SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 D D D D D D D D D D D D D Military Operating Temperature Range –55°C to 125°C, QML Processing Fast Instruction Cycle Time of 50 ns and 40 ns Two 1K-Word × 32-Bit Single-Cycle Dual-Access On-Chip RAM Blocks 32-Bit Instruction and Data Words, 24-Bit Addresses Integer, Floating-Point, and Logical Operations 40- or 32-Bit Floating-Point / Integer Multiplier and Arithmetic Logic Unit (ALU) 24 × 24-Bit Integer Multiplier, 32-Bit Product 32 × 32-Bit Floating-Point Multiplier, 40-Bit Product Parallel ALU and Multiplier Execution in a Single Cycle 32-Bit Barrel Shifter Eight Extended-Precision Registers (Accumulators) Circular and Bit-Reversed Addressing Capabilities Two Independent Bidirectional Serial Ports With Support for 8 -, 16-, 24 -, or 32-Bit Transfers D D D D D D D D D D D D D Two 32-Bit Timers With Control and Counter Registers Validated Ada Compiler 64-Word × 32-Bit Instruction Cache On-Chip Direct Memory Access (DMA) Controller for Concurrent I / O and CPU Operation One 4K × 32-Bit Single-Cycle Dual-Access On-Chip ROM Block Two 32-Bit External Ports (24- and 13-Bit Addresses) Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs) Zero-Overhead Loops With Single-Cycle Branches Interlocked Instructions for Multiprocessing Support Two- and Three-Operand Instructions Conditional Calls and Returns Block-Repeat Capability Fabricated Using 0.72-µm Enhanced Performance Implanted CMOS (EPIC) Technology by Texas Instruments description The SMJ320C30KGDB digital signal processor (DSP) is a high-performance, 32-bit floating-point processor manufactured in 0.72-µm, double-level metal CMOS technology. The SMJ320C30KGDB internal busing and special digital-signal-processing instruction set have the speed and flexibility to execute up to 50 million floating-point operations per second (MFLOPS). The SMJ320C30KGDB optimizes speed by implementing functions in hardware that other processors implement through software or microcode. This hardware-intensive approach provides performance previously unavailable on a single chip. The SMJ320C30KGDB can perform parallel multiply and ALU operations on integer or floating-point data in a single cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated ARAUs, internal dual-access memories, one DMA channel supporting concurrent I / O, and a short machine-cycle time. High performance and ease of use are results of these features. The large address space, multiprocessor interface, internally and externally generated wait states, two external interface ports, two timers, two serial ports, and multiple interrupt structure enhanced general-purpose applications. The SMJ320C30KGDB supports a wide variety of system applications from host processor to dedicated coprocessor. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 1 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 description (Continued) High-level language support is easily implemented through a register-based architecture, large address space, powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic. known good die (KGD) technology KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe process. This process uses standard probed product that is tested in wafer form at speed and elevated temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for shipment. electrical specifications For electrical and timing specifications, see the SMJ320C30 Digital Signal Processor data sheet, literature number SGUS014. SMJ PREFIX SMJ = 320 C 30 KGD M 40 B DIE REVISION ’C30 B = Revision 7.4 MIL-PRF-38535 SPEED RANGE 40 = 40 MHz 50 = 50 MHz DEVICE FAMILY 320 = DSP Family TECHNOLOGY C = CMOS TEMPERATURE RANGE M = – 55°C to 125°C L = 0°C to 70°C DEVICE 30 = Floating-Point DSP PACKAGE TYPE KGD = Known Good Die Figure 1. SMJ320C30KGDB Device Nomenclature 2 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 JEDEC STANDARD D D D D D D D D D D D D D D D Die thickness is approximately 15 mils "1 mil. Backside surface finish is silicon. Maximum allowable die junction operating temperature is 175°C. Glassivation material is compressive nitride. Bond pad metal is composed of copper-doped aluminum. Percent defective allowed for burned-in die is 5%. Life test data is available. Configuration control notification Group A attribute summary is available (SMJ only). Suggested die-attach material is Silverglass (QMI 3555). Suggested bond wire size is 1.25 mil. ESD rating is Class II. Minimum allowable peak process temperature for die attach is 325°C (for QMI 3555). Saw kerf is dependent on blade size used. Die backside potential is grounded. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 3 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 SMJ320C30KGDB (rev 7.x) known good die pad information Figure 2 shows the SMJ320C30KGDB die-numbering format. See Table 1 for SMJ320C30KGDB die pad information. Die Side Number 4 204 155 154 1 Die Designator TMS320C30FW Pad Number One Die Side Number 1 Zero-Zero (origin) Die Side Number 3 51 104 52 Die Side Number 2 103 Figure 2. ’320C30KGD Die-Numbering Format (See Table 1) Table 1 provides a reference for the following: D D The ’C30 signal identities in relation to the pad numbers The ’C30 X,Y coordinates, where bond pad 52 serves as the origin (0,0) In addition, significant specifications include: D D D D D 4 X,Y coordinate data is in microns. Coordinate origin is at (0,0) (center of bond pad 52). The active silicon dimensions are 7 779.60 µm × 9 453.10 µm (306.28 mils × 372.17 mils). The die size is approximately 7 950.20 µm × 9 779.00 µm (313.00 mils × 385.00 mils). Bond pad dimensions are 103.50 µm × 103.50 µm (4.07 mils × 4.07 mils). POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) DIE SIDE #1 ’C30 DIE BOND PAD LOCATIONS DIE/TAB BOND PAD IDENTITY 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 PDVDD PDVDD DR0 FSR0 CLKR0 CLKX0 FSX0 DX0 TCLK0 TCLK1 PADTOG IOD0 IOD1 IOD2 IODVDD IODVDD IOD3 IOD4 IOD5 IOD6 IOD7 IOD8 IOD9 IOD10 VDDL VDDL DVSS VSSL CVSS IOD11 IOD12 IOD13 IOD14 IOD15 IOD16 IOD17 IOD18 IOD19 IOD20 IOD21 IOD22 IOD23 IOD24 IOD25 IOD26 IOD27 IOD28 IOD29 IOD30 IODVDD IODVDD X-COORDINATE OF THE DIE BOND PAD – 614.16 POST OFFICE BOX 1443 Y-COORDINATE OF THE DIE BOND PAD 7165.35 7029.99 6895.42 6760.42 6625.42 6490.42 6355.42 6220.42 6085.42 5950.42 5815.42 5673.22 5538.22 5403.22 5268.22 5133.22 4998.22 4863.22 4728.22 4593.22 4458.22 4323.22 4188.22 4053.22 3918.22 3783.22 3644.08 3504.04 3369.04 3234.04 3099.04 2964.04 2829.04 2694.04 2559.04 2424.04 2289.04 2154.04 2019.04 1884.04 1749.04 1614.04 1479.04 1344.04 1209.04 1074.04 939.04 804.04 669.04 529.54 394.56 • HOUSTON, TEXAS 77251–1443 PITCH OF LEAD 135.36 134.57 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 142.20 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 139.14 140.04 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 139.50 134.98 5 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued) DIE SIDE #2 6 ’C30 DIE BOND PAD LOCATIONS DIE/TAB BOND PAD IDENTITY 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 DVSS VSSL IVSS CVSS IOD31 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 ADVDD ADVDD A13 A12 A11 A10 A9 A8 A7 A6 VDDL VDDL DVSS CVSS A5 A4 A3 A2 A1 A0 EMU0 EMU1 EMU2 EMU3 EMU4 MC / MP IOA12 IOA11 IOA10 IOA9 IOA8 IOA7 IOA6 CVSS IVSS VSSL DVSS X-COORDINATE OF THE DIE BOND PAD Y-COORDINATE OF THE DIE BOND PAD 0.00 139.68 274.68 409.68 609.48 773.28 944.28 1093.68 1343.88 1478.88 1613.88 1784.63 1919.63 2054.63 2225.63 2360.63 2495.63 2688.23 2837.63 2987.03 3136.43 3285.83 3435.23 3599.03 3734.03 3897.83 4032.83 4177.37 4321.91 4480.85 4637.63 4794.23 4950.83 5107.43 5264.03 5443.85 5646.89 5849.93 6029.75 6209.57 6412.61 6570.83 6720.23 6869.63 7019.03 7168.43 7317.83 7467.23 7710.23 7859.63 8009.03 8158.79 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 PITCH OF LEAD 139.68 135.00 135.00 199.80 163.80 171.00 149.40 250.20 135.00 135.00 170.75 135.00 135.00 171.00 135.00 135.00 192.60 149.40 149.40 149.40 149.40 149.40 163.80 135.00 163.80 135.00 144.54 144.54 158.94 156.78 156.60 156.60 156.60 156.60 179.82 203.04 203.04 179.82 179.82 203.04 158.22 149.40 149.40 149.40 149.40 149.40 149.40 243.00 149.40 149.40 149.76 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued) DIE SIDE #3 ’C30 DIE BOND PAD LOCATIONS DIE/TAB BOND PAD IDENTITY 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 ADVDD ADVDD IOA5 IOA4 IOA3 IOA2 IOA1 IOA0 D31 D30 D29 D28 D27 D26 DDVDD DDVDD D25 D24 D23 D22 D21 D20 D19 D18 VDDL VDDL DVSS CVSS VSSL D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 H1 H3 DDVDD DDVDD X-COORDINATE OF THE DIE BOND PAD 8618.31 POST OFFICE BOX 1443 Y-COORDINATE OF THE DIE BOND PAD 394.56 529.54 664.54 799.54 934.54 1069.54 1204.54 1339.54 1481.74 1616.74 1751.74 1886.74 2021.74 2156.74 2291.74 2426.74 2561.74 2696.74 2831.74 2966.74 3101.74 3236.74 3371.74 3506.74 3641.74 3776.74 3913.00 4055.74 4190.74 4325.74 4460.74 4595.74 4730.74 4865.74 5000.74 5135.74 5270.74 5405.74 5540.74 5675.74 5810.74 5945.74 6080.74 6215.74 6350.74 6485.74 6620.74 6755.74 6890.56 7025.67 7160.31 • HOUSTON, TEXAS 77251–1443 PITCH OF LEAD 134.98 135.00 135.00 135.00 135.00 135.00 135.00 142.20 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 136.26 142.74 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 134.82 135.11 134.64 7 SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998 Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued) DIE SIDE #4 8 ’C30 DIE BOND PAD LOCATIONS DIE/TAB BOND PAD IDENTITY 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 DVSS VSSL IVSS CVSS X2/CLKIN X1 VSUBS EMU5 IORDY MSTRB IOSTRB IOR/W HOLDA HOLD MDVDD MDVDD RDY STRB R/W RESET XF1 XF0 IACK INT0 VDDL VDDL VSSL IVSS INT1 INT2 INT3 RSV0 RSV1 RSV2 RSV3 RSV4 RSV5 RSV6 RSV7 RSV8 RSV9 RSV10 DR1 FSR1 CLKR1 CLKX1 FSX1 DX1 CVSS DVSS X-COORDINATE OF THE DIE BOND PAD Y-COORDINATE OF THE DIE BOND PAD 8167.43 8020.73 7877.63 7742.63 7582.07 7412.51 7176.53 6404.15 6245.93 6087.71 5952.71 5817.71 5682.71 5524.49 5366.27 5231.27 5073.05 4914.83 4779.83 4621.61 4463.39 4328.39 4193.39 4035.17 3876.95 3741.95 3602.27 3458.09 3297.53 3124.55 2943.11 2770.49 2597.87 2425.25 2252.63 2080.01 1914.59 1779.59 1644.84 1509.84 1374.84 1239.84 1104.84 969.84 654.84 498.24 341.64 185.04 28.44 –128.16 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 7558 83 7558.83 PITCH OF LEAD 146.70 143.10 135.00 160.56 169.56 235.98 772.38 158.22 158.22 135.00 135.00 135.00 158.22 158.22 135.00 158.22 158.22 135.00 158.22 158.22 135.00 135.00 158.22 158.22 135.00 139.68 144.18 160.56 172.98 181.44 172.62 172.62 172.62 172.62 172.62 165.42 135.00 134.75 135.00 135.00 135.00 135.00 135.00 315.00 156.60 156.60 156.60 156.60 156.60 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. 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