FAIRCHILD FIN1028MPX

Revised June 2003
FIN1028
3.3V LVDS 2-Bit High Speed Differential Receiver
General Description
Features
This dual receiver is designed for high speed interconnects
utilizing Low Voltage Differential Signaling (LVDS) technology. The receiver translates LVDS levels, with a typical differential input threshold of 100 mV, to LVTTL signal levels.
LVDS provides low EMI at ultra low power dissipation even
at high frequencies. This device is ideal for high speed
transfer of clock and data.
■ Greater than 400Mbs data rate
The FIN1028 can be paired with its companion driver, the
FIN1027, or any other LVDS driver.
■ Fail safe protection for open-circuit, shorted and
terminated conditions
■ 3.3V power supply operation
■ 0.4ns maximum differential pulse skew
■ 2.5ns maximum propagation delay
■ Low power dissipation
■ Power-Off protection
■ Meets or exceeds the TIA/EIA-644 LVDS standard
■ Flow-through pinout simplifies PCB layout
■ 8-Lead SOIC and 8-terminal MLP packages save space
Ordering Code:
Order Number
Package Number
FIN1028M
(Note 1)
M08A
FIN1028MPX
(Preliminary)
Package Description
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MLP08C
8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square
[TAPE and REEL]
Note 1: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pin Descriptions
Connection Diagrams
Pin Name
Description
ROUT1, ROUT2
Pin Assignment for SOIC
LVTTL Data Outputs
RIN1+, RIN2+
Non-inverting LVDS Inputs
RIN1−, RIN2−
Inverting LVDS Inputs
VCC
Power Supply
GND
Ground
Function Table
Input
Outputs
RIN+
RIN+
L
H
L
H
L
H
ROUT
Fail Safe Condition
(Top View)
H
Terminal Assignments for MLP
H = HIGH Logic Level
L = LOW Logic Level
Fail Safe = Open, Shorted, Terminated
(Top Through View)
© 2003 Fairchild Semiconductor Corporation
DS500503
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FIN1028 3.3V LVDS 2-Bit High Speed Differential Receiver
March 2001
FIN1028
Absolute Maximum Ratings(Note 2)
Supply Voltage (VCC)
−0.5V to +4.6V
Recommended Operating
Conditions
DC Input Voltage (RINx+, RINx−)
−0.5V to +4.7V
Supply Voltage (VCC)
DC Output Voltage (ROUTx)
−0.5V to +6V
DC Output Current (IO)
16 mA
Storage Temperature Range (TSTG)
0 to VCC
Magnitude of Differential Voltage
−65°C to +150°C
(|VID|)
100 mV to VCC
150°C
Common-mode Input Voltage
(Soldering, 10 seconds)
260°C
ESD (Human Body Model)
≥ 6500V
Operating Temperature (TA)
Max Junction Temperature (TJ)
Lead Temperature (TL)
(VIC)
0.05V to 2.35V
−40°C to +85°C
Note 2: The “Absolute Maximum Ratings”: are those values beyond which
damage to the device may occur. The databook specifications should be
met, without exception, to ensure that the system design is reliable over its
power supply, temperature and output/input loading variables. Fairchild
does not recommend operation of circuits outside databook specification.
≥ 300V
ESD (Machine Model)
3.0V to 3.6V
Input Voltage (VIN)
DC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Symbol
Parameter
Min
Test Conditions
VTH
Differential Input Threshold HIGH
See Figure 1 and Table 1
VTL
Differential Input Threshold LOW
See Figure 1 and Table 1
Typ
Max
(Note 3)
100
−100
Units
mV
mV
IIN
Input Current
VIN = 0V or VCC
±20
µA
II(OFF)
Power-OFF Input Current
VCC = 0V, VIN = 0V or 3.6V
±20
µA
VOH
Output HIGH Voltage
IOH = −100 µA
VCC −0.2
IOH = −8 mA
VOL
Output LOW Voltage
V
2.4
IOH = 100 µA
0.2
IOL = 8 mA
0.5
−1.5
V
VIK
Input Clamp Voltage
IIK = −18 mA
ICC
Power Supply Current
(RIN+ = 1V and RIN− = 1.4V) or
CIN
Input Capacitance
4
pF
COUT
Output Capacitance
6
pF
V
9
(RIN+ = 1.4V and RIN− = 1V)
mA
Note 3: All typical values are at TA = 25°C and with VCC = 3.3V.
AC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Symbol
tPLH
Parameter
Test Conditions
Differential Propagation Delay
Typ
Differential Propagation Delay
2.5
0.9
HIGH-to-LOW
Max
(Note 4)
0.9
LOW-to-HIGH
tPHL
Min
2.5
tTLH
Output Rise Time (20% to 80%)
|VID| = 400 mV, CL = 10 pF,
0.5
tTHL
Output Fall Time (80% to 20%)
See Figure 1 and Figure 2
0.5
tSK(P)
Pulse Skew |tPLH - tPHL|
tSK(LH),
Channel-to-Channel Skew
tSK(HL)
(Note 5)
tSK(PP)
Part-to-Part Skew (Note 6)
Units
ns
ns
ns
ns
0.4
ns
0.3
ns
1.0
ns
Note 4: All typical values are at TA = 25°C and with VCC = 3.3V.
Note 5: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direction.
Note 6: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction
(either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.
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FIN1028
Note A: All input pulses have frequency = 10 MHz, tR or tF = 1 ns
Note B: CL includes all probe and fixture capacitances
FIGURE 1. Differential Driver Propagation Delay and Transition Time Test Circuit
TABLE 1. Receiver Minimum and Maximum Input Threshold Test Voltages
Applied Voltages (V)
Resulting Differential
Input Voltage (mV)
Resulting Common Mode
Input Voltage (V)
VIC
VIA
VIB
VID
1.25
1.15
100
1.2
1.15
1.25
−100
1.2
2.4
2.3
100
2.35
2.3
2.4
−100
2.35
0.1
0
100
0.05
0
0.1
−100
0.05
1.5
0.9
600
1.2
0.9
1.5
−600
1.2
2.4
1.8
600
2.1
1.8
2.4
−600
2.1
0.6
0
600
0.3
0
0.6
−600
0.3
FIGURE 2. AC Waveforms
3
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FIN1028
DC /AC Typical Performance Curves
FIGURE 3. Output High Voltage vs.
Power Supply Voltage
FIGURE 4. Output Low Voltage vs.
Power Supply Voltage
FIGURE 5. Output Short Circuit Current vs.
Power Supply Voltage
FIGURE 6. Power Supply Current vs.
Frequency
FIGURE 8. Differential Propagation Delay vs.
Power Supply Voltage
FIGURE 7. Power Supply Current vs.
Ambient Temperature
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4
FIN1028
DC /AC Typical Performance Curves
(Continued)
FIGURE 9. Differential Propagation Delay vs.
Ambient Temperature
FIGURE 10. Differential Skew (tPLH - tPHL) vs.
Power Supply Voltage
FIGURE 12. Differential Propagation Delay vs.
Differential Input Voltage
FIGURE 11. Differential Skew (tPHL - tPHL) vs.
Ambient Temperature
FIGURE 13. Differential Propagation Delay vs.
Common-Mode Voltage
FIGURE 14. Transition Time vs.
Power Supply Voltage
5
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FIN1028
DC /AC Typical Performance Curves
(Continued)
FIGURE 15. Transition Time vs.
Ambient Temperature
FIGURE 16. Differential Propagation Delay vs.
Load
FIGURE 17. Differential Propagation Delay vs.
Load
FIGURE 18. Transition Time vs.
Load
FIGURE 19. Transition Time vs.
Load
FIGURE 20. Power Supply Current vs.
Power Supply Voltage
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TAPE FORMAT for MLP
Ao
Bo
Package
±0.10 ±0.10
2x2
2.30
2.30
D
D1
E
F
Ko
P1
Po
P2
T
TC
W
Wc
±0.05
Min
±0.1
±0.1
±0.1
TYP
TYP
±0/05
TYP
±0.005
±0.3
TYP
1.55
1.0
1.75
3.5
1.0
8.0
4.0
2.0
0.3
0.06
8.0
5.3
MLP Embossed Tape Dimensions (Dimensions are in millimeters)
REEL DIMENSIONS (millimeters)
Tape Width
Dia A
Max
Dim B
Min
Dia C
+0.5/−0.2
Dia D
Min
Dim N
Min
Dim W1
+2/−0
Dim W2
Max
Dim W3
(LSL - USL)
8 mm
330
1.5
13
20.2
178
8.4
14.4
7.9 ∼ 10.4
7
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FIN1028
Tape and Reel Specification
FIN1028
Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M08A
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8
FIN1028 3.3V LVDS 2-Bit High Speed Differential Receiver
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square
Package Number MLP08C
(Preliminary)
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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