0
0
0
0
0
0
0
0
3
2
STA
DCC
0
1
0
1
0
Res
0
0
Using the tAD Adjust feature at its maximum setting, for the maximum sampling clock rate, may affect the
integrity of the sampling clock on chip. Therefore, it is not recommended to do so. The maximum setting
for the coarse adjust is 825ps. The period for the maximum sampling clock rate of is 555ps, so it should
not be necessary to exceed this value in any case.
Bits 15:4
CAM(11:0): Coarse Adjust Magnitude. This 12-bit value determines the amount of delay that will be applied to the input CLK
signal. The range is 0 ps delay for CAM(11:0) = 0d to a maximum delay of 825 ps for CAM(11:0) = 2431d (±95 ps due to PVT
variation) in steps of ~340 fs. For code CAM(11:0) = 2432d and above, the delay saturates and the maximum delay applies.
Additional, finer delay steps are available in register Dh. The STA (Bit 3) must be selected to enable this function.
Bit 3
STA: Select tAD Adjust. Set this bit to 1b to enable the tAD adjust feature, which will make both coarse and fine adjustment
settings, i.e. CAM(11:0) and FAM(5:0), available.
Bit 2
DCC: Duty Cycle Correct. This bit can be set to 0b to disable the automatic duty-cycle stabilizer feature of the chip. This
feature is enabled by default.
Bits 1:0
Reserved. Must be set to 0b.
Table 6-28. Aperture Delay Fine Adjust (1)
Addr: Dh (1101b)
Bit
15
POR state: 0000h
14
Name
12
11
10
9
FAM(5:0)
POR
(1)
13
0
0
0
0
8
7
6
5
4
Res
0
0
0
3
2
1
0
0
0
0
0
Res
0
0
0
0
0
This feature functionality is not tested in production test; performance is tested in the specified / default mode only.
Using the tAD Adjust feature at its maximum setting, for the maximum sampling clock rate, may affect the
integrity of the sampling clock on chip. Therefore, it is not recommended to do so. The maximum setting
for the coarse adjust is 825ps. The period for the maximum sampling clock rate of is 555ps, so it should
not be necessary to exceed this value in any case.
Bits 15:10
FAM(5:0): Fine Aperture Adjust Magnitude. This 6-bit value determines the amount of additional delay that will be applied to
the input CLK when the Clock Phase Adjust feature is enabled via STA (Addr: Ch, Bit 3). The range is straight binary from 0 ps
delay for FAM(5:0) = 0d to 2.3 ps delay for FAM(5:0) = 63d (±300 fs due to PVT variation) in steps of ~36 fs.
Bits 9:0
Reserved. Must be set as shown.
Functional Description
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Table 6-29. AutoSync
Addr: Eh (1110b)
Bit
15
POR state: 0003h
14
13
12
Name
11
10
9
8
7
DRC(8:0)
POR
0
0
0
0
0
0
0
0
0
6
5
DCK
Res
0
0
4
3
SP(1:0)
0
0
2
1
0
ES
DOC
DR
0
1
1
Bits 15:7
DRC(8:0): Delay Reference Clock (9:0). These bits may be used to increase the delay on the input reference clock when
synchronizing multiple ADCs. The minimum delay is 0s (0d) to 1200 ps (319d). The delay remains the maximum of 1200 ps for
any codes above or equal to 639d. See SYNCHRONIZING MULTIPLE ADC12D1800RFS IN A SYSTEM for more information.
Bit 6
DCK: DESCLKIQ Mode. Set this bit to 1b to enable Dual-Edge Sampling, in which the Sampling Clock samples the I- and Qchannels 180° out of phase with respect to one another, i.e. the DESCLKIQ Mode. To select the DESCLKIQ Mode, Addr: 0h,
Bits<7:5> must also be set to 000b. See DES/Non-DES Mode for more information.
Bit 5
Reserved. Must be set as shown.
Bits 4:3
SP(1:0): Select Phase. These bits select the phase of the reference clock which is latched. The codes correspond to the
following phase shift:
00 = 0°
01 = 90°
10 = 180°
11 = 270°
Bit 2
ES: Enable Slave. Set this bit to 1b to enable the Slave Mode of operation. In this mode, the internal divided clocks are
synchronized with the reference clock coming from the master ADC. The master clock is applied on the input pins RCLK. If this
bit is set to 0b, then the device is in Master Mode.
Bit 1
DOC: Disable Output reference Clocks. Setting this bit to 0b sends a CLK/4 signal on RCOut1 and RCOut2. The default
setting of 1b disables these output drivers. This bit functions as described, regardless of whether the device is operating in
Master or Slave Mode, as determined by ES (Bit 2).
Bit 0
DR: Disable Reset. The default setting of 1b leaves the DCLK_RST functionality disabled. Set this bit to 0b to enable
DCLK_RST functionality.
Table 6-30. Reserved
Addr: Fh (1111b)
Bit
POR state: 001Dh
15
14
13
12
11
10
9
8
0
0
0
0
0
0
0
0
Name
6
5
4
3
2
1
0
0
0
0
1
1
1
0
1
Res
POR
Bits 15:0
74
7
Reserved. This address is read only.
Functional Description
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (April 2013) to Revision H
•
Changed layout of National Data Sheet to TI format
Page
..........................................................................
Functional Description
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75
PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
ADC12D1800RFIUT
ACTIVE
BGA
NXA
292
40
TBD
Call TI
Call TI
-40 to 85
ADC12D1800RFIUT
ADC12D1800RFIUT/NOPB
ACTIVE
BGA
NXA
292
40
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-3-250C-168 HR
-40 to 85
ADC12D1800RFIUT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
MECHANICAL DATA
NXA0292A
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