LATTICE ISPLSI1048C

ispLSI 1048C/883
®
In-System Programmable High Density PLD
Functional Block Diagram
• HIGH-DENSITY PROGRAMMABLE LOGIC
— 8000 PLD Gates
— 96 I/O Pins, 12 Dedicated Inputs, 2 Global Output
Enables
— 288 Registers
— High-Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
— Security Cell Prevents Unauthorized Copying
• HIGH PERFORMANCE E2CMOS® TECHNOLOGY
— fmax = 50 MHz Maximum Operating Frequency
— tpd = 22 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile E2CMOS Technology
— 100% Tested at Time of Manufacture
• IN-SYSTEM PROGRAMMABLE
— In-System Programmable™ (ISP™) 5-Volt Only
— Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality
— Reprogram Soldered Devices for Faster Debugging
• COMBINES EASE OF USE AND THE FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs
— Four Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
Output Routing Pool
Output Routing Pool
F7 F6 F5 F4 F3 F2 F1 F0
E7 E6 E5 E4 E3 E2 E1 E0
D7
Output Routing Pool
A0
D Q
A1
A2
A3
A4
Logic
Global Routing Pool (GRP)
Array
D6
D5
D Q
D Q
GLB
D4
D3
D2
A5
D Q
A6
A7
D1
Output Routing Pool
Features
D0
B0 B1 B2 B3 B4 B5 B6 B7
C0 C1 C2 C3 C4 C5 C6 C7
Output Routing Pool
Output Routing Pool
CLK
0139G1A-isp
Description
The ispLSI 1048C/883 is a High-Density Programmable
Logic Device processed in full compliance to MIL-STD883. This military grade device contains 288 Registers,
96 Universal I/O pins, 12 Dedicated Input pins, two
Global Output Enables (GOE), four Dedicated Clock
Input pins and a Global Routing Pool (GRP). The GRP
provides complete interconnectivity between all of these
elements. The ispLSI 1048C/883 features 5-Volt insystem programming and in-system diagnostic
capabilities. It is the first device which offers non-volatile
reprogrammability of the logic, and the interconnect to
provide truly reconfigurable systems. Compared to the
ispLSI 1048, the ispLSI 1048C/883 offers two additional
dedicated inputs and two new Global Output Enable pins.
• ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
The basic unit of logic on the ispLSI 1048C/883 device is
the Generic Logic Block (GLB). The GLBs are labeled A0,
A1 .. F7 in figure 1. There are a total of 48 GLBs in the
ispLSI 1048C/883 devices. Each GLB has 18 inputs, a
programmable AND/OR/XOR array, and four outputs
which can be configured to be either combinatorial or
registered. Inputs to the GLB come from the GRP and
dedicated inputs. All of the GLB outputs are brought back
into the GRP so that they can be connected to the inputs
of any other GLB on the device.
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
1048CMIL_01
1
September 2000
Specifications ispLSI 1048C/883
Functional Block Diagram
Figure 1. ispLSI 1048C/883 Functional Block Diagram
I/O I/O I/O I/O
95 94 93 92
I/O I/O I/O I/O
91 90 89 88
I/O I/O I/O I/O
87 86 85 84
I/O I/O I/O I/O
83 82 81 80
IN IN
11 10
I/O I/O I/O I/O
79 78 77 76
I/O I/O I/O I/O
75 74 73 72
I/O I/O I/O I/O
71 70 69 68
I/O I/O I/O I/O
67 66 65 64
IN
9
IN
8
RESET
Input Bus
Input Bus
Output Routing Pool (ORP)
Output Routing Pool (ORP)
GOE0
Generic
Logic Blocks
(GLBs)
GOE1
F7
F6
F5
F4
F3
F2
F1
F0
E7
E6
E5
E4
E3
E2
E1
IN 7
IN 6
E0
I/O 63
I/O 62
I/O 61
D7
I/O 12
I/O 13
I/O 14
I/O 15
D6
A1
D5
Global
Routing
Pool
(GRP)
A2
A3
A4
D4
D3
D2
A5
D1
A6
D0
I/O 60
I/O 59
I/O 58
I/O 57
lnput Bus
A0
Output Routing Pool (ORP)
I/O 8
I/O 9
I/O 10
I/O 11
Input Bus
I/O 4
I/O 5
I/O 6
I/O 7
Output Routing Pool (ORP)
I/O 0
I/O 1
I/O 2
I/O 3
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
A7
SDI/IN 0
MODE/IN 1
B0
B1
B2
B3
B4
B5
B6
B7
C0
C1
C2
C3
C4
C5
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Input Bus
Input Bus
C6
CLK 0
CLK 1
CLK 2
IOCLK 0
IOCLK 1
C7
Clock
Distribution
Network
Megablock
ispEN
IN2 SDO/
IN3
I/O I/O I/O I/O
16 17 18 19
I/O I/O I/O I/O
20 21 22 23
I/O I/O I/O I/O
24 25 26 27
I/O I/O I/O I/O
28 29 30 31
IN SCLK/ I/O I/O I/O I/O
4 IN 5 32 33 34 35
I/O I/O I/O I/O
36 37 38 39
I/O I/O I/O I/O
40 41 42 43
I/O I/O I/O I/O
44 45 46 47
Y Y Y Y
0 1 2 3
0139F(2)-48B-isp
The GRP has, as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
The device also has a 96 I/O cells, each of which is
directly connected to an I/O pin. Each I/O cell can be
individually programmed to be a combinatorial input,
registered input, latched input, output or bi-directional
I/O pin with 3-state control. Additionally, all outputs have
selectable polarity, active high or active low. The signal
voltage levels are TTL-compatible, and the output drivers
can source 4 mA or sink 8 mA.
Clocks in the ispLSI 1048C/883 device are selected
using the Clock Distribution Network. Four dedicated
clock pins (Y0, Y1, Y2 and Y3) are brought into the
distribution network, and five clock outputs (CLK 0, CLK
1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route
clocks to the GLBs and I/O cells. The Clock Distribution
Network can also be driven from a special clock GLB (D0
on the ispLSI 1048C/883 device). The logic of this GLB
allows the user to create an internal clock from a combination of internal signals.
Eight GLBs, 16 I/O cells, two dedicated inputs and one
ORP are connected together to make a Megablock as
shown in figure 1. The outputs of the eight GLBs are
connected to a set of 16 universal I/O cells by the ORP.
Each ispLSI 1048C/883 device contains six Megablocks.
2
Specifications ispLSI 1048C/883
Absolute Maximum Ratings 1
Supply Voltage Vcc ...................................-0.5 to +7.0V
Input Voltage Applied ........................ -2.5 to VCC +1.0V
Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V
Storage Temperature ................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Conditions
SYMBOL
PARAMETER
MIN.
MAX.
4.5
5.5
UNITS
VCC
Supply Voltage
VIL
VIH
Input Low Voltage
0
0.8
V
Input High Voltage
2.0
Vcc + 1
V
Military/883
TC = -55°C to +125°C
0005A mil.eps
Capacitance (TA=25oC, f=1.0 MHz)
MAXIMUM1
UNITS
TEST CONDITIONS
Dedicated Input Capacitance
10
pf
VCC=5.0V, VIN=2.0V
I/O and Clock Capacitance
10
pf
VCC=5.0V, VI/O, VY=2.0V
SYMBOL
PARAMETER
C1
C2
Table 2- 0006mil
1. Characterized but not 100% tested.
Data Retention Specifications
PARAMETER
MINIMUM
MAXIMUM
UNITS
20
—
Years
10000
—
Cycles
Data Retention
Erase/Reprogram Cycles
Table 2- 0008B
3
Specifications ispLSI 1048C/883
Switching Test Conditions
Input Pulse Levels
Figure 2. Test Load
GND to 3.0V
≤ 3ns 10% to 90%
Input Rise and Fall Time
Input Timing Reference Levels
1.5V
Output Timing Reference Levels
1.5V
Output Load
+ 5V
R1
See figure 2
Device
Output
3-state levels are measured 0.5V from steady-state
active level.
Test
Point
Table 2- 0003
CL*
R2
Output Load Conditions (see figure 2)
Test Condition
R1
R2
CL
470Ω
390Ω
35pF
Active High
∞
390Ω
35pF
Active Low
470Ω
390Ω
35pF
Active High to Z
at VOH - 0.5V
∞
390Ω
5pF
Active Low to Z
470Ω
390Ω
5pF
A
B
C
*CL includes Test Fixture and Probe Capacitance.
at VOL + 0.5V
Table 2- 0004A
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL
CONDITION
PARAMETER
MIN.
TYP. 3
MAX.
UNITS
VOL
VOH
IIL
IIH
IIL-isp
IIL-PU
IOS1
Output Low Voltage
IOL =8 mA
–
–
0.4
V
Output High Voltage
IOH =-4 mA
2.4
–
–
V
Input or I/O Low Leakage Current
0V ≤ VIN ≤ VIL (MAX.)
–
–
-10
µA
Input or I/O High Leakage Current
3.5V ≤ VIN ≤ VCC
–
–
10
µA
isp Input Low Leakage Current
0V ≤ VIN ≤ VIL (MAX.)
–
–
-150
µA
I/O Active Pull-Up Current
0V ≤ VIN ≤ VIL
–
–
-150
µA
Output Short Circuit Current
VCC = 5V, VOUT = 0.5V
–
–
-200
mA
ICC2,4
Operating Power Supply Current
VIL = 0.5V, VIH = 3.0V
–
165
260
mA
fTOGGLE = 1 MHz
1. One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems by tester ground
degradation. Characterized but not 100% tested.
2. Measured using twelve 16-bit counters.
3. Typical values are at VCC = 5V and TA = 25oC.
4. Maximum ICC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this datasheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum
ICC.
0007A-48C mil
4
Specifications ispLSI 1048C/883
External Timing Parameters
Over Recommended Operating Conditions
4 2
PARAMETER TEST #
COND.
tpd1
tpd2
fmax (Int.)
fmax (Ext.)
fmax (Tog.)
tsu1
tco1
th1
tsu2
tco2
th2
tr1
trw1
tptoeen
tptoedis
tgoeen
tgoedis
twh
twl
tsu3
th3
1.
2.
3.
4.
-50
DESCRIPTION1
UNITS
MIN. MAX.
A
1
Data Propagation Delay, 4PT bypass, ORP bypass
–
22.0
ns
A
2
Data Propagation Delay
–
26.0
ns
50.3
–
MHz
34.5
–
MHz
58.8
–
MHz
13.0
–
ns
A
3
Clock Frequency with Internal
Feedback 3
–
1
4 Clock Frequency with External Feedback ( tsu2 + tco1 )
1
5 Clock Frequency, Max Toggle ( twh + tw1 )
–
6
GLB Reg. Setup Time before Clock, 4PT bypass
A
7
GLB Reg. Clock to Output Delay, ORP bypass
–
14.0
ns
–
8
GLB Reg. Hold Time after Clock, 4 PT bypass
0
–
ns
–
9
GLB Reg. Setup Time before Clock
15.0
–
ns
–
10 GLB Reg. Clock to Output Delay
–
16.0
ns
–
11 GLB Reg. Hold Time after Clock
0
–
ns
A
12 Ext. Reset Pin to Output Delay
–
20.5
ns
–
13 Ext. Reset Pulse Duration
13.5
–
ns
B
14 Input to Output Enable
–
27.5
ns
C
15 Input to Output Disable
–
27.5
ns
B
16 Global OE Output Enable
–
20.5
ns
C
17 Global OE Output Disable
–
20.5
ns
–
20 Ext. Sync. Clock Pulse Duration, High
8.5
–
ns
–
21 Ext. Sync. Clock Pulse Duration, Low
8.5
–
ns
–
22 I/O Reg. Setup Time before Ext. Sync. Clock (Y2, Y3)
3.0
–
ns
–
23 I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)
9.0
–
ns
–
Unless noted otherwise, all parameters use a GRP load of 4 GLBs, 20 PTXOR path, ORP and Y0 clock.
Refer to Timing Model in this data sheet for further details.
Standard 16-Bit counter using GRP feedback.
Reference Switching Test Conditions section.
5
Table 2- 0030-48C/50 mil
Specifications ispLSI 1048C/883
Internal Timing Parameters1
PARAMETER
#
2
-50
DESCRIPTION
UNITS
MIN. MAX.
Inputs
tiobp
tiolat
tiosu
tioh
tioco
tior
tdin
GRP
tgrp1
tgrp4
tgrp8
tgrp16
tgrp48
GLB
t4ptbp
t1ptxor
t20ptxor
txoradj
tgbp
tgsu
tgh
tgco
tgro
tptre
tptoe
tptck
ORP
torp
torpbp
24
I/O Register Bypass
–
4.3
ns
25
I/O Latch Delay
–
5.5
ns
26
I/O Register Setup Time before Clock
9.1
–
ns
27
I/O Register Hold Time after Clock
0.3
–
ns
28
I/O Register Clock to Out Delay
–
4.6
ns
29
I/O Register Reset to Out Delay
–
5.1
ns
30
Dedicated Input Delay
–
7.4
ns
31
GRP Delay, 1 GLB Load
–
6.2
ns
32
GRP Delay, 4 GLB Loads
–
6.7
ns
33
GRP Delay, 8 GLB Loads
–
8.0
ns
34
GRP Delay, 16 GLB Loads
–
10.5
ns
35
GRP Delay, 48 GLB Loads
–
22.7
ns
36
4 Product Term Bypass Path Delay
–
5.5
ns
37
1 Product Term/XOR Path Delay
–
6.7
ns
38
20 Product Term/XOR Path Delay
–
7.5
ns
–
8.9
ns
–
1.2
ns
Delay 3
39
XOR Adjacent Path
40
GLB Register Bypass Delay
41
GLB Register Setup Time before Clock
3.9
–
ns
42
GLB Register Hold Time after Clock
7.3
–
ns
43
GLB Register Clock to Output Delay
–
2.3
ns
44
GLB Register Reset to Output Delay
–
2.8
ns
45
GLB Product Term Reset to Register Delay
–
11.1
ns
46
GLB Product Term Output Enable to I/O Cell Delay
–
9.6
ns
47
GLB Product Term Clock Delay
3.4
8.2
ns
48
ORP Delay
–
3.4
ns
49
ORP Bypass Delay
–
1.4
ns
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
6
Table 2- 0036-48C/50MIL
Specifications ispLSI 1048C/883
Internal Timing Parameters1
PARAMETER
#
2
-50
DESCRIPTION
UNITS
MIN. MAX.
Outputs
50
tob
51
toen
todis
52
tgoe
53
Clocks
tgy0
54
tgy1/2
55
tgcp
56
tioy2/3
57
tiocp
58
Global Reset
tgr
59
Output Buffer Delay
–
2.9
ns
I/O Cell OE to Output Enabled
–
6.9
ns
I/O Cell OE to Output Disabled
–
6.9
ns
Global OE
–
13.6
ns
Clock Delay, Y0 to Global GLB Clock Line (Ref. clock)
7.4
7.4
ns
Clock Delay, Y1 or Y2 to Global GLB Clock Line
6.1
8.7
ns
Clock Delay, Clock GLB to Global GLB Clock Line
2.6
7.6
ns
Clock Delay, Y2 or Y3 to I/O Cell Global Clock Line
6.1
8.7
ns
Clock Delay, Clock GLB to I/O Cell Global Clock Line
2.6
7.6
ns
–
11.4
ns
Global Reset to GLB and I/O Registers
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
7
Table 2- 0037-48C/50mil
Specifications ispLSI 1048C/883
ispLSI 1048C/883 Timing Model
I/O Cell
GRP
GLB
ORP
I/O Cell
Feedback
Ded. In
I/O Pin
(Input)
#59
#30
4 PT Bypass
GLB Reg Bypass
ORP Bypass
#24
#32
#36
#40
#49
Input
D Register Q
RST
#25 - 29
GRP
Loading
Delay
#31, 33,
34, 35
20 PT
XOR Delays
GLB Reg
Delay
ORP
Delay
I/O Reg Bypass
GRP 4
#37, 38, 39
D
Clock
Distribution
Y1,2,3
#55, 56,
57, 58
I/O Pin
(Output)
#51, 52
#48
RST
#59
Reset
Q
#50
#41, 42,
43, 44
Control RE
PTs
OE
#45, 46, CK
47
#54
Y0
GOE0, 1
#53
0491A/48
Derivations of tsu, th and tco from the Product Term Clock1
tsu
= Logic + Reg su - Clock (min)
= (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tiobp + tgrp4 + tptck(min))
= (#24 + #32 + #38) + (#41) - (#24 + #32 + #47)
8.0 ns = (4.3 + 6.7 + 7.5) + (3.9) - (4.3 + 6.7 + 3.4)
th
= Clock (max) + Reg h - Logic
= (tiobp + tgrp4 + tptck(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor)
= (#24 + #32 + #47) + (#42) - (#24 + #32 + #38 )
8.0 ns = (4.3 + 6.7 + 8.2) + (7.3) - (4.3 + 6.7 + 7.5)
tco
= Clock (max) + Reg co + Output
= (tiobp + tgrp4 + tptck(max)) + (tgco) + (torp + tob)
= (#24 + #32 + #47) + (#43) + (#48 + #50)
32.8 ns = (4.3 + 6.7 + 8.2) + (7.3) + (3.4 + 2.9)
Derivations of tsu, th and tco from the Clock GLB1
tsu
= Logic + Reg su - Clock (min)
= (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tgy0(min) + tgco + tgcp(min))
= (#24 + #32 + #38) + (#41) - (#54 + #43 + #56)
10.1 ns= (4.3 + 6.7 + 7.5) + (3.9) - (7.4 + 2.3 + 2.6)
th
= Clock (max) + Reg h - Logic
= (tgy0(max) + tgco + tgcp(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor)
= (#54 + #43 + #56) + (#42) - (#24 + #32 + #38)
6.1 ns = (7.4 + 2.3 + 7.6) + (7.3) - (4.3 + 6.7 + 7.5)
tco
= Clock (max) + Reg co + Output
= (tgy0(max) + tgco + tgcp(max)) + (tgco) + (torp + tob)
= (#54 + #43 + #56) + (#43) + (#48 + #50)
30.9 ns = (7.4 + 2.3 + 7.6) + (7.3) + (3.4 + 2.9)
1. Calculations are based upon timing specifications for the ispLSI 1048C-50
8
Specifications ispLSI 1048C/883
Maximum GRP Delay vs GLB Loads
11
ispLSI 1048C-50
10
GRP Delay (ns)
9
8
7
6
5
4
3
4
1
8
12
16
GLB Loads
0126A-48C-80-ispmil
Power Consumption
Power consumption in the ispLSI 1048C/883 device
depends on two primary factors: the speed at which the
device is operating, and the number of Product Terms
used. Figure 3 shows the relationship between power
and operating speed.
ICC (mA)
Figure 3. Typical Device Power Consumption vs fmax
250
ispLSI 1048C
200
150
100
50
0
10
20
30
40
50
60
70
80
fmax (MHz)
Notes: Configuration of Twelve 16-bit Counters
Typical Current at 5V, 25˚C
ICC can be estimated for the ispLSI 1048C using the following equation:
ICC = 73 + (# of PTs * 0.23) + (# of nets * Max. freq * 0.010) where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max. freq = Highest Clock Frequency to the device
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of 2 GLB
loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating
conditions and the program in the device, the actual ICC should be verified.
0127A-48C-80-isp
9
Specifications ispLSI 1048C/883
Pin Description
NAME
I/O 0 - I/O 5
I/O 6 - I/O 11
I/O 12 - I/O 17
I/O 18 - I/O 23
I/O 24 - I/O 29
I/O 30 - I/O 35
I/O 36 - I/O 41
I/O 42 - I/O 47
I/O 48 - I/O 53
I/O 54 - I/O 59
I/O 60 - I/O 65
I/O 66 - I/O 71
I/O 72 - I/O 77
I/O 78 - I/O 83
I/O 84 - I/O 89
I/O 90 - I/O 95
J2,
L2,
M3,
P4,
N9,
N11,
M12,
L14,
F13,
D13,
C12,
A11,
B6,
B4,
C3,
D1,
J3,
K3,
P2,
M5,
M9,
M10,
N14,
K12,
F12,
E12,
A13,
C10,
C6,
C5,
B1,
E3,
GOE0, GOE1
N13,
B7,
IN 2, IN 4
IN 6 - IN 11
P7,
F14,
P9
A9,
ispEN
H2
SDI/IN 01
J1
MODE/IN 11
P6
SDO/IN 31
P8
SCLK/IN 51
J14
RESET
H1
Y0
G1
Y1
G14
Y2
H13
Y3
H14
GND
B2,
M8,
C7,
N7
VCC
DESCRIPTION
CPGA PIN NUMBERS
K1,
N1,
N3,
N5,
P10,
P13,
M13,
K13,
E14,
B14,
B12,
B10,
A5,
A2,
C2,
E2,
L1,
M2,
M4,
P5,
P11,
N12,
L12,
K14,
D14,
C13,
C11,
A10,
A4,
B3,
D3,
E1,
K2,
L3,
P3,
M6,
N10,
M11,
M14,
J12,
E13,
D12,
A12,
C9,
B5,
C4,
C1,
F3,
M1,
P1,
N4,
N6,
P12,
P14,
L13,
J13,
C14,
A14,
B11,
B9,
A3,
A1,
D2,
F2
Input/Output Pins - These are the general purpose I/O pins used
by the logic array.
Global output enables for all I/Os.
Dedicated input pins to the device.
A8,
A7,
A6,
F1
Input – Dedicated in-system programming enable input pin. This
pin is brought low to enable the programming mode. The MODE,
SDI, SDO and SCLK options become active.
Input – This pin performs two functions. It is a dedicated input pin
when ispEN is logic high. When ispEN is logic low, it functions as
an input pin to load programming data into the device. SDI/IN 0
also is used as one of the two control pins for the isp state machine.
Input – This pin performs two functions. It is a dedicated input pin
when ispEN is logic high. When ispEN is logic low, it functions as
a pin to control the operation of the isp state machine.
Input/Output – This pin performs two functions. It is a dedicated
input pin when ispEN is logic high. When ispEN is logic low, it
functions as an output pin to read serial shift register data.
Input – This pin performs two functions. It is a dedicated input
when ispEN is logic high. When ispEN is logic low, it functions as
a clock pin for the Serial Shift Register.
Active Low (0) Reset pin which resets all of the GLB and I/O
registers in the device.
Dedicated Clock input. This clock input is connected to one of the
clock inputs of all of the GLBs on the device.
Dedicated clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB on
the device.
Dedicated clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB and/
or any I/O cell on the device.
Dedicated clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any I/O cell on
the device.
B8, B13, C8, H3, H12,
N2,
N8
G2, G3, G12, G13, M7,
Ground (GND)
VCC
Table 2- 0002C-48C/CPGA
1. Pins have dual function capability.
10
Specifications ispLSI 1048C/883
Pin Configuration
ispLSI 1048C/883 133-Pin CPGA Pinout Diagram
14
13
12
I/O59
I/O61
I/O56
PIN A1
11
10
9
8
7
6
5
4
3
2
1
I/O64
I/O66
I/O69
IN7
IN8
IN9
IN10
I/O74
I/O75
I/O77
I/O80
I/O83
A
GND
I/O62
I/O65
I/O68
I/O71
GND
GOE1
I/O72
I/O76
I/O78
I/O81
GND
I/O85
B
I/O53
I/O57
I/O60
I/O63
I/O67
I/O70
GND
Vcc
I/O73
I/O79
I/O82
I/O84
I/O86
I/O88
C
I/O51
I/O54
I/O58
INDEX
I/O87
I/O89
I/O90
D
I/O50
I/O52
I/O55
I/O91
I/O92
I/O93
E
IN6
I/O48
I/O49
I/O94
I/O95
IN11
F
Y1
Vcc
Vcc
Vcc
Vcc
Y0
G
Y3
Y2
GND
GND
ispEN
RESET
H
SCLK/
IN51
I/O47
I/O46
I/O1
I/O0
SDI/
IN01
J
I/O45
I/O44
I/O43
I/O7
I/O4
I/O2
K
I/O42
I/O41
I/O39
I/O10
I/O6
I/O3
L
I/O40
I/O38
I/O36
I/O34
I/O37
GOE0
I/O33
I/O30
I/O28
I/O24
I/O35
I/O32
I/O29
I/O27
I/O26
IN4
ispLSI 1048C/883
Bottom View
I/O31
I/O25
Vcc
I/O22
I/O19
I/O15
I/O12
I/O9
I/O5
M
GND
Vcc
I/O23
I/O20
I/O17
I/O14
GND
I/O8
N
SDO/
IN31
IN2
MODE/
IN11
I/O21
I/O18
I/O16
I/O13
I/O11
P
GND
133 CPGA Pinout.eps
1. Pins have dual function capability.
11
Specifications ispLSI 1048C/883
Part Number Description
ispLSI 1048C – XX
X
Device Family
X
X
Grade
/883 = 883 Military Process
Device Number
Package
G = CPGA
Speed
50 = 50 MHz fmax
Power
L = Low
0212-80B-isp1048C mil
Ordering Information
MILITARY
Family
ispLSI
fmax (MHz) tpd (ns)
50
22
Ordering Number
SMD Number
Package
ispLSI 1048C-50LG/883
5962-9558701MXC
133-Pin CPGA
Table 2- 0041A-48C-ispmil
12