PREPARED BY:
DATE:
TTti
/(6/?7
*_I;,*
DATE:
/I&/
7-I LLdLl
APPROVED
BY:
97,
~E~TRONIC
COMPONENTS GROUP
SHARP CORPORATION
SPEC~CATIO~J
DEVICE SPECIFICATION
1
Opto-Electronic Devices Division
FOR
Light Emitting Diode
MODEL No.
GL5ZJ302BOS
A
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment
* Home appliance
* Telecommunication equipment (Terminal)
* LMeasuring equipment
1
L * Tooling machines * Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, &ain. automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Rescue and security equipment
*
Other
safety
equipment
[I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
*
L- Nuclear power control equipment * Medical equipment
1
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMERS
‘DATE:
BY:
APPROVAL
M.Katoh,
Department General Manager of
Engineering Dept.,IH
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPOR4TION
DG996030
MODEL
No.
Juni16iW
PAGE
GLSZJ302BOS
GL5ZT302BOS
StAfication
1. Application
This specification applies to the light emitting diode device Model No. GL5ZJ302BOS.
[AlGaIS (dicing or scribe/brake ty-pe) Orange IED device]
2. Guthne dimensions and pin
co~ections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer
to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability .,.....................................................
4-l. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 5.
5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifrca of defect
6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7-8.
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 9- 10.
7-1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
l/10
Jud16199
DG!396030
PAGE
MODEL No.
I
GLZJ302BOS
I
2/10
2. Outline dimensions aud-pin connections
Colorless +nspare~Y
0
.
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4
oi
I
*
w
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:-I
z
z
0
L.
54NOM
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I _ 0. 5 20. 1 C-J
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y.
4
pin connections
0. Anode
0. cathode
(Note) Unspecified tol. to be k0.21~1
2. 4
L-J
(Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Finish
Lead : Sn plated or wave soldering
Drawing No.
51106011
Jun/16/9!
DG996030
PAGE
MODEL No.
GL5ZJ302BOS
3110
3. Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the positionof 1.6mmfrom the bottom resinpackage
Terminal capacitance
V=OV,f=lMHz
60
Ct
Viewing Angle
261/2
IF=2OmA
30
(Note 3) Refer to the suplementitem 6. regardingthe standardof rank classification.
-
pF
deg.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120
z
.5
iz 100
g
80
,m
3
60
-25
0
Amb i ent
25
50
Temperature
75 85 100
Ta (“cl
125
-25
0
Ambient
25
50
Temperature
75”*100
TarC)
125
Jun/16/%
PAGE
DG996030
MODEL
No.
GLZJ302BOS
Peak
Forward
CurrFnt
vs.
Duty
4110
Ratio
(Ta?Z!?C)
1000
I I/lil/ll
I I ““‘I// I i I /lllll
II
III!1
/llllllll
I I
I /II/
i II
loo
l/100
1
l/10
Duty
3-4. Characteristics
10
Raito
DR
Diagram(typ)
(Note 1)
Relative
Forward
Current
vs.Forward
Voltage
vs.
Luminous
Ambient
Intensity
Temperature
(Ta=25”C)
( I F=2GmA)
100
10
I
I
I
,
I
I
1
/
,
,I
I I I
I I I
/I
I!
I
I
1
1;:
‘,‘,:;,,,I
0. 1
1
1.2
1.4
1.6
Forward
Relative
Luminous
/
!
/
I I
I I
1.8
Intensity
4
/
2
Voltage
!
I I I I.
2.2
2.4
2.6
-60
VFW
vs.
Frorard
Voltage
(Ta=
Q5”c)
1000
100
10
1
0. 1
0.01
0. 1
1
Forward
(Note 1) Above characteristic
10
Current
100
IFhA)
&ta are typical data ad not a guarantteed &u.
-40-20
Ambient
0
20
40
Temprature
60
80
Ta("C)-
100
120
Junl16/94
DC3996030
PAGE
MODEL No.
GL5a302BOS
S/10
4. Reliability
The reliability of productsshallbe satisfiedwith itemslistedbelow.
Al-1. Test itemsand test conditions
Test items
Confidencelevel: 9096
Samples(n)
LTPD
Defective (C)
(Q/o) 3
Test conditions
Solderability
230*5”c. 5s
Prior disposition: Dip in rosinflux
n=ll, C=O
20
Soldering
temperature
260tPC,
n=ll,C=O
20
15 OOOm/sz,
OSms,
3times/ iSgtY,kZ direction
n=ll. C=O
20
2OOm/s*,100to 2 Oooto lOOHz/sweepfor 4min.
.4times/fX+Y,iZ direction
n=ll, C=O
20
Weight:lON, S/each terminal
n=ll, C=O
20
Weight:SN, 0” - 90” -+ O”* -90” + 0”
/each terminal
n=ll,C=O
20
Temperaturecycling
-4O”c(3Omin)~+lOO”c(3~in),3O cycles
n=22, C=O
10
High temp.andhigh
humidity storage
Ta=+60%, 9O%RH,t=lOOOh
n=22, C=O
10
tigh temperaturestorageTa=lOO”C, t=lOOOh
n=22, C=O
10
x)w temperaturestorageTa=-40”C, t=lOOOh
n=22, C=O
10
n=22, C=O
10
Mechanicalshock
Variable frequency
vibration
Terminal strength
(Tension)
Terminalstrength
(Bending)
Operationlife
5s
Ta=25”c. IFMAX, t=1000h *3
4-2. Measurementitemsand Failurejudgementcriteria * 1
Measurement
SpbOl
Failurejudgementcriteria *2
Forward voltage
vF
v, > U.S.L. x 1.2
Reversecurrent
IR
I, > U.S.L. x 2.0
Luminousintensity
Iv
Iv > The fist stagevalue X 2.0 or The first stagevalue X 0.5 > Iv
Z Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion.
z Terminalstrength: Packageis not destroyed,andterminalis not slack.
* 1: Measuringcondition is in accordancewith specification.
*2: U.S.L. is shownby Upper Specification Limit.
*3: IF MAX.is shownby forward current of absolutemaximumratings.
Jun/W!X
DG996030
PAGE
MODEL No.
GL5ZJ302BOS
5. Incoming inspection
5-1. Applied standard: IS0 2859-l
5-2. Samplingmethodand level : A single samplingplan,notmalinspectionlevel II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items,judgementcriteria and class&a of defect
No.
Test items
judgementcriteria
1
Disconnection
Not emit light
2
Positionof Cuttingoff
rim
Different from dimension
3
Reverseterminal
Different from dimension
4
Outline dimensions
Not satisfy outline specification
5
Characteristics
6
Cut off the rim
Exceed -0.2mm
7
Foreign substance
White pint : Exceed 4 0.3mm (on top view)
Black point : Exceed 4 0.3mm (on top view)
String fotm : Exceed 3.Omm(on top view)
8
Scratch
Exceed o 0.3mmor O.lmm x l.Omm(on top view)
9
Void
Exceed Q0.3mm (on top view)
LO
Uneven densityof
materialfor scattering
11
Unbalancedcenter
Exceed M.25mrn from packagecenter
12
Burr
Exceed +0.2mm againstprovideddimension
13
Insertionpositionof
terminal
Insertion positionof terminal
classificaof deft
Major defect
Over the limit value of specificationat V,, Ia, andI,,
Extiemely
uneven
Minor defect
density
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassificaof defect
No.
Test items
judgementcriteria
classificaof defect
14
Chappedthesurface
The surfacechappedis striking for seethe lamptop
Minor defect
15
Hollow the surface
The surfacehollow is striking for seethe lamptop
6/10
DG996030
MODEL
No.
GLEZJ302BOS
Juni16/9!
PAGE
7110
6. Supplement
61. Packing
6-l-l. Inner package
Put 25Cpcsthe sameluminousintensity rank productsinto pack andput following label by pack.
Productweight : 0.28g (One Roduct.Typ.)
(Indication labelsample)
SHIPMEHTTABLE
PART No.
GLJ~J~O~BOS * Model number
*clcl
cloonn
250
+-- Quantity of products
QUANTITY
--KA99B19
* Lot number*
LOT No.
@co
0
0
0
G-C tLuminousintensity rank
dominant wavelengthrank
SHARP’
MADEIN JAP.4N
+ Production country
0
@
@
@
@
Productionplant code(to be indicated alphabetically)
Supportcode
Year of production(thelast two figures of the year)
Month of production
(to be indicatedalphabeticallywith Januarycorrespondingto A)
Date of production(01w 3 1)
6-l-2. Outer package
Put 8 packs (the sameluminousintensity rank) into outer package.
(approximately670g per one outer package)
6-l-3. Outer packageout line dimension
Width: 14Omm,Depth : 225rnm, Hight: 9Omm
6-2.Luminousintensity rank (Note 1)
Rank
Luminousintensity
K
383
746
L
552
1075
M
795
1548
unit
(Ta=25”c )
Condition
mcd
It92OnLA
(Note 1) Tolerance:fl5%
In regardto luminousintensity , the following rankingshallbe carriedout.
However the quantity of eachrank shallnot be pre scribed.
In caseof the distribution of the luminousintensity shift to high, at that
point new upperrank is prescribedandlower rank is delete.
X
1 623.5
627.0 1
I
I
(Note 2) The condition of measurement: The measurement
of the light emissionfrom the front sideof lamp.
This rank value is the setting value of whenthat classitiesit the rank and be not a guaranteevalue.
Also I shall not ask the delivery ratio of eachrank.
1
DG996030
MODEL No.
I
GL5a302BOS
-6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part: CFCsJlalones,CC&,Trichloroetha&Methychlorofom@
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
Jun/16/94
PAGE
8/10
DG996030
MODEL, No.
GLZJ302BOS
Juni16i99
PAGE
9110
7. Precautionsfor use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering
‘7 - 2. Notice of installation
7-2-l installation on a P W B
Whenmounting an LED lamp on a PwB,do not apply
physical stress to the lead pins.
The lead pin pitch should match the PIB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
Whenpositioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 ‘#hen an LED1 is mounted directly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins maybe subjected to physical stress
due to P’#Bwarp, cutting or clinching of lead
pins. Prior to use. be sure to check that no
disconnection inside of the resin or damageto
resin etc.,is found-when an LED lamp is mounted
on a double-sided PIB,the heat during soldering
affects the resin;therefore.keep
the LED lamp
more that 1.6mmafloat above the PIVB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat,mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to-the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
l
NG
l
Good
DG996030
MODEL, No.
GL5ZJ302BOS
7 7 3. S oldering Conditions
Solder the lead pins under the following conditions
Conditions
Type of Soldering
295’C*5”c, within 3 seconds
1. Manual soldering
260°Ct5”c. within 5 seconds
2. Wave soldering
Preheating
70°C to 8O”C, within 30 seconds
3. Auto soldering
Soldering 245”c*S”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection way occur.
iron
7 - 4. For cleaning
(1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PIB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 1 Applicable solvent
Ethyl alcohoLYethy1 alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
Junl16/99
PAGE
lO/lO