MICROCHIP TC170COE

TC170
CMOS Current Mode PWM Controller
Features
General Description
• Low Supply Current With CMOS Technology:
3.8mA Max
• Internal Reference: 5.1V
• Fast Rise/Fall Times (C L = 1000pF): 50nsec
• Dual Push-Pull Outputs
• Direct-Power MOSFET Drive
• High Totem-Pole Output Drive: 300mA
• Differential Current-Sense Amplifier
• Programmable Current Limit
• Soft-Start Operation
• Double-Pulse Suppression
• Undervoltage Lockout
• Wide Supply Voltage Operation: 8V to 16V
• High Frequency Operation: 200kHz
• Available with Low OFF State Outputs
• Low Power, Pin-Compatible Replacement for
UC3846
The TC170 offers maximum supply current of 3.8mA.
Bipolar current-mode control integrated circuits require
five times more operating current.
Applications
The dual totem-pole CMOS outputs drive power
MOSFETs or bipolar transistors. The 50nsec typical
output rise and fall times (1000pF capacitive loads)
minimize MOSFET power dissipation. Output peak
current is 300mA.
The TC170 contains a full array of system-protection
circuits (see Features Section).
Current-mode control lets users parallel power supply
modules. Two or more TC170 controllers can be slaved
together for parallel operation. Circuits can operate
from a master TC170 internal oscillator or an external
system oscillator.
The TC170 operates from an 8V to 16V power supply.
An internal 2%, 5.1V reference minimizes external
component count. The TC170 is pin compatible with
the Unitrode UC1846/UC2846/UC3846 bipolar
controller.
Other advantages inherent in current-mode control
include superior line and load regulation and automatic
symmetry correction in push-pull converters.
• Switching Power Supplies
• DC/DC Converters
• Motor Control
Device Selection Table
Part Number
Package
Temp. Range
TC170COE
16-Pin SOIC (Wide)
0°C to +70°C
TC170CPE
16-Pin PDIP (Narrow)
0°C to +70°C
Package Type
16-Pin PDIP (Narrow)
SOFT START/
ILIM 1
16 SHDN
16-Pin SOIC (Wide)
SOFT START/
ILIM
1
16
SHDN
VREFOUT
2
15
VIN
– I SENSE IN 3
– I SENSE IN
3
14
OUTPUT B
+ I SENSE IN 4
+ I SENSE IN
4
13
VDD
VREFOUT
2
15
TC170CPE
IN
DD
TC170COE
+ ERROR AMP IN
5
12
GND
– ERROR AMP IN 6
– ERROR AMP IN
6
11
OUTPUT A
CMPTR 7
CMPTR
7
10
SYNC
CO
8
9
RO
+ ERROR AMP IN 5
CO 8
9 RO
NOTE: Outputs LOW in "OFF" state.
 2002 Microchip Technology Inc.
DS21395B-page 1
TC170
Functional Block Diagram
VREF
2
VIN
15
RO
9
CO
8
Sync
(–) Current
Sense Input
(+) Current
Sense Input
Comp
(+) Error
Amp Input
(–) Error
Amp Input
5.1-Volt
Reference
TC170
11
Undervoltage
Lockout
Oscillator
–
4
x 3.15 Current
Amplifier
+
–
+
0.75V
7
6
PWM
Comparator
R
Q
–
S
+
14
S
Limit Buffer
Amplifier
VDD
5
+
100µA
12
PWM Latch
1
+
–
–
VDD
Output
A(
)
D Q
C
Q
10
3
13
Output
B(
)
Ground
Current Limit/
Soft-Start Adjust
Q4
Error
Amplifier
Shutdown
Comparator
350mV
Lock-up
Amplifier
16
–
+
Q1
+
Q2
–
Positive
Feedback
Shutdown
350
mV
6kΩ
Q3
3.5kΩ
NOTE: Outputs low in OFF state.
DS21395B-page 2
 2002 Microchip Technology Inc.
TC170
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ....................................................... 18V
Output Voltage ........................................... VDD or 18V
Analog Inputs .................................. -0.3V to VS + 0.3V
Package Thermal Resistance:
SOIC (Wide) θJA ..................................... 105°C/W
SOIC (Wide) θJC ....................................... 23°C/W
PDIP (Narrow) θJA .................................... 95°C/W
PDIP (Narrow) θJC .................................... 55°C/W
Operating Temperature Range ............... 0°C to +70°C
Storage Temperature Range .............. -65°C to +150°C
TC170 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = 16V, RO = 24kΩ, CO = 1nF, TA = 25°C, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
5
Units
Test Conditions
Reference Voltage
VREF
VRTC
5.1
5.3
V
Line Regulation
Reference Voltage
5
15
mV
IOUT = 1mA
VIN = 8V to 16V
Load Regulation
13
20
mV
IOUT = 1mA to 10mA
Temperature Coefficient
0.4
0.5
mV/°C
Over operating temperature range.
Oscillator
F
Oscillator Frequency
VCOSC
Voltage Stability
TCOSC
Temperature Stability
35
42
46
kHz
1.1
1.5
%/V
5
10
%
VIN = 8V to 16V
Over operating temperature range.
Error Amplifier
VOS
Input Offset Voltage
±30
mV
IB
Input Bias Current
±1
nA
VCMRR
Common-Mode Input Voltage
0
AVOL
Open-Loop Voltage Gain
70
VDD – 2V
BW
Unity Gain Bandwidth
CMRR
Common-Mode Rejection Ratio
60
dB
VCMV = 0V to 14V
PSRR
Power Supply Rejection Ratio
60
dB
VIN = 8V to 16V
1.2
V
VIN = 8V to 16V
dB
VOUT = 1V to 6V
MHz
Current Sense Amplifier
AIAMP
Amplifier Gain
VDM
Maximum Differential Input Signal
VCM
Common-Mode Input Voltage
3
3.15
3.3
V/V
≤ 1.1
V
0
VDD – 3V
V
0.5
1
V
1
nA
Pin 3 = 0V to 1.1V
VPIN4 – VPIN3
Current Limit Adjust
VOS
Current Limit Offset Voltage
IB
Input Bias Current
Shutdown Terminal
VTH
Threshold Voltage
VIN
Input Voltage Range
IL
Minimum Latching Current at Pin 1
IL
Maximum Nonlatching Current at Pin 1
 2002 Microchip Technology Inc.
0.3
0
0.35
0.4
V
VDD
V
µA
125
50
µA
DS21395B-page 3
TC170
TC170 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = 16V, R O = 24kΩ, CO = 1nF, TA = 25°C, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
VIN – 0.5
VIN
Test Conditions
Output Stage
V DD
Output Voltage
VIN + 0.5
V
VOL
Output Low Level
0.4
V
Pin 13
ISINK = 20mA
VOL
Output Low Level
2
V
ISINK = 100mA
VOH
Output High Level
VDD – 1V
V
ISOURCE = 20mA
VOL
Output High Level
VDD – 4V
V
ISOURCE = 100mA
tR
Output Rise Time
50
150
nsec
CL = 1000pF
tF
Output Fall Time
50
150
nsec
CL = 1000pF
7.15
7.7
8.25
V
0.5
0.75
1
V
2.7
3.8
mA
Undervoltage Lockout
Start-Up
Threshold Hysteresis
Threshold
Supply
IS
Standby Supply Current
DS21395B-page 4
 2002 Microchip Technology Inc.
TC170
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(16-Pin PDIP,
SOIC)
1
PIN FUNCTION TABLE
Symbol
Description
SOFT START/ILIM Soft Start Adjust/Current Limit. For setting the peak current threshold of sense inputs (pins 3
and 4). Second function of this pin is Soft-Start Adjust.
2
VREFOUT
Reference supply output of 5.1 volts. It can supply a minimum of 10mA.
3
-ISENSEIN
-Current Sense Input. Inverting input for sensing peak current of the pass transistor through
series sense current monitor resistor.
4
+ISENSEIN
+Current Sense Input. Non-inverting input used in conjunction with pin 3. This senses the
positive end of current monitor resistor.
5
+ERROR AMP IN +Error Amp In. Non-inverting input for output voltage regulation.
6
-ERROR AMP IN
7
CMPTR
8
CO
Timing capacitor (CO) input to set oscillator frequency in conjunction with pin 9, RO, resistor
input. Second function is for setting crossover dead time of pin 11and 14 outputs.
9
RO
Timing resistor (RO) input to set oscillator frequency by setting constant current charge rate to
charge capacitor CO.
10
SYNC
For PWM controller oscillator synchronization of two or more controllers. Or as a clock input to
sync oscillator from external signal.
11
OUTPUT A
12
GND
Ground return for all input and output pins.
13
V DD
Supplies power to operate the output drivers only.
14
OUTPUT B
15
VIN
16
SHDN
 2002 Microchip Technology Inc.
-Error Amp In. Inverting input of the amplifier for the reference voltage.
For compensation of the feedback loop response.
A output drive of phase A from push pull transistors.
Output of phase B from push pull transistors.
Voltage bias supply for all TC170 circuits except the output transistors.
Input pin to disable both output drives to 0V OFF.
DS21395B-page 5
TC170
3.0
DETAILED DESCRIPTION
3.1
Peak Current Limit Setup
Resistors R1 and R2 at the current limit input (pin 1) set
the TC170 peak current limit (Figure 3-1). The potential
at pin 1 is easily calculated:
V1 = VREF
R2
R1 + R2
R1 should be selected first. The shutdown circuit
feature is not latched for (VREF – 0.35)/R1 < 50µA and
is latched for currents greater than 125µA.
The error amplifier output voltage is clamped from
going above V1 through the limit buffer amplifier. Peak
current is sensed by RS and amplified by the current
amplifier which has a fixed gain of 3.15.
IPCL, the peak current limit, is the current that causes
the PWM comparator noninverting input to exceed V1,
the potential at the inverting input. Once the
comparator trip point is exceeded, both outputs are
disabled.
The input pulse to pin 16 should be at least 500nsec
wide and have an amplitude of at least 1V in order to
get the minimum propagation delay from input to
output. If these parameters are met, the delay should
be less than 600nsec at 25°C; however, the delay time
will increase as the device temperature rises.
3.3
Soft Restart From Shutdown
A soft restart can be programmed if nonlatched
shutdown operation is used.
A capacitor at pin 1 will cause a gradual increase in
potential toward V1. When the voltage at pin 1 reaches
0.75V, the PWM latch set input is removed and the
circuit establishes a regulated output voltage. The softstart operation forces the PWM output drivers to initially
operate with minimum duty cycle and low peak
currents.
Even if a soft start is not required, it is necessary to
insert a capacitor between pin 1 and ground if the
current IL is greater than 125µA. This capacitor will
prevent "noise triggering" of the latch, yet minimize the
soft-start effect.
IPCL is easily calculated:
IPCL =
V1 – 0.75V
3.15 (RS)
where:
V1 = VREF
R2
R1 + R2
VREF = Internal voltage reference = 5.1V
3.15 = Gain of current-sense amplifier
0.75V = Current limit offset
Both driver outputs (pins 11 and 14) are OFF (LOW)
when the peak current limit is exceeded. When the
sensed current goes below IPCL, the circuit operates
normally.
3.2
Output Shutdown
The TC170 outputs can be turned OFF quickly through
the shutdown input (pin 16). A signal greater than
350mV at pin 16 forces the shutdown comparator
output HIGH. The PWM latch is held set, disabling the
outputs.
Q2 is also turned ON. If VREF/R1 is greater than 125µA,
positive feedback through the lockup amplifier and Q1
keeps the inverting PWM comparator inverting input
below 0.75V. Q3 remains ON even after the shutdown
input signal is removed, because of the positive
feedback. The state can be cleared only through a
power-up cycle. Outputs will be disabled whenever the
potential at pin 1 is below 0.75V.
The shutdown terminal gives a fast, direct way to
disable the TC170 output transistors. System protection and remote shutdown applications are possible.
DS21395B-page 6
3.4
Soft-Start Power-Up
During power-up, a capacitor at R1, R2 initiates a softstart cycle. As the input voltage (pin 15) exceeds the
undervoltage lockout potential (7.7V), Q4 is turned
OFF, ending undervoltage lockout. Whenever the
PWM comparator inverting input is below 0.5V, both
outputs are disabled.
When the undervoltage lockout level is passed, the
capacitor begins to charge. The PWM duty cycle
increases until the operating output voltage is reached.
Soft-start operation forces the PWM output drivers to
initially operate with minimum duty cycle and low peak
current.
3.5
Current-Sense Amplifier
The current-sense amplifier operates at a fixed gain
of 3.15. Maximum differential input voltage (VPIN4 –
VPIN3) is 1.1V. Common-mode input voltage range is
0V to VIN – 3V.
Resistive-sensing methods are shown in Figure 3-2
and Figure 3-3. In Figure 3-2, a simple RC filter limits
transient voltage spikes at pin 4, caused by external
output transistor-collector capacitance. Transformer
coupling (Figure 3-4) offers isolation and better power
efficiency, but cost and complexity increase.
In order to minimize the propagation delay from the
input to the current amplifier to the output terminals, the
current ramp should be in the order of 1µsec in width
(min). Typical time delay values are in the 300 to
400nsec region at 25°C. The delay time increases with
device temperature so that at 50°C, the delay times
may be increased by as much as 100nsec.
 2002 Microchip Technology Inc.
TC170
FIGURE 3-1:
R1 AND R2 SET MAXIMUM PEAK OUTPUT CURRENT
Switch
Current
10
x 3.15 Current Sense
Amplifier
4
3
RS
PWM Comparator
+
–
–
+
"A" = 1
Output
Off (Low)
R
+
S
0.75V
Q
–
7
S
From
Undervoltage
Lockout
VDD
100µA
PWM Latch
5.1V
VREF
Q4
2
Error
Amplifier
5
+
6
–
R1
1
+
V1
–
Limit
Buffer
Amplifier
Q3
R2
Shutdown
Comparator
Lock-Up
Amplifier
16
–
350mV
+
Q1
+
R*
4
3.5kΩ
FIGURE 3-3:
I
C
TC170
6kΩ
350mV
x 3.15 Current Sense
Amplifier
–
–
IL
GROUND REFERENCE
RESISTIVE SENSING
+
Q2
Positive
Feedback
TC170
FIGURE 3-2:
V1
RS
ABOVE GROUND
RESISTIVE SENSING
I
RS
VOUT
x 3.15 Current Sense
Amplifier
3
+
4
*Optional RC Filter
–
3
TC170
 2002 Microchip Technology Inc.
DS21395B-page 7
TC170
FIGURE 3-4:
TRANSFORMER
ISOLATED CURRENT
SENSE
x 3.15 Current Sense
Amplifier
+
–
TC170
4
3
+
VS
–
N
FIGURE 3-5:
MASTER/SLAVE
PARALLEL OPERATION
9
RO
TC170
1
8
IS
CO
SYNC
CMPTR
10
Master
IS • RS
VS =
N
7
1/2 TC4427
VDD
3.6
Undervoltage Lockout
The undervoltage lockout circuit forces the TC170
outputs OFF (low) if the supply voltage is below 7.7V.
Threshold hysteresis is 0.75V and guarantees clean,
jitter-free turn-on and turnoff points. The hysteresis
also reduces capacitive filtering requirements at the
PWM controller supply input (pin 15).
3.7
9 R
O
Two or more TC170 controllers can be slaved together
for parallel operation. Circuits can operate from a
master TC170 internal oscillator with an external driver
(Figure 3-5). Devices can also be slaved to an external
oscillator (Figure 3-6). Disable internal slave device
oscillators by grounding pin 8. Slave controllers derive
an oscillator from the bidirectional synchronization
output signal at pin 10.
Pin 10 is bidirectional in that it is intended to be both a
sync output and input. This is accomplished by making
the output driver "weak." This is advantageous in that it
eliminates an additional pin from the package but does
not enable the device to directly drive another device.
In order to make it an effective driver, a buffer is
required (Figure 3-5). In order to use pin 10 as a sync
input, it is necessary to overcome the internal driver.
This requires a pulse with an amplitude equal to VIN.
Since VIN must be above 8.25V for the undervoltage
lockout to be disabled, a CMOS or open-collector TTL
driver should be used.
DS21395B-page 8
10
7
SYNC
CMPTR
TC170
8
Circuit Synchronization
Current-mode-controlled power supplies can be
operated in parallel with a common load. Paralleled
converters will equally share the load current. Voltagemode controllers unequally share the load current,
decreasing system reliability.
2
VREF
CO
Slave
FIGURE 3-6:
EXTERNAL CLOCK
SYNCHRONIZATION
VDD
External*
Oscillator
1/2
TC4427
15
VIN
10
SYNC TC170
VREF
CO
8
RO
2
9
+
VS
*Pulse Width of
Oscillator is = TD
15
VIN
10
SYNC TC170
VREF
2
CO
RO
9
 2002 Microchip Technology Inc.
TC170
FIGURE 3-7:
OSCILLATOR CIRCUIT
VDD
1
FO
Pin 8
2.3V 4.3V
+
ICHARGE ≈ 2.3V
RO
8
10
–
Pin 10
9
Output Dead Time (TD)
RO
Sync
Discharge
Current
3.8
On-Time
2.3V
1mA
CO
Oscillator Frequency and Output
Dead Time
FIGURE 3-8:
The oscillator frequency for R O = 24kΩ and CO =
1000pF is:
OSCILLATOR
FREQUENCY VS.
OSCILLATOR
RESISTANCE
50
where:
[
ROCO
–
2800
RO2CO
]
CO
CO + 150 x 10–12
R O = Oscillator Resistor (Ω)
C O = Oscillator Capacitor (F)
FO = Oscillator Frequency (Hz)
The oscillator resistor can range from 5kΩ to 50kΩ.
Oscillator capacitor can range from 250pF to 1000pF.
Figure 3-8 shows typical operation for various
resistance and capacitance values.
During transitions between the two outputs,
simultaneous conduction is prevented. Oscillator fall
time controls the output off, or dead time (Figure 3-7).
Dead time is approximately:
TD =
where:
2000 [CO]
2.3
1–
RO
OSCILLATOR RESISTANCE (kΩ)
FO =
1.27
45
TA = +25°C
40
35
30
25
20
250pF
15
10
500pF
5
1000pF 750pF
0
20 40 60 80 100 120 140 160 180 200
OSCILLATOR FREQUENCY (kHz)
( )
R O = Oscillator Resistor (kΩ)
C O = Oscillator Capacitor (pF)
TD = Output Dead Time (sec)
Maximum possible duty cycle is set by the dead time.
 2002 Microchip Technology Inc.
DS21395B-page 9
TC170
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Rise and Fall Times
Output Rise and Fall Times
TA = +25°C
CLOAD = 1000pF
VS = 16V
TA = +25°C
CLOAD = 1800pF
VS = 16V
TA = +25°C
CLOAD = 500pF
VS = 16V
Output Rise and Fall Times
5V
DIV
5V
DIV
50 nsec
DIV
5 nsec
DIV
5V
DIV
50 nsec
DIV
DS21395B-page 10
 2002 Microchip Technology Inc.
TC170
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
16-Pin SOIC (W)
 2002 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
16 mm
12 mm
1000
13 in
DS21395B-page 11
TC170
5.3
Package Dimensions
16-Pin PDIP (Narrow)
PIN 1
.270 (6.86)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.770 (19.56)
.740 (18.80)
.310 (7.87)
.290 (7.37)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.014 (0.36)
.008 (0.20)
10° MAX.
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.070 (1.78)
.045 (1.14)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
16-Pin SOIC (Wide)
PIN 1
.299 (7.59) .419 (10.65)
.291 (7.40) .398 (10.10)
.413 (10.49)
.398 (10.10)
.104 (2.64)
.097 (2.46)
.050 (1.27) TYP. .019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
8°
MAX.
.013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21395B-page 12
 2002 Microchip Technology Inc.
TC170
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21395B-page13
TC170
NOTES:
DS21395B-page14
 2002 Microchip Technology Inc.
TC170
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21395B-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
Hong Kong
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
*DS21395B*
DS21395B-page 16
 2002 Microchip Technology Inc.