MOTOROLA XMMA1000P

Order this document
by XMMA1000P/D
SEMICONDUCTOR TECHNICAL DATA
The XMMA series of silicon capacitive, micromachined accelerometers
features; signal conditioning, a 4–pole low pass filter and temperature
compensation. Zero–g offset full scale span and filter cut–off are factory set and
require no external devices. A full system self–test capability verifies system
functionality.
The XMMA series of accelerometers is suitable for automotive crash
detection and recording, vibration monitoring, automotive suspension control,
appliance control systems, etc.
XMMA1000: Z AXIS SENSITIVITY
XMMA2000: X AXIS SENSITIVITY
MICROMACHINED
ACCELEROMETER
± 50g
Features
• Minimum Full Scale Measurement ± 44g
• Calibrated, Self–Test
• Integral Signal Conditioning and 4–Pole Filter
10 9
12 11
14 13
16 15
• Linear Output
• Robust, High Shock Survivability
• Ratiometric
7 8
5 6
3 4
1 2
• G–Cell, Hermetically Sealed at Wafer Level
• Two Packaging Options Available:
1) Plastic DIP for Z Axis Sensing (XMMA1000P)
2) Wingback for X Axis Sensing (XMMA2000W)
DIP PACKAGE
CASE 648C–03
XMMA1000P
Typical Applications
• Automotive Crash Detection and Recording
• Automotive Suspension Control
• Vibration Monitoring and Recording
• Appliance Control
1
• Mechanical Bearing Monitoring
• Computer Hard Drive Protection
• Computer Mouse and Joysticks
2
3
4
5
6
WB PACKAGE
CASE 456–03
XMMA2000W
• Virtual Reality Input Devices
• Sports Diagnostic Devices and Systems
SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM
VDD
G–CELL
SENSOR
VST
SELF–TEST
INTEGRATOR
GAIN
CONTROL LOGIC &
EPROM TRIM CIRCUITS
FILTER
OSCILLATOR
TEMP
COMP
VOUT
CLOCK GEN.
VSS
Senseon is a trademark of Motorola, Inc.
Replaces MMA1000P/D
Motorola Sensor Device Data
 Motorola, Inc. 1997
1
MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Symbol
Value
Unit
Powered Acceleration (all axis)
Rating
Gpd
500
g
Unpowered Acceleration (all axis)
Gupd
2000
g
Supply Voltage
VDD
–0.3 to +7.0
V
Ddrop
1.2
m
Tstg
– 40 to +105
°C
Drop Test(1)
Storage Temperature Range
OPERATING RANGE (These limits define the range of operation for which the part will meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
Supply Voltage(2)
VDD
4.75
5.0
5.25
V
Supply Current
IDD
1.0
4.0
5.0
mA
Operating Temperature Range
TA
– 40
—
+85
°C
NOTES:
1. Dropped onto concrete surface from any axis.
2. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits
the device may operate as a linear device but is not guaranteed to be in calibration.
ELECTRO STATIC DISCHARGE (ESD)
Due to the technological advancing semiconductor industry, it has now become increasingly important for semiconductor manufacturers, users of semiconductors and other
electronic components to fully understand the nature and
sources of ESD. More importantly, a thorough understanding
of its impact on quality and reliability must be understood.
Whereas the Motorola accelerometers contain internal
2kV ESD protection circuitry, extra precaution must be taken
by the user to protect the chip from ESD. A charge of over
2000 volts can accumulate on the human body or associated
Automated Test Equipment (ATE). A charge of this magnitude can alter the performance or cause failure of the chip.
When proper ESD precautions are followed the discharges
will not be detrimental to the chips performance.
FREQUENTLY ASKED QUESTIONS
Q. What is the g–cell?
A. The g–cell is the acceleration transducer within the accelerometer device. It is hermetically sealed at the wafer level to
ensure a contaminant free environment, resulting in superior
reliability performance.
Q. What does the output typically interface with?
A. The accelerometer device is designed to interface with an
analog to digital converter available on most microcontrollers. The output has a 2.5 V DC offset, therefore positive and
negative acceleration is measurable.
2
Q. What is the orientation of the g–force in relation to the
output voltage?
A. The accelerometer responds to g forces perpendicular to
the plane of the package. For acceleration directed onto the
top of the package, the output voltage will increase above the
nominal 2.5 V. For acceleration directed away from the top of
the package, the output will decrease below 2.5 V. Refer to
the “Positive Acceleration Sensing Direction’’ diagram on
page 7.
Q. What is the resonant frequency of the g–cell?
A. The accelerometer’s g–cell is overdamped. The first resonant mode of the package is 10 kHz for the DIP and 5 kHz for
the Wingback.
Q. What is ratiometricity?
A. Ratiometricity is the sensors ability to track changes in
supply voltage. This is a key feature when interfacing to a
microcontroller or an A/D converter. Ratiometricity allows for
system level cancellation of supply induced errors in the analog to digital conversion process. Refer to the Special Features section under the Principle of Operation for more
information.
Q. Is the accelerometer device sensitive to electrostatic
discharge (ESD)?
A. Yes . . . the SENSEON accelerometer should be handled
like other CMOS technology devices.
Q. Can the g–cell part “latch’’?
A. No, overrange stops have been designed into the g–cell
to prevent latching. (Latching is when the middle plate of the
g–cell sticks to either the upper or lower plate.)
Motorola Sensor Device Data
OPERATING CHARACTERISTICS
(Unless otherwise noted: –40°
v TA v +85°, 4.75 v VDD v 5.25, Acceleration = 0g, Loaded output(1))
Characteristic
Symbol
Min
Typ
Max
Unit
Sensitivity (TA = 25°C, VDD = 5.0 V)(2)
∆S
37.2
40
42.8
mV/g
Sensitivity(2)
∆S
7.36
8.0
8.64
mV/V/g
Zero Accel Output(3) (VDD = 5.0 V)
VOFF
2.2
2.5
2.8
V
Zero Accel Output
VOFF
0.44 VDD
0.5 VDD
0.56 VDD
V
G
44
50
—
g
VN
—
—
3.5
mVrms
VNC
—
2.0
—
mVpk
F 3dB
*
360
400
440
Hz
Self–Test Output Response
GST
20
25
30
g
Self–Test Input Low
VIL
—
—
1.4
V
Self–Test Input High
VIH
3.7
—
—
V
Self–Test Input Loading(7)
IIN
30
60
120
µA
Self–Test Response Time(8)
tST
—
2.0
—
ms
Electrical Saturation Recovery Time(9)
—
—
0.2
—
ms
Acceleration Range(4)
Noise (10 Hz to 400 Hz)(5)
Clock Noise(6)
Filter Cut Off Frequency
Full Scale Output Range (IOUT = 200 µA)
VDD
*0.3
VFSO
0.3
—
Capacitive Load Drive(10)
CL
—
—
100
pF
V
Output Impedance
ZO
—
300
—
Ω
Nonlinearity
—
—
1.0
% FSO
Alignment Error
—
—
"3.0
—
—
degrees
Transverse Sensitivity(11)
—
—
3.0
—
% FSO
Package Resonance (DIP/WB)
—
—
10/5
—
kHz
NOTES:
1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground.
2. The device is calibrated at 20g.
3. The device can measure both + and acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2 and for negative acceleration the output will decrease below VDD/2.
4. Refer to the Principle of Operation section for a sample g range calculation.
5. Refer to the Principle of Operation section for a sample rms to peak to peak calculation.
6. At clock frequency
65 kHz.
7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages.
8. Time for the output to reach 90% of its final value after a self–test is initiated.
9. Time for amplifiers to recover after an acceleration signal causing them to saturate.
10. Preserves phase margin (60°) to guarantee output amplifier stability.
11. A measure of the devices ability to reject an acceleration applied 90° from the true axis of sensitivity.
*
^
Motorola Sensor Device Data
3
Pinout description for the Wingback package:
1
2
3
4
5
6
Pin #
Pin Name
Description
1
—
No internal connection, tie to VSS
2
ST
Logic input pin to initiate self test
3
VOUT
4
—
Output voltage
No internal connection, tie to VSS
5
VSS
Signal ground
6
VDD
Supply voltage (5 V)
—
Wings
Support pins, internally connected to lead frame. Tie to VSS.
10 9
12 11
14 13
16 15
Pinout description for the DIP package:
7 8
5 6
3 4
1 2
4
Pin #
Pin Name
Description
1
—
No internal connection, tie to VSS
2
—
No internal connection, tie to VSS
3
—
No internal connection, tie to VSS
4
ST
Logic input pin to initiate self test
5
VOUT
6
—
7
VSS
Signal ground
8
VDD
Supply voltage (5 V)
9
Trim 1
Used for factory trim, tie to VSS
10
Trim 2
Used for factory trim, tie to VSS
Output voltage
No internal connection, tie to VSS
11
Trim 3
Used for factory trim, MUST tie to VDD
12
Trim 4
Used for factory trim, tie to VSS
13
Trim 5
Used for factory trim, tie to VSS
14
—
No internal connection, tie to VSS
15
—
No internal connection, tie to VSS
16
—
No internal connection, tie to VSS
Motorola Sensor Device Data
Table 1.
PRINCIPLE OF OPERATION
The Motorola accelerometer is a surface–micromachined
integrated–circuit accelerometer.
The device consists of a surface micromachined capacitive sensing cell (G–cell) and a CMOS signal conditioning
ASIC contained in a single integrated circuit package. The
sensing element is sealed hermetically at the wafer level
using a bulk micromachined “cap’’ wafer.
The G–Cell is a mechanical structure formed from semiconductor materials (polysilicon) using semiconductor processes (masking and etching). It consists of two stationary
plates with a moveable plate in–between. The center plate
can be deflected from its rest position by subjecting the system to an acceleration (Figure 1).
When the center plate deflects, the distance from it to one
fixed plate will increase by the same amount that the distance to the other plate decreases. The change in distance is
a measure of acceleration.
The G–Cell plates form two back–to–back capacitors
(Figure 2). As the center plate moves with acceleration, the
distance between the plates changes and each capacitor’s
value will change, (C = Aε/D). Where A is the area of the
plate, ε is the dielectric constant, and D is the distance
between the plates.
The CMOS ASIC uses switched capacitor techniques to
measure the G–Cell capacitors and extract the acceleration
data from the difference between the two capacitors. The
ASIC also signal conditions and filters (switched capacitor)
the signal, providing a high level output voltage that is ratiometric and proportional to acceleration.
Acceleration
Figure 1.
Figure 2.
SPECIAL FEATURES
Filtering
The Motorola accelerometers contain an onboard 4–pole
switched capacitor filter. A Bessel implementation is used
because it provides a maximally flat delay response (linear
phase) thus preserving pulse shape integrity. Because the filter is realized using switched capacitor techniques, there is
no requirement for external passive components (resistors
and capacitors) to set the cut–off frequency.
Noise Calculation
The noise for the Motorola accelerometer is specified as
an rms value which is a statistical value of a gaussian noise
source. To convert the rms values to a peak to peak value at
a particular confidence level refer to Table 1. A sample calculation at a 99.9% confidence level is shown.
Motorola Sensor Device Data
Nominal Peak to Peak Value
% Confidence Level
2.0
rms
68%
3.0
rms
87%
4.0
rms
95.40%
5.0
rms
98.80%
6.0
rms
99.73%
6.6
rms
99.90%
Noise rms = 3.5mVrms
Noise peak to peak at a 99.9% confidence level:
3.5mVrms* 6.6 = 23.1mVpp
Self–Test
XMMA sensors provide a self–test feature that allows the
verification of the mechanical and electrical integrity of the
accelerometer at any time before or after installation. This
feature is critical in applications such as automotive airbag
systems where system integrity must be ensured over the life
of the vehicle. A fourth “plate’’ is used in the g–cell as a self–
test plate. This plate is fixed and is located under an extended portion of the center (moveable) plate. When the user
applies a logic high input to the self–test pin, a calibrated potential is applied across the self–test plate and the moveable
plate. The resulting electrostatic force (Fe = 1/2 AV2/d2)
causes the center plate to deflect. The resultant deflection, is
measured by the accelerometer’s control ASIC and a proportional output voltage results. This procedure assures that
both the mechanical (g–cell) and electronic sections of the
sensor are functioning.
Ratiometricity
The XMMA1000P and XMMA2000W are designed to be
“ratiometric’’. That is, their transfer function will be proportional to the applied supply voltage. This feature allows easy
interfacing to common microcontrollers that use ratiometric
A/D converters for system cost benefits.
In operation, a ratiometric sensor’s gain or “sensitivity’’ will
change 1:1 with applied supply voltage and the zero signal
output will be at midsupply. (2.5 V for a 5 V VDD and 2.625 V
for a 5.25 VDD).
Minimum G Range Calculation
To calculate the minimum g range values of an accelerometer several factors have to be taken into consideration.
These considerations include, the supply voltage, the
device’s sensitivity, offset voltage and output rail. A sample
calculation for the minimum g range is shown below.
To complete the calculation the rail and offset voltages
must be subtracted from the supply voltage, then divided by
the supply voltage multiplied by the device’s worst case
(highest) sensitivity.
*
*
ńń
V DD 0.56V DD 0.3V
V DD(8.64mV V g)
* 0.3V +
+ 0.44V
V (0.00864)
DD
DD
ǒ
50.93
Ǔ
* 34.72
V
DD
g
Using the standard five volt power supply, the minimum g
range is calculated to be:
50.926
* 34.722
+ 43.98 [ 44g
5.00
5
PCB Layout
BASIC CONNECTIONS
VDD
ACCELEROMETER
VOUT
VSS
VDD
LOGIC
INPUT
C1
0.1 µF
11 TRIM 3
5
R1
1 kΩ
OUTPUT
SIGNAL
(a)
XMMA2000W
LOGIC
INPUT
2 ST
6 VDD
VOUT
C1
0.1 µF
3
R1
1 kΩ
OUTPUT
SIGNAL
C2
0.01 µF
5 VSS
1 kΩ
C 0.01 µF
C 0.1 µF
VRH
VSS
C 0.1 µF
VDD
0.1 µF
NOTES:
C2
0.01 µF
7 VSS
A/D IN
R
POWER SUPPLY
4 ST
VOUT
P0
C
XMMA1000P
8 VDD
VDD
ST
MICROCONTROLLER
Circuit Schematic
Figure 3 shows the recommended connection diagram for
operating the accelerometer. Figure 3 (a) shows the 16 pin
DIP package version, the XMMA1000P, while (b) shows the
6 pin Wingback package version, the XMMA2000W. For the
XMMA1000P, pins 1, 2, 3, 6, 14, 15, and 16 have no internal
connections, and pins 9 through 13 are used for calibration
and trimming in the factory. These pins should all be connected to VSS, except pin 11 which must be connected to
VDD. For the XMMA2000W, pins 1 and 4, and the wings
(supporting pins) should be connected to VSS.
(b)
Figure 3. Accelerometers with Recommended
Connection Diagram
•
Use a .1 µF capacitor on VDD to decouple the power source.
• Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
• Place a ground plane beneath the accelerometer to reduce
noise, the ground plane should be attached to all of the
open ended terminals shown above.
• Use independent supply traces for the A/D reference
(microcontroller) and the accelerometer.
• Use an RC filter of 1 kΩ and 0.01 µF on the output of the
accelerometer to minimize induced errors.
• PCB layout of power and ground should not couple power
supply noise.
• Accelerometer and microcontroller should not be a high
current path.
• For ratiometricity purposes the accelerometer VDD and microcontroller A/D reference pin should be on the same
trace.
• A/D sampling rate and any external power supply switching
frequency should be selected such that they do not interfere with the internal accelerometer sampling frequency.
This will prevent aliasing errors.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
6
Motorola Sensor Device Data
Positive Acceleration Sensing Direction
DIP PACKAGE
WINGBACK PACKAGE
12
16
9
1
8
7
1
6
*
*
* When positioned as shown, the Earth’s gravity will result in a positive 1g output
Drilling Patterns
WB PACKAGE DRILLING PATTERN
.000 .100 .200 .300 .400 .500
0.088
0.588
∅ .045 2X
.095 2X
.000
.13
∅ .030 6X
PIN 1
.627
Measurement in inches
ORDERING INFORMATION
Device
Temperature Range
Case No.
Package
XMMA1000P
–40 to +85°C
Case 648C–03
Plastic DIP
XMMA2000W
–40 to +85°C
Case 456–03
Plastic Wingback
Motorola Sensor Device Data
7
PACKAGE DIMENSIONS
–A–
L
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–B–
M
INCHES
MIN
MAX
0.740
0.840
0.240
0.260
0.145
0.185
0.015
0.021
0.050 BSC
0.040
0.70
0.100 BSC
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.040
NOTE 5
J
C
DIM
A
B
C
D
E
F
G
J
K
L
M
N
16 PL
0.13 (0.005)
M
T B
S
–T–
N
SEATING
PLANE
K
E
F
G
D 16 PL
0.13 (0.005)
M
T A
CASE 648C–03
ISSUE C
DIP PACKAGE
S
MILLIMETERS
MIN
MAX
18.80
21.34
6.10
6.60
3.69
4.69
0.38
0.53
1.27 BSC
1.02
1.78
2.54 BSC
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
12
7
–B–
1
6
L
K
H
M
D
0.13 (0.005)
G
M
J
6 PL
T A
M
B
M
S
N
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
S
INCHES
MIN
MAX
0.618
0.638
0.250
0.270
0.130
0.135
0.015
0.021
0.328
0.368
0.112
0.120
0.100 BSC
0.050 BSC
0.009
0.012
0.125
0.140
0.063
0.070
0.015
0.025
0.036
0.044
0.110
0.120
0.025
0.035
MILLIMETERS
MIN
MAX
15.70
16.21
6.35
6.86
3.30
3.43
0.38
0.53
8.33
9.35
2.84
3.05
2.54 BSC
1.27 BSC
0.23
0.30
3.18
3.56
1.60
1.78
0.38
0.64
0.91
1.12
2.79
3.05
0.64
0.89
P
E
F
–T–
CASE 456–03
ISSUE D
WB PACKAGE
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8
◊
Motorola SensorXMMA1000P/D
Device Data