Philips Semiconductors Product specification Damper diode fast, high-voltage FEATURES BY329X-1700S SYMBOL • Low forward volt drop • Fast switching • Soft recovery characteristic • High thermal cycling performance • Isolated mounting tab QUICK REFERENCE DATA VR = 1700 V k 1 VF ≤ 1.5 V a 2 IF(PEAK) = 6 A IFSM ≤ 60 A trr ≤ 170 ns GENERAL DESCRIPTION Glass-passivated double diffused rectifier diode featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. The device is intended for use in TV receivers and PC monitors. PINNING PIN SOD113 DESCRIPTION case 1 cathode 2 anode tab isolated The BY329X series is supplied in the conventional leaded SOD113 package. 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VRSM Peak non repetitive reverse voltage Peak repetitive reverse voltage Crest working reverse voltage Peak working forward current VRRM VRWM IF(peak) IFRM IF(RMS) IFSM Peak repetitive forward current RMS forward current Peak non-repetitive forward current Tstg Tj Storage temperature Operating junction temperature CONDITIONS MIN. MAX. UNIT - 1700 V - 1700 1300 6 6 14 10 60 V V A A A A A -40 - 150 150 ˚C ˚C f = 16 kHz f = 64 kHz t = 25 µs; δ = 0.5; Ths ≤ 91 ˚C t = 10 ms sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol R.M.S. isolation voltage from both terminals to external heatsink f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree Cisol Capacitance from both terminals f = 1 MHz to external heatsink September 1998 1 MIN. TYP. - - 10 MAX. UNIT 2500 V - pF Rev 1.200 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1700S THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Thermal resistance junction to ambient with heatsink compound without heatsink compound in free air. Rth j-a MIN. TYP. MAX. UNIT - 55 4.8 5.9 - K/W K/W K/W MIN. TYP. MAX. UNIT - 1.35 1.2 - 1.65 1.5 250 1.0 V V µA mA MIN. TYP. MAX. UNIT - 30 300 130 0.7 40 320 170 1.0 V ns ns µC STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS VF Forward voltage IR Reverse current IF = 6.5 A IF = 6.5 A; Tj = 125 ˚C VR = VRWMmax VR = VRWMmax; Tj = 125 ˚C DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS Vfr tfr trr Qs Forward recovery voltage Forward recovery time Reverse recovery time Reverse recovery charge IF = 6.5 ; dIF/dt = 50 A/µs IF = 6.5 A; dIF/dt = 50 A/µs; VF = 5 V IF = 1 A; -dIF/dt = 50 A/µs; VR ≥ 30 V IF = 2 A; -dIF/dt = 20 A/µs; VR ≥ 30 V I F I dI F F dt trr 10% time tfr time VF Qs V VF 5V fr I 25% 100% R time Fig.1. Definition of Vfr and tfr September 1998 Fig.2. Definition of trr and Qs 2 Rev 1.200 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1700S VCC 30 IF / A BY329S17 Tj = 125 C Tj = 25 C 20 Line output transformer LY 10 Cf typ Cs D1 deflection transistor max 0 Fig.3. Basic horizontal deflection circuit. 100 Maximum pulse width / us 0 0.5 1 1.5 VF / V 2 Fig.5. BY329-1500S Typical and maximum forward characteristic IF = f(VF); parameter Tj BY459X-1500 10 Transient thermal impedance, Zth j-hs (K/W) VRRM V 1 pulse width tp time period T 0.1 10 PD 0.01 1 10 0.001 1us 100 line frequency / kHz Fig.4. Maximum allowable pulse width tp versus line frequency; Basic horizontal deflection circuit. September 1998 tp D= T 10us tp T t 100us 1ms 10ms 100ms 1s pulse width, tp (s) BY229F 10s Fig.6. Transient thermal impedance Zth = f(tp) 3 Rev 1.200 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1700S MECHANICAL DATA Dimensions in mm 10.3 max 4.6 max Net Mass: 2 g 3.2 3.0 2.9 max 2.8 Recesses (2x) 2.5 0.8 max. depth 6.4 15.8 19 max. max. 15.8 max seating plane 3 max. not tinned 3 2.5 13.5 min. 1 0.4 2 M 1.0 (2x) 0.6 2.54 0.9 0.7 0.5 2.5 5.08 Fig.7. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1998 4 Rev 1.200