Philips Semiconductors Objective specification Rectifier diode fast, high-voltage FEATURES BY359DX-1500 SYMBOL • Low forward volt drop • Fast switching • Soft recovery characteristic • High thermal cycling performance • Isolated mounting tab QUICK REFERENCE DATA VR = 1500 V k 1 VF ≤ 1.5 V a 2 IF(AV) = 10 A IFSM ≤ 60 A trr ≤ 600 ns GENERAL DESCRIPTION Glass-passivated double diffused rectifier diode featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. The device is intended for use in TV receivers, series resonant switched mode power supplies and other high voltage circuits. PINNING PIN SOD117 DESCRIPTION 1 cathode 2 anode tab case isolated 1 The BY359DX series is supplied in the conventional leaded SOD117 package. 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VRSM Peak non-repetitive reverse voltage Peak repetitive reverse voltage Crest working reverse voltage Average forward current RMS forward current Peak repetitive forward current Peak non-repetitive forward current VRRM VRWM IF(AV) IF(RMS) IFRM IFSM I2t Tstg Tj I2t for fusing Storage temperature Operating junction temperature CONDITIONS MIN. MAX. UNIT - 1500 V - 1500 1300 10 20 60 60 66 V V A A A A A -40 - 18 150 150 A2s ˚C ˚C sinusoidal; a = 1.57; Ths = tbf sinusoidal; a = 1.57 t = 10 ms t = 8.3 ms half sine wave; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) t = 10 ms ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol R.M.S. isolation voltage from both terminals to external heatsink f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree Cisol Capacitance from both terminals f = 1 MHz to external heatsink April 1998 1 MIN. TYP. - - 10 MAX. UNIT 2500 V - pF Rev 1.000 Philips Semiconductors Objective specification Rectifier diode fast, high-voltage BY359DX-1500 THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Thermal resistance junction to ambient with heatsink compound without heatsink compound in free air. Rth j-a MIN. TYP. MAX. UNIT - tbf tbf tbf - K/W K/W K/W MIN. TYP. MAX. UNIT - 1.3 1.00 10 50 1.8 1.5 100 300 V V µA µA MIN. TYP. MAX. UNIT - 0.47 1.6 11.0 0.6 2.0 - µs µC V STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS VF Forward voltage IR Reverse current IF = 20 A IF = 10 A; Tj = 150˚C VR = 1300 V VR = 1300 V; Tj = 100 ˚C DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS trr Qs Vfr Reverse recovery time Reverse recovery charge Peak forward recovery voltage IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs IF = 10 A; dIF/dt = 30 A/µs April 1998 2 Rev 1.000 Philips Semiconductors Objective specification Rectifier diode fast, high-voltage BY359DX-1500 MECHANICAL DATA Dimensions in mm 5.8 max 16.0 max Net Mass: 5.9 g 3.0 0.7 4.5 3.3 10.0 27 max 25 25.1 25.7 22.5 max 5.1 2.2 max 18.1 min 1.1 0.4 M 2 0.9 max 10.9 3.3 Fig.1. SOD117; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". April 1998 3 Rev 1.000 Philips Semiconductors Objective specification Rectifier diode fast, high-voltage BY359DX-1500 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1998 4 Rev 1.000