4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 PACKAGE SCHEMATIC ANODE 1 4 COLLECTOR 4 4 CATHODE 2 1 3 EMITTER 1 4 1 DESCRIPTION The H11B815 consists of a gallium arsenide infrared emitting diode driving a silicon Darlington phototransistor in a 4-pin dual in-line package. FEATURES • • • • Compact 4-pin package Current Transfer Ratio: 600% minimum (at IF = 1 mA) High isolation voltage between input and output (5300 VRMS) UL recognized (File # E90700) APPLICATIONS • • • • • Power Supply Monitors Relay Contact Monitor Telephone/Telegraph Line Receiver Twisted Pair Line Receiver Digital Logic/Digital Logic © 2002 Fairchild Semiconductor Corporation Page 1 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 ABSOLUTE MAXIMUM RATINGS (No derating required up to 85°C) Parameter Symbol Value Units Storage Temperature TSTG -55 to +150 °C Operating Temperature TOPR -55 to +100 °C Lead Solder Temperature TSOL 260 for 10 sec °C PD 250 mW DC/Average Forward Input Current IF 80 mA Reverse Input Voltage VR 6 V IF(pk) 1 A 140 mW 1.33 mW/°C TOTAL DEVICE Total Device Power Dissipation @ TA = 25°C EMITTER Forward Current - Peak (1µs pulse, 300pps) LED Power Dissipation @ TA = 25°C PD Derate above 25°C DETECTOR Collector-Emitter Voltage VCEO 35 V Emitter-Collector Voltage VECO 6 V IC 200 mA 200 mW 2.0 mW/°C Continuous Collector Current Detector Power Dissipation @ TA = 25°C PD Derate above 25°C ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Min Typ** Max Unit EMITTER Input Forward Voltage (IF = 20 mA) VF 1.2 1.50 V Reverse Leakage Current (VR = 6.0 V) IR 0.001 10 µA DETECTOR Collector-Emitter Breakdown Voltage (IC = 1.0 mA, IF = 0) BVCEO 35 60 V Emitter-Collector Breakdown Voltage (IE = 100 µA, IF = 0) BVECO 6 8 V (VCE = 10 V, IF = 0) ICEO 0.005 (VCE = 0 V, f = 1 MHz) CCE 8 Collector-Emitter Dark Current Capacitance © 2002 Fairchild Semiconductor Corporation Page 2 of 9 1 µA pF 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 TRANSFER CHARACTERISTICS DC Characteristic Test Conditions Current Transfer Ratio, Collector-Emitter Saturation Voltage Symbol Min (IF = 1 mA, VCE = 2 V) CTR 600 (IF = 20 mA, IC = 5 mA) VCE(sat) Typ** Max Units 7,500 % 1.0 V 0.8 Rise Time (non saturated) (IC = 10 mA, VCE = 2 V, RL = 100V) tr 300 µs Fall Time (non saturated) (IC = 10 mA, VCE = 2 V, RL = 100V) tf 250 µs ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions Symbol Min Typ** (II-O [ 1 µA, 1 min.) VISO 5300 Vac(rms) (VI-O = 500 VDC) RISO 1011 Ω (VI-O = &, f = 1 MHz) CISO 0.5 Max Units pf ** All typicals at TA = 25°C © 2002 Fairchild Semiconductor Corporation Page 3 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Typical Performance Curves Fig. 2 Normalized Current Transfer Ratio vs. Ambient Temperature 1.4 1.2 NORMALIZED CURRENT TRANSFER RATIO - CTR NORMALIZED CURRENT TRANSFER RATIO - CTR Fig. 1 Normalized Current Transfer Ratio vs. Forward Current VCE = 2 V NORMALIZED TO IF = 1 mA 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.1 1 1.0 0.8 0.6 0.4 0.2 IF = 1 mA, VCE = 2 V NORMALIZED TO TA = 25˚C 0.0 -55 10 -25 IF - FORWARD CURRENT (mA) Fig. 3 Normalized Collector Current vs. Collector Emitter Voltage 50 75 100 100000 ICEO - COLLECTOR-EMITTER DARK CURRENT (nA) 10 mA IC - NORMALIZED COLLECTOR CURRENT 25 Fig. 4 Collector-Emitter Dark Current vs. Ambient Temperature 4.0 3.5 3.0 5 mA 2.5 2.0 2 mA 1.5 1 mA 1.0 0.5 IF = 0.5 mA NORMALIZED TO IF =1 mA, VCE = 2 V 0.0 0 0 TA - AMBIENT TEMPERATURE (˚C) 1 2 3 4 5 VCE = 10 V 10000 1000 100 10 1 0.1 0 VCE - COLLECTOR-EMITTER VOLTAGE (V) 20 40 60 80 100 TA - AMBIENT TEMPERATURE (˚C) Fig. 5 LED Forward Voltage vs. Forward Current 1.8 VF - FORWARD VOLTAGE (V) 1.7 1.6 1.5 1.4 TA = 55˚C 1.3 TA = 25˚C 1.2 TA = 100˚C 1.1 1.0 1 10 100 IF - LED FORWARD CURRENT (mA) © 2002 Fairchild Semiconductor Corporation Page 4 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Recommended Thermal Reflow Profile for Surface Mount DIP Package Temperature (°C) 225°C 250 220°C: 10 sec to 40 sec 200 150 Time > 183°C: 120 sec to 180 sec 100 50 0 0 © 2002 Fairchild Semiconductor Corporation 1 2 3 Page 5 of 9 4 5 Time (Min) 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Package Dimensions (0.4" Lead Spacing) Package Dimensions (Through Hole) 0.270 (6.86) 0.250 (6.35) 0.270 (6.86) 0.250 (6.35) 0.270 (6.86) 0.250 (6.35) 0.190 (4.83) 0.175 (4.45) SEATING PLANE SEATING PLANE 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.200 (5.08) 0.115 (2.92) 0.154 (3.90) 0.120 (3.05) 0.154 (3.90) 0.120 (3.05) 0.004 (0.10) MIN 0.020 (0.51) MIN 15° 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 0.100 (2.54) TYP 0.300 (7.62) typ Package Dimensions (Surface Mount) 0.270 (6.86) 0.250 (6.35) 0.016 (0.40) 0.008 (0.20) 0.400 (10.16) TYP 0 to 15° PCB Footprint Layout 0.070 (1.78) 0.270 (6.86) 0.250 (6.35) 0.060 (1.52) SEATING PLANE 0.100 (2.54) 0.300 (7.62) TYP 0.190 (4.83) 0.175 (4.45) 0.295 (7.49) 0.415 (10.54) 0.200 (5.08) 0.115 (2.92) 0.070 (1.78) 0.045 (1.14) 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 0.315 (8.00) MIN 0.405 (10.30) MAX 0.030 (0.76) 0.016 (0.40) 0.008 (0.20) 0.100 (2.54) TYP Lead Coplanarity 0.004 (0.10) MAX NOTE All dimensions are in inches (millimeters) © 2002 Fairchild Semiconductor Corporation Page 6 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 ORDERING INFORMATION Option Order Entry Identifier Description S .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION 4 5 V X YY T 6 H11B815 2 3 1 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code © 2002 Fairchild Semiconductor Corporation Page 7 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Carrier Tape Specifications 12.0 ± 0.1 5.00 ± 0.20 0.30 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 13.2 ± 0.2 4.95 ± 0.20 0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1 User Direction of Feed NOTE All dimensions are in millimeters © 2002 Fairchild Semiconductor Corporation Page 8 of 9 3/26/03 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2002 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 9 of 9 3/26/03