DYNEX MP03TT1250

MP03TT1250
MP03TT1250
Dual Thyristor Water Cooled Welding Module
Preliminary Information
DS5424-1.1 June 2001
FEATURES
■
Dual Device Module
■
Electrically Isolated Package
■
Pressure Contact Construction
■
International Standard Footprint
■
Alumina (Non Toxic) Isolation Medium
■
Integral Water Cooled Heatsink
KEY PARAMETERS
VDRM
ILINE(cont.)
ILINE(20cy./50%)
ITSM(per arm)
Visol
G1 K1 K2 G2
2
1
APPLICATIONS
■
1800V
798A
1258A
8100A
3000V
3
Fig. 1 Circuit diagram
Welding
VOLTAGE RATINGS
Type Number
MP03TT1250-18
MP03TT1250-17
MP03TT1250-16
MP03TT1250-15
Repetitive Peak
Voltages
VDRM VRRM
V
1800
1700
1600
1500
Conditions
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 30mA
VDSM = VRSM =
VDRM = VRRM + 100V
respectively
Lower voltage grades available
Outline type code:
MP03 - W1 or W2
Outline type code:
MP03 - W3 or W4
ORDERING INFORMATION
Order As:
MP03TT1250-XX W1
MP03TT1250-XX W2
MP03TT1250-XX W3
MP03TT1250-XX W3A
MP03TT1250-XX W4
With 1/4 BSP connection
1/4 – 18 NPT connection
1/4 – 18 NPT connection
1/4 – 18 NPT water connection thread
With 1/4 BSP connection
XX shown in the part number about represents VDRM/100
selection required, e.g. MP03TT1250-16-W3
Note: When ordering, please use the whole part number.
Auxiliary gate and cathode leads can be ordered separately.
Outline type code: MP03 - W3A
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
1/9
www.dynexsemi.com
MP03TT1250
ABSOLUTE MAXIMUM CURRENT RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
ILINE
Parameter
Max.
Units
Max. controllable RMS line
Continuous 50/60Hz
Twater (in) = 25˚C
798
A
current - single phase
4.5 Ltr/min
Twater (in) = 40˚C
703
A
20 cycles, 50% duty cycle
Twater (in) = 25˚C
1410
A
4.5 Ltr/min
Twater (in) = 40˚C
1258
A
10ms half sine, Tj = 125˚C
8.1
kA
VR = 0
0.33X106
A2s
10ms half sine, Tj = 125˚C
6.5
kA
VR = 50% VDRM
0.21X106
A2s
3000
V
ITSM
Surge (non-repetitive) on-current
I2t
I2t for fusing
ITSM
Surge (non-repetitive) on-current
I2t
I2t for fusing
Visol
Test Conditions
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Isolation voltage
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-w)
Parameter
Max.
Units
dc, 4.5 Ltr/min
-
0.175
˚C/kW
(per thyristor)
Half wave, 4.5 Ltr/min
-
0.185
˚C/kW
3 Phase, 4.5 Ltr/min
-
0.195
˚C/kW
Reverse (blocking)
-
125
˚C
–40
125
˚C
Mounting - M6
5(44)
-
Nm (lb.ins)
Electrical connections - M4
8(70)
9(80)
Nm (lb.ins)
-
Refer to
drawing
g
Virtual junction temperature
Tstg
Storage temperature range
-
Min.
Thermal resistance - junction to water
Tvj
-
Test Conditions
Screw torque
Weight (nominal)
-
-
2/9
www.dynexsemi.com
MP03TT1250
DYNAMIC CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min.
Max.
Units
Peak reverse and off-state current
At VRRM/VDRM, Tj = 125˚C
-
30
mA
dV/dt
Linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125˚C
-
1000
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 500A, gate source 10V, 5Ω
-
500
A/µs
IRRM/IDRM
tr = 0.5µs, Tj = 125˚C
VT(TO)
rT
Threshold voltage
At Tvj = 125˚C
-
0.93
V
On-state slope resistance
At Tvj = 125˚C
-
0.67
mΩ
Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25oC
3
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25oC
150
mA
VGD
Gate non-trigger voltage
At VDRM Tcase = 125oC
0.25
V
VFGM
Peak forward gate voltage
Anode positive with respect to cathode
30
V
VFGN
Peak forward gate voltage
Anode negative with respect to cathode
0.25
V
VRGM
Peak reverse gate voltage
5
V
IFGM
Peak forward gate current
Anode positive with respect to cathode
10
A
PGM
Peak gate power
See table fig. 5
100
W
PG(AV)
Mean gate power
5
W
-
-
3/9
www.dynexsemi.com
MP03TT1250
1600
20
Measured under pulse conditions
Peak half sine wave on-state current - (kA)
1200
1000
Tj = 125˚C
800
600
400
200
0
0.5
1.0
1.5
Instantaneous on-state voltage, VT - (V)
15
300
10
250
5
0
1
2.0
U
95%
Thermal resistance (junction to water). Rth(j-w) - (˚C/W)
mit
r li
ppe
0W
10
W
50
W
20
W
10
5W
Cycles at 50Hz
Duration
0.1
0.01
e
L ow
r lim
it 5%
0.01
Tj = 25˚C
Tj = -40˚C
1
Tj = 125˚C
Gate trigger voltage, VGT - (V)
150
50
2 3 45
1.0
Pulse width Frequency Hz Table gives pulse power PGM in Watts
µs
50 100 400
20
100 100 100
25
100 100 100
100
100 100 100
500
100 100 25
1ms
100 50 12.5
10 10ms
10 - -
0.1
0.001
1
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% VRSM at Tcase = 125˚C)
100
VGD
10
ms
Fig. 3 Maximum (limit) on-state characteristics
200
I2t
I2t value - (A2s x 103)
Instantaneous on-state current, IT - (A)
1400
I2t = Î2 x t
2
Region of
certain triggering
0.1
1
Gate trigger current, IGT - (A)
Fig. 5 Gate characteristics
10
0.001
0.001
0.01
0.1
1
Time - (s)
10
100
1000
Fig. 6 Transient thermal impedance - dc
4/9
www.dynexsemi.com
MP03TT1250
No. of cycles
1
2
3
5
10
20
30
50
100
Rms line current - (A rms)
4000
3000
2000
5000
3000
2000
1000
1000
Tj = 125˚C, Twater = 30˚C @ 4.5 Ltrs/min
0
1
10
Duty cycles - (%)
Tj = 125˚C, Twater = 25˚C @ 4.5 Ltrs/min
0
1
10
Duty cycles - (%)
100
Fig. 7 Single phase welding rating @Twater = 25˚C
Fig. 8 Single phase welding rating @Twater = 30˚C
3000
2000
No. of cycles
1
2
3
5
10
20
30
50
100
4000
Rms line current - (A rms)
No. of cycles
1
2
3
5
10
20
30
50
100
4000
Rms line current - (A rms)
100
5000
5000
3000
2000
1000
1000
0
1
No. of cycles
1
2
3
5
10
20
30
50
100
4000
Rms line current - (A rms)
5000
Tj = 125˚C, Twater = 50˚C @ 4.5 Ltrs/min
10
Duty cycles - (%)
Fig. 9 Single phase welding rating @Twater = 40˚C
100
0
1
Tj = 125˚C, Twater = 50˚C @ 4.5 Ltrs/min
10
Duty cycles - (%)
100
Fig. 10 Single phase welding rating @Twater = 50˚C
5/9
www.dynexsemi.com
MP03TT1250
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
28.5
35
42.5
5
Ø5.5
5
K2
50
3
38
2
1
18
6.5
G2
G1
5
K1
Fast on tabs
2.8 x 0.8
80
92
M8
61
41
19
Thread size:
W1 : 1/4 BSP connection
W2 : 1/4 – 18 NPT connection
25
27.5
37
Recommended fixings for mounting: M5 socket head cap screws
Nominal weight: 1100g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP03-W1 and W2
6/9
www.dynexsemi.com
MP03TT1250
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
28.5
35
42.5
5
Ø5.5
5
K2
50
3
38
2
1
18
6.5
G2
G1
5
K1
Fast on tabs
2.8 x 0.8
80
92
M8
61
41
9
19
27.5
37
Thread size:
W3 : 1/4 – 18 NPT connection
W4 : 1/4 BSP connection
Recommended fixings for mounting: M5 socket head cap screws
Nominal weight: 1100g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP03-W3 and W4
7/9
www.dynexsemi.com
MP03TT1250
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
42.5
35
28.5
5
1
K2
G2
G1
K1
6.5
2
3
5
18
38
50
5
Ø5.5
Fast on tabs
2.8 x 0.8
80
92
20.6
50.8
25.4
Thread size:
W3A : 1/4 – 18 NPT connection thread
10.37
47.4
67.4
M8
Recommended fixings for mounting: M5 socket head cap screws
Nominal weight: 1300g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP03-W3A
8/9
www.dynexsemi.com
MP03TT1250
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5424-1 Issue No. 1.1 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
9/9
www.dynexsemi.com