LINER LTC1267-ADJ5

LTC1267
LTC1267-ADJ/LTC1267-ADJ5
Dual High Efficiency
Synchronous Step-Down
Switching Regulators
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DESCRIPTIO
FEATURES
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The LTC®1267 series are dual synchronous step-down
switching regulator controllers featuring automatic Burst
ModeTM operation to maintain high efficiencies at low
output currents. The LTC1267 is composed of two separate regulator blocks, each driving a pair of external complementary power MOSFETs at switching frequencies up to
400kHz. The LTC1267 uses a constant off-time currentmode architecture to provide constant ripple current in the
inductor and provide excellent line and load transient
response.
Dual Outputs: 3.3V and 5V, Two Adjustables or
Adjustable and 5V
Wide VIN Range: 4V to 40V
Ultra-High Efficiency: Up to 95%
Low Supply Current in Shutdown: 20µA
Current Mode Operation for Excellent Line and Load
Transient Response
High Efficiency Maintained Over a Wide Output
Current Range
Independent Micropower Shutdown
Very Low Dropout Operation: 100% Duty Cycle
Synchronous FET Switching for High Efficiency
Available in Standard 28-Pin SSOP
A separate pin and on-board switch allow the MOSFET
driver power to be derived from the regulated output
voltage, providing significant efficiency improvement when
operating at high input voltage. The output current level is
user-programmable via an external current sense resistor.
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APPLICATI
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The LTC1267 series is ideal for applications requiring dual
output voltages with high conversion efficiencies over a
wide load current range in a small amount of board space.
Notebook and Palmtop Computers
Battery-Operated Digital Devices
Portable Instruments
DC Power Distribution Systems
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a trademark of Linear Technology Corporation.
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TYPICAL APPLICATI
+
CIN3
100µF
50V
VIN
5.4V to 25V
+
+
0.15µF
3.3µF
1N4148
VOUT3
3.3V
2A
L3
20µH
0.1µF
4
5
VCC3
CAP3
1
2
VCC
VIN
PGATE 3
PDRIVE 3
14
SENSE +
13
12
SENSE – 3
3
1000pF
D3
MBRS140T3
+
COUT3
220µF
10V
×2
6
N-CH
Si9410DY
+
1N4148
3
8
P-CH
Si9435DY
RSENSE3
0.05Ω
0.15µF
SHDN3
NGATE 3
PGND3 SGND3 CT3
7
11
9
27
26
28
21
MSHDN CAP5 EXT VCC VCC5
25
PGATE 5
24
PDRIVE 5
18
+
SENSE 5
LTC1267
17
SENSE – 5
19
SHDN5
23
NGATE 5
ITH3
10
ITH5
15
CT5
SGND5 PGND5
16
20
22
3.3µF
P-CH
Si9435DY
0.1µF
L5
33µH
RSENSE5
0.05Ω
RC3
1k
RC5
1k
SHDN3, SHDN5, MSHDN
0V = NORMAL, >2V = SHDN
VOUT5
5V
2A
1000pF
D5
MBRS140T3
N-CH
Si9410DY
+
CC3
CC5
CT5
CT3
270pF 3300pF 3300pF 270pF
RSENSE3: KRL SL-1R050J
L3: COILTRONICS CTX20-4
CIN5
100µF
50V
COUT5
220µF
10V
×2
RSENSE5: KRL SL-1R050J
L5: COILTRONICS CTX33-4
LTC1267 • F01
Figure 1. High Efficiency Dual 3.3V, 5V
1
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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W W
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Input Supply Voltage (Pin 2)..................... – 0.3V to 40V
VCC Output Current (Pin 1) .................................. 50mA
EXT VCC Input Voltage (Pin 28) .............................. 10V
Continuous Output Current (Pins 5, 6, 23, 24) .... 50mA
Sense Voltages
LTC1267 (Pins 13, 14, 17, 18) ............. VCC to – 0.3V
LTC1267-ADJ (Pins 12, 13, 17, 18) ..... VCC to – 0.3V
LTC1267-ADJ5 (Pins 12, 13, 17, 18) ... VCC to – 0.3V
Shutdown Voltages
LTC1267 (Pins 12, 19, 27) ................................... 7V
LTC1267-ADJ (Pins 11, 27) ................................. 7V
LTC1267-ADJ5 (Pins 11, 19, 27) ......................... 7V
Operating Ambient Temperature Range ...... 0°C to 70°C
Extended Commercial
Temperature Range ........................... – 40°C to 85°C
Junction Temperature (Note 1) ............................ 125°C
Storage Temperature Range ................ – 65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
TOP VIEW
VCC 1
28 EXT VCC
VIN 2
27 MSHDN
CAP1 3
ORDER PART
NUMBER
26 CAP2
LTC1267CG-ADJ
PACKAGE/ORDER I FOR ATIO
ORDER PART
NUMBER
TOP VIEW
VCC 1
28 EXT VCC
VIN 2
27 MSHDN
CAP3 3
26 CAP5
PGATE 3 4
25 PGATE 5
PDRIVE 3 5
24 PDRIVE 5
NGATE 3 6
23 NGATE 5
PGND3 7
21 VCC5
CT3 9
20 SGND5
ITH3 10
19 SHDN5
SGND3 11
18 SENSE + 5
SHDN3 12
17 SENSE – 5
SENSE – 3 13
SENSE + 3 14
16 CT5
15 ITH5
G PACKAGE
28-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 95°C/W
TOP VIEW
VCC 1
28 EXT VCC
VIN 2
27 MSHDN
CAP1 3
26 CAP5
25 PGATE 5
24 PDRIVE 2
PDRIVE 1 5
24 PDRIVE 5
23 NGATE 2
NGATE 1 6
23 NGATE 5
25 PGATE 2
PDRIVE 1 5
NGATE 1 6
VCC1 7
22 PGND
VCC1 7
22 PGND
CT1 8
21 VCC2
CT1 8
21 VCC5
ITH1 9
20 SGND2
ITH1 9
20 SGND5
SGND1 10
19 VFB2
SGND1 10
19 SHDN5
SHDN1 11
18 SENSE + 2
SHDN1 11
18 SENSE + 5
1 12
SENSE + 1 13
VFB1 14
17
SENSE –
2
SENSE –
1 12
17 SENSE – 5
16 CT2
SENSE + 1 13
16 CT5
15 ITH2
VFB1 14
15 ITH5
G PACKAGE
28-LEAD PLASTIC SSOP
G PACKAGE
28-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 95°C/W
TJMAX = 125°C, θJA = 95°C/W
Consult factory for Industrial and Military grade parts.
The LTC1267 demo circuit board is now available. Consult factory.
LTC1267CG
22 PGND5
VCC3 8
PGATE 1 4
PGATE 1 4
SENSE –
2
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RATI GS
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AXI U
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ABSOLUTE
ORDER PART
NUMBER
LTC1267CG-ADJ5
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
ELECTRICAL CHARACTERISTICS
TA = 25°C, VIN = 12V, VMSHDN, VSHDN1,3,5 = 0V (Note 2), unless otherwise noted.
SYMBOL
PARAMETER
VFB1, 2
Feedback Voltage
LTC1267-ADJ, LTC1267-ADJ5: VIN = 9V
●
IFB1, 2
Feedback Current
LTC1267-ADJ, LTC1267-ADJ5
●
VOUT
Regulated Output Voltage
3.3V Output
5V Output
LTC1267: VIN = 9V, ILOAD = 700mA
LTC1267, LTC1267-ADJ5: VIN = 9V, ILOAD = 700mA
●
●
∆VOUT
CONDITIONS
Output Voltage Line Regulation
VIN = 9V to 40V
Output Voltage Load Regulation
3.3V Output
5V Output
Figure 1 Circuit
5mA < ILOAD < 2.0A
5mA < ILOAD < 2.0A
Burst Mode Output Ripple
ILOAD = 0A
VCC
Internal Regulator Voltage
VIN = 12V to 40V, EXT VCC = 0V, ICC = 10mA
VIN – VCC
VCC Dropout Voltage
IEXTVCC
EXT VCC Pin Current (Note 3)
IIN
VIN Pin Current (Note 3)
Normal
Shutdown
1.21
1.25
1.29
V
0.2
1
µA
3.23
4.90
3.33
5.05
3.43
5.20
V
V
– 40
0
40
mV
40
60
65
100
mV
mV
●
●
50
mVP-P
VIN = 4V, EXT VCC = Open, ICC = 10mA
200
300
mV
EXT VCC = 5V, Sleep Mode
360
µA
VIN = 12V, EXT VCC = 5V
VIN = 40V, EXT VCC = 5V
VIN = 12V, VMSHDN = 2V
VIN = 40V, VMSHDN = 2V
320
550
15
25
µA
µA
µA
µA
200
VPGATE –
VIN
PGate to Source Voltage (Off)
VIN = 12V
VIN = 40V
●
4.25
UNITS
V
VIN = 12V, EXT VCC = 5V, ISWITCH = 10mA
VSHDN
MAX
4.75
EXT VCC Switch Drop
VSENSE + 3, 5 – Current Sense Threshold Voltage
VSENSE –3, 5
TYP
4.5
VEXTVCC –
VCC
VSENSE +1, 2 – Current Sense Threshold Voltage
VSENSE –1, 2
MIN
– 0.2
– 0.2
0
0
300
mV
V
V
LTC1267-ADJ, LTC1267-ADJ5
VSENSE –1, 2 = 5.1V, VFB1, 2 = VOUT/4 + 25mV (Forced)
VSENSE – 1, 2 = 4.9V, VFB1, 2 = VOUT/4 – 25mV (Forced)
●
135
25
160
180
mV
mV
LTC1267
VSENSE – 3, 5 = VOUT + 100mV (Forced)
VSENSE – 3, 5 = VOUT – 100mV (Forced)
●
135
25
160
180
mV
mV
0.8
0.6
1.4
0.8
2.0
2.0
V
V
12
20
µA
Shutdown Threshold
MSHDN
SHDN1, 3, 5
IMSHDN
MSHDN Input Current
VMSHDN = 5V
ICT
CT Pin Discharge Current
VOUT in Regulation
VOUT = 0V
50
70
2
90
10
µA
µA
tOFF
Off-Time (Note 4)
CT = 390pF, ILOAD = 700mA, VIN = 10V
4
5
6
µs
tr, tf
Driver Output Transition Times
CL = 3000pF (PDrive and NGate Pins), VIN = 6V
100
200
ns
3
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
ELECTRICAL CHARACTERISTICS
– 40°C ≤ TA ≤ 85°C, VIN = 12V, VMSHDN, VSHDN1,3,5 = 0V (Notes 2, 5), unless otherwise noted.
SYMBOL
PARAMETER
VFB1, 2
VOUT
IIN
CONDITIONS
MIN
TYP
MAX
Feedback Voltage
LTC1267-ADJ, LTC1267-ADJ5: VIN = 9V
1.2
1.25
1.3
V
Regulated Output Voltage
3.3V Output
5V Output
VIN = 9V
ILOAD = 700mA
ILOAD = 700mA
3.17
4.85
3.30
5.05
3.48
5.25
V
V
VIN Pin Current (Note 3)
Normal
UNITS
VIN = 12V, EXT VCC = 5V
VIN = 40V, EXT VCC = 5V
VIN = 12V, VMSHDN = 2V
VIN = 40V, VMSHDN = 2V
320
550
15
25
µA
µA
µA
µA
EXT VCC Pin Current (Note 3)
EXT VCC = 5V, Sleep Mode
360
µA
VCC
Internal Regulator Voltage
VIN = 12V to 40V, EXT VCC = 0V, ICC = 20mA
4.5
V
VSENSE + –
VSENSE –
Current Sense Threshold Voltage
Low Threshold (Forced)
High Threshold (Forced)
130
25
160
185
mV
mV
VMSHDN
Shutdown Threshold MSHDN
0.8
1.4
2.0
V
tOFF
Off-Time (Note 4)
3
5
7
µs
Shutdown
IEXTVCC
CT = 390pF, ILOAD = 700mA, VIN = 10V
The ● denotes specifications which apply over the full operating
temperature range.
Note 1: TJ is calculated from the ambient temperature TA and power
dissipation PD according to the following formula:
LTC1267/LTC1267-ADJ/LTC1267ADJ5: TJ = TA + (PD × 95°C/ W)
Note 2: On LTC1267 versions which have MSHDN and SHDN1, 3, 5 pins,
they must be at ground potential for testing.
Note 3: The LTC1267 VIN and EXT VCC current measurements exclude
MOSFET driver currents. When VCC power is derived from the output via
EXT VCC, the input current increases by (IGATECHG × Duty Cycle)/Efficiency.
See Typical Performance Characteristics and Applications Information.
Note 4: In applications where RSENSE is placed at ground potential, the
off-time increases approximately 40%.
Note 5: The LTC1267/LTC1267-ADJ/LTC1267-ADJ5 are not tested and
quality-assurance sampled at – 40°C to 85°C. These specifications are
guaranteed by design and/or correlation.
Note 6: The logic level power MOSFETs shown in Figure 1 are rated for
VDS(MAX) = 30V. For operation at VIN > 30V, use standard threshold
MOSFETs with EXT VCC powered from a 9V supply. See applications
information.
Note 7: LTC1267-ADJ and LTC1267-ADJ5 are tested at an output of 3.3V
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TYPICAL PERFORMANCE CHARACTERISTICS
5V Output Efficiency
vs Load Current
3.3V Output Efficiency
vs Load Current
100
95
20
EFFICIENCY (%)
90
85
VIN = 20V
80
75
85
VIN = 20V
80
75
70
70
65
65
60
0.01
60
0.01
0.1
1
LOAD CURRENT (A)
10
LTC1267 • G01
VIN = 10V
∆OUTPUT VOLTAGE (mV)
90
EFFICIENCY (%)
30
95
VIN = 10V
4
Load Regulation
100
10
VIN = 20V
VOUT = 3.3V
0
VIN = 10V
VOUT = 3.3V
–10
VIN = 10V
VOUT = 5V
–20
–30
VIN = 20V
VOUT = 5V
–40
–50
0.1
1
LOAD CURRENT (A)
10
LTC1267 • G02
–60
0
0.5
1.5
1.0
LOAD CURRENT
2.0
2.5
LTC1267 • G03
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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TYPICAL PERFORMANCE CHARACTERISTICS
5V Output Efficiency
vs Line Voltage
3.3V Output Efficiency
vs Line Voltage
LOGIC THRESHOLD
GATE, 1A
95
LOGIC THRESHOLD
GATE, 1A
NOTE 6
85
LOGIC
THRESHOLD
GATE, 0.1A
75
STANDARD
THRESHOLD GATE, 1A
VEXTVCC = 9V
STANDARD
THRESHOLD GATE, 0.1A
VEXTVCC = 9V
65
0
5
10
15 20 25 30
INPUT VOLTAGE (V)
35
NOTE 6
85
LOGIC
THRESHOLD
GATE, 0.1A
75
STANDARD
70 THRESHOLD GATE, 1A
VEXTVCC = 9V
80
STANDARD
THRESHOLD GATE, 0.1A
VEXTVCC = 9V
65
60
40
0
5
10
15 20 25 30
INPUT VOLTAGE (V)
LTC1267 • G04
35
VOUT = 5V
ILOAD = 700mA
–60
0
40
OFF-TIME (µs)
70°C
180
140
160
120
140
100
80
60
3.3V OUTPUT REGULATOR
0.5
40
25
0
35
40
120
100
80
60
MINIMUM THRESHOLD
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
OUTPUT VOLTAGE (V)
LTC1267 • G07
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PI FU CTIO S
15 20 25 30
INPUT VOLTAGE (V)
MAXIMUM THRESHOLD
40
5V OUTPUT REGULATOR
20
15
20
10
(VIN – VOUT) VOLTAGE (V)
10
Current Sense Threshold Voltage
160
25°C
1.0
5
LT1267 • G06
0°C
1.5
5
–20
Off-Time vs Output Voltage
2.0
0
0
LTC1267 • G05
Operating Frequency
vs (VIN – VOUT)
0
NOTE 6
20
–40
SENSE VOLTAGE (mV)
80
70
NORMALIZED FREQUENCY (Hz)
40
90
EFFICIENCY (%)
EFFICIENCY (%)
60
95
90
60
Line Regulation
100
∆OUTPUT VOLTAGE (mV)
100
LTC1267 • F08
0
0
10 20 30 40 50 60 70 80 90 100
TEMPERATURE (°C)
LTC1267 • G09
(Applies to both regulator sections)
VIN: Main Supply Input Pin.
EXT VCC: External VCC Supply for the Regulators. See EXT
VCC Pin Connection.
VCC: Output of the Internal 4.5V Linear Regulator, EXT VCC
Switch, and Supply Inputs for Driver and Control Circuits.
The driver and control circuits are powered from the
higher of the 4.5V regulator or EXT VCC voltage. Must be
closely decoupled to the power ground.
PGND: Power Ground. Connect to the source of N-channel
MOSFET and the (–) terminal of CIN.
SGND: Small-Signal Ground. Must be routed separately
from other grounds to the (–) terminal of COUT.
PGATE: Level Shifted Gate Drive for the Top P-channel
MOSFET. The voltage swing at the PGate pin is from VIN to
(VIN – VCC).
PDRIVE: High Current Gate Drive for the Top P-channel
MOSFET. The PDrive pin swings from VCC to GND.
NGATE: High Current Drive for the Bottom N-channel
MOSFET. The NGate pin swings from GND to VCC.
5
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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PI FU CTIO S
CAP: Charge Compensation Pin. A capacitor to VCC provides charge required by the PGate level shift capacitor
during supply transitions. The charge compensation capacitor must be larger than the gate drive capacitor.
CT: External Capacitor. From this pin to ground sets the
operating frequency. (The frequency is also dependent
upon the ratio VOUT/VIN).
ITH : Gain Amplifier Decoupling Point. The regulator current comparator threshold increases with the ITH pin
voltage.
SENSE – : Connects to internal resistive divider which sets
the output voltage. The Sense – pin is also the (–) input of
the current comparator.
SENSE + : The (+) Input for the Current Comparator. A
built-in offset between the Sense+ and Sense– pins, in
conjunction with RSENSE, sets the current trip threshold.
VFB1, 2: These pins receive the feedback voltage from an
external resistive divider used to set the output voltage of
the adjustable section.
MSHDN: Master Shutdown Pin. Taking MSHDN high
shuts down VCC and all control circuitry.
SHDN1, 3, 5: These pins shut down the individual regulator control circuitry (VCC is not affected). Taking SHDN1,
3, 5 pins high turns off the control circuitry of adjustable
1, 3.3V, 5V sections and holds both MOSFETs off. Must be
at ground potential for normal operation.
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FU CTIO AL DIAGRA
(Internal divider broken at VFB1,2 for adjustable versions. Only one regulator block shown.)
VIN
MSHDN
EXT VCC
LOW
DROPOUT
4.5V REGULATOR
LOW DROPOUT
SWITCH
CAP
PGATE
VCC
VCC
550k
550k
PDRIVE
SLEEP
SENSE+
NGATE
SENSE –
–
PGND
V
+
–
R
+
S
13k
+
ITH
T
G
100k
+
VTH1
VOS
–
–
VTH2
25mV TO 150mV
+
S
–
C
Q
OFF-TIME
CONTROL
SENSE –
SGND
1.25V
REFERENCE
VFB1, 2
SHDN1, 3, 5
CT
LTC1267 • FD
6
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
OPERATIO
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(Refer to Functional Diagram)
The LTC1267 series consists of two individual regulator
blocks, each using current mode, constant off-time architectures to synchronously switch an external pair of
complementary power MOSFETs. The two regulators are
internally set to provide output voltages of 3.3V and 5V for
the LTC1267. The LTC1267-ADJ is configured to provide
two adjustable output voltages, each set by their individual external resistor dividers. The LTC1267-ADJ5 has
adjustable and 5V output voltages. Operating frequency is
individually set on each section by the external capacitors
attached to the CT pin.
The output voltage is sensed by an internal voltage divider
connected to the Sense – pin or external divider returned
to the VFB pin (LTC1267-ADJ, LTC1267-ADJ5). A voltage
comparator V and a gain block G compare the divided
output voltage with a reference voltage of 1.25V. To
optimize efficiency, the LTC1267 series automatically
switches between two modes of operation, Burst Mode
and continuous mode. The voltage comparator is the
primary control element when the device is in Burst Mode
operation, while the gain block controls the output voltage
in continuous mode.
A low dropout 4.5V regulator provides the operating
voltage VCC for the MOSFET drivers and control circuitry
during start-up. During normal operation, the LTC1267
family powers the drivers and control from the output via
the EXT VCC pin to improve efficency. The NGate pin is
referenced to ground and drives the N-channel MOSFET
gate directly. The P-channel gate drive must be referenced
to the main supply input VIN, which is accomplished by
level-shifting the PDrive signal via an internal 550k resistor and an external capacitor.
During the switch “ON” cycle in continuous mode, current
comparator C monitors the voltage between Sense+ and
Sense– pins connected across an external shunt in series
with the inductor. When the voltage across the shunt
reaches its threshold value, the PGate output is switched
to VIN, turning off the P-channel MOSFET. The timing
capacitor CT is now allowed to discharge at a rate determined by the off-time controller. The discharge current is
made proportional to the output voltage to model the
inductor current, which decays at a rate that is also
proportional to the output voltage. While the timing capacitor is discharging, the NGate output is high, turning
on the N-channel MOSFET.
When the voltage on the timing capacitor has discharged
past VTH1, comparator T trips, setting the flip-flop. This
causes the NGate output to go low (turning off the
N-channel MOSFET) and the PGate output to also go low
(turning the P-channel MOSFET back on). The cycle then
repeats. As the load current increases, the output voltage
decreases slightly. This causes the output of the gain
stage to increase the current comparator threshold, thus
tracking the load current.
The sequence of events for Burst Mode operation is very
similar to continuous operation with the cycle interrupted
by the voltage comparator. When the output voltage is at
or above the desired regulated value, the P-channel
MOSFET is held off by comparator V and the timing
capacitor continues to discharge below VTH1. When the
timing capacitor discharges past VTH2, voltage comparator S trips, causing the internal SLEEP line to go low and
the N-channel MOSFET to turn off.
The circuit now enters sleep mode with both power
MOSFETs turned off. In sleep mode a majority of the
circuitry is turned off, dropping the quiescent current
from several mA (with the MOSFETs switching) to 360µA.
The load current is now being supplied by the output
capacitor. When the output voltage has dropped by the
amount of hysteresis in comparator V, the P-channel
MOSFET is again turned on and this process repeats.
To avoid the operation of the current loop interfering with
Burst Mode operation, a built-in offset VOS is incorporated
in the gain stage. This prevents the current comparator
threshold from increasing until the output voltage has
dropped below a minimum threshold.
To prevent both the external MOSFETs from ever being
turned on at the same time, feedback is incorporated to
sense the state of the driver output pins. Before the
NGate output can go high, the PDrive output must also be
high. Likewise, the PDrive output is prevented from going
low while the NGate output is high.
7
The LTC1267 Compared to the LTC1159, LTC1149 and
LTC1142 Family
The LTC1267 family is a dual LTC1159. Identical to the
LTC1159, the LTC1267 can reduce the quiescent and
shutdown currents by making use of an internal switch
which allows the driver and control sections to be
powered from an external source to improve efficiency.
The basic LTC1267 application circuit shown in Figure
1 is limited to a maximum input voltage of 30V due to
external MOSFET breakdown. If the application does
not require greater than 18V operation the LTC1142HV
should be used.
Component Selection
The basic LTC1267 application circuit is shown in Figure
1. External component selection is driven by the load
requirement and begins with the selection of RSENSE.
Once RSENSE is known, CT and L can be chosen. Next, the
power MOSFETs and diode are selected. Finally, CIN and
COUT are selected and the loop is compensated. Since the
adjustable, 3.3V and 5V sections in the LTC1267 are
identical, the process of component selection is the same
for both sections.
RSENSE Selection for Output Current
RSENSE is chosen based on the required output current.
The LTC1267 current comparators have a threshold range
which extends from a minimum of 25mV/RSENSE to a
maximum of 150mV/RSENSE. The current comparator
threshold sets the peak of the inductor ripple current,
yielding a maximum output current IMAX equal to the peak
value less half the peak-to-peak ripple current. For proper
Burst Mode operation, IRIPPLE(P-P) must be less than or
equal to the minimum current comparator threshold.
Since efficiency generally increases with ripple current,
the maximum allowable ripple current is assumed, i.e.,
IRIPPLE(P-P) = 25mV/RSENSE (see CT and L Selection for
Operating Frequency). Solving for RSENSE and allowing a
margin for variations in the LTC1267 and external component values yields:
RSENSE = 100mV
IMAX
8
The LTC1267 works well with values of RSENSE from
0.02Ω to 0.2Ω. Figure 2 shows the selection of RSENSE vs
maximum output current.
0.20
0.15
RSENSE (Ω)
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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0.10
0.05
0
0
1
3
4
2
MAXIMUM OUTPUT CURRENT (A)
5
LTC1267 • F02
Figure 2. Selecting RSENSE
The load current below which Burst Mode operation commences, IBURST and the peak short-circuit current ISC(PK)
both track IMAX. Once RSENSE has been chosen, IBURST and
ISC(PK) can be predicted from the following:
IBURST ≈ 15mV
RSENSE
ISC(PK) = 150mV
RSENSE
The LTC1267 automatically extends tOFF during a short
circuit to allow sufficient time for the inductor current to
decay between switch cycles. The resulting ripple current
causes the average short-circuit current ISC(AVG) to be
reduced to approximately IMAX.
CT and L Selection for Operating Frequency
Each regulator section of the LTC1267 uses a constant offtime architecture with tOFF determined by an external
timing capacitor CT. The value of CT is calculated from the
desired continuous mode operating frequency (fO):
)
–5
V
CT = 7.8 × 10
1 – OUT
VIN
fO
)
A graph for selecting CT vs frequency including the effects
of input voltage is given in Figure 3.
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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1400
value, but it is very dependent on inductance selected. As
inductance increases, core losses go down but copper I2R
losses increase. For additional information regarding inductor selection, please refer to the LTC1159 data sheet.
VOUT = 5V
TIMING CAPACITANCE (pF)
1200
1000
VIN = 24V
800
Power MOSFET and Diode Selection
600
VIN = 12V
400
200
0
50
0
100
150
FREQUENCY (kHz)
200
250
LTC1267 • F03
Figure 3. Timing Capacitor Value
As the operating frequency is increased the gate charge
losses will be higher, reducing efficiency (see Efficiency
Considerations). The complete expression for operating
frequency is given by:
)
V
fO = 1 1 – OUT
VIN
tOFF
)
where:
tOFF
= 1.3 × 104
× CT
Once the frequency has been set by CT, the inductor L must
be chosen to provide no more than 0.025V/RSENSE of
peak-to-peak inductor ripple current. This results in a
minimum required inductor value of:
LMIN = 5.1
× 105
× RSENSE × CT × VOUT
As the inductor value is increased from the minimum
value, the ESR requirements for the output capacitor are
eased at the expense of efficiency. If too small an inductor
is used, the LTC1267 may not enter Burst Mode operation
and efficiency will be severely degraded at low currents.
Inductor Core Selection
Once the minimum value for L is known, the type of
inductor must be selected. High efficiency converters
generally cannot afford the core loss found in low cost
powdered iron cores, forcing the use of more expensive
ferrite, molypermalloy (MPP), or Kool Mµ® cores. Actual
core loss is independent of core size for a fixed inductor
Two external power MOSFETs must be selected for use
with each section of the LTC1267: a P-channel MOSFET
for the main switch, and an N-channel MOSFET for the
synchronous switch.
The peak-to-peak gate drive levels are set by the V CC
voltage on the LTC1267. This voltage is typically 4.5V
during start-up and 5V to 7V during normal operation (see
EXT VCC Pin Connection). Consequently, logic-level threshold MOSFETs must be used in most LTC1267 family
applications. The only exceptions are applications in
which EXT VCC is powered from an external supply greater
than 8V, in which standard threshold MOSFETs (V GS(TH)
> 4V) may be used. Pay close attention to the BVDSS
specification for the MOSFETs as well; many of the logiclevel MOSFETs are limited to 30V.
Selection criteria for the power MOSFETs include the onresistance RDS(ON), reverse transfer capacitance CRSS,
input voltage, and maximum output current. When the
LTC1267 is operating in continuous mode, the duty cycles
for the two MOSFETs are given by:
V
Duty Cycle = OUT
VIN
V – VOUT
N-Channel Duty Cycle = IN
VIN
The MOSFET dissipations at maximum output current are
given by:
V
P-Ch PD = OUT (IMAX)2 (1 + δP) RDS(ON)
VIN
+ k (VIN)2 (IMAX) (CRSS) fO
V – VOUT
N-Ch PD = IN
(IMAX)2 (1 + δN) RDS(ON)
VIN
Kool Mµ is a registered trademark of Magnetics, Inc.
9
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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Both MOSFETs have I2R losses, while the P-channel
equation includes an additional term for transition losses,
which are highest at high input voltages. For VIN < 20V, the
high current efficiency generally improves with larger
MOSFETs, while for VIN > 20V, the transition losses rapidly
increase to the point that the use of a higher RDS(ON) device
with lower CRSS actually provides higher efficiency. The
N-channel MOSFET losses are the greatest at high input
voltage or during a short circuit when the N-channel duty
cycle is nearly 100%.
The term (1 + δ) is generally given for a MOSFET in the
form of a normalized RDS(ON) vs temperature curve, but δ
= 0.007/°C can be used as an approximation for low
voltage MOSFETs. CRSS is usually specified in the MOSFET
electrical characteristics. The constant k = 5 can be used
for the LTC1267 to estimate the relative contributions of
the two terms in the P-channel dissipation equation.
The Schottky diodes D3 and D5 shown in Figure 1 only
conduct during the dead-time between the conduction of
the respective power MOSFETs. The sole purpose of D3
and D5 is to prevent the body diode of the N-channel
MOSFET from turning on and storing charge during the
dead-time, which could cost as much as 1% in efficiency
(although there are no other harmful effects if D3 and D5
are omitted). Therefore, D3 and D5 should be selected for
a forward voltage of less than 0.6V when conducting IMAX.
CIN and COUT Selection
In continuous mode, the source current of the P-channel
MOSFET is a square wave of duty cycle VOUT/ VIN. To
prevent large voltage transients, a low ESR input capacitor sized for the maximum RMS current must be used. The
maximum RMS capacitor current is given by:
CIN Required IRMS ≈ IMAX
[VOUT(VIN – VOUT)]1/2
VIN
This formula has a maximum at VIN = 2VOUT where IRMS =
IOUT/2. This simple worst-case condition is commonly
used for design because even significant deviations do not
offer much relief. Note that capacitor manufacturer’s
ripple current ratings are often based on only 2000 hours
10
of life. This makes it advisable to further derate the
capacitor or to choose a capacitor rated at a higher
temperature than required. Several capacitors may also be
paralleled to meet size or height requirements in the
design. Always consult the manufacturer if there is any
question. An additional 0.1µF ceramic capacitor is also
required on VIN for high frequency decoupling.
The selection of COUT is driven by the required Effective
Series Resistance (ESR). The ESR of COUT must be less
than twice the value of RSENSE for proper operation of the
LTC1267:
COUT Required ESR < 2RSENSE
Optimum efficiency is obtained by making the ESR equal
to RSENSE. As the ESR is increased up to 2RSENSE, the
efficiency degrades by less than 1%. If the ESR is greater
than 2RSENSE, the voltage ripple on the output capacitor
will prematurely trigger Burst Mode operation, resulting in
disruption of continuous mode and an efficiency hit which
can be several percent.
Manufacturers such as Nichicon, United Chemicon, and
Sprague should be considered for high performance capacitors. In surface mount applications multiple capacitors may have to be paralleled to meet the capacitance,
ESR, or RMS current handling requirements of the application. For additional information regarding capacitor
selection, please refer to the LTC1159 data sheet.
At low supply voltages, a minimum capacitance at COUT is
needed to prevent an abnormal low frequency operating
mode (see Figure 4). When COUT is made too small, the
output ripple at low frequencies will be large enough to trip
1000
L = 50µH
RSENSE = 0.02Ω
OUTPUT CAPACITANCE (µF)
Where δ is the temperature dependency of RDS(ON) and k
is a constant inversely related to the gate drive current.
800
L = 25µH
RSENSE = 0.02Ω
600
400
L = 50µH
RSENSE = 0.05Ω
200
0
0
1
3
4
2
(VIN – VOUT) VOLTAGE (V)
5
LTC1267 • F04
Figure 4. Minimum Suggested COUT
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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the voltage comparator. This causes Burst Mode operation to be activated when the LTC1267 would normally be
in continuous operation. The effect is most pronounced
with low values of RSENSE and can be improved by operating at higher frequencies with lower values of L. The
output remains in regulation at all times.
VIN
+
EXT VCC
VIN
PDRIVE 3
The following list summarizes the four possible connections for EXT VCC:
1. EXT VCC left open. This will cause VCC to be powered
only from the internal 4.5V regulator, resulting in reduced MOSFET gate drive levels and an efficiency
penalty of up to 10% at high input voltages.
2. EXT VCC connected directly to highest VOUT of the two
regulators. This is the normal connection for LTC1267/
LTC1267-ADJ/LTC1267-ADJ5 and provides the highest efficiency.
3. EXT VCC connected to an output-derived boost network. For 3.3V and other low voltage regulators, efficiency gains can still be realized by connecting EXT VCC
to an output-derived voltage which has been boosted to
greater than 4.5V. This can be done either with the
inductive boost winding shown in Figure 5a or the
capacitive charge pump shown in Figure 5b. The charge
pump has the advantage of simple magnetics and
generally provides the highest efficiency at the expense
of a slightly higher parts count.
+
•
1µF
RSENSE
VOUT
3.3V
•
LTC1267
NGATE 3
Significant efficiency gain can be realized by powering VCC
from the output, since the VIN current resulting from the
driver and control currents will be scaled by a factor of
Duty Cycle/Efficiency. For LTC1267, LTC1267-ADJ or
LTC1267-ADJ5 this simply means connecting the EXT
VCC pin directly to VOUT of the 5V regulator.
L
1:1
P-CH
PGATE 3
EXT VCC Pin Connection
The LTC1267 contains an internal PNP switch connected
between the EXT VCC and VCC pins. The switch closes and
supplies the VCC power whenever the EXT VCC pin is higher
in voltage than the 4.5V internal regulator. This allows the
MOSFET driver and control power to be derived from the
output during normal operation and from the internal
regulator when the output is out of regulation (start-up,
short circuit).
1N4148
CIN
N-CH
+
COUT
PGND3
LTC1267 • F05A
Figure 5a. Inductive Boost Circuit for EXT VCC
+
VIN
1µF
+
EXT VCC
CIN
VIN
PGATE 3
BAT 85
P-CH
PDRIVE 3
BAT 85
0.22µF
VN2222LL
L
RSENSE
BAT 85
LTC1267
NGATE 3
+
N-CH
VOUT
3.3V
COUT
PGND3
LTC1267 • F05B
Figure 5b. Capacitive Charge Pump for EXT VCC
4. EXT VCC connected to an external supply. If an external
supply is available in the 5V to 10V range it may be used
to power EXT VCC providing it is compatible with the
MOSFET gate drive requirements. When driving standard threshold MOSFETs, the external supply must
always be present during operation to prevent MOSFET
failure due to insufficient gate drive.
Under the condition that EXT VCC is connected to VOUT1
which is greater than 5.5V, to power down the whole
regulator, both the pins MSHDN and SHDN1 have to be
pulled high. If SHDN1 is left floating or grounded the
EXT VCC may self-power from VOUT1, preventing complete shutdown.
LTC1267 Adjustable Applications
When an output voltage other than 3.3V or 5V is required,
the LTC1267-ADJ and LTC1267-ADJ5 adjustable versions are used with an external resistive divider from VOUT
to the VFB1, 2 pins. This is shown in Figure 6. The regulated
voltage is determined by:
) )
VOUT = 1 + R2 1.25V
R1
11
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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The VFB1, 2 pin is extremely sensitive to pickup from the
inductor switching node. Care should be taken to isolate
the feedback network from the inductor and a 100pF
capacitor should be connected between the VFB1, 2 and
SGND pins next to the package.
The circuit in Figure 6 cannot be used to regulate a VOUT
which is greater than the maximum voltage allowed on the
LTC1267 EXT V CC pin (10V). In applications with
VOUT > 10V, RSENSE must be moved to the ground side of
the output capacitor and load. This operates the current
sense comparator at 0V common mode, increasing the
off-time approximately 40% and requiring the use of a
smaller timing capacitor CT.
RSENSE
R2
VFB1, 2
+
100pF
R1
VOUT
COUT
SGND
LTC1267 • F06
Figure 6. LTC1267-ADJ/LTC1267-ADJ5
External Feedback Network
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
% Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percentage of input power. (For high efficiency circuits, only small
errors are incurred by expressing losses as a percentage
of output power.)
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
losses in LTC1267 circuits:
1.
2.
3.
4.
LTC1267 VIN current
LTC1267 VCC current
I2R losses
P-channel transition losses
12
1. LTC1267 VIN current is the DC supply current given in
the electrical characteristics which excludes MOSFET
driver and control currents. VIN currents results in a
small (<1%) loss which increases with VIN .
2. LTC1267 VCC current is the sum of the MOSFET driver
and control circuits currents. The MOSFET driver current results from switching the gate capacitance of the
power MOSFETs. Each time a MOSFET gate is switched
from low to high to low again, a packet of charge dQ
moves from VCC to ground. The resulting dQ/dt is a
current out of VCC which is typically much larger than
the control circuit current. In continuous mode IGATECHG
≈ fO(QP +QN), where QP and QN are the gate charges of
the two MOSFETs.
By powering EXT VCC from an output-derived source,
the additional VIN current resulting from the driver and
control currents will be scaled by a factor of Duty Cycle/
Efficiency. For example, in a 20V to 5V application,
10mA of VCC current results in approximately 3mA of
VIN current. This reduces the mid-current loss from
10% or more (if the driver was powered directly from
VIN) to only a few percent.
3. I2R losses are easily predicted from the DC resistances
of the MOSFET, inductor, and current shunt. In continuous mode all the output current flows through L and
RSENSE, but is “chopped” between the P-channel and Nchannel MOSFETs. If the two MOSFETs have approximately the same RDS(ON), then the resistance of one
MOSFET can simply be summed with the resistances of
L and RSENSE to obtain I2R losses. For example, if each
RDS(ON) = 0.1Ω, RL = 0.15Ω, and RSENSE = 0.05Ω, then
the total resistance is 0.3Ω. This results in losses
ranging from 3% to 12% as the output current increases
from 0.5A to 2A. I2R losses cause the efficiency to roll
off at high output currents.
4. Transition losses apply only to the P-channel MOSFET
and only when operating at high input voltages (typically
20V or greater). Transition losses can be estimated
from:
Transition Loss ≈ 5 × VIN2 × IMAX × CRSS × fO
Other losses including CIN and COUT ESR dissipative
losses, Schottky conduction losses during dead-time,
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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and inductor core losses, generally account for less
than 2% total additional loss.
Auxiliary Windings––Suppressing Burst Mode
Operation
The LTC1267 synchronous switch removes the normal
limitation that power must be drawn from the inductor
primary winding in order to extract power from auxiliary
windings. With synchronous switching, auxiliary outputs
may be loaded without regard to the primary output load,
providing that the loop remains in continuous mode
operation.
Burst Mode operation can be suppressed at low output
currents with a simple external network which cancels the
25mV minimum current comparator threshold. This technique is also useful for eliminating audible noise from
certain types of inductors in high current (IOUT > 5A)
applications when they are lightly loaded.
An external offset is put in series with the Sense – pin to
subtract from the built-in 25mV offset. An example of this
technique is shown in Figure 7. Two 100Ω resistors are
inserted in series with the sense leads from the sense
resistor.
L
+
R2
100Ω
SENSE +
LTC1267
RSENSE
1000pF
SENSE –
COUT
R1
100Ω
R3
LTC1267 • F07
Figure 7. Suppressing Burst Mode Operation
With the addition of R3 a current is generated through R1
causing an offset of:
VOFFSET = VOUT
)R1R1+ R3)
If VOFFSET > 25mV, the built-in offset will be cancelled and
Burst Mode operation is prevented from occurring. Since
VOFFSET is constant, the maximum load current is also
decreased by the same offset. Thus, to get back to the
same IMAX, the value of the sense resistor must be
reduced:
RSENSE ≈ 75 mΩ
IMAX
To prevent noise spikes from erroneously tripping the
current comparator, a 1000pF capacitor is needed across
Sense+ and Sense– pins.
Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1267. These items are also illustrated graphically in
the layout diagram of Figure 8. In general each block
should be self-contained with little cross coupling for best
performance. Check the following in your layout:
1. Are the signal and power grounds segregated? The
LTC1267 signal ground must return to the (–) plate of
COUT. The power ground returns to the source of the
N-channel MOSFET, anode of the Schottky diode,
and (–) plate of CIN, which should have as short lead
lengths as possible.
2. Does the LTC1267 Sense – pin connect to a point close
to RSENSE and the (+) plate of COUT? In adjustable
applications the resistive divider R1 and R2 must be
connected between the (+) plate of COUT and signal
ground.
3. Are the Sense – and Sense + leads routed together with
minimum PC trace spacing? The 1000pF capacitor
between the two Sense pins should be as close as
possible to the LTC1267. Up to 100Ω may be placed in
series with each Sense lead to help decouple the Sense
pins. However, when these resistors are used the
capacitor should be no larger than 1000pF.
4. Does the (+) plate of CIN connect to the source of the
P-channel MOSFET as closely as possible? An additional 0.1µF ceramic capacitor between VIN and power
ground may be required in some applications.
5. Is the VCC decoupling capacitor connected closely
between the VCC pins of the LTC1267 and power
ground? This capacitor carries the MOSFET driver peak
currents.
13
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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VIN
2
0.15µF
P-CH
4
0.1µF
N-CH
5
6
+
D3
3
CIN3
7
L3
1µF
+
1k
RSENSE3
3300pF
10
CT3
11
+
SHDN3
12
13
1000pF
EXT VCC
VIN
MSHDN
CAP5
CAP3
PGATE 3
PGATE 5
PDRIVE 3
PDRIVE 5
NGATE 3
NGATE 5
PGND5
PGND3
8 VCC3
9
COUT3
VCC
14
VCC5
LTC1267
CT3
SGND5
ITHR3
SHDN5
SGND3
SHDN3
SENSE + 5
SENSE – 5
SENSE – 3
SENSE + 3
CT5
ITHR5
28
27
26
1N4148
MSHDN
0.15µF
P-CH
25
24
0.1µF
N-CH
23
L5
CIN5
22
21
D5
+
+
1µF
20
19
SHDN5
CT5
COUT5
+
1
1N4148
18
17
RSENSE5
1000pF
VOUT5
16
3300pF
15
BOLD LINES INDICATE HIGH CURRENT PATHS
1k
LTC1267 • F08
VOUT3
Figure 8. LTC1267 Layout Diagram
6. In adjustable versions, the feedback pin is very sensitive to pickup from the switch node. Care must be taken
to isolate VFB1, 2 from possible capacitive coupling of
the inductor switch signal.
7. Are MSHDN and SHDN1, 3, 5 actively pulled to ground
during normal operation? These shutdown pins are
high impedance and must not be allowed to float.
If the CT is observed falling to ground at high output
currents, it indicates poor decoupling or improper grounding. Refer to the Board Layout Checklist.
Inductor current should also be monitored. Look to verify
that the peak-to-peak ripple current in continuous mode
operation is approximately the same as in Burst Mode
operation.
3.3V
Troubleshooting Hints
Since efficiency is critical to LTC1267 applications, it is
very important to verify that the circuit is functioning
correctly in both continuous and Burst Mode operation.
The waveform to monitor is the voltage on the CT pin.
In continuous mode (ILOAD > IBURST) the voltage on the CT
pin should be a sawtooth with a 0.9VP-P swing. This
voltage should never dip below 2V as shown in Figure 9a.
When load currents are low (ILOAD < IBURST) Burst Mode
operation occurs. The voltage on the CT pin now falls to
ground for periods of time as shown in Figure 9b.
14
0V
(a) CONTINUOUS MODE OPERATION
3.3V
0V
(b) Burst Mode OPERATION
Figure 9. CT Waveforms
LTC1267 • F09
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
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TYPICAL APPLICATIONS N
LTC1267-ADJ Dual Regulator with 3.6V/2.5A and 5V/2A Outputs
VIN
5.4V to 25V
+
+
CIN1
100µF
50V
+
0.15µF
3.3µF
VOUT1
3.6V
2.5A
L1
20µH
3
7
4
0.1µF
5
13
VCC1
CAP1
1
2
VCC
VIN
COUT1
220µF
10V
×2
+
26
28
P-CH
Si9435DY
MSHDN CAP2 EXT VCC VCC2
PGATE 2
PDRIVE 1
PDRIVE 2
SENSE + 1
6
N-CH
Si9410DY
25
0.1µF
24
SENSE + 2
18
SENSE –
17
NGATE 1
R2
100k
1%
2
NGATE 2
SHDN1
PGND2
SGND1 CT1
14
10
8
100pF
ITH1
CT2
ITH2
9
15
SGND2
16
RC1
1k
RSENSE1: KRL SL-1R040J
L1: COILTRONICS CTX20-4
RSENSE2
0.05Ω
VOUT2
5V
2A
23
22
VFB2
20
CC1
CC2
CT2
CT1
270pF 3300pF 3300pF 270pF
R1
52.3k
1%
L2
33µH
1000pF
SENSE – 1
VFB1
3.3µF
21
LTC1267-ADJ
11
D1
MBRS140T3
27
PGATE 1
1000pF
12
+
1N4148
P-CH
Si9435DY
RSENSE1
0.04Ω
0.15µF
1N4148
CIN2
100µF
50V
D2
MBRS140T3
N-CH
Si9410DY
19
+
COUT2
220µF
10V
×2
+
CIN2
100µF
50V
R2
150k
1%
100pF
R1
49.9k
1%
RC2
1k
MSHDN, SHDN1
0V = NORMAL, >2V = SHDN
RSENSE2: KRL SL-1R050J
L2: COILTRONICS CTX33-4
LTC1267 • F010
LTC1267-ADJ5 Dual Regulator with 3.45V/2.5A and 5V/2A Outputs
VIN
5.4V to 25V
+
CIN1
100µF
50V
+
0.15µF
3.3µF
VOUT1
3.45V
2.5A
L1
20µH
4
0.1µF
5
13
VCC1
CAP1
1
2
VCC
VIN
COUT1
220µF
10V
×2
+
6
N-CH
Si9410DY
MSHDN CAP5 EXT VCC VCC5
PDRIVE 5
SENSE + 1
25
SENSE + 5
SENSE – 5
17
SHDN5
NGATE 1
NGATE 5
SGND1 CT1
10
8
ITH1
9
ITH5
15
0.1µF
24
L2
33µH
RSENSE2
0.05Ω
VOUT2
5V
2A
1000pF
SENSE – 1
CT5
SGND5 PGND
16
20
19
23
N-CH
Si9410DY
D2
MBRS140T3
+
22
CC1
CC5
CT5
CT1
270pF 3300pF 3300pF 270pF
RC1
1k
RSENSE1: KRL SL-1R040J
L1: COILTRONICS CTX20-4
P-CH
Si9435DY
18
SHDN1
VFB1
3.3µF
21
PDRIVE 1
100pF
R1
56.2k
1%
28
PGATE 5
14
R2
100k
1%
26
LTC1267-ADJ5
11
D1
MBRS140T3
27
PGATE 1
1000pF
12
+
1N4148
3
7
P-CH
Si9435DY
RSENSE1
0.04Ω
0.15µF
1N4148
COUT2
220µF
10V
×2
RC5
1k
MSHDN, SHDN1, SHDN5
0V = NORMAL, >2V = SHDN
RSENSE2: KRL SL-1R050J
L2: COILTRONICS CTX33-4
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC1267 • F011
15
LTC1267
LTC1267-ADJ/LTC1267-ADJ5
U
PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted.
G Package
28-Lead Plastic SSOP
0.397 – 0.407*
(10.07 – 10.33)
0.205 – 0.212*
(5.20 – 5.38)
0.068 – 0.078
(1.73 – 1.99)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
0° – 8°
0.022 – 0.037
(0.55 – 0.95)
0.005 – 0.009
(0.13 – 0.22)
0.0256
(0.65)
BSC
0.301 – 0.311
(7.65 – 7.90)
0.010 – 0.015
(0.25 – 0.38)
0.002 – 0.008
(0.05 – 0.21)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28SSOP 0694
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1142
Dual Step-Down Switching Regulator Controller
Dual Version of LTC1148
LTC1143
Dual Step-Down Switching Regulator Controller
Dual Version of LTC1147
LTC1147
Step-Down Switching Regulator Controller
Nonsynchronous, 8-Pin, VIN ≤ 16V
LTC1148
Step-Down Switching Regulator Controller
Synchronous, VIN ≤ 20V
LTC1149
Step-Down Switching Regulator Controller
Synchronous, VIN ≤ 48V, for Standard Threshold FETs
LTC1159
Step-Down Switching Regulator Controller
Synchronous, VIN ≤ 40V, for Logic Level FETs
LTC1174
Step-Down Switching Regulator with Internal 0.5A Switch
VIN ≤ 18.5V, Comparator/Low Battery Detector
LTC1265
Step-Down Switching Regulator with Internal 1A Switch
VIN ≤ 13V, Comparator/Low Battery Detector
LTC1266
Step-Up/Down Switching Regulator Controller
Synchronous N- or P-Channel FETs, Comparator/Low Battery Detector
LTC1574
Step-Down Switching Regulator with Internal 0.5A Switch
and Schottky Diode
VIN ≤ 18.5V, Comparator
16
Linear Technology Corporation
LT/GP 0695 10K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7487
(408) 432-1900 ● FAX: (408) 434-0507 ● TELEX: 499-3977
 LINEAR TECHNOLOGY CORPORATION 1995