TI 54F251A

54F251A,74F251A
54F251A 74F251A 8-Input Multiplexer with TRI-STATE Outputs
Literature Number: SNOS178A
54F/74F251A
8-Input Multiplexer with TRI-STATEÉ Outputs
General Description
Features
The ’F251A is a high-speed 8-input digital multiplexer. It provides, in one package, the ability to select one bit of data
from up to eight sources. It can be used as a universal function generator to generate any logic function of four variables. Both assertion and negation outputs are provided.
Y
Y
Multifunctional capability
On-chip select logic decoding
Inverting and non-inverting TRI-STATE outputs
Package
Number
Military
Package Description
e
Commercial
Y
N16E
16-Lead (0.300× Wide) Molded Dual-In-Line
J16A
16-Lead Ceramic Dual-In-Line
74F251ASC (Note 1)
M16A
16-Lead (0.150× Wide) Molded Small Outline, JEDEC
74F251ASJ (Note 1)
M16D
16-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F251AFM (Note 2)
W16A
16-Lead Cerpack
54F251ALL (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
74F251APC
et
54F251ADM (Note 2)
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
bs
ol
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbols
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9504–3
O
IEEE/IEC
TL/F/9504 – 1
TL/F/9504 – 2
TL/F/9504–5
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9504
RRD-B30M75/Printed in U. S. A.
54F/74F251A 8-Input Multiplexer with TRI-STATE Outputs
November 1994
Unit Loading/Fan Out
54F/74F
S0 – S2
OE
I0 – I7
Z
Z
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Select Inputs
TRI-STATE Output Enable Input (Active LOW)
Multiplexer Inputs
TRI-STATE Multiplexer Output
Complementary TRI-STATE Multiplexer Output
1.0/1.0
1.0/1.0
1.0/1.0
150/40 (33.3)
150/40 (33.3)
20 mA/b0.6 mA
20 mA/b0.6 mA
20 mA/b0.6 mA
b 3 mA/24 mA (20 mA)
b 3 mA/24 mA (20 mA)
Functional Description
Truth Table
Inputs
Outputs
OE
S2
S1
S0
Z
Z
H
L
L
L
X
L
L
L
X
L
L
H
X
L
H
L
Z
I0
I1
I2
Z
I0
I1
I2
L
L
L
L
L
L
H
H
H
H
H
L
L
H
H
H
L
H
L
H
I3
I4
I5
I6
I7
I3
I4
I5
I6
I7
et
H e HIGH Voltage Level
L e LOW Voltage Level
X e Immaterial
Z e High Impedance
bs
ol
This device is a logical implementation of a single-pole, 8position switch with the switch position controlled by the
state of three Select inputs, S0, S1, S2. Both assertion and
negation outputs are provided. The Output Enable input
(OE) is active LOW. When it is activated, the logic function
provided at the output is:
Z e OE # (I0 # S0 # S1 # S2 a I1 # S0 # S1 # S2 a
I2 # S0 # S1 # S2 a I3 # S0 # S1 # S2 a
I4 # S0 # S1 # S2 a I5 # S0 # S1 # S2 a
I6 # S0 # S1 # S2 a I7 # S0 # S1 # S2)
When the Output Enable is HIGH, both outputs are in the
high impedance (High Z) state. This feature allows multiplexer expansion by tying the outputs of up to 128 devices
together. When the outputs of the TRI-STATE devices are
tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the
maximum ratings. The Output Enable signals should be designed to ensure there is no overlap in the active LOW portion of the enable voltages.
e
Pin Names
O
Logic Diagram
TL/F/9504 – 4
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Current Applied to Output
in LOW State (Max)
Absolute Maximum Ratings (Note 1)
twice the rated IOL (mA)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Storage Temperature
b 65§ C to a 150§ C
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Recommended Operating
Conditions
b 55§ C to a 175§ C
b 55§ C to a 150§ C
VCC Pin Potential to
Ground Pin
Free Air Ambient Temperature
Military
Commercial
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
Standard Output
TRI-STATE Output
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 30 mA to a 5.0 mA
a 4.5V to a 5.5V
a 4.5V to a 5.5V
b 0.5V to VCC
b 0.5V to a 5.5V
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
IIH
IBVI
ICEX
VID
V
Conditions
Recognized as a HIGH Signal
V
Recognized as a LOW Signal
et
0.8
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
74F 5% VCC
74F 5% VCC
VCC
b 1.2
2.5
2.4
2.5
2.4
2.7
2.7
V
V
Min
IIN e b18 mA
Min
IOH
IOH
IOH
IOH
IOH
IOH
e
e
e
e
e
e
b 1 mA
b 3 mA
b 1 mA
b 3 mA
b 1 mA
b 3 mA
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.5
0.5
V
Min
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
VIN e 0.5V
O
IOD
2.0
Units
Max
bs
ol
VOL
Typ
e
DC Electrical Characteristics
4.75
IOL e 20 mA
IOL e 24 mA
IIL
Input LOW Current
b 0.6
mA
Max
IOZH
Output Leakage Current
50
mA
Max
VOUT e 2.7V
IOZL
Output Leakage Current
b 50
mA
Max
VOUT e 0.5V
IOS
Output Short-Circuit Current
b 150
mA
Max
VOUT e 0V
IZZ
Bus Drainage Test
500
mA
0.0V
VOUT e 5.25V
ICCL
Power Supply Current
15
22
mA
Max
VO e LOW
ICCZ
Power Supply Current
16
24
mA
Max
VO e HIGH Z
b 60
3
AC Electrical Characteristics
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Units
Min
Typ
Max
Min
Max
Min
Max
tPLH
tPHL
Propagation Delay
Sn to Z
3.5
3.2
6.0
5.0
9.0
7.5
3.5
3.2
11.5
8.0
3.5
3.2
9.5
7.5
ns
tPLH
tPHL
Propagation Delay
Sn to Z
4.5
4.0
7.5
6.0
10.5
8.5
3.5
3.0
14.0
10.5
4.5
4.0
12.5
9.0
ns
tPLH
tPHL
Propagation Delay
In to Z
3.0
1.5
5.0
2.5
6.5
4.0
2.5
1.5
8.0
6.0
3.0
1.5
7.0
5.0
ns
tPLH
tPHL
Propagation Delay
In to Z
3.5
3.5
5.0
5.5
7.0
7.0
2.5
3.5
9.0
9.0
2.5
3.5
8.0
7.5
ns
tPZH
tPZL
Output Enable Time
OE to Z
2.5
2.5
4.3
4.3
6.0
6.0
2.0
2.5
7.0
7.5
2.5
2.5
7.0
6.5
tPHZ
tPLZ
Output Disable Time
OE to Z
2.5
1.5
4.0
3.0
5.5
4.5
2.5
1.5
tPZH
tPZL
Output Enable Time
OE to Z
3.5
3.5
5.0
5.5
7.0
7.5
3.0
3.5
tPHZ
tPLZ
Output Disable Time
OE to Z
2.0
1.5
3.8
3.0
5.5
4.5
2.0
1.5
ns
e
2.5
1.5
6.0
4.5
8.5
9.0
3.0
3.5
7.5
8.0
5.5
5.5
2.0
1.5
5.5
4.5
ns
O
bs
ol
et
6.0
5.0
4
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
251A
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reel
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
O
bs
ol
et
e
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
e
Physical Dimensions inches (millimeters) (Continued)
O
bs
ol
et
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
16-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M16A
6
et
e
Physical Dimensions inches (millimeters) (Continued)
bs
ol
16-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M16D
O
16-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N16E
7
e
et
16-Lead Ceramic Flatpak (F)
NS Package Number W16A
bs
ol
54F/74F251A 8-Input Multiplexer with TRI-STATE Outputs
Physical Dimensions inches (millimeters) (Continued)
LIFE SUPPORT POLICY
O
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Tel: 1(800) 272-9959
TWX: (910) 339-9240
National Semiconductor
GmbH
Livry-Gargan-Str. 10
D-82256 F4urstenfeldbruck
Germany
Tel: (81-41) 35-0
Telex: 527649
Fax: (81-41) 35-1
National Semiconductor
Japan Ltd.
Sumitomo Chemical
Engineering Center
Bldg. 7F
1-7-1, Nakase, Mihama-Ku
Chiba-City,
Ciba Prefecture 261
Tel: (043) 299-2300
Fax: (043) 299-2500
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
National Semiconductores
Do Brazil Ltda.
Rue Deputado Lacorda Franco
120-3A
Sao Paulo-SP
Brazil 05418-000
Tel: (55-11) 212-5066
Telex: 391-1131931 NSBR BR
Fax: (55-11) 212-1181
National Semiconductor
(Australia) Pty, Ltd.
Building 16
Business Park Drive
Monash Business Park
Nottinghill, Melbourne
Victoria 3168 Australia
Tel: (3) 558-9999
Fax: (3) 558-9998
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated