LZ0P3800 1/4-type Built-in Lens Color CMOS Image Sensor with 110 k Pixels LZ0P3800 PIN CONNECTIONS • • • • • • • • • BIAS1 31 33 CLP1 32 CLP2 NC 35 SIGIN 34 SIGOUT 36 30 29 28 27 26 25 24 23 22 21 20 19 D0 16 D1 17 13 DVDD • • • Progressive scan Square pixel Compatible with CIF standard Number of effective pixels : 367 (H) x 291 (V) Number of optical black pixels – Horizontal : 13 front and 13 rear – Vertical : 4 front and 4 rear Pixel pitch : 9.4 µm (H) x 9.4 µm (V) R, G, and B primary color mosaic filters Image inversion function (horizontally and/or vertically) Power save mode Analog output and 8-bit digital output Variable gain control (3 to 30 dB) Variable electronic shutter (1/30 to 1/10 000 s) Single +3.0 V power supply Built-in optical low-pass-filter Integrated lens : 52˚ horizontal viewing angle Package – 36-pin WLCC* type – Base section size : 16 mm (H) x 13 mm (V) Package height : approx. 10 mm 1 2 3 4 5 6 7 8 9 10 11 12 CKI 14 CKO 15 REFIN AGCSET BIAS3 AGCOUT AGND AVDD OFS ADL DAL DAH AGND DGND FEATURES • • • • • TOP VIEW 36-PIN WLCC TYPE BIAS2 NC SCLK SDI VD HD CLK D7 D6 D5 D4 D3 18 The LZ0P3800 is a 1/4-type (4.5 mm) 110 000pixel built-in lens color CMOS (Complementary Metal Oxide Semiconductor) image sensor that consists of a timing generator (TG), a correlated double sampling (CDS) circuit, an auto gain control (AGC) circuit and an analog-to-digital converter (ADC) circuit. With small lens and WLCC-type flat package, possible to make ultra small color camera easily. D2 DESCRIPTION * Window Leadless Chip Carrier In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 LZ0P3800 BLOCK DIAGRAM HD, VD CLK TG AGC CONTROL 8-BIT D/A DATA 8-BIT A/D CMOS IMAGE SENSOR AGC ANALOG VIDEO OUTPUT AGC OUTPUT 2 DIGITAL VIDEO OUTPUT LZ0P3800 PIN DESCRIPTION PIN NO. SYMBOL 1 REFIN I/O I A/D Analog DESCRIPTION Reference voltage for analog input 2 3 AGCSET BIAS3 – – Analog Analog Connect to AGC bias resistor Analog bias voltage 3 for image sensor 4 5 AGCOUT AGND O – Analog Analog AGC output Analog ground 6 7 AVDD OFS – – Analog Analog Analog power supply Offset bias voltage for AGC output 8 ADL – Analog Bottom ADC reference voltage 9 10 DAL DAH – – Analog Analog Bottom DAC reference voltage Top DAC reference voltage 11 12 AGND DGND – – Analog Digital Analog ground Digital ground 13 DVDD – Digital Digital power supply 14 CKI I Digital 15 CKO O Digital Clock input for oscillator Clock output for oscillator 16 17 D0 D1 O O Digital Digital ADC signal output (LSB) ADC signal output 18 D2 O Digital ADC signal output 19 20 D3 D4 O O Digital Digital ADC signal output ADC signal output 21 22 D5 D6 O O Digital Digital ADC signal output ADC signal output 23 D7 O Digital ADC signal output (MSB) 24 25 CLK HD O I Digital Digital Clock output (9.0 MHz) Horizontal drive pulse input 26 27 VD SDI I I Digital Digital Vertical drive pulse input Data input (AGC gain, offset, shutter control, etc.) 28 29 SCLK NC I – Digital – Shift clock for data. No connection 30 BIAS2 – Analog Analog bias voltage 2 for image sensor 31 32 BIAS1 CLP2 – – Analog Analog Analog bias voltage 1 for image sensor Analog bias voltage 2 for clamp circuit 33 34 CLP1 SIGOUT – O Analog Analog Analog bias voltage 1 for clamp circuit Analog image signal output 35 SIGIN I Analog Analog image signal input 36 NC – – No connection 3 LZ0P3800 ABSOLUTE MAXIMUM RATINGS PARAMETER Power supply voltage Input signal voltage Storage temperature (TA = +25 ˚C) SYMBOL VDD RATING –0.3 to +4.3 UNIT V VØ TSTG –0.3 to VDD +0.3 –20 to +70 V ˚C RECOMMENDED OPERATING CONDITIONS PARAMETER Power supply voltage SYMBOL VDD MIN. 2.7 TYP. 3.0 MAX. 3.3 Operating temperature TOPR –10 +25 +60 ˚C Oscillation frequency Digital input voltage Analog input voltage Analog bias voltage 9.0 UNIT V LOW level fCK VØL 0 0.2VDD MHz V HIGH level VØH 0.8VDD VDD V (Connect to pin through a capacitor) (Connect to GND through a capacitor) NOTES : 1. Applied to input pins HD, VD, SDI and SCLK. 2. Applied to input pins SIGIN and REFIN. Do not connect to DC directly. 3. Applied to pins BIAS1, BIAS2, BIAS3, OFS, ADL, DAL, DAH, CLP1 and CLP2. Do not connect to GND directly. 4 NOTE 1 2 3 LZ0P3800 CHARACTERISTICS (1/30 s progressive scan readout mode) (TA : +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K) • Measurement point : Analog image signal output (pin no. 34), before AGC circuit and AD converter. PARAMETER Standard output voltage Saturation output voltage Sensitivity (Green channel) Resolution (at center) Resolution (at corner) Shading Difference of center position Supply current SYMBOL VO VSAT R MIN. 600 200 TYP. 150 1 000 300 150 100 40 MAX. ±10 IVDD 10 UNIT mV mV mV TV line TV line % % mA NOTE 1 2 3 4 5 6 7 8 NOTES : 5. The resolution in the peripheral area (image height : Y = 0.8) under the conditions mentioned above. 6. Defined by the following formula at the brightness of standard output voltage : (Vco/Vce) x 100 [%] Vco : Output voltage at edge (image height : Y = 0.8) of the image (at video output). Vce : Output voltage at center of the image (at video output). 7. The difference between the center position of image and that of the monitor. This is the ratio for the horizontal underscanning monitor size which includes the decentering eccentricity when turning the lens head one time. 8. Total current of analog and digital power supplies, in the dark and at the standard load conditions. 1. The average output voltage of G signal in the central area (H/10, V/10) under uniform illumination. The standard exposure conditions are defined as when VO is 150 mV. 2. The average output voltage of G signal in the central area (H/10, V/10) under 10 times exposure of the standard exposure conditions. 3. The average output voltage of G signal in the central area (H/10, V/10) when a 1 000 lux light source with a white board of 90% reflector is imaged. 4. The resolution in the central area (H/10, V/10) at which the image of the TV resolution chart (ex. EIAJ test chart) can be distinguished on the B/W video monitor when converted into composite video signals. LENS SPECIFICATIONS PARAMETER Construction Focal length F No. Viewing angle TV distortion Focus adjustment range Torque of focusing SPECIFICATION Single (non-spherical, plastic) 4.0 mm [TYP. : reference] 2.8±5% H : 52˚, V : 40˚, Diagonal : 65˚ [TYP. : reference] ≤ –3.2% ∞ to 10 cm 0.00005 to 0.001 N·m NOTE 1 2 3 NOTES : 1. TV distortion is defined by the formula, (∆y/y) x 100 [%] at capturing rectangular pattern sized horizontal by vertical as 4 by 3. "y" is defined as the vertical height of the center of the horizontal line. ∆y is defined as the difference between the vertical height of the center of the horizontal line and an edge of it. 2. The best focus point of an object can be obtained by turning the lens head within this range. 3. Torques which are necessary for turning the lens. * Be careful not to remove the lens head by turning it counterclockwise too much when adjusting macro. ∆y y 5 LZ0P3800 PIXEL STRUCTURE yyyyyyyyy ,,,,,,,,, , y , y , y , y ,,,,,,,,, yyyyyyyyy , y , y , y , y ,,,,,,,,, yyyyyyyyy , y , y , y , y ,,,,,,,,, yyyyyyyyy , y , y , y , y ,,,,,,,,, yyyyyyyyy , y , y , y , y ,,,,,,,,, yyyyyyyyy , y , y , y , y ,,,,,,,,, yyyyyyyyy y,y, y,y, OPTICAL BLACK (4 PIXELS) OPTICAL BLACK (13 PIXELS) OPTICAL BLACK (13 PIXELS) 367 (H) X 291 (V) OB OB (A) (B) 6 OB OB (B) (A) 7 7 6 • OB (A) : Reference signal formed by optically shielded pixels. • OB (B) : Standard signal generated electrically. OPTICAL BLACK (4 PIXELS) COLOR FILTER ARRAY (1, 291) (367, 291) R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R (1, 1) (367, 1) 6 LZ0P3800 TIMING CHART HORIZONTAL PULSE TIMING HD 906 910 01 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 889092 CLK ADOUT (D0-D7) Normal 361 363 365 367OBB ππππ OBBOBA πππππ OBA Mirror 7 5 3 1 OBB ππππ OBBOBA πππππ OBA HD 104 108 112 116 120 124 128 132 136 140 144 148 152 156 160 164 168 172 176 180 184 188 192 196 200 CLK ADOUT (D0-D7) Normal OBA OBAOBB ππππ OBB 2 4 6 8 10 OBA OBAOBB ππππ OBB 366 364 362 360 358 Mirror • The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1). • The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79). PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK) CLK ∆t SYMBOL MIN. ∆t 0 TYP. MAX. UNIT 15 40 ns ADOUT (D0-D7) SDI, SCLK Forbidden Period VERTICAL PULSE TIMING VD 328 329 330 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 HD ADOUT (D0-D7) Normal 288 289 290 291 OB OB OB OB OB OB 4 3 2 1 OB OB OB OB OB OB Mirror • The rising edge and falling edge of the VD pulse must be in high period of the HD pulses. SERIAL DATA TIMING (SDI, SCLK) Offset AGC D0 D10 Shutter D20 D30 D38 SDI SCLK • Data in SDI are taken at the rising edge of SCLK. • Clock frequency of SCLK should be 1/16 of that of CLK. • Do not insert the SDI and SCLK pulses between 36H* and 37H*. Refer to "VERTICAL PULSE TIMING". • Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D38. * It means ordinal number of the HD pulse. 7 LZ0P3800 SERIAL DATA INPUTS DATA D0 D1 D2 NAME FUNCTION Not used. AGC7 (MSB) (Fix to low level.) Auto gain control D3 D4 AGC6 (0 to 20 dB) D5 D6 AGC4 AGC3 D7 AGC2 D8 D9 AGC1 AGC0 (LSB) AGC5 Not used. (Fix to low level.) D10 D11 D12 D13 D14 OFS7 (MSB) OFS6 Offset level control of AGC output (0.9 to 1.5 V) D15 D16 OFS5 OFS4 D17 OFS3 D18 D19 OFS2 OFS1 D20 D21 OFS0 (LSB) D22 SHT8 (MSB) Shutter speed control D23 D24 SHT7 SHT6 (Exposure time is 1 to 1/330 frame period.) D25 D26 SHT5 SHT4 D27 D28 SHT3 SHT2 D29 SHT1 D30 D31 SHT0 (LSB) MIRH H : Horizontal mirror inversion image, L : Normal image D32 D33 MIRV SAD1 (MSB) H : Vertical mirror inversion image, L : Normal image Phase selection of AD clock Not used. (Fix to low level.) D34 SAD0 (LSB) (Fix to low level.) D35 D36 MAX2 (MSB) MAX1 Selection of fixed gain (3 to 10 dB) D37 D38 MAX0 (LSB) LPMD H : Power save mode (AGC and AD off), L : All active 8 LZ0P3800 Setting of Auto Gain Control • One LSB of the gain code represents approximately 0.078 dB. • Nominal gain values at typical codes are shown below. AUTO GAIN CONTROL D2 D3 D4 D5 D6 D7 D8 D9 L L L L L L L L L H L H L L L H 2 3 L L L L L H H L H L L H H H L L 4 L L H H L L H H 5 6 L L H H L L L L L H L H L L L H 7 8 L L H H L H H L H L L H L H H L (dB) 0 1 9 L H H H L L H H 10 11 H H L L L L L L L H L H L L L L 12 13 H H L L L H H L H L L H L H H L 14 H L H H L L H H 15 16 H H L H H L H L H H H H H L H L 17 18 H H H H L H H L H L L H L H H L 19 H H H H L L H L 20 H H H H H H H H Setting of Offset Level • One LSB of the offset code represents approximately 0.002 V. • Nominal offset values at typical codes are shown below. OFFSET LEVEL (V) 0.9 D13 L D14 L D15 L D16 L D17 L D18 L D19 L D20 L 1.0 1.1 L L L H H L L H H L L H H L H H 1.2 1.3 H H L L L H L L L H L L L H L L 1.4 H H L H L H L H 1.5 H H H H H H H H 9 LZ0P3800 Setting of Shutter Speed • One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period. • Shutter speed values at typical codes are shown below. SHUTTER SPEED D22 D23 D24 D25 D26 D27 D28 D29 D30 L L L L L L L L L L L L L L L L L H 328 · L L L L L L L H L 300 L L L L H H H H L L H L L L L L H L L H H H L L H H L H L H L L L L L L 3 2 H H L L H H L L L L L H H L H L H L 1 H L H L L H L L H (Exposure Time Unit : 1H) 330 329 · · 200 · · 100 · · 10 · Setting of Fixed Gain • One LSB of the gain code represents 1 dB. FIXED GAIN (dB) 3 D37 D35 D36 L L L L L L H H L 6 L H H 7 8 H H L L L H 9 10 H H H H L H 4 5 10 11 36 6 5 4 AGCOUT SCLK 3 BIAS3 NC 2 AGCSET BIAS2 1 23 CLK NC 19 20 21 22 D7 35 SDI 27 D6 REFIN 24 10 DAH 9 DAL 8 ADL OFS + 22 k$ 11 AGND 10 µF 12 DGND 7 (TOP VIEW) LZ0P3800 26 AGND 28 D5 SIGIN 33 CLP1 25 AVDD VD 29 D4 34 32 CLP2 HD 30 D3 SIGOUT 31 BIAS1 D1 D0 CKO CKI DVDD 17 16 15 14 13 Analog Power Supply Digital Power Supply Oscillator (9 MHz) • Insert capacitors more than 10 µF between AVDD and AGND and between DVDD and DGND. • Capacitors whose values are not shown must be 0.1 µF. D2 18 LZ0P3800 EXAMPLE OF OPERATION CIRCUIT PACKAGES FOR CCD AND CMOS DEVICES PACKAGE (Unit : mm) 36 WLCC TYPE +0 16.0–0.1 +0 Approx. 10 16.0–0.1 7.5 P1.0 31 2-Ø1.1–0.1 2-R0.95 ,,, ,,, ,,, ,,,, ,,,, ,,,, ,,,, +0 –0.1 4-R0.5 1.0 2.9 36 13 12 1 2-C0.2 32-1.0 36-R0.2 4-1.55 15.6 2.0 ,,, ,,, ,,, 3.8 P1.0 0.5 1.2 ,,, , ,,,,, , ,, ,,,, ,, ,, ,,,, ,,,, ,, ,, ,,,, ,,,, ,, ,, ,,,, ,,,,, ,,,,, ,,,, ,,,,, ,, , , ,, ,,,, ,, ,, ,,,, ,,,, ,, ,, ,,,, ,,,, ,, ,, ,,,, ,,,,, ,,,,, ,,,, ,,,,,,, ,, 1.0 5.3 1 ,,, ,,, ,,, 2.2 2.8 Approx. 10 1.0 6.0 0.5 ,,,, Ø11.0 1 2.0 1.45 2-Ø1.55±0.05 +0 18 +0 4-R0.2 13.3±0.1 ¿Applicable model¡ LZ0P3800 15.6±0.1 12 13.0–0.1 2-Ø1.35 32-0.50 4-0.7 ,,, ,,, ,,, 1.35 4-R0.5 ,,,, ,,,, ,,,, ,,,, ,,,, 12.0±0.1 5.0 3.20±0.1 0.65±0.05 2.0 4-R1.0 ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,, 6.0 0.5 1.75 +0 13.0–0.05 Ø12.0 PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS 1. Package Breakage 2. Electrostatic Damage In order to prevent the package, the lens holder, and the lens from being broken, follow the instructions below : 1) The CMOS image sensor is a precise optical component and the package-base material is ceramic. Therefore, ø Take care not to drop the device when mounting, handling, or transporting. ø Avoid giving a shock to the package. Especially when leads are fixed to the socket or the circuit board, a small shock could break the package more easily than when the package isn’t fixed. 2) When adjusting the focus, screw the lens holder to the circuit board before soldering the leads. At that time, make sure to use a circuit board with plenty of strength, and to avoid the package and the lens holder from being broken, the following screw and clamp torque are recommended. ø Recommended mounting screw : Ø1.7 tapping screw (B-tight type), Length, L = the thickness of the circuit board + 6 mm ø Recommended clamp torque : 0.012 N·m [however, when the thickness of the circuit board is thinner than t = 2.0 mm] 3) If any damage or breakage occurs on the surface of the lens, its characteristics could deteriorate. Therefore, ø Do not hit the lens. ø Do not give a shock large enough to cause distortion. ø Do not scrub or scratch the surface of the lens. – Even a soft cloth or applicator, if dry, could cause dust to scratch the lens. As compared with general MOS-LSI, CMOS image sensor has lower ESD. Therefore, take the following anti-static measures when handling the CMOS image sensor : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hold the lens holder and do not touch the lead. 3) To avoid generating static electricity, a. do not scrub the device with cloth etc. b. do not attach any tape or labels. 4) When storing or transporting the device, put it in a container of conductive material. 3. Dust and Contamination Dust or contamination on the surface of the lens and the inside of the lens holder could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the device, take the following precautions : 1) Do not remove the lens from the body. Especially when adjusting macro, be careful not to remove the lens by turning it counterclockwise too much. 2) Do not touch the surface of the lens with the fingers. If dust or contamination gets on the surface of the lens, the following cleaning method is recommended : ø Handle the built-in lens CMOS image sensor in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 13 PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS ø Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the leads on the device before blowing off the dust. ø The contamination on the surface of the lens should be wiped off with a clean applicator soaked in isopropyl alcohol. Wipe slowly and gently in one direction only. – Frequently replace the applicator and do not use the same applicator to clean more than one device. ø Make sure there is no dust or contamination on the lens and screw it on the lens holder. ø Do not put too much force onto the lens and the lens holder while soldering. ø Be careful not to let the soldering iron touch the lens holder. – Soldering can be quickly/neatly done by laying the soldering iron so it lightly touches the border between the package and the circuit board and sliding it in sideways. 2) There is no guarantee of the performance of the device which has been removed or resoldered after being soldered once under the conditions mentioned above. – In case there seems to be an inferior device, consult with our sales office before removing it. 3) Avoid using or storing the CMOS image sensor at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CMOS image sensor. 4) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters. 4. Other 1) Soldering should be manually performed within 2 seconds per pin at 400 ˚C maximum at soldering iron. ø Use ESD-measured soldering iron ø The conditions of the soldering time in which the soldering iron touches the package. – In case where the soldering may exceed 2 seconds per pin, resume the work after the device returns to normal temperature. 14