INTEGRATED CIRCUITS DATA SHEET TDA7056 3 W mono BTL audio output amplifier Product specification File under Integrated Circuits, IC01 May 1992 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier FEATURES • No external components TDA7056 GENERAL DESCRIPTION The TDA7056 is a mono output amplifier contained in a 9 pin medium power package. The device is designed for battery-fed portable mono recorders, radios and television. • No switch-on/off clicks • Good overall stability • Low power consumption • Short circuit proof • ESD protected on all pins. QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage PO output power in 16 Ω GV internal voltage gain IP total quiescent current THD total harmonic distortion CONDITIONS VP = 11 V VP = 11 V; MIN. TYP. MAX. UNIT 3 11 18 V 2.5 3 − W 39 40.5 42 dB − 5 7 mA − 0.25 1 % RL = ∞ PO = 0.5 W ORDERING INFORMATION EXTENDED TYPE NUMBER TDA7056 PACKAGE PINS PIN POSITION MATERIAL CODE 9 SIL plastic SOT110(1) Note 1. SOT110-1; 1996 August 21. May 1992 2 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 Fig.1 Block diagram. PINNING FUNCTIONAL DESCRIPTION PIN 1 n.c. 2 VP 3 input (+) 4 signal ground 5 n.c. 6 output (+) 7 power ground 8 output (−) 9 n.c. May 1992 The TDA7056 is a mono output amplifier, designed for battery-fed portable radios and mains-fed equipment such as television. For space reasons there is a trend to decrease the number of external components. For portable applications there is also a trend to decrease the number of battery cells, but still a reasonable output power is required. DESCRIPTION The TDA7056 fulfills both of these requirements. It needs no peripheral components, because it makes use of the Bridge-Tied-Load (BTL) principle. Consequently it has, at the same supply voltage, a higher output power compared to a conventional Single Ended output stage. It delivers an output power of 1 W into a loudspeaker load of 8 Ω with 6 V supply or 3 W into 16 Ω loudspeaker at 11 V without need of an external heatsink. The gain is internally fixed at 40 dB. Special attention is given to switch-on/off click suppression, and it has a good overall stability. The load can be short circuited at all input conditions. 3 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage − 18 V IORM Peak output current repetitive − 1 A IOSM Peak output current non-repetitive − 1.5 A Tstg storage temperature range −55 150 °C Tj junction temperature − 150 °C Ptot total power dissipation Tcase < 60 °C − 9 W Tsc short circuiting time see note 1 − 1 hr Note 1. The load can be short-circuited at all input conditions. THERMAL RESISTANCE SYMBOL PARAMETER NOM. UNIT Rth j-c from junction to case 10 K/W Rth j-a from junction to ambient in free air 55 K/W POWER DISSIPATION Assume: VP = 11 V; RL = 16 Ω. The maximum sine-wave dissipation is 1.52 W. The Rth j-a of the package is 55 K/W. Tamb max = 150 − 55 × 1.52 = 66.4 °C. May 1992 4 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 CHARACTERISTICS At Tamb = 25 °C; f = 1 kHz; VP = 11 V; RL = 16 Ω (see Fig.2). SYMBOL PARAMETER VP operating supply voltage IORM repetitive peak output current IP total quiescent current CONDITIONS MIN. 3 note 1 TYP. 11 MAX. 18 UNIT V − − 0.6 A − 5 7 mA RL = ∞ PO output power THD = 10% 2.5 3 − W THD total harmonic distortion PO = 0.5 W − 0.25 1 % Gv voltage gain 39 40.5 42 dB Vno noise output voltage note 2 − 180 300 µV Vno noise output voltage note 3 − 60 − µV − 20 to 20.000 − Hz frequency response RR ripple rejection note 4 36 50 − dB ∆V DC-output offset voltage note 5 − − 200 mV |Zi| input impedance − 100 − kΩ Ii input bias current − 100 300 nA Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted (20 Hz to 20 kHz). 3. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz. With a practical load (RL = 16 Ω, LL = 200 µH) the noise output current is only 50 nA. 4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage (200 mV) is applied to the positive supply rail. 5. RS = 5 kΩ. May 1992 5 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 (1) This capacitor can be omitted if the supply electrolytic capacitor is placed closer to pin 2. Fig.2 Test and application diagram. May 1992 6 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 May 1992 EUROPEAN PROJECTION 7 Philips Semiconductors Product specification 3 W mono BTL audio output amplifier TDA7056 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1992 8